M375932 五、新型說明： 【新型所屬之技術領域】 本創作係應用於觸控面板之技術領域，尤指一種 提供觸控面板表面平整化之觸控面板結構。 【先前技術】M375932 V. New Description: [New Technology Area] This creation is applied to the technical field of touch panels, especially a touch panel structure that provides surface flattening of touch panels. [Prior Art]
按，一般習知之觸控面板結構，如第5圖至第7 圖所不，其係依序設有一裝飾層1 〇 0、一光學雙面 月梦200、一第一導電層300、一框膠、複 數，置於框膠5 0 0内部之間隙子（spacer)6工〇、 :第二導電層40〇，且相對於框膠500—側之該 苐一導電層3 0 0及第二導電層4 〇 〇間設有一軟 性印刷電路板7 〇 〇，並該軟性印刷電路板7 〇 〇相 對。亥第-導電層3 〇 〇及該第二導電層4 〇 〇設有 複數個接合墊7丄〇 ’並配合該第一導電層3 〇 ◦與 該第二導電層40 0、經由一異方性導電膠（ACP)8 0 0熱壓，以電性連結於該軟性印刷電路板7 〇 〇相對 之接合墊7 1 〇。 々丹与用之觸控面板結構上仍有其缺失，如第 圖所示，即該軟性印刷電路板7 〇 ◦需相 對熱U合於該第-導電層3 0 〇與該第二導電層 400時，由於該異方性導電膠8〇〇的厚度、孰壓 的：度奋壓力及時間都有一定範圍的公差，而這：公 …會造成該第一導電層300會有波浪狀：出 3 M375932 二：整：：摺，進而間接導致該裝飾層1 Ο 0表面不 此;去:θ 5玄觸控面板表面之平整性及美觀，所以一 敏摺的位置設置商標，以藉由商標的標示 +心、的視覺效果’但如此卻會侷限該軟性印刷 商標設置的位置，減少設置的靈活度，以: 限制商4的設計變化。 【新型内容】 使用Τ創作者有鑑於前述習用觸控面板結構於實際 使用上，仍然有表面不平^貫際 予以重新設計。 、觀之缺點存在，而 本創作之主要目的係Α趄 ，苴係能總Ml, k 種觸控面板結構 :係把猎由觸控面板的結構設計稱 板表面不平整之缺陷，以 ：至广:觸控面 增加觸控面板表面變化的靈活性錦層表面之平整度， 為了可達到前述的創作目 術手段係在於提供-種觸控面用的技 飾層，該裝飾層具有一第一面及一 /、係匕含一裝 層於周緣形成一非顯示區，該二第二面，且該裴飾 可觸控之動作區，且該裝飾層之第：區内圍設形成-雙面朦層，且該光學雙面膠層相:面黏设有一光學 示區設有至少一孔洞，且該光風錐；該裝飾層之非顯 層之-面黏設一第一導電層，：第：膠層異於該裒飾 光學雙面膠層之孔洞位置形成一★導電層相對於該 第一接合區，並該 4 M375932 第一導電層平行設有一第二導電層，且該第二導電層 對應§亥第一接合區設有一第二接合區，於該第一導電 層與該第二導電層周緣之間圍設有一框膠，且相對於According to the conventional touch panel structure, as shown in FIGS. 5 to 7 , a decorative layer 1 〇 0, an optical double-sided moon dream 200 , a first conductive layer 300 , and a frame are sequentially disposed. a glue, a plurality of spacers disposed inside the frame glue 500, a second conductive layer 40〇, and the first conductive layer 300 and the second side with respect to the side of the sealant 500 A flexible printed circuit board 7 is disposed between the conductive layers 4, and the flexible printed circuit board 7 is opposed to each other. The first conductive layer 3 〇〇 and the second conductive layer 4 〇〇 are provided with a plurality of bonding pads 7 丄〇 ′ and cooperate with the first conductive layer 3 〇◦ and the second conductive layer 40 0 , via an anisotropy The conductive adhesive (ACP) is hot pressed to be electrically connected to the flexible printed circuit board 7 〇〇 opposite to the bonding pad 7 1 〇. There is still a defect in the structure of the touch panel used by the 々丹, as shown in the figure, that is, the flexible printed circuit board 7 does not need to be thermally combined with the first conductive layer 30 〇 and the second conductive layer. At 400 o'clock, due to the thickness of the anisotropic conductive adhesive, the pressure: the pressure and the time have a certain range of tolerances, and this: the first conductive layer 300 will have a wave shape: 3 M375932 2: Whole:: fold, and indirectly lead to the decorative layer 1 Ο 0 surface is not this; go: θ 5 Xuan touch panel surface flatness and beauty, so a sensitive position to set the trademark, by The mark of the trademark + the visual effect of the heart, but this will limit the position of the soft printed trademark setting, and reduce the flexibility of the setting to: Limit the design change of the quotient 4. [New content] In view of the practical use of the touch panel structure described above, the use of the Τ creator still has a redesigned surface. The shortcomings of the concept, and the main purpose of this creation is that the system can always use Ml, k touch panel structure: the design of the touch panel is designed to be uneven on the surface of the panel, to: Wide: the touch surface increases the flexibility of the surface of the touch panel, and the flatness of the surface of the touch panel, in order to achieve the above-mentioned creative method, is to provide a technical layer for the touch surface, the decorative layer has a first One side and one/, the system includes a layer on the periphery to form a non-display area, the second side, and the enamel decoration touchable action area, and the first layer of the decorative layer is formed in the area - a double-sided enamel layer, and the optical double-sided adhesive layer phase: an optical display area is provided with at least one hole, and the light wind cone; the non-display layer of the decorative layer is adhered to a first conductive layer, : the adhesive layer is different from the hole position of the enamel optical double-sided adhesive layer to form a conductive layer relative to the first bonding region, and the 4 M375932 first conductive layer is parallel with a second conductive layer, and the The second conductive layer is provided with a second bonding region corresponding to the first bonding region of the first conductive layer. a sealant is disposed between the layer and the periphery of the second conductive layer, and is opposite to
該裝飾層之非顯示區位置，而於該框膠内設有一絕緣 層’並該絕緣層内設有複數個間隙子（spacer )，以 間隔開該第一導電層與該第二導電層，另設有一軟性 =刷電路板，該軟性印刷電路板設置於該第一導電層 ::亥第一導電層之間，且該軟性印刷電路板-端之兩 斜該第-導電層之第一接合區及該第二導電： 接合；複數個接合墊，並配合該第- 。 弟一接5區分別與對應之接合墊電性連結 L貫施方式】 士〇第1圖$笛《5 ，其係包含：圖所示’本創作之觸控面板結構 及-第= 該裝飾層10具有-第-面1 1 示區1 3，該非顯且該裝飾層1 0於周緣形成-非顯 作區14 ; #,、、、員不區13内圍設形成-可觸控之動 #設於該2 ? ’該光學雙面膠層2 0 一面 層2 0才目鮮於該#之第二面12，且該光學雙面膠 孔洞2 1 ; X e 1 0之非顯示區1 3設有一 5 一第一導電層3〇，該第一 錫氧化物（ITO)等導電材質，並誃3 0可為一銦 於該光學雙面膠層2〇異：—導電層30黏合 該第-導電層3 0相對於該二飾層1 ◦之-面’且 洞2 1位置形成有-第-接合：31面膠層2 〇之孔 一第二導電層4〇，嗲篦_ ’ 级备於物ητο、楚、耸 μ弟一導電層40可為一銦 外览Q η 貝且w亥第一導電層40平行 该弟一導電層3〇設置， IS—接人且該第一導電層40對應該 第接口&31设有一第二接合區4 一框膠5 0，該框膠 Q 5 〇了為—雙面膠帶，以圍 么二,◦與該第二導電層40周緣之 間，且相對於㈣飾層1Q之非㈣ 該框膠5 0可直接結合兮篦 a 卫 電層40 ; …亥第-導電層3 0及第二導 s緣層（圖中未不），該絕緣層形成於該框膠 内’亚於该絕緣層内設有複數個間隙+( spacer )6 1 ’以間隔開該第—導電層3 0與該第二導電層 4 0 ’且該絕緣層可為空氣層<液態光學膠； 車人性印刷電路板7 〇，該軟性印刷電路板7 〇 设置於該第一導電層3 〇與該第二導電層4 〇之間 且位於忒框膠5 〇之一側，該軟性印刷電路板7 〇 一端之兩面相對該第一導電層3 0之第一接合區3 1及s亥第二導電層4 0之第二接合區4丄分別設有 複數個接合塾7 1 ’並配合該第一接合區3 1、該第 二接合區4 1分別與對應之接合墊7 1經由一異方 係為，^ ( ACP) 8 Q電性連結’且異方性導電膠8 ◦ ，藉膠體（圖中未標號）内含有複數導電粒子8丄 “=等導電粒子8 1，以分別電性連接該第一導 完及該第二導電層4 Q ’·藉由上述之結構，以 凡成本創作之觸控面板結構。 印刷：參閱第3圖及第4圖所示，本創作由於該軟性 二電路板70在與該第一導電層3〇及該第二導 導=〇於熱壓接合時，該第一導電層30及該第二 ㈢4〇受該軟性印刷電路板7〇之該等接合墊 示之：導電粒子8 1顆粒的影響’會產生如第3圖所 鍤面腹t狀不平整的凸出狀紋路’本創作藉由該光學 ^層2 Q對應該軟性印刷電路板7 〇之接合塾 :置設有該孔洞2 1 ’以供該第—導電層3 〇於 =不平整之凸出紋路皺摺位置可容置埋設於該 二2 1 π，不會突出於該裝飾層丄〇之表面，而有 該裝飾層10第一面11之平整性，並藉由該 1〇之第一面11能保持平整性，能能方便設 °靈活選擇該軟性印刷電路板7 0設置的位置，而 :局限對應於設置商標的位置，甚至商標可直接於該 衣飾層10内顯示出，增加該觸控面板2 〇之整體性 ^再如第1圖及第2圖所示，該觸控面板2〇為配 ::置有其他電子配件’例如：攝影機、麥克風、喇 ^等，而於该觸控面板設置有至少一開孔9 0，以供 電子配件表面裸露出，如圖面所示，該裝飾層1 〇 芦=面膠層20、第一導電層3〇及該第二導電 g 4 0卓對應位置均設置有複數個開孔9 〇。 另外，本創作之觸控面板亦可結合於— 二’；且該，層之操作區對應於該顯示器之可視區表 置二二：：裔可為一液晶顯示器’並該觸控面板可設 置於㈣aB顯示器之基板表面，該基板 不器之上基板或為彩色遽光片。 巧/夜曰日〆頁 以上所述僅為舉例性，而非為限制性者。任何未 =本發明之精神與範4，而對其進行之等效修改或 受更，均應包含於後附之申請專利範圍巾，而非限定 於上述之實施例。 【圖式簡單說明】 第1圖係本創作之元件立體分解圖。 第2圖係本創作之平面俯視示意圖。 第3圖係第2圖之組合剖視圖。 第4圖係第3圖之部份放大示意圖。 第5圖係習用之元件立體分解圖。 第β圖係習用之平面俯視示意圖。 第7圖係第6圖之組合剖視圖。 第8圖係第7圖之部份放大示意圖。。 【主要元件符號說明】 10、10 0裝飾層 11第一面The non-display area of the decorative layer is disposed, and an insulating layer is disposed in the sealant, and a plurality of spacers are disposed in the insulating layer to space the first conductive layer and the second conductive layer. Further, a soft=brush circuit board is disposed, the flexible printed circuit board is disposed between the first conductive layer: the first conductive layer, and the first of the flexible printed circuit board-side is inclined to the first conductive layer The bonding region and the second conductive: bonding; a plurality of bonding pads, and matching the first -. The younger brothers are connected to the corresponding joints and the corresponding joints are electrically connected. The first version of the gentry is shown in the first section: $ flute "5, which contains: the picture shows the structure of the touch panel and the - = the decoration The layer 10 has a - face-to-surface 1 1 region 13 , which is non-existent and the decorative layer 10 forms a non-display area 14 at the periphery; #,,,, and the member 13 is surrounded by a formation-touchable The movement # is set in the 2? 'The optical double-sided adhesive layer 2 0 one layer 2 0 is fresh on the second side 12 of the #, and the optical double-sided adhesive hole 2 1 ; X e 1 0 non-display area 1 3 is provided with a first conductive layer 3 〇, the first tin oxide (ITO) and other conductive materials, and the 誃 30 may be an indium in the optical double-sided adhesive layer 2: - the conductive layer 30 is bonded The first conductive layer 30 is formed with a -th-join at the position of the hole 2 1 with respect to the surface of the two-layered layer 1 and the surface of the hole 2 1 : a 31-layer layer 2 〇 a hole and a second conductive layer 4 〇, 嗲篦 _ ' The level of the material ητο, Chu, and the second conductive layer 40 can be an indium view Q η 且 and the first conductive layer 40 is parallel to the first conductive layer 3 ,, IS - access and the first The conductive layer 40 is provided with a second corresponding to the interface & The area 4 is a frame glue 50, and the frame glue Q 5 is folded into a double-sided tape to surround the circumference of the second conductive layer 40, and relative to the (four) decoration layer 1Q (four) The sealant 50 can directly bond the 兮篦a wei electric layer 40; the hai-conducting layer 30 and the second s-edge layer (not shown), the insulating layer is formed in the sealant a plurality of gaps + ( spacers) 6 1 ' are disposed in the insulating layer to space the first conductive layer 30 and the second conductive layer 40 ' and the insulating layer can be an air layer < liquid optical glue; a printed circuit board 7 〇 disposed between the first conductive layer 3 〇 and the second conductive layer 4 且 and located on one side of the 忒 胶 5 ,, the flexible printed circuit board 7 〇 Two sides of one end are respectively provided with a plurality of joints 1 7 1 ' with respect to the first joint region 3 1 of the first conductive layer 30 and the second joint region 4 s of the second conductive layer 40 of the first conductive layer 30 The bonding region 3 1 and the second bonding region 4 1 are respectively electrically connected to the corresponding bonding pad 7 1 via an anisotropy, ^ ( ACP ) 8 Q and the anisotropic conductive adhesive 8 ◦ The middle unlabeled) contains a plurality of conductive particles 8 丄 "= equal conductive particles 8.1 to electrically connect the first conductive and the second conductive layer 4 Q ', respectively, by the above structure, at a cost Touch panel structure. Printing: Referring to Figures 3 and 4, the present invention is in that the flexible two circuit board 70 is in thermal compression bonding with the first conductive layer 3 and the second conductor. The first conductive layer 30 and the second (three) 4 〇 are exposed by the bonding pads of the flexible printed circuit board 7 :: the influence of the particles of the conductive particles 81 1 will produce a t-shaped unevenness as shown in FIG. The embossed pattern 'this creation corresponds to the bonding layer of the flexible printed circuit board 7 by the optical layer 2 Q: the hole 2 1 ' is disposed for the first conductive layer 3 to be 不 uneven The protruding line wrinkle position can be embedded in the two 2 1 π, does not protrude from the surface of the decorative layer, and has the flatness of the first surface 11 of the decorative layer 10, and by the The first surface 11 can maintain the flatness, and the position of the flexible printed circuit board 70 can be flexibly selected, and the limitation is limited. The position of the trademark should be set, and even the trademark can be directly displayed in the clothing layer 10 to increase the integrity of the touch panel 2. As shown in FIGS. 1 and 2, the touch panel 2〇 For the matching:: other electronic accessories are provided, for example: a camera, a microphone, a la, etc., and the touch panel is provided with at least one opening 90 for the surface of the electronic accessory to be exposed, as shown in the figure, The decorative layer 1 hoist=cover layer 20, the first conductive layer 3〇 and the second conductive g 4 0 corresponding positions are provided with a plurality of openings 9 〇. In addition, the touch panel of the present invention can also be combined with the second two; and the operation area of the layer corresponds to the visible area of the display, and the two can be a liquid crystal display and the touch panel can be set. On the surface of the substrate of the (4) aB display, the substrate is not on the substrate or is a color calender.巧/夜曰日〆 The above description is for illustrative purposes only and is not a limitation. Any and all equivalent modifications and/or modifications of the present invention should be included in the appended claims, and are not limited to the embodiments described above. [Simple description of the diagram] Figure 1 is an exploded perspective view of the components of this creation. Figure 2 is a top plan view of the creation. Figure 3 is a cross-sectional view of the combination of Figure 2. Figure 4 is an enlarged schematic view of a portion of Figure 3. Figure 5 is a perspective exploded view of a conventional component. The figure β is a plan view of a plan view. Figure 7 is a cross-sectional view of the combination of Figure 6. Fig. 8 is a partially enlarged schematic view of Fig. 7. . [Main component symbol description] 10, 10 0 decorative layer 11 first side