M286462 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種發光二極體燈具，尤指一種散熱效 果較佳的發光二極體燈具。 【先前技術】 發光二極體由於發光的同時會産生大量的熱，如不及 時將其所產生的熱揮散掉，發光二極體晶片將迅速地老 化，甚至燒毀。 為解決此問題，便有如第四圖所示，以 的方式達到散熱之目的，主要係於一外型為.讀片；：構= ;圓柱型金屬基座（60)上裝設有一導熱平台， 该導熱平台（7〇）之外側面上形成有兩根電極柱（7 1 )， 汶電極柱（7 !)係用以與發光二極體（圖中未示）之金 屬接腳連接，而發光二極體（ 、 ,^ ^ τ禾不）所產生之熱能藉 盆广“的一熱源點與該導熱平台（7〇)之接觸傳導到 …再藉由該導熱平台（70)與金屬基座（ 接觸，而將熱量傳導至金屬 缺 ’土、b υ )以達散熱目的。 w而大功率發光二極體所 率發光二極體大得,ρ审社的電抓已車父以往的小功 ί 大仔夕，故需更佳之散熱能力以雨 且於製程中，制、土兮八屈敌产/ 寸〇而求， Τ衣亥金屬基座（6 〇 )與導埶平A r 7 η、 總令製作成本增加亦非良方。 （70) 【新型内容】 為解決上述問題，本創作 王要目的在於提供一種具 3 M286462 更佳散熱效果的發光二極體燈具。 為達成前述目的所採取之主要技術手段係令前述發光 二極體燈具包括： p刷幫路板’其中央處形成有一通孔，並於外側面 對應該通孔處設置有一發光二極體，該發光二極體之接腳 穿過印刷電路板並透過一導電手段構成電連接； 一散熱模組，係由一導熱係數高之金屬包覆一導熱棒M286462 VIII. New Description: [New Technology Field] This creation is about a light-emitting diode lamp, especially a light-emitting diode lamp with better heat dissipation effect. [Prior Art] A light-emitting diode generates a large amount of heat due to light emission, and if it does not, the heat generated by it is dissipated, and the light-emitting diode wafer is rapidly aged or even burned. In order to solve this problem, it is as shown in the fourth figure, in order to achieve the purpose of heat dissipation, mainly in the form of an external reading; reading =; structure =; cylindrical metal base (60) is equipped with a heat conduction platform Two electrode columns (7 1 ) are formed on the outer surface of the heat conducting platform (7〇), and the electrode column (7!) is connected to the metal pin of the light emitting diode (not shown). The thermal energy generated by the light-emitting diode (, , ^^ τhe) is conducted by the contact of a heat source point with the heat-conducting platform (7〇), and then by the heat-conducting platform (70) and the metal The pedestal (contact, but the heat is transferred to the metal lack 'soil, b υ) to achieve the purpose of heat dissipation. w. The high-power light-emitting diode has a large luminous diode, and the electric power of the RP has been captured by the father. The small work of the small ί 大 夕 夕 故 故 故 故 故 故 故 故 故 故 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大 大r 7 η, the total production cost increase is not a good recipe. (70) [New content] In order to solve the above problems, the purpose of this creation king is to provide A light-emitting diode lamp with a better heat dissipation effect of 3 M286462. The main technical means for achieving the foregoing purpose is that the light-emitting diode lamp includes: a p-brush road plate having a through hole formed in the center thereof, and a light-emitting diode is disposed on the outer side of the through hole, and the pin of the light-emitting diode passes through the printed circuit board and is electrically connected through a conductive means; a heat-dissipating module is made of a metal having a high thermal conductivity Coating a heat conducting rod
所構成’胃導熱棒之—端係以—熱傳導手段而與該發光二 極體熱接觸； 一燈罩，係用以將前述發光二極體與印刷電路板固定 在燈罩與散熱模組之間。 前述結構由於所需要的製程步驟較習用少，故可節省 成本’又由於發光二極體係直接與該散熱模組中的導熱棒 接觸，故可直接將熱量傳遞至該散熱模組上，而得到較佳 的散熱效果。 前述散熱模組可為一在外表面形成有複數錯片的圓筒 體，鰭片可增加散熱面積以增進散熱效率；該散熱模組更 進一步於其與燈罩接觸之一端形成有一凹肖，令該燈罩適 可匹配地置入該凹槽中與散熱模組固定。 為達成前述目的所採取之另—技術手段係令前述發光 二極體燈具包括： ~ W π力乂啕一通孔，亚於外側 對應該通孔處設置有一發朵_ X尤一極體，該發光二極體之接 穿過印刷電路板並透過_道Φ < V電手段與其電連接； M286462 一散熱核組’係由複數個導熱係數高之金屬分別包覆 v熱棒興^熱片所構成，該導熱棒之内側端係與該導 熱片接觸，該導熱片外側面則以一熱傳導手段與該發光二 極體熱接觸，並以-固定手段將導熱片與前述印刷電路板 固定在一起； k罩係用以將前述發光二極體與印刷電路板固定 在燈罩與散熱模組之間。 月j l政，、、、杈組可為一在外表面形成有複數鰭片的圓筒 體，結片可增加散熱面積以增進散熱效率；該散熱模組更 進一步於其與燈罩接觸之一端形成有一凹槽，令該燈罩適 可匹配地置入該凹槽中與散熱模組固定。 前述導熱棒可為一鋼棒或一石墨棒。 前述熱傳導手段可Α μ # @， 杈了為表该導熱片或導熱棒上形成有一 的通孔與發光二極體熱接觸戈導熱棒通過印刷電路板上 有兩二:電手段係”線連接或於印刷電路板内側*設 前述固定手段係可於印刷 緣，並於導熱片上形成有數個穿邊緣上形成有數個凹 扣住凹緣而將印刷電路板與導熱二二具穿過穿孔 將印刷電路板與導熱片鎖固。心在一起，或以螺絲 剷述扣具係為一 Y型扣具。 【實施方式】 5 M286462 戶、施例之具體構造，請參閱第一圖所 二極體（4 〇 )、一印刷電路板（3 〇 )、 )與一燈罩（2 〇 )，其中··The end of the 'gastric thermal conduction rod is thermally contacted with the light emitting diode by means of heat conduction; and a lamp cover is used for fixing the light emitting diode and the printed circuit board between the lamp cover and the heat dissipation module. The foregoing structure can save cost because the required process steps are less used, and since the light-emitting diode system directly contacts the heat-conducting rod in the heat-dissipating module, heat can be directly transmitted to the heat-dissipating module, thereby obtaining Better heat dissipation. The heat dissipation module may be a cylindrical body formed with a plurality of wrong pieces on the outer surface, and the fins may increase the heat dissipation area to improve the heat dissipation efficiency; the heat dissipation module further forms a concave surface at one end of the contact with the lamp cover, so that the heat dissipation module The lamp cover is fitably fitted into the recess and fixed to the heat dissipation module. The other technical means adopted for achieving the foregoing purpose is that the light-emitting diode lamp comprises: ~ W π force 乂啕 a through hole, and the outer side corresponding to the through hole is provided with a hair _ X especially a pole body, The light-emitting diode is connected through the printed circuit board and electrically connected through the _channel Φ < V electric means; the M286462 a heat-dissipating core group is covered by a plurality of metals with high thermal conductivity respectively. The inner side of the heat conducting rod is in contact with the heat conducting sheet, and the outer side surface of the heat conducting sheet is in thermal contact with the light emitting diode by a heat conducting means, and the heat conducting sheet is fixed to the printed circuit board by a fixing means. The k-cover is used to fix the light-emitting diode and the printed circuit board between the lamp cover and the heat dissipation module. The jl zhen, 、, 杈 group may be a cylindrical body having a plurality of fins formed on the outer surface, and the slab may increase the heat dissipation area to improve the heat dissipation efficiency; the heat dissipation module further has a one end formed in contact with the lamp cover The recess is adapted to be fitably fitted into the recess to be fixed to the heat dissipation module. The heat conducting rod may be a steel rod or a graphite rod. The heat conduction means may be # μ # @, and the through hole formed on the heat conductive sheet or the heat conductive rod is in thermal contact with the light emitting diode. The heat conducting rod has two or two through the printed circuit board: Or on the inner side of the printed circuit board, the fixing means can be disposed on the printing edge, and a plurality of concave edges are formed on the plurality of wearing edges on the heat conducting sheet, and the printed circuit board and the heat conducting member are passed through the through hole to be printed. The circuit board and the heat-conducting piece are locked together. The heart is together, or the screw is used to shovel the buckle to be a Y-type fastener. [Embodiment] 5 M286462 household, the specific structure of the example, please refer to the diode of the first figure (4 〇), a printed circuit board (3 〇), ) and a lampshade (2 〇), where ··
1 0 )係以絲金屬為基材，由複數個鰭 1 1 )包覆一導熱棒（1 2 )所構成， 導熱棒（1 2 )係為一銅棒，又該導熱 —極體（4 〇 )間以一熱傳導手段熱接 熱傳導手段係於該導熱棒（1 2 )内側 iSl) ’供與發光二極體（4〇)的 散熱模組（1 〇 )之内側端則形成有一1 0) is composed of a wire metal as a base material, and is composed of a plurality of fins 1 1 ) coated with a heat conducting rod (1 2 ), the heat conducting rod (1 2 ) is a copper rod, and the heat conducting body (4) 〇) is thermally coupled to the inner side of the heat conducting rod (1 2 ) by a heat conduction means (i), and the inner side of the heat dissipating module (1 〇) for the light emitting diode (4 〇) is formed
關於本創作第 不，係包括一發光 一散熱模組（1 〇 該散熱模組（ 片組成的圓筒體（ 於本實施例中，該 棒（1 2 )與發光 觸，本實施例中該 端形成有一凸緣（ 熱源點接觸’而該 凹槽（1 4 ); ”亥印刷甩路板（3 〇 )表面形成有兩個穿孔（3 2 ) 與一通孔（3 1 )，於本實施例中，該發光二極體（4 〇 : 之接腳係以連接導線作為導電手段而穿過兩穿孔（3 2 )， 而前述導熱棒（1 2 )之凸緣（i 2丄），穿過通孔（3 1 )與發光二極體（4 0 )熱接觸以達導熱功效； 該燈罩（2 0 )係呈圓形蓋狀，於内側面延伸出一漏 斗部（2 1 )，適可匹配地置入前述散熱模組（1 〇 )之 凹槽（1 4 )中而與散熱模組（1 〇 )固定。 再請參閱第二圖，係本實施例之剖面圖，該發光二極 體（4 0 )係設置於該印刷電路板（3 0 )上，而與該導 熱棒（12)之凸緣（121)接觸，該導熱棒（12) 可迅速地將發光二極體（4 0 )所產生之熱傳導至由|蓄片 組成的鋁金屬圓筒體（1 1 )上以將熱量發散掉。 6 M286462 關於本創作之第二實施例，請參閱第三圖所示，其構 造大致與第一實施例同，不同之處為： 該印刷電路板（3 0，）係呈一圓形板狀，本實施例係 於印刷電路板（3 0，）内側面設有兩電極柱（3 4 )作為 導電手段，外側面則設有電路層（圖上未示），且於徑面 處形成有三個凹緣（3 3 )，圓心處則形成有一直徑小於 外仫的圓形通孔（3 1 ’），並使發光二極體（4 〇 )設於 該位置，而該發光二極體（4 〇 )之接腳係連接電極柱（3 4 ); 該散熱模組（1 0 )之圓筒體（1 1 )内側端無形, s且導4棒（1 2 ’）未形成有凸緣，並朝印刷電路法 (3 ?:—)方向尚包括一以圓形紹金屬導熱片（丄”為了: k面上由複數鰭片構成的圓筒體（1 1 ，苴 導熱片（13)上形成有數個穿孔 中央則形成有一凸緣（132)作」=)’其外側3Regarding the present invention, the present invention includes a light-emitting and heat-dissipating module (1 〇 the heat-dissipating module (the cylindrical body composed of the sheets (in the present embodiment, the rod (12) and the light-emitting contact, in the embodiment) The end is formed with a flange (heat source point contact ' and the groove (14);" the surface of the printed circuit board (3 〇) is formed with two perforations (3 2 ) and a through hole (3 1 ), in the present embodiment In the example, the light-emitting diode (4 〇: the pin is passed through the two perforations (3 2 ) by using a connecting wire as a conductive means, and the flange (i 2丄) of the heat conducting rod (1 2 ) is worn. The through hole (3 1 ) is in thermal contact with the light emitting diode (40) for thermal conductivity; the lampshade (20) has a circular cap shape, and a funnel portion (2 1 ) extends from the inner side surface. The heat dissipation module (1 )) is fixedly inserted into the recess (1 4 ) of the heat dissipation module (1 )) and fixed to the heat dissipation module (1 〇). Referring to the second figure, a cross-sectional view of the embodiment, the light emission The pole body (40) is disposed on the printed circuit board (30) and is in contact with the flange (121) of the heat conducting rod (12), and the heat conducting rod (12) can quickly emit light The heat generated by the polar body (40) is conducted to the aluminum metal cylinder (1 1 ) composed of the | stock sheet to dissipate the heat. 6 M286462 Regarding the second embodiment of the present creation, please refer to the third figure. The structure is substantially the same as that of the first embodiment, except that the printed circuit board (30) is in the form of a circular plate. The embodiment is provided on the inner side of the printed circuit board (30). There are two electrode columns (3 4 ) as a conductive means, and a circuit layer (not shown) is arranged on the outer side surface, and three concave edges (3 3 ) are formed at the radial surface, and a diameter smaller than the outer diameter is formed at the center of the circle. a circular through hole (3 1 '), and the light emitting diode (4 〇) is disposed at the position, and the pin of the light emitting diode (4 〇) is connected to the electrode column (3 4 ); The inner end of the cylindrical body (1 1 ) of the module (10) is invisible, and the guide 4 rod (1 2 ') is not formed with a flange, and includes a direction toward the printed circuit method (3?:-) The circular metal heat-conducting sheet (丄) is: a cylindrical body composed of a plurality of fins on the k-plane (1 1 , a plurality of perforated centers are formed on the crucible heat-conducting sheet (13) Flange (132) as '=') its outer side 3
.十L “）作為熱傳導手段，穿過肯 述印刷電路板（3 〇，）上的通孔（ 體熱接觸； 13 i )而與發光二才i.10L") as a means of heat conduction, through the through hole (body thermal contact; 13 i) on the printed circuit board (3 〇,)
片中以—扣具（5Q)作為固定手段將導旁 (5 it:!!電路板（3〇，)固定在-起，且該W 配地穿過前述導熱片（13)上的穿孔：V 住印刷電路板（3 0，）之凹緣（）’並扣 板(3。，)與導熱片（13)扣合。）進而將印⑽ 第二實施例將發光二極體（4Q)所產生之熱傳導至 7 M286462 3 )，冉經由導熱片（1 3 )傳導至導熱棒 2)，以增加散熱的面積’可迅速的將熱量發散， 速散熱的效果。 逐力In the film, the buckle (5Q) is used as a fixing means to fix the guide (5 it:!! circuit board (3〇,)), and the W grounding passes through the through hole on the heat conductive sheet (13): V The printed circuit board (30) has a concave edge ()' and the gusset plate (3.,) is fastened to the thermal conductive sheet (13).) Further printing (10) The second embodiment will illuminate the diode (4Q) The heat generated is transmitted to 7 M286462 3), and the heat is transmitted to the heat conducting rod 2) via the heat conducting sheet (13) to increase the heat dissipating area, which can quickly dissipate heat and accelerate the heat. Force
+上述可知，由於本創作僅需—散熱一體成型之散埶 模組’故於製程中可較為簡易、便利的製造…於係： 用銅棒或石墨棒作為導熱棒導熱，故可增加其散熱效果； 又由於係以導熱棒與發光二極體直接接觸導熱，或藉由一 導熱片增加導熱面冑’因此導熱之方式相較習用之設計必 有更佳之進步，使得散熱的效果亦相對增加許多。 綜上所述，本創作實為一極具進步性之佳作，且未見 於刊物或公開使用，辟人新剂直夺丨出 K⑺付合新型專利之申請要件，爰依法提 出申請。 【圖式簡單說明】+ As can be seen from the above, since this creation only needs to be a heat-dissipating one-piece diverging module, it can be easily and conveniently manufactured in the process... In the case of using a copper rod or a graphite rod as a heat conducting rod, it can increase its heat dissipation. The effect is that the heat conduction rod is directly in contact with the light-emitting diode to directly conduct heat conduction, or the heat-conducting surface is increased by a heat-conducting sheet. Therefore, the heat conduction method is better than the conventional design, so that the heat dissipation effect is relatively increased. a lot of. In summary, this creation is a highly progressive work, and it has not been seen in the publication or public use. It has created a new agent to directly extract the application requirements of the K(7) Fuhe new patent, and filed an application according to law. [Simple description of the map]
第一圖：係本創作第 弟 >—圖·係本創作第 第三圖：係本創作第 第四圖：係習用技術 【主要元件符號說 (1 0 )散熱模組 (12) 導熱棒 (13) 導熱片 (1 3 2 )圓筒體 (2〇）燈罩 實施例之分解構造圖。 實施例之剖面圖。 實施例之分解構造圖。 分解構造圖。 ] (1 1 )圓筒體 (1 2 1 )凸緣 (1 3 1 )穿孔· (1 4 )凹槽 (2 1 )漏斗部 8 M286462 (30) ( 3〇’）印刷電路板 (31) ( 3 1 ’）通孔（3 2 )穿孔 (3 3 )凹緣 （3 4 )電極柱 (4 0 )發光二極體 (5 0 )扣具 （5 1 )扣腳 (6 0 )基座 (7 0 )導熱平台 （7 1 )電極柱The first picture: the first brother of this creation> The first picture of the creation of this book: the fourth picture of this creation: the use of the technology [main component symbol (1 0) thermal module (12) thermal bar (13) Explosive configuration diagram of the heat-conducting sheet (1 3 2) cylindrical body (2 〇) lampshade embodiment. A cross-sectional view of an embodiment. An exploded structural view of the embodiment. Decompose the construction diagram. (1 1 ) cylindrical body (1 2 1 ) flange (1 3 1 ) perforated · (1 4 ) groove (2 1 ) funnel portion 8 M286462 (30) ( 3〇') printed circuit board (31) ( 3 1 ') through hole (3 2 ) perforation (3 3 ) concave edge (3 4 ) electrode column (4 0 ) light emitting diode (50) buckle (5 1) buckle foot (60) base (7 0) heat conduction platform (7 1 ) electrode column