TWM258343U - Side-sucked cooling structure of industrial computer - Google Patents

Side-sucked cooling structure of industrial computer Download PDF

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Publication number
TWM258343U
TWM258343U TW93209999U TW93209999U TWM258343U TW M258343 U TWM258343 U TW M258343U TW 93209999 U TW93209999 U TW 93209999U TW 93209999 U TW93209999 U TW 93209999U TW M258343 U TWM258343 U TW M258343U
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Taiwan
Prior art keywords
heat
computer
cooling
motherboard
industrial computer
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Application number
TW93209999U
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Chinese (zh)
Inventor
Guo-Chuan Hung
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Guo-Chuan Hung
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Priority to TW93209999U priority Critical patent/TWM258343U/en
Publication of TWM258343U publication Critical patent/TWM258343U/en

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Description

M258343 23、創作說明(1) 【技術領域】 本創作係 種利用主機板 後方的距離最 散熱效能者。 【先前技術】 按,工業 南的電力,故 預留所需的散 祠服器的空間 ,雖然有报多 閱第一圖,都 此將熱源產生 後再以機殼内 散熱孔d排出, 到散熱的功能 限散熱面積的 間内很不容易 為耗時且緩慢 故本創作 熱鰭片的風罩 面緊密貼合, 加上因為中央 背板上的風扇 有關「側吸式工業電腦散熱結構」,尤指一 逆日守針轉向9 0度,使中央處理器距電腦機殼 近同4與整體散熱的方向相同,有效提升 二用祠服器、所使用的中央處理器'通常是消耗較 j中央處理益所產生的熱量最大,但機殼内 :空間卻是有限的,習知之散熱器因工業用 ^ 一般桌上型電腦小,故在使用散熱構造時 ,不同構造安排方式,以在歸納後,請參 2用在熱源體a上方設置有—散熱器b,藉 :熱量整個傳導至位於上方之散熱器b,然 置的風扇c來將熱量吹散,自機殼後方的 這種胃散熱的構造安排方式,雖然也可以達 五但=因為熱源在短時間内整個被聚集在有 ^熱裔上,且不斷的累積,所以熱量在短時 破驅散掉,又因此種散熱器在散熱功能上級 ’所以散熱方式並不理想。 人利用電腦機殼後方的風扇,加上可包覆散 σ構使政熱鳍片的底部與中央處理器的頂 以後背板上的風扇由内向外抽的方式設計, 處理器距離後方的通風孔距離較近,$使後 陕速將中央處理器產生的熱量抽出機殼外,M258343 23. Creative Instructions (1) [Technical Field] This creative system uses the distance from the back of the motherboard to maximize heat dissipation. [Previous technology] According to the power of Industrial South, the space required for the Sanctuary server is reserved. Although there are many reports to read the first picture, the heat source will be generated and then discharged through the heat dissipation hole d in the chassis. The function of heat dissipation is not easy to be time-consuming and slow. Therefore, the air hood surface of the thermal fins is closely fitted. In addition, the fan on the central back panel is related to the "side-suction industrial computer cooling structure". , Especially when the needle is turned 90 degrees against the sun, so that the central processing unit is close to the computer case and the overall cooling direction is the same, effectively improving the dual-purpose temple server, the central processing unit used is usually more expensive jThe heat generated by the central processing unit is the largest, but the space inside the cabinet is limited. The conventional heat sink is for industrial use. ^ General desktop computers are small. Therefore, when using a heat dissipation structure, different structural arrangements are used to After induction, please refer to 2. Heat sink b is provided above the heat source body a. The heat sink b is used to conduct heat to the heat sink b located above, and the fan c is used to dissipate the heat. Structural arrangement of gastric heat dissipation Although it can also reach five but = because the heat source is collected on the heat source in a short period of time, and it is continuously accumulated, the heat is broken away in a short time, so this kind of radiator is superior in heat dissipation. The cooling method is not ideal. A person uses a fan behind the computer case, plus a fan that can cover the bottom of the thermal fins and the top and rear fans on the central processor. The fan is designed to draw from the inside out, and the processor is far from the rear. The distance between the holes is relatively short, so that Hou Shaanxi will extract the heat generated by the central processing unit out of the case.

第5頁 M258343Page 5 M258343

另,又因散熱方向與電腦機殼内部結構配置的方式 走向設有電子元件阻擋其通風道,所以也可以將電腦:: 内部其他發熱元件所產生的熱量以相同方向一併帶试成 能更有效提升散熱效能。 ’而 【内容】 本案創作人有鑑上述習知構造的缺失,爰精心, 並積個人從事該項事業的多年經驗,終設計出一種 ^ ’ 「側吸式工業電腦散熱結構」。 斤’斤的 本創作之主要目的,旨在提供一種裝設於工業用 内部的散熱構造’不但簡單且可有效提升散熱效能。_ 為達上述目的’本創作「側吸式工業電腦散熱結構 ,其主要係由風罩、散熱鰭片與散熱風扇所組成,' ^中 在電腦機殼的側邊後段作成内縮缺口的外殼結構,兮缺 可供主機板上的輸出/入連接介面通過,然後將主機板r 逆時針轉動90度固定在電腦機殼内,並使主機板之輪&出^ 入連接介面卡入特定孔位後,再將散熱鰭片放置於^罩 包覆’令散熱鰭片的底部與中央處理器的頂面緊密貼人内 接著’將風罩連接至電腦機殼的後背板上,使數個散^ ’ 扇被包覆於風罩與電腦機殼連接處内部,藉由内向外^八 的方式進行散熱。 。 風 依據上述構造實施時,原置於中間的中央處理器的 置會向後方移動而更接近電腦機殼的後背板,使散^風= 與中央處理器的距離縮短,相對地,其於風罩内2斤^二屬 熱量的距離也會縮短,更進一步增加了吸引的力量·,且引In addition, because of the direction of heat dissipation and the configuration of the internal structure of the computer case, there are electronic components to block the ventilation channels. Therefore, the heat generated by other internal heating components in the computer can also be tested in the same direction. Effectively improve cooling performance. ’And [Content] The creator of this case has learned the lack of the above-mentioned conventional structure, and carefully, and accumulated many years of personal experience in the cause, has finally designed a“ side-suction industrial computer cooling structure ”. The main purpose of this work is to provide a heat dissipation structure installed inside the industry, which is not only simple but also can effectively improve heat dissipation performance. _ To achieve the above purpose, 'this creation "side-suction industrial computer cooling structure, which is mainly composed of wind hood, cooling fins and cooling fans,' ^ in the rear side of the computer case is made into a recessed shell Structure, it can be passed through the input / output connection interface on the motherboard, and then turn the motherboard r 90 degrees counterclockwise to fix it in the computer case, and make the wheel & input connection interface of the motherboard click into the specific After the holes are placed, the heat sink fins are placed on the cover to make the bottom of the heat sink fins and the top surface of the central processor close to each other. Then, the wind shield is connected to the back panel of the computer case, so that Each fan is covered inside the connection between the windshield and the computer case, and heat is dissipated from the inside to the outside. When the wind is implemented according to the above structure, the orientation of the central processor originally placed in the middle will be Moving behind and closer to the back of the computer case, the diffused wind = the distance from the central processing unit is shortened. On the other hand, the distance of 2 kg of heat in the wind hood will be shortened, which further increases the attraction. The power of

M258343 四、創作說明(3) 散熱鰭片包覆於風罩内,由於開口 ^ 熱風扇進行散熱時,產 向向内,當後方的散 上-些發熱元件所產生: = 功能,㈣主機板 =能:目的,且採用數個散出不m效提升散 =心習知内部單-風扇損壞時,整個大增且不 君%’當其中之一散熱風扇損壞時,复::旎就失效的 以繼續運轉,達到持續吸引散埶^他放熱風扇依然可 【實施方式】 … 的° 較佳之可行實施例 「側吸式工業電腦 鰭片20與數個散熱M258343 IV. Creation instructions (3) The cooling fins are enclosed in the hood. Due to the opening ^ heat fan for heat dissipation, the production direction is inward. When the rear surface is scattered-some heating elements are generated: = function, ㈣ motherboard = Yes: Purpose, and use several diffuse inefficiencies to improve dispersion. = When the internal single-fan is damaged, the whole increase and the percentage is not large. 'When one of the cooling fans is damaged, the complex :: 旎 will fail It can continue to run to achieve continuous attraction. ^ He radiating fan can still be used. [Embodiment]… ° The preferred feasible embodiment "Side-suction industrial computer fins 20 and several heat dissipation

、,本創作之構造、裝置及其特徵舉— 並配合圖式詳細說明如下: 請搭配第二、三圖所示,本創作之 散熱結構」,其主要係由風罩丨0、散熱 風扇3 0所組成,其中The structure, installation, and features of this creation—and the detailed description with the drawings are as follows: Please match the second and third figures, the heat dissipation structure of this creation ", which is mainly composed of the windshield 丨 0 and the cooling fan 3 Consisting of 0, of which

於電腦機殼2的側邊後段作成内縮缺口 “的外殼結 構,其可供主機板3上的輪出/入連接介面3a通過並固定, 然後將主機板3逆時針轉動go度固定在電腦機殼2内,並使 ^機板3之輸出/入連接介面3a由該内縮缺口仏穿出;接 著,將散熱鰭片20包覆於風罩1〇内,令散熱鰭片3〇的底部 與中央處理器4的頂面緊密貼合,將風罩1〇連接至電腦機 殼2的後背板2b,使數個散熱風扇30包覆於連接處内部, 以由内向外抽的方式進行散熱。 請參閱第四A、四B圖,為本創作之實施示意圖,依據 上述構造實施時,中央處理器4的位置會向後方移動而更 接近電腦機殼2的後背板2b,使散熱風扇20與中央處理器4An indented notch shell structure is formed on the back side of the computer case 2 to allow the wheel-out / in-connection interface 3a on the motherboard 3 to pass through and be fixed, and then the motherboard 3 is turned counterclockwise to fix it to the computer. Inside the casing 2 and let the output / input connection interface 3a of the plate 3 pass through the indented notch; then, the heat dissipation fins 20 are enclosed in the windshield 10, so that the heat dissipation fins 30 The bottom is in close contact with the top surface of the central processing unit 4. The air hood 10 is connected to the back plate 2b of the computer case 2, and several cooling fans 30 are wrapped inside the connection, which is carried out from the inside to the outside. Please refer to Figures 4A and 4B, which are schematic diagrams of the implementation of this creation. During the implementation of the above structure, the position of the central processing unit 4 will be moved backward and closer to the back plate 2b of the computer case 2 to enable the cooling fan. 20 with CPU 4

第7頁 M258343 四、創作說明(4) 的距離縮短,且 向内,當後方的 風機的功能,會 熱量一併帶出。 綜上所述, 電腦機殼的側邊 電腦機殼後背板 罩結構,令散熱 合,以由内向外 之功效,而具創 依專利法之規定 散熱鰭 散熱風 連同主 本創作 後段作 内的散 韓片的 抽的方 作之「 ,向 片20包覆於風罩10内,其開口方向 :3〇進行吸引散熱時,i生有如抽 機板3上一些發熱元件3b所產生的 、侧吸式工業電腦散熱結構」,於 成内縮缺口的外殼結構,使裝設於 熱風扇’加上可包覆散熱鰭片的風 J部與中央處理器的頂面緊密貼 ί用達到有效提升散熱效率 起:型=性」;申請人美 叮安專利之申請。 M258343 圖式簡單說明 圖式簡單說明: 第一圖為習知之實施示意圖 第二圖為本創作之立體分解圖 第三圖為本創作之立體結構圖 第四A圖為本創作之實施示意圖 第四B圖為本創作之側面剖視圖 圖號說明:Page 7 M258343 Fourth, the distance of the creative description (4) is shortened and turned inward. When the function of the fan behind, the heat will be taken out together. To sum up, the side of the computer case, the back cover structure of the computer case, allows the heat dissipation to work from the inside out, and it is innovative in accordance with the provisions of the patent law. The drawing of the San Han piece is "", the piece 20 is wrapped in the wind hood 10, and the opening direction is: 30. When attracting and dissipating heat, i has the same side as that generated by some heating elements 3b on the pump plate 3. "Sucking industrial computer heat dissipation structure", which is formed into a shrinkable shell structure, so that the wind J part installed on the heat fan plus the heat dissipation fins can be closely attached to the top surface of the central processor to achieve effective improvement. The heat dissipation efficiency starts from: type = sexuality; the applicant's application for Mei Ding'an patent. M258343 Simple illustration of the diagram Simple illustration of the diagram: The first diagram is a conventional implementation diagram The second diagram is a three-dimensional exploded view of the creation The third diagram is a three-dimensional structure diagram of the creation The fourth A is the diagram of the implementation of the fourth Figure B is a side sectional view of the creation.

2----- ——電 腦 機殼 2a 缺 V 2b---- ——後 背 板 3----- ----± 機 板 3a---- 輸 出 /入連接介面 3b---- ——發 熱 元 件 4----- ——中 央 處理器 10—— -風 罩 20---- ——散 熱 鰭片 30—— ——散 熱 風 扇2 ----- ——Computer case 2a lacks V 2b ---- ——Back panel 3 ----- ---- ± Machine board 3a ---- I / O connection interface 3b --- -——Heating Element 4 ----- ——Central Processing Unit 10 —— -Air Hood 20 ---- ——Heat Dissipating Fin 30—— ——Heat Dissipating Fan

第9頁Page 9

Claims (1)

M258343M258343 五、申請專利範圍 • 一種1側吸式工業電腦散熱結 熱鰭片與散熱風扇所組成,可快::,主要:由風罩、散 央處理器產生的熱量快速排出,避:工業用電腦内部之中 效能;其特徵在於:將主機板逆日± 3聚集的熱量影響整德 電腦機殼内,使主機板上的輪出向^度後,鎖固於 側面的内縮缺口穿出,並將散孰絲連勺接"面由電腦機殼 熱鰭片的底部盥中央卞理考的;包覆於風罩内,令韵 [效ίί 的内部裝設有數個散熱風扇,可有效提升傲 2 ·如申請專利範圍 構」’其中之散熱 第1項所述之「側吸式工業電腦散熱結 風屬係採用由内向外抽出的塑式。V. Scope of patent application • A type of 1 side suction industrial computer cooling junction fins and cooling fan, which can quickly ::, Mainly: The heat generated by the windshield and the central processor is quickly discharged, avoiding: industrial computers Internal efficiency; It is characterized by: The heat accumulated by the motherboard on the reverse day ± 3 affects the inside of the computer case, after the wheel on the motherboard is turned out ^ degrees, it is locked on the side of the retracted notch and penetrates, and Connect the scrambled wire with a spoon. The surface is covered by the center of the bottom of the computer's hot fins. It is wrapped in the wind hood, so that the interior of the rhyme [effect ί] is equipped with several cooling fans, which can effectively enhance the proud 2 · The "side-suction industrial computer cooling junction wind" described in item 1 of the "Application for Patent Scope Structure" is a plastic type drawn from the inside out.
TW93209999U 2004-06-25 2004-06-25 Side-sucked cooling structure of industrial computer TWM258343U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103376856A (en) * 2012-04-26 2013-10-30 鸿富锦精密工业(深圳)有限公司 Heat dissipation stabilizing structure and server with same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103376856A (en) * 2012-04-26 2013-10-30 鸿富锦精密工业(深圳)有限公司 Heat dissipation stabilizing structure and server with same
TWI450682B (en) * 2012-04-26 2014-08-21 Hon Hai Prec Ind Co Ltd Holding structure for radiating heat and server using same
CN103376856B (en) * 2012-04-26 2017-02-22 周星星 Heat dissipation stabilizing structure and server with same

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