TWI834132B - Sensing chip with fluid device - Google Patents

Sensing chip with fluid device Download PDF

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Publication number
TWI834132B
TWI834132B TW111109041A TW111109041A TWI834132B TW I834132 B TWI834132 B TW I834132B TW 111109041 A TW111109041 A TW 111109041A TW 111109041 A TW111109041 A TW 111109041A TW I834132 B TWI834132 B TW I834132B
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fluid
gate
measured
substrate
area
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TW111109041A
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Chinese (zh)
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TW202300907A (en
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高熹騰
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高熹騰
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Priority to CN202210681190.2A priority Critical patent/CN115508426A/en
Priority to AU2022204265A priority patent/AU2022204265A1/en
Priority to US17/845,504 priority patent/US20220404345A1/en
Priority to CA3164766A priority patent/CA3164766A1/en
Priority to EP22180215.0A priority patent/EP4109086A1/en
Publication of TW202300907A publication Critical patent/TW202300907A/en
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Publication of TWI834132B publication Critical patent/TWI834132B/en

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Abstract

A sensing chip with fluid device is provided, which includes a substrate with a first area and a second area; a field effect transistor which is arranged in the second area of the substrate and is electrically connected with the field effect transistor. The fluid device includes an insulation layer with a window to expose the surface of the substrate in the second area. A second gate electrode is arranged in the window of the isolation layer on the second area of the substrate. The second gate electrode includes a polysilicon layer and one or more metal layer(s) thereon, and a reference electrode adjacent to the second gate on the second area of the substrate. The fluid to be tested is placed in the fluid device to contact with the second gate, and the receptor on the metal layer will capture the target in the fluid to be tested, so the voltage of the metal layer will change follow with the amount of the target which are captured by the receptor. Thus, the concentration of the target in the fluid can be obtained by the changes of the voltage of the metal layer.

Description

具有流體裝置的感測晶片 Sensing chip with fluidic device

本發明涉及一種檢測技術領域,特別是有關於一種可檢測蛋白質、細菌、病毒、懸浮微粒,且具有流體裝置的感測晶片。 The present invention relates to the field of detection technology, and in particular to a sensing chip that can detect proteins, bacteria, viruses, and suspended particles and has a fluid device.

生物感測器是根據電學、電化學、光學及機械檢測原理等基礎進行操作,用來感應及檢測生物分子的裝置。具有電晶體的生物感測器可以經由電性方式感應生物分子或是生物實體的電荷、光子及機械性質。此檢測行為可經由直接檢測感應,或經由特定反應物與生物分子/生物實體進行反應或是交互作用來達成。這些生物感測器可用半導體製程製造生產,可快速地轉換電子訊號,非常容易地應用於積體電路(integrated circuit;ICs)及微機電系統(microelectromechanical systems;MEMs)。 Biosensors are devices that operate based on electrical, electrochemical, optical and mechanical detection principles and are used to sense and detect biomolecules. Biosensors with transistors can electrically sense charges, photons, and mechanical properties of biomolecules or biological entities. This detection behavior can be achieved through direct detection and induction, or through the reaction or interaction of specific reactants with biomolecules/biological entities. These biosensors can be manufactured using semiconductor processes, which can quickly convert electronic signals and can be easily applied to integrated circuits (ICs) and microelectromechanical systems (MEMs).

生物晶片實質上是一種微型實驗室,可以同時進行數百個或是數千個生化反應。生物晶片可以檢測特殊的生物分子、測量其性質、運算處理訊號,甚至是直接分析資料,故生物晶片使研究人員可以快速地篩選大量的生物分析物,應用於從疾病診斷到檢測生化恐怖攻擊等各種目的。先進的生物晶片利用流體通道邊許多生物感測器進行反應整合、感應及樣品管理。生物場效電晶體(biological field-effect transistors,or bio-organic field-effect transistors;BioFET)是一 種含有電晶體的生物感測器,可經由電性方式感應生物分子或是生物實體。雖然生物場效電晶體在許多方面具有優勢,但在其製造及/或操作上也出現了一些挑戰,例如:基於與半導體製程相容性的課題,生物性的限制及/或極限,在大型積體電路(Large scale integration;LSI)製程上出現許多挑戰,例如:電子訊號與生物應用的整合。 A biochip is essentially a miniature laboratory that can conduct hundreds or thousands of biochemical reactions simultaneously. Biochips can detect special biomolecules, measure their properties, compute and process signals, and even directly analyze data. Therefore, biochips allow researchers to quickly screen a large number of biological analytes for applications ranging from disease diagnosis to the detection of biochemical terrorist attacks. various purposes. Advanced biochips utilize many biosensors alongside fluidic channels for reaction integration, sensing and sample management. Biological field-effect transistors, or bio-organic field-effect transistors; BioFET) is a A biosensor containing a transistor that can electrically sense biomolecules or biological entities. Although biofield effect transistors have advantages in many aspects, there are also some challenges in their manufacturing and/or operation, such as: issues based on compatibility with semiconductor manufacturing processes, biological limitations and/or limits, in large-scale Many challenges arise in the integrated circuit (Large scale integration; LSI) manufacturing process, such as the integration of electronic signals and biological applications.

此外,現有技術的生物感測晶片僅能檢測到有/無細菌、病毒或是懸浮微粒,且檢測面積範圍有限,也無法估算其濃度。另外,晶片方式所設計的高靈敏度奈米線,容易有雜訊干擾,以致於容易有誤判的情況發生,且奈米線以多晶矽(polysilicon)暴露在外,此為特殊的製程,然而大多數的晶片廠不願意提供特殊且須要客製化的製程來配合生產製造,因此無法提高良率,而無法有效的生產。 In addition, the existing biosensing chips can only detect the presence/absence of bacteria, viruses or suspended particles, and the detection area range is limited, and their concentration cannot be estimated. In addition, the high-sensitivity nanowires designed in the chip method are prone to noise interference, which may lead to misjudgment. Moreover, the nanowires are exposed with polysilicon. This is a special manufacturing process. However, most Chip factories are unwilling to provide special and customized processes to coordinate production and manufacturing, so they cannot improve yield and cannot produce efficiently.

另外,聚合酶連鎖反應(PCR,polymerase chain reaction)須要提供較長的檢測反應時間或是需要標記之後才能被檢測出來,且須要昂貴的儀器來操作,無法普及化。 In addition, polymerase chain reaction (PCR) requires a long detection reaction time or needs to be labeled before it can be detected. It also requires expensive equipment to operate and cannot be popularized.

本發明主要目的是揭露一種具有流體裝置的感測晶片,可以依據目前晶片廠所提供的互補式金屬氧化半導體(CMOS,complementary metal oxide semiconductor)製程來設計出具有流體裝置的感測晶片。 The main purpose of the present invention is to disclose a sensing chip with a fluid device. The sensing chip with the fluid device can be designed based on the complementary metal oxide semiconductor (CMOS) process currently provided by chip factories.

本發明的另一目的在於利用具有流體裝置的感測晶片,可以檢測液體或是氣體的待測流體,除了可以快速的檢測出在待測流體內的目標物是否存在之外,還可以檢測出待測流體內的目標物的濃度。 Another object of the present invention is to use a sensing chip with a fluid device to detect liquid or gas fluid to be measured. In addition to quickly detecting whether the target object in the fluid to be measured exists, it can also detect The concentration of the target substance in the fluid to be measured.

本發明的更一目在於利用具有流體裝置的感測晶片對於溫度敏感性的目標物進行檢測,利用溫度調控單元對具有流體裝置的感測晶片提供溫度調控訊號,用以對具有流體裝置的感測晶片上的待測流體進行加熱並調控其溫度,使得待測流體內的目標物因溫度升高而增加其動能或是變化分解,金屬層上的接受器可以有效的捕捉目標物,藉由金屬層所產生的電壓值變化,量測在待測流體內的目標物在預設溫度下的數量或是濃度變化。 Another object of the present invention is to use a sensing chip with a fluid device to detect a temperature-sensitive target, and use a temperature control unit to provide a temperature control signal to the sensing chip with a fluid device, so as to sense the fluid device. The fluid to be measured on the chip is heated and its temperature is adjusted, so that the target object in the fluid to be measured increases its kinetic energy or changes and decomposes due to the increase in temperature. The receptor on the metal layer can effectively capture the target object through the metal. The change in voltage value generated by the layer is used to measure the change in quantity or concentration of the target substance in the fluid to be measured at a preset temperature.

本發明的再一目的在於將多個具有流體裝置的感測晶片以分小區檢測方式形成一個感測元件,藉由提高待測流體本身的樣本體積量來提高檢測的準確度。 Another object of the present invention is to form a sensing element using a plurality of sensing chips with fluid devices in a sub-area detection manner, thereby improving the detection accuracy by increasing the sample volume of the fluid to be detected.

本發明的又一目的在於將多個具有流體裝置的感測晶片以形成一個感測元件,依據具有流體裝置的感測晶片中的接受器材質相同或是不同,以捕捉在同一個待測流體內的相同目標物或是多個不同的目標物,以節省檢測時間,並且可以得到一個或是多個目標物的檢測結果,以提供後續判斷或是評估。 Another object of the present invention is to form a sensing element using multiple sensing chips with fluid devices, and the materials of the receptors in the sensing chips with fluid devices are the same or different, so as to capture the same flow to be measured. The same target or multiple different targets in the body can save detection time, and the detection results of one or multiple targets can be obtained to provide subsequent judgment or evaluation.

根據上述目的,本發明揭露一種具有流體裝置的感測晶片,包括:基板,具有第一區域及第二區域;場效電晶體,設置在基板的第一區域中,且場效電晶體包含:第一閘極、源極及汲極,且第一閘極設置在源極及汲極上;以及流體裝置,設置在基板的第二區域上且與場效電晶體電性連接,其中流體裝置包括:隔離層,具有窗口以暴露在第二區域的基板的表面,其中窗口所圍成的區域為容置空間;第二閘極,設置在隔離層的窗口內,第二閘極由基板向上依序包括多晶矽層及一層或多層的金屬層;以及參考電極,鄰近於第二閘極設置在基板的第二區域上,其中,將待測流體容置於容置空間內,使得第二閘極接觸到待測流體之後,在金屬層上的多個接受器用以捕捉在待測流體內的多個目標物,且第二 閘極的金屬層的電壓值會隨著這些接受器捕捉這些目標物的數量而改變,及第二閘極將金屬層的電壓值變化經由場效電晶體傳送至外部處理單元以對電壓值變化進行處理,以計算目標物濃度。 According to the above object, the present invention discloses a sensing chip with a fluid device, including: a substrate having a first area and a second area; a field effect transistor disposed in the first area of the substrate, and the field effect transistor includes: a first gate, a source and a drain, and the first gate is disposed on the source and the drain; and a fluid device disposed on the second region of the substrate and electrically connected to the field effect transistor, wherein the fluid device includes : The isolation layer has a window to expose the surface of the substrate in the second area, where the area enclosed by the window is the accommodation space; the second gate is arranged in the window of the isolation layer, and the second gate depends upward from the substrate. The sequence includes a polycrystalline silicon layer and one or more metal layers; and a reference electrode, which is disposed on the second area of the substrate adjacent to the second gate, wherein the fluid to be measured is accommodated in the accommodation space, so that the second gate After contacting the fluid to be measured, multiple receptors on the metal layer are used to capture multiple targets in the fluid to be measured, and a second The voltage value of the metal layer of the gate will change as the number of these targets captured by these receptors, and the second gate transmits the voltage value change of the metal layer to the external processing unit through the field effect transistor to respond to the voltage value change. Processed to calculate target concentration.

在本發明的一較佳實施例中,參考電極是當待測流體容置於容置空間時,與待測流體接觸並供應量測第二閘極的金屬層的電壓值變化所需的電壓。 In a preferred embodiment of the present invention, the reference electrode is in contact with the fluid to be measured when the fluid to be measured is contained in the accommodation space and supplies the voltage required for measuring changes in the voltage value of the metal layer of the second gate. .

本發明揭露另一種具有流體裝置的感測晶片,包括:基板具有第一區域及第二區域;場效電晶體,設置於基板的第一區域中,場效電晶體包含第一閘極、源極及汲極,第一閘極設置在源極及汲極之間且在基板上;以及流體裝置,設置在基板的第二區域且與場效電晶體電性連接,流體裝置包括:隔離層,具有窗口且暴露第二區域的基板的表面,其中窗口所圍成的區域為容置空間;第二閘極,設置於隔離層的窗口內,第二閘極由基板往上包括多晶矽層及一層或多層的金屬層;以及參考電極,鄰近於第二閘極且設置在基板的第二區域上,參考電極與待測流體接觸,其中,將待測流體容置於容置空間內,使得第二閘極的金屬層接觸到待測流體,將第二閘極中的多晶矽層的一端用以接地及多晶矽層的另一端與溫度調控單元電性連接,溫度調控單元提供溫度調控訊號,並透過多晶矽層利用溫度調控訊號對在容置空間內的待測流體進行加熱並調控其溫度,使得待測流體的溫度在達到預設溫度的過程中,在金屬層的表面上的多個接受器用以捕捉在待測流體內的多個目標物,且第二閘極的金屬層的電壓值會隨著多個接受器捕捉多個目標物的數量而改變,且第二閘極將金屬層的電壓值變化經由場效電晶體以對應的電流值變化傳送至外部處理單元,由外部處理單元處理 以得到對應於金屬層的電壓值變化的待測流體內的多個目標物在預設溫度下的濃度值。 The invention discloses another sensing chip with a fluid device, including: a substrate having a first area and a second area; a field effect transistor disposed in the first area of the substrate, the field effect transistor including a first gate, a source pole and drain, the first gate is disposed between the source and the drain and on the substrate; and a fluid device is disposed in the second area of the substrate and electrically connected to the field effect transistor, the fluid device includes: an isolation layer , has a window and exposes the surface of the substrate in the second area, where the area surrounded by the window is the accommodation space; the second gate is arranged in the window of the isolation layer, and the second gate includes a polycrystalline silicon layer and a One or more metal layers; and a reference electrode, adjacent to the second gate and disposed on the second area of the substrate, the reference electrode is in contact with the fluid to be measured, wherein the fluid to be measured is accommodated in the accommodation space, so that The metal layer of the second gate contacts the fluid to be measured. One end of the polycrystalline silicon layer in the second gate is used for grounding and the other end of the polycrystalline silicon layer is electrically connected to the temperature control unit. The temperature control unit provides a temperature control signal, and The temperature control signal is used through the polycrystalline silicon layer to heat and regulate the temperature of the fluid to be measured in the accommodation space, so that when the temperature of the fluid to be measured reaches the preset temperature, multiple receptors on the surface of the metal layer are used. to capture multiple targets in the fluid to be measured, and the voltage value of the metal layer of the second gate will change with the number of multiple targets captured by the multiple receptors, and the second gate will The voltage value changes are transmitted to the external processing unit via the field effect transistor with corresponding current value changes, and are processed by the external processing unit To obtain concentration values of multiple target objects in the fluid to be measured at a preset temperature corresponding to changes in the voltage value of the metal layer.

在本發明的一較佳實施例中,溫度調控單元為脈衝寬度調變單元(PWM,pulse width modulation)。 In a preferred embodiment of the present invention, the temperature control unit is a pulse width modulation unit (PWM).

在本發明的一較佳實施例中,預設溫度範圍為50℃-95℃。 In a preferred embodiment of the present invention, the preset temperature range is 50°C-95°C.

根據上述目的,本發明還揭露另一種具有流體裝置的感測晶片,包括:基板,具有第一區域及第二區域;場效電晶體,設置於基板的第一區域中,場效電晶體包含第一閘極、源極及汲極,且第一閘極設置在源極及汲極上;以及流體裝置,設置在基板的第二區域且與場效電晶體電性連接,其中流體裝置包括:隔離層,具有窗口,且設置於基板的第二區域上以暴露在第二區域的基板的表面,其中窗口所圍成的區域為容置空間;第二閘極,設置於隔離層的窗口內,第二閘極由基板往上包括多晶矽層及一層或多層的金屬層,藉此,當將具有流體裝置的感測晶片置於具有待測流體的環境下,並使待測流體通過流體裝置的第二閘極,對流體裝置的第二閘極多晶矽層施加電壓時,第二閘極的金屬層及接受器的表面會產生多個電荷,在金屬層上的每一個電荷用以捕捉在待測流體內的目標物,且第二閘極的金屬層的電壓值會隨著這些電荷捕捉目標物的數量而改變,且第二閘極將金屬層的電壓值變化經由場效電晶體傳送至外部處理單元以進行處理,並進一步計算後得到待測液體內的目標物濃度。 According to the above object, the present invention also discloses another sensing chip with a fluid device, including: a substrate having a first area and a second area; a field effect transistor disposed in the first area of the substrate, the field effect transistor including A first gate, a source and a drain, and the first gate is disposed on the source and the drain; and a fluid device disposed in the second region of the substrate and electrically connected to the field effect transistor, wherein the fluid device includes: The isolation layer has a window and is disposed on the second area of the substrate to expose the surface of the substrate in the second area, where the area surrounded by the window is the accommodation space; the second gate is disposed in the window of the isolation layer , the second gate includes a polycrystalline silicon layer and one or more metal layers from the substrate upward, whereby when the sensing chip with the fluid device is placed in an environment with the fluid to be measured, and the fluid to be measured passes through the fluid device When a voltage is applied to the second gate polycrystalline silicon layer of the fluid device, multiple charges will be generated on the surface of the metal layer of the second gate and the receptor. Each charge on the metal layer is used to capture the second gate in the fluid device. Target objects in the fluid to be measured, and the voltage value of the metal layer of the second gate will change with the number of these charge-captured targets, and the second gate will transmit the voltage value change of the metal layer through the field effect transistor to the external processing unit for processing, and further calculation to obtain the target concentration in the liquid to be measured.

在本發明的一較佳實施例中,電荷可以是正電荷或是負電荷。 In a preferred embodiment of the present invention, the charges may be positive charges or negative charges.

在本發明的一較佳實施例中,施予第二閘極的定電壓小於30伏特。 In a preferred embodiment of the present invention, the constant voltage applied to the second gate is less than 30 volts.

在本發明的一較佳實施例中,待測流體為氣體。 In a preferred embodiment of the present invention, the fluid to be measured is a gas.

在本發明的一較佳實施例中,目標物可以是細菌、病毒、懸浮微粒或是氣體分子。 In a preferred embodiment of the present invention, the target may be bacteria, viruses, suspended particles or gas molecules.

1、1000:具有流體裝置的感測晶片 1. 1000: Sensing chip with fluid device

10:基板 10:Substrate

10A:第一區域 10A: The first area

10B:第二區域 10B:Second area

15:溫度調控單元 15: Temperature control unit

17:溫度感知線路 17: Temperature sensing circuit

20:場效電晶體 20: Field effect transistor

202:閘極 202: Gate

204:源極 204:Source

206:汲極 206:Jiji

30:隔離層 30:Isolation layer

302:窗口 302:Window

40、4000:第二閘極 40, 4000: second gate

402、4002:多晶矽層 402, 4002: Polycrystalline silicon layer

404、4004:一層或多層的金屬層 404, 4004: One or more metal layers

406、4006、4006A、4006B、4006C、4006D:接受器 406, 4006, 4006A, 4006B, 4006C, 4006D: Receiver

50:參考電極 50:Reference electrode

60:待測流體 60: Fluid to be measured

602、602A、602B、602C、602D:目標物 602, 602A, 602B, 602C, 602D: target

7:具有流體裝置的感測晶片 7: Sensing chip with fluidic device

70:基板 70:Substrate

70A:第一區域 70A:First area

70B:第二區域 70B:Second area

80:第二閘極 80: Second gate

802:多晶矽層 802:Polycrystalline silicon layer

804:一層或多層的金屬層 804: One or more metal layers

8042:電荷 8042:Charge

806:接受器 806:Receiver

90:待測流體 90: Fluid to be measured

902:目標物 902:Target

Test A、Test B、Test C、Test D:區塊 Test A, Test B, Test C, Test D: block

步驟S10-步驟S20:具有流體裝置的感測晶片在進行檢測待測液體時的步驟流程圖 Step S10-Step S20: Flowchart of steps when a sensing chip with a fluid device detects a liquid to be measured

圖1A是根據本發明所揭露的技術,表示具有流體裝置的感測晶片的一實施例的示意圖。 1A is a schematic diagram illustrating an embodiment of a sensing chip with a fluidic device according to the technology disclosed in the present invention.

圖1B是根據本發明所揭露的技術,表示具有流體裝置的感測晶片的電路示意圖。 1B is a schematic circuit diagram illustrating a sensing chip with a fluidic device according to the technology disclosed in the present invention.

圖2是根據本發明所揭露的技術,表示具有流體裝置的感測晶片的再一實施例的電路示意圖。 FIG. 2 is a schematic circuit diagram showing yet another embodiment of a sensing chip with a fluid device according to the technology disclosed in the present invention.

圖3A是根據本發明所揭露的技術,表示具有多個流體裝置的感測晶片的另一實施例的俯視圖。 3A is a top view of another embodiment of a sensing chip having multiple fluidic devices according to the technology disclosed in the present invention.

圖3B是根據本發明所揭露的技術,表示感測元件由多個具有流體裝置的感測晶片所構成且以分區方式檢測在同一個待測流體內的不同目標物的俯視圖。 3B is a top view showing that the sensing element is composed of a plurality of sensing chips with fluid devices and detects different targets in the same fluid to be measured in a partitioned manner according to the technology disclosed in the present invention.

圖4A是根據本發明所揭露的技術,表示具有流體裝置的感測晶片的另一實施的示意圖。 4A is a schematic diagram illustrating another implementation of a sensing chip with a fluidic device according to the technology disclosed in the present invention.

圖4B是根據本發明所揭露的技術,表示具有流體裝置的感測晶片的電路示意圖。 4B is a schematic circuit diagram showing a sensing chip with a fluidic device according to the technology disclosed in the present invention.

圖5是根據本發明所揭露的技術,表示具有流體裝置的感測晶片檢測在待測流體內的目標物的步驟流程示意圖。 FIG. 5 is a schematic flowchart showing the steps of detecting a target object in a fluid to be measured by a sensing chip having a fluid device according to the technology disclosed in the present invention.

圖6是根據本發明所揭露的技術,表示具有流體裝置的感測晶片檢測具有大腸桿菌的待測流體的示意圖。 6 is a schematic diagram showing a sensing chip with a fluid device detecting fluid to be tested containing E. coli according to the technology disclosed in the present invention.

首先請參考圖1A。圖1A表示具有流體裝置的感測晶片的結構示意圖。在圖1A中,具有流體裝置的感測晶片1由場效電晶體(Field effect transistor;FET)20及流體裝置(fluid device)所構成。具有流體裝置的感測晶片1包含基板10,在基板10上設有虛線用以區分成第一區域10A及第二區域10B,在此,將基板10區分成第一區域10A及第二區域10B是為了後續說明容易理解,在實際的基板10上不會有虛線。在基板10的第一區域10A中設有場效電晶體20,場效電晶體20例如N型金屬氧化半導體(NMOS),其結構至少包含閘極202、源極204及汲極206,閘極202介於源極204及汲極206之間、且設置於基板10上,源極204及汲極206設置於基板10的第一區域10A內,在基板10的第一區域10A上還設有隔離層(或可以稱為場氧化層(Field oxide layer))30。要說明的是,上述隔離層30、閘極202、源極204及汲極206是利用適合的互補式金屬氧化半導體(CMOS)製程來形成,其形成步驟不是本發明的主要技術特徵,不在此多加陳述。 First please refer to Figure 1A. FIG. 1A shows a schematic structural diagram of a sensing chip with a fluidic device. In FIG. 1A , a sensing chip 1 with a fluid device is composed of a field effect transistor (FET) 20 and a fluid device. The sensing chip 1 with a fluid device includes a substrate 10. A dotted line is provided on the substrate 10 to divide it into a first area 10A and a second area 10B. Here, the substrate 10 is divided into a first area 10A and a second area 10B. In order to make the subsequent description easy to understand, there will be no dotted lines on the actual substrate 10 . A field effect transistor 20 is provided in the first region 10A of the substrate 10. The field effect transistor 20 is, for example, an N-type metal oxide semiconductor (NMOS). Its structure at least includes a gate 202, a source 204 and a drain 206. The gate 202 is between the source electrode 204 and the drain electrode 206 and is disposed on the substrate 10. The source electrode 204 and the drain electrode 206 are disposed in the first region 10A of the substrate 10. There is also a Isolation layer (or field oxide layer) 30 . It should be noted that the above-mentioned isolation layer 30, gate 202, source 204 and drain 206 are formed using a suitable complementary metal oxide semiconductor (CMOS) process. The formation steps are not the main technical features of the present invention and are not discussed here. Make more statements.

流體裝置設置在基板10的第二區域10B上,且與場效電晶體20電性連接,其中流體裝置包含:隔離層30、第二閘極40及參考電極50。隔離層30具有窗口(window)302,此窗口302用以暴露出第二區域10B的基板10的表面,且窗口302所圍成的區域為容置空間。第二閘極40設置在隔離層30的窗口302內,由基板10向上依序為多晶矽層402及一層或多層的金屬層404。在金屬層404上還設有多個接受器406。另外,在鄰近於第二閘極40、且設置在基板10的第二區域10B上 設有參考電極(reference electrode)50,此參考電極50與待測流體60接觸,並供應量測第二閘極40的金屬層404的電壓值變化時所需的電壓。 The fluid device is disposed on the second region 10B of the substrate 10 and is electrically connected to the field effect transistor 20 . The fluid device includes: an isolation layer 30 , a second gate 40 and a reference electrode 50 . The isolation layer 30 has a window 302, which is used to expose the surface of the substrate 10 in the second area 10B, and the area surrounded by the window 302 is an accommodation space. The second gate 40 is disposed in the window 302 of the isolation layer 30 , and includes a polysilicon layer 402 and one or more metal layers 404 in order from the substrate 10 upward. A plurality of receptors 406 are also provided on the metal layer 404. In addition, on the second region 10B adjacent to the second gate 40 and provided on the substrate 10 A reference electrode 50 is provided. The reference electrode 50 is in contact with the fluid 60 to be measured and supplies the voltage required for measuring changes in the voltage value of the metal layer 404 of the second gate 40 .

在本實施例中,在第二區域10B上的隔離層30的窗口302所圍成的區域作為容置待測流體60(如圖1B所示)的容置空間,因此當待測流體60放置於此容置空間302,讓待測流體60會與第二閘極40的金屬層404接觸一段時間之後,觀察金屬層404的電壓值產生變化,藉由電壓值變化來判斷待測流體60內是否有目標物602及目標物602的濃度,其詳細的操作在後續說明。 In this embodiment, the area surrounded by the window 302 of the isolation layer 30 on the second area 10B is used as a receiving space to accommodate the fluid 60 to be tested (as shown in FIG. 1B ). Therefore, when the fluid 60 to be tested is placed In this accommodating space 302, the fluid 60 to be tested is allowed to contact the metal layer 404 of the second gate 40 for a period of time, and then the voltage value of the metal layer 404 is observed to change, and the content of the fluid to be tested 60 is determined by the change in the voltage value. Whether there is a target 602 and the concentration of the target 602 will be described in detail later.

接著請參考圖1B。圖1B表示具有流體裝置的感測晶片的電路示意圖。在圖1B中,將場效電晶體20的源極204接地(GND),汲極206與外部處理單元(未在圖中表示)電性連接,在進行操作時,將待測流體60放置於具有流體裝置的感測晶片1的容置空間302之後,讓待測流體60與流體裝置的第二閘極40的金屬層404上的多個接受器(receptor)406接觸並且靜置至少30分鐘,在靜置的過程中,這些接受器406用以捕捉在待測流體60內的目標物(或目標分子)602,要說明的是,接受器406是在感測晶片1生產後的抗體加工過程中固定化在金屬層404上。 Next, please refer to Figure 1B. Figure 1B shows a circuit schematic of a sensing chip with a fluidic device. In FIG. 1B , the source 204 of the field effect transistor 20 is grounded (GND), and the drain 206 is electrically connected to an external processing unit (not shown in the figure). During operation, the fluid 60 to be measured is placed on After the accommodating space 302 of the sensing chip 1 of the fluid device is provided, the fluid 60 to be measured is allowed to contact the plurality of receptors (receptors) 406 on the metal layer 404 of the second gate 40 of the fluid device and allowed to stand for at least 30 minutes. , during the standing process, these receptors 406 are used to capture the target object (or target molecule) 602 in the fluid 60 to be measured. It should be noted that the receptors 406 are processed by the antibody after the production of the sensing chip 1 It is fixed on the metal layer 404 during the process.

舉例來說,要進行檢測的待測流體60可以是含有未知目標物濃度的BTP緩衝液、全血或是血漿,其中當待測流體60為全血或是血漿時,可利用BTP緩衝液將待測流體60稀釋,接著將稀釋後的待測流體60放置在流體裝置的容置空間302(如圖1A所示),即第二閘極40所在的位置,將稀釋後的待測流體60靜置一段時間,此靜置時間是除了讓第二閘極40的金屬層404與稀釋後的待測流體60有足夠的接觸時間,而讓金屬層404上的接受器406能夠有足夠的時間捕捉稀釋後的待測流體60內的目標物602,當第二閘極40的金屬層404的表面上的多個接受器406捕捉稀釋後的待測流體60內的目標物602時,金屬層404的電壓值會隨著 接受器406所捕捉到的目標物602的數量而改變,再經由場效電晶體20將第二閘極40的金屬層404所改變的電流值輸出(即圖1B中的Iout)至外部處理單元(未在圖中表示)進行處理,來得到對應於金屬層404的電壓值的稀釋後的待測流體60內的目標物602的濃度值(或是數量)。在本實施例中,待測流體60內的目標物602可以是生物體,當待測流體60是BTP緩衝液,則在BTP緩衝液內的目標物602可以是酵母菌、細菌、病毒或蛋白質以及當待測流體60是血漿,則在血漿中的目標物602可以是細胞。 For example, the fluid 60 to be tested may be a BTP buffer containing an unknown target concentration, whole blood or plasma. When the fluid 60 to be tested is whole blood or plasma, the BTP buffer may be used to The fluid to be tested 60 is diluted, and then the diluted fluid to be tested 60 is placed in the accommodation space 302 of the fluid device (as shown in FIG. 1A ), that is, where the second gate 40 is located, and the diluted fluid to be tested 60 is Let it stand for a period of time. This standing time is not only to allow the metal layer 404 of the second gate 40 to have sufficient contact time with the diluted fluid to be measured 60, but also to allow the receptor 406 on the metal layer 404 to have enough time. Capture the target object 602 in the diluted fluid to be measured 60. When the plurality of receptors 406 on the surface of the metal layer 404 of the second gate 40 capture the target object 602 in the diluted fluid to be measured 60, the metal layer The voltage value of 404 will change with the number of targets 602 captured by the receptor 406, and then the current value changed by the metal layer 404 of the second gate 40 is output through the field effect transistor 20 (i.e., in FIG. 1B I out ) to an external processing unit (not shown in the figure) for processing to obtain the concentration value (or quantity) of the target 602 in the diluted fluid to be measured 60 corresponding to the voltage value of the metal layer 404 . In this embodiment, the target object 602 in the fluid to be tested 60 can be an organism. When the fluid to be tested 60 is a BTP buffer, the target object 602 in the BTP buffer can be yeast, bacteria, viruses or proteins. And when the fluid 60 to be measured is plasma, the target objects 602 in the plasma may be cells.

接著,請參考圖2。圖2是表示本發明所揭露的具有流體裝置的感測晶片的再一實施的示意圖。在圖2中,具有流體裝置的感測晶片1的各元件的結構、元件與元件之間的連接關係及功能與前述圖1A及圖1B相同,在此不多加陳述。圖2與前述圖1A及圖1B的區別在於:將第二閘極40中的多晶矽層402的一端用以接地(GND)(即圖2的左側)及多晶矽層402的另一端與溫度調控單元15電性連接及具有流體裝置的感測晶片1與溫度感知線路17電性連接。在此實施例中,溫度感知線路17用以量測具有流體裝置的感測晶片1的溫度,溫度調控單元15是用以提供溫度調控訊號,並以此溫度調控訊號的寬度來調控多晶矽層402的溫度,從而對在容置空間內的待測流體60進行加熱,由於待測流體60內的目標物602因為溫度升高而增加在待測流體60內的動能,使得待測流體60內的目標物602更容易被金屬層404上的接受器406所捕捉,其詳細的檢測步驟如下所述。此外,圖2所表示的多晶矽層402的接地端及溫度調控單元15的連接位置可以左右互換。 Next, please refer to Figure 2. FIG. 2 is a schematic diagram showing yet another implementation of a sensing chip with a fluid device disclosed in the present invention. In FIG. 2 , the structure, connection relationship and function of each element of the sensing chip 1 with a fluid device are the same as those in the aforementioned FIGS. 1A and 1B , and will not be further described here. The difference between Figure 2 and the aforementioned Figures 1A and 1B is that one end of the polycrystalline silicon layer 402 in the second gate 40 is connected to the ground (GND) (ie, the left side of Figure 2) and the other end of the polycrystalline silicon layer 402 is connected to the temperature control unit. 15 is electrically connected and the sensing chip 1 with the fluid device is electrically connected to the temperature sensing circuit 17 . In this embodiment, the temperature sensing circuit 17 is used to measure the temperature of the sensing chip 1 having a fluid device, and the temperature control unit 15 is used to provide a temperature control signal, and control the polycrystalline silicon layer 402 with the width of the temperature control signal. temperature, thereby heating the fluid to be measured 60 in the accommodation space. Since the target 602 in the fluid to be measured 60 increases the kinetic energy in the fluid to be measured 60 due to the increase in temperature, the target object 602 in the fluid to be measured 60 will The target object 602 is more easily captured by the receptor 406 on the metal layer 404, and its detailed detection steps are as follows. In addition, the connection positions of the ground terminal of the polycrystalline silicon layer 402 and the temperature control unit 15 shown in FIG. 2 can be interchanged left and right.

首先,將待測流體60置於具有流體裝置的感測晶片1內,具體來說是將待測流體60滴入容置空間內。接著,由溫度調控單元15提供溫度調控訊號透 過多晶矽層402來對待測流體進行加熱,並且以溫度調控訊號的寬度調控多晶矽層402的溫度,從而進一步的控制待測流體60的溫度,使得待測流體60的溫度可以在經過一段加熱時間之後達到預設溫度,其中預設溫度範為50℃-95℃。於另一實施例中,如果是進行生物檢測,由於生物目標物有可能會因為溫度過高而被破壞,因此在進行生物檢測時,其預設溫度為90℃,較佳的溫度是小於90℃。 First, the fluid 60 to be measured is placed in the sensing chip 1 with the fluid device. Specifically, the fluid 60 to be measured is dropped into the accommodation space. Then, the temperature control unit 15 provides temperature control signal transmission The polycrystalline silicon layer 402 is used to heat the fluid to be measured, and the temperature of the polycrystalline silicon layer 402 is controlled by the width of the temperature control signal, thereby further controlling the temperature of the fluid to be measured 60 so that the temperature of the fluid to be measured 60 can be adjusted after a period of heating time. Reach the preset temperature, where the preset temperature range is 50℃-95℃. In another embodiment, if biological detection is performed, the biological target may be destroyed due to excessive temperature. Therefore, when performing biological detection, the default temperature is 90°C, and the preferred temperature is less than 90°C. ℃.

要說明的是,溫度調控單元15提供溫度調控訊號,並控制其寬度透過多晶矽層402來對待測流體60進行加熱的同時,溫度感知線路17持續的量測整個具有流體裝置的感測晶片1的溫度,用以將待測流體60及具有流體裝置的感測晶片1的溫度控制在固定的溫度下,據此,可以在待測流體60的溫度加熱到預設溫度的過程中,量測得到待測流體60的目標物602的濃度或是數量。具體來說,在利用溫度調控單元15對待測流體60進行加熱時,在待測流體60內的目標物602會因為溫度升高而產生動能的變化,此動能的變化會驅使目標物602在待測流體60中的移動或分解,更容易地被金屬層404的表面上的多個接受器406所捕捉。與圖1A及圖1B所述相同,在加熱升溫的過程中,第二閘極40的金屬層404的電壓值會隨著多個接受器406捕捉到目標物602的數量而改變,且第二閘極40將金屬層404的電壓值變化經由場效電晶體以對應的電流值變化傳送至外部處理單元(未在圖中表示),由外部處理單元(未在圖中表示)進行處理,直到待測流體60的溫度到達了預設溫度之後,且電流值不再有變化時,此時可以得到在預設溫度下,對應於金屬層404的電壓值變化的待測流體60內的多個目標物602的濃度值。 It should be noted that the temperature control unit 15 provides a temperature control signal and controls its width to heat the fluid 60 to be measured through the polysilicon layer 402. At the same time, the temperature sensing circuit 17 continuously measures the temperature of the entire sensing chip 1 with the fluid device. The temperature is used to control the temperature of the fluid to be measured 60 and the sensing chip 1 with the fluid device at a fixed temperature. Accordingly, it can be measured during the process of heating the temperature of the fluid to be measured 60 to the preset temperature. The concentration or quantity of the target object 602 in the fluid 60 to be measured. Specifically, when the temperature control unit 15 is used to heat the fluid 60 to be measured, the target 602 in the fluid 60 to be measured will produce a change in kinetic energy due to the increase in temperature. This change in kinetic energy will drive the target 602 to move in the fluid to be measured. Movement or decomposition in the measured fluid 60 is more easily captured by the plurality of receptors 406 on the surface of the metal layer 404. As described in FIG. 1A and FIG. 1B , during the heating process, the voltage value of the metal layer 404 of the second gate 40 will change with the number of target objects 602 captured by the multiple receptors 406 , and the second The gate 40 transmits the voltage value change of the metal layer 404 to the external processing unit (not shown in the figure) via the field effect transistor with the corresponding current value change, and is processed by the external processing unit (not shown in the figure) until After the temperature of the fluid to be measured 60 reaches the preset temperature and the current value no longer changes, at this time, multiple voltage values in the fluid to be measured 60 corresponding to changes in the voltage value of the metal layer 404 at the preset temperature can be obtained. The concentration value of target 602.

在本上述的圖1A、圖1B及圖2的實施例中,待測流體60除了如上述的全血或血漿之外,亦可以是含有未知目標物濃度的BTP緩衝液。此外,第二 閘極40中的金屬層404可以是一層或是多層,且金屬層404與參考電極50的材質可以是鋁-銅合金(Al-Cu alloy)。 In the embodiments of FIGS. 1A , 1B and 2 , the fluid to be tested 60 may be a BTP buffer containing an unknown target concentration in addition to whole blood or plasma as mentioned above. In addition, the second The metal layer 404 in the gate 40 may be one layer or multiple layers, and the material of the metal layer 404 and the reference electrode 50 may be aluminum-copper alloy (Al-Cu alloy).

根據上述可以得到,本發明所揭露的具有流體裝置的感測晶片1可以檢測出待測流體60內的目標物602的濃度,但是為了避免待測流體60內的目標物602數量過多時,容易因為場效電晶體20輸出不足而造成誤差。因此,為了提高準確度,本發明還揭露另一種具有流體裝置的感測晶片1000,如圖3A所示。圖3A為具有流體裝置的感測晶片的另一實施例的俯視圖。在圖3A中,具有流體裝置的感測晶片1000同樣是由流體裝置和場效電晶體20所構成,與前述的感測晶片1的區別在於:在此實施例中的感測晶片1000的流體裝置同樣具有隔離層(未在圖中表示)、第二閘極4000及參考電極(未在圖中表示)。第二閘極4000同樣是設置在具有窗口(未在圖中表示)的隔離層內。在基板(未在圖中表示)上的第二閘極4000依序為多晶矽層4002及一層或多層的金屬層4004。在此實施例中,第二閘極4000中的多晶矽層4002是連續的一整層,只是將金屬層4004分小區的方式設置在多晶矽層4002上,每一個金屬層4004都與一個場效電晶體20電性連接,場效電晶體20再將這些輸出電流以並聯方式計算總輸出電流的變化量。 According to the above, it can be obtained that the sensing chip 1 with a fluid device disclosed in the present invention can detect the concentration of the target object 602 in the fluid 60 to be measured. However, in order to avoid the excessive number of target objects 602 in the fluid 60 to be measured, it is easy to The error is caused by insufficient output of the field effect transistor 20 . Therefore, in order to improve accuracy, the present invention also discloses another sensing chip 1000 with a fluid device, as shown in FIG. 3A . Figure 3A is a top view of another embodiment of a sensing chip with a fluidic device. In FIG. 3A , the sensing chip 1000 with a fluid device is also composed of a fluid device and a field effect transistor 20 . The difference from the aforementioned sensing chip 1 is that the fluid of the sensing chip 1000 in this embodiment is The device also has an isolation layer (not shown in the figure), a second gate 4000 and a reference electrode (not shown in the figure). The second gate 4000 is also disposed in an isolation layer having a window (not shown in the figure). The second gate 4000 on the substrate (not shown in the figure) is a polysilicon layer 4002 and one or more metal layers 4004 in sequence. In this embodiment, the polycrystalline silicon layer 4002 in the second gate 4000 is a continuous whole layer, and the metal layer 4004 is arranged on the polycrystalline silicon layer 4002 in a subdivided manner. Each metal layer 4004 is connected to a field effect electrode. The crystal 20 is electrically connected, and the field effect transistor 20 connects these output currents in parallel to calculate the change in the total output current.

於另一實施例,感測元件是由多個具有流體裝置的感測晶片1000所構成,同樣地,每一個具有流體裝置的感測晶片1000是由流體裝置和場效電晶體20所構成,流體裝置由隔離層(未在圖中表示)、參考電極(未在圖中表示)及第二閘極4000所構成,其中第二閘極4000是由一層多晶矽層4002與一層或多層的金屬層4004所構成,即一層多晶矽層4002對應一層或多層的金屬層4004,流體裝置的第二閘極4000來對待測流體60的目標物602進行捕捉並進一步的檢測。藉由分別具有兩種不同結構設計的具有流體裝置的感測晶片1000,可以將目標物602 數量較多的待測流體60由具有流體裝置的感測晶片1000的第二閘極4000以分小區的方式檢測。同樣的,每一個具有流體裝置的感測晶片1000中的第二閘極4000與一個場效電晶體20電性連接,使得當每一個具有流體裝置的感測晶片1000中的第二閘極4000接觸待測流體60之後,其第二閘極4000的金屬層404所產生的電壓值變化都會經由與流體裝置連接的場效電晶體20輸出電流至外部處理單元(未在圖中表示),再以並聯方式計算總輸出電流的變化量。藉由此種分小區檢測的方式來判斷每一個分區面積的待測流體60內是否有目標物602之外,也同時可以得到一個分區面積的待測流體60內的目標物602的濃度,而這些單位面積的濃度目標物602的總和,即是整個待測流體60的目標物602的總和,據此,藉由具有多個具有流體裝置的感測晶片1000的感測元件以分小區偵測及輸出並聯方式提高檢測的靈敏度,同時提高相對應的待測流體60的樣本體積以及增加檢測結果的精確度。 In another embodiment, the sensing element is composed of a plurality of sensing chips 1000 having a fluid device. Similarly, each sensing chip 1000 having a fluid device is composed of a fluid device and a field effect transistor 20. The fluidic device is composed of an isolation layer (not shown in the figure), a reference electrode (not shown in the figure) and a second gate 4000. The second gate 4000 is composed of a polycrystalline silicon layer 4002 and one or more metal layers. 4004, that is, a polycrystalline silicon layer 4002 corresponds to one or more metal layers 4004. The second gate 4000 of the fluid device is used to capture the target 602 of the fluid 60 to be measured and further detect it. By using the sensing chip 1000 with the fluid device having two different structural designs, the target 602 can be A larger quantity of fluid 60 to be measured is detected by the second gate 4000 of the sensing chip 1000 having a fluid device in a sub-area manner. Similarly, the second gate 4000 in each sensing chip 1000 having a fluid device is electrically connected to a field effect transistor 20, so that when the second gate 4000 in each sensing chip 1000 having a fluid device After contacting the fluid 60 to be measured, the voltage value changes generated by the metal layer 404 of the second gate 4000 will output current to an external processing unit (not shown in the figure) through the field effect transistor 20 connected to the fluid device, and then Calculate the change in total output current in parallel. By using this area-by-area detection method to determine whether there is a target object 602 in the fluid to be measured 60 in each partition area, the concentration of the target object 602 in the fluid to be measured 60 in a partition area can also be obtained, and The sum of these concentration targets 602 per unit area is the sum of the targets 602 of the entire fluid 60 to be measured. Accordingly, by using sensing elements with multiple sensing chips 1000 having fluid devices, detection is performed in different areas. And the output parallel connection method improves the sensitivity of detection, simultaneously increases the sample volume of the corresponding fluid 60 to be measured, and increases the accuracy of the detection results.

接著請參考圖3B,圖3B是表示感測元件由多個具有流體裝置的感測晶片所構成且以分區方式檢測在同一個待測流體內的不同目標物。在圖3B中,感測元件的結構與圖3A相同,在此只是將感測元件上的多個感測晶片畫分成Test A、Test B、Test C及Test D四個區塊,在這四個區塊中,同一個區塊上的感測晶片的流體裝置的第二閘極4000上的接受器相同,不同區塊的接受器則不相同,因此在Test A區塊、Test B區塊、Test C區塊及Test D區塊中的接受器分別為4006A、4006B、4006C及4006D。在本實施例中,分成不同區塊的目的是為了要捕捉在同一個待測流體60內的不同種類的目標物602A、602B、602C及602D。因此,同樣的,將待測流體60容置於如上述圖1A及圖1B中的具有流體裝置的感測晶片1的容置空間302內,由於不同區塊Test A、Test B、Test C及Test D中的接受 器4006A、4006B、4006C及4006D不同,因此所要捕捉在待測流體60內的目標物602A、602B、602C及602D也不同。因此,藉由此感測元件,可以依據使用者欲檢測的目標物602來設置在Test A區塊、Test B區塊、Test C區塊及Test D區塊的第二閘極4000的金屬層4004上的接受器4006A、4006B、4006C及4006D的種類,據此,可以在同一個檢測時間、在同一個待測流體60內捕捉到不同的目標物602A、目標物602B、目標物602C及/或目標物602D,可以大幅的節省了使用者的操作時間及人力。 Next, please refer to FIG. 3B . FIG. 3B shows that the sensing element is composed of a plurality of sensing chips with fluid devices and detects different targets in the same fluid to be measured in a partitioned manner. In Figure 3B, the structure of the sensing element is the same as that in Figure 3A. Here, the multiple sensing chips on the sensing element are divided into four blocks: Test A, Test B, Test C and Test D. In these four blocks In each block, the receptors on the second gate 4000 of the fluid device of the sensing chip on the same block are the same, but the receptors in different blocks are different. Therefore, in the Test A block and the Test B block , the receivers in the Test C block and Test D block are 4006A, 4006B, 4006C and 4006D respectively. In this embodiment, the purpose of dividing into different blocks is to capture different types of target objects 602A, 602B, 602C and 602D in the same fluid 60 to be measured. Therefore, similarly, the fluid 60 to be measured is accommodated in the accommodating space 302 of the sensing chip 1 with the fluid device as shown in FIGS. 1A and 1B above. Due to the different blocks Test A, Test B, Test C and Acceptance in Test D The devices 4006A, 4006B, 4006C and 4006D are different, so the target objects 602A, 602B, 602C and 602D to be captured in the fluid 60 to be measured are also different. Therefore, with this sensing element, the metal layer of the second gate 4000 in the Test A block, Test B block, Test C block and Test D block can be set according to the target object 602 that the user wants to detect. The types of receivers 4006A, 4006B, 4006C and 4006D on 4004, accordingly, different target objects 602A, 602B, 602C and/or can be captured in the same fluid 60 to be tested at the same detection time. Or target object 602D, which can greatly save the user's operating time and manpower.

接著,請參考圖4A。圖4A是表示本發明所揭露的具有流體裝置的感測晶片的另一實施的示意圖。在圖4A中,具有流體裝置的感測晶片7同樣也是由場效電晶體20及流體裝置80所組成,具有流體裝置的感測晶片7包含基板70,在基板70上設有虛線用以區分成第一區域70A及第二區域70B,在基板70的第一區域70A中設有場效電晶體20,例如N型金屬氧化半導體(NMOS),其結構及形成方法與圖1A相同,就不再多加陳述。在基板70的第二區域70B上設有隔離層30,此隔離層30具有窗口(window)302,此窗口302用以暴露出第二區域10B的基板10的表面。 Next, please refer to Figure 4A. FIG. 4A is a schematic diagram illustrating another implementation of a sensing chip with a fluidic device disclosed in the present invention. In Figure 4A, the sensing chip 7 with a fluid device is also composed of a field effect transistor 20 and a fluid device 80. The sensing chip 7 with a fluid device includes a substrate 70, and a dotted line is provided on the substrate 70 to distinguish It is divided into a first region 70A and a second region 70B. The first region 70A of the substrate 70 is provided with a field effect transistor 20, such as an N-type metal oxide semiconductor (NMOS). Its structure and formation method are the same as those in FIG. 1A. Add more statements. An isolation layer 30 is provided on the second region 70B of the substrate 70 . The isolation layer 30 has a window 302 , and the window 302 is used to expose the surface of the substrate 10 in the second region 10B.

流體裝置設置在基板70的第二區域70B上,且與場效電晶體20電性連接,其中流體裝置包括:隔離層30及第二閘極80。隔離層30具有窗口(window)302,此窗口302用以暴露出第二區域70B的基板70的表面,且窗口302所圍成的區域為容置空間。第二閘極80設置在隔離層30的窗口302內,此第二閘極80由基板70向上依序為多晶矽層802及一層或多層的金屬層804。 The fluid device is disposed on the second region 70B of the substrate 70 and is electrically connected to the field effect transistor 20 . The fluid device includes: an isolation layer 30 and a second gate 80 . The isolation layer 30 has a window 302. The window 302 is used to expose the surface of the substrate 70 in the second area 70B, and the area surrounded by the window 302 is an accommodation space. The second gate 80 is disposed in the window 302 of the isolation layer 30 . The second gate 80 includes a polysilicon layer 802 and one or more metal layers 804 in sequence from the substrate 70 upward.

在本實施例中,在隔離層30的窗口302所圍成的區域作為容置空間,此容置空間用以容置待測流體90(如圖2B所示),因此當待測流體90容置於此 容置空間302之後,待測流體90會與第二閘極80的金屬層804接觸,使得金屬層804的電壓值產生變化,其詳細的操作在後續說明。在本實施例中的待測流體90為氣體。 In this embodiment, the area surrounded by the window 302 of the isolation layer 30 is used as an accommodation space. This accommodation space is used to accommodate the fluid 90 to be measured (as shown in FIG. 2B ). Therefore, when the fluid 90 to be measured is contained in place here After accommodating the space 302, the fluid to be measured 90 will contact the metal layer 804 of the second gate 80, causing the voltage value of the metal layer 804 to change. The detailed operation will be described later. The fluid 90 to be measured in this embodiment is gas.

接著請參考圖4B。圖4B表示具有流體裝置的感測晶片的電路示意圖。在圖4B中,將場效電晶體20的源極204接地,汲極206與外部處理單元(未在圖中表示)連接。在進行操作時,將具有流體裝置的感測晶片7置於具有待測流體90的環境中,並靜置一段時間後,對第二閘極80施加電壓,此電壓值小於30伏特(V),較佳的電壓值範圍可以是5-7伏特。具體來說,當施加至第二閘極80的多晶矽層802的電壓為正電壓時,則在第二閘極80的金屬層804的表面會產生電性相反於多晶矽層802的多個負電荷8042,而這些負電荷8042會被待測流體90內帶有正電荷的細菌、病毒、懸浮微粒或是氣體分子影響其帶電量;同樣的,若施加至第二閘極80的多晶矽層802為負電壓,則在第二閘極80的金屬層804的表面會產生多個電性相反於多晶矽層802極性的正電荷(未在圖中表示),待測流體90內帶有負電荷的細菌、病毒、懸浮微粒或是氣體分子會影響這些正電荷8042的帶電量。 Next, please refer to Figure 4B. Figure 4B shows a circuit schematic of a sensing chip with a fluidic device. In FIG. 4B , the source electrode 204 of the field effect transistor 20 is connected to ground, and the drain electrode 206 is connected to an external processing unit (not shown in the figure). During operation, the sensing chip 7 with the fluid device is placed in an environment with the fluid to be measured 90, and after leaving it for a period of time, a voltage is applied to the second gate 80, and the voltage value is less than 30 volts (V). , the better voltage value range can be 5-7 volts. Specifically, when the voltage applied to the polysilicon layer 802 of the second gate 80 is a positive voltage, a plurality of negative charges with electrical properties opposite to the polysilicon layer 802 will be generated on the surface of the metal layer 804 of the second gate 80 8042, and these negative charges 8042 will be affected by positively charged bacteria, viruses, suspended particles or gas molecules in the fluid to be measured 90; similarly, if the polycrystalline silicon layer 802 applied to the second gate 80 is If a negative voltage is applied to the surface of the metal layer 804 of the second gate 80, a plurality of positive charges (not shown in the figure) opposite to the polarity of the polycrystalline silicon layer 802 will be generated, and bacteria with negative charges in the fluid 90 to be measured will , viruses, suspended particles or gas molecules will affect the charge of these positively charged particles.

舉例來說,當施加正電壓(Vin)於第二閘極80的多晶矽層802時,第二閘極80的金屬層804的表面及接受器806會產生多個負電荷8042,待測流體90內帶有正電荷的目標物902例如細菌、病毒、懸浮微粒或是氣體分子會影響負電荷8042的帶電量,第二閘極80的金屬層804的電壓值會隨著在金屬層804表面的這些目標物902而改變,再經由場效電晶體20將第二閘極80的金屬層804所產生的電流值傳送至外部處理單元(未在圖中表示),可以得到對應於金屬層804的電壓值的待測流體90內的目標物902的濃度值(或是數量)。 For example, when a positive voltage (V in ) is applied to the polysilicon layer 802 of the second gate 80 , a plurality of negative charges 8042 will be generated on the surface of the metal layer 804 of the second gate 80 and the receptor 806 , and the fluid to be measured will Targets 902 with positive charges within 90 such as bacteria, viruses, suspended particles or gas molecules will affect the amount of negative charge 8042, and the voltage value of the metal layer 804 of the second gate 80 will change with the surface of the metal layer 804. These targets 902 are changed, and then the current value generated by the metal layer 804 of the second gate 80 is transmitted to an external processing unit (not shown in the figure) through the field effect transistor 20, and the corresponding value of the metal layer 804 can be obtained. The voltage value corresponds to the concentration value (or quantity) of the target object 902 in the fluid 90 to be measured.

於另一實施例中,若是為了要得到在單位體積下的待測流體90內各種目標物902的濃度,這些目標物902可以是細菌、病毒、懸浮微粒或是氣體分子,對應每一個不同的目標物902來改變具有流體裝置的感測晶片7的第二閘極80中的接受器806,如同前述,將以陣列設置的具有流體裝置的感測晶片7的感測元件(未在圖中表示)置於具有待測流體90的檢測環境中,並且施加電壓至每一個具有流體裝置的感測晶片7的第二閘極80,陣列中的各個具有流體裝置的感測晶片7的第二閘極80的金屬層804的表面會產生負電荷(或正電荷),而依據各個接受器806的種類來捕捉在待測流體90所對應的各種目標物902,陣列中的每個具有流體裝置的感測晶片7所捕捉到的目標物之後所產生的電壓值分別經由每個具有流體裝置的感測晶片7的場效電晶體20轉換以產生對應的電流值,再將各個電流值再經由場效電晶體20輸出至外部處理單元(未在圖中表示),可以依據各個電流值來得到此待測流體90內不同種類的目標物902的濃度。 In another embodiment, in order to obtain the concentration of various target objects 902 in the fluid 90 to be measured under unit volume, the target objects 902 can be bacteria, viruses, suspended particles or gas molecules, corresponding to each different The target 902 is used to change the receptor 806 in the second gate 80 of the sensing chip 7 with a fluid device. As mentioned above, the sensing elements of the sensing chip 7 with a fluid device (not shown in the figure) will be arranged in an array. (represented) is placed in a detection environment with the fluid 90 to be measured, and a voltage is applied to the second gate 80 of each sensing chip 7 with a fluid device, and the second gate electrode 80 of each sensing chip 7 with a fluid device in the array is The surface of the metal layer 804 of the gate 80 will generate negative charges (or positive charges), and capture various targets 902 corresponding to the fluid 90 to be measured according to the type of each receptor 806. Each of the arrays has a fluid device. The voltage values generated after the target is captured by the sensing chip 7 are respectively converted by the field effect transistor 20 of each sensing chip 7 with a fluid device to generate a corresponding current value, and then each current value is passed through The field effect transistor 20 is output to an external processing unit (not shown in the figure), and the concentrations of different types of target objects 902 in the fluid to be measured 90 can be obtained based on each current value.

接著請參考圖5。圖5是根據本發明所揭露的技術,表示具有流體裝置的感測晶片在進行檢測時的步驟流程圖。在說明圖5的步驟流程示意圖的同時,以圖1A-圖1B的具有流體裝置的感測晶片1來舉例說明。在圖5中,步驟S10:提供具有流體裝置的感測晶片。步驟S12:清洗具有流體裝置的感測晶片。在此步驟中,將具有流體裝置的感測晶片1利用去離子水進行清洗,以去除在具有流體裝置的感測晶片1上的一些雜質,以避免在進行檢測待測流體60時,產生雜訊而影響檢測結果的精準度。 Please refer to Figure 5 next. FIG. 5 is a flow chart showing the steps of detecting a sensing chip with a fluid device according to the technology disclosed in the present invention. While describing the schematic step flow chart of FIG. 5 , the sensing wafer 1 with the fluidic device in FIGS. 1A and 1B is used as an example. In Figure 5, step S10: providing a sensing wafer with a fluidic device. Step S12: Clean the sensing wafer with the fluid device. In this step, the sensing chip 1 with the fluid device is cleaned with deionized water to remove some impurities on the sensing chip 1 with the fluid device, so as to avoid the generation of impurities when detecting the fluid 60 to be measured. The information will affect the accuracy of the test results.

接著,步驟S14:將具有流體裝置的感測晶片浸泡於緩衝溶液(buffer solution)中以測得基準線(base line)。在此步驟中,先將具有流體裝置的感測晶片1浸泡於緩衝溶液中,由於緩衝溶液中沒有任何的目標物,因此具有流體 裝置的感測晶片1的第二閘極40的金屬層404表面及接受器406不會影響電壓,但是可以由參考電極50來供應具有流體裝置的感測晶片1在浸泡緩衝溶液之後電壓值,以及經由場效電晶體20所傳送至外部處理裝置(未在圖中表示)的電壓值,此電壓值為參考電極提供電壓至金屬層404本身的電壓值,而得到汲極電流與閘極電壓的基準線(base line),此基準線可以用來與後續檢測具有目標物的待測流體進行比對。 Next, step S14: soak the sensing chip with the fluid device in a buffer solution to measure the base line. In this step, the sensing chip 1 with the fluid device is first immersed in the buffer solution. Since there is no target in the buffer solution, there is fluid The surface of the metal layer 404 of the second gate 40 of the sensing chip 1 of the device and the receiver 406 will not affect the voltage, but the voltage value of the sensing chip 1 with the fluid device can be supplied by the reference electrode 50 after being soaked in the buffer solution. And the voltage value transmitted to the external processing device (not shown in the figure) through the field effect transistor 20. This voltage value is the voltage value provided by the reference electrode to the metal layer 404 itself, thereby obtaining the drain current and gate voltage. A base line, which can be used for comparison with the subsequent detection of the fluid to be tested with target objects.

於步驟S16:將待測流體容置於具有流體裝置的感測晶片,並且靜置30分鐘之後再清洗檢測。在此步驟中,將待測流體60容置於具有流體裝置的感測晶片1,並且靜置30分鐘,讓待測流體60可以與具有流體裝置的感測晶片1的第二閘極40的金屬層404充份地接觸。在靜置的過程中,於金屬層404的表面上的接受器406用以捕捉在待測流體60內的目標物602。如同前述,接受器406在捕捉到目標物602之後,會導致金屬層404在後續步驟20時的電壓值產生變化。 In step S16: place the fluid to be measured on the sensing chip with the fluid device, and let it stand for 30 minutes before cleaning and testing. In this step, the fluid 60 to be measured is accommodated in the sensing chip 1 with the fluid device, and left for 30 minutes, so that the fluid 60 to be measured can interact with the second gate 40 of the sensing chip 1 with the fluid device. Metal layer 404 is fully in contact. During the standing process, the receptors 406 on the surface of the metal layer 404 are used to capture the target 602 in the fluid 60 to be measured. As mentioned above, after the receptor 406 captures the target object 602, it will cause the voltage value of the metal layer 404 to change in the subsequent step 20.

接下來,步驟S18:利用緩衝溶液清洗具有流體裝置的感測晶片。在此步驟中,將前述步驟S16浸泡於緩衝溶液的具有流體裝置的感測晶片1用新的緩衝溶液清洗,為了檢測的準確度,對具有流體裝置的感測晶片1是須要進行清洗步驟。 Next, step S18: Clean the sensing wafer with the fluid device using a buffer solution. In this step, the sensing chip 1 with the fluid device that was soaked in the buffer solution in step S16 is cleaned with a new buffer solution. For the accuracy of detection, the cleaning step is required for the sensing chip 1 with the fluid device.

步驟S20:重複步驟S14將檢測結果與原來的基準線比較來判斷待測流體內是否有目標物以及目標物的濃度。在此步驟中,是將前述步驟S14得到的檢測結果與基準線來進行比較,除了可以由電壓值的變化來判斷待測流體60內是否有目標物602的存在之外,還可以藉由電電壓值來估算待測流體60內的目標物602的濃度。 Step S20: Repeat step S14 to compare the detection result with the original baseline to determine whether there is a target object in the fluid to be measured and the concentration of the target object. In this step, the detection result obtained in the aforementioned step S14 is compared with the baseline. In addition to judging whether there is a target 602 in the fluid 60 to be measured by the change of the voltage value, it can also be determined by the voltage value. The voltage value is used to estimate the concentration of the target 602 in the fluid 60 to be measured.

基於上述步驟,圖6是表示利用基準線與含有三個不同濃度的大腸桿菌的待測流體的比較示意圖。在圖6中,基準線是利用緩衝溶液來得到。接著依據上述步驟S18至步驟S20,分別將具有不同濃度的大腸桿菌的待測流體容置於具有流體裝置的感測晶片1以進行檢測,其中大腸桿菌的濃度分別為102cells/ml、104/cells/ml及106cells/ml。由圖6除了可以得到具有流體裝置的感測晶片1可以檢測到待測流體內的大腸桿菌之外,還可以得到在相同電壓的條件下,不同的大腸桿菌濃度愈高,具有流體裝置的感測晶片1的第二閘極40的金屬層404的電流值變化亦有所有不同。 Based on the above steps, FIG. 6 is a schematic diagram showing the comparison between the baseline and the fluid to be tested containing three different concentrations of E. coli. In Figure 6, the baseline is obtained using a buffer solution. Then according to the above-mentioned steps S18 to step S20, the fluids to be tested with different concentrations of E. coli are placed in the sensing chip 1 with the fluid device for detection, where the concentrations of E. coli are 10 2 cells/ml, 10 4 /cells/ml and 10 6 cells/ml. From Figure 6, in addition to the fact that the sensing chip 1 with a fluid device can detect E. coli in the fluid to be measured, it can also be seen that under the same voltage conditions, the higher the concentration of different E. coli, the higher the sensor chip 1 with the fluid device. The changes in the current value of the metal layer 404 of the second gate 40 of the measured chip 1 are also different.

綜合上述,本發明所揭露的具有流體裝置的感測晶片1、7、1000可以檢測液體或是氣體形式的待測流體之外,還可以檢測出待測流體60的目標物602、目標物602A、目標物602B、目標物602C、及/或目標物602D的濃度,並非僅是檢測有沒有目標物602、目標物602A、目標物602B、目標物602C、及/或目標物602D的存在,而是可以在短時間內,得到待測流體內的目標物602、目標物602A、目標物602B、目標物602C、及/或目標物602D的濃度,將所得到的結果可以提供給後續相關人員進行研究或是判斷,以解決了現有技術的感測晶片只能檢測有無目標物的存在,而無法對目標物來定量的技術問題。 To sum up the above, the sensing chip 1, 7, 1000 with the fluid device disclosed in the present invention can not only detect the fluid to be measured in the form of liquid or gas, but also can detect the target 602 and target 602A of the fluid 60 to be measured. , the concentration of the target 602B, the target 602C, and/or the target 602D is not just to detect the presence of the target 602, the target 602A, the target 602B, the target 602C, and/or the target 602D, but The concentration of the target 602, the target 602A, the target 602B, the target 602C, and/or the target 602D in the fluid to be measured can be obtained in a short period of time, and the obtained results can be provided to subsequent relevant personnel. Research or judgment is carried out to solve the technical problem that the existing sensing chip can only detect the presence or absence of a target but cannot quantify the target.

此外,在本發明的實施例中,具有流體裝置的感測晶片1、7、1000中的第二閘極40、80、4000可相容於目前標準的CMOS(complementary metal oxide semiconductor)半導體製程,因此晶片廠不需要額外其他特殊或是需要客製化的製程即可完成,解決了現有技術中,感測晶片需要特殊的製程才能完成的技術問題。 In addition, in embodiments of the present invention, the second gates 40, 80, 4000 in the sensing chips 1, 7, 1000 with fluid devices are compatible with the current standard CMOS (complementary metal oxide semiconductor) semiconductor process. Therefore, the chip factory does not need any additional special or customized processes to complete the process, which solves the technical problem in the existing technology that the sensing chip requires a special process to complete.

1:具有流體裝置的感測晶片 1: Sensing chip with fluidic device

10:基板 10:Substrate

10A:第一區域 10A: The first area

10B:第二區域 10B:Second area

20:場效電晶體 20: Field effect transistor

202:閘極 202: Gate

204:源極 204:Source

206:汲極 206:Jiji

30:隔離層 30:Isolation layer

302:窗口 302:Window

40:第二閘極 40: Second gate

402:多晶矽層 402:Polycrystalline silicon layer

404:一層或多層的金屬層 404: One or more metal layers

406:接受器 406:Receiver

50:參考電極 50:Reference electrode

60:待測流體 60: Fluid to be measured

602:目標物 602:Target

Claims (8)

一種具有流體裝置的感測晶片,包括:一基板,該基板具有一第一區域及一第二區域;一場效電晶體,設置於該基板的該第一區域中,該場效電晶體包含一第一閘極、一源極及一汲極,該第一閘極設置在該源極及該汲極之間且在該基板上;以及一流體裝置,設置在該基板的該第二區域且與該場效電晶體電性連接,該流體裝置包括:一隔離層,具有一窗口且暴露該第二區域的該基板的一表面,其中該窗口所圍成的一區域為一容置空間;一第二閘極,設置於該隔離層的該窗口內,該第二閘極由該基板往上包括一多晶矽層及一層或多層的一金屬層;以及一參考電極,鄰近於該第二閘極且設置在該基板的該第二區域上,該參考電極與該待測流體接觸,其中,將一待測流體容置於該容置空間內,使得該第二閘極的該金屬層接觸到該待測流體,將該第二閘極中的該多晶矽層的一端用以接地及該多晶矽層的另一端與一溫度調控單元電性連接,該溫度調控單元提供一溫度調控訊號,並透過該多晶矽層利用該溫度調控訊號對在該容置空間內的該待測流體進行加熱並調控該待測流體的一溫度,使得該待測流體的該溫度在達到一預設溫度的過程中,在該金屬層的一表面上的多個接受器用以捕捉在該待測流體內的多個目標物,且該第二閘極的該金屬層的一電壓值會隨著該些接受器捕捉該些目標物的數量而改變,且該第二閘極將該金屬層的該電壓值變化經 由該場效電晶體以對應的一電流值變化傳送至一外部處理單元,由該外部處理單元處理以得到對應於該金屬層的該電壓值變化的該待測流體內的該些目標物在該預設溫度下的一濃度值。 A sensing chip with a fluid device includes: a substrate having a first area and a second area; a field effect transistor disposed in the first area of the substrate, the field effect transistor including a A first gate, a source and a drain, the first gate is disposed between the source and the drain and on the substrate; and a fluid device is disposed in the second area of the substrate and Electrically connected to the field effect transistor, the fluid device includes: an isolation layer having a window and exposing a surface of the substrate in the second area, wherein an area surrounded by the window is an accommodation space; a second gate disposed in the window of the isolation layer, the second gate including a polysilicon layer and one or more metal layers from the substrate upward; and a reference electrode adjacent to the second gate The reference electrode is disposed on the second area of the substrate, and the reference electrode is in contact with the fluid to be measured, wherein a fluid to be measured is accommodated in the accommodation space, so that the metal layer of the second gate electrode contacts To the fluid to be measured, one end of the polycrystalline silicon layer in the second gate is used to ground and the other end of the polycrystalline silicon layer is electrically connected to a temperature control unit. The temperature control unit provides a temperature control signal, and through The polycrystalline silicon layer uses the temperature control signal to heat the fluid to be measured in the accommodation space and regulate a temperature of the fluid to be measured, so that the temperature of the fluid to be measured reaches a preset temperature. A plurality of receptors on a surface of the metal layer are used to capture a plurality of targets in the fluid to be measured, and a voltage value of the metal layer of the second gate will increase as the receptors capture the The number of these targets changes, and the second gate changes the voltage value of the metal layer through A corresponding current value change is transmitted from the field effect transistor to an external processing unit, and the external processing unit processes it to obtain the changes in the target objects in the fluid to be measured corresponding to the voltage value change of the metal layer. A concentration value at the preset temperature. 如請求項1所述的具有流體裝置的感測晶片,其中該參考電極與該待測流體接觸,並用以提供量測該第二閘極的該金屬層的該電壓值變化時所需的一電壓。 The sensing chip with a fluid device as claimed in claim 1, wherein the reference electrode is in contact with the fluid to be measured and is used to provide a signal required for measuring changes in the voltage value of the metal layer of the second gate. voltage. 如請求項1所述的具有流體裝置的感測晶片,其中該溫度調控單元為一脈衝寬度調變單元(PWM,pulse width modulation)。 The sensing chip with a fluid device as claimed in claim 1, wherein the temperature control unit is a pulse width modulation unit (PWM). 如請求項1所述的具有流體裝置的感測晶片,其中該預設溫度範圍為50℃-95℃。 The sensing chip with a fluid device as described in claim 1, wherein the preset temperature range is 50°C-95°C. 一種具有流體裝置的感測晶片,包括:一基板,該基板具有一第一區域及一第二區域;一場效電晶體,設置於該基板的該第一區域中,該場效電晶體包含一第一閘極、一源極及一汲極,該第一閘極設置在該源極及該汲極之間且在該基板上;一流體裝置,設置在該基板的該第二區域且與該場效電晶體電性連接,該流體裝置包括:一隔離層,具有一窗口,且設置於該基板的該第二區域上以暴露出該第二區域的該基板的一表面,其中該窗口所圍成的一區域為一容置空間;以及一第二閘極,設置於該隔離層的該窗口內,該第二閘極由該基板往上包括一多晶矽層及一層或多層的金屬層, 藉此,當將具有該流體裝置的該感測晶片置於具有一待測流體的一環境下,並使該待測流體通過該流體裝置的該第二閘極,對該流體裝置的該第二閘極施加一電壓時,該第二閘極的該金屬層的一表面會產生多個電荷,在該金屬層上的各該電荷的一帶電量會被在該待測流體內的一目標物影響,且該第二閘極的該金屬層的一電壓值會隨著該些電荷捕捉該些目標物的數量而改變,且該第二閘極將該金屬層的該電壓值經由該場效電晶體傳送至一外部處理單元以對該電壓電流值進行處理。 A sensing chip with a fluid device includes: a substrate having a first area and a second area; a field effect transistor disposed in the first area of the substrate, the field effect transistor including a A first gate, a source and a drain, the first gate is disposed between the source and the drain and on the substrate; a fluid device is disposed in the second area of the substrate and connected with The field effect transistor is electrically connected, and the fluid device includes: an isolation layer having a window, and is disposed on the second area of the substrate to expose a surface of the substrate in the second area, wherein the window An area enclosed is an accommodation space; and a second gate is disposed in the window of the isolation layer. The second gate includes a polycrystalline silicon layer and one or more metal layers from the substrate upward. , Thereby, when the sensing chip with the fluid device is placed in an environment with a fluid to be measured, and the fluid to be measured passes through the second gate of the fluid device, the third gate of the fluid device is When a voltage is applied to the second gate, a plurality of charges will be generated on a surface of the metal layer of the second gate, and a charged amount of each charge on the metal layer will be transferred to a target object in the fluid to be measured. influence, and a voltage value of the metal layer of the second gate will change with the number of the targets captured by the charges, and the second gate will pass the voltage value of the metal layer through the field effect The transistor is sent to an external processing unit to process the voltage and current values. 如請求項5所述的具有流體裝置的感測晶片,其中該電壓小於30伏特。 The sensing chip with a fluidic device as claimed in claim 5, wherein the voltage is less than 30 volts. 如請求項5所述的具有流體裝置的感測晶片,其中該待測流體為氣體。 The sensing chip with a fluid device as described in claim 5, wherein the fluid to be measured is a gas. 如請求項5所述的具有流體裝置的感測晶片,其中該目標物可以是細菌、病毒、懸浮微粒或氣體分子。 The sensing chip with a fluid device as claimed in claim 5, wherein the target may be bacteria, viruses, suspended particles or gas molecules.
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WO2005022134A1 (en) 2003-08-29 2005-03-10 Japan Science And Technology Agency Field-effect transistor, single electron transistor, and sensor using same

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