TWI818548B - Test kits and test equipment - Google Patents

Abstract

The present invention provides a test kit and test equipment. The bottom plate and the upper board of the adapter board assembly of the test kit are used to reshape the signal transmission mode and the installation mode, and through the design of the test carrier board or the existing test carrier board to cooperate with the test kit, carry out the installation on the test machine for testing. The invention can not only divert the test available space of the test carrier board to avoid affecting the components on the test carrier board, but also redesign the test carrier board to greatly increase the testable capacity of the test carrier board. The design or the existing test carrier board can be used to test different DUTs, which can reduce the setup cost of the plant equipment, the complexity of the test and improve the efficiency of the test output at the same time.

Description

Test suites and test equipment

The present invention relates to testing of semiconductors or electronic components, and in particular, to a testing kit and testing equipment.

Semiconductor components and wafers or lower-level electronic circuit components and wafers not only include complex manufacturing, packaging processes and testing related steps, but packaged wafers (integrated circuits) can generally refer to components with semiconductors. Then carry out the relevant testing process.

The equipment or device for testing semiconductor wafers has a test host specifically for testing semiconductor wafers and a carrier board used to install the object under test. The test host can be called a test machine or a test head, which installs the carrier board and tests the object under test. , the test host is a device that generates test signals or signal sources.

After the carrier board and test host for the object under test are installed, only the object under test based on the specific specifications of the carrier board can be tested. When different objects under test are to be tested, only carrier boards and test hosts with other specifications can be used. , its test host cannot be universal, that is, a set of equipment cannot test objects under test with other specifications or functions.

In view of the problems raised by the prior art, the present invention provides a test kit and test equipment to solve the problem that one set of equipment cannot test objects under test of other specifications or functions.

According to an embodiment of the present invention, a test kit is proposed, which includes: an adapter board assembly. The adapter board assembly is provided with a base plate and an upper plate. The lower surface of the base plate is provided with a plurality of first signal connection portions and A first connection for at least one relay control switch board connection The upper board is connected to the bottom board through a plurality of second connectors, and the upper surface of the upper board is provided with a plurality of second signal connection portions for connecting a plurality of adapter board connectors; and a mounting base, the mounting base The base is provided with a mounting slot for fixing the adapter plate assembly, and the mounting base is provided with at least one first fixing piece.

Wherein, the upper surface of the base plate is provided with a plurality of third signal connection portions, and the plurality of first signal connection portions of the base plate change the upper surface of the base plate through a first circuit layout layer of the base plate for the plurality of second signal connections. The arrangement direction of the plurality of third signal connection portions connected by the connector.

Wherein, a plurality of fourth signal connection portions are provided on the lower surface of the upper plate, and the arrangement direction of the plurality of fourth signal connection portions for connecting the plurality of second connectors and the plurality of third signal connection portions are provided on the lower surface of the upper plate. The three signal connection parts are arranged in the same direction, and the plurality of fourth signal connection parts are electrically connected to the plurality of second signal connection parts respectively through a second circuit layout layer of the upper board.

According to another embodiment of the present invention, a test equipment using the test kit is proposed. The test equipment includes: a test machine, the test machine is provided with a plurality of first signal connection parts for connecting. Tester signal connector.

It further includes a test carrier board, the test carrier board is provided with a test carrier board circuit layout layer, the lower surface of the test carrier board is provided with a plurality of lower surface signal connection portions, and the plurality of lower surface signal connection portions are electrically connected The plurality of adapter board connectors on the upper surface of the upper board, the plurality of lower surface signal connection portions are provided on the upper surface of the test carrier board through the test carrier board circuit layout layer of the test carrier board. The upper surface signal connection part is composed of a plurality of fifth electrical contacts, and the upper surface signal connection part is composed of a plurality of sixth electrical contacts.

It further includes a test carrier board, the lower surface of the test carrier board is provided with a plurality of fifth signal connection parts and at least a sixth signal connection part for connecting the plurality of adapter board connectors, and the test carrier board has A plurality of seventh signal connection portions are provided on the upper surface. The sixth signal connection portion changes the upper surface of the test carrier board through a test carrier board circuit layout layer of the test carrier board. In the arrangement direction of the plurality of seventh signal connection portions for connecting the plurality of third connectors, the third connector connected to each seventh signal connection portion is composed of a plurality of stacked connectors.

When the plurality of first signal connection parts of the base plate are installed and connected to the plurality of test machine signal connectors of the test machine, the plurality of test signals provided by the plurality of test machine signal connectors of the test machine pass through After the plurality of first signal connection portions on the lower surface of the base plate, the plurality of test signals are transmitted out through the plurality of third signal connection portions and the plurality of second connectors on the upper surface of the base plate.

The possible technical effect of the present invention is to reorganize the signal of the adapter board component in the test suite, change the signal transmission path and installation structure and method, and thereby divert the available test space of the test carrier board to avoid affecting the test carrier board. components. Moreover, the present invention can greatly increase the testable capacity of the test carrier board by redesigning the test carrier board. The redesigned test carrier board and the existing test carrier board can be directly applied to the adapter board connector on the adapter board assembly. Perform assembly and testing under a set of test equipment, reducing equipment setup costs and accelerating (times) test output.

In order to further understand the technology, methods and effects adopted by the present invention to achieve the intended purpose, please refer to the following detailed description and drawings of the present invention. It is believed that the purpose, features and characteristics of the present invention can be understood in depth and concretely. However, the attached drawings are only for reference and illustration, and are not intended to limit the present invention.

1: Test suite

11: Adapter board components

111: Bottom plate

112:On the board

112A: Fourth signal connection part

113: First signal connection part

114:First connector

115:Relay control switch board

116:Second connector

117: Adapter board connector

117A: Second signal connection part

118:Third signal connection part

12:Mounting seat

121:Installation slot

122:First fixing piece

123: handrail

13:Support column

2:Testing machine

21:Testing machine signal connector

3: Test carrier board

31: Lower surface signal connection part

32: Upper surface signal connection part

4: Test carrier board

41:Fifth signal connection part

42:Sixth signal connection part

43:Seventh signal connection part

5:Third connector

6: Connecting rod fixing device

61: First control axis device

610: First pressing device

611: First connecting rod

612:The first fixed vehicle

613: first groove

614: First extension track

615: First placement hole

7: First track

8: Test the carrier plate connecting rod fixing device

81: Second control axis device

811: Second suppression device

812: Second connecting rod

813:Second fixed vehicle

814: Second groove

815: Second extension track

816: Second insertion hole

9:Second track

100: Fixed frame plate

200: handrail

300:Second fixing piece

FIG. 1 shows a schematic three-dimensional exploded structure diagram of a test kit installed in a testing machine to form a testing device according to an embodiment of the present invention.

FIG. 2 shows a schematic diagram of the three-dimensional assembly structure of the test kit installed on the test machine to form the test equipment according to an embodiment of the present invention.

Figure 3 shows the structure and perspective diagram of a test kit according to an embodiment of the present invention. Figure.

FIG. 4 shows the structure and perspective view of the bottom plate and the upper plate of the test kit according to an embodiment of the present invention.

FIG. 5 shows a schematic diagram of installing the test carrier board after the test kit and the test machine are installed according to an embodiment of the present invention.

FIG. 6 shows a schematic diagram of installing an existing test carrier board after the test kit and the test machine are installed according to an embodiment of the present invention.

FIG. 7 shows a structural and perspective view of redesigning an existing test carrier board according to an embodiment of the present invention.

FIG. 8 shows a schematic diagram of the use state when the test kit is fixed through a fastener according to an embodiment of the present invention.

FIG. 9 shows a schematic diagram of the use state in which the fastener is inserted into the test kit for fixing and limiting according to an embodiment of the present invention.

The following is an explanation of the implementation of the "test kit and test equipment" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations, not depictions based on actual dimensions, and the sequential names and spaces of "bottom", "top", "first" to "seventh" or more are mentioned in the description. The relative position names are only for understanding the relative positions and spatial distribution of the technical features of the present invention, and are not intended to limit the scope of protection of the present invention, as stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, and the disclosed detailed content is not intended to limit the scope of the present invention.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, a brief introduction will be given below to the drawings needed to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those with ordinary knowledge and skills in the art, other drawings can also be obtained based on these drawings without putting in too much effort.

The invention discloses a test kit and test equipment. The materials used for the bottom plate and the upper plate in the test kit can be one of common insulating and flame-resistant circuit substrates, plastic plates, rubber plates, bakelite boards, glass fiber substrates, or Any board available for circuit layout. In addition, the test machine in the test equipment can be installed with software and hardware that provide test signals or a motherboard that provides test signals, and the test machine has a power socket connected to an external power cord for the test machine to connect to power and operate.

The testing machine of the testing equipment can be equipped with a moving mechanism, such as a pulley, so that the entire testing equipment can be easily moved or a bracket can be provided to bear the weight of the testing machine. Moreover, the testing machine can also be placed at a specific location in the factory without installing a moving mechanism. In principle, the test machine is equipped with a test table for the installation and replacement of test kits, and the inside of the test machine can also be equipped with heat dissipation fans or fins to match the heat dissipation holes on the test machine to assist when the test machine is operating. heat dissipation.

When the test kit is installed on the test machine for testing, the test machine can be installed on a rotatable support rod so that the test machine can rotate based on an axis to change the angle of the test table. This also facilitates the operator's installation and Dismantling and maintenance work.

Please continue to refer to the following description. According to an embodiment of the present invention, please refer to FIGS. 1 to 4 . FIG. 1 shows a three-dimensional exploded structural diagram of a test kit shown in an embodiment of the present invention installed on a test machine to form a test equipment. FIG. 2 shows a schematic diagram of the three-dimensional assembly structure of the test kit installed on the test machine to form the test equipment according to an embodiment of the present invention. FIG. 3 shows the structure and perspective view of a test kit according to an embodiment of the present invention. FIG. 4 shows the structure and perspective view of the bottom plate and the upper plate of the test kit according to an embodiment of the present invention.

The present invention provides a test kit that can be applied to semiconductor test equipment. The test equipment includes a test kit 1 and a test machine 2. The test kit 1 includes but is not limited to: an adapter board assembly 11 and a mounting base 12.

Among them, the adapter board assembly 11 is provided with a bottom plate 111 and an upper plate 112. The two plates are arranged in parallel. The bottom surface of the bottom plate 111 is provided with a plurality of first signal connection portions 113 and at least one relay control switch board 115. First connector 114. The upper board 112 is connected to the bottom board 111 through a plurality of second connectors 116 , and a plurality of second signal connection portions 117A for connecting a plurality of adapter board connectors 117 are provided on the upper surface of the upper board 112 .

In one embodiment, a plurality of first connectors 114 can be provided to respectively connect to a relay control switch board 115 , and the first connectors 114 electrically connect a plurality of first signal connections through the circuit layout of the base plate 111 Part 113, the function of the relay control switch board 115 is to control the timely opening or closing of a plurality of relay switches therein, so as to achieve the effect of changing or expanding the input and output pins of the testing machine. That is, by controlling the power on and off of each relay, the test signal of the testing machine passes through multiple relays in the relay control switch board 115, and the signal transmission path is changed in which the relay's off-circuit is a path or the path is an open-circuit, that is, the signal transmission path can be changed. Or expand the number of input and output pins that the test machine can test. The first connector 114 may be a backplane connector, the adapter board connector may be a connector in the form of a pogo pin, and the pogo pin connector has a certain height, but the present invention is not as described above. for restrictions.

Among them, the test kit 1 also includes a mounting base 12. The mounting base 12 is provided with a mounting slot 121, and the mounting slot 121 provides the adapter plate assembly 11 for fixation. In one embodiment, the upper plate 112 can be inserted into the installation slot 121 for fixation, or both the bottom plate 111 and the upper plate 112 can be inserted into the installation slot 121 for fixation, but the invention is not limited to the above.

Moreover, a plurality of first fixing members 122 are provided on the mounting base 12, and the plurality of first fixing members 122 are disposed on the sides of the mounting base 12 through the plate body.

The present invention reorganizes signals through the adapter board assembly 11 and reorganizes the multiple boards for signal transmission, and the installation method is also adjusted accordingly. It can not only connect the test machine of a single specification test equipment, but also can pass the signal after reorganization. , to be applicable to test carrier boards of different specifications and corresponding objects under test.

Referring to Figures 3 and 4, the signal reshaping of the present invention is to provide a plurality of third signal connection portions 118 on the upper surface of the base plate 111, and the plurality of first signal connection portions 113 of the base plate 111 pass through a first The circuit layout layer changes the arrangement direction of the plurality of third signal connection portions 118 on the upper surface of the base plate 111 for connecting the plurality of second connectors 116 . And a plurality of fourth signal connection portions 112A are provided on the lower surface of the upper plate 112. The lower surface of the upper plate 112 is provided with a plurality of fourth signal connection portions 112A for connecting the plurality of second connectors 116. The arrangement direction and number of the three signal connection portions 118 are the same or different. The plurality of fourth signal connection portions 112A are electrically connected to the plurality of second signal connection portions 117A through a second circuit layout layer of the upper board 112 .

In one embodiment, the first signal connection part 113 is composed of a plurality of first electrical contacts, the second signal connection part 117A is composed of a plurality of second electrical contacts, and the third signal connection part 118 is composed of a plurality of third electrical contacts. The fourth signal connection part 112A is composed of a plurality of fourth electrical contacts, and is not limited to the above.

In one embodiment, the arrangement directions of the plurality of first signal connection portions 113 on the lower surface of the base plate 111 and the arrangement directions of the plurality of third signal connection portions 118 on the upper surface of the base plate 111 are perpendicular to each other or are not limited. That is to say, when the present invention changes the arrangement direction of the plurality of third signal connection portions 118 through the first circuit layout layer, the arrangement size of the upper board 112 and the layout position of the components on the upper board 112 can be changed. Therefore, after changing the setting size of the upper board 112 and the layout position of the components on the upper board 112, and setting the adapter board connector 117, the connection space of the test carrier board can be diverted. The adapter board connector 117 can connect different specifications. Test the carrier board and the corresponding object under test. At this time, the installation and test available space of the test carrier board can be moved out (with the adapter board connector 117), which can avoid the traditional The test carrier board is directly installed on a single test machine and the space is limited, so as to increase the available space for the installation and testing of the test carrier board, and to increase the setting height of the components on the test carrier board after it is installed to avoid components being placed on the test carrier board. The test carrier board is subject to interference during installation and testing (because components are usually placed on the lower surface of the test carrier board, which can reduce or avoid interference to the components).

In one embodiment, since the present invention increases the available space for installation and testing of the test carrier board and avoids affecting the components on the test carrier board, the present invention can also redesign the test carrier board accordingly, so that the object under test Compared with the test carrier board, the number of test positions that can be installed can be increased, for example, four test positions (4site) can be changed to eight test positions (8site) or more test positions. That is to say, the test carrier board can be separated from the restriction of being installed directly on the test machine. Not only can the test carrier board be redesigned, but the number of objects under test that can be installed relative to the test carrier board can also be changed.

In one embodiment, when the adapter plate assembly 11 is fixed to the installation groove 121, it is fixed by fitting or other fixing means such as locking fixation, riveting fixation, etc., and the invention is not limited to the above. .

Please continue to refer to FIGS. 5 to 9 , and refer to FIGS. 1 to 4 in conjunction. FIG. 5 shows a schematic diagram of the test carrier board after the test kit and the test machine are installed according to an embodiment of the present invention. FIG. 6 shows a schematic diagram of installing an existing test carrier board after the test kit and the test machine are installed according to an embodiment of the present invention. FIG. 7 shows a structural and perspective view of redesigning an existing test carrier board according to an embodiment of the present invention. FIG. 8 shows a schematic diagram of the use state when the test kit is fixed through a fastener according to an embodiment of the present invention. FIG. 9 shows a schematic diagram of the use state in which the fastener is inserted into the test kit for fixing and limiting according to an embodiment of the present invention. Among them, Figures 8 and 9 are enlarged views of the IX area in Figure 2.

When the test carrier boards 3 and 4 of specific specifications are to be installed for testing through the test kit 1 of the present invention, the test can be performed through redesigned or existing test carrier boards 3 and 4 . In one embodiment, please see Figure 5. The test carrier board 3 is provided with a test carrier board circuit layout layer. The following table of the test carrier board 3 A plurality of lower surface signal connection portions 31 are provided on the upper surface of the test carrier board 3 through the test carrier board circuit layout layer of the test carrier board 3. A plurality of upper surface signal connection portions are provided on the upper surface of the test carrier board 3. 32. The lower surface signal connection part 31 is composed of a plurality of fifth electrical contacts, and the upper surface signal connection part 32 is composed of a plurality of sixth electrical contacts.

In one embodiment, referring to FIG. 1 and FIG. 5 , the test machine 2 is prepared and the test kit 1 and the test carrier board 3 are installed during testing. The test machine 2 is provided with a plurality of test machine signal connectors 21 for connecting the plurality of first signal connection portions 113 of the base plate 111 of the test suite 1. When the plurality of first signal connection portions 113 of the base plate 111 of the test suite 1 are connected, When installed and connected to the plurality of test machine signal connectors 21 of the test machine 2, the plurality of lower surface signal connection portions 31 of the test carrier board 3 are installed (electrically connected) to the upper surface of the upper board 112 of the test suite 1. Multiple adapter board connectors 117 are installed for subsequent testing.

In one embodiment, after the plurality of test signals provided by the plurality of tester signal connectors 21 of the testing machine 2 pass through the plurality of first signal connection portions 113 on the lower surface of the base plate 111, they are then passed through the plurality of first signal connection portions 113 on the upper surface of the base plate 111. The third signal connection part 118 and the plurality of second connectors 116 transmit a plurality of test signals. Through the signal reorganization and redesign of the adapter board assembly 11 or when the existing test carrier boards 3 and 4 are assembled and tested, not only the available test space of the test carrier boards 3 and 4 can be expanded, but also the installation and installation of the test carrier boards 3 and 4 can be expanded. The above components will not be affected during testing, and it can also be quickly switched to support testing of objects under test of different specifications to install test carrier boards 3 and 4 of different specifications, for example, between test machine 2 and test kit 1 of a set of test equipment. Under the conditions, the test carrier board 3 is switched to the test carrier board 4 to install and test carrier boards of different specifications.

In one embodiment, in addition to the redesigned test carrier boards 3 and 4, it can also be an existing carrier board, for example, it can be a carrier board with S100-7D-BY8-2MM-Raising-diag-LB specification to connect to Pogo pin form adapter board connector 117, but the present invention is not limited to the above.

Since the present invention transmits test signals through the adapter board assembly 11 in the test kit 1 After the path and the installation method of the test kit 1 relative to the test machine 2 are changed and rearranged, the adapter board connector 117 on the test kit 1 can be directly adapted to and connected to the designed test carrier boards 3 and 4 of different specifications or existing The test carrier boards 3 and 4 of the S100-7D-V50-ITF-BD specification are shown in Figure 6, and the existing test carrier boards 3 and 4 of the S100-7D-V50-ITF-BD specification can also be designed.

In one embodiment, referring to Figures 6 and 7, the lower surface of the test carrier board 4 of the S100-7D-V50-ITF-BD specification is provided with a plurality of fifth signal connections for a plurality of adapter board connectors 117 to connect to. 41 and two sixth signal connection parts 42. A plurality of seventh signal connection parts 43 are provided on the upper surface of the test carrier board 4. The two sixth signal connection parts 42 pass through a test carrier board circuit of the test carrier board 4. The layout layer changes the arrangement direction of the plurality of seventh signal connection portions 43 on the upper surface of the test carrier 4 for connection with the plurality of third connectors 5. The change in the arrangement direction is that the portion of the seventh signal connection portion 43 and the third signal connection portion 43 are connected to each other. The arrangement directions of the six signal connection portions 42 are mutually perpendicular or not limited, and the third connector 5 is composed of a plurality of stacked connectors.

In one embodiment, when the third connector 5 is a plurality of stacked connectors, it can be a board-to-board connector, and the board-to-board connector can be a three-row jack with 64 pins and is locked together. The fixing means are installed on the test carrier board 4, and each third connector 5 is used to install the circuit board to be tested (not shown in the figure), and the invention is not limited by the above.

Therefore, the present invention changes the arrangement direction of some of the plurality of seventh signal connection portions 43 through the test carrier board 4 to restructure the signals, and further raises the height with connectors stacked on each other, so that the present invention can be installed on the existing S100-7D- When testing the object under test (for example, a circuit board under test) of the V50-ITF-BD specification, the available test space of the test carrier board 4 is diverted to avoid affecting the installation of the test carrier board 4. The components originally set above. In this way, the present invention allows the designed or existing test carrier boards 3 and 4 of any specifications to be easily installed on the test machine 2 through the test kit 1 through the rearrangement of the signal path and installation method of the adapter board assembly 11 . Quickly switch the installation of each test carrier board 3 and 4. For example, when the connector 117 of each adapter board is a Pogo pin connector, it can be quickly replaced. The S100-7D-BY8-2MM-Raising-diag-LB specification carrier board or the S100-7D-V50-ITF-BD specification carrier board is tested to quickly switch and support the installation of test carrier boards 3 and 4 of different specifications.

Moreover, after the available test space of the test carrier boards 3 and 4 is appropriated, not only the test capacity of the test carrier boards 3 and 4 can be changed through design. In addition, on the premise that semiconductor test equipment is expensive, the test equipment of the test machine 2 can be effectively reduced to one set, and test carrier boards 3 and 4 of different specifications can be quickly replaced in the same test factory or test area. Accelerated or multiplied test output can be obtained.

In one embodiment, referring to Figures 3, 5, and 6, when the test kit 1 is installed on the test machine 2 for signal transfer, the second connector 116 can be configured as a board-to-board connector to increase the height between the base plate 111 and the upper The overall installation height of the board 112. Moreover, a plurality of support pillars 13 can also be provided on the base plate 111 or the mounting base 12 to increase the height of the test kit 1 when it is installed, so that the test carrier boards 3 and 4 subsequently installed on it can be more easily installed. The improvement of the available space for testing will basically not be affected by the test machine 2.

In one embodiment, the mounting base 12 of the test kit 1 can be provided with symmetrical handrails 123. When installing or disassembling relative to the testing machine 2, testers can use the handrails to quickly align and install and easily disassemble. This avoids the problem that the base plate 111 of the test kit 1 and the electrical contacts of the test machine 2 cannot be easily aligned and connected reliably, and the tester can also easily remove the test kit 1.

In one embodiment, referring to Figures 1, 3, 8, and 9, when the present invention installs the test kit 1 and the test carrier boards 3 and 4, in principle, the plurality of base plates 111 in the adapter board assembly 11 of the test kit 1 are installed. The first signal connection part 113 only needs to be electrically connected to the plurality of tester signal connectors 21 of the tester 2 . In the same way, the signal connection parts of the test carrier boards 3 and 4 and the adapter board connector 117 on the upper plate 112 of the adapter board assembly 11 can also be electrically connected through the spring force of the spring pin connector spring. . However, when the present invention is tested, the test kit 1 and the test carrier boards 3 and 4 can also be compared with the test machine 2 Perform effective fixation to avoid signal transmission problems during testing.

Therefore, in one embodiment, one or more first fixing members 122 are provided on the mounting base 12 of the test kit 1, which may be distributed around the mounting base 12, and the first fixing members are rollers. The test table of the testing machine 2 includes one or more sets of connecting rod fixing devices 6. The connecting rod fixing device 6 is provided with a first control shaft device 61. The first control shaft device 61 is provided with a first pressing device 610 and a first pressing device 610. A connecting rod 611. The first connecting rod 611 is connected to a first fixed carrier 612 moving on a first track 7. The first fixed carrier 612 is provided with a first groove 613 and the first groove 613 is provided with a first fixed carrier 612. The first extension rail 614 is provided with an inclination angle. The first fixed carrier 612 is provided with a first insertion hole 615 of the first groove 613 .

When the plurality of first signal connection portions 113 of the base plate 111 are installed and connected to the plurality of test machine signal connectors 21 of the test machine 2, the first fixing member 122 is simultaneously inserted into the first groove 613 through the first insertion hole 615. (At this time, the mounting base 12 can be placed beside the connecting rod fixing device 6), and then the first pressing device 610 is operated relative to the first control shaft device 61 to drive the first fixed carrier through the first connecting rod 611. 612 moves on the first track 7, and through the movement of the first fixed carrier 612, the first fixing member 122, which is a roller, moves relatively in the first extended track 614 for limiting and fixing.

In one embodiment, when there are multiple sets of link fixing devices 6, the first fixing carrier 612 and its corresponding first groove 613, first insertion hole 615, first track 7 and first extension track 614 can be Multiple groups are provided, and the multiple groups of first fixed carriers 612 are controlled and linked with each other. That is to say, one end of one of the first control shaft devices 61 controls the movement of the first fixed carrier 612 through the first connecting rod 611 to limit and fix the test kit 1, and the other end of the same first control shaft device 61 then It is connected through an intermediate link, and the intermediate link is connected to another first fixed carrier 612 through another first control shaft device 61, which is arranged relative to another track, thereby driving each fixed carrier to move on the track. , when each first fixing part is a roller, it moves relatively in the extended track of each fixed carrier. Limit and fix to strengthen the installation of the fixed test kit 1.

In addition, the test carrier plates 3 and 4 can also be strengthened and fixed relative to the test machine 2. The test machine 2 is provided with one or more sets of test carrier plate connecting rod fixing devices 8, which have the same structure and action principle as the aforementioned connecting rod fixing devices 6. or approximately. The test carrier plate connecting rod fixing device 8 is provided with a second control shaft device 81. The second control shaft device 81 is provided with a second pressing device 811 and a second connecting rod 812. The second connecting rod 812 is connected to a second track 9 On a second fixed carrier 813 that moves upward, the second fixed carrier 813 is provided with a second groove 814 and the second groove 814 is provided with a second extension track 815. The second extension track 815 has an inclination angle. A second insertion hole 816 of the second groove 814 is provided on the two fixed carriers 813 . In conjunction with FIG. 7 , the test carriers 3 and 4 can be provided with a fixed frame plate 100 . The fixed frame plate 100 is provided with two handrails 200 and a plurality of second fixing parts 300 . The second fixing parts 300 are rollers.

When the test carrier boards 3 and 4 are connected to the plurality of adapter board connectors 117 on the upper surface of the upper board 112, the second fixing member 300 is simultaneously inserted into the second groove 814 through the second insertion hole 816, and then passes through the second insertion hole 816. The operation of the second pressing device 811 relative to the second control shaft device 81 drives the second fixed carrier 813 to move on the second track 9 through the second connecting rod 812, and the movement of the second fixed carrier 813 causes the second fixed component to move. When 300 is a roller, the relative movement is limited and fixed in the second extension track 815 . Therefore, the test carrier boards 3 and 4 can also be effectively fixed like the test kit 1 and facilitate the tester's operation during testing.

In one embodiment, the aforementioned electrical contacts may be gold finger electrical contacts, electroplated electrical contacts, electrical contacts with solder, printed electrical contacts, or electrical contacts produced by any circuit board (PCB) process, etc. etc., and the present invention is not limited by the above.

[Possible technical effects of the present invention]

The possible technical effect of the present invention is to reorganize the signal of the adapter board assembly in the test kit, change the signal transmission path and the installation structure and method, thereby achieving the test carrier board The available test space is diverted to avoid affecting the components on the test carrier board. Moreover, the present invention can greatly increase the testable capacity of the test carrier board by redesigning the test carrier board. The redesigned test carrier board and the existing test carrier board can be directly applied to the adapter board connector on the adapter board assembly. Carry out assembly and testing under a set of test equipment, reducing equipment setup costs (factory area) and accelerating (twice) the test output.

Finally, it should be noted that in the foregoing description, although the concept of the technology of the present invention has been specifically shown and described in a plurality of exemplary embodiments, those with ordinary knowledge in the field of this technology will understand that without Various changes in form and details may be made without departing from the scope of the technical concept of the present invention as defined by the following claims.

1: Test suite

11: Adapter board components

111: Bottom plate

112:On the board

112A: Fourth signal connection part

113: First signal connection part

114:First connector

115:Relay control switch board

117: Adapter board connector

118:Third signal connection part

12:Mounting seat

121:Installation slot

122:First fixing piece

123: handrail

13:Support column

Claims (10)

A test suite that includes: An adapter board assembly, the adapter board assembly is provided with a bottom plate and an upper plate, the bottom surface of the bottom plate is provided with a plurality of first signal connection parts and at least a first connector for connecting a relay control switch board, the upper surface The board is connected to the bottom board through a plurality of second connectors, and the upper surface of the upper board is provided with a plurality of second signal connection portions for connecting the plurality of adapter board connectors; and A mounting base, the mounting base is provided with a mounting slot for fixing the adapter plate assembly, and the mounting base is provided with at least one first fixing piece; Wherein, the upper surface of the base plate is provided with a plurality of third signal connection portions, and the plurality of first signal connection portions of the base plate change the upper surface of the base plate through a first circuit layout layer of the base plate for the plurality of second signal connections. The arrangement direction of the plurality of third signal connection parts connected by the connector; Wherein, a plurality of fourth signal connection portions are provided on the lower surface of the upper plate, and the arrangement direction of the plurality of fourth signal connection portions for connecting the plurality of second connectors and the plurality of third signal connection portions are provided on the lower surface of the upper plate. The three signal connection parts are arranged in the same direction, and the plurality of fourth signal connection parts are electrically connected to the plurality of second signal connection parts respectively through a second circuit layout layer of the upper board. The test kit according to claim 1, wherein the arrangement direction of the plurality of first signal connection portions on the lower surface of the base plate and the arrangement direction of the plurality of third signal connection portions on the upper surface of the base plate are perpendicular. The test kit of claim 1, wherein the first signal connection part is composed of a plurality of first electrical contacts, the second signal connection part is composed of a plurality of second electrical contacts, and the third signal connection part is composed of It is composed of a plurality of third electrical contacts, and the fourth signal connection part is composed of a plurality of fourth electrical contacts. The test kit according to claim 1, wherein the first fixing member is a roller, and at least one support column is provided on the bottom plate or the mounting base for heightening. The test kit according to claim 1, further comprising a test carrier board, the test carrier board is provided with a test carrier board circuit layout layer, the lower surface of the test carrier board is provided with a plurality of lower surface signal connection portions, and the plurality of lower surface signal connection portions are provided on the lower surface of the test carrier board. A lower surface signal connection portion is electrically connected to the plurality of adapter board connectors on the upper surface of the upper board. The plurality of lower surface signal connection portions pass through the test carrier board circuit layout layer of the test carrier board. The upper surface of the carrier board is provided with a plurality of upper surface signal connection portions. The lower surface signal connection portion is composed of a plurality of fifth electrical contacts. The upper surface signal connection portion is composed of a plurality of sixth electrical contacts. The test kit according to claim 1, further comprising a test carrier board, the lower surface of which is provided with a plurality of fifth signal connection portions for connecting the plurality of adapter board connectors and at least a sixth The signal connection part is provided with a plurality of seventh signal connection parts on the upper surface of the test carrier board. The sixth signal connection part changes the upper surface of the test carrier board through a test carrier board circuit layout layer to provide multiple signal connection parts. The direction in which the seventh signal connection portions are connected to a third connector, and the third connector is composed of a plurality of stacked connectors. A kind of test equipment, the test equipment includes: - Having a test suite as described in any one of claims 5 to 6; and A testing machine, the testing machine is provided with a plurality of testing machine signal connectors for connecting the plurality of first signal connection parts; Wherein, when the plurality of first signal connection parts of the base plate are installed and connected to the plurality of test machine signal connectors of the testing machine, the plurality of test machine signal connectors of the testing machine provide a plurality of test signals. After the signals pass through the first signal connection portions on the lower surface of the base plate, the test signals are transmitted out through the third signal connection portions and the second connectors on the upper surface of the base plate. The test equipment of claim 7, wherein the second connector is a board-to-board connector, and the adapter board connector is a spring pin connector. The testing equipment of claim 7, wherein the testing machine is provided with a connecting rod fixing device, the connecting rod fixing device is provided with a first control shaft device, and the first control shaft device is provided with a first pressing device and a first A connecting rod, the first connecting rod is connected to a first fixed carrier moving on a first track, the first fixed carrier is provided with a first groove, and the first groove is provided with a first extension track , the first extension track is provided with an inclination angle, the first fixed carrier is provided with a first insertion hole of the first groove, when the plurality of first signal connection parts of the base plate are installed and connected to the test When the plurality of test machine signal connectors are installed on the machine, the first fixing member is simultaneously inserted into the first groove through the first inserting hole, and then is relative to the first control shaft device through the first pressing device. The operation of the first connecting rod drives the first fixed carrier to move on the first track, and the movement of the first fixed carrier causes the first fixed component to move relative to the first extended track to limit the movement. Position and fixed. The test equipment of claim 9, wherein the testing machine is provided with a test carrier plate connecting rod fixing device, the test carrier plate connecting rod fixing device is provided with a second control shaft device, and the second control shaft device is provided with a first Two pressing devices and a second connecting rod, the second connecting rod is connected to a second fixed carrier moving on a second track, the second fixed carrier is provided with a second groove and the second groove A second extension track is provided, the second extension track is provided with an inclination angle, the second fixed carrier is provided with a second insertion hole of the second groove, and the test carrier plate is provided with a fixed frame plate, The fixed frame board is provided with two handrails and at least one second fixing part. The second fixing part is a roller. When the test carrier board is connected to the plurality of adapter board connectors on the upper surface of the upper board, the third fixing part is The two fixing members are simultaneously inserted into the second groove through the second insertion hole, and then the second pressing device is operated relative to the second control shaft device to drive the second fixed load through the second connecting rod. The tool moves on the second track, and the movement of the second fixed carrier causes the second fixing component to move relatively within the second extended track for limiting and fixing.

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