TWI813026B - Two-phase immersion-cooled heat-dissipation substrate - Google Patents
Two-phase immersion-cooled heat-dissipation substrate Download PDFInfo
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 56
- 239000000758 substrate Substances 0.000 title claims abstract description 30
- 238000010438 heat treatment Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 9
- 239000000110 cooling liquid Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 238000007654 immersion Methods 0.000 description 4
- 239000002826 coolant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明涉及一種散熱基材，具體來說是涉及一種兩相浸沒式散熱基材。The present invention relates to a heat dissipation base material, specifically to a two-phase immersed heat dissipation base material.
浸沒式冷卻技術是將發熱元件(如伺服器、磁碟陣列等)直接浸沒在不導電的冷卻液中，以透過冷卻液吸熱氣化帶走發熱元件運作所產生之熱能。然而，如何透過浸沒式冷卻技術更加有效地進行散熱一直是業界所需要解決的問題。Immersion cooling technology directly immerses heating components (such as servers, disk arrays, etc.) in non-conductive cooling liquid, so that the cooling liquid absorbs heat and vaporizes to take away the heat energy generated by the operation of the heating components. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem that the industry needs to solve.
有鑑於此，本發明人本於多年從事相關產品之開發與設計，有感上述缺失之可改善，乃特潛心研究並配合學理之運用，終於提出一種設計合理且有效改善上述缺失之本發明。In view of this, the inventor has been engaged in the development and design of related products for many years. He felt that the above deficiencies could be improved, so he devoted himself to research and applied academic theories, and finally proposed an invention that is reasonably designed and effectively improves the above deficiencies.
本發明所要解決的技術問題在於，針對現有技術的不足提供一種兩相浸沒式散熱基材。The technical problem to be solved by the present invention is to provide a two-phase immersed heat dissipation base material in view of the shortcomings of the existing technology.
為了解決上述的技術問題，本發明提供一種兩相浸沒式散熱基材，用以與發熱元件接觸，包括：一浸沒式散熱基底；至少一第一鰭片組；至少一第二鰭片組；其中，所述浸沒式散熱基底具有一上表面及一下表面，所述下表面用以與所述發熱元件接觸，所述上表面形成有所述至少一第一鰭片組及所述至少一第二鰭片組，所述至少一第一鰭片組的位置對應於所述發熱元件的至少一熱源高溫區的正上方，所述至少一第二鰭片組的位置對應於所述發熱元件的非所述至少一熱源高溫區的正上方，所述至少一第一鰭片組包含有複數個第一鰭片，所述至少一第二鰭片組包含有複數個第二鰭片，所述複數個第一鰭片的排列密度大於所述複數個第二鰭片的排列密度，並且所述複數個第一鰭片的鰭片高度大於所述複數個第二鰭片的鰭片高度。In order to solve the above technical problems, the present invention provides a two-phase immersed heat dissipation substrate for contacting the heating element, including: an immersed heat dissipation substrate; at least a first fin group; at least a second fin group; Wherein, the immersed heat dissipation base has an upper surface and a lower surface, the lower surface is used to contact the heating element, and the at least one first fin group and the at least one first fin group are formed on the upper surface. Two fin groups, the position of the at least one first fin group corresponds to directly above the high temperature zone of at least one heat source of the heating element, and the position of the at least one second fin group corresponds to the position of the heating element. Not directly above the high temperature zone of the at least one heat source, the at least one first fin group includes a plurality of first fins, the at least one second fin group includes a plurality of second fins, and the at least one first fin group includes a plurality of second fins. The arrangement density of the plurality of first fins is greater than the arrangement density of the plurality of second fins, and the fin height of the plurality of first fins is greater than the fin height of the plurality of second fins.
在一優選實施例中，所述浸沒式散熱基底係以鋁、銅、鋁合金、銅合金的其中之一所製成。In a preferred embodiment, the immersed heat dissipation base is made of one of aluminum, copper, aluminum alloy, and copper alloy.
在一優選實施例中，所述浸沒式散熱基底是浸沒於兩相冷卻液中且孔隙率大於5%的一多孔金屬散熱片。In a preferred embodiment, the immersed heat dissipation base is a porous metal heat sink immersed in a two-phase cooling liquid and with a porosity greater than 5%.
在一優選實施例中，每個所述第一鰭片組的孔隙率與每個所述第二鰭片組的孔隙率皆高於所述浸沒式散熱基底的孔隙率。In a preferred embodiment, the porosity of each first fin group and the porosity of each second fin group are higher than the porosity of the immersed heat dissipation base.
在一優選實施例中，每個所述第一鰭片組的鰭片數量大於每個所述第二鰭片組的鰭片數量。In a preferred embodiment, the number of fins in each first fin group is greater than the number of fins in each second fin group.
在一優選實施例中，每個所述第一鰭片組與每個所述第二鰭片組是一體成型在所述浸沒式散熱基底的所述上表面上。In a preferred embodiment, each first fin group and each second fin group are integrally formed on the upper surface of the immersed heat dissipation base.
在一優選實施例中，每個所述第一鰭片組與每個所述第二鰭片組是呈接續排列設置。In a preferred embodiment, each of the first fin groups and each of the second fin groups are arranged in a continuous arrangement.
為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不背離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。The following is a description of the relevant implementation modes disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.
[第一實施例][First Embodiment]
請參閱圖1所示，其為本發明的其中一種實施例，本發明實施例提供了兩相浸沒式散熱基材700，用以接觸發熱元件800。如圖1所示，根據本發明實施例所提供的兩相浸沒式散熱基材700，其基本上包括有浸沒式散熱基底10、至少一第一鰭片組20、以及至少一第二鰭片組30。Please refer to FIG. 1 , which is an embodiment of the present invention. The embodiment of the present invention provides a two-phase immersed heat dissipation substrate 700 for contacting the heating element 800 . As shown in FIG. 1 , a two-phase immersed heat dissipation substrate 700 provided according to an embodiment of the present invention basically includes an immersed heat dissipation substrate 10 , at least one first fin set 20 , and at least one second fin. Group 30.
在本實施例中，浸沒式散熱基底10可採用高導熱性材所製成，例如鋁、銅或其合金。進一步說，本實施例的浸沒式散熱基底10可以是浸沒於兩相冷卻液900中且孔隙率大於5%的多孔金屬散熱片，用於增加氣泡的生成量，以加強浸沒式散熱效果。並且，本實施例的浸沒式散熱基底10的孔隙率是被訂在5%以上，50%以下。In this embodiment, the immersed heat dissipation substrate 10 can be made of a material with high thermal conductivity, such as aluminum, copper or alloys thereof. Furthermore, the immersed heat dissipation substrate 10 of this embodiment can be a porous metal heat sink immersed in the two-phase cooling liquid 900 and with a porosity greater than 5%, which is used to increase the generation of bubbles to enhance the immersed heat dissipation effect. Furthermore, the porosity of the immersed heat dissipation substrate 10 of this embodiment is set to be between 5% and 50%.
在本實施例中，浸沒式散熱基底10具有相對的一上表面11及一下表面12。浸沒式散熱基底10的下表面12用以與發熱元件800接觸。並且，浸沒式散熱基底10的上表面11形成有一個第一鰭片組20以及兩個第二鰭片組30。In this embodiment, the immersed heat dissipation substrate 10 has an upper surface 11 and a lower surface 12 opposite to each other. The lower surface 12 of the immersed heat dissipation substrate 10 is used to contact the heating element 800 . Furthermore, a first fin group 20 and two second fin groups 30 are formed on the upper surface 11 of the immersed heat dissipation base 10 .
進一步說，本實施例的第一鰭片組20的位置是對應於發熱元件800預定的熱源高溫區801的正上方，且兩個第二鰭片組30的位置是對應於發熱元件800的非熱源高溫區的正上方。在本實施例中，熱源高溫區801在發熱元件800的中央處，非熱源高溫區(也可以說發熱溫度相對較低的兩熱源低溫區802)在發熱元件800的中央處的兩側，使得本實施例的第一鰭片組20的位置是對應於發熱元件800的中央處，兩個第二鰭片組30的位置是對應於發熱元件800的中央處的兩側。並且，第一鰭片組20與兩個第二鰭片組30是呈接續排列設置，也就是兩個第二鰭片組30是接續第一鰭片組20向外側排列。Furthermore, the position of the first fin group 20 in this embodiment is directly above the predetermined heat source high temperature zone 801 of the heating element 800 , and the position of the two second fin groups 30 is corresponding to the non-high temperature zone 801 of the heating element 800 . Directly above the high temperature area of the heat source. In this embodiment, the heat source high-temperature area 801 is at the center of the heating element 800, and the non-heat source high-temperature area (which can also be said to be the two heat source low-temperature areas 802 with relatively low heating temperatures) is on both sides of the center of the heating element 800, so that In this embodiment, the position of the first fin group 20 corresponds to the center of the heating element 800 , and the positions of the two second fin groups 30 correspond to both sides of the center of the heating element 800 . Moreover, the first fin group 20 and the two second fin groups 30 are arranged in a continuous arrangement, that is, the two second fin groups 30 are arranged outward following the first fin group 20 .
更進一步說，本實施例的第一鰭片組20包含有複數個第一鰭片201，且每個第二鰭片組30包含有複數個第二鰭片301。並且，第一鰭片組20的複數個第一鰭片201的排列密度大於第二鰭片組30的複數個第二鰭片301的排列密度，且第一鰭片組20的複數個第一鰭片201的鰭片高度大於第二鰭片組30的複數個第二鰭片301的鰭片高度。Furthermore, the first fin group 20 of this embodiment includes a plurality of first fins 201 , and each second fin group 30 includes a plurality of second fins 301 . Moreover, the arrangement density of the plurality of first fins 201 of the first fin group 20 is greater than the arrangement density of the plurality of second fins 301 of the second fin group 30 , and the plurality of first fins 201 of the first fin group 20 are arranged at a higher density. The fin height of the fin 201 is greater than the fin height of the plurality of second fins 301 of the second fin group 30 .
因此，本實施例透過形成在浸沒式散熱基底10表面上的第一鰭片組20的位置是對應於發熱元件800預定的熱源高溫區801的正上方，且第一鰭片組20的複數個第一鰭片201的排列較密，並且第一鰭片組20的複數個第一鰭片201的鰭片高度較高，以在有限的表面積上增加更多的浸沒式散熱面積，從而更能將熱源高溫區801產生的高熱量帶走，以更加強浸沒式散熱效果。Therefore, in this embodiment, the position of the first fin group 20 formed on the surface of the immersed heat dissipation substrate 10 is directly above the predetermined heat source high temperature zone 801 of the heating element 800, and a plurality of the first fin group 20 The first fins 201 are arranged densely, and the fin heights of the plurality of first fins 201 of the first fin group 20 are higher to increase more immersed heat dissipation area in the limited surface area, thereby making it more efficient. The high heat generated in the high temperature zone 801 of the heat source is taken away to further enhance the immersion heat dissipation effect.
[第二實施例][Second Embodiment]
請參閱圖2所示，其為本發明的第二實施例，本實施例與第一實施例大致相同，其差異說明如下。Please refer to FIG. 2 , which is a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.
在本實施例中，浸沒式散熱基底10具有相對的一上表面11及一下表面12。浸沒式散熱基底10的下表面12用以與發熱元件800接觸。並且，浸沒式散熱基底10的上表面11形成有兩個第一鰭片組20以及三個第二鰭片組30。In this embodiment, the immersed heat dissipation substrate 10 has an upper surface 11 and a lower surface 12 opposite to each other. The lower surface 12 of the immersed heat dissipation substrate 10 is used to contact the heating element 800 . Furthermore, two first fin groups 20 and three second fin groups 30 are formed on the upper surface 11 of the immersed heat dissipation base 10 .
進一步說，本實施例的兩個第一鰭片組20的位置是對應於發熱元件800預定的兩個熱源高溫區801的正上方，且三個第二鰭片組30的位置是對應於發熱元件800的非熱源高溫區的正上方。在本實施例中，兩個熱源高溫區801位於發熱元件800的中央處的兩側，非熱源高溫區(也可以說發熱溫度相對較低的三個熱源低溫區802)在發熱元件800的中央處與兩最外側，使得本實施例的兩個第一鰭片組20的位置是對應於發熱元件800的中央處的兩側，而三個第二鰭片組30的位置是對應於發熱元件800的中央處與最外側。並且，兩個第一鰭片組20與三個第二鰭片組30是呈接續排列設置。Furthermore, the positions of the two first fin groups 20 in this embodiment are directly above the two predetermined heat source high-temperature zones 801 of the heating element 800, and the positions of the three second fin groups 30 are corresponding to the heat-generating areas. Directly above the high-temperature area of the component 800 that is not a heat source. In this embodiment, two heat source high-temperature areas 801 are located on both sides of the center of the heating element 800 , and non-heat source high-temperature areas (which can also be said to be three heat source low-temperature areas 802 with relatively low heating temperatures) are located in the center of the heating element 800 and the two outermost sides, so that the positions of the two first fin groups 20 in this embodiment correspond to the two sides of the center of the heating element 800, and the positions of the three second fin groups 30 correspond to the heating elements. The center and outermost part of 800. Moreover, the two first fin groups 20 and the three second fin groups 30 are arranged in a continuous arrangement.
更進一步說，本實施例的每個第一鰭片組20包含有複數個第一鰭片201，且每個第二鰭片組30包含有複數個第二鰭片301。並且，第一鰭片組20的複數個第一鰭片201的排列密度大於第二鰭片組30的複數個第二鰭片301的排列密度，且第一鰭片組20的複數個第一鰭片201的鰭片高度大於第二鰭片組30的複數個第二鰭片301的鰭片高度。Furthermore, in this embodiment, each first fin group 20 includes a plurality of first fins 201 , and each second fin group 30 includes a plurality of second fins 301 . Moreover, the arrangement density of the plurality of first fins 201 of the first fin group 20 is greater than the arrangement density of the plurality of second fins 301 of the second fin group 30 , and the plurality of first fins 201 of the first fin group 20 are arranged at a higher density. The fin height of the fin 201 is greater than the fin height of the plurality of second fins 301 of the second fin group 30 .
本實施例的每個第一鰭片組20的鰭片數量與每個第二鰭片組30的鰭片數量不具體限定，但每個第一鰭片組20的鰭片數量優選是大於每個第二鰭片組30的鰭片數量。The number of fins in each first fin group 20 and the number of fins in each second fin group 30 in this embodiment is not specifically limited, but the number of fins in each first fin group 20 is preferably greater than that in each second fin group 30 . The number of fins of the second fin group 30.
本實施例的每個第一鰭片組20的孔隙率與每個第二鰭片組30的孔隙率皆高於浸沒式散熱基底10的孔隙率。並且，本實施例的每個第一鰭片組20的孔隙率與每個第二鰭片組30的孔隙率是被訂在50%以上，95%以下，並且本實施例的每個第一鰭片組20的孔隙率亦可高於每個第二鰭片組30的孔隙率。The porosity of each first fin group 20 and the porosity of each second fin group 30 of this embodiment are higher than the porosity of the immersed heat dissipation substrate 10 . Furthermore, the porosity of each first fin group 20 and the porosity of each second fin group 30 in this embodiment are set to be between 50% and below 95%, and each first fin group in this embodiment is The porosity of the fin set 20 may also be higher than the porosity of each second fin set 30 .
需說明的是，本實施例是誇張或放大地示出孔洞結構，以便更好的理解本發明。It should be noted that this embodiment shows the hole structure in an exaggerated or enlarged manner for better understanding of the present invention.
本實施例的每個第一鰭片組20與每個第二鰭片組30可一體成型或焊接成型在浸沒式散熱基底10表面上，但每個第一鰭片組20與每個第二鰭片組30優選是一體成型在浸沒式散熱基底10表面上。In this embodiment, each first fin group 20 and each second fin group 30 can be integrally formed or welded on the surface of the immersed heat dissipation base 10 , but each first fin group 20 and each second fin group The fin set 30 is preferably integrally formed on the surface of the immersed heat dissipation base 10 .
因此，本實施例透過形成在浸沒式散熱基底10表面上的兩個第一鰭片組20的位置是對應於發熱元件800預定的兩個熱源高溫區801的正上方，且兩個第一鰭片組20的複數個第一鰭片201的排列較密，並且兩個第一鰭片組20的複數個第一鰭片201的鰭片高度較高，可在產品整體質量變動較小的前提下，創造更理想的浸沒式散熱基底10表面積利用率，以更提升浸沒式散熱效果。Therefore, in this embodiment, the positions of the two first fin groups 20 formed on the surface of the immersed heat dissipation substrate 10 are directly above the two predetermined heat source high temperature areas 801 of the heating element 800, and the two first fins The plurality of first fins 201 of the chip set 20 are arranged densely, and the fin heights of the plurality of first fins 201 of the two first fin sets 20 are relatively high, which can reduce the overall quality of the product. This creates a more ideal surface area utilization of the immersed heat dissipation substrate 10 to further enhance the immersed heat dissipation effect.
綜合以上所述，本發明提供的兩相浸沒式散熱基材，其可以通過「所述浸沒式散熱基底具有一上表面及一下表面，所述下表面用以與所述發熱元件接觸，所述上表面形成有所述至少一第一鰭片組及所述至少一第二鰭片組」、「所述至少一第一鰭片組的位置對應於所述發熱元件的至少一熱源高溫區的正上方，所述至少一第二鰭片組的位置對應於所述發熱元件的非所述至少一熱源高溫區的正上方」、「所述至少一第一鰭片組包含有複數個第一鰭片，所述至少一第二鰭片組包含有複數個第二鰭片」、「所述複數個第一鰭片的排列密度大於所述複數個第二鰭片的排列密度，並且所述複數個第一鰭片的鰭片高度大於所述複數個第二鰭片的鰭片高度」的整體技術方案，從而可以有效提升浸沒式散熱效果。Based on the above, the two-phase immersed heat dissipation substrate provided by the present invention can be used. "The immersed heat dissipation substrate has an upper surface and a lower surface, and the lower surface is used to contact the heating element. The at least one first fin group and the at least one second fin group are formed on the upper surface. "The position of the at least one first fin group corresponds to the high temperature zone of at least one heat source of the heating element." Directly above, the position of the at least one second fin group corresponds to directly above the high temperature area of the heating element that is not the at least one heat source." "The at least one first fin group includes a plurality of first fins, the at least one second fin group includes a plurality of second fins", "the arrangement density of the plurality of first fins is greater than the arrangement density of the plurality of second fins, and the The overall technical solution is that the fin heights of the plurality of first fins are greater than the fin heights of the plurality of second fins, thereby effectively improving the immersion heat dissipation effect.
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的申請專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的申請專利範圍內。The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.
700:兩相浸沒式散熱基材 10:浸沒式散熱基底 11:上表面 12:下表面 20:第一鰭片組 201:第一鰭片 30:第二鰭片組 301:第二鰭片 800:發熱元件 801:熱源高溫區 802:熱源低溫區 900:兩相冷卻液 700: Two-phase immersed heat dissipation base material 10: Immersed heat dissipation base 11: Upper surface 12: Lower surface 20:First fin group 201:First fin 30:Second fin group 301: Second fin 800: Heating element 801: Heat source high temperature area 802: Heat source low temperature zone 900: Two-phase coolant
圖1為本發明第一實施例的兩相浸沒式散熱基材的側視示意圖。Figure 1 is a schematic side view of a two-phase immersed heat dissipation substrate according to the first embodiment of the present invention.
圖2為本發明第二實施例的兩相浸沒式散熱基材的側視示意圖。Figure 2 is a schematic side view of a two-phase immersed heat dissipation substrate according to the second embodiment of the present invention.
700:兩相浸沒式散熱基材 700: Two-phase immersed heat dissipation base material
10:浸沒式散熱基底 10: Immersed heat dissipation base
11:上表面 11: Upper surface
12:下表面 12: Lower surface
20:第一鰭片組 20:First fin group
201:第一鰭片 201:First fin
30:第二鰭片組 30:Second fin group
301:第二鰭片 301: Second fin
800:發熱元件 800: Heating element
801:熱源高溫區 801: Heat source high temperature area
802:熱源低溫區 802: Heat source low temperature zone
900:兩相冷卻液 900: Two-phase coolant
Claims (5)
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| TW110135499A TWI813026B (en) | 2021-09-24 | 2021-09-24 | Two-phase immersion-cooled heat-dissipation substrate |
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| TW110135499A TWI813026B (en) | 2021-09-24 | 2021-09-24 | Two-phase immersion-cooled heat-dissipation substrate |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200838409A (en) * | 2007-03-09 | 2008-09-16 | Asustek Comp Inc | Radiator |
| CN103547115A (en) * | 2012-07-13 | 2014-01-29 | 台达电子工业股份有限公司 | Heat radiator, electronic device and heat exchange device |
| TWM613344U (en) * | 2021-03-24 | 2021-06-11 | 力致科技股份有限公司 | Water block with varied dense fins |
-
2021
- 2021-09-24 TW TW110135499A patent/TWI813026B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200838409A (en) * | 2007-03-09 | 2008-09-16 | Asustek Comp Inc | Radiator |
| CN103547115A (en) * | 2012-07-13 | 2014-01-29 | 台达电子工业股份有限公司 | Heat radiator, electronic device and heat exchange device |
| TWM613344U (en) * | 2021-03-24 | 2021-06-11 | 力致科技股份有限公司 | Water block with varied dense fins |
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