TWI808728B - metal resin composite - Google Patents

metal resin composite Download PDF

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TWI808728B
TWI808728B TW111114631A TW111114631A TWI808728B TW I808728 B TWI808728 B TW I808728B TW 111114631 A TW111114631 A TW 111114631A TW 111114631 A TW111114631 A TW 111114631A TW I808728 B TWI808728 B TW I808728B
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resin
resin member
metal plate
metal
rectangular
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TW111114631A
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Chinese (zh)
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TW202306753A (en
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青柳慎
若松基貴
小林良聡
佐佐木康則
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日商Jx金屬股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

本發明之金屬樹脂複合體1具備金屬板2及固定於上述金屬板2之樹脂構件3,藉由包含上述樹脂構件3之密封構件而劃分出內部空間,上述樹脂構件3具有於上述金屬板2上包圍內部空間之周圍而延伸的框狀,於框狀之該樹脂構件3的周緣方向上存在一處或兩處熔接線7,上述金屬板2於被上述樹脂構件3覆蓋之樹脂被覆面具有粗化凹凸面,該粗化凹凸面由在該樹脂被覆面之俯視下於一方向及其正交方向之各方向交替排列的矩形凹部5a及矩形凸部5b形成。The metal-resin composite 1 of the present invention includes a metal plate 2 and a resin member 3 fixed to the metal plate 2. The internal space is defined by a sealing member including the resin member 3. The resin member 3 has a frame shape extending around the inner space on the metal plate 2. There are one or two welding lines 7 in the peripheral direction of the frame-shaped resin member 3. The metal plate 2 has a roughened uneven surface on the resin coating surface covered by the resin member 3. Rectangular recesses 5 a and rectangular protrusions 5 b are formed alternately in one direction and each direction perpendicular to it as viewed from below.

Description

金屬樹脂複合體metal resin composite

本說明書揭示一種關於具備金屬板及固定於金屬板之樹脂構件的金屬樹脂複合體之技術。This specification discloses a technology related to a metal-resin composite body including a metal plate and a resin member fixed to the metal plate.

對於藉由插入成形等所製造之金屬樹脂複合體,要求提高金屬板與樹脂構件之密接性。For metal-resin composites produced by insert molding, etc., it is required to improve the adhesion between the metal plate and the resin member.

與此相關地,例如於專利文獻1記載有「一種金屬構件之製造方法,該金屬構件於表面具有凹凸,上述金屬構件之製造方法具有如下步驟:藉由具有第1規定曲率且具備格子狀之多個第1凸部的第1衝頭對平板狀之金屬進行第1衝壓;藉由上述第1衝頭於與上述第1衝壓交叉之方向進行第2衝壓;藉由具有第2規定曲率且具備格子狀之多個第2凸部的第2衝頭進行第3衝壓;及藉由上述第2衝頭於與上述第3衝壓交叉之方向進行第4衝壓;上述第3衝壓及上述第4衝壓係對未進行上述第1衝壓及上述第2衝壓之部位實施」及「一種散熱片,其具有第1凹部及第2凹部排列成格子狀之凹凸面,該第2凹部配置於與上述第1凹部不同之位置,且形狀與上述第1凹部不同」。 [先前技術文獻] [專利文獻] In connection with this, for example, Patent Document 1 describes "a method of manufacturing a metal member having irregularities on the surface. The manufacturing method of the metal member includes the following steps: first punching a flat plate-shaped metal with a first punch having a first predetermined curvature and having a plurality of first protrusions in a lattice shape; performing a second punch with the first punch in a direction intersecting with the first pressing; The third stamping is performed; and the fourth stamping is performed by the second punch in a direction intersecting with the third stamping; the third stamping and the fourth stamping are performed on the parts where the first stamping and the second stamping are not performed" and "a heat sink, which has a concave-convex surface with a first concave portion and a second concave portion arranged in a grid. [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開2017-208486號公報[Patent Document 1] Japanese Patent Laid-Open No. 2017-208486

然而,存在以下之金屬樹脂複合體,其係在固定於金屬板之樹脂構件進而設置其他樹脂構件等,藉此以包含該樹脂構件之密封構件而劃分出內部空間。例如,於將金屬板作為引線框架且用於半導體元件之金屬樹脂複合體中,半導體晶片被封閉於該內部空間。However, there is a metal-resin composite in which a resin member fixed to a metal plate is further provided with another resin member, and an internal space is defined by a sealing member including the resin member. For example, in a metal-resin composite used for a semiconductor element using a metal plate as a lead frame, a semiconductor chip is enclosed in the internal space.

於未充分確保藉由樹脂構件等形成之內部空間之密閉性的情形時,含有水分之空氣會自外部滲透至內部空間,而會發生正在發熱之半導體晶片因與水分接觸而導致之動作失調等故障。尤其是用於半導體元件之金屬樹脂複合體不僅因封閉於內部空間之半導體晶片的開啟與關閉,還會因外部環境之變化而暴露於反覆之溫度變化。基於進一步提高內部空間之密閉性的觀點,專利文獻1所記載之技術存在改善的餘地。If the airtightness of the internal space formed by the resin member etc. is not sufficiently ensured, moisture-containing air will permeate into the internal space from the outside, and malfunctions such as malfunction of the heat-generating semiconductor chip due to contact with moisture may occur. In particular, metal-resin composites used in semiconductor devices are exposed to repeated temperature changes not only due to the opening and closing of the semiconductor chip enclosed in the internal space, but also due to changes in the external environment. From the viewpoint of further improving the airtightness of the internal space, the technique described in Patent Document 1 has room for improvement.

本說明書中揭示一種金屬樹脂複合體,其可提高藉由樹脂構件形成之內部空間的密閉性。This specification discloses a metal-resin composite body that can improve the airtightness of an internal space formed by a resin member.

本說明書中揭示之一金屬樹脂複合體具備金屬板及固定於上述金屬板之樹脂構件,藉由包含上述樹脂構件之密封構件而劃分出內部空間,上述樹脂構件具有於上述金屬板上包圍內部空間之周圍而延伸的框狀,於框狀之該樹脂構件的周緣方向上存在一處或兩處熔接線,上述金屬板於被上述樹脂構件覆蓋之樹脂被覆面具有粗化凹凸面,該粗化凹凸面由在該樹脂被覆面之俯視下於一方向及其正交方向之各方向交替排列的矩形凹部及矩形凸部形成。A metal-resin composite disclosed in this specification includes a metal plate and a resin member fixed to the metal plate. The internal space is divided by a sealing member including the above-mentioned resin member. The above-mentioned resin member has a frame shape extending around the inner space on the above-mentioned metal plate. There are one or two welding lines in the peripheral direction of the frame-shaped resin member. Rectangular concave portions and rectangular convex portions arranged alternately in each direction are formed.

本說明書中揭示之另一金屬樹脂複合體具備金屬板及固定於上述金屬板之樹脂構件,藉由包含上述樹脂構件之密封構件而劃分出內部空間,上述樹脂構件具有於上述金屬板上包圍內部空間之周圍而延伸的框狀,於框狀之該樹脂構件的周緣方向上存在一處或兩處熔接線,上述金屬板於被上述樹脂構件覆蓋之樹脂被覆面含有粗化鍍覆層。Another metal-resin composite disclosed in this specification includes a metal plate and a resin member fixed to the metal plate. The internal space is defined by a sealing member including the resin member. The resin member has a frame shape extending around the inner space on the metal plate. There are one or two welding lines in the peripheral direction of the frame-shaped resin member. The metal plate includes a roughened plating layer on the resin coating surface covered by the resin member.

若根據上述金屬樹脂複合體,可提高藉由樹脂構件形成之內部空間的密閉性。According to the above-mentioned metal-resin composite, the airtightness of the internal space formed by the resin member can be improved.

以下,對上述金屬樹脂複合體之實施形態進行詳細說明。 圖1所例示之金屬樹脂複合體1,具備具有例如長方形等俯視外輪廓形狀之金屬板2及固定於金屬板2之樹脂構件3。 Hereinafter, embodiments of the metal-resin composite described above will be described in detail. A metal-resin composite 1 illustrated in FIG. 1 includes a metal plate 2 having a planar outer contour shape such as a rectangle, and a resin member 3 fixed to the metal plate 2 .

如圖1、2所示,圖示之金屬板2於中央形成有貫通於板厚方向之大致長方形的貫通孔4。金屬樹脂複合體1中,於金屬板2之貫通孔4的周圍,作為一例,設有俯視之內外輪廓形狀均為長方形等之框狀的樹脂構件3,於其內側,例如配置如圖3所示之半導體晶片51。於此情形時,金屬板2作為支撐半導體晶片51並與外部配線連接之引線框架發揮功能,金屬樹脂複合體1用於半導體元件。金屬板例如由銅、鋁或鐵或者其等之合金等構成。As shown in FIGS. 1 and 2 , the illustrated metal plate 2 has a substantially rectangular through-hole 4 penetrating in the thickness direction of the plate formed at the center. In the metal-resin composite 1, around the through-hole 4 of the metal plate 2, as an example, a frame-shaped resin member 3 having a rectangular inner and outer contour in plan view is provided, and a semiconductor chip 51 as shown in FIG. 3 is placed inside it, for example. In this case, the metal plate 2 functions as a lead frame that supports the semiconductor chip 51 and is connected to external wiring, and the metal-resin composite 1 is used for a semiconductor element. The metal plate is made of, for example, copper, aluminum or iron or alloys thereof.

框狀樹脂構件3之內側空間被該樹脂構件3及未圖示之其他樹脂構件等密封構件包圍,而劃分出配置半導體晶片51並將其封閉之內部空間。該金屬樹脂複合體1藉由包含樹脂構件3之密封構件而劃分出貫通孔4形成一部分之內部空間,樹脂構件3被設置為包圍其內部空間而延伸。The inner space of the frame-shaped resin member 3 is surrounded by sealing members such as the resin member 3 and other resin members not shown, and defines an internal space in which the semiconductor chip 51 is disposed and sealed. This metal-resin composite 1 defines an internal space in which a through hole 4 forms a part by a sealing member including a resin member 3 , and the resin member 3 is provided so as to extend around the internal space.

再者,設置於金屬板2之貫通孔4並不限於如圖示之長方形,可根據配置於其之半導體晶片51的形狀、構成等條件而設為正方形或其他多邊形或者圓形等各種形狀。又,金屬板2之俯視外輪廓形狀亦可變更為如圖示之長方形以外的形狀。框狀樹脂構件3之俯視的內外輪廓形狀亦可適宜地變更為長方形以外之形狀。Furthermore, the through hole 4 provided in the metal plate 2 is not limited to the rectangle shown in the figure, and can be formed in various shapes such as a square, other polygons, or a circle according to the shape and configuration of the semiconductor chip 51 disposed therein. In addition, the outer contour shape of the metal plate 2 in plan view can also be changed to a shape other than the rectangle shown in the figure. The shape of the inner and outer contours of the frame-shaped resin member 3 in plan view may be appropriately changed to a shape other than a rectangle.

此處,其後被劃分於金屬樹脂複合體1之內部空間,有時會被要求充分確保密閉性。例如,當半導體晶片51被封閉於內部空間之情形時,若內部空間未充分密封,則含有水分之空氣會自外部滲透至內部空間,而有引起半導體晶片51之動作失調之虞。Here, the internal space divided into the metal-resin composite body 1 afterward may be required to sufficiently secure airtightness. For example, when the semiconductor chip 51 is sealed in the internal space, if the internal space is not sufficiently sealed, the air containing moisture will permeate into the internal space from the outside, which may cause malfunction of the semiconductor chip 51 .

為了提高內部空間之密閉性,本實施形態中,於金屬板2之被樹脂構件3覆蓋的樹脂被覆面設置如以放大圖例示於圖4之凹凸面5。如圖5之立體圖所示,該凹凸面5由矩形凹部5a及矩形凸部5b形成,該矩形凹部5a及矩形凸部5b位於在樹脂被覆面之俯視下於一方向及與該一方向正交之方向即正交方向之各方向交替排列的位置。凹凸面5於俯視下呈現所謂方格花樣。In order to improve the airtightness of the internal space, in the present embodiment, the resin-coated surface of the metal plate 2 covered with the resin member 3 is provided with a concave-convex surface 5 as shown in FIG. 4 as an enlarged illustration. As shown in the perspective view of FIG. 5, the concave-convex surface 5 is formed by rectangular concave portions 5a and rectangular convex portions 5b, and the rectangular concave portions 5a and rectangular convex portions 5b are located at positions alternately arranged in one direction and a direction orthogonal to the one direction, that is, orthogonal directions, in a plan view of the resin coating surface. The concave-convex surface 5 presents a so-called checkered pattern in a plan view.

若針對以此方式在樹脂被覆面設置凹凸面5之金屬板2,藉由一體成形等在該樹脂被覆面上設置樹脂構件3,則空氣自外部朝內部空間之通道將會被凹凸面5阻斷。藉此,樹脂構件3與樹脂被覆面間之水分滲透受到有效抑制,結果可大幅度提高內部空間之密閉性。If the resin member 3 is provided on the metal plate 2 with the uneven surface 5 on the resin-coated surface by integral molding or the like, the passage of air from the outside to the inner space will be blocked by the uneven surface 5 . Thereby, the moisture penetration between the resin member 3 and the resin coating surface is effectively suppressed, and as a result, the airtightness of the internal space can be greatly improved.

關於凹凸面5之排列方向,於該例中,「一方向」係設為沿長方形金屬板2之長邊的方向(圖2、4中,左右方向),而「正交方向」則是設為沿金屬板2之短邊的方向(圖2、4中,上下方向)。但是,亦可藉由將「一方向」及「正交方向」設為分別相對於長邊或短邊傾斜之方向,將矩形凹部5a及矩形凸部5b相對於長邊或短邊以斜向作排列配置,而形成凹凸面5。Regarding the arrangement direction of the concave-convex surface 5, in this example, the "one direction" is defined as the direction along the long side of the rectangular metal plate 2 (the left-right direction in FIGS. 2 and 4), and the "orthogonal direction" is defined as the direction along the short side of the metal plate 2 (the up-down direction in FIGS. However, the concave-convex surface 5 can also be formed by setting the "one direction" and the "orthogonal direction" as directions inclined relative to the long side or the short side, respectively, and arranging the rectangular concave portion 5a and the rectangular convex portion 5b obliquely with respect to the long side or the short side.

形成凹凸面5之矩形凹部5a及矩形凸部5b的俯視形狀,除了可設為如圖示之長方形以外,亦可設為正方形。於俯視下,亦可使矩形凹部5a與矩形凸部5b之尺寸或形狀互不相同,並且亦可使多個矩形凹部5a彼此之形狀或尺寸及/或多個矩形凸部5b之形狀或尺寸互不相同。如圖5所示,藉由俯視之形狀及尺寸均大致相同之矩形凹部5a及矩形凸部5b而形成有凹凸面5。The planar shape of the rectangular concave portion 5a and the rectangular convex portion 5b forming the concave-convex surface 5 may be not only a rectangle as shown in the figure, but also a square. In plan view, the size or shape of the rectangular concave portion 5a and the rectangular convex portion 5b can also be different, and the shape or size of the plurality of rectangular concave portions 5a and/or the shape or size of the plurality of rectangular convex portions 5b can also be different. As shown in FIG. 5 , the concave-convex surface 5 is formed by a rectangular concave portion 5 a and a rectangular convex portion 5 b having substantially the same shape and size in plan view.

凹凸面5之矩形凹部5a及矩形凸部5b,當對一方向及正交方向分別排列設置時,若在與其排列方向正交之方向上即使是稍微錯位,則亦可視為於各方向交替排列。即,若相互鄰接之矩形凹部5a彼此及相互鄰接之矩形凸部5b彼此於一方向及正交方向之各方向的形成位置不一致,則認為該等矩形凹部5a及矩形凸部5b係於各方向交替排列。例如,於圖6(a)之凹凸面5中,使矩形凹部5a及矩形凸部5b分別於一方向(圖6之左右方向)及正交方向(圖6之上下方向)上,在與其排列方向正交之方向不相互重疊地交替排列設置。另一方面,於圖6(b)之凹凸面15中,矩形凹部15a及矩形凸部15b則是分別在排列於一方向之方向上觀察,在與其正交之方向部分重疊,作交替排列設置。但是,基於提高內部空間之密閉性的觀點,較佳為如圖6(a)所示,使矩形凹部5a及矩形凸部5b分別於一方向(圖6之左右方向)及正交方向(圖6之上下方向)上,在與其排列方向正交之方向不相互重疊地交替排列設置。其原因在於,藉此,於空氣自外部朝內部空間之侵入路徑中,不存在相對較平坦之矩形凸部5b之連接。When the rectangular concave portions 5a and rectangular convex portions 5b of the concave-convex surface 5 are respectively arranged in one direction and in an orthogonal direction, they can be considered to be alternately arranged in each direction if they are slightly misaligned in the direction orthogonal to the arrangement direction. That is, if the formation positions of the mutually adjacent rectangular concave portions 5a and the mutually adjacent rectangular convex portions 5b in one direction and each direction perpendicular to each other are inconsistent, it is considered that the rectangular concave portions 5a and the rectangular convex portions 5b are alternately arranged in each direction. For example, in the concave-convex surface 5 of FIG. 6(a), the rectangular concave portions 5a and the rectangular convex portions 5b are arranged alternately in one direction (the left-right direction in FIG. 6 ) and the orthogonal direction (the up-down direction in FIG. 6 ), and in the direction perpendicular to the arrangement direction without overlapping each other. On the other hand, in the concave-convex surface 15 of FIG. 6( b ), the rectangular concave portions 15 a and the rectangular convex portions 15 b are respectively viewed in a direction arranged in one direction, and partially overlap in a direction orthogonal to it, and are alternately arranged. However, from the viewpoint of improving the airtightness of the internal space, it is preferable to arrange the rectangular concave portions 5a and the rectangular convex portions 5b in one direction (the left-right direction in FIG. 6 ) and the orthogonal direction (the up-down direction in FIG. 6 ) respectively, as shown in FIG. The reason for this is that, thereby, there is no connection of the relatively flat rectangular protrusions 5b in the intrusion path of air from the outside to the inner space.

於將矩形凹部5a及矩形凸部5b之俯視形狀設為長方形之情形時,較佳為矩形凹部5a及矩形凸部5b各者之長邊的長度La設為0.17 mm~0.25 mm,短邊的長度Lb設為0.04 mm~0.10 mm。若長邊或短邊之長度過長,則凹凸數量會減少,而有內部空間之密閉性降低之虞,若長邊或短邊之長度過短,則擔憂衝壓時衝頭前端之強度不足引起之破損風險增加,以及進入矩形凹部5a之樹脂減少,樹脂強度下降,導致密閉性降低。 又,較佳為矩形凹部5a之長邊方向的間距Pa設為0.38 mm~0.46 mm,短邊方向的間距Pb設為0.11 mm~0.17 mm。若間距Pa、Pb過大,則可能被相鄰之矩形凹部5a夾住之矩形凸部5b之壁的凸起會不足,殘留大量平面,導致密閉性降低。另一方面,若間距Pa、Pb過小,則有時會將相鄰之矩形凹部5a擠壞而使之變形,該處之樹脂強度降低,導致密閉性降低。間距Pa、Pb意指於一方向或正交方向隔著矩形凸部5b而相鄰之矩形凹部5a於一方向或正交方向之中心點間的距離。 When the plan view shape of the rectangular concave portion 5a and the rectangular convex portion 5b is a rectangle, it is preferable that the length La of the long side of each of the rectangular concave portion 5a and the rectangular convex portion 5b is set to 0.17 mm to 0.25 mm, and the length Lb of the short side is set to 0.04 mm to 0.10 mm. If the length of the long side or the short side is too long, the number of concavities and convexities will decrease, and there is a possibility that the airtightness of the internal space will be reduced. If the length of the long side or the short side is too short, there is a concern that the risk of damage due to insufficient strength of the front end of the punch during punching will increase, and the resin entering the rectangular concave portion 5a will decrease, and the strength of the resin will decrease, resulting in a decrease in airtightness. In addition, it is preferable that the pitch Pa in the longitudinal direction of the rectangular concave portion 5a is set to 0.38 mm to 0.46 mm, and the pitch Pb in the short side direction is set to 0.11 mm to 0.17 mm. If the distances Pa and Pb are too large, the protrusions of the walls of the rectangular protrusions 5b that may be sandwiched by the adjacent rectangular recesses 5a will be insufficient, leaving a large number of flat surfaces, resulting in reduced airtightness. On the other hand, if the pitches Pa and Pb are too small, the adjacent rectangular recesses 5a may be crushed and deformed, and the strength of the resin there may decrease, resulting in a decrease in airtightness. The pitches Pa and Pb refer to the distance between the center points of the rectangular concave portions 5 a adjacent to each other via the rectangular convex portion 5 b in the one direction or the orthogonal direction.

要於樹脂被覆面形成由矩形凹部5a及矩形凸部5b所形成之凹凸面5,例如可藉由對樹脂被覆面實施衝壓加工來進行。於該衝壓加工,雖省略圖示,但可使用在前端面排列設置有多個與矩形凹部5a對應之形狀的突起部之衝頭。Forming the concave-convex surface 5 formed by the rectangular concave portion 5 a and the rectangular convex portion 5 b on the resin coating surface can be performed, for example, by performing press work on the resin coating surface. In this press working, although illustration is omitted, a punch in which a plurality of protrusions having a shape corresponding to the rectangular recess 5 a are arranged in a line at the front end surface can be used.

於形成相對較小之間距Pa及/或Pb之凹凸面5的情形時,較佳進行包括第一衝壓步驟及第二衝壓步驟之多個階段的衝壓步驟。具體而言,首先,如圖7(a)所示,將於前端面具有多個突起部之衝頭壓抵於樹脂被覆面,進行第一衝壓步驟。藉此,於樹脂被覆面上形成第一凹部群R1。其次,如圖7(b)所示,將於前端面具有多個突起部之衝頭壓抵於在樹脂被覆面上沿一方向及正交方向等規定方向錯開之位置,進行第二衝壓步驟。於第二衝壓步驟所使用之衝頭亦可與第一衝壓步驟之衝頭相同,但亦可為不同形狀者。在第二衝壓步驟,於樹脂被覆面上,第二凹部群R2與第一凹部群R1至少部分重疊,於第一凹部群R1之矩形凹部5a彼此間形成第二凹部群R2之矩形凹部5a。矩形凸部5b設置於相鄰之矩形凹部5a之間。其結果,可於樹脂被覆面上密集地形成矩形凹部5a及矩形凸部5b。In the case of forming the concave-convex surface 5 with a relatively small pitch Pa and/or Pb, it is preferable to perform a multiple-stage punching step including a first punching step and a second punching step. Specifically, first, as shown in FIG. 7( a ), a punch having a plurality of protrusions on the front end surface is pressed against the resin-coated surface to perform a first pressing step. Thereby, the first recessed portion group R1 is formed on the resin coating surface. Next, as shown in FIG. 7( b ), the second punching step is performed by pressing a punch having a plurality of protrusions on the front end to positions shifted in predetermined directions such as one direction and a perpendicular direction on the resin coating surface. The punches used in the second punching step can also be the same as those used in the first punching step, but can also be of different shapes. In the second pressing step, the second recess group R2 and the first recess group R1 are at least partially overlapped on the resin-coated surface, and the rectangular recesses 5a of the second recess group R2 are formed between the rectangular recesses 5a of the first recess group R1. The rectangular protrusions 5b are disposed between adjacent rectangular recesses 5a. As a result, the rectangular recesses 5a and the rectangular protrusions 5b can be densely formed on the resin coating surface.

於設置凹凸面5之情形時,矩形凸部5b最突出於樹脂構件3側(金屬板2之板厚方向的外側)之部分的頂面5c亦可設為平坦面,但較佳如圖8沿板厚方向之剖視圖所示,設為於樹脂構件3側呈凸狀之曲面。藉此,提高樹脂之俯視方向的剪切強度,緩和因暴露於反覆之溫度變化而引起之密閉性惡化。又,藉由在空氣自外部朝內部空間之侵入路徑中不存在平坦之矩形凸部5b之連接,而可提高內部空間之密閉性。當如上述般,使用在前端面設有多個突起部之衝頭而形成凹凸面5的情形時,此種於樹脂構件3側具有凸狀曲面之矩形凸部5b有時可藉由下述方式而得,亦即伴隨著相當於矩形凹部5a之凹處的形成,該矩形凹部5a間之壁凸起於板厚方向之外側(圖8之上方側)。 此處,矩形凹部5a之深度(凹部深度)較佳為0.20 mm以下,更佳為0.10 mm以下。若凹部深度過大,則朝板厚方向之延伸增大,而有變形到於後續步驟(成形)產生影響之程度之虞。凹部深度係指於板厚方向上,自該矩形凹部5a之底面的最深位置至與該矩形凹部5a相鄰之矩形凸部5b之頂面5c的最高位置之距離。於設置矩形凹部5a之情形時,凹部深度較佳為0.02 mm~0.20 mm,更佳為0.04 mm~0.10 mm。 When the concave-convex surface 5 is provided, the top surface 5c of the portion of the rectangular convex portion 5b that protrudes most on the side of the resin member 3 (the outer side in the thickness direction of the metal plate 2) may also be a flat surface, but it is preferably a curved surface that is convex on the side of the resin member 3 as shown in the cross-sectional view in the thickness direction of FIG. 8 . Thereby, the shear strength of the resin in the plan view direction is improved, and the deterioration of airtightness caused by exposure to repeated temperature changes is alleviated. Also, since there is no connection of the flat rectangular convex portion 5b in the air intrusion path from the outside to the interior space, the airtightness of the interior space can be improved. When the concave-convex surface 5 is formed using a punch provided with a plurality of protrusions on the front end surface as described above, such a rectangular convex portion 5b having a convex curved surface on the resin member 3 side may be obtained by forming a concave portion corresponding to the rectangular concave portion 5a whose walls between the rectangular concave portions 5a are convex on the outer side in the thickness direction (upper side in FIG. 8 ). Here, the depth of the rectangular recess 5 a (recess depth) is preferably 0.20 mm or less, more preferably 0.10 mm or less. If the depth of the concave portion is too large, the extension in the direction of the plate thickness will increase, and there is a possibility of deformation to an extent that affects the subsequent step (forming). The depth of the recess refers to the distance from the deepest position on the bottom surface of the rectangular recess 5a to the highest position on the top surface 5c of the rectangular protrusion 5b adjacent to the rectangular recess 5a in the thickness direction. When the rectangular recess 5a is provided, the depth of the recess is preferably from 0.02 mm to 0.20 mm, more preferably from 0.04 mm to 0.10 mm.

為了提高內部空間之密閉性,設置於樹脂被覆面之凹凸面5較理想為藉由蝕刻或鍍覆等來實施使表面粗糙度Ra變粗之粗化處理。藉此,凹凸面5成為粗化凹凸面,於該粗化凹凸面之樹脂的定錨效應與形成於該處之矩形凹部5a及矩形凸部5b相輔相成,而大幅提升內部空間之密閉性。In order to improve the airtightness of the internal space, it is desirable that the uneven surface 5 provided on the resin-coated surface is roughened by etching or plating to increase the surface roughness Ra. Thereby, the concave-convex surface 5 becomes a roughened concave-convex surface, and the anchoring effect of the resin on the roughened concave-convex surface complements the rectangular concave portion 5a and rectangular convex portion 5b formed there, thereby greatly improving the airtightness of the internal space.

具體而言,粗化凹凸面之表面粗糙度Ra宜為0.2 μm以上。此表面粗糙度Ra意指依據JIS B0601:2001之算術平均粗糙度。粗化凹凸面之表面粗糙度Ra,係設為於構成該粗化凹凸面之矩形凸部5b之頂面5c的位置所測得之算術平均粗糙度。再者,粗化凹凸面之粗化面可藉由立體顯微鏡或SEM、雷射顯微鏡進行確認。若粗化條件相同,則粗化凹凸面之表面粗糙度與不具有凹凸面5之粗化面的表面粗糙度同等。當未實施粗化處理之情形時由於會成為光澤面,若實施粗化處理則會成為非光澤面,故有時即便是目視亦可加以判別。Specifically, the surface roughness Ra of the roughened concave-convex surface is preferably 0.2 μm or more. This surface roughness Ra means the arithmetic mean roughness based on JIS B0601:2001. The surface roughness Ra of the roughened concave-convex surface is the arithmetic mean roughness measured at the position of the top surface 5c of the rectangular convex portion 5b constituting the roughened concave-convex surface. Furthermore, the roughened surface of the roughened concave-convex surface can be confirmed with a stereo microscope, SEM, or laser microscope. If the roughening conditions are the same, the surface roughness of the roughened concave-convex surface is the same as that of the roughened surface without the concave-convex surface 5 . When the roughening treatment is not performed, it will become a glossy surface, and if the roughening treatment is performed, it will become a matte surface, so it may be distinguished even visually.

於樹脂被覆面,可代替設置上述凹凸面5,或者在設置上述凹凸面5之外,如圖9所示之實施形態般設置粗化鍍覆層6。藉由在樹脂被覆面設置粗化鍍覆層6,使得樹脂構件3透過粗化鍍覆層6而充分密接於樹脂被覆面,因此於此情形時,未必需要於樹脂被覆面設置凹凸面5。但是,於在樹脂被覆面設置凹凸面5,且於其上進而設置粗化鍍覆層6來形成粗化凹凸面時,可更進一步提高內部空間之密閉性。有無粗化鍍覆層6可藉由光學顯微鏡進行確認。On the resin coating surface, instead of providing the above-mentioned concave-convex surface 5, or in addition to providing the above-mentioned concave-convex surface 5, a rough plating layer 6 may be provided as in the embodiment shown in Fig. 9 . Since the roughened plating layer 6 is provided on the resin-coated surface, the resin member 3 is sufficiently adhered to the resin-coated surface through the roughened plating layer 6 . Therefore, in this case, it is not necessarily necessary to provide the uneven surface 5 on the resin-coated surface. However, when the roughened surface 5 is provided on the resin-coated surface, and the roughened plating layer 6 is further provided thereon to form the roughened uneven surface, the airtightness of the internal space can be further improved. The presence or absence of the roughened plating layer 6 can be confirmed with an optical microscope.

設置於樹脂被覆面之粗化鍍覆層6的鍍覆厚度,較佳為2.0 μm~6.0 μm,更佳為3.0 μm~5.0 μm。於粗化鍍覆層6之鍍覆厚度過薄的情形時,擔憂樹脂構件3對樹脂被覆面之密接不夠。另一方面,於粗化鍍覆層6之鍍覆厚度過厚的情形時,則有成本增加之虞。The plating thickness of the roughened plating layer 6 provided on the resin-coated surface is preferably 2.0 μm to 6.0 μm, more preferably 3.0 μm to 5.0 μm. When the plating thickness of the roughened plating layer 6 is too thin, there is a concern that the adhesion of the resin member 3 to the resin-coated surface is insufficient. On the other hand, when the plating thickness of the roughening plating layer 6 is too thick, there exists a possibility of cost increase.

粗化鍍覆層6雖亦可為銅或銀等,但較佳為鍍鎳,可含有鎳。當為含有鎳之粗化鍍覆層6的情形時,具有容易控制粗化形狀、粗化程度之優點。又,有時於粗化鍍覆層6含有選自由鎳、銅及銀所組成之群中的至少一種。The rough plating layer 6 may be copper, silver, etc., but is preferably nickel-plated and may contain nickel. In the case of the roughened plating layer 6 containing nickel, there is an advantage that it is easy to control the shape and degree of roughening. In addition, at least one selected from the group consisting of nickel, copper, and silver may be contained in the rough plating layer 6 .

要於金屬板2之樹脂被覆面形成粗化鍍覆層6,例如,雖省略圖示,但可藉由如下方式進行,亦即於用遮罩覆蓋了金屬板2不形成粗化鍍覆層6之表面的狀態下,於含有粗化鍍覆層6之鍍覆金屬的鍍覆液中,對金屬板2實施電鍍。於其他實施形態中,亦可不使用遮罩而於金屬板2整面形成粗化鍍覆層6。Forming the roughened plating layer 6 on the resin-coated surface of the metal plate 2 can be performed, for example, although not shown, by performing electroplating on the metal plate 2 in a plating solution containing the plating metal of the roughened plating layer 6 in a state where the surface of the metal plate 2 on which the roughened plating layer 6 is not formed is covered with a mask. In other embodiments, the roughened plating layer 6 may be formed on the entire surface of the metal plate 2 without using a mask.

再者,亦可於樹脂被覆面之一部分具有不存在凹凸面5及/或粗化鍍覆層6之部位,但基於充分確保樹脂構件3與金屬板2之密接性的觀點,凹凸面5及/或粗化鍍覆層6較佳設置於整個樹脂被覆面。Furthermore, part of the resin-coated surface may have a portion without the uneven surface 5 and/or the roughened plating layer 6, but from the viewpoint of sufficiently ensuring the adhesion between the resin member 3 and the metal plate 2, the uneven surface 5 and/or the roughened plated layer 6 are preferably provided on the entire resin-coated surface.

為了將框狀之樹脂構件3設置於如上述之設有粗化鍍覆層6或粗化凹凸面的金屬板2,可進行插入成形。In order to install the frame-shaped resin member 3 on the metal plate 2 provided with the roughened plating layer 6 or the roughened concave-convex surface as described above, insert molding may be performed.

於插入成形,係將金屬板2配置於具有與該樹脂構件3之形狀對應之模腔的射出成形模具內,將樹脂材料自射出成形模具之澆口射出至該模腔。自澆口流入至模腔之樹脂材料流動於具有與框狀樹脂構件3對應之形狀的模腔,於其中途合流而填充至模腔。其後,於模腔中將樹脂材料冷卻使之固化。藉此,可獲得於金屬板2固定有樹脂構件3之金屬樹脂複合體1。In the insert molding, the metal plate 2 is placed in an injection mold having a cavity corresponding to the shape of the resin member 3, and the resin material is injected from the gate of the injection mold into the cavity. The resin material flowing from the gate into the cavity flows into the cavity having a shape corresponding to the frame-shaped resin member 3 , joins in the middle, and fills the cavity. Thereafter, the resin material is cooled to solidify in the mold cavity. Thereby, the metal-resin composite 1 which fixed the resin member 3 to the metal plate 2 can be obtained.

此處,於成形後之樹脂構件3,在射出時流動於模腔之樹脂材料合流的位置形成熔接線7。於圖示之實施形態中,作為一例,由於在與俯視之內外輪廓形狀均為長方形之框狀樹脂構件3的兩條長邊之中央位置對應的模腔各位置設有兩處澆口,故樹脂材料自各澆口於模腔分叉流動並合流,結果於樹脂構件3之兩個短邊的中央位置形成有兩處熔接線7。或者,於澆口為一處之情形時,可於框狀樹脂構件3之周緣方向上在距其澆口最遠之位置形成一處熔接線7。熔接線7有時會形成為於寬度方向上橫跨框狀樹脂構件3之直線或曲線等線狀,可藉由目視或光學顯微鏡對樹脂構件3之外表面進行觀察來確認。Here, the weld line 7 is formed at the position where the resin material flowing in the cavity joins the molded resin member 3 during injection. In the illustrated embodiment, as an example, since two gates are provided at each position of the mold cavity corresponding to the central position of the two long sides of the frame-shaped resin member 3 whose inner and outer contours are rectangular in plan view, the resin material flows from each gate to the mold cavity and merges. As a result, two welding lines 7 are formed at the central position of the two short sides of the resin member 3. Alternatively, when there is one gate, one welding line 7 may be formed at a position farthest from the gate in the peripheral direction of the frame-shaped resin member 3 . The weld line 7 may be formed in a linear shape such as a straight line or a curve across the frame-shaped resin member 3 in the width direction, and can be confirmed by observing the outer surface of the resin member 3 visually or with an optical microscope.

上述熔接線7較佳於框狀樹脂構件3之周緣方向上為一處或兩處。其原因在於,藉由除了於金屬板2設置上述粗化凹凸面或粗化鍍覆層6以外,還使熔接線7為兩處以下,而大幅度提高內部空間之密閉性。換言之,若存在三處以上之熔接線7,則內部空間之密閉性降低,增加含有水分之空氣容易自熔接線7滲透至內部空間的可能性。The above-mentioned welding line 7 is preferably located at one or two locations in the peripheral direction of the frame-shaped resin member 3 . The reason for this is that, in addition to providing the above-mentioned roughened uneven surface or roughened plating layer 6 on the metal plate 2, the weld line 7 is made to be two or less, so that the airtightness of the internal space is greatly improved. In other words, if there are more than three welding lines 7 , the airtightness of the internal space will decrease, and the possibility that air containing moisture will easily penetrate from the welding lines 7 into the internal space increases.

再者,作為樹脂構件3之材料,並無特別限定,例如可使用液晶聚合物、丙烯腈-丁二烯-苯乙烯共聚合成樹脂(ABS)、聚醯胺(PA)、聚丙烯(PP)、聚酯系熱塑性彈性體(TPC)、聚縮醛(POM)、聚對苯二甲酸丁二酯(PBT)、聚苯硫醚(PPS)等。Furthermore, the material of the resin member 3 is not particularly limited, for example, liquid crystal polymer, acrylonitrile-butadiene-styrene copolymerized resin (ABS), polyamide (PA), polypropylene (PP), polyester thermoplastic elastomer (TPC), polyacetal (POM), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), etc. can be used.

然而,圖示之金屬板2設有向貫通孔4之外側延伸的多處切口部8a~8c。更詳細而言,於該例中具有共計六處切口部8a~8c,即長方形切口部8a及具有較其更大之面積的多邊形切口部8b,其等在長方形金屬板2之長邊方向(圖1中,左右方向)之各個外側連接於貫通孔4,通過樹脂構件3之配置部位而向外側延伸地擴寬;以及切口部8c,其於金屬板2之長邊方向的中央位置在寬度方向(圖1中,上下方向)之各個外側連接於貫通孔4,向外側延伸地擴寬為略微細長之長方形。各切口部8a~8c貫通於金屬板2之板厚方向而形成。However, the illustrated metal plate 2 is provided with a plurality of notches 8 a to 8 c extending outside the through hole 4 . More specifically, in this example, there are a total of six cutouts 8a to 8c, i.e., a rectangular cutout 8a and a polygonal cutout 8b having a larger area, which are connected to the through-hole 4 on each outer side in the longitudinal direction of the rectangular metal plate 2 (in FIG. ) are connected to the through-hole 4 on each outer side, and widened outwardly to form a slightly elongated rectangle. The notches 8 a to 8 c are formed to penetrate through the metal plate 2 in the plate thickness direction.

又,樹脂構件3不僅於金屬板2之正面Sf側,還如圖10所示般於金屬板2之背面Sb側,即兩面側,通過為各切口部8a~8c與貫通孔4之連結部位的空處以框狀被設置於貫通孔4之周圍。藉此,於框狀樹脂構件3之周緣方向的一部分,金屬板2被該樹脂構件3自兩側夾住,但於具有上述空處之剩餘部分,在該樹脂構件3之內側不存在金屬板2。In addition, the resin member 3 is provided not only on the front Sf side of the metal plate 2 but also on the back Sb side of the metal plate 2 as shown in FIG. Thereby, the metal plate 2 is sandwiched by the resin member 3 from both sides in a part of the peripheral direction of the frame-shaped resin member 3 , but the metal plate 2 does not exist inside the resin member 3 in the remaining part having the above-mentioned void.

如此,當框狀樹脂構件3於周緣方向之一部分自板厚方向之兩側夾住金屬板2而設置的情形時,較佳為上文敍述之熔接線7形成於框狀樹脂構件3之周緣方向上且該樹脂構件3之內側不存在金屬板2的部位。藉由熔接線7存在於樹脂構件3之內側不存在金屬板2且樹脂構件3未受金屬板2支撐的部位,而可進一步提高內部空間之密閉性。若熔接線7存在於樹脂構件3之內側存在金屬板2的部位,則有含有水分之空氣自樹脂構件3形成有該熔接線7之部位與金屬板2的界面滲透至內部空間之虞。In this way, when a part of the frame-shaped resin member 3 in the peripheral direction sandwiches the metal plate 2 from both sides in the plate thickness direction, it is preferable that the weld line 7 described above is formed in the peripheral direction of the frame-shaped resin member 3 and the metal plate 2 does not exist inside the resin member 3. Since the welding line 7 is present inside the resin member 3 where the metal plate 2 is not present and the resin member 3 is not supported by the metal plate 2, the airtightness of the internal space can be further improved. If the weld line 7 exists inside the resin member 3 where the metal plate 2 exists, air containing moisture may permeate into the inner space from the interface between the resin member 3 where the weld line 7 is formed and the metal plate 2 .

再者,金屬板2於正面Sf側具有較樹脂構件3更突出於貫通孔4側之內緣部2a,且於該內緣部2a藉由接合線52而與半導體晶片51連接。Furthermore, the metal plate 2 has an inner edge portion 2 a protruding from the through hole 4 side than the resin member 3 on the front surface Sf side, and is connected to the semiconductor chip 51 by a bonding wire 52 at the inner edge portion 2 a.

圖11揭示其他實施形態之金屬樹脂複合體1。圖11之金屬樹脂複合體1中,於在框狀樹脂構件3之周緣方向上形成有熔接線7的部位設有突出於該樹脂構件3之外側的突出部9,除此以外,具有與圖1所示者大致相同之構成。該突出部9自樹脂構件3於與金屬板2之表面大致平行的方向突出。雖省略了圖示,但突出部9除了亦可以突出於樹脂構件3之內側(貫通孔側)的方式設置以外,亦可在樹脂構件3上於板厚方向突出作設置。FIG. 11 shows a metal-resin composite 1 of another embodiment. In the metal-resin composite 1 of FIG. 11 , a protruding portion 9 protruding from the outer side of the resin member 3 is provided at a position where a weld line 7 is formed in the peripheral direction of the frame-shaped resin member 3, and has substantially the same structure as that shown in FIG. 1 except that. The protruding portion 9 protrudes from the resin member 3 in a direction substantially parallel to the surface of the metal plate 2 . Although not shown in the drawing, the protruding portion 9 may protrude from the resin member 3 in the plate thickness direction instead of protruding inside the resin member 3 (the through-hole side).

若使用具有於樹脂構件3設有突出部9之模腔的射出成形模具來成形樹脂構件3,則射出至模腔之樹脂材料當於形成突出部9之部位合流時流向會朝側方變更,熔接之層受到一些破壞。其結果,樹脂構件3之強度提高,內部空間之密閉性亦隨之提高。If the resin member 3 is molded using an injection molding die having a cavity provided with the protrusion 9 on the resin member 3, the flow direction of the resin material injected into the cavity will change sideways when the resin material injected into the cavity merges at the position where the protrusion 9 is formed, and the welded layer is slightly damaged. As a result, the strength of the resin member 3 is improved, and the airtightness of the internal space is also improved accordingly.

突出部9有時會於其後被切斷而去除。於此情形時,於樹脂構件3形成有熔接線7之部位,形成並存在有切斷痕跡。切斷痕跡可藉由目視來確認。若於樹脂構件3形成有熔接線7之部位存在切斷痕跡,則可推斷之前於該處形成有突出部9,藉此進行了起因於熔接線7之脆弱部分的補強。 [實施例] The protruding part 9 may be cut and removed thereafter. In this case, cut marks are formed and exist in the portion of the resin member 3 where the weld line 7 is formed. Cutting marks can be confirmed visually. If there is a cutting mark at the portion of the resin member 3 where the welded line 7 is formed, it can be inferred that the protruding portion 9 was formed there before, thereby reinforcing the weak portion caused by the welded line 7 . [Example]

其次,嘗試製作了如上述之金屬樹脂複合體,並確認了其效果,因此進行如下說明。但是,此處之說明僅是以例示為目的,而非意欲限定於此。Next, the above-mentioned metal-resin composite was tried to be produced, and its effect was confirmed, so it will be explained as follows. However, the description here is for the purpose of illustration only, and is not intended to be limited thereto.

(凹凸面) 製作如圖1所示之金屬樹脂複合體。 實施例1~4以及比較例3及4中,如使用圖6所說明般,使用各自於前端面設有多個突起部之各衝頭對金屬板之樹脂被覆面進行第一衝壓步驟及第二衝壓步驟,形成於一方向及其正交方向之各方向交替排列之長方形的矩形凹部及矩形凸部,而設置凹凸面(矩形凹凸面)。各矩形凹部之長邊的長度La設為0.21 mm,短邊的長度Lb設為0.07 mm,長邊方向之間距Pa設為0.42 mm,短邊方向之間距Pb設為0.14 mm。矩形凹部與矩形凸部之俯視尺寸設為實質上相同。矩形凹部之深度(凹部深度)如表1所示。 (uneven surface) Fabricate the metal-resin composite as shown in Figure 1. In Examples 1 to 4 and Comparative Examples 3 and 4, as explained using FIG. 6 , the first punching step and the second punching step were performed on the resin-coated surface of the metal plate using each punch provided with a plurality of protrusions on the front end surface, forming rectangular rectangular concave portions and rectangular convex portions alternately arranged in one direction and each direction perpendicular to the direction thereof, and providing a concave-convex surface (rectangular concave-convex surface). The length La of the long side of each rectangular recess was set to 0.21 mm, the length Lb of the short side was set to 0.07 mm, the distance Pa between the long sides was set to 0.42 mm, and the distance Pb between the short sides was set to 0.14 mm. The plan view dimensions of the rectangular concave portion and the rectangular convex portion are set to be substantially the same. The depth of the rectangular recess (deep depth) is shown in Table 1.

比較例2中,於金屬板之樹脂被覆面設置有凹凸面(線狀凹凸面),該凹凸面(線狀凹凸面)係於與直線方向正交之方向上隔開間隔形成有多個延伸於一方向之線狀凹部。線狀凹部之寬度設為0.04 mm,線狀凹部之間距設為0.1 mm。於相鄰之線狀凹部之間形成有線狀凸部。In Comparative Example 2, the resin-coated surface of the metal plate is provided with a concave-convex surface (linear concave-convex surface) in which a plurality of linear concave portions extending in one direction are formed at intervals in a direction perpendicular to the linear direction. The width of the linear recesses is set to 0.04 mm, and the distance between the linear recesses is set to 0.1 mm. A linear convex portion is formed between adjacent linear concave portions.

實施例5及6以及比較例1及5中,未於金屬板之樹脂被覆面設置凹凸面。In Examples 5 and 6 and Comparative Examples 1 and 5, no concavo-convex surface was provided on the resin-coated surface of the metal plate.

(表面處理) 實施例1及2以及比較例2及4中,以成為表1所示之表面粗糙度Ra的方式,使用MEC股份有限公司製造之CZ-8101,於處理溫度為30℃之條件下,對樹脂被覆面或凹凸面實施粗化處理(蝕刻)。 (surface treatment) In Examples 1 and 2 and Comparative Examples 2 and 4, roughening treatment (etching) was performed on the resin-coated surface or uneven surface using CZ-8101 manufactured by MEC Co., Ltd. at a treatment temperature of 30°C so that the surface roughness Ra shown in Table 1 was obtained.

實施例3~6及比較例5中,對金屬板之樹脂被覆面實施粗化鍍鎳。鍍浴組成:Ni金屬成分130 g/L、硼酸25 g/L,pH值為3.3。此處,Ni金屬成分由作為Ni鹽之胺磺酸鎳四水合物及氯化Ni構成。更具體而言,胺磺酸鎳四水合物:Ni(NH 2SO 3) 2·4H 2O=294 g/L(約300 g/L),以Ni量計為53.5 g/L,氯化鎳六水合物:NiCl 2·6H 2O=約310 g/L,以Ni量計為76.5 g/L。鍍覆液溫度設為60℃,電流密度設為10 A/dm 2。處理時間以成為表1之表面粗糙度Ra的方式調整。 In Examples 3-6 and Comparative Example 5, roughening nickel plating was given to the resin coating surface of a metal plate. Plating bath composition: Ni metal component 130 g/L, boric acid 25 g/L, pH value 3.3. Here, the Ni metal component is composed of nickel sulfamate tetrahydrate and Ni chloride which are Ni salts. More specifically, nickel sulfamate tetrahydrate: Ni(NH 2 SO 3 ) 2 4H 2 O = 294 g/L (about 300 g/L), 53.5 g/L in Ni amount, nickel chloride hexahydrate: NiCl 2 6H 2 O = about 310 g/L, 76.5 g/L in Ni amount. The temperature of the plating solution was set at 60° C., and the current density was set at 10 A/dm 2 . The processing time was adjusted so that the surface roughness Ra of Table 1 was obtained.

比較例1及3中,未對金屬板之樹脂被覆面實施表面處理。In Comparative Examples 1 and 3, no surface treatment was performed on the resin-coated surface of the metal plate.

再者,表1所示之表面粗糙度Ra的測定,係藉由三鷹光器股份有限公司製造之非接觸表面性狀測定裝置(PF-60)進行,於具有凹凸面之粗化凹凸面的情形時,觀察矩形凸部或線狀凸部之頂面的位置。觀察倍率設為1000倍,點徑設為 1.0 μm,解析度設為X軸0.1 μmm、Y軸0.1 μmm、Z1軸(測定用Z軸)0.01 μm。測定設定如下。 測定間距:1 μm 測定範圍:8.0 mm(於直線之掃描)(於測定凹凸面之凸部的情形時,從後面提取該部分) 測定精度:X軸2 μm,Y軸2 μm,Z1軸0.3 μm 測定方式:掃描 掃描速度:100 μm/s AF增益:Standard 物鏡:SL100×(100倍) In addition, the measurement of the surface roughness Ra shown in Table 1 was carried out with a non-contact surface texture measuring device (PF-60) manufactured by Mitaka Koki Co., Ltd., and in the case of a roughened uneven surface with an uneven surface, the position of the top surface of the rectangular convex portion or the linear convex portion was observed. The observation magnification is set to 1000 times, and the spot diameter is set to 1.0 μm, the resolution is set to 0.1 μmm on the X axis, 0.1 μmm on the Y axis, and 0.01 μm on the Z1 axis (Z axis for measurement). Measurement settings are as follows. Measuring pitch: 1 μm Measuring range: 8.0 mm (scanning on a straight line) (In the case of measuring the convex part of the concave-convex surface, the part is extracted from the back) Measuring accuracy: X-axis 2 μm, Y-axis 2 μm, Z1-axis 0.3 μm Measuring method: scanning Scanning speed: 100 μm/s AF gain: Standard Objective lens: SL100× (100 times)

(射出成形) 使樹脂材料為液晶聚合物(ENEOS液晶股份有限公司製造之M-350B),藉由使用射出成形模具之插入成形,使樹脂構件固定於金屬板而形成。於任一實施例及比較例中,射出壓力均為150 MPa,除了比較例5以外,澆口套筒溫度均為360℃。比較例5中,將澆口套筒溫度設為170℃。 (injection molding) The resin material is a liquid crystal polymer (M-350B manufactured by ENEOS Liquid Crystal Co., Ltd.), and the resin member is fixed to a metal plate by insert molding using an injection mold. In any of the Examples and Comparative Examples, the injection pressure was 150 MPa, and the sprue sleeve temperature was 360° C. except for Comparative Example 5. In Comparative Example 5, the sprue sleeve temperature was set to 170°C.

實施例1~6以及比較例1及3中,於射出成形模具之模腔在周緣方向上設置兩處澆口,藉此在樹脂構件之周緣方向上,於不存在金屬板之部位形成有兩處熔接線。比較例2、4及5中,由於將澆口設為四處,故形成於樹脂構件之熔接線於周緣方向上為四處。實施例2中,於樹脂構件,在形成熔接線之位置設置有如圖11所示之兩個突出部。In Examples 1 to 6 and Comparative Examples 1 and 3, two gates are provided in the peripheral direction of the cavity of the injection molding mold, thereby forming two weld lines in the peripheral direction of the resin member at the portion where no metal plate exists. In Comparative Examples 2, 4, and 5, since four gates were provided, the weld lines formed in the resin member were four in the circumferential direction. In Example 2, two protrusions as shown in FIG. 11 were provided in the position where the weld line was formed on the resin member.

(紅色檢查試驗(red check test)) 對金屬樹脂複合體進行紅色檢查試驗,驗證紅色試驗液是否滲透樹脂構件與金屬板之間。具體而言,在金屬樹脂複合體之金屬板的貫通孔周圍,用金屬絲之前端將微量試驗液塗佈於樹脂構件之內側的內緣部,放置0.5小時。若放置後,試驗液未漏至樹脂構件之外側,則試驗液未滲透樹脂構件,因此可評價為密閉性良好。 (red check test) Conduct a red inspection test on the metal-resin composite to verify whether the red test liquid penetrates between the resin component and the metal plate. Specifically, around the through-hole of the metal plate of the metal-resin composite, a small amount of the test solution was applied to the inner edge of the resin member with the tip of a wire, and left for 0.5 hours. If the test liquid does not leak outside the resin member after being left to stand, the test liquid has not permeated the resin member, so it can be evaluated that the airtightness is good.

試驗係對未加熱之金屬樹脂複合體及於260℃加熱2小時後之金屬樹脂複合體進行。實施例1~6以及比較例2及4中,將非加熱之金屬樹脂複合體及加熱後之金屬樹脂複合體各5個供於試驗。比較例1、3及5中,針對1個非加熱之金屬樹脂複合體進行試驗。將供於試驗之總個數(5個或1個)中未漏出試驗液之個數(n個)的比率(n/5或n/1)示於表1。The test was carried out on the unheated metal-resin composite and the metal-resin composite heated at 260°C for 2 hours. In Examples 1-6 and Comparative Examples 2 and 4, five metal-resin composites without heating and five metal-resin composites after heating were used for the test. In Comparative Examples 1, 3, and 5, a test was performed on one non-heated metal-resin composite. Table 1 shows the ratio (n/5 or n/1) of the number (n pieces) that did not leak the test solution to the total number (5 pieces or 1 piece) used for the test.

(樹脂剝離試驗) 使用塊狀治具,於與金屬板水平之方向上對金屬樹脂複合體之樹脂構件自外側向內側施力而自金屬板剝離樹脂構件,於剝離樹脂構件之後,確認附著於金屬板上之樹脂的殘留。樹脂殘留於金屬板上,意指剝離之形態並非自金屬板與樹脂構件之界面剝離的形態,而是因樹脂構件內部之凝聚破壞而產生的形態,可判斷金屬板與樹脂構件之密接性良好。塊狀治具之衝頭塊設為寬度8.3 mm×厚度1.8 mm×長度26.0 mm之尺寸。該樹脂剝離試驗亦分別對非加熱之金屬樹脂複合體及加熱(260℃,2小時)後之金屬樹脂複合體進行。 (Resin peel test) Using a block jig, force is applied from the outside to the inside of the resin member of the metal-resin composite in a direction horizontal to the metal plate to peel the resin member from the metal plate. After peeling off the resin member, the residue of resin adhering to the metal plate is checked. Resin remaining on the metal plate means that the form of peeling is not the form of peeling from the interface between the metal plate and the resin member, but the form produced by the cohesion failure inside the resin member. It can be judged that the adhesion between the metal plate and the resin member is good. The punch block of the block fixture is set to the size of width 8.3 mm x thickness 1.8 mm x length 26.0 mm. The resin peeling test was also carried out on the non-heated metal-resin composite and the metal-resin composite after heating (260°C, 2 hours).

將其結果示於表1。此處,將樹脂之殘留未達樹脂被覆面之面積的10%之情形記為「×」,將樹脂之殘留為樹脂被覆面之面積的10%以上且未達50%或樹脂之殘留間斷而內側與外側相連之情形記為「△」,將樹脂之殘留為樹脂被覆面之面積的50%以上且內側及外側被樹脂殘留阻斷之情形記為「○」。The results are shown in Table 1. Here, the case where the resin residue is less than 10% of the area of the resin coating surface is marked as "×", the case where the resin residue is more than 10% and less than 50% of the area of the resin coating surface or the case where the resin residue is intermittent and the inside and the outside are connected is marked as "△", and the case where the resin residue is more than 50% of the area of the resin coating surface and the inside and outside are blocked by the resin residue is marked as "○".

(熱循環試驗) 針對實施例1~6之各金屬樹脂複合體,如圖12所示,用接著劑82使蓋體81a、81b接著於金屬樹脂複合體71之樹脂構件73的兩側,製作模擬半導體元件之供試驗體91。但是,該供試驗體91於內部之空腔不具有半導體晶片。樹脂構件73以及蓋體81a、81b由液晶聚合物(ENEOS液晶股份有限公司製造之M-350B)構成。 (Thermal cycle test) For each of the metal-resin composites of Examples 1-6, as shown in FIG. 12 , the lids 81a, 81b were bonded to both sides of the resin member 73 of the metal-resin composite 71 with an adhesive 82 to produce a test object 91 simulating a semiconductor element. However, the test object 91 does not have a semiconductor chip in the inner cavity. The resin member 73 and the covers 81 a and 81 b are made of a liquid crystal polymer (M-350B manufactured by ENEOS Liquid Crystal Co., Ltd.).

將上述供試驗體91供於-65℃~160℃之反覆升溫、降溫的熱循環試驗後,使供試驗體91浸沒於水中,確認有無空氣洩漏。將其結果示於表1。於表1,針對經進行100次、200次、500次熱循環試驗之情形的各者,揭示供於試驗之供試驗體91的總個數中無空氣洩漏之供試驗體91之個數的比率。After subjecting the above-mentioned test body 91 to a heat cycle test in which the temperature was repeatedly raised and lowered from -65°C to 160°C, the test body 91 was immersed in water to check for air leakage. The results are shown in Table 1. In Table 1, the ratio of the number of test objects 91 without air leakage to the total number of test objects 91 used in the test is disclosed for each of the cases where the heat cycle test was performed 100 times, 200 times, and 500 times.

(密閉性評價) 根據上述紅色檢查試驗、樹脂剝離試驗及熱循環試驗之結果,對金屬樹脂複合體之內部空間的密閉性進行評價。將其結果示於表1。表1中,針對密閉性,「○」表示密閉性良好,「△」表示具有某種程度之密閉性,「×」則表示密閉性不足。 (Tightness evaluation) The airtightness of the internal space of the metal-resin composite was evaluated based on the results of the above-mentioned red color test, resin peeling test, and heat cycle test. The results are shown in Table 1. In Table 1, regarding the airtightness, "○" indicates that the airtightness is good, "△" indicates that the airtightness is to some extent, and "×" indicates that the airtightness is insufficient.

[表1]    樹脂被覆面 凹部深度 (mm) 表面處理 表面粗糙度Ra (μm) 熔接線 有無突出部 非加熱之紅色檢查 加熱後之紅色檢查 加熱前樹脂剝離 加熱後樹脂剝離 熱循環 (100次) 熱循環 (200次) 熱循環 (500次) 密接性 實施例1 矩形凹凸面 0.067 蝕刻 0.50 2 5/5 5/5 6/6 - 5/6 實施例2 矩形凹凸面 0.067 蝕刻 0.50 2 5/5 5/5 6/6 - 6/6 實施例3 矩形凹凸面 0.067 粗化鍍Ni 0.29 2 5/5 5/5 5/5 5/5 - 實施例4 矩形凹凸面 0.067 粗化鍍Ni 0.25 2 5/5 5/5 5/5 5/5 - 實施例5 無凹凸面 - 粗化鍍Ni 0.27 2 5/5 5/5 5/5 5/5 - 實施例6 無凹凸面 - 粗化鍍Ni 0.25 2 5/5 5/5 5/5 4/5 - 比較例1 無凹凸面 - - 0.10 2 0/1 - - - - - - × 比較例2 線狀凹凸面 0.067 蝕刻 0.50 4 5/5 5/5 - - - × 比較例3 矩形凹凸面 0.067 - 0.10 2 0/1 - - - - - - × 比較例4 矩形凹凸面 0.067 蝕刻 0.50 4 5/5 5/5 - - - × 比較例5 無凹凸面 - 粗化鍍Ni 0.30 4 0/1 - - - - - - × [Table 1] Resin coating Recess Depth (mm) surface treatment Surface roughness Ra (μm) weld line With or without protrusion Non-heated red check Red check after heating Resin peeling before heating Resin peeling off after heating Thermal cycle (100 times) Thermal cycle (200 times) Thermal cycle (500 times) Closeness Example 1 Rectangular concave-convex surface 0.067 etching 0.50 2 none 5/5 5/5 6/6 - 5/6 Example 2 Rectangular concave-convex surface 0.067 etching 0.50 2 have 5/5 5/5 6/6 - 6/6 Example 3 Rectangular concave-convex surface 0.067 Rough Ni plating 0.29 2 none 5/5 5/5 5/5 5/5 - Example 4 Rectangular concave-convex surface 0.067 Rough Ni plating 0.25 2 none 5/5 5/5 5/5 5/5 - Example 5 No uneven surface - Rough Ni plating 0.27 2 none 5/5 5/5 5/5 5/5 - Example 6 No uneven surface - Rough Ni plating 0.25 2 none 5/5 5/5 5/5 4/5 - Comparative example 1 No uneven surface - - 0.10 2 none 0/1 - - - - - - x Comparative example 2 linear concave-convex surface 0.067 etching 0.50 4 none 5/5 5/5 - - - x Comparative example 3 Rectangular concave-convex surface 0.067 - 0.10 2 none 0/1 - - - - - - x Comparative example 4 Rectangular concave-convex surface 0.067 etching 0.50 4 none 5/5 5/5 - - - x Comparative Example 5 No uneven surface - Rough Ni plating 0.30 4 none 0/1 - - - - - - x

(探討) 根據表1所示,可知實施例1~6藉由將樹脂構件之熔接線設為兩處以下,於樹脂被覆面設置粗化凹凸面或粗化鍍覆層,而與比較例1~5相比,內部空間之密閉性高。不僅於對矩形凹凸面實施蝕刻或粗化鍍覆而製成粗化凹凸面之實施例1~4中,於在樹脂被覆面未形成凹凸面而是實施粗化鍍覆之實施例5及6中,亦確保了內部空間之高密閉性。 (discuss) As shown in Table 1, it can be seen that in Examples 1 to 6, compared with Comparative Examples 1 to 5, the airtightness of the internal space is higher than that of Comparative Examples 1 to 5 by setting the weld line of the resin member at two or less places and providing a roughened uneven surface or a roughened plating layer on the resin coating surface. Not only in Examples 1 to 4 in which the rectangular uneven surface was formed by etching or roughening plating, but also in Examples 5 and 6 in which roughening plating was performed on the resin-coated surface without forming an uneven surface, high airtightness of the internal space was ensured.

另一方面,比較例1由於未在樹脂被覆面設置凹凸面及粗化鍍覆層中之任一者,故密閉性低。由比較例3可知,即便於樹脂被覆面設置矩形凹凸面,若不實施粗化處理,亦無法確保充分之密閉性。又,由比較例2、4及5可知,若形成於樹脂構件之熔接線增多,則密閉性會降低。On the other hand, in Comparative Example 1, since neither the uneven surface nor the roughened plating layer was provided on the resin coating surface, the airtightness was low. As can be seen from Comparative Example 3, even if a rectangular concave-convex surface is provided on the resin-coated surface, sufficient airtightness cannot be ensured without roughening treatment. In addition, from Comparative Examples 2, 4, and 5, it can be seen that when the number of weld lines formed in the resin member increases, the airtightness decreases.

由以上可知,若根據上述之金屬樹脂複合體,可提高藉由樹脂構件形成之內部空間的密閉性。From the above, it can be seen that according to the above-mentioned metal-resin composite, the airtightness of the internal space formed by the resin member can be improved.

(樹脂密接性) 分別針對經實施鍍鎳處理之銅製金屬板及未實施任何處理之銅製金屬板,使樹脂構件固定後,剝離樹脂構件,測定剪切強度。將其結果示於表2。 (resin adhesion) The resin member was fixed to the nickel-plated copper metal plate and the copper metal plate without any treatment, and then the resin member was peeled off to measure the shear strength. The results are shown in Table 2.

[表2]    處理 鍍覆厚度 (μm) Rz (μm) 剪切強度 (MPa) 鍍Ni金屬板 鍍Ni 0.5 0.962 4.574 金屬板 - 0.928 18.423 [Table 2] deal with Plating thickness (μm) Rz (μm) Shear strength (MPa) Ni-plated metal plate Ni plating 0.5 0.962 4.574 Metal plate none - 0.928 18.423

由表2可知,儘管樹脂被覆面之表面粗糙度Rz大致相同,但未經處理之金屬板具有較高之剪切強度。該表面粗糙度Rz意指依據JIS B0601:2001之最大高度。又,已知鍍鎳之樹脂密接性通常較低。再者,表面粗糙度Rz之測定係藉由其恩斯公司製造之雷射顯微鏡(VK-X150)進行,於觀察倍率為1000倍,點徑為 0.8 mm之條件下進行測定。物鏡設為100倍。測定範圍(測定面積)設為用該雷射顯微鏡測定後獲得之圖像的尺寸,即105.737 μm×141.029 μm。解析係藉由在線粗糙度測定中繪製水平線(垂直線)進行計算而執行。 It can be seen from Table 2 that although the surface roughness Rz of the resin-coated surface is approximately the same, the untreated metal plate has a higher shear strength. This surface roughness Rz means the maximum height based on JIS B0601:2001. Also, it is known that the resin adhesion of nickel plating is generally low. Furthermore, the measurement of the surface roughness Rz is carried out by means of a laser microscope (VK-X150) manufactured by Enns Corporation. The observation magnification is 1000 times, and the spot diameter is Measured under the condition of 0.8 mm. The objective lens is set at 100 times. The measurement range (measurement area) was set to the size of an image obtained after measurement with the laser microscope, that is, 105.737 μm×141.029 μm. The analysis is performed by drawing horizontal lines (vertical lines) in line roughness measurement and performing calculations.

因此,即便是在樹脂被覆面設有樹脂密接性低之粗化鍍鎳層的情形時,亦可如表1所示般確保內部空間之充分的密閉性,故可說於在樹脂被覆面設有除鎳以外之粗化鍍覆層的情形時亦能發揮高密閉性。Therefore, even when a rough nickel plating layer with low resin adhesion is provided on the resin coating surface, sufficient airtightness of the internal space can be ensured as shown in Table 1, so it can be said that high airtightness can also be exhibited when a rough plating layer other than nickel is provided on the resin coating surface.

1,71:金屬樹脂複合體 2,72:金屬板 2a:內緣部 3,73:樹脂構件 4:貫通孔 5,15:凹凸面 5a,15a:矩形凹部 5b,15b:矩形凸部 5c:頂面 6:粗化鍍覆層 7:熔接線 8a~8c:切口部 9:突出部 51:半導體晶片 52:接合線 81a,81b:蓋體 82:接著劑 91:供試驗體 La:矩形凹部、矩形凸部之長邊的長度 Lb:矩形凹部、矩形凸部之短邊的長度 Pa:矩形凹部之長邊方向的間距 Pb:矩形凹部之短邊方向的間距 R1:第一凹部群 R2:第二凹部群 Sb:背面 Sf:正面 1,71: metal resin composite 2,72: metal plate 2a: inner edge 3,73: Resin components 4: Through hole 5,15: concave and convex surface 5a, 15a: Rectangular recess 5b, 15b: rectangular convex part 5c: top surface 6: Coarse plating layer 7: Weld line 8a~8c: Incision part 9: Projection 51: Semiconductor wafer 52: Bonding wire 81a, 81b: cover body 82: Adhesive 91: Subject for test La: The length of the long side of the rectangular concave part and the rectangular convex part Lb: The length of the short side of the rectangular concave part and the rectangular convex part Pa: The pitch in the long side direction of the rectangular recess Pb: Pitch in the short side direction of the rectangular recess R1: the first recess group R2: Second recess group Sb: back Sf: front

[圖1]係表示一實施形態之金屬樹脂複合體的俯視圖。 [圖2]係表示圖1之金屬樹脂複合體所具備之金屬板的俯視圖。 [圖3]係表示圖1之金屬樹脂複合體於搭載有半導體晶片之狀態下的俯視圖。 [圖4]係表示圖2之金屬板的局部放大俯視圖。 [圖5]係表示圖2之金屬板之凹凸面一部分的立體圖。 [圖6]係表示圖2之金屬板之凹凸面及其變化例的俯視圖。 [圖7]係表示於金屬板之樹脂被覆面上之凹凸面的形成例之俯視圖。 [圖8]係表示沿圖6(a)之VII-VII線的剖視圖。 [圖9]係表示另一實施形態之金屬樹脂複合體所具備之金屬板的俯視圖。 [圖10]係表示圖1之金屬樹脂複合體的仰視圖。 [圖11]係表示再另一實施形態之金屬樹脂複合體的俯視圖。 [圖12]係表示實施例中使用金屬樹脂複合體製成之供試驗體的剖視圖及俯視圖。 [ Fig. 1 ] is a plan view showing a metal-resin composite according to an embodiment. [ Fig. 2 ] is a plan view showing a metal plate included in the metal-resin composite of Fig. 1 . [ Fig. 3] Fig. 3 is a plan view showing the metal-resin composite in Fig. 1 in a state where a semiconductor chip is mounted. [ Fig. 4 ] is a partially enlarged plan view showing the metal plate in Fig. 2 . [ Fig. 5 ] is a perspective view showing a part of the concave-convex surface of the metal plate in Fig. 2 . [ Fig. 6 ] is a plan view showing the concave-convex surface of the metal plate in Fig. 2 and its modification. [FIG. 7] It is a top view which shows the example of the formation of the uneven|corrugated surface on the resin-coated surface of a metal plate. [ Fig. 8 ] is a sectional view taken along line VII-VII of Fig. 6( a ). [ Fig. 9 ] is a plan view showing a metal plate included in a metal-resin composite according to another embodiment. [ Fig. 10 ] is a bottom view showing the metal-resin composite in Fig. 1 . [ Fig. 11 ] is a plan view showing a metal-resin composite in still another embodiment. [ Fig. 12 ] is a cross-sectional view and a plan view showing a test object manufactured using a metal-resin composite in Examples.

Claims (8)

一種金屬樹脂複合體,其具備金屬板及固定於該金屬板之樹脂構件,藉由包含該樹脂構件之密封構件而劃分出內部空間,該樹脂構件具有於該金屬板上包圍內部空間之周圍而延伸的框狀,於框狀之該樹脂構件的周緣方向上存在一處或兩處熔接線,該金屬板於被該樹脂構件覆蓋之樹脂被覆面具有粗化凹凸面,該粗化凹凸面由在該樹脂被覆面之俯視下於一方向及其正交方向之各方向交替排列的矩形凹部及矩形凸部形成。 A metal-resin composite body comprising a metal plate and a resin member fixed to the metal plate. The inner space is defined by a sealing member including the resin member. The resin member has a frame shape extending around the inner space on the metal plate. There are one or two welding lines in the peripheral direction of the frame-shaped resin member. The metal plate has a roughened concave-convex surface on the resin coating surface covered by the resin component. Rectangular recesses and rectangular protrusions arranged alternately in directions are formed. 如請求項1之金屬樹脂複合體,其中,該粗化凹凸面之表面粗糙度Ra為0.2μm以上。 The metal-resin composite according to claim 1, wherein the surface roughness Ra of the roughened concave-convex surface is 0.2 μm or more. 如請求項1或2之金屬樹脂複合體,其中,該矩形凹部及矩形凸部各自於該樹脂被覆面之俯視下為長方形。 The metal-resin composite according to claim 1 or 2, wherein each of the rectangular concave portion and the rectangular convex portion is rectangular in plan view of the resin-coated surface. 如請求項1或2之金屬樹脂複合體,其中,該矩形凸部於該樹脂構件側具有凸狀之曲面。 The metal-resin composite according to claim 1 or 2, wherein the rectangular protrusion has a convex curved surface on the side of the resin member. 如請求項1或2之金屬樹脂複合體,其中,框狀之該樹脂構件於周緣方向上之一部分自板厚方向之兩側夾住該金屬板而設置,該熔接線形成於在框狀之該樹脂構件的周緣方向上且該樹脂構件之內側不存在該金屬板的部位。 The metal-resin composite according to claim 1 or 2, wherein a portion of the frame-shaped resin member in the peripheral direction sandwiches the metal plate from both sides in the plate thickness direction, and the weld line is formed at a portion of the frame-shaped resin member in the peripheral direction where the metal plate does not exist inside the resin member. 一種金屬樹脂複合體,其具備金屬板及固定於該金屬板之樹脂構件,藉由包含該樹脂構件之密封構件而劃分出內部空間,該樹脂構件具有於該金屬板上包圍內部空間之周圍而延伸的框狀,於框狀之該樹脂構件的周緣方向上存在一處或兩處熔接線,該金屬板於被該樹脂構件覆蓋之樹脂被覆面含有粗化鍍覆層,框狀之該樹脂構件於周緣方向上之一部分自板厚方向之兩側夾住該金屬板 而設置,該熔接線形成於在框狀之該樹脂構件的周緣方向上且該樹脂構件之內側不存在該金屬板的部位。 A metal-resin composite body comprising a metal plate and a resin member fixed to the metal plate, the inner space is defined by a sealing member including the resin member, the resin member has a frame shape extending around the metal plate surrounding the inner space, one or two welding lines exist in the peripheral direction of the frame-shaped resin member, the metal plate has a roughened plating layer on the resin-coated surface covered by the resin member, and the frame-shaped resin member sandwiches the metal plate from both sides in the thickness direction of the frame-shaped resin member Furthermore, the welding line is formed at a portion in the peripheral direction of the frame-shaped resin member where the metal plate does not exist inside the resin member. 如請求項6之金屬樹脂複合體,其中,該粗化鍍覆層含有鎳。 The metal-resin composite according to claim 6, wherein the roughened plating layer contains nickel. 如請求項1、2、6或7之金屬樹脂複合體,其中,於該樹脂構件形成有熔接線之部位存在切斷痕跡。 The metal-resin composite according to claim 1, 2, 6, or 7, wherein there are cutting marks at the portion where the weld line is formed on the resin member.
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JPH10326845A (en) * 1997-03-25 1998-12-08 Mitsui Chem Inc Resin package, semiconductor device and manufacture of resin package
JP2020025145A (en) * 2016-02-17 2020-02-13 株式会社三井ハイテック Lead frame and semiconductor package
TW202112523A (en) * 2019-09-17 2021-04-01 日商Jx金屬股份有限公司 Insert molded product and method for manufacturing insert molded product
TW202123410A (en) * 2019-08-29 2021-06-16 日商Jx金屬股份有限公司 Metallic plate, metal-resin composite, semiconductor device, and metallic plate production method

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JPH10326845A (en) * 1997-03-25 1998-12-08 Mitsui Chem Inc Resin package, semiconductor device and manufacture of resin package
JP2020025145A (en) * 2016-02-17 2020-02-13 株式会社三井ハイテック Lead frame and semiconductor package
TW202123410A (en) * 2019-08-29 2021-06-16 日商Jx金屬股份有限公司 Metallic plate, metal-resin composite, semiconductor device, and metallic plate production method
TW202112523A (en) * 2019-09-17 2021-04-01 日商Jx金屬股份有限公司 Insert molded product and method for manufacturing insert molded product

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