TWI803152B - Wafer chuck for improving warpage problem - Google Patents

Abstract

A wafer chuck for improving a warpage problem is proposed. The wafer chuck for improving the warpage problem includes a main wafer chuck, a plurality of center suckers, a plurality of middle suckers and a plurality of surrounding suckers. The main wafer chuck includes a center area, a middle area, a surrounding area, a plurality of center holes, a plurality of middle holes and a plurality of surrounding holes. The center holes, the middle holes and the surrounding holes are disposed in the center area, the middle area and the surrounding area, respectively. The center suckers are disposed through the center holes, respectively. The middle suckers are disposed through the middle holes, respectively. The surrounding suckers are disposed through the surrounding holes, respectively. A center sucker height between the main wafer chuck and one of the center suckers is higher than a middle sucker height between the main wafer chuck and one of the middle suckers, and the middle sucker height is higher than a surrounding sucker height between the main wafer chuck and one of the surrounding suckers. Thus, the wafer chuck for improving the warpage problem of the present disclosure eliminates the warpage radian by generating a time difference while difference parts of the wafer are sucked by the center suckers, the middle suckers and the surrounding suckers, which is caused by a height different between the center suckers, the middle suckers, the surrounding suckers, respectively.

Description

Wafer carrier with improved warpage

The present invention relates to a wafer carrier, in particular to a wafer carrier which improves warpage.

In the wafer packaging process, in addition to the natural warping of the wafer itself, warping may occur due to the stacking of wafers with different expansion coefficients, or warping may also occur when it is combined with a circuit board. If the warping of the wafer If the arc is too large, it will affect the yield rate of the subsequent process.

In view of this, the development of a wafer carrier that improves the warpage problem has become a worthwhile research and development goal for related companies.

Therefore, the object of the present invention is to provide a wafer carrier that improves the warpage problem. By using the height difference of the central suction nozzle, the central suction nozzle, and the surrounding suction nozzles, the difference in the time when different blocks of the wafer are sucked is produced, and the wafer Return to level.

According to one embodiment of the structural aspect of the present invention, a wafer carrier for improving the warpage problem is provided, including a carrier body, a plurality of central nozzles, a plurality of central nozzles, and a plurality of peripheral nozzles. The carrier body includes a central area, a central area, a peripheral area, a plurality of central through holes, a plurality of central through holes and a plurality of peripheral through holes. The central area surrounds the central area; the peripheral area surrounds the central area. The central vias are located in the central area; the central vias are located in the central area; and the peripheral vias are located in the peripheral area. The central suction nozzles are respectively disposed through the central through holes, and there is a height difference between each central suction nozzle and the main body of the carrier board. The central suction nozzles are respectively disposed through the central through holes, and there is a height difference between each central suction nozzle and the main body of the carrier board. The peripheral suction nozzles are respectively disposed through the peripheral through holes, and there is a peripheral suction nozzle height difference between each peripheral suction nozzle and the main body of the carrier board. Wherein, the height difference of the central suction nozzle is higher than the height difference of the central suction nozzle, and the height difference of the central suction nozzle is higher than the height difference of the peripheral suction nozzles.

In this way, the wafer carrier of the present invention that improves the warping problem utilizes the height difference between the central nozzle, the central nozzle, and the surrounding nozzles and the main body of the carrier to create a time difference for the wafer to be sucked by the nozzle, thereby eliminating the The warping arc of the circle.

Other examples of the above-mentioned embodiment are as follows: the above-mentioned central suction nozzles, these central suction nozzles and these peripheral suction nozzles are all made of an antistatic material, and the antistatic material is doped with one of rubber and silicon rubber carbon.

Other examples of the foregoing embodiments are as follows: any one of the aforementioned central suction nozzles is a three-fold organ suction nozzle, and any one of these central suction nozzles and these peripheral suction nozzles is a two-fold organ suction nozzle Mouth.

Other examples of the aforementioned embodiment are as follows: each of the aforementioned central suction nozzles includes a central suction plate portion, and the central suction plate portion has a first thickness. Each peripheral suction nozzle includes a peripheral suction plate portion, and the peripheral suction plate portion has a second thickness. Wherein, the first thickness is greater than the second thickness.

Other examples of the above-mentioned embodiments are as follows: the above-mentioned wafer carrier for improving the warpage problem further includes a partition controller. The partition controller connects these central suction nozzles, these central suction nozzles and these peripheral suction nozzles, and controls these central suction nozzles in the central area, these central suction nozzles in the central area and these peripheral suction nozzles in the peripheral area respectively. The multiple adsorption states of the mouth are controlled by zones.

Other examples of the aforementioned embodiment are as follows: the number of the peripheral through holes in the aforementioned peripheral area is greater than the number of the central through holes in the central area.

According to one embodiment of the structural aspect of the present invention, a wafer carrier with improved warpage problem is provided, which includes a carrier body, a plurality of central suction nozzles and a plurality of peripheral suction nozzles. The carrier body includes a central area, a peripheral area, a plurality of central through holes and a plurality of peripheral through holes. The central area has a center. The peripheral area is farther from the center than the central area. The central through-holes are arranged in the central area in a ring at intervals; the peripheral through-holes are arranged in a ring at intervals in the peripheral area. The central suction nozzles are respectively disposed through the central through holes, and there is a height difference between each central suction nozzle and the main body of the carrier board. The peripheral suction nozzles are respectively disposed through the peripheral through holes, and there is a peripheral suction nozzle height difference between each peripheral suction nozzle and the main body of the carrier board. Wherein, the height difference of the central suction nozzle is higher than that of the surrounding suction nozzles.

Thereby, the wafer carrier for improving the warping problem of the present invention uses the difference in height between the central nozzle and peripheral nozzles and the main body of the carrier to create a time difference for the wafer to be sucked by the nozzles, thereby eliminating warpage.

Other examples of the aforementioned embodiment are as follows: the aforementioned central suction nozzles and the peripheral suction nozzles are all made of an antistatic material, and the antistatic material is one of rubber and silicon rubber doped with carbon.

Other examples of the above-mentioned embodiment are as follows: any one of the above-mentioned central suction nozzle and these peripheral suction nozzles is a two-fold organ suction nozzle.

Other examples of the above-mentioned embodiments are as follows: the above-mentioned wafer carrier for improving the warpage problem further includes a partition controller. The zone controller is connected to the central nozzles and the peripheral nozzles, and performs zone control on the multiple suction states of the central nozzles in the central area and the peripheral nozzles in the peripheral area.

Several embodiments of the present invention will be described below with reference to the drawings. For the sake of clarity, many practical details are included in the following narrative. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some commonly used structures and elements will be shown in a simple and schematic way in the drawings; and repeated elements may be denoted by the same reference numerals.

In addition, when a certain element (or unit or module, etc.) is "connected" to another element herein, it may mean that the element is directly connected to another element, or it may mean that a certain element is indirectly connected to another element , that is, there are other elements interposed between the element and another element. And when it is stated that an element is "directly connected" to another element, it means that there is no other element interposed between the element and another element. The terms first, second, third, etc. are used to describe different components, and have no limitation on the components themselves. Therefore, the first component can also be called the second component. Moreover, the combination of components/units/circuits in this article is not a combination that is generally known, conventional or conventional in this field. Whether the components/units/circuits themselves are known or not can be used to determine whether the combination relationship is easily recognized by those in the technical field. Usually knowledgeable people do it easily.

Please refer to FIG. 1 to FIG. 2 . FIG. 1 is a perspective view of a wafer carrier 100 for improving the warpage problem according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the wafer carrier 100 that improves the warpage problem according to FIG. 1 . The wafer carrier 100 that improves the warping problem includes a carrier body 120 , a plurality of central nozzles 140 , a plurality of central nozzles 150 and a plurality of peripheral nozzles 160 . The carrier body 120 includes a central area 121 , a central area 122 , a peripheral area 123 , a plurality of central through holes 124 , a plurality of central through holes 125 and a plurality of peripheral through holes 126 . The central area 122 surrounds the central area 121 ; the peripheral area 123 surrounds the central area 122 . The central through holes 124 are located in the central area 121 ; the central through holes 125 are located in the central area 122 ; and the peripheral through holes 126 are located in the peripheral area 123 . The central suction nozzles 140 are respectively disposed through the central through holes 124 , and there is a central suction nozzle height difference H1 between each central suction nozzle 140 and the carrier body 120 . The central suction nozzles 150 respectively pass through the central through holes 125 , and there is a central suction nozzle height difference H2 between each central suction nozzle 150 and the carrier main body 120 . The peripheral suction nozzles 160 respectively pass through the peripheral through holes 126 , and there is a peripheral suction nozzle height difference H3 between each peripheral suction nozzle 160 and the carrier body 120 . Wherein, the height difference H1 of the central suction nozzle is higher than the height difference H2 of the central suction nozzle, and the height difference H2 of the central suction nozzle is higher than the height difference H3 of the surrounding suction nozzles. In this way, the wafer carrier 100 of the present invention that improves the warping problem uses the height difference between the central suction nozzle 140, the central suction nozzle 150, the peripheral suction nozzle 160 and the carrier main body 120 to manufacture the wafer 10 by the central suction nozzle. 140 , the time difference between the suction of the central suction nozzle 150 and the peripheral suction nozzle 160 , thereby eliminating the warpage of the wafer 10 .

In detail, when the wafer 10 is placed on the warpage-improved wafer carrier 100, the central region 121, the central region 122 and the peripheral region 123 of the warpage-improved wafer carrier 100 correspond to the blocks of the wafer 10 respectively. 10a, 10b and 10c. The warping problem of the wafer 10 is mainly the warping of the crying face (the block 10 a is higher than the block 10 c ) and the smiling face warping (the block 10 a is lower than the block 10 c ). When the warping of the crying face occurs, the warping arc of the block 10a of the wafer 10 is larger than that of the block 10b, and the warping arc of the block 10b is larger than that of the block 10c, as shown in FIG. 2 . Since the height difference H1 of the central nozzle, the height difference H2 of the central nozzle and the height difference H3 of the surrounding nozzles decrease gradually, when the wafer 10 is placed on the wafer carrier 100 which improves the warpage problem, the highest central nozzle 140 first touches The block 10a with the largest warping arc forms a vacuum state, thereby reducing the warping arc of the block 10a; then the central suction nozzle 150 absorbs the block 10b with the second largest warping arc, reducing the warping arc of the block 10b; The peripheral suction nozzle 160 absorbs the block 10c with the least warping arc at the latest, so that the wafer 10 becomes flat. When the wafer 10 is warped with a smiling face, the working principle of the wafer carrier 100 for improving the warping problem is the same as when the warped face occurs with a sad face, and will not be repeated here.

The number of the peripheral through holes 126 in the peripheral area 123 is greater than the number of the central through holes 125 in the central area 122 . Specifically, since the areas of the peripheral area 123, the central area 122, and the central area 121 are gradually decreasing, in order to allow the block 10c of the wafer 10 to be evenly adsorbed, the number of the peripheral through holes 126 and the peripheral suction nozzles 160 is greater than that of the central through hole 125. And the number of central suction nozzles 150. In this embodiment, the central suction nozzle 150 and the peripheral suction nozzle 160 are arranged at intervals in the central area 122 and the peripheral area 123 respectively in an annular shape, the number of the central suction nozzle 140 is at least three, and the shapes of the central area 121 and the central area 122 are the same as The shape and size of the carrier body 120 are consistent with the 8-inch wafer, and the 12-inch wafer is consistent. In addition, when the wafer 10 is warped, if the height difference between the highest point and the lowest point of the wafer 10 is less than or equal to 8 mm, the height difference between the central suction nozzle height difference H1 and the peripheral suction nozzle height difference H3 must be greater than or equal to 8 mm . In one embodiment, the center nozzle height difference H1 between the center nozzle 140 and the carrier body 120 can be 9.49 mm; the center nozzle height difference H2 between the center nozzle 150 and the carrier body 120 can be 6.57 mm. mm; the height difference H3 between the peripheral suction nozzle 160 and the carrier body 120 may be 5.07 mm, but the present invention is not limited thereto. Thus, the warpage-improving wafer carrier 100 of the present invention can improve 8-inch wafers and 12-inch wafers that have a warpage of up to 4 mm.

Please refer to FIG. 2 to FIG. 4. FIG. 3 is a cross-sectional view of the center suction nozzle 140 of the wafer carrier 100 for improving the warpage problem according to FIG. 1 . FIG. 4 is a cross-sectional view of the peripheral suction nozzle 160 of the wafer carrier 100 that improves the warpage problem according to FIG. 1 . The central suction nozzles 140 , the central suction nozzles 150 and the peripheral suction nozzles 160 are all made of an antistatic material. The antistatic material can be one of rubber and silicon rubber doped with carbon, that is, rubber doped carbon or silicon rubber doped carbon, but the invention is not limited thereto. Any one of these central suction nozzles 140 is a three-fold organ suction nozzle, as shown in Figure 3; and any one of these central suction nozzles 150 and these peripheral suction nozzles 160 is a two-fold organ suction nozzle suction nozzle, wherein the peripheral suction nozzle 160 is as shown in FIG. 4 . Each central suction nozzle 140 includes a central suction plate portion 141, and the central suction plate portion 141 has a first thickness T1. Each peripheral suction nozzle 160 includes a peripheral suction plate portion 161 , and the peripheral suction plate portion 161 has a second thickness T2. Wherein, the first thickness T1 is greater than the second thickness T2.

In detail, the material of these central suction nozzles 140, these central suction nozzles 150 and these peripheral suction nozzles 160 can be an antistatic material formed by rubber doping carbon or silicon rubber doping carbon. By adjusting the carbon doping Ratio, the surface resistance of the central suction nozzles 140, the central suction nozzles 150 and the peripheral suction nozzles 160 can be made between 10 ⁵ Ω~10 ⁸ Ω. Thereby, the central suction nozzle 140, the central suction nozzle 150, and the peripheral suction nozzle 160 of the wafer carrier 100 that improves the warpage problem of the present invention are made of antistatic materials, which can avoid the static electricity on the wafer 10 when the wafer 10 is adsorbed. Component damaged. The central suction nozzle 140 is a three-fold organ suction nozzle. Since the block 10a corresponding to the central area 121 has a large warping arc, the wafer carrier 100 of the present invention improves the warping problem by configuring the central suction nozzle 140 to vary in height. The three-fold organ nozzle, which is larger than the two-fold organ nozzle, can completely remove the warping arc of the block 10 a of the wafer 10 . The width W1 of the central suction nozzle 140 can be 15.1 mm; the first thickness T1 of the central suction plate portion 141 can be 0.7 mm; the width W2 of the peripheral suction nozzle 160 can be 20 mm; the second thickness T2 of the peripheral suction plate portion 161 can be 0.11mm, but the present invention is not limited thereto. As can be seen from Figures 3 and 4, the three-fold organ nozzle has three layers of pleats, and the two-fold organ nozzle has two layers of pleats. The width W2 of the peripheral suction nozzle 160 is wider than the width W1 of the central suction nozzle 140, which can create a larger suction area, and the second thickness T2 of the peripheral suction disk part 161 is thinner than the first thickness T1 of the central suction disk part 141, which has better deformation range. Thereby, the wafer carrier 100 of the present invention that improves the warpage problem configures the central suction nozzle 140 to be higher than the height of the carrier body 120 than the central suction nozzle 150 and the peripheral suction nozzles 160, which helps to grasp the wafer 10 The block 10a with the largest warping arc; the central suction nozzle 150 and the peripheral suction nozzle 160 are configured as a two-fold suction nozzle with a larger adsorption area than the central suction nozzle 140 and a better deformation range, so that a single central suction nozzle 150 and the surrounding suction nozzle 150 The suction nozzle 160 can suck a larger area, and then completely suck and level the blocks 10b and 10c with a larger area. It must be noted that the structure of the central suction nozzle 150 is similar to that of the peripheral suction nozzle 160 and will not be shown again.

In other embodiments of the present invention, the wafer carrier for improving the warpage problem further includes a partition controller (not shown). The partition controller connects these central suction nozzles, these central suction nozzles and these peripheral suction nozzles, and controls these central suction nozzles in the central area, these central suction nozzles in the central area and these peripheral suction nozzles in the peripheral area respectively. The multiple adsorption states of the mouth are controlled by zones. In other words, the wafer carrier that improves the warping problem of the present invention can control the time sequence in which the central nozzle, the central nozzle and the peripheral nozzles start to absorb the wafer, the suction force at the beginning of adsorption, and the suction force in the release state through the partition controller . After the wafer is flattened, when the partition controller releases the adsorption state of the central nozzle, the central nozzle and the surrounding nozzles, the partition controller can slowly release the adsorption state through a pressure relief valve to avoid when the suction nozzle is released from the adsorption state Touching the wafer by bouncing back quickly towards the wafer, thereby causing the wafer to shift from its original position.

Please refer to FIG. 5 . FIG. 5 is a perspective view of a wafer carrier 100 a that improves the warpage problem according to a second embodiment of the present invention. The wafer carrier 100a that improves the warping problem includes a carrier body 120a , a plurality of central suction nozzles 150 and a plurality of peripheral suction nozzles 160 . The carrier body 120 a includes a central area 122 a , a peripheral area 123 a , a plurality of central through holes 125 , a plurality of peripheral through holes 126 and a plurality of elongated holes 127 . The central area 122a has a center C. As shown in FIG. The peripheral area 123a is farther from the center C than the central area 122a. The central through holes 125 are arranged at intervals in the central area 122 a; the peripheral through holes 126 are arranged at intervals in the peripheral area 123 a. The central suction nozzles 150 respectively pass through the central through holes 125 , and there is a central suction nozzle height difference H2 a between each central suction nozzle 150 and the carrier main body 120 a. The peripheral suction nozzles 160 are respectively disposed through the peripheral through holes 126 , and there is a peripheral suction nozzle height difference H3 a between each peripheral suction nozzle 160 and the carrier main body 120 a. The central suction nozzle height difference H2a is higher than the peripheral suction nozzle height difference H3a. In the embodiment shown in FIG. 5, the central nozzle 150, the peripheral nozzle 160, the peripheral area 123a, the central through hole 125 and the peripheral through hole 126 of the wafer carrier 100a that improve the warpage problem are respectively the same as those in the embodiment shown in FIG. 1. The structure of the central nozzle 150 , peripheral nozzle 160 , peripheral area 123 , central through hole 125 and peripheral through hole 126 of the wafer carrier 100 with the curvature problem is the same, and will not be repeated here. In particular, the structure of the central area 122a is the same as that of the central area 121 plus the central area 122 in the embodiment shown in FIG. 1 . The warpage-improved wafer carrier 100 a does not have a central area, a central through hole, and a central suction nozzle, and the warpage-improved wafer carrier 100 a may further include an elongated hole 127 . Specifically, the elongated hole 127 allows the robot arm to pass through the wafer carrier 100a, thereby supporting and lowering the wafer (not shown in the figure), and starts to absorb the wafer when the wafer is lowered. Thereby, the wafer carrier 100a that improves the warping problem of the present invention uses the height difference between the central suction nozzle 150, the peripheral suction nozzle 160 and the carrier main body 120a to manufacture the wafer by the central suction nozzle 150 and the peripheral suction nozzle 160 The time sequence of adsorption eliminates the warpage of the wafer.

It can be seen from the above-mentioned embodiments that the present invention has the following advantages: First, the wafer carrier that improves the warpage problem of the present invention is manufactured by the difference in height between the central suction nozzle, the central suction nozzle, and the peripheral suction nozzles and the carrier body. The time difference between the wafer being sucked by the central nozzle, the central nozzle and the peripheral nozzles, thereby eliminating the warpage of the wafer; The nozzle and peripheral nozzles are higher than the height of the main body of the carrier board, which helps to grab the area with the largest warping arc of the wafer; the central nozzle and peripheral nozzles are configured to have a larger adsorption area and a smaller deformation range than the central nozzle The best two-fold suction nozzle, so that a single central suction nozzle and peripheral suction nozzle can absorb a larger area, and then completely absorb and flatten the block with a larger area; third, the wafer carrier that improves the warpage problem of the present invention The board uses the height difference between the central nozzle and the peripheral nozzles and the main body of the carrier to manufacture the time sequence in which the wafer is sucked by the central nozzle and the peripheral nozzles, eliminating the warpage of the wafer.

Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Anyone skilled in this art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be defined by the appended patent application scope.

10:Wafer 10a, 10b, 10c: blocks 100, 100a: wafer carrier 120,120a: Carrier main body 121: Central area 122, 122a: Central District 123,123a: Surrounding area 124: Center through hole 125: central through hole 126: Perimeter through hole 127: Long hole 140: Center nozzle 141: Central adsorption plate part 150:Central suction nozzle 160: Surrounding nozzle 161: Peripheral adsorption plate part C: center H1: Center nozzle height difference H2, H2a: Central suction nozzle height difference H3, H3a: Height difference of surrounding suction nozzles T1: first thickness T2: second thickness W1, W2: width

Figure 1 is a perspective view of a wafer carrier that improves the warpage problem of the first embodiment of the present invention; Figure 2 is a schematic cross-sectional view of a wafer carrier that improves the warpage problem according to Figure 1; Figure 3 is a cross-sectional view of the center nozzle of the wafer carrier that improves the warpage problem according to Figure 1; Figure 4 is a cross-sectional view of the peripheral suction nozzle of the wafer carrier that improves the warpage problem according to Figure 1; and FIG. 5 is a perspective view of a wafer carrier for improving the warpage problem of the second embodiment of the present invention.

10:Wafer

10a, 10b, 10c: blocks

100: wafer carrier

120: Carrier main body

121: Central area

122:Central District

123: Surrounding area

124: Center through hole

125: central through hole

126: Perimeter through hole

140: Center nozzle

150:Central suction nozzle

160: Surrounding nozzle

Claims (10)

A wafer carrier that improves warpage, comprising: A carrier board body, including: a central area; a central area surrounding the central area; a peripheral area surrounding the central area; a plurality of central through holes located in the central region; a plurality of central openings located in the central area; and a plurality of peripheral vias located in the peripheral region; A plurality of central suction nozzles are respectively installed in the central through holes, and there is a height difference between each central suction nozzle and the main body of the carrier board; A plurality of central suction nozzles are respectively installed in the central through holes, and there is a height difference between each central suction nozzle and the main body of the carrier board; and A plurality of peripheral suction nozzles are respectively installed in the peripheral through holes, and there is a height difference between each peripheral suction nozzle and the main body of the carrier board; Wherein, the height difference of the central suction nozzle is higher than the height difference of the central suction nozzle, and the height difference of the central suction nozzle is higher than the height difference of the peripheral suction nozzles. The wafer carrier for improving the warpage problem as described in claim 1, wherein the central suction nozzles, the central suction nozzles and the peripheral suction nozzles are all made of an antistatic material, and the antistatic material is rubber And one of the silica gel is doped with carbon. The wafer carrier for improving the warpage problem as described in claim 1, wherein any one of the central suction nozzles is a three-fold organ suction nozzle, and any one of the central suction nozzles and the peripheral suction nozzles It is a two-fold organ suction nozzle. The wafer carrier for improving the warpage problem as described in claim 3, wherein, Each of the central suction nozzles includes a central suction plate portion having a first thickness; and Each of the peripheral suction nozzles includes a peripheral suction disk portion, and the peripheral suction disk portion has a second thickness; Wherein, the first thickness is greater than the second thickness. The wafer carrier board for improving the warpage problem described in claim 1 further includes: A zone controller, which connects the central nozzles, the central nozzles and the peripheral nozzles, and respectively the central nozzles in the central zone, the central nozzles in the central zone, and the peripheral zone The multiple suction states of the surrounding nozzles are controlled by zones. The wafer carrier for improving the warpage problem as claimed in claim 1, wherein the number of the peripheral through holes in the peripheral region is greater than the number of the central through holes in the central region. A wafer carrier that improves warpage, comprising: A carrier board body, including: a central district, having a center; a peripheral area which is further from the center than the central area; A plurality of central through-holes are arranged at intervals in the central area; and A plurality of peripheral through holes are arranged at intervals in the peripheral area; A plurality of central suction nozzles are respectively installed in the central through holes, and there is a height difference between each central suction nozzle and the main body of the carrier board; and A plurality of peripheral suction nozzles are respectively installed in the peripheral through holes, and there is a height difference between each peripheral suction nozzle and the main body of the carrier board; Wherein, the height difference of the central suction nozzle is higher than the height difference of the peripheral suction nozzles. The wafer carrier for improving the warpage problem as described in claim 7, wherein the central suction nozzles and the peripheral suction nozzles are made of an antistatic material, and the antistatic material is one of rubber and silicon rubber are doped with carbon. The wafer carrier board for improving the warpage problem as described in claim 7, wherein any one of the central nozzles and the peripheral nozzles is a two-fold organ nozzle. The wafer carrier board for improving the warpage problem as described in claim 7 further includes: A zone controller is connected to the central nozzles and the peripheral nozzles, and performs zone control on the multiple adsorption states of the central nozzles in the central zone and the peripheral nozzles in the peripheral zone.

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