TWI800586B - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
TWI800586B
TWI800586B TW107147174A TW107147174A TWI800586B TW I800586 B TWI800586 B TW I800586B TW 107147174 A TW107147174 A TW 107147174A TW 107147174 A TW107147174 A TW 107147174A TW I800586 B TWI800586 B TW I800586B
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TW
Taiwan
Prior art keywords
substrate processing
processing apparatus
processing method
substrate
processing
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Application number
TW107147174A
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Chinese (zh)
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TW201936278A (en
Inventor
御所眞高
道木裕一
枇杷聡
岡村聡
大川勝宏
桾本裕一朗
Original Assignee
日商東京威力科創股份有限公司
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Publication of TWI800586B publication Critical patent/TWI800586B/en

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TW107147174A 2018-01-04 2018-12-26 Substrate processing apparatus and substrate processing method TWI800586B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-000247 2018-01-04
JP2018000247 2018-01-04
JP2018201615A JP7142535B2 (en) 2018-01-04 2018-10-26 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
JP2018-201615 2018-10-26

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TW201936278A TW201936278A (en) 2019-09-16
TWI800586B true TWI800586B (en) 2023-05-01

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JP (1) JP7142535B2 (en)
TW (1) TWI800586B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6956024B2 (en) * 2018-02-15 2021-10-27 東京エレクトロン株式会社 Liquid treatment device and liquid film condition determination method
JP7249233B2 (en) * 2019-07-30 2023-03-30 倉敷紡績株式会社 thermo camera
JP7308688B2 (en) * 2019-08-05 2023-07-14 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE DRYING METHOD
KR102578764B1 (en) * 2021-03-25 2023-09-15 세메스 주식회사 Substrate processing apparatus and processing substrate method
JP2023125013A (en) * 2022-02-28 2023-09-07 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing system
TW202405935A (en) * 2022-06-01 2024-02-01 日商東京威力科創股份有限公司 Substrate processing method and substrate processing device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6067154A (en) * 1998-10-23 2000-05-23 Advanced Micro Devices, Inc. Method and apparatus for the molecular identification of defects in semiconductor manufacturing using a radiation scattering technique such as raman spectroscopy
US20060181706A1 (en) * 2005-02-15 2006-08-17 Sweeney Thomas I Process for enhancing dye polymer recording yields by pre-scanning coated substrate for defects
US20150273534A1 (en) * 2014-03-27 2015-10-01 Shibaura Mechatronics Corporation Substrate processing apparatus and substrate processing method
CN107275257A (en) * 2016-03-30 2017-10-20 芝浦机械电子株式会社 Substrate board treatment and substrate processing method using same
US20170345680A1 (en) * 2016-05-27 2017-11-30 Semes Co., Ltd. Transfer unit, and apparatus and method for treating substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4488780B2 (en) * 2003-05-28 2010-06-23 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP2010239013A (en) * 2009-03-31 2010-10-21 Shibaura Mechatronics Corp Substrate treatment apparatus and substrate treatment method
JP6563762B2 (en) * 2015-09-29 2019-08-21 芝浦メカトロニクス株式会社 Substrate processing apparatus and substrate processing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6067154A (en) * 1998-10-23 2000-05-23 Advanced Micro Devices, Inc. Method and apparatus for the molecular identification of defects in semiconductor manufacturing using a radiation scattering technique such as raman spectroscopy
US20060181706A1 (en) * 2005-02-15 2006-08-17 Sweeney Thomas I Process for enhancing dye polymer recording yields by pre-scanning coated substrate for defects
US20150273534A1 (en) * 2014-03-27 2015-10-01 Shibaura Mechatronics Corporation Substrate processing apparatus and substrate processing method
CN107275257A (en) * 2016-03-30 2017-10-20 芝浦机械电子株式会社 Substrate board treatment and substrate processing method using same
US20170345680A1 (en) * 2016-05-27 2017-11-30 Semes Co., Ltd. Transfer unit, and apparatus and method for treating substrate

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TW201936278A (en) 2019-09-16
JP2019121781A (en) 2019-07-22
JP7142535B2 (en) 2022-09-27

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