TWI796929B - Immersion cooling system - Google Patents

Abstract

An immersion cooling system includes a tank, an isolation plate and a condenser. The tank includes a base plate and a sidewall connected with the base plate. The sidewall and the base plate together define a space configured to accommodate a cooling liquid. The isolation plate connects with the sidewall and divides the space into a first subsidiary space and a second subsidiary space. The first subsidiary space is configured to accommodate electronic equipment, such that the electronic equipment is immersed in the cooling liquid. The isolation plate is at least partially separated from the base plate. The sidewall surrounds the condenser. A vertical projection of the condenser to the base plate at least partially overlaps with the second subsidiary space. The electronic equipment evaporates a portion of the cooling liquid to form a vapor. The condenser is configured to condense the vapor into a liquid form.

Description

Immersion Cooling System

The present invention relates to an immersion cooling system.

In order to effectively prevent large-scale electronic equipment from affecting operating efficiency or even causing damage due to excessive heat generated during operation, how to effectively dissipate heat from large-scale electronic equipment under reliable conditions is undoubtedly a subject that the industry attaches great importance to.

In the application of the immersion cooling system, the user will immerse the large electronic equipment in the cooling liquid in the immersion cooling system to remove the heat energy generated by the electronic equipment during operation.

One of the objectives of the present invention is to provide an immersion cooling system, which can prevent electronic equipment from being damaged by water splashed from different sources in the box.

According to an embodiment of the present invention, an immersion cooling system includes a box, a partition plate, and a condenser. The box body includes a bottom plate and a wall body. The walls are connected to the base plate and define together with the base plate a volume configured to receive the coolant. The partition plate is connected to the wall and divides the space into a first subspace and a second subspace. The first subspace is configured to accommodate at least one electronic device so that the electronic device is immersed in the cooling liquid. The partition plate and the base plate are at least partially separated from each other. The wall surrounds the condenser, and the vertical projection of the condenser towards the bottom plate at least partially overlaps the second subspace. Electronic equipment evaporates part of the cooling liquid to form vapor, and the condenser is configured to condense the vapor into a liquid state.

In one or more embodiments of the present invention, the above-mentioned immersion cooling system further includes a moisture detector and a display device. The moisture detector is connected to one of the partition board or the wall and is located in the second subspace. The moisture detector is configured to detect whether there is moisture.

In one or more embodiments of the present invention, the above-mentioned immersion cooling system further includes a display device. The display device signal is connected to the moisture detector and is configured to display whether the moisture detector detects moisture.

In one or more embodiments of the present invention, the above-mentioned immersion cooling system further includes a top plate. The wall body is connected between the top board and the bottom board, and the partition board and the top board are separated from each other.

In one or more embodiments of the present invention, the above-mentioned immersion cooling system further includes at least one support member. The supporting piece is connected between the partition board and the top board.

In one or more embodiments of the present invention, the above-mentioned immersion cooling system further includes at least one support member. The supporting piece is connected between the partition board and the bottom board.

In one or more embodiments of the present invention, the above-mentioned dividing plate includes a first sub-dividing plate and a second sub-dividing plate, the first sub-dividing plate and the second sub-dividing plate are connected to each other to form an included angle, The first sub-separation plate and the bottom plate are separated from each other, and the second sub-separation plate and the bottom plate are connected to each other.

In one or more embodiments of the present invention, the above-mentioned immersion cooling system further includes at least one support member. The supporting piece is connected between the first sub-partition board and the bottom board.

In one or more embodiments of the present invention, the above-mentioned partition board is substantially perpendicular to the bottom board.

In one or more embodiments of the present invention, the above-mentioned condenser includes an inlet port, an outlet port, and a main body. The inlet port and the outlet port are respectively connected to the main body. Flow out of the body, which is configured to condense the vapor to a liquid state.

The foregoing embodiments of the present invention have at least the following advantages:

(1) Even if there is some water vapor in the box, the condenser condenses the original water vapor in the box to form water droplets, and the water droplets will flow into the cooling liquid in the second subspace during the dripping process However, the accumulated water will not be splashed into the first subspace because of the barrier of the partition plate. In other words, even if the condenser condenses the water vapor in the box into water droplets, the electronic equipment accommodated in the first subspace will not be splashed by these water droplets because of the barrier of the partition plate, avoiding the electronic The chance of the equipment coming into contact with moisture due to the moisture in the box also reduces the risk of damage to the electronic equipment.

(2) If the condenser leaks cooling water due to different reasons, the cooling water leaked from the condenser will flow to the cooling liquid in the second subspace and accumulate as water, and it will not flow due to the barrier of the partition plate. will splash into the first subspace. In other words, even if the cooling water leaks from the condenser, the electronic equipment accommodated in the first subspace will not be splashed by the cooling water leaking from the condenser due to the barrier of the partition plate, thereby preventing the electronic equipment from being splashed. The chance of the equipment coming into contact with the cooling water due to the leakage of the condenser also reduces the risk of damage to the electronic equipment.

(3) If there is water from different sources in the box, the water will finally flow back into the coolant in the second subspace, and the water detector can detect the presence of water, and the display device signal connection Moisture detector, and display whether the moisture detector detects moisture. In this way, the user can simply and easily know whether there is moisture from different sources in the box through the display device.

Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some commonly used structures and elements will be shown in a simple schematic way in the drawings, and in all the drawings, the same reference numerals will be used to represent the same or similar elements . And if possible in practice, the features of different embodiments can be used interchangeably.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meanings that can be understood by those skilled in the art. Furthermore, the definitions of the above-mentioned words in the commonly used dictionaries should be interpreted in the content of this specification as meanings consistent with the relevant fields of the present invention. Unless specifically defined, these terms are not to be interpreted in an idealized or overly formal sense.

Please refer to Figures 1 and 2. FIG. 1 is a schematic cross-sectional view illustrating an immersion cooling system 100 according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view along line A-A in Fig. 1 . In this embodiment, as shown in FIGS. 1 to 2 , the immersion cooling system 100 includes a box body 110 , a partition plate 120 and a condenser 130 . The box body 110 includes a bottom plate 111 and a wall body 112 . The wall body 112 is connected to the base plate 111 and together with the base plate 111 defines a space SP configured to accommodate the cooling liquid CL. The partition plate 120 is connected to the wall body 112 and divides the space SP into a first subspace SP1 and a second subspace SP2, and both the first subspace SP1 and the second subspace SP2 accommodate the cooling liquid CL. Furthermore, the first subspace SP1 is configured to accommodate at least one electronic device 200 so that the electronic device 200 can be immersed in the cooling liquid CL to dissipate heat. It is worth noting that the partition plate 120 and the bottom plate 111 are separated from each other, and the channel P1 is defined between the partition plate 120 and the bottom plate 111, that is, the first subspace SP1 and the second subspace SP2 communicate with each other through the channel P1, therefore , the cooling liquid CL can flow between the first subspace SP1 and the second subspace SP2 through the passage P1. The condenser 130 is located in the space SP of the box body 110 , the wall 112 surrounds the condenser 130 , and the vertical projection of the condenser 130 toward the bottom plate 111 at least partially overlaps the second subspace SP2.

When the electronic equipment 200 is in operation, the electronic equipment 200 generates heat energy. The heated electronic equipment 200 evaporates part of the cooling liquid CL to form steam CV. The heated steam CV floats up and leaves the cooling liquid CL. The condenser 130 is configured to The vapor CV is condensed into a liquid state, thereby reducing the vapor CV to the liquid coolant CL. As mentioned above, since the vertical projection of the condenser 130 toward the bottom plate 111 at least partially overlaps the second subspace SP2, the cooling liquid CL condensed and reduced by the condenser 130 drops due to its weight and flows back to the second subspace SP2. In the cooling liquid CL of SP2, the cooling liquid CL forms a fluid circulation in the space SP of the box body 110 through repeated conversion between liquid state and gas state.

It should be noted that since the partition plate 120 is at least partially blocked between the first subspace SP1 and the second subspace SP2, the cooling liquid CL condensed and reduced by the condenser 130 will flow back during the dripping process. into the cooling liquid CL located in the second subspace SP2, and will not be splashed into the first subspace SP1 due to the barrier of the partition plate 120 .

In this way, even if there is some water vapor WV in the box body 110, the condenser 130 condenses the original water vapor WV in the box body 110 into water droplets, and the water droplets will also flow to the The water W is accumulated in the cooling liquid CL in the second subspace SP2 and will not be splashed into the first subspace SP1 due to the barrier of the partition plate 120 . In other words, even if the condenser 130 condenses the water vapor WV in the box body 110 into water droplets, the electronic equipment 200 housed in the first subspace SP1 will not be sprayed by these water droplets due to the barrier of the partition plate 120 Splashing avoids the chance of the electronic device 200 coming into contact with the moisture W due to the moisture WV stored in the box body 110 , and thus reduces the risk of damage to the electronic device 200 .

Furthermore, as shown in FIG. 1 , the condenser 130 includes an inlet port 131 , an outlet port 132 and a main body 133 , and the inlet port 131 and the outlet port 132 communicate with the main body 133 respectively. Specifically, the vertical projection of the main body 133 toward the bottom plate 111 at least partially overlaps the second subspace SP2. The inlet port 131 is configured to allow the cooling water CW to flow into the main body 133 , and the outlet port 132 is configured to allow the cooling water CW to flow out of the main body 133 . The main body 133 of the condenser 130 is configured to condense the vapor CV into a liquid state by the cooling water CW flowing through the main body 133 . In practical applications, the main body 133 of the condenser 130 can be composed of a conduit, for example. If the condenser 130 has problems such as conduit corrosion or poor contact and causes leakage of the cooling water CW, similarly, the cooling water leaked from the condenser 130 CW will also flow into the cooling liquid CL located in the second subspace SP2 and accumulate as water W, and will not be splashed into the first subspace SP1 due to the barrier of the partition plate 120 . In other words, even if the cooling water CW leaks from the condenser 130 , the electronic equipment 200 accommodated in the first subspace SP1 will not be blocked by the cooling water CW leaked from the condenser 130 due to the barrier of the partition plate 120 . Splashing prevents the electronic device 200 from being exposed to water W (ie, cooling water CW) due to the leakage of the condenser 130 , thereby reducing the risk of damage to the electronic device 200 .

In practical applications, the cooling liquid CL can be an insulating dielectric liquid, and the dielectric liquid and the water W are immiscible, and the weight of the water W is lighter than the dielectric liquid. The water W in the cooling liquid CL will float on the dielectric liquid (ie, the cooling liquid CL). In this way, the water W cannot flow from the second subspace SP2 to the first subspace SP1 through the channel P1 close to the bottom plate 111, while the dielectric fluid located under the water W can flow from the second subspace SP through the channel P1. SP2 flows to the first subspace SP1 , therefore, the fluid circulation of the dielectric fluid (ie, the cooling fluid CL) in the box body 110 can be kept smooth.

In practical application, the partition plate 120 is substantially perpendicular to the bottom plate 111 . Therefore, when the user places the electronic device 200 in the first subspace SP1, or takes out the electronic device 200 from the first subspace SP1, the electronic device 200 is not easy to collide with the partition plate 120, reducing the electronic device 200. 200 chance of being damaged by a collision.

In addition, as shown in FIG. 1 , the immersion cooling system 100 further includes a top plate 160 . The wall body 112 is connected between the top board 160 and the bottom board 111 , the partition board 120 and the top board 160 are separated from each other, and the passage P2 is defined between the partition board 120 and the top board 160 . Therefore, the vapor CV formed by the evaporation of the cooling liquid CL by the electronic device 200 can flow from the first subspace SP1 to the second subspace SP2 through the passage P2, so that the main body 133 of the condenser 130 can condense the vapor CV.

Furthermore, the immersion cooling system 100 further includes a moisture detector 140 and a display device 150 . As shown in FIG. 1 , the moisture detector 140 is connected to the partition plate 120 and located in the second subspace SP2, and the moisture detector 140 is configured to detect whether the moisture W exists. As mentioned above, if there is moisture W from different sources in the tank 110, the moisture W will eventually flow back into the coolant CL located in the second subspace SP2, and the moisture detector 140 can detect the moisture Whether W exists. Furthermore, the display device 150 is signal-connected to the moisture detector 140 and configured to display whether the moisture detector 140 has detected moisture W. In this way, the user can simply and easily know through the display device 150 whether there is water W from different sources in the box body 110 .

Please refer to Figure 3. FIG. 3 is a schematic cross-sectional view illustrating an immersion cooling system 100 according to another embodiment of the present invention. In this embodiment, the immersion cooling system 100 further includes at least one supporting member 170 . The supporting member 170 is connected between the partition board 120 and the bottom board 111 to enhance the structural strength between the partition board 120 and the bottom board 111 . For example, as shown in FIG. 3 , the number of support members 170 is plural.

Please refer to Figure 4. FIG. 4 is a schematic cross-sectional view showing an immersion cooling system 100 according to yet another embodiment of the present invention. In this embodiment, the supporting member 170 is connected between the partition board 120 and the top board 160 to enhance the structural strength between the partition board 120 and the top board 160 . For example, as shown in FIG. 4 , the number of support members 170 is plural. In other embodiments, the position of the support member 170, in addition to the places shown in Figure 3 and Figure 4, can also be connected between the partition plate 120 and the wall body 112 depending on the actual situation, so as to enhance Structural strength between the partition plate 120 and the wall body 112 .

Please refer to Figure 5. FIG. 5 is a schematic cross-sectional view showing an immersion cooling system 100 according to another embodiment of the present invention. According to the actual situation, as shown in FIG. 5 , the moisture detector 140 can also be connected to the wall 112 and located in the second subspace SP2, thus the application flexibility of the moisture detector 140 can be improved.

Please refer to Figure 6. FIG. 6 is a schematic cross-sectional view illustrating an immersion cooling system 100 according to another embodiment of the present invention. In this embodiment, as shown in FIG. 6, the partition 120 includes a first sub-partition 121 and a second sub-partition 122, and the first sub-partition 121 and the second sub-partition 122 are connected to each other. connected to form an angle θ. For example, the included angle θ can be 90 degrees, so it can correspond to the L-shaped condenser 130 disposed on the wall 112 . The first sub-separation plate 121 is separated from the bottom plate 111 , a channel P1 is defined between the first sub-separation plate 121 and the bottom plate 111 , and the second sub-separation plate 122 is connected to the bottom plate 111 .

Please refer to Figure 7. FIG. 7 is a schematic cross-sectional view showing an immersion cooling system 100 according to yet another embodiment of the present invention. In this embodiment, the immersion cooling system 100 further includes at least one supporting member 170 . The supporting member 170 is connected between the first sub-partition board 121 and the bottom board 111 to enhance the structural strength between the partition board 120 and the bottom board 111 . For example, as shown in FIG. 7 , the number of support members 170 is plural.

In summary, the technical solutions disclosed in the above embodiments of the present invention have at least the following advantages:

(1) Even if there is some water vapor in the box, the condenser condenses the original water vapor in the box to form water droplets, and the water droplets will flow into the cooling liquid in the second subspace during the dripping process However, the accumulated water will not be splashed into the first subspace because of the barrier of the partition plate. In other words, even if the condenser condenses the water vapor in the box into water droplets, the electronic equipment accommodated in the first subspace will not be splashed by these water droplets because of the barrier of the partition plate, avoiding the electronic The chance of the equipment coming into contact with moisture due to the moisture in the box also reduces the risk of damage to the electronic equipment.

(2) If the condenser leaks cooling water due to different reasons, the cooling water leaked from the condenser will flow to the cooling liquid in the second subspace and accumulate as water, and it will not flow due to the barrier of the partition plate. will splash into the first subspace. In other words, even if the cooling water leaks from the condenser, the electronic equipment accommodated in the first subspace will not be splashed by the cooling water leaking from the condenser due to the barrier of the partition plate, thereby preventing the electronic equipment from being splashed. The chance of the equipment coming into contact with the cooling water due to the leakage of the condenser also reduces the risk of damage to the electronic equipment.

(3) If there is water from different sources in the box, the water will finally flow back into the coolant in the second subspace, and the water detector can detect the presence of water, and the display device signal connection Moisture detector, and display whether the moisture detector detects moisture. In this way, the user can simply and easily know whether there is moisture from different sources in the box through the display device.

Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Anyone skilled in this art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be defined by the appended patent application scope.

100: Immersion Cooling System 110: cabinet 111: Bottom plate 112: wall 120: Partition board 121: The first sub-divider 122: the second sub-divider 130: condenser 131: Entry port 132: Export port 133: subject 140: Moisture detector 150: display device 160: top plate 170: support 200: Electronic equipment A-A: line segment CL: coolant CV: steam CW: cooling water P1, P2: channel SP: space SP1: First Subspace SP2: Second Subspace W: Moisture WV: water vapor θ: included angle

FIG. 1 is a schematic cross-sectional view illustrating an immersion cooling system according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view along line A-A in Fig. 1 . FIG. 3 is a schematic cross-sectional view illustrating an immersion cooling system according to another embodiment of the present invention. FIG. 4 is a schematic cross-sectional view showing an immersion cooling system 100 according to yet another embodiment of the present invention. FIG. 5 is a schematic cross-sectional view showing an immersion cooling system according to another embodiment of the present invention. Fig. 6 is a schematic cross-sectional view showing an immersion cooling system according to another embodiment of the present invention. Fig. 7 is a schematic cross-sectional view showing an immersion cooling system according to yet another embodiment of the present invention.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

100: Immersion Cooling System 110: cabinet 111: Bottom plate 112: wall 120: Partition board 130: condenser 131: Entry port 132: Export port 133: subject 140: Moisture detector 150: display device 160: top plate 200: Electronic equipment A-A: line segment CL: coolant CV: steam CW: cooling water P1, P2: channel SP: space SP1: First Subspace SP2: Second Subspace W: Moisture WV: water vapor

Claims (10)

An immersion cooling system, comprising: a box, including: a bottom plate; and a wall, connected to the bottom plate, and defining a space together with the bottom plate; a partition plate, connected to the wall and dividing the space into A first subspace and a second subspace, the first subspace and the second subspace are configured to accommodate cooling liquid, the first subspace is further configured to accommodate at least one electronic device, so that the electronic The equipment is immersed in the cooling liquid, the dividing plate and the bottom plate are at least partially separated from each other; and a condenser, the wall surrounds the condenser, and the condenser faces a vertical projection of the bottom plate at least partially overlapping the second sub- space, wherein the electronic device evaporates part of the cooling liquid to form a vapor, and the condenser is configured to condense the vapor into a liquid state and return it to the cooling liquid in the second subspace during the dripping process . The immersion cooling system as described in claim 1, further comprising: a moisture detector connected to one of the partition board or the wall and located in the second subspace, the moisture detector is configured to detect the presence of moisture. The immersion cooling system as described in Claim 2 further includes: a display device, signally connected to the moisture detector, and configured to display whether the moisture detector detects moisture. The immersion cooling system as described in Claim 1 further comprises: a top plate, the wall body is connected between the top plate and the bottom plate, and the partition plate and the top plate are separated from each other. The immersion cooling system as claimed in claim 4 further comprises: at least one supporting member connected between the partition board and the top board. The immersion cooling system as claimed in claim 1 further includes: at least one support member connected between the partition plate and the bottom plate. The immersion cooling system as described in claim 1, wherein the dividing plate comprises a first sub-dividing plate and a second sub-dividing plate, and the first sub-dividing plate and the second sub-dividing plate are mutually connected to form an included angle, the first sub-separation plate and the bottom plate are separated from each other, and the second sub-separation plate and the bottom plate are connected to each other. The immersion cooling system as claimed in claim 7 further includes: at least one support member connected between the first sub-division plate and the bottom plate. The immersion cooling system as claimed in claim 1, wherein the partition plate is substantially perpendicular to the bottom plate. The immersion cooling system as described in claim 1, wherein the condenser includes an inlet port, an outlet port and a main body, the inlet port and The outlet ports communicate with the main body respectively, the inlet ports are configured to allow cooling water to flow into the main body, the outlet ports are configured to allow the cooling water to flow out of the main body, and the main body is configured to condense the steam into a liquid state.

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