TWI789209B - Cooling device of projector optical engine - Google Patents

Abstract

A cooling device of projector optical engine includes a projector optical engine heat source, a heat conduction block, a thermoelectric cooling chip and a humidity sensor. The heat conduction block is connected with the projector optical engine heat source. The thermoelectric cooling chip is provided with a hot end and a cold end. The thermoelectric cooling chip is connected to the heat conduction block with the cold end. The humidity sensor is arranged on the heat conduction block.

Description

Cooling device for projection light machine

The present invention relates to a cooling device, and in particular to a cooling device for a projection light machine.

As the brightness specifications of projectors continue to increase, traditional heat dissipation methods cannot solve the problem of heat accumulation in projectors. Therefore, at present, the cooling chip is used to solve the heat dissipation problem of the projector, and a temperature sensor is used as the judgment basis of the control logic at the same time. The current methods are: 1.) Install the temperature sensor on the cold end of the cooling chip, and control the temperature of the cold end to be the same as the ambient temperature; or, 2.) Install the temperature sensor on the cooling target, and control A difference is maintained between the temperature of the cooling object and the ambient temperature. However, in order to avoid condensation caused by the temperature control of the cold end being too low, it can only be set under conservative conditions.

The invention provides a cooling device for a projection light machine, which is not limited by environmental conditions and can maximize the cooling capacity of the cooling chip.

According to an embodiment of the present invention, a cooling device for a light projection machine includes a heat source for a light projection machine, a heat conduction block, a cooling chip, and a humidity sensor. The heat conduction block is connected with the heat source of the projection light machine. The cooling chip has a hot end and a cold end. The cooling chip is connected to the heat conduction block with a cold end. The humidity sensor is disposed on the heat conduction block.

According to an embodiment of the present invention, a cooling device for a light projector includes a heat source for a light projector, a cooling chip, a humidity sensor, and a controller. The cooling chip has a hot end and a cold end. The cooling chip is connected to the heat source of the projection light machine with a cold end. The humidity sensor is arranged on the heat source of the projection light machine. The controller is electrically connected with the humidity sensor and the cooling chip.

Based on the above, in the cooling device of the projection light machine of the present invention, the cooling chip is connected to the heat conduction block or the heat source of the projection light machine through the cold end, and the humidity sensor is arranged on the heat conduction block or the heat source of the projection light machine. The humidity sensor is used to detect the relative humidity of the heat conduction block at the cold end of the cooling chip or the heat source of the projection light machine, so as to control the power of the cooling chip. In this way, the cooling device of the projection light machine of the present invention is not limited by environmental conditions, and can maximize the cooling capacity of the cooling chip.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Please refer to FIG. 1A first. In this embodiment, the cooling device 100a of the light projector includes a heat source 110a for the light projector, a heat conduction block 150, a cooling chip 120, and a humidity sensor 130a. The heat conduction block 150 is connected with the heat source 110a of the projector light machine. The cooling chip 120 has a hot end H and a cold end C. The cooling chip 120 is connected to the heat conduction block 150 through the cold terminal C. The humidity sensor 130a is disposed on the heat conduction block 150 .

In detail, in this embodiment, the projection light engine heat source 110a is, for example, a digital micro-mirror device (Digital Micro-mirror Device, DMD), but it is not limited thereto. The heat conduction block 150 is disposed between the heat source 110 a of the light projection machine and the cooling chip 120 , wherein the embodiment does not limit the shape of the heat conduction block 150 . Here, the size of the projector heat source 110a is larger than the size of the cooling chip 120, wherein the size refers to the area. When the area of the projector heat source 110 a is different from that of the cooling chip 120 , the heat generated by the projector heat source 110 a can be uniformly transferred to the cooling chip 120 by providing the heat conduction block 150 . Here, the cooling chip 120 is a semiconductor that can be freely cooled, heated and temperature controlled by direct current. There are N-type semiconductors and P-type semiconductors on this wafer. After the direct current passes, it will flow from N-type semiconductors to P-type semiconductors and absorb heat to become a cold end C. Then, it will flow from P-type semiconductors to N-type semiconductors and release heat. becomes the hot end H.

Furthermore, the humidity sensor 130a of the present embodiment is disposed adjacent to the cold end C of the cooling chip 120, wherein the humidity sensor 130a is used to detect the temperature of the heat conduction block 150 connected to the cold end C of the cooling chip 120. Relative humidity. That is to say, the humidity sensor 130 a of this embodiment detects the relative humidity of the heat conduction block 150 instead of the ambient humidity. It should be noted that, if the humidity sensor 130a is arranged at the cold end C adjacent to the cooling chip 120, the detection of the humidity (such as whether there is condensation) is more direct and accurate, and it does not need to go through the calculation system of the system humidity and system temperature. dew point temperature. For example, the dew point temperature difference between 50% relative humidity and 90% relative humidity is about 10degC. If the heat source 110a of the light projection machine condenses during cooling, there will be water droplets, which may cause equipment damage or abnormal operation. Furthermore, the moisture treatment in a closed environment is inconvenient, and it is difficult to directly perform dehumidification treatment. Therefore, in this embodiment, the relative humidity of the heat conduction block 150 located at the cold end C is detected by the humidity sensor 130a, so that the relative humidity can be maintained below 100% to avoid condensation, and at the same time, the power of the cooling chip 120 can be maximized. .

In addition, the cooling device 100 a of the projection light machine in this embodiment further includes a controller 140 electrically connected to the humidity sensor 130 a and the cooling chip 120 . In addition, the cooling device 100 a of the projection light machine of this embodiment further includes a base 160 and a heat sink 170 . The projector heat source 110 a is disposed on the base 160 , and the heat sink 170 is thermally coupled to the hot end H of the cooling chip 120 .

Next, please refer to FIG. 1B , in operation, firstly, the relative humidity of the heat conduction block 150 is detected by the humidity sensor 130 a to obtain the relative humidity of the heat conduction block 150 , that is, the relative humidity is obtained in step S10 . Next, the relative humidity detected by the humidity sensor 130 a is confirmed through the controller 140 , that is, the value of the relative humidity is confirmed in step S20 . Afterwards, if the relative humidity is less than 90, the controller 140 controls the cooling chip 120 to increase the power of the cooling chip 120, that is, step S32 increases the power of the cooling chip. On the contrary, if the relative humidity is greater than or equal to 90, the controller 140 will control the cooling chip 120 to reduce the power of the cooling chip 120, that is, step S34 reduces the power of the cooling chip. In this way, the power of the cooling chip 120 can be maximized.

In short, the cooling device 100a of the optical projector of this embodiment, in addition to dissipating the heat generated by the heat source 110a of the optical projector through the cooling chip 120, also uses the humidity sensor 130a to detect the cooling chip The relative humidity of the heat conduction block 150 at the cold end C of 120. In this way, the relative humidity can be maintained below 100% to avoid condensation, and the power of the cooling chip 120 can be maximized. In this way, the cooling device 100 a of the optical projection machine of this embodiment is not limited by environmental conditions and does not require dehumidification, and can also maximize the cooling capacity of the cooling chip 120 .

Other embodiments of the present invention will be described below. It must be noted here that the following embodiments use the component numbers and part of the content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

FIG. 2 is a schematic diagram of a cooling device for a projection light machine according to another embodiment of the present invention. Please refer to FIG. 1A and FIG. 2 at the same time. The cooling device 100b of the projection light machine in this embodiment is similar to the cooling device 100a of the projection light machine in FIG. The projection light mechanical heat source 110b of 100b is embodied as a projection light source, wherein the projection light source is, for example, a light emitting diode or a laser.

FIG. 3 is a schematic diagram of a cooling device for a projection light machine according to another embodiment of the present invention. Please refer to FIG. 1A and FIG. 3 at the same time. The cooling device 100c of the projection light machine in this embodiment is similar to the cooling device 100a of the projection light machine in FIG. 100c includes a projection light engine heat source 110a , a cooling chip 120 , a humidity sensor 130c and a controller 140 . The cooling chip 120 is provided with a hot end H and a cold end C, wherein the cold end C of the cooling chip 120 is connected to the heat source 110a of the projection light machine. The humidity sensor 130c is directly disposed on the projection light engine heat source 110a and is substantially in contact with the projection light engine heat source 110a. The controller 140 is electrically connected to the humidity sensor 130c and the cooling chip 120 .

Here, the area of the light projector heat source 110a is similar to the area of the cooling chip 120, so the heat conduction block 150 in FIG. 1A is not provided. Furthermore, the humidity sensor 130c of this embodiment is used to detect the relative humidity of the light projector heat source 110a connected to the cold end C of the cooling chip 120 . That is to say, the humidity sensor 130c of this embodiment detects the relative humidity of the heat source 110a of the projection light engine, rather than the ambient humidity. The humidity sensor 130c directly detects the relative humidity of the projector heat source 110a located at the cold end C, so that the relative humidity can be kept below 100% to avoid condensation and maximize the power of the cooling chip 120 .

FIG. 4 is a schematic diagram of a cooling device for a projection light machine according to another embodiment of the present invention. Please refer to FIG. 3 and FIG. 4 at the same time. The cooling device 100d of the projection light machine in this embodiment is similar to the cooling device 100c of the projection light machine in FIG. The projection light mechanical heat source 110b of 100d is embodied as a projection light source, wherein the projection light source is, for example, a light emitting diode or a laser.

To sum up, in the cooling device of the projection light machine of the present invention, the cooling chip is connected to the heat conduction block or the heat source of the projection light machine at the cold end, and the humidity sensor is arranged on the heat conduction block or the heat source of the projection light machine . The humidity sensor is used to detect the relative humidity of the heat conduction block at the cold end of the cooling chip or the heat source of the projection light machine, so as to control the power of the cooling chip. In this way, the cooling device of the projection light machine of the present invention is not limited by environmental conditions, and can maximize the cooling capacity of the cooling chip.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

100a, 100b, 100c, 100d: cooling device for projection light machine 110a, 110b: projection light machine heat source 120: cooling chip 130a, 130c: humidity sensor 140: Controller 150: heat conduction block 160: base 170: radiator C: cold end H: hot end S10, S20, S32, S34: steps

FIG. 1A is a schematic diagram of a cooling device for a projection light machine according to an embodiment of the present invention. FIG. 1B is a schematic diagram of a control method of the cooling device of the projection light machine in FIG. 1A . FIG. 2 is a schematic diagram of a cooling device for a projection light machine according to another embodiment of the present invention. FIG. 3 is a schematic diagram of a cooling device for a projection light machine according to another embodiment of the present invention. FIG. 4 is a schematic diagram of a cooling device for a projection light machine according to another embodiment of the present invention.

100a: Cooling device for projection light machine

110a: projection light machine heat source

120: cooling chip

130a: humidity sensor

140: Controller

150: heat conduction block

160: base

170: radiator

C: cold end

H: hot end

Claims (10)

A cooling device for a projection light machine, comprising: A projection light machine heat source; A heat conduction block connected with the heat source of the projection light machine; A cooling chip is provided with a hot end and a cold end, and the cooling chip is connected to the heat conducting block through the cold end; and A humidity sensor is arranged on the heat conduction block. The cooling device for projection light machine as described in claim item 1, further comprising: A controller is electrically connected with the humidity sensor and the cooling chip. The cooling device of the light projector as claimed in claim 1, wherein the heat conduction block is disposed between the heat source of the light projector and the cooling chip. The cooling device of the projection light machine as claimed in claim 1, wherein the size of the heat source of the projection light machine is smaller or larger than the size of the cooling chip. A cooling device for a projection light machine, comprising: A projection light machine heat source; A cooling chip is provided with a hot end and a cold end, and the cooling chip is connected to the projector heat source through the cold end; a humidity sensor located on the heat source of the projector; and A controller is electrically connected with the humidity sensor and the cooling chip. The cooling device of the optical projection machine as claimed in claim 1 or 5, wherein the heat source of the optical projection machine is a projection light source or a digital micro-mirror element. The cooling device for a projection light machine as claimed in Claim 6, wherein the projection light source is a light emitting diode or a laser. The cooling device of the light projector as claimed in claim 1 or 5, wherein the humidity sensor is used to detect the relative humidity of the heat source of the light projector connected to the cold end of the cooling chip or the heat conduction block. The cooling device for projection light machine as described in claim item 1 or 5, further comprising: a base on which the light projector heat source is located; and A heat sink is thermally coupled with the hot end of the cooling chip. The cooling device for a light projection machine as claimed in claim 1 or 5, wherein the humidity sensor is disposed adjacent to the cold end of the cooling chip.

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