TWI786542B - Wireless communication device - Google Patents

Abstract

The present invention provides a wireless communication device comprising a substrate having a first surface and a second surface opposite to the first surface, a first antenna structure formed on the first surface, a second antenna structure formed on the second surface, a radio frequency, a plurality of conducting wire, and a protection layer. The second antenna structure is electrically coupled to the first antenna structure. The radio frequency die is bonding onto the first surface. The plurality of conducting wires are electrically connected the radio frequency die to the first antenna structure. The protection layer is formed on the first surface for covering the first antenna structure and the radio frequency die, wherein at least one part of the top surface of the protection layer is a flat surface.

Description

wireless communication device

The invention relates to a wireless communication technology, in particular to a wireless communication device with a radio frequency identification tag.

Radio Frequency Identification (Radio Frequency Identification, hereinafter referred to as RFID) is a communication technology that is composed of wireless information processing technology, readers, and RFID devices. RFID devices refer to components composed of RFID chips and antenna circuits. , as long as it is equipped with a dedicated reader, the data can be read or written from the outside by means of non-contact communication. At the same time, the reader can capture and identify the information of the RFID device, and provide it to the back-end application system for further processing and use. Or value-added applications, the radio frequency identification system can be used in a wide range of applications, such as general access control, car chip anti-theft devices, or consumer electronic devices, such as smart phones, cameras, etc.

Please refer to FIG. 1 , which is a schematic diagram of RFID module packaging in a conventional wireless communication device. In conventional technology, the wireless communication device 1 includes a substrate 10 with an antenna structure 11 formed on its surface and electrically connected with an RFID module 12 . A protective layer 13 is formed on the periphery of the RFID module 12 to protect the RFID module 12 from damage.

Although the wireless communication device in the conventional technology protects the RFID module 12 through the design of the protective layer 13, there are several problems. First, although the surface of the RFID module 12 has a protective layer 13, it is mostly uneven or curved. Therefore, it is inconvenient to grab the RFID module 12 in the subsequent process. second, The commonly used material for the protective layer 13 is thermosetting resin. Although a package structure completely covered with resin can be made, the material used is thermosetting resin, which cannot withstand high temperature for a long time, so it cannot be applied to the surface of high temperature application environment. Insufficient flatness for automated production. Third, the conventional RFID module 12 is obtained by encapsulating the radio frequency identification chip, so it has a certain packaging volume. After being combined with the antenna and the substrate, the volume and thickness of the entire wireless communication device 1 will be increased. .

To sum up the above, a brand new wireless communication identification device is needed to solve the deficiencies of the prior art.

The present invention provides a wireless communication device, which is to directly place a radio frequency die (radio frequency die) on a substrate with an antenna structure through die bonding, and then connect the die to the substrate through wire bonding. The antennas are electrically connected together to form a thinner wireless communication device.

The invention provides a wireless communication device, which uses heat-resistant materials to cover the antenna and the radio frequency bare crystal, and forms a flat contact surface on the outer surface, so that the wireless communication device can be easily picked up by a mechanical arm in the subsequent automatic manufacturing process. In addition, in another embodiment, the bottom of the wireless communication device further has an electrical connection surface, so as to facilitate the wireless communication device to be disposed on the circuit substrate of other electronic devices by surface mount technology (SMT).

In one embodiment, the present invention provides a wireless communication device, which includes a substrate, a first antenna structure, a second antenna structure, a radio frequency die, a plurality of wires and a protective layer. The substrate has a first surface and a second surface opposite to the first surface. The first antenna structure is formed on the first surface. The second antenna structure is formed on the second surface and is connected with the first antenna Structural electrical connection. The radio frequency die is adhered on the first surface. The wires are respectively electrically connected to the radio frequency die and the first antenna structure. The protection layer is formed on the first surface and covers the first antenna structure and the radio frequency die. The protection layer has a flat surface.

In one embodiment, the present invention provides a wireless communication device, which includes a plurality of substrates, a plurality of antenna structures, a radio frequency die, a plurality of wires and a protective layer. The plurality of substrates are stacked on top of each other, with a first substrate at the top, which has a first surface and a second surface opposite to the first surface, and a second substrate at the bottom, which has a third surface. The plurality of antenna structures are formed on the first surface and the second surface. The radio frequency die is adhered on the first surface. The plurality of wires are respectively electrically connected to the radio frequency die and the antenna structure formed on the first surface. The protection layer is formed on the first surface and covers the antenna structure and the radio frequency die on the first surface, and the protection layer has a flat surface.

1: Wireless communication device

10: Substrate

11: Antenna structure

12: RFID module

13: Protective layer

2: Wireless communication device

20: Substrate

200: first surface

201: second surface

202: through hole

21: The first antenna structure

22: Second Antenna Structure

23: RF bare crystal

230: Adhesive layer

231, 232: electrical contacts

24a, 24b: wires

25: protective layer

250: flat surface

3, 3a, 3b: wireless communication device

30a: first substrate

30b: Substrate

30c: second substrate

300: first surface

301: third surface

302: second surface

303a, 303b: the first through hole

303c, 303d: the second through hole

305: electrical connection surface

31a: First antenna structure

31b: Second Antenna Structure

310, 311: electrical contacts

312~315: electrical contacts

32a~32d: wire

33: RF bare crystal

330: Adhesive layer

34: protective layer

35: Substrate adhesive layer

4: Circuit board

40: electrical connection point

5: Circuit board

50: Electrical connection surface

51, 52: Electronic components

510, 520: electrical connection surface

FIG. 1 is a schematic diagram of a conventional wireless communication device.

FIG. 2A is a schematic perspective view of an embodiment of the wireless communication device of the present invention.

FIG. 2B is a schematic cross-sectional view of AA of the wireless communication device embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of another embodiment of the wireless communication device of the present invention.

FIG. 4 is a schematic cross-sectional view of an embodiment of the combination of a wireless communication device and an electronic device according to the present invention.

FIG. 5 is a schematic cross-sectional view of another embodiment of the wireless communication device of the present invention.

FIG. 6 is a schematic diagram of another embodiment of the wireless communication device of the present invention.

Various exemplary embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which some exemplary embodiments are shown. However, inventive concepts may be embodied in many different forms and should not be construed as limited to the illustrative embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Like numbers indicate like elements throughout. The wireless communication device will be described below with various embodiments with reference to the drawings, however, the following embodiments are not intended to limit the present invention.

Please refer to FIG. 2A and FIG. 2B , wherein FIG. 2A is a schematic perspective view of an embodiment of a wireless communication device of the present invention, and FIG. 2B is a schematic cross-sectional view of AA of an embodiment of a wireless communication device of the present invention. In this embodiment, the wireless communication device 2 includes a substrate 20 , a first antenna structure 21 , a second antenna structure 22 , a radio frequency die 23 , a plurality of wires 24 and a protective layer 25 . The substrate 20 can be a printed circuit board (PCB), such as a double-sided copper-clad PCB made of epoxy resin and glass cloth, or a flexible printed circuit board (FPCB) or a ceramic substrate. The substrate 20 has a first surface 200 and a second surface 201 . In this embodiment, the first surface 200 and the second surface 201 are located on upper and lower sides of the substrate body corresponding to each other.

The first antenna structure 21 is formed on the first surface 200 of the substrate 20. The first antenna structure 21 can be made of copper or aluminum metal or composite materials, such as: silver paste and graphene, etc., but not Use this as a limit. In this embodiment, the first antenna structure 21 is formed on the first surface 200 by copper etching or aluminum etching or printing. The second antenna structure 22 is formed on the second surface 201 of the substrate 20 and is also made of copper or aluminum. In this embodiment, the second antenna structure 22 is formed on the second surface 201 through copper etching or aluminum etching. In one embodiment, the first antenna structure 21 and the second antenna structure 22 are HF band antennas, but not limited thereto, for example: in another embodiment, the first and second antenna structures The wire structures 21 and 22 are antennas for the UHF band.

The first antenna structure 21 is electrically connected to the second antenna structure 22 . In this embodiment, the first antenna structure 21 is electrically connected to the second antenna structure 22 through the through hole 202 formed on the substrate 20 . The through hole 202 passes through the substrate 20 and is filled with conductive metal material to be electrically connected to the first antenna structure 21 and the second antenna structure 22 . The radio frequency die 23 is adhered to the substrate 20 by die bonding in this embodiment. In this embodiment, the radio frequency die is a radio frequency identification (RFID) die, but it is not limited. For example, a die for near field communication or a die for wireless communication can be implemented.

The method of adhesion is described below. Firstly, an adhesive layer 230 is formed on the first surface 200 , and then the radio frequency die 23 is placed on the adhesive layer 230 so that the radio frequency die 23 is adhered to the first surface 200 . It should be noted that, in the conventional technology, the radio frequency die is usually firstly packaged, and after pulling out wires or electrical connection points, it is then electrically connected to the substrate by soldering or surface mount (SMT). However, in this embodiment, the radio frequency die 23 is not packaged, but the radio frequency die 23 is directly bonded to the substrate 20, and then the electrical connection point on the radio frequency die is connected to the first and second through wires 24a and 24b. The two antenna structures 21 and 22 are electrically connected. Therefore, the thickness of the entire wireless communication device 2 can be reduced. For example: in one embodiment, the thickness of the wireless communication device 2 may be less than or equal to 1 mm, and the length or width may be less than or equal to 10 mm. It should be noted that the size is related to the frequency band used, for example, if it is a UHF frequency band, the length or width will be greater than 10mm.

In this embodiment, the radio frequency die 23 has two electrical contacts 231 and 232, and the wires 24a and 24b are respectively connected to the electrical contacts formed on the first surface 200 by wire bonding. The points 210 and 211 are electrically connected, and further electrically connected with the first antenna structure 21 . The protective layer 25 is formed on the first surface 200 and covers the first antenna structure 21 and the radio frequency die 23 to protect the first antenna structure 21 and the radio frequency die 23 from pollution, water air or physical damage. The insurance The top surface of the protective layer 25 is a flat surface 250, which is convenient for the automatic arm or suction device to pick up the wireless communication device 2 in the subsequent automatic process. In an embodiment, the flat surface is not the entire area on the upper surface of the protection layer 25 , but a local area is a flat surface. On the non-flat area, there are usually characters, models or patterns formed by laser. In one embodiment, the protection layer 25 can be made of polymer materials with long-term heat resistance. In this embodiment, the polymer material is compound epoxy, but it is not limited thereto.

Please refer to FIG. 3 , which is a schematic cross-sectional view of another embodiment of the wireless communication device of the present invention. In this embodiment, the wireless communication device 3 includes a plurality of substrates, a plurality of antenna structures, a plurality of wires 32 a - 32 d , a radio frequency die 33 and a protective layer 34 . The plurality of substrates are stacked on top of each other, with a first substrate 30a at the top, which has a first surface 300, and a second substrate 30c at the bottom, which has a third surface 301, with the substrate 30b interposed therebetween. . It should be noted that although the substrate in this embodiment has three layers, the actual number of layers depends on requirements and is not limited by this embodiment. The substrates 30 a - 30 c may be printed circuit boards (PCBs), for example, double-sided copper-clad or silver-pasted PCBs laminated by epoxy resin and glass cloth, flexible printed circuit boards (FPC), or ceramic substrates. In this embodiment, the substrate is a PCB substrate.

The plurality of antenna structures, in this embodiment, have a first antenna structure 31a and a second antenna structure 31b, wherein the first antenna structure 31a is formed on the first surface 300, and the second antenna structure 31b is formed On the second surface 302 of the first substrate 30a, there are antenna structures on the upper and lower surfaces of the first substrate 30a, so that the size of the first substrate 30a can be reduced. The first and second antenna structures 31a and 31b can be selected as antenna structures of the HF frequency band or the UHF frequency band. In this embodiment, the first substrate 30a further has first through holes 303a and 303b penetrating through the first substrate 30a, and a conductive material is formed therein for electrically connecting the first and second antenna structures 31a and 31b. Together. It should be noted that, on the first substrate 30a except for the first through The through holes other than the holes 303a and 303b are used for the purpose of telecommunication transmission with the circuit substrate 4 electrically connected with the wireless communication device 3 , which will be described later in detail.

The radio frequency die 33, in this embodiment, has the function of radio frequency identification. The radio frequency die 33 is adhered on the first substrate 30a by means of die bond. In the manufacturing steps, an adhesive layer 330 is first formed on the first surface 300 , and then the radio frequency die 33 is placed on the adhesive layer 330 so that the radio frequency die 33 is adhered to the first surface 300 . Its purpose is as mentioned above, and will not be repeated here. In this embodiment, the radio frequency die 33 has a plurality of electrical contacts, wherein two electrical contacts are respectively formed on the first surface 200 through wires 32a and 32b by wire bonding. The electrical contacts 310 and 311 are electrically connected. The RF die 33 also has functional contacts for signal transmission, which are electrically connected to the electrical connection points 312 and 313 on the first surface 300 of the first substrate 30a, and the electrical connection points 312 and 313 are then passed through wires 32c and 32d The second through holes 303c and 303d are electrically connected to the electrical connection surface 305 , so that the radio frequency die 33 can transmit signals to the circuit substrate electrically connected to the electrical connection surface 305 .

之間可以維持氣密狀態，避免水氣、污染物的污染與破壞。 The protective layer 34 is formed on the first surface 300 to cover the first antenna structure 31 a and the RF die 33 to protect the first antenna structure 31 a and the RF die 33 . Part or all of the top surface of the protection layer 34 is a flat surface, which can facilitate the automatic arm or the clamping device to clamp the wireless communication device 3 in the subsequent automatic process. In one embodiment, the protective layer 34 can be made of polymer material with heat resistance. In this embodiment, the polymer material is compound epoxy, but it is not limited thereto. In order to further protect the wireless communication device 3 from moisture or pollutants damaging the wireless communication device 3, in this embodiment, the gaps between the substrates 30a-30c are further filled with a substrate adhesive layer 35 formed of a polymer material, which It is an adhesive polymer material, so that the substrates 30a~30

The airtight state can be maintained between them to avoid the pollution and damage of water vapor and pollutants.

Please refer to FIG. 4 , which is a schematic cross-sectional view of an embodiment of the combination of a wireless communication device and an electronic device according to the present invention. In this embodiment, the wireless communication device 3 has the same structure as shown in FIG. 3 , further, the wireless communication device 3 is electrically connected to a circuit substrate 4 of the electronic device. In this embodiment, the circuit substrate 4 has a plurality of electrical connection points 40 . Since the wireless communication device 3 has an electrical connection surface 305, the wireless communication device 3 can be electrically connected to a plurality of electrical connection points 40 on the circuit substrate 4 through a surface mount (SMT) process, so that the radio frequency die 33 and the circuit board 4 can be electrically connected. Signal transmission can be performed between the circuit substrates 4 .

In another embodiment, please refer to FIG. 5 , which is a schematic diagram of another embodiment of the wireless communication device of the present invention. The wireless communication device 3a in this embodiment is basically similar to the wireless communication device 3 in FIG. The electronic components 51 and 52 are electrically connected to the substrate 5 . In this embodiment, the electronic components may be sensors, such as temperature sensors, humidity sensors or pressure sensors, etc., but not limited thereto. Therefore, the wireless communication device 3 a of this embodiment and at least one electronic component 51 or 52 are electrically connected to the electrical connection surface 50 of the circuit substrate 5 through the electrical connection surface 510 or 520 in a surface-adhesive manner. The electronic component 51 or 52 is electrically connected to the radio frequency die through the substrate 5 . In this embodiment, the electronic component 51 or 52 is electrically connected to the RF die through the electrical connection interface 50 on the substrate 5 via the electrical connection points 312-313, the through holes 303c, 303d, and the wires 32c and 32d. This enables the radio frequency bare chip 33 to record more sensor information, expanding the application level of the radio frequency bare chip 33 .

Please refer to FIG. 6 , which is a schematic diagram of another embodiment of the wireless communication device of the present invention. This embodiment is basically similar to FIG. 5, the difference is that the electronic components 51 and 52 of the wireless communication device 3b in this embodiment are not arranged on the substrate 5, but are arranged on the first substrate 30a, and are exposed to the radio frequency Die 33 is encapsulated within protective layer 34 . The electronic components 51 and 52 are electrically connected to the radio frequency die 33 .

The above description is only a description of the preferred implementation or examples of the technical means used to solve the problems in the present invention, and is not intended to limit the scope of the patent implementation of the present invention. That is, all equivalent changes and modifications that are consistent with the scope of the patent application of the present invention, or made according to the scope of the patent of the present invention, are covered by the scope of the patent of the present invention.

2: Wireless communication device

20: Substrate

200: first surface

201: second surface

202: through hole

21: The first antenna structure

22: Second Antenna Structure

23: RF bare crystal

230: Adhesive layer

24a, 24b: wires

25: protective layer

250: flat surface

Claims (14)

A wireless communication device, comprising: a substrate having a first surface and a second surface opposite to the first surface; a first antenna structure formed on the first surface; a second antenna structure , formed on the second surface, the second antenna structure is electrically connected to the first antenna structure; a radio frequency die is adhered to the first surface; a plurality of wires are respectively connected to the radio frequency die The crystal and the first antenna structure are electrically bonded by wire; and a protection layer is formed on the first surface to cover the first antenna structure and the radio frequency die, and the protection layer has a flat surface. The wireless communication device as described in claim 1 of the patent application, wherein the substrate is a printed circuit substrate, a ceramic substrate or a flexible printed circuit board. The wireless communication device as described in item 1 of the scope of the patent application, wherein the first antenna structure and the second antenna structure are HF or UHF frequency band antennas. The wireless communication device as described in claim 1, wherein the protective layer is a composite epoxy resin. In the wireless communication device described in item 1 of the scope of the patent application, the substrate has at least one through hole with conductive material therein for connecting the first antenna structure with the second antenna structure. A wireless communication device comprising: A plurality of substrates are stacked on top of each other, with a first substrate at the top, which has a first surface and a second surface opposite to the first surface, and a second substrate at the bottom, which has a third surface A plurality of antenna structures formed on the first surface and the second surface; a radio frequency bare crystal, by bonding on the first surface; a plurality of wires, respectively connected with the radio frequency bare crystal and formed on the second surface The antenna structure on a surface is electrically bonded; and a protective layer is formed on the first surface, covering the antenna structure on the first surface and the radio frequency die, and at least one area of the protective layer is a flat surface. The wireless communication device as described in claim 6 of the patent application, wherein the substrate is a printed circuit substrate, a ceramic substrate or a flexible printed circuit board. The wireless communication device described in item 6 of the scope of the patent application, wherein the antenna structure is an antenna for wireless communication such as HF or UHF frequency bands. The wireless communication device as described in item 6 of the scope of the patent application, wherein the protective layer is a composite epoxy resin. The wireless communication device as described in item 6 of the scope of the patent application, wherein the first substrate has at least one through hole with conductive material therein for connecting the plurality of antenna structures. The wireless communication device as described in item 6 of the scope of the patent application, wherein the third surface further has a plurality of electrical connection surfaces, so that the wireless communication device can be electrically connected to a circuit of an electronic device through a surface-mounting process on the substrate. The wireless communication device as described in item 11 of the scope of the patent application, wherein the circuit substrate is further electrically connected with at least one electronic component and the radio frequency die. The wireless communication device as described in item 6 of the scope of the patent application, wherein the flat surface provides an automatic equipment suction. In the wireless communication device described in item 6 of the scope of the patent application, the first substrate is further electrically connected with at least one electronic component and the radio frequency die.

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