TWI776536B - Substrate debonder - Google Patents

Abstract

The invention provides a substrate debonder, including a base and a suction/moving module. The suction/moving module includes a suction element, a lifting mechanism, a body and a plurality of elastic pin parts. The suction element sucks a second substrate, the lifting mechanism is connected to the suction element, and moves the suction element up and down with respect to the base. The body is connected to the base and the lifting mechanism, and moves the suction element with respect to the base. The elastic pin part is connected to the lifting mechanism, wherein when the suction element sucks the second substrate, the second substrate compresses the elastic pin part to a compressed state, and when the suction element releases the suction force, the elastic pin part is released from the compressed state and stretches, such that the second substrate separates from the suction element.

Description

Substrate separation device

The present invention relates to a substrate separating device, which utilizes an adsorption moving module to separate a second substrate bonded with a first substrate from the first substrate, and the adsorption moving module separates the second substrate separated from the first substrate. Move to a placement area to place it.

The integrated circuit technology has developed to a mature stage. At present, electronic products are developing towards the trend of thinness, high performance, high reliability and intelligence. The wafers in an electronic product can have a significant impact on its performance, where the thickness of the wafer is particularly relevant to the performance of the electronic product. For example, thinner chips can improve heat dissipation efficiency, increase mechanical performance, improve electrical performance, and reduce package size and weight.

In the semiconductor manufacturing process, processes such as substrate thinning, via etching, and backside metallization are usually performed on the backside (lower surface) of the wafer. However, when the thickness of the wafer (the first substrate) is too thin (for example, less than or equal to 150 μm), cracking or bending deformation of the wafer may be caused during the thinning process. Generally speaking, before thinning the substrate, a first substrate and a second substrate (eg, a sapphire substrate) are bonded first, and after the thinning process is completed, debonding is performed to separate the first substrate and the second substrate .

In the debonding process, the second substrate is usually adsorbed by a vacuum suction module to separate the second substrate from the wafer (the first substrate). However, when the vacuum suction module is to be removed or released the second When the substrate is used, the vacuum state is not completely released, and the second substrate jumps, so that the second substrate cannot be placed on the placement table stably and accurately, which may cause damage to the second substrate and contaminate the debonding machine.

In order to solve the above-mentioned problems faced by the prior art, the present invention proposes a substrate separation device, which mainly includes a plurality of elastic abutments on the adsorption moving module, so that when the adsorption moving module removes or releases the second substrate to the placing table, the elastic The abutting member continuously abuts against the second substrate, so as to separate the second substrate from the adsorption element, and at the same time maintain the second substrate stably abutting on the placing table.

An object of the present invention is to provide a substrate separation device, which includes a base and an adsorption moving module, wherein the adsorption moving module is connected to the base and mainly includes an adsorption element, a lifting mechanism and a plurality of elastic resists. The lifting mechanism is connected to the adsorption element, and drives the adsorption element and the second substrate it adsorbs to rise and fall relative to the base, and the elastic abutting piece is connected to the lifting mechanism. In the compressed state, when the suction element releases the suction force to the second substrate, the elastic abutting element will be released from the compressed state and stretch, and continue to abut against the second substrate, so that the second substrate leaves the suction element while maintaining the second substrate stably against the second substrate. Affixed to the stand on the base.

An object of the present invention is to provide a substrate separation device, including a base and an adsorption moving module, wherein the base includes a separation area and a placement area, and the placement area includes a placement table. The adsorption moving module is connected to the base, and includes an adsorption element, a lifting mechanism, a main body and a plurality of elastic resisting pieces. The lifting mechanism is connected to the adsorption element, and drives the adsorption element and the second substrate to be adsorbed to rise and fall relative to the base, and the body is connected to the base and the lifting mechanism, and drives the adsorption element and its adsorption The second substrate is displaced between the separation area and the placement area, and the elastic abutting piece is connected to the lifting mechanism. Wherein, when the adsorption element is adsorbed on the second substrate in the separation area, the second substrate will compress the elastic abutting member to make it in a compressed state. After that, the adsorption moving module moves to the top of the placement area, and the lifting mechanism drives the adsorption element and the second substrate to be adsorbed to descend until the second substrate contacts the placement table, and the adsorption element releases the suction force to the second substrate and is driven by the lifting mechanism. When rising, the elastic abutting member is released from the compressed state and continuously abuts against the second substrate, so that the second substrate leaves the adsorption element, while maintaining the second substrate stably abutting on the placing table.

In order to achieve the above purpose, the present invention provides a substrate separation device, which includes a base and an adsorption moving module, the base includes a separation area and a placement area, and the separation area is provided with: a carrying unit, suitable for carrying a load plate, a heating unit for heating a first substrate and a second substrate that are bonded, and a vacuum unit for adsorbing the first substrate, a placement table is arranged in the placement area, and the adsorption moving module includes: an adsorption The component is used to adsorb the second substrate; a lifting mechanism is connected to the adsorption component, and drives the adsorption component and the second substrate it adsorbs to rise and fall relative to the base; a body connects the base and the lifting mechanism, and drives the adsorption component and its suction The adsorbed second substrate is displaced between the separation area and the placement area; and a plurality of elastic abutting members are connected to the lifting mechanism, wherein when the adsorption element adsorbs the second substrate, the second substrate will compress the elastic abutting member to make it in a compressed state , and when the suction element releases the suction force to the second substrate, the elastic abutting element will be released from the compressed state and stretched, so that the second substrate leaves the suction element.

In the substrate separating device, wherein the elastic abutting member includes an elastic part connected with the lifting mechanism, and a contact part connected with the elastic part for contacting with the second substrate.

In the substrate separating device, the elastic part includes a spring.

In the substrate separating device, wherein the adsorption moving module further comprises a connecting piece, which is connected to the main body. The lifting mechanism connects the suction element through the connecting piece, and drives the connecting piece, the suction element and the second substrate to be sucked up and down relative to the main body and the base. The elastic abutting piece is connected with the lifting mechanism through the connecting piece. According to some embodiments of the present invention, the lifting mechanism includes a hydraulic element or a motor, which is connected to the connecting element and drives the connecting element, the adsorption element and the second substrate to be adsorbed to move up and down relative to the main body and the base.

In the substrate separating device, a plurality of elastic abutting members are arranged around the adsorption element.

The substrate separating device has at least two, at least three or at least four elastic abutting pieces, which are arranged around the adsorption element. Preferably, when the elastic abutting member is released from the compressed state and elongated, the moments generated by the force applied to the second substrate cancel each other, so that the second substrate can be stably abutted on the placing table when it leaves the adsorption element. For example, two elastic abutments are arranged around the adsorption element on both sides thereof, and three or more elastic abutments are arranged around the adsorption element at equal intervals.

In the substrate separation device, wherein the adsorption moving module is above the separation area, the lifting mechanism drives the adsorption element and the elastic abutting member to descend, the elastic abutting member abuts against the second substrate, the lifting mechanism drives the adsorption element to continue to descend, and the elastic abutting member continues to descend. The parts are compressed from a relaxed state until the adsorption element contacts the second substrate, the adsorption element adsorbs the second substrate, or, the adsorption mobile module is above the placement area, and the lifting mechanism drives the adsorption element and the adsorbed second substrate to descend, Until the second substrate contacts the placing table, the suction element releases the suction force to the second substrate and is driven by the lifting mechanism to rise, and the elastic abutting piece is released from the compressed state and continuously abuts against the second substrate, so that the second substrate leaves the suction element. In the substrate separating device, the elastic abutting member protrudes out of the adsorption element in a relaxed state.

In the substrate separating device, the base includes a track, and the adsorption and moving module is connected to the base through the track, and is displaced relative to the base along the track.

The said substrate separation device, wherein the carrying unit comprises a plurality of lifting rods and a carrying platform, the lifting rods are used to carry the carrier board and the bonded first and second substrates placed thereon, and drive the carried carrier board , the first substrate and the second substrate are close to the carrier table to place the carrier board, the first substrate and the second substrate on the carrier table.

In the substrate separating device, the carrier plate has a plurality of through holes, and the vacuum unit sucks the first substrate through the plurality of through holes of the carrier plate.

In the substrate separation device, the adsorption unit of the adsorption mobile module adsorbs the second substrate located in the separation area, and the main body drives the adsorption element and the adsorbed second substrate to slide relative to the first substrate, so that the second substrate is separated from the first substrate .

11: Pedestal

111: Orbit

13: Separation area

131: Bearing unit

1311: Lifting rod

1313: Bearing Table

15: Placement area

151: Placement table

17: Adsorption mobile module

171: Ontology

172: Orbit

173: Lifting mechanism

174: Connector

175: Adsorption element

177: Elastic contact

1771: Elastic Department

1773: Contact Department

C: carrier board

W: the first substrate

S: Second substrate

[FIG. 1] is a three-dimensional schematic diagram of an embodiment of the present invention.

[ Fig. 2 ] is a perspective view of an embodiment of the present invention.

[ Fig. 3 ] is a schematic perspective view of an embodiment of the present invention.

4 is a schematic cross-sectional view of an embodiment of the present invention.

5 is a schematic cross-sectional view of an embodiment of the present invention.

Please refer to FIG. 1 and FIG. 2, which are drawn according to an embodiment of the present invention. As shown in the figure, the substrate separation device includes a base 11 and a suction-moving module 17 . The base 11 includes a separation area 13 , a placement area 15 and a rail 111 .

The separation area 13 is provided with a carrying unit 131 suitable for carrying a carrier C, a heating unit (not shown) for heating a first substrate W and a second substrate S bonded together, and a vacuum unit ( Not shown), for adsorbing the first substrate W. The carrying unit 131 includes a plurality of lifting rods 1311 and a carrying platform 1313 . The placing area 15 is provided with a placing table 151 .

In this embodiment, the carrier C is a SiC carrier, the first substrate W is a wafer, and the second substrate S is a sapphire substrate, but the invention is not limited to this.

The adsorption moving module 17 includes an adsorption element 175 , a lifting mechanism 173 , a main body 171 and a plurality of elastic resists 177 .

The adsorption element 175 includes, but is not limited to, a vacuum adsorption element (eg, a vacuum suction cup), which is used to adsorb the second substrate S.

The lifting mechanism 173 is connected to the adsorption element 175 , and drives the adsorption element 175 and the second substrate S to be adsorbed to rise and fall relative to the base 11 . Please refer to FIG. 3 , FIG. 4 , and FIG. 5 , in this embodiment, the suction-moving module 17 further includes a connecting member 174 , which is connected to the main body 171 through a rail 172 , and the lifting mechanism 173 is connected to the suction element 175 through the connecting member 174 . The elastic abutting member 177 is connected to the lifting mechanism 173 through the connecting member 174 . For example, the lifting mechanism 173 includes a hydraulic element, a motor, an air cylinder or a screw, etc., and drives the connecting member 174 , the suction member 175 and the second substrate S to be sucked up and down relative to the main body 171 and the base 11 .

The main body 171 is connected to the lifting mechanism 173 and is connected to the base 11 through the rail 111 , so that the adsorption moving module 17 can be displaced relative to the base 11 along the rail 111 , wherein the main body 171 drives the adsorption element 175 and the second substrate S to which it is adsorbed. It is displaced between the separation area 13 and the placement area 15 along the track 111 .

Please refer to FIG. 4 and FIG. 5 , the elastic resisting member 177 includes an elastic portion 1771 and a contact portion 1773 . The elastic portion 1771 is connected to the lifting mechanism 173 through the connecting member 174 . The contact portion 1773 is connected to the elastic portion 1771 and used for contacting with the second substrate S. Generally speaking, the elastic part 1771 includes a telescopic rod body and a spring, and the spring is sleeved on the telescopic rod body; the contact part 1773 is made of a material suitable for contacting the second substrate S, such as a plastic.

When the adsorption element 175 adsorbs the second substrate S, the second substrate S will compress the elastic abutting member 177 to be in a compressed state, and when the adsorption element 175 releases the suction force to the second substrate S, the elastic abutting member 177 will be released by the The compressed state is released and extended, so that the second substrate S is separated from the suction element 175 . Please refer to FIG. 5 again, the elastic resist 177 protrudes from the adsorption element 175 in its relaxed state. As shown in the figure, the elastic resist 177 has a height h1 in the relaxed state, and the adsorption element 175 has a height h2, wherein h1 is greater than h2.

To use the substrate separation device to debond the bonded first substrate W and the second substrate S, as shown in FIG. 1311 is in a raised state), and then place the bonded first substrate W and the second substrate S on the carrier C with the first substrate W facing down and in contact with the carrier C. The lifting rod 1311 descends, and drives the carrier C, the first substrate W and the second substrate S carried toward the carrier table 1313 to place the carrier C, the first substrate W and the second substrate S on the carrier table 1313 . Next, a heating unit (not shown) heats the first substrate W and the second substrate S to soften the adhesive bonding the two.

The adsorption moving module 17 moves along the track 111 to the top of the separation area 13 , the lifting mechanism 173 drives the adsorption element 175 and the elastic abutting member 177 to descend, the elastic abutting member 177 abuts against the second substrate S, and the lifting mechanism 173 drives the adsorption element 175 Continue to descend, the elastic resist 177 is compressed from a relaxed state until the adsorption element 175 contacts the second substrate S, at this time, the adsorption element 175 adsorbs the second substrate S. At the same time, the vacuum unit (not shown) also adsorbs the first substrate W. In this embodiment, the carrier C has a plurality of perforations (not shown), and the vacuum unit sucks the first substrate W through the plurality of perforations of the carrier C. As shown in FIG.

Then, the main body 171 drives the adsorption element 175 and the adsorbed second substrate S to slide relative to the first substrate W, so that the second substrate S is separated from the first substrate W. As shown in FIG. Please refer to FIG. 3 , FIG. 4 and FIG. 5 , the adsorption moving module 17 moves along the track 111 to the top of the placement area 15 , and the lifting mechanism 173 drives the adsorption element 175 and the second substrate S to which it is adsorbed to descend until the second substrate S Contacting the placing table 151 (as shown in FIG. 4 ), the suction element 175 releases the suction force on the second substrate S and is driven by the lifting mechanism 173 to rise, and the elastic abutting member 177 is released from the compressed state and continuously abuts against the second substrate S , the second substrate S is separated from the suction element 175 while maintaining the second substrate S stably abutting on the placing table 151 (as shown in FIG. 5 ).

Finally, the plurality of lift rods 1311 of the carrier unit 131 are raised again (the suction force of the vacuum unit has been released at this time) to drive the carrier board C and the first substrate W placed thereon away from the carrier table 1313, and then the wafer robot The carrier C and the first substrate W are moved to a cleaning machine for cleaning, and the debonding process is completed after cleaning.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Modifications should be included within the scope of the patent application of the present invention.

151: Placement table

17: Adsorption mobile module

171: Ontology

173: Lifting mechanism

174: Connector

175: Adsorption element

177: Elastic contact

1771: Elastic Department

1773: Contact Department

S: Second substrate

Claims (9)

A substrate separation device, comprising: a base, including: a separation area, provided with a bearing unit, suitable for bearing a carrier; a heating unit, used to heat a first substrate and a second substrate, wherein the first substrate The substrate and the second substrate are bonded to each other; a vacuum unit is used to adsorb the first substrate; and a placement area is provided with a placement table; a second substrate; a lifting mechanism, connected to the adsorption element, and drives the adsorption element and the second substrate to be adsorbed to rise and fall relative to the base; a body, connected to the base and the lifting mechanism, and drives the adsorption element and the adsorbed second substrate is displaced between the separation area and the placement area; and a plurality of elastic abutting pieces are connected to the lifting mechanism, wherein when the adsorbing element adsorbs the second substrate, the second substrate will compress the The elastic abutting piece is in a compressed state, and when the suction element releases the suction force to the second substrate, the elastic abutting piece is released from the compressed state and elongated, so that the second substrate leaves the suction element, wherein the The elastic abutting piece includes: an elastic part connected with the lifting mechanism; and a contact part connected with the elastic part for contacting with the second substrate. The substrate separating device of claim 1, wherein the elastic portion includes a spring. A substrate separation device, comprising: a base, comprising: A separation area is provided with a carrying unit suitable for carrying a carrier; a heating unit for heating a first substrate and a second substrate, wherein the first substrate and the second substrate are bonded to each other; and a vacuum a unit for adsorbing the first substrate; and a placement area, provided with a placement table; and an adsorption moving module, including: an adsorption element for adsorbing the second substrate; a lifting mechanism, connected to the adsorption element, and drives the adsorption element and the second substrate to be adsorbed to rise and fall relative to the base; a body is connected to the base and the lifting mechanism, and drives the adsorption element and the second substrate to be adsorbed in the separation area and Displacement between the placement areas; and a plurality of elastic abutting pieces connected to the lifting mechanism, wherein when the adsorption element adsorbs the second substrate, the second substrate will compress the elastic abutting piece to be in a compressed state, and the When the suction element releases the suction force to the second substrate, the elastic abutting piece is released from the compressed state and elongated, so that the second substrate leaves the suction element, wherein the plurality of elastic abutting pieces are arranged around the suction element. A substrate separation device, comprising: a base, including: a separation area, provided with a bearing unit, suitable for bearing a carrier; a heating unit, used to heat a first substrate and a second substrate, wherein the first substrate The substrate and the second substrate are bonded to each other; a vacuum unit is used to adsorb the first substrate; and a placement area is provided with a placement table; the second substrate; A lifting mechanism is connected to the suction element, and drives the suction element and the second substrate to be sucked up and down relative to the base; a body is connected to the base and the lifting mechanism, and drives the suction element and its suction The second substrate is displaced between the separation area and the placement area; and a plurality of elastic abutments are connected to the lifting mechanism, wherein when the adsorption element adsorbs the second substrate, the second substrate will compress the elastic abutments, It is in a compressed state, and when the suction element releases the suction force to the second substrate, the elastic abutting piece will be released from the compressed state and elongated, causing the second substrate to leave the suction element, wherein: the suction moving mold Set above the separation area, the lifting mechanism drives the adsorption element and the elastic abutting piece to descend, the elastic abutting piece abuts against the second substrate, the lifting mechanism drives the adsorption element to continue to descend, and the elastic abutting piece is A relaxed state is compressed until the adsorption element contacts the second substrate, and the adsorption element adsorbs the second substrate; or the adsorption moving module is above the placement area, and the lifting mechanism drives the adsorption element and its adsorption The second substrate descends until the second substrate contacts the placing table, the suction element releases the suction force on the second substrate and is driven by the lifting mechanism to rise, the elastic abutting member is released from the compressed state and continues to abut to The second substrate is separated from the adsorption element. The substrate separating device according to claim 4, wherein the elastic abutting member protrudes from the adsorption element in the relaxed state. A substrate separation device, comprising: a base, including: a separation area, provided with a bearing unit, suitable for bearing a carrier; a heating unit, used to heat a first substrate and a second substrate, wherein the first substrate The substrate and the second substrate are bonded to each other; and a vacuum unit is used to adsorb the first substrate; and a placement area is provided with a placement table; and An adsorption moving module includes: an adsorption element for adsorbing the second substrate; a lifting mechanism, connected to the adsorption element, and drives the adsorption element and the second substrate to be adsorbed to move up and down relative to the base; a The main body is connected to the base and the lifting mechanism, and drives the adsorption element and the second substrate to be adsorbed to move between the separation area and the placement area; and a plurality of elastic resists are connected to the lifting mechanism, wherein the When the adsorption element adsorbs the second substrate, the second substrate will compress the elastic abutting member to be in a compressed state, and when the adsorption element releases the suction force of the second substrate, the elastic abutting member will be in the compressed state The second substrate is released and elongated so that the second substrate leaves the suction element, wherein the base includes a track, and the suction-moving module is connected to the base through the track and is displaced relative to the base along the track. A substrate separation device, comprising: a base, including: a separation area, provided with a bearing unit, suitable for bearing a carrier; a heating unit, used to heat a first substrate and a second substrate, wherein the first substrate The substrate and the second substrate are bonded to each other; a vacuum unit is used to adsorb the first substrate; and a placement area is provided with a placement table; a second substrate; a lifting mechanism, connected to the adsorption element, and drives the adsorption element and the second substrate to be adsorbed to rise and fall relative to the base; a body, connected to the base and the lifting mechanism, and drives the adsorption element The second substrate and the adsorbed second substrate are displaced between the separation area and the placement area; and A plurality of elastic abutments are connected to the lifting mechanism, wherein when the adsorption element adsorbs the second substrate, the second substrate compresses the elastic abutment to make it in a compressed state, and the adsorption element releases the second substrate When the suction force is strong, the elastic abutting piece will be released from the compressed state and elongated, so that the second substrate leaves the suction element, wherein the carrying unit includes a plurality of lifting rods and a carrying platform, the lifting rod is used to carry the carrier board and the first substrate and the second substrate placed thereon, and drive the carrier, the first substrate and the second substrate to approach the carrier, so as to bring the carrier, the first substrate and the second substrate closer to the carrier. The second substrate is placed on the stage. A substrate separation device, comprising: a base, including: a separation area, provided with a bearing unit, suitable for bearing a carrier; a heating unit, used to heat a first substrate and a second substrate, wherein the first substrate The substrate and the second substrate are bonded to each other; a vacuum unit is used to adsorb the first substrate; and a placement area is provided with a placement table; a second substrate; a lifting mechanism, connected to the adsorption element, and drives the adsorption element and the second substrate to be adsorbed to rise and fall relative to the base; a body, connected to the base and the lifting mechanism, and drives the adsorption element and the adsorbed second substrate is displaced between the separation area and the placement area; and a plurality of elastic abutting pieces are connected to the lifting mechanism, wherein when the adsorbing element adsorbs the second substrate, the second substrate will compress the The elastic abutting piece is in a compressed state, and when the suction element releases the suction force to the second substrate, the elastic abutting piece is released from the compressed state and elongated, so that the second substrate leaves the suction element, wherein the The carrier plate has a plurality of through holes, and the vacuum unit adsorbs the first substrate through the plurality of through holes of the carrier plate. A substrate separation device, comprising: a base, including: a separation area, provided with a bearing unit, suitable for bearing a carrier; a heating unit, used to heat a first substrate and a second substrate, wherein the first substrate The substrate and the second substrate are bonded to each other; a vacuum unit is used to adsorb the first substrate; and a placement area is provided with a placement table; a second substrate; a lifting mechanism, connected to the adsorption element, and drives the adsorption element and the second substrate to be adsorbed to rise and fall relative to the base; a body, connected to the base and the lifting mechanism, and drives the adsorption element and the adsorbed second substrate is displaced between the separation area and the placement area; and a plurality of elastic abutting pieces are connected to the lifting mechanism, wherein when the adsorbing element adsorbs the second substrate, the second substrate will compress the The elastic abutting piece is in a compressed state, and when the suction element releases the suction force to the second substrate, the elastic abutting piece is released from the compressed state and elongated, so that the second substrate leaves the suction element, wherein the The suction unit of the suction-moving module suctions the second substrate located in the separation area, and the main body drives the suction element and the suctioned second substrate to slide relative to the first substrate, so that the second substrate is removed from the first substrate Substrate separation.

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