TWI757825B - System and method for pcb inspection based on false defect detection - Google Patents

System and method for pcb inspection based on false defect detection Download PDF

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TWI757825B
TWI757825B TW109127011A TW109127011A TWI757825B TW I757825 B TWI757825 B TW I757825B TW 109127011 A TW109127011 A TW 109127011A TW 109127011 A TW109127011 A TW 109127011A TW I757825 B TWI757825 B TW I757825B
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諾尼 弗依斯沃瑟
凡 柯布蘭
胡冰峰
陳朋飛
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大陸商蘇州康代智能科技股份有限公司
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Abstract

System and method for PCB inspection based on false defect detection,the system includes automatic optical inspection equipment, database server and inspection equipment; the automatic optical inspection equipment is used to scan a printed circuit board which is to be inspected to obtain a scanned image and compare it with the corresponding standard images loaded by a database server, so as to construct a defect list containing defect coordinate information corresponding to a preliminarily determined defect of the scanned image; the maintenance equipment can load the scanned image and the corresponding defect list through the database server, and check the preliminarily determined defects at each defect coordinate in the defect list of the scanned image one by one; if the re-examined defect is a false defect, the defect will be deleted from the defect list, and the maintenance equipment will repair the printed circuit board according to remaining defects in the corresponding defect list.

Description

基於假點缺陷檢測之PCB檢修系統及檢修方法PCB maintenance system and maintenance method based on false point defect detection

本發明涉及電路板檢測檢修領域,尤其涉及一種基於假點缺陷檢測之PCB檢修系統及檢修方法。The invention relates to the field of circuit board inspection and repair, in particular to a PCB inspection system and repair method based on false point defect detection.

現如今在高度發展之電子工業時代,印刷電路板(Printed Circuit Board,PCB)已成為計算機、電子通信等産品上必不可缺之一樣重要部件之一。印刷電路板在生産過程中會有線路短路或者斷路之缺陷,而印刷電路板之好壞決定著相應電子器件産品之合格與否,因此,印刷電路板之質量檢測與檢修顯得格外重要。In today's highly developed electronic industry era, Printed Circuit Board (PCB) has become one of the indispensable and important components in computers, electronic communications and other products. In the production process of printed circuit boards, there will be defects of short circuit or open circuit, and the quality of printed circuit boards determines the qualification of corresponding electronic device products. Therefore, the quality inspection and maintenance of printed circuit boards are particularly important.

現有技術中,自動光學檢測設備(Automated Optical Inspection,AOI)在電路板生産過程中運用較為普遍,AOI能夠檢測PCB上之缺陷,然後人工根據AOI檢測到之缺陷進行檢修。現今客戶不僅對AOI自身之工作效率有要求,而且對AOI檢測後完成檢修之工作效率要求也越來越高,目前,市場上之普遍之AOI供應商,僅能提供單獨之AOI設備,被檢測之PCB從AOI設備上得到缺陷坐標後,移動到檢修設備,根據該缺陷坐標,人工通過檢修設備對缺陷逐個進行檢修,這個過程中,在數據傳輸、PCB板材搬運、逐個缺陷點檢修等都會耗費大量之時間。In the prior art, automated optical inspection equipment (Automated Optical Inspection, AOI) is commonly used in the production process of circuit boards. AOI can detect defects on the PCB, and then manually perform maintenance according to the defects detected by AOI. Nowadays, customers not only have requirements for the work efficiency of AOI itself, but also have higher and higher requirements for the work efficiency of AOI inspection and maintenance. At present, the common AOI suppliers in the market can only provide independent AOI equipment to be inspected. After the PCB gets the defect coordinates from the AOI equipment, it is moved to the maintenance equipment. According to the defect coordinates, the defects are manually repaired one by one through the maintenance equipment. a lot of time.

現有技術中缺少一種提高PCB缺陷檢測及檢修之解決方案。A solution for improving PCB defect detection and maintenance is lacking in the prior art.

為瞭解決現有技術之問題,本發明提供了一種基於假點缺陷檢測之PCB檢修系統及檢修方法,大大提高PCB缺陷檢測及檢修效率,所述技術方案如下:In order to solve the problems of the prior art, the present invention provides a PCB inspection system and inspection method based on false point defect detection, which greatly improves the PCB defect inspection and inspection efficiency. The technical scheme is as follows:

一方面,本發明提供了一種基於假點缺陷檢測之PCB檢修系統,包括自動光學檢測設備、數據庫服務器和檢修設備,所述檢修設備上配置有用於驗證假點缺陷之缺陷虛擬檢測模塊,所述自動光學檢測設備、缺陷虛擬檢測模塊均與所述數據庫服務器通信連接;In one aspect, the present invention provides a PCB overhaul system based on false point defect detection, including automatic optical inspection equipment, a database server and an overhaul equipment, wherein the overhaul equipment is configured with a defect virtual detection module for verifying false point defects, the The automatic optical detection equipment and the defect virtual detection module are all connected in communication with the database server;

所述自動光學檢測設備用於對待檢測之印刷電路板進行掃描得到掃描圖像,並將其與通過數據庫服務器加載之對應標準圖像作比較,以構建缺陷列表,所述缺陷列表中包含對應於所述掃描圖像之初步判定之缺陷之缺陷坐標信息;The automatic optical inspection equipment is used to scan the printed circuit board to be inspected to obtain the scanned image, and compare it with the corresponding standard image loaded through the database server, so as to construct a defect list. The defect coordinate information of the defects initially determined in the scanned image;

所述數據庫服務器用於存儲所述自動光學檢測設備輸出之掃描圖像及對應之缺陷列表;The database server is used for storing the scanned images and the corresponding defect list output by the automatic optical inspection equipment;

所述檢修設備之缺陷虛擬檢測模塊能夠通過所述數據庫服務器加載掃描圖像及對應之缺陷列表,並對所述掃描圖像在缺陷列表中之每個缺陷坐標處之初步判定之缺陷進行一一複檢,若複檢缺陷為假點缺陷,則將該缺陷從所述缺陷列表中刪除,所述檢修設備對所述印刷電路板對應缺陷列表中剩餘之缺陷坐標處之缺陷進行檢修。The defect virtual detection module of the maintenance equipment can load the scanned image and the corresponding defect list through the database server, and carry out one-by-one preliminary determination of defects at each defect coordinate of the scanned image in the defect list. Re-inspection, if the re-inspection defect is a false point defect, the defect is deleted from the defect list, and the inspection equipment repairs the defects at the remaining defect coordinates in the corresponding defect list of the printed circuit board.

作為第一種可選技術方案,對初步判定之缺陷進行複檢包括:提取初步判定之缺陷對應之缺陷坐標處之局部圖像,判斷該局部圖像是否滿足短路特徵或者斷路特徵,其中,所述短路特徵包括具有連接著兩根排線之直線,所述斷路特徵包括在排線上存在缺口,若滿足任意一個特徵,則判定所述缺陷為真實缺陷,否則判定所述缺陷為假點缺陷。As a first optional technical solution, re-inspecting the initially determined defect includes: extracting a local image at the defect coordinates corresponding to the initially determined defect, and judging whether the local image satisfies the short-circuit feature or the open-circuit feature, wherein all the The short-circuit feature includes a straight line connecting two cables, and the open-circuit feature includes a gap in the cable. If any one of the characteristics is satisfied, the defect is determined to be a real defect, otherwise, the defect is determined to be a false point defect.

作為第二種可選技術方案,對初步判定之缺陷進行複檢包括:提取初步判定之缺陷對應之缺陷坐標處之局部圖像,判斷該局部圖像是否同時滿足以下條件:非直線、不規則且孤立存在之圖形,若同時滿足以上特徵,則判定所述缺陷為假點缺陷。As a second optional technical solution, re-inspecting the initially determined defect includes: extracting a partial image at the defect coordinates corresponding to the initially determined defect, and judging whether the partial image satisfies the following conditions at the same time: non-linear, irregular And for an isolated figure, if the above characteristics are met at the same time, the defect is determined to be a false point defect.

作為第三種可選技術方案,對初步判定之缺陷進行複檢包括:As a third optional technical solution, the re-inspection of the initially determined defects includes:

通過數據庫服務器加載預設之若幹個缺陷模板圖像,所述缺陷模板圖像被標定為真實缺陷或假點缺陷;Load several preset defect template images through the database server, and the defect template images are marked as real defects or false point defects;

提取初步判定之缺陷對應之缺陷坐標處之局部圖像,並將其與所述缺陷模板圖像進行相似度比較,找到與之相似度最高之缺陷模板圖像;Extracting the partial image at the defect coordinates corresponding to the initially determined defect, and comparing the similarity with the defect template image to find the defect template image with the highest similarity;

若所述相似度最高之缺陷模板圖像被標定為真實缺陷,則判定該初步判定之缺陷為真實缺陷;若所述相似度最高之缺陷模板圖像被標定為假點缺陷,則判定該初步判定之缺陷為假點缺陷。If the defect template image with the highest similarity is marked as a real defect, the preliminary determined defect is determined as a real defect; if the defect template image with the highest similarity is marked as a false point defect, the preliminary determined defect is determined as a false point defect. The identified defects are false point defects.

作為第四種可選技術方案,對初步判定之缺陷進行複檢包括:提取初步判定之缺陷對應之缺陷坐標處之局部圖像,將其輸入完成訓練之神經網絡模型,根據所述神經網絡模型輸出之結果,判定所述缺陷為真實缺陷還是假點缺陷。As a fourth optional technical solution, re-inspecting the initially determined defect includes: extracting a partial image at the defect coordinate corresponding to the initially determined defect, inputting it into the trained neural network model, according to the neural network model As a result of the output, it is determined whether the defect is a real defect or a false point defect.

進一步地,對待檢測之印刷電路板進行掃描包括採用不同視角角度對PCB進行掃描,得到不同視角視圖,所述視角視圖包括二維視角視圖和三維視角視圖。Further, scanning the printed circuit board to be inspected includes scanning the PCB with different viewing angles to obtain different viewing angles, and the viewing angles include two-dimensional viewing and three-dimensional viewing.

進一步地,所述檢修設備還包括可移動之攝像裝置,所述攝像裝置能夠移動到所述印刷電路板對應缺陷列表中剩餘之缺陷坐標處,並對所述缺陷坐標處之缺陷進行放大顯示,以供進行人工檢修。Further, the maintenance equipment further includes a movable camera device, the camera device can be moved to the remaining defect coordinates in the corresponding defect list of the printed circuit board, and the defects at the defect coordinates can be enlarged and displayed, for manual maintenance.

進一步地,所述數據庫服務器之數量為一個,所述自動光學檢測設備和檢修設備之數量為多個,所述自動光學檢測設備和檢修設備之數量相同或者不同。Further, the number of the database server is one, the number of the automatic optical detection equipment and the maintenance equipment is multiple, and the number of the automatic optical detection equipment and the maintenance equipment is the same or different.

另一方面,本發明提供了一種基於假點缺陷檢測之PCB檢修方法,包括以下步驟:On the other hand, the present invention provides a PCB repair method based on false point defect detection, comprising the following steps:

對待檢測之印刷電路板進行掃描得到掃描圖像;Scan the printed circuit board to be tested to obtain a scanned image;

將其與印刷電路板之標準圖像作比較,將差異作為初步判定之缺陷並構建缺陷列表,所述缺陷列表中包含對應於所述掃描圖像之初步判定之缺陷之缺陷坐標信息;Comparing it with the standard image of the printed circuit board, taking the difference as a preliminarily determined defect and constructing a defect list, the defect list including defect coordinate information corresponding to the preliminarily determined defect of the scanned image;

對所述掃描圖像在缺陷列表中之每個缺陷坐標處之初步判定之缺陷進行一一複檢,若複檢缺陷為假點缺陷,則將該缺陷從所述缺陷列表中刪除;Rechecking the initially determined defects of the scanned image at each defect coordinate in the defect list one by one, if the rechecking defect is a false point defect, delete the defect from the defect list;

對所述印刷電路板對應缺陷列表中剩餘之缺陷坐標處之缺陷進行檢修。Repair the defects at the remaining defect coordinates in the corresponding defect list of the printed circuit board.

進一步地,對每一個初步判定之缺陷進行複檢包括以下步驟:Further, re-inspecting each preliminary determined defect includes the following steps:

提取初步判定之缺陷對應之缺陷坐標處之局部圖像,並對所述局部圖像按照以下任意一種或多種方式進行判斷:Extract the partial image at the defect coordinates corresponding to the preliminary judged defect, and judge the partial image according to any one or more of the following methods:

第一種方式為判斷該局部圖像是否滿足短路特徵或者斷路特徵,其中,所述短路特徵包括具有連接著兩根排線之直線,所述斷路特徵包括在排線上存在缺口,若滿足任意一個特徵,則判定所述缺陷為真實缺陷,否則判定所述缺陷為假點缺陷;The first way is to determine whether the local image satisfies the short-circuit feature or the open-circuit feature, wherein the short-circuit feature includes a straight line connecting two cables, and the open-circuit feature includes a gap in the cable. feature, the defect is determined to be a real defect, otherwise the defect is determined to be a false point defect;

第二種方式為判斷該局部圖像是否同時滿足以下條件:非直線、不規則且孤立存在之圖形,若同時滿足以上特徵,則判定所述缺陷為假點缺陷;The second method is to judge whether the local image meets the following conditions at the same time: non-linear, irregular and isolated graphics, if the above characteristics are met at the same time, then the defect is judged to be a false point defect;

第三種方式為將該局部圖像與預設之若幹個標定為真實缺陷或假點缺陷之缺陷模板圖像進行相似度比較,根據相似度最高之缺陷模板圖像之標定來判定所述缺陷為真實缺陷還是假點缺陷;The third method is to compare the similarity between the partial image and several preset defect template images marked as real defects or false point defects, and determine the defect according to the calibration of the defect template image with the highest similarity Whether it is a real defect or a false point defect;

第四種方式為將該局部圖像輸入至完成訓練之神經網絡模型,根據所述神經網絡模型輸出之結果,判定所述缺陷為真實缺陷還是假點缺陷。The fourth method is to input the partial image into the neural network model after training, and determine whether the defect is a real defect or a false point defect according to the output result of the neural network model.

本發明具有如下有益效果:The present invention has the following beneficial effects:

a. 將AOI檢測到之假點缺陷進行排查,排除不需要檢修之假點缺陷後再進行檢修,大大提高檢修效率;a. Investigate the false point defects detected by AOI, eliminate the false point defects that do not need maintenance, and then carry out maintenance, which greatly improves the maintenance efficiency;

b. 通過數據庫服務器將AOI與檢修設備連接,實現高效之數據傳輸;b. Connect the AOI with the maintenance equipment through the database server to achieve efficient data transmission;

c. 檢修設備設置可移動之攝像裝置,對排除假點缺陷後之真實缺陷進行定位並放大顯示,提高人工檢修效率;c. The maintenance equipment is equipped with a movable camera device to locate and magnify the real defects after eliminating the false point defects, so as to improve the efficiency of manual maintenance;

d. 多台AOI設備配置一套數據庫服務器與多台檢修設備連接,節約空間和成本。d. Multiple AOI devices are configured with one database server to connect with multiple maintenance devices, saving space and cost.

在以下詳細描述中,闡述了許多具體細節以便提供對本發明之透徹理解。然而,本領域技術人員將理解,可以在沒有這些具體細節之情況下實踐本發明。 在其他情況下,沒有詳細描述衆所周知之方法,過程和組件,以免模糊本發明。In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, one skilled in the art will understand that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures and components have not been described in detail so as not to obscure the present invention.

被視為本發明之主題在說明書之結論部分中被特別指出並清楚地主張權利。然而,當結合附圖一起參閱時,通過參考以下詳細描述可以最佳地理解本發明之組織、操作方法,以及主題、特徵和優點。The subject matter that is regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. However, the organization, method of operation, and subject matter, features, and advantages of the present invention are best understood by reference to the following detailed description, when read in conjunction with the accompanying drawings.

應當理解,為了說明之簡單和清楚,圖中所示之元件不一定按比例繪制。例如,為了清楚起見,一些元件之尺寸可能相對於其他元件被放大。It will be appreciated that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some elements may be exaggerated relative to other elements for clarity.

由於本發明之說明性實施例在很大程度上可使用本領域技術人員熟知之電子元件和電路來實施,如上文所述,在認為必要之範圍之外,不會對細節作更大之解釋,以便理解和體會本發明之基本概念,以免混淆或分散本發明之教導。Since the illustrative embodiments of the invention may be practiced to a large extent using electronic components and circuits well known to those skilled in the art, as described above, no further detail will be explained beyond what is deemed necessary , in order to understand and appreciate the basic concepts of the present invention, so as not to obscure or distract the teachings of the present invention.

本文中提供了一種基於假點缺陷檢測之PCB檢修系統,參見圖1,所述基於假點缺陷檢測之PCB檢修系統包括自動光學檢測設備(以下AOI)、數據庫服務器(data base Server)和檢修設備,所述檢修設備上配置有用於驗證假點缺陷之缺陷虛擬檢測模塊(又稱虛擬驗證檢測模塊,Virtual Verification and Repair Station,VVR),所述自動光學檢測設備、缺陷虛擬檢測模塊均與所述數據庫服務器通信連接;This paper provides a PCB repair system based on false point defect detection, see Figure 1, the PCB inspection system based on false point defect detection includes automatic optical inspection equipment (the following AOI), database server (data base Server) and maintenance equipment , a defect virtual detection module (also called virtual verification and detection module, Virtual Verification and Repair Station, VVR) for verifying false point defects is configured on the maintenance equipment, and the automatic optical detection equipment and the defect virtual detection module are all the same as the above Database server communication connection;

所述自動光學檢測設備用於對待檢測之印刷電路板進行掃描得到掃描圖像,並將其與通過數據庫服務器加載之對應標準圖像作比較,將比較得到之差異點作為初步判定之缺陷,構建缺陷列表,所述缺陷列表中包含對應於所述掃描圖像之初步判定之缺陷之缺陷坐標信息;The automatic optical inspection equipment is used to scan the printed circuit board to be inspected to obtain the scanned image, and compare it with the corresponding standard image loaded through the database server. A defect list, the defect list includes defect coordinate information corresponding to the preliminary determined defects of the scanned image;

所述數據庫服務器用於存儲所述自動光學檢測設備輸出之掃描圖像及對應之缺陷列表;The database server is used for storing the scanned images and the corresponding defect list output by the automatic optical inspection equipment;

所述檢修設備之缺陷虛擬檢測模塊能夠通過所述數據庫服務器加載掃描圖像及對應之缺陷列表,並對所述掃描圖像在缺陷列表中之每個缺陷坐標處之初步判定之缺陷進行一一複檢,若複檢缺陷為假點缺陷,則將該缺陷從所述缺陷列表中刪除,所述檢修設備對所述印刷電路板對應缺陷列表中剩餘之缺陷坐標處之缺陷進行檢修。The defect virtual detection module of the maintenance equipment can load the scanned image and the corresponding defect list through the database server, and carry out one-by-one preliminary determination of defects at each defect coordinate of the scanned image in the defect list. Re-inspection, if the re-inspection defect is a false point defect, the defect is deleted from the defect list, and the inspection equipment repairs the defects at the remaining defect coordinates in the corresponding defect list of the printed circuit board.

如圖1所示,AOI設備其在掃描PCB板後,可以得到缺陷之整體佈局圖片,並能在圖片中準確之標定對應缺陷點之坐標,在AOI設備系統中,還具有判定缺陷類型之功能,例如線路板漏焊、多焊和焊接錯誤等。與AOI 連接之是帶有 數據儲存功能之數據庫服務器,該數據庫服務器可以準確地存儲AOI掃描後輸入之信息,與數據庫服務器連接之是檢修設備之VVR系統,VVR採集數據庫服務器中對應板材之缺陷信息,通過自身之智能判定系統或者人工圖片驗視,可以準確地判斷出缺陷信息中“假點”信息和“假點”坐標信息,然後通過操作可以刪除判斷出來之“假點”信息,在刪除“假點”後,通過VVR設備上之Video移動到對應“真點”缺陷坐標位置處進行人工檢修。As shown in Figure 1, the AOI equipment can obtain the overall layout picture of the defect after scanning the PCB board, and can accurately calibrate the coordinates of the corresponding defect point in the picture. In the AOI equipment system, it also has the function of judging the type of defect , such as circuit board missing soldering, excessive soldering and soldering errors, etc. Connected with AOI is a database server with data storage function, the database server can accurately store the information input after AOI scanning, connected with the database server is the VVR system for overhauling equipment, VVR collects the defect information of the corresponding plate in the database server , Through its own intelligent judgment system or artificial picture inspection, it can accurately judge the "false point" information and "false point" coordinate information in the defect information, and then delete the judged "false point" information through operation. After the "false point", move to the corresponding "true point" defect coordinate position through the Video on the VVR device for manual inspection.

相比較之前所有之由AOI掃描出之缺陷點,均需要由單獨之檢修設備,通過人工對缺陷點逐個檢修之方法,減少了大量之工作浪費在“假點”之處理上,不僅提高了工作效率,而且避免了了人工在檢修“假點”誤判。Compared with all the defect points scanned by AOI before, all the defect points need to be repaired by a separate maintenance equipment, and the method of manually overhauling the defect points one by one reduces a lot of work wasted in the processing of "false points", which not only improves the work. Efficiency, and avoids manual misjudgment of "false points" in maintenance.

在本發明之一個優選實施例中,可採用不同視角角度對PCB進行掃描,得到不同視角視圖,比如某一對比度、飽和度、色調之二維視圖(比如圖5)或3D視覺之圖像(比如圖6),尤其如圖6所示之3D掃描視覺,可以準確地判斷出“假點”、“真點”,提高了判斷之準確性,不會出現誤刪“假點”之情況,而且還可以為後續之人工修複提供圖像參考,更加方便人工檢修。In a preferred embodiment of the present invention, different viewing angles can be used to scan the PCB to obtain different viewing angles, such as a two-dimensional view of a certain contrast, saturation, and hue (such as Figure 5) or a 3D visual image ( For example, Figure 6), especially the 3D scanning vision shown in Figure 6, can accurately determine "false points" and "true points", which improves the accuracy of judgment, and does not delete "false points" by mistake. Moreover, it can also provide image reference for subsequent manual repair, which is more convenient for manual repair.

作為第一種可選技術方案,利用排除法對初步判定之缺陷進行複檢包括:提取初步判定之缺陷對應之缺陷坐標處之局部圖像,判斷該局部圖像是否滿足短路特徵或者斷路特徵,其中,所述短路特徵包括具有連接著兩根排線之直線(如圖2所示),所述斷路特徵包括在排線上存在缺口(未圖示),若滿足任意一個特徵,則判定所述缺陷為真實缺陷,否則判定所述缺陷為假點缺陷。“假點缺陷”是在初步判定過程中被誤判為缺陷,實際不需要人工檢修,因此,需要從缺陷列表中刪除;“真實缺陷”是需要人工逐個點檢修之,如圖2中之多焊接之窄縫,會導致PCB短路,這時就需要人工將該窄縫去除。As a first optional technical solution, using the exclusion method to re-examine the initially determined defect includes: extracting a partial image at the defect coordinates corresponding to the initially determined defect, and judging whether the partial image satisfies the short-circuit feature or the open-circuit feature, Wherein, the short-circuit feature includes a straight line connecting two cables (as shown in Figure 2), and the open-circuit feature includes a gap (not shown) on the cable. If any one of the characteristics is satisfied, it is determined that the The defect is a real defect, otherwise it is determined that the defect is a false point defect. "False point defect" is misjudged as a defect in the preliminary judgment process, and does not need manual maintenance. Therefore, it needs to be deleted from the defect list; "true defect" needs to be manually repaired point by point, as shown in Figure 2. The narrow gap will lead to a short circuit of the PCB, and then the narrow gap needs to be removed manually.

作為第二種可選技術方案,利用特徵對應法對初步判定之缺陷進行複檢包括:提取初步判定之缺陷對應之缺陷坐標處之局部圖像,判斷該局部圖像是否同時滿足以下條件:非直線、不規則且孤立存在之圖形(如圖3所示),若同時滿足以上特徵,則判定所述缺陷為假點缺陷。所述“假點缺陷”可以是灰塵,汙點,或者指紋等,在PCB板材中會大量存在,在AOI掃描時候均會判定為缺陷點,若不智能排除,在後續檢修時候,將花費大量人工在這些大量之“假點缺陷”上面,本發明實施例引入VVR系統,可以大大減少該方面之時間花費。As a second optional technical solution, using the feature correspondence method to re-inspect the initially determined defect includes: extracting a partial image at the defect coordinates corresponding to the initially determined defect, and judging whether the partial image satisfies the following conditions at the same time: For straight, irregular and isolated graphics (as shown in Figure 3), if the above characteristics are met at the same time, the defect is determined to be a false point defect. The "false point defects" can be dust, stains, or fingerprints, etc., which will exist in large quantities in the PCB board, and will be judged as defect points during AOI scanning. On these large numbers of "false point defects", the embodiment of the present invention introduces a VVR system, which can greatly reduce the time spent in this aspect.

作為第三種可選技術方案,利用相似度匹配法對初步判定之缺陷進行複檢包括:As a third optional technical solution, using the similarity matching method to re-examine the initially determined defects includes:

通過數據庫服務器加載預設之若幹個缺陷模板圖像,所述缺陷模板圖像被標定為真實缺陷或假點缺陷;Load several preset defect template images through the database server, and the defect template images are marked as real defects or false point defects;

提取初步判定之缺陷對應之缺陷坐標處之局部圖像,並將其與所述缺陷模板圖像進行相似度比較,找到與之相似度最高之缺陷模板圖像;Extracting the partial image at the defect coordinates corresponding to the initially determined defect, and comparing the similarity with the defect template image to find the defect template image with the highest similarity;

若所述相似度最高之缺陷模板圖像被標定為真實缺陷,則判定該初步判定之缺陷為真實缺陷;若所述相似度最高之缺陷模板圖像被標定為假點缺陷,則判定該初步判定之缺陷為假點缺陷。If the defect template image with the highest similarity is marked as a real defect, the preliminary determined defect is determined as a real defect; if the defect template image with the highest similarity is marked as a false point defect, the preliminary determined defect is determined as a false point defect. The identified defects are false point defects.

作為第四種可選技術方案,對初步判定之缺陷進行複檢包括:提取初步判定之缺陷對應之缺陷坐標處之局部圖像,將其輸入完成訓練之神經網絡模型,根據所述神經網絡模型輸出之結果,判定所述缺陷為真實缺陷還是假點缺陷。其中,所述神經網絡模型可採用現有技術中之深度神經網絡,結合反向傳播算法及隨機梯度下降法對該神經網絡進行訓練。神經網絡在圖像識別領域的應用為現有技術,神經網絡的具體模型及相關算法本身可以理解為採用現有技術。As a fourth optional technical solution, re-inspecting the initially determined defect includes: extracting a partial image at the defect coordinate corresponding to the initially determined defect, inputting it into the trained neural network model, according to the neural network model As a result of the output, it is determined whether the defect is a real defect or a false point defect. Wherein, the neural network model can be a deep neural network in the prior art, and the neural network can be trained in combination with a back-propagation algorithm and a stochastic gradient descent method. The application of the neural network in the field of image recognition is the prior art, and the specific model of the neural network and the related algorithm itself can be understood as adopting the prior art.

需要說明的是,為了進壹步提高假點缺陷的檢測準確性,以上四種對初步判定之缺陷進行複檢的技術方案可以組合使用,比如使用第壹種和第三種技術方案的結合,只有兩者均判定當前缺陷為假點缺陷,才可以將當前缺陷作為假點缺陷進而從缺陷列表中將其刪除。It should be noted that, in order to further improve the detection accuracy of false point defects, the above four technical solutions for re-inspecting the initially determined defects can be used in combination, such as using the combination of the first and third technical solutions, Only when both determine that the current defect is a false point defect, the current defect can be regarded as a false point defect and then deleted from the defect list.

甚至可以將四種技術方案組合起來判斷當前缺陷是真實缺陷還是假點缺陷。顯然,若四種技術方案的判斷結果均為假點缺陷,則當前缺陷為假點缺陷的判定準確性即大大提高;或者,四種技術方案的判斷結果中至少三種(或兩種)判定為假點缺陷,則將當前缺陷作為假點缺陷進而從缺陷列表中將其刪除。It is even possible to combine the four technical solutions to judge whether the current defect is a real defect or a false point defect. Obviously, if the judgment results of the four technical solutions are all false point defects, the accuracy of the judgment that the current defect is a false point defect is greatly improved; or, at least three (or two) of the judgment results of the four technical solutions are judged as If there is a false point defect, the current defect is regarded as a false point defect and then deleted from the defect list.

在本發明之一個優選實施例中,所述檢修設備還包括可移動之攝像裝置,所述攝像裝置能夠移動到所述印刷電路板對應缺陷列表中剩餘之缺陷坐標處,並對所述缺陷坐標處之缺陷進行放大顯示,以供進行人工檢修。在本實施例中,所述攝像裝置有兩個作用,第一是移動到當前待檢修之缺陷之相對位置處,以提示檢修人員對攝像裝置當前相對位置處之PCB進行檢修,避免漏檢修;第二是攝像裝置能夠對當前缺陷區域進行高倍率放大顯示,以使檢修人員清楚、快速地確定當前要檢修之缺陷,避免誤檢修。In a preferred embodiment of the present invention, the maintenance equipment further includes a movable camera device, the camera device can move to the remaining defect coordinates in the corresponding defect list of the printed circuit board, and monitor the defect coordinates The defects at the place are enlarged and displayed for manual maintenance. In this embodiment, the camera device has two functions. The first is to move to the relative position of the defect to be repaired, so as to prompt the maintenance personnel to repair the PCB at the current relative position of the camera device to avoid missed repairs; The second is that the camera device can magnify and display the current defective area at a high magnification, so that the maintenance personnel can clearly and quickly determine the current defect to be repaired and avoid wrong inspection.

在本發明之一個優選實施例中,如圖4所示,所述數據庫服務器之數量為一個,所述自動光學檢測設備和檢修設備之數量為多個。為多台AOI設備配置一套數據庫服務器與多台VVR系統連接,數據庫服務器在客戶處可以只使用一套即可,其可以配合多台AOI與VVR同時工作,數據庫服務器不僅可以收集單片或者多片PCB缺陷信息,還可以收集多台AOI掃描PCB缺陷信息,這樣通過一套數據庫服務器就可以工作之系統可以節省客戶處之空間和成本。顯然,若所述自動光學檢測設備和/或檢修設備同樣僅為壹臺的情況同樣屬於本發明主張的保護範圍,多臺自動光學檢測設備和檢修設備僅為優選實施例,而非必要限定,對於多臺自動光學檢測設備和檢修設備的情況,兩者數量可以不同,即兩者之間不壹定存在壹壹對應的關聯。In a preferred embodiment of the present invention, as shown in FIG. 4 , the number of the database server is one, and the number of the automatic optical inspection equipment and the maintenance equipment is multiple. Configure a set of database server for multiple AOI devices to connect with multiple VVR systems. The database server can only use one set at the customer. It can work with multiple AOIs and VVRs at the same time. The database server can not only collect single or multiple Piece PCB defect information, can also collect multiple AOI scanning PCB defect information, so that a system that can work through a database server can save space and cost for customers. Obviously, if the automatic optical detection equipment and/or maintenance equipment is only one set, it also belongs to the protection scope claimed by the present invention, and multiple automatic optical detection equipment and maintenance equipment are only preferred embodiments, and are not necessarily limited. For the case of multiple automatic optical inspection equipment and maintenance equipment, the number of the two can be different, that is, there is not necessarily a corresponding relationship between the two.

在本發明之一個實施例中,提供了一種基於假點缺陷檢測之PCB檢修方法,如圖7所示,所述檢修方法包括以下步驟:In one embodiment of the present invention, a PCB repair method based on false point defect detection is provided, as shown in FIG. 7 , the repair method includes the following steps:

S1、對待檢測之印刷電路板進行掃描得到掃描圖像;S1. Scan the printed circuit board to be tested to obtain a scanned image;

S2、將其與印刷電路板之標準圖像作比較,將差異作為初步判定之缺陷並構建缺陷列表,所述缺陷列表中包含對應於所述掃描圖像之初步判定之缺陷之缺陷坐標信息;S2, compare it with the standard image of the printed circuit board, take the difference as a preliminary judged defect and construct a defect list, the defect list contains the defect coordinate information corresponding to the preliminary judged defect of the scanned image;

S3、開始遍曆缺陷列表,比如按序對第一個缺陷坐標處之初步判定之缺陷進行複檢;S3. Start traversing the defect list, such as re-inspecting the initially determined defects at the coordinates of the first defect in sequence;

S4、若複檢之結果為該缺陷為假點缺陷,則執行S5,否則執行S6;S4. If the result of the re-inspection is that the defect is a false point defect, execute S5; otherwise, execute S6;

S5、將複檢得到之假點缺陷從所述缺陷列表中刪除;S5, delete the false point defect obtained by rechecking from the defect list;

S6、判斷是否完成對缺陷列表中之缺陷之遍曆,若完成,執行S7,否則,遍曆缺陷列表中之下一個缺陷坐標處之缺陷並繼續執行S4;S6, determine whether to complete the traversal of the defects in the defect list, if completed, execute S7, otherwise, traverse the defect at the next defect coordinate in the defect list and continue to execute S4;

S7、對所述印刷電路板對應缺陷列表中剩餘之缺陷坐標處之缺陷進行檢修。S7, repair the defects at the remaining defect coordinates in the corresponding defect list of the printed circuit board.

如上述實施例所述,對每一個初步判定之缺陷進行複檢包括以下步驟:As described in the above embodiment, the re-inspection of each initially determined defect includes the following steps:

提取初步判定之缺陷對應之缺陷坐標處之局部圖像,並對所述局部圖像按照以下任意一種或多種方式進行判斷:Extract the partial image at the defect coordinates corresponding to the preliminary judged defect, and judge the partial image according to any one or more of the following methods:

第一種方式為判斷該局部圖像是否滿足短路特徵或者斷路特徵,其中,所述短路特徵包括具有連接著兩根排線之直線,所述斷路特徵包括在排線上存在缺口,若滿足任意一個特徵,則判定所述缺陷為真實缺陷,否則判定所述缺陷為假點缺陷;The first way is to determine whether the local image satisfies the short-circuit feature or the open-circuit feature, wherein the short-circuit feature includes a straight line connecting two cables, and the open-circuit feature includes a gap in the cable. feature, the defect is determined to be a real defect, otherwise the defect is determined to be a false point defect;

第二種方式為判斷該局部圖像是否同時滿足以下條件:非直線、不規則且孤立存在之圖形,若同時滿足以上特徵,則判定所述缺陷為假點缺陷;The second method is to judge whether the local image meets the following conditions at the same time: non-linear, irregular and isolated graphics, if the above characteristics are met at the same time, then the defect is judged to be a false point defect;

第三種方式為將該局部圖像與預設之若幹個標定為真實缺陷或假點缺陷之缺陷模板圖像進行相似度比較,根據相似度最高之缺陷模板圖像之標定來判定所述缺陷為真實缺陷還是假點缺陷;The third method is to compare the similarity between the partial image and several preset defect template images marked as real defects or false point defects, and determine the defect according to the calibration of the defect template image with the highest similarity Whether it is a real defect or a false point defect;

第四種方式為將該局部圖像輸入至完成訓練之神經網絡模型,根據所述神經網絡模型輸出之結果,判定所述缺陷為真實缺陷還是假點缺陷。The fourth method is to input the partial image into the neural network model after training, and determine whether the defect is a real defect or a false point defect according to the output result of the neural network model.

以上四種方式參見上述系統實施例詳述,按照多種方式進行判斷的方法也參見上述系筒實施例中關於四種技術方案可組合以判定的具體說明,在此不再贅述。The above four methods refer to the detailed description of the above-mentioned system embodiments, and the method for determining according to various methods also refers to the specific descriptions that the four technical solutions can be combined to determine in the above-mentioned barrel embodiments, which will not be repeated here.

本發明是將AOI檢測後之缺陷坐標、掃描圖像(優選地,還包括缺陷之預判類型)通過數據庫服務器連接在檢修設備上,該檢修設備上同時配置有高端之缺陷虛擬檢測模塊,通過該缺陷虛擬檢測模塊自動篩選缺陷點,該系統將所有之灰階缺陷圖像(有缺陷之掃描圖像)分類為“真實”,或者“假”,“假”缺陷被刪除,該“假”缺陷可能為灰塵、汙垢等,從而可以從檢修缺陷列表中刪除;或者通過人工驗視AOI所提供之灰階缺陷圖,將假之缺陷從檢修缺陷列表中刪除。然後“真實”之缺陷將被通過攝像機放大,並通過人工進行驗收,從而可以節省檢修設備對“假”缺陷點進行檢測時間。實現工業4.0之轉變,不僅節省了大量人工檢修時間,減少了人力成本,而且還降低了人工之誤判之概率。In the present invention, the defect coordinates and scanned images (preferably, including the prediction type of the defect) after AOI detection are connected to the maintenance equipment through the database server, and the maintenance equipment is also equipped with a high-end defect virtual detection module. The defect virtual detection module automatically filters defect points, the system classifies all gray-scale defect images (defective scanned images) as "true", or "false", "false" defects are deleted, the "false" Defects may be dust, dirt, etc., so they can be deleted from the maintenance defect list; or by manually inspecting the gray-scale defect map provided by AOI, false defects can be deleted from the maintenance defect list. Then the "real" defects will be magnified by the camera and checked manually, which can save the inspection time of the maintenance equipment for the "false" defect points. Realizing the transformation of Industry 4.0 not only saves a lot of manual maintenance time and labor costs, but also reduces the probability of manual misjudgment.

本發明將AOI檢測到之假點缺陷進行排查,排除不需要檢修之假點缺陷後再進行檢修,大大提高檢修效率;通過數據庫服務器將AOI與檢修設備連接,實現高效之數據傳輸;檢修設備設置可移動之攝像裝置,對排除假點缺陷後之真實缺陷進行定位並放大顯示,提高人工檢修效率;多台AOI設備配置一套數據庫服務器與多台檢修設備連接,節約空間和成本。The present invention checks the false point defects detected by the AOI, removes the false point defects that do not need maintenance, and then performs the maintenance, thereby greatly improving the maintenance efficiency; the AOI is connected with the maintenance equipment through the database server to realize efficient data transmission; the maintenance equipment is set The movable camera device locates and magnifies the real defects after eliminating the false point defects, improving the efficiency of manual maintenance; multiple AOI equipments are equipped with a database server to connect with multiple maintenance equipments, saving space and cost.

此外,本領域技術人員將意識到,上述操作之間之界限僅為示例性。多個操作可以合並為單個操作,單個操作可以分佈於額外操作中,且可在至少部分重疊之時間下執行操作。此外,可選實施例可包括特定操作之多個舉例說明,並且操作順序可在各種其他實施例中變化。Furthermore, those skilled in the art will appreciate that the boundaries between the operations described above are exemplary only. Multiple operations may be combined into a single operation, a single operation may be distributed among additional operations, and operations may be performed at at least partially overlapping times. Furthermore, alternative embodiments may include multiple illustrations of particular operations, and the order of operations may vary in various other embodiments.

然而,其他修改、變化及替代也是可能的。因此,應在示例性意義上而非限制性意義上看待說明書及附圖。However, other modifications, changes and substitutions are also possible. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.

在申請專利範圍聲明中,置於圓括號之間任何參考符號不應被視為限制請求項。詞語“包括”並不排除那些列在申請專利範圍聲明中之其他元件或步驟之存在。此外,本文所使用之術語“一”或“一個”,被定義為一個或多於一個。除非另有說明,否則諸如“第一”和“第二”之類之術語用於任意區分這些術語所描述之元素。因此,這些術語不一定旨在表示這些元素之時間或其他優先級。在彼此不同之申請專利範圍中敘述某些措施之僅有事實並不表示這些措施之組合不能加以利用。In the claim statement, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of other elements or steps listed in the claim statement. Also, the terms "a" or "an" as used herein are defined as one or more than one. Unless stated otherwise, terms such as "first" and "second" are used to arbitrarily distinguish between the elements these terms describe. Accordingly, these terms are not necessarily intended to denote the timing or other priority of these elements. The mere fact that certain measures are recited in mutually different claims does not mean that a combination of these measures cannot be used.

雖然本文已經說明和描述了本發明之某些特徵,但是本領域普通技術人員現在將想到許多修改、替換、改變和等同物。因此,應該理解,所附申請專利範圍旨在覆蓋落入本發明之真正精神內之所有這些修改和變化。While certain features of the invention have been illustrated and described herein, many modifications, substitutions, changes and equivalents will now occur to those of ordinary skill in the art. Therefore, it should be understood that the scope of the appended claims is intended to cover all such modifications and changes as fall within the true spirit of this invention.

without

被視為本發明之主題在說明書之結論部分中被特別指出並清楚地主張權利。然而,當結合附圖一起參閱時,通過參考以下詳細描述可以最佳地理解本發明之組織、操作方法,以及主題、特徵和優點,其中: 圖1是本發明實施例提供之基於假點缺陷檢測之PCB檢修系統之結構示意圖; 圖2是本發明實施例提供之真實短路缺陷掃描圖像之特徵示意圖; 圖3是本發明實施例提供之假點缺陷掃描圖像之特徵示意圖; 圖4是本發明實施例提供之多AOI、多VVR對應單數據庫服務器之結構示意圖; 圖5是本發明實施例提供之採用二維視角掃描PCB得到之二維視角視圖; 圖6是本發明實施例提供之採用三維視角掃描PCB得到之三維視角視圖; 圖7是本發明實施例提供之基於假點缺陷檢測之PCB檢修方法之流程圖。The subject matter that is regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. However, the organization, method of operation, and subject matter, features, and advantages of the present invention are best understood by reference to the following detailed description when read in conjunction with the accompanying drawings, wherein: 1 is a schematic structural diagram of a PCB inspection system based on false point defect detection provided by an embodiment of the present invention; FIG. 2 is a characteristic schematic diagram of a real short-circuit defect scanning image provided by an embodiment of the present invention; 3 is a characteristic schematic diagram of a false point defect scanning image provided by an embodiment of the present invention; 4 is a schematic structural diagram of a single database server corresponding to multiple AOIs and multiple VVRs provided by an embodiment of the present invention; 5 is a two-dimensional perspective view obtained by scanning a PCB with a two-dimensional perspective provided by an embodiment of the present invention; 6 is a three-dimensional perspective view obtained by scanning a PCB with a three-dimensional perspective provided by an embodiment of the present invention; FIG. 7 is a flowchart of a PCB repair method based on false point defect detection according to an embodiment of the present invention.

本代表圖為流程圖,故無符號簡單說明 This representative picture is a flow chart, so there is no symbol for simple description

Claims (2)

一種基於假點缺陷檢測之PCB檢修系統,其特徵在於,包括自動光學檢測設備、數據庫服務器和檢修設備,所述檢修設備上配置有用於驗證假點缺陷之缺陷虛擬檢測模塊,所述自動光學檢測設備、缺陷虛擬檢測模塊均與所述數據庫服務器通信連接,所述數據庫服務器之數量為一個,所述自動光學檢測設備和檢修設備之數量為多個,所述自動光學檢測設備和檢修設備之數量相同或者不同;所述自動光學檢測設備用於對待檢測之印刷電路板進行掃描得到掃描圖像,包括採用不同視角角度對PCB進行掃描,得到不同視角視圖,所述視角視圖包括二維視角視圖和三維視角視圖,所述自動光學檢測設備在掃描印刷電路板後,得到缺陷之整體佈局圖片,並能在圖片中準確之標定對應缺陷點之坐標;並將其與通過數據庫服務器加載之對應標準圖像作比較,以構建缺陷列表,所述缺陷列表中包含對應於所述掃描圖像之初步判定之缺陷之缺陷坐標信息;所述數據庫服務器用於存儲所述自動光學檢測設備輸出之掃描圖像及對應之缺陷列表;所述檢修設備之缺陷虛擬檢測模塊能夠通過所述數據庫服務器加載掃描圖像及對應之缺陷列表,並對所述掃描圖像在缺陷列表中之每個缺陷坐標處之初步判定之缺陷進行一一複檢,所述檢修設備還包括可移動之攝像裝置,若複檢缺陷為假點缺陷,則將 該缺陷從所述缺陷列表中刪除,所述檢修設備對所述印刷電路板對應缺陷列表中剩餘之缺陷坐標處之缺陷進行檢修,所述攝像裝置能夠移動到所述印刷電路板對應缺陷列表中剩餘之缺陷坐標處,並對所述缺陷坐標處之缺陷進行放大顯示,以供進行人工檢修;其中,對初步判定之缺陷進行一一複檢包括:組合使用以下任意兩種或三種或四種判斷方式,至少有兩種方式判定當前缺陷為假點缺陷,才可以將當前缺陷作為假點缺陷進而從缺陷列表中將其刪除:第一種方式為提取初步判定之缺陷對應之缺陷坐標處之局部圖像,判斷該局部圖像是否滿足短路特徵或者斷路特徵,其中,所述短路特徵包括具有連接著兩根排線之直線,所述斷路特徵包括在排線上存在缺口,若滿足任意一個特徵,則判定所述缺陷為真實缺陷,否則判定所述缺陷為假點缺陷;第二種方式為提取初步判定之缺陷對應之缺陷坐標處之局部圖像,判斷該局部圖像是否同時滿足以下條件:非直線、不規則且孤立存在之圖形,若同時滿足以上特徵,則判定所述缺陷為假點缺陷;第三種方式為通過數據庫服務器加載預設之若幹個缺陷模板圖像,所述缺陷模板圖像被標定為真實缺陷或假點缺陷;提取初步判定之缺陷對應之缺陷坐標處之局部圖像,並將其與所述缺陷模板圖像進行相似度比較,找到與之相似度最高之缺陷模板圖像;若所述相似度最高之缺陷模板圖像被標定為真實缺陷,則判定該初步判定之缺陷為真實缺陷;若所述相似度最高之缺陷模板圖像被標定為假點缺陷,則判定該初步判定之缺陷為假點 缺陷;第四種方式為提取初步判定之缺陷對應之缺陷坐標處之局部圖像,將其輸入完成訓練之神經網絡模型,根據所述神經網絡模型輸出之結果,判定所述缺陷為真實缺陷還是假點缺陷。 A PCB repair system based on false point defect detection is characterized in that it includes automatic optical inspection equipment, a database server and repair equipment, the inspection equipment is equipped with a defect virtual detection module for verifying false point defects, and the automatic optical inspection The equipment and the virtual defect detection module are all connected in communication with the database server, the number of the database server is one, the number of the automatic optical detection equipment and the maintenance equipment is multiple, and the number of the automatic optical detection equipment and the maintenance equipment is The same or different; the automatic optical inspection equipment is used for scanning the printed circuit board to be inspected to obtain a scanned image, including scanning the PCB with different viewing angles to obtain different viewing angles, and the viewing angles include two-dimensional viewing and Three-dimensional perspective view, after the automatic optical inspection equipment scans the printed circuit board, the overall layout picture of the defect can be obtained, and the coordinates of the corresponding defect point can be accurately calibrated in the picture; and the corresponding standard image loaded through the database server The image is compared to construct a defect list, the defect list contains defect coordinate information corresponding to the preliminary determined defects of the scanned image; the database server is used for storing the scanned image output by the automatic optical inspection device and the corresponding defect list; the defect virtual detection module of the maintenance equipment can load the scanned image and the corresponding defect list through the database server, and perform a preliminary analysis of the scanned image at each defect coordinate in the defect list. The determined defects are re-inspected one by one. The maintenance equipment also includes a movable camera device. If the re-inspected defects are false point defects, the The defect is deleted from the defect list, the inspection equipment repairs the defects at the remaining defect coordinates in the defect list corresponding to the printed circuit board, and the camera device can be moved to the defect list corresponding to the printed circuit board. At the remaining defect coordinates, the defects at the said defect coordinates are enlarged and displayed for manual maintenance; wherein, the re-inspection of the initially determined defects includes: combining any two, three or four of the following Judgment method, there are at least two ways to judge the current defect as a false point defect, and then the current defect can be regarded as a false point defect and then deleted from the defect list: the first method is to extract the defect coordinates corresponding to the defect in the preliminary judgment. A partial image to determine whether the partial image satisfies the short-circuit feature or the open-circuit feature, wherein the short-circuit feature includes a straight line connecting two cables, and the open-circuit feature includes a gap in the cable. If any one of the characteristics is satisfied , then it is determined that the defect is a real defect, otherwise it is determined that the defect is a false point defect; the second method is to extract the local image at the defect coordinates corresponding to the defect that is initially determined, and determine whether the local image satisfies the following conditions at the same time : Non-straight, irregular and isolated graphics. If the above characteristics are met at the same time, the defect is determined to be a false point defect; the third method is to load several preset defect template images through the database server. The template image is marked as a real defect or a false point defect; extract the local image at the defect coordinates corresponding to the initially determined defect, and compare it with the defect template image to find the one with the highest similarity. Defect template image; if the defect template image with the highest similarity is marked as a real defect, the initially determined defect is determined as a real defect; if the defect template image with the highest similarity is marked as a false point defect , the defect of the preliminary judgment is determined to be a false point The fourth method is to extract the local image at the defect coordinates corresponding to the initially determined defect, input it into the trained neural network model, and determine whether the defect is a real defect or a real defect according to the output of the neural network model False point defect. 一種基於假點缺陷檢測之PCB檢修方法,其特徵在於,包括以下步驟:對待檢測之印刷電路板進行掃描得到掃描圖像,包括採用不同視角角度對PCB進行掃描,得到不同視角視圖,所述視角視圖包括二維視角視圖和三維視角視圖,在掃描印刷電路板後,得到缺陷之整體佈局圖片,並能在圖片中準確之標定對應缺陷點之坐標;將其與印刷電路板之標準圖像作比較,將差異作為初步判定之缺陷並構建缺陷列表,所述缺陷列表中包含對應於所述掃描圖像之初步判定之缺陷之缺陷坐標信息;對所述掃描圖像在缺陷列表中之每個缺陷坐標處之初步判定之缺陷進行一一複檢,若複檢缺陷為假點缺陷,則將該缺陷從所述缺陷列表中刪除;對所述印刷電路板對應缺陷列表中剩餘之缺陷坐標處之缺陷進行檢修,檢修過程中利用攝像裝置移動到所述印刷電路板對應缺陷列表中剩餘之缺陷坐標處,並對所述缺陷坐標處之缺陷進行放大顯示,以供進行人工檢修;其中,對初步判定之缺陷進行一一複檢包括:組合使用以下任意兩種 或三種或四種判斷方式,至少有兩種方式判定當前缺陷為假點缺陷,才可以將當前缺陷作為假點缺陷進而從缺陷列表中將其刪除:第一種方式為提取初步判定之缺陷對應之缺陷坐標處之局部圖像,判斷該局部圖像是否滿足短路特徵或者斷路特徵,其中,所述短路特徵包括具有連接著兩根排線之直線,所述斷路特徵包括在排線上存在缺口,若滿足任意一個特徵,則判定所述缺陷為真實缺陷,否則判定所述缺陷為假點缺陷;第二種方式為提取初步判定之缺陷對應之缺陷坐標處之局部圖像,判斷該局部圖像是否同時滿足以下條件:非直線、不規則且孤立存在之圖形,若同時滿足以上特徵,則判定所述缺陷為假點缺陷;第三種方式為通過數據庫服務器加載預設之若幹個缺陷模板圖像,所述缺陷模板圖像被標定為真實缺陷或假點缺陷;提取初步判定之缺陷對應之缺陷坐標處之局部圖像,並將其與所述缺陷模板圖像進行相似度比較,找到與之相似度最高之缺陷模板圖像;若所述相似度最高之缺陷模板圖像被標定為真實缺陷,則判定該初步判定之缺陷為真實缺陷;若所述相似度最高之缺陷模板圖像被標定為假點缺陷,則判定該初步判定之缺陷為假點缺陷;第四種方式為提取初步判定之缺陷對應之缺陷坐標處之局部圖像,將其輸入完成訓練之神經網絡模型,根據所述神經網絡模型輸出之結果,判定所述缺陷為真實缺陷還是假點缺陷。A method for overhauling a PCB based on false point defect detection is characterized in that it includes the following steps: scanning a printed circuit board to be detected to obtain a scanned image, including scanning the PCB with different viewing angles to obtain views of different viewing angles, and the viewing angles are The view includes two-dimensional view and three-dimensional view. After scanning the printed circuit board, a picture of the overall layout of the defect can be obtained, and the coordinates of the corresponding defect point can be accurately calibrated in the picture; it is compared with the standard image of the printed circuit board. comparing, taking the difference as a preliminary judged defect and constructing a defect list, the defect list including the defect coordinate information corresponding to the preliminary judged defect of the scanned image; for each of the scanned image in the defect list The preliminary determined defects at the defect coordinates are re-inspected one by one. If the re-inspection defect is a false point defect, the defect is deleted from the defect list; the remaining defect coordinates in the corresponding defect list of the printed circuit board are During the maintenance process, the camera device is used to move to the remaining defect coordinates in the corresponding defect list of the printed circuit board, and the defects at the defect coordinates are enlarged and displayed for manual maintenance; The one-by-one re-inspection of the initially determined defects includes: using any two of the following in combination Or three or four judgment methods, there are at least two methods to determine the current defect as a false point defect, and then the current defect can be regarded as a false point defect and then deleted from the defect list: The first method is to extract the corresponding defects of the preliminary judgment. The local image at the defect coordinates is determined to determine whether the local image satisfies the short-circuit feature or the open-circuit feature, wherein the short-circuit feature includes a straight line connecting two cables, and the open-circuit feature includes a gap in the cable, If any one of the characteristics is satisfied, the defect is determined to be a real defect, otherwise, the defect is determined to be a false point defect; the second method is to extract the local image at the defect coordinates corresponding to the initially determined defect, and determine the local image. Whether the following conditions are met at the same time: non-linear, irregular and isolated graphics, if the above characteristics are met at the same time, the defect is determined to be a false point defect; the third method is to load several preset defect template images through the database server image, the defect template image is marked as a real defect or a false point defect; extract the local image at the defect coordinates corresponding to the defect that is initially determined, and compare it with the defect template image to find the The defect template image with the highest similarity; if the defect template image with the highest similarity is marked as a real defect, the preliminary determined defect is determined as a real defect; if the defect template image with the highest similarity is marked as a real defect If it is marked as a false point defect, it is determined that the preliminary judgment defect is a false point defect; the fourth method is to extract the local image at the defect coordinates corresponding to the preliminary judgment defect, and input it into the neural network model that has completed the training. According to the output result of the neural network model, it is determined whether the defect is a real defect or a false point defect.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI786894B (en) * 2021-10-20 2022-12-11 國立清華大學 Detection method

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111353983B (en) * 2020-02-28 2023-05-23 腾讯科技(深圳)有限公司 Defect detection identification method, device, computer readable medium and electronic equipment
CN111768371A (en) * 2020-06-05 2020-10-13 上海展华电子(南通)有限公司 AOI intelligent maintenance method and device, computer equipment and storage medium
CN111707677A (en) * 2020-06-24 2020-09-25 江西景旺精密电路有限公司 PCB appearance detection method and device
CN111812118A (en) * 2020-06-24 2020-10-23 阿丘机器人科技(苏州)有限公司 PCB detection method, device, equipment and computer readable storage medium
CN111808367B (en) * 2020-07-09 2023-05-30 浙江七色鹿色母粒有限公司 Improvement method for plastic PPR silver grain whitening defect
CN114441554B (en) * 2020-11-06 2023-09-29 李明苍 Detection method
KR20230078729A (en) * 2020-11-18 2023-06-02 심스 쑤저우 컴퍼니 리미티드 Printed circuit board remote optical maintenance method and system
CN112415973B (en) * 2020-11-24 2022-05-17 广州广合科技股份有限公司 Intelligent control method and system for inner layer AOI (automated optical inspection) process
CN113012097B (en) * 2021-01-19 2023-12-29 富泰华工业(深圳)有限公司 Image rechecking method, computer device and storage medium
CN112964737A (en) * 2021-02-04 2021-06-15 鼎勤科技(深圳)有限公司 Double-sided appearance detection method of circuit board
CN113032919B (en) * 2021-03-12 2022-03-04 奥特斯科技(重庆)有限公司 Component carrier manufacturing method, processing system, computer program and system architecture
CN113538341B (en) * 2021-03-31 2024-04-30 联合汽车电子有限公司 Automatic optical detection assisting method, device and storage medium
TWI745256B (en) * 2021-04-12 2021-11-01 南亞塑膠工業股份有限公司 Operation management system
CN113138529B (en) * 2021-04-23 2024-04-09 成都路维光电有限公司 Mask defect detection method and system based on AOI system
CN113030123B (en) * 2021-05-27 2021-08-24 安福得鑫智能设备有限公司 AOI detection feedback system based on Internet of things
CN113609897A (en) * 2021-06-23 2021-11-05 阿里巴巴新加坡控股有限公司 Defect detection method and defect detection system
CN113554626A (en) * 2021-07-26 2021-10-26 朗华全能自控设备(上海)股份有限公司 Method and device for detecting defects of flexible circuit board
CN114494131A (en) * 2021-12-24 2022-05-13 深圳英博达智能科技有限公司 Method for detecting defects of salient points on ink surface of PCB
CN114280079A (en) * 2021-12-27 2022-04-05 昆山柏特电子有限公司 Improvement method of AOI test process for printed circuit board production
CN114782431B (en) * 2022-06-20 2022-10-14 苏州康代智能科技股份有限公司 Printed circuit board defect detection model training method and defect detection method
CN115063286B (en) * 2022-08-08 2022-11-25 江苏时代新能源科技有限公司 Detection system and image processing method
CN115754670B (en) * 2022-11-15 2023-07-18 广东炬森智能装备有限公司 Repairing and rechecking method and device for short circuit defect of PCB
CN116967615B (en) * 2023-07-31 2024-04-12 上海感图网络科技有限公司 Circuit board reinspection marking method, device, equipment and storage medium
CN117372368A (en) * 2023-10-17 2024-01-09 苏州真目人工智能科技有限公司 Appearance detection device and method based on cascade closed-loop deep learning algorithm
CN117409261B (en) * 2023-12-14 2024-02-20 成都数之联科技股份有限公司 Element angle classification method and system based on classification model

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200732653A (en) * 2005-10-21 2007-09-01 Orbotech Ltd Apparatus and method for use in automatically inspecting and repairing prined circuit boards, and apparatus for use in automatically marking printed circuit boards
CN109060817A (en) * 2018-05-24 2018-12-21 牧德科技股份有限公司 Artificial intelligence reinspection system and method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1955717B (en) * 2000-09-10 2011-04-20 奥博泰克有限公司 Reducing of error alarm in PCB detection
JP2003344309A (en) * 2002-05-30 2003-12-03 Olympus Optical Co Ltd Method of setting parameter for inspection equipment
US20080002874A1 (en) * 2006-06-29 2008-01-03 Peter Fiekowsky Distinguishing reference image errors in optical inspections
CN201440128U (en) * 2009-07-13 2010-04-21 北京航星科技有限公司 Automatic optical detection system for PCB defect detection
CN103926254A (en) * 2014-05-08 2014-07-16 康代影像科技(苏州)有限公司 Statistical system and method used for PCB defect detection
CN106897994A (en) * 2017-01-20 2017-06-27 北京京仪仪器仪表研究总院有限公司 A kind of pcb board defect detecting system and method based on layered image
CN107093174B (en) * 2017-04-05 2018-03-27 湖北工业大学 A kind of PCB design defect inspection method
CN207908385U (en) * 2017-12-13 2018-09-25 深圳市光速达机器人科技有限公司 A kind of pcb board weld defect self-checking system that view-based access control model is differentiated
CN110006903A (en) * 2018-01-05 2019-07-12 皓琪科技股份有限公司 Printed circuit board rechecks system, marker method and reinspection method
CN109752392B (en) * 2018-12-24 2021-08-03 苏州江奥光电科技有限公司 PCB defect type detection system and method
CN109936927A (en) * 2019-04-10 2019-06-25 奥蒂玛光学科技(深圳)有限公司 Circuit board renovation method and system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200732653A (en) * 2005-10-21 2007-09-01 Orbotech Ltd Apparatus and method for use in automatically inspecting and repairing prined circuit boards, and apparatus for use in automatically marking printed circuit boards
CN109060817A (en) * 2018-05-24 2018-12-21 牧德科技股份有限公司 Artificial intelligence reinspection system and method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI786894B (en) * 2021-10-20 2022-12-11 國立清華大學 Detection method

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