TWI733597B - Electronic device - Google Patents

Abstract

An electronic device includes a device body, an air outlet structure and a heat dissipation module. The air outlet structure is connected to the device body and has a first air outlet surface and a second air outlet surface not parallel to each other. The air outlet structure includes a plurality of first pillar portions at the first air outlet surface and includes a plurality of second pillar portions at the second air outlet surface. The first pillar portions are arranged with intervals to form a plurality of first openings, and the second pillar portions are arranged with intervals to form a plurality of second openings. An inner surface of at least one of the first pillar portions includes a first convex surface or an inner surface of at least one of the second pillar portions includes a second convex surface. The heat dissipation module is disposed in the device body and is adapted to provide a dissipation airflow. The dissipation airflow passes through the first openings and the second openings to flow out of the device body.

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device including a heat dissipation module.

Most notebook computers use cooling fans and cooling fin sets to dissipate heat. The cooling airflow provided by the cooling fans can move the heat of the cooling fins to the outside of the body. However, as the performance of notebook computers continues to increase, especially for graphics or gaming-oriented models, their heat dissipation requirements have increased significantly. In order to improve the heat dissipation capacity, the most common way is to increase the speed of the cooling fan. However, the noise generated by this action causes users to be troubled. In addition, increasing the area of the heat dissipation fins can also improve the heat dissipation capacity, but the larger the area of the heat dissipation fins, the greater the noise generated by the heat dissipation airflow hitting the heat dissipation fins.

The invention provides an electronic device, which can reduce the noise generated by a heat dissipation module.

The electronic device of the present invention includes a device main body, an air outlet structure and a heat dissipation module. The air outlet structure is connected to the main body of the device and has a first air outlet surface and a second air outlet surface that are not parallel to each other. The air outlet structure includes a plurality of first pillar portions on the first air outlet surface and a plurality of second pillar portions on the second air outlet surface. These first column parts are arranged at intervals to form a plurality of first openings, and these second column parts are arranged at intervals to form a plurality of second openings. An inner surface of at least one of the first column portions includes a first convex surface or an inner surface of at least one of the second column portions includes a second convex surface. The heat dissipation module is arranged in the main body of the device and is suitable for providing a heat dissipation airflow. The heat dissipation airflow flows to the outside of the device body through the first openings and the second openings.

In an embodiment of the present invention, the above-mentioned first convex surface includes a convex arc surface, and the second convex surface includes a convex arc surface.

In an embodiment of the present invention, the above-mentioned first convex surface includes two planes that are not parallel to each other, and the second convex surface includes two planes that are not parallel to each other.

In an embodiment of the present invention, the above-mentioned first column parts are respectively connected to the second column parts.

In an embodiment of the present invention, the above-mentioned air outlet structure includes a plurality of ribs, which are connected to the first pillars and the second pillars and are respectively located at the junctions of the first openings and the second openings. Place.

In an embodiment of the present invention, the above-mentioned ribs together form a zigzag structure or a wavy structure.

In an embodiment of the present invention, an inner surface of the aforementioned at least one rib includes a third convex surface.

In an embodiment of the present invention, the aforementioned third convex surface includes a convex arc surface.

In an embodiment of the present invention, the aforementioned third convex surface includes two flat surfaces that are not parallel to each other.

In an embodiment of the present invention, the above-mentioned heat dissipation module includes a heat dissipation fan and a heat dissipation fin group, the heat dissipation fin group is located between the heat dissipation fan and the air outlet structure, and the heat dissipation fan is adapted to provide heat dissipation airflow through which the heat dissipation airflow passes The radiating fin group flows towards the air outlet structure afterwards.

In an embodiment of the present invention, the above-mentioned electronic device further includes a flow stabilization structure, wherein there is a distance between the heat dissipation fin group and the air outlet structure, and the flow stabilization structure is connected between the heat dissipation fin group and the air outlet structure.

In an embodiment of the present invention, the above-mentioned flow stabilization structure includes a plurality of retaining walls, and these retaining walls surround a flow stabilization cavity between the heat dissipation fin group and the wind outlet structure.

In an embodiment of the present invention, in an outlet direction of the heat dissipation fan, the length of the steady flow cavity is greater than the length of the heat dissipation fin group.

In an embodiment of the present invention, these retaining walls seal the flow stabilizing cavity except at the wind outlet structure.

Based on the above, the air outlet structure of the present invention includes at least two air outlet surfaces that are not parallel to each other to expand the air outlet angle range, so that the heat dissipation airflow will not be restricted by the air outlet angle range when it flows out of the device body. Excessive impact on the main body of the device and the air outlet structure reduces the noise generated by the heat dissipation airflow. In addition, the inner surface of the column of the air outlet structure is designed as a convex surface to provide a diversion effect, so that the heat dissipation airflow can pass through the air outlet structure more smoothly to further reduce the noise generated by the heat dissipation airflow.

FIG. 1 is a partial perspective view of an electronic device according to an embodiment of the invention. FIG. 2 is a perspective view of some components of the electronic device of FIG. 1. Please refer to FIGS. 1 and 2. The electronic device 100 of this embodiment includes a device main body 110, an air outlet structure 120, and a heat dissipation module 130 (shown in FIG. 1). The device main body 110 is, for example, a notebook computer and includes a first body 112 and a second body 114. The first body 112 and the second body 114 are the host and the screen of the notebook computer, respectively. The air outlet structure 120 is connected to the rear end of the first body 112 of the device main body 110, and the heat dissipation module 130 is disposed in the first body 112 of the device main body 110 and is adapted to provide a heat dissipation air flow, which can flow through the air outlet structure 120 To the outside of the main body 110 of the device.

Fig. 3 is a partial perspective view of the air outlet structure of Fig. 2. 3, the air outlet structure 120 of this embodiment has a first air outlet surface 120a and a second air outlet surface 120b that are not parallel to each other, which can be regarded as two outlets of the air outlet structure 120 with different orientations. On the wind side, the projections of the first air outlet surface 120a and the second air outlet surface 120b on the YZ plane are approximately L-shaped. The air outlet structure 120 includes a plurality of first column portions 122 on the first air outlet surface 120a and a plurality of second column portions 124 on the second air outlet surface 120b, and the first column portions 122 are respectively connected to the second column portions 124. The first column portions 122 are arranged at intervals to form a plurality of first openings 122 a, and the second column portions 124 are arranged at intervals to form a plurality of second openings 124 a. The heat-dissipating airflow can flow to the outside of the first body 112 (shown in FIGS. 1 and 2) of the device main body 110 through the first openings 122a and the second openings 124a.

Fig. 4 is a partial side view of the first body of Fig. 2. As described above, the range shown by the virtual line a and the virtual line b in FIG. 4 is the air outlet angle range of the air outlet structure 120 including only the first air outlet surface 120a. The air outlet structure 120 in this embodiment includes two non-parallel air outlets. Two air outlet surfaces (ie, the first air outlet surface 120a and the second air outlet surface 120b) expand the air outlet angle range to the range indicated by the virtual line a and the virtual line b'. When the heat dissipation airflow flows outside the first body 112 of the device main body 110, the air outlet angle range is limited, and the first body 112 and the air outlet structure 120 of the device main body 110 are not excessively hit, so as to reduce the heat dissipation airflow. The noise produced. In other embodiments, the air outlet structure 120 may have three air outlet surfaces that are not parallel to each other, and the projection on the YZ plane is substantially in the shape of a U, so as to further expand the range of the air outlet angle.

FIG. 5 is a partial three-dimensional view of the wind outlet structure of FIG. 3 from another perspective, that is, a perspective from the inside of the first body 112 toward the wind outlet direction. 5, in the air outlet structure 120 of this embodiment, the inner surface of each first pillar portion 122 includes a first convex surface 122b, and the inner surface of each second pillar portion 124 includes a second convex surface 124b. The inner surface refers to the surfaces of the first column portion 122 and the second column portion 124 facing the inside of the first body 112. The first convex surface 122b and the second convex surface 124b can provide a diversion effect, so that the heat dissipation airflow passes through the air outlet structure 120 more smoothly to further reduce the noise generated by the heat dissipation airflow. In this embodiment, the first convex surface 122b and the second convex surface 124b are, for example, convex arc surfaces.

In this embodiment, the air outlet structure 120 further includes a plurality of ribs 126. The ribs 126 are connected to the first column portions 122 and the second column portions 124 and are located at the first openings 122a and the second openings, respectively. The junction of 124a to provide structural strengthening effect. The ribs 126 may jointly form a zigzag structure as shown in FIG. 5, or may jointly form a wave-shaped structure to improve the diversion effect. In addition, the inner surface of each rib 126 includes a third convex surface 126a. The inner surface refers to the surface of the rib 126 facing the inside of the first body 112. The third convex surface 126a can provide a diversion effect, so that the heat dissipation airflow passes through the air outlet structure 120 more smoothly to further reduce the noise generated by the heat dissipation airflow. In this embodiment, the third convex surface 126a is, for example, a convex arc surface.

Fig. 6 is a partial schematic diagram of the electronic device of Fig. 1. Please refer to FIG. 6, the heat dissipation module 130 of this embodiment includes a heat dissipation fan 132 and a heat dissipation fin group 134. The heat dissipation fin group 134 is connected to the heat dissipation fan 132 and is located between the heat dissipation fan 132 and the air outlet structure 120. The heat dissipation fan 132 is adapted to provide heat dissipation airflow, and the heat dissipation airflow passes through the heat dissipation fin group 134 and then flows toward the air outlet structure 120. Further, there is a distance between the heat dissipation fin group 134 and the air outlet structure 120 as shown in FIG. 6, and the electronic device 100 (marked in FIG. 1) further includes a flow stabilization structure 140 connected to the heat dissipation fins The sheet group 134 and the wind outlet structure 120 include a plurality of retaining walls 142. These retaining walls 142 surround a steady flow cavity C between the heat dissipation fin group 134 and the air outlet structure 120. In addition, in addition to the air inlet direction where the flow stabilization structure 140 is connected to the heat dissipation fin set 134, and the air outlet direction where the flow stabilization structure 140 is connected to the air outlet structure 120, these retaining walls 142 seal the flow stabilization cavity C, as shown in FIG. As an example, the retaining wall 142 seals the steady flow cavity C except for the Y direction, that is, the wind direction D. Thereby, the heat dissipation airflow provided by the heat dissipation fan 132 first passes through the steady flow cavity C to reduce turbulence and then flows out of the first body 112 through the air outlet structure 120 to further reduce the noise generated by the heat dissipation airflow. Specifically, the steady flow structure 140 can surround the steady flow cavity C by its retaining walls 142 and the shell of the first body 112, or the steady flow structure 140 can surround the steady flow cavity C by its sufficient number of retaining walls 142. Flow cavity C. In this embodiment, in the air outlet direction D of the heat dissipation fan 132, the length of the flow stabilizing cavity C is greater than the length of the heat dissipation fin group 134, so as to provide a sufficient flow stabilization effect.

Fig. 7 is a partial perspective view of a wind outlet structure according to another embodiment of the present invention. In the air outlet structure 220 shown in FIG. 7, the configuration and mode of operation of the first column portion 222, the second column portion 224, the first opening 222a, the second opening 224a, and the rib 226 are similar to those of the first embodiment. The configuration and function of the column 122, the second column 124, the first opening 122a, the second opening 124a, and the rib 126 will not be repeated here. The difference shown in FIG. 7 from the previous embodiment is that the first convex surface 222b of the first column portion 222 includes two planes 222b1 that are not parallel to each other, so that the first column portion 222 is in the form of a prismatic column, and the second column portion 224 has the shape of a prismatic column. The second convex surface 224b includes two flat surfaces 224b1 that are not parallel to each other so that the second column portion 224 is in the form of a prismatic column. The third convex surface 226a of the rib 226 includes two non-parallel flat surfaces 226a1, and the rib 226 is angular rib form.

In summary, the air outlet structure of the present invention includes at least two air outlet surfaces that are not parallel to each other to expand the air outlet angle range, so that the heat dissipation airflow will not be affected by the air outlet angle range during the process of flowing out of the main body of the device. Restricted and excessive impact on the main body of the device and the air outlet structure, thereby reducing the noise generated by the heat dissipation airflow. In addition, the inner surface of the column of the air outlet structure is designed as a convex surface to provide a diversion effect, so that the heat dissipation airflow can pass through the air outlet structure more smoothly to further reduce the noise generated by the heat dissipation airflow. In addition, a steady flow cavity can be formed between the radiating fin group of the heat dissipation module and the air outlet structure by a steady flow structure, so that the heat dissipation air flow provided by the cooling fan first passes through the steady flow cavity to reduce turbulence before passing through Air outlet structure to further reduce the noise generated by the heat dissipation airflow.

100: electronic device 110: Device body 112: First Body 114: Second Body 120, 220, 320: wind structure 120a: The first windy side 120b: The second windy side 122, 222, 322: the first column 122a, 222a, 322a: first opening 122b, 222b: the first convex surface 124, 224, 324: second column 124a, 224a, 324a: second opening 124b, 224b: second convex surface 126, 226, 326: ribs 126a, 226a: third convex surface 130: cooling module 132: cooling fan 134: heat sink fin set 140: Steady flow structure 142: Retaining Wall 222b1, 224b1, 226a1: plane a, b, b’: virtual line C: Steady flow cavity D: Wind direction

FIG. 1 is a partial perspective view of an electronic device according to an embodiment of the invention. FIG. 2 is a perspective view of some components of the electronic device of FIG. 1. Fig. 3 is a partial perspective view of the air outlet structure of Fig. 2. Fig. 4 is a partial side view of the first body of Fig. 2. Fig. 5 is a partial perspective view of the air outlet structure of Fig. 3 from another perspective. Fig. 6 is a partial schematic diagram of the electronic device of Fig. 1. Fig. 7 is a partial perspective view of a wind outlet structure according to another embodiment of the present invention.

120: Wind structure 120a: The first windy side 120b: The second windy side 122: first column 122a: first opening 124: The second column 124a: second opening 126: Ribs

Claims (14)

An electronic device, including: A device body; An air outlet structure connected to the main body of the device and having a first air outlet surface and a second air outlet surface that are not parallel to each other, wherein the air outlet structure includes a plurality of first column portions on the first air outlet surface and The second air outlet surface includes a plurality of second column parts, the first column parts are arranged at intervals to form a plurality of first openings, and the second column parts are arranged at intervals to form a plurality of second openings. An inner surface of at least one of the first pillar portions includes a first convex surface or an inner surface of at least one of the second pillar portions includes a second convex surface; and A heat dissipation module is arranged in the device main body and is suitable for providing a heat dissipation airflow, wherein the heat dissipation airflow flows out of the device main body through the first openings and the second openings. The electronic device according to claim 1, wherein the first convex surface includes a convex arc surface, and the second convex surface includes a convex arc surface. The electronic device according to claim 1, wherein the first convex surface includes two planes that are not parallel to each other, and the second convex surface includes two planes that are not parallel to each other. The electronic device according to claim 1, wherein the first pillar portions are respectively connected to the second pillar portions. The electronic device according to claim 1, wherein the air outlet structure includes a plurality of ribs, and the ribs are connected to the first pillars and the second pillars and are located at the first openings and the second pillars, respectively. The junction of these second openings. The electronic device according to claim 5, wherein the ribs together form a zigzag structure or a wavy structure. The electronic device according to claim 5, wherein an inner surface of at least one of the ribs includes a third convex surface. The electronic device according to claim 7, wherein the third convex surface includes a convex arc surface. The electronic device according to claim 7, wherein the third convex surface includes two flat surfaces that are not parallel to each other. The electronic device according to claim 1, wherein the heat dissipation module includes a heat dissipation fan and a heat dissipation fin set, the heat dissipation fin set is located between the heat dissipation fan and the air outlet structure, and the heat dissipation fan is suitable for providing the The heat dissipation airflow, the heat dissipation airflow flows toward the air outlet structure after passing through the heat dissipation fin group. The electronic device according to claim 10, further comprising a flow stabilization structure, wherein there is a distance between the heat dissipation fin set and the air outlet structure, and the flow stabilization structure is connected to the heat dissipation fin set and the air outlet structure. between. The electronic device according to claim 11, wherein the flow stabilizing structure includes a plurality of retaining walls, and the retaining walls surround a flow stabilizing cavity between the heat dissipation fin group and the wind outlet structure. The electronic device according to claim 12, wherein in an air outlet direction of the heat dissipation fan, the length of the steady flow cavity is greater than the length of the heat dissipation fin group. The electronic device according to claim 12, wherein the retaining walls seal the steady flow cavity except at the wind outlet structure.

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