TWI728346B - Substrate processing device and substrate processing method - Google Patents

Substrate processing device and substrate processing method Download PDF

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TWI728346B
TWI728346B TW108113826A TW108113826A TWI728346B TW I728346 B TWI728346 B TW I728346B TW 108113826 A TW108113826 A TW 108113826A TW 108113826 A TW108113826 A TW 108113826A TW I728346 B TWI728346 B TW I728346B
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substrate
protective cover
liquid
unit
nozzle
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TW108113826A
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TW201937552A (en
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林昌之
岩田敬次
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日商斯庫林集團股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Abstract

基板處理裝置係包含有：旋轉單元，係使被收容於腔室內的基板保持單元保持的基板繞著鉛直的旋轉軸線旋轉；噴嘴，係具有噴出口，用以從前述噴出口朝被前述旋轉單元保持的基板的主表面噴出液體；第一藥液供給單元，係用以對前述噴嘴供給第一藥液；處理罩，係用以收容前述基板保持單元，並具有複數個筒狀的防護罩，前述複數個筒狀的防護罩係包含有圍繞前述基板保持單元的周圍之筒狀的第一防護罩以及圍繞前述第一防護罩的周圍之筒狀的第二防護罩；升降單元，係用以使前述複數個防護罩中的至少一個防護罩升降；以及控制裝置，係控制前述旋轉單元、前述第一藥液供給單元以及前述升降單元；前述控制裝置係執行：上位置配置步驟，係將前述複數個防護罩中的至少一個防護罩配置於上位置，該上位置係設定至比預定的接液位置還上方並可藉由前述防護罩接住從前述基板飛散的液體之預定的上位置，前述預定的接液位置係可藉由前述防護罩接住從被前述旋轉單元旋轉的基板飛散之第一藥液；以及第一藥液供給步驟，係在前述防護罩配置於前述上位置的狀態下，一邊藉由前述旋轉單元使基板旋轉一邊對基板的主表面供給第一藥液。The substrate processing apparatus includes: a rotating unit that rotates the substrate held by the substrate holding unit contained in the chamber around a vertical axis of rotation; and the nozzle has an ejection port for moving from the ejection port toward the rotating unit The main surface of the held substrate sprays liquid; the first chemical liquid supply unit is used to supply the first chemical liquid to the aforementioned nozzle; the processing cover is used to house the aforementioned substrate holding unit and has a plurality of cylindrical protective covers, The plurality of cylindrical protective covers includes a cylindrical first protective cover surrounding the periphery of the substrate holding unit and a cylindrical second protective cover surrounding the periphery of the first protective cover; the lifting unit is used for Raising and lowering at least one of the plurality of protective covers; and a control device that controls the rotation unit, the first liquid medicine supply unit, and the lifting unit; the control device executes: the upper position arrangement step, which is to move the aforementioned rotating unit, the first chemical liquid supply unit, and the aforementioned lifting unit; At least one of the plurality of protective covers is arranged at an upper position, and the upper position is set to a predetermined upper position that is higher than a predetermined liquid contact position and can catch the liquid scattered from the substrate by the protective cover, The predetermined liquid contact position is capable of receiving the first chemical solution scattered from the substrate rotated by the rotating unit by the protective cover; and the first chemical liquid supply step is in a state where the protective cover is arranged at the upper position Next, the first chemical solution is supplied to the main surface of the substrate while the substrate is rotated by the rotation unit.

Description

基板處理裝置及基板處理方法Substrate processing device and substrate processing method

本發明係有關於一種使用藥液處理基板之基板處理裝置以基板處理方法。前述基板的例子係包括例如半導體基板、液晶顯示裝置用基板、電漿顯示器用基板、FED(Field Emission Display；場發射顯示器)用基板、光碟用基板、磁碟用基板、光磁碟用基板、光罩(photomask)用基板、陶瓷基板、太陽電池用基板等。The present invention relates to a substrate processing device and a substrate processing method using a chemical solution to process a substrate. Examples of the aforementioned substrates include, for example, semiconductor substrates, substrates for liquid crystal display devices, substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical disks, substrates for magnetic disks, substrates for optical magnetic disks, Substrates for photomasks, ceramic substrates, substrates for solar cells, etc.

在半導體裝置液晶顯示裝置的製造步驟中，為了對半導體基板等基板的表面施予藥液所為之處理，會有使用用以逐片地處理基板之葉片式的基板處理裝置之情形。在該葉片式的基板處理裝置的腔室(chamber)內例如包含有：自轉夾具(spin chuck)，係大致水平地保持基板並使基板旋轉；噴嘴，係對被該自轉夾具旋轉的基板供給藥液；處理罩(processing cup)，係用以接住從基板飛散的處理液，並將該處理液予以排液；以及圓板狀的阻隔板，係與被自轉夾具保持的基板的表面(上表面)對向配置。 處理罩係例如作成將自轉夾具所致使之基板的旋轉軸線作為中心軸線之略圓筒狀，且於上端設置有開口(上部開口)。處理罩係具備有：罩部(cup)，係被固定的收容；以及防護罩(guard)，係設置成可相對於罩部升降，並可接住從被自轉夾具旋轉的基板飛散的藥液。在通常的例子中，於基板的液體處理時，將至少最外側的防護罩的高度位置設定至預定的接液位置，該接液位置係可藉由該防護罩接住從基板飛散的藥液。 在此狀態下，一邊藉由自轉夾具使基板旋轉一邊從噴嘴對基板的表面供給藥液，藉此對基板的表面施予藥液所為之處理。供給至基板的表面之藥液係承受基板的旋轉所致使之離心力並從基板的周緣部朝側方飛散。並且，朝側方飛散的藥液係被防護罩接住，沿著防護罩的內壁供給至罩部後被排液處理。 [先前技術文獻] [專利文獻] 專利文獻1：日本特開平9-97757號公報。In the manufacturing process of a semiconductor device liquid crystal display device, in order to apply a chemical solution to the surface of a substrate such as a semiconductor substrate, a blade-type substrate processing apparatus for processing the substrates piece by piece may be used. The chamber of the blade type substrate processing apparatus includes, for example, a spin chuck, which holds the substrate substantially horizontally and rotates the substrate; and a nozzle, which supplies medicine to the substrate rotated by the spin chuck. The processing cup (processing cup) is used to catch the processing liquid scattered from the substrate and drain the processing liquid; and the disc-shaped baffle plate is connected to the surface of the substrate held by the rotation jig (upper Surface) facing configuration. The processing cover is formed, for example, in a substantially cylindrical shape with the rotation axis of the substrate caused by the rotation jig as the center axis, and an opening (upper opening) is provided at the upper end. The processing cover is provided with: a cup, which is fixed and contained; and a guard, which is set up and down with respect to the cover and can catch the liquid medicine scattered from the substrate rotated by the autorotating jig. . In a normal example, during the liquid processing of the substrate, the height position of at least the outermost shield is set to a predetermined wetted position, and the wetted position can be used to catch the chemical liquid scattered from the substrate by the shield . In this state, the chemical liquid is supplied from the nozzle to the surface of the substrate while rotating the substrate by the rotation jig, thereby applying the chemical liquid treatment to the surface of the substrate. The chemical liquid supplied to the surface of the substrate receives the centrifugal force caused by the rotation of the substrate and scatters laterally from the peripheral edge of the substrate. In addition, the liquid medicine system that has scattered to the side is caught by the protective cover, is supplied to the cover portion along the inner wall of the protective cover, and is drained. [Prior Art Document] [Patent Document] Patent Document 1: Japanese Patent Application Laid-Open No. 9-97757.

[發明所欲解決之課題] 然而，為了達成接住從基板飛散的藥液之目的，防護罩的接液位置的高度為充分的高度，不過在較低的高度位置之情形中，即使藉由排氣機構將處理罩內予以排氣，亦會有處理罩的內部中之包含有藥液的霧氣等之氛圍通過處理罩的上部開口流出至處理罩外並擴散至腔室的內部之虞。由於包含有藥液的霧氣等之氛圍係變成微粒(particle)而成為附著於基板並污染該基板及污染腔室的內壁之原因，因此期望抑制或防止此種氛圍擴散至周圍。 因此，本發明的目的係提供一種能抑制包含有供給至基板的主表面的藥液之氛圍擴散至周圍之基板處理裝置及基板處理方法。 [用以解決課題的手段] 本發明提供一種基板處理裝置，係包含有：腔室；基板保持單元，係收容於前述腔室內，用以將基板保持成水平姿勢；旋轉單元，係使被前述基板保持單元保持的基板繞著鉛直的旋轉軸線旋轉；噴嘴，係具有噴出口，用以從前述噴出口朝被前述旋轉單元保持的基板的主表面噴出液體；第一藥液供給單元，係用以對前述噴嘴供給第一藥液；處理罩，用以收容前述基板保持單元，並具有複數個筒狀的防護罩，前述複數個筒狀的防護罩係包含有圍繞前述基板保持單元的周圍之筒狀的第一防護罩以及圍繞前述第一防護罩的周圍之筒狀的第二防護罩；升降單元，係用以使前述複數個防護罩中的至少一個防護罩升降；以及控制裝置，係控制前述旋轉單元、前述第一藥液供給單元以及前述升降單元；前述控制裝置係執行：上位置配置步驟，係將前述複數個防護罩中的至少一個防護罩配置於上位置，該上位置係設定至比預定的接液位置還上方並可藉由前述防護罩接住從前述基板飛散的液體之預定的上位置，前述預定的接液位置係可藉由前述防護罩接住從被前述旋轉單元旋轉的基板飛散之第一藥液；以及第一藥液供給步驟，係在前述防護罩配置於前述上位置的狀態下，一邊藉由前述旋轉單元使基板旋轉一邊對基板的主表面供給第一藥液。 依據此構成，在複數個防護罩中的至少一個防護罩配置於設定在比接液位置還上方的上位置之狀態下，對處於旋轉狀態的基板的主表面供給第一藥液。在複數個防護罩中的至少一個防護罩配置於上位置之狀態下，大大地確保處理罩的上部開口與基板之間的距離。在第一藥液供給步驟中，雖然藉由對基板供給第一藥液而產生藥液的霧氣，然而由於大大地確保處理罩的上部開口與基板之間的距離，因此包含有藥液的霧氣之氛圍不易通過處理罩的上部開口流出至處理罩外。藉此，能提供一種能抑制包含有供給至基板的主表面的第一藥液之氛圍朝周圍擴散之基板處理裝置。 在本發明的實施形態之一中，進一步包含有：對向構件，係配置於比前述防護罩還上方，並在前述防護罩配置於前述上位置的狀態下於與前述防護罩的上端之間形成環狀間隙，且具有基板對向面，前述基板對向面係在上方與被前述基板保持單元保持的基板的上表面對向。 依據此構成，為了使處理罩的內部的氛圍流出至腔室的內部，處理罩內的氛圍不僅要通過上部開口流出至處理罩外，更需要通過配置於上位置的狀態的防護罩的上端與基板對向面之間的環狀間隙並到達腔室的內部。在此情形中，以環狀間隙變窄之方式設定防護罩的上位置，藉此能有效地抑制或防止氛圍通過環狀間隙流出至腔室的內部的量。 前述基板處理裝置亦可進一步具備有：噴嘴臂，係保持前述噴嘴，並以沿著被前述基板保持單元保持的基板的主表面移動前述噴嘴之方式，可搖動地設置於預定的搖動軸線周圍，前述預定的搖動軸線係設定至前述基板的旋轉範圍外。在此情形中，前述環狀間隙亦可以前述噴嘴臂能跨越前述旋轉範圍的內外之方式設定成比前述噴嘴臂的上下寬度還大。 依據此構成，將環狀間隙設定成此種大小，藉此能使噴嘴臂一邊通過環狀間隙一邊跨越旋轉範圍的內外。而且，儘量縮小環狀間隙，藉此能以容許噴嘴臂通過之範圍將環狀間隙設定成最低限度的大小。在此情形中，能有效地減少從處理罩的內部流出至腔室的內部之氛圍的量。藉此，能更有效地抑制包含有第一藥液之氛圍朝周圍擴散。 前述基板處理裝置亦可進一步包含有：噴嘴臂，係保持前述噴嘴，並以沿著被前述基板保持單元保持的基板的主表面移動前述噴嘴之方式，可搖動地設置於預定的搖動軸線周圍，前述預定的搖動軸線係設定至前述基板保持單元的側方。在此情形中，前述上位置亦可為配置於前述上位置的狀態的前述防護罩的上端與前述噴嘴臂的下端之間的第一間隔變得比前述噴嘴臂的下端與前述噴出口之間的第二間隔還窄之位置。 依據此構成，以此種方式設定第一間隔與第二間隔之間的大小關係，藉此能有效地減少從處理罩流出至腔室的內部之氛圍的量。藉此，能更有效地抑制包含有第一藥液之氛圍朝周圍擴散。 前述上位置亦可為配置於前述上位置的狀態的前述防護罩的上端位於比前述噴嘴臂的下端與被前述基板保持單元保持的基板的主表面之間的中間位置還上方之位置。 依據此構成，將上位置設定成上述說明般的位置，藉此能有效地減少從處理罩流出至腔室的內部之氛圍的量。藉此，能更有效地抑制包含有第一藥液之氛圍朝周圍擴散。 前述基板處理裝置亦可進一步包含有：第二藥液供給單元，係用以將與前述第一藥液不同種類的第二藥液供給至前述基板的主表面。在此情形中，前述控制裝置亦可進一步控制前述第二藥液供給單元；前述控制裝置亦可進一步執行：將前述第一防護罩配置於前述第一防護罩的上端位於比被前述基板保持單元保持的基板還下方之下位置且將前述第二防護罩配置於前述接液位置之步驟；以及第二藥液供給步驟，係在前述第一防護罩配置於前述下位置且前述第二防護罩配置於前述接液位置的狀態下，一邊藉由前述旋轉單元使前述基板旋轉一邊對前述基板的主表面供給第二藥液。 依據此構成，在第一防護罩配置於下位置且第二防護罩配置於接液位置的狀態下執行第二藥液供給步驟。因此，在第二藥液供給步驟中，能以位於接液位置的第二防護罩良好地接住從基板飛散的第二藥液。 前述控制裝置亦可將用以將前述第一防護罩及前述第二防護罩配置於前述上位置之步驟作為前述上位置配置步驟來執行。 依據此構成，在第一防護罩及第二防護罩配置於上位置的狀態下執行第一藥液供給步驟。因此，在第一藥液供給步驟中，能儘量地將第一防護罩配置於上方，並藉由該第一防護罩良好地接住從基板飛散的第一藥液。藉此，在第一藥液供給步驟中，能更有效地抑制包含有第一藥液之氛圍朝周圍擴散。 前述基板處理裝置亦可進一步包含有：水供給單元，係用以對前述噴嘴供給水。前述控制裝置亦可進一步控制前述水供給單元。前述控制裝置亦可進一步執行：將前述第一防護罩及前述第二防護罩配置於前述接液位置之步驟；以及水供給步驟，係在前述第一防護罩及前述第二防護罩配置於前述接液位置的狀態下，一邊藉由前述旋轉單元使前述基板旋轉一邊對前述基板的主表面供給水。 依據此構成，在第一防護罩及第二防護罩配置於接液位置的狀態下執行水供給步驟。因此，在水供給步驟中，能以位於接液位置的第一防護罩良好地接住從基板飛散的水。 在水供給步驟中，由於基板的主表面的周圍幾乎不存在藥液的霧氣，因此即使第一防護罩位於接液位置，藥液的霧氣亦幾乎不會從處理罩流出至腔室的內部。 前述控制裝置亦可將用以將前述第一防護罩配置於前述接液位置且將前述第二防護罩配置於前述上位置之步驟作為前述上位置配置步驟來執行。 依據此構成，在第一防護罩配置於接液位置且第二防護罩配置於上位置的狀態下執行第一藥液供給步驟。將位於上位置的第二防護罩儘量地配置於上方，藉此能抑制第一藥液的霧氣流出至處理罩外。因此，在第一藥液供給步驟中，能藉由位於接液位置的第一防護罩接住從基板飛散的第一藥液並防止包含有第一藥液的霧氣之氛圍流出至處理罩外。藉此，在第一藥液供給步驟中，能更有效地抑制包含有第一藥液之氛圍朝周圍擴散。 前述基板處理裝置亦可進一步包含有：水供給單元，係用以對前述噴嘴供給水。前述控制裝置亦可進一步控制前述水供給單元。前述控制裝置亦可進一步執行：將前述第一防護罩配置於前述第一防護罩的上端位於比被前述基板保持單元保持的基板還下方之下位置且將前述第二防護罩配置於前述接液位置之步驟；以及水供給步驟，係在前述第一防護罩配置於前述下位置且前述第二防護罩配置於前述接液位置的狀態下，一邊藉由前述旋轉單元使前述基板旋轉一邊對前述基板的主表面供給水。 依據此構成，在第一防護罩配置於下位置且第二防護罩配置於接液位置的狀態下執行水供給步驟。因此，在水供給步驟中，能以位於接液位置的第二防護罩良好地接住從基板飛散的水。此外，在第一藥液供給步驟中，由於將第一防護罩配置於接液位置且將第二防護罩配置於上位置，因此會有在第一藥液供給步驟後第一藥液的霧氣附著於在第一防護罩與第二防護罩之間被區劃的內部空間的牆壁之虞。然而，在水供給步驟中，能供給至在第一防護罩與第二防護罩之間被區劃的內部空間。因此，即使在第一藥液的霧氣附著於在第一防護罩與第二防護罩之間被區劃的內部空間的牆壁之情形中，亦能藉由執行水供給步驟以水沖流前述第一藥液的霧氣。 前述控制裝置亦可在前述第一藥液供給步驟執行前及／或執行後以及／或者前述第二藥液供給步驟執行前及／或執行後執行前述水供給步驟。 依據此構成，在共通的腔室內執行使用了彼此不同種類的藥液之第一藥液供給步驟及第二藥液供給步驟。此外，在第一藥液供給步驟執行前及／或執行後以及／或者第二藥液供給步驟執行前及／或執行後執行水供給步驟。 在第一藥液供給步驟結束後及／或第二藥液供給步驟開始前會有第一藥液的霧氣附著於在第一防護罩與第二防護罩之間被區劃的內部空間的牆壁之虞。在此情形中，在第一藥液供給步驟結束後及／或第二藥液供給步驟開始前實施水供給步驟，藉此能將水供給至內部空間，從而能沖流附著於內部空間的牆壁之第一藥液的霧氣。因此，在第二藥液供給步驟開始時第一藥液的霧氣不會殘留於內部空間的牆壁。因此，在前述第二藥液供給步驟中即使第二藥液進入至內部空間，前述第二藥液亦不會與第一藥液混合接觸。藉此，能防止在內部空間的內部中第一藥液與第二藥液混合接觸。 前述基板處理裝置亦可包含有：分隔板，係在前述腔室內將前述基板保持單元的側方區域上下地分隔成上側的上空間與下側的下空間。在此情形中，亦可於前述下空間開口有排氣口，並於前述第二防護罩與前述分隔板之間形成有間隙。前述第二防護罩亦可具有：閉塞部，係用以將前述間隙閉塞。再者，亦可為在前述第二防護罩配置於前述上位置的狀態下前述閉塞部將前述間隙閉塞，且在前述第二防護罩配置於設定在比前述上位置還下方的預定的下方位置的狀態下形成有前述間隙。 依據此構成，當間隙呈開口時，於腔室的內部流動之氣流係流動至處理罩的內部以及下空間雙方。另一方面，當間隙呈閉塞時，於腔室的內部流動之氣流不會流動至下空間，而是聚集在處理罩的內部。 在第二防護罩位於上位置的狀態下執行第一藥液供給步驟之情形中，在第一藥液供給步驟中能形成從腔室的內部朝向處理罩的內部之氣流。藉此，能更有效地抑制包含有藥液的霧氣之氛圍從處理罩朝腔室的內部流出。 此外，前述第一藥液亦可包含有硫酸與過氧化氫水的混合液。 本發明提供一種基板處理方法，係在基板處理裝置中被執行，前述基板處理裝置係包含有：腔室；基板保持單元，係收容於前述腔室內，用以將基板保持成水平姿勢；旋轉單元，係使被前述基板保持單元保持的基板繞著鉛直的旋轉軸線旋轉；以及複數個防護罩，係包含有圍繞前述基板保持單元的周圍之筒狀的第一防護罩以及圍繞前述第一防護罩的周圍之筒狀的第二防護罩；前述基板處理方法係包含有：基板保持步驟，係藉由前述基板保持單元保持基板；上位置配置步驟，係將前述複數個防護罩中的至少一個防護罩配置於上位置，該上位置係設定至比預定的接液位置還上方並可藉由前述防護罩接住從前述基板飛散的液體之預定的上位置，前述預定的接液位置係可藉由前述防護罩接住從被前述旋轉單元旋轉的基板飛散之液體；以及第一藥液供給步驟，係在前述防護罩配置於前述上位置的狀態下，一邊藉由前述旋轉單元使基板旋轉一邊對基板的主表面供給第一藥液。 依據此方法，在複數個防護罩中的至少一個防護罩配置於設定在比接液位置還上方的上位置之狀態下，使基板旋轉並對基板的主表面供給第一藥液。在複數個防護罩中的至少一個防護罩配置於上位置之狀態下，大大地確保處理罩的上部開口與基板之間的距離。在第一藥液供給步驟中，雖然藉由對基板供給第一藥液而產生藥液的霧氣，然而由於大大地確保處理罩的上部開口與基板之間的距離，因此包含有藥液的霧氣之氛圍不易通過處理罩的上部開口流出至處理罩外。藉此，能提供一種能抑制包含有供給至基板的主表面的第一藥液之氛圍朝周圍擴散之基板處理方法。 在本發明的實施形態之一中，前述基板處理方法係進一步包含有：將前述第一防護罩配置於前述第一防護罩的上端位於比被前述基板保持單元保持的基板還下方之下位置且將前述第二防護罩配置於前述接液位置之步驟；以及第二藥液供給步驟，係在前述第一防護罩配置於前述下位置且前述第二防護罩配置於前述接液位置的狀態下，一邊藉由前述旋轉單元使前述基板旋轉一邊對前述基板的主表面供給第二藥液。 依據此方法，在第一防護罩配置於下位置且第二防護罩配置於接液位置的狀態下執行第二藥液供給步驟。因此，在第二藥液供給步驟中，能以位於接液位置的第二防護罩良好地接住從基板飛散的第二藥液。 前述上位置配置步驟亦可包含有將前述第一防護罩及前述第二防護罩配置於前述上位置之步驟。 依據此方法，在第一防護罩及第二防護罩配置於上位置的狀態下執行第一藥液供給步驟。因此，在第一藥液供給步驟中，能儘量地將第一防護罩配置於上方，並藉由該第一防護罩良好地接住從基板飛散的第一藥液。藉此，在第一藥液供給步驟中，能更有效地抑制包含有第一藥液之氛圍朝周圍擴散。 前述基板處理方法亦可進一步包含有：將前述第一防護罩及前述第二防護罩配置於前述接液位置之步驟；以及水供給步驟，係在前述第一防護罩及前述第二防護罩配置於前述接液位置的狀態下，一邊藉由前述旋轉單元使前述基板旋轉一邊對前述基板的主表面供給水。 依據此方法，在第一防護罩及第二防護罩配置於接液位置的狀態下執行水供給步驟。因此，在水供給步驟中，能以位於接液位置的第一防護罩良好地接住從基板飛散的水。 在水供給步驟中，由於基板的主表面的周圍幾乎不存在藥液的霧氣，因此即使第一防護罩位於接液位置，藥液的霧氣亦幾乎不會從處理罩流出至腔室的內部。 前述上位置配置步驟亦可進一步包含有將前述第一防護罩配置於前述接液位置且將前述第二防護罩配置於前述上位置之步驟。 依據此方法，在第一防護罩配置於接液位置且第二防護罩配置於上位置的狀態下執行第一藥液供給步驟。將位於上位置的第二防護罩儘量地配置於上方，藉此能抑制第一藥液的霧氣流出至處理罩外。因此，在第一藥液供給步驟中，能藉由位於接液位置的第一防護罩接住從基板飛散的第一藥液並防止包含有第一藥液的霧氣之氛圍流出至處理罩外。藉此，在第一藥液供給步驟中，能更有效地抑制包含有第一藥液之氛圍朝周圍擴散。 前述基板處理方法亦可進一步包含有：將前述第一防護罩及前述第二防護罩配置於前述接液位置之步驟；將前述第一防護罩配置於前述第一防護罩的上端位於比被前述基板保持單元保持的基板還下方之下位置且將前述第二防護罩配置於前述接液位置之步驟；以及水供給步驟，係在前述第一防護罩配置於前述下位置且前述第二防護罩配置於前述接液位置的狀態下，一邊藉由前述旋轉單元使前述基板旋轉一邊對前述基板的主表面供給水。 依據此方法，在第一防護罩配置於下位置且第二防護罩配置於接液位置的狀態下執行水供給步驟。因此，在水供給步驟中，能以位於接液位置的第二防護罩良好地接住從基板飛散的水。此外，在第一藥液供給步驟中，由於將第一防護罩配置於接液位置且將第二防護罩配置於上位置，因此會有在第一藥液供給步驟後第一藥液的霧氣附著於在第一防護罩與第二防護罩之間被區劃的內部空間的牆壁之虞。然而，在水供給步驟中，能供給至在第一防護罩與第二防護罩之間被區劃的內部空間。因此，即使在第一藥液的霧氣附著於在第一防護罩與第二防護罩之間被區劃的內部空間的牆壁之情形中，亦能藉由執行水供給步驟以水沖流前述第一藥液的霧氣。 前述水供給步驟亦可在前述第一藥液供給步驟執行前及／或執行後以及／或者前述第二藥液供給步驟執行前及／或執行後執行。 依據此方法，在共通的腔室內執行使用了彼此不同種類的藥液之第一藥液供給步驟及第二藥液供給步驟。此外，在第一藥液供給步驟執行前及／或執行後以及／或者第二藥液供給步驟執行前及／或執行後執行水供給步驟。 在第一藥液供給步驟結束後及／或第二藥液供給步驟開始前會有第一藥液的霧氣附著於在第一防護罩與第二防護罩之間被區劃的內部空間的牆壁之虞。在此情形中，在第一藥液供給步驟結束後及／或第二藥液供給步驟開始前實施水供給步驟，藉此能將水供給至內部空間，從而能沖流附著於內部空間的牆壁之第一藥液的霧氣。因此，在第二藥液供給步驟開始時第一藥液的霧氣不會殘留於內部空間的牆壁。因此，在前述第二藥液供給步驟中即使第二藥液進入至內部空間，前述第二藥液亦不會與第一藥液混合接觸。藉此，能防止在內部空間的內部中第一藥液與第二藥液混合接觸。 本發明的前述目的、特徵及功效以及其他的目的、特徵及功效係參照隨附圖式並藉由下述實施形態的說明而更明瞭。[Problem to be Solved by the Invention] However, in order to achieve the purpose of catching the chemical liquid scattered from the substrate, the height of the liquid contact position of the protective cover is a sufficient height, but in the case of a lower height position, even if The exhaust mechanism exhausts the inside of the processing cover, and there is a risk that the atmosphere of the mist containing the chemical liquid in the processing cover flows out of the processing cover through the upper opening of the processing cover and diffuses into the inside of the chamber. Since the atmosphere such as the mist containing the chemical liquid becomes particles and causes the adhesion to the substrate and contaminates the substrate and the inner wall of the chamber, it is desirable to suppress or prevent such atmosphere from spreading to the surroundings. Therefore, the object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can suppress the diffusion of the atmosphere containing the chemical liquid supplied to the main surface of the substrate to the surroundings. [Means for Solving the Problem] The present invention provides a substrate processing apparatus that includes: a chamber; a substrate holding unit that is housed in the chamber to hold the substrate in a horizontal posture; and a rotating unit that is The substrate held by the substrate holding unit rotates around a vertical axis of rotation; the nozzle has an ejection port for ejecting liquid from the ejection port toward the main surface of the substrate held by the rotating unit; the first chemical liquid supply unit is used To supply the first chemical solution to the nozzle; the processing cover for accommodating the substrate holding unit, and has a plurality of cylindrical protective covers, the plurality of cylindrical protective covers include surrounding the substrate holding unit A cylindrical first protective cover and a cylindrical second protective cover surrounding the first protective cover; a lifting unit for raising and lowering at least one of the plurality of protective covers; and a control device, Control the rotating unit, the first liquid medicine supply unit, and the lifting unit; the control device executes the upper position arranging step, which is to arrange at least one of the plurality of protective covers in the upper position, and the upper position is Set to a predetermined upper position that is higher than the predetermined wetted position and can catch the liquid scattered from the substrate by the protective cover. The predetermined wetted position can be caught by the protective cover from being rotated by the aforementioned The first chemical solution scattered by the substrate while the unit is rotating; and the first chemical solution supplying step is to supply the first chemical solution to the main surface of the substrate while the substrate is rotated by the rotating unit while the protective cover is arranged in the upper position. One liquid medicine. According to this configuration, in a state where at least one of the plurality of protective covers is arranged at an upper position higher than the liquid contact position, the first liquid chemical is supplied to the main surface of the substrate in the rotating state. In the state where at least one of the plurality of protective covers is arranged in the upper position, the distance between the upper opening of the processing cover and the substrate is greatly ensured. In the first chemical liquid supply step, although the chemical liquid mist is generated by supplying the first chemical liquid to the substrate, since the distance between the upper opening of the processing cover and the substrate is greatly ensured, the chemical liquid mist is contained The atmosphere is not easy to flow out of the treatment cover through the upper opening of the treatment cover. Thereby, it is possible to provide a substrate processing apparatus capable of suppressing the diffusion of the atmosphere containing the first chemical solution supplied to the main surface of the substrate to the surroundings. In one of the embodiments of the present invention, further comprising: an opposing member arranged above the protective cover, and between the upper end of the protective cover and the protective cover in a state where the protective cover is arranged in the upper position An annular gap is formed and has a substrate facing surface, and the substrate facing surface is upwardly opposed to the upper surface of the substrate held by the substrate holding unit. According to this structure, in order for the atmosphere inside the processing cover to flow out to the inside of the chamber, the atmosphere in the processing cover not only flows out of the processing cover through the upper opening, but also needs to pass through the upper end and the upper end of the protective cover in the upper position. The annular gap between the facing surfaces of the substrate reaches the inside of the chamber. In this case, the upper position of the shield is set in such a way that the annular gap is narrowed, thereby effectively suppressing or preventing the amount of atmosphere flowing out into the chamber through the annular gap. The substrate processing apparatus may further include a nozzle arm that holds the nozzle and is oscillatingly provided around a predetermined oscillating axis by moving the nozzle along the main surface of the substrate held by the substrate holding unit, The predetermined shaking axis is set outside the rotation range of the substrate. In this case, the annular gap may also be set to be larger than the vertical width of the nozzle arm in such a way that the nozzle arm can span the inside and outside of the rotation range. According to this structure, by setting the annular gap to such a size, the nozzle arm can span the inside and outside of the rotation range while passing through the annular gap. In addition, the annular gap is minimized, so that the annular gap can be set to the minimum size within the range that allows the nozzle arm to pass through. In this case, the amount of atmosphere flowing out from the inside of the processing cover to the inside of the chamber can be effectively reduced. Thereby, it is possible to more effectively prevent the atmosphere containing the first liquid medicine from spreading to the surroundings. The substrate processing apparatus may further include: a nozzle arm that holds the nozzle, and is oscillatingly arranged around a predetermined oscillating axis by moving the nozzle along the main surface of the substrate held by the substrate holding unit, The predetermined shaking axis is set to the side of the substrate holding unit. In this case, the first interval between the upper end of the protective cover and the lower end of the nozzle arm in the state where the upper position is arranged in the upper position may be greater than that between the lower end of the nozzle arm and the ejection port. The second interval is still narrow. According to this configuration, the size relationship between the first interval and the second interval is set in this way, thereby effectively reducing the amount of atmosphere flowing out of the processing cover into the interior of the chamber. Thereby, it is possible to more effectively prevent the atmosphere containing the first liquid medicine from spreading to the surroundings. The upper position may be a position where the upper end of the protective cover in the state of being arranged in the upper position is located higher than the middle position between the lower end of the nozzle arm and the main surface of the substrate held by the substrate holding unit. According to this structure, the upper position is set to the position described above, thereby effectively reducing the amount of atmosphere flowing out of the processing cover into the chamber. Thereby, it is possible to more effectively prevent the atmosphere containing the first liquid medicine from spreading to the surroundings. The substrate processing apparatus may further include: a second chemical liquid supply unit for supplying a second chemical liquid different from the first chemical liquid to the main surface of the substrate. In this case, the control device may further control the second chemical liquid supply unit; the control device may further execute: arranging the first protective cover on the upper end of the first protective cover which is higher than the substrate holding unit The step of holding the substrate at the lower position and arranging the second protective cover at the liquid contact position; and the step of supplying the second chemical solution when the first protective cover is arranged at the lower position and the second protective cover In the state of being arranged at the liquid contact position, the second chemical liquid is supplied to the main surface of the substrate while the substrate is rotated by the rotation unit. According to this configuration, the second chemical solution supply step is performed in a state in which the first protective cover is arranged at the lower position and the second protective cover is arranged at the liquid receiving position. Therefore, in the second liquid chemical supply step, the second protective cover located at the liquid contact position can well catch the second liquid chemical scattered from the substrate. The aforementioned control device can also execute the step of arranging the aforementioned first protective cover and the aforementioned second protective cover in the aforementioned upper position as the aforementioned upper position arranging step. According to this configuration, the first chemical solution supply step is executed in a state where the first protective cover and the second protective cover are arranged in the upper position. Therefore, in the first liquid chemical supply step, the first protective cover can be arranged as much as possible above, and the first protective cover can well catch the first chemical liquid scattered from the substrate. Thereby, in the first chemical liquid supply step, the atmosphere containing the first chemical liquid can be more effectively prevented from spreading to the surroundings. The substrate processing apparatus may further include: a water supply unit for supplying water to the nozzle. The aforementioned control device can also further control the aforementioned water supply unit. The aforementioned control device may further perform: the step of arranging the first protective cover and the second protective cover in the liquid contact position; and the water supply step is performed when the first protective cover and the second protective cover are arranged in the aforementioned In the state of the liquid contact position, water is supplied to the main surface of the substrate while the substrate is rotated by the rotation unit. According to this structure, the water supply step is performed in a state where the first protective cover and the second protective cover are arranged at the liquid-receiving position. Therefore, in the water supply step, the first protective cover located at the liquid contact position can well catch the water scattered from the substrate. In the water supply step, since there is almost no mist of the chemical liquid around the main surface of the substrate, even if the first protective cover is located at the liquid contact position, the mist of the chemical liquid hardly flows out of the processing cover into the chamber. The control device may also execute the step of arranging the first protective cover in the liquid contact position and arranging the second protective cover in the upper position as the upper position arranging step. According to this configuration, the first chemical solution supply step is performed in a state in which the first protective cover is arranged at the liquid receiving position and the second protective cover is arranged at the upper position. Arranging the second protective cover at the upper position as much as possible upwards, thereby preventing the mist of the first chemical liquid from flowing out of the processing cover. Therefore, in the first chemical liquid supply step, the first protective cover located at the liquid contact position can catch the first chemical liquid scattered from the substrate and prevent the atmosphere of the mist containing the first chemical liquid from flowing out of the processing cover. . Thereby, in the first chemical liquid supply step, the atmosphere containing the first chemical liquid can be more effectively prevented from spreading to the surroundings. The substrate processing apparatus may further include: a water supply unit for supplying water to the nozzle. The aforementioned control device can also further control the aforementioned water supply unit. The control device may further perform: arranging the first protective cover on the upper end of the first protective cover at a position lower than the substrate held by the substrate holding unit, and arranging the second protective cover on the wetted liquid The step of positioning; and the step of supplying water, in a state where the first protective cover is disposed at the lower position and the second protective cover is disposed at the liquid contact position, while rotating the substrate by the rotating unit Water is supplied to the main surface of the substrate. According to this configuration, the water supply step is performed in a state where the first protective cover is arranged at the lower position and the second protective cover is arranged at the liquid-receiving position. Therefore, in the water supply step, the second protective cover located at the liquid contact position can well catch the water scattered from the substrate. In addition, in the first liquid chemical supply step, since the first protective cover is arranged at the liquid receiving position and the second protective cover is arranged at the upper position, there is a mist of the first chemical liquid after the first chemical liquid supply step. It may be attached to the wall of the internal space partitioned between the first protective cover and the second protective cover. However, in the water supply step, it can be supplied to the internal space partitioned between the first protective cover and the second protective cover. Therefore, even in the case where the mist of the first chemical liquid adheres to the wall of the internal space partitioned between the first protective cover and the second protective cover, the water can be flushed with water by performing the water supply step. The mist of liquid medicine. The aforementioned control device may also execute the aforementioned water supply step before and/or after the aforementioned first liquid medicine supply step and/or before and/or after the aforementioned second liquid medicine supply step. According to this configuration, the first liquid medicine supply step and the second liquid medicine supply step using different types of liquid medicine are executed in the common chamber. In addition, the water supply step is performed before and/or after the first liquid medicine supply step and/or before and/or after the second liquid medicine supply step. After the first liquid chemical supply step ends and/or before the second liquid chemical supply step starts, the mist of the first chemical liquid adheres to the wall of the internal space partitioned between the first protective cover and the second protective cover Yu. In this case, the water supply step is performed after the first liquid chemical supply step ends and/or before the second liquid chemical supply step starts, so that water can be supplied to the internal space, so that it can flush to the wall attached to the internal space The mist of the first liquid medicine. Therefore, the mist of the first chemical solution does not remain on the wall of the internal space at the start of the second chemical solution supply step. Therefore, even if the second chemical liquid enters the internal space in the second chemical liquid supply step, the second chemical liquid will not be mixed and contacted with the first chemical liquid. Thereby, it is possible to prevent the first liquid medicine and the second liquid medicine from being mixed and contacted in the interior of the internal space. The substrate processing apparatus may also include a partition plate that partitions the side area of the substrate holding unit up and down into an upper space on the upper side and a lower space on the lower side in the chamber. In this case, an exhaust port may be opened in the lower space, and a gap may be formed between the second protective cover and the partition plate. The aforementioned second protective cover may also have: a blocking portion for blocking the aforementioned gap. Furthermore, the closing portion may close the gap in a state in which the second shield is arranged at the upper position, and the second shield may be arranged at a predetermined lower position set below the upper position The aforementioned gap is formed in the state. According to this configuration, when the gap is open, the airflow flowing inside the chamber flows to both the inside of the processing cover and the lower space. On the other hand, when the gap is closed, the airflow flowing inside the chamber does not flow to the lower space, but gathers inside the processing cover. In the case where the first liquid chemical supply step is performed with the second protective cover in the upper position, the air flow from the inside of the chamber to the inside of the processing cover can be formed in the first liquid chemical supply step. As a result, it is possible to more effectively prevent the atmosphere of the mist containing the liquid medicine from flowing out of the processing cover into the chamber. In addition, the aforementioned first chemical solution may also include a mixed solution of sulfuric acid and hydrogen peroxide water. The present invention provides a substrate processing method, which is executed in a substrate processing apparatus. The substrate processing apparatus includes: a chamber; a substrate holding unit housed in the chamber to hold the substrate in a horizontal posture; a rotating unit , The substrate held by the substrate holding unit is rotated around a vertical axis of rotation; and a plurality of protective covers including a cylindrical first protective cover surrounding the periphery of the substrate holding unit and surrounding the first protective cover The surrounding cylindrical second protective cover; the aforementioned substrate processing method includes: a substrate holding step of holding the substrate by the aforementioned substrate holding unit; an upper position arrangement step of protecting at least one of the aforementioned plurality of protective covers The cover is arranged in an upper position, and the upper position is set to a predetermined upper position that is higher than the predetermined wetted position and can catch the liquid scattered from the substrate by the protective cover. The predetermined wetted position can be obtained by The protective cover receives the liquid scattered from the substrate rotated by the rotating unit; and the first chemical liquid supply step is to rotate the substrate by the rotating unit while the protective cover is arranged in the upper position The first chemical solution is supplied to the main surface of the substrate. According to this method, in a state where at least one of the plurality of protective covers is arranged at an upper position higher than the liquid contact position, the substrate is rotated and the first chemical solution is supplied to the main surface of the substrate. In the state where at least one of the plurality of protective covers is arranged in the upper position, the distance between the upper opening of the processing cover and the substrate is greatly ensured. In the first chemical liquid supply step, although the chemical liquid mist is generated by supplying the first chemical liquid to the substrate, since the distance between the upper opening of the processing cover and the substrate is greatly ensured, the chemical liquid mist is contained The atmosphere is not easy to flow out of the treatment cover through the upper opening of the treatment cover. Thereby, it is possible to provide a substrate processing method capable of suppressing the diffusion of the atmosphere containing the first chemical solution supplied to the main surface of the substrate to the surroundings. In one embodiment of the present invention, the substrate processing method further includes: arranging the first protective cover on the upper end of the first protective cover at a position lower than the substrate held by the substrate holding unit, and The step of disposing the second protective cover at the liquid contact position; and the step of supplying the second chemical solution in a state where the first protective cover is disposed at the lower position and the second protective cover is disposed at the liquid contact position , While the substrate is rotated by the rotation unit, the second chemical solution is supplied to the main surface of the substrate. According to this method, the second liquid medicine supply step is performed in a state in which the first protective cover is arranged at the lower position and the second protective cover is arranged at the liquid receiving position. Therefore, in the second liquid chemical supply step, the second protective cover located at the liquid contact position can well catch the second liquid chemical scattered from the substrate. The step of arranging the upper position may also include the step of arranging the first protective cover and the second protective cover in the upper position. According to this method, the first liquid medicine supply step is performed in a state where the first protective cover and the second protective cover are arranged in the upper position. Therefore, in the first liquid chemical supply step, the first protective cover can be arranged as much as possible above, and the first protective cover can well catch the first chemical liquid scattered from the substrate. Thereby, in the first chemical liquid supply step, the atmosphere containing the first chemical liquid can be more effectively prevented from spreading to the surroundings. The substrate processing method may further include: a step of arranging the first protective cover and the second protective cover at the liquid contact position; and a water supply step, which is arranged in the first protective cover and the second protective cover In the state of the liquid contact position, water is supplied to the main surface of the substrate while the substrate is rotated by the rotation unit. According to this method, the water supply step is performed in a state where the first protective cover and the second protective cover are arranged at the liquid contact position. Therefore, in the water supply step, the first protective cover located at the liquid contact position can well catch the water scattered from the substrate. In the water supply step, since there is almost no mist of the chemical liquid around the main surface of the substrate, even if the first protective cover is located at the liquid contact position, the mist of the chemical liquid hardly flows out of the processing cover into the chamber. The step of arranging the upper position may further include a step of arranging the first protective cover at the liquid-welded position and arranging the second protective cover at the upper position. According to this method, the first liquid medicine supply step is performed in a state where the first protective cover is arranged at the liquid receiving position and the second protective cover is arranged at the upper position. Arranging the second protective cover at the upper position as much as possible upwards, thereby preventing the mist of the first chemical liquid from flowing out of the processing cover. Therefore, in the first chemical liquid supply step, the first protective cover located at the liquid contact position can catch the first chemical liquid scattered from the substrate and prevent the atmosphere of the mist containing the first chemical liquid from flowing out of the processing cover. . Thereby, in the first chemical liquid supply step, the atmosphere containing the first chemical liquid can be more effectively prevented from spreading to the surroundings. The substrate processing method may further include: arranging the first protective cover and the second protective cover at the liquid contact position; arranging the first protective cover on the upper end of the first protective cover at a position higher than the upper end of the first protective cover The step of placing the substrate held by the substrate holding unit at the lower position and arranging the second protective cover at the liquid contact position; and the step of supplying water when the first protective cover is arranged at the lower position and the second protective cover In the state of being arranged at the liquid contact position, water is supplied to the main surface of the substrate while the substrate is rotated by the rotation unit. According to this method, the water supply step is performed in a state in which the first protective cover is disposed at the lower position and the second protective cover is disposed at the liquid contact position. Therefore, in the water supply step, the second protective cover located at the liquid contact position can well catch the water scattered from the substrate. In addition, in the first liquid chemical supply step, since the first protective cover is arranged at the liquid receiving position and the second protective cover is arranged at the upper position, there is a mist of the first chemical liquid after the first chemical liquid supply step. It may be attached to the wall of the internal space partitioned between the first protective cover and the second protective cover. However, in the water supply step, it can be supplied to the internal space partitioned between the first protective cover and the second protective cover. Therefore, even in the case where the mist of the first chemical liquid adheres to the wall of the internal space partitioned between the first protective cover and the second protective cover, the water can be flushed with water by performing the water supply step. The mist of liquid medicine. The water supply step may also be performed before and/or after the first liquid medicine supply step and/or before and/or after the second liquid medicine supply step. According to this method, the first liquid medicine supply step and the second liquid medicine supply step using different kinds of liquid medicine are executed in a common chamber. In addition, the water supply step is performed before and/or after the first liquid medicine supply step and/or before and/or after the second liquid medicine supply step. After the first liquid chemical supply step ends and/or before the second liquid chemical supply step starts, the mist of the first chemical liquid adheres to the wall of the internal space partitioned between the first protective cover and the second protective cover Yu. In this case, the water supply step is performed after the first liquid chemical supply step ends and/or before the second liquid chemical supply step starts, so that water can be supplied to the internal space, so that it can flush to the wall attached to the internal space The mist of the first liquid medicine. Therefore, the mist of the first chemical solution does not remain on the wall of the internal space at the start of the second chemical solution supply step. Therefore, even if the second chemical liquid enters the internal space in the second chemical liquid supply step, the second chemical liquid will not be mixed and contacted with the first chemical liquid. Thereby, it is possible to prevent the first liquid medicine and the second liquid medicine from being mixed and contacted in the interior of the internal space. The foregoing objectives, features, and effects of the present invention, as well as other objectives, features, and effects, are made clearer with reference to the accompanying drawings and the description of the following embodiments.

圖1係用以說明本發明實施形態之一的基板處理裝置1的內部的布局之示意性的俯視圖。基板處理裝置1係用以逐片地處理矽晶圓等基板W之葉片式的裝置。在本實施形態中，基板W為圓板狀的基板。基板處理裝置1係包含有：複數個處理單元2，係以處理液處理基板W；裝載埠(load port)LP，係載置有承載器(carrier)C，該承載器C係用以收容用以被處理單元2處理之複數個基板W；搬運機器人IR及搬運機器人CR，係在裝載埠LP與處理單元2之間搬運基板W；以及控制裝置3，係控制基板處理裝置1。搬運機器人IR係在承載器C與基板搬運機器人CR之間搬運基板W。基板搬運機器人CR係在搬運機器人IR與處理單元2之間搬運基板W。複數個處理單元2係例如具有同樣的構成。 圖2A係用以說明處理單元2的構成例之示意性的剖視圖。 處理單元2係包含有：箱形的腔室4；自轉夾具(基板保持單元)5，係在腔室4內以水平的姿勢保持一片基板W，使基板W繞著通過基板W的中心之鉛直的旋轉軸線A1旋轉；對向構件7，係具有與被自轉夾具5保持的基板W的上表面(主表面)對向之基板對向面6；SPM(sulfuric acid／ hydrogen peroxide mixture；硫酸過氧化氫水混合液)供給單元(第一藥液供給單元)8，係用以將作為第一藥液的硫酸過氧化氫水混合液(SPM)供給至被自轉夾具5保持的基板W；有機溶劑供給單元(第二藥液供給單元)10，係對被自轉夾具5保持的基板W的表面(上表面)供給作為第二藥液的有機溶劑(具有低表面張力之有機溶劑)的一例之異丙醇(IPA；isopropyl alcohol)液；水供給單元11，係用以對被自轉夾具5保持的基板W的表面(上表面)供給作為清洗(rinse)液的水；以及筒狀的處理罩12，係圍繞自轉夾具5。 腔室4係包含有：箱狀的隔壁13，係收容自轉夾具5或噴嘴；作為送風單元的FFU(fan filter unit；風扇過濾器單元)14，係從隔壁13的上部對隔壁13內輸送清淨空氣(經過過濾器過濾的空氣)；以及分隔板16，係在腔室4的內部中將腔室4內之處理罩12的側方區域15上下地分隔成上部區域15a與下部區域15b。 FFU14係配置於隔壁13的上方，並安裝於隔壁13的頂部。控制裝置3係以FFU14從隔壁13的頂部朝下地將清淨空氣輸送至腔室4內之方式控制FFU14。 於隔壁13的下部或底部開口有排氣口9。於排氣口9連接有排氣導管9a。排氣裝置係吸引腔室4的內部的下部空間4a(腔室4的內部空間中之在上下方向中比分隔板16還下方的空間)的氛圍，並將該下部空間4a予以排氣。 FFU14係對腔室4的內部供給清淨空氣且排氣裝置係將腔室4的下部空間4a予以排氣，藉此於腔室4內形成有降流(down flow)(下降流)。基板W的處理係在腔室4內形成有降流的狀態下進行。 分隔板16係配置於處理罩12的外壁與腔室4的隔壁13(側方的隔壁)之間。分隔板16的內端部係沿著處理罩12的外壁的外周面配置。分隔板16的外端部係沿著腔室4的隔壁13(側方的隔壁)的內表面配置。後述之SPM噴嘴28及噴嘴臂29係配置於比分隔板16還上方。分隔板16係可為一片板，亦可為配置在相同高度的複數片板。分隔板16的上表面係可為水平，亦可為朝旋轉軸線A1斜上地延伸。 採用用以在水平方向夾著基板W並水平地保持基板W之夾持式的夾具作為自轉夾具5。具體而言，自轉夾具5係包含有：自轉馬達(spin motor)(旋轉單元)17；下自轉軸18，係與自轉馬達17的驅動軸一體化；以及圓板狀的自轉基座(spin base)19，係略水平地安裝於下自轉軸18的上端。自轉基座19係具備有由平坦面所構成的上表面19a。 於自轉基座19的上表面19a的周緣部配置有複數個(三個以上，例如為六個)夾持構件20。複數個夾持構件20係在自轉基座19的上表面周緣部中在與基板W的外周形狀對應之圓周上隔著適當的間隔配置。 此外，作為自轉夾具5，並未限定於夾持式的自轉夾具，例如亦可採用真空吸附式的自轉夾具(真空夾具)，該真空吸附式的自轉夾具係真空吸附基板W的背面，藉此以水平的姿勢保持基板W，並在此狀態下使基板W繞著鉛直的旋轉軸線旋轉，從而使被自轉夾具5保持的基板W旋轉。 對向構件7係包含有：阻隔板21；以及上自轉軸22，係同軸地設置於阻隔板21。阻隔板21為圓板狀，並具有與基板W大致相同的直徑或基板W的直徑以上的直徑。基板對向面6係形成阻隔板21的下表面，且為與基板W的上表面全域對向之圓形。 於基板對向面6的中央部形成有圓筒狀的貫通孔23(參照圖2B)，該貫通孔23係上下地貫通阻隔板21及上自轉軸22。貫通孔23的內周壁係被圓筒面區劃。於貫通孔23的內部插通有分別朝上下延伸之第一噴嘴24及第二噴嘴25。 於上自轉軸22結合有阻隔板旋轉單元26。阻隔板旋轉單元26係使上自轉軸22連同阻隔板21一起繞著旋轉軸線A2旋轉。於阻隔板21結合有包含有電動馬達及滾珠螺桿(ball screw)等構成之阻隔板升降單元27。阻隔板升降單元27係將阻隔板21連同第一噴嘴24及第二噴嘴25於鉛直方向升降。阻隔板升降單元27係使阻隔板21、第一噴嘴24以及第二噴嘴25在接近位置(參照圖6D等)與退避位置(參照圖2A及圖6A等)之間升降，該接近位置為阻隔板21的基板對向面6接近至被自轉夾具5保持的基板W的上表面之位置，該退避位置係設置於接近位置的上方之位置。阻隔板升降單元27係可在接近位置與退避位置之間的各位置保持阻隔板21。 SPM供給單元8係包含有：SPM噴嘴(噴嘴)28；噴嘴臂29，前端部係安裝有SPM噴嘴28；SPM配管30，係連接至SPM噴嘴28；SPM閥31，係夾設於SPM配管30；以及噴嘴移動單元32，係連接至噴嘴臂29，並使噴嘴臂29繞著搖動軸線A3搖動而使SPM噴嘴28移動。噴嘴移動單元32係包含有馬達等。 SPM噴嘴28係例如為以連續流動的狀態噴出液體之直式噴嘴(straight nozzle)。在本實施形態中，於SPM噴嘴28的本體的外周面形成有噴出口28a，並從噴出口28a橫向地噴出SPM。然而，亦可採用下述構成來取代此構成：於SPM噴嘴28的本體的下端形成有噴出口，並從噴出口28a朝下噴出SPM。 對SPM配管30供給有來自硫酸過氧化氫水供給源的硫酸過氧化氫水混合液(SPM)。在本實施形態中，供給至SPM配管30的SPM為高溫(例如約170℃至約180℃)。對SPM配管30供給有藉由硫酸與過氧化氫水的反應熱而升溫至前述高溫的SPM。 當SPM閥31開啟時，從SPM噴嘴28的噴出口28a噴出從SPM配管30供給至SPM噴嘴28的高溫的SPM。當SPM閥31關閉時，停止從SPM噴嘴28噴出高溫的SPM。噴嘴移動單元32係使SPM噴嘴28在處理位置與退避位置之間移動，該處理位置為從SPM噴嘴28噴出的高溫的SPM被供給至基板W的上表面之位置，該退避位置為俯視觀看時SPM噴嘴28已退避至自轉夾具5的側方之位置。 圖2B係用以具體地說明處理單元2所含有的對向構件7的周邊的構成之圖。 於貫通孔23的內部插通有上下延伸之中心軸噴嘴33。中心軸噴嘴33係包含有第一噴嘴24、第二噴嘴25以及圍繞第一噴嘴24與第二噴嘴25之筒狀的殼體(casing)34。 於第一噴嘴24的下端形成有用以朝下方噴出液體之第一噴出口35。於第二噴嘴25的下端形成有用以朝下方噴出液體之第二噴出口36。在本實施形態中，第一噴嘴24及第二噴嘴25分別為內管(inner tube)。殼體34係沿著旋轉軸線A2於上下方向延伸。殼體34係以非接觸狀態插入至貫通孔23的內部。因此，阻隔板21的內周係於徑方向隔著間隔圍繞殼體34的外周。 有機溶劑供給單元10係包含有：第一噴嘴24；有機溶劑配管37，係連接至第一噴嘴24，且內部連通至第一噴出口35；第一有機溶劑閥38，係夾設於有機溶劑配管37，用以將有機溶劑予以開閉；以及第二有機溶劑閥39，係夾設於比第一有機溶劑閥38還下游側的有機溶劑配管37，用以將有機溶劑予以開閉。 於有機溶劑配管37中之設定至第一有機溶劑閥38與第二有機溶劑閥39之間的分歧位置40分歧連接有吸引配管41，該吸引配管41的前端係連接有吸引裝置(未圖示)。於吸引配管41夾設有用以將吸引配管41予以開閉之吸引閥42。 當第一有機溶劑閥38開啟時，來自有機溶劑供給源的有機溶劑係被供給至第二有機溶劑閥39。在此狀態下，當第二有機溶劑閥39開啟時，從第一噴出口35朝基板W的上表面中央部噴出供給至第二有機溶劑閥39的有機溶劑。 在吸引裝置的動作狀態中，當在第一有機溶劑閥38關閉且第二有機溶劑閥39開啟的狀態下開啟吸引閥42時，吸引裝置的作動被有效化，有機溶劑配管37中之比分歧位置40還下游側的下游側部分43(以下稱為「有機溶劑下游側部分43」)的內部係被排氣，於有機溶劑下游側部分43所含有之有機溶劑係被吸入至吸引配管41。吸引裝置及吸引閥42係包含於吸引單元44。 水供給單元11係包含有：第二噴嘴25；水配管46，係連接至第二噴嘴25，且內部連通至第二噴出口36；以及水閥47，用以將水配管46予以開閉，並切換從水配管46朝第二噴嘴25供給水以及停止供給水。當水閥47開啟時，來自水供給源的水係被供給至水配管46並從第二噴出口36朝基板W的上表面中央部噴出。供給至水配管46的水係例如為碳酸水，但並未限定於碳酸水，亦可為去離子水(DIW；deionized water)、電解離子水、氫水、臭氧水以及稀釋濃度(例如10ppm至100ppm左右)的鹽酸水中的任一者。 處理單元2係進一步包含有：惰性氣體配管48，係對殼體34的外周與阻隔板21的內周之間的筒狀的空間供給惰性氣體；以及惰性氣體閥49，係夾設於惰性氣體配管48。當惰性氣體閥49開啟時，來自惰性氣體供給源的惰性氣體係通過殼體34的外周與阻隔板21的內周之間從阻隔板21的下表面中央部朝下方噴出。因此，當在阻隔板21配置於接近位置的狀態下開啟惰性氣體閥49時，從阻隔板21的下表面中央部噴出的惰性氣體係於基板W的上表面與阻隔板21的基板對向面6之間朝外側(從旋轉軸線A1遠離的方向)擴展，基板W與阻隔板21之間的空氣係被置換成惰性氣體。於惰性氣體配管48內流動之惰性氣體係例如為氮氣。惰性氣體並未限定於氮氣，亦可為氦氣或氬氣等其他的惰性氣體。 如圖2A所示，處理罩12係包含有：複數個罩部(第一罩部51及第二罩部52)，係以雙重地圍繞自轉夾具5之方式固定性地配置；複數個防護罩(第一防護罩53及第二防護罩54)，係用以接住飛散至基板W的周圍的處理液(SPM、有機溶劑或水)；以及防護罩升降單元(升降單元)55，係獨立地使各個防護罩升降。防護罩升降單元55係例如為包含有滾珠螺桿機構之構成。 處理罩12係可以於上下方向重疊之方式收容，防護罩升降單元55係使第一防護罩53及第二防護罩54中的至少一者升降，藉此進行處理罩12的展開及摺疊。 第一罩51係呈圓環狀，並在自轉夾具5與圓筒構件50之間圍繞自轉夾具5的周圍。第一罩部51係具有相對於基板W的旋轉軸線A1大致旋轉對稱的形狀。第一罩部51係呈剖面U字狀，並區劃第一排液槽59，該第一排液槽59係用以將已使用於基板W的處理之處理液予以排液。於第一排液槽59的底部的最低處開口有第一排液口(未圖示)，於第一排液口連接有第一排液配管61。通過第一排液配管61排液的處理液係被輸送至預定的回收裝置或廢棄裝置，並被該回收裝置或廢棄裝置進行處理。第二罩部52係呈圓環狀，並圍繞第一罩部51的周圍。第二罩部52係具有相對於基板W的旋轉軸線A1大致旋轉對稱的形狀。第二罩52係呈剖面U字狀，並區劃第二排液槽62，該第二排液槽62係用以收集並回收已使用於基板W的處理之處理液。於第二排液槽62的底部的最低處開口有第二排液口(未圖示)，於第二排液口連接有第二排液配管64。通過第二排液配管64排液的處理液係被輸送至預定的回收裝置或廢棄裝置，並被該回收裝置或廢棄裝置進行處理。 內側的第一防護罩53係圍繞自轉夾具5的周圍，並具有相對於自轉夾具5所為之基板W的旋轉軸線A1大致旋轉對稱的形狀。第一防護罩53係一體性地具備有：圓筒狀的導引部66，係圍繞自轉夾具5的周圍；以及圓筒狀的處理液分離壁67，係連結至導引部66。導引部66係具有：圓筒狀的下端部68，係圍繞自轉夾具5的周圍；筒狀的厚壁部69，係從下端部68的上端朝外側(從基板W的旋轉軸線A1遠離的方向)延伸；圓筒狀的中段部70，係從厚壁部69的上表面外周部朝鉛直上方延伸；以及圓環狀的上端部71，係從中段部70的上端朝內側(接近基板W的旋轉軸線A1的方向)斜上方地延伸。 處理液分離壁67係從厚壁部69的外周部微量地朝鉛直下方延伸，並位於第二排液槽62上。此外，導引部66的下端部68係位於第一排液槽59上，並以最接近第一防護罩53與第一罩部51的狀態下收容於第一排液槽59的內部。導引部66的上端部71的內周端係呈俯視觀看時比被自轉夾具5保持的基板W還大徑的圓形。此外，如圖2A等所示，導引部66的上端部71的剖面形狀係可為直線狀，亦可為例如一邊描繪圓滑的圓弧狀一邊延伸。 外側的第二防護罩54係在第一防護罩53的外側中圍繞自轉夾具5的周圍，並具有相對於自轉夾具5所為之基板W的旋轉軸線A1大致旋轉對稱的形狀。第二防護罩54係具有：圓筒部72，係與第一防護罩53同軸；上端部73，係從圓筒部72的上端朝中心側(接近基板W的旋轉軸線A1的方向)斜上方延伸；以及圓環狀的突部(閉塞部)75，係在圓筒部72的例如下端部中朝外側突出。上端部73的內周端係作成俯視觀看時比被自轉夾具5保持的基板W還大徑的圓形。此外，如圖2A等所示，上端部73的剖面形狀係可為直線狀，亦可例如一邊描繪圓滑的圓弧一邊延伸。上端部73的前端係區劃處理罩12的上部開口部12a(參照圖2A)。 圓筒部72係位於第二排液槽62上。此外，上端部73係以於上下方向與第一防護罩53的導引部66的上端部71重疊之方式設置，並以在第一防護罩53與第二防護罩54最接近的狀態下保持微小的間隙接近導引部66的上端部71之方式形成。折返部74係以在第一防護罩53與第二防護罩54最接近的狀態下於水平方向與導引部66的上端部71重疊之方式形成。突部75係具有由平坦的水平面所構成的圓環狀的上表面。 防護罩升降單元55係使各個防護罩在下述的上位置P1(參照圖3B等)與防護罩的上端部位於比基板W還下方的下位置P3(參照圖3C等)之間升降。 第一防護罩53及第二防護罩54的上位置P1係分別為設定至比下述的接液位置P2(參照圖3A等)還上方之高度位置。各個防護罩(第一防護罩53及第二防護罩54)的上位置P1係形成於防護罩的上端與對向構件7(基板對向面6)之間的環狀間隙86(參照圖6B)的大小(上下方向寬度)變得比噴嘴臂29的上下寬度W1還大之位置。 以其他觀點而言，各個防護罩的上位置P1係比噴嘴臂29的下端面29a還下方且比噴出口28a還上方之位置。更具體而言，各個防護罩的上位置P1係防護罩的上端與噴嘴臂29的下端面29a(噴嘴臂29的下端)之間的第一間隔87(參照圖6B)變得與噴嘴臂29的下端面29a與SPM噴嘴28的噴出口28a之間的第二間隔(參照圖6A及圖6B)88同等或比該第二間隔88還狹窄之位置。更具體而言，各個防護罩的上位置P1係防護罩的上端變得比噴嘴臂29的下端面29a與被自轉夾具5保持的基板W的上表面之間的中間位置M(參照圖3B)還上方之位置。 防護罩升降單元55係可在上位置P1與下位置P3之間的任意的位置保持第一防護罩53及第二防護罩54。具體而言，防護罩升降單元55係將第一防護罩53及第二防護罩54分別保持於上位置P1、下位置P3以及設定至上位置P1與下位置P3之間的接液位置P2。第一防護罩53及第二防護罩54的接液位置P2係防護罩的上端部位於比基板W還上方之高度位置。對基板W供給處理液以及基板W的乾燥係在某個防護罩(第一防護罩53及第二防護罩54)與基板W的周端面對向的狀態下進行。 圖3A至圖3C係用以說明第一防護罩53及第二防護罩54的高度位置與腔室4的內部的氣流的流動之示意性的圖。圖3A係顯示第二防護罩54配置於接液位置P2的狀態。圖3B係顯示第二防護罩54配置於上位置P1的狀態。圖3C係顯示第二防護罩54配置於下位置P3的狀態。 作為使內側的第一防護罩53與基板W的周端面對向之手法，有下述兩個手法。 如圖3B中以實線所示，第一個手法為將第一防護罩53及第二防護罩54皆配置於上位置P1。以下將此種處理罩12的狀態稱為「第一上位置狀態」。此外，在第一上位置狀態中，折返部74係在水平方向與導引部66的上端部71重疊，亦即第一防護罩53及第二防護罩54隔著狹窄間隔重疊。 如圖3A中以實線所示，第二個手法係將第一防護罩53及第二防護罩54皆配置於接液位置P2之手法。以下將此種處理罩12的狀態稱為「第一接液位置狀態」。此外，在第一接液位置狀態中，折返部74係於水平方向與導引部66的上端部71重疊，亦即第一防護罩53及第二防護罩54係隔著狹窄間隔重疊。 此外，作為使外側的第二防護罩54與基板W的周端面對向之手法係有下述兩個手法。 如圖3B中以二點鍊線所示，第一個手法係將第一防護罩53配置於下位置P3且將第二防護罩54配置於上位置P1之手法。以下將此種處理罩12的狀態稱為「第二上位置狀態」。 如圖3A中以二點鍊線所示，第二個手法係將第一防護罩53配置於下位置P3且將第二防護罩54配置於接液位置P2之手法。以下將此種處理罩12的狀態稱為「第二接液位置狀態」。在第二接液位置狀態中，第一防護罩53及第二防護罩54的間隔係上下地擴展。 此外，如圖3C所示，處理罩12亦可作成所有的防護罩(第一防護罩53及第二防護罩54)皆未與基板W的周端面對向。在此狀態下，第一防護罩53及第二防護罩54皆配置於下位置P3。以下將此種處理罩12的狀態稱為「退閉狀態」。 如圖3C所示，在處理罩12的退避狀態中，於第二防護罩54的突部75(的上表面)與分隔板16(的下表面)之間隔著大的間隔(上下方向的間隔約70mm)W2。因此，在氣體通過突部75與分隔板16之間時，幾乎不會有氣體的壓力損失。 另一方面，在此狀態下，由於第二防護罩54的上端位於比基板W的周端面還下方，因此自轉夾具5(自轉基座19)與第二防護罩54的前端(折返部74)之間的間隔狹窄，故在氣體通過自轉夾具5與第二防護罩54的前端之間的間隙S0時氣體的壓力損失大。因此，在處理罩12的退避狀態中流動於腔室4的內部之降流DF1係專一地通過突部75與分隔板16之間並進入至腔室4的下部空間4a。 此外，如圖3A所示，在處理罩12的第一接液位置狀態或第二接液位置狀態中，第二防護罩54的突部75(的上表面)與分隔板16(的下表面)之間的間隙S係間隔成比退避狀態的情形還狹窄(上下方向的間隔約30mm且左右方向的間隔約2mm)。因此，氣體通過突部75與分隔板16之間的間隙S之壓力損失係變得比退避狀態還大。此外，由於第二防護罩54的上端位於比基板W的周端面還上方，因此自轉夾具5與第二防護罩54的前端之間的間隙S0比退避狀態的情形還廣，從而氣體通過自轉夾具5與第二防護罩54的前端之間時的壓力損失係比退避狀態的情形還小(亦即存在某種程度)。因此，在處理罩12的第一接液位置狀態或第二接液位置狀態中於腔室4的內部之降流DF2係通過突部75與分隔板16之間的間隙S以及自轉夾具5與第二防護罩54的前端之間的間隙S0雙方並進入至腔室4的下部空間4a。 如圖3B所示，在處理罩12的第一上位置狀態或第二上位置狀態中第二防護罩54的突部75的上表面與分隔板16的下表面接觸，藉此突部75與分隔板16之間的間隙S略為零(實質上被閉塞，更嚴格而言上下方向的間隔為約3mm且左右方向的間隔為約2mm)。 另一方面，在此狀態下，由於第二防護罩54的上端位於比基板W的周端面還非常上方，因此自轉夾具5(自轉基座19)與第二防護罩54的前端之間的間隔極大，從而在氣體通過自轉夾具5與第二防護罩54的前端之間時幾乎不會產生氣體的壓力損失。因此，在處理罩12的第一上位置狀態或第二上位置狀態中於腔室4的內部流動之降流DF3係專一地通過自轉夾具5與第二防護罩54的前端之間並進入至腔室4的下部空間4a。 圖4係用以說明基板處理裝置1的主要部分的電性構成之方塊圖。 控制裝置3係使用例如微電腦(microcomputer)所構成。控制裝置3係具有CPU(Central Processing Unit；中央處理器)等運算單元、固定記憶體器件及硬碟驅動器等記憶單元、以及輸入輸出單元。記憶單元係記憶有讓運算單元執行的程式。 控制裝置3係控制自轉馬達17、噴嘴移動單元32、阻隔板旋轉單元26、阻隔板升降單元27以及防護罩升降單元55等的動作。此外，控制裝置3係將SPM閥31、第一有機溶劑閥38、第二有機溶劑閥39、吸引閥42、水閥47以及惰性氣體閥49等予以開閉。 圖5係用以說明處理單元2所為之第一基板處理例之流程圖。圖6A至圖6E係用以說明第一基板處理例之示意圖。 以下參照圖2A、圖2B以及圖5說明第一基板處理例。適當地參照圖3A至圖3C以及圖6A至圖6E。第一基板處理例為用以去除形成於基板W的上表面的阻劑(resist)之阻劑去除處理。如下所述般，第一基板處理例係包含有：SPM供給步驟(第一藥液供給步驟)S3，係將SPM供給至基板W的上表面；以及有機溶劑步驟(第二藥液供給步驟)S5，係將IPA等液體的有機溶劑供給至基板W的上表面。SPM與有機溶劑係藉由混合接觸會伴隨著危險(在此情形中為急遽的反應)之藥液的組合。 在藉由處理單元2對基板W施予阻劑去除處理時，將高劑量的離子植入處理後的基板W搬入至腔室4的內部(圖5的步驟S1)。被搬入的基板W為未接受用以將阻劑予以灰化(ashing)之處理的基板。此外，於基板W的表面形成有細微且高縱橫比(aspect ratio)之細微圖案。 在對向構件7(亦即阻隔板21及中心軸噴嘴33)退避至退避位置且SPM噴嘴28從自轉夾具5的上方退避且第一防護罩53及第二防護罩54下降至下位置的狀態(第一防護罩53及第二防護罩54的上端皆配置於比基板W的保持位置還下方的狀態)下，控制裝置3係使正在保持基板W之基板搬運機器人CR(參照圖1)的手部H(參照圖1)進入至腔室4的內部。藉此，在將基板W的表面(阻劑形成面)朝向上方的狀態下將基板W授受至自轉夾具5。之後，基板W係被自轉夾具5保持。 之後，控制裝置3係藉由自轉馬達17使基板W開始旋轉(圖5的步驟S2)。基板W係上升至預先設定的液體處理速度(在約10rpm至500rpm的範圍內，例如約400rpm)，並維持在該液體處理速度。 接著，控制裝置3係進行用以將高溫的SPM供給至基板W的上表面之SPM供給步驟(圖5的步驟S3)。在SPM供給步驟S3中，控制裝置3係將來自SPM噴嘴28之高溫的SPM供給至例如基板W的上表面中央部，俾從基板W的表面剝離阻劑。 具體而言，控制裝置3係控制噴嘴移動單元32，藉此使SPM噴嘴28從退避位置移動至處理位置。藉此，如圖6A所示，SPM噴嘴28係配置於基板W的中央部的上方。 SPM噴嘴28配置於處理位置(例如中央位置)後，控制裝置3係控制防護罩升降單元55，使第一防護罩53及第二防護罩54分別上升至上位置(使處理罩12的狀態遷移至第一上位置狀態)，並使第一防護罩53與基板W的周端面對向。 如圖6B所示，在處理罩12的第一上位置狀態中，第二防護罩54的上端與噴嘴臂29的下端面29a之間的第一間隔87(例如略為零)係變得比噴嘴臂29的下端面29a與SPM噴嘴28的噴出口28a之間的第二間隔88(例如約5mm)還狹窄。進一步而言，在處理罩12的第一上位置狀態中，為第二防護罩54的上端位於比噴嘴臂29的下端面29a與被自轉夾具5保持的基板W的上表面之間的中間位置M(參照圖3B)還上方之位置。 第一防護罩53及第二防護罩54上升後，控制裝置3係開啟SPM閥31。藉此，如圖6B所示，高溫(例如約170℃至約180℃)的SPM從SPM配管30供給至SPM噴嘴28，並從該SPM噴嘴28的噴出口28a噴出高溫的SPM。從SPM噴嘴28噴出的高溫的SPM係著液至基板W的上表面的中央部，並接受基板W的旋轉所為之離心力沿著基板W的上表面朝外側流動。藉此，基板W的上表面全域係被SPM的液膜覆蓋。藉由高溫的SPM，阻劑係從基板W的表面剝離並從該基板W的表面去除。此外，亦可使來自SPM噴嘴28的高溫的SPM的供給位置在基板W的上表面中央部與上表面周緣部之間移動(掃描)。 供給至基板W的上表面的SPM係從基板W的周緣部朝基板W的側方飛散，並被第一防護罩53的內壁接住。接著，沿著第一防護罩53的內壁流下的SPM係在被收集至第一排液槽59後被導引至第一排液配管61，並被導引至用以將SPM予以排液處理之排液處理裝置(未圖示)。 在SPM供給步驟S3中，由於所使用的SPM非常高溫(例如約170℃至約180℃)，因此產生大量的SPM的霧氣MI。藉由對基板W供給SPM，大量地產生於基板W的上表面周圍的SPM的霧氣MI係在基板W的上表面上浮游。 在SPM供給步驟S3中，為了達成接住從基板W飛散的藥液之目的，防護罩(至少第二防護罩54)的高度為充分的高度，不過在較低的高度位置之情形中，會有處理罩12的內部中之包含有SPM的霧氣MI等之氛圍通過處理罩12的上部開口12a流出至處理罩12外並擴散至腔室4的內部之虞。由於包含有SPM的霧氣MI等之氛圍係變成微粒而成為附著於基板W並污染該基板W及污染腔室4的隔壁13的內壁之原因，因此不希望此種氛圍擴散至周圍。 在第一基板處理例的SPM供給步驟S3中，在第一防護罩53及第二防護罩54配置於上位置的狀態下(亦即處理罩12的第一上位置狀態)，高溫的SPM被供給至處於旋轉狀態的基板W的上表面。在處理罩12的第一上位置狀態中，在配置於上位置P1的狀態的第二防護罩54的上端與阻隔板21的基板對向面6之間所形成的環狀間隙86(參照圖3B)係設定成狹窄。因此，處理罩12內的氛圍難以通過環狀間隙86流出至腔室4的內部。藉此，能抑制或防止包含有處理罩12的內部中的SPM的霧氣MI之氛圍流出至腔室4的內部。 此外，在處理罩12的第一上位置狀態中，由於突部75與分隔板16之間的間隙S變成略為零，因此於腔室4的內部流動之降流DF3(參照圖3B)係通過自轉夾具5與第二防護罩54的前端之間進入至腔室4的下部空間4a。藉此，能更有效地抑制包含有SPM的霧氣MI之氛圍從處理罩12流出至腔室4的內部。 此外，在處理罩12的第一上位置狀態(圖3B中以實線所示的狀態)中，第一防護罩53與第二防護罩54最接近。在此狀態中，折返部74係於水平方向與導引部66的上端部71重疊。因此，在SPM供給步驟S3中，在基板W的上表面上浮游的SPM的霧氣MI不會進入至第一防護罩53與第二防護罩54之間。於SPM供給步驟S3開始前，會有IPA附著於第二防護罩54的內壁之情形。然而，由於SPM的霧氣MI不會進入至第一防護罩53與第二防護罩54之間，因此在SPM供給步驟S3中能抑制或防止SPM與IPA在處理罩12的內部中混合接觸。藉此，能抑制或防止處理罩12的內部成為微粒產生源。 當從開始噴出高溫的SPM經過預先設定的期間時，結束SPM供給步驟S3。具體而言，控制裝置3係關閉SPM閥31，停止從SPM噴嘴28噴出高溫的SPM。此外，控制裝置3係控制防護罩升降單元55，使第一防護罩53及第二防護罩54分別下降至接液位置P2。第一防護罩53及第二防護罩54開始下降後，控制裝置3係控制噴嘴移動單元32，使SPM噴嘴28退避至退避位置。 接著，進行用以將作為清洗液的水供給至基板W的上表面之水供給步驟(圖5的步驟S4)。具體而言，控制裝置3係開啟水閥47。藉此，如圖6C所示，從中心軸噴嘴33(的第二噴嘴25(參照圖2B))朝基板W的上表面中央部噴出水。從中心軸噴嘴33噴出的水係著液至基板W的上表面中央部，接受基板W的旋轉所為之離心力並於基板W的上表面上朝基板W的周緣部流動。基板W上的SPM係被該水沖流至外側並排出至基板W的周圍。結果，基板W上的SPM的液膜係被置換成用以覆蓋基板W的上表面全域之水的液膜。亦即，藉由作為清洗液的水從基板W的上表面沖流SPM。 於基板W的上表面流動之水係從基板W的周緣部朝基板W的側方飛散，並被第一防護罩53的內壁接住。接著，沿著第一防護罩53的內壁流下的水係被收集至第一排液槽59後被導引至第一排液配管61，並被導引至用以將水予以排液處理之排液處理裝置(未圖示)。在已在SPM供給步驟中使用的SPM的液體附著於第一防護罩53的內壁、第一排液槽59及／或第一排液配管61的管壁之情形中，該SPM的液體係被水沖流。 當從開始噴出水經過預先設定的期間時，控制裝置3係關閉水閥47，停止從第二噴嘴25噴出水。藉此，結束水供給步驟S4。 接著，進行用以將作為有機溶劑的IPA供給至基板W的上表面之有機溶劑步驟(圖5的步驟S5)。具體而言，如圖6D所示，控制裝置3係控制阻隔板升降單元27，將阻隔板21配置於接近位置。在阻隔板21位於接近位置時，阻隔板21係將基板W的上表面與基板W的周圍的空間阻隔。 此外，控制裝置3係控制防護罩升降單元55，在第一防護罩53配置於下位置P3的狀態下，將第二防護罩54配置於上位置P1並使第二防護罩54與基板W的周端面相對向。 此外，控制裝置3係將基板W的旋轉減速至預定的覆液(paddle)速度。所謂覆液速度係指以覆液速度使基板W旋轉時作用於基板W的上表面的液體之離心力比在清洗液與基板W的上表面之間作用之表面張力還小或者前述離心力與前述表面張力大致相抗之速度。 接著，在基板W的旋轉速度下降至覆液速度後，控制裝置3係開啟第二有機溶劑閥39並關閉吸引閥42，且開啟第一有機溶劑閥38。藉此，來自有機溶劑供給源的IPA被供給至第一噴嘴24，從第一噴嘴24噴出IPA並著液至基板W的上表面。 在有機溶劑步驟S5中，藉由從第一噴嘴24噴出IPA，於基板W的上表面的液膜所含有的水係依序被置換成IPA。藉此，用以覆蓋基板W的上表面全域之IPA的液膜係於基板W的上表面保持成覆液狀。在基板W的上表面全域的液膜大致被置換成IPA的液膜後，亦繼續進行對基板W的上表面供給IPA。因此，從基板W的周緣部排出IPA。 從基板W的周緣部排出之IPA係被第二防護罩54的內壁接住。接著，沿著第二防護罩54的內壁流下的IPA係被收集至第二排液槽62後被導引至第二排液配管64，並被導引至用以將IPA予以排液處理之處理裝置(未圖示)。 在本實施形態中，從基板W的周緣部排出的IPA係被與基板W的周端面對向之第二防護罩54的內壁接住，而不會被退避於基板W的周端面的下方之第一防護罩53的內壁接住。而且，在有機溶劑步驟S5中，於基板W的周圍所產生的IPA的霧氣為少量，IPA的霧氣亦不會被導入至第一防護罩53的內壁。而且，在SPM供給步驟S3中附著於第一防護罩53的SPM係藉由水供給步驟S4中的水的供給而被沖流。因此，在有機溶劑步驟S5中不會產生IPA與SPM的混合接觸。 當開始噴出IPA經過預先設定的期間時，控制裝置3係關閉第一有機溶劑閥38，停止從第二噴嘴25噴出IPA。藉此，結束有機溶劑步驟S5。 接著，進行用以使基板W乾燥之離心法脫水(spin-drying)步驟(圖5的步驟S6)。具體而言，在控制裝置3將阻隔板21配置於接近位置的狀態下，控制裝置3係控制自轉馬達17，藉此如圖6E所示般，使基板W加速至比從SPM供給步驟S3至有機溶劑步驟S5為止的各個步驟中的旋轉速度還大之乾燥旋轉速度(例如數千rpm)，並以該乾燥旋轉速度使基板W旋轉。藉此，大的離心力施加至基板W上的液體，附著於基板W之液體係被甩離至基板W的周圍。如此，從基板W去除液體使基板W乾燥。此外，控制裝置3係控制阻隔板旋轉單元26，使阻隔板21高速地於基板W的旋轉方向旋轉。 此外，與離心法脫水步驟S6並行地執行用以吸引有機溶劑配管37內的有機溶劑之有機溶劑吸引步驟。該有機溶劑吸引步驟係藉由吸引單元44吸引在有機溶劑步驟S5後存在於有機溶劑配管37的內部之有機溶劑。 具體而言，控制裝置3係在有機溶劑步驟S5結束後，開啟第二有機溶劑閥39並關閉第一有機溶劑閥38，且開啟吸引閥42。藉此，有機溶劑下游側部分43的內部被排氣，存在於有機溶劑下流側部分43的IPA係被引入(吸引)至吸引配管41。IPA的吸引係進行直至IPA的前端面後退至配管內的預定的待機位置。當IPA的前端面後退至待機位置時，控制裝置3係關閉吸引閥42。藉此，能防止在離心法脫水步驟S6中IPA從有機溶劑配管37落液(滴落)。 當從基板W加速經過預先設定的期間時，控制裝置3係控制自轉馬達17使自轉夾具5停止旋轉基板W(圖5的步驟S7)，且控制阻隔板旋轉單元26使阻隔板21停止旋轉。 之後，從腔室4內搬出基板W(圖5的步驟S8)。具體而言，控制裝置3係使阻隔板21上升並配置於退避位置且使第二防護罩54下降至下位置P3，將第一防護罩53及第二防護罩54配置於比基板W的保持位置還下方。之後，控制裝置3係使基板搬運機器人CR的手部保持自轉夾具5上的基板W，並使基板搬運機器人CR的手部H從腔室4內退避。藉此，從腔室4搬出已從表面去除阻劑的基板W。依據該第一基板處理例，在處理罩12的第一上位置狀態下執行SPM供給步驟S3。因此，在SPM供給步驟S3中，能儘量地將第一防護罩53配置於上方，並藉由該第一防護罩53良好地接住從基板飛散的第一藥液。 此外，在SPM供給步驟S3與有機溶劑供給步驟S5中，由於將用以接住處理液的防護罩(第一防護罩53及第二防護罩54)分開，因此能抑制或防止在處理罩12的內部中SPM與IPA混合接觸。藉此，能抑制或防止處理罩12的內部成為微粒產生源。 圖7係用以放大顯示處理單元2的下部的構成例的一例之示意性的剖視圖。亦可於第二罩部52的第二排液配管64的前端連接有水用分歧配管102及IPA用分歧配管103。亦即，於第二排液配管64流通之液體的流通目的地(通過於第一防護罩53與第二防護罩54之間被區劃的內部空間之液體的流通目的地)係分歧成兩個分歧配管(水用分歧配管102及IPA用分歧配管103)。以下說明採用此種兩個分歧配管的情形。 於水用分歧配管102夾設有用以將水用分歧配管102予以開閉之水用開閉閥105。於IPA用分歧配管103夾設有用以將IPA用分歧配管103予以開閉之IPA用開閉閥106。在關閉IPA用開閉閥106的狀態下開啟水用開閉閥105，藉此於第二排液配管64流動之液體的流通目的地係被設定至水用分歧配管102。在關閉水用開閉閥105的狀態下開啟IPA用開閉閥106，藉此於第二排液配管64流動之液體的流通目的地係被設定至IPA用分歧配管103。 圖8A至圖8C係用以說明第二基板處理例之示意性的圖。在基本性的處理流程上，第二基板處理例係與第一基板處理例沒有什麼不同。參照圖2A、圖2B、圖5以及圖7說明第二基板處理例。適當地參照圖8A至圖8C。 與第一基板處理例的差異點在於：第二基板處理例係在SPM供給步驟S3中，處理罩12的狀態並非是配置於第一上位置狀態，而是配置於第二上位置狀態。所謂處理罩12的第二上位置狀態係指第一防護罩53配置於接液位置P2且第二防護罩54配置於上位置之狀態。此外，與第一基板處理例的差異點在於：雖然有在SPM供給步驟S3中將處理罩12設定成第二上位置狀態會導致SPM的霧氣MI附著於在第一防護罩53與第二防護罩54之間所區劃的內部空間的牆壁(第二防護罩54的內壁及第一防護罩53的外壁等)之虞，然而在水供給步驟S4中將處理罩12設定成第二接液位置位置並將從基板W的周緣部飛散的水供給至在第一防護罩53與第二防護罩54之間被區劃的內部空間，藉此以水沖流附著於該內部空間的牆壁(第二防護罩54的內壁及第一防護罩53的外壁等)之SPM的霧氣MI。以下詳細地說明第二基板處理例的SPM供給步驟S3。 在SPM供給步驟S3中，SPM噴嘴28配置於處理位置後，控制裝置3係控制防護罩升降單元55，藉此使第一防護罩53上升至接液位置P2且使第二防護罩54上升至上位置P1，使第二防護罩54與基板W的周端面對向。 與處理罩12的第一上位置狀態同樣地，在處理罩12的第二上位置狀態中，第二防護罩54的上端與噴嘴臂29的下端面29a之間的第一間隔87(例如略為零)係變得比噴嘴臂29的下端面29a與SPM噴嘴28的噴出口28a之間的第二間隔88(例如約5mm)還狹窄。進一步而言，處理罩12的第二上位置狀態係第二防護罩54的上端位於比噴嘴臂29的下端面29a與被自轉夾具5保持的基板W的上表面之間的中間位置M(參照圖3B)還上方之位置。第二防護罩54上升後，控制裝置3係開啟SPM閥31(參照圖2A)。 如圖8A所示，在本實施形態的SPM供給步驟S3中，在第一防護罩53配置於接液位置P2且第二防護罩54配置於上位置P1的狀態(亦即處理罩12的第二上位置狀態)下，對處於旋轉狀態的基板W的上表面供給高溫的SPM。供給至基板W的上表面的SPM係接受基板W的旋轉所為之離心力，從基板W的周緣部朝側方飛散。接著，朝側方飛散的SPM係被處於接液位置P2的第一防護罩53接住並沿著第一防護罩53的內壁流下。於第一防護罩53流下的SPM係被導引至第一排液配管61，並被導引至用以將SPM予以排液處理之排液處理裝置(未圖示)。 此外，在SPM供給步驟S3中，由於所使用的SPM非常高溫(例如約170℃至約180℃)，因此產生大量的SPM的霧氣MI。藉由對基板W供給SPM，大量地產生於基板W的上表面周圍的SPM的霧氣MI係在基板W的上表面上浮游。 在處理罩12的第二上位置狀態中，在配置於上位置P1的狀態的第二防護罩54的上端與阻隔板21的基板對向面6之間所形成的環狀間隙86(參照圖3B)係設定成狹窄。因此，處理罩12內的氛圍難以通過環狀間隙86流出至腔室4的內部。藉此，能抑制或防止包含有處理罩12的內部中的SPM的霧氣MI之氛圍流出至腔室4的內部。 此外，在處理罩12的第二上位置狀態中，由於突部75與分隔板16之間的間隙S變成略為零，因此於腔室4的內部流動之降流DF3(參照圖3B)係通過自轉夾具5與第二防護罩54的前端之間進入至腔室4的下部空間4a，藉此能更有效地抑制包含有SPM的霧氣MI之氛圍從處理罩12流出至腔室4的內部。 在該第二基板處理例的SPM供給步驟S3中，SPM的霧氣MI係進入至在第一防護罩53與第二防護罩54之間所區劃的內部空間，如此會有SPM的霧氣MI附著於內部空間的牆壁(第二防護罩54的內壁及第一防護罩53的外壁等)之虞。 SPM供給步驟S3結束後，控制裝置3係控制防護罩升降單元55，使第一防護罩53從接液位置P2下降至下位置P3，並使第二防護罩54從上位置P1下降至接液位置P2。亦即，使處理罩12的狀態遷移至第二接液位置狀態。在處理罩12的第二接液位置狀態中，第二防護罩54係與基板W的周端面相對向。此外，在噴出水之前，控制裝置3係關閉IPA用開閉閥106並開啟水用開閉閥105，藉此將於第二排液配管64流動之液體的流通目的地設定至水用分歧配管102。第一防護罩53開始下降後，控制裝置3係控制噴嘴移動單元32，使SPM噴嘴28退避至退避位置。 接著，進行水供給步驟(圖5的步驟S4)。具體而言，控制裝置3係開啟水閥47。藉此，如圖8B所示，從中心軸噴嘴33(的第二噴嘴25)(參照圖2B)朝基板W的上表面中央部噴出水。從中心軸噴嘴33噴出的水係著液至基板W的上表面中央部，接受基板W的旋轉所為之離心力並於基板W的上表面上朝基板W的周緣部流動。 供給至基板W的上表面的水係從基板W的周緣部朝基板W的側方飛散並進入至在第一防護罩53與第二防護罩54之間所區劃的內部空間(第二防護罩54的內壁及第一防護罩53的外壁等)，並被第二防護罩54的內壁接住。接著，沿著第二防護罩54的內壁流下的水係被收集至第二排液槽62後被導引至第二排液配管64。在第二基板處理例的水供給步驟S4中，由於在第二排液配管64流動之液體的流通目的地係設定至水用分歧配管102(參照圖7)，因此於第二排液配管64流動的水係被供給至水用分歧配管102後，被輸送至用以將水予以排液處理之處理裝置(未圖示)。 於上述SPM供給步驟S3後，會有SPM的霧氣MI附著於在第一防護罩53與第二防護罩54之間被區劃的內部空間(第二防護罩54的內壁及第一防護罩53的外壁等)的牆壁之虞。然而，在水供給步驟S4中，藉由供給至在第一防護罩53與第二防護罩54之間被區劃的內部空間的水，沖流附著於牆壁的SPM的霧氣MI。當從開始噴出水經過預先設定的期間時，結束水供給步驟S4。 接著，進行用以將作為有機溶劑的IPA供給至基板W的上表面之有機溶劑步驟(圖5的步驟S5)。在IPA開始噴出前，控制裝置3係關閉水用開閉閥105並開啟IPA用開閉閥106，藉此將於第二排液配管64流動之液體的流通目的地設定至IPA用分歧配管103(參照圖7)。有機溶劑步驟S5中之除了上述以外的控制係與第一基板處理例的情形相同。 從基板W的周緣部排出的IPA係被第二防護罩54的內壁接住。接著，沿著第二防護罩54的內壁流下的IPA係被第二排液槽62收集後被導引至第二排液配管64，並被導引至用以將IPA予以排液處理之處理裝置(未圖示)。在第二基板處理例中的有機溶劑步驟S5中，由於在第二排液配管64流動之液體的流通目的地被設定至IPA用分歧配管103，因此於第二排液配管64流動的IPA係被供給至IPA用分歧配管103後，被輸送至用以將IPA予以排液處理之處理裝置(未圖示)。當從IPA開始噴出後經過預先設定的期間時，結束有機溶劑步驟S5。接著，控制裝置3係執行離心法脫水步驟(圖5的步驟S6)。在離心法脫水步驟S6結束後，控制裝置3係使自轉夾具5停止旋轉基板W(圖5的步驟S7)，並使阻隔板21停止旋轉。之後，從腔室4內搬出基板W(圖5的步驟S8)。由於這些各個步驟係與第一基板處理例的情形相同，因此省略各者的說明。 在第二基板處理例中，搬出基板W後，執行用以洗淨處理罩12之罩部洗淨步驟。在罩部洗淨步驟中，使用水作為洗淨液。 在罩部洗淨步驟中，控制裝置3係藉由自轉馬達17(參照圖2A)使自轉基座19開始旋轉。 於將水開始供給至自轉基座19之前，控制裝置3係控制防護罩升降單元55(參照圖2A)，將第一防護罩53保持於下位置P3，並使第二防護罩54上升至接液位置P2。亦即，如圖8C所示，使處理罩12的狀態遷移至第二接液位置狀態。在處理罩12的第二接液位置狀態中，第二防護罩54係與自轉基座19的上表面19a的周緣部對向。 此外，在將水開始供給至自轉基座19之前，控制裝置3係關閉IPA用開閉閥106(參照圖7)並開啟水用開閉閥105(參照圖7)，藉此將於第二排液配管64流動之液體的流通目的地設定至水用分歧配管102(參照圖7)。 當自轉基座19的旋轉速度達至預定的旋轉速度時，控制裝置3係開啟水閥47(參照圖2)。藉此，如圖8C所示，從中心軸噴嘴33(的第二噴嘴25(參照圖2B))開始噴出水。從中心軸噴嘴33噴出的水係著液至自轉基座19的上表面19a的中央部，接受自轉基座19的旋轉所為之離心力，於自轉基座19的上表面19a上朝自轉基座19的周緣部流動，並從自轉基座19的周緣部朝側方飛散。 從自轉基座19的周緣部飛散的水係進入至在第一防護罩53與第二防護罩54之間被區劃的內部空間(第二防護罩54的內壁及第一防護罩53的外壁等)，並被第二防護罩54的內壁接住。接著，沿著第二防護罩54的內壁流下的水係被收集至第二排液槽62後，被導引至第二排液配管64(參照圖7)。在罩部洗淨步驟中，由於在第二排液配管64流動之液體的流通目的地係被設定至水用分歧配管102(參照圖7)，因此於第二排液配管64流動的水係被供給至水用分歧配管102後，被輸送至用以將水予以排液處理之處理裝置(未圖示)。 於搬出基板W後，雖然IPA的液體會附著於在第一防護罩53與第二防護罩54之間被區劃的內部空間的牆壁(第二防護罩54的內壁及第一防護罩53的外壁)以及第二排液槽62與第二排液配管64的管壁，但藉由執行罩部洗淨步驟，藉由水沖流該IPA的液體。 當從開始噴出水經過預先設定的期間時，控制裝置3係關閉水閥47，停止將水供給至自轉基座19的上表面19a。此外，控制裝置3係控制自轉馬達17，使自轉基座19停止旋轉。藉此，結束罩部洗淨步驟。 此外，在第二基板處理例的罩部洗淨步驟中，亦可使自轉夾具5保持碳化矽(SiC)等製的虛設(dummy)基板(具有與基板W相同的直徑)，並對處於旋轉狀態的虛設基板供給水等洗淨液，藉此使水從虛設基板的周緣朝虛設基板的側方飛散。 依據該第二基板處理例，在處理罩12的第二上位置狀態中執行SPM供給步驟S3。因此，在SPM供給步驟S3中，能儘量地將第二防護罩53配置於上方，並藉由該第二防護罩53良好地接住從基板飛散的第一藥液。 此外，會有在SPM供給步驟S3中所產生的SPM的霧氣MI附著於在第一防護罩53與第二防護罩54之間被區劃的內部空間的牆壁(第二防護罩54的內壁及第一防護罩53的外壁等)之虞。然而，在SPM供給步驟S3結束後的水供給步驟S4中，將從基板W的周緣部飛散的水供給至在第一防護罩53與第二防護罩54之間被區劃的內部空間(第二防護罩54的內壁及第一防護罩53的外壁等)，藉此能沖流附著於內部空間的內壁的SPM。因此，能抑制或防止在處理罩12的內部中SPM與IPA混合接觸。藉此，能抑制或防止處理罩12的內部成為微粒產生源。 此外，在有機溶劑供給步驟S5中，以第二防護罩54的內壁接住從基板W排出的處理液。因此，於有機溶劑供給步驟S5結束後，IPA的液體附著於在第一防護罩53與第二防護罩54之間被區劃的內部空間的牆壁。然而，由於在有機溶劑供給步驟S5開始後執行罩部洗淨步驟，因此能藉由水沖流附著於在第一防護罩53與第二防護罩54之間被區劃的內部空間的牆壁(第二防護罩54的內壁及第一防護罩53的外壁)以及第二排液槽62與第二排液配管64的管壁之IPA的液體。因此，能抑制或防止在處理罩12的內部中SPM與IPA混合接觸，藉此能抑制或防止處理罩12的內部成為微粒產生源。 此外，在第二基板處理例中，亦可在SPM供給步驟S3開始前先進行水供給步驟S4。 如上所述，依據本實施形態，在SPM供給步驟S3中，在第二防護罩54配置於上位置P1的狀態下對處於旋轉狀態的基板W的上表面供給高溫的SPM。在第二防護罩54配置於上位置P1的狀態下，大幅地確保處理罩12的上部開口12a與基板W之間的距離。在SPＭ供給步驟S3中，雖然因為對基板W供給高溫的SPM而產生SPM的霧氣，但由於大幅地確保處理罩12的上部開口12a與基板W之間的距離，因此包含有SPM的霧氣之氛圍難以通過處理罩12的上部開口12a流出至處理罩12外。 具體而言，第一防護罩53及第二防護罩54的上位置P1係形成於防護罩的上端與對向構件7(基板對向面6)之間的環狀間隙86係變得比噴嘴臂29的上下寬度W1還大且非常狹窄之位置。藉此，能在容許噴嘴臂29通過的範圍內將環狀間隙86設定成最低限度的大小。在此情形中，能有效地降低從處理罩12的內部流出至腔室4的內部之氛圍的量。藉此，能更有效地抑制包含有SPM的氛圍朝周圍擴散。 此外，從其他觀點而言，第一防護罩53及第二防護罩54的上位置P1係比噴嘴臂29的下端面29a還下方且比噴出口28a還上方之位置。更具體而言，第一防護罩53及第二防護罩54的上位置P1係防護罩的上端與噴嘴臂29的下端面38a之間的第一間隔87變得比噴嘴臂29的下端面29a與SPM噴嘴28的噴出口34a之間的第二間隔88還狹窄之位置。再者，第一防護罩53及第二防護罩54的上位置P1係防護罩的上端變成比噴嘴臂29的下端面38a與被自轉夾具5保持的基板W的上表面之間的中間位置M(參照圖3B)還上方之位置。 藉由將上位置P1設定至此種位置，能有效地減少從處理罩12流出至腔室4的內部之氛圍的量。藉此，能更有效地抑制包含有SPM的氛圍擴散至周圍。 以上雖然已說明本發明的實施形態之一，但本發明亦可以其他的形態來實施。 例如在第一基板處理例及第二基板處理例中，亦可作成在水供給步驟S4結束後執行用以將洗淨藥液供給至基板W的上表面之洗淨藥液供給步驟。在此情形中，能使用氟酸或SC1(包含有NH4 OH與H2 O2 之混合液)作為在洗淨藥液供給步驟所使用的洗淨藥液。在執行洗淨藥液供給步驟之情形後，執行用以藉由清洗液沖流基板W的上表面的藥液之第二水供給步驟。 此外，在第一基板處理例及第二基板處理例中，亦可在SPM供給步驟S3執行後或洗淨藥液供給步驟執行後，進行用以將過氧化氫水(H2 O2 )供給至基板W的上表面(表面)之過氧化氫水供給步驟。 此外，在上述實施形態中，雖然例示IPA作為使用於第二藥液的一例的有機溶劑的一例，但除此之外亦可例示甲醇、乙醇、HFE(hydrofluoroether；氫氟醚)、丙酮等作為有機溶劑。此外，作為有機溶劑，並未限定於僅由單體成分所構成之情形，亦可為與其他成分混合的液體。例如，亦可為IPA與丙酮的混合液，或亦可為IPA與甲醇的混合液。 雖然已詳細地說明本發明的實施形態，但這些實施形態僅為用以明瞭本發明的技術性內容之具體例，本發明不應被這些具體例限定地解釋，本發明的範圍僅被隨附的申請專利範圍所限定。 本發明係與2016年8月24日於日本特許廳所提出的日本特願2016-163744號對應，並將日本特願2016-163744號的全部內容援用並組入至本發明中。FIG. 1 is a schematic plan view for explaining the internal layout of a substrate processing apparatus 1 according to one embodiment of the present invention. The substrate processing apparatus 1 is a blade-type apparatus for processing substrates W such as silicon wafers one by one. In this embodiment, the substrate W is a disc-shaped substrate. The substrate processing apparatus 1 includes: a plurality of processing units 2 for processing a substrate W with a processing liquid; a load port LP is mounted with a carrier C, and the carrier C is used for accommodating A plurality of substrates W processed by the processing unit 2; the transfer robot IR and the transfer robot CR, which transport the substrate W between the load port LP and the processing unit 2; and the control device 3, which controls the substrate processing device 1. The transfer robot IR transfers the substrate W between the carrier C and the substrate transfer robot CR. The substrate transfer robot CR transfers the substrate W between the transfer robot IR and the processing unit 2. The plural processing units 2 have the same configuration, for example. FIG. 2A is a schematic cross-sectional view for explaining a configuration example of the processing unit 2. The processing unit 2 includes: a box-shaped chamber 4; a rotation jig (substrate holding unit) 5, which holds a substrate W in a horizontal position in the chamber 4 so that the substrate W passes through the center of the substrate W in a vertical direction. The rotation axis A1 rotates; the opposite member 7 has a substrate opposite surface 6 opposite to the upper surface (main surface) of the substrate W held by the rotation fixture 5; SPM (sulfuric acid/hydrogen peroxide mixture; sulfuric acid peroxidation) Hydrogen-water mixed solution) supply unit (first chemical solution supply unit) 8 for supplying sulfuric acid and hydrogen peroxide-water mixed solution (SPM) as the first chemical solution to the substrate W held by the rotation jig 5; organic solvent The supply unit (second chemical liquid supply unit) 10 is an example of supplying an organic solvent (organic solvent with low surface tension) as the second chemical liquid to the surface (upper surface) of the substrate W held by the rotation jig 5 Isopropyl alcohol (IPA; isopropyl alcohol) liquid; a water supply unit 11 for supplying water as a rinse liquid to the surface (upper surface) of the substrate W held by the rotation jig 5; and a cylindrical processing cover 12 , Department around the autorotation fixture 5. The chamber 4 includes: a box-shaped partition wall 13 for accommodating a rotation jig 5 or nozzle; an FFU (fan filter unit) 14 as a blower unit, which transports and cleans the inside of the partition wall 13 from the upper part of the partition wall 13 Air (air filtered by a filter); and a partition plate 16, which divides the side area 15 of the processing cover 12 in the chamber 4 up and down into an upper area 15a and a lower area 15b in the interior of the chamber 4. The FFU 14 is arranged above the partition wall 13 and installed on the top of the partition wall 13. The control device 3 controls the FFU 14 in such a way that the FFU 14 conveys clean air into the chamber 4 from the top of the partition wall 13 downward. An exhaust port 9 is opened at the lower or bottom of the partition wall 13. An exhaust duct 9a is connected to the exhaust port 9. The exhaust device sucks the atmosphere of the lower space 4a (the space below the partition plate 16 in the vertical direction in the inner space of the chamber 4) inside the chamber 4, and exhausts the lower space 4a. The FFU 14 supplies clean air to the inside of the chamber 4 and the exhaust device exhausts the lower space 4 a of the chamber 4, thereby forming a down flow (down flow) in the chamber 4. The processing of the substrate W is performed in a state where a downflow is formed in the chamber 4. The partition plate 16 is arranged between the outer wall of the processing cover 12 and the partition wall 13 (side partition wall) of the chamber 4. The inner end of the partition plate 16 is arranged along the outer peripheral surface of the outer wall of the processing cover 12. The outer end portion of the partition plate 16 is arranged along the inner surface of the partition wall 13 (side partition wall) of the chamber 4. The SPM nozzle 28 and the nozzle arm 29 described later are arranged above the partition plate 16. The partition plate 16 may be a single plate or a plurality of plates arranged at the same height. The upper surface of the partition plate 16 may be horizontal, or may extend obliquely upward toward the rotation axis A1. As the rotation jig 5, a clamping jig for clamping the substrate W in the horizontal direction and holding the substrate W horizontally is used. Specifically, the spin jig 5 includes: a spin motor (rotation unit) 17; a lower spin shaft 18 integrated with the drive shaft of the spin motor 17; and a disc-shaped spin base (spin base) ) 19, is installed slightly horizontally on the upper end of the lower autorotation shaft 18. The rotation base 19 is equipped with the upper surface 19a which consists of a flat surface. Plural (three or more, for example, six) clamping members 20 are arranged on the peripheral edge portion of the upper surface 19 a of the rotation base 19. A plurality of clamping members 20 are arranged on a circumference corresponding to the outer peripheral shape of the substrate W in the peripheral edge portion of the upper surface of the rotation base 19 at appropriate intervals. In addition, the rotation jig 5 is not limited to a clamping type rotation jig. For example, a vacuum suction type rotation jig (vacuum clamp) may be used. The vacuum suction type rotation jig vacuum sucks the back surface of the substrate W. The substrate W is held in a horizontal posture, and in this state, the substrate W is rotated about a vertical rotation axis, so that the substrate W held by the rotation jig 5 is rotated. The opposing member 7 includes: a barrier plate 21; and an upper rotation shaft 22, which is coaxially arranged on the barrier plate 21. The barrier plate 21 has a disc shape, and has a diameter substantially the same as that of the substrate W or a diameter equal to or greater than the diameter of the substrate W. The substrate facing surface 6 forms the lower surface of the barrier plate 21, and is a circular shape facing the entire upper surface of the substrate W. A cylindrical through hole 23 (see FIG. 2B) is formed in the center of the substrate facing surface 6, and the through hole 23 penetrates the barrier plate 21 and the upper autorotation shaft 22 vertically. The inner peripheral wall of the through hole 23 is partitioned by a cylindrical surface. The first nozzle 24 and the second nozzle 25 respectively extending upward and downward are inserted into the through hole 23. A barrier rotating unit 26 is coupled to the upper rotation shaft 22. The baffle plate rotating unit 26 rotates the upper rotation shaft 22 together with the baffle plate 21 around the rotation axis A2. The baffle plate 21 is combined with a baffle plate lifting unit 27 including an electric motor and a ball screw. The barrier plate lifting unit 27 lifts the barrier plate 21 together with the first nozzle 24 and the second nozzle 25 in the vertical direction. The barrier lifting unit 27 lifts and lowers the barrier 21, the first nozzle 24, and the second nozzle 25 between the approaching position (refer to FIG. 6D, etc.) and the retreat position (refer to FIGS. 2A and 6A, etc.). The approaching position is the barrier The substrate facing surface 6 of the plate 21 approaches to the position of the upper surface of the substrate W held by the rotation jig 5, and the retracted position is set at a position above the approached position. The barrier lifting unit 27 can hold the barrier 21 at each position between the approaching position and the retreating position. The SPM supply unit 8 includes: an SPM nozzle (nozzle) 28; a nozzle arm 29 with an SPM nozzle 28 installed at the tip; an SPM piping 30 connected to the SPM nozzle 28; an SPM valve 31, which is clamped to the SPM piping 30 And the nozzle moving unit 32 is connected to the nozzle arm 29, and the nozzle arm 29 is rocked around the rocking axis A3 to move the SPM nozzle 28. The nozzle moving unit 32 includes a motor and the like. The SPM nozzle 28 is, for example, a straight nozzle that ejects liquid in a continuous flow state. In the present embodiment, an ejection port 28a is formed on the outer peripheral surface of the main body of the SPM nozzle 28, and the SPM is ejected laterally from the ejection port 28a. However, instead of this structure, the following structure may be adopted: an ejection port is formed at the lower end of the main body of the SPM nozzle 28, and the SPM is ejected downward from the ejection port 28a. The SPM pipe 30 is supplied with a sulfuric acid hydrogen peroxide water mixture (SPM) from a sulfuric acid hydrogen peroxide water supply source. In this embodiment, the SPM supplied to the SPM pipe 30 is high temperature (for example, about 170°C to about 180°C). The SPM pipe 30 is supplied with SPM heated to the aforementioned high temperature by the reaction heat of sulfuric acid and hydrogen peroxide water. When the SPM valve 31 is opened, the high-temperature SPM supplied from the SPM pipe 30 to the SPM nozzle 28 is ejected from the ejection port 28 a of the SPM nozzle 28. When the SPM valve 31 is closed, the ejection of high-temperature SPM from the SPM nozzle 28 is stopped. The nozzle moving unit 32 moves the SPM nozzle 28 between a processing position and a retracted position where the high-temperature SPM ejected from the SPM nozzle 28 is supplied to the upper surface of the substrate W. The retracted position is when viewed from above. The SPM nozzle 28 has retracted to a position on the side of the rotation jig 5. FIG. 2B is a diagram for specifically explaining the configuration of the periphery of the facing member 7 included in the processing unit 2. A central axis nozzle 33 extending up and down is inserted into the through hole 23. The central axis nozzle 33 includes a first nozzle 24, a second nozzle 25, and a cylindrical casing 34 surrounding the first nozzle 24 and the second nozzle 25. A first ejection port 35 for ejecting liquid downward is formed at the lower end of the first nozzle 24. A second ejection port 36 for ejecting liquid downward is formed at the lower end of the second nozzle 25. In this embodiment, the first nozzle 24 and the second nozzle 25 are each an inner tube. The housing 34 extends in the vertical direction along the rotation axis A2. The housing 34 is inserted into the through hole 23 in a non-contact state. Therefore, the inner circumference of the baffle plate 21 surrounds the outer circumference of the housing 34 at intervals in the radial direction. The organic solvent supply unit 10 includes: a first nozzle 24; an organic solvent pipe 37 connected to the first nozzle 24 and internally communicated with the first ejection port 35; and a first organic solvent valve 38 sandwiched between the organic solvent The piping 37 is used to open and close the organic solvent; and the second organic solvent valve 39 is interposed on the organic solvent piping 37 downstream of the first organic solvent valve 38 to open and close the organic solvent. In the organic solvent pipe 37 set to the branch position 40 between the first organic solvent valve 38 and the second organic solvent valve 39, a suction pipe 41 is branched and connected, and a suction device (not shown) is connected to the tip of the suction pipe 41 ). A suction valve 42 for opening and closing the suction pipe 41 is sandwiched between the suction pipe 41. When the first organic solvent valve 38 is opened, the organic solvent system from the organic solvent supply source is supplied to the second organic solvent valve 39. In this state, when the second organic solvent valve 39 is opened, the organic solvent supplied to the second organic solvent valve 39 is ejected from the first ejection port 35 toward the center of the upper surface of the substrate W. In the operation state of the suction device, when the suction valve 42 is opened with the first organic solvent valve 38 closed and the second organic solvent valve 39 opened, the operation of the suction device is activated, and the ratio in the organic solvent piping 37 is divided The interior of the downstream portion 43 on the downstream side of the position 40 (hereinafter referred to as the “organic solvent downstream portion 43 ”) is exhausted, and the organic solvent contained in the organic solvent downstream portion 43 is sucked into the suction pipe 41. The suction device and the suction valve 42 are included in the suction unit 44. The water supply unit 11 includes: a second nozzle 25; a water pipe 46 connected to the second nozzle 25 and internally communicated with the second spray port 36; and a water valve 47 for opening and closing the water pipe 46, and The supply of water from the water pipe 46 to the second nozzle 25 and the stop of the supply of water are switched. When the water valve 47 is opened, the water system from the water supply source is supplied to the water pipe 46 and sprayed from the second spray port 36 toward the center of the upper surface of the substrate W. The water system supplied to the water piping 46 is, for example, carbonated water, but is not limited to carbonated water, and may be deionized water (DIW; deionized water), electrolyzed ion water, hydrogen water, ozone water, and dilution concentration (for example, 10 ppm to About 100 ppm) in hydrochloric acid water. The processing unit 2 further includes: an inert gas piping 48 for supplying inert gas to the cylindrical space between the outer periphery of the housing 34 and the inner periphery of the baffle plate 21; and an inert gas valve 49 interposed between the inert gas The piping 48. When the inert gas valve 49 is opened, the inert gas system from the inert gas supply source is sprayed downward from the center of the lower surface of the barrier 21 through the outer circumference of the housing 34 and the inner circumference of the barrier 21. Therefore, when the inert gas valve 49 is opened in the state where the barrier 21 is arranged in the close position, the inert gas system sprayed from the center of the lower surface of the barrier 21 is on the upper surface of the substrate W and the substrate facing surface of the barrier 21 The space between 6 expands outward (in the direction away from the rotation axis A1), and the air system between the substrate W and the barrier plate 21 is replaced with an inert gas. The inert gas system flowing in the inert gas pipe 48 is, for example, nitrogen. The inert gas is not limited to nitrogen, and may be other inert gases such as helium or argon. As shown in FIG. 2A, the processing cover 12 includes: a plurality of cover parts (the first cover part 51 and the second cover part 52), which are fixedly arranged in a manner of double surrounding the rotation jig 5; and a plurality of protective covers (The first protective cover 53 and the second protective cover 54) are used to catch the processing liquid (SPM, organic solvent or water) scattered around the substrate W; and the protective cover lifting unit (lifting unit) 55, which is independent Ground the various protective covers up and down. The shield lifting unit 55 is, for example, a structure including a ball screw mechanism. The treatment cover 12 can be housed in a manner of overlapping in the vertical direction, and the protective cover lifting unit 55 lifts at least one of the first protective cover 53 and the second protective cover 54 to expand and fold the treatment cover 12. The first cover 51 has an annular shape, and surrounds the rotation jig 5 between the rotation jig 5 and the cylindrical member 50. The first cover portion 51 has a substantially rotationally symmetrical shape with respect to the rotation axis A1 of the substrate W. The first cover portion 51 has a U-shaped cross-section, and defines a first drain tank 59 for draining the processing liquid that has been used in the processing of the substrate W. A first liquid discharge port (not shown) is opened at the lowest part of the bottom of the first liquid discharge tank 59, and a first liquid discharge pipe 61 is connected to the first liquid discharge port. The treatment liquid system discharged through the first liquid discharge pipe 61 is sent to a predetermined recovery device or disposal device, and is processed by the recovery device or disposal device. The second cover portion 52 is annular and surrounds the periphery of the first cover portion 51. The second cover 52 has a substantially rotationally symmetrical shape with respect to the rotation axis A1 of the substrate W. The second cover 52 has a U-shaped cross-section and is divided into a second drain tank 62 for collecting and recovering the processing liquid that has been used in the processing of the substrate W. A second liquid discharge port (not shown) is opened at the lowest part of the bottom of the second liquid discharge tank 62, and a second liquid discharge pipe 64 is connected to the second liquid discharge port. The treatment liquid system discharged through the second liquid discharge pipe 64 is sent to a predetermined recovery device or disposal device, and is processed by the recovery device or disposal device. The inner first protective cover 53 surrounds the rotation jig 5 and has a substantially rotationally symmetrical shape with respect to the rotation axis A1 of the substrate W of the rotation jig 5. The first protective cover 53 is integrally provided with a cylindrical guide portion 66 that surrounds the circumference of the rotation jig 5 and a cylindrical processing liquid separation wall 67 that is connected to the guide portion 66. The guide portion 66 has: a cylindrical lower end 68 that surrounds the rotation jig 5; a cylindrical thick-walled portion 69 that extends from the upper end of the lower end 68 to the outside (distance from the rotation axis A1 of the substrate W) Direction) extending; the cylindrical middle section 70 extends vertically upward from the outer periphery of the upper surface of the thick section 69; and the annular upper end 71 is from the upper end of the middle section 70 toward the inner side (close to the substrate W The direction of the rotation axis A1) extends diagonally upward. The processing liquid separation wall 67 slightly extends vertically downward from the outer peripheral portion of the thick portion 69 and is located on the second drain tank 62. In addition, the lower end portion 68 of the guide portion 66 is located on the first drain groove 59 and is accommodated in the first drain groove 59 in a state closest to the first protective cover 53 and the first cover portion 51. The inner peripheral end of the upper end 71 of the guide portion 66 has a circular shape with a larger diameter than the substrate W held by the rotation jig 5 when viewed from above. In addition, as shown in FIG. 2A and the like, the cross-sectional shape of the upper end portion 71 of the guide portion 66 may be linear, or may extend while drawing a smooth arc shape, for example. The outer second protective cover 54 surrounds the rotation jig 5 in the outer side of the first protective cover 53 and has a substantially rotationally symmetrical shape with respect to the rotation axis A1 of the substrate W of the rotation jig 5. The second shield 54 has: a cylindrical portion 72 which is coaxial with the first shield 53; an upper end 73 is diagonally upward from the upper end of the cylindrical portion 72 toward the center side (the direction approaching the rotation axis A1 of the substrate W) Extend; and an annular protrusion (blocking portion) 75, which protrudes outward in the lower end portion of the cylindrical portion 72, for example. The inner peripheral end of the upper end portion 73 is formed in a circular shape having a larger diameter than the substrate W held by the rotation jig 5 when viewed from above. In addition, as shown in FIG. 2A and the like, the cross-sectional shape of the upper end portion 73 may be linear, or may extend while drawing a smooth arc, for example. The front end of the upper end 73 is the upper opening 12a of the division processing cover 12 (refer to FIG. 2A). The cylindrical portion 72 is located on the second drain tank 62. In addition, the upper end 73 is provided so as to overlap the upper end 71 of the guide portion 66 of the first protective cover 53 in the vertical direction, and is held in a state where the first protective cover 53 and the second protective cover 54 are closest to each other. The minute gap is formed so as to be close to the upper end 71 of the guide portion 66. The folded portion 74 is formed so as to overlap the upper end 71 of the guide portion 66 in the horizontal direction in a state where the first protective cover 53 and the second protective cover 54 are closest to each other. The protrusion 75 has an annular upper surface formed by a flat horizontal surface. The shield raising and lowering unit 55 raises and lowers each shield between an upper position P1 (refer to FIG. 3B etc.) described below and a lower position P3 (refer to FIG. 3C etc.) where the upper end of the shield is located below the substrate W. The upper position P1 of the first protective cover 53 and the second protective cover 54 is set to a height position higher than the liquid contact position P2 (refer to FIG. 3A etc.) described below, respectively. The upper position P1 of each protective cover (the first protective cover 53 and the second protective cover 54) is formed in the annular gap 86 between the upper end of the protective cover and the facing member 7 (the substrate facing surface 6) (refer to FIG. 6B The size (width in the vertical direction) of) becomes larger than the vertical width W1 of the nozzle arm 29. From another point of view, the upper position P1 of each shield is a position lower than the lower end surface 29a of the nozzle arm 29 and higher than the ejection port 28a. More specifically, the upper position P1 of each protective cover is the first interval 87 (refer to FIG. 6B) between the upper end of the protective cover and the lower end surface 29a of the nozzle arm 29 (the lower end of the nozzle arm 29). The second interval (refer to FIGS. 6A and 6B) 88 between the lower end surface 29a of the SPM nozzle 28 and the discharge port 28a of the SPM nozzle 28 is equal to or narrower than the second interval 88. More specifically, the upper position P1 of each protective cover is the upper end of the protective cover becoming higher than the intermediate position M between the lower end surface 29a of the nozzle arm 29 and the upper surface of the substrate W held by the rotation jig 5 (see FIG. 3B) Also the position above. The protective cover lifting unit 55 can hold the first protective cover 53 and the second protective cover 54 at any position between the upper position P1 and the lower position P3. Specifically, the protective cover lifting unit 55 holds the first protective cover 53 and the second protective cover 54 at the upper position P1, the lower position P3, and the liquid contact position P2 set between the upper position P1 and the lower position P3, respectively. The liquid contact position P2 of the first protective cover 53 and the second protective cover 54 is a position where the upper end of the protective cover is located higher than the substrate W. The supply of the processing liquid to the substrate W and the drying of the substrate W are performed in a state where a certain protective cover (the first protective cover 53 and the second protective cover 54) faces the peripheral end of the substrate W. 3A to 3C are schematic diagrams for explaining the height positions of the first protective cover 53 and the second protective cover 54 and the flow of the airflow inside the chamber 4. FIG. 3A shows a state in which the second protective cover 54 is disposed at the liquid receiving position P2. FIG. 3B shows a state in which the second protective cover 54 is arranged at the upper position P1. FIG. 3C shows a state in which the second protective cover 54 is disposed at the lower position P3. As a method of making the inner first protective cover 53 face the peripheral end of the substrate W, there are the following two methods. As shown by the solid line in FIG. 3B, the first technique is to arrange both the first protective cover 53 and the second protective cover 54 at the upper position P1. Hereinafter, the state of such a processing cover 12 is referred to as the "first upper position state". In addition, in the first upper position state, the turn-back portion 74 overlaps the upper end portion 71 of the guide portion 66 in the horizontal direction, that is, the first protection cover 53 and the second protection cover 54 overlap with a narrow interval. As shown by the solid line in FIG. 3A, the second method is to arrange both the first protective cover 53 and the second protective cover 54 at the liquid contact position P2. Hereinafter, the state of such a processing cover 12 is referred to as the "first liquid contact position state". In addition, in the first liquid contact position state, the turn-back portion 74 overlaps the upper end portion 71 of the guide portion 66 in the horizontal direction, that is, the first protection cover 53 and the second protection cover 54 overlap with a narrow interval. In addition, there are the following two methods as a method for making the outer second protective cover 54 face the peripheral end of the substrate W. As shown by the two-dot chain line in FIG. 3B, the first method is to arrange the first protective cover 53 at the lower position P3 and the second protective cover 54 at the upper position P1. Hereinafter, the state of such a processing cover 12 is referred to as a "second upper position state". As shown by the two-dot chain line in FIG. 3A, the second method is to arrange the first protective cover 53 at the lower position P3 and the second protective cover 54 at the liquid contact position P2. Hereinafter, the state of such a processing cover 12 is referred to as a "second liquid contact position state". In the second liquid contact position state, the interval between the first protective cover 53 and the second protective cover 54 is expanded up and down. In addition, as shown in FIG. 3C, the processing cover 12 can also be made such that all the protective covers (the first protective cover 53 and the second protective cover 54) are not facing the peripheral end of the substrate W. In this state, the first protective cover 53 and the second protective cover 54 are both arranged at the lower position P3. Hereinafter, the state of such a processing cover 12 is referred to as a "retracted state". As shown in FIG. 3C, in the retracted state of the processing cover 12, the protrusion 75 (the upper surface) of the second protective cover 54 and the partition plate 16 (the lower surface) are separated by a large interval (in the vertical direction). The interval is about 70mm) W2. Therefore, when the gas passes between the protrusion 75 and the partition plate 16, there is almost no pressure loss of the gas. On the other hand, in this state, since the upper end of the second protective cover 54 is located below the peripheral end surface of the substrate W, the rotation jig 5 (rotation base 19) and the front end (turned-back portion 74) of the second protective cover 54 Since the interval between the two is narrow, the pressure loss of the gas is large when the gas passes through the gap S0 between the rotation jig 5 and the tip of the second shield 54. Therefore, the downflow DF1 flowing inside the chamber 4 in the retracted state of the processing cover 12 exclusively passes between the protrusion 75 and the partition plate 16 and enters the lower space 4a of the chamber 4. In addition, as shown in FIG. 3A, in the first liquid contact position state or the second liquid contact position state of the processing cover 12, the protrusion 75 (the upper surface) of the second protective cover 54 and the partition plate 16 (the lower part) The gap S between the surfaces) is narrower than in the retracted state (the interval in the vertical direction is about 30 mm and the interval in the left and right direction is about 2 mm). Therefore, the pressure loss of the gap S between the gas passing protrusion 75 and the partition plate 16 becomes larger than that in the retracted state. In addition, since the upper end of the second protective cover 54 is located above the peripheral end surface of the substrate W, the gap S0 between the rotation jig 5 and the front end of the second protective cover 54 is wider than in the retracted state, so that the gas passes through the rotation jig The pressure loss between 5 and the front end of the second protective cover 54 is smaller than that in the retracted state (that is, there is a certain degree). Therefore, the downflow DF2 inside the chamber 4 in the first or second liquid contact position state of the processing cover 12 passes through the gap S between the protrusion 75 and the partition plate 16 and the rotation jig 5 Both of the gap S0 with the front end of the second protective cover 54 enter the lower space 4a of the chamber 4. As shown in FIG. 3B, in the first upper position state or the second upper position state of the processing cover 12, the upper surface of the protrusion 75 of the second protective cover 54 is in contact with the lower surface of the partition plate 16, whereby the protrusion 75 The gap S between the partition plate 16 and the partition plate 16 is slightly zero (it is substantially closed, and more strictly speaking, the space in the vertical direction is about 3 mm and the space in the left and right direction is about 2 mm). On the other hand, in this state, since the upper end of the second protective cover 54 is located far above the peripheral end surface of the substrate W, the distance between the rotation jig 5 (rotation base 19) and the front end of the second protective cover 54 is It is extremely large, so that almost no pressure loss of the gas occurs when the gas passes between the rotation jig 5 and the front end of the second protective cover 54. Therefore, the downflow DF3 flowing inside the chamber 4 in the first upper position state or the second upper position state of the processing cover 12 exclusively passes between the rotation jig 5 and the front end of the second protective cover 54 and enters The lower space 4a of the chamber 4. FIG. 4 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus 1. The control device 3 is configured using, for example, a microcomputer. The control device 3 has a CPU (Central Processing Unit; central processing unit) and other arithmetic units, a fixed memory device and a hard disk drive and other memory units, and an input and output unit. The memory unit stores a program for the arithmetic unit to execute. The control device 3 controls the operations of the rotation motor 17, the nozzle moving unit 32, the barrier rotating unit 26, the barrier lifting unit 27, the shield lifting unit 55, and the like. In addition, the control device 3 opens and closes the SPM valve 31, the first organic solvent valve 38, the second organic solvent valve 39, the suction valve 42, the water valve 47, the inert gas valve 49, and the like. FIG. 5 is a flowchart for explaining the first substrate processing example performed by the processing unit 2. 6A to 6E are schematic diagrams for explaining the first substrate processing example. Hereinafter, a first substrate processing example will be described with reference to FIGS. 2A, 2B, and 5. Refer to FIGS. 3A to 3C and FIGS. 6A to 6E as appropriate. The first substrate processing example is a resist removal processing for removing a resist formed on the upper surface of the substrate W. As described below, the first substrate processing example includes: an SPM supply step (first chemical liquid supply step) S3, which supplies SPM to the upper surface of the substrate W; and an organic solvent step (second chemical liquid supply step) S5 is to supply a liquid organic solvent such as IPA to the upper surface of the substrate W. SPM and organic solvents are a combination of chemical solutions that are accompanied by danger (in this case, a rapid reaction) by mixing and contacting them. When the resist removal process is applied to the substrate W by the processing unit 2, the substrate W after the high-dose ion implantation process is carried into the chamber 4 (step S1 in FIG. 5). The substrate W to be carried in is a substrate that has not been processed for ashing the resist. In addition, a fine pattern with a high aspect ratio is formed on the surface of the substrate W. In the state where the opposing member 7 (that is, the blocking plate 21 and the central axis nozzle 33) is retracted to the retracted position, the SPM nozzle 28 is retracted from above the rotation jig 5, and the first protective cover 53 and the second protective cover 54 are lowered to the lower position (The upper ends of the first protective cover 53 and the second protective cover 54 are both arranged below the holding position of the substrate W), the control device 3 causes the substrate transfer robot CR (refer to FIG. 1) that is holding the substrate W to The hand H (refer to FIG. 1) enters into the chamber 4. Thereby, the substrate W is transferred to and received from the rotation jig 5 with the surface (resist forming surface) of the substrate W facing upward. After that, the substrate W is held by the rotation jig 5. After that, the control device 3 starts the rotation of the substrate W by the rotation motor 17 (step S2 in FIG. 5). The substrate W is raised to a predetermined liquid processing speed (in the range of about 10 rpm to 500 rpm, for example, about 400 rpm), and maintained at the liquid processing speed. Next, the control device 3 performs an SPM supply step for supplying high-temperature SPM to the upper surface of the substrate W (step S3 in FIG. 5). In the SPM supply step S3, the control device 3 supplies the high-temperature SPM from the SPM nozzle 28 to the center of the upper surface of the substrate W, for example, to peel the resist from the surface of the substrate W. Specifically, the control device 3 controls the nozzle moving unit 32 to thereby move the SPM nozzle 28 from the retracted position to the processing position. Thereby, as shown in FIG. 6A, the SPM nozzle 28 is arranged above the center part of the substrate W. As shown in FIG. After the SPM nozzle 28 is arranged at the processing position (for example, the central position), the control device 3 controls the shield lifting unit 55 to raise the first shield 53 and the second shield 54 to the upper position (to shift the state of the processing cover 12 to The first upper position state), and the first protective cover 53 faces the peripheral end of the substrate W. As shown in FIG. 6B, in the first upper position state of the processing cover 12, the first interval 87 (for example, slightly zero) between the upper end of the second protective cover 54 and the lower end surface 29a of the nozzle arm 29 becomes larger than that of the nozzle The second interval 88 (for example, about 5 mm) between the lower end surface 29a of the arm 29 and the ejection port 28a of the SPM nozzle 28 is also narrow. Furthermore, in the first upper position state of the processing cover 12, the upper end of the second protection cover 54 is located at an intermediate position between the lower end surface 29a of the nozzle arm 29 and the upper surface of the substrate W held by the rotation jig 5 M (refer to Figure 3B) is also in the upper position. After the first protective cover 53 and the second protective cover 54 are raised, the control device 3 opens the SPM valve 31. As a result, as shown in FIG. 6B, SPM having a high temperature (for example, about 170° C. to about 180° C.) is supplied from the SPM pipe 30 to the SPM nozzle 28, and the high temperature SPM is ejected from the ejection port 28 a of the SPM nozzle 28. The high-temperature SPM discharged from the SPM nozzle 28 reaches the center of the upper surface of the substrate W, and receives the centrifugal force caused by the rotation of the substrate W to flow outward along the upper surface of the substrate W. Thereby, the entire upper surface of the substrate W is covered with the liquid film of SPM. With the high-temperature SPM, the resist is peeled from the surface of the substrate W and removed from the surface of the substrate W. In addition, the supply position of the high-temperature SPM from the SPM nozzle 28 may be moved (scanned) between the center portion of the upper surface of the substrate W and the peripheral edge portion of the upper surface. The SPM supplied to the upper surface of the substrate W is scattered from the peripheral edge of the substrate W toward the side of the substrate W, and is caught by the inner wall of the first protective cover 53. Then, the SPM flowing down the inner wall of the first protective cover 53 is collected in the first drain tank 59 and then guided to the first drain piping 61, and is guided to drain the SPM. Drainage treatment device (not shown) for treatment. In the SPM supply step S3, since the SPM used is very high temperature (for example, about 170° C. to about 180° C.), a large amount of mist MI of SPM is generated. By supplying SPM to the substrate W, the mist MI of the SPM generated around the upper surface of the substrate W in a large amount floats on the upper surface of the substrate W. In the SPM supply step S3, in order to achieve the purpose of catching the chemical liquid scattered from the substrate W, the height of the protective cover (at least the second protective cover 54) is a sufficient height, but in the case of a lower height position, There is a possibility that the atmosphere such as mist MI containing SPM in the inside of the processing cover 12 flows out of the processing cover 12 through the upper opening 12 a of the processing cover 12 and diffuses into the inside of the chamber 4. Since the atmosphere such as mist MI containing SPM becomes particles and causes it to adhere to the substrate W and contaminate the substrate W and the inner wall of the partition wall 13 of the chamber 4, it is undesirable for this atmosphere to diffuse to the surroundings. In the SPM supply step S3 of the first substrate processing example, in the state where the first protective cover 53 and the second protective cover 54 are arranged in the upper position (that is, the state of the first upper position of the processing cover 12), the high-temperature SPM is It is supplied to the upper surface of the substrate W in a rotating state. In the first upper position state of the processing cover 12, an annular gap 86 formed between the upper end of the second protective cover 54 arranged at the upper position P1 and the substrate facing surface 6 of the barrier partition plate 21 (refer to FIG. 3B) The system is set to be narrow. Therefore, it is difficult for the atmosphere in the processing cover 12 to flow out into the chamber 4 through the annular gap 86. Thereby, it is possible to suppress or prevent the atmosphere including the mist MI of the SPM in the processing cover 12 from flowing out into the chamber 4. In addition, in the first upper position state of the processing cover 12, since the gap S between the protrusion 75 and the partition plate 16 becomes a little zero, the downflow DF3 (refer to FIG. 3B) flowing inside the chamber 4 is a system It enters the lower space 4a of the chamber 4 through the space between the rotation jig 5 and the front end of the second shield 54. Thereby, it is possible to more effectively suppress the outflow of the atmosphere of the mist MI including SPM from the processing cover 12 into the chamber 4. In addition, in the first upper position state of the processing cover 12 (the state shown by the solid line in FIG. 3B ), the first protection cover 53 and the second protection cover 54 are the closest to each other. In this state, the turned-back portion 74 overlaps the upper end portion 71 of the guide portion 66 in the horizontal direction. Therefore, in the SPM supply step S3, the mist MI of the SPM floating on the upper surface of the substrate W does not enter between the first protective cover 53 and the second protective cover 54. Before the start of the SPM supply step S3, IPA may adhere to the inner wall of the second protective cover 54. However, since the mist MI of the SPM does not enter between the first protective cover 53 and the second protective cover 54, it is possible to suppress or prevent the SPM and IPA from being mixed and contacted in the interior of the processing cover 12 in the SPM supply step S3. Thereby, it is possible to suppress or prevent the inside of the processing cover 12 from becoming a source of particle generation. When a predetermined period has elapsed since the start of the high-temperature SPM discharge, the SPM supply step S3 is ended. Specifically, the control device 3 closes the SPM valve 31 and stops the ejection of high-temperature SPM from the SPM nozzle 28. In addition, the control device 3 controls the protective cover lifting unit 55 to lower the first protective cover 53 and the second protective cover 54 to the liquid receiving position P2, respectively. After the first protective cover 53 and the second protective cover 54 start to descend, the control device 3 controls the nozzle moving unit 32 to retract the SPM nozzle 28 to the retracted position. Next, a water supply step for supplying water as a cleaning liquid to the upper surface of the substrate W is performed (step S4 in FIG. 5). Specifically, the control device 3 opens the water valve 47. Thereby, as shown in FIG. 6C, water is sprayed from the central axis nozzle 33 (the second nozzle 25 (refer to FIG. 2B)) toward the center of the upper surface of the substrate W. The water system sprayed from the central axis nozzle 33 reaches the center of the upper surface of the substrate W, receives the centrifugal force caused by the rotation of the substrate W, and flows on the upper surface of the substrate W toward the peripheral edge of the substrate W. The SPM on the substrate W is flushed to the outside by the water and discharged to the periphery of the substrate W. As a result, the liquid film of SPM on the substrate W is replaced with a liquid film of water covering the entire upper surface of the substrate W. That is, the SPM is flushed from the upper surface of the substrate W by the water as the cleaning liquid. The water system flowing on the upper surface of the substrate W scatters from the peripheral edge of the substrate W toward the side of the substrate W, and is caught by the inner wall of the first protective cover 53. Then, the water system flowing down the inner wall of the first protective cover 53 is collected in the first drain tank 59 and then guided to the first drain piping 61, and is guided to drain the water. The drainage treatment device (not shown). When the liquid of the SPM used in the SPM supply step adheres to the inner wall of the first protective cover 53, the first drain tank 59 and/or the wall of the first drain pipe 61, the liquid system of the SPM Washed by water. When a predetermined period has elapsed since the start of spraying water, the control device 3 closes the water valve 47 and stops spraying water from the second nozzle 25. Thereby, the water supply step S4 is ended. Next, an organic solvent step for supplying IPA as an organic solvent to the upper surface of the substrate W is performed (step S5 in FIG. 5). Specifically, as shown in FIG. 6D, the control device 3 controls the barrier plate lifting unit 27 to arrange the barrier plate 21 at a close position. When the barrier 21 is located at the close position, the barrier 21 blocks the upper surface of the substrate W from the space around the substrate W. In addition, the control device 3 controls the protective cover raising and lowering unit 55, and when the first protective cover 53 is disposed at the lower position P3, the second protective cover 54 is disposed at the upper position P1 and the second protective cover 54 is connected to the substrate W. The circumferential end faces face each other. In addition, the control device 3 decelerates the rotation of the substrate W to a predetermined paddle speed. The so-called coating speed means that when the substrate W is rotated at the coating speed, the centrifugal force of the liquid acting on the upper surface of the substrate W is smaller than the surface tension acting between the cleaning liquid and the upper surface of the substrate W, or the aforementioned centrifugal force and the aforementioned surface The tension is roughly against the speed. Next, after the rotation speed of the substrate W drops to the liquid coating speed, the control device 3 opens the second organic solvent valve 39 and closes the suction valve 42, and opens the first organic solvent valve 38. Thereby, the IPA from the organic solvent supply source is supplied to the first nozzle 24, and the IPA is ejected from the first nozzle 24 and reaches the upper surface of the substrate W. In the organic solvent step S5, by spraying IPA from the first nozzle 24, the water system contained in the liquid film on the upper surface of the substrate W is sequentially replaced with IPA. Thereby, the liquid film of the IPA covering the entire upper surface of the substrate W is kept on the upper surface of the substrate W in a liquid-coated state. After the liquid film on the entire upper surface of the substrate W is substantially replaced with the liquid film of IPA, the supply of IPA to the upper surface of the substrate W is also continued. Therefore, the IPA is discharged from the peripheral edge of the substrate W. The IPA discharged from the peripheral edge of the substrate W is caught by the inner wall of the second protective cover 54. Then, the IPA system flowing down the inner wall of the second protective cover 54 is collected in the second drain tank 62 and then guided to the second drain piping 64, and is guided to the IPA for draining treatment的处理装置 (not shown). In this embodiment, the IPA discharged from the peripheral edge of the substrate W is caught by the inner wall of the second shield 54 facing the peripheral end of the substrate W, and will not be retracted from the peripheral end surface of the substrate W. The inner wall of the lower first protective cover 53 catches it. Moreover, in the organic solvent step S5, the mist of IPA generated around the substrate W is small, and the mist of IPA is not introduced to the inner wall of the first protective cover 53. In addition, the SPM attached to the first protective cover 53 in the SPM supply step S3 is flushed by the water supply in the water supply step S4. Therefore, no mixed contact between IPA and SPM occurs in the organic solvent step S5. When a predetermined period of time has elapsed since the start of the discharge of IPA, the control device 3 closes the first organic solvent valve 38 and stops the discharge of IPA from the second nozzle 25. Thereby, the organic solvent step S5 is ended. Next, a spin-drying step for drying the substrate W is performed (step S6 in FIG. 5). Specifically, in a state where the control device 3 arranges the baffle plate 21 at the close position, the control device 3 controls the rotation motor 17, thereby accelerating the substrate W as shown in FIG. 6E to the speed from the SPM supply steps S3 to S3. The rotation speed in each step from the organic solvent step S5 is higher than the drying rotation speed (for example, several thousand rpm), and the substrate W is rotated at the drying rotation speed. As a result, a large centrifugal force is applied to the liquid on the substrate W, and the liquid system attached to the substrate W is thrown away to the periphery of the substrate W. In this way, the liquid is removed from the substrate W and the substrate W is dried. In addition, the control device 3 controls the baffle plate rotating unit 26 to rotate the baffle plate 21 in the rotation direction of the substrate W at a high speed. In addition, an organic solvent suction step for sucking the organic solvent in the organic solvent pipe 37 is performed in parallel with the centrifugal dehydration step S6. In this organic solvent suction step, the organic solvent existing in the organic solvent pipe 37 after the organic solvent step S5 is sucked by the suction unit 44. Specifically, the control device 3 opens the second organic solvent valve 39, closes the first organic solvent valve 38, and opens the suction valve 42 after the organic solvent step S5 ends. Thereby, the inside of the downstream portion 43 of the organic solvent is exhausted, and the IPA system existing in the downstream portion 43 of the organic solvent is introduced (suctioned) to the suction pipe 41. The suction of the IPA is performed until the tip surface of the IPA is retracted to a predetermined standby position in the pipe. When the front end surface of the IPA retreats to the standby position, the control device 3 closes the suction valve 42. This can prevent IPA from falling (dripping) from the organic solvent pipe 37 in the centrifugal dehydration step S6. When a predetermined period of time has passed through the acceleration from the substrate W, the control device 3 controls the rotation motor 17 to stop the rotation jig 5 from rotating the substrate W (step S7 in FIG. 5), and controls the barrier plate rotating unit 26 to stop the barrier plate 21 from rotating. After that, the substrate W is carried out from the chamber 4 (step S8 in FIG. 5). Specifically, the control device 3 raises the baffle plate 21 and arranges it at the retreat position, lowers the second protection cover 54 to the lower position P3, and arranges the first protection cover 53 and the second protection cover 54 to be higher than the substrate W. The location is still below. After that, the control device 3 causes the hand of the substrate transfer robot CR to hold the substrate W on the rotation jig 5 and retracts the hand H of the substrate transfer robot CR from the chamber 4. Thereby, the substrate W from which the resist has been removed from the surface is carried out from the chamber 4. According to this first substrate processing example, the SPM supply step S3 is executed in the first upper position state of the processing cover 12. Therefore, in the SPM supply step S3, the first protective cover 53 can be arranged as much as possible above, and the first protective cover 53 can catch the first chemical liquid scattered from the substrate well. In addition, in the SPM supply step S3 and the organic solvent supply step S5, since the shields (the first shield 53 and the second shield 54) for catching the processing liquid are separated, it is possible to suppress or prevent the processing cover 12 SPM and IPA are mixed in contact with each other. Thereby, it is possible to suppress or prevent the inside of the processing cover 12 from becoming a source of particle generation. FIG. 7 is a schematic cross-sectional view for enlarging and displaying an example of a configuration example of the lower portion of the processing unit 2. The branch pipe 102 for water and the branch pipe 103 for IPA may be connected to the front-end|tip of the 2nd drain pipe 64 of the 2nd cover part 52. That is, the flow destination of the liquid flowing through the second liquid discharge pipe 64 (the flow destination of the liquid passing through the partitioned internal space between the first protective cover 53 and the second protective cover 54) is divided into two Branch piping (water branch pipe 102 and IPA branch pipe 103). The following describes the use of such two branch piping. A water on-off valve 105 for opening and closing the water branch pipe 102 is sandwiched between the water branch pipe 102. The IPA branch pipe 103 is provided with an IPA on-off valve 106 for opening and closing the IPA branch pipe 103. The opening and closing valve 105 for water is opened with the opening and closing valve 106 for IPA closed, whereby the flow destination of the liquid flowing through the second discharge pipe 64 is set to the branch pipe 102 for water. When the on-off valve for IPA 106 is opened while the on-off valve for water 105 is closed, the flow destination of the liquid flowing through the second discharge pipe 64 is set to the branch pipe for IPA 103. 8A to 8C are schematic diagrams for explaining a second substrate processing example. In terms of the basic processing flow, the second substrate processing example is no different from the first substrate processing example. The second substrate processing example will be described with reference to FIGS. 2A, 2B, 5, and 7. Refer to FIGS. 8A to 8C as appropriate. The difference from the first substrate processing example is that in the second substrate processing example, in the SPM supply step S3, the state of the processing cover 12 is not the state of being arranged in the first upper position, but the state of being arranged in the second upper position. The second upper position state of the processing cover 12 refers to a state in which the first protective cover 53 is disposed at the liquid-receiving position P2 and the second protective cover 54 is disposed at the upper position. In addition, the difference from the first substrate processing example is that although the processing cover 12 is set to the second upper position state in the SPM supply step S3, the mist MI of the SPM may adhere to the first protection cover 53 and the second protection cover. The walls of the internal space partitioned between the covers 54 (the inner wall of the second protective cover 54 and the outer wall of the first protective cover 53, etc.), however, in the water supply step S4, the processing cover 12 is set to be the second wetted Position and supply the water scattered from the peripheral edge of the substrate W to the internal space partitioned between the first protective cover 53 and the second protective cover 54 to adhere to the wall of the internal space (the first The inner wall of the second protective cover 54 and the outer wall of the first protective cover 53, etc.) mist MI of the SPM. The SPM supply step S3 of the second substrate processing example will be described in detail below. In the SPM supply step S3, after the SPM nozzle 28 is arranged at the processing position, the control device 3 controls the shield lifting unit 55, thereby raising the first shield 53 to the liquid contact position P2 and raising the second shield 54 to the upper position. In the position P1, the second protective cover 54 faces the peripheral end of the substrate W. Similar to the first upper position state of the processing cover 12, in the second upper position state of the processing cover 12, the first gap 87 (for example, slightly Zero) is narrower than the second interval 88 (for example, about 5 mm) between the lower end surface 29a of the nozzle arm 29 and the ejection port 28a of the SPM nozzle 28. Furthermore, the second upper position state of the processing cover 12 is that the upper end of the second protection cover 54 is located at an intermediate position M between the lower end surface 29a of the nozzle arm 29 and the upper surface of the substrate W held by the rotation jig 5 (refer to Fig. 3B) The upper position. After the second protective cover 54 is raised, the control device 3 opens the SPM valve 31 (refer to FIG. 2A). As shown in FIG. 8A, in the SPM supply step S3 of the present embodiment, the first protective cover 53 is arranged at the liquid-receiving position P2 and the second protective cover 54 is arranged at the upper position P1 (that is, the first protective cover of the processing cover 12). In the second upper position state), high-temperature SPM is supplied to the upper surface of the substrate W in the rotating state. The SPM supplied to the upper surface of the substrate W receives the centrifugal force caused by the rotation of the substrate W, and scatters laterally from the peripheral edge of the substrate W. Then, the SPM scattered to the side is caught by the first protective cover 53 at the liquid contact position P2 and flows down along the inner wall of the first protective cover 53. The SPM flowing down the first protective cover 53 is guided to the first discharge pipe 61 and to a discharge treatment device (not shown) for discharging the SPM. In addition, in the SPM supply step S3, since the SPM used is very high temperature (for example, about 170° C. to about 180° C.), a large amount of mist MI of SPM is generated. By supplying SPM to the substrate W, the mist MI of the SPM generated around the upper surface of the substrate W in a large amount floats on the upper surface of the substrate W. In the second upper position state of the processing cover 12, an annular gap 86 formed between the upper end of the second protective cover 54 arranged at the upper position P1 and the substrate facing surface 6 of the barrier partition 21 (refer to FIG. 3B) The system is set to be narrow. Therefore, it is difficult for the atmosphere in the processing cover 12 to flow out into the chamber 4 through the annular gap 86. Thereby, it is possible to suppress or prevent the atmosphere including the mist MI of the SPM in the processing cover 12 from flowing out into the chamber 4. In addition, in the second upper position state of the processing cover 12, since the gap S between the protrusion 75 and the partition plate 16 becomes a little zero, the downflow DF3 (refer to FIG. 3B) flowing inside the chamber 4 is By entering the lower space 4a of the chamber 4 between the front end of the rotation jig 5 and the second protective cover 54, it can more effectively prevent the atmosphere of mist MI containing SPM from flowing out of the processing cover 12 into the interior of the chamber 4 . In the SPM supply step S3 of the second substrate processing example, the mist MI of the SPM enters the internal space partitioned between the first protective cover 53 and the second protective cover 54, so that the mist MI of the SPM adheres to The walls of the internal space (the inner wall of the second protective cover 54 and the outer wall of the first protective cover 53, etc.) are in danger. After the SPM supply step S3 is completed, the control device 3 controls the protective cover lifting unit 55 to lower the first protective cover 53 from the liquid receiving position P2 to the lower position P3, and lower the second protective cover 54 from the upper position P1 to the liquid receiving position. Location P2. That is, the state of the processing cover 12 is transferred to the second liquid contact position state. In the second liquid contact position state of the processing cover 12, the second protection cover 54 is opposed to the peripheral end surface of the substrate W. In addition, before the water is sprayed, the control device 3 closes the on-off valve 106 for IPA and opens the on-off valve 105 for water, thereby setting the flow destination of the liquid flowing in the second discharge pipe 64 to the branch pipe 102 for water. After the first protective cover 53 starts to descend, the control device 3 controls the nozzle moving unit 32 to retract the SPM nozzle 28 to the retracted position. Next, the water supply step (step S4 in FIG. 5) is performed. Specifically, the control device 3 opens the water valve 47. Thereby, as shown in FIG. 8B, water is sprayed from the central axis nozzle 33 (the second nozzle 25 of) (refer to FIG. 2B) toward the center of the upper surface of the substrate W. The water system sprayed from the central axis nozzle 33 reaches the center of the upper surface of the substrate W, receives the centrifugal force caused by the rotation of the substrate W, and flows on the upper surface of the substrate W toward the peripheral edge of the substrate W. The water system supplied to the upper surface of the substrate W scatters from the peripheral edge portion of the substrate W toward the side of the substrate W and enters the internal space divided between the first protective cover 53 and the second protective cover 54 (second protective cover 54 and the outer wall of the first protective cover 53, etc.), and are caught by the inner wall of the second protective cover 54. Then, the water system flowing down the inner wall of the second protective cover 54 is collected in the second drain tank 62 and then guided to the second drain pipe 64. In the water supply step S4 of the second substrate processing example, since the flow destination of the liquid flowing through the second liquid discharge pipe 64 is set to the water branch pipe 102 (refer to FIG. 7), the second liquid discharge pipe 64 After the flowing water system is supplied to the water branch pipe 102, it is sent to a treatment device (not shown) for draining water. After the above-mentioned SPM supply step S3, the mist MI of SPM will adhere to the internal space partitioned between the first protective cover 53 and the second protective cover 54 (the inner wall of the second protective cover 54 and the first protective cover 53). The outer wall, etc.) of the wall. However, in the water supply step S4, by the water supplied to the internal space partitioned between the first protective cover 53 and the second protective cover 54, the mist MI of the SPM adhering to the wall is flushed. When a predetermined period has elapsed since the start of spraying water, the water supply step S4 is ended. Next, an organic solvent step for supplying IPA as an organic solvent to the upper surface of the substrate W is performed (step S5 in FIG. 5). Before the IPA starts to spray, the control device 3 closes the on-off valve 105 for water and opens the on-off valve 106 for IPA, thereby setting the flow destination of the liquid flowing in the second discharge pipe 64 to the branch pipe 103 for IPA (refer to Figure 7). The control system other than the above in the organic solvent step S5 is the same as in the case of the first substrate processing example. The IPA discharged from the peripheral edge of the substrate W is caught by the inner wall of the second protective cover 54. Next, the IPA flowing down the inner wall of the second protective cover 54 is collected by the second drain tank 62 and then guided to the second drain piping 64, and is guided to the IPA for draining treatment. Processing device (not shown). In the organic solvent step S5 in the second substrate processing example, since the flow destination of the liquid flowing through the second liquid discharge pipe 64 is set to the IPA branch pipe 103, the IPA system flowing through the second liquid discharge pipe 64 After being supplied to the branch pipe 103 for IPA, it is sent to a processing device (not shown) for discharging IPA. When a predetermined period has elapsed since the start of the spraying of the IPA, the organic solvent step S5 is ended. Next, the control device 3 executes the centrifugal dehydration step (step S6 in FIG. 5). After the centrifugal dehydration step S6 is completed, the control device 3 stops the rotation of the substrate W by the autorotating jig 5 (step S7 in FIG. 5), and stops the rotation of the baffle plate 21. After that, the substrate W is carried out from the chamber 4 (step S8 in FIG. 5). Since these respective steps are the same as in the case of the first substrate processing example, the description of each is omitted. In the second substrate processing example, after the substrate W is carried out, a cover part washing step for washing the processing cover 12 is performed. In the cover washing step, water is used as a washing liquid. In the cover washing step, the control device 3 starts the rotation of the rotation base 19 by the rotation motor 17 (refer to FIG. 2A). Before starting to supply water to the rotation base 19, the control device 3 controls the protective cover lifting unit 55 (refer to FIG. 2A) to hold the first protective cover 53 at the lower position P3 and raise the second protective cover 54 to the position Liquid position P2. That is, as shown in FIG. 8C, the state of the processing cover 12 is shifted to the second liquid contact position state. In the second liquid contact position state of the processing cover 12, the second protection cover 54 is opposed to the peripheral edge portion of the upper surface 19 a of the rotation base 19. In addition, before starting to supply water to the rotation base 19, the control device 3 closes the IPA on-off valve 106 (refer to FIG. 7) and opens the water on-off valve 105 (refer to FIG. 7), thereby discharging the second liquid The flow destination of the liquid flowing through the pipe 64 is set to the branch pipe 102 for water (refer to FIG. 7). When the rotation speed of the rotation base 19 reaches a predetermined rotation speed, the control device 3 opens the water valve 47 (refer to FIG. 2). Thereby, as shown in FIG. 8C, water is sprayed from the central axis nozzle 33 (the second nozzle 25 (refer to FIG. 2B)). The water system sprayed from the central axis nozzle 33 reaches the center of the upper surface 19a of the rotation base 19, receives the centrifugal force caused by the rotation of the rotation base 19, and faces the rotation base 19 on the upper surface 19a of the rotation base 19 The peripheral edge portion of the rotation surface flows and scatters laterally from the peripheral edge portion of the rotation base 19. The water system scattered from the peripheral edge of the rotation base 19 enters the internal space partitioned between the first protective cover 53 and the second protective cover 54 (the inner wall of the second protective cover 54 and the outer wall of the first protective cover 53). Etc.), and is caught by the inner wall of the second protective cover 54. Next, the water system flowing down the inner wall of the second protective cover 54 is collected in the second drain tank 62 and then guided to the second drain pipe 64 (see FIG. 7). In the hood washing step, since the flow destination of the liquid flowing through the second drain pipe 64 is set to the water branch pipe 102 (see FIG. 7), the water system flowing through the second drain pipe 64 After being supplied to the branch pipe 102 for water, it is sent to a treatment device (not shown) for draining water. After the substrate W is removed, although the IPA liquid will adhere to the walls of the internal space partitioned between the first protective cover 53 and the second protective cover 54 (the inner wall of the second protective cover 54 and the inner wall of the first protective cover 53) The outer wall) and the pipe walls of the second drain tank 62 and the second drain piping 64, but the liquid of the IPA is flushed with water by performing the hood cleaning step. When a predetermined period of time has elapsed since the start of spraying water, the control device 3 closes the water valve 47 to stop the supply of water to the upper surface 19 a of the rotation base 19. In addition, the control device 3 controls the rotation motor 17 to stop the rotation of the rotation base 19. Thereby, the cover part washing step is ended. In addition, in the cover cleaning step of the second substrate processing example, the spin jig 5 may hold a dummy substrate (with the same diameter as the substrate W) made of silicon carbide (SiC) and the like, and rotate it The dummy substrate in the state is supplied with a washing liquid such as water, thereby causing the water to scatter from the periphery of the dummy substrate toward the side of the dummy substrate. According to this second substrate processing example, the SPM supply step S3 is executed in the second upper position state of the processing cover 12. Therefore, in the SPM supply step S3, the second protective cover 53 can be arranged as much as possible above, and the second protective cover 53 can well catch the first chemical solution scattered from the substrate. In addition, the mist MI of the SPM generated in the SPM supply step S3 may adhere to the wall of the internal space partitioned between the first protective cover 53 and the second protective cover 54 (the inner wall of the second protective cover 54 and the inner wall of the second protective cover 54). The outer wall of the first protective cover 53, etc.). However, in the water supply step S4 after the SPM supply step S3 is completed, the water scattered from the peripheral edge of the substrate W is supplied to the internal space divided between the first protective cover 53 and the second protective cover 54 (second The inner wall of the protective cover 54 and the outer wall of the first protective cover 53, etc.), whereby the SPM adhering to the inner wall of the internal space can be flushed. Therefore, it is possible to suppress or prevent the mixed contact of SPM and IPA in the inside of the processing cover 12. Thereby, it is possible to suppress or prevent the inside of the processing cover 12 from becoming a source of particle generation. In addition, in the organic solvent supply step S5, the inner wall of the second protective cover 54 catches the processing liquid discharged from the substrate W. Therefore, after the organic solvent supply step S5 is completed, the liquid of IPA adheres to the wall of the internal space partitioned between the first protective cover 53 and the second protective cover 54. However, since the cover washing step is performed after the organic solvent supply step S5 is started, it can be adhered to the wall of the internal space partitioned between the first protective cover 53 and the second protective cover 54 (the first The inner wall of the second protective cover 54 and the outer wall of the first protective cover 53) as well as the IPA liquid of the second drain tank 62 and the wall of the second drain pipe 64. Therefore, it is possible to suppress or prevent the mixing and contact of SPM and IPA in the interior of the processing cover 12, thereby suppressing or preventing the interior of the processing cover 12 from becoming a source of particle generation. In addition, in the second substrate processing example, the water supply step S4 may be performed before the start of the SPM supply step S3. As described above, according to the present embodiment, in the SPM supply step S3, the high-temperature SPM is supplied to the upper surface of the substrate W in the rotating state with the second shield 54 being arranged at the upper position P1. In a state in which the second protective cover 54 is arranged at the upper position P1, the distance between the upper opening 12a of the processing cover 12 and the substrate W is greatly ensured. In the SPM supply step S3, although the SPM mist is generated due to the supply of high-temperature SPM to the substrate W, the distance between the upper opening 12a of the processing cover 12 and the substrate W is greatly ensured, so the atmosphere includes the mist of SPM It is difficult to flow out of the processing cover 12 through the upper opening 12a of the processing cover 12. Specifically, the upper position P1 of the first protective cover 53 and the second protective cover 54 is formed at an annular gap 86 between the upper end of the protective cover and the facing member 7 (the substrate facing surface 6) which is larger than the nozzle The upper and lower width W1 of the arm 29 is also large and very narrow. Thereby, the annular gap 86 can be set to the minimum size within the range allowing the nozzle arm 29 to pass through. In this case, the amount of atmosphere flowing out from the inside of the processing cover 12 to the inside of the chamber 4 can be effectively reduced. Thereby, it is possible to more effectively suppress the diffusion of the atmosphere containing SPM to the surroundings. In addition, from another point of view, the upper position P1 of the first protective cover 53 and the second protective cover 54 is a position lower than the lower end surface 29a of the nozzle arm 29 and higher than the ejection port 28a. More specifically, the upper position P1 of the first protective cover 53 and the second protective cover 54 is the first interval 87 between the upper end of the protective cover and the lower end surface 38a of the nozzle arm 29 becomes larger than the lower end surface 29a of the nozzle arm 29 The second gap 88 with the ejection port 34a of the SPM nozzle 28 is still narrow. Furthermore, the upper position P1 of the first protective cover 53 and the second protective cover 54 is the upper end of the protective cover becomes a position M which is greater than the middle position M between the lower end surface 38a of the nozzle arm 29 and the upper surface of the substrate W held by the rotation jig 5 (Refer to Figure 3B) The position is also up. By setting the upper position P1 to such a position, the amount of atmosphere flowing out of the processing cover 12 into the chamber 4 can be effectively reduced. Thereby, it is possible to more effectively suppress the diffusion of the atmosphere containing SPM to the surroundings. Although one of the embodiments of the present invention has been described above, the present invention can also be implemented in other forms. For example, in the first substrate processing example and the second substrate processing example, it is also possible to perform the cleaning chemical supply step for supplying the cleaning chemical to the upper surface of the substrate W after the water supply step S4 is completed. In this case, hydrofluoric acid or SC1 (a mixed liquid containing NH 4 OH and H 2 O 2 ) can be used as the cleaning solution used in the cleaning solution supply step. After the cleaning chemical liquid supply step is executed, a second water supply step for flushing the chemical liquid on the upper surface of the substrate W with the cleaning liquid is performed. In addition, in the first substrate processing example and the second substrate processing example, after the SPM supply step S3 is performed or the cleaning solution supply step is performed, it is also possible to supply hydrogen peroxide water (H 2 O 2 ). The step of supplying hydrogen peroxide water to the upper surface (surface) of the substrate W. In addition, in the above-mentioned embodiment, although IPA is exemplified as an example of the organic solvent used in the second chemical solution, in addition, methanol, ethanol, HFE (hydrofluoroether; hydrofluoroether), acetone, etc. may also be exemplified as examples Organic solvents. In addition, as an organic solvent, it is not limited to the case where it consists only of a monomer component, and may be a liquid mixed with other components. For example, it may be a mixed liquid of IPA and acetone, or may be a mixed liquid of IPA and methanol. Although the embodiments of the present invention have been described in detail, these embodiments are only specific examples for clarifying the technical content of the present invention, and the present invention should not be limitedly interpreted by these specific examples. The scope of the present invention is merely appended. The scope of patent application is limited. The present invention corresponds to Japanese Patent Application No. 2016-163744 filed by the Japan Patent Office on August 24, 2016, and incorporates all the contents of Japanese Patent Application No. 2016-163744 into the present invention.

1‧‧‧基板處理裝置 2‧‧‧處理單元 3‧‧‧控制裝置 4‧‧‧腔室 4a‧‧‧下部空間 5‧‧‧自轉夾具 6‧‧‧基板對向面 7‧‧‧對向構件 8‧‧‧SPM供給單元 9‧‧‧排氣口 9a‧‧‧排氣導管 10‧‧‧有機溶劑供給單元 11‧‧‧水供給單元 12‧‧‧處理罩 12a‧‧‧上部開口 13‧‧‧隔壁 14‧‧‧FFU 15‧‧‧側方區域 15a‧‧‧上部區域 15b‧‧‧下部區域 16‧‧‧分隔板 17‧‧‧自轉馬達 18‧‧‧下自轉軸 19‧‧‧自轉基座 19a‧‧‧上表面 20‧‧‧夾持構件 21‧‧‧阻隔板 22‧‧‧上自轉軸 23‧‧‧貫通孔 24‧‧‧第一噴嘴 25‧‧‧第二噴嘴 26‧‧‧阻隔板旋轉單元 27‧‧‧阻隔板升降單元 28‧‧‧SPM噴嘴 28a‧‧‧噴出口 29‧‧‧噴嘴臂 29a‧‧‧下端面 30‧‧‧SPM配管 31‧‧‧SPM閥 32‧‧‧噴嘴移動單元 33‧‧‧中心軸噴嘴 34‧‧‧殼體 34a‧‧‧噴出口 35‧‧‧第一噴出口 36‧‧‧地二噴出口 37‧‧‧有機溶劑配管 38‧‧‧第一有機溶劑閥 38a‧‧‧下端面 39‧‧‧第二有機溶劑閥 40‧‧‧分歧位置 41‧‧‧吸引配管 42‧‧‧吸引閥 43‧‧‧有機溶劑下游側部分 44‧‧‧吸引單元 46‧‧‧水配管 47‧‧‧水閥 48‧‧‧惰性氣體配管 49‧‧‧惰性氣體閥 50‧‧‧圓筒構件 51‧‧‧第一罩部 52‧‧‧第二罩部 53‧‧‧第一防護罩 54‧‧‧第二防護罩 55‧‧‧防護罩升降單元 59‧‧‧第一排液槽 61‧‧‧第一排液配管 62‧‧‧第二排液槽 64‧‧‧第二排液配管 66‧‧‧導引部 67‧‧‧處理液分離壁 68‧‧‧下端部 69‧‧‧厚壁部 70‧‧‧中段部 71‧‧‧上段部 72‧‧‧圓筒部 73‧‧‧上端部 74‧‧‧折返部 75‧‧‧突部 86‧‧‧環狀間隙 87‧‧‧第一間隔 88‧‧‧第二間隔 102‧‧‧水用分歧配管 103‧‧‧IPA用分歧配管 105‧‧‧水用開閉閥 106‧‧‧IPA用開閉閥 A1、A2‧‧‧旋轉軸線 A3‧‧‧搖動軸線 C‧‧‧承載器 CR‧‧‧基板搬運機器人 DF1、DF2、DF3‧‧‧降流 H‧‧‧手部 IR‧‧‧搬運機器人 LP‧‧‧裝載埠 M‧‧‧中間位置 MI‧‧‧霧氣 P1‧‧‧上位置 P2‧‧‧接液位置 P3‧‧‧下位置 S、S0‧‧‧間隙 S1、S2‧‧‧步驟 S3‧‧‧SPM供給步驟 S4‧‧‧水供給步驟 S5‧‧‧有機溶劑供給步驟 S6‧‧‧離心法脫水步驟 W‧‧‧基板 W1‧‧‧上下寬度 1‧‧‧Substrate processing equipment 2‧‧‧Processing unit 3‧‧‧Control device 4‧‧‧ Chamber 4a‧‧‧Lower space 5‧‧‧Rotating fixture 6‧‧‧Substrate facing surface 7‧‧‧Opposite member 8‧‧‧SPM supply unit 9‧‧‧Exhaust port 9a‧‧‧Exhaust duct 10‧‧‧Organic solvent supply unit 11‧‧‧Water supply unit 12‧‧‧Treatment cover 12a‧‧‧Upper opening 13‧‧‧Next door 14‧‧‧FFU 15‧‧‧Side area 15a‧‧‧Upper area 15b‧‧‧Lower area 16‧‧‧Partition plate 17‧‧‧Rotating Motor 18‧‧‧Lower rotation axis 19‧‧‧Rotating base 19a‧‧‧Upper surface 20‧‧‧Clamping member 21‧‧‧Barrier plate 22‧‧‧Upper rotation axis 23‧‧‧Through hole 24‧‧‧First nozzle 25‧‧‧Second nozzle 26‧‧‧Barrier plate rotating unit 27‧‧‧Barrier plate lifting unit 28‧‧‧SPM nozzle 28a‧‧‧Ejection port 29‧‧‧Nozzle arm 29a‧‧‧lower end surface 30‧‧‧SPM piping 31‧‧‧SPM valve 32‧‧‧Nozzle moving unit 33‧‧‧Center axis nozzle 34‧‧‧Shell 34a‧‧‧Ejector 35‧‧‧First nozzle 36‧‧‧Second Jet Outlet 37‧‧‧Organic solvent piping 38‧‧‧The first organic solvent valve 38a‧‧‧Lower end surface 39‧‧‧Second organic solvent valve 40‧‧‧Different location 41‧‧‧Suction piping 42‧‧‧Suction valve 43‧‧‧The downstream part of the organic solvent 44‧‧‧Attraction Unit 46‧‧‧Water piping 47‧‧‧Water valve 48‧‧‧Inert gas piping 49‧‧‧Inert gas valve 50‧‧‧Cylinder component 51‧‧‧First cover 52‧‧‧Second cover 53‧‧‧First protective cover 54‧‧‧Second protective cover 55‧‧‧Protection cover lifting unit 59‧‧‧First drain tank 61‧‧‧First drain piping 62‧‧‧Second drain tank 64‧‧‧Second drain piping 66‧‧‧Guiding Department 67‧‧‧Processing liquid separation wall 68‧‧‧Lower end 69‧‧‧Thick Wall 70‧‧‧Middle section 71‧‧‧Upper section 72‧‧‧Cylinder 73‧‧‧Upper end 74‧‧‧Return Department 75‧‧‧Protrusion 86‧‧‧Annular gap 87‧‧‧First interval 88‧‧‧Second interval 102‧‧‧Branch piping for water 103‧‧‧Branch piping for IPA 105‧‧‧On-off valve for water 106‧‧‧Open/close valve for IPA A1, A2‧‧‧axis of rotation A3‧‧‧Shaking axis C‧‧‧Carrier CR‧‧‧Substrate handling robot DF1, DF2, DF3‧‧‧Lower flow H‧‧‧Hand IR‧‧‧Handling robot LP‧‧‧Load Port M‧‧‧Middle position MI‧‧‧Fog P1‧‧‧Up position P2‧‧‧Wetting position P3‧‧‧down position S, S0‧‧‧Gap S1, S2‧‧‧Step S3‧‧‧SPM supply steps S4‧‧‧Water supply steps S5‧‧‧Organic solvent supply steps S6‧‧‧Dehydration step by centrifugal method W‧‧‧Substrate W1‧‧‧Up and down width

圖1係用以說明本發明實施形態之一的基板處理裝置的內部的布局之示意性的俯視圖。 圖2A係用以說明前述基板處理裝置所具備的處理單元的構成例之示意性的剖視圖。 圖2B係用以具體地說明前述處理單元所含有的對向構件的周邊的構成之圖。 圖3A係用以說明在圖2A所示的第二防護罩位於下位置的狀態中之前述腔室的內部的氣流的流動之示意性的圖。 圖3B係用以說明前述第二防護罩位於接液位置的狀態中之前述腔室的內部的氣流的流動之示意性的圖。 圖3C係用以說明前述第二防護罩位於上位置的狀態中之前述腔室的內部的氣流的流動之示意性的圖。 圖4係用以說明前述基板處理裝置的主要部分的電性構成之方塊圖。 圖5係用以說明前述處理單元所為之第一基板處理例之流程圖。 圖6A及圖6B係用以說明前述第一基板處理例之示意性的圖。 圖6C及圖6D係用以說明緊接於圖6B的步驟之示意性的圖。 圖6E係用以說明緊接於圖6D的步驟之示意性的圖。 圖7係用以放大顯示前述處理單元的下部的構成例之示意性的剖視圖。 圖8A及圖8B係用以說明前述處理單元所為之第二基板處理例之示意圖。 圖8C係用以說明前述處理單元所為之第二基板處理例之示意圖。FIG. 1 is a schematic plan view for explaining the internal layout of a substrate processing apparatus according to one embodiment of the present invention. 2A is a schematic cross-sectional view for explaining a configuration example of a processing unit included in the substrate processing apparatus. Fig. 2B is a diagram for specifically explaining the configuration of the periphery of the opposed member included in the aforementioned processing unit. FIG. 3A is a schematic diagram for explaining the flow of the airflow inside the aforementioned chamber in the state where the second shield shown in FIG. 2A is in the lower position. FIG. 3B is a schematic diagram for explaining the flow of the airflow inside the chamber in the state where the second protective cover is located at the liquid contact position. FIG. 3C is a schematic diagram for explaining the flow of the airflow inside the chamber in the state where the second protective cover is in the upper position. FIG. 4 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus. Fig. 5 is a flowchart for explaining the first substrate processing example performed by the aforementioned processing unit. 6A and 6B are schematic diagrams for explaining the foregoing first substrate processing example. 6C and 6D are schematic diagrams for explaining the steps immediately following FIG. 6B. Fig. 6E is a schematic diagram for explaining the steps immediately following Fig. 6D. FIG. 7 is a schematic cross-sectional view for enlargedly showing a configuration example of the lower part of the aforementioned processing unit. 8A and 8B are schematic diagrams for explaining the second substrate processing example performed by the aforementioned processing unit. FIG. 8C is a schematic diagram for explaining the second substrate processing example performed by the aforementioned processing unit.

1‧‧‧基板處理裝置 1‧‧‧Substrate processing equipment

2‧‧‧處理單元 2‧‧‧Processing unit

4‧‧‧腔室 4‧‧‧ Chamber

4a‧‧‧下部空間 4a‧‧‧Lower space

5‧‧‧自轉夾具 5‧‧‧Rotating fixture

6‧‧‧基板對向面 6‧‧‧Substrate facing surface

7‧‧‧對向構件 7‧‧‧Opposite member

12‧‧‧處理罩 12‧‧‧Treatment cover

13‧‧‧隔壁 13‧‧‧Next door

14‧‧‧FFU 14‧‧‧FFU

15b‧‧‧下部區域 15b‧‧‧Lower area

16‧‧‧分隔板 16‧‧‧Partition plate

21‧‧‧阻隔板 21‧‧‧Barrier plate

51‧‧‧第一罩部 51‧‧‧First cover

52‧‧‧第二罩部 52‧‧‧Second cover

53‧‧‧第一防護罩 53‧‧‧First protective cover

54‧‧‧第二防護罩 54‧‧‧Second protective cover

75‧‧‧突部 75‧‧‧Protrusion

A1‧‧‧旋轉軸線 A1‧‧‧Rotation axis

DF3‧‧‧降流 DF3‧‧‧Downstream

M‧‧‧中間位置 M‧‧‧Middle position

P1‧‧‧上位置 P1‧‧‧Up position

P3‧‧‧下位置 P3‧‧‧down position

W‧‧‧基板 W‧‧‧Substrate

Claims (19)

一種基板處理裝置，係包含有：腔室；基板保持單元，係收容於前述腔室內，用以將基板保持成水平姿勢；旋轉單元，係使被前述基板保持單元保持的基板繞著鉛直的旋轉軸線旋轉；第一藥液供給單元，係用以對被前述基板保持單元保持的基板的主表面供給第一藥液；處理罩，用以收容前述基板保持單元，並具有複數個筒狀的防護罩，前述複數個筒狀的防護罩係包含有圍繞前述基板保持單元的周圍之筒狀的第一防護罩以及圍繞前述第一防護罩的周圍之筒狀的第二防護罩；升降單元，係用以使前述複數個防護罩中的至少一個防護罩升降；以及控制裝置，係控制前述旋轉單元、前述第一藥液供給單元以及前述升降單元；前述控制裝置係執行：將前述第一防護罩配置在預定的接液位置的步驟，預定的前述接液位置係可藉由前述第一防護罩接住從被前述旋轉單元旋轉的基板飛散之第一藥液的位置；上位置配置步驟，係將前述第二防護罩配置於上位置，前述上位置係設定至比前述接液位置還上方並可藉由前述第二防護罩接住在前述基板之周圍產生的含有霧氣的環境氣體之預定的上位置；以及第一藥液供給步驟，係在前述第一防護罩配置於前述接液位置且前述第二防護罩配置於前述上位置的狀態下，一邊藉 由前述旋轉單元使基板旋轉一邊藉由前述第一藥液供給單元對前述基板的主表面供給第一藥液。 A substrate processing device includes: a chamber; a substrate holding unit, which is housed in the chamber to hold the substrate in a horizontal posture; a rotating unit, which makes the substrate held by the substrate holding unit rotate vertically around The axis rotates; the first chemical liquid supply unit is used to supply the first chemical liquid to the main surface of the substrate held by the substrate holding unit; the processing cover is used to house the substrate holding unit and has a plurality of cylindrical protections Cover, the plurality of cylindrical protective covers include a cylindrical first protective cover surrounding the periphery of the substrate holding unit and a cylindrical second protective cover surrounding the periphery of the first protective cover; the lifting unit is For raising and lowering at least one of the plurality of protective covers; and a control device for controlling the rotation unit, the first liquid medicine supply unit, and the lifting unit; the control device executes: turning the first protective cover The step of arranging at a predetermined liquid contact position is a position where the predetermined liquid contact position can be caught by the first protective cover and the first liquid medicine scattered from the substrate rotated by the rotating unit; the upper position arrangement step is The second protective cover is arranged in the upper position, and the upper position is set to be higher than the liquid contact position. The second protective cover can be used to catch the predetermined environment gas containing mist generated around the substrate. The upper position; and the first liquid medicine supply step, in a state where the first protective cover is arranged in the liquid contact position and the second protective cover is arranged in the upper position, while borrowing While the substrate is rotated by the rotating unit, the first chemical solution is supplied to the main surface of the substrate by the first chemical solution supply unit. 如請求項1所記載之基板處理裝置，其中進一步具備有：送風單元，係從前述腔室的頂部對前述腔室內朝下地輸送清淨空氣；以及排氣裝置，係將前述腔室內的下部空間的環境氣體予以排氣。 The substrate processing apparatus according to claim 1, which is further provided with: an air blowing unit that conveys clean air downward from the top of the chamber to the chamber; and an exhaust device that divides the lower space of the chamber Exhaust the ambient gas. 如請求項1所記載之基板處理裝置，其中前述第一藥液供給單元係包含：噴嘴，係具有噴出口，用以從前述噴出口朝被前述基板保持單元保持的基板的主表面噴出液體。 The substrate processing apparatus according to claim 1, wherein the first chemical liquid supply unit includes a nozzle having an ejection port for ejecting liquid from the ejection port toward the main surface of the substrate held by the substrate holding unit. 如請求項3所記載之基板處理裝置，其中進一步具備有：對向構件，係配置於比前述防護罩還上方，且具有基板對向面，並在前述防護罩配置於前述上位置的狀態下在與前述防護罩的上端之間形成環狀間隙，前述基板對向面係在上方與被前述基板保持單元保持的基板的上表面對向；以及噴嘴臂，係保持前述噴嘴，並以沿著被前述基板保持單元保持的基板的主表面移動前述噴嘴之方式可搖動地設置於預定的搖動軸線周圍，預定的前述搖動軸線係設定至前述基板的旋轉範圍外；前述環狀間隙係以前述噴嘴臂能跨越前述旋轉範圍的內外之方式設定成比前述噴嘴臂的上下寬度還大。 The substrate processing apparatus according to claim 3, further comprising: an opposing member arranged above the protective cover, having a substrate facing surface, and in a state where the protective cover is arranged at the upper position An annular gap is formed between the upper end of the protective cover, and the substrate facing surface is above and opposed to the upper surface of the substrate held by the substrate holding unit; and a nozzle arm is used to hold the nozzle and follow The main surface of the substrate held by the substrate holding unit moves the nozzle so that the nozzle is swayably arranged around a predetermined shaking axis, and the predetermined shaking axis is set outside the rotation range of the substrate; the annular gap is based on the nozzle The manner in which the arm can span the inside and outside of the aforementioned rotation range is set to be larger than the vertical width of the aforementioned nozzle arm. 如請求項3所記載之基板處理裝置，其中進一步包含有：噴嘴臂，係保持前述噴嘴，並以沿著被前述基板保持單元保持的基板的主表面移動前述噴嘴之方式可搖動地設置於預定的搖動軸線周圍，前述預定的搖動軸線係設定至前述基板保持單元的側方；前述上位置為配置於前述上位置的狀態的前述防護罩的上 端與前述噴嘴臂的下端之間的第一間隔變得比前述噴嘴臂的下端與前述噴出口之間的第二間隔還窄之位置。 The substrate processing apparatus according to claim 3, further comprising: a nozzle arm that holds the nozzle and is swayably installed at a predetermined position so as to move the nozzle along the main surface of the substrate held by the substrate holding unit Around the rocking axis of, the predetermined rocking axis is set to the side of the substrate holding unit; the upper position is the upper position of the protective cover in the state of being arranged in the upper position The first interval between the end and the lower end of the nozzle arm becomes narrower than the second interval between the lower end of the nozzle arm and the ejection port. 如請求項4或5所記載之基板處理裝置，其中前述上位置為配置於前述上位置的狀態的前述防護罩的上端位於比前述噴嘴臂的下端與被前述基板保持單元保持的基板的主表面之間的中間位置還上方之位置。 The substrate processing apparatus according to claim 4 or 5, wherein the upper end of the protective cover in a state where the upper position is arranged in the upper position is located higher than the lower end of the nozzle arm and the main surface of the substrate held by the substrate holding unit The middle position in between is also the position above. 如請求項1至3中任一項所記載之基板處理裝置，其中進一步包含有：第二藥液供給單元，係用以將與前述第一藥液不同種類的第二藥液供給至前述基板的主表面；前述控制裝置係進一步控制前述第二藥液供給單元；前述控制裝置係進一步執行：將前述第一防護罩配置於前述第一防護罩的上端位於比被前述基板保持單元保持的基板還下方之下位置且將前述第二防護罩配置於前述接液位置之步驟；以及第二藥液供給步驟，係在前述第一防護罩配置於前述下位置且前述第二防護罩配置於前述接液位置的狀態下，一邊藉由前述旋轉單元使前述基板旋轉一邊對前述基板的主表面供給第二藥液。 The substrate processing apparatus according to any one of claims 1 to 3, further comprising: a second chemical liquid supply unit for supplying a second chemical liquid different from the first chemical liquid to the substrate The control device further controls the second chemical liquid supply unit; the control device further executes: the first protective cover is arranged on the upper end of the first protective cover and is located higher than the substrate held by the substrate holding unit The step of arranging the second protective cover in the liquid contact position in the lower position; and the step of supplying the second liquid medicine in the lower position and the second protective cover in the lower position. In the state of the liquid contact position, the second chemical liquid is supplied to the main surface of the substrate while rotating the substrate by the rotating unit. 如請求項1至3中任一項所記載之基板處理裝置，其中進一步包含有：對向構件，係配置於比前述防護罩還上方，並在前述防護罩配置於前述上位置的狀態下於與前述防護罩的上端之間形成環狀間隙，且具有基板對向面，前述基板對向面係在上方與被前述基板保持單元保持的基板的上表面對向。 The substrate processing apparatus according to any one of claims 1 to 3, further comprising: an opposing member arranged above the protective cover, and in a state where the protective cover is arranged at the upper position An annular gap is formed with the upper end of the protective cover, and has a substrate facing surface, and the substrate facing surface is upwardly opposed to the upper surface of the substrate held by the substrate holding unit. 如請求項8所記載之基板處理裝置，其中進一步包含有：水供給單元，係用以對前述基板的主表面供給水；前述水供給單元係具有：第二噴嘴，係被配置於前述對向構件，且朝前述基板的主表面噴出水； 前述控制裝置係進一步控制前述水供給單元；前述控制裝置係進一步執行：將前述第一防護罩配置於前述第一防護罩的上端位於比被前述基板保持單元保持的基板還下方之下位置且將前述第二防護罩配置於前述接液位置之步驟；以及水供給步驟，係在前述第一防護罩配置於前述下位置且前述第二防護罩配置於前述接液位置的狀態下，一邊藉由前述旋轉單元使前述基板旋轉一邊從前述第二噴嘴對前述基板的主表面供給水。 The substrate processing apparatus according to claim 8, which further includes: a water supply unit for supplying water to the main surface of the substrate; the water supply unit has: a second nozzle, which is arranged in the opposite direction Component, and spray water toward the main surface of the aforementioned substrate; The control device further controls the water supply unit; the control device further executes: arranging the first protective cover on the upper end of the first protective cover at a position lower than the substrate held by the substrate holding unit and The step of disposing the second protective cover at the liquid contact position; and the step of supplying water in a state where the first protective cover is disposed at the lower position and the second protective cover is disposed at the liquid contact position. The rotation unit rotates the substrate while supplying water from the second nozzle to the main surface of the substrate. 如請求項9所記載之基板處理裝置，其中前述控制裝置係在前述第一藥液供給步驟執行前及/或執行後執行前述水供給步驟。 The substrate processing apparatus according to claim 9, wherein the control device executes the water supply step before and/or after the first chemical solution supply step is performed. 如請求項1至3中任一項所記載之基板處理裝置，其中進一步包含有：分隔板，係在前述腔室內將前述基板保持單元的側方區域上下地分隔成上側的上空間與下側的下空間，並於前述下空間開口有排氣口；於前述第二防護罩與前述分隔板之間形成有間隙；前述第二防護罩係具有：閉塞部，係用以將前述間隙閉塞；在前述第二防護罩配置於前述上位置的狀態下前述閉塞部將前述間隙閉塞且在前述第二防護罩配置於設定在比前述上位置還下方的預定的下方位置的狀態下形成有前述間隙。 The substrate processing apparatus according to any one of claims 1 to 3, which further includes: a partition plate that partitions the side area of the substrate holding unit up and down into an upper space and a lower space in the chamber. Side lower space, and an exhaust port is opened in the lower space; a gap is formed between the second protective cover and the partition plate; the second protective cover has: a blocking portion for closing the gap Blocked; in a state where the second shield is arranged in the upper position, the blocking portion closes the gap, and is formed in a state in which the second shield is arranged at a predetermined lower position below the upper position The aforementioned gap. 如請求項1至3中任一項所記載之基板處理裝置，其中前述第一藥液係包含有硫酸與過氧化氫水的混合液。 The substrate processing apparatus according to any one of claims 1 to 3, wherein the first chemical solution includes a mixed solution of sulfuric acid and hydrogen peroxide water. 如請求項1至3中任一項所記載之基板處理裝置，其中前述第一藥液供給步驟係供給用以對形成於前述基板之主表面的阻劑進行去除處理之前述第一藥液；前述含有霧氣的環境氣體係從用以對前述阻劑進行去除處 理的前述第一藥液產生。 The substrate processing apparatus according to any one of claims 1 to 3, wherein the first chemical solution supply step is to supply the first chemical solution for removing the resist formed on the main surface of the substrate; The aforementioned ambient air system containing mist is used to remove the aforementioned resist The aforementioned first chemical solution of the treatment is produced. 一種基板處理方法，係在基板處理裝置中被執行，前述基板處理裝置係包含有：腔室；基板保持單元，係收容於前述腔室內，用以將基板保持成水平姿勢；旋轉單元，係使被前述基板保持單元保持的基板繞著鉛直的旋轉軸線旋轉；以及複數個防護罩，係包含有圍繞前述基板保持單元的周圍之筒狀的第一防護罩以及圍繞前述第一防護罩的周圍之筒狀的第二防護罩；前述基板處理方法係包含有：基板保持步驟，係藉由前述基板保持單元保持基板；將前述第一防護罩配置在預定的接液位置的步驟，預定的前述接液位置係可藉由前述第一防護罩接住從被前述旋轉單元旋轉的基板飛散之液體的位置；上位置配置步驟，係將前述第二防護罩配置於上位置，前述上位置係設定至比前述接液位置還上方並可藉由前述第二防護罩接住在前述基板之周圍產生的含有霧氣的環境氣體之預定的上位置；以及第一藥液供給步驟，係在前述第一防護罩配置於前述接液位置且前述第二防護罩配置於前述上位置的狀態下，一邊藉由前述旋轉單元使基板旋轉一邊對前述基板的主表面供給第一藥液。 A substrate processing method is executed in a substrate processing apparatus. The substrate processing apparatus includes: a chamber; a substrate holding unit is housed in the chamber to hold the substrate in a horizontal posture; a rotating unit is used to hold the substrate in a horizontal position; The substrate held by the substrate holding unit rotates around a vertical axis of rotation; and a plurality of protective covers including a cylindrical first protective cover surrounding the periphery of the substrate holding unit and one surrounding the periphery of the first protective cover A cylindrical second protective cover; the aforementioned substrate processing method includes: a substrate holding step of holding the substrate by the aforementioned substrate holding unit; a step of arranging the aforementioned first protective cover at a predetermined wetted position, and the predetermined aforementioned contact The liquid position is a position where the liquid scattered from the substrate rotated by the rotating unit can be caught by the first protective cover; the upper position arranging step is to arrange the second protective cover in the upper position, and the upper position is set to It is higher than the liquid contact position and can be caught by the second protective cover at a predetermined upper position of the ambient gas containing mist generated around the substrate; and the first chemical liquid supply step is in the first protective cover In a state where the cover is arranged at the liquid contact position and the second protective cover is arranged at the upper position, the first chemical solution is supplied to the main surface of the substrate while the substrate is rotated by the rotation unit. 如請求項14所記載之基板處理方法，其中進一步包含：排氣步驟，係將前述含有霧氣的環境氣體予以排氣；前述排氣步驟係包含：從前述腔室的頂部對前述腔室內朝下地輸送清淨空氣的步驟；以及從排氣口將前述腔室內的下部空間的環境氣體予以排氣的步驟。 The substrate processing method according to claim 14, which further comprises: an exhaust step, which is to exhaust the mist-containing ambient gas; the exhaust step includes: from the top of the chamber to the inside of the chamber downward The step of delivering clean air; and the step of exhausting the ambient air in the lower space of the chamber from the exhaust port. 如請求項14或15所記載之基板處理方法，其中前述第一藥液供給步驟係供給用以對形成於前述基板之主表面的阻劑進行去除處理之前述第一藥液；前述含有霧氣的環境氣體係從用以對前述阻劑進行去除處理的前述第一藥液產生。 The substrate processing method according to claim 14 or 15, wherein the first chemical solution supply step is to supply the first chemical solution for removing the resist formed on the main surface of the substrate; the aforementioned mist-containing The ambient gas system is generated from the first chemical liquid used to remove the resist. 如請求項14或15所記載之基板處理方法，其中進一步包含有：將前述第一防護罩配置於前述第一防護罩的上端位於比被前述基板保持單元保持的基板還下方之下位置且將前述第二防護罩配置於前述接液位置之步驟；以及第二藥液供給步驟，係在前述第一防護罩配置於前述下位置且前述第二防護罩配置於前述接液位置的狀態下，一邊藉由前述旋轉單元使前述基板旋轉一邊對前述基板的主表面供給第二藥液。 The substrate processing method according to claim 14 or 15, further comprising: arranging the first protective cover on the upper end of the first protective cover at a position lower than the substrate held by the substrate holding unit and placing The step of disposing the second protective cover at the liquid contact position; and the step of supplying the second chemical solution in a state where the first protective cover is disposed at the lower position and the second protective cover is disposed at the liquid contact position, The second chemical solution is supplied to the main surface of the substrate while rotating the substrate by the rotating unit. 如請求項14或15所記載之基板處理方法，其中進一步包含有：將前述第一防護罩配置於前述第一防護罩的上端位於比被前述基板保持單元保持的基板還下方之下位置且將前述第二防護罩配置於前述接液位置之步驟；以及水供給步驟，係在前述第一防護罩配置於前述下位置且前述第二防護罩配置於前述接液位置的狀態下，一邊藉由前述旋轉單元使前述基板旋轉一邊對前述基板的主表面供給水。 The substrate processing method according to claim 14 or 15, further comprising: arranging the first protective cover on the upper end of the first protective cover at a position lower than the substrate held by the substrate holding unit and placing The step of disposing the second protective cover at the liquid contact position; and the step of supplying water in a state where the first protective cover is disposed at the lower position and the second protective cover is disposed at the liquid contact position. The rotation unit rotates the substrate while supplying water to the main surface of the substrate. 如請求項18所記載之基板處理方法，其中前述水供給步驟係在前述第一藥液供給步驟執行前及/或執行後執行。The substrate processing method according to claim 18, wherein the water supply step is performed before and/or after the first chemical liquid supply step is performed.
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