TWI699252B - Light emitting method and light emitting device - Google Patents

Light emitting method and light emitting device Download PDF

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TWI699252B
TWI699252B TW107100065A TW107100065A TWI699252B TW I699252 B TWI699252 B TW I699252B TW 107100065 A TW107100065 A TW 107100065A TW 107100065 A TW107100065 A TW 107100065A TW I699252 B TWI699252 B TW I699252B
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component
offset
light emitting
path
emitting device
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TW107100065A
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TW201929991A (en
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胡平浩
呂紹銓
李炫璋
周柏寰
李閔凱
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財團法人工業技術研究院
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Abstract

A light emitting method comprises a laser beam passing through at least one offset assembly and a focusing assembly in sequence and operating the offset assembly by a control mechanism to cause the laser beam to be offset so that the laser beam can quickly produce any shape of the controllable openings in the drilling process.

Description

出光方法及出光裝置 Light emitting method and light emitting device

本揭露係有關一種出光方法及其裝置,尤指一種出光路徑之調整方法及其裝置。 The present disclosure relates to a light-emitting method and device, especially a light-emitting path adjustment method and device.

雷射微孔加工技術目前已廣泛應用於許多產業,如半導體製程檢測用之探針卡、透明硬脆材料、引擎噴油孔、金屬切孔等製程。惟目前雷射加工設備所製作出之微孔係為錐形圓孔,故需配合鑽孔模組,以具備可控制錐角(taper angle)之能力而產生不同需求之微孔形狀,如探針卡之矩形微孔加工、強化玻璃之直孔、引擎噴嘴之錐孔等。 Laser micro-hole processing technology has been widely used in many industries, such as probe cards for semiconductor process inspection, transparent hard and brittle materials, engine fuel injection holes, metal cutting holes and other processes. However, the current micro-holes produced by laser processing equipment are tapered round holes, so it is necessary to cooperate with the drilling module to have the ability to control the taper angle to produce different shapes of micro-holes. Rectangular micro-hole processing for pin cards, straight holes for strengthened glass, taper holes for engine nozzles, etc.

然而,雷射加工設備往往受限於雷射光束繞射特性,而無法任意調整微孔錐角,致使該鑽孔模組不具備靈活的錐孔加工能力,因而無法滿足單一雷射鑽孔製程中需局部調變成直通孔或錐孔之需求,例如,在矩形孔洞之邊緣側之傾斜度與轉角處之傾斜度不同時的狀況。 However, laser processing equipment is often limited by the diffraction characteristics of the laser beam and cannot adjust the taper angle of the micro-hole arbitrarily. As a result, the drilling module does not have flexible taper hole processing capabilities, and therefore cannot meet a single laser drilling process. For example, when the inclination of the edge of a rectangular hole is different from the inclination of the corner, it needs to be partially adjusted to a through hole or a taper hole.

再者,於習知技術中,係將玻璃平板或稜鏡式繞圓模組(Trepan)藉由中空馬達帶動旋轉,但僅能完成圓形路徑偏移,且該中空馬達之轉速過低(係小於4,000rpm),致使產 能過低,故不僅無法滿足矩形錐孔或其它孔形製程所需之高速且可調控的偏移路徑的條件,且其鑽孔尺寸也受限,例如,無法製作直徑小於50微米(μm)的孔洞。 Furthermore, in the prior art, the glass plate or the trepan type circular module (Trepan) is rotated by a hollow motor, but only the circular path deviation can be completed, and the rotation speed of the hollow motor is too low ( Is less than 4,000rpm), resulting in production It can be too low, so not only can it not meet the conditions of the high-speed and adjustable offset path required by the rectangular taper hole or other hole shape manufacturing process, but the drilling size is also limited, for example, it cannot be made with a diameter less than 50 microns (μm) Holes.

因此,如何克服習知技術之種種缺點,實為目前各界亟欲解決之技術問題。 Therefore, how to overcome the various shortcomings of the conventional technology is actually a technical problem that all circles urgently want to solve.

鑑於上述習知技術之種種缺失,本揭露揭露一種出光方法,係包括:將一光束依序通過至少一偏移組件與一聚焦組件;以及藉由調控機構作動該偏移組件,以令該光束產生偏移,其中,該調控機構係透過可程式邏輯控制器規劃該偏移組件之位移路徑,以帶動該偏移組件位移,並調控該光束的偏移路徑。 In view of the various deficiencies of the above-mentioned conventional technologies, the present disclosure discloses a light emitting method which includes: passing a light beam through at least one offset component and a focusing component in sequence; and actuating the offset component by a regulating mechanism to make the light beam An offset is generated, wherein the control mechanism plans the displacement path of the offset element through a programmable logic controller to drive the displacement of the offset element and adjust the offset path of the light beam.

本揭露復揭露一種出光裝置,係包括:偏移組件,係供一光束通過;聚焦組件,係接收來自該偏移組件之光束;以及調控機構,係作動該偏移組件,以令該光束產生偏移,其中,該調控機構係透過可程式邏輯控制器規劃該偏移組件之位移路徑,以帶動該偏移組件位移,並調控該光束的偏移路徑。 The present disclosure further discloses a light emitting device, which includes: an offset component for a light beam to pass through; a focusing component to receive the light beam from the offset component; and a control mechanism to actuate the offset component to generate the light beam Offset, wherein the control mechanism plans the displacement path of the offset component through a programmable logic controller to drive the displacement of the offset component and regulate the offset path of the light beam.

前述之出光方法中,該偏移組件之位移路徑係為移動距離變化或角度偏轉變化。 In the aforementioned light emitting method, the displacement path of the offset component is the change of the moving distance or the change of the angle deflection.

前述之出光方法及出光裝置中,該出光裝置係為雷射裝置,且該光束係為雷射。 In the aforementioned light emitting method and light emitting device, the light emitting device is a laser device, and the light beam is a laser.

前述之出光方法及出光裝置中,該光束之偏移係為平行位移。 In the aforementioned light emitting method and light emitting device, the deviation of the light beam is parallel displacement.

前述之出光方法及出光裝置中,該光束係用以形成開孔。例如,該可程式邏輯控制器依據光束移動距離與該開孔壁面傾斜角度規劃該偏移組件之位移路徑。 In the aforementioned light emitting method and light emitting device, the light beam is used to form an opening. For example, the programmable logic controller plans the displacement path of the offset component according to the moving distance of the beam and the inclination angle of the wall of the opening.

前述之出光方法及出光裝置中,該偏移組件係包括:分光鏡;波片,係設於該分光鏡上方;以及反射鏡,係設於該波片上方,使該光束從該分光鏡入射,經該分光鏡反射後,經過該波片,再經由該反射鏡反射而再次穿過該波片,之後由該分光鏡反射而出。 In the aforementioned light emitting method and light emitting device, the offset component includes: a beam splitter; a wave plate arranged above the beam splitter; and a reflecting mirror arranged above the wave plate so that the light beam is incident from the beam splitter After being reflected by the beam splitter, it passes through the wave plate, is reflected by the mirror, passes through the wave plate again, and then is reflected by the beam splitter.

前述之出光方法及該出光裝置中,該調控機構具有振鏡馬達,以偏轉該偏移組件於一偏轉角度,且該光束之偏移距離與該偏轉角度兩者之間係相互關聯。 In the aforementioned light emitting method and the light emitting device, the control mechanism has a galvanometer motor to deflect the offset component at a deflection angle, and the offset distance of the light beam and the deflection angle are related to each other.

前述之出光方法及出光裝置中,該光束經過兩組該偏移組件,且其中一組該偏移組件係用以令該光束於X方向上產生偏移,而另一組該偏移組件係用以令該光束於Y方向上產生偏移,其中,該X方向與該Y方向係相互垂直。 In the aforementioned light emitting method and light emitting device, the light beam passes through two sets of the offset components, and one of the offset components is used to offset the light beam in the X direction, and the other set of offset components is It is used to make the light beam shift in the Y direction, wherein the X direction and the Y direction are perpendicular to each other.

前述之出光方法及出光裝置中,復包括將通過該偏移組件之光束藉由掃描組件導引至該聚焦組件。例如,該掃描組件與該可程式邏輯控制器係用以調控該光束的偏移路徑,其可為圓形、方形、三角形、多角形或曲折之路徑,以應用於複雜元件之雷射製程。 In the aforementioned light-emitting method and light-emitting device, it further includes guiding the light beam passing through the offset component to the focusing component through the scanning component. For example, the scanning component and the programmable logic controller are used to control the deviation path of the beam, which can be a circular, square, triangular, polygonal or tortuous path, which can be applied to the laser manufacturing process of complex components.

由上可知,本揭露之出光方法及出光裝置中,主要藉由該調控機構與該偏移組件之配置,以調控該光束之路徑,故應用於雷射加工之鑽孔製程中,不僅能依需求快速地產生可控制及任意形狀的錐形孔或直通孔,且能製作尺 寸小尺寸的孔洞。 It can be seen from the above that in the light emitting method and the light emitting device of the present disclosure, the path of the light beam is adjusted mainly by the configuration of the adjusting mechanism and the offset component. Therefore, it is applied to the drilling process of laser processing, not only Need to quickly produce controllable and arbitrary shape tapered holes or through holes, and can make rulers Inch small size hole.

1,3‧‧‧出光裝置 1,3‧‧‧Light emitting device

10‧‧‧光源 10‧‧‧Light source

11,21,31x,31y‧‧‧偏移組件 11,21,31x,31y‧‧‧Offset component

12‧‧‧調控機構 12‧‧‧Regulatory agency

13‧‧‧聚焦組件 13‧‧‧Focusing component

20,310‧‧‧偏振分光鏡 20,310‧‧‧Polarization beam splitter

20a‧‧‧第一表面 20a‧‧‧First surface

20b‧‧‧第二表面 20b‧‧‧Second surface

21a,21b,311‧‧‧1/4波片 21a, 21b, 311‧‧‧1/4 wave plate

22a,22b,312‧‧‧反射鏡 22a,22b,312‧‧‧Mirror

32‧‧‧掃描組件 32‧‧‧Scanning components

320‧‧‧導引鏡 320‧‧‧Guiding mirror

8‧‧‧目標物 8‧‧‧Target

80‧‧‧圓形錐孔 80‧‧‧Circular taper hole

81‧‧‧圓形倒錐孔 81‧‧‧Round inverted taper hole

82‧‧‧星形開孔 82‧‧‧Star opening

83‧‧‧交叉狀開孔 83‧‧‧Cross-shaped opening

9‧‧‧探針卡 9‧‧‧Probe card

90‧‧‧開孔 90‧‧‧Opening

a‧‧‧原點 a‧‧‧origin

b‧‧‧偏移點 b‧‧‧offset point

D‧‧‧平行位移距離 D‧‧‧Parallel displacement distance

e‧‧‧傾斜度 e‧‧‧Inclination

W‧‧‧長邊 W‧‧‧long side

L,L1,L2,L3,L4,L,L6,L7,L9‧‧‧光束 L,L1,L2,L3,L4,L,L6,L7,L9‧‧‧Beam

R1‧‧‧矩形路徑 R1‧‧‧Rectangular path

R2‧‧‧圓形路徑 R2‧‧‧Circular path

R3‧‧‧偏移路徑 R3‧‧‧Offset path

θ‧‧‧偏轉角度 θ‧‧‧Deflection angle

第1圖係為本揭露之出光裝置之第一實施例的示意圖;第1A及1B圖係為第1圖之光束路徑規劃之其它態樣的示意圖;第1C及1D圖係為第1圖之開孔形狀之其它態樣的示意圖;第2A圖係為本揭露之出光裝置之第二實施例的局部示意圖;第2B圖係為第2A圖的光束偏移狀態示意圖;第2C圖係為第2B圖的光束於目標物上的結果示意圖;以及第3圖係為本揭露之出光裝置之第三實施例的示意圖。 Figure 1 is a schematic diagram of the first embodiment of the light emitting device disclosed in the disclosure; Figures 1A and 1B are schematic diagrams of other aspects of the beam path planning of Figure 1; Figures 1C and 1D are of Figure 1 A schematic diagram of other aspects of the shape of the opening; Fig. 2A is a partial schematic diagram of the second embodiment of the disclosed light emitting device; Fig. 2B is a schematic diagram of the beam shift state of Fig. 2A; Fig. 2C is a diagram 2B is a schematic diagram of the result of the beam on the target; and FIG. 3 is a schematic diagram of the third embodiment of the light emitting device disclosed in the disclosure.

以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The following specific examples illustrate the implementation of the present invention. Those familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功 效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「下」、「第一」、「第二」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。 It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this manual are only used to match the contents disclosed in the manual for the understanding and reading of those familiar with the art, and are not intended to limit the implementation of the present invention. Therefore, it does not have any technical significance. Any structural modification, proportional relationship change or size adjustment does not affect the function of the present invention. The effect and the achievable purpose should still fall within the scope of the technical content disclosed in the present invention. At the same time, the terms "upper", "lower", "first", "second" and "one" quoted in this manual are only for convenience of description, and are not intended to limit the scope of the present invention. The scope of implementation, the change or adjustment of the relative relationship, shall be regarded as the scope of the implementation of the present invention without substantial changes to the technical content.

請參閱第1圖,係為本揭露之出光裝置1之第一實施例的示意圖。如第1圖所示,該出光裝置1係模組化,其包括一偏移組件11、一調控機構12以及一聚焦組件13。 Please refer to FIG. 1, which is a schematic diagram of the first embodiment of the light emitting device 1 of this disclosure. As shown in FIG. 1, the light emitting device 1 is modularized, which includes an offset component 11, a regulating mechanism 12 and a focusing component 13.

所述之偏移組件11係包含分光鏡。 The offset component 11 includes a beam splitter.

所述之調控機構12係作動該偏移組件11,且包含振鏡馬達(Galvo motor),以藉由可程式邏輯控制器(programmable logic controller,簡稱PLC)規劃該偏移組件11之位移路徑(如第1圖所示之矩形路徑R1),使該振鏡馬達帶動該偏移組件位移,其中,該可程式邏輯控制器之規劃方式係依據光束移動距離(如探針卡9導引探針用之開孔90之長邊W之尺寸)與光束開孔壁面傾斜角度(即該開孔90之錐面傾斜度e),亦即該可程式邏輯控制器之規劃方式係為光束移動距離與光束開孔壁面傾斜角度之關聯方程式。 The control mechanism 12 actuates the offset component 11, and includes a galvo motor (Galvo motor) to plan the displacement path of the offset component 11 by a programmable logic controller (PLC). As shown in Figure 1, the rectangular path R1), the galvanometer motor drives the displacement of the offset assembly. The programming method of the programmable logic controller is based on the light beam moving distance (such as the probe card 9 guides the probe The size of the long side W of the opening 90 used) and the inclination angle of the beam opening wall (that is, the inclination e of the cone of the opening 90), that is, the programming method of the programmable logic controller is the beam moving distance and The correlation equation of the inclination angle of the beam opening wall.

所述之聚焦組件13係包含聚焦鏡片。 The focusing component 13 includes a focusing lens.

於操作時,由一光源10產生如雷射之光束L,該光束L經由該偏移組件11,再經由該聚焦組件13,以將該光束L聚焦於目標物(如該探針卡9之開孔90處)上,且藉由 該調控機構12位移該偏移組件11(如沿著第1圖所示之矩形路徑R1),以調控該光束L的偏移路徑(依不同偏移路徑而成為光束L或光束L9)。 During operation, a light source 10 generates a laser beam L, the beam L passes through the offset component 11, and then through the focusing component 13, to focus the beam L on a target (such as the probe card 9 90 holes) on it, and by The adjusting mechanism 12 displaces the offset component 11 (for example, along the rectangular path R1 shown in FIG. 1) to adjust the offset path of the light beam L (being the light beam L or the light beam L9 according to different offset paths).

因此,本揭露之出光裝置1藉由該調控機構12之振鏡馬達與可程式邏輯控制器之設計,以調控該偏移組件11之偏移,使該光束L的路徑(如第1圖所示之矩形路徑R1或第1A及1B圖所示之圓形路徑R2)可依需求規劃,故該出光裝置1能任意調整開孔錐角(如該矩形開孔90之長邊W之傾斜度e與轉角處之傾斜度e不同),因而能應用於各種孔形之製作,如第1A及1B圖所示之目標物8之圓形錐孔80及圓形倒錐孔81、第1C圖所示之目標物8之星形開孔82及交叉狀開孔83、或如第1D圖所示之探針卡9之具倒角之矩形開孔90,尤其是可製作直徑小於50微米(μm)的孔洞(如該探針卡9之矩形開孔90)。 Therefore, the light emitting device 1 of the present disclosure uses the design of the galvanometer motor of the adjusting mechanism 12 and the programmable logic controller to adjust the offset of the offset element 11 so that the path of the light beam L (as shown in Figure 1 The rectangular path R1 shown or the circular path R2 shown in Figures 1A and 1B) can be planned according to requirements, so the light emitting device 1 can adjust the taper angle of the opening arbitrarily (such as the inclination of the long side W of the rectangular opening 90 e is different from the inclination e at the corner), so it can be applied to the production of various hole shapes, such as the circular taper hole 80 and the circular inverted taper hole 81 of the target 8 shown in Figures 1A and 1B, Figure 1C The star-shaped opening 82 and the cross-shaped opening 83 of the target 8 shown, or the chamfered rectangular opening 90 of the probe card 9 shown in Fig. 1D, can be made especially with a diameter of less than 50 microns ( μm) holes (such as the rectangular opening 90 of the probe card 9).

請參閱第2A及2B圖,係為本揭露之出光裝置之第二實施例的局部示意圖。本實施例與第一實施例之差異在於偏移組件之構件,其它配置大致相同,故以下不再贅述相同處。 Please refer to FIGS. 2A and 2B, which are partial schematic diagrams of the second embodiment of the light emitting device disclosed in this disclosure. The difference between this embodiment and the first embodiment lies in the components of the offset assembly, and the other configurations are substantially the same, so the same points will not be repeated below.

如第2A圖所示,該偏移組件21係包含一偏振分光鏡(Polarizing beam splitter,簡稱PBS)20、兩1/4波片(wave plate)21a,21b與兩反射鏡(mirror)22a,22b。 As shown in Figure 2A, the offset component 21 includes a polarizing beam splitter (PBS) 20, two quarter wave plates (wave plates) 21a, 21b, and two mirrors (mirror) 22a. 22b.

於本實施例中,該偏振分光鏡20具有相對之第一表面20a與第二表面20b,且該兩1/4波片21a,21b係分別設於該第一表面20a與第二表面20b之一側,而該兩反射鏡 22a,22b係分別設於該兩1/4波片21a,21b之一側。 In this embodiment, the polarizing beam splitter 20 has a first surface 20a and a second surface 20b opposite to each other, and the two quarter wave plates 21a, 21b are respectively disposed on the first surface 20a and the second surface 20b. One side, and the two mirrors 22a and 22b are respectively arranged on one side of the two quarter wave plates 21a and 21b.

於使用時,該光源10之光束L1係為S偏振光,其從該偏振分光鏡20之第一表面20a入射,經該偏振分光鏡20之第一表面20a反射後,經過該第一表面20a之一側之1/4波片21a,再經由其上之反射鏡22a反射而再次穿過該第一表面20a上之1/4波片21a,此時光束L2變成P偏振光,故會穿過該偏振分光鏡20之第一表面20a與第二表面20b。之後,該光束L2(P偏振光)穿過該偏振分光鏡20並經過該第二表面20b上之1/4波片21b,再經由其上之反射鏡22b反射而再次穿過該第二表面20b之一側之1/4波片21b,此時光束L3會變回S偏振光,故會由該偏振分光鏡20之第二表面20b反射而出光。 When in use, the light beam L1 of the light source 10 is S-polarized light, which enters from the first surface 20a of the polarizing beam splitter 20, is reflected by the first surface 20a of the polarizing beam splitter 20, and then passes through the first surface 20a The quarter-wave plate 21a on one side is reflected by the mirror 22a on it and passes through the quarter-wave plate 21a on the first surface 20a again. At this time, the beam L2 becomes P-polarized light, so it will pass through Pass the first surface 20a and the second surface 20b of the polarizing beam splitter 20. After that, the light beam L2 (P polarized light) passes through the polarization beam splitter 20 and passes through the quarter-wave plate 21b on the second surface 20b, and then is reflected by the mirror 22b thereon to pass through the second surface again The quarter wave plate 21b on one side of 20b, at this time, the light beam L3 will change back to S-polarized light, so it will be reflected by the second surface 20b of the polarization beam splitter 20 to emit light.

因此,利用該偏振分光鏡20對S偏振光具備高反射特性及P偏振光具備高穿透特性,以調整該光束L1的偏振特性,使該光束L3在該偏振分光鏡20之第二表面20b反射出光,即可產生可控制且任意的偏移位置。 Therefore, the polarization beam splitter 20 is used to have high reflection characteristics for S-polarized light and high penetration characteristics for P-polarized light to adjust the polarization characteristics of the light beam L1 so that the light beam L3 is on the second surface 20b of the polarization beam splitter 20 Reflect the light to produce a controllable and arbitrary offset position.

再者,如第2B圖所示,利用該調控機構12之振鏡馬達(Galvo motor)朝順時針偏轉調整該偏振分光鏡20的角度,使該光束L3產生平行之位移(如位移後之光束L4),且可達到高速調控(例如,馬達每分鐘轉速大於20,000rpm)。具體地,該偏振分光鏡20之初始位置如虛線位置(或如第2A圖所示),且該振鏡馬達朝順時針或逆時針偏轉該偏振分光鏡20的偏轉角度為±θ,故可推得該光束L3之平行位移距離D為2(D1+D2)tan(2θ),其中,D1 係表示該第一表面20a上之反射鏡22a至該偏振分光鏡20之距離,且D2係表示該第二表面20b上之反射鏡22b至該偏振分光鏡20之距離。例如,當該偏振分光鏡20的偏轉角度θ為1度且該偏移組件21之長度為86mm(即D1與D2視為43mm)時,則D=2(43+43)tan(2.1)=6.006mm,使該光束L3之平行位移6.006mm而成為第2B圖所示之下方光束L4,亦即如第2C圖所示之由原點a(位移前之光束L3於聚焦後之目標物8上之開孔處)位移至偏移點b(位移後之光束L4於聚焦後之目標物8上之開孔處)。應可理解地,若該振鏡馬達朝逆時針偏轉該偏振分光鏡20,則位移前之光束L3會向上偏移成另一光束L5。 Furthermore, as shown in Figure 2B, the galvo motor of the adjusting mechanism 12 is used to deflection clockwise to adjust the angle of the polarization beam splitter 20, so that the beam L3 is parallel shifted (such as the shifted beam L4), and can achieve high-speed control (for example, the motor speed is greater than 20,000 rpm). Specifically, the initial position of the polarization beam splitter 20 is the position of the dotted line (or as shown in Figure 2A), and the deflection angle of the galvanometer motor clockwise or counterclockwise to deflect the polarization beam splitter 20 is ±θ, so It is deduced that the parallel displacement distance D of the beam L3 is 2(D1+D2)tan(2θ), where D1 It represents the distance from the mirror 22a on the first surface 20a to the polarization beam splitter 20, and D2 represents the distance from the mirror 22b on the second surface 20b to the polarization beam splitter 20. For example, when the deflection angle θ of the polarization beam splitter 20 is 1 degree and the length of the offset component 21 is 86 mm (that is, D1 and D2 are regarded as 43 mm), then D=2(43+43)tan(2.1 )=6.006mm, make the parallel displacement of the beam L3 6.006mm to become the lower beam L4 shown in Figure 2B, that is, as shown in Figure 2C from the origin a (before the displacement of the beam L3 is the target after focusing The opening on the object 8 is displaced to the offset point b (the beam L4 after displacement is at the opening on the target 8 after focusing). It should be understood that if the galvanometer motor deflects the polarization beam splitter 20 counterclockwise, the beam L3 before the displacement will shift upward into another beam L5.

又,依據上述公式可知,該平行位移距離D與該偏振分光鏡20的偏轉角度θ兩者之間係相關聯,故於實際運作(如鑽孔製程)中,藉由該調控機構12之可程式邏輯控制器(PLC)之規畫方式,即光束移動距離(如該平行位移距離D)與開孔壁面傾斜角度(即孔錐度)之相關聯方程式,因而只要輸入所欲位移之數值(平行位移距離D)即可推算出所需之偏轉角度θ,進而令該可程式邏輯控制器(PLC)操控該振鏡馬達偏轉該偏振分光鏡20。 Furthermore, according to the above formula, the parallel displacement distance D is related to the deflection angle θ of the polarization beam splitter 20. Therefore, in actual operations (such as a drilling process), the control mechanism 12 can The programming method of the Program Logic Controller (PLC) is the correlation equation between the beam moving distance (such as the parallel displacement distance D) and the inclination angle of the hole wall (ie the hole taper), so just enter the desired displacement value (parallel The displacement distance D) can calculate the required deflection angle θ, and then the programmable logic controller (PLC) can control the galvanometer motor to deflect the polarization beam splitter 20.

本揭露藉由該偏移組件21配合該調控機構12之設計,不僅可調控該光束L3之偏移,且調控速度高,故該出光裝置能任意調整開孔錐角,因而能應用於各種孔形之製作。 According to the present disclosure, through the design of the offset component 21 and the adjusting mechanism 12, not only the offset of the light beam L3 can be adjusted, but the adjustment speed is high. Therefore, the light emitting device can adjust the taper angle of the opening arbitrarily, and thus can be applied to various holes. Shape production.

再者,該偏移組件21之體積小,故該出光裝置之模組 空間亦得小型化。 Furthermore, the volume of the offset component 21 is small, so the module of the light emitting device The space must also be miniaturized.

第3圖係為本揭露之出光裝置3之第三實施例的示意圖。本實施例與第一實施例之差異在於偏移組件之佈設,其它配置大致相同,故以下不再贅述相同處。 FIG. 3 is a schematic diagram of the third embodiment of the light emitting device 3 of the disclosure. The difference between this embodiment and the first embodiment lies in the layout of the offset components, and the other configurations are substantially the same, so the same points will not be repeated in the following.

如第3圖所示,該出光裝置3係包括至少兩組偏移組件31x,31y及掃描組件32。 As shown in FIG. 3, the light emitting device 3 includes at least two sets of offset components 31x, 31y and a scanning component 32.

所述之偏移組件31x,31y係可採用如第二實施例所示之偏移組件21,其包含一偏振分光鏡310、兩1/4波片311與兩反射鏡312,以利用調控機構12之振鏡馬達調整該偏振分光鏡310的偏轉角度,其中,一組偏移組件31y係用以令光束於Y軸方向產生偏移,而另一組偏移組件31x係用以令光束於X軸方向產生偏移。 The offset components 31x, 31y can be the offset component 21 shown in the second embodiment, which includes a polarization beam splitter 310, two quarter-wave plates 311, and two mirrors 312 to utilize the control mechanism The galvo motor 12 adjusts the deflection angle of the polarization beam splitter 310. One set of offset components 31y is used to offset the beam in the Y-axis direction, and the other set of offset components 31x is used to offset the beam in the Y-axis direction. The X-axis direction is offset.

所述之掃描組件32係為振鏡式,例如有限狀態機(finite-state machine,簡稱FSM)掃描器(scanner)或XY掃描器等二維掃描器,其具有兩垂直排設之導引鏡320。有關掃描組件32之種類繁多,並不限於上述型式,例如可為一維掃描器。 The scanning component 32 is a galvanometer type, such as a finite-state machine (FSM) scanner or a two-dimensional scanner such as an XY scanner, which has two guide mirrors arranged vertically 320. There are many types of scanning components 32, which are not limited to the above-mentioned types. For example, they may be a one-dimensional scanner.

於使用時,該光源10之光束L6先後經過該兩偏移組件31x,31y,再經由該掃描組件32之導引鏡320反射導引至該聚焦組件13,以將該光束聚焦於目標物上。若應用於鑽孔製程中,藉由該兩偏移組件31x,31y可調整開孔之錐面傾斜度(即孔錐度,相關說明可參考第二實施例,如第3圖所示之虛線所表示之調整後之光束L7),且藉由該掃描組件32與該可程式邏輯控制器(PLC)以調控該光束L6 的偏移路徑R3,其圖示係為圓形路徑,但於其它實施例中,該偏移路徑R3可為任意路徑,如方形、三角形、多角形或曲折等路徑,以應用於複雜元件之雷射製程。 When in use, the light beam L6 of the light source 10 passes through the two offset components 31x and 31y successively, and then is reflected and guided to the focusing component 13 by the guide mirror 320 of the scanning component 32 to focus the beam on the target . If applied in the drilling process, the taper inclination of the opening (ie, taper of the hole) can be adjusted by the two offset components 31x, 31y. The related description can refer to the second embodiment, as shown by the dotted line in Figure 3 Indicates the adjusted light beam L7), and the light beam L6 is controlled by the scanning component 32 and the programmable logic controller (PLC) The offset path R3 shown in the figure is a circular path, but in other embodiments, the offset path R3 can be any path, such as a square, triangle, polygon, or zigzag path, to be applied to complex components Laser process.

本揭露以兩組獨立的偏移組件31x,31y,分別使該光束L6於X、Y方向產生偏移,且藉由該掃描組件32在XY平面與聚焦光軸上產生可控制且任意的錐角。 The present disclosure uses two independent offset components 31x, 31y to offset the beam L6 in the X and Y directions, and the scanning component 32 generates a controllable and arbitrary cone on the XY plane and the focusing optical axis. angle.

綜上所述,本揭露之出光方法及其出光裝置,係藉由該調控機構與該偏移組件之配置,以調控光束之路徑,故應用於雷射加工之鑽孔製程中,不僅能依需求快速地產生可控制及任意形狀的錐形孔或直通孔,且能製作尺寸大於、等於或小於50微米的孔洞。 In summary, the light emitting method and the light emitting device disclosed in the present disclosure regulate the path of the light beam by the configuration of the adjusting mechanism and the offset component. Therefore, it is applied to the drilling process of laser processing, not only can It is required to quickly produce controllable and arbitrary-shaped tapered holes or through holes, and to make holes with a size greater than, equal to or less than 50 microns.

另外,該調控機構12之振鏡馬達可由音圈馬達或轉矩馬達取代,並無特別限制。 In addition, the galvanometer motor of the regulating mechanism 12 can be replaced by a voice coil motor or a torque motor, and there is no particular limitation.

上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。 The above-mentioned embodiments are used to exemplify the principles and effects of the present invention, but not to limit the present invention. Anyone familiar with this technique can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

1‧‧‧出光裝置 1‧‧‧Light emitting device

10‧‧‧光源 10‧‧‧Light source

11‧‧‧偏移組件 11‧‧‧Offset component

12‧‧‧調控機構 12‧‧‧Regulatory agency

13‧‧‧聚焦組件 13‧‧‧Focusing component

9‧‧‧探針卡 9‧‧‧Probe card

90‧‧‧開孔 90‧‧‧Opening

e‧‧‧傾斜度 e‧‧‧Inclination

W‧‧‧長邊 W‧‧‧long side

L,L9‧‧‧光束 L,L9‧‧‧Beam

R1‧‧‧矩形路徑 R1‧‧‧Rectangular path

Claims (12)

一種出光方法,係包括:將一用以形成開孔之雷射光束依序通過至少一包含分光鏡之偏移組件與一聚焦組件;以及藉由調控機構作動該偏移組件,以令該光束產生偏移,其中,該光束之偏移係為平行位移,該調控機構係透過可程式邏輯控制器依據光束移動距離與該開孔壁面傾斜角度規劃該偏移組件之位移路徑,以帶動該偏移組件位移,並調控該光束的偏移路徑,且該偏移組件之位移路徑係為移動距離變化或角度偏轉變化。 A light emitting method includes: sequentially passing a laser beam for forming an opening through at least one offset component including a beam splitter and a focusing component; and actuating the offset component by a regulating mechanism to make the beam The deviation is generated, wherein the deviation of the beam is parallel displacement, and the control mechanism plans the displacement path of the deviation component according to the moving distance of the beam and the inclination angle of the opening wall through a programmable logic controller to drive the deviation The displacement component is displaced and regulates the deviation path of the light beam, and the displacement path of the deviation component is the change of the moving distance or the change of the angle deflection. 如申請專利範圍第1項所述之出光方法,其中,該偏移組件復包括:波片,係設於該分光鏡上方;以及反射鏡,係設於該波片上方,使該光束入射該分光鏡,經該分光鏡反射,經過該波片,再經由該反射鏡反射而再次穿過該波片,之後由該分光鏡反射而出。 As described in the first item of the scope of patent application, the offset component further comprises: a wave plate arranged above the beam splitter; and a reflecting mirror arranged above the wave plate so that the light beam enters the The beam splitter is reflected by the beam splitter, passes through the wave plate, is reflected by the mirror, passes through the wave plate again, and then is reflected by the beam splitter. 如申請專利範圍第1項所述之出光方法,其中,該調控機構具有振鏡馬達以偏轉該偏移組件於一偏轉角度,且該光束之偏移距離與該偏轉角度相關聯。 According to the light emitting method described in claim 1, wherein the adjusting mechanism has a galvanometer motor to deflect the offset component at a deflection angle, and the deflection distance of the light beam is related to the deflection angle. 如申請專利範圍第1項所述之出光方法,其中,該光束經過兩組該偏移組件,且其中一組該偏移組件係用以令該光束於X方向上產生偏移,而另一組該偏移組件係用以令該光束於Y方向上產生偏移,其中,該X方向與該Y方向係相互垂直。 As described in the first item of the scope of patent application, the light beam passes through two sets of the offset components, and one of the offset components is used to offset the light beam in the X direction, and the other The offset component is set to make the beam offset in the Y direction, wherein the X direction and the Y direction are perpendicular to each other. 如申請專利範圍第1項所述之出光方法,復包括將通過該偏移組件之光束藉由掃描組件導引至該聚焦組件。 As described in the first item of the scope of patent application, the light emitting method further includes guiding the light beam passing through the offset component to the focusing component through the scanning component. 一種出光裝置,係包括:包含分光鏡之偏移組件,係供一用以形成開孔之雷射光束通過;聚焦組件,係接收來自該偏移組件之光束;以及調控機構,係作動該偏移組件,以令該光束產生偏移,其中,該光束之偏移係為平行位移,該調控機構係透過可程式邏輯控制器依據光束移動距離與該開孔壁面傾斜角度規劃該偏移組件之位移路徑,以帶動該偏移組件位移,並調控該光束的偏移路徑,且該偏移組件之位移路徑係為移動距離變化或角度偏轉變化。 A light emitting device includes: an offset component including a beam splitter for a laser beam used to form an opening to pass through; a focusing component to receive the beam from the offset component; and a regulating mechanism to actuate the deviation Shift the component to make the beam shift, wherein the shift of the beam is parallel displacement, and the control mechanism plans the shift component of the shift component according to the moving distance of the beam and the inclination angle of the opening wall through a programmable logic controller The displacement path is used to drive the displacement of the deflection component and regulate the deflection path of the light beam, and the displacement path of the deflection component is the change of the movement distance or the change of the angle deflection. 如申請專利範圍第6項所述之出光裝置,其中,該偏移組件復包括:波片,係設於該分光鏡上方;以及反射鏡,係設於該波片上方。 According to the light emitting device described in item 6 of the scope of patent application, the offset component further includes: a wave plate arranged above the beam splitter; and a reflecting mirror arranged above the wave plate. 如申請專利範圍第6項所述之出光裝置,其中,該調控機構具有振鏡馬達,以偏轉該偏移組件於一偏轉角度,且該光束之偏移距離與該偏轉角度相關聯。 According to the light emitting device described in item 6 of the scope of patent application, the adjusting mechanism has a galvanometer motor to deflect the offset component at a deflection angle, and the deflection distance of the light beam is related to the deflection angle. 如申請專利範圍第6項所述之出光裝置,其中,該光束經過兩組該偏移組件,且其中一組該偏移組件係用以令該光束於X方向上產生偏移,而另一組該偏移組件係用以令該光束於Y方向上產生偏移,其中,該X方向與該Y方向係相互垂直。 For the light emitting device described in item 6 of the scope of patent application, the light beam passes through two sets of the offset components, and one of the offset components is used to offset the light beam in the X direction, and the other The offset component is set to make the beam offset in the Y direction, wherein the X direction and the Y direction are perpendicular to each other. 如申請專利範圍第6項所述之出光裝置,復包括掃描組件,係設於該偏移組件與該聚焦組件之間,以將通過該偏移組件之光束導引至該聚焦組件。 As described in item 6 of the scope of patent application, the light emitting device further includes a scanning component, which is arranged between the offset component and the focusing component, so as to guide the light beam passing through the offset component to the focusing component. 如申請專利範圍第10項所述之出光裝置,其中,該掃描組件與該可程式邏輯控制器係用以調控該光束的偏移路徑。 According to the light emitting device described in claim 10, the scanning element and the programmable logic controller are used to control the deviation path of the light beam. 如申請專利範圍第11項所述之出光裝置,其中,該偏移路徑係為圓形、方形、三角形、多角形或曲折之路徑,以應用於複雜元件之雷射製程。 For the light emitting device described in item 11 of the scope of the patent application, the offset path is a circular, square, triangular, polygonal or tortuous path for use in the laser manufacturing process of complex components.
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TW201733730A (en) * 2013-08-02 2017-10-01 柔芬新拿科技公司 Method and apparatus for performing laser filamentation within transparent materials

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US20130258332A1 (en) * 2010-11-22 2013-10-03 Yokogawa Electric Corporation Microscope spectrometer, optical axis shift correction device, spectroscope and microscope using same
TW201733730A (en) * 2013-08-02 2017-10-01 柔芬新拿科技公司 Method and apparatus for performing laser filamentation within transparent materials
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