TWI694335B - Memory card adaptor and memory device - Google Patents

Memory card adaptor and memory device Download PDF

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Publication number
TWI694335B
TWI694335B TW107109070A TW107109070A TWI694335B TW I694335 B TWI694335 B TW I694335B TW 107109070 A TW107109070 A TW 107109070A TW 107109070 A TW107109070 A TW 107109070A TW I694335 B TWI694335 B TW I694335B
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memory card
electrical
electrical connection
slot
electrically connected
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TW107109070A
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Chinese (zh)
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TW201939300A (en
Inventor
尹永興
劉文平
潘仁傑
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威剛科技股份有限公司
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Priority to TW107109070A priority Critical patent/TWI694335B/en
Priority to CN201810251603.7A priority patent/CN110277675B/en
Publication of TW201939300A publication Critical patent/TW201939300A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07732Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6675Structural association with built-in electrical component with built-in electronic circuit with built-in power supply
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/70Structural association with built-in electrical component with built-in switch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00Coupling parts supported only by co-operation with counterpart
    • H01R31/06Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00Connectors or connections adapted for particular applications
    • H01R2201/06Connectors or connections adapted for particular applications for computer periphery

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A memory device comprise a housing and a circuit board. The circuit board has a socket conforming to M.2 interface standard specification and an electric connector conforming to M.3 interface standard specification. The circuit board has a processor to convert an external voltage to an operating voltage for memory card which is inserted into the socket. The memory device provides a hot-plugging function for active connection/disconnection of the memory card to/from the socket.

Description

轉接組件及記憶卡裝置 Adapter assembly and memory card device

本發明涉及一種轉接組件及記憶卡裝置,特別是一種能插接於提供符合M.3介面規範的記憶卡插設的電連接槽中的轉接組件及記憶卡裝置。 The invention relates to an adapter component and a memory card device, in particular to an adapter component and a memory card device that can be plugged into an electrical connection slot provided with a memory card that meets the M.3 interface specification.

M.3介面規範是目前三星公司(Samsung)極力推展的高速固態硬碟(Solid State Disk,SSD)的新介面規範,目前主要是應用於企業級的伺服器中。此M.3介面規範的相關連接埠與現有的M.2介面規範的相關連接埠基本上不相容。但,目前較為流通的高速固態硬碟為符合M.2介面規範的固態硬碟,因此,對於相關技術人員而言,如何使現有符合M.2介面規範的固態硬碟與M.3介面規範的相關連接埠相容,成為了重要的課題。 The M.3 interface specification is a new interface specification for high-speed solid state disks (SSDs) that Samsung (Samsung) is actively promoting. It is currently mainly used in enterprise-level servers. The related ports of the M.3 interface specification are basically incompatible with the related ports of the existing M.2 interface specification. However, the high-speed solid-state drives currently in circulation are solid-state drives that comply with the M.2 interface specification. Therefore, for related technical personnel, how to make the existing solid-state drives that comply with the M.2 interface specification and the M.3 interface specification The compatibility of related ports has become an important issue.

緣此,本發明人乃潛心研究並配合學理的運用,而提出一種設計合理且有效改善上述問題的本發明。 For this reason, the present inventor has devoted himself to study and cooperate with the application of theory, and proposes a reasonable design and effectively improves the above problems.

本發明的主要目的在於提供一種轉接組件及記憶卡裝置,用以改善現有技術中,符合M.2介面規範的記憶卡無法直接與用以提供符合M.3介面規範的記憶卡插設的電連接槽插接的問題。 The main purpose of the present invention is to provide an adaptor assembly and a memory card device to improve the existing technology, the memory card that meets the M.2 interface specification cannot be directly inserted into the memory card that provides the M.3 interface specification The problem of electrical connection slot insertion.

為了實現上述目的,本發明提供一種轉接組件,其包含:一殼體、一電連接插槽、一電插接結構及一電路板。殼體的一端形成有一開口。電連接插槽設置殼體中,電連接插槽對應露出於開口,電連接插槽用以提供符合M.2(NGFF)介面規範的記憶卡電性插 接;符合M.2(NGFF)介面規範的記憶卡能通過開口,而與電連接插槽電性連接。電插接結構的部份外露於殼體,且外露於殼體的電插接結構對應位於殼體相反於形成有開口的一端;電插接結構能插設於提供符合M.3(NGSFF)介面規範的記憶卡插設的一外部電插槽。電路板設置有一處理模組,電路板設置於殼體中,電連接插槽及電插接結構設置於電路板,處理模組電性連接電連接插槽及電插接結構。其中,當符合M.2(NGFF)介面規範的記憶卡插接於電連接插槽,且電插接結構插設於外部電插槽時,處理模組能將外部電插槽輸入的電壓轉換至符合M.2(NGFF)介面規範的記憶卡所需的電壓。 In order to achieve the above object, the present invention provides an adaptor assembly, which includes: a housing, an electrical connection slot, an electrical plug structure and a circuit board. An opening is formed at one end of the housing. The electrical connection slot is provided in the casing, and the electrical connection slot is correspondingly exposed in the opening. The electrical connection slot is used to provide electrical insertion of a memory card conforming to the M.2 (NGFF) interface specification Connect; the memory card conforming to the M.2 (NGFF) interface specification can be electrically connected to the electrical connection slot through the opening. The part of the electrical plug structure is exposed to the shell, and the electrical plug structure exposed to the shell corresponds to the end of the shell opposite to the opening formed; the electrical plug structure can be plugged in to provide compliance with M.3 (NGSFF) An external electrical slot inserted into the interface standard memory card. The circuit board is provided with a processing module. The circuit board is disposed in the housing. The electrical connection slot and the electrical plug structure are disposed on the circuit board. The processing module is electrically connected to the electrical connection slot and the electrical plug structure. Among them, when a memory card that conforms to the M.2 (NGFF) interface specification is plugged into the electrical connection slot, and the electrical plug structure is inserted into the external electrical slot, the processing module can convert the voltage input from the external electrical slot The voltage required to a memory card that meets the M.2 (NGFF) interface specification.

為了實現上述目的,本發明還提供一種記憶卡裝置,其能插設於提供符合M.3(NGSFF)介面規範的記憶卡插設的一外部電插槽,記憶卡裝置包含:一記憶卡、一殼體、一電連接插槽、一電連接結構及一電路板。記憶卡符合M.2(NGFF)介面規範。殼體的一端形成有一開口。電連接插槽設置殼體中,電連接插槽對應露出於開口,電連接插槽用以提供記憶卡插接。電插接結構的部份外露於殼體,且外露於殼體的電插接結構對應位於殼體相反於形成有開口的一端;電插接結構能插接於外部電插槽。電路板設置有一處理模組,電路板設置於殼體中,電連接插槽及電插接結構設置於電路板,處理模組電性連接電連接插槽及電插接結構。其中,當符合記憶卡插接於電連接插槽,且電插接結構插設於外部電插槽時,處理模組能將外部電插槽輸入的電壓轉換至記憶卡所需的電壓。 In order to achieve the above object, the present invention also provides a memory card device that can be inserted into an external electrical slot that provides a memory card that conforms to the M.3 (NGSFF) interface specification. The memory card device includes: a memory card, A casing, an electrical connection slot, an electrical connection structure and a circuit board. The memory card conforms to the M.2 (NGFF) interface specification. An opening is formed at one end of the housing. The electrical connection slot is provided in the housing, the electrical connection slot is correspondingly exposed in the opening, and the electrical connection slot is used to provide a memory card insertion. A part of the electrical plug structure is exposed to the casing, and the electrical plug structure exposed to the casing corresponds to the end of the casing opposite to the opening formed; the electrical plug structure can be plugged into an external electrical socket. The circuit board is provided with a processing module. The circuit board is disposed in the housing. The electrical connection slot and the electrical plug structure are disposed on the circuit board. The processing module is electrically connected to the electrical connection slot and the electrical plug structure. When the memory card is inserted into the electrical connection slot and the electrical insertion structure is inserted into the external electrical slot, the processing module can convert the voltage input from the external electrical slot to the voltage required by the memory card.

本發明的有益效果可以在於:使用者可以利用轉接組件及記憶卡裝置,而使符合M.2(NGFF)介面規範的記憶卡,與用以提供符合M.3(NGSFF)介面規範的記憶卡插設的電連接槽插接電性連接,即,使用者利用轉接組件及記憶卡裝置,即可使提供符合M.3(NGSFF)介面規範的記憶卡插設的電連接槽,能電性連接符合 M.2(NGFF)介面規範的記憶卡,而可對M.2(NGFF)介面規範的記憶卡進行資料讀寫作業。 The beneficial effect of the present invention may be that the user can use the adapter assembly and the memory card device to make the memory card conforming to the M.2 (NGFF) interface specification and to provide the memory conforming to the M.3 (NGSFF) interface specification The electrical connection slot of the card is inserted into the electrical connection, that is, the user can use the adapter component and the memory card device to provide the electrical connection slot of the memory card insertion that meets the M.3 (NGSFF) interface specification. Electrical connection M.2 (NGFF) interface standard memory card, and can read and write data to M.2 (NGFF) interface standard memory card.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and explanation only, and are not intended to limit the present invention.

S:記憶卡裝置 S: Memory card device

1:轉接組件 1: Adapter components

10:殼體 10: Shell

10a:開口 10a: opening

101:容置槽 101: accommodating slot

102:露出口 102: Dew exit

11:電路板 11: Circuit board

111:供電電路 111: power supply circuit

112:斷電控制電路 112: Power-off control circuit

12:電連接插槽 12: Electrical connection slot

121:第一腳位 121: First position

122:第二腳位 122: second foot

13:電插接結構 13: Electric plug structure

131:第一偵測腳位 131: The first detection pin

132:第二偵測腳位 132: second detection pin

14:處理模組 14: Processing module

141:電壓轉換單元 141: Voltage conversion unit

142:熱插拔單元 142: hot swap unit

2:記憶卡 2: Memory card

M1:外部電路板 M1: external circuit board

M2:外部電插槽 M2: external electrical slot

M3:熱插拔電路 M3: hot swap circuit

圖1為本發明的轉接組件的示意圖;亦為本發明的記憶卡裝置的分解示意圖。 FIG. 1 is a schematic diagram of the adapter assembly of the present invention; and also is an exploded schematic diagram of the memory card device of the present invention.

圖2為本發明的轉接組件與符合M.2介面規範的記憶卡相互插接的示意圖;亦為本發明的記憶卡裝置的組裝示意圖。 FIG. 2 is a schematic diagram of the adapter component of the present invention and a memory card complying with the M.2 interface specification; FIG. 2 is also a schematic diagram of the assembly of the memory card device of the present invention.

圖3為本發明的轉接組件與符合M.2介面規範的記憶卡相互插接的另一實施例的示意圖;亦為本發明的記憶卡裝置的另一實施例的組裝示意圖。 FIG. 3 is a schematic diagram of another embodiment of the adapter component of the present invention and a memory card complying with the M.2 interface specification. FIG. 3 is also an assembly schematic diagram of another embodiment of the memory card device of the present invention.

圖4為本發明的轉接組件的又一實施例的示意圖;亦為本發明的記憶卡裝置的又一實施例的組裝示意圖。 4 is a schematic diagram of another embodiment of the adapter assembly of the present invention; and also is an assembly diagram of another embodiment of the memory card device of the present invention.

圖5為本發明的轉接組件的方塊示意圖;亦為本發明的記憶卡裝置的方塊示意圖。 5 is a block schematic diagram of the adapter component of the present invention; also a block schematic diagram of the memory card device of the present invention.

圖6為本發明的轉接組件的另一實施例的方塊示意圖;亦為本發明的記憶卡裝置的另一實施例的方塊示意圖。 FIG. 6 is a block schematic diagram of another embodiment of the adapter component of the present invention; FIG. 6 is also a block schematic diagram of another embodiment of the memory card device of the present invention.

圖7為本發明的轉接組件插設於外部電路板的外部電插槽的局部電路連接示意圖。 FIG. 7 is a schematic diagram of partial circuit connection of the adapter component of the present invention inserted into an external electrical slot of an external circuit board.

以下係藉由特定的具體實例說明本發明之轉接組件及記憶卡裝置的實施方式,熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點與功效。本發明亦可藉由其他不同的具體實例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明之精神下進行各種修飾與變更。又本發明之圖式僅為簡單說明,並非依實際尺寸描繪,亦即未反 應出相關構成之實際尺寸,先予敘明。以下之實施方式係進一步詳細說明本發明之觀點,但並非以任何觀點限制本發明之範疇。 The following is a specific example to illustrate the implementation of the adapter assembly and the memory card device of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied by other different specific examples. Various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the spirit of the present invention. In addition, the drawings of the present invention are only for simple description, and are not depicted according to actual sizes, that is, they are not reversed. The actual size of the relevant components should be stated first. The following embodiments further describe the viewpoint of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

請一併參閱圖1及圖2,其為本發明的轉接組件的示意圖。如圖所示,轉接組件1包含有一殼體10、一電路板11、一電連接插槽12、一電插接結構13及一處理模組14。殼體10的一端形成有一開口10a。電路板11固定設置於殼體10中,電路板11上設置有電連接插槽12、電插接結構13及處理模組14。設置於電路板11上的電連接插槽12是對應露出於殼體10的開口10a,而相關記憶卡則能通過開口10a而插接於電連接插槽12中。殼體10形成有開口10a的一端還可以是對應內凹形成有一容置槽101。 Please refer to FIG. 1 and FIG. 2 together, which are schematic diagrams of the adapter assembly of the present invention. As shown in the figure, the adapter assembly 1 includes a housing 10, a circuit board 11, an electrical connection slot 12, an electrical plug structure 13 and a processing module 14. An opening 10a is formed at one end of the housing 10. The circuit board 11 is fixedly disposed in the housing 10, and the circuit board 11 is provided with an electrical connection slot 12, an electrical plug structure 13 and a processing module 14. The electrical connection slot 12 provided on the circuit board 11 corresponds to the opening 10a exposed in the casing 10, and the related memory card can be inserted into the electrical connection slot 12 through the opening 10a. One end of the casing 10 where the opening 10a is formed may also be formed with a receiving groove 101 corresponding to the concave.

電連接插槽12及電插接結構13可以設置於電路板11彼此相反的兩端,但不以此為限,在不同的實施例中,電連接插槽12及電插接結構13也可以是設置於電路板11彼此相連的兩側。電連接插槽12用以提供符合M.2(NGFF)介面規範的記憶卡2插設,電連接插槽12的型式可以是依據需求,為B Key型式、M Key型式或B+M Key型式等,於此不加以限制。另外,電連接插槽12還可以是具有限位(防呆)結構,以限制符合M.2介面規範的記憶卡2僅能以特定的方式,插設於電連接插槽12中。其中,M.2(NGFF)介面規範即為英特爾(Intel)公司所制訂的相關規格(例如包含電氣層及硬體層等相關規格)。 The electrical connection slot 12 and the electrical plug-in structure 13 may be disposed at opposite ends of the circuit board 11, but not limited to this, in different embodiments, the electrical connection slot 12 and the electrical-plug structure 13 may also be It is provided on both sides of the circuit board 11 connected to each other. The electrical connection slot 12 is used to provide insertion of a memory card 2 conforming to the M.2 (NGFF) interface specification. The electrical connection slot 12 can be of a B Key type, M Key type, or B+M Key type according to requirements Wait, not limited here. In addition, the electrical connection slot 12 may also have a limit (foolproof) structure to limit that the memory card 2 that conforms to the M.2 interface specification can only be inserted into the electrical connection slot 12 in a specific manner. Among them, the M.2 (NGFF) interface specification is the relevant specification (for example, including the relevant specifications of the electrical layer and the hardware layer) formulated by Intel Corporation.

在實際實施中,形成容置槽101的側壁,將可導引符合M.2介面規範的記憶卡2正確地與電連接插槽12相互插接。如圖2所示,符合M.2介面規範的記憶卡2與電連接插槽12相互插接時,符合M.2介面規範的記憶卡2的部份可以是對應外露於轉接組件1外,但不以此為限。如圖3所示,在不同的實施例中,容置槽101的深度可以大致與符合M.2介面規範的記憶卡2長度相同,而符合M.2介面規範的記憶卡2與電連接插槽12相互插接時,符合M.2介面規範的記憶卡2的整體將對應被容置於容置槽101 中。另外,在圖3所示的實施態樣中,殼體10可以是具有使容置槽101與外連通的露出口102,該露出口102可以是與開口10a相互連通,而使用者將符合M.2介面規範的記憶卡2設置於容置槽101中時,將可以透過露出口102觀看符合M.2介面規範的記憶卡2所標示的相關資訊。當然,在不同的應用中,殼體10也可以是不具有露出口102,而僅具有容置槽101。在另一實施例中,殼體10的一端也可是僅具有開口10a,而電連接插槽12則大致鄰近於開口10a設置。 In actual implementation, the side wall forming the accommodating slot 101 will guide the memory card 2 that conforms to the M.2 interface specification to be correctly inserted into the electrical connection slot 12. As shown in FIG. 2, when the memory card 2 conforming to the M.2 interface specification and the electrical connection slot 12 are inserted into each other, the part of the memory card 2 conforming to the M.2 interface specification may be correspondingly exposed outside the adapter assembly 1 , But not limited to this. As shown in FIG. 3, in different embodiments, the depth of the accommodating slot 101 may be substantially the same as the length of the memory card 2 conforming to the M.2 interface specification, and the memory card 2 conforming to the M.2 interface specification is electrically connected to When the slots 12 are inserted into each other, the whole of the memory card 2 conforming to the M.2 interface specification will be accommodated in the accommodating slot 101 in. In addition, in the embodiment shown in FIG. 3, the housing 10 may have an exposure port 102 that allows the accommodating groove 101 to communicate with the outside. The exposure port 102 may communicate with the opening 10a, and the user will meet M When the memory card 2 of the .2 interface specification is installed in the accommodating slot 101, the relevant information marked by the memory card 2 conforming to the M.2 interface specification can be viewed through the exposure port 102. Of course, in different applications, the housing 10 may not have the outlet 102 but only the accommodating groove 101. In another embodiment, one end of the housing 10 may only have the opening 10a, and the electrical connection slot 12 is disposed substantially adjacent to the opening 10a.

電插接結構13的至少一部份外露於殼體10,且外露於殼體10的電插接結構13對應位於殼體10相反於形成有開口10a的一端。在實際應用中,電插接結構13可以是與電路板11一體成型地設置,但不以此為限。電插接結構13的形式可以是依據需求為B Key型式、M Key型式等,於此不加以限制。電插接結構13能插設於用以提供符合M.3(NGSFF)介面規範的記憶卡插設的一外部電插槽(例如是固定設置於電腦主板中或是伺服器主板中)。其中,M.3介面規範即為三星電子(Samsung)公司所制訂的相關規格。 At least a part of the electrical plug-in structure 13 is exposed to the casing 10, and the electrical plug-in structure 13 exposed to the casing 10 is corresponding to the end of the casing 10 opposite to the opening 10a. In practical applications, the electrical plug-in structure 13 may be integrally formed with the circuit board 11, but it is not limited thereto. The form of the electrical plug-in structure 13 may be B Key type, M Key type, etc. according to requirements, which is not limited herein. The electrical plug-in structure 13 can be inserted into an external electrical slot (for example, fixedly installed in a computer motherboard or a server motherboard) to provide a memory card that conforms to the M.3 (NGSFF) interface specification. Among them, the M.3 interface specification is the relevant specification formulated by Samsung Electronics (Samsung).

處理模組14設置於電路板11,處理模組14電性連接電連接插槽12的各腳位及電插接結構13的各腳位,而處理模組14用以處理及傳遞來自外部電插槽所傳遞的訊號至插設於電連接插槽12的符合M.2介面規範的記憶卡。在具體實施中,處理模組14可以是微處理器。 The processing module 14 is disposed on the circuit board 11, the processing module 14 is electrically connected to the pins of the electrical connection slot 12 and the pins of the electrical plug-in structure 13, and the processing module 14 is used to process and transmit external power The signal transmitted by the slot is to a memory card inserted in the electrical connection slot 12 and conforming to the M.2 interface specification. In a specific implementation, the processing module 14 may be a microprocessor.

當符合M.2介面規範的記憶卡2插接於所述電連接插槽12,且電插接結構13插設於外部電插槽時,處理模組14能將外部電插槽輸入的電壓轉換至符合M.2介面規範的記憶卡所需的電壓。具體來說,外部電插接槽所輸入的電壓為12伏特,而處理模組14能將其轉換為3.3伏特,以供符合M.2介面規範的記憶卡使用。 When the memory card 2 conforming to the M.2 interface specification is inserted into the electrical connection slot 12 and the electrical insertion structure 13 is inserted into the external electrical slot, the processing module 14 can input the voltage from the external electrical slot The voltage required to convert to a memory card that meets the M.2 interface specification. Specifically, the voltage input from the external electrical socket is 12 volts, and the processing module 14 can convert it to 3.3 volts for use with memory cards that comply with the M.2 interface specification.

特別說明的是,本發明的轉接組件1的殼體10所具有的開口10a及容置槽101的形式,可依據需求設計,不侷限於圖2及圖3 所示的型態。舉例來說,如圖4所示,在不同的應用中,殼體10的容置槽101可以是與外連通,且容置槽101的寬度可以是略大於符合M.2介面規範的記憶卡2的寬度,殼體10於開口10a的兩側還可以是對應設置有相關的卡扣結構(例如彈片、彈性凸點、凸點等)。當使用者欲將符合M.2介面規範的記憶卡2與殼體10中的電連接插槽12相互插接前,使用者可以是先將符合M.2介面規範的記憶卡2的部份壓入容置槽101中,此時,設置於容置槽101中的相關卡扣結構,將可使符合M.2介面規範的記憶卡2穩定地設置於容置槽101中,而後使用者可再將已位於容置槽101中的符合M.2介面規範的記憶卡2向電連接插槽12方向推抵,據以使符合M.2介面規範的記憶卡2與電連接插槽12相互電性插接。在另一容置槽101與外連通的實施例中,殼體10還可以是具有可活動地的一蓋體,其可被操作而選擇性地遮蔽容置槽101,據以限制已設置於容置槽101中的符合M.2介面規範的記憶卡2。 In particular, the form of the opening 10a and the accommodating groove 101 of the housing 10 of the adapter assembly 1 of the present invention can be designed according to requirements, and is not limited to FIGS. 2 and 3 The type shown. For example, as shown in FIG. 4, in different applications, the accommodating slot 101 of the housing 10 may be in communication with the outside, and the width of the accommodating slot 101 may be slightly larger than the memory card conforming to the M.2 interface specification With respect to the width of 2, the housing 10 on both sides of the opening 10a may also be correspondingly provided with related snap structures (such as elastic sheets, elastic bumps, bumps, etc.). Before the user wants to insert the memory card 2 conforming to the M.2 interface specification and the electrical connection slot 12 in the casing 10 into each other, the user may first insert the memory card 2 conforming to the M.2 interface specification. Press into the receiving slot 101. At this time, the relevant buckle structure provided in the receiving slot 101 will enable the memory card 2 conforming to the M.2 interface specification to be stably placed in the receiving slot 101, and then the user The memory card 2 conforming to the M.2 interface specification already in the accommodating slot 101 can then be pushed toward the electrical connection slot 12, so that the memory card 2 conforming to the M.2 interface specification and the electrical connection slot 12 can be pushed Mutual electrical connection. In another embodiment where the accommodating groove 101 communicates with the outside, the housing 10 may also be a cover with a movable ground, which can be operated to selectively cover the accommodating groove 101, thereby restricting the The memory card 2 in the accommodating slot 101 conforming to the M.2 interface specification.

請一併參閱圖5及圖6,其為本發明的轉接組件1的方塊示意圖。如圖所示,處理模組14可以包含有一電壓轉換單元141、一熱插拔單元142,電路板11還設置有一供電電路111及一斷電控制電路112。電壓轉換單元141用以將電連接插槽12所輸入的電壓,轉換為符合M.2介面規範的記憶卡所需的電壓。熱插拔單元142電性連接電插接結構13,熱插拔單元142能確保轉接組件1與通電的外部電插槽相互插接時,轉接組件1能正常工作,且熱插拔單元142亦能確保轉接組件1在與外部電插槽電性連接的情況下被拔除時,插設於轉接組件1上符合M.2介面規範的記憶卡2不受影響。也就是說,熱插拔單元142能避免符合M.2介面規範的記憶卡2,在轉接組件1突然地被拔離通電的外部電插槽時,受到突波、過電壓或是過電流等影響,且熱插拔單元142能讓使用者在外部電插槽通電時,直接使電插接結構13插接於外部電插槽,而轉接組件1能直接工作。在實際應用中,熱插拔單元142 可以是包含有電子熔絲(eFuse)的電路保護器,但不以此為限;電壓轉換單元141則可以是降壓變換器(Buck Converter)。 Please refer to FIG. 5 and FIG. 6 together, which is a schematic block diagram of the adapter assembly 1 of the present invention. As shown in the figure, the processing module 14 may include a voltage conversion unit 141 and a hot swap unit 142. The circuit board 11 is further provided with a power supply circuit 111 and a power-off control circuit 112. The voltage conversion unit 141 is used to convert the voltage input from the electrical connection slot 12 into the voltage required by the memory card conforming to the M.2 interface specification. The hot-swap unit 142 is electrically connected to the electric-swap structure 13. The hot-swap unit 142 can ensure that the adapter assembly 1 can work normally when the adapter component 1 and the energized external electrical slot are plugged into each other The 142 can also ensure that the memory card 2 inserted in the adaptor component 1 conforming to the M.2 interface specification is not affected when the adaptor component 1 is unplugged while being electrically connected to the external electrical socket. In other words, the hot-swap unit 142 can prevent the memory card 2 that meets the M.2 interface specification from being subjected to surge, overvoltage, or overcurrent when the adapter component 1 is suddenly pulled out of the energized external electrical slot The hot plug unit 142 allows the user to directly plug the electrical plug-in structure 13 into the external electrical socket when the external electrical socket is powered on, and the adapter assembly 1 can work directly. In practical applications, the hot swap unit 142 It may be a circuit protector including an electronic fuse (eFuse), but not limited to this; the voltage conversion unit 141 may be a buck converter (Buck Converter).

供電電路111可以是電性連接電插接結構13(如圖2所示)的供電腳位。斷電控制電路112電性連接電插接結構13(如圖2所示)的斷電指示腳位(Power Disable Feature,PWDIS),而使用者可以透過斷電控制電路112以切斷插接於電連接插槽12上符合M.2介面規範的記憶卡2的電力,或者使插接於電連接插槽12上符合M.2介面規範的記憶卡2進入睡眠狀態。 The power supply circuit 111 may be a power supply pin electrically connected to the electrical plug-in structure 13 (as shown in FIG. 2 ). The power-off control circuit 112 is electrically connected to the power-off indication pin (Power Disable Feature, PWDIS) of the electrical plug-in structure 13 (as shown in FIG. 2), and the user can cut off the plug-in connection through the power-off control circuit 112 The power of the memory card 2 conforming to the M.2 interface specification in the electrical connection slot 12 or the memory card 2 conforming to the M.2 interface specification inserted in the electrical connection slot 12 is put into a sleep state.

在實際應用中,電壓轉換單元141、熱插拔單元142、供電電路111及斷電控制電路112的彼此間的電性連接方式,可以是依據需求設計。舉例來說,如圖5所示,電壓轉換單元141可以是電性連接供電電路111、斷電控制電路112及熱插拔單元142,而熱插拔單元142可以是電性連接及電連接插槽12,而插設於電連接插槽12中符合M.2介面規範的記憶卡2所需的電力則是來自於熱插拔單元142提供;如圖6所示,在另一實施例中,熱插拔單元142電性連接供電電路111及斷電控制電路112;電壓轉換單元141電性連接熱插拔單元142及電連接插槽12,而插設於電連接插槽12中符合M.2介面規範的記憶卡2所需的電力則是來自於電壓轉換單元141提供。透過如圖5及圖6所示的電性連接方式,當斷電控制電路112切斷插接於電連接插槽12上符合M.2介面規範的記憶卡2的電力,或者使插接於電連接插槽12上符合M.2介面規範的記憶卡2進入睡眠狀態時,熱插拔單元142及電壓轉換單元141的電力將同時被切斷,而可達到省電的效果。 In practical applications, the electrical connection between the voltage conversion unit 141, the hot-swap unit 142, the power supply circuit 111, and the power-off control circuit 112 can be designed according to requirements. For example, as shown in FIG. 5, the voltage conversion unit 141 may be electrically connected to the power supply circuit 111, the power-off control circuit 112, and the hot-swap unit 142, and the hot-swap unit 142 may be electrically connected and electrically connected. Slot 12, and the power required by the memory card 2 inserted in the electrical connection slot 12 conforming to the M.2 interface specification is provided by the hot-swap unit 142; as shown in FIG. 6, in another embodiment , The hot-swap unit 142 is electrically connected to the power supply circuit 111 and the power-off control circuit 112; the voltage conversion unit 141 is electrically connected to the hot-swap unit 142 and the electrical connection slot 12, and is inserted in the electrical connection slot 12 in accordance with M The power required by the memory card 2 with .2 interface specification comes from the voltage conversion unit 141. Through the electrical connection shown in FIGS. 5 and 6, when the power-off control circuit 112 cuts off the power of the memory card 2 that is plugged into the electrical connection slot 12 and meets the M.2 interface specification, or the plug-in When the memory card 2 conforming to the M.2 interface specification in the electrical connection slot 12 enters the sleep state, the power of the hot-swap unit 142 and the voltage conversion unit 141 will be cut off at the same time, and the effect of power saving can be achieved.

請復參圖1至圖3,其為本發明的記憶卡裝置S的示意圖。如圖所示,記憶卡裝置S包含有一記憶卡2及一轉接組件1。轉接組件1包含有一殼體10、一電路板11、一電連接插槽12、一電插接結構13及一處理模組14。記憶卡2為符合M.2介面規範的記憶卡。關於轉接組件1的詳細說明,與前述實施例相同,於此不再 贅述。 Please refer to FIGS. 1 to 3 again, which are schematic diagrams of the memory card device S of the present invention. As shown in the figure, the memory card device S includes a memory card 2 and an adapter assembly 1. The adapter assembly 1 includes a housing 10, a circuit board 11, an electrical connection slot 12, an electrical plug structure 13 and a processing module 14. Memory card 2 is a memory card that conforms to the M.2 interface specification. The detailed description of the adapter assembly 1 is the same as the previous embodiment, and will not be repeated here Repeat.

特別說明的是,上述符合M.2介面規範的記憶卡在實際應用中,可以依據需求選擇所需的通訊介面(例如PCIe、SATA),上述符合M.2介面規範的記憶卡2及電連接插槽12不侷限特定的通訊介面。 In particular, in the actual application of the above-mentioned memory card conforming to the M.2 interface specification, the required communication interface (such as PCIe, SATA) can be selected according to the needs. The above-mentioned memory card 2 conforming to the M.2 interface specification and electrical connection The slot 12 does not limit a specific communication interface.

請參閱圖7,其顯示為本發明的轉接組件的另一實施例的電路連接示意圖。如圖所示,轉接組件1的電插接結構13包含有多個腳位(圖未示),其中兩個腳位分別定義為一第一偵測腳位131及一第二偵測腳位132。其中,轉接組件1在未設置有符合M.2介面規範的記憶卡2的狀態下,插接於一外部電路板M1的符合M.3介面規範的一外部電插槽M2時,第一偵測腳位131及第二偵測腳位132將呈現為斷路狀態。符合M.2介面規範的記憶卡2插設於電連接插槽12時,第一偵測腳位131與第二偵測腳位132對應與符合M.2介面規範的記憶卡2的一第一腳位121及一第二腳位122相互電性連接;其中,符合M.2介面規範的記憶卡2的第一腳位121及第二腳位122是彼此相互電性連接。 Please refer to FIG. 7, which is a schematic diagram of a circuit connection of another embodiment of the adapter component of the present invention. As shown in the figure, the electrical plug-in structure 13 of the adapter assembly 1 includes a plurality of pins (not shown), wherein the two pins are defined as a first detection pin 131 and a second detection pin, respectively Bit 132. Wherein, when the adapter assembly 1 is not provided with the memory card 2 conforming to the M.2 interface specification, it is inserted into an external electrical socket M2 conforming to the M.3 interface specification of an external circuit board M1, the first The detection pin 131 and the second detection pin 132 will be in an open state. When the memory card 2 conforming to the M.2 interface specification is inserted into the electrical connection slot 12, the first detection pin 131 and the second detection pin 132 correspond to the first section of the memory card 2 conforming to the M.2 interface specification. A pin 121 and a second pin 122 are electrically connected to each other; wherein, the first pin 121 and the second pin 122 of the memory card 2 conforming to the M.2 interface specification are electrically connected to each other.

當轉接組件1的電連接插槽12插設有符合M.2介面規範的記憶卡2,且轉接組件1插設於外部電路板M1的符合M.3介面規範的外部電插槽M2時,外部電路板M1的一熱插拔電路M3,將與第一偵測腳位131、第一腳位121、第二腳位122及第二偵測腳位132共同形成一偵測迴路。換言之,轉接組件1插接於外部電路板M1的外部電插槽M2時,第一偵測腳位131及第二偵測腳位132能透過符合M.2介面規範的記憶卡2彼此相互電性連接,即,第一偵測腳位131及第二偵測腳位132能對應呈現為相互導通的狀態。 When the electrical connection slot 12 of the adapter assembly 1 is inserted with a memory card 2 conforming to the M.2 interface specification, and the adapter assembly 1 is inserted into an external electrical socket M2 conforming to the M.3 interface specification of the external circuit board M1 At this time, a hot-swap circuit M3 of the external circuit board M1 will form a detection loop with the first detection pin 131, the first pin 121, the second pin 122 and the second detection pin 132. In other words, when the adapter assembly 1 is plugged into the external electrical socket M2 of the external circuit board M1, the first detection pin 131 and the second detection pin 132 can communicate with each other through the memory card 2 conforming to the M.2 interface specification Electrically connected, that is, the first detection pin 131 and the second detection pin 132 can correspondingly assume a state of mutual conduction.

當轉接組件1插接於外部電路板M1的外部電插槽M2,且符合M.2介面規範的記憶卡2突然被拔離轉接組件1的電連接插槽12時,第一偵測腳位131與第二偵測腳位132將由導通狀態轉換 為斷路狀態。此時,外部電路板M1的相關處理器,將可據以得知符合M.2介面規範的記憶卡2已被拔離所述轉接組件1,而處理器將可對應執行相對應的動作。 The first detection is when the adapter component 1 is plugged into the external electrical socket M2 of the external circuit board M1 and the memory card 2 conforming to the M.2 interface specification is suddenly pulled out of the electrical connection socket 12 of the adapter component 1 The pin 131 and the second detection pin 132 will switch from the conducting state It is a disconnected state. At this time, the relevant processor of the external circuit board M1 will be able to know that the memory card 2 that conforms to the M.2 interface specification has been pulled out of the adapter assembly 1, and the processor will perform the corresponding action accordingly .

相對地,當插接有符合M.2介面規範的記憶卡2的轉接組件1,突然被拔離外部電路板M1的外部電插槽M2時,所述偵測迴路將由導通狀態轉換為斷路狀態,此時,外部電路板M1的處理器將可據以得知轉接組件1已被拔離外部電路板M1,外部電路板M1的處理器則可據以執行相對應的動作。 On the contrary, when the adaptor 1 with the memory card 2 conforming to the M.2 interface specification inserted, is suddenly pulled out of the external electrical socket M2 of the external circuit board M1, the detection loop will change from an on state to an open circuit At this time, the processor of the external circuit board M1 will be able to know that the adapter assembly 1 has been pulled out of the external circuit board M1, and the processor of the external circuit board M1 can perform the corresponding action accordingly.

如下表所示,其顯示為本發明的轉接組件1的電插接結構13的具體腳位定義。其中,表中所示第67位腳位(PRSNT1#)及第6位腳位(PRSNT2#),即為前述實施例所述第一偵測腳位131及第二偵測腳位132。 As shown in the following table, it shows the specific pin definition of the electrical plug-in structure 13 of the adapter assembly 1 of the present invention. Among them, the 67th pin position (PRSNT1#) and the 6th pin position (PRSNT2#) shown in the table are the first detection pin position 131 and the second detection pin position 132 described in the foregoing embodiment.

Figure 107109070-A0101-12-0009-1
Figure 107109070-A0101-12-0009-1
Figure 107109070-A0101-12-0010-2
Figure 107109070-A0101-12-0010-2

以上所述僅為本發明的較佳可行實施例,非因此侷限本發明的專利範圍,故舉凡運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的保護範圍內。 The above are only the preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention. .

S‧‧‧記憶卡裝置 S‧‧‧Memory card device

1‧‧‧轉接組件 1‧‧‧Adapter kit

10‧‧‧殼體 10‧‧‧Housing

10a‧‧‧開口 10a‧‧‧Opening

101‧‧‧容置槽 101‧‧‧Accommodation slot

11‧‧‧電路板 11‧‧‧ circuit board

12‧‧‧電連接插槽 12‧‧‧Electrical connection slot

13‧‧‧電插接結構 13‧‧‧Electric plug structure

14‧‧‧處理模組 14‧‧‧Processing module

2‧‧‧記憶卡 2‧‧‧Memory card

Claims (8)

一種轉接組件,其包含:一殼體,其一端形成有一開口;一電連接插槽,其設置所述殼體中,所述電連接插槽對應露出於所述開口中,所述電連接插槽用以提供符合M.2介面規範的記憶卡電性插接;符合M.2介面規範的記憶卡能通過所述開口而與所述電連接插槽電性連接;一電插接結構,所述電插接結構的部份外露於所述殼體,且外露於所述殼體的電插接結構對應位於所述殼體相反於形成有所述開口的一端;所述電插接結構能插設於提供符合M.3介面規範的記憶卡插設的一外部電插槽;以及一電路板,其設置有一處理模組,所述電路板設置於所述殼體中,所述電連接插槽及所述電插接結構設置於所述電路板,所述處理模組電性連接所述電連接插槽及所述電插接結構;其中,當符合M.2介面規範的記憶卡插接於所述電連接插槽,且所述電插接結構插設於所述外部電插槽時,所述處理模組能將所述外部電插槽輸入的電壓轉換至符合M.2介面規範的記憶卡所需的電壓;其中,所述殼體於具有所述開口的一端內凹形成有一容置槽,形成所述容置槽的側壁,能導引符合M.2介面規範的記憶卡正確地與所述電連接插槽相互插接;所述電插接結構包含有多個腳位,其中兩個所述腳位定義為一第一偵測腳位及一第二偵測腳位,符合M.2介面規範的記憶卡插設於所述電連接插槽時,所述第一偵測腳位及所述第二偵測腳位對應與符合M.2介面規範的記憶卡的彼此相互電性連接的兩腳位相互電性連接;當未設置有符合M.2介面規 範的記憶卡的所述轉接組件插設於一外部電路板的所述外部電插槽時,所述轉接組件的所述第一偵測腳位與所述第二偵測腳位呈現為斷路狀態;當插設有符合M.2介面規範的記憶卡的所述轉接組件插設於所述外部電路板時,所述外部電路板的一熱插拔電路將與所述第一偵測腳位、符合M.2介面規範的記憶卡的兩個彼此相互電性連接的兩腳位及所述第二偵測腳位共同形成一偵測迴路;當所述記憶卡在所述偵測迴路呈現為導通狀態下被拔離所述轉接組件時,所述偵測迴路將由導通狀態轉換為斷路狀態。 An adaptor assembly includes: a housing with an opening formed at one end; an electrical connection slot disposed in the housing, the electrical connection slot correspondingly exposed in the opening, the electrical connection The slot is used to provide electrical insertion of a memory card conforming to the M.2 interface specification; a memory card conforming to the M.2 interface specification can be electrically connected to the electrical connection slot through the opening; an electrical insertion structure , Part of the electrical plug structure is exposed to the casing, and the electrical plug structure exposed to the casing is correspondingly located at the end of the casing opposite to the opening; the electrical plug The structure can be inserted into an external electrical slot that provides a memory card that conforms to the M.3 interface specification; and a circuit board, which is provided with a processing module, the circuit board is disposed in the housing, the The electrical connection slot and the electrical plug-in structure are provided on the circuit board, and the processing module is electrically connected to the electrical connection slot and the electrical plug-in structure; wherein, when meeting the M.2 interface specification When the memory card is inserted into the electrical connection slot and the electrical insertion structure is inserted into the external electrical slot, the processing module can convert the voltage input from the external electrical slot to conform to M .2 the voltage required by the memory card with the interface specification; wherein, the housing is formed with an accommodating groove concavely at the end with the opening, forming a side wall of the accommodating groove, which can guide the interface conforming to the M.2 interface The standard memory card is correctly inserted into the electrical connection slot; the electrical insertion structure includes a plurality of pins, two of which are defined as a first detection pin and a second pin Detecting the pin position, when a memory card conforming to the M.2 interface specification is inserted into the electrical connection slot, the first detecting pin position and the second detecting pin position correspond to the M.2 interface specification The two pins of the memory card are electrically connected to each other; when the M.2 interface specification is not set When the adapter component of the memory card of the Fan is inserted into the external electrical slot of an external circuit board, the first detection pin and the second detection pin of the adapter component appear It is in an open state; when the adaptor assembly with a memory card that conforms to the M.2 interface specification is inserted into the external circuit board, a hot-swap circuit of the external circuit board will be connected to the first Two pin positions that are electrically connected to each other and the second detection pin positions of a memory card that detects a pin and conforms to the M.2 interface specification form a detection loop; when the memory card is in the When the detection loop appears to be disconnected from the switching component in the on-state, the detection loop will change from the on-state to the off-state. 如請求項1所述的轉接組件,其中,所述電路板還設置有一熱插拔單元,所述熱插拔單元電性連接所述電插接結構,所述熱插拔單元能確保所述轉接組件與通電的所述外部電插槽相互插接時,所述轉接組件能正常工作,且所述熱插拔單元亦能確保所述轉接組件在與所述外部電插槽電性連接的情況下被拔除時,插設於所述轉接組件上符合M.2介面規範的記憶卡不受影響。 The adapter assembly according to claim 1, wherein the circuit board is further provided with a hot plug unit, the hot plug unit is electrically connected to the electric plug structure, and the hot plug unit can ensure When the adapter component and the external electrical socket that is powered on are plugged into each other, the adapter component can work normally, and the hot-swap unit can also ensure that the adapter component is in contact with the external electrical socket When it is unplugged in the case of electrical connection, the memory card inserted in the adapter component conforming to the M.2 interface specification is not affected. 如請求項2所述的轉接組件,其中,所述電路板還設置有一供電電路、一斷電控制電路及一電壓轉換單元,所述供電電路電性連接所述電插接結構的供電腳位;所述斷電控制電路電性連接所述電插接結構的斷電指示腳位;所述電壓轉換單元電性連接所述供電電路、所述斷電控制電路及所述熱插拔單元,所述電壓轉換單元能將由所述供電電路輸入的電壓轉換至符合M.2介面規範的記憶卡所需的電壓;所述熱插拔單元電性連接及所述電連接插槽,而插設於所述電連接插槽中符合M.2介面規範的記憶卡所需的電力是來自於所述熱插拔單元提供。 The adapter assembly according to claim 2, wherein the circuit board is further provided with a power supply circuit, a power-off control circuit and a voltage conversion unit, and the power supply circuit is electrically connected to the power supply pin of the electrical plug-in structure The power-off control circuit is electrically connected to the power-off indication pin of the electrical plug-in structure; the voltage conversion unit is electrically connected to the power supply circuit, the power-off control circuit, and the hot-swap unit , The voltage conversion unit can convert the voltage input by the power supply circuit to the voltage required by the memory card conforming to the M.2 interface specification; the hot-swap unit is electrically connected to the electrical connection slot, and inserted The power required by the memory card in the electrical connection slot conforming to the M.2 interface specification is provided by the hot-swap unit. 如請求項2所述的轉接組件,其中,所述電路板還設置有一 供電電路、一斷電控制電路及一電壓轉換單元,所述供電電路電性連接所述電插接結構的供電腳位;所述斷電控制電路電性連接所述電插接結構的斷電指示腳位;所述熱插拔單元電性連接所述供電電路及所述斷電控制電路;所述電壓轉換單元電性連接所述熱插拔單元及所述電連接插槽,所述電壓轉換單元能將所述供電電路輸入的電壓轉換至符合M.2介面規範的記憶卡所需的電壓;插設於所述電連接插槽中符合M.2介面規範的記憶卡所需的電力是來自於所述電壓轉換單元提供。 The adapter assembly according to claim 2, wherein the circuit board is further provided with a A power supply circuit, a power-off control circuit and a voltage conversion unit, the power supply circuit is electrically connected to the power supply pin of the electrical plug-in structure; the power-off control circuit is electrically connected to the power-off of the electrical plug-in structure Indicating the pin position; the hot-swap unit is electrically connected to the power supply circuit and the power-off control circuit; the voltage conversion unit is electrically connected to the hot-swap unit and the electrical connection slot, the voltage The conversion unit can convert the voltage input by the power supply circuit into the voltage required by the memory card conforming to the M.2 interface specification; the power required by the memory card conforming to the M.2 interface specification inserted in the electrical connection slot Is provided by the voltage conversion unit. 一種記憶卡裝置,其能插設於提供符合M.3介面規範的記憶卡插設的一外部電插槽,所述記憶卡裝置包含:一記憶卡,其符合M.2介面規範;以及一轉接組件,其包含:一殼體,其一端形成有一開口;一電連接插槽,其設置所述殼體中,所述電連接插槽對應露出於所述開口,所述電連接插槽用以提供所述記憶卡插接;一電插接結構,所述電插接結構的部份外露於所述殼體,且外露於所述殼體的電插接結構對應位於所述殼體相反於形成有所述開口的一端;所述電插接結構能插接於所述外部電插槽;及一電路板,其設置有一處理模組,所述電路板設置於所述殼體中,所述電連接插槽及所述電插接結構設置於所述電路板,所述處理模組電性連接所述電連接插槽及所述電插接結構;其中,當符合所述記憶卡插接於所述電連接插槽,且所述電插接結構插設於所述外部電插槽時,所述處理模組能將所 述外部電插槽輸入的電壓轉換至所述記憶卡所需的電壓;其中,所述殼體於具有所述開口的一端內凹形成有一容置槽,形成所述容置槽的側壁,能導引所述記憶卡正確地與所述電連接插槽相互插接;所述電插接結構包含有多個腳位,其中兩個所述腳位定義為一第一偵測腳位及一第二偵測腳位;所述記憶卡包含有一第一腳位及一第二腳位,所述第一腳位與所述第二腳位電性連接;當未設置有所述記憶卡的所述轉接組件插設於一外部電路板的所述外部電插槽時,所述轉接組件的所述第一偵測腳位與所述第二偵測腳位呈現為斷路狀態;當插設有所述記憶卡的所述轉接組件插設於所述外部電路板時,所述外部電路板的一熱插拔電路將與所述第一偵測腳位、所述第一腳位、所述第二腳位及所述第二偵測腳位共同形成一偵測迴路;當所述記憶卡在所述偵測迴路呈現為導通狀態下被拔離所述轉接組件時,所述偵測迴路將由導通狀態轉換為斷路狀態。 A memory card device that can be inserted into an external electrical slot that provides a memory card that conforms to the M.3 interface specification. The memory card device includes: a memory card that conforms to the M.2 interface specification; and a The adapter assembly includes: a housing with an opening formed at one end; an electrical connection slot disposed in the housing, the electrical connection slot correspondingly exposed in the opening, the electrical connection slot It is used to provide the memory card insertion; an electric insertion structure, part of the electric insertion structure is exposed to the casing, and the electric insertion structure exposed to the casing is correspondingly located in the casing Opposite to the end where the opening is formed; the electrical plug-in structure can be plugged into the external electrical slot; and a circuit board, which is provided with a processing module, the circuit board is disposed in the housing , The electrical connection slot and the electrical plug-in structure are provided on the circuit board, the processing module is electrically connected to the electrical connection slot and the electrical plug-in structure; When the card is inserted into the electrical connection slot, and the electrical insertion structure is inserted into the external electrical slot, the processing module can The voltage input from the external electrical slot is converted to the voltage required by the memory card; wherein, the housing has an accommodating groove formed in a recess at the end with the opening, forming a side wall of the accommodating groove, Guide the memory card to be correctly inserted into the electrical connection slot; the electrical insertion structure includes a plurality of pins, two of which are defined as a first detection pin and a Second detection pin position; the memory card includes a first pin position and a second pin position, the first pin position is electrically connected to the second pin position; when the memory card is not provided When the adapter component is inserted into the external electrical slot of an external circuit board, the first detection pin and the second detection pin of the adapter component are in an open state; When the adapter component with the memory card inserted is inserted into the external circuit board, a hot-swap circuit of the external circuit board will interact with the first detection pin and the first pin Together, the second pin position and the second detection pin position together form a detection loop; when the memory card is pulled out of the adapter assembly when the detection loop is rendered conductive, The detection loop will change from the on state to the off state. 如請求項5所述的記憶卡裝置,其中,所述電路板還設置有一熱插拔單元,所述熱插拔單元電性連接所述電插接結構,所述熱插拔單元能確保所述記憶卡裝置與通電的所述外部電插槽相互插接時,所述記憶卡能正常工作,且所述熱插拔單元亦能確保所述記憶卡裝置在與所述外部電插槽電性連接的情況下被拔除時,所述記憶卡不受影響。 The memory card device according to claim 5, wherein the circuit board is further provided with a hot plug unit, the hot plug unit is electrically connected to the electric plug structure, and the hot plug unit can ensure When the memory card device and the energized external electrical slot are inserted into each other, the memory card can work normally, and the hot swap unit can also ensure that the memory card device is electrically connected to the external electrical slot The memory card is not affected when it is unplugged in the case of sexual connection. 如請求項6所述的記憶卡裝置,其中,所述電路板還設置有一供電電路、一斷電控制電路及一電壓轉換單元,所述供電電路電性連接所述電插接結構的供電腳位;所述斷電控制電路電性連接所述電插接結構的斷電指示腳位;所述電壓轉換單元電性連接所述供電電路、所述斷電控制電路及所述熱插拔單元,所述電壓轉換單元能將由所述供電電路輸入的電壓 轉換至所述記憶卡所需的電壓;所述熱插拔單元電性連接及所述電連接插槽,而插設於所述電連接插槽中的所述記憶卡所需的電力是來自於所述熱插拔單元提供。 The memory card device according to claim 6, wherein the circuit board is further provided with a power supply circuit, a power-off control circuit and a voltage conversion unit, and the power supply circuit is electrically connected to the power supply pin of the electrical plug-in structure The power-off control circuit is electrically connected to the power-off indication pin of the electrical plug-in structure; the voltage conversion unit is electrically connected to the power supply circuit, the power-off control circuit, and the hot-swap unit , The voltage conversion unit can convert the voltage input by the power supply circuit Converted to the voltage required by the memory card; the hot-swap unit is electrically connected to the electrical connection slot, and the power required for the memory card inserted in the electrical connection slot comes from Provided in the hot swap unit. 如請求項6所述的記憶卡裝置,其中,所述電路板還設置有一供電電路、一斷電控制電路及一電壓轉換單元,所述供電電路電性連接所述電插接結構的供電腳位;所述斷電控制電路電性連接所述電插接結構的斷電指示腳位;所述熱插拔單元電性連接所述供電電路及所述斷電控制電路;所述電壓轉換單元電性連接所述熱插拔單元及所述電連接插槽,所述電壓轉換單元能將所述供電電路輸入的電壓轉換至所述記憶卡所需的電壓;插設於所述電連接插槽中的所述記憶卡所需的電力是來自於所述電壓轉換單元提供。 The memory card device according to claim 6, wherein the circuit board is further provided with a power supply circuit, a power-off control circuit and a voltage conversion unit, and the power supply circuit is electrically connected to the power supply pin of the electrical plug-in structure The power-off control circuit is electrically connected to the power-off indication pin of the electrical plug-in structure; the hot-swap unit is electrically connected to the power supply circuit and the power-off control circuit; the voltage conversion unit Electrically connect the hot-swap unit and the electrical connection slot, the voltage conversion unit can convert the voltage input by the power supply circuit to the voltage required by the memory card; The power required by the memory card in the slot comes from the voltage conversion unit.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI801972B (en) * 2021-08-18 2023-05-11 神雲科技股份有限公司 Generic interface card

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113886309A (en) * 2021-10-13 2022-01-04 北京世宁达科技有限公司 PCIE module with hot plug structure and chassis
CN114421246B (en) * 2022-02-22 2024-04-09 深圳市康睿优医疗器械有限公司 Adapter structure for converting solid state disk of M.2 interface into compatible CFexpress B type memory card

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW579025U (en) * 2002-05-23 2004-03-01 Wistron Corp PDA and memory card adapter of PDA
US20040089717A1 (en) * 2002-11-13 2004-05-13 Sandisk Corporation Universal non-volatile memory card used with various different standard cards containing a memory controller
TWI221346B (en) * 2003-09-19 2004-09-21 Datafab Sys Inc Electrical connector suitable for plural types of electronic cards and electronic device using the same
TWI222009B (en) * 2003-03-21 2004-10-11 Carry Computer Eng Co Ltd Universal micro memory card
TWI243995B (en) * 2002-10-04 2005-11-21 Onspec Electronic Inc Multimode controller for intelligent and ""dumb"" flash cards
TWI244607B (en) * 2004-08-27 2005-12-01 Incomm Technologies Co Ltd Multi-interface auto-switching circuit and memory device having the same
TW200830189A (en) * 2007-01-08 2008-07-16 Alcor Micro Corp Expresscard device
US20140106621A1 (en) * 2012-10-11 2014-04-17 Carry Technology Co., Ltd. Memory card adapter device
TWI586239B (en) * 2015-01-28 2017-06-01 惠普研發公司 Interposer and system for connecting computing device to module
TW201724664A (en) * 2015-12-17 2017-07-01 宜鼎國際股份有限公司 M.2 interface memory device and M.2 interface connection seat insertedly provided thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101355217A (en) * 2007-07-25 2009-01-28 恩悠数位股份有限公司 Multifunctional switching device
KR20100012993U (en) * 2009-06-23 2010-12-31 (주)허브로 iGender
CN201590584U (en) * 2010-02-05 2010-09-22 深圳市普联技术有限公司 Switching device
CN202997252U (en) * 2012-12-25 2013-06-12 蒋一博 Data interface converter

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW579025U (en) * 2002-05-23 2004-03-01 Wistron Corp PDA and memory card adapter of PDA
TWI243995B (en) * 2002-10-04 2005-11-21 Onspec Electronic Inc Multimode controller for intelligent and ""dumb"" flash cards
US20040089717A1 (en) * 2002-11-13 2004-05-13 Sandisk Corporation Universal non-volatile memory card used with various different standard cards containing a memory controller
TWI222009B (en) * 2003-03-21 2004-10-11 Carry Computer Eng Co Ltd Universal micro memory card
TWI221346B (en) * 2003-09-19 2004-09-21 Datafab Sys Inc Electrical connector suitable for plural types of electronic cards and electronic device using the same
TWI244607B (en) * 2004-08-27 2005-12-01 Incomm Technologies Co Ltd Multi-interface auto-switching circuit and memory device having the same
TW200830189A (en) * 2007-01-08 2008-07-16 Alcor Micro Corp Expresscard device
US20140106621A1 (en) * 2012-10-11 2014-04-17 Carry Technology Co., Ltd. Memory card adapter device
TWI586239B (en) * 2015-01-28 2017-06-01 惠普研發公司 Interposer and system for connecting computing device to module
TW201724664A (en) * 2015-12-17 2017-07-01 宜鼎國際股份有限公司 M.2 interface memory device and M.2 interface connection seat insertedly provided thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI801972B (en) * 2021-08-18 2023-05-11 神雲科技股份有限公司 Generic interface card

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