TWI688055B - Resin molding device and method for manufacturing resin molded product - Google Patents

Abstract

The present invention provides a resin molding device capable of suppressing or preventing molding defects even if the thickness of a product to be molded varies. The resin molding device includes: a molding die; and a mold wedge mechanism; and a mold cavity block driving mechanism, the molding die includes a mold and another mold, the mold includes a mold cavity block and a mold cavity frame member, and the mold cavity frame member includes a sliding hole , The model cavity block can move in the sliding hole in the mold opening and closing direction of the molding die, the model cavity block can be formed with the surface of the model cavity block opposite to the other mold and the inner side surface of the model cavity frame member, using the model The cavity block driving mechanism can move the model cavity block in the mold opening and closing direction, and a mold wedge mechanism can fix the position of a model cavity block in the mold opening and closing direction.

Description

Resin molding device and method for manufacturing resin molded product

The present invention relates to a resin molding device and a method of manufacturing a resin molded product.

In the method of manufacturing a resin molded product, for example, a resin molding device equipped with a molding die is used.

For example, Patent Document 1 describes a method of manufacturing an electronic device by resin-sealing one surface of a first substrate and one surface of a second substrate.

[Prior Technical Literature] Patent Literature

Patent Document 1: Japanese Patent Publication No. 2015-076547.

However, in resin molding of a molded object (also referred to as a molded product) including a plurality of substrates, molding defects such as resin leakage may occur due to variations in the thickness of the molded object.

Therefore, an object of the present invention is to provide a resin molding device and a method of manufacturing a resin molded product that can suppress or prevent molding defects even if the thickness of the object to be molded varies.

In order to achieve the object, the resin molding device of the present invention includes: a molding die; and a die wedge mechanism; and a model cavity block driving mechanism, the molding die includes one die and another die, and the one die includes a model A cavity block and a model cavity frame member, the one model cavity frame member is formed with a sliding hole, the one model cavity block can move in the sliding hole in the mold opening and closing direction of the molding die, and can A surface of the one model cavity block opposite to the other mold and an inner side surface of the one model cavity frame member form a model cavity, and the use of the one model cavity block driving mechanism enables the one model cavity block to The mold is moved in the opening and closing direction, and the position of the one mold cavity block in the mold opening and closing direction can be fixed using the one mold wedge mechanism.

The method for manufacturing a resin molded product of the present invention is performed using a resin molding apparatus including a molding die including one mold and another mold, the one mold including a mold cavity block and a mold cavity frame member, the one A sliding hole is formed in the model cavity frame member, the one model cavity block can move in the sliding hole in the mold opening and closing direction of the forming mold, and the one model cavity block can be opposed to the other mold And the inner surface of the one model cavity frame member form a model cavity, and the manufacturing method of the resin molded product includes: a step of supplying a molded object, supplying the molded object to the molding die; and a model cavity block The position changing step changes the position of the one mold cavity block in the mold opening and closing direction of the molding die; and the resin molding step, performs resin molding of the object to be molded in the one mold cavity.

According to the present invention, it is possible to provide a resin molding device and a method of manufacturing a resin molded product that can suppress or prevent molding defects even if the thickness of the object to be molded varies.

10‧‧‧substrate (object to be molded, object to be molded)

10A‧‧‧Resin molded product

11‧‧‧The first substrate

12‧‧‧Second substrate

13‧‧‧First connection part (first connection terminal)

14‧‧‧Second connection part (second connection terminal)

15‧‧‧chip

20‧‧‧cured resin (encapsulating resin)

20a‧‧‧Board (resin material)

20b‧‧‧Melted resin (fluid resin)

20d‧‧‧Residual resin (useless resin part)

40‧‧‧Release film

41‧‧‧ Release film at the vent

1000‧‧‧Resin molding device

1100, 1100a‧‧‧ Upper mold (one mold)

1101, 1101a‧‧‧up model cavity block (one model cavity block)

1102, 1102a‧‧‧up model cavity frame member (a model cavity frame member)

1103, 1103a‧‧‧up model cavity frame member (a model cavity frame member)

1104, 1104a‧‧‧ vent slot

1105, 1105a ‧‧‧ sliding hole

1106, 1106a‧‧‧up model cavity (one model cavity)

1200, 1200a‧‧‧lower die (another die)

1201, 1201a‧‧‧Lower model cavity block (another model cavity block)

1202, 1202a‧‧‧Lower mold side block (another mold side block)

1203, 1203a‧‧‧slot block

1204, 1204a ‧‧‧ Lower model cavity block pillar (another model cavity block pillar)

1205, 1205a ‧‧‧ lower elastic member (another elastic member)

1211‧‧‧slot

1212‧‧‧ Plunger

1300‧‧‧Upper model cavity block position changing mechanism setting part (one model cavity block position changing mechanism setting part)

1301‧‧‧Up model cavity block drive mechanism (a model cavity block drive mechanism)

1302‧‧‧ Upper model cavity block holding member (one model cavity block holding member)

1303‧‧‧force sensor (pressing pressure measuring mechanism)

1304‧‧‧Up model cavity block pillar (one model cavity block pillar)

1310‧‧‧ Upper die wedge mechanism (one die wedge mechanism)

1311a‧‧‧The first wedge member of the upper die (the first wedge member of one die)

1311b‧‧‧ Upper wedge-shaped member (one wedge-shaped member)

1312‧‧‧ Upper die wedge member power transmission member (one die wedge member power transmission member)

1313‧‧‧ Upper die wedge member drive mechanism (one die wedge member drive mechanism)

1321‧‧‧ Upper mold second wedge-shaped member holding member (one mold second wedge-shaped member holding member)

1322‧‧‧Elastic member of the second wedge-shaped member holding member of the upper mold (one member of the elastic member of the second wedge-shaped member holding member)

1330‧‧‧ vent opening and closing mechanism

1331‧‧‧Exhaust pin power mechanism

1332‧‧‧ vent pin

1340‧‧‧Pressing plate (upper model cavity block position changing mechanism setting part base member or a model cavity block position changing mechanism setting part base member)

1341‧‧‧Upper model cavity block position changing mechanism setting part frame member (one model cavity block position changing mechanism setting part frame member)

1342‧‧‧Upper model cavity block position changing mechanism setting part bottom surface member (one model cavity block position changing mechanism setting part bottom surface member)/upper member

1343‧‧‧ Upper model cavity block position changing mechanism setting part bottom surface member (one model cavity block position changing mechanism setting part bottom surface member)/lower member

1351‧‧‧ Release film adsorption mechanism

1352‧‧‧Desorption film adsorption piping

1353‧‧‧Adsorption hole for release film

1400‧‧‧ Lower model cavity block position changing mechanism setting part (another model cavity block position changing mechanism setting part)

1410‧‧‧Lower die wedge mechanism (another die wedge mechanism)

1411a‧‧‧The first wedge member of the lower die (the first wedge member of the other die)

1411b‧‧‧Second wedge member (the second wedge member of the other die)

1412‧‧‧Lower die wedge member power transmission member (another die wedge member power transmission member)

1413‧‧‧Lower die wedge member drive mechanism (another die wedge member drive mechanism)

1421‧‧‧Lower mold mounting member (another mold mounting member)

1422‧‧‧Pressing plate (lower mold second wedge member holding member or another mold second wedge member holding member)

X1~X4‧‧‧arrow indicating the upward direction or force direction of the lower die (another die) 1200

Y1~Y2‧‧‧ indicates the downward direction of the lower die (another die) 1200

a1~a2‧‧‧arrow indicating the direction of advancement of the first wedge-shaped member of the lower die (the first wedge-shaped member of the other die) 1411a

c1~c2‧‧‧ indicates the downward direction of the upper model cavity block (a model cavity block) 1101

d1‧‧‧arrow indicating the upward direction of the upper model cavity block (a model cavity block) 1101

e1~e2‧‧‧arrow indicating the direction of the advancement of the first wedge-shaped member (the first wedge-shaped member of the mold) 1311a

g1~g2‧‧‧arrow indicating the direction of plunger 1212 pushing

s‧‧‧Space

h1‧‧‧ Arrow indicating the downward direction of the vent pin 1332

D‧‧‧Thickness (height) of the object 10

FIG. 1 is a cross-sectional view schematically showing an example of the resin molding apparatus of the present invention.

2 is a cross-sectional view schematically showing one step of an example of a method of manufacturing a resin molded product using the resin molding device of FIG. 1.

FIG. 3 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

4 is a cross-sectional view schematically showing another step of the method for manufacturing the same resin molded product as FIG. 2.

FIG. 5 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

Fig. 6 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as Fig. 2.

7 is a cross-sectional view schematically showing another step of the method for manufacturing the same resin molded product as FIG. 2.

FIG. 8 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

9 is a cross-sectional view schematically showing another step of the method for manufacturing the same resin molded product as FIG. 2.

FIG. 10 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 11 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 12 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 13 is a cross-sectional view schematically showing another step of the method for manufacturing the same resin molded product as FIG. 2.

14 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 15 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 16 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 17 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

Fig. 18 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as Fig. 2.

FIG. 19 is a cross-sectional view schematically showing the same resin molding apparatus as FIG. 1.

20 is a cross-sectional view schematically showing a state in which the upper mold and the lower mold are removed from the resin molding apparatus of FIG. 19.

21 is a cross-sectional view schematically showing a state in which an upper mold and a lower mold different from FIG. 19 are attached to the resin molding apparatus of FIG. 19.

22 is a cross-sectional view schematically showing one step of another example of a method of manufacturing a resin molded product using the resin molding device of FIG. 1.

FIG. 23 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 22.

FIG. 24 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 22.

25 is a cross-sectional view schematically showing an example of a structure in which a mold release film is adsorbed to an upper mold in the resin molding apparatus of FIG. 1.

FIG. 26(a) is a cross-sectional view schematically showing an example of the object to be molded. FIG. 26(b) is a cross-sectional view schematically showing an example of a resin molded product in which the object to be molded in FIG. 26(a) is resin-molded.

Next, the present invention will be described in further detail by examples. However, the present invention is not limited to the following description.

The resin molding apparatus of the present invention may further include a release film adsorption mechanism, for example.

The resin molding apparatus of the present invention can press, for example, the object to be molded by the resin with the one mold cavity block via the release film.

The resin molding apparatus of the present invention can further include, for example, a pressing force measuring mechanism that measures the pressing force of pressing the one model cavity block using the one model cavity block driving mechanism.

With regard to the resin molding device of the present invention, for example, the one die wedge mechanism includes a pair of die wedge members, and the pair of die wedge members includes a die first wedge member and a die second wedge member, The one-mould first wedge-shaped member and the one-mould second wedge-shaped member respectively have slope surfaces, and are arranged so that the sloped surfaces face each other, by moving the one-mould first wedge-shaped member and the one At least one of the second wedge-shaped members of the mold can change the length of the pair of one wedge-shaped members in the mold opening and closing direction when the first wedge-shaped member of the one mold contacts the second wedge-shaped member of the one mold . In addition, the direction in which the at least one wedge member is moved may be, for example, a wedge-shaped front end direction or a rear end direction of the moved wedge member.

With regard to the resin molding apparatus of the present invention, for example, the resin molding apparatus can further include another mold wedge mechanism, and the other mold includes another mold cavity block. Using the other mold wedge mechanism, the resin mold can be fixed The position of the other mold cavity block in the opening and closing direction of the mold.

With respect to the resin molding apparatus of the present invention, for example, the another die wedge mechanism includes a pair of another die wedge members including the other die first wedge member and the other die The second wedge-shaped member, the first wedge-shaped member of the other mold and the second wedge-shaped member of the other mold respectively have slope surfaces, and are arranged in such a manner that the slope surfaces face each other, by moving the first mold At least one of a wedge member and the second wedge member of the one mold can change the wedge shape of the pair of other molds when the first wedge member of the other mold contacts the second wedge member of the other mold The length of the member in the mold opening and closing direction. In addition, the direction in which the at least one wedge member is moved may be, for example, a wedge-shaped front end direction or a rear end direction of the moved wedge member.

In the resin molding apparatus of the present invention, for example, when the first wedge member of the one mold and the second wedge member of the one mold are in contact, the direction of opening and closing of the pair of one wedge members in the mold can be changed The length of the mold cavity can change the position of the one mold cavity block in the mold opening and closing direction.

For the resin molding device of the present invention, for example, it is possible to:

By moving at least one of the one mold and the other mold in the mold closing direction, the one mold and the other mold hold the object to be molded, and By using the one model cavity block driving mechanism, the one model cavity block is moved toward the object to be molded, and the one model cavity block is pressed against the object to be molded via the release film. The one mold wedge mechanism can fix the position of the one mold cavity block in the mold opening and closing direction.

In the resin molding apparatus of the present invention, for example, after the position of the one mold cavity block is fixed, at least one of the one mold and the other mold can be moved in the mold opening direction of the mold, After that, the position of the one model cavity block can be changed and fixed using the one model cavity block driving mechanism and the one model wedge mechanism.

In the resin molding apparatus of the present invention, for example, the one mold may be an upper mold, and the other mold may be a lower mold. In addition, for example, in contrast to this, in the resin molding apparatus of the present invention, the one mold may be a lower mold and the other mold may be an upper mold.

The resin molding device of the present invention may be, for example, a device for transfer molding. In addition, the resin molding apparatus of the present invention is not limited to this, and may be an apparatus for compression molding, for example.

As for the method of manufacturing the resin molded product of the present invention, as described above, although a resin molding device including a molding die is used, for example, the resin molding device may be the resin molding device of the present invention.

The method for manufacturing a resin molded article of the present invention may further include a mold surface covering step of covering the mold surface of the one mold with a release film.

The method for manufacturing a resin molded article of the present invention may further include, for example, a molded object pressing step of pressing the molded object molded by the resin with the one mold cavity block via the release film.

The method for manufacturing a resin molded product of the present invention may further include a step of changing the position of the other mold cavity block in the mold opening and closing direction, for example.

The method for manufacturing the resin molded product of the present invention may be, for example, that the resin molding device is the resin molding device of the present invention, and the resin molding device of the present invention further includes the other mold wedge mechanism.

The method for manufacturing a resin molded product of the present invention may further include, for example, a step of clamping a molded object, by closing at least one of the one mold and the other mold to the molding mold Moving in the direction, and clamping and fixing the object to be molded by the one mold and the other mold; and the step of pressing the object to be molded, pressing the object to be molded with the one mold cavity block through the release film And a model cavity block fixing step, fixing the position of the one model cavity, in the step of changing the position of the one model cavity block, using the one model cavity block driving mechanism, so that the one model cavity block The molded object moves, and in the step of pressing the molded object, the one mold cavity block driving mechanism is used to press the molded object with the one mold cavity block through the release film, and the molded object is molded. After the object pressing step, in the one model cavity block fixing step, the one model cavity block is used to fix the position of the one model cavity block in the mold opening and closing direction.

The method for manufacturing a resin molded product of the present invention may include, for example, after the step of fixing the one mold cavity block, opening at least one of the one mold and the other mold toward the molding mold The mold direction moves, and then, the second model cavity block position changing step using the one model cavity block driving mechanism to change the position of the one model cavity block and fixing the one model cavity using the one mold wedge mechanism The block position is the second model cavity block fixing step.

In the method for manufacturing a resin molded article of the present invention, for example, in the resin molding step, the object to be molded can be resin molded by transfer molding. In addition, the method of manufacturing the resin molded article of the present invention is not limited to this, and for example, the object to be molded can be molded by compression molding or the like in the resin molding step.

In the method of manufacturing a resin molded article of the present invention, for example, the object to be molded may include a plurality of substrates, and the object to be molded may be resin molded by encapsulating the resin between the substrates .

In addition, in the present invention, the "forming mold" is, for example, a metal mold, but it is not limited to this, and may be, for example, a ceramic mold.

In the present invention, the resin molded product is not particularly limited, and may be, for example, a resin molded product that molds only resin, or a resin molded product that packages resin such as a wafer. In the present invention, the resin molded product may be, for example, an electronic component.

In the present invention, “resin molding” or “resin encapsulation” refers to, for example, a state where the resin is cured (hardened).

In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, thermosetting resins such as epoxy resins and silicone resins, or thermoplastic resins. Also, it may be a composite material containing a part of thermosetting resin or thermoplastic resin. In the present invention, examples of the form of the resin material before molding include pellet resin, fluid resin, sheet resin, plate resin, and powder resin. In the present invention, the fluid resin is not particularly limited if it is a fluid resin, and examples thereof include liquid resin and molten resin. In the present invention, the liquid resin refers to a resin that is liquid or has fluidity at room temperature, for example. In the present invention, the molten resin refers to a resin that becomes liquid or has a fluid state by melting, for example. The form of the resin may be other forms as long as it can be supplied into the cavity and groove of the mold.

In addition, although the term “electronic component” generally refers to a wafer before resin encapsulation and refers to a state where the wafer is resin encapsulated, in the present invention, it is only referred to as “electronic component”. Hereinafter, unless otherwise specified, it refers to an electronic component in which the wafer is resin-encapsulated (electronic component as a finished product). In the present invention, the "wafer" refers to a wafer before resin encapsulation, and specifically, for example, an integrated circuit (IC), a semiconductor wafer, a semiconductor element for power control, or the like. In the present invention, the wafer before resin packaging is referred to as a "wafer" for convenience in order to distinguish it from the electronic components after resin packaging. However, the “wafer” of the present invention is not particularly limited as long as it is a wafer before resin encapsulation, and may not be in a wafer shape.

In the present invention, “flip-chip” refers to an integrated circuit (IC) wafer or an integrated circuit (IC) wafer having bump-shaped bump electrodes called solder joints on electrodes (pads) on the surface portion of the integrated circuit (IC) wafer. Kinds of wafer morphology. The wafer can be mounted downward (face down) on a wiring portion such as a printed circuit board. The flip chip can be used, for example, as a wafer for wireless bonding or as one of mounting methods.

In the present invention, for example, a resin molded product can be manufactured by resin-encapsulating (resin molding) a component (for example, wafer, flip chip, etc.) mounted on a substrate. In the present invention, the substrate (also referred to as an interposer) is not particularly limited, but for example, it may be a lead frame, a wiring substrate, a wafer, a ceramic substrate, or the like. The substrate may be, for example, as described above, a mounting substrate on which wafers are mounted on one surface or both surfaces. Although the method of mounting the wafer is not particularly limited, for example, wire bonding, flip chip bonding, etc. may be mentioned. In the present invention, for example, the electronic component in which the wafer is resin-encapsulated can be manufactured by resin-encapsulating the mounting substrate. In addition, the use of the resin-encapsulated substrate with the resin encapsulation device of the present invention is not particularly limited, and examples include high-frequency module substrates for mobile communication terminals, module substrates for power control, and substrates for machine control.

In addition, in the present invention, "installation" includes "mounting" or "fixing". Further, in the present invention, "mounting" includes "fixing".

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For convenience of explanation, the drawings are schematically described by appropriately omitting, exaggerating, etc.

[Example 1]

In this embodiment, an example of a resin molding apparatus of the present invention and an example of a method of manufacturing a resin molded product using the same will be described.

In the cross-sectional view of FIG. 1, the structure of the resin molding apparatus of this embodiment is schematically shown. As shown in the figure, the resin molding apparatus 1000 includes a molding die including an upper mold (one mold) 1100 and a lower mold (another mold) 1200 as main components; an upper mold cavity block position changing mechanism setting portion (a mold cavity block Position changing mechanism setting section) 1300; lower model cavity position changing mechanism setting section (another model cavity block position changing mechanism setting section) 1400. In addition, the resin molding apparatus 1000 further includes a release film suction mechanism (not shown in FIG. 1) and a vent opening and closing mechanism 1330 as main components. In this embodiment, as will be described later, although the vent opening and closing mechanism 1330 is one of the components of the upper mold cavity block position changing mechanism setting portion 1300, the present invention is not limited to this. For example, the vent opening and closing mechanism 1330 may be one of the components of the resin molding apparatus 1000 that is different from the upper mold cavity block position changing mechanism setting portion 1300.

The upper mold (one mold) 1100 includes an upper mold cavity block (one mold cavity block) 1101 and upper mold cavity frame members (one mold cavity frame member) 1102 and 1103. As shown in the figure, two upper cavity blocks 1101 are arranged side by side. Among the members constituting the upper mold cavity frame member, the upper mold cavity frame member 1103 is arranged so as to be sandwiched by the two upper mold cavity blocks 1101. The upper mold cavity frame member 1102 is disposed outside the upper mold cavity block 1101 as shown. A slide hole 1105 is formed on the upper mold cavity frame member so as to be surrounded by the upper mold cavity frame members 1102 and 1103. The upper mold cavity block 1101 can move in the slide hole 1105 in the mold opening and closing direction of the molding mold. In addition, the "mold opening and closing direction" in Fig. 1 is the opening and closing direction of the upper mold 1100 and the lower mold 1200, that is, the vertical direction of the figure. Further, as shown in the figure, the upper model cavity (one model cavity) can be formed by surrounding the space of the above model cavity block 1101 opposite to the lower mold (another mold) 1200 and the inner sides of the upper model cavity frame members 1102 and 1103 )1106. Then, as will be described later, the molded object to be molded by the resin can be pressed through the mold cavity block 1101 above the release film. In addition, a vent hole 1104 is formed at the lower end of the upper mold cavity frame member 1102.

In addition, although not shown in FIG. 1, the upper mold cavity frame member 1103 may be further formed with a remaining resin portion (also referred to as a waste resin portion or a residual material) as a space for containing the remaining resin (useless resin) during resin molding. unit).

Lower mold (another mold) below 1200 model cavity block (another mold cavity block) 1201, lower mold side block (another mold side block) 1202 and groove block 1203 as main components, and further includes a lower mold cavity block pillar ( Another model cavity block pillar) 1204, a lower mold elastic member (another mold elastic member) 1205, and a plunger 1212. In addition, although the plunger 1212 may be one of the components of the lower mold 1200 as described above, it may be one of the components of the resin molding apparatus 1000 that is different from the lower mold 1200. There are two lower mold cavity blocks 1201, which are arranged in such a manner that the upper surface faces the upper mold cavity block 1101. The groove block 1203 is arranged so as to be sandwiched between the two lower mold cavity blocks 1201. The lower mold side block 1202 is arranged outside the lower mold cavity block 1201 as shown. Then, the two lower mold cavity blocks 1201 are arranged inside the lower mold side block 1202 and the groove block 1203, respectively. In the groove block 1203, a groove 1211 is formed, and the groove 1211 is a hole penetrating in the vertical direction. The plunger 1212 can move up and down in the groove 1211. As described later, by raising the plunger 1212, the fluid resin in the groove 1211 can be pushed into the upper mold cavity 1106.

The lower mold cavity block pillar 1204 is installed on the lower surface of the lower mold cavity block 1201. The lower mold elastic member 1205 is disposed so as to surround the lower mold cavity block pillar 1204, and can expand and contract in the mold opening and closing direction (vertical direction in the figure).

The upper mold cavity block position changing mechanism setting part (one mold cavity block position changing mechanism setting part) 1300 includes an upper cavity block driving mechanism (one model cavity block driving mechanism) 1301, an upper mold cavity block holding member (one model cavity block holding Component) 1302, load cell (pressing force measuring mechanism) 1303, upper model cavity block pillar (a model cavity block pillar) 1304, upper die wedge mechanism (also called a die wedge mechanism, upper die wedge mechanism or a die) Wedge mechanism) 1310, upper die second wedge member holding member (also called a die second wedge member retaining member or upper die second wedge member or a die second wedge retaining member) 1321, upper die second wedge member retaining member Elastic member (an elastic member of a mold second wedge-shaped member holding member) 1322, vent opening and closing mechanism 1330, pressure plate (upper mold cavity block position changing mechanism setting part base member or a mold cavity block position changing mechanism setting part base member ) 1340, upper model cavity block position changing mechanism setting part frame member (one model cavity block position changing mechanism setting part frame member) 1341, upper model cavity block position changing mechanism setting part bottom member (one model cavity block position changing mechanism setting part Bottom member) 1342 and 1343. The pressure plate 1340 is a plate-shaped member, and is arranged above the upper mold 1100 so as to cover the entire upper mold 1100. In addition, as will be described later, other members of the upper mold cavity block position changing mechanism setting portion 1300 are directly or indirectly mounted on the pressure plate 1340.

As shown in the figure, the upper mold cavity block holding member 1302 penetrates the pressure plate 1340 upward and downward, and can move up and down. An upper mold cavity block post 1304 is attached to the lower end of one mold cavity block holding member 1302. An upper mold cavity block 1101 is attached to the lower end of the upper mold cavity block pillar 1304. In addition, as will be described later, the upper mold cavity block 1101 can be attached to and detached from the upper mold cavity block post 1304. The upper mold cavity block driving mechanism 1301 is connected to the upper end of the upper mold cavity block holding member 1302. By moving the upper mold cavity block holding member 1302 up and down by the above mold cavity block driving mechanism 1301, the upper mold cavity block 1101 can be moved up and down (that is, in the mold opening and closing direction).

The upper die wedge mechanism 1310 includes an upper die first wedge member (also called a die first wedge member, an upper die first wedge or a die first wedge) 1311a, and an upper die second wedge member (also called a Die second wedge member, upper die second wedge or a die second wedge 1311b, upper die wedge member power transmission member (also called a die wedge member power transmission member, upper die wedge power transmission member or a die wedge power transmission Component) 1312, upper die wedge member drive mechanism (also called a die wedge member drive mechanism, upper die wedge drive mechanism or a die wedge drive mechanism) 1313. As shown in FIG. 1, with respect to the upper die first wedge member 1311a and the upper die second wedge member 1311b, one surface in the thickness direction (vertical direction in the figure) is a slope surface. More specifically, as shown in the figure, the lower surface of the upper wedge member 1311a of the upper mold and the upper surface of the second wedge member 1311b of the upper mold are slope surfaces, respectively. The upper die first wedge-shaped member 1311a and the upper die second wedge-shaped member 1311b are arranged so that their slope surfaces face each other.

In addition, the upper die first wedge member 1311a is connected to the upper die wedge member driving mechanism 1313 via the upper die wedge member power transmission member 1312. Then, by the upper die wedge member driving mechanism 1313, a pair of upper die wedge members (a pair of one die wedge members formed by the upper die first wedge member 1311a and the upper die second wedge member 1311b). Called "a pair of upper die wedge members", "upper die wedge members" or "upper die wedges"), the slope surface (left-right direction in the figure) of the slope surface slides, and the pair of upper die wedge members can be changed in The length in the thickness direction. For example, if the upper die first wedge member 1311a is slid in the direction of its front end, the upper die second wedge member 1311b will slide in the opposite direction relative to the upper die first wedge member 1311a. In this way, the length of the pair of upper die wedge members in the thickness direction (the vertical direction in the figure) increases. In addition, for example, conversely, by sliding the upper die first wedge member 1311a in the direction of the rear end thereof, the length of the pair of upper die wedge members in the thickness direction (vertical direction in the figure) can be reduced. Thus, as will be described later, the position of the upper mold cavity block 1101 in the vertical direction (mold opening and closing direction) can be changed. Thus, even if the thickness of the article to be molded has a deviation, the position of the upper mold cavity block 1101 can be adjusted to an appropriate position. That is, by this, the depth of the upper mold cavity 1106 can be adjusted to an appropriate depth.

In addition, in the example of FIG. 1, the upper die first wedge member 1311 a on the upper side of the pair of upper die wedge members can be slid (slid) in the horizontal (left and right) direction by the upper die wedge member drive mechanism 1313. However, it is not limited to this. For example, the upper mold second wedge member 1311b can also be slid by the upper mold wedge member drive mechanism 1313, and both the upper mold first wedge member 1311a and the upper mold second wedge member 1311b can also be slid . In addition, the upper die wedge member driving mechanism 1313 is not particularly limited, and for example, a servo motor, a cylinder, or the like can be used.

In addition, in FIG. 1, the entire surface of each of the upper die first wedge member 1311 a and the upper die second wedge member 1311 b is a slope surface. However, the present invention is not limited to this, and it is sufficient that at least one wedge member can slide along the slope surface. For example, as for one or both of the upper wedge member 1311a and the upper wedge member 1311b of the upper mold, only a part of one surface thereof may be a slope surface. More specifically, for example, with respect to at least one of the upper wedge member 1311a and the upper wedge member 1311b shown in the figure, the front end side (the thinner side) of only one surface is a slope surface, and the base side (The thicker side) may be horizontal.

The upper surface of the upper mold second wedge member holding member 1321 is in contact with the lower surface of the upper mold second wedge member 1311b. On the other hand, the lower surface of the pressure plate 1340 is in contact with the upper surface of the first wedge member 1311a of the upper mold. That is, the pair of upper die wedge members are arranged so as to be sandwiched between the upper surface of the upper die second wedge member holding member 1321 and the lower surface of the pressure plate 1340. In addition, the elastic member 1322 of the upper mold second wedge member holding member and the upper mold second wedge member holding member 1321 hold the state where the upper mold first wedge member 1311a and the upper mold second wedge member 1311b are in contact.

The bottom surface member of the upper mold cavity block position changing mechanism installation portion is formed of an upper member 1342 and a lower member 1343. As shown in the figure, the bottom surface member 1343 of the upper mold cavity block position changing mechanism installation part can mount the upper mold cavity frame members 1102 and 1103 on the lower surface thereof. As will be described later, the upper mold cavity frame members 1102 and 1103 can be attached to and detached from the bottom surface member 1343 of the upper mold cavity block position changing mechanism installation portion. In addition, the upper mold cavity block post 1304 penetrates the upper mold cavity block position changing mechanism installation portion bottom surface members 1342 and 1343 in the up-down direction and can move up and down. The elastic member 1322 of the upper mold second wedge member holding member is arranged so as to be sandwiched between the lower surface of the upper mold second wedge member holding member 1321 and the upper surface of the upper mold cavity block position changing mechanism setting portion bottom surface member 1342 Telescopic up and down. For the upper mold cavity block position changing mechanism setting part frame member 1341, its upper end is connected to the lower surface of the upper mold cavity block position changing mechanism setting part base member 1340, and its lower end is connected to the bottom surface of the upper mold cavity block position changing mechanism setting part The upper surface of the member 1342. The upper mold cavity block position changing mechanism setting portion frame member 1341 is arranged to surround the upper mold second wedge member holding member 1321, the upper mold cavity block holding member 1302, and the pair of upper mold wedge members.

The vent opening and closing mechanism 1330 includes a vent pin power mechanism 1331 and a vent pin 1332. The vent pin 1332 penetrates the upper part of the upper mold cavity frame member 1102, the upper mold cavity block position changing mechanism setting part bottom surface members 1342 and 1343, and the upper mold cavity block position changing mechanism setting part frame member 1341 in the vertical direction as shown in the figure And the pressure plate 1340, and can move up and down. The exhaust hole pin 1332 is moved up and down by the exhaust hole pin power mechanism 1331, and the exhaust hole groove 1104 can be opened and closed as described later. In addition, the vent pin power mechanism 1331 is not particularly limited, and for example, a servo motor, a cylinder, or the like can be used.

In addition, the "upper model cavity block position changing mechanism (one model cavity block position changing mechanism)" provided in the upper model cavity block position changing mechanism setting section (one model cavity block position changing mechanism setting section) 1300 includes in this embodiment An upper mold cavity block drive mechanism (a mold cavity block drive mechanism) 1301 and an upper mold wedge mechanism (a mold wedge mechanism) 1310. However, the present invention is not limited to this, for example, the upper mold cavity block position changing mechanism (a mold cavity block position changing mechanism) may further include other members.

The lower mold cavity block position changing mechanism setting portion 1400 includes a lower mold wedge mechanism (another mold wedge mechanism) 1410, a lower mold mounting member (another mold mounting member) 1421, and a pressure plate (also called a lower mold second wedge shape) A member holding member or another mold second wedge member holding member, a lower mold second wedge holding member or another mold second wedge holding member) 1422.

The lower die wedge mechanism 1410 includes a lower die first wedge member (also called another die first wedge member, a lower die first wedge or another die first wedge) 1411a, and a lower die second wedge member (also Called another die second wedge member, lower die second wedge or another die second wedge) 1411b, lower die wedge member power transmission member (also called another die wedge member power transmission member, lower die wedge power transmission member or Another die wedge power transmission member) 1412, a lower die wedge member driving mechanism (also called another die wedge member driving mechanism, a lower die wedge driving mechanism, or another die wedge driving mechanism) 1413. As shown in FIG. 1, the other surface of the lower die first wedge member 1411 a and the lower die second wedge member 1411 b in the thickness direction (vertical direction in the figure) is a slope surface. More specifically, as shown in the drawing, the upper surface of the lower first wedge-shaped member 1411a and the lower surface of the lower second wedge-shaped member 1411b are slope surfaces, respectively. The lower die first wedge-shaped member 1411a and the lower die second wedge-shaped member 1411b are arranged so that their slope surfaces face each other.

Also, the lower die first wedge member 1411a is connected to the lower die wedge member driving mechanism 1413 via the lower die wedge member power transmission member 1412. In addition, a pair of lower die wedge members (a pair of other die wedge members formed by the lower die first wedge member 1411a and the lower die second wedge member 1411b) are formed by the lower die wedge member driving mechanism 1413. Slip surface (left and right direction in the figure) of the slope surface called "a pair of lower die wedge members" or "lower die wedge members" or "lower die wedge members" can change the thickness direction of the pair of lower die wedge members length. For example, if the lower die first wedge member 1411a is slid in the direction of its front end, the lower die second wedge member 1411b will slide in the opposite direction relative to the lower die first wedge member 1411a. As a result, the length of the pair of lower die wedge members in the thickness direction (the vertical direction in the figure) increases. Further, for example, conversely, the length of the pair of lower mold wedge members in the thickness direction (vertical direction in the figure) can be reduced by sliding the lower mold first wedge member 1411a toward the rear end direction thereof. Thus, as will be described later, the position of the lower mold cavity block 1201 in the vertical direction (mold opening and closing direction) can be changed. Thus, for example, even if the thickness of the first substrate 11 of the article 10 to be described later has a deviation (for example, even if the thicknesses of the first substrate 11 on the left and right of FIG. 3 described later are different), each lower model can be appropriately changed (adjusted) At the position of the cavity block 1201 (for example, the left and right lower mold cavity blocks 1201 in FIG. 3 ), the left and right first substrates 11 are clamped with an appropriate pressing force.

In addition, in the example of FIG. 1, the lower die first wedge member 1411a on the lower side of the pair of lower die wedge members can be slid in the horizontal (left and right) direction by the lower die wedge member drive mechanism 1413 ( Slip). However, it is not limited to this, for example, the lower die second wedge member 1411b may be slipped by the lower die wedge member driving mechanism 1413, and both the lower die first wedge member 1411a and the lower die second wedge member 1411b may be slid shift. In addition, the lower die wedge member drive mechanism 1413 is not particularly limited, and for example, a servo motor, a cylinder, or the like can be used.

In addition, in FIG. 1, the entire surface of each of the lower first wedge-shaped member 1411 a and the lower second wedge-shaped member 1411 b is a slope surface. However, the present invention is not limited to this, and it is possible to slide at least one wedge member along the slope surface. For example, for one or both of the lower die first wedge member 1411a and the lower die second wedge member 1411b, only a part of one surface may be a slope surface. More specifically, for example, with respect to at least one of the lower die first wedge member 1411a and the lower die second wedge member 1411b shown in the figure, only the front end side (the thinner side) of one surface may be a slope surface and the base side (The thicker side) is the horizontal plane. In addition, although the lower first wedge member 1411a and the lower second wedge member 1411b are not connected in FIG. 1, the lower first wedge member 1411a and the second lower die can be held in the same manner as the upper wedge member 1310. The state where the wedge member 1411b is in contact.

The upper surface of the lower mold second wedge member holding member 1422 is in contact with the lower surface of the lower mold first wedge member 1411a. On the one hand, the lower end of the lower mold cavity block pillar 1204 is connected to the upper surface of the second wedge member 1411b of the lower mold. That is, the pair of lower mold wedge members are arranged so as to be sandwiched between the upper surface of the lower mold second wedge member holding member 1422 and the lower end of the lower mold cavity block pillar 1204. Moreover, by changing the length of the pair of lower mold wedge members in the thickness direction, the lower mold cavity block 1201 can be moved up and down.

The lower die mounting member 1421 is arranged above the lower die second wedge member holding member 1422, and is fixed so as not to move up and down relative to the lower die second wedge member holding member 1422. In the space sandwiched by the lower die mounting member 1421 and the lower die second wedge member holding member 1422, the length in the thickness direction can be changed by driving the pair of lower die wedge members as described above. A lower mold side block 1202 and a groove block 1203 are provided on the upper surface of the lower mold mounting member 1421. In addition, the lower mold cavity block pillar 1204 penetrates the inside of the lower mold mounting member 1421 in the vertical direction, and can move up and down. The lower mold elastic member 1205 is sandwiched between the lower surface of the lower mold cavity block 1201 and the upper surface of the lower mold mounting member 1421, and as described above, can expand and contract in the mold opening and closing direction (vertical direction in the figure).

In addition, the "lower model cavity block position changing mechanism (another model cavity block position changing mechanism)" provided in the lower model cavity block position changing mechanism setting section (another model cavity block position changing mechanism setting section) 1400 in this embodiment The lower die wedge mechanism (another die wedge mechanism) 1410 is included. However, the present invention is not limited to this, for example, the lower mold cavity block position changing mechanism (another mold cavity block position changing mechanism) may further include other members.

The method of manufacturing a resin molded product using the resin molding apparatus of FIG. 1 can be performed as shown in FIGS. 2 to 19, for example.

First, as shown in FIG. 2, the mold release film 40 is supplied to the mold surface (upper mold surface) of the upper mold 1100. Then, the upper mold surface is covered with the release film 40 by suction or the like (one mold surface covering step). As described later, a release film adsorption mechanism (not shown in FIG. 2) can be used. The “mold surface of the upper mold 1100 (upper mold surface)” to which the release film 40 is adsorbed includes a mold surface of the upper mold cavity 1106 and a lower surface of the upper mold cavity frame member 1102 as shown. Further, at this time, as shown in the figure, the release film 41 is also supplied into the exhaust hole groove 1104. In the state of FIG. 2, since the vent hole groove 1104 is not blocked, the release film 40 can be adsorbed through the vent hole groove 1104.

In addition, the adsorption of the release film 40 can be performed as shown in FIG. 25, for example. In FIG. 25, the resin molding apparatus 1000 includes a release film suction mechanism 1351. The release film adsorption mechanism 1351 is not particularly limited, but for example, a suction pump or the like can be used. Mold release film adsorption piping 1352 is provided on the pressing plate 1340, the upper mold cavity block position changing mechanism setting part frame member 1341, the upper mold cavity block position changing mechanism setting part bottom surface members 1342 and 1343, and the upper mold cavity frame member 1102 and 1103. The release film adsorption piping 1352 is divided into branch lines, and each end of the branch is opened as a release film adsorption hole 1353 at the lower ends of the upper mold cavity frame members 1102 and 1103. Then, by sucking from the other end of the release film suction pipe 1352, by the release film suction mechanism 1351, the release film 40 and the release film 41 can be attracted to the upper mold through the release film suction hole 1353. Surface and vent hole slot 1104.

In addition, the release film 40 and the release film 41 can be transported to the position of the forming mold by, for example, a release film transport mechanism (not shown), etc., and then carried out on the mold surface (upper mold surface) of the upper mold 1100 as described above. supply.

Next, as shown in FIG. 3, the board (resin material) 20a is supplied into the groove 1211. At the same time, as shown in the figure, the molded article (object to be molded) 10 is supplied to the upper surface of the lower mold cavity block 1201 (object to be molded). The resin material 20a may be, for example, a thermosetting resin, but it is not limited thereto, and may be a thermoplastic resin, for example. At this time, the upper mold 1100 and the lower mold 1200 or only the lower mold 1200 may be heated and heated by a heater (not shown) in advance. In addition, for example, the resin material 20a and the article to be molded 10 can be conveyed to the position of the mold by a conveying mechanism (not shown) and supplied to the mold.

In addition, the article to be molded (object to be molded, hereinafter sometimes simply referred to as "substrate") 10 includes a first substrate 11, a second substrate 12, a first connection portion (first connection terminal) 13, and a second connection as shown in the figure Part (second connection terminal) 14, wafer 15. The first substrate 11 and the second substrate 12 are arranged such that their respective surfaces face each other. With respect to the first substrate 11 and the second substrate 12, the opposing surfaces are connected to each other by the first connection terminal 13. The chip 15 is connected to the surface of the first substrate 11 opposite to the second substrate 12 via the second connection terminal 14. In addition, in this figure, one substrate (molded product) 10 includes one first substrate 11 and one second substrate 12, but the present invention is not limited to this. For example, one substrate (molded product) 10 may include a plurality of second substrates 12, and the plurality of second substrates 12 may be mounted on the first substrate 11. In addition, the outline of the manufacturing method of the resin molded product using the substrate (molded product) 10 can be shown by (a) and (b) of FIG. 26, for example. First, the substrate (molded product) 10 shown in (a) of FIG. 26 is the same as the substrate (molded product) 10 of FIG. 3, and its structure is as described above. The thickness (the height from the lower surface of the first substrate 11 to the upper surface of the second substrate 12) of the substrate (molded product) 10 is indicated by the symbol D in FIG. 26(a). In addition, as shown in (a) of the prior art 26, by filling the space between the first substrate 11 and the second substrate 12 with resin, the first connection terminal 13, the second connection terminal 14, and the chip 15 are encapsulated with the encapsulating resin 20 To shape. In this way, as shown in the prior art, the resin molded product 10A can be manufactured. The specific method of the resin encapsulation (resin molding) of this embodiment will be described later. In addition, for example, as shown in Example 3 described later, in the present invention, even if the thickness D of the substrate (to-be-molded product) 10 is different, it can be handled.

Next, as shown in FIG. 4, the lower mold 1200 is raised in the direction of arrow X1 by a driving source (not shown), and the first substrate 11 is sandwiched between the lower mold cavity block 1201 and the upper mold cavity frame member 1102. At this time, as shown in the figure, the resin material 20a is melted into molten resin (fluid resin) 20b by the heat of the lower mold 1200 which has been heated in advance.

Next, as shown in FIG. 5, the lower mold 1200 is further raised in the direction of arrow X2. Thus, the lower mold cavity block 1201 applies upward pressure to the first substrate 11 sandwiched between the lower mold cavity block 1201 and the upper mold cavity frame member 1102. In this way, the first mold 11 is clamped and clamped by the lower mold cavity block 1201 and the upper mold cavity frame member 1102 (clamping step of the molded object).

Next, as shown in FIG. 6, the lower first wedge member 1411a is moved in the direction of its front end (the direction of arrow a1), and contacts the lower second wedge member 1411b. By fixing the lower mold first wedge member 1411a and the lower mold second wedge member 1411b at this position, the position of the lower mold cavity block 1201 in the up-down direction is fixed to this position.

Next, as shown in FIG. 7, the upper mold cavity block 1101 is lowered in the direction of arrow c1 by the upper mold cavity block driving mechanism 1301. As a result, the upper mold cavity block 1101 and the second substrate 12 are brought into contact via the release film 40. At this time, the pressing force (clamping force) of the second substrate 12 due to the upper mold cavity block 1101 is measured by the force sensor 1303. Thus, the pressing force of the second substrate 12 can be controlled. As a result, it is possible to suppress breakage of the substrate 10 due to the excessive pressing force.

Next, as shown in FIG. 8, the first wedge member 1311a of the upper mold is moved in the direction of the front end (direction of arrow e1). Thereby, the length of the upper die wedge (the upper die first wedge member 1311a and the upper die second wedge member 1311b) in the thickness direction is increased, and as shown in the figure, the upper die second wedge member holding member 1321 is pressed down The upper mold cavity block holding member 1302 is contacted. By fixing the upper mold first wedge member 1311a, the upper mold second wedge member 1311b, and the upper mold cavity block holding member 1302 at this position, the position of the upper mold cavity block 1101 in the up-down direction is fixed at this position ( A model cavity block fixing step).

Next, as shown in FIG. 9, the lower mold 1200 is lowered in the direction of arrow Y1, and the mold is slightly opened. The "slightly opened mold" means slightly opened with the second substrate 12 and the release film 40 in a non-contact state. Specifically, although not particularly limited, the distance between the second substrate 12 and the release film 40 can be set to a small distance such as about 0.1 mm.

Next, as shown in FIG. 10, the upper mold cavity block driving mechanism 1301 lowers the upper mold cavity block 1101 again in the direction of arrow c2 (second mold cavity block position changing step). Thus, as shown in the figure, the upper mold cavity block 1101 and the second substrate 12 are brought into contact again via the release film 40. Thus, by lowering the upper mold cavity block 1101 again in the direction of arrow c2, the upper mold second wedge member 1311b can be formed between the upper mold cavity block holding member 1302 and the upper mold second wedge member holding member 1321 Falling space s.

Next, as shown in FIG. 11, the upper wedge-shaped first wedge member 1311a is slightly moved in the direction of the front end (direction of arrow e2). In this way, as shown in FIG. 11, the second wedge member 1311 b of the upper mold is slightly lowered from the state of FIG. 10 in consideration of the interference amount (the amount of shrinkage in the mold closing direction) of the second substrate 12. In this way, by considering the interference amount of the second substrate 12, it is possible to suppress or prevent the resin from entering between the second substrate 12 and the release film 40.

Next, as shown in FIG. 12, the upper mold cavity block driving mechanism 1301 is used to raise the upper mold cavity block 1101 in the direction of arrow d1. Thereby, as shown in the figure, the upper mold cavity block holding member 1302 and the upper mold second wedge member holding member 1321 are brought into contact.

In addition, although the "one mold cavity block position changing step" of the method for manufacturing a resin molded article of the present invention can be performed as described in FIGS. 8 to 12, for example, it is not limited to this method, and may be arbitrary. For example, in FIGS. 8 to 12, the upper mold wedge mechanism (one mold wedge mechanism) 1310 and the upper mold cavity block drive mechanism (one mold cavity block drive mechanism) 1301 are used to perform the "one mold cavity block position change step". ". However, the "one model cavity block position changing step" may be performed using only one of the two mechanisms, for example, or may not be used. In addition, the specific method and steps for performing the "one model cavity block position changing step" are not limited to the methods and steps in FIGS. 8 to 12, and may be arbitrary.

Next, as shown in FIG. 13, the first wedge member 1411a of the lower mold is slightly moved in the front end direction (direction of arrow a2). Thus, in consideration of the interference amount of the first substrate 11, the length of the pair of lower die wedges formed by the lower die first wedge member 1411a and the lower die second wedge member 1411b is increased in the thickness direction. At this time, as shown in the figure, the upper mold cavity block holding member 1302 is continuously applied with an upward force by the upper mold cavity block driving mechanism 1301 in the direction of arrow d1.

Next, as shown in FIG. 14, the lower mold 1200 is raised in the direction of arrow X3, and the molding mold is closed again. As a result, the resin molded substrate (object to be molded) 10 is pressed through the mold cavity block 1101 or more via the mold release film 40 (object to be molded pressed step). Furthermore, the inside of the forming mold (inside the upper mold cavity 1106, etc.) is depressurized using a decompression mechanism (not shown). At this time, as shown in FIG. 15, the upward force is continuously applied to the lower mold 1200 in the direction of the arrow X4.

Next, as shown in FIG. 16, the plunger 1212 is moved upward (in the direction of arrow g1 ), and the fluid resin 20b in the groove 1211 is pushed into the upper mold cavity 1106.

Further, as shown in FIG. 17, the exhaust hole pin 1332 is pressed downward (in the direction of arrow h1) by the exhaust hole pin power mechanism 1331, and the exhaust hole groove 1104 is blocked. Thereafter, as shown in the figure, the plunger 1212 is further raised in the direction of arrow g2, and the final filling of the fluid resin 20b in the upward mold cavity 1106 is performed. At this time, the upper mold cavity block 1101 is fixed using the upper mold wedge mechanism 1310 (second mold cavity block fixing step). Further, the lower mold cavity block 1201 is fixed using the lower mold wedge mechanism 1410. In this way, since the upper mold cavity block 1101 and the lower mold cavity block 1201 are fixed, even if resin pressure is applied inside the upper mold cavity 1106, the movement of the upper mold cavity block 1101 and the lower mold cavity block 1201 in the mold opening and closing direction can be suppressed or prevented.

Further, as shown in FIG. 18, after the fluid resin 20b is cured into a cured resin (encapsulating resin) 20 and an excess resin (useless resin) 20d, the lower mold 1200 is lowered in the direction of arrow Y2, and the mold is opened. In addition, the method of curing the fluid resin 20b into the cured resin (encapsulating resin) 20 is not particularly limited. For example, when the fluid resin 20b is a thermosetting resin, it can be cured by further continuous heating. Further, for example, when the fluid resin 20b is a thermoplastic resin, it can be solidified by stopping the heating of the mold and leaving it as it is to cool. In this way, a resin molded product encapsulated by the cured resin (encapsulating resin) 20 between the first substrate 11 and the second substrate 12 can be manufactured. After that, the resin molded product is carried out and recovered by an unloader (not shown) or the like to the outside of the resin molding device 1000.

In addition, in the method of manufacturing a resin molded article of the present invention, the "resin molding step" is not limited to the method described in FIGS. 2 to 18. For example, although examples of transfer molding are shown in FIGS. 2 to 18, in the present invention, other arbitrary resin molding methods such as compression molding can be used. In addition, the method of transfer molding is not limited to the method of FIGS. 2 to 18 and may be arbitrary.

In the present invention, for example, as described in this embodiment, the position of one mold cavity block can be changed according to the thickness of the article to be molded. Thus, since the depth of one mold cavity can be changed, even if the thickness of the molded product varies, molding defects can be suppressed or prevented. Specifically, with the present invention, for example, it is possible to suppress or prevent resin leakage caused by the mold being closed too loosely (the depth of one mold cavity is too large relative to the thickness of the molded product). Furthermore, with the present invention, for example, it is possible to suppress or prevent damage to the molded article caused by the mold being closed too tightly (the depth of one mold cavity is too small relative to the thickness of the molded article). Thus, in the present invention, since the resin molded product can be suppressed or prevented from being defective, the resin molded product can be manufactured with high yield.

In addition, in changing the position of the one model cavity block, for example, the one die wedge mechanism can be used. Also, in the change of the position, the one mold cavity block driving mechanism, the other mold wedge mechanism, etc. may be used as necessary, for example, as explained in this embodiment.

Furthermore, the present invention is not limited to this embodiment, and can be arbitrarily changed. For example, in this embodiment, the "one mold" is an upper mold, and the "other mold" is a lower mold. However, the present invention is not limited to this. For example, on the contrary, the "one mold" may be a lower mold, and the "other mold" may also be an upper mold.

[Example 2]

Next, other embodiments of the present invention will be described.

The resin molding apparatus of the present invention can replace only the molding die with another molding die, for example. Therefore, it is possible to easily cope with resin molding using molding dies of different specifications.

FIG. 19 is a cross-sectional view showing the structure of the same resin molding apparatus 1000 as FIG. 1 (Example 1). The structure of this resin molding apparatus is as explained with reference to FIG. 1.

20 is a schematic view showing that the upper mold 1100 and the lower mold 1200 are removed from the resin molding apparatus 1000 of FIG. 19 (FIG. 1), and the upper mold cavity block position changing mechanism setting section (one mold cavity block position changing mechanism setting section is retained) ) 1300 and a cross-sectional view of the state of the lower model cavity block position changing mechanism setting section (another model cavity block position changing mechanism setting section) 1400. The configurations of the upper mold cavity block position changing mechanism setting section 1300 and the lower mold cavity block position changing mechanism setting section 1400 are as described with reference to FIG. 1.

21 is a cross-sectional view schematically showing the structure of a resin molding apparatus in a state where an upper mold 1100a and a lower mold 1200a different from the apparatus of FIG. 19 (FIG. 1) are mounted in FIG. 20. For the upper mold (one mold) 1100a, the upper mold cavity block (one mold cavity block) 1101 is replaced with the upper mold cavity block (one mold cavity block) 1101a, and the upper mold cavity frame member (a mold cavity frame member) is replaced. 1102 is provided with an upper model cavity frame member (one model cavity frame member) 1102a, instead of the upper model cavity frame member (one model cavity frame member) 1103 and an upper model cavity frame member (one model cavity frame member) 1103a, and an alternative exhaust The hole groove 1104 includes an exhaust hole groove 1104a, a sliding hole 1105a instead of the sliding hole 1105, and an upper mold cavity (one mold cavity) 1106a instead of the upper mold cavity (one mold cavity) 1106. The upper mold 1100a is the same as the upper mold 1100 of FIG. 19 (FIG. 1) except that the shapes and sizes of the parts (for example, the upper mold cavity block and the upper mold cavity frame member) are slightly different. In addition, for the lower mold (another mold) 1200a, a lower mold cavity block (another mold cavity block) 1201 is provided instead of the lower mold cavity block (another mold cavity block) 1201, and a lower mold side block (another (Mold side block) 1202 with a lower mold side block (another mold side block) 1202a, a groove block 1203a instead of a groove block 1203, and a lower mold cavity instead of a lower mold cavity block pillar (another mold cavity block pillar) 1204 The block pillar (another mold cavity block pillar) 1204a is provided with a lower mold elastic member (another mold elastic member) 1205a instead of another mold elastic member (lower mold elastic member) 1205. The lower mold 1200a is the same as the lower mold 1200 of FIG. 19 (FIG. 1) except that the shapes and sizes of the parts (for example, the lower mold cavity block and the groove block) are slightly different.

For example, as shown in FIGS. 19 to 21, by replacing the molding die with a molding die of different specifications, it is also possible to cope with resin molding of different specifications. Specifically, for example, as shown in FIGS. 19-21, the shape of the upper mold cavity block can be changed in accordance with the necessary cavity shape. Also, as shown in Figs. 19 to 21, for example, the shape of the lower mold cavity block can be changed in accordance with the shape of the substrate used. In addition, as shown in FIGS. 19 to 21, for example, the shape of the groove block can be changed according to the number and shape of the resin plates (resin materials) used. Further, for example, the vent opening and closing mechanism can be moved in accordance with the shape of the molding die.

In the resin molding apparatus of the present invention, for example, as shown in FIGS. 1 to 21, the wedge mechanism (wedge mechanism) is not assembled as a part of the molding die, but is constituted separately from the molding die and the wedge mechanism (wedge mechanism). Thus, for example, as shown in FIGS. 19 to 21, even if the wedge-shaped mechanism (wedge mechanism) is not replaced or another wedge-shaped member (wedge) is not prepared, the molding die can be easily replaced. Thus, according to the resin molding apparatus of the present invention, for example, the replacement of the molding die used for the replacement of the types of resin molded products becomes easy.

[Example 3]

Next, other embodiments of the present invention will be described.

In this embodiment, another example of a method of manufacturing a resin molded product using the resin molding device (FIG. 1) of Embodiment 1 will be described.

22 is a cross-sectional view schematically showing one step of the method of manufacturing the resin molded article of the present embodiment. In this figure, the thickness (the height from the lower surface of the first substrate 11 to the upper surface of the second substrate 12) of the substrate (molded product) 10 is different (the thickness on the right side is larger). Except for this, FIGS. 22 and 3 are the same. In addition, although the width of the upper mold cavity 1106 shown in FIGS. 22 and 3 is different, the steps of the method for manufacturing a resin molded product can be performed in the same manner even if the width of the upper mold cavity 1106 is different.

From this state, for example, the same steps as in FIGS. 4 to 5 are performed. As shown in FIG. 23, the lower mold cavity block 1201 and the upper mold cavity frame member 1102 clamp and clamp the first substrate 11. After that, for example, the same steps as those in FIGS. 6 to 8 are performed. As shown in FIG. 24, the position of the upper mold cavity block 1101 in the vertical direction is fixed to this position. As a result, the depths of the upper and lower upper mold cavities 1106 shown in FIG. 24 can be determined separately.

22 to 24 are a part of the steps of the manufacturing method of the resin molded article of this embodiment. The manufacturing method of the resin molded article of this embodiment is more specifically, for example, it can be performed in the same order and procedure as in Embodiment 1 (FIGS. 2 to 18 ).

In addition, in FIGS. 22 to 24, for convenience of illustration and explanation, examples in which the thickness of the substrate (molded product) 10 is different are shown on the left and right sides of the figure. However, in the present invention, examples of responding to changes in the thickness of the object to be molded (moulded product) are not limited to this. Specifically, for example, in the method of manufacturing a primary resin molded product, when the thickness of all objects to be molded is made uniform, and the method of manufacturing the resin molded product is performed again, the thickness of the object to be molded may be changed as necessary Respond.

Further, the present invention is not limited by the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selected for use as needed without departing from the gist of the present invention.

This application claims priority based on Japanese application Japanese Patent Application No. 2017-209713 filed on October 30, 2017, and the entire contents of its disclosure are incorporated herein.

1000‧‧‧Resin molding device

1100‧‧‧ Upper mold (one mold)

1101‧‧‧Upper model cavity block (one model cavity block)

1102‧‧‧Up model cavity frame member (a model cavity frame member)

1103‧‧‧Up model cavity frame member (a model cavity frame member)

1104‧‧‧Vent slot

1105‧‧‧sliding hole

1106‧‧‧Up model cavity (one model cavity)

1200‧‧‧ Lower mold (another mold)

1201‧‧‧Lower model cavity block (another model cavity block)

1202‧‧‧Lower mold side block (another mold side block)

1203‧‧‧Slot block

1204‧‧‧Lower model cavity block pillar (another model cavity block pillar)

1205‧‧‧Lower mold elastic member (another mold elastic member)

1211‧‧‧slot

1212‧‧‧ Plunger

1300‧‧‧Upper model cavity block position changing mechanism setting part (one model cavity block position changing mechanism setting part)

1301‧‧‧Up model cavity block drive mechanism (a model cavity block drive mechanism)

1302‧‧‧Up model cavity block holding member (one model cavity block holding member)

1303‧‧‧force sensor (pressing pressure measuring mechanism)

1304‧‧‧Up model cavity block pillar (one model cavity block pillar)

1310‧‧‧ Upper die wedge mechanism (one die wedge mechanism)

1311a‧‧‧The first wedge member of the upper die (the first wedge member of one die)

1311b‧‧‧ Upper wedge-shaped member (one wedge-shaped member)

1312‧‧‧ Upper die wedge member power transmission member (one die wedge member power transmission member)

1313‧‧‧ Upper die wedge member drive mechanism (one die wedge member drive mechanism)

1321‧‧‧ Upper mold second wedge-shaped member holding member (one mold second wedge-shaped member holding member)

1322‧‧‧Elastic member of the second wedge-shaped member holding member of the upper mold (one member of the elastic member of the second wedge-shaped member holding member)

1330‧‧‧ vent opening and closing mechanism

1331‧‧‧Exhaust pin power mechanism

1332‧‧‧ vent pin

1340‧‧‧Pressing plate (upper model cavity block position changing mechanism setting part base member or a model cavity block position changing mechanism setting part base member)

1341‧‧‧Upper model cavity block position changing mechanism setting part frame member (one model cavity block position changing mechanism setting part frame member)

1342‧‧‧Upper model cavity block position changing mechanism setting part bottom surface member (one model cavity block position changing mechanism setting part bottom surface member)/upper member

1343‧‧‧ Upper model cavity block position changing mechanism setting part bottom surface member (one model cavity block position changing mechanism setting part bottom surface member)/lower member

1400‧‧‧ Lower model cavity block position changing mechanism setting part (another model cavity block position changing mechanism setting part)

1410‧‧‧Lower die wedge mechanism (another die wedge mechanism)

1411a‧‧‧The first wedge member of the lower die (the first wedge member of the other die)

1411b‧‧‧Second wedge member (the second wedge member of the other die)

1412‧‧‧Lower die wedge member power transmission member (another die wedge member power transmission member)

1413‧‧‧Lower die wedge member drive mechanism (another die wedge member drive mechanism)

1421‧‧‧Lower mold mounting member (another mold mounting member)

1422‧‧‧Pressing plate (lower mold second wedge member holding member or another mold second wedge member holding member)

Claims (20)

A resin molding device includes: a molding die; a mold wedge mechanism; and a model cavity block driving mechanism; the foregoing molding die includes a mold and another mold; the foregoing one mold includes a model cavity block and a model cavity frame member; wherein The aforementioned one model cavity frame member is formed with a sliding hole; wherein the aforementioned one model cavity block can move in the sliding hole in the mold opening/closing direction of the aforementioned molding die; wherein the aforementioned one model cavity block can be opposed to the aforementioned another mold And the inner side surface of the aforementioned one model cavity frame member form a model cavity; wherein using the aforementioned one model cavity block drive mechanism can move the aforementioned one model cavity block in the aforementioned mold opening and closing direction; and wherein using the aforementioned one mold wedge mechanism can Fixing the position of the one model cavity block in the opening and closing direction of the mold; sandwiching a part of the molded object by the one model cavity frame member and the other mold, and using the one model cavity block driving mechanism by the aforementioned one The model cavity block and the aforementioned other mold make the portion different from the aforementioned portion of the molded object into a pressed state; for the aforementioned one model whose position is set based on the aforementioned state The cavity block is fixed using the aforementioned one die wedge mechanism to limit its position in the direction away from the aforementioned other die. The resin molding apparatus according to claim 1, wherein the position of the one model cavity block based on the state is compared with that of the object to be molded by the one model cavity block and the other mold The part where the aforementioned part is different becomes a position in a pressed state, and the aforementioned one mold cavity block is set closer to the aforementioned other mold. The resin molding apparatus according to claim 1 or 2, further comprising a pressing force measuring mechanism capable of measuring the pressing force of pressing the aforementioned one model cavity block using the aforementioned one model cavity block driving mechanism. The resin molding device as recited in claim 1 or 2, wherein the aforementioned one die wedge mechanism includes a pair of die wedge members; wherein the aforementioned one pair of die wedge members include a die first wedge member and a die second wedge member; Wherein the first wedge-shaped member of the first mold and the second wedge-shaped member of the first mold respectively have slope surfaces and are arranged so that the slope surfaces face each other; and wherein the first wedge-shaped member and the first mold are moved by moving the first mold At least one of the two wedge members can change the length of the pair of one mold wedge members in the direction of opening and closing of the mold when the first wedge member of the one mold contacts the second wedge member of the one mold. The resin molding apparatus as described in claim 1 or 2, wherein the resin molding apparatus further includes another mold wedge mechanism; wherein the other mold includes another mold cavity block; and wherein the foregoing mold wedge mechanism can be used to fix the foregoing The position of the other mold cavity block in the opening and closing direction of the mold; in the aforementioned state, in order to clamp a part of the object to be molded, the mold cavity frame member and the other mold cavity block are clamped to press The part different from the part of the molded object is pressed by the one model cavity block and the other model cavity block; for the other model cavity block whose position is set based on the state, the other mold is used The wedge mechanism fixes it to limit its position in the direction away from the aforementioned one die. The resin molding apparatus according to claim 5, wherein the position of the other mold cavity block is set based on the above state, as compared with the use of the one mold cavity block and the other mold cavity block The part where the aforementioned part is different becomes the pressed state, and the other model cavity block is set closer to the aforementioned one mold. The resin molding apparatus as recited in claim 5, wherein the aforementioned another die wedge mechanism includes a pair of another die wedge members; the aforementioned pair of another die wedge members includes another die first wedge member and another die second wedge member Member; the aforementioned other die first wedge member and the aforementioned another die second The wedge-shaped members are respectively provided with slope surfaces and are arranged so that the slope surfaces face each other; and wherein by moving at least one of the first wedge member of the one mold and the second wedge member of the one mold, the other mold When the first wedge member contacts the second wedge member of the other mold, the length of the pair of other mold wedge members in the opening and closing direction of the mold is changed. The resin molding apparatus according to claim 4, wherein by changing the length of the pair of one-mold wedge members in the direction of opening and closing of the mold when the first wedge-shaped member of the one mold contacts the second wedge-shaped member of the one mold, The position of the one mold cavity block in the opening and closing direction of the mold can be changed. The resin molding apparatus according to claim 1 or 2, wherein the one mold and the other mold are sandwiched by moving at least one of the one mold and the other mold toward a mold closing direction of the molding mold Holding the object to be molded, and moving the one model cavity block to the object to be molded by using the model cavity block driving mechanism, and pressing the object to be molded with the model cavity block through the release film, and then using The aforementioned one mold wedge mechanism can fix the position of the aforementioned one mold cavity block in the aforementioned mold opening and closing direction. The resin molding device according to claim 1 or 2, wherein after fixing the position of the one mold cavity block, at least one of the one mold and the other mold is moved in the mold opening direction of the mold, and then used The aforementioned one model cavity block driving mechanism and the aforementioned one model wedge shape The mechanism can change and fix the position of the aforementioned one model cavity block. A method for manufacturing a resin molded product is performed by using a resin molding device including a molding die, the foregoing molding die includes a mold and another mold; the foregoing one mold includes a mold cavity block and a mold cavity frame member; and the foregoing mold cavity A sliding hole is formed in the frame member; the one model cavity block can move in the sliding hole in the mold opening and closing direction of the forming mold; the face of the one model cavity block opposite to the other mold and the one model cavity can be used A mold cavity is formed on the inner side of the frame member; the aforementioned another mold includes the aforementioned another mold cavity block; wherein the manufacturing method of the aforementioned resin molded article includes the following steps: a molded article supplying step, supplying the molded article to the molded mold; For the object to be molded supplied to the molding die, a part of the object to be molded is sandwiched between the one model cavity frame member and the other model cavity block, and the one model cavity block and the other one The step of making the mold cavity block make the part different from the previous part of the molded object into a pressed state; fixing the one mold cavity block whose position is set based on the previous state to limit it in the direction away from the other mold The step of the position of the above; the other model of the position that will be set based on the aforementioned state The step of fixing the cavity block to limit its position in the direction away from the aforementioned one mold; and the resin molding step of performing resin molding of the aforementioned object in the aforementioned one mold cavity. The method for manufacturing a resin molded product according to claim 11, wherein the position of the one model cavity block is set based on the above state, as compared with the use of the one model cavity block and the other mold The part where the aforementioned part is different becomes a pressed state, and the aforementioned one model cavity block is set closer to the aforementioned other mold. The method for manufacturing a resin molded product according to claim 11 or 12, wherein the position of the other model cavity block is set based on the above state, as compared to the use of the one model cavity block and the other model cavity block The part different from the part of the object to be molded becomes a pressed state, and the other mold cavity block is set closer to the one mold. The method for manufacturing a resin molded product according to claim 11 or 12, wherein in the aforementioned state, a release film is interposed between the aforementioned one mold cavity block and the aforementioned molded object. The method for manufacturing a resin molded product according to claim 11 or 12, wherein the resin molding device is the resin molding device according to any one of claims 1 to 10. The method for manufacturing a resin molded product as described in claim 11 or 12, further comprising changing another mold cavity block in the aforementioned mold opening and closing direction The position of another model cavity block position changing step. The method for manufacturing a resin molded product according to claim 16, wherein the resin molding device is the resin molding device according to any one of claims 5 to 7. The method for manufacturing a resin molded product as recited in claim 15, further comprising the step of: clamping the object to be molded, by moving at least one of the one mold and the other mold toward the mold closing direction of the mold And the one mold and the other mold are used to hold the object to be molded; the object to be molded is pressed, and the object to be molded is pressed with the one model cavity block through the release film; and a model cavity block fixing step is fixed The position of the aforementioned one model cavity block; wherein in the aforementioned one model cavity block position changing step, the aforementioned one model cavity block driving mechanism is used to move the aforementioned one model cavity block toward the molded object; in the aforementioned molded object pressing step , Using the aforementioned one model cavity block driving mechanism, pressing the aforementioned molded object with the aforementioned one model cavity block through the release film; after the aforementioned molded object pressing step, in the aforementioned one model cavity block fixing step, the aforementioned one is used The mold wedge mechanism fixes the position of the one mold cavity block in the mold opening and closing direction. The method for manufacturing a resin molded product as described in claim 11 or 12, further includes the following steps: In the second mold cavity block position changing step, after the previous one mold cavity block fixing step, at least one of the one mold and the other mold is moved in the mold opening direction of the molding mold, and then, the previous one is used The model cavity block driving mechanism changes the position of the aforementioned one model cavity block; and the second model cavity block fixing step uses the aforementioned one model wedge mechanism to fix the position of the aforementioned one model cavity block. The method for manufacturing a resin molded product according to claim 11 or 12, wherein the object to be molded includes a plurality of substrates; and wherein the object to be molded is resin-encapsulated between each of the plurality of substrates Perform resin molding.

Images