TWI677934B - Apparatus for inspecting exterior of semiconductor device - Google Patents
Apparatus for inspecting exterior of semiconductor device Download PDFInfo
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- TWI677934B TWI677934B TW107111847A TW107111847A TWI677934B TW I677934 B TWI677934 B TW I677934B TW 107111847 A TW107111847 A TW 107111847A TW 107111847 A TW107111847 A TW 107111847A TW I677934 B TWI677934 B TW I677934B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
Abstract
本發明涉及一種半導體器件外觀檢查裝置。第一視覺檢查儀對容納於從所述加載部移送的托盤的各個半導體器件的第一表面進行檢查。第二視覺檢查儀對經過傳送器在上下翻轉的狀態下容納於托盤的各個半導體器件的第二表面進行檢查。第一拾取器將經過所述第二視覺檢查儀的半導體器件從相關托盤以行單位拾取多個來沿行向移送到第一側面檢查區域，然後將半導體器件返回到相關托盤。第三視覺檢查儀對移送到所述第一側面檢查區域的各個半導體器件的第三表面和第四表面進行檢查。第二拾取器將經過所述第三視覺檢查儀的半導體器件從相關托盤以列單位拾取多個並以垂直軸為中心旋轉90度來沿行向移送到第二側面檢查區域，然後返回到相關托盤。第四視覺檢查儀對移送到所述第二側面檢查區域的各個半導體器件的第五表面和第六表面進行檢查。The invention relates to an appearance inspection device for a semiconductor device. The first visual inspection device inspects a first surface of each semiconductor device accommodated in a tray transferred from the loading section. The second visual inspection device inspects the second surface of each semiconductor device accommodated in the tray through the conveyor in an upside-down state. The first picker picks up a plurality of semiconductor devices that have passed through the second visual inspection device from a related tray in a row unit to move them in a row direction to the first side inspection area, and then returns the semiconductor devices to the related tray. The third visual inspection device inspects the third surface and the fourth surface of each semiconductor device transferred to the first side inspection area. The second picker picks up a plurality of semiconductor devices that have passed through the third visual inspection device from the relevant tray in column units and rotates 90 degrees around the vertical axis to move in a row direction to the second side inspection area, and then returns to the relevant tray. The fourth visual inspection device inspects the fifth surface and the sixth surface of each semiconductor device transferred to the second side inspection area.
Description
發明領域 本發明涉及將半導體器件的各個外觀檢查並分類的半導體器件外觀檢查裝置。FIELD OF THE INVENTION The present invention relates to a semiconductor device appearance inspection apparatus that inspects and classifies individual appearances of semiconductor devices.
發明背景 半導體器件通過半導體工藝製造，然後在出貨之前經過檢查。也就是說，如果不僅存在封裝內部的缺陷還存在外部缺陷，則對半導體器件的性能有嚴重影響。因此，不僅對半導體器件進行電氣操作檢查，還對半導體器件進行包括外觀檢查的各種檢查。BACKGROUND OF THE INVENTION Semiconductor devices are manufactured by a semiconductor process and then inspected before shipment. That is, if there are not only defects inside the package but also external defects, the performance of the semiconductor device will be seriously affected. Therefore, not only the electrical operation inspection of the semiconductor device but also various inspections including the appearance inspection of the semiconductor device are performed.
另一方面，隨着半導體器件的封裝方法越來越尖端化，需要精確的檢查技術。例如，球柵陣列（BGA）型半導體器件以六面體形式封裝，並且呈焊球排列在一側表面的形狀。以往通常主要進行焊球的尺寸檢查。On the other hand, as semiconductor packaging methods become more sophisticated, precise inspection techniques are required. For example, a ball grid array (BGA) type semiconductor device is packaged in the form of a hexahedron and has a shape in which solder balls are arranged on one side surface. In the past, dimensional inspection of solder balls was mainly performed.
然而，為了對半導體器件的精密外觀檢查，有時還需要進行用於檢查半導體器件的剩餘表面的裂紋、氣泡、金屬暴露、划痕、異物等的表面檢查和針對刻在半導體器件表面的識別碼的標記檢查。However, for precise appearance inspection of semiconductor devices, it is sometimes necessary to perform surface inspections to inspect cracks, bubbles, metal exposure, scratches, foreign objects, etc. on the remaining surface of the semiconductor device and identification codes for the surface of the semiconductor device. Check mark.
在此情況下，半導體器件外觀檢查裝置需要被設置成使得，在對半導體器件的所有六個表面進行外觀檢查之後，根據檢查的結果快速且高效地自動進行分類合格產品和不合格產品的工作。In this case, the appearance inspection device of the semiconductor device needs to be set such that after appearance inspection is performed on all six surfaces of the semiconductor device, the work of sorting qualified products and unqualified products is performed quickly and efficiently according to the results of the inspection.
發明要解決的問題 本發明的目的在於，提供能夠對半導體器件的各個六個表面快速且高效地自動進行外觀檢查和分類工作的半導體器件外觀檢查裝置。 用於解決問題的方案Problem to be Solved by the Invention An object of the present invention is to provide a semiconductor device appearance inspection device capable of quickly and efficiently automatically performing appearance inspection and classification work on each of six surfaces of a semiconductor device. Solution to Problem
為了達到上述目的，根據本發明的半導體器件外觀檢查裝置包括主體、托盤放置台、第一、第二、第三、第四及第五托盤載體部、第一視覺檢查儀、傳送器、第二視覺檢查儀、第一拾取器、第三視覺檢查儀、第二拾取器、第四視覺檢查儀及分選部。托盤放置檯布置在主體的前方，且包括：加載部，供容納有待檢查的半導體器件的托盤放置；空托盤供應部，供空托盤放置；不合格產品存儲部，供容納有分為不合格產品的半導體器件的托盤放置；托盤存儲部，供在分類過程中都排出半導體器件或只剩下不合格產品的半導體器件的托盤放置；及卸載部，供容納有分為合格產品的半導體器件的托盤放置。In order to achieve the above object, a semiconductor device appearance inspection device according to the present invention includes a main body, a tray placing table, first, second, third, fourth, and fifth tray carrier sections, a first visual inspection device, a conveyor, and a second A visual inspector, a first pickup, a third visual inspector, a second pickup, a fourth visual inspector, and a sorting unit. The tray placing table is arranged in front of the main body, and includes: a loading section for placing trays containing semiconductor devices to be inspected; an empty tray supplying section for placing empty trays; a non-conforming product storage section for accommodating divided products Tray placement of semiconductor devices; tray storage section for tray placement of semiconductor devices that are discharged during the sorting process or semiconductor devices with only defective products left; and unloading section for trays containing semiconductor devices classified as qualified products Place.
第一、第二、第三、第四及第五托盤載體部分別連接到加載部、空托盤供應部、不合格產品存儲部、托盤存儲部及卸載部，以移送相關托盤。第一視覺檢查儀對容納於從加載部移送的托盤的各個半導體器件的第一表面進行檢查。傳送器以能夠往返第一、第二、第三、第四及第五托盤載體部之間的方式設置在主體的後方上側，並使經過第一視覺檢查儀的半導體器件上下翻轉來轉移到空托盤。第二視覺檢查儀對經過傳送器在上下翻轉的狀態下容納於托盤的各個半導體器件的第二表面進行檢查。第一拾取器在主體的上側向與左右方向平行的行方向往返，並將經過第二視覺檢查儀的半導體器件從相關托盤以行單位拾取多個來沿行向移送到第一側面檢查區域，然後將半導體器件返回到相關托盤。第三視覺檢查儀對在被第一拾取器拾取的狀態下移送到第一側面檢查區域的各個半導體器件的第三表面和第四表面進行檢查。第二拾取器在主體的上側向與左右方向平行的行方向往返，並將經過第三視覺檢查儀的半導體器件從相關托盤以列單位拾取多個並以垂直軸為中心旋轉90度來沿行向移送到第二側面檢查區域，然後返回到相關托盤。第四視覺檢查儀對在被第二拾取器拾取的狀態下移送到第二側面檢查區域的各個半導體器件的第五表面和第六表面進行檢查。分選部與第二拾取器連接來將已經完成檢查的半導體器件分為合格產品和不合格產品並容納於相關托盤。 發明的效果The first, second, third, fourth, and fifth tray carrier sections are respectively connected to the loading section, the empty tray supply section, the defective product storage section, the tray storage section, and the unloading section to transfer the relevant trays. The first visual inspection device inspects the first surface of each semiconductor device accommodated in the tray transferred from the loading section. The conveyor is provided on the upper rear side of the main body so as to be able to move between the first, second, third, fourth and fifth tray carrier portions, and the semiconductor device passing through the first visual inspection device is turned upside down to transfer to the empty space. tray. The second visual inspection device inspects the second surface of each semiconductor device accommodated in the tray through the conveyor in an upside-down state. The first picker reciprocates in a row direction parallel to the left and right directions on the upper side of the main body, and picks up a plurality of semiconductor devices that have passed through the second visual inspection unit from the relevant tray in row units to move to the first side inspection area in the row direction. The semiconductor device is then returned to the relevant tray. The third visual inspection device inspects the third surface and the fourth surface of each semiconductor device that are transferred to the first side inspection area in a state of being picked up by the first picker. The second picker reciprocates in a row direction parallel to the left and right directions on the upper side of the main body, and picks up a plurality of semiconductor devices that have passed through the third visual inspection device from the relevant tray in column units and rotates 90 degrees around the vertical axis to move along the row Move to the second side inspection area and return to the relevant tray. The fourth visual inspection device inspects the fifth surface and the sixth surface of each semiconductor device that has been transferred to the second side inspection area in the state picked up by the second picker. The sorting unit is connected to the second picker to classify the semiconductor devices that have been inspected into qualified products and unqualified products and store them in relevant trays. Effect of the invention
根據本發明，能夠對半導體器件的所有各個六個表面快速且高效地自動進行外觀檢查和分類工作。According to the present invention, it is possible to automatically and quickly perform an appearance inspection and sorting work on all six surfaces of the semiconductor device.
較佳實施例之詳細說明 下面，將參照附圖對本發明進行具體說明。其中，對於相同或類似的結構要素，標註相同的附圖標記，並且，在說明本發明時，省略重複的說明，且判斷與本發明相關的公知技術和構成的具體說明為不必需地或混淆本發明的要旨，省略其詳細說明。本發明的實施例是為了更加完整地向本發明所屬技術領域的普通技術人員說明本發明而提供的。因此，為了說明的明了性，可能對附圖所示的構成要素的形狀和大小等進行放大表現或簡單化表現。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the drawings. Wherein, the same or similar structural elements are marked with the same reference numerals, and redundant descriptions are omitted when describing the present invention, and it is judged that the specific description of the publicly known technologies and structures related to the present invention is unnecessary or confusing. The gist of the present invention is omitted from the detailed description. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art to which the present invention pertains. Therefore, for clarity of description, the shape, size, and the like of the constituent elements shown in the drawings may be enlarged or simplified.
圖1為根據本發明的一實施例的半導體器件外觀檢查裝置的立體圖。圖2為圖1的平面圖。圖3為圖1中示出的半導體器件外觀檢查裝置的示意性結構圖。FIG. 1 is a perspective view of a semiconductor device appearance inspection apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of FIG. 1. FIG. 3 is a schematic structural diagram of a semiconductor device appearance inspection device shown in FIG. 1.
參照圖1至圖3，半導體器件外觀檢查裝置包括主體100、托盤放置台200、第一托盤載體部310、第二托盤載體部320、第三托盤載體部330、第四托盤載體部340及第五托盤載體部350、第一視覺檢查儀410、第二視覺檢查儀420、第三視覺檢查儀430及第四視覺檢查儀440、傳送器500、第一拾取器600、第二拾取器700及分選部800。1 to 3, a semiconductor device appearance inspection device includes a main body 100, a tray placing table 200, a first tray carrier portion 310, a second tray carrier portion 320, a third tray carrier portion 330, a fourth tray carrier portion 340, and a first Five-tray carrier section 350, first visual inspection instrument 410, second visual inspection instrument 420, third visual inspection instrument 430 and fourth visual inspection instrument 440, conveyor 500, first pickup 600, second pickup 700, and Sorting Department 800.
托盤放置台200布置在主體100的前方。托盤放置台200包括加載部210、空托盤供應部220、不合格產品存儲部230、托盤存儲部240及卸載部250。The tray placing table 200 is arranged in front of the main body 100. The tray placing table 200 includes a loading section 210, an empty tray supply section 220, a defective product storage section 230, a tray storage section 240, and an unloading section 250.
加載部210供容納有待檢查的半導體器件的托盤放置。其中，若半導體器件為球柵陣列（BGA）型，則半導體器件可以被封裝為六面體並且呈一側表面上排列有焊球的形狀。半導體器件可以在形成有錫球的表面朝向上方的狀態下容納於托盤。The loading section 210 is used for placing a tray containing semiconductor devices to be inspected. Wherein, if the semiconductor device is a ball grid array (BGA) type, the semiconductor device can be packaged as a hexahedron and has a shape in which solder balls are arranged on one surface. The semiconductor device can be housed in a tray with the surface on which the solder balls are formed facing upward.
空托盤供應部220供空托盤放置。空托盤供應部220的空托盤可以被供應到分選部800的第一待機區域810並用於容納相當於不合格產品的半導體器件，或可以被供應到傳送器500並用於使半導體器件上下翻轉。The empty tray supply unit 220 is used for placing empty trays. The empty tray of the empty tray supply section 220 may be supplied to the first standby area 810 of the sorting section 800 and used to accommodate a semiconductor device equivalent to a defective product, or may be supplied to the conveyor 500 and used to turn the semiconductor device upside down.
不合格產品存儲部230供容納有分為不合格產品的半導體器件的托盤放置。不合格產品存儲部230可以從第一待機區域810接受容納有分為不合格產品的半導體器件的托盤T1來放置。第一待機區域810的托盤T1可以由相當於不合格產品的半導體器件填滿，並移送到不合格產品存儲部230。The defective product storage section 230 is used for placing a tray containing semiconductor devices classified as defective products. The defective product storage unit 230 may receive and place the tray T1 containing semiconductor devices classified as defective products from the first standby area 810. The tray T1 in the first standby area 810 may be filled with a semiconductor device corresponding to a defective product and transferred to the defective product storage section 230.
托盤存儲部240供在分類過程中都排出半導體器件或只剩下不合格產品的半導體器件的托盤放置。托盤存儲部240可以從緩衝區域830接受託盤T3並放置。其中，托盤T3可以處於在分類過程中都排出半導體器件而空的狀態，或處於只剩下不合格產品的半導體器件的狀態。The tray storage section 240 is used for placing trays for which semiconductor devices are discharged during the sorting process or semiconductor devices with only defective products remaining. The tray storage unit 240 can receive the tray T3 from the buffer area 830 and place it. Among them, the tray T3 may be in a state where all the semiconductor devices are discharged during the sorting process, or in a state where only the semiconductor devices of the defective products are left.
或者，可以在容納於緩衝區域830的托盤T3的半導體器件中僅一種不合格產品被移送到第一待機區域810的托盤T1，而另一種類的不合格產品留在緩衝區域830的托盤T3且被移送到托盤存儲部240並放置。在此情況下，半導體器件可以分為兩種不合格產品，因此，具有焊球缺陷的嚴重不合格產品可被廢棄，並且具有標記缺陷的不合格產品可通過返工可以再生。Alternatively, in the semiconductor device accommodated in the tray T3 of the buffer area 830, only one defective product may be transferred to the tray T1 of the first standby area 810, and another type of defective product may remain on the tray T3 of the buffer area 830 and It is transferred to the tray storage section 240 and placed. In this case, the semiconductor device can be divided into two types of non-conforming products. Therefore, a severely non-conforming product having a solder ball defect can be discarded, and a non-conforming product having a marking defect can be recycled by rework.
卸載部250供容納有分為合格產品的半導體器件的托盤放置。卸載部250可以從第二待機區域820接受容納有分為合格產品的半導體器件的托盤T2並放置。容納於第二待機區域820的托盤T2的合格產品的半導體器件可以包裝在包裝部(圖中未示出)。The unloading section 250 is used for placing a tray containing semiconductor devices classified into qualified products. The unloading unit 250 may receive and place the tray T2 containing the semiconductor devices classified as qualified products from the second standby area 820. The semiconductor devices of the qualified products accommodated in the tray T2 of the second standby area 820 may be packed in a packaging section (not shown in the figure).
第一托盤載體部310、第二托盤載體部320、第三托盤載體部330、第四托盤載體部340及第五托盤載體部350分別連接到加載部210、空托盤供應部220、不合格產品存儲部230、托盤存儲部240及卸載部250來移送托盤。第一托盤載體部310、第二托盤載體部320、第三托盤載體部330、第四托盤載體部340及第五托盤載體部350可以向左右方向排列。The first tray carrier section 310, the second tray carrier section 320, the third tray carrier section 330, the fourth tray carrier section 340, and the fifth tray carrier section 350 are connected to the loading section 210, the empty tray supply section 220, and the defective products, respectively. The storage unit 230, the tray storage unit 240, and the unloading unit 250 transfer the tray. The first tray carrier portion 310, the second tray carrier portion 320, the third tray carrier portion 330, the fourth tray carrier portion 340, and the fifth tray carrier portion 350 may be aligned in the left-right direction.
第一托盤載體部310將放置在加載部210的托盤移送到主體100的後方。第二托盤載體部320將放置在空托盤供應部220的托盤移送到主體100的後方。第三托盤載體部330將托盤從主體100的後方經過第一待機區域810移送到不合格產品存儲部230。第四托盤載體部340將托盤從主體100的後方經過緩衝區域830移送到托盤存儲部240。第五托盤載體部350將托盤從主體100的後方經過第二待機區域820移送到卸載部250。The first tray carrier section 310 moves a tray placed on the loading section 210 to the rear of the main body 100. The second tray carrier section 320 moves the tray placed in the empty tray supply section 220 to the rear of the main body 100. The third tray carrier section 330 moves the tray from the rear of the main body 100 through the first standby area 810 to the defective product storage section 230. The fourth tray carrier section 340 moves the tray from the rear of the main body 100 to the tray storage section 240 through the buffer area 830. The fifth tray carrier section 350 moves the tray from the rear of the main body 100 to the unloading section 250 through the second standby area 820.
第一托盤載體部310可以包括可移動塊、導軌及線性致動器，所述可移動塊在供托盤安置的狀態下向主體100的前後方向線性往複，所述導軌引導可移動塊的線性往複，所述線性致動器使可移動塊線性往複。線性致動器可以包括通過螺絲連接到可移動塊的下側的滾珠絲杠和用於使滾珠絲杠旋轉的旋轉馬達。The first tray carrier portion 310 may include a movable block, a guide rail, and a linear actuator, the movable block linearly reciprocating in the front-back direction of the main body 100 in a state where the tray is placed, and the guide rail guides the linear reciprocation of the movable block. The linear actuator reciprocates the movable block linearly. The linear actuator may include a ball screw connected to the lower side of the movable block by a screw, and a rotary motor for rotating the ball screw.
第二托盤載體部320、第三托盤載體部330、第四托盤載體部340及第五托盤載體部350也可以與第一托盤載體部310相同地構成。第一托盤載體部310、第二托盤載體部320、第三托盤載體部330、第四托盤載體部340及第五托盤載體部350可以由整體上控制半導體器件外觀檢查裝置的控制部控制。The second tray carrier section 320, the third tray carrier section 330, the fourth tray carrier section 340, and the fifth tray carrier section 350 may be configured similarly to the first tray carrier section 310. The first tray carrier section 310, the second tray carrier section 320, the third tray carrier section 330, the fourth tray carrier section 340, and the fifth tray carrier section 350 may be controlled by a control section that controls the appearance inspection device of the semiconductor device as a whole.
第一視覺檢查儀410對容納於從加載部210通過第一托盤載體部310移送的托盤的各個半導體器件的第一表面進行檢查。半導體器件的第一表面相當於形成有錫球的表面。第一視覺檢查儀410的攝像部位被布置成朝向下方，以便能夠對容納於托盤的半導體器件的第一表面的錫球的狀態等進行二維檢查。The first visual inspection device 410 inspects the first surface of each semiconductor device stored in a tray transferred from the loading section 210 through the first tray carrier section 310. The first surface of the semiconductor device corresponds to a surface on which a solder ball is formed. The imaging portion of the first visual inspection device 410 is arranged to face downward so that the state of the solder balls and the like on the first surface of the semiconductor device accommodated in the tray can be inspected in two dimensions.
第一視覺檢查儀410可設置在主體100的上側以向左右方向水平往還。第一視覺檢查儀410可以沿着固定在主體100的上側的圓柱向左右方向可滑動地被支撐，且可以通過線性致動器水平往還。線性致動器可以為常規的線性致動器。第一視覺檢查儀410可以包括照相機和用於處理從照相機拍攝的圖像的圖像處理裝置。圖像處理裝置可以搭載於控制部。第一視覺檢查器410可以包括照明器，以在由照明器照明半導體器件的第一表面的狀態下進行攝像。The first visual inspection device 410 may be disposed on the upper side of the main body 100 to return it horizontally in the left-right direction. The first visual inspection device 410 may be slidably supported in a left-right direction along a cylinder fixed on the upper side of the main body 100, and may be returned horizontally by a linear actuator. The linear actuator may be a conventional linear actuator. The first visual inspection device 410 may include a camera and an image processing device for processing an image captured from the camera. The image processing device may be mounted on a control unit. The first visual inspector 410 may include an illuminator to perform imaging in a state where the first surface of the semiconductor device is illuminated by the illuminator.
傳送器500以能夠往返第一托盤載體部310、第二托盤載體部320、第三托盤載體部330、第四托盤載體部340及第五托盤載體部350之間的方式設置在主體100的後方上側。傳送器500使經過第一視覺檢查儀410的半導體器件上下翻轉來轉移到空托盤。The conveyor 500 is provided at the rear of the main body 100 so as to be able to travel between the first tray carrier portion 310, the second tray carrier portion 320, the third tray carrier portion 330, the fourth tray carrier portion 340, and the fifth tray carrier portion 350. Upside. The conveyor 500 flips the semiconductor device passing through the first visual inspection device 410 up and down to transfer to the empty tray.
即，傳送器500將空托盤上下翻轉並堆積在容納有經過第一視覺檢查儀410的半導體器件的托盤的上部，然後在堆積的狀態下上下翻轉，從而可以執行將上下翻轉的半導體器件轉移到空托盤，並將其移送到第二視覺檢查儀420的功能。傳送器500由控制部控制。傳送器500的構成將在後面描述。That is, the conveyor 500 flips up and down the empty trays on the upper part of the tray containing the semiconductor devices passing through the first visual inspection device 410, and then flips up and down in a stacked state, so that the semiconductor devices flipped up and down can be transferred to The function of emptying the tray and transferring it to the second visual inspection device 420. The conveyor 500 is controlled by a control unit. The configuration of the conveyor 500 will be described later.
第二視覺檢查儀420對經過傳送器500在上下翻轉的狀態下容納於托盤的各個半導體器件的第二表面進行檢查。半導體器件的第二表面相當於與形成有錫球的表面相反側的表面。The second visual inspection device 420 inspects the second surface of each semiconductor device accommodated in the tray through the conveyor 500 in an upside-down state. The second surface of the semiconductor device corresponds to a surface on the opposite side to the surface on which the solder balls are formed.
第二視覺檢查儀420對容納於經過第一視覺檢查儀410移送到分選部800的托盤的各個半導體器件的第二表面進行檢查。例如，雖然圖中未示出，當標記部設置在第一視覺檢查儀410和第二視覺檢查儀420之間並且在半導體器件的第二表面上標記識別碼時，第二視覺檢查儀420可以對半導體器件的第二表面的標記狀態進行二維檢查。由第二視覺檢查儀420攝像的圖像可以被圖像處理裝置處理。The second visual inspection device 420 inspects the second surface of each semiconductor device stored in a tray transferred to the sorting unit 800 through the first visual inspection device 410. For example, although not shown in the figure, when the marking portion is provided between the first visual inspection device 410 and the second visual inspection device 420 and the identification code is marked on the second surface of the semiconductor device, the second visual inspection device 420 may The two-dimensional inspection of the marking state of the second surface of the semiconductor device is performed. An image captured by the second visual inspection device 420 may be processed by an image processing device.
第二視覺檢查儀420設置在主體100的上側以向左右方向水平往還，從而可以在第二托盤載體部320與第三托盤載體部330之間往還。第二視覺檢查儀420可以沿着固定在主體100的上側的圓柱向左右方向可滑動地被支撐，且可以通過線性致動器水平往還。線性致動器可以為常規的線性致動器。第二視覺檢查儀420可以與第一視覺檢查儀410相同地構成。第二視覺檢查儀420可以包括照明器，以在由照明器照明半導體器件的第二表面的狀態下進行攝像。The second visual inspection device 420 is provided on the upper side of the main body 100 to return horizontally in the left-right direction, so that it can return between the second tray carrier portion 320 and the third tray carrier portion 330. The second visual inspection device 420 can be slidably supported in a left-right direction along a cylinder fixed on the upper side of the main body 100, and can be returned horizontally by a linear actuator. The linear actuator may be a conventional linear actuator. The second visual inspection device 420 may be configured in the same manner as the first visual inspection device 410. The second visual inspection device 420 may include an illuminator to perform imaging in a state where the second surface of the semiconductor device is illuminated by the illuminator.
第一拾取器600在主體100的上側向與左右方向平行的行方向往返。第一拾取器600將經過第二視覺檢查儀420的半導體器件從相關托盤以行單位拾取多個來沿行向移送到第一側面檢查區域，然後將半導體器件返回到相關托盤。The first pickup 600 reciprocates in a row direction parallel to the left-right direction on the upper side of the main body 100. The first picker 600 picks up a plurality of semiconductor devices that have passed through the second visual inspection device 420 from the relevant tray in a row unit to move them in a row direction to the first side inspection area, and then returns the semiconductor devices to the relevant tray.
當半導體元件被以行單位拾取多個時，朝向列方向的各個兩個側面都被同時暴露。由於與第一托盤載體部310、第二托盤載體部320、第三托盤載體部330、第四托盤載體部340及第五托盤載體部350及第三視覺檢查儀430之間的布置關係，半導體器件最優選具有在行方向上移送的路徑，以便使暴露的兩個側面經過檢查。因此，第一拾取器600被設置成使得在以行單位拾取半導體器件的狀態下沿行向移送半導體器件。When a plurality of semiconductor elements are picked up in a row unit, each of the two side surfaces facing the column direction are simultaneously exposed. Due to the arrangement relationship with the first tray carrier portion 310, the second tray carrier portion 320, the third tray carrier portion 330, the fourth tray carrier portion 340, the fifth tray carrier portion 350, and the third visual inspection device 430, the semiconductor The device most preferably has a path that moves in the row direction so that the exposed two sides are inspected. Therefore, the first picker 600 is provided so that the semiconductor devices are transferred in a row direction in a state where the semiconductor devices are picked up in a row unit.
例如，參照圖4和圖5，第一拾取器600可以包括噴嘴組裝體610、噴嘴組裝體升降機構620及拾取器基座630。噴嘴組裝體610包括沿行向排列成一列的多個噴嘴611。各個噴嘴611通過氣動供給裝置接收負壓以吸附半導體器件，並且可以通過氣動供給裝置接收正壓以脫附半導體器件。噴嘴611可以一次從托盤拾取多個半導體器件並將所述半導體器件移送到第一側面檢查區域。For example, referring to FIGS. 4 and 5, the first pickup 600 may include a nozzle assembly 610, a nozzle assembly lifting mechanism 620, and a pickup base 630. The nozzle assembly 610 includes a plurality of nozzles 611 arranged in a row in a row direction. Each nozzle 611 receives a negative pressure through a pneumatic supply device to adsorb a semiconductor device, and can receive a positive pressure through a pneumatic supply device to desorb the semiconductor device. The nozzle 611 may pick up a plurality of semiconductor devices from a tray at a time and move the semiconductor devices to a first side inspection area.
通過噴嘴升降機構，噴嘴611能夠獨立於噴嘴基座612而上下動作。噴嘴升降機構可以包括噴嘴升降體613和彈性構件（圖中未示出）。噴嘴升降體613在固定噴嘴611的狀態下以能夠相對於噴嘴基座612升降的方式被支撐。噴嘴升降部件613通過氣動供給部件接收氣壓並下降。The nozzle lifting mechanism allows the nozzle 611 to move up and down independently of the nozzle base 612. The nozzle lifting mechanism may include a nozzle lifting body 613 and an elastic member (not shown in the drawings). The nozzle raising and lowering body 613 is supported so that it can raise and lower with respect to the nozzle base 612 in the state which fixed the nozzle 611. The nozzle raising and lowering member 613 receives the air pressure through the pneumatic supply member and descends.
彈性構件在使噴嘴升降體613相對於噴嘴基體612上升的方向上施加彈力，使得當施加於噴嘴升降體613的氣壓被解除時，噴嘴升降體613上升至原來的高度。因此，噴嘴611能夠根據噴嘴升降體613的升降動作而上下動作。The elastic member applies an elastic force in a direction that raises the nozzle raising and lowering body 613 relative to the nozzle base 612 so that when the air pressure applied to the nozzle raising and lowering body 613 is released, the nozzle raising and lowering body 613 rises to the original height. Therefore, the nozzle 611 can move up and down in accordance with the lifting operation of the nozzle lifting body 613.
噴嘴組裝體610可以包括節距可變機構640，所述節距可變機構640以與容納在托盤的半導體器件之間的節距匹配的方式改變噴嘴611之間的節距。節距可變機構640包括可變移動體641、摺疊連桿642及連桿致動器643。可變移動體641在彼此隔開的狀態下分別固定在噴嘴基座612，且沿行向可滑動地支撐在噴嘴支架614。The nozzle assembly 610 may include a variable pitch mechanism 640 that changes the pitch between the nozzles 611 in a manner that matches the pitch between the semiconductor devices housed in the tray. The variable pitch mechanism 640 includes a variable moving body 641, a folding link 642, and a link actuator 643. The variable moving bodies 641 are respectively fixed to the nozzle base 612 while being spaced apart from each other, and are slidably supported by the nozzle holder 614 in the row direction.
摺疊連桿642可以包括第一連桿構件642a和第二連桿構件642b，所述第一連桿構件642a以之字形鉸接，所述第二連桿構件642b以之字形鉸接並與第一連桿構件642a對稱地分別交叉的中心部分鉸接。第一連桿構件642a和第二連桿構件642b的中心鉸接部分分別可以固定在可變移動體641。The folding link 642 may include a first link member 642a and a second link member 642b, the first link member 642a is hinged in a zigzag, and the second link member 642b is hinged in a zigzag and connected to the first The central portions of the lever members 642a that cross each other symmetrically are hinged. The central hinge portions of the first link member 642a and the second link member 642b may be fixed to the variable moving body 641, respectively.
摺疊連桿642使第一連桿構件642a的鉸接部分被摺疊並使第二連桿構件642b的鉸接部分被摺疊，使得隨着第一連桿構件642a和第二連桿構件642b之間的中心鉸接部彼此靠近或遠離，噴嘴611之間的節距可以減小或增加。結果，噴嘴611之間的間距可以改變。The folding link 642 causes the hinged portion of the first link member 642a to be folded and the hinged portion of the second link member 642b to be folded such that with the center between the first link member 642a and the second link member 642b The hinges are close to or far from each other, and the pitch between the nozzles 611 can be reduced or increased. As a result, the interval between the nozzles 611 can be changed.
連桿致動器643通過使第一連桿構件642a和第二連桿構件642b的中心鉸接部分沿行嚮往復來摺疊摺疊連桿642。連桿致動器643可以是包括螺桿和旋轉馬達的致動器，或者是氣缸或直線馬達等常規的線性致動器等。The link actuator 643 folds the folding link 642 by reciprocating the center hinge portions of the first link member 642a and the second link member 642b in the row direction. The link actuator 643 may be an actuator including a screw and a rotary motor, or a conventional linear actuator such as a cylinder or a linear motor.
噴嘴組裝體升降機構620使噴嘴組裝體610相對於拾取器基座630升降動作並使噴嘴611同時升降，從而一次能拾取或摘下半導體器件。噴嘴組裝體升降機構620可以包括升降塊621和升降致動器622。升降塊621在固定於噴嘴組裝體610的噴嘴支架614的狀態下以能夠升降的方式支撐在拾取器基座630。升降致動器622使升降塊621相對於拾取器基座630升降移動。升降致動器622可以為常規的致動器。The nozzle assembly lifting mechanism 620 raises and lowers the nozzle assembly 610 relative to the picker base 630 and raises and lowers the nozzle 611 at the same time, so that the semiconductor device can be picked up or removed at one time. The nozzle assembly lifting mechanism 620 may include a lifting block 621 and a lifting actuator 622. The elevating block 621 is supported by the pickup base 630 so as to be able to elevate in a state of being fixed to the nozzle holder 614 of the nozzle assembly 610. The lifting actuator 622 moves the lifting block 621 up and down relative to the pickup base 630. The lift actuator 622 may be a conventional actuator.
拾取器基座630以能夠沿行向滑動地支撐在固定於主體100的上側的圓柱，以便通過線性致動器水平往還，使得噴嘴組裝體610水平往還。線性致動器可以為常規的線性致動器。上述第一拾取器600由控制部控制。The picker base 630 is slidably supported in a column that is fixed to the upper side of the main body 100 in a row direction so as to be returned horizontally by a linear actuator so that the nozzle assembly 610 is returned horizontally. The linear actuator may be a conventional linear actuator. The first pickup 600 is controlled by a control unit.
第三視覺檢查儀430對在被第一拾取器600拾取的狀態下移送到第一側面檢查區域的各個半導體器件的第三表面和第四表面進行檢查。半導體器件的第三表面和第四表面相當於以容納於托盤的半導體器件為基準在半導體器件的四個表面中朝向列向的兩個側面。The third visual inspection device 430 inspects the third surface and the fourth surface of each semiconductor device that has been transferred to the first side inspection area in the state picked up by the first pickup 600. The third surface and the fourth surface of the semiconductor device correspond to two side surfaces facing the column direction among the four surfaces of the semiconductor device with reference to the semiconductor device accommodated in the tray.
若半導體器件被第一拾取器600以行單位拾取多個並移送到第一側面檢查區域，則各個第三表面和第四表面被暴露。第三視覺檢查儀430對暴露的半導體器件的第三表面和第四表面進行檢查。第三視覺檢查儀430可以對半導體器件的第三表面和第四表面的裂紋、氣泡、金屬暴露、划痕、異物等進行二維檢查。If a plurality of semiconductor devices are picked up by the first picker 600 in units of rows and transferred to the first side inspection area, each of the third surface and the fourth surface is exposed. The third visual inspection device 430 inspects the third surface and the fourth surface of the exposed semiconductor device. The third visual inspection device 430 can perform two-dimensional inspection on cracks, bubbles, metal exposure, scratches, foreign objects, and the like on the third and fourth surfaces of the semiconductor device.
如圖4所示，第三視覺檢查儀430可以包括一對照相機431、432，以便分別檢查半導體器件的第三表面和第四表面。照相機431、432在列方向上間隔地布置在第一側面檢查區域中，使得彼此的攝像部位面對。一個照相機431的攝像部位朝向前方以對半導體器件的第三表面進行攝像，另一個照相機432的攝像部位朝向後方以對半導體器件的第四表面進行攝像。由照相機431、432攝像的圖像可以被圖像處理裝置處理。第三視覺檢查儀430可以包括照明器，以在由照明器分別照明半導體器件的第三表面和第四表面的狀態下進行攝像。As shown in FIG. 4, the third visual inspection device 430 may include a pair of cameras 431, 432 to inspect the third surface and the fourth surface of the semiconductor device, respectively. The cameras 431 and 432 are arranged at intervals in the column direction in the first side inspection area so that the imaging parts of each other face each other. The imaging part of one camera 431 faces forward to capture the third surface of the semiconductor device, and the imaging part of the other camera 432 faces backward to capture the fourth surface of the semiconductor device. The images captured by the cameras 431 and 432 may be processed by an image processing device. The third visual inspection device 430 may include an illuminator to perform imaging in a state where the third surface and the fourth surface of the semiconductor device are respectively illuminated by the illuminator.
照相機431、432可以通過照相機移動機構433分別在列方向上線性往複。照相機移動機構433可以包括滑塊、導軌及線性致動器，所述滑塊固定到相關照相機431、432，所述導軌引導滑塊沿列方向移動，所述線性致動器使滑塊沿列方向線性往複。線性致動器可以為如氣壓缸、線性馬達等的常規致動器。照相機移動機構433使照相機431、432從待機位置移動到針對每個半導體器件設定的攝像位置，從而對半導體器件的第三表面和第四表面進行拍攝。The cameras 431 and 432 can be linearly reciprocated in the column direction by the camera moving mechanism 433, respectively. The camera moving mechanism 433 may include a slider, a guide, and a linear actuator fixed to the relevant cameras 431 and 432, the guide guides the slider to move in a column direction, and the linear actuator causes the slider to move along the column The direction reciprocates linearly. The linear actuator may be a conventional actuator such as a pneumatic cylinder, a linear motor, or the like. The camera moving mechanism 433 moves the cameras 431 and 432 from the standby position to the imaging position set for each semiconductor device, thereby photographing the third surface and the fourth surface of the semiconductor device.
下面，參照圖6和圖7，對上述的第三視覺檢查儀430與第一拾取器600連接來對各個半導體器件的第三表面和第四表面進行檢查的過程進行說明。6 and 7, a process in which the third visual inspection device 430 and the first pickup 600 are connected to inspect the third surface and the fourth surface of each semiconductor device will be described.
第一拾取器600從相關托盤T拾取沿行向排列的多個半導體器件S，然後將所述半導體器件沿行向移送到所個照相機431、432之間。接着，第一拾取器600在拾取半導體器件S的狀態下從照相機431、432沿行向將所述半導體器件移送到相關托盤T，然後在相關托盤T上摘下，從而可以將半導體器件S返回到托盤T上的原位。The first picker 600 picks up a plurality of semiconductor devices S arranged in a row direction from an associated tray T, and then moves the semiconductor devices to the cameras 431 and 432 in a row direction. Next, the first picker 600 moves the semiconductor device S to the relevant tray T from the cameras 431 and 432 in a row direction while picking up the semiconductor device S, and then takes off the relevant tray T, so that the semiconductor device S can be returned Return to the original position on the tray T.
第二拾取器700在主體100的上側向與左右方向平行的行方向往返。第二拾取器700將經過第三視覺檢查儀430的半導體器件從相關托盤以列單位拾取多個並以垂直軸為中心旋轉90度來沿行向移送到第二側面檢查區域，然後返回到相關托盤。The second pickup 700 reciprocates in a row direction parallel to the left-right direction on the upper side of the main body 100. The second picker 700 picks up a plurality of semiconductor devices that have passed through the third visual inspection device 430 from the relevant tray in column units and rotates 90 degrees around the vertical axis to move in a row direction to the second side inspection area, and then returns to the relevant side tray.
當半導體器件經過第一視覺檢查儀410、第二視覺檢查儀420和第三視覺檢查儀430時，以容納於托盤的半導體器件為基準，在各個六個表面中僅有朝向行向的兩個側表面處於未經過檢查的狀態。半導體器件需要以列單位被拾取，使得朝向行向的兩個側面被同時暴露。由於與第一托盤載體部310、第二托盤載體部320、第三托盤載體部330、第四托盤載體部340、第五托盤載體部350、第三視覺檢查儀430及第四視覺檢查儀440之間的布置關係，半導體器件最優選在以垂直軸為中心旋轉90度之後具有沿行向移送的路徑，使得暴露的兩個側面經過檢查。因此，第二拾取器700被設置成使得第二拾取器700以列單位拾取半導體器件，然後以垂直軸為中心旋轉半導體器件90度並沿行向進行移送。 When the semiconductor device passes the first visual inspection device 410, the second visual inspection device 420, and the third visual inspection device 430, based on the semiconductor device accommodated in the tray, there are only two of the six surfaces facing in the row direction. The side surface is left unchecked. Semiconductor devices need to be picked up in column units so that both sides facing the row direction are exposed at the same time. Since the first tray carrier portion 310, the second tray carrier portion 320, the third tray carrier portion 330, the fourth tray carrier portion 340, the fifth tray carrier portion 350, the third visual inspection device 430, and the fourth visual inspection device 440 For the arrangement relationship between the semiconductor devices, it is most preferable that the semiconductor device has a path of moving in a row direction after being rotated 90 degrees around the vertical axis as the center, so that the exposed two sides are inspected. Therefore, the second picker 700 is provided such that the second picker 700 picks up the semiconductor device in a column unit, and then rotates the semiconductor device 90 degrees about the vertical axis as a center and transfers it in the row direction.
例如，如圖8所示，第二拾取器700可以包括分別具有與第一拾取器600的噴嘴組裝體610、噴嘴組裝體升降機構620、拾取器基座630及節距可變機構640相同的構成的噴嘴組裝體710、噴嘴組裝體升降機構720、拾取器基座730及間距可變機構740。 For example, as shown in FIG. 8, the second pickup 700 may include a nozzle assembly 610, a nozzle assembly lifting mechanism 620, a pickup base 630, and a variable pitch mechanism 640, respectively, which are the same as those of the first pickup 600. The nozzle assembly 710, the nozzle assembly lifting mechanism 720, the pickup base 730, and the pitch-variable mechanism 740 are configured.
第二拾取器700還包括用於拾取器的旋轉器750。用於拾取器的旋轉器750使噴嘴組裝體710在90度範圍進行正旋轉和逆旋轉。用於拾取器的旋轉器750可以包括可動軸751和用於使可動軸751旋轉的旋轉器主體752。可動軸751固定在噴嘴組裝體710的噴嘴支架714，旋轉主體固定在升降塊721，從而噴嘴組裝體710可以通過可動軸751的旋轉相對於升降塊721進行旋轉。因此，噴嘴711可以在沿列向排列的狀態下通過可動軸751的90度旋轉而沿行向排列。第二拾取器700由控制部控制。 The second picker 700 also includes a rotator 750 for the picker. The spinner 750 for the picker causes the nozzle assembly 710 to rotate forward and backward in a range of 90 degrees. The rotator 750 for the pickup may include a movable shaft 751 and a rotator body 752 for rotating the movable shaft 751. The movable shaft 751 is fixed to the nozzle holder 714 of the nozzle assembly 710, and the rotating body is fixed to the lifting block 721, so that the nozzle assembly 710 can rotate relative to the lifting block 721 by the rotation of the movable shaft 751. Therefore, the nozzles 711 can be aligned in the row direction by 90-degree rotation of the movable shaft 751 in a state of being aligned in the column direction. The second pickup 700 is controlled by a control unit.
第四視覺檢查儀440對在被第二拾取器700拾取的狀態下移送到第二側面檢查區域的各個半導體器件的第五表面和第六表面進行檢查。半導體器件的第五表面和第六表面以容納於托盤的半導體器件為基準相當於在半導體器件的四個表面中朝向行向的剩餘兩個側面。 The fourth visual inspection device 440 inspects the fifth surface and the sixth surface of each semiconductor device that have been transferred to the second side inspection area in a state of being picked up by the second pickup 700. The fifth surface and the sixth surface of the semiconductor device, based on the semiconductor device accommodated in the tray, are equivalent to the remaining two side faces of the semiconductor device that face the row direction.
當半導體器件被第二拾取器700以列單位拾取多個，然後在以垂直軸為中心旋轉90度的狀態下被移送 到第二側面檢查區域時，各個第五表面和第六表面被暴露。第四視覺檢查儀440對暴露的半導體器件的第五表面和第六表面進行檢查。第四視覺檢查儀440可以對半導體器件的第五表面和第六表面的裂紋、氣泡、金屬暴露、划痕、異物等進行二維檢查。 When a plurality of semiconductor devices are picked up by the second picker 700 in a column unit, they are then transferred in a state of being rotated by 90 degrees about the vertical axis. When the second side inspection area is reached, each of the fifth and sixth surfaces is exposed. The fourth visual inspection device 440 inspects the fifth surface and the sixth surface of the exposed semiconductor device. The fourth visual inspection instrument 440 can perform two-dimensional inspection on cracks, bubbles, metal exposure, scratches, foreign objects, and the like on the fifth and sixth surfaces of the semiconductor device.
如圖8所示，第四視覺檢查儀440可以包括一對照相機441、442，以便分別對半導體器件的第五表面和第六表面進行檢查。照相機441、442在列方向上間隔地布置在第二側面檢查區域中，使得彼此的攝像部位面對。一個照相機441的攝像部位朝向前方以對半導體器件的第五表面進行攝像，另一個照相機442的攝像部位朝向後方以對半導體器件的第六表面進行攝像。 As shown in FIG. 8, the fourth visual inspection device 440 may include a pair of cameras 441, 442 to inspect the fifth surface and the sixth surface of the semiconductor device, respectively. The cameras 441 and 442 are arranged at intervals in the column direction in the second side inspection area so that the imaging parts of each other face each other. The imaging part of one camera 441 faces forward to capture the fifth surface of the semiconductor device, and the imaging part of the other camera 442 faces backward to capture the sixth surface of the semiconductor device.
由照相機441、442攝像的圖像可以被圖像處理裝置處理。第四視覺檢查儀440可以包括照明器，以在由照明器分別照明半導體器件的第五表面和第六表面的狀態下進行攝像。第四視覺檢查儀440的照相機441、442可以通過具有與上述第三視覺檢查儀430的照相機移動機構433相同的構成的照相機移動機構443沿列向分別線性往還。 The images captured by the cameras 441 and 442 can be processed by an image processing device. The fourth visual inspection instrument 440 may include an illuminator to perform imaging in a state where the fifth surface and the sixth surface of the semiconductor device are respectively illuminated by the illuminator. The cameras 441 and 442 of the fourth visual inspection device 440 can be returned linearly in the column direction by a camera moving mechanism 443 having the same configuration as the camera moving mechanism 433 of the third visual inspection device 430 described above.
參照圖9至圖11，下面將說明上述的第四視覺檢查儀440和第二拾取器700連接來對各個半導體器件的第三表面和第四表面進行檢查的過程。 Referring to FIGS. 9 to 11, a process in which the above-mentioned fourth visual inspection device 440 and the second pickup 700 are connected to inspect the third surface and the fourth surface of each semiconductor device will be described below.
第二拾取器700將沿行向排列的噴嘴711以垂直軸為中心旋轉90度來沿列向排列。接着，第二拾取器700通過噴嘴711從相關托盤T拾取沿列向排列的多個半導體器件S，然後將該半導體器件以垂直軸為中心向相反的方向旋轉90度，從而將該半導體器件沿行向移動到第四視覺檢查儀440的照相機441、442之間。接着，第二拾取器700在拾取半導體器件S的狀態下將該半導體器件從照相機441、442沿行向移送到相關托盤T，然後以垂直軸為中心向相反的方向旋轉90度，將半導體器件從噴嘴711摘下到相關托盤T。從而可以將半導體器件S返回到托盤T上的原位。The second picker 700 rotates the nozzles 711 arranged in the row direction by 90 degrees around the vertical axis to arrange them in the column direction. Next, the second picker 700 picks up the plurality of semiconductor devices S arranged in the column direction from the relevant tray T through the nozzle 711, and then rotates the semiconductor device by 90 degrees in the opposite direction with the vertical axis as the center, thereby moving the semiconductor device along The line direction moves between the cameras 441 and 442 of the fourth visual inspection device 440. Next, the second picker 700 moves the semiconductor device from the cameras 441 and 442 to the relevant tray T in a row direction while picking up the semiconductor device S, and then rotates the semiconductor device by 90 degrees in the opposite direction with the vertical axis as the center. It is detached from the nozzle 711 to the relevant tray T. Thereby, the semiconductor device S can be returned to the original position on the tray T.
分選部800與第二拾取器700連接來將已經完成檢查的半導體器件分為合格產品和不合格產品並容納於相關托盤。分選部800包括第一待機區域810、第二待機區域820及緩衝區域830，所述第一待機區域810供從空托盤供應部220移送的空托盤T1待機，所述第二待機區域820供容納有已經完成檢查的半導體器件的托盤T2待機，所述緩衝區域830用於臨時保管容納有已經完成檢查的半導體器件的其他托盤T3。分選部800可以布置在主體100的中心側。第一待機區域810、第二待機區域820及緩衝區域830可以沿左右方向排列。緩衝區域830可以布置在第一待機區域810與第二待機區域820之間。The sorting unit 800 is connected to the second picker 700 to classify the semiconductor devices that have completed the inspection into qualified products and unqualified products and store them in the relevant tray. The sorting section 800 includes a first standby area 810, a second standby area 820, and a buffer area 830. The first standby area 810 is used for standby of the empty tray T1 transferred from the empty tray supply section 220, and the second standby area 820 is used for standby. The tray T2 containing the semiconductor devices that have completed the inspection is on standby, and the buffer area 830 is used to temporarily store other trays T3 that contain the semiconductor devices that have completed the inspection. The sorting part 800 may be disposed on the center side of the main body 100. The first standby area 810, the second standby area 820, and the buffer area 830 may be arranged in the left-right direction. The buffer area 830 may be disposed between the first standby area 810 and the second standby area 820.
第二拾取器700在第一待機區域810、第二待機區域820及緩衝區域830之間往還。第二拾取器700在容納於第二待機區域820的托盤T2的半導體器件中拾取相當於不合格產品的半導體器件並將該半導體器件容納於第一待機區域810的空托盤T1，且在容納於緩衝區域830的托盤T3的半導體器件中拾取相當於合格產品的半導體器件並將該半導體器件容納於第二待機區域820的托盤T2。The second picker 700 returns between the first standby area 810, the second standby area 820, and the buffer area 830. The second picker 700 picks up a semiconductor device corresponding to a defective product among the semiconductor devices stored in the tray T2 of the second standby area 820 and stores the semiconductor device in the empty tray T1 of the first standby area 810. Among the semiconductor devices in the tray T3 of the buffer area 830, a semiconductor device corresponding to a qualified product is picked up and stored in the tray T2 of the second standby area 820.
此時，在已經完成檢查的狀態下容納於第二待機區域820的托盤T2和緩衝區域830的托盤T3的半導體器件的各個位置的關於合格和不合格的信息通過第一視覺檢查儀410、第二視覺檢查儀420、第三視覺檢查儀430、第四視覺檢查儀440及第五視覺檢查儀450預先存儲於控制部，且控制部可以基於半導體器件的各個位置的關於合格和不合格的信息而控制第二拾取器700來進行上述的分類工作。At this time, in the state where the inspection has been completed, the information on the pass and fail of each position of the semiconductor device accommodated in the tray T2 of the second standby area 820 and the tray T3 of the buffer area 830 passes the first visual inspection device 410, The two visual inspection devices 420, the third visual inspection device 430, the fourth visual inspection device 440, and the fifth visual inspection device 450 are stored in the control section in advance, and the control section may be based on the information about the pass and fail of each position of the semiconductor device. The second picker 700 is controlled to perform the above-mentioned classification work.
進一步地，半導體器件外觀檢查裝置可以包括第五視覺檢查儀450，所述第五視覺檢查儀450對容納於從加載部210通過第一托盤載體部310移送的托盤的半導體器件的第一表面進行三維檢查。第五視覺檢查儀450可以識別半導體器件的錫球的三維形狀來對高度缺陷等進行檢查。第五視覺檢查儀450包括照相機，且由照相機攝像的圖像可以由圖像處理裝置處理。第五視覺檢查儀450可以包括照明器，以在由照明器照明半導體器件的第一表面的狀態下進行攝像。Further, the semiconductor device appearance inspection device may include a fifth visual inspection device 450 for performing a first inspection on the first surface of the semiconductor device accommodated in the tray transferred from the loading section 210 through the first tray carrier section 310. 3D inspection. The fifth visual inspection device 450 can recognize the three-dimensional shape of the solder ball of the semiconductor device to inspect highly defective or the like. The fifth visual inspection device 450 includes a camera, and an image captured by the camera may be processed by an image processing device. The fifth visual inspection device 450 may include an illuminator to perform imaging in a state where the first surface of the semiconductor device is illuminated by the illuminator.
第五視覺檢查儀450可以設置在主體100的上側，以便能夠在左右方向上水平往還。第五視覺檢查儀450可以沿着固定在主體100的上側的圓柱向左右方向可滑動地被支撐，且可以通過線性致動器水平往還。線性致動器可以為常規的線性致動器。The fifth visual inspection device 450 may be disposed on the upper side of the main body 100 so as to be able to return horizontally in the left-right direction. The fifth visual inspection device 450 may be slidably supported in a left-right direction along a cylinder fixed on the upper side of the main body 100, and may be returned horizontally by a linear actuator. The linear actuator may be a conventional linear actuator.
作為一個例子，如圖12和圖13所示，傳送器500被設置成使得傳送器主體510在主體100上側的圓柱520能夠沿左右方向水平往還並升降。使傳送器主體510水平往還並升降的致動器可以為常規的致動器。As an example, as shown in FIGS. 12 and 13, the conveyor 500 is provided so that the cylinder 520 of the conveyor main body 510 on the upper side of the main body 100 can be returned horizontally in the left-right direction and raised and lowered. The actuator for raising and lowering the conveyor body 510 horizontally may be a conventional actuator.
傳送器500可以包括夾具530、上夾持器540和下夾持器550以及用於夾持器的旋轉器560。夾具530以能夠升降的方式設置在傳送器主體510。夾具530被設置成根據一對夾爪531之間的間隔變窄或變寬而抓取或釋放托盤。The conveyor 500 may include a jig 530, an upper holder 540 and a lower holder 550, and a spinner 560 for the holder. The jig 530 is provided on the conveyor main body 510 so as to be able to move up and down. The jig 530 is provided to grasp or release the tray according to a narrowing or widening of the interval between the pair of jaws 531.
上夾持器540和下夾持器550根據彼此之間的間隔變窄或變寬而固定或釋放一個托盤或兩個堆疊的托盤。上夾持器540可以根據一對夾緊構件541之間的間隔變窄或變寬而使托盤進出。下夾持器550也可以根據夾緊構件541之間的間隔變窄或變寬而使托盤進出。上夾持器540和下夾持器550可以相同地構成。The upper gripper 540 and the lower gripper 550 fix or release one tray or two stacked trays according to a narrowing or widening of an interval between each other. The upper gripper 540 can advance and exit the tray in accordance with the narrowing or widening of the interval between the pair of clamping members 541. The lower gripper 550 may allow the tray to be moved in and out according to a narrowing or widening of the interval between the clamping members 541. The upper holder 540 and the lower holder 550 may be configured in the same manner.
用於夾持器的旋轉器560通過使上夾持器540和下夾持器550同時旋轉並上下翻轉，使得在上夾持器540和下夾持器550之間的托盤上下翻轉。夾具530、上夾持器540、下夾持器550及用於夾持器的旋轉器560的各個致動器可以為常規的致動器。The rotator 560 for the gripper rotates the upper gripper 540 and the lower gripper 550 at the same time and turns upside down, so that the tray between the upper gripper 540 and the lower gripper 550 is turned upside down. Each actuator of the jig 530, the upper holder 540, the lower holder 550, and the spinner 560 for the holder may be a conventional actuator.
下面將說明通過傳送器500使半導體器件上下翻轉的過程。The process of turning the semiconductor device upside down by the conveyor 500 will be described below.
首先，傳送器主體510移動到空托盤T4待機的位置。接着，當下夾持器550的夾緊構件551之間的間隔變寬時，夾具530下降並握持空托盤T4，然後上升並將空托盤T4位於下夾持器550和上夾持器540之間。First, the conveyor main body 510 is moved to the standby position of the empty tray T4. Next, when the interval between the clamping members 551 of the lower holder 550 becomes wider, the jig 530 lowers and holds the empty tray T4, and then raises and positions the empty tray T4 between the lower holder 550 and the upper holder 540. between.
接着，下夾持器550的夾緊構件551之間的間隔變窄，上夾持器540和下夾持器550之間的間隔變窄，以便固定空托盤T4，然後上夾持器540和下夾持器550通過用於夾持器的旋轉器560旋轉180度。那麼，空托盤T4上下翻轉。與此同時，傳送器主體510移動到已經完成通過第一視覺檢查儀310的檢查的托盤T5。Next, the interval between the clamping members 551 of the lower holder 550 is narrowed, and the interval between the upper holder 540 and the lower holder 550 is narrowed to fix the empty tray T4, and then the upper holder 540 and The lower holder 550 is rotated 180 degrees by a rotator 560 for the holder. Then, the empty tray T4 is turned upside down. At the same time, the conveyor body 510 moves to the tray T5 that has completed the inspection by the first visual inspection apparatus 310.
接着，夾具530下降並握持空托盤T4之後，向下側移動的上夾持器540的夾緊構件541之間間隔變寬。接着，夾具530將空托盤T4堆疊在已經完成檢查的托盤T5的上部並同時握持，然後上升並將其位於下夾持器550與上夾持器540之間。Next, after the jig 530 descends and holds the empty tray T4, the interval between the clamping members 541 of the upper holder 540 moving downward is widened. Next, the jig 530 stacks the empty tray T4 on the upper portion of the tray T5 that has completed the inspection and holds it at the same time, and then rises and positions it between the lower holder 550 and the upper holder 540.
接着，上夾持器540的夾緊構件541之間的間隔變窄，上夾持器540和下夾持器550之間的間隔變窄，以便固定堆積狀態的托盤T4、T5，然後上夾持器540和下夾持器550通過用於夾持器的旋轉器560旋轉180度。那麼，已經完成檢查的托盤T5的半導體器件上下翻轉並被移送到空托盤T4。與此同時，傳送器主體510移動到第四托盤載體部340或第五托盤載體部350。Next, the interval between the clamping members 541 of the upper holder 540 is narrowed, and the interval between the upper holder 540 and the lower holder 550 is narrowed to fix the stacked trays T4 and T5, and then the upper holder is clamped. The holder 540 and the lower holder 550 are rotated 180 degrees by a rotator 560 for the holder. Then, the semiconductor device of the tray T5 that has completed the inspection is turned upside down and transferred to the empty tray T4. At the same time, the conveyor body 510 moves to the fourth tray carrier portion 340 or the fifth tray carrier portion 350.
接着，在夾具530握持堆積狀態的托盤T4、T5之後，下夾持器550的夾緊構件551之間的間隔變寬。接着，夾具530將容納有上下翻轉的半導體器件的托盤T4放置在第四托盤載體部340或第五托盤載體部350，並握持位於上側的空的狀態的托盤T5之後，上升並將該托盤T5位於下夾持器550和上夾持器540之間。Next, after the trays T4 and T5 in the stacked state are held by the jig 530, the interval between the clamping members 551 of the lower holder 550 is widened. Next, the jig 530 places the tray T4 containing the semiconductor device upside down on the fourth tray carrier portion 340 or the fifth tray carrier portion 350, and holds the tray T5 in an empty state on the upper side, and then raises the tray T5 is located between the lower holder 550 and the upper holder 540.
接着，下夾持器550的各個夾緊構件551之間的間隔變窄，上夾持器540和下夾持器550之間的間隔變窄，以固定空的狀態的托盤T5。空的狀態的托盤T5用於供已經完成通過第一視覺檢查儀410和第五視覺檢查儀450的檢查的新的托盤的半導體器件通過上述過程轉移並放置。Next, the interval between the respective clamping members 551 of the lower holder 550 is narrowed, and the interval between the upper holder 540 and the lower holder 550 is narrowed to fix the empty tray T5. The empty tray T5 is used to transfer and place the semiconductor devices of the new tray that have completed the inspections by the first visual inspection device 410 and the fifth visual inspection device 450 through the above-mentioned process.
下面示意性說明上述半導體器件外觀檢查裝置的作用例。An example of the operation of the above-mentioned semiconductor device appearance inspection device is schematically described below.
將容納有待檢查的半導體器件的多個托盤放置在加載部210。此時，半導體器件可以在位於各個第一表面的錫球朝向上方的狀態下容納於托盤。而且，將多個空托盤放置在空托盤供應部220，並完成進行檢查的準備。A plurality of trays containing semiconductor devices to be inspected are placed in the loading section 210. At this time, the semiconductor device can be housed in a tray with the solder balls on each first surface facing upward. Then, a plurality of empty trays are placed in the empty tray supply section 220 and preparations for inspection are completed.
在此狀態下，若半導體器件外觀檢查裝置啟動，則空托盤供應部220的空托盤被第二托盤載體部320移送到主體100的後方。那麼，空托盤被傳送器500移送到第三托盤載體部330之後，被第三托盤載體部330移送到分選部800的第一待機區域810並待機。另一方面，空托盤供應部220的其他空托盤為了半導體器件的上下翻轉而被移送到主體100的後方並待機。In this state, when the semiconductor device visual inspection device is activated, the empty tray of the empty tray supply section 220 is moved to the rear of the main body 100 by the second tray carrier section 320. Then, after the empty tray is moved to the third tray carrier section 330 by the conveyor 500, it is moved to the first standby area 810 of the sorting section 800 by the third tray carrier section 330 and stands by. On the other hand, the other empty trays of the empty tray supply unit 220 are moved to the rear of the main body 100 and turned on standby for the semiconductor device to be turned upside down.
放置在加載部210的托盤被第一托盤載體部310移送到第一視覺檢查儀410，且第一視覺檢查儀410對位於容納於托盤的各個半導體器件的第一表面的錫球的狀態等進行二維檢查。已經完成通過第一視覺檢查儀410的檢查的托盤被第一托盤載體部310移送到第五視覺檢查儀450，且第五視覺檢查儀450可以識別容納於托盤的半導體器件的錫球的三維形狀來對高度缺陷等進行三維檢查。The tray placed in the loading section 210 is transferred to the first visual inspection device 410 by the first tray carrier section 310, and the first visual inspection device 410 performs a state and the like of the solder balls on the first surface of each semiconductor device accommodated in the tray. Two-dimensional inspection. The tray that has completed the inspection by the first visual inspection device 410 is moved to the fifth visual inspection device 450 by the first tray carrier portion 310, and the fifth visual inspection device 450 can recognize the three-dimensional shape of the solder ball of the semiconductor device contained in the tray To perform three-dimensional inspections of height defects.
已經完成通過第五視覺檢查儀450的檢查的托盤的半導體器件被上述傳送器500上下翻轉並移送到空托盤。容納有上下翻轉的半導體器件的托盤被傳送器500移送到第四托盤載體部340，然後被第四托盤載體部340移送到第二視覺檢查儀420。第二視覺檢查儀420可以對半導體器件的第二表面的標記狀態等進行二維檢查。The semiconductor device of the tray that has completed the inspection by the fifth visual inspection device 450 is turned upside down by the above-mentioned conveyor 500 and moved to the empty tray. The tray containing the upside-down semiconductor device is transferred to the fourth tray carrier portion 340 by the conveyor 500, and then transferred to the second visual inspection device 420 by the fourth tray carrier portion 340. The second visual inspection device 420 can perform a two-dimensional inspection on a marking state and the like of the second surface of the semiconductor device.
已經完成通過第二視覺檢查儀420的檢查的托盤的半導體器件被第四托盤載體部340移送到第一拾取器600側。第一拾取器600從托盤以行單位拾取多個半導體器件並將該半導體器件沿行向移送到第三視覺檢查儀430，然後將該半導體器件從第三視覺檢查儀430返回到相關托盤。此時，第三視覺檢查儀430可以對通過第一拾取器600拾取的半導體器件的第三表面和第四表面的裂紋、氣泡、金屬暴露、划痕、異物等進行二維檢查。The semiconductor device of the tray that has completed the inspection by the second visual inspection device 420 is moved to the first picker 600 side by the fourth tray carrier portion 340. The first picker 600 picks up a plurality of semiconductor devices in a row unit from a tray and moves the semiconductor devices to the third visual inspection device 430 in a row direction, and then returns the semiconductor devices from the third visual inspection device 430 to the relevant tray. At this time, the third visual inspection instrument 430 may perform two-dimensional inspection on cracks, bubbles, metal exposure, scratches, foreign matter, and the like on the third and fourth surfaces of the semiconductor device picked up by the first picker 600.
已經完成通過第三視覺檢查儀430的檢查的半導體器件在容納於托盤的狀態下被第四托盤載體部340移送到第二拾取器700側。第二拾取器700從托盤以列單位拾取多個半導體器件，並將該半導體器件以垂直軸為中心旋轉並沿行向移送到第四視覺檢查儀440，然後將該半導體器件從第四視覺檢查儀440返回到相關托盤。此時，第四視覺檢查儀440可以對通過第二拾取器700拾取的半導體器件的第五表面和第六表面的裂紋、氣泡、金屬暴露、划痕、異物等進行二維檢查。已經完成通過第四視覺檢查儀440的檢查的半導體器件在容納於托盤的狀態下在分選部800的第二待機區域820待機。The semiconductor device that has completed the inspection by the third visual inspection device 430 is moved to the second picker 700 side by the fourth tray carrier portion 340 in a state of being accommodated in the tray. The second picker 700 picks up a plurality of semiconductor devices in a column unit from the tray, rotates the semiconductor devices around the vertical axis and moves them to the fourth visual inspection device 440 in a row direction, and then inspects the semiconductor devices from the fourth visual inspection The meter 440 returns to the relevant tray. At this time, the fourth visual inspection instrument 440 can perform two-dimensional inspection on cracks, bubbles, metal exposure, scratches, foreign matter, and the like on the fifth and sixth surfaces of the semiconductor device picked up by the second picker 700. The semiconductor device that has completed the inspection by the fourth visual inspection device 440 waits in the second standby area 820 of the sorting unit 800 in a state of being accommodated in a tray.
接着，容納有待檢查的半導體器件的後續托盤通過與上述過程相同的過程經過第一視覺檢查儀410和第五視覺檢查儀450受到檢查，然後被傳送器500上下翻轉並移送到空托盤。容納有上下翻轉的半導體器件的托盤被傳送器500移送到第五托盤載體部350，然後通過第五托盤載體部350移送到第二視覺檢查儀420。第二視覺檢查儀420對半導體器件的第二表面進行檢查。Next, the subsequent trays containing the semiconductor devices to be inspected are inspected through the first visual inspection device 410 and the fifth visual inspection device 450 through the same process as described above, and then turned upside down by the conveyor 500 and moved to the empty tray. The tray containing the upside-down semiconductor device is transferred to the fifth tray carrier portion 350 by the conveyor 500, and then transferred to the second visual inspection device 420 through the fifth tray carrier portion 350. The second visual inspection device 420 inspects the second surface of the semiconductor device.
已經完成通過第二視覺檢查儀420的檢查的半導體器件容納於托盤的狀態下被第五托盤載體部350移送到第一拾取器600，然後各個第三表面和第四表面被第一拾取器600和第三視覺檢查儀430經過檢查。接着，已經完成通過第三視覺檢查儀430的檢查的半導體器件在容納於托盤的狀態下被第五托盤載體部350移送到第二拾取器700，然後各個第五表面和第六表面被第二拾取器700和第四視覺檢查儀440經過檢查。已經完成通過第四視覺檢查儀440的檢查的半導體器件在容納於托盤的狀態下在分選部800的第二待機區域820待機。The semiconductor device that has completed the inspection by the second visual inspection device 420 is transferred to the first picker 600 by the fifth tray carrier portion 350 in a state of being accommodated in a tray, and then each of the third surface and the fourth surface is moved by the first pickup 600 And the third visual inspection device 430 is inspected. Next, the semiconductor device that has completed the inspection by the third visual inspection device 430 is moved to the second picker 700 by the fifth tray carrier portion 350 in a state of being accommodated in the tray, and then each of the fifth surface and the sixth surface is subjected to the second The pickup 700 and the fourth visual inspection device 440 are inspected. The semiconductor device that has completed the inspection by the fourth visual inspection device 440 waits in the second standby area 820 of the sorting unit 800 in a state of being accommodated in a tray.
當容納於第二待機區域820的托盤的半導體器件中不存在不合格產品時，第二待機區域820的托盤T2可以被第五托盤載體部350移送到卸載部250並放置。When there is no defective product in the semiconductor device accommodated in the tray of the second standby area 820, the tray T2 of the second standby area 820 may be moved to the unloading portion 250 and placed by the fifth tray carrier portion 350.
另一方面，當容納於第二待機區域820的托盤T2的半導體器件中存在不合格產品時，第二拾取器700進行在容納於第二待機區域820的托盤T2的半導體器件中拾取不合格產品並將該不合格產品容納於第一待機區域810的空托盤T1，且在容納於緩衝區域830的托盤T3的半導體器件中拾取合格產品並將該合格產品容納於第二待機區域820的托盤T2的分類工作。On the other hand, when there is a defective product in the semiconductor device of the tray T2 accommodated in the second standby area 820, the second picker 700 picks up the defective product in the semiconductor device of the tray T2 accommodated in the second standby area 820 The defective product is stored in the empty tray T1 of the first standby area 810, and a qualified product is picked up from the semiconductor device stored in the tray T3 of the buffer area 830, and the qualified product is stored in the tray T2 of the second standby area 820. Classification work.
通過這種分類工作，當第二待機區域820的托盤T2由合格產品填滿時，容納有合格產品的托盤T2被第五托盤載體部350移送到卸載部250並放置。當第一待機區域810的托盤T1由不合格產品填滿時，容納有不合格產品的托盤T1被第三托盤載體部330移送到不合格產品存儲部230並放置。當在緩衝區域830的托盤T3不再存在合格產品或僅剩下不合格產品時，處於空狀態或僅剩下不合格產品的狀態的托盤T3被移送到托盤存儲部240並放置。Through this sorting work, when the tray T2 of the second standby area 820 is filled with a qualified product, the tray T2 containing the qualified product is transferred to the unloading section 250 by the fifth tray carrier section 350 and placed. When the tray T1 of the first standby area 810 is filled with defective products, the tray T1 containing the defective products is moved to the defective product storage section 230 by the third tray carrier section 330 and placed. When there is no more qualified product or only defective products remain on the tray T3 in the buffer area 830, the tray T3 in the empty state or only the defective products is transferred to the tray storage section 240 and placed.
本發明參考附圖中圖示的一實施例進行了說明，但這僅僅是作為例示，只要是所屬領域技術人員，都能理解通過這些來進行多種變形及均等的其他實施例。因此，本發明的真正的保護範圍應通過申請專利範圍來確定。The present invention has been described with reference to an embodiment illustrated in the accompanying drawings, but this is merely an example, as long as a person skilled in the art can understand other embodiments in which various modifications and equalizations can be performed through these. Therefore, the true scope of protection of the present invention should be determined by the scope of patent application.
100‧‧‧主體 100‧‧‧ main body
200‧‧‧托盤放置台 200‧‧‧Tray placement table
210‧‧‧加載部 210‧‧‧Loading Department
220‧‧‧空托盤供應部 220‧‧‧Empty pallet supply department
230‧‧‧不合格產品存儲部 230‧‧‧Unqualified Product Storage Department
240‧‧‧托盤存儲部 240‧‧‧Tray storage department
250‧‧‧卸載部 250‧‧‧Unloading Department
310‧‧‧第一托盤載體部 310‧‧‧The first tray carrier
320‧‧‧第二托盤載體部 320‧‧‧Second pallet carrier
330‧‧‧第三托盤載體部 330‧‧‧Third Pallet Carrier
340‧‧‧第四托盤載體部 340‧‧‧The fourth tray carrier
350‧‧‧第五托盤載體部 350‧‧‧Fifth pallet carrier
410‧‧‧第一視覺檢查儀 410‧‧‧The first visual inspection instrument
420‧‧‧第二視覺檢查儀 420‧‧‧Second visual inspection instrument
430‧‧‧第三視覺檢查儀 430‧‧‧Third visual inspection instrument
431、432‧‧‧照相機 431, 432‧‧‧ camera
433‧‧‧照相機移動機構 433‧‧‧Camera moving mechanism
440‧‧‧第四視覺檢查儀 440‧‧‧Fourth visual inspection instrument
441、442‧‧‧照相機 441, 442‧‧‧ cameras
443‧‧‧照相機移動機構 443‧‧‧ Camera moving mechanism
450‧‧‧第五視覺檢查儀 450‧‧‧The fifth visual inspection instrument
500‧‧‧傳送器 500‧‧‧ transmitter
510‧‧‧傳送器主體 510‧‧‧Conveyor body
520‧‧‧圓柱 520‧‧‧Cylinder
530‧‧‧夾具 530‧‧‧Fixture
531‧‧‧夾爪 531‧‧‧Jaw
540‧‧‧上夾持器 540‧‧‧ Upper gripper
541‧‧‧對夾緊構件 541‧‧‧ pair of clamping members
550‧‧‧下夾持器 550‧‧‧ Lower gripper
551‧‧‧夾緊構件 551‧‧‧Clamping member
560‧‧‧旋轉器 560‧‧‧Rotator
600‧‧‧第一拾取器 600‧‧‧First Picker
610‧‧‧噴嘴組裝體 610‧‧‧Nozzle assembly
611‧‧‧噴嘴 611‧‧‧Nozzle
612‧‧‧噴嘴基座 612‧‧‧Nozzle base
613‧‧‧噴嘴升降體 613‧‧‧Nozzle lifting body
614‧‧‧噴嘴支架 614‧‧‧Nozzle holder
620‧‧‧噴嘴組裝體升降機構 620‧‧‧Nozzle assembly lifting mechanism
621‧‧‧升降塊 621‧‧‧lifting block
622‧‧‧升降致動器 622‧‧‧ Lifting actuator
630‧‧‧拾取器基座 630‧‧‧Picker base
640‧‧‧節距可變機構 640‧‧‧ variable pitch mechanism
641‧‧‧可變移動體 641‧‧‧Variable moving body
642‧‧‧摺疊連桿 642‧‧‧Folding Link
642a‧‧‧第一連桿構件 642a‧‧‧first link member
642b‧‧‧第二連桿構件 642b‧‧‧Second link member
643‧‧‧連桿致動器 643‧‧‧Link Actuator
700‧‧‧第二拾取器 700‧‧‧Second Picker
710‧‧‧噴嘴組裝體 710‧‧‧nozzle assembly
711‧‧‧噴嘴 711‧‧‧Nozzle
720‧‧‧噴嘴組裝體升降機構 720‧‧‧ Nozzle assembly lifting mechanism
721‧‧‧升降塊 721‧‧‧lifting block
730‧‧‧拾取器基座 730‧‧‧ Picker base
740‧‧‧間距可變機構 740‧‧‧Variable pitch mechanism
750‧‧‧旋轉器 750‧‧‧rotator
751‧‧‧可動軸 751‧‧‧movable shaft
752‧‧‧旋轉器主體 752‧‧‧rotator body
800‧‧‧分選部 800‧‧‧Sorting Division
810‧‧‧第一待機區域 810‧‧‧First standby area
820‧‧‧第二待機區域 820‧‧‧Second standby area
830‧‧‧緩衝區域 830‧‧‧Buffer area
S‧‧‧半導體器件 S‧‧‧semiconductor device
T,T1,T2,T3,T4,T5‧‧‧托盤 T, T1, T2, T3, T4, T5‧‧‧pallets
圖1為根據本發明的一實施例的半導體器件外觀檢查裝置的立體圖。 圖2為圖1的平面圖。 圖3為圖1中示出的半導體器件外觀檢查裝置的示意性結構圖。 圖4為圖1中選取第一拾取器和第三視覺檢查儀來示出的分解立體圖。 圖5為將圖4中示出的第一拾取器分解並示出的立體圖。 圖6和圖7為用於說明圖4中示出的第一拾取器和第三視覺檢查儀的作用例的概念圖。 圖8為圖1中選取第二拾取器和第四視覺檢查儀來示出的分解立體圖。 圖9至圖11為用於說明圖8中示出的第二拾取器和第四視覺檢查儀的作用例的概念圖。 圖12為圖1中選取傳送器來示出的立體圖。 圖13為用於說明圖12中示出的傳送器的作用例的概念圖。FIG. 1 is a perspective view of a semiconductor device appearance inspection apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of FIG. 1. FIG. 3 is a schematic structural diagram of a semiconductor device appearance inspection device shown in FIG. 1. FIG. 4 is an exploded perspective view showing the first picker and the third visual inspection device shown in FIG. 1. FIG. 5 is a perspective view in which the first pickup shown in FIG. 4 is exploded and shown. 6 and 7 are conceptual diagrams for explaining examples of operations of the first pickup and the third visual inspection device shown in FIG. 4. FIG. 8 is an exploded perspective view showing the second pickup and the fourth visual inspection device selected in FIG. 1. 9 to 11 are conceptual diagrams for explaining examples of operations of the second pickup and the fourth visual inspection device shown in FIG. 8. FIG. 12 is a perspective view showing a transmitter selected in FIG. 1. FIG. 13 is a conceptual diagram for explaining an operation example of the transmitter shown in FIG. 12.
Claims (4)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0014823 | 2018-02-06 | ||
| KR1020180014823A KR102142687B1 (en) | 2018-02-06 | 2018-02-06 | Apparatus for inspecting exterior of semiconductor device |
| ??10-2018-0014823 | 2018-02-06 |
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|---|---|
| TW201935601A TW201935601A (en) | 2019-09-01 |
| TWI677934B true TWI677934B (en) | 2019-11-21 |
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| TW107111847A TWI677934B (en) | 2018-02-06 | 2018-04-03 | Apparatus for inspecting exterior of semiconductor device |
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| KR (1) | KR102142687B1 (en) |
| TW (1) | TWI677934B (en) |
| WO (1) | WO2019156286A1 (en) |
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| KR102270760B1 (en) * | 2019-11-29 | 2021-06-30 | 에이엠티 주식회사 | The test apparatus of the device having fine pitch |
| KR102343739B1 (en) * | 2020-05-08 | 2021-12-28 | (주) 인텍플러스 | Flipping apparatus for inspecting exterior of battery |
| KR102345882B1 (en) * | 2020-05-20 | 2022-01-03 | (주) 인텍플러스 | Sorting system for battery exterior inspection |
| US11686690B2 (en) | 2020-11-12 | 2023-06-27 | Kla Corporation | System and method for inspection and metrology of four sides of semiconductor devices |
| KR102337602B1 (en) * | 2021-05-27 | 2021-12-09 | 주식회사 제이티엔 | Pickup module with improved movement precision |
| KR20230029496A (en) | 2021-08-24 | 2023-03-03 | 박하림 | Golf swing training device |
| KR20230171050A (en) | 2022-06-10 | 2023-12-20 | (주)펨트론 | Inspection method for vision inspection equipment |
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| KR20010104607A (en) * | 1999-10-20 | 2001-11-26 | 손성호 | System for virtually inspecting appearance of semiconductor devices and method thereof |
| JP2002031603A (en) * | 2000-07-14 | 2002-01-31 | Hitachi Ltd | Method of manufacturing semiconductor device |
| KR20180002227A (en) * | 2016-06-29 | 2018-01-08 | 세메스 주식회사 | Method of inspecting semiconductor devices |
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| JP2978860B2 (en) * | 1997-10-24 | 1999-11-15 | 東北日本電気株式会社 | Appearance inspection equipment for electronic components |
| TW473773B (en) * | 1998-12-23 | 2002-01-21 | Mirae Corp | Loading/unloading control apparatus of semiconductor device and control method thereof |
| KR100638311B1 (en) * | 2005-01-31 | 2006-10-25 | (주) 인텍플러스 | Apparatus for inspecting semiconductor device and method for a classification semiconductor device using the same |
| KR20060127633A (en) * | 2005-06-08 | 2006-12-13 | 삼성전자주식회사 | Automatic visual inspection apparatus of semiconductor package |
| KR100873670B1 (en) * | 2007-05-23 | 2008-12-12 | (주) 인텍플러스 | System for inspection of semiconductor package |
| KR100991511B1 (en) * | 2008-10-09 | 2010-11-04 | (주) 인텍플러스 | a vision inspection system for the five surface |
| KR102059139B1 (en) * | 2015-12-31 | 2019-12-24 | (주)제이티 | Vision inspection method |
| KR101697119B1 (en) * | 2016-07-07 | 2017-01-18 | 에스에스오트론 주식회사 | apparatus for vision inspection of semiconductor |
| KR101683589B1 (en) * | 2016-07-13 | 2016-12-08 | 에스에스오트론 주식회사 | Vision inspection apparatus and vision inspection method therefor |
-
2018
- 2018-02-06 KR KR1020180014823A patent/KR102142687B1/en active IP Right Grant
- 2018-04-03 TW TW107111847A patent/TWI677934B/en active
- 2018-04-27 WO PCT/KR2018/004914 patent/WO2019156286A1/en active Application Filing
Patent Citations (3)
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| KR20010104607A (en) * | 1999-10-20 | 2001-11-26 | 손성호 | System for virtually inspecting appearance of semiconductor devices and method thereof |
| JP2002031603A (en) * | 2000-07-14 | 2002-01-31 | Hitachi Ltd | Method of manufacturing semiconductor device |
| KR20180002227A (en) * | 2016-06-29 | 2018-01-08 | 세메스 주식회사 | Method of inspecting semiconductor devices |
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| Publication number | Publication date |
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| KR20190095035A (en) | 2019-08-14 |
| KR102142687B1 (en) | 2020-08-07 |
| WO2019156286A1 (en) | 2019-08-15 |
| TW201935601A (en) | 2019-09-01 |
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