TWI657334B - Portable electronic device - Google Patents
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- TWI657334B TWI657334B TW107115155A TW107115155A TWI657334B TW I657334 B TWI657334 B TW I657334B TW 107115155 A TW107115155 A TW 107115155A TW 107115155 A TW107115155 A TW 107115155A TW I657334 B TWI657334 B TW I657334B
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Abstract
一種可攜式電子裝置,包含一主機座體、一顯示機體以及一液冷式散熱模組。顯示機體樞接於主機座體,以令顯示機體可相對主機座體開啟或閉合。液冷式散熱模組包含一散熱排、一散熱風扇、一液冷頭以及一撓性流管。散熱排以及散熱風扇設置於顯示機體。液冷頭設置於主機座體。撓性流管用以連接液冷頭以及散熱排。A portable electronic device includes a main body, a display body and a liquid-cooled heat dissipation module. The display body is pivotally connected to the main body, so that the display body can be opened or closed relative to the main body. The liquid cooling heat dissipation module comprises a heat dissipation row, a cooling fan, a liquid cooling head and a flexible flow tube. The heat dissipation row and the cooling fan are disposed on the display body. The liquid cooling head is disposed on the main body. The flexible flow tube is used to connect the liquid cooling head and the heat dissipation row.
Description
本發明係關於一種可攜式電子裝置,特別是一種將散熱排以及散熱風扇裝設於顯示機體的可攜式電子裝置。The present invention relates to a portable electronic device, and more particularly to a portable electronic device in which a heat dissipation row and a heat dissipation fan are mounted on a display body.
由於消費者對於消費性電子產品的輕薄便攜益趨重視,造成現今電子產品,如筆記型電腦、超便攜電腦(ultra mobile personal computer,UMPC)、PDA等可攜式電子裝置,皆朝向薄型化發展。以筆記型電腦為例,對於需要經常在外的使用者來說,筆記型電腦的微小化大幅提升使用上的方便性。然而,筆記型電腦中電子元件的單位面積發熱量卻也因體積的薄型化而提高。若無法有效將筆記型電腦內部的熱量排出,則內部高溫將影響電子元件運作時的穩定性及效率,甚至造成筆記型電腦的使用壽命縮短。為了解決筆記型電腦中的電子元件運轉時溫度過高的問題,一般將整個液冷式散熱模組裝設於筆記型電腦中設有鍵盤的主機座中,以降低主機座中各個電子元件的溫度。As consumers pay more attention to the thin and light portable consumer electronics products, today's electronic products, such as notebook computers, ultra mobile personal computers (UMPCs), PDAs and other portable electronic devices, are moving towards thinner development. . Taking a notebook computer as an example, for users who need to be constantly outside, the miniaturization of the notebook computer greatly enhances the convenience of use. However, the heat per unit area of the electronic components in the notebook computer is also increased by the thinning of the volume. If the heat inside the notebook computer cannot be effectively discharged, the internal high temperature will affect the stability and efficiency of the operation of the electronic components, and even shorten the service life of the notebook computer. In order to solve the problem of excessive temperature during operation of electronic components in the notebook computer, the entire liquid-cooled heat-dissipating mold is generally assembled in a mainframe of the notebook computer with a keyboard to reduce the electronic components of the mainframe. temperature.
然而,在薄型化的機體中,將整個液冷式散熱模組裝設於主機座中,除了將導致主機座內的液冷式散熱系統擠壓到其他電子元件的設置空間之外,更受限於薄型化的機體而難以擴大位於主機座的散熱孔的分佈範圍。詳細來說,通風孔的設置是為了將液冷式散熱模組中散熱風扇產生的氣流排出,而通風孔一般位於遠離使用者的面上以防止通風孔排出的熱風吹往使用者,但是主機座中遠離使用者的面因輕薄的設計而具有較小的面積,因此若配置整個液冷式散熱模組於主機座中,將會限縮散熱孔的面積。也因為散熱孔的分佈範圍與液冷式散熱系統的散熱效能呈正相關,故分佈範圍受到侷限的散熱孔也連帶降低了液冷式散熱系統的散熱效能。However, in a thinned body, the entire liquid-cooled heat-dissipating mold is assembled in the main body, except that the liquid-cooled heat-dissipating system in the main body is squeezed into the installation space of other electronic components, and more It is difficult to expand the distribution range of the heat dissipation holes located in the main body base due to the limited thickness of the body. In detail, the ventilation holes are arranged to discharge the airflow generated by the cooling fan in the liquid-cooled heat dissipation module, and the ventilation holes are generally located away from the user's surface to prevent the hot air discharged from the ventilation holes from being blown to the user, but the host The surface away from the user in the seat has a small area due to the slim design. Therefore, if the entire liquid-cooled heat dissipation module is disposed in the main frame, the area of the heat dissipation hole will be limited. Also, because the distribution range of the vent holes is positively correlated with the heat dissipation performance of the liquid-cooled heat dissipation system, the limited vent holes of the distribution range also reduce the heat dissipation performance of the liquid-cooled heat dissipation system.
本發明在於提供一種可攜式電子裝置,藉由將散熱風扇以及散熱排由主機座移至顯示機體中,並於顯示機體遠離使用者的面上配置分佈範圍較廣的散熱孔,解決設置整個液冷式散熱系統於輕薄的主機座體中擠壓其他電子元件配置空間,以及散熱孔分佈範圍受到侷限而降低液冷式散熱模組的散熱效能的問題。The present invention provides a portable electronic device that moves a heat dissipating fan and a heat dissipation row from a main body to a display body, and arranges a wide distribution of heat dissipation holes on a surface of the display body away from the user. The liquid-cooled heat dissipation system squeezes other electronic component configuration spaces in the thin and light main body, and the distribution of the heat dissipation holes is limited to reduce the heat dissipation performance of the liquid-cooled heat dissipation module.
本發明之一實施例所揭露之可攜式電子裝置,包含一主機座體、一顯示機體以及一液冷式散熱模組。顯示機體樞接於主機座體,以令顯示機體可相對主機座體開啟或閉合。液冷式散熱模組包含一散熱排、一散熱風扇、一液冷頭以及一撓性流管。散熱排以及散熱風扇設置於顯示機體,液冷頭設置於主機座體,撓性流管用以連接液冷頭以及散熱排。The portable electronic device disclosed in one embodiment of the present invention comprises a main body, a display body and a liquid-cooled heat dissipation module. The display body is pivotally connected to the main body, so that the display body can be opened or closed relative to the main body. The liquid cooling heat dissipation module comprises a heat dissipation row, a cooling fan, a liquid cooling head and a flexible flow tube. The heat dissipation fin and the cooling fan are disposed on the display body, the liquid cooling head is disposed on the main body, and the flexible flow tube is used to connect the liquid cooling head and the heat dissipation row.
根據上述實施例所揭露的可攜式電子裝置,因將液冷式散熱模組中的散熱排以及散熱風扇從主機座體移至顯示機體,使液冷式散熱模組於主機座體中所佔的空間下降,並使設置於遠離使用者的面上的通風孔具有較大的分佈範圍,如此一來,除了提高主機座體中各電子元件擁有的配置空間以及靈活度,更可藉由較大範圍的通風孔加大進風與出風量,以提高液冷式散熱模組的散熱效能。According to the portable electronic device disclosed in the above embodiment, the liquid cooling type heat dissipation module and the heat dissipation fan are moved from the main body to the display body, so that the liquid cooling type heat dissipation module is disposed in the main body. The space occupied is reduced, and the vent holes disposed on the surface away from the user have a large distribution range, so that in addition to improving the configuration space and flexibility of the electronic components in the main body, it is possible to A wide range of venting holes increase the amount of air and airflow to improve the heat dissipation performance of the liquid-cooled heat-dissipating module.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.
請參閱圖1至圖4。圖1為根據本發明第一實施例所述之可攜式電子裝置開啟且為全展開模式時之立體圖。圖2為圖1之可攜式電子裝置於閉合模式之立體圖。圖3為圖1之可攜式電子裝置於另一視角之立體圖。圖4為圖1之可攜式電子裝置於另一視角之立體圖。Please refer to Figure 1 to Figure 4. FIG. 1 is a perspective view of a portable electronic device according to a first embodiment of the present invention when it is turned on and in a fully expanded mode. 2 is a perspective view of the portable electronic device of FIG. 1 in a closed mode. 3 is a perspective view of the portable electronic device of FIG. 1 in another perspective. 4 is a perspective view of the portable electronic device of FIG. 1 in another perspective.
本實施例之可攜式電子裝置10,包含一主機座體100、一顯示機體200、一液冷式散熱模組300、二處理晶片400以及一支撐座500。The portable electronic device 10 of the present embodiment includes a main body 100, a display body 200, a liquid-cooled heat dissipation module 300, two processing wafers 400, and a support base 500.
顯示機體200樞接於主機座體100,以令顯示機體200可相對主機座體100開啟或閉合。詳細來說,顯示機體200包含一散熱座201、一顯示座202以及二遮風罩203。散熱座201樞接於主機座體100,散熱座201具有一第一側面2010、一第二側面2011、多個第一散熱孔2012、二凹槽2013以及多個第二散熱孔2014。當顯示機體200疊設於主機座體100時,第一側面2010面向主機座體100(如圖2所示)。第二側面2011背對第一側面2010。第一散熱孔2012位於第一側面2010。二凹槽2013由第二側面2011向內凹陷。第二散熱孔2014位於凹槽2013背對第一側面2010的面上。顯示座202可活動的設置於散熱座201,且顯示座202藉由相對散熱座201活動而遮蔽或暴露第一散熱孔2012。二遮風罩203可活動的設置於散熱座201,且二遮風罩203可相對散熱座201活動而容置於凹槽2013並遮蔽第二散熱孔2014或是脫離凹槽2013並暴露第二散熱孔2014。此外二遮風罩203的外形分別匹配於二凹槽2013,使顯示機體200的外觀於二遮風罩203分別容置於二凹槽2013時顯得更平整。於其他實施例中,凹槽以及遮風罩的數量亦可為一。此外,於其他實施例中,第二散熱孔亦可暴露於外。或者,散熱孔亦可無需設置凹槽而使第二散熱孔位於第二側面,且第二散熱孔暴露於外。The display body 200 is pivotally connected to the main body 100 to open or close the display body 200 relative to the main body 100. In detail, the display body 200 includes a heat sink 201, a display stand 202, and two windshields 203. The heat sink 201 is pivotally connected to the main body 100. The heat sink 201 has a first side surface 2010, a second side surface 2011, a plurality of first heat dissipation holes 2012, two grooves 2013, and a plurality of second heat dissipation holes 2014. When the display body 200 is stacked on the main body 100, the first side 2010 faces the main body 100 (as shown in FIG. 2). The second side 2011 faces away from the first side 2010. The first heat dissipation hole 2012 is located on the first side surface 2010. The two grooves 2013 are recessed inward by the second side surface 2011. The second heat dissipation hole 2014 is located on the surface of the groove 2013 facing away from the first side surface 2010. The display stand 202 is movably disposed on the heat sink 201, and the display stand 202 shields or exposes the first heat dissipation hole 2012 by moving relative to the heat sink 201. The two air shields 203 are movably disposed on the heat sink 201, and the two windshields 203 are movable relative to the heat sink 201 to be received in the recesses 2013 and shield the second heat dissipation holes 2014 or from the recesses 2013 and expose the second Cooling holes 2014. In addition, the outer shape of the air hood 203 is matched with the two grooves 2013, so that the appearance of the display body 200 is more flat when the two windshields 203 are respectively accommodated in the two grooves 2013. In other embodiments, the number of the grooves and the windshield may also be one. In addition, in other embodiments, the second heat dissipation hole may also be exposed to the outside. Alternatively, the heat dissipation holes may be provided with the second heat dissipation holes on the second side without the grooves, and the second heat dissipation holes are exposed to the outside.
液冷式散熱模組300包含一散熱排301、一散熱風扇302、一液冷頭303、一儲液槽304、一幫浦305以及一撓性流管306。散熱排301以及散熱風扇302設置於顯示機體200,且散熱風扇302導引之氣流流經第一散熱孔2012以及第二散熱孔2014。液冷頭303、儲液槽304以及幫浦305設置於主機座體100。儲液槽304以及幫浦305連接於液冷頭303。撓性流管306用以連接液冷頭303以及散熱排301,且散熱液透過撓性流管206流動於液冷頭303與散熱排301而形成一冷卻循環。其中,二處理晶片400設置於主機座體100內。液冷頭303用以熱接觸於二處理晶片400,並吸收二處理晶片400所發出的熱量。幫浦305用以將吸收熱量後的散熱液由主機座體100藉由撓性流管306送往顯示機體200中的散熱排301。The liquid cooling heat dissipation module 300 includes a heat dissipation row 301, a heat dissipation fan 302, a liquid cooling head 303, a liquid storage tank 304, a pump 305, and a flexible flow tube 306. The heat dissipation row 301 and the heat dissipation fan 302 are disposed on the display body 200 , and the airflow guided by the heat dissipation fan 302 flows through the first heat dissipation hole 2012 and the second heat dissipation hole 2014 . The liquid cooling head 303, the liquid storage tank 304, and the pump 305 are disposed in the main body 100. The liquid storage tank 304 and the pump 305 are connected to the liquid cooling head 303. The flexible flow tube 306 is used to connect the liquid cooling head 303 and the heat dissipation row 301, and the heat dissipation liquid flows through the flexible flow tube 206 to the liquid cooling head 303 and the heat dissipation row 301 to form a cooling cycle. The two processing wafers 400 are disposed in the main body 100. The liquid cooling head 303 is used to thermally contact the two processing wafers 400 and absorb the heat emitted by the two processing wafers 400. The pump 305 is configured to send the heat-dissipating heat-dissipating liquid from the main body 100 through the flexible flow tube 306 to the heat-dissipating row 301 in the display body 200.
支撐座500可活動的設置於顯示機體200,而使支撐座500具有一支撐位置(如圖4所示)以及一收納位置(如圖3所示),當可攜式電子裝置10開啟,且支撐座500位於支撐位置(如圖4所示)時,支撐座500凸出於散熱座201遠離主機座體100的一側,且支撐座500用以支撐可攜式電子裝置10,而提高可攜式電子裝置10放置時的穩固性。當支撐座500位於收納位置(如圖3所示)時,支撐座500則收納於散熱座201內部。在其他實施例中,可攜式電子裝置亦可無需設置支撐座。The support base 500 is movably disposed on the display body 200, and the support base 500 has a support position (as shown in FIG. 4) and a storage position (as shown in FIG. 3), when the portable electronic device 10 is turned on, and When the support base 500 is in the support position (as shown in FIG. 4 ), the support base 500 protrudes from the side of the heat sink 201 away from the main body 100 , and the support base 500 supports the portable electronic device 10 , and the support can be improved. The stability of the portable electronic device 10 when placed. When the support base 500 is located at the storage position (as shown in FIG. 3), the support base 500 is housed inside the heat sink 201. In other embodiments, the portable electronic device may not need to be provided with a support base.
具體來說,當顯示機體200相對主機座體100開啟時,顯示機體200具有閉合模式以及全展開模式,當顯示機體200處於閉合模式時,顯示座202遮蔽第一散熱孔2012、遮風罩203容置於凹槽2013而遮蔽第二散熱孔2014,且支撐座500位於收納位置(如圖3所示)。當使用者切換可攜式電子裝置10至全展開模式時,顯示座202活動而顯露第一散熱孔2012,同時遮風罩203活動而顯露第二散熱孔2014,且支撐座500自收納位置(如圖3所示)活動至支撐位置(如圖4所示)。顯示座202、遮風罩203以及支撐座500活動的方式例如為以驅動元件驅動顯示座202,並同時以連接於驅動元件、顯示座202、遮風罩203以及支撐座500的連動組件,連動遮風罩203以及支撐座500。但不以此為限,連動組件亦可僅連接於驅動元件、顯示座202以及遮風罩203,而以手動的方式使支撐座500活動。或者,可攜式電子裝置10亦可無需設置連動組件,而改用三個驅動元件分別驅動顯示座202、遮風罩203以及支撐座500。更或者,可攜式電子裝置10亦可無需設置驅動元件以及連動組件,而改成以手動的方式使顯示座202、遮風罩203以及支撐座500相對散熱座201個別活動。Specifically, when the display body 200 is opened relative to the main body 100, the display body 200 has a closed mode and a full deployment mode. When the display body 200 is in the closed mode, the display stand 202 shields the first heat dissipation hole 2012 and the windshield 203. The second heat dissipation hole 2014 is shielded by the recess 2013, and the support base 500 is located at the storage position (as shown in FIG. 3). When the user switches the portable electronic device 10 to the full deployment mode, the display stand 202 moves to expose the first heat dissipation hole 2012, while the windshield 203 moves to expose the second heat dissipation hole 2014, and the support base 500 is self-retained ( As shown in Figure 3) move to the support position (as shown in Figure 4). The display seat 202, the windshield 203, and the support base 500 are movable, for example, by driving the display stand 202 with a driving component, and simultaneously interlocking with the driving component, the display base 202, the windshield 203, and the supporting base 500. The wind shield 203 and the support base 500. However, not limited thereto, the interlocking component may be connected only to the driving component, the display stand 202 and the windshield 203, and the support base 500 is moved in a manual manner. Alternatively, the portable electronic device 10 can also drive the display stand 202, the windshield 203, and the support base 500 by using three driving elements instead of providing the interlocking component. In addition, the portable electronic device 10 can also be manually operated to individually move the display stand 202, the windshield 203, and the support base 500 relative to the heat sink 201 without providing a driving component and a linking component.
當液冷式散熱模組300開始對主機座體100的內部電子元件進行散熱時,由於液冷頭303所吸收的熱能會透過撓性流管306內之流體傳至散熱排301,且散熱排301又需要外部冷空氣來將接收到之熱能排出,所以使用者透過觸控面板500將可攜式電子裝置10切換為全展開模式而令顯示座202朝遠離主機座體100的方向開啟而顯露第一散熱孔2012,並帶動遮風罩203相對主機座體100活動而顯露第二散熱孔2014。如此一來,散熱風扇302所產生的散熱氣流就會從第一散熱孔2012流入,並在流經散熱排301後由第二散熱孔2014排出顯示機體200外,進而將散熱排301的熱量帶走。When the liquid-cooled heat dissipation module 300 starts to dissipate the internal electronic components of the main body 100, the heat absorbed by the liquid cooling head 303 is transmitted to the heat dissipation row 301 through the fluid in the flexible flow tube 306, and the heat dissipation row The 301 needs external cold air to discharge the received thermal energy. Therefore, the user switches the portable electronic device 10 to the fully expanded mode through the touch panel 500 to open the display stand 202 in a direction away from the main body 100. The first heat dissipation hole 2012 moves the windshield 203 relative to the main body 100 to expose the second heat dissipation hole 2014. As a result, the heat dissipation airflow generated by the cooling fan 302 flows from the first heat dissipation hole 2012, and flows out of the display body 200 through the second heat dissipation hole 2014 after flowing through the heat dissipation row 301, thereby heating the heat dissipation row 301. go.
此外,相較於設置通風孔2012、2014於薄型化的主機座體100上,位於第一側面2010的第一散熱孔2012以及位於凹槽2013背對第一側面2010的面上的第二散熱孔2014有較大的分佈範圍,使散熱風扇302的進風量以及出風量加大,進而提升液冷式散熱模組300的散熱效能。In addition, the first heat dissipation hole 2012 located on the first side surface 2010 and the second heat dissipation surface located on the surface of the groove 2013 opposite to the first side surface 2010 are formed on the thinned main body body 100 compared to the vent holes 2012, 2014. The hole 2014 has a large distribution range, so that the air intake amount and the air volume of the heat dissipation fan 302 are increased, thereby improving the heat dissipation performance of the liquid cooling heat dissipation module 300.
根據上述實施例之可攜式電子裝置,因將液冷式散熱模組中的散熱排以及散熱風扇從主機座體移至顯示機體,使液冷式散熱模組於主機座體中所佔的空間下降,並使設置於遠離使用者的面上的通風孔具有較大的分佈範圍,如此一來,除了提高主機座體中各電子元件擁有的配置空間以及靈活度,更可藉由較大範圍的通風孔加大進風與出風量,以提高液冷式散熱模組的散熱效能。此外,可活動的顯示座以及遮風罩,不但於可攜式電子裝置閒置時,遮蔽散熱孔而保護散熱排,更於可攜式電子裝置使用時,藉由活動而顯露散熱孔,進而增加液冷式散熱模組的散熱效率。According to the portable electronic device of the above embodiment, the heat-dissipating heat-dissipating module in the liquid-cooled heat-dissipating module and the heat-dissipating fan are moved from the main body to the display body, so that the liquid-cooled heat-dissipating module occupies the main body. The space is lowered, and the ventilation holes disposed on the surface away from the user have a large distribution range, so that in addition to improving the configuration space and flexibility of the electronic components in the main body, the larger The range of ventilation holes increases the amount of air and airflow to improve the heat dissipation performance of the liquid-cooled heat dissipation module. In addition, the movable display stand and the windshield cover not only when the portable electronic device is idle, but also shield the heat dissipation hole to protect the heat dissipation row, and when the portable electronic device is used, the heat dissipation hole is exposed by the activity, thereby increasing Heat dissipation efficiency of liquid-cooled heat dissipation module.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。While the present invention has been described above in terms of the foregoing embodiments, it is not intended to limit the invention, and it is to be understood that those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.
10‧‧‧可攜式電子裝置10‧‧‧Portable electronic devices
100‧‧‧主機座體100‧‧‧Host body
200‧‧‧顯示機體200‧‧‧Display body
201‧‧‧散熱座201‧‧‧ Heat sink
2010‧‧‧第一側面2010‧‧‧ first side
2011‧‧‧第二側面2011‧‧‧ second side
2012‧‧‧第一散熱孔2012‧‧‧First vent
2013‧‧‧凹槽2013‧‧‧ Groove
2014‧‧‧第二散熱孔2014‧‧‧Second cooling hole
202‧‧‧顯示座202‧‧‧ display stand
203‧‧‧遮風罩203‧‧‧ hood
300‧‧‧液冷式散熱模組300‧‧‧Liquid cooling module
301‧‧‧散熱排301‧‧‧ heat sink
302‧‧‧散熱風扇302‧‧‧ cooling fan
303‧‧‧液冷頭303‧‧‧ liquid cold head
304‧‧‧儲液槽304‧‧‧ liquid storage tank
305‧‧‧幫浦305‧‧‧
306‧‧‧撓性流管306‧‧‧Flexible flow tube
400‧‧‧處理晶片400‧‧‧Processing wafer
500‧‧‧支撐座500‧‧‧ support
圖1為根據本發明第一實施例所述之可攜式電子裝置開啟且為全展開模式時之立體圖。 圖2為圖1之可攜式電子裝置於閉合模式之立體圖。 圖3為圖2之可攜式電子裝置於另一視角之立體圖。 圖4為圖1之可攜式電子裝置於另一視角之立體圖。FIG. 1 is a perspective view of a portable electronic device according to a first embodiment of the present invention when it is turned on and in a fully expanded mode. 2 is a perspective view of the portable electronic device of FIG. 1 in a closed mode. 3 is a perspective view of the portable electronic device of FIG. 2 in another perspective. 4 is a perspective view of the portable electronic device of FIG. 1 in another perspective.
Claims (7)
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TW107115155A TWI657334B (en) | 2018-05-04 | 2018-05-04 | Portable electronic device |
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TWI657334B true TWI657334B (en) | 2019-04-21 |
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TWI755191B (en) * | 2019-12-11 | 2022-02-11 | 仁寶電腦工業股份有限公司 | Electronic device with radiation structure |
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TWI790009B (en) * | 2020-12-02 | 2023-01-11 | 仁寶電腦工業股份有限公司 | Portable electronic device |
Citations (2)
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TWI239443B (en) * | 2003-05-26 | 2005-09-11 | Toshiba Corp | Cooling unit having a plurality of heat-radiating fins, and electronic apparatus with the cooling unit |
TW200733856A (en) * | 2006-02-20 | 2007-09-01 | Sunonwealth Electr Mach Ind Co | Composite heat-dissipating module |
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Patent Citations (2)
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TWI239443B (en) * | 2003-05-26 | 2005-09-11 | Toshiba Corp | Cooling unit having a plurality of heat-radiating fins, and electronic apparatus with the cooling unit |
TW200733856A (en) * | 2006-02-20 | 2007-09-01 | Sunonwealth Electr Mach Ind Co | Composite heat-dissipating module |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI755191B (en) * | 2019-12-11 | 2022-02-11 | 仁寶電腦工業股份有限公司 | Electronic device with radiation structure |
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