TWI628600B - Electronic apparatus with embedded fingerprint sensing module - Google Patents

Abstract

The invention discloses an electronic device with an embedded fingerprint detecting module, which comprises a protective glass on a display, and the protective glass is provided with a groove on one side of the display. The electronic device further includes a fingerprint detecting module disposed in the trench, and includes a fingerprint detector, a cover, a glue layer and a decorative printed layer. Since the fingerprint detecting module is located on one of the grooves of the protective glass, and the groove does not penetrate the protective glass, the waterproofness can be improved and the manufacturing cost can be reduced.

Description

Electronic device with embedded fingerprint detection module

The present invention relates to an electronic device, and more particularly to an electronic device having an embedded fingerprint detecting module.

Due to the rise of e-commerce, the development of remote payment has grown rapidly, and the commercial demand for biometrics has rapidly expanded. Biometric technology can be divided into fingerprint identification technology, iris recognition technology, and DNA identification technology. Considering the requirements of efficiency, safety, and non-intrusion, fingerprint identification has become the technology of choice for biometric identification. Fingerprint identification technology is also available in optical, thermal, ultrasonic and capacitive. Among them, capacitive technology stands out under the comprehensive considerations of device size, cost, power saving, reliability, and anti-counterfeiting.

The conventional fingerprint identification technology usually combines the sensing electrode and the sensing circuit on an integrated circuit chip (ie, a fingerprint identification integrated circuit chip), and opens a through hole in the display protection glass to identify the integrated circuit of the fingerprint. The wafer is made into a button in a complicated manner. In this way, not only the waterproof performance is sacrificed, the material and packaging process cost are increased, and the product yield, life and tolerance are considered. Therefore, there is still much room for improvement in the display device with fingerprint identification.

The object of the present invention is to provide an electronic device with a simple package and an embedded fingerprint detecting module. A groove is disposed on a side of the display protection glass opposite to the display, and a fingerprint detecting module is disposed in the groove. To improve water resistance and manufacturing packaging costs, and improve the correctness of fingerprint detection.

In order to achieve the above object of the present invention, the present invention provides a fingerprint detecting module embedded in a display protection glass, comprising: a display; a display protection glass attached to a display surface of the display, the protective glass facing away from the display A fingerprint detecting module is disposed in the groove, and comprises: a fingerprint detector; a cover plate glued to a side of the fingerprint detector.

According to one embodiment of the invention, the material of the cover is glass, ceramic, sapphire or polymeric material.

According to an embodiment of the invention, the fingerprint detecting module further comprises a decorative printing layer disposed on a side of the cover facing the fingerprint detector, the decorative printing layer being printed, sprayed or splashed The plating method causes the cover to have a predetermined color or texture pattern.

According to an embodiment of the invention, the fingerprint detection module further comprises a flexible circuit board, one end of which is attached or pressure welded to the fingerprint detector.

According to an embodiment of the invention, the fingerprint detection module further includes a fingerprint detection integrated circuit disposed on the flexible circuit board.

According to an embodiment of the invention, the fingerprint detector further comprises: a substrate, a glass substrate, a polymer film substrate or a metal substrate; and a sensing electrode layer, and a plurality of fingerprint sensing electrodes are disposed.

According to an embodiment of the invention, the fingerprint detector further comprises a thin film transistor layer, and a plurality of thin film transistors and a plurality of traces are disposed.

According to an embodiment of the invention, the fingerprint detection module further includes a fingerprint detection integrated circuit disposed on the substrate.

According to an embodiment of the invention, an edge of the trench of the display protection glass is provided with a lead angle structure.

According to an embodiment of the present invention, the groove of the cover glass may be located at a relative position of the display area or the non-display area of the display.

According to an embodiment of the invention, the fingerprint detecting module does not include the cover plate having a thickness of less than 300 micrometers or less than 250 micrometers.

The technical solutions of the present invention are described in detail below with reference to the accompanying drawings and specific embodiments, which are not to be construed as limiting the scope of the invention.

FIG. 1 is a front elevational view of an electronic device 100A having a fingerprint detecting module 10A according to a prior art. The electronic device 100A (for example, a smart phone) has a display area R1 and a non-display area R2, and the fingerprint detection module 10A is located, for example, in the non-display area R2. In the prior art, in order to install the fingerprint detecting module 10A, an opening is usually formed on the protective glass to be embedded in the fingerprint detecting module 10A (for example, a fingerprint detecting module shaped like a button is inserted into the opening). ). However, in the protective glass making opening, not only the waterproof performance is sacrificed, the material and packaging process cost are increased, and the product yield, life and tolerance are considered.

FIG. 2 is a schematic diagram of an electronic device 100 having an embedded fingerprint detecting module according to the present invention. The electronic device 100 is, for example but not limited to, a smart phone. The electronic device 100 has a display area R1 and a non-display area R2, and the fingerprint detection module 10 embedded in the display protection glass is located in the non-display area R2. However, according to the present invention, the fingerprint detecting module 10 can also be disposed in the display area R1. The electronic device 100 has a display and a protective glass for protecting the display (described later); the fingerprint detecting module 10 is disposed on a groove of the protective glass. The groove may be, for example, a structure for thinning one edge of the protective glass or a shallow groove provided at one edge of the protective glass, and does not need to be opened on the protective glass (through the hole of the protective glass), so the present invention can Improves water resistance, reduces material and packaging process costs, and improves product yield, life and tolerance.

Referring to FIG. 3A and FIG. 3B, respectively, a side view of the electronic device 100 with the embedded fingerprint detecting module of the present invention along two different angles is shown, wherein FIG. 3A is a side view viewed along the direction D1 of FIG. Fig. 3B is a side view as viewed in the direction D2 of Fig. 2. The electronic device 100 has a display 102 and a protective glass 104. The protective glass 104 has a trench 106. The trench 106 is disposed on a side of the protective glass 104 away from the display 102, and is preferably located. One side edge of the protective glass 104 is provided. The groove 106 does not penetrate the cover glass 104, and may be formed together when the protective glass 104 is fabricated, or the thickness of one side edge portion of the cover glass 104 may be reduced after the protective glass 104 is completed; in other words, This trench 106 does not completely pass through the cover glass 104 in the depth direction. Moreover, according to another embodiment of the present invention, the depth and area of the trench 106 are sufficient to accommodate the fingerprint detecting module 10, and the technical disclosure about the depth of the trench 106 will be described later. Additionally, the trenches 106 of the cover glass 104 can be located at opposite locations of the display or non-display area of the display.

4A is a schematic diagram of a stack of fingerprint detecting modules 10 according to an embodiment of the present invention. The fingerprint detecting module 10 is configured to be embedded in a trench 106 of a cover glass 104. The fingerprint detecting module 10 is disposed, for example, on the trench 106 of the protective glass 104 and corresponds to one of the fingerprint sensing regions of the electronic device 100. The trace of the fingerprint detecting module 10 bypasses a lead structure of the trench 106 of the protective glass 104 to electrically connect to other electronic devices at the other side of the protective glass 104 (away from the side formed by the trench 106) . As shown in FIG. 4A, the fingerprint detecting module 10 includes, for example, a cover plate 26 from top to bottom, a decorative printed layer 24, a glue layer 22, and a fingerprint detector 20. The cover 26 is used to protect the fingerprint detecting module 10 from scratches of foreign objects, and is made of, for example, glass, ceramic, sapphire or polymer materials. The decorative printed layer 24 is formed by printing, spraying or sputtering, and has a predetermined color or texture pattern so that the fingerprint detecting module 10 has a predetermined view when viewed from the outside (that is, when viewed by the cover 26). The color or texture. The glue layer 22 is used to bond the fingerprint detector 20 to the decorative print layer 24. The detailed structure of the fingerprint detector 20 will be described later in conjunction with other figures. The fingerprint detecting module 10 further includes a flexible circuit board 12 disposed between the glue layer 22 and the fingerprint detector 20 and electrically connected to the fingerprint detector 20, and the flexible circuit board 12 is attached or pressure welded at one end. On the fingerprint detector. The fingerprint signal sensed by the fingerprint detector 20 can be sent to other units or electronic devices through the traces in the flexible circuit board 12 for further processing (see below for details). In the structure of FIG. 4A, the thickness of the fingerprint detecting module 10 (excluding the cover plate 26) may be less than 300 micrometers (um); or may be less than 250 micrometers (um); in other words, the decorative printed layer 24, the glue layer 22 And the total thickness of the fingerprint detector 20 may be less than 300 micrometers (um); or may be less than 250 micrometers (um).

FIG. 4B is a schematic diagram of a stacking of the fingerprint detecting module 10 according to another embodiment of the present invention. The structure of the fingerprint detecting module 10 is similar to that shown in FIG. 4A. However, the flexible circuit board 12 is connected to one side of the fingerprint detector 20 away from the glue layer 22, and is also electrically connected to the fingerprint detector 20 (for example, The flexible circuit board 12 is attached or soldered to the fingerprint detector at one end. Similarly, the fingerprint signal sensed by the fingerprint detector 20 can be sent to other units or electronic devices for further processing through the internal wiring of the flexible circuit board 12. 4C is a schematic diagram of a stack of fingerprint detecting modules 10 according to still another embodiment of the present invention. The structure of the fingerprint detecting module 10 is similar to that shown in FIG. 4A. However, the fingerprint detecting device 20 is formed on a flexible circuit board, for example, on the flexible circuit board 12, and is formed by the inside of the flexible circuit board 12. The trace sends the fingerprint signal sensed by the fingerprint detector 20 to other units or electronic devices for further processing. Similarly, in the embodiment shown in FIGS. 4B and 4C, the decorative printing layer 24 is formed by printing, spraying or sputtering, and has a predetermined color or texture pattern so that the fingerprint detecting module 10 is viewed from the outside. The time (i.e., when viewed by the cover 26) has a predetermined color or texture. Furthermore, the thickness of the fingerprint detecting module 10 (excluding the cover plate 26) may be less than 300 micrometers (um); or may be less than 250 micrometers (um); in other words, the decorative printed layer 24, the glue layer 22 and the fingerprint detection The sum of the thickness of the device 20 can be less than 300 micrometers (um); or can be less than 250 micrometers (um).

5A is a schematic diagram of a stack of a fingerprint detector 20 according to an embodiment of the invention. The fingerprint detector 20 includes a top-down sensing electrode layer 34, a thin film transistor layer 32, and a substrate 30. The fingerprint detector 20 is electrically connected to a fingerprint identification integrated circuit 50 via a flexible circuit board 12. 4A and 4B, if the user's finger is operating on the cover 26, the finger crests and troughs will produce different equivalent capacitances for the sensing electrodes in the sensing electrode layer 34 in the fingerprint detector 20. The fingerprint identification integrated circuit 50 can transmit the fingerprint-operated capacitive excitation signal and the control signal to the thin film transistor of the thin film transistor layer 32 to perform equivalent capacitance measurement on the selected sensing electrode in the sensing electrode layer 34, thereby obtaining the use. Fingerprint information. In the embodiment shown in FIG. 5A, the substrate 30 is, for example, a glass substrate, a polymer film substrate or a metal substrate. In addition, the substrate 30 can also be a flexible circuit board. Moreover, although not shown in this illustration, the flexible circuit board 12 can be bent to bypass the lead angle structure 108 of the trench 106 (see FIGS. 4A and 4B). In addition, although not shown in this figure, the positions of the sensing electrode layer 34 and the thin film transistor layer 32 may be reversed, that is, the sensing electrode layer 34 is sandwiched between the thin film transistor layer 32 and the substrate 30.

5B is a schematic diagram of a stack of a fingerprint detector 20 according to another embodiment of the present invention. The fingerprint detector 20 includes a top-down sensing electrode layer 34, a thin film transistor layer 32, and a substrate 30. The fingerprint identification integrated circuit 50 is mounted on the substrate 30. Referring to FIG. 4C, if the user's finger is operating on the cover 26, the finger crests and troughs will produce different equivalent capacitances for the sensing electrodes in the sensing electrode layer 34 in the fingerprint detector 20. The fingerprint identification integrated circuit 50 can transmit the fingerprint-operated capacitive excitation signal and the control signal to the thin film transistor of the thin film transistor layer 32 to perform equivalent capacitance measurement on the selected sensing electrode in the sensing electrode layer 34, thereby obtaining the use. Fingerprint information. In the embodiment shown in FIG. 5B, the substrate 30 is, for example, a flexible circuit board. However, in accordance with other possible modes of the present invention, the substrate 30 can also be a glass substrate, a polymer film substrate or a metal substrate. Moreover, although not shown in this illustration, the flexible circuit board 12 can be bent to bypass the lead angle structure 108 of the trench 106 (see FIG. 4C). In addition, although not shown in this figure, the positions of the sensing electrode layer 34 and the thin film transistor layer 32 may be reversed, that is, the sensing electrode layer 34 is sandwiched between the thin film transistor layer 32 and the substrate 30.

Referring to Figure 6, a side view of an electronic device 100 having an embedded fingerprint detection module in accordance with the present invention is shown in a side view taken in the direction D1 of Figure 2 . Similarly, the fingerprint detecting module 10 has a cover plate 26 from top to bottom, a decorative printed layer 24, a glue layer 22 and a fingerprint detector 20. The fingerprint detector 20 is formed on a flexible circuit board, for example, on the flexible circuit board 12, and the fingerprint signal sensed by the fingerprint detector 20 is sent to other units through the internal circuit of the flexible circuit board 12. Do further processing. The display cover glass 104 has a lead structure 108 along which the flexible circuit board 12 is bent to extend to the other side of the cover glass 104. Referring to FIG. 5B, when the user's finger operates on the cover 26, the finger crests and troughs will produce different equivalent capacitances for the sensing electrodes in the sensing electrode layer 34 in the fingerprint detector 20. The fingerprint identification integrated circuit 50 is mounted, for example, on the flexible circuit board 12, and on the other side of the protective glass 104 away from the trench 106. The fingerprint identification integrated circuit 50 performs an equivalent capacitance measurement on the selected sensing electrodes in the sensing electrode layer 34, thereby obtaining user fingerprint information. In the structure shown in FIG. 6, since the fingerprint detecting module 10 is disposed at the groove 106 at one side edge of the protective glass 104, and the groove 106 does not need to penetrate the protective glass 104, the waterproof performance and the lowering can be improved. Material and packaging process costs, and improve product yield, longevity and tolerance. Since the groove 106 is tied at one side edge of the cover glass 104, the display content of the display 102 is not affected. Moreover, the flexible circuit board 12 is bent along the lead structure 108 to extend to the other side of the cover glass 104, and the lead structure 108 can have, for example, a rounded edge to avoid the traces 120 in the flexible circuit board 12 being bent. Break and break the road. The fingerprint identification integrated circuit 50 is mounted on the other side of the protective glass 104 away from the trench 106, which can avoid increasing the depth of the trench 106 and further enhance the structural strength of the protective glass 104.

Referring to FIG. 7, a side view of an electronic device 100 having an embedded fingerprint detecting module according to another embodiment of the present invention is shown, which is a side view as viewed in a direction D1 of FIG. Similarly, the fingerprint detecting module 10 has a cover plate 26 from top to bottom, a decorative printed layer 24, a glue layer 22 and a fingerprint detector 20. The fingerprint detection module 10 further includes a flexible circuit board 12 connected to one side of the fingerprint detector 20 away from the glue layer 22 and also electrically connected to the fingerprint detector 20. The display cover glass 104 has a lead structure 108 along which the flexible circuit board 12 is bent to extend to the other side of the cover glass 104. The fingerprint identification integrated circuit 50 is mounted, for example, on the flexible circuit board 12, and on the other side of the protective glass 104 away from the trench 106. Similarly, in the structure shown in FIG. 7, since the fingerprint detecting module 10 is disposed at the groove 106 at one side edge of the protective glass 104, and the groove 106 does not need to penetrate the protective glass 104, the waterproofing can be improved. Performance, reduced material and packaging process costs, and improved product yield, longevity and tolerance. In the structure shown in FIG. 6 and FIG. 7, the thickness of the fingerprint detecting module 10 (excluding the cover 26 and the flexible circuit board 12) may be less than 300 micrometers (um); or may be less than 250 micrometers (um); in other words, The total thickness of the decorative printed layer 24, the glue layer 22 and the fingerprint detector 20 may be less than 300 micrometers (um); or may be less than 250 micrometers (um). Thus, the depth of the trenches 106 can also be about 300 microns (um) or 250 microns (um).

Referring to FIG. 8, a schematic diagram of the arrangement of the sensing electrodes and the thin film transistors of the thin film transistor layer 32 in the sensing electrode layer 34 of the fingerprint detector 20 of the present invention is illustrated. As shown in the figure, the sensing electrode layer 34 includes a plurality of sensing electrodes SE11 to SEnm, and for each sensing electrode, the thin film transistor layer 32 has a plurality of thin film transistors. For example, for the sensing electrode SE11, the thin film transistor layer 32 has two thin film transistors Q11a and Q11b. The fingerprint identification integrated circuit 50 can transmit a control signal to the thin film transistor gate in the thin film transistor layer 32 via the trace 120 of the flexible circuit board 12 to selectively turn on the thin film transistor. Furthermore, the fingerprint identification integrated circuit 50 can transmit the capacitive excitation signal to the thin film transistor source (or the drain) in the thin film transistor layer 32 via the trace of the flexible circuit board 12, thereby transmitting the capacitive excitation signal to The corresponding sensing electrode is connected to the drain (or source) of the thin film transistor, so that the fingerprint identification integrated circuit 50 senses the change of the capacitance on the corresponding sensing electrode.

However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made by the scope of the present invention should still be covered by the patent of the present invention. The scope of the scope is intended to protect. The invention may be embodied in various other modifications and changes without departing from the spirit and scope of the inventions. It is intended to fall within the scope of the appended claims. In summary, it is known that the present invention has industrial applicability, novelty and advancement, and the structure of the present invention has not been seen in similar products and public use, and fully complies with the requirements of the invention patent application, and is filed according to the patent law.

100A‧‧‧Issue electronic device

R1‧‧‧ display area

R2‧‧‧ non-display area

10A‧‧‧Finger Detection Module

this invention

100‧‧‧Electronic devices

R1‧‧‧ display area

R2‧‧‧ non-display area

D1, D2‧‧ Direction

10‧‧‧Finger Detection Module

12‧‧‧Soft circuit board

120‧‧‧Wiring

102‧‧‧ display

104‧‧‧protective glass

106‧‧‧ trench

108‧‧‧Guide structure

20‧‧‧Finger Detector

22‧‧‧Glued layer

24‧‧‧Decorative printing layer

26‧‧‧ Cover

30‧‧‧Substrate

32‧‧‧Thin film transistor layer

34‧‧‧Induction electrode layer

SE11~SEnm‧‧‧Induction electrode

Q11a, Q11b‧‧‧ film transistor

FIG. 1 is a front elevational view of an electronic device having a fingerprint detecting module according to a prior art.

2 is a schematic view showing the application of a fingerprint detecting module embedded in a display protection glass according to the present invention.

3A and 3B are respectively side views showing two different angles of the fingerprint detecting module of the display protection glass of the present invention.

4A is a schematic diagram of a stacking of fingerprint detecting modules according to an embodiment of the invention.

4B is a schematic diagram of a stack of fingerprint detecting modules according to another embodiment of the present invention.

4C is a schematic diagram of a stacking of fingerprint detecting modules according to still another embodiment of the present invention.

FIG. 5A is a schematic diagram of a stack of fingerprint detectors according to an embodiment of the invention.

FIG. 5B is a schematic diagram of a stack of fingerprint detectors according to another embodiment of the invention.

6 is a side view of the fingerprint detecting module of the display protection glass of the present invention.

FIG. 7 is a side view of the fingerprint detecting module of the display protection glass of the present invention.

Figure 8 shows a schematic view of a thin film transistor layer of the present invention.

Claims (11)

An electronic device having an embedded fingerprint detecting module, comprising: a display having a display surface; a protective glass having an inner surface and an outer surface opposite the inner surface, the inner surface being attached to the display On the display surface, the protective glass is provided with a groove on the outer surface of the display, the groove is formed at one edge of the protection glass, and is disposed on the outer surface, the groove does not penetrate The cover glass is disposed in the groove, the fingerprint detection module includes: a fingerprint detector; and a cover plate glued to a side of the fingerprint detector; wherein The fingerprint detecting module does not include the cover plate having a thickness of less than 300 micrometers. The electronic device with the embedded fingerprint detecting module according to claim 1, wherein the cover material is glass, ceramic, sapphire or polymer material. The electronic device with an embedded fingerprint detecting module according to claim 2, wherein the fingerprint detecting module further comprises a decorative printing layer disposed on a side of the cover facing the fingerprint detector The decorative printed layer is printed, sprayed or sputtered to have a predetermined color or texture pattern. The electronic device having the embedded fingerprint detecting module according to claim 1, wherein the fingerprint detecting module further comprises a flexible circuit board, and one end of the fingerprint detecting module is attached or pressure welded to the fingerprint detecting device. The electronic device having the embedded fingerprint detecting module described in claim 4, the fingerprint detecting module further comprising a fingerprint detecting integrated circuit disposed on the flexible circuit board. The electronic device with the embedded fingerprint detecting module described in claim 1, the fingerprint detector further comprising: A substrate is a glass substrate, a polymer film substrate or a metal substrate; and a sensing electrode layer is provided with a plurality of fingerprint sensing electrodes. An electronic device having an embedded fingerprint detecting module according to claim 6, wherein the fingerprint detector further comprises a thin film transistor layer, and a plurality of thin film transistors and a plurality of traces are disposed. The electronic device having the embedded fingerprint detecting module according to claim 6, wherein the fingerprint detecting module further comprises a fingerprint detecting integrated circuit disposed on the substrate. The fingerprint detecting module of the display protection glass as claimed in claim 1, wherein an edge of the groove of the display protection glass is provided with a lead angle structure. For the electronic device with the embedded fingerprint detecting module described in claim 1, the groove of the protective glass may be located at a relative position of the display area or the non-display area of the display. The electronic device having the embedded fingerprint detecting module according to claim 1, wherein the fingerprint detecting module does not include the cover plate having a thickness of less than 250 micrometers.