TWI626326B - Evaporation and deposition system equipped with diffusion apparatus - Google Patents

Abstract

An evaporation system comprising an evaporation device for evaporating organic material to form a vaporized gas; a thermal cracking device connected to the evaporation device, heating and holding temperature for thermally cracking the vaporized gas entering the thermal cracking device to form an organic a material monomer; a coating chamber connected to the thermal cracking device, the organic material monomer material entering the coating cavity for coating; and a diffusion device located in the thermal cracking device, the diffusion device comprising a diffusion nozzle having a plurality of holes At least one of the combination with a baffle.

Description

Evaporation system with diffusion device

The present invention relates to an evaporation system, and more particularly to an evaporation system having a diffusion device that reduces the vapor deposition flow rate of the material and improves the uniformity of the coating.

In recent years, with the vigorous development of 3C products, many electronic components tend to be miniaturized. Therefore, the conventional methods for fabricating electronic component insulating layers need to be changed as the electronic components are miniaturized. For example, a parylene film is most commonly used for making insulating layers for this generation. The Parylene film needs to be plated in a vacuum chamber. The principle of the plating is that the white powder starting material dimer double body is sublimated into a gaseous state in a vacuum chamber at 150 ° C, and then enters the 650 ° C thermal cracking chamber to form a monomer form. Then, the monomer was introduced into a normal temperature (25 ° C) process chamber, and polymerized into a Parylene film on the substrate. Parylene has many good features, such as room temperature, no residual stress after coating, precise control of deposited film thickness and uniformity, acid and alkali resistance, good dielectric properties, colorless and high transparency, etc. Widely used in the electrical isolation of printed circuit boards, moisture protection of sensors or medical instruments, and corrosion protection of metal coatings. The characteristics of room temperature coating make Parylene a structural coating material that can be used with a photoresist sacrificial layer.

Parylene coating is a high temperature cracking monomer in a vacuum deposition chamber In the organic polymerization mode, if the monomer concentration is too high, the flow rate is faster and the whitening gas phase nucleation is easy to occur, which also causes the coating uniformity to be poor, which is closely related to the flow field behavior of the evaporation source. The traditional solution is to reduce the amount of Parylene powder in the front evaporating device, to reduce the amount of Parylene vapor, and to reduce the flow rate of the monomer concentration, thereby improving the nucleation and whitening of the Parylene film. However, the problem of the method is the whole. The coating rate is greatly reduced, and the yield is limited by the amount of Parylene powder. This is a big concern for mass production.

The invention relates to an evaporation system with a diffusion device, which can reduce the evaporation flow rate of the organic material and improve the uniformity of the coating, so as to effectively improve the gas phase nucleation whitening phenomenon of the organic material and achieve the effect of uniform diffusion of the vapor deposition gas. To improve the properties of the coated product.

According to an embodiment, an evaporation system is provided, comprising an evaporation device for evaporating organic material to form a vaporized gas; a thermal cracking device connected to the evaporation device, heated and held for thermal cracking into the thermal cracking device a vaporized gas to form an organic material monomer; a coating chamber connected to the thermal cracking device, the organic material monomer material entering the coating cavity for coating; and a diffusion device located in the thermal cracking device, the diffusion device including at least A diffusion nozzle having a plurality of holes.

According to an embodiment, an evaporation system is further provided, including an evaporation device for evaporating organic material to form a vaporized gas; a thermal cracking device connected to the evaporation device, heated and held for thermal cracking into the thermal cracking device a vaporized gas to form an organic material monomer; a coating chamber connected to the thermal cracking device, the organic material monomer material entering the coating cavity for coating; and a diffusion device located at In the thermal cracking apparatus, the diffusing means includes at least one of a diffusion nozzle having a plurality of holes and a shutter combination.

In order to better understand the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings are set forth below. However, the scope of the invention is defined by the scope of the appended claims.

1‧‧‧ evaporation system

10‧‧‧Evaporation unit

20‧‧‧Thermal cracker

202‧‧‧ Thermal cracking chamber

204‧‧‧heating department

A _Heat ‧‧‧heating temperature zone

30‧‧‧coating cavity

40‧‧‧Diffusion device

402‧‧‧Diffusion nozzle

402h‧‧‧ hole

40M‧‧‧Substrate

402t‧‧‧ upper surface

402b‧‧‧ lower surface

405‧‧‧Block combination

405a, 405b, 405c, 405d, 405e‧‧ ‧

1 is a schematic view of an evaporation system according to an embodiment of the present disclosure.

Figure 2 is a partial enlarged view of the circled portion in Figure 1.

3 is a schematic view of a diffusion device in an evaporation system according to an embodiment of the present disclosure.

4 is a schematic view of a diffusing device disposed in a thermal cracking chamber according to an embodiment of the present disclosure.

Fig. 5A is a distribution diagram of the vapor deposition fluid jet concentration after the Parylene organic vapor-deposited organic monomer vapor entering the coating chamber in the first experiment without the diffusion device.

5B and 5C are fluid velocity distribution diagrams of Parylene organic vapor-deposited organic monomer vapor entering the coating chamber without diffusion device in Experiment 1.

Fig. 5D is a graph of Parylene actually formed according to Experiment 1.

Fig. 6A is a distribution diagram of the vapor deposition fluid jet concentration after the Parylene organic vapor-deposited organic monomer vapor of the diffusion nozzle is placed in the coating chamber in the second experiment.

6B and 6C are fluid velocity distribution diagrams of the Parylene organic vapor-deposited organic monomer vapor which only provided the diffusion nozzle in the experiment 2 after entering the coating chamber.

Fig. 6D is a graph of Parylene actually formed according to Experiment 2.

Fig. 7A is a distribution diagram of the vapor deposition fluid jet concentration after the Parylene organic vapor-deposited organic monomer vapor is placed in the coating chamber in the third experiment.

7B and 7C are fluid velocity distribution diagrams of the Parylene organic vapor-deposited organic monomer vapor which only sets the flap combination in the experiment 3 after entering the coating chamber.

Fig. 7D is a graph of Parylene actually formed according to Experiment 3.

Fig. 8A is a distribution diagram of the vapor deposition fluid jet concentration after the Parylene organic vapor-deposited organic monomer vapor of the diffusion head and the plurality of flaps are placed in the coating chamber in the fourth experiment.

8B and 8C are fluid velocity distribution diagrams of the Parylene organic vapor-deposited organic monomer vapor which is provided with the diffusion nozzle and the stopper in the experiment 4 after entering the coating chamber.

Fig. 8D is a graph of Parylene actually formed according to Experiment 4.

The embodiment proposes an evaporation system, and particularly relates to an evaporation system having a diffusion device, which can reduce the vapor deposition flow rate of the organic material and improve the uniformity of the coating. Compared with the conventional vapor deposition method, the vapor deposition system of the embodiment can effectively improve the gas phase nucleation whitening phenomenon of the organic material and achieve the effect of diffusion homogenization, and improve the product properties of the organic material vapor deposition film formation.

The vapor deposition system of the present disclosure can be applied to the production of organic materials, such as the production of parylene vapor deposited films. Hereinafter, several sets of embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Relevant structural details such as related components and spatial configurations are as described in the following examples. However, the disclosure is not limited to the description, and the disclosure does not show all possible embodiments. The same or similar reference numerals in the embodiments are used to designate the same or similar parts. Furthermore, not Other implementations proposed by the present disclosure may also be applicable. Variations and modifications of the structure of the embodiments can be made in the relevant embodiments without departing from the spirit and scope of the disclosure. The drawings have been simplified to clearly illustrate the contents of the embodiments, and the dimensional ratios in the drawings are not drawn to scale in terms of actual products. Therefore, the description and illustration are for illustrative purposes only and are not intended to be limiting.

1 is a schematic view of an evaporation system according to an embodiment of the present disclosure. The evaporation system 1 of an embodiment includes an evaporation device 10, a thermal cracking device 20, a coating chamber 30, and a diffusion device 40. The evaporation device 10 is configured to evaporate an organic material to form a vaporized gas; the thermal cracking device 20 is coupled to the evaporation device 10 (for example, located behind the evaporation device 10 and connected to an outlet end of the evaporation device 10) for vaporization into the thermal cracking device 20. The gas is heated and held at a temperature to thermally crack the vaporized gas to form an organic material monomer. The coating chamber 30 is connected to the thermal cracking device 20, and the organic material monomer material enters the coating chamber 30 for coating. The diffusion device 40 is then located in the thermal cracker 20. As shown in FIG. 1, the diffusing device 40 is disposed, for example, at a junction adjacent to the thermal cracking device 20 and the coating chamber 30.

Figure 2 is a partial enlarged view of the circled portion in Figure 1. Please refer to Figures 1 and 2 at the same time. In one embodiment, the thermal cracking unit includes a thermal cracking chamber 202 and a heating portion 204. The heating unit 204 coats the thermal cracking chamber 202 to form a heating temperature holding area A _Heat in the thermal cracking chamber 202 (Fig. 1). The diffusion device 40 is disposed in the thermal cracking chamber 202 and is located in the heating temperature holding area A _Heat (Fig. 1). The dispersing device 40 is arranged to reduce the vapor deposition flow rate (that is, the flow rate of the vaporized gas of the organic material) and increase the thermal cracking reaction time, so that the vaporized organic material can be completely cracked, so that the quality of the formed vapor deposited film can be effectively improved, for example, improved. The phenomenon of gas phase nucleation whitening of the organic material and the effect of diffusing the organic material monomer material into the coating cavity 30 to achieve a more uniform effect.

3 is a schematic view of a diffusion device in an evaporation system according to an embodiment of the present disclosure. 4 is a schematic view of a diffusing device disposed in a thermal cracking chamber according to an embodiment of the present disclosure. According to the present disclosure, the diffusion device 40 includes a diffusion nozzle 402 and a shutter assembly 405 having a plurality of apertures. The diffusion device 40 may also have only a diffusion nozzle 402 or only a shutter assembly 405.

In one embodiment, the diffusion device 40 includes, for example, a diffusion showerhead 402 having a plurality of holes 402h; as shown in FIG. 1, the diffusion showerhead 402 is disposed, for example, adjacent to the junction of the thermal cracker 20 and the coating cavity 30. . The diffusion nozzle 402 includes a base 40M having an upper surface 402t and a lower surface 402b, the holes 402h being a plurality of through holes extending through the upper surface 402t and the lower surface 402b of the substrate 40M. The organic material single system formed after the thermal cracking passes through the holes 402h (through holes) and enters the plating chamber 30.

In another embodiment, the diffusing device 40 is, for example, a flap assembly 405 comprising at least two or more than one plurality of flaps, such as the flaps 405a, 405b, 405c, 405d shown in FIGS. 3 and 4. 405e, which can prolong the flow path of the vaporized organic material in the thermal cracking chamber 202, thereby increasing the thermal cracking time. Furthermore, the present invention is not particularly limited in the thermal cracking chamber 202 and the baffles 405a, 405b, 405c, 405d, 405e may be equally or non-equally distributed.

In another embodiment, the diffusing device 40 can include, for example, both, including a diffusion nozzle 402 (having a plurality of holes 402h) and a flap assembly 405. The shutter assembly 405 includes, for example, flaps 405a, 405b, 405c, 405d. 405e) A total of five flaps, but the flap assembly 405 can also be used without limiting five flaps, or at least Two blanks. The diffusion device 40 including the diffusion nozzle 402 and the shutter assembly 405 is illustrated in FIG. 1 , wherein the diffusion device 40 is disposed between the spacers (eg, 405a-405e) and the coating chamber 30.

In one embodiment, as shown in Figures 1, 2, and 4, the thermal cracking chamber 202 is a cylindrical chamber, and the flaps, for example, 405a-405e are shaped, for example, as semi-circular flaps, adjacent semicircles. The flap partially shields different cross-sectional areas of the cylindrical chamber, for example, the flap 405a covers the left half cross-sectional area of the cylindrical chamber, and the next flap 405b covers the right half cross-sectional area of the chamber, and then A flap 405c obscures the left half cross-sectional area of the chamber, etc., thus alternately shielding the left and right (or upper and lower) two-half cross-sectional areas of the chamber, thereby causing the thermal cracking chamber 20 to form a curved flow path. The flap assembly 405 is configured to extend the flow path of the vaporized gas into the thermal cracker 202, increasing the thermal cracking reaction time.

In one embodiment, the diffusion showerhead 402 is sized, for example, such that the substrate 40M has an area substantially equal to the cross-sectional area of the thermal cracking chamber 202 (ex: cylindrical chamber). When the diffusion device 40 is placed in the thermal cracking chamber 202, the substrate 40M can be disposed at the entrance of the coating chamber 30 so that the cracked monomer can enter the coating chamber 30 only through the holes 402h. In one embodiment, the semicircular baffles, such as 405a-405e, have a radius of the cross-section of the cylindrical cavity having a radius of about 90% to 100%, such that most of the gas flows in the curved passage. In one embodiment, the flap is, for example, a portion of the outer edge of the flap adjacent to or even in contact with the inner wall of the thermal cracking chamber 202 (ex: cylindrical chamber) to effectively extend the flow path of the gas.

In summary, the flap assembly 405 disposed in the thermal cracking chamber 202 and located in the heated temperature holding zone A _Heat (Fig. 1) can extend the flow path of the vaporized organic material in the thermal cracking chamber 202, thereby increasing thermal cracking. Time, the vaporized organic material vapor can be completely cracked. The diffusion nozzle 402 is disposed, for example, at the junction of the thermal cracking chamber 202 and the coating chamber 30 and can be disposed in the heating temperature holding region A _Heat to reduce the flow rate of the organic material monomer into the coating chamber.

Hereinafter, a method for producing a vapor-deposited film of parylene according to the vapor deposition system of Fig. 1 will be briefly described as a description of one of the applicable aspects of the present disclosure. Parylene is a high molecular polymer. Unlike the common method of preparation by liquid coating method, Parylene is polymerized on the surface of the object to complete deposition via a reactive monomer gas. In the deposition process, a di-para-xylylene dimer material is placed in the evaporation device 10 to be heated and vaporized (for example, 150 ° C), and then the vaporized gas is heated. The pyrolysis device 20 (such as the thermal cracking chamber 202) is subjected to pyrolysis (for example, 650 ° C) as a monomer of para-xylylene, and finally the monomer is introduced into the coating cavity 30 through the diffusion nozzle 402 of the diffusion device 40. Polymerization is deposited to form a Parylene organic film, for example, deposited on a substrate surface by vapor deposition (CVD). Parylene organic film can form a pinhole-free film layer, has excellent water-blocking oxygen characteristics, colorless and high transparency, high dielectric strength, and excellent resistance to rust, corrosion and weathering. Other organic materials such as C-type parylene C, parylene D, parylene N, and parylene F may also be used. The deposition is carried out using the evaporation system of the present disclosure.

In the examples, Parylene was used as an example to propose an array-related experiment, and the jet concentration concentration simulation analysis and fluid velocity simulation analysis of organic monomer vapor were carried out, and the product of Parylene actual film formation was observed. The following sets of experiments and related results are presented as examples of the examples.

<Experiment 1>

Experiment 1 was a control group, that is, no diffusion device was provided in the thermal cracking device. The organic material Parylene is still coated with an evaporation system as shown in Fig. 1 (including the evaporation device 10, the thermal cracking device 20, and the coating chamber 30, which is the standard Parylene standard plating process in the industry), but no diffusion device is provided. 40. Fig. 5A is a distribution diagram of the vapor deposition fluid jet concentration after the Parylene organic vapor-deposited organic monomer vapor entering the coating chamber in the first experiment without the diffusion device. Among them, the argon gas is used for the simulation analysis of the jet concentration, and the argon concentration in the thermal cracking chamber and the inlet of the coating chamber is 1, and the concentration after entering the coating chamber is expressed as the ratio of the argon gas concentration 1. As shown in Fig. 5A, Parylene organic vapor deposition has no diffusion device. It can be known from the simulation analysis of the jet concentration that the high concentration of the vapor deposition source results in a fast flow rate, that is, the rapid flow of the vapor deposition fluid (organic vapor) causes poor diffusion effect.

5B and 5C are fluid velocity distribution diagrams of Parylene organic vapor-deposited organic monomer vapor entering the coating chamber without diffusion device in Experiment 1. Fig. 5D is a graph of Parylene actually formed according to Experiment 1. It can be seen from the flow field simulation shown in Figs. 5B and 5C that the organic vapor directly sprays directly in the coating chamber 30 without a diffusion device, resulting in a phenomenon of gas phase nucleation whitening. The Parylene film which is actually formed in the coating chamber 30 is obtained as a Parylene film which is whitened and opaque and non-uniform, as shown in Fig. 5D.

<Experiment 2>

In the second experiment, the influence of the diffusion nozzle 402 on the vapor deposition of Parylene in the thermal cracking device was simulated. The organic material Parylene is still coated by the vapor deposition system shown in Fig. 1, but only the diffusion nozzle 402 having a plurality of holes 402h is provided, and the shutter assembly 405 is not provided. Figure 6A shows that only experiment 2 The distribution profile of the vapor deposition fluid spray concentration after the Parylene organic vapor-deposited organic monomer vapor of the diffusion nozzle enters the coating chamber. Among them, the simulation analysis of the jet concentration was carried out with argon gas. The Parylene organic vapor deposition diffusion device (diffusion nozzle 402) has been effective in reducing the flow rate. From the simulation analysis of the jet concentration shown in Fig. 6A, it can be seen that the diffusion range is already more than the diffusion range without the diffusion device (Fig. 5A). More extensive.

6B and 6C are fluid velocity distribution diagrams of the Parylene organic vapor-deposited organic monomer vapor which only provided the diffusion nozzle in the experiment 2 after entering the coating chamber. Fig. 6D is a graph of Parylene actually formed according to Experiment 2. From the flow field simulation shown in Figures 6B and 6C, it can be seen that the rapid flow of organic vapor through the diffusion device (diffusion nozzle 402) in the coating chamber 30 can effectively reduce the flow rate, but the flow rate of the organic vapor before the diffusion nozzle is still fast (ie The flow rate in the thermal cracking chamber 202 is still relatively fast, faster than the flow rate of the organic vapor in the thermal cracking chamber 202 of Experiment 3. The Parylene film which is actually formed in the coating chamber 30 is obtained as a Parylene film which is transparent but has uneven rainbow pattern, as shown in Fig. 6D.

<Experiment 3>

In Experiment 3, the effect of the set flap assembly 405 on the vapor deposition of Parylene in the thermal cracking apparatus was simulated. The organic material Parylene is still coated using an evaporation system as shown in Fig. 1, but only the shutter assembly 405 (a plurality of shutters such as 405a-405e) is provided, and the diffusion nozzle 402 provided with a plurality of holes 402h is not provided. Fig. 7A is a distribution diagram of the vapor deposition fluid jet concentration after the Parylene organic vapor-deposited organic monomer vapor is placed in the coating chamber in the third experiment. Among them, the simulation analysis of the jet concentration was carried out with argon gas. Parylene organic vapor deposition via flap assembly 405 (blocks 405a-405e) has been effective in reducing the flow rate. It can be seen from the simulation analysis of the jet concentration shown in Figure 7A that the diffusion range is already better than that without the diffusion device (5A). Figure) The spread range is broader.

7B and 7C are fluid velocity distribution diagrams of the Parylene organic vapor-deposited organic monomer vapor which only sets the flap combination in the experiment 3 after entering the coating chamber. Fig. 7D is a graph of Parylene actually formed according to Experiment 3. From the flow field simulation shown in Figures 7B and 7C, it can be seen that the rapid flow of organic vapor through the baffle in the coating chamber 30 can effectively reduce the flow rate, but the flow rate of the organic vapor before entering the coating chamber 30 is still fast (ie organic vapor) The flow rate in the thermal cracking chamber 202 is still relatively fast, faster than the flow rate of the organic vapor in the thermal cracking chamber 202 of Experiment 4. The Parylene film which is actually formed in the coating chamber 30 is obtained as a Parylene film which is transparent but has uneven rainbow pattern, as shown in Fig. 7D. Furthermore, the effect of lowering the flow rate with only the diffusion nozzle (Experiment 2) is slightly better than that of the diffusion only baffle (Experiment 3).

<Experiment 4>

In the fourth experiment, the influence of the diffusion nozzle 402 and the shutter assembly 405 on the vapor deposition of Parylene in the thermal cracking device was simulated. The organic material Parylene is applied by an evaporation system as shown in Fig. 1, and the diffusion device 40 includes a diffusion nozzle 402 and a plurality of shutters such as 405a-405e. Fig. 8A is a distribution diagram of the vapor deposition fluid jet concentration after the Parylene organic vapor-deposited organic monomer vapor of the diffusion head and the plurality of flaps are placed in the coating chamber in the fourth experiment. Among them, the simulation analysis of the jet concentration was carried out with argon gas. Parylene organic vapor deposition is passed through a diffusion device such as Experiment 3 (diffusion nozzle 402 + baffle), diffusion nozzle 402 is used to reduce the flow rate of organic evaporation; diffusion baffles such as 405a-405e allow organic evaporation to prolong the flow in thermal cracking chamber 202 The path, which in turn increases the thermal cracking time, allows the vaporized organic vapor to be completely cracked.

As shown in the simulation analysis of the jet concentration shown in Fig. 8A, it can be known that the diffusion range of the organic vapor in the coating chamber of Experiment 4 is larger than that of Experiments 2 and 3. The area is much wider, and the diffusion range is significantly larger than that without the diffusion device (Fig. 5A). 8B and 8C are fluid velocity distribution diagrams of the Parylene organic vapor-deposited organic monomer vapor which is provided with the diffusion nozzle and the stopper in the experiment 4 after entering the coating chamber. Fig. 8D is a graph of Parylene actually formed according to Experiment 4. From the flow field simulation shown in Figures 8B and 8C, it can be seen that the rapid flow of organic vapor through the diffusion device (diffusion nozzle 402 + baffle) has greatly reduced the flow rate (ex: the flow rate ratio of the organic vapor in the thermal cracking chamber 202 of Experiment 4 Experiments 2 and 3 are going to drop a lot). As shown in FIG. 8D, the Parylene which is actually formed in the coating chamber 30 can effectively improve the nucleation whitening phenomenon of Parylene, and obtain a transparent and uniform Parylene film effect.

In summary, the vapor deposition system with a diffusion device as set forth in the above embodiments is designed, for example, to include at least one of a diffusion showerhead and a diffusion barrier, and the diffusion device is disposed in the thermal cracking device (ex: thermal cracking chamber), wherein The organic vapor deposition can be reduced in flow rate by the diffusion nozzle, and the organic vapor deposition in the thermal cracking chamber can be extended by the diffusion barrier. Thus, the diffusion device of the embodiment can reduce the evaporation flow rate and/or increase the thermal cracking reaction time (to enable complete vaporization of the vaporized organic material vapor). Compared with the conventional vapor deposition method, the vapor deposition system of the embodiment can effectively improve the gas phase nucleation whitening phenomenon of the organic material and achieve the effect of diffusion homogenization, and improve the product properties of the organic material vapor deposition film formation. For example, in one embodiment, a diffusion nozzle and a diffusion barrier are provided to obtain a transparent and uniformized Parylene vapor-deposited film. Furthermore, the diffusion device proposed in the embodiment has high compatibility with the existing vapor deposition system, can be easily placed in the original thermal cracking chamber, and has the advantages of simple and convenient setting procedure and easy replacement, without excessive increase. In the case of manufacturing cost, the product properties of the organic film formation can be greatly improved, and thus the design of the present disclosure is extremely economical in application.

Other embodiments, such as an evaporation device, a thermal cracking device, a coating chamber The known components of the body will not be described here, and the related components of the diffusion device may have different component arrangement and arrangement, etc., and may also be applied, and may be appropriately adjusted or changed depending on the actual needs and conditions of the application. Therefore, the structures shown in the specification and drawings are for illustrative purposes only and are not intended to limit the scope of the disclosure. In addition, it is to be understood by those skilled in the art that the shapes and positions of the components in the embodiments are not limited to those illustrated in the drawings, and the requirements and/or manufacturing steps according to actual applications are not deviated from the spirit of the disclosure. In the case of the situation can be adjusted accordingly.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Claims (16)

An evaporation system comprising: an evaporation device for evaporating organic material to form a vaporized gas; a thermal cracking device coupled to the evaporation device, heated and maintained to thermally crack the vaporized gas entering the thermal cracking device, Forming an organic material monomer; a plating chamber connected to the thermal cracking device, the organic material monomer material entering the coating cavity for coating; and a diffusion device located in the thermal cracking device, the diffusion device comprising at least A diffusion nozzle having a plurality of holes, and at least two flaps are distributed in the thermal cracking device to extend a flow path of the vaporized gas entering the thermal cracking device. The vapor deposition system of claim 1, wherein the diffusion nozzle is disposed adjacent to a junction of the thermal cracking device and the coating chamber. The vapor deposition system of claim 1, wherein the thermal cracking device comprises: a thermal cracking chamber; and a heating portion covering the thermal cracking chamber to form a heating temperature holding region in the thermal cracking chamber; Wherein the diffusion device is disposed in the thermal cracking chamber and is located in the heating temperature holding region. The vapor deposition system of claim 1, wherein the diffusion nozzle is located between the spacers and the coating chamber. The vapor deposition system of claim 1, wherein the thermal cracking device comprises a cylindrical one type thermal cracking chamber, the diffusion head comprising a circular substrate, the holes being through the circular substrate a plurality of through holes on the upper surface and the lower surface, the circle The area of the substrate is equal to the cross-sectional area of the thermal cracking chamber. The vapor deposition system of claim 5, wherein the baffles respectively shield a portion of the cross-section of the thermal cracking chamber such that the thermal cracking chamber forms a curved flow path. The vapor deposition system of claim 5, wherein the baffles are semi-circular baffles having a radius of 90% to 100% of a cross section of the thermal cracking chamber. radius. The vapor deposition system of claim 1, wherein the diffusion nozzle comprises a base having an upper surface and a lower surface, the holes being through the upper surface and the lower surface of the substrate Multiple through holes. The vapor deposition system of claim 1, wherein the aforementioned organic material comprises parylene. The vapor deposition system according to claim 1, wherein the organic material comprises parylene C, parylene D, and parylene N. ), F-type parylene F (parylene F). An evaporation system comprising: an evaporation device for evaporating organic material to form a vaporized gas; a thermal cracking device coupled to the evaporation device, heated and maintained to thermally crack the vaporized gas entering the thermal cracking device, Forming an organic material monomer; a plating chamber connected to the thermal cracking device, the organic material monomer entering the coating cavity for coating; and a diffusion device located in the thermal cracking device, the diffusion device comprising a plurality One of the holes is a diffusion nozzle that is combined with a baffle that includes at least two baffles distributed in the thermal cracker. The vapor deposition system of claim 11, wherein the diffusion device comprises: the diffusion nozzle disposed adjacent to the junction of the thermal cracking device and the coating chamber. The vapor deposition system of claim 12, wherein the diffusion nozzle of the diffusion device is located between the shutter and the coating chamber. The vapor deposition system of claim 13, wherein the diffusion nozzle comprises a base having an upper surface and a lower surface, the holes being through the upper surface and the lower surface of the substrate Multiple through holes. The vapor deposition system of claim 11, wherein the thermal cracking device comprises: a thermal cracking chamber; and a heating portion covering the thermal cracking chamber to form a heating and holding temperature region in the thermal cracking chamber; Wherein the diffusion device is disposed in the thermal cracking chamber and is located in the heating temperature holding region. The vapor deposition system of claim 11, wherein the organic material comprises parylene C, parylene D, and parylene N. ), F-type parylene F (parylene F).