TWI626119B - Cutting apparatus, manufacturing method of polishing pad - Google Patents

Abstract

A cutting device for cutting a polishing pad blank into a continuous elongated abrasive layer or liner layer having a predetermined thickness. The continuous strip of abrasive layer or liner layer described above can be used to make a polishing pad. The above cutting device includes a rotating mechanism and a cutting mechanism. The rotating mechanism is used to carry the polishing pad semi-finished product. A cutting mechanism is used to cut the polishing pad semi-finished product. When the cutting is performed, the polishing pad semi-finished product rotates in the circumferential direction, and as the cutting time progresses, the radius of the polishing pad blank is gradually reduced until the cutting action is completed.

Description

Cutting device, method of manufacturing polishing pad

The present invention relates to a cutting device, a method of manufacturing a polishing pad, and a polishing pad, and more particularly to a cutting device for producing a polishing pad having a high speed, a method of manufacturing the polishing pad, and a polishing pad.

As the industry advances, flattening processes are often adopted as processes for producing various components. In the planarization process, the CMP process is often used in the industry; in general, the chemical mechanical polishing (CMP) process is performed by supplying a slurry with a chemical mixture onto the polishing pad and treating it. The abrasive article applies pressure to press it against the polishing pad and causes the article and the polishing pad to move relative to one another. By the mechanical friction generated by the relative motion and the chemical action of the polishing liquid, the surface layer of some objects is removed, and the surface thereof is gradually flattened to achieve the purpose of planarization. The polishing pad can be a single layer polishing pad with only an abrasive layer, or a double or multiple layer polishing pad comprising an abrasive layer and a liner laminate. Wherein, the surface of the polishing layer is an abrasive surface in contact with the abrasive article, and the liner layer is disposed under the polishing layer to support or buffer the abrasive layer.

In the production of the polishing pad, the polishing pad semi-finished product is usually formed first, and the polishing pad semi-finished product has a column shape, for example, a cake. After the polishing pad semi-finished product is statically formed, a cutting process is performed to form a sheet-like polishing layer having a predetermined thickness, and then a process of grooving or opening, bonding, and the like is performed to complete the production of the polishing pad. The cutting program mainly uses a cutting device to semi-finish the polishing pad. Cut into a sheet-like abrasive layer, the known cutting device is mainly composed of a fixed blade and a reciprocable table, wherein the reciprocable table is used to carry the polishing pad semi-finished product and quickly The movement causes the cutter to cut the polishing pad blank into a plurality of sheet-like abrasive layers having a predetermined thickness.

In the above cutting procedure, the single cutting operation performed by the cutter can only cut a sheet-like polishing layer having a predetermined thickness, and in practice, it is necessary to repeatedly perform a plurality of cutting operations to apply a columnar polishing pad. The semifinished product is cut into a plurality of sheet-like abrasive layers having a predetermined thickness.

The present invention provides a cutting device that can continuously cut an elongated abrasive layer or liner layer having a predetermined thickness.

The present invention provides a method of manufacturing a polishing pad which cuts an elongated abrasive layer or liner layer having a predetermined thickness in a continuous production manner.

The present invention provides a polishing pad which is formed by cutting through the above cutting device.

The present invention provides a cutting apparatus for cutting a polishing pad blank into a continuous elongated abrasive layer or liner layer having a predetermined thickness. The continuous strip of abrasive layer or liner layer described above can be used to make a polishing pad. The cutting device comprises a rotating mechanism for carrying a polishing pad semi-finished product and a cutting mechanism for cutting the polishing pad semi-finished product. When the cutting is performed, the polishing pad semi-finished product rotates in the circumferential direction, and as the cutting time progresses, the radius of the polishing pad blank is gradually reduced until the cutting action is completed.

The invention provides a method for manufacturing a polishing pad, comprising the following steps: First, a polishing pad semi-finished product is provided. Then, the polishing pad semi-finished product is transferred to the cutting device, and the cutting device has a cutting mechanism for cutting the polishing pad blank into a continuous elongated abrasive layer or liner layer having a predetermined thickness, wherein when the cutting is performed, the polishing pad semi-finished product along the cutting edge The rotation in the circumferential direction, and as the cutting time progresses, the radius of the polishing pad semi-finished product is gradually reduced until the cutting action is completed.

The invention provides a polishing pad. The polishing pad is formed by cutting the polishing pad blank into a continuous elongated polishing pad semi-finished product having a predetermined thickness by the above cutting device. The polishing pad comprises an abrasive layer or a liner layer, and the polishing layer or the liner layer is made of the continuous elongated polishing pad semi-finished product, the polishing layer or the liner layer has a first hole group and a second hole group, and the polishing layer Or the pad layer has a first area and a second area, and the first hole group is formed in the first area, and the second hole group is formed in the second area. The number of holes in the first hole group is larger than the number of holes in the second hole group; or the average hole diameter of the first hole group is larger than the average hole diameter of the second hole group.

Based on the above, the present invention performs a continuous and uninterrupted cutting process through a cutting device to cut a continuous elongated polishing layer or liner layer having a predetermined thickness, and then the polishing pad or liner layer is used to manufacture the polishing pad. Accordingly, the production of the polishing pad by the method of manufacturing the polishing pad of the present invention can improve the production efficiency of the polishing pad. In addition, the polishing pad produced by the cutting apparatus of the present invention can select the characteristics of the abrasive layer or the backing layer for the needs of certain specific polishing processes, whereby the desired polishing characteristics can be obtained.

In order to make the above features and advantages of the present invention more obvious, the following The embodiments are described in detail with reference to the accompanying drawings.

1 is a schematic flow chart of a manufacturing process of a polishing pad according to an embodiment of the present invention. Referring to Figure 1, first, a polishing pad blank 10 is provided. In the present embodiment, the polishing pad blank 10 can be formed by an upright die casting method or a lateral die casting method, and the shape of the polishing pad blank 10 is, for example, a cylindrical shape.

The polishing pad blank 10 is transferred to the cutting device 200. For example, the cutting device 200 includes a rotating mechanism 210, and the rotating mechanism 210 can carry the polishing pad blank 10. In the embodiment of FIG. 1, the polishing pad blank 10 is, for example, clamped from the side by the rotating mechanism 210 to be carried on the rotating mechanism 210 of the cutting device 200, wherein the rotating mechanism 210 is, for example, a rotating shaft, a cylindrical polishing pad. The center of the semi-finished product 10 is fixed to the rotating shaft, so that the rotating mechanism 210 can drive the cylindrical polishing pad blank 10 to rotate in the circumferential direction D1 during operation.

The cutting device 200 has a cutting mechanism 220 for cutting the polishing pad blank 10, for example a fixed cutter. When the cutting process is performed, the relative position of the rotating mechanism 210 and the cutting mechanism 220 can be controlled such that the cutting end of the cutting mechanism 220 contacts the polishing pad blank 10, so that the rotating mechanism 210 starts to operate so that the polishing pad semi-finished product 10 continues in the circumferential direction D1. The ground is rotated, and a continuous cutting action is performed along the cutting direction D2 to cause the polishing pad blank 10 to be cut by the cutting mechanism 220 into a continuous and uninterrupted elongated abrasive layer or liner layer 10a.

As the cutting action proceeds, the volume of the polishing pad semi-finished product 10 will be The gradient is small until the cut is complete. In other words, the radius of the polishing pad blank 10 is gradually reduced during the cutting process. In this continuous cutting process, the relative position between the rotating mechanism 210 and the cutting mechanism 220 can be controlled to ensure that the cutting device 200 can perform the cutting action without interruption. For example, the relative position between the rotating mechanism 210 and the cutting mechanism 220 may be controlled by moving one of the rotating mechanism 210 and the cutting mechanism 220 or both, with an appropriate distance therebetween. In one embodiment, the relative position of the cutting mechanism 220 is gradually moved in a direction in which the radius of the polishing pad blank 10 is reduced. The rotational speed of the rotating mechanism 210 can also be controlled along with the continuous cutting process. For example, the faster the rotational speed of the rotating mechanism 210 is when cutting in the direction of decreasing radius, so that the cutting mechanism 220 has a relatively uniform cutting linear velocity.

In the embodiment of FIG. 1 , the cutting mechanism 220 is exemplified by a fixed cutter, but the invention is not limited thereto, and in other embodiments, a reciprocating cutter, a reciprocating wire saw, and a loop may also be used. Mobile cutters, loop-operated wire saws, laser cutting tools, or other suitable cutting tools.

The elongated abrasive layer or liner layer 10a that has been cut can be outputted by an output mechanism (not shown), such as an output platform or a take-up device. The above-mentioned winding device can wind the long abrasive layer or the backing layer 10a into a roll shape for storage. Further, the elongated abrasive layer or liner layer 10a which has been cut has a predetermined thickness t, for example, from 0.5 mm to 5.0 mm, wherein the thickness t of the elongated abrasive layer or liner layer 10a may depend on The distance between the rotating mechanism 210 and the cutting mechanism 220. In other words, the polishing layer or liner layer 10a having a predetermined thickness (i.e., t) can be cut by designing and adjusting the distance between the rotating mechanism 210 and the cutting mechanism 220 in accordance with the thickness of the polishing pad to be manufactured.

In an embodiment, the cutting device 200 can optionally further include a sharpening mechanism (not shown), such as a grinding wheel. If the cutting mechanism 220 is a mechanical cutter, the cutting end of the cutting mechanism 220 may be worn. When the cutting mechanism 220 cuts the polishing pad semi-finished product 10 or during the cutting process, the cutting mechanism 220 can be ground and cut by the sharpening mechanism. The cutting end of mechanism 220 maintains a sharp state.

In one embodiment, the manufacturing process for making the polishing pad using the cutting device 200 can optionally include a heating step to preheat the polishing pad blank 10 to a softened state before proceeding with the cutting process. This embodiment is particularly suitable for cutting a polishing pad made of a high-hardness material, and using a heating step to reduce the hardness of the polishing pad, which not only facilitates cutting but also prevents the cutting mechanism 220 from being passivated and worn by cutting a high-hardness material. Accordingly, the cutting device 200 can optionally include a heating mechanism (not shown), and the heating medium of the heating mechanism is, for example, an electrothermal method or a thermal fluid method. The heating mechanism can also be other suitable heating means, such as a hot air heating device or an infrared heating device. The heating mechanism can be optionally disposed on the cutting device 200 or additionally independent of the cutting device 200. The above heating step can raise and soften the temperature of the polishing pad blank 10 so that the cutting mechanism 220 can relatively easily cut the polishing pad blank 10. Preferably, the temperature of the polishing pad blank 10 is heated to a temperature close to its glass transition temperature (Tg) through a heating step, so that the polishing pad semi-finished product 10 is softened. The status will help the subsequent cutting process.

In an embodiment, the method for forming the polishing pad semi-finished product may be an upright die casting method, and the polishing pad semi-finished product formed according to the method may control the formulation of the raw material or the foaming condition, so that the polishing pad semi-finished product has at least two different holes. The region of density, and the regions of at least two different hole densities are respectively distributed at different positions in the high direction of the polishing pad semi-finished product. Here, the high direction means a direction perpendicular to the circular bottom surface of the cylindrical polishing pad blank. At the same time, the polishing layer or the liner layer made of the polishing pad semi-finished product has a plurality of holes, and the polishing layer or the liner layer has a first region and a second region, wherein the number of holes in the hole group in the first region is greater than The number of holes in the hole group in the second region, or the average hole diameter of the hole group in the first region is larger than the average pore size of the hole group in the second region.

2A is a schematic view showing the structure of a polishing pad semi-finished product according to an embodiment of the present invention. 2B is a schematic view showing the structure of the polishing pad manufactured by the polishing pad semi-finished product of FIG. 2A. Referring to FIG. 2A and FIG. 2B, in the present embodiment, the polishing pad blank 10 is formed by an upright die casting method. The upright mold infusion method is, for example, injecting a polishing pad material into an uprightly placed mold and standing still. Specifically, in this embodiment, a cylindrical mold is used, and thus the shape of the polishing pad blank 10 after standing molding is a cylindrical shape. There are a plurality of holes in the formed cylindrical polishing pad semi-finished product 10, wherein the number of holes H1 located above the cylindrical polishing pad semi-finished product 10 (ie, the region in the high direction is larger) is located below the cylindrical polishing pad semi-finished product 10 (ie, high) The number of holes H2 in the direction of the smaller direction, or the hole H1 above the cylindrical polishing pad semi-finished product 10 is larger than the average diameter of the hole in the cylindrical polishing pad The average pore size of the hole H2 below the semi-finished product 10. In other words, the volume of the hole H1 above the cylindrical polishing pad blank 10 is larger than the volume of the hole H2 located below the cylindrical polishing pad blank 10.

After the formed polishing pad blank 10 is cut through the cutting device 200 of FIG. 1 along the cutting direction D2, a subsequent processing procedure (such as a cutting process) is performed to obtain an abrasive layer or liner as shown in FIG. 2B. Layer 100a, this abrasive layer or liner layer 100a has a cutting trajectory that is substantially parallel to the cutting direction D2. Specifically, the polishing layer or liner layer 100a has a first region R1 and a second region R2, wherein the first region R1 and the second region R2 are located on opposite sides of the cutting direction. In other words, the first region R1 is above the vertical direction D3 substantially perpendicular to the cutting direction D2, and the second region R2 is below the vertical direction D3. In the present embodiment, the first region R1 corresponds to the upper position of the original cylindrical polishing pad semi-finished product 10 (ie, the region having a larger height in the high direction), and the second region R2 corresponds to the original cylindrical polishing pad semi-finished product 10, for example. The lower position (ie, the area with a smaller height). Accordingly, the number of holes H1 located in the first region R1 is larger than the number of holes H2 located in the second region R2, or the average hole diameter of the holes H1 located above the first region R1 is larger than the average pore diameter of the holes H2 located in the second region R2. In other words, the distribution directions of the first region R1 and the second region R2 are substantially parallel to the direction of the cutting track.

On the other hand, the polishing layer or liner layer 100a of FIG. 2B can be considered to have a first group of holes and a second group of holes, wherein the first group of holes is composed of holes H1 and the second group of holes is composed of holes H2. The number of holes H1 of the first hole group is larger than the number of holes H2 of the second hole group, or the first hole group The average pore diameter of the hole H1 is larger than the average pore diameter of the hole H2 of the second hole group. In addition, the shape of the polishing layer or the backing layer 100a of the present embodiment is described by taking a rectangular shape as an example, but the invention is not limited thereto. In other embodiments, the abrasive layer or backing layer can be designed as a square, a circle, or other predetermined shape.

In another embodiment, the method for forming the polishing pad semi-finished product may be a lateral die casting method, and the polishing pad semi-finished product formed according to the method may control the formulation of the raw material or the foaming condition, so that the polishing pad semi-finished product has at least two different The region of the density of the holes, and the regions of the at least two different hole densities are respectively distributed at different positions in the radial direction of the polishing pad semi-finished product. Here, the radial angle direction refers to the direction corresponding to the radius angle of the cylindrical shape of the polishing pad semi-finished product. At the same time, the polishing pad made of the polishing pad semi-finished product has a first hole group and a second hole group, and the first hole group and the second hole group are alternately arranged on the polishing pad, wherein the number of holes of the first hole group The number of holes larger than the second hole group, or the average hole diameter of the first hole group is larger than the average hole diameter of the second hole group.

3A is a schematic view showing the structure of a polishing pad semi-finished product according to an embodiment of the present invention. FIG. 3B is a schematic view showing the structure of the polishing pad manufactured by the polishing pad semi-finished product of FIG. 3A. Referring to FIG. 3A and FIG. 3B, in the present embodiment, the polishing pad blank 10 is formed by a lateral die casting method. The transverse mold infusion method is, for example, injecting the polishing pad material into a mold placed laterally and standing still. Specifically, in this embodiment, a cylindrical mold is used, and thus the shape of the polishing pad blank 10 after standing molding is a cylindrical shape. In the cylindrical polishing pad semi-finished product 10 after molding, there are a plurality of holes, which are located in the horizontal The number of holes H1 above the cylindrical polishing pad semi-finished product 10 (i.e., the region having a radius angle of about 0 to 180 degrees) is larger than the horizontal cylindrical polishing pad semi-finished product 10 (i.e., an area of about 180 to 360 degrees in the radial direction direction). The number of holes H2, or the hole H1 above the cylindrical cylindrical polishing pad blank 10, has an average pore diameter larger than the average hole diameter of the hole H2 located below the cylindrical cylindrical polishing pad blank 10. In other words, the volume of the hole H1 above the cylindrical cylindrical polishing pad blank 10 is larger than the volume of the hole H2 below the cylindrical cylindrical polishing pad blank 10.

After the formed cylindrical polishing pad blank 10 is cut through the cutting device 200 of FIG. 1 along the cutting direction D2, a subsequent processing procedure (such as a cutting process) is performed to obtain an abrasive layer as shown in FIG. 3B or The liner layer 100b has a cutting trajectory in which the direction of the cutting track is substantially parallel to the cutting direction D2. Specifically, the polishing layer or liner layer 100b has a first region R1 and a second region R2, wherein the first region R1 and the second region R2 are staggered in the cutting direction D2 on the polishing pad 100b. In the present embodiment, the first region R1 corresponds to, for example, an upper position of the cylindrical polishing pad semi-finished product 10 (ie, a region having a radius angle of about 0 to 180 degrees), and the second region R2 corresponds to the original portion. The position of the horizontal cylindrical polishing pad semi-finished product 10 (i.e., the region in the direction of the radial angle of about 180 to 360 degrees). Accordingly, the number of holes H1 located in the first region R1 is larger than the number of holes H2 located in the second region R2, or the average hole diameter of the holes H1 located above the first region R1 is larger than the average pore diameter of the holes H2 located in the second region R2. In other words, the first district The distribution direction of the domain R1 and the second region R2 is substantially perpendicular to the direction of the cutting track.

On the other hand, the polishing layer or liner layer 100b of FIG. 3B can be considered to have a first group of holes and a second group of holes, wherein the first group of holes is composed of holes H1 and the second group of holes is composed of holes H2. The number of holes H1 of the first hole group is larger than the number of holes H2 of the second hole group, the average hole diameter of the hole H1 of the first hole group is larger than the average hole diameter of the hole H2 of the second hole group, or the first hole group and the second hole group The staggered arrangement is distributed over the abrasive layer or liner layer 100b. In addition, the shape of the polishing layer or the backing layer 100b of the present embodiment is described by taking a rectangular shape as an example, but the invention is not limited thereto. In other embodiments, the abrasive layer or backing layer can be designed as a square, a circle, or other predetermined shape.

The polishing layer or the liner layer which is completed by the above cutting device can be further grooved or perforated, bonded, etc., to complete a single layer polishing pad with only the polishing layer, or include the polishing layer and the liner. Laminated double or multi-layer polishing pads. In an embodiment, particularly for a two-layer or multi-layer polishing pad, the cutting trajectory of the polishing layer and the lining layer are in the overlapping arrangement direction, and the cutting trajectories of each other may be selected to be in the same direction, or the cutting trajectories of each other may be selected. Has an angle.

In summary, the present invention drives the polishing pad semi-finished product to rotate in the circumferential direction through the rotating mechanism of the cutting device, and the cutting mechanism continuously cuts the polishing pad semi-finished product into a long abrasive layer or liner layer having a predetermined thickness. Accordingly, the production of the polishing pad by the cutting device of the present invention can improve the production efficiency of the polishing pad. In addition, the polishing pad produced by the cutting device of the present invention, The requirements of certain polishing processes can be selected from the abrasive layer or liner features detailed above to achieve the desired abrasive characteristics.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧ polishing pad semi-finished products

10a‧‧‧Abrasion or lining

100a, 100b‧‧‧grinding or lining

200‧‧‧ cutting device

210‧‧‧Rotating mechanism

220‧‧‧ cutting mechanism

D1‧‧‧ circumferential direction

D2‧‧‧ cutting direction

D3‧‧‧Vertical direction

R1‧‧‧ first area

R2‧‧‧ second area

H1, H2‧‧‧ holes

T‧‧‧thickness

1 is a schematic flow chart of a manufacturing process of a polishing pad according to an embodiment of the present invention.

2A is a schematic view showing the structure of a polishing pad semi-finished product according to an embodiment of the present invention.

2B is a schematic view showing the structure of the polishing pad manufactured by the polishing pad semi-finished product of FIG. 2A.

3A is a schematic view showing the structure of a polishing pad semi-finished product according to an embodiment of the present invention.

FIG. 3B is a schematic view showing the structure of the polishing pad manufactured by the polishing pad semi-finished product of FIG. 3A.

Claims (20)

A cutting device for cutting a polishing pad blank into a continuous elongated abrasive layer or liner layer having a predetermined thickness to manufacture a polishing pad, the cutting device comprising: a rotating mechanism for carrying the polishing pad semi-finished product And a cutting mechanism for cutting the polishing pad semi-finished product; wherein when the cutting is performed, the polishing pad semi-finished product rotates in a circumferential direction, and as the cutting time progresses, the radius of the polishing pad semi-finished product gradually decreases until Before the cutting operation is completed, the polishing pad has a plurality of holes, the polishing pad has a first area and a second area, wherein the holes in the first area have a larger number of holes than in the second area The number of holes of the holes, or the average pore diameter of the holes in the first region is larger than the average pore diameter of the holes in the second region, wherein the polishing pad semi-finished product is a cylindrical sanding pad semi-finished product. The center of the cylindrical sanding pad semi-finished product is fixed to the rotating shaft, wherein the cylindrical polishing pad semi-finished product has at least two different holes The area of the at least two different hole densities respectively distributed at different positions in the high direction of the cylindrical polishing pad semi-finished product, or the regions of the at least two different hole densities respectively distributed on the radius of the cylindrical polishing pad semi-finished product Locations with different angular directions. The cutting device of claim 1, wherein the cutting mechanism comprises a fixed cutter, a reciprocating cutter, a reciprocating wire saw, a circulating movable cutter, a circulating mobile wire saw, or a laser. Cutting tool. The cutting device of claim 1, wherein the rotating mechanism is a rotating shaft. The cutting device of claim 1, wherein the polishing pad has a first hole group and a second hole group, and the first hole group and the second hole group are alternately arranged on the polishing pad, wherein The number of holes of the first hole group is larger than the number of holes of the second hole group, or the average hole diameter of the first hole group is larger than the average hole diameter of the second hole group. The cutting device of claim 1, further comprising a heating mechanism for heating the polishing pad semi-finished product. The cutting device of claim 1, further comprising an output mechanism for outputting the polishing pad semi-finished product that has been cut. The cutting device of claim 6, wherein the output mechanism is an output platform or a take-up device. The cutting device of claim 1, further comprising a sharpening mechanism for sharpening the cutting mechanism. The cutting device of claim 8, wherein the grinding mechanism is a grinding wheel. A manufacturing method of a polishing pad, comprising: providing a polishing pad semi-finished product; and conveying the polishing pad semi-finished product to a cutting device, the cutting device having a cutting mechanism for cutting a polishing pad blank into a continuous strip having a predetermined thickness An abrasive layer or a liner layer; wherein, when the cutting is performed, the polishing pad semi-finished product rotates in a circumferential direction, and the radius of the polishing pad semi-finished product as the cutting time progresses Gradually shrinking until the cutting action is completed, wherein the polishing layer or the backing layer has a plurality of holes, the polishing layer or the backing layer having a first area and a second area, wherein the first layer is located in the first area The number of holes in the holes is greater than the number of holes in the holes in the second region, or the average pore diameter of the holes in the first region is larger than the average pore size of the holes in the second region, wherein The polishing pad semi-finished product is a cylindrical polishing pad semi-finished product, and the center of the cylindrical polishing pad semi-finished product is fixed to the rotating shaft, wherein the cylindrical polishing pad semi-finished product has at least two regions of different hole densities when the cylindrical polishing pad When the semi-finished product is formed by the upright mold infusion method, the at least two regions of different hole densities are respectively distributed at different positions in the high direction of the cylindrical polishing pad semi-finished product, or when the cylindrical polishing pad semi-finished product is formed by In the transverse die casting method, the at least two regions of different hole densities are respectively distributed in the semi-finished product of the cylindrical polishing pad Directions different angular position. The manufacturing method of the polishing pad according to claim 10, wherein the cutting mechanism comprises a fixed cutter, a reciprocating cutter, a reciprocating wire saw, a circulating movable cutter, a circulating mobile wire saw, Or laser cutting tools. The method of manufacturing a polishing pad according to claim 10, wherein the cutting device further comprises a rotating mechanism for carrying the polishing pad blank. The method of manufacturing a polishing pad according to claim 12, wherein the rotating mechanism is a rotating shaft. The method for manufacturing a polishing pad according to claim 10, wherein the polishing layer or the liner layer has a first hole group and a second hole group, and the first hole group and the second hole group are staggered. Distributed in the polishing layer or the liner layer, wherein the number of holes of the first hole group is larger than the number of holes of the second hole group, or the average hole diameter of the first hole group is larger than the average hole diameter of the second hole group. The method of manufacturing a polishing pad according to claim 10, wherein the cutting device further comprises a heating mechanism for heating the polishing pad blank. The manufacturing method of the polishing pad according to claim 10, wherein the cutting device further comprises an output mechanism for outputting the polishing pad semi-finished product that has been cut. The method for manufacturing a polishing pad according to claim 16, wherein the output mechanism is an output platform or a winding device. The method of manufacturing a polishing pad according to claim 10, wherein the cutting device further comprises a sharpening mechanism for sharpening the cutting mechanism. The method of manufacturing a polishing pad according to claim 18, wherein the grinding mechanism is a grinding wheel. The method for manufacturing a polishing pad according to claim 10, further comprising a heating step to increase the temperature of the polishing pad blank.