TWI597594B - Input output module baffle and motherboard having the same - Google Patents
Input output module baffle and motherboard having the same Download PDFInfo
- Publication number
- TWI597594B TWI597594B TW105129997A TW105129997A TWI597594B TW I597594 B TWI597594 B TW I597594B TW 105129997 A TW105129997 A TW 105129997A TW 105129997 A TW105129997 A TW 105129997A TW I597594 B TWI597594 B TW I597594B
- Authority
- TW
- Taiwan
- Prior art keywords
- baffle
- fixing plate
- module
- output module
- motherboard
- Prior art date
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
本案係有關於一種主機板。 This case is about a motherboard.
傳統上，在組裝個人電腦，例如是桌上型電腦，時，組裝人員需要將主機板、硬碟等各種電腦裝置，一一的安裝於機殼之中，並與主機板及電源供應器分別連接。而主機板上，必須配置有許多的輸出入埠，以用來連接電腦的周邊裝置連接。 Traditionally, when assembling a personal computer, such as a desktop computer, the assembler needs to install various computer devices such as a motherboard and a hard disk one by one in the casing, and separately from the motherboard and the power supply. connection. On the motherboard, a large number of input and output ports must be configured to connect the peripheral devices of the computer.
在桌上型電腦，這些輸出入埠大部分配置於機殼後方，以便於使用者進行連接相關的周邊裝置。而組裝人員將主機板安裝於電腦機殼時，必須先將一輸出入埠擋板安裝於機殼上，然後再將主機板上的輸出入埠對準輸出入埠擋板上的開口，然後再將主機板固定於機殼之上。 In the desktop computer, most of these input and output ports are disposed behind the casing, so that the user can connect the related peripheral devices. When the assembler installs the motherboard into the computer case, it must first install an input and output baffle plate on the casing, and then align the output port on the main board with the opening on the output baffle plate, and then Then fix the motherboard to the case.
然而，當組裝人員將輸出入埠擋板安裝於電腦機殼後方時，常常容易因為金屬板材較為 銳利的端面，而不慎造成受傷的情況，也增加了主機板安裝的時間。 However, when the assembler installs the output baffle plate behind the computer case, it is often easier because of the metal plate. Sharp end faces, inadvertently causing injuries, also increase the time required for motherboard installation.
本發明揭露一輸出入模組擋板，適用於一電子裝置，電子裝置具有一主機板以及一機殼，其中主機板位於機殼內，且具有一連接器模組。輸出入模組擋板包含有一固定板具有複數個固定夾，以將固定板夾持於連接器模組，一導電元件位於固定板與連接器模組之間，以及一外框位於固定板與機殼之間。 The invention discloses an input/output module baffle suitable for an electronic device. The electronic device has a main board and a casing, wherein the main board is located in the casing and has a connector module. The output module baffle includes a fixing plate having a plurality of fixing clips for clamping the fixing plate to the connector module, a conductive component between the fixing plate and the connector module, and an outer frame located on the fixing plate and Between the casings.
本發明之另一態樣係揭露一種主機板，適用於一電子裝置，電子裝置具有一機殼。主機板包含有一連接器模組以及一輸出入模組擋板。其中，輸出入模組擋板包含有一固定板具有複數個固定夾，以將固定板夾持於連接器模組，一導電元件，位於固定板與連接器模組之間，以及一外框，位於固定板與機殼之間。 Another aspect of the present invention discloses a motherboard for use in an electronic device having a housing. The motherboard includes a connector module and an input and output module shutter. The output module baffle includes a fixing plate having a plurality of fixing clips for clamping the fixing plate to the connector module, a conductive component, between the fixing plate and the connector module, and a frame. Located between the fixed plate and the case.
本發明所揭露的輸出入模組擋板及主機板，利用固定板與導電元件可以在使用時有效地增加主機板與機殼電性連接的效果，提升電子裝置的電磁干擾(Electromagnetic Disturbance，EMI)以及靜電放電(Electrostatic Discharge，ESD)的防護能力，且更可以降低電子裝置承受震動時的機殼與連接器模組之間的影響，提升電子裝置的穩定性與可靠度。且由於 輸出入模組擋板預先已安裝於主機板之上，可避免使用者為了將輸出入模組擋板組裝於機殼上而須直接透過機殼安裝的不便性與刮傷的風險，同時增加主機板安裝於機殼上的方便性與安全性。 The input and output module baffle and the motherboard of the invention can effectively increase the electrical connection between the motherboard and the casing by using the fixing plate and the conductive component, and improve the electromagnetic interference of the electronic device (Electromagnetic Disturbance, EMI) ) and the electrostatic discharge (ESD) protection capability, and can further reduce the influence between the casing and the connector module when the electronic device is subjected to vibration, and improve the stability and reliability of the electronic device. And because The input and output module baffle is pre-installed on the main board, which avoids the inconvenience and scratching risk of the user directly installing through the casing in order to assemble the output into the module baffle. The convenience and safety of the motherboard on the chassis.
100‧‧‧主機板 100‧‧‧ motherboard
110‧‧‧電路板 110‧‧‧Circuit board
120‧‧‧連接器模組 120‧‧‧Connector Module
200‧‧‧輸出入模組擋板 200‧‧‧Output module baffle
210‧‧‧導電元件 210‧‧‧Conductive components
212‧‧‧開口 212‧‧‧ openings
220‧‧‧固定板 220‧‧‧fixed board
222‧‧‧開口 222‧‧‧ openings
224‧‧‧固定夾 224‧‧‧fixed clip
230‧‧‧導電片 230‧‧‧Conductor
232‧‧‧開口 232‧‧‧ openings
240‧‧‧外框 240‧‧‧Front frame
242‧‧‧開口 242‧‧‧ openings
250‧‧‧擋板扣合件 250‧‧‧Baffle fasteners
300‧‧‧散熱模組 300‧‧‧ Thermal Module
310‧‧‧散熱片 310‧‧‧ Heat sink
320‧‧‧防塵蓋 320‧‧‧Dust cover
400‧‧‧機殼 400‧‧‧Chassis
500‧‧‧輸出入模組擋板 500‧‧‧Output module baffle
510‧‧‧導電元件 510‧‧‧Conductive components
512‧‧‧開口 512‧‧‧ openings
520‧‧‧固定板 520‧‧‧fixed board
522‧‧‧開口 522‧‧‧ openings
523‧‧‧定位開口 523‧‧‧ Positioning opening
524‧‧‧固定夾 524‧‧‧fixed clip
525‧‧‧夾持部 525‧‧‧ gripping department
526‧‧‧延伸部 526‧‧‧Extension
528‧‧‧夾持板 528‧‧‧Clamping plate
529‧‧‧夾持彈片 529‧‧‧Clamping shrapnel
530‧‧‧導電片 530‧‧‧Conductor
532‧‧‧開口 532‧‧‧ openings
540‧‧‧外框 540‧‧‧Front frame
542‧‧‧開口 542‧‧‧ openings
544‧‧‧外延部 544‧‧‧Extension
546‧‧‧彈性導電片 546‧‧‧elastic conductive sheet
548‧‧‧導電凸點 548‧‧‧Electrical bumps
550‧‧‧擋板扣合件 550‧‧‧Baffle fasteners
552‧‧‧連接部 552‧‧‧Connecting Department
554‧‧‧扣合部 554‧‧‧Deduction Department
555‧‧‧補強肋 555‧‧‧ reinforcing ribs
557‧‧‧定位部 557‧‧‧ Positioning Department
558‧‧‧開口 558‧‧‧ openings
559‧‧‧定位凸起 559‧‧‧Positioning bulges
560‧‧‧銘板 560‧‧‧Name board
562‧‧‧開口 562‧‧‧ openings
564‧‧‧外側面 564‧‧‧Outside
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下：第1圖是依照本發明所揭露一實施例所繪示的一種主機板以及電腦機殼之爆炸示意圖。 The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. The description of the drawings is as follows. FIG. 1 is a schematic diagram of a motherboard according to an embodiment of the present invention. A schematic diagram of the explosion of the computer case.
第2圖是依照第1圖之實施例所繪示的一種主機板組立示意圖。 FIG. 2 is a schematic diagram of a motherboard assembly according to an embodiment of FIG. 1. FIG.
第3圖是依照本發明所揭露另一實施例所繪示的一種輸出入模組擋板之爆炸示意圖。 FIG. 3 is a schematic exploded view of an output module barrier according to another embodiment of the present invention.
下文係舉實施例配合所附圖式進行詳細說明，但所提供之實施例並非用以限制本揭露所涵蓋的範圍，而結構運作之描述非用以限制其執行之順序，任何由元件重新組合之結構，所產生具有均等功效的裝置，皆為本揭露所涵蓋的範圍。另外，圖式僅以說明為目的，並未依照原尺寸作圖。為使便 於理解，下述說明中相同元件或相似元件將以相同之符號標示來說明。 The following is a detailed description of the embodiments, but the embodiments are not intended to limit the scope of the disclosure, and the description of the structural operation is not intended to limit the order of execution, and any components are recombined. The structure and the device with equal efficiency are all covered by the disclosure. In addition, the drawings are for illustrative purposes only and are not drawn to the original dimensions. For convenience It is to be understood that the same or similar elements will be described with the same reference numerals.
另外，在全篇說明書與申請專利範圍所使用之用詞(terms)，除有特別註明外，通常具有每個用詞使用在此領域中、在此揭露之內容中與特殊內容中的平常意義。某些用以描述本揭露之用詞將於下或在此說明書的別處討論，以提供本領域技術人員在有關本揭露之描述上額外的引導。 In addition, the terms used in the entire specification and the scope of the patent application, unless otherwise specified, usually have the usual meaning of each word used in the field, in the content disclosed herein and in the special content. . Certain terms used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the disclosure.
關於本文中所使用之『第一』、『第二』、...等，並非特別指稱次序或順位的意思，亦非用以限定本發明，其僅僅是為了區別以相同技術用語描述的元件或操作而已。 The terms "first", "second", etc., as used herein, are not intended to refer to the order or the order, and are not intended to limit the invention, only to distinguish the elements described in the same technical terms. Or just operate.
其次，在本文中所使用的用詞『包含』、『包括』、『具有』、『含有』等等，均為開放性的用語，即意指包含但不限於。 Secondly, the terms "including", "including", "having", "containing", and the like, as used herein, are all open terms, meaning, but not limited to.
第1圖是依照本發明所揭露一實施例所繪示的一種主機板以及電腦機殼之爆炸示意圖，而第2圖則是依照第1圖之實施例所繪示的一種主機板組立示意圖。 1 is a schematic exploded view of a motherboard and a computer casing according to an embodiment of the present invention, and FIG. 2 is a schematic diagram of a motherboard assembly according to an embodiment of FIG. 1.
如圖中所示，主機板100包含有一電路板110，一連接器模組120設置於電路板110。一般而言，此連接器模組120係設置於機殼400的後端位置，以方便使用者使用電腦時連接周邊裝置，然並不限定於此。主機板100更包含有一輸出入模組擋板 200以及一擋板扣合件250，輸出入模組擋板200安裝於連接器模組120之上，並利用擋板扣合件250將其固定於電路板110之上。同時，擋板扣合件250亦可以是一防塵蓋320，例如是結合一散熱模組300的防塵蓋320，也同時將輸出入模組擋板200有效地固定於電路板110之上。散熱模組300還包含散熱片310，以提供電路板110上之電子元件散熱之所需。 As shown in the figure, the motherboard 100 includes a circuit board 110, and a connector module 120 is disposed on the circuit board 110. Generally, the connector module 120 is disposed at the rear end position of the casing 400 to facilitate connection between the peripheral devices when the user uses the computer, but is not limited thereto. The motherboard 100 further includes an input and output module baffle The switch module baffle 200 is mounted on the connector module 120 and is fixed to the circuit board 110 by the baffle fastening member 250. At the same time, the baffle fastening component 250 can also be a dust cover 320, for example, a dust cover 320 combined with a heat dissipation module 300, and at the same time, the output module baffle 200 is effectively fixed on the circuit board 110. The heat dissipation module 300 further includes a heat sink 310 to provide heat dissipation for the electronic components on the circuit board 110.
輸出入模組擋板200包含有一固定板220，而固定板220上則形成有複數個開口222及複數個固定夾224，並利用固定夾224將固定板220夾持於電路板110之連接器模組120之上。開口222則對準並露出連接器模組120之上的連接埠。 The output module baffle 200 includes a fixing plate 220, and the fixing plate 220 is formed with a plurality of openings 222 and a plurality of fixing clips 224, and the fixing plate 220 is clamped to the connector of the circuit board 110 by the fixing clips 224. Above the module 120. The opening 222 then aligns and exposes the port on the connector module 120.
輸出入模組擋板200更包含有一導電元件210固定於固定板220之上，且位於固定板220與連接器模組120之間。導電元件210上形成有複數個開口212，以對準並露出連接器模組120之上的連接埠。 The input and output module baffle 200 further includes a conductive component 210 fixed on the fixing plate 220 and located between the fixing plate 220 and the connector module 120. A plurality of openings 212 are formed in the conductive member 210 to align and expose the connection ports on the connector module 120.
導電元件210，例如是一導電泡棉、導電布或者是其他軟質的導電材料，使固定板220與連接器模組120的連接器外殼可以在使用時電性導通。 The conductive element 210 is, for example, a conductive foam, a conductive cloth or other soft conductive material, so that the fixing plate 220 and the connector housing of the connector module 120 can be electrically connected during use.
輸出入模組擋板200更包含有一外框240，外框240具有至少一開口242，外框240位於固定板220的另一側，亦即當主機板100安裝於電腦機 殼400時，在固定板220與電腦機殼400之間，外框240固定於固定板220之上，以用來使固定板220、外框240與電腦機殼400能夠在使用時電性導通。藉由導電元件210、固定板220、外框240、電腦機殼400以及連接器模組120的連接器外殼在使用時的相互電性導通，可以有效地將干擾訊號加以阻隔，進而改善電子裝置的防電磁干擾(Electromagnetic Interference，EMI)的性能。開口242則露出連接器模組120之上的連接埠。此外，軟質的導電元件210更可以有效避免電子裝置使用時或運送時所產生震動所造成的影響，提高產品的耐用性與可靠度。 The output module baffle 200 further includes an outer frame 240 having at least one opening 242, and the outer frame 240 is located on the other side of the fixed plate 220, that is, when the main board 100 is mounted on the computer In the case of the case 400, between the fixing plate 220 and the computer casing 400, the outer frame 240 is fixed on the fixing plate 220 for electrically connecting the fixing plate 220, the outer frame 240 and the computer casing 400 during use. . The conductive housing 210, the fixing plate 220, the outer frame 240, the computer casing 400, and the connector housing of the connector module 120 are electrically connected to each other, thereby effectively blocking the interference signal and improving the electronic device. The performance of Electromagnetic Interference (EMI). The opening 242 exposes the connection port on the connector module 120. In addition, the soft conductive element 210 can effectively avoid the influence of vibration caused by the use of the electronic device or during transportation, and improve the durability and reliability of the product.
輸出入模組擋板200更包含有一導電片230位於固定板220與外框240之間，以將固定板220與外框240黏合在一起，並使固定板220與外框240在使用時可以電性導通。導電片230更具有至少一開口232，以露出連接器模組120之上的連接埠，而導電片230可以是一導電雙面膠，或其他具有黏著功能之導電材料，其均不脫離本發明之精神與範圍。 The input and output module baffle 200 further includes a conductive sheet 230 between the fixing plate 220 and the outer frame 240 to bond the fixing plate 220 and the outer frame 240 together, and the fixing plate 220 and the outer frame 240 can be used. Electrically conductive. The conductive sheet 230 further has at least one opening 232 to expose the connection port on the connector module 120, and the conductive sheet 230 can be a conductive double-sided tape or other conductive material having an adhesive function, without departing from the invention. The spirit and scope.
因此，本發明之一實施例所揭露之一種輸出入模組擋板200，可以適用於一電子裝置，其中電子裝置具有一主機板100以及一機殼400，例如是一電腦機殼。主機板100安裝於機殼400之內，且主機板100上具有一連接器模組120，輸出入模組擋板200可以使得主機板100與機殼400經由輸出入模組 擋板200可以電性導通，以提升電子裝置的防電磁干擾的性能與抗震性。其中，固定板220以及外框240可以是一金屬板、一不銹鋼板或其他導電材質所形成。 Therefore, an input/output module baffle 200 disclosed in an embodiment of the present invention can be applied to an electronic device. The electronic device has a motherboard 100 and a casing 400, such as a computer casing. The motherboard 100 is mounted in the casing 400, and the motherboard 100 has a connector module 120. The output module barrier 200 allows the motherboard 100 and the chassis 400 to pass through the output module. The baffle 200 can be electrically connected to improve the anti-electromagnetic interference performance and shock resistance of the electronic device. The fixing plate 220 and the outer frame 240 may be formed by a metal plate, a stainless steel plate or other conductive materials.
進一步參閱第3圖，第3圖係依照本發明所揭露另一實施例所繪示的一種輸出入模組擋板之爆炸示意圖。如圖所示，此輸出入模組擋板500包含有一固定板520，而固定板520上則形成有複數個開口522及複數個固定夾524，並利用固定夾524將固定板520夾持於電路板之連接器模組之上。開口522則對準並露出連接器模組之上的連接埠。 Referring to FIG. 3, FIG. 3 is a schematic diagram of an explosion of an input/output module baffle according to another embodiment of the present invention. As shown in the figure, the output module baffle 500 includes a fixing plate 520, and the fixing plate 520 is formed with a plurality of openings 522 and a plurality of fixing clips 524, and the fixing plate 520 is clamped by the fixing clip 524. Above the connector module of the board. The opening 522 aligns and exposes the port on the connector module.
輸出入模組擋板500更包含有一導電元件510固定於固定板520之上，且位於固定板520與連接器模組之間。導電元件510上形成有複數個開口512，以對準並露出連接器模組之上的連接埠。 The input and output module baffle 500 further includes a conductive member 510 fixed on the fixing plate 520 and located between the fixing plate 520 and the connector module. A plurality of openings 512 are formed in the conductive member 510 to align and expose the connection ports on the connector module.
導電元件510，例如是一導電泡棉、導電布或者是其他軟質的導電材料，使固定板520與連接器模組的連接器外殼可以在使用時電性導通。 The conductive element 510 is, for example, a conductive foam, a conductive cloth or other soft conductive material, so that the fixing plate 520 and the connector housing of the connector module can be electrically connected during use.
輸出入模組擋板500更包含有一外框540，位於固定板520的另一側，亦即當主機板安裝於電腦機殼時，在固定板520與電腦機殼之間，外框540固定於固定板520之上，以用來使固定板520、外框540與電腦機殼能夠在使用時電性導通。藉由導電元件510、固定板520、外框540、電腦機殼以及連 接器模組的連接器外殼在使用時的相互電性導通，可以有效地將干擾訊號加以接地，進而改善電子裝置的防電磁干擾(Electromagnetic Interference，EMI)的性能。 The output module baffle 500 further includes an outer frame 540 located on the other side of the fixing plate 520, that is, when the main board is mounted on the computer casing, the outer frame 540 is fixed between the fixing plate 520 and the computer casing. Above the fixing plate 520, the fixing plate 520, the outer frame 540 and the computer casing can be electrically connected during use. By conductive element 510, fixing plate 520, outer frame 540, computer case and even The connector housing of the connector module is electrically connected to each other during use, and can effectively ground the interference signal, thereby improving the performance of the electronic device against electromagnetic interference (EMI).
此外，軟質的導電元件510更可以有效避免電子裝置使用時或運送時所產生震動所造成的影響，提高產品的耐用性與可靠度。 In addition, the soft conductive element 510 can effectively avoid the influence of vibration caused by the use of the electronic device or during transportation, and improve the durability and reliability of the product.
輸出入模組擋板500更包含有一導電片530位於固定板520與外框540之間，以將固定板520與外框540黏合在一起，並使固定板520與外框540可以電性導通。導電片530更具有至少一開口532，以露出部分的固定板520，而導電片530可以是一導電雙面膠，或其他具有黏著功能之導電材料，其均不脫離本發明之精神與範圍。 The output module baffle 500 further includes a conductive sheet 530 between the fixing plate 520 and the outer frame 540 to bond the fixing plate 520 and the outer frame 540 together, and electrically connect the fixing plate 520 and the outer frame 540. . The conductive sheet 530 further has at least one opening 532 to expose a portion of the fixing plate 520, and the conductive sheet 530 may be a conductive double-sided tape or other conductive material having an adhesive function without departing from the spirit and scope of the invention.
輸出入模組擋板500，更包含有一擋板扣合件550，例如是一L型擋板扣合件，以用來將固定板520扣合於電路板之連接器模組。 The output module baffle 500 further includes a baffle fastening member 550, such as an L-shaped baffle fastening member, for fastening the fixing plate 520 to the connector module of the circuit board.
上述之固定夾524更包含一定位開口523，而擋板扣合件550更包含有一定位部557、一連接部552與一扣合部554。定位部557則包含有一定位凸起559形成於開口558之中，以將擋板扣合件550定位於固定夾524的定位開口523之中。擋板扣合件550更包含有補強肋555以增加擋板扣合件550的強度。 The fixing clip 524 further includes a positioning opening 523, and the baffle fastening component 550 further includes a positioning portion 557, a connecting portion 552 and a fastening portion 554. The positioning portion 557 includes a positioning protrusion 559 formed in the opening 558 to position the baffle fastening member 550 in the positioning opening 523 of the fixing clip 524. The baffle fastening member 550 further includes reinforcing ribs 555 to increase the strength of the baffle fastening member 550.
固定夾524更包含有夾持部525以及延伸部526夾持部525內面可夾持於電路板之連接器模組的外殼，夾持部525與延伸部526之間則形成定位開口523，延伸部526則更進一步提升固定夾524的強度。 The fixing clip 524 further includes a clamping portion 525 and an outer casing of the connector module 525 of the extending portion 526 that can be clamped to the circuit board, and a positioning opening 523 is formed between the clamping portion 525 and the extending portion 526. The extension 526 further enhances the strength of the retaining clip 524.
固定板520的上方更可形成有一夾持板528，配合開口522兩旁形成的夾持彈片529，更可以協助將輸出入模組擋板500扣合於電路板之連接器模組之上。 A clamping plate 528 can be formed on the upper surface of the fixing plate 520. The clamping elastic piece 529 formed on the two sides of the opening 522 can further assist in fastening the input and output module baffle 500 to the connector module of the circuit board.
擋板扣合件550的扣合部554則可以有效地扣合於連接器模組120的背部，進一步使得固定板520穩定地安裝於電路板之連接器模組上。 The fastening portion 554 of the baffle fastening member 550 can be effectively fastened to the back of the connector module 120, and further the fixing plate 520 is stably mounted on the connector module of the circuit board.
此外，外框540更包含有複數個開口542，以露出電路板之連接器模組的各個連接埠，以及一外延部544，外延部544上形成有複數個導電凸點548，並黏合有一彈性導電片546，以用來在使用時與電腦機殼電性導通。彈性導電片546舉例而言，為一導電泡棉或導電布所形成，然並不限定於此，可以使用軟質的導電材料，使外框540在使用時可以穩定地接觸機殼，提升導電的效果。其中，固定板520、外框540、以及擋板扣合件550，可以是一金屬板、一不銹鋼板或其他導電材質所形成。 In addition, the outer frame 540 further includes a plurality of openings 542 for exposing the respective connection ports of the connector module of the circuit board, and an extension portion 544. The plurality of conductive bumps 548 are formed on the extension portion 544, and an elastic bond is formed. The conductive sheet 546 is used to electrically conduct with the computer case during use. For example, the elastic conductive sheet 546 is formed of a conductive foam or a conductive cloth. However, the conductive conductive sheet 546 is not limited thereto, and a soft conductive material can be used, so that the outer frame 540 can stably contact the casing during use, and the conductive is improved. effect. The fixing plate 520, the outer frame 540, and the baffle fastening member 550 may be formed by a metal plate, a stainless steel plate or other conductive materials.
此外，輸出入模組擋板500更包含有一銘板560，銘板560具有複數個開口562，銘板 560貼合於外框540遠離連接器模組120之一側，且銘板560的外側面564印刷有連接器的對應圖樣，以顯示連接器模組之各個連接埠的位置。 In addition, the input and output module baffle 500 further includes a nameplate 560 having a plurality of openings 562, a nameplate The 560 is attached to the outer frame 540 away from the side of the connector module 120, and the outer side 564 of the nameplate 560 is printed with a corresponding pattern of the connector to display the position of each connector of the connector module.
綜上所述，本發明之實施例所揭露的輸出入模組擋板及主機板，可以在使用時有效地增加主機板與機殼電性連接的效果，提升電子裝置防電磁干擾的性能，且避免電子裝置震動時的影響，改善電子裝置的穩定性與可靠度。且由於輸出入模組擋板安裝於主機板之上，然後才安裝於機殼上，組裝者可以有效地避免被機殼刮傷的風險，同時增加主機板安裝於機殼上的方便性與安全性。 In summary, the output module baffle and the motherboard disclosed in the embodiments of the present invention can effectively increase the electrical connection between the motherboard and the chassis during use, and improve the anti-electromagnetic interference performance of the electronic device. Moreover, the influence of the vibration of the electronic device is avoided, and the stability and reliability of the electronic device are improved. Moreover, since the output module baffle is mounted on the motherboard and then mounted on the casing, the assembler can effectively avoid the risk of being scratched by the casing, and at the same time increase the convenience of the motherboard being mounted on the casing. safety.
雖然本揭露已以實施方式揭露如上，然其並非用以限定本揭露，任何本領域具通常知識者，在不脫離本揭露之精神和範圍內，當可作各種之更動與潤飾，因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。 The present disclosure has been disclosed in the above embodiments, and is not intended to limit the disclosure. Any one of ordinary skill in the art can make various changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection is subject to the definition of the scope of the patent application.
500‧‧‧輸出入模組擋板 500‧‧‧Output module baffle
510‧‧‧導電元件 510‧‧‧Conductive components
512‧‧‧開口 512‧‧‧ openings
520‧‧‧固定板 520‧‧‧fixed board
522‧‧‧開口 522‧‧‧ openings
523‧‧‧定位開口 523‧‧‧ Positioning opening
524‧‧‧固定夾 524‧‧‧fixed clip
525‧‧‧夾持部 525‧‧‧ gripping department
526‧‧‧延伸部 526‧‧‧Extension
528‧‧‧夾持板 528‧‧‧Clamping plate
529‧‧‧夾持彈片 529‧‧‧Clamping shrapnel
530‧‧‧導電片 530‧‧‧Conductor
532‧‧‧開口 532‧‧‧ openings
540‧‧‧外框 540‧‧‧Front frame
542‧‧‧開口 542‧‧‧ openings
544‧‧‧外延部 544‧‧‧Extension
546‧‧‧彈性導電片 546‧‧‧elastic conductive sheet
548‧‧‧導電凸點 548‧‧‧Electrical bumps
550‧‧‧擋板扣合件 550‧‧‧Baffle fasteners
552‧‧‧連接部 552‧‧‧Connecting Department
554‧‧‧扣合部 554‧‧‧Deduction Department
555‧‧‧補強肋 555‧‧‧ reinforcing ribs
557‧‧‧定位部 557‧‧‧ Positioning Department
558‧‧‧開口 558‧‧‧ openings
559‧‧‧定位凸起 559‧‧‧Positioning bulges
560‧‧‧銘板 560‧‧‧Name board
562‧‧‧開口 562‧‧‧ openings
564‧‧‧外側面 564‧‧‧Outside
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/481,451 US10114427B2 (en) | 2016-05-16 | 2017-04-06 | Input/output module baffle and motherboard with the same |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662336746P | 2016-05-16 | 2016-05-16 | |
| US62/336,746 | 2016-05-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI597594B true TWI597594B (en) | 2017-09-01 |
| TW201809961A TW201809961A (en) | 2018-03-16 |
Family
ID=60719529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105129997A TWI597594B (en) | 2016-05-16 | 2016-09-14 | Input output module baffle and motherboard having the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI597594B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5622523A (en) * | 1995-10-31 | 1997-04-22 | Hon Hai Precision Ind, Co., Ltd. | Grounding device for use with shielded DIN connector |
| US5822182A (en) * | 1997-01-24 | 1998-10-13 | Dell U.S.A. L.P. | Flexible I/O port configuration and connector labeling scheme for computer chassis |
| CN1794134A (en) * | 2005-12-29 | 2006-06-28 | 圆刚科技股份有限公司 | Extension card device applying elastic fixed device and assembling method of extension card device |
| TW201109897A (en) * | 2009-09-09 | 2011-03-16 | Asustek Comp Inc | I/O cover plate and its motherboard module |
-
2016
- 2016-09-14 TW TW105129997A patent/TWI597594B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5622523A (en) * | 1995-10-31 | 1997-04-22 | Hon Hai Precision Ind, Co., Ltd. | Grounding device for use with shielded DIN connector |
| US5822182A (en) * | 1997-01-24 | 1998-10-13 | Dell U.S.A. L.P. | Flexible I/O port configuration and connector labeling scheme for computer chassis |
| CN1794134A (en) * | 2005-12-29 | 2006-06-28 | 圆刚科技股份有限公司 | Extension card device applying elastic fixed device and assembling method of extension card device |
| TW201109897A (en) * | 2009-09-09 | 2011-03-16 | Asustek Comp Inc | I/O cover plate and its motherboard module |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201809961A (en) | 2018-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI511388B (en) | Electronic device having waterproof and shockproof connector | |
| US7557306B2 (en) | Shield assembly with gaskets | |
| US7744172B2 (en) | Computer enclosure with interchangeable I/O plate | |
| US20090190309A1 (en) | Electronic apparatus with air guiding element | |
| JP6434656B2 (en) | Electronic equipment | |
| JP2008028106A (en) | Electronic apparatus, and gnd connection method for printed board | |
| US10568206B2 (en) | Printed circuit board assembly and assembling method thereof | |
| TW201352127A (en) | Electromagnetic shielding case and electronic device having the same | |
| TW201238432A (en) | Electronic device | |
| CN110290632B (en) | Electronic device for electrostatic discharge protection | |
| TWI597594B (en) | Input output module baffle and motherboard having the same | |
| TW201310810A (en) | USB connector and connecting device with USB connector | |
| TW201352116A (en) | Electronic apparatus | |
| JP6238863B2 (en) | Electronics | |
| US10114427B2 (en) | Input/output module baffle and motherboard with the same | |
| KR20200050261A (en) | Electronic apparatus | |
| KR20170011141A (en) | Electrostatic discharge, PCB assembly and Control device having the same | |
| JP5307278B2 (en) | Circuit board | |
| JP5765215B2 (en) | Wiring member fixing structure of electronic device casing, wiring member fixing method, and electronic apparatus or audiovisual apparatus using the same | |
| US20130063906A1 (en) | Circuit board assembly and electronic device with circuit board | |
| TWI752836B (en) | Electronic assembly | |
| TW201244295A (en) | Connector mounting apparatus | |
| CN211982257U (en) | Dustproof structure | |
| JP2014120546A (en) | Wiring member fixing structure and wiring member fixing method of electronic apparatus housing and electronic apparatus or audiovisual apparatus using the same | |
| TWI501472B (en) | Battery connecting port module |