TWI579640B - Thin-film mask, fitting aids, fitting and exposure device and fitting method for the thin-film mask pasted on a curved substrate - Google Patents

Description

Film mask, bonding aid, bonding and exposure aids, and a film mask Method of bonding to a curved substrate

The present invention relates to a reticle, and more particularly to a film reticle, a bonding aid, a bonding and exposure assisting device, and a method of attaching a film reticle to a curved substrate.

At present, smart devices such as smart phones, smart watches, smart medical devices, etc., are equipped with large screens for users to watch the information on the screen. In addition to their powerful functions, these devices with large screens are gradually becoming personalized and beautiful, including appearance, shape and color. These must be achieved through an impressive shell design and manufacturing. At present, the curved shell shape is particularly attractive, and it has gradually become the future trend of smart devices.

At present, there are several methods for the patterning of the curved outer casing of the smart device: the first method: transfer technology. Transfer to the curved surface of the target through the pre-made plan. The processing cost of such a method is low, but the processing speed is slow, the material cost is high, and the line resolution is poor. The second method: inkjet + laser engraving. The pigment is sprayed onto the curved surface of the target by an inkjet method, and the pattern is engraved by laser engraving. This method of processing costs and processing The speed is slow, the equipment cost is also high, and the material cost is also high. The advantage is that the line resolution is high, up to 20um (micron).

Therefore, how to develop a multi-practice with low processing cost, fast processing speed, low material cost, and high line resolution, and a method of producing a color pattern on a curved outer casing or a three-dimensional outer casing, and becoming a smart device manufacturer The direction of development that is desired. One of the techniques is the technique of using a color photoresist layer, that is, after the color photoresist layer is coated on the curved outer casing, the pattern is etched by photolithography. However, how these curved outer casings can be etched with a reticle has become the development focus of this process.

To achieve the above object, the present invention provides a film mask, a bonding aid, a bonding and exposure assisting device, and a method of attaching a film mask to a curved substrate, and applying a masking aid to the film mask It is combined with the curved substrate to make the film mask curved, and the curved substrate can be made into a curved pattern. By using the device and the method of the invention, the curved outer shell pattern made by the photoresist technology can achieve the technical effect of real mass production, improved quality and precision, and improved yield.

The present invention provides a film mask for attaching to a curved substrate, such that the curved substrate can produce a photoresist layer, the film mask comprises: a film substrate composed of a flexible material; and a film a mask layer formed on the film substrate, the film mask layer forming a pattern, the pattern being visible, the film mask layer being used for bonding to the photoresist layer of the curved substrate; wherein the film base The thickness of the material is between 1 and 100 microns and the film mask layer is between 10 and 3000 nanometers.

The present invention further provides a bonding aid for attaching the film mask to the film In the case of a curved substrate, the auxiliary film is pressed against the curved substrate, and serves as an interface between the thin film mask and an exposure machine, and comprises: a soft plate made of a high-transparent elastic material, which can be deformed. When the film mask is attached to the curved substrate, the film mask is deformed by an external force to closely adhere the film mask to the photoresist layer of the curved substrate, and the film mask is curved.

The invention further provides a bonding and exposure assisting device, which can form a curved substrate into a photoresist layer having a curved pattern, comprising: a film mask comprising: a film substrate, which is composed of a flexible material, a plurality of positioning holes are disposed on the film substrate, and the film substrate is positioned by the positioning holes to accurately align with the curved substrate; and a film mask layer is formed on the film substrate On the film substrate, the film mask layer forms a pattern, and the pattern is visible; wherein the film substrate has a thickness between 1 and 100 microns, and the film mask layer is between 10 and 3000 nanometers. a soft sheet made of a highly transparent elastic material, which can be deformed, and when the film mask is attached to the photoresist layer of the curved substrate, is deformed by an external force to make the film mask tight The thin film mask is curved on the photoresist layer of the curved substrate; wherein the flexible plate, the thin film mask layer, and the curved substrate are sequentially stacked, and then placed together in an exposure machine for exposure. The photoresist layer is formed into the pattern.

The invention further provides a bonding and exposure assisting device, which can form a curved substrate into a photoresist layer having a curved pattern, comprising: a film mask comprising: a film substrate, which is composed of a flexible material, a plurality of positioning holes are disposed on the film substrate, and the film substrate is positioned by the positioning holes to accurately align with the curved substrate; a film mask layer is formed on the film On the film substrate, the film mask layer constitutes a pattern, the pattern is visible; wherein the film substrate has a thickness of between 1 and 100 microns, and the film mask layer is between 10 and 3000 nanometers; a hard plate pre-made as a curved surface conforming to the curved substrate, and the film When the reticle is attached to the curved substrate, the film reticle is pressed to closely adhere to the photoresist layer of the curved substrate, and the film reticle is curved; wherein the film is bonded The curved substrate of the film mask layer is exposed to an exposure machine to expose the photoresist layer to form the pattern.

The present invention further provides a method for attaching a film mask to a curved substrate, comprising: providing a curved substrate, a film mask, and a bonding aid, the curved substrate having a photoresist layer; The cover is placed between the curved substrate and the bonding aid; and the film mask is pressed onto the curved substrate by using the bonding aid.

The above and other objects, features, and advantages of the present invention will become more apparent and understood.

1‧‧‧Surface shell

10‧‧‧Rot surface substrate

20‧‧‧Color photoresist layer

20A‧‧‧positive photoresist layer

20B‧‧‧negative photoresist layer

30A, 30B‧‧‧ film mask

31‧‧‧篓空块块

32, 35‧‧‧ film mask layer

34‧‧‧Positioning holes

39‧‧‧ Film substrate

40A, 40B, 40C‧‧‧ affixing aids

41‧‧‧ bottom

42‧‧‧First curved side

43‧‧‧Second curved side

50‧‧‧Fitting fixture

51‧‧‧ 对 榫

60‧‧‧Fitting aids

61‧‧‧ bottom

62‧‧‧First curved side

63‧‧‧Second curved side

64‧‧‧Support ribs

80‧‧‧ ultraviolet light

Step 101‧‧‧ provides a curved substrate with a color photoresist layer, a film mask, and a bonding aid

Step 102‧‧‧ placing the film mask between the curved substrate and the bonding aid

Step 103‧‧‧ Pressing the film mask to the curved substrate using the bonding aid

The embodiment of Fig. 1A will be described later in conjunction with the embodiment of Fig. 3A-7E.

Step 111‧‧‧ provides a curved substrate with a color photoresist layer, a film mask, and a bonding aid, the bonding aid is a soft material

Step 112‧‧‧ placing the film mask between the curved substrate and the bonding aid

Step 113‧‧‧ Pressing the film mask to the curved substrate using the bonding aid

Step 114‧‧‧ Vacuum processing to remove air between the film mask and the curved substrate

Step 121‧‧‧ provides a curved substrate with a color photoresist layer, a film mask, and a bonding aid, the bonding aid is a hard material

Step 122‧‧‧ placing the film mask between the curved substrate and the bonding aid

Step 123‧‧‧ Pressing the film mask to the curved substrate using the bonding aid

Step 124‧‧‧ Vacuum processing to remove air between the film mask and the curved substrate

Step 125‧‧‧Remove the fitting aid

Step 131‧‧‧ provides a curved substrate with a color photoresist layer, a film mask, and a bonding aid, the bonding aid is a hard material

Step 132‧‧‧ placing the film mask between the curved substrate and the bonding aid

Step 133‧‧‧ Pressing the film mask to the curved substrate using the bonding aid

Step 134‧‧‧Remove the fitting aid

1A-1D is a flow diagram of various embodiments of a method of attaching a film reticle to a curved substrate of the present invention.

2A-2B is a front view and a cross-sectional view of a curved outer casing to be fabricated using the techniques of the present invention.

3A and 3B are views showing an embodiment of a front view and a cross-sectional view of a film mask used in a positive resist of the present invention.

4A and 4B are views showing an embodiment of a front view and a cross-sectional view of a film mask used in a negative resist of the present invention.

Figs. 5A and 5B are views showing an embodiment of the bonding jig 50 used in the present invention.

6A is a top view of an embodiment of the bonding aid of the present invention, FIG. 6B is a cross-sectional view taken along line AA of FIG. 6A, and FIG. 6C is another embodiment different from FIG. 68, FIG. 6D Different Another embodiment of Figure 6B.

7A-7E is an embodiment of a cross-sectional flow diagram of the embodiment of Fig. 1B.

8A-8E are still another embodiment of a cross-sectional flow diagram of the embodiment of Fig. 1B.

9A-9E are still another embodiment of a cross-sectional flow diagram of the embodiment of Fig. 1B.

Fig. 10A is a top view of another embodiment of the bonding aid of the present invention, and Fig. 10B is a cross-sectional view taken along line A-A of Fig. 10A.

11A-11E are diagrams showing an embodiment of a cross-sectional flow diagram of the embodiment of Fig. 1D.

According to an embodiment of the present invention, the present invention uses a soft or rigid bonding aid to attach a film mask to a curved substrate, and the film mask is curved and closely adhered to the curved substrate, thereby using the inclusion The curved substrate of the film mask is subjected to a lithography process to produce a curved pattern. Next, please refer to FIGS. 1A to 1D, which illustrate several embodiments of the method of bonding a film mask to a curved substrate of the present invention.

First, please refer to FIG. 1A, which is a flow chart of an embodiment of a method for attaching a film mask to a curved substrate, comprising:

Step 101: providing a curved substrate with a color photoresist layer, a film mask, and a bonding aid.

Step 102: The film mask is placed between the curved substrate and the bonding aid.

Step 103: Pressing the film mask to the curved substrate by using the bonding aid.

The embodiment of FIG. 1A will be followed by the embodiment of FIG. 3A-7E. Bright.

First, please refer to FIG. 1B, which is a flow chart of an embodiment of a method for attaching a film mask to a curved substrate, comprising:

Step 111: providing a curved substrate with a color photoresist layer, a film mask, and a bonding aid, the bonding aid being a soft material.

Step 112: The film mask is placed between the curved substrate and the bonding aid.

Step 113: Pressing the film mask to the curved substrate by using the bonding aid.

Step 114: Perform a vacuum process to remove air between the film mask and the curved substrate.

In the embodiment of Fig. 1B, a soft material is used as a material for the bonding aid, for example, a silicone rubber having a pressure-adhesive property, or an auxiliary device of other soft porous materials, to assist the film mask to be attached to the color. The curved substrate of the photoresist layer. In addition, in the embodiment of FIG. 1B, after the air between the bonded film mask and the curved substrate is removed by vacuum processing, the film mask and the curved substrate can be more closely adhered. Finally, due to the pressure-bonding material such as silicone rubber, it can be closely attached to the film mask to form a three-layer structure of a bonding aid, a film mask, a curved substrate, etc., and the three-layer structure can be used for the lithography process. . In addition, the refractive index of the material selected for the bonding aid is greater than the refractive index of the air, so that the bonding aid participates in the lithography process, which can improve the collimation of the light incident on the curved substrate, and the exposure effect is better.

Next, please refer to Figs. 2A and 2B, which are curved outer casing 1 which is to be produced by the technique of the present invention, and Fig. 2B is a sectional view taken along line A-A of Fig. 2A, and it can be found that the curved base The board 10 has a colored photoresist layer 20 on which a curved pattern has been formed. However, the production of this curved pattern is difficult. The traditional screen printing method, the poor accuracy, resulting in poor resolution, can not meet the high resolution requirements of current consumer electronics products. However, by using the technique of the present invention, a highly accurate curved film mask can be provided, and a film mask that is perfectly adhered to the color photoresist layer of the curved substrate 10 can be fabricated, and then the lithography process can be performed. A high-resolution surface pattern of Fig. 2A can be realized.

Hereinafter, the bonding apparatus and method of the present invention will be described together with the embodiment of the 3A-7E drawing. The invention uses a film mask, a bonding aid, a bonding fixture, etc. to perform a close and accurate bonding of the film mask.

Figures 3A and 3B show a film mask used in a positive photoresist, and Figs. 4A and 4B are film masks used in a negative photoresist, and the patterns of the two are reversed. Fig. 3B is a cross-sectional view taken along line A-A of Fig. 3A, and Fig. 4B is a cross-sectional view taken along line A-A of Fig. 4A.

The film mask 30A of Figs. 3A and 3B includes a film substrate 39 and a film mask layer 32 formed thereon. The film mask 30B of Figs. 4A and 4B includes a film substrate 39 and a film mask layer 35 formed thereon. The film substrate 39 is made of a flexible material such as PET or the like, and the film mask layer 32 is formed on the film substrate 39 to form a visible pattern. The film mask layers 32, 35 are used to conform to the colored photoresist layer of the curved substrate. Wherein, the thickness of the film substrate 30 is between 1 and 100 microns, and the thickness of the film mask layers 32, 35 is between 10 and 3000 nm. The film mask layers 32 and 35 are made of a metal material as a base. When the thickness is between 10 and 3000 nm, the film has a large flexibility and is suitable for use on a curved substrate. In addition, a plurality of positioning holes 34 are disposed on the film substrate 39, so that the subsequent film can be accurately positioned and attached to the curved substrate.

Next, please refer to FIG. 5A, FIG. 5B, which is an embodiment of the bonding fixture 50, which has the alignment 榫51 of the plurality of positioning holes 34 of the film masks 30A, 30B, can accurately hold the thin film? The masks 30A, 30B are accurately aligned.

Next, please refer to FIG. 6A, which is a top view of an embodiment of the bonding aid of the present invention, and FIG. 6B is a cross-sectional view taken along line AA of FIG. 6A, and FIG. 6C is different from FIG. 6B. Another embodiment. In the embodiment of FIGS. 6A and 6B, the bonding aid 40A is preliminarily formed in a shape conforming to the shape of the curved substrate 10 to accelerate the bonding speed, and constitutes the bottom portion 41, the first curved surface portion 42, Second curved side portion 43. In the embodiment of Fig. 6C, the flat bonding aid 40B is directly produced as a single material. The embodiment of Fig. 6D is also directly fabricated as a bonding aid 40C having a curved bottom portion from a single material. In addition to a single material, the use of silicone rubber, eucalyptus oil coated soft outer material, enamel organic materials, fluorine-containing organic materials, etc. to make different shapes of auxiliary tools, in order to form a good deformation, can help the film reticle to fit the surface On the substrate.

It can be seen from the above various embodiments that the shape of the bonding aid is preferably made of a highly transparent elastic material (for example, 300 n-500 nm light can be penetrated), and is preferably prepared in advance by a curved surface structure of the curved substrate. The bottom of the surface that matches it is better. The use of high light transmission material can improve the collimation of the subsequent exposure and development process, thereby improving the resolution of the exposure.

Next, please refer to FIG. 7A-7E, which illustrates a cross-sectional flow of the embodiment of FIG. 1B, which is a film mask for applying the bonding aid 40A and the positive photoresist layer 20A of FIGS. 6A and 6B. 30A.

First, in FIG. 7A, the bonding jig 50 holds the film mask 30A, and is aligned with the curved substrate 10 having the positive resist layer 20A, and is pressed by the bonding aid 40A. Hehe. That is, the steps 111 and 112 provide: providing a curved substrate with a color photoresist layer, a film mask, and a bonding aid, the bonding aid being a soft material; placing the film mask on the surface Between the substrate and the bonding aid.

Next, in the 7B-7C drawing, it is seen that the film mask 30A is gradually deformed and adhered to the curved substrate 10 during the gradual press-fitting of the bonding aid 40A. At this time, the positive resist layer 20A on the curved substrate 10 is bonded to the thin film mask layer 32 of the film mask 30A, and the hollow portion 31 of the thin film mask 30A is supported by air. That is, in step 113, the film mask is pressed onto the curved substrate by using the bonding aid.

Next, proceeding to step 114: performing a vacuum process to remove air between the film mask and the curved substrate. That is, as shown in Fig. 7D, after vacuum processing, the air between the thin film block 31 originally in Fig. 7C and the thin film mask layer 32 and the positive type resist layer 20A will be extracted. The bonding aid 40A, which is a soft material, will also be deformed by the air being pulled away, as shown in Fig. 7D. This deformation is transient, but the bonding aid 40A, the film mask 30A, and the positive photoresist layer 20A can form a good close fit, which will be beneficial to the subsequent lithography process.

Next, after the bonding fixture 50 is removed, the lithography process can be performed by the ultraviolet light 80 as shown in FIG. 7E.

Similarly, the 8A-8E diagram is an embodiment in which the negative photoresist layer 20B is employed, which correspondingly employs a thin film mask 30B which can be applied to a negative photoresist. The specific process is the same as that of the embodiment of FIG. 7A-7E, and will not be further described herein. The difference between the two embodiments is that, in the 7D and 8D drawings, it can be found that the positions where the two are deformed are different because the film mask layer 30A of the 7Dth image and the film mask layer 30B of the 8D figure are different. The position is different, and due to the softness of the bonding aid 40A, it is deformed by the pressure generated after the air is evacuated, so that the corresponding correspondence is generated. Deformation.

Next, please refer to the embodiment of FIGS. 9A-9E, which is an embodiment in which another bonding aid 40B is applied. The bonding aid 40B is not subjected to the prior shape adjustment, but simply adopts a planar structure. However, due to its material relationship, it does not affect the substantive results. Similarly, due to the characteristics of the soft material of the bonding aid 40B, a corresponding deformation occurs during the bonding process, and the film mask 30A can be closely adhered to the curved substrate 10.

In addition, the fitting aids can also be made of solid silicone rubber, which is wrapped with liquid silicone, which can also produce the corresponding deformation required. Other non-silicone soft materials, such as many high light transmission elastic materials, can also be used.

In the foregoing several embodiments, an example in which a material for a bonding aid is made of a soft material has been described. Next, an embodiment in which a bonding aid is made of a hard material will be described.

First, please refer to FIG. 1C, which is another embodiment of the method flow of the present invention, which uses a bonding aid as a hard material, and includes:

Step 121: providing a curved substrate with a color photoresist layer, a film mask, and a bonding aid, the bonding aid being a hard material.

Step 122: Place the film mask between the curved substrate and the bonding aid.

Step 123: Pressing the film mask to the curved substrate by using the bonding aid.

Step 124: Perform a vacuum process to remove air between the film mask and the curved substrate.

Step 125: Remove the fitting aid.

Next, please refer to FIG. 1D, which is another embodiment of the method flow of the present invention, which uses a bonding aid as a hard material, and includes:

Step 131: providing a curved substrate with a color photoresist layer, a film mask, and a bonding aid, the bonding aid being a hard material.

Step 132: Place the film mask between the curved substrate and the bonding aid.

Step 133: Pressing the film mask to the curved substrate by using the bonding aid.

Step 134: Remove the bonding aid.

Next, please refer to Figures 10A-10B and 11A-11E. The bonding aid 60 is made of a rigid material and is preliminarily made to conform to the shape of the curved substrate 10. As shown in FIG. 10B, the bonding aid 60 includes a bottom 61, a first curved side 62, and a second curved side. 63. Support ribs 64. Since the bonding aid 60 made of a hard material is less elastic, the supporting ribs 64 are required to assist in positioning. On the bottom surface of the bonding aid 60, that is, the portion that will contact the film mask, an elastic film can be formed to enhance the bonding effect.

Please refer to the 11A-11E diagram for the entire fitting process, ie the flow of the 1C, 1D diagram. FIG. 11A illustrates steps 121-122 and 131-132: providing a curved substrate with a color photoresist layer, a film mask, and a bonding aid, the bonding aid being a hard material; A photomask is placed between the curved substrate and the bonding aid.

Figure 11B-11C illustrates steps 123, 133: pressing the film mask to the curved substrate using the bonding aid.

Figure 11D illustrates steps 125, 134: removal of the attachment aid. Step 124 It is not drawn. If vacuum extraction is performed, the film substrate 39 can also be deformed to be bonded to the positive resist layer 20A.

As can be seen from the above description, by using the apparatus and method of the present invention, it is possible to accurately perform the alignment, and the curved outer casing pattern produced by the photoresist technology can achieve real mass production, and the quality and precision are improved, and the yield is improved.

Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention are encompassed by the present invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

10‧‧‧Rot surface substrate

20B‧‧‧negative photoresist layer

30B‧‧‧film mask

40A‧‧‧Fitting aids

80‧‧‧ ultraviolet light

Claims (18)

A film mask for bonding to a curved substrate, the curved substrate having a photoresist layer, the film mask comprising: a film substrate composed of a flexible material; and a film mask layer formed on On the film substrate, the film mask layer forms a pattern, and the pattern is visible. The film mask layer is used to adhere to the photoresist layer of the curved substrate, so that the curved substrate can be subjected to subsequent curved lithography. The process further produces a curved pattern on the curved substrate; wherein the thickness of the film substrate is between 1 and 100 microns, and the film mask layer is between 10 and 3000 nanometers. The film reticle of claim 1, wherein the flexible material is selected from the group consisting of PET. The film mask of claim 1, further comprising: a plurality of positioning holes formed on the film substrate, and the film substrate is positioned through a bonding fixture to accurately align with the curved substrate. A bonding aid for a film mask of claim 1, wherein when the film mask is attached to the curved substrate, the film mask is assisted to be pressed against the curved substrate, and the film mask is used as the film mask The interface of an exposure machine comprises: a soft plate material, which is composed of a high light transmissive elastic material, can penetrate 300 to 500 nm of light, can be deformed, and when the film reticle is attached to the curved substrate The film is deformed by an external force to make the film mask closely adhere to the photoresist layer of the curved substrate, and the film mask is curved. The bonding aid of claim 4, wherein the high light transmission elastic material is selected from the group consisting of silicone rubber and oyster sauce It is covered with a soft outer layer, a bismuth organic material, and a fluorine-containing organic material. The bonding aid of claim 4, wherein the bottom of the flexible sheet is made into a curved surface conforming to the curved substrate. The invention relates to a bonding and exposure auxiliary device, which can form a curved substrate into a photoresist layer having a curved pattern, comprising: a film mask comprising: a film substrate composed of a flexible material on the film substrate Having a plurality of positioning holes, the fixing film is positioned by the positioning holes to accurately align the film substrate; and a film mask layer is formed on the film substrate The film mask layer forms a pattern, and the pattern is visible, so that the curved substrate can be subjected to a subsequent curved lithography process, and the curved surface pattern is formed on the curved substrate; and wherein the thickness of the film substrate is between Between 1-100 microns, the film mask layer is between 10-3000 nm; a soft sheet material is made of an elastic material that can produce one of the deformations and has high light transmission, and can penetrate light of 300 to 500 nm. And when the film mask is attached to the photoresist layer of the curved substrate, deformed by an external force to make the film mask closely adhere to the photoresist layer of the curved substrate, so that the film mask Surface modification; wherein the soft sheet, the Mask film layer, after the surface of the substrate sequentially stacked, placed in a common exposure apparatus exposure, the photoresist layer so that the pattern is formed. The bonding and exposure assisting device of claim 7, wherein the high light transmissive elastic material is selected from the group consisting of silicone rubber, eucalyptus oil coated soft outer layer, enamel organic material, and fluorine-containing organic material. The exposure assisting device of claim 7, wherein the bottom of the flexible sheet is made into a curved surface conforming to the curved substrate. The invention relates to a bonding and exposure auxiliary device, which can form a curved substrate into a photoresist layer having a curved pattern, comprising: a film mask comprising: a film substrate composed of a flexible material on the film substrate Having a plurality of positioning holes, the fixing film is positioned by the positioning holes to accurately align the film substrate; and a film mask layer is formed on the film substrate The film mask layer forms a pattern, and the pattern is visible, so that the curved substrate can be subjected to a subsequent curved lithography process, and the curved surface pattern is formed on the curved substrate; and wherein the thickness of the film substrate is between Between 1-100 microns, the film mask layer is between 10-3000 nm; a hard plate is pre-made as a curved surface conforming to the curved substrate, and when the film mask is attached to the curved substrate Pressing the film reticle to closely adhere the film reticle to the photoresist layer of the curved substrate to make the film reticle curved; wherein the curved substrate of the film reticle layer is adhered, Placed on an exposure machine for exposure The photoresist layer to form the pattern. The bonding and exposure aid of claim 10, wherein the flexible material is selected from the group consisting of PET. The bonding and exposure assisting device of claim 10, wherein the film mask is pressed to closely adhere the film mask to the photoresist layer of the curved substrate by vacuuming. A method of attaching a film mask to a curved substrate, comprising: Providing a curved substrate, a film mask, and a bonding aid, the curved substrate having a photoresist layer; the film mask being disposed between the curved substrate and the bonding aid; and applying the bonding aid The film mask is pressed to the curved substrate. The method of claim 13, further comprising: performing a vacuum process to remove air between the film mask and the curved substrate. The method of claim 13 or 14, wherein the bonding aid is composed of a soft material. The method of claim 15, wherein the soft material is composed of a highly transparent elastic material that can penetrate light of 300 to 500 nm. The method of claim 16, wherein the high light transmission elastic material is selected from the group consisting of silicone rubber, eucalyptus oil coated soft outer layer, enamel organic material, and fluorine-containing organic material. The method of claim 13 or 14, wherein the bonding aid is composed of a rigid material.