TWI566151B - Touch panel and electronic device - Google Patents

Description

Touch panel and electronic device

The present invention relates to a touch panel, and particularly to a touch panel that provides a low resistance path between a metal lead electrically connected to a touch electrode and a bonding pin of a flexible circuit board, and an electronic device using the touch panel. .

A plurality of touch electrodes are disposed in a common touch panel. The touch electrodes are made of a transparent conductive material, and the touch operation can be detected by changing a capacitance value of the touch electrodes. The touch electrodes are electrically connected to the plurality of bonding pins through the plurality of metal wires, and the bonding pins are electrically connected to the integrated circuit (IC). The flexible circuit board transmits and receives the driving and sensing signals of the touch electrodes. In some conventional practices, the material of the metal wire comprises aluminum or copper, and to save the process steps, the bond pins are typically made in the same process as the metal wires. However, in the reliability test, because the metal material is easily corroded, the characteristics of the touch panel are affected. In addition, because when the touch panel is subjected to electrostatic problems, static electricity will be electrostatically discharged by the electrostatic discharge path of the metal wire/joint pin to prevent static electricity from damaging the touch panel, and therefore seek to solve the problem of corrosion extending from the bonding pin to the metal. Wire At the same time, avoiding static damage to the touch panel at the same time is an issue of concern to those skilled in the art.

Embodiments of the present invention provide a touch panel including a substrate, a transparent conductive layer, a metal layer, a cover layer, a conductive material layer of a different direction, and a bonding pin of the flexible circuit board. The transparent conductive layer is disposed on the substrate, and the transparent conductive layer includes a touch electrode pattern and a bonding pin. The metal layer is disposed on the substrate and includes a metal wire electrically connected to the touch electrode pattern and the bonding pin. The cover layer covers the touch electrode pattern and the metal wire. The different direction conductive material layers are disposed on the bonding pins. The bonding pins of the flexible circuit board are disposed on the opposite direction conductive material layer, and the bonding pins are electrically connected by the opposite direction conductive material layer.

In some embodiments, the distance from the end of the bond pin to the side of the cover layer on the substrate is less than 200 microns.

In some embodiments, the touch panel further includes a conductive block disposed on the bonding pin and electrically connected to the bonding pin, wherein the conductive block and the metal wire have a gap, wherein the conductive block has a resistivity smaller than The resistivity of the bond pins.

In some embodiments, the conductive bumps belong to a metal layer and the conductive bumps directly contact the bond pins.

In some embodiments, the cover layer covers at least a portion of the conductive bumps.

In some embodiments, from the normal vector of the substrate, The pedestal, the conductive block and the bond pins are at least partially overlapped.

In some embodiments, the conductive bumps are in direct contact with the bond pins or are electrically connected to the bond pins by a layer of electrically conductive material in a different direction.

In some embodiments, the material of the conductive block comprises aluminum or copper.

In some embodiments, the substrate includes an active area and an inactive area. The touch electrode pattern is located in the active region; the conductive block, the different direction conductive material layer and the bonding pin are located in the inactive area.

Embodiments of the present invention provide an electronic device including the above touch panel.

In the above-mentioned electronic device and touch panel, the conductive block provides a conductive path with a low resistivity, whereby the problem of electrostatic discharge can be improved.

The above described features and advantages of the invention will be apparent from the following description.

100, 200, 300‧‧‧ touch panels

110‧‧‧Display area

112‧‧‧Non-display area

121‧‧‧First touch electrode column

122‧‧‧Second touch electrode column

121a, 122a‧‧‧ touch electrodes

121b‧‧‧Bridge

122b‧‧‧Connecting Department

131, 132‧‧‧Metal wires

140‧‧‧Join pins

150‧‧‧Transverse conductive material layer

150s‧‧‧Side side of conductive material layer

160‧‧‧Soft circuit board

160a‧‧‧Join pin

160b‧‧‧Flexible substrate

160a1‧‧‧End of the joint pin

X, Y, Z‧‧ Direction

AA’‧‧‧ Tangent

210‧‧‧Substrate

220‧‧‧metal layer

230‧‧‧Transparent conductive layer

240‧‧‧ Coverage

Side of the 240s‧‧ ‧ cover

280‧‧‧Electrostatic Discharge Path

D1‧‧‧ distance

310‧‧‧Electrical block

310s‧‧‧Side side of conductive block

G‧‧‧ gap

L‧‧‧ length

OV1‧‧‧ cover layer extends beyond the distance of the metal wire

1 is a top plan view of a touch panel according to a first embodiment of the present invention.

Fig. 2 is a cross-sectional view of the present invention corresponding to a tangent AA' of Fig. 1.

[Fig. 3a to 3d] are diagrams showing electrostatic discharge paths of different aspects in the first embodiment of the present invention.

4 is a top plan view of a touch panel according to a second embodiment of the present invention.

Fig. 5 is a cross-sectional view corresponding to the tangential line AA' of Fig. 4 of the present invention.

[Fig. 6a, 6b] is an electrostatic discharge path diagram of the present invention which does not have a conductive block and has a conductive block.

[Fig. 7a, 7b, 7c] are cross-sectional views of different covering layers in the second embodiment of the present invention.

FIG. 8 is a top plan view of a touch panel according to another aspect of the second embodiment of the present invention.

[Fig. 9a, 9b] are diagrams showing electrostatic discharge paths of different aspects in the second embodiment of the present invention.

[Fig. 10a, 10b] are electrostatic discharge path diagrams of different embodiments in the second embodiment of the present invention.

[Fig. 11a, 11b, 11c, 11d] are cross-sectional views of different covering layers in the second embodiment of the present invention.

The aspects of the present disclosure can be better understood from the following detailed description when read in conjunction with the drawings. It should be emphasized that, according to the standard practice in the industry, the features in the figures are not drawn to scale, and in fact each feature can be arbitrarily increased or decreased. In addition, other features may be added between features and features unless specifically noted as "direct contact" below.

[First Embodiment]

1 is a schematic plan view of a touch panel 100 according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view corresponding to a tangent line AA' of FIG. 1. Referring to FIG. 1 and FIG. 2 simultaneously, the touch panel 100 includes a substrate 210. The substrate 210 includes an active region 110 (also referred to as a touch region) and an inactive region. (non-active region) 112 (also known as the surrounding area). Touch electrodes 121a and 122a (also referred to as touch electrode patterns) and a plurality of metal wires 131 and 132 are respectively formed in the active region 110 and the inactive region 112. The plurality of touch electrodes 121a are formed along the bridge portion 121b. The first touch electrode row 121 extending in the Y direction, and the plurality of touch electrodes 122a form the second touch electrode array 122 extending along the X direction by the connection portion 122b. The first touch electrode row 121 and the second touch electrode row 122 are spatially isolated from each other. In this embodiment, the touch electrode 121a is a driving electrode, and the touch electrode 122a is a sensing electrode. However, the present invention is not limited thereto. In other embodiments, the touch electrode 121a may also be a sensing electrode. The touch electrode 122a is a drive electrode. The first touch electrode row 121 and the second touch electrode row 122 are electrically connected to one ends of the metal wires 131 and 132, respectively. The other ends of the metal wires 131 and 132 are electrically connected to the bonding pins 140, and the bonding pins 140 are formed by multiple layers of the anisotropic conductive film (ACF) 150 and the flexible circuit board 160. The bonding pin 160a (generally known as a gold finger) is electrically connected. As shown in FIG. 2, the flexible circuit board 160 includes a flexible substrate 160b and a plurality of bonding pins 160a disposed on the flexible substrate 160b. 2 is only a cross-sectional view of the metal lead 132 electrically connected to the joint pin 140. However, the cross-sectional view of the metal lead 131 electrically connected to the joint pin 140 is the same as that of FIG. 2, and therefore the same description will not be repeated. It should be noted that although FIG. 1 does not show that the plurality of bonding pins 160a of the flexible circuit board 160 are electrically connected to the touch provided on the flexible circuit board 160 by the conductive traces of the flexible circuit board 160. a control circuit component (such as a touch IC) (not shown) or a printed circuit board disposed on the flexible circuit board 160 The touch circuit elements (not shown) are known to those of ordinary skill in the art and will not be described again. As shown in the cross-sectional view of FIG. 2, an anisotropic conductive film (ACF) 150 is disposed between the bonding pin 160a of the flexible circuit board 160 and the bonding pin 140 in the Z direction for electrical connection. The bonding pin 160a of the flexible circuit board 160 and the bonding pin 140. The touch panel 100 further includes an over coating layer 240 formed on the touch electrodes 121a and 122a and the metal wires 131 and 132, and has a function of protecting the touch electrodes and the metal wires. The cover layer 240 covers the active region 110 and the partial inactive region 112 and has an opening 240a exposing the bonding pin 140 such that the opposite-direction conductive material layer 150 can be disposed over the bonding pin 140, and the flexible circuit board 160 is bonded. The foot 160a can press the different direction conductive material layer 150 such that the bonding pin 160a is electrically connected to the bonding pin 140. In the present embodiment, the thickness of the cover layer 240 is between 1 micrometer and 2 micrometers, and in FIG. 2, in the normal vector of the substrate, the cover layer 240 extends beyond the metal conductor in the direction of the conductive material layer 150 in the opposite direction. The distance OV1 of 131, 132 is between 10 micrometers and 50 micrometers, and preferably between 20 micrometers and 30 micrometers, but the thickness of the cover layer 240 of the present invention and the distance over which the cover layer 240 extends beyond the metal wires 131, 132 are not limit. 1 and 2 illustrate that the side 150s of the opposite-direction conductive material layer 150 contacts the side 240s of the cover layer 240, but the invention is not limited thereto because the opposite-direction conductive material layer 150 is used for electrical conductivity in the Z direction. The bonding pin 160a and the bonding pin 140 are connected, so that the dislocation conductive material layer 150 can be disposed at a position that does not contact the side 240s of the cover layer 240, and the side 150s of the different direction conductive material layer 150 to the side 240s of the cover layer 240. The distance can also be affected without affecting the bonding pins 160a and the electrical connection of the joint pin 140 are adjusted according to actual needs. With the above configuration, and the touch circuit component (for example, the touch control IC) is disposed on the flexible circuit board 160 or the printed circuit board (not shown) electrically connected to the flexible circuit board 160, the touch can be touched. The driving signal and the sensing signal are transmitted through the path of the bonding pin 160a/the different direction conductive material layer 150/the bonding pin 140/metal wires 131, 132/touch electrodes 121a, 122a of the flexible circuit board 160 for sensing use. The touch point coordinates of the touch panel 100.

In this embodiment, the touch electrodes 121a, 122a are formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or other conductive and transparent materials. The wires 131, 132 may be made of aluminum, copper or other suitable metal or alloy, and the material of the bonding pins 140 is different from the metal wires 131, 132, and is preferably the same material as the touch electrodes 121a, 122a and is Formed in the same process step to save costs. In the prior art, the material of the bonding pin 140 is the same as that of the metal wires 131, 132, so when performing the reliability test, the corrosion of the bonding pin 140 (for example, aluminum rust) may extend to the metal wires 131, 132, resulting in The performance of the touch panel 100 is abnormal. By providing the bonding pins 140 different from the metal wires 131 and 132 in the touch driving signal and the sensing signal transmission path, the reliability test of the touch display device 100 can be avoided because the bonding pins 140 are used. The corrosion causes the performance of the touch panel 100 to be abnormal.

It should be noted that, in this embodiment, the metal wires 131 and 132 are in direct contact with the bonding pins 140 to be electrically connected to each other. However, in the present invention, the electrical connections of the metal wires 131 and 132 and the bonding pins 140 are not electrically connected. Take This is limited. For example, in other embodiments, the bonding pin 140 may have an insulating layer between the metal wires 131, 132 disposed thereon, and the insulating layer has conductive vias to electrically connect the bonding pins 140 and Metal wires 131, 132.

In addition, the shape and arrangement of the touch electrodes 121a and 122a in FIG. 1 are merely examples, and the present invention does not limit the shape, arrangement, and formation method of the touch electrode patterns. For example, although the touch electrode pattern is a conventional single-sided ITO (SITO) structure in the embodiment of FIG. 1, the invention is not limited thereto. In other embodiments, the touch electrode pattern may be a single layer solution (OLS) structure or a double sided ITO (DITO) structure. In addition, although the touch electrodes of the touch panel 100 are designed as a mutual-capacitance type, the present invention is not limited thereto. In other embodiments, the touch electrodes of the touch panel may also be designed. It is a self-capacitance type.

In a practical application, the touch panel 100 can be separately formed and then combined with the display panel to form a touch display screen, or the touch panel and the display panel can be integrated into an On-cell or In-cell type touch display screen. In the On-cell or In-cell type touch display screen implementation, the substrate 210 of FIG. 2 corresponds to a color filter substrate or a TFT array substrate. In addition, the touch panel 100 is included in an electronic device, and the electronic device may be a television, a smart phone, a tablet computer, a notebook computer, or any device having a touch function, but is not limited thereto.

Please continue to refer to Figure 2. The material of the substrate 210 includes, for example, Glass, polymer, composite, or a combination thereof. Useful materials are, for example, but not limited to, polyethylene terephthalate (PET), polycarbonate (PC), polyether sulfone (PES), triacetyl cellulose (triacetyl) Cellulose, TAC), polymethyl methacrylate (PMMA), polyethylene, cycloolefin polymer (COP), polyimide (PI), and polycarbonate (PC) with polymethyl A composite material composed of methyl acrylate (PMMA) and the like.

The substrate 210 has a transparent conductive layer 230. The transparent conductive layer 230 includes a touch electrode pattern (ie, touch electrodes 121a, 122a) in the active region 110 and a bonding pin 140 in the inactive region 112. The material of the transparent conductive layer 230 includes indium tin oxide, indium zinc oxide, or other conductive and transparent materials. The substrate 210 also has a metal layer 220 thereon. The metal layer 220 includes metal wires 131, 132. The material of the metal layer 220 includes copper, aluminum, or other suitable metal or alloy. The cover layer 240 covers the touch electrode patterns and the metal wires 131, 132 and has an opening 240a exposing the bonding pins 140, and the cover layer 240 may be made of any suitable insulating material. In some embodiments, the metal wires 131, 132 are in direct contact with the bond pins 140. By electrically connecting the metal wires 131 and 132 to the bonding pin 140, the bonding pin 140 is provided with an opposite-direction conductive material layer 150, and the different-direction conductive material layer 150 is provided with a bonding pin 160a of the flexible circuit board 160. The metal wires 131 and 132 are electrically connected to the flexible circuit board 160. The material of the bonding pins 160a of the flexible circuit board 160 includes, for example, copper or gold, but is not limited thereto.

In this embodiment, the distance between the end 160a1 of the bonding pin 160a and the side 240s of the cover layer 240 on the substrate 210 is D1. When the touch panel 100 encounters a static problem, the static electricity is discharged by the discharge path 280 of the metal wires 131, 132 / the bonding pins 140 / the different direction conductive material layer 150 / the bonding pins 160a of the flexible circuit board 160 (such as Figure 2 shows the arrow). Although the present invention provides the bonding pins 140 different in material from the metal wires 131 and 132 in the touch driving signal and the sensing signal transmission path, the metal wires 131 and 132 are prevented from being formed during the reliability test of the touch display device 100. Corrosion, but because the resistance value of the bonding pin 140 formed by the transparent conductive material of the present invention is larger than that of the bonding material of the same material as the metal wire in the prior art (the sheet resistance of the general transparent conductive material is about 18 ohm/sq, The resistivity is about 10 -4 power ohm.cm, while the metal lead sheet containing aluminum or copper has a resistance of about 0.5 ohm/sq and a resistivity of about 10 to -8 ohm.cm), while the static electricity is very It is easy to accumulate a very high potential in a short time, and therefore it is easy to cause damage due to the large impedance of the discharge path 280, so that static electricity is not released and accumulated on the touch panel 100. In addition, since the resistance of the bonding pin 140 formed of a transparent conductive material is large, the bonding pin 140 is also subjected to high power when discharged, so that the bonding pin 140 is extremely melted and melted when subjected to an electrostatic problem. Therefore, the present invention reduces the impedance of the discharge path 280 by setting the distance D1 to less than 200 microns (i.e., when the electrostatic discharge is released, the path through the shorter joint pin 140 can be released upward by the conductive material layer 150 in the opposite direction. To the bonding pin 160a) of the flexible circuit board 160. In this way, the electrostatic discharge problem caused by the large resistance of the bonding pin 140 can be solved.

It should be noted that, although the discharge path in the conductive material layer 150 in the different direction is shown as being inclined and having an angle with the Z axis in the discharge path 280 illustrated in FIG. 2, it is merely an example. Because the bonding pins 160a and the bonding pins 140 are formed by the conductive particles (not shown) in the conductive material layer 150 in different directions to form a vertical conduction, the conductive particles are uniformly dispersed in the opposite direction conductive material layer 150. Therefore, the discharge path between the actual bonding pin 140 and the bonding pin 160a is determined according to the position of the conductive particles in the conductive material layer 150 that are pressed and conducted in the opposite direction, and thus, in some embodiments, the conductive material in the opposite direction The discharge path in layer 150 may also be substantially parallel to the Z axis.

In addition, because the projections of the end portion 160a1 of the bonding pin 160a and the side 240s of the cover layer 240 in the Z-axis direction overlap in FIG. 2 (that is, the height and coverage of the bonding pin 160a on the Z-axis) The height of the layer 240 on the Z axis overlaps, so the distance D1 between the end 160a1 of the bonding pin 160a and the side 240s of the cover layer 240 depicted in FIG. 2 is a parallel XY plane. In other embodiments of the present invention, if the thickness of the opposite direction conductive material layer 150 is such that the projection of the end portion 160a1 of the bonding pin 160a and the side 240s of the cover layer 240 in the Z-axis direction does not overlap (that is, in the Z-axis) The upper surface of the bonding pin 160a is higher than the upper surface of the cover layer 240, and the distance D1 between the end 160a1 of the bonding pin 160a and the side 240s of the cover layer 240 is not parallel to the XY plane, and the XY plane With an angle. Since the impedance of the discharge path 280 is proportional to the projected length of the distance D1 between the end 160a1 of the bonding pin 160a and the side 240s of the cover layer 240 on the substrate 210, the present invention is based on the distance D1 on the substrate 210. The projection length on the top is set to Less than 200 microns to reduce the impedance of the discharge path 280. In the embodiment of FIG. 2, since the distance D1 is a parallel X-Y plane, the projection length of the distance D1 on the substrate 210 is equal to D1.

Referring to FIGS. 3a-3d, FIG. 3a is a schematic diagram of the distance D1 between the end 160a1 of the bonding pin 160a of the flexible circuit board 160 and the side 240s of the cover layer being greater than 200 micrometers, and FIG. 3b is a distance D1 less than 200 micrometers. And a schematic view greater than 0 microns, FIG. 3c is a schematic view of the distance D1 being equal to 0 microns, and FIG. 3d is the end 160a1 of the bond pin 160a being above the cover layer 240. 3a-3d, it can be seen that, in the case of electrostatic discharge, compared to the arrangement of the bonding pins 160a of FIG. 3a, the paths of FIGS. 3b to 3d can be released to the soft state by the conductive material layer 150 in the opposite direction via the shorter bonding pin 140 path. The bonding pin 160a of the circuit board 160 can reduce the risk of static damage to the touch panel 100 or the bonding pin 140 during electrostatic discharge to improve the electrostatic protection capability of the touch panel 100.

[Second embodiment]

4 to 5, FIG. 4 is a schematic plan view of the touch panel 200 according to the second embodiment of the present invention, and FIG. 5 is a cross-sectional view corresponding to the line AA' of FIG. 4 to 5 differ from FIGS. 1 to 2 in that the conductive blocks 310 are formed on the upper surface of the bonding pins 140 in FIGS. 4 to 5, and the rest are similar to the first embodiment, and the same description will not be repeated here. In the present embodiment, the conductive block 310 and the metal wires 131, 132 belong to the metal layer 220, and thus the conductive block 310 and the metal wires 131, 132 can be formed in the same process step to save cost. However, the present invention is not limited thereto, and the material of the conductive block 310 may be different from the metal wires 131 and 132. As shown in FIG. 5, the length of the conductive block 310 extending in the X direction The degree is L. In the distance of the length L of the segment, as long as the resistance of the conductive block 310 is lower than the resistance of the lower bonding pin 140 in the length L of the segment, the charge will be upward toward the electrostatic discharge. The lower conductive block 310 moves to quickly release the static electricity. Therefore, the material of the conductive block 310 is preferably a metal material or other conductive material having a lower resistivity than the bonding pin 140, but the invention is not limited thereto. The conductive block 310 is disposed between the cover layer 240 and the bonding pin 160a of the flexible circuit board 160 in the X direction, and is electrically connected to the bonding pin 140. In the embodiment of FIG. 5, the conductive block 310 is a direct contact bonding pin 140, but the invention is not limited thereto. For example, in other embodiments, when the conductive block 310 and the metal wires 131, 132 belong to the metal layer 220, and the bonding pins 140 and the metal wires 131, 132 and the conductive blocks 310 located thereon have a An insulating layer having conductive vias for electrically connecting the bonding pins 140 and the metal wires 131, 132 and the conductive blocks 310 thereon, since the conductive vias are generally made of a resistivity much lower than that of the transparent conductive material. The metal material is formed, so that when the electrostatic discharge is released, the electric charge moves from the bonding pin 140 upward through the conductive via hole to the lower resistance conductive block 310.

Therefore, the electrostatic discharge path 280 of the present embodiment includes the low resistance conductive block 310, that is, the first embodiment of the original electrostatic discharge path 280 is higher than the first embodiment without the conductive block 310. The resistance of the bonding pin 140 is replaced by the lower resistance conductive block 310, so that the static electricity encountered by the touch panel 200 can be quickly released through the discharge path 280 to prevent the touch panel 200 from being damaged by static electricity (refer to FIG. 6a). The discharge path without the conductive block 310 and the discharge path of the conductive block 310 of FIG. 6b). It should be particularly noted that the present invention can be combined with the embodiment of FIGS. 3a and 3b to form a conductive block. 310 is disposed between the end portion 160a1 of the bonding pin 160a and the side 240s of the cover layer 240, and the conductive material layer 150 and the bonding pin 140 do not have the opposite direction conductive material layer 150, that is, the bonding pin 160a is not limited in this embodiment. The distance D1 from the end portion 160a1 to the side 240s of the cover layer. For example, in the aspect where the distance D1 is less than 200 micrometers, the conductive block 310 is formed on the upper surface of the bonding pin 140 to further reduce the impedance of the electrostatic discharge path and improve the electrostatic discharge protection capability. Or the distance D1 cannot be reduced to less than 200 micrometers due to factors such as the length of the bonding pin 160, the width of the opposite-direction conductive material layer 150, and the size of the opening 240a of the cover layer 240, and may be formed by the upper surface of the bonding pin 140. Conductive block 310 to enhance electrostatic discharge protection. In addition, as shown in FIGS. 4 and 5, since the conductive block 310 does not directly contact the metal wires 131 and 132 and has a gap G between the metal wires 131 and 132, the conductive block 310 is electrically connected to the bonding pin 140. Metal wires 131, 132. With the above configuration, when the reliability test of the touch panel is performed, even if the corrosion phenomenon of the conductive block 310 occurs, the corrosion does not extend to the occurrence of the metal wires 131 and 132, so that the touch panel can still operate normally ( Because the touch driving signal and the sensing signal can pass through the bonding pin 160a of the flexible circuit board 160 / the opposite-direction conductive material layer 150 / the bonding pin 140 even when the resistance of the conductive block 310 is severely corroded and the resistance is increased or disconnected. / Path transmission of metal wires 131, 132).

It should be noted that the present invention does not limit the length, width, thickness or aspect ratio of the conductive block 310, nor does it limit the width of the conductive block 310 to be wider than the width of the bonding pin 140 as shown in FIG. For example, referring to FIG. 5, the length of the conductive block 310 extending in the X direction is L, and the length of the segment L is L. In the distance, as long as the resistance of the conductive block 310 is lower than the resistance of the lower bonding pin 140 in the length L of the segment, the electric charge will move upward toward the lower conductive block 310 to quickly move. Release static electricity. Therefore, those skilled in the art can adjust the position, shape, thickness, length or width of the conductive block according to the design requirements and process capability of the touch panel.

In the embodiment of FIG. 5, the conductive block 310 does not directly contact the cover layer 240, and is disposed between the end portion 160a1 of the bonding pin 160a and the side 240s of the cover layer 240, but the invention is not limited thereto. Referring to FIGS. 7a-7c, in the embodiment of FIG. 7a, the side 310s of the conductive block 310 directly contacts the side 240s of the cover layer 240, and in the embodiment of FIGS. 7b and 7c, the cover layer 240 is partially covered and Full coverage of the conductive block 310 can also achieve the effect of improving the electrostatic protection capability. That is, whether the overlay 240 directly contacts or covers the conductive block 310 does not affect the electrostatic protection capability. Therefore, those skilled in the art can determine whether the overlay 240 contacts or covers the conductive block 310 according to process capability and touch panel design requirements. . In addition, since at least a portion of the conductive block 310 in the embodiment of FIGS. 5, 7a, and 7b is exposed to the air and is susceptible to moisture corrosion, the cover layer 240 completely covers the conductive block 310 in the embodiment of FIG. 7c to avoid the above water. The problem of gas etching the conductive block 310.

In the embodiment of FIGS. 5, 7a-7c, the conductive block 310 does not directly contact the bonding pins 160a of the flexible circuit board 160. 8 and 9a, FIG. 8 is a top plan view of the touch panel 300 of the present invention, and FIG. 9a is a cross-sectional view corresponding to the tangent line AA' of FIG. As shown in FIGS. 8 and 9a, in the vertical direction (Z direction) (as viewed from the normal vector of the substrate 210), the conductive block 310 and the bonding The pin 140 and the bonding pin 160a of the flexible circuit board 160 are at least partially overlapped. In the embodiment of Figures 8, 9a, the conductive block 310 is a bond pin 160a that directly contacts the flexible circuit board 160, in practice forming a longer conductive block 310. The present invention is not limited to the embodiment of FIGS. 8 and 9a, and the bonding lead 160a of the flexible circuit board 160 may be designed to have a longer length as shown in FIG. 9b, and the conductive block 310 may also be in direct contact with the flexible circuit board 160. Bonding pin 160a. The present invention does not limit the length of the bonding pins 160a of the conductive block 310 and the flexible circuit board 160. Referring to FIG. 6b, 7a-7c, 9a-9b, the discharge path 280 of FIG. 6b, 7a-7c is a metal wire 131, 132 / bonding pin 140 / conductive block 310 / bonding pin 140 / The opposite direction conductive material layer 150 / the bonding pin 160a of the flexible circuit board 160, and the electrostatic discharge path 280 of FIGS. 9a to 9b is the bonding of the metal wires 131, 132 / the bonding pin 140 / the conductive block 310 / the flexible circuit board 160 Pin 160a, thus the embodiment of Figures 9a, 9b provides a lower impedance electrostatic discharge path 280, which further enhances the electrostatic protection capability of the touch panel, as compared to the embodiment of Figures 6b, 7a-7c.

Next, please refer to Figures 10a and 10b. 10a, 10b differ from FIGS. 9a, 9b in that the conductive block 310 has a different direction conductive material layer 150 between the bonding pins 160a of the flexible circuit board 160. When the difference between the thickness of the conductive block 310 and the different direction conductive material layer 150 (for example, if the thickness of the conductive block 310 is much smaller than the thickness of the opposite direction conductive material layer 150), the conductive block 310 cannot directly contact the flexible circuit as shown in FIGS. 9a and 9b. When the board 160 is bonded to the pin 160a, the opposite-direction conductive material layer 150 can be disposed on the bonding pin 140 and the conductive block 310, and then the bonding pin 160a of the flexible circuit board 160 is pressed into the opposite-direction conductive material. Bonding of the flexible circuit board 160 on the layer 150 The pin 160a can be electrically connected to the bonding pin 140 and the conductive block 310 by the opposite direction conductive material layer 150. Referring to the electrostatic discharge paths 280 of FIGS. 6b, 7a-7c, 10a-10b, the discharge paths 280 of FIGS. 6b, 7a-7c are metal wires 131, 132/joint pins 140/conductive blocks 310/joint pins 140/ The opposite direction conductive material layer 150 / the bonding pin 160a of the flexible circuit board 160, and the electrostatic discharge path 280 of FIGS. 10a, 10b is the metal wire 131, 132 / bonding pin 140 / conductive block 310 / the direction of the conductive material layer 150 The bonding pin 160a of the flexible circuit board 160, thus the embodiment of Figures 10a, 10b provides a lower impedance electrostatic discharge path 280 than the embodiment of Figures 6b, 7a-7c.

Next, please refer to Figures 11a to 11d. In the embodiment of FIGS. 9a-9b and 10a-10b, although the cover layer 240 does not cover the conductive block 310, other embodiments of the present invention may be modified such that the cover layer 240 partially covers the conductive block 310 as shown in FIGS. 11a-11d to avoid The problem of moisture eroding the conductive block 310. It should be noted that the right side of the cover layer 240 in FIGS. 11a to 11d does not contact the bonding pin 160a or the opposite-direction conductive material layer 150 of the flexible circuit board 160, but the invention is not limited thereto. In other embodiments, The side of the cover layer 240 may contact the bonding pin 160a of the flexible circuit board 160 or the opposite-direction conductive material layer 150 to completely cover the conductive block 310 with the bonding pin 160a of the flexible circuit board 160 or the opposite-direction conductive material layer 150.

Those skilled in the art can retouch or modify the embodiments of Figures 4, 5, 7a-7c, 8, 9a-9b, 10a~10b, 11a~11d to make other forms of conductive blocks, as long as they are in metal. Bonding pins of the electrical connections of the wires 131, 132 and the bonding pins 140 to the flexible circuit board 160 It is within the scope of the invention for the discharge path 280 between 160a to provide a conductive block having a small resistance value (compared to the resistance of the bonding pin 140 being the same length L).

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

132‧‧‧Metal wire

140‧‧‧Join pins

150‧‧‧Transverse conductive material layer

150s‧‧‧Side side of conductive material layer

160‧‧‧Soft circuit board

160a‧‧‧Join pin

160b‧‧‧Flexible substrate

160a1‧‧‧End of the joint pin

X, Z‧‧‧ direction

210‧‧‧Substrate

220‧‧‧metal layer

230‧‧‧Transparent conductive layer

240‧‧‧ Coverage

Side of the 240s‧‧ ‧ cover

280‧‧‧Electrostatic Discharge Path

D1‧‧‧ distance

OV1‧‧‧ cover layer extends beyond the distance of the metal wire

Claims (10)

A touch panel includes: a substrate; a transparent conductive layer disposed on the substrate, the transparent conductive layer includes a touch electrode pattern and at least one bonding pin; a metal layer disposed on the substrate Including at least one metal wire, the metal wire is electrically connected to the touch electrode pattern and the bonding pin; a cover layer covering the touch electrode pattern and the metal wire; and a conductive material layer in an opposite direction is disposed on the bonding And a flexible circuit board comprising at least one bonding pin disposed on the opposite-direction conductive material layer, and electrically connecting the bonding pin by the opposite-direction conductive material layer; The distance from the end of the bond pin to the side of the cover layer on the substrate is less than 200 microns. The touch panel of claim 1, wherein the cover layer extends in a direction of the opposite direction conductive material layer beyond the metal wire by a distance from the normal vector of the substrate. The touch panel of claim 2, wherein the distance is between 10 micrometers and 50 micrometers. The touch panel of claim 1, wherein the metal wire is in direct contact with the bonding pin. The touch panel of claim 1, wherein the metal wire, the bonding pin, the anisotropic conductive material layer, and the bonding pin form a conductive path. The touch panel of claim 1, wherein the distance from the end of the bonding pin to the side of the cover layer is 0 micrometers. The touch panel of claim 1, wherein the transparent conductive layer comprises indium tin oxide or indium zinc oxide. The touch panel of claim 1, wherein the material of the at least one metal wire comprises aluminum or copper. The touch panel of claim 1, wherein the substrate comprises an active area and an inactive area, the touch electrode pattern is located in the active area, and the conductive material layer of the different direction is located at the bonding pin. Within the inactive area. An electronic device including a touch panel, the touch panel includes: a substrate; a transparent conductive layer disposed on the substrate, the transparent conductive layer package a touch electrode pattern and at least one bonding pin; a metal layer disposed on the substrate and including at least one metal wire electrically connected to the touch electrode pattern and the bonding pin; Covering the touch electrode pattern and the metal wire; a different direction conductive material layer disposed on the bonding pin; and a flexible circuit board including at least one bonding pin, the bonding pin being disposed in the opposite direction Above the conductive material layer, and electrically connecting the bonding pin by the opposite direction conductive material layer, wherein the distance from the end of the bonding pin to the side of the cover layer is less than 200 micrometers on the substrate .