TWI563613B - Method of manufacturing electronic package module and electronic package module manufactured by the same - Google Patents

Method of manufacturing electronic package module and electronic package module manufactured by the same

Info

Publication number
TWI563613B
TWI563613B TW103126024A TW103126024A TWI563613B TW I563613 B TWI563613 B TW I563613B TW 103126024 A TW103126024 A TW 103126024A TW 103126024 A TW103126024 A TW 103126024A TW I563613 B TWI563613 B TW I563613B
Authority
TW
Taiwan
Prior art keywords
electronic package
package module
same
manufactured
manufacturing
Prior art date
Application number
TW103126024A
Other languages
Chinese (zh)
Other versions
TW201605001A (en
Inventor
Jen Chun Chen
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW103126024A priority Critical patent/TWI563613B/en
Publication of TW201605001A publication Critical patent/TW201605001A/en
Application granted granted Critical
Publication of TWI563613B publication Critical patent/TWI563613B/en

Links

TW103126024A 2014-07-30 2014-07-30 Method of manufacturing electronic package module and electronic package module manufactured by the same TWI563613B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103126024A TWI563613B (en) 2014-07-30 2014-07-30 Method of manufacturing electronic package module and electronic package module manufactured by the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103126024A TWI563613B (en) 2014-07-30 2014-07-30 Method of manufacturing electronic package module and electronic package module manufactured by the same

Publications (2)

Publication Number Publication Date
TW201605001A TW201605001A (en) 2016-02-01
TWI563613B true TWI563613B (en) 2016-12-21

Family

ID=55809711

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103126024A TWI563613B (en) 2014-07-30 2014-07-30 Method of manufacturing electronic package module and electronic package module manufactured by the same

Country Status (1)

Country Link
TW (1) TWI563613B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778323B (en) * 2019-01-29 2022-09-21 日商日亞化學工業股份有限公司 Method of manufacturing light emitting device
TWI817669B (en) * 2019-01-29 2023-10-01 日商日亞化學工業股份有限公司 Light emitting device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6672113B2 (en) * 2016-09-09 2020-03-25 Ｔｏｗａ株式会社 Electronic circuit device and method of manufacturing electronic circuit device
TWI719718B (en) 2019-11-18 2021-02-21 啟碁科技股份有限公司 Package structure and manufacturing method thereof
TWI732517B (en) * 2020-04-09 2021-07-01 矽品精密工業股份有限公司 Electronic package and manufacturing method thereof
CN113611688A (en) * 2021-08-03 2021-11-05 东莞记忆存储科技有限公司 Chip structure and processing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200940662A (en) * 2008-03-27 2009-10-01 Walsin Technology Corp Light curable electric conduction ink and light curable electric conduction film
TW201414374A (en) * 2012-09-24 2014-04-01 Universal Scient Ind Shanghai Electronic module and method for same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200940662A (en) * 2008-03-27 2009-10-01 Walsin Technology Corp Light curable electric conduction ink and light curable electric conduction film
TW201414374A (en) * 2012-09-24 2014-04-01 Universal Scient Ind Shanghai Electronic module and method for same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778323B (en) * 2019-01-29 2022-09-21 日商日亞化學工業股份有限公司 Method of manufacturing light emitting device
TWI817669B (en) * 2019-01-29 2023-10-01 日商日亞化學工業股份有限公司 Light emitting device

Also Published As

Publication number Publication date
TW201605001A (en) 2016-02-01

Similar Documents

Publication Publication Date Title
TWI563633B (en) Integrated circuit and method for manufacturing the same
EP3340264A4 (en) Electronic device and electronic device manufacturing method
GB2538459B (en) Coil component, coil module, and method for manufacturing coil component
TWI562337B (en) Integrated circuit, 3d stacked ic device and method of manufacturing the same
EP3104400A4 (en) Electronic component module, and manufacturing method of electronic component module
HUE051760T2 (en) Method of manufacturing a semiconductor module
EP3204966A4 (en) Semiconductor device and method of manufacturing the same
EP3166372A4 (en) Electronic component and method for manufacturing same
TWI560818B (en) Electronic package and the manufacture thereof
SG10201505824YA (en) Semiconductor device and method of manufacturing the same
TWI562318B (en) Electronic package and fabrication method thereof
TWI562455B (en) Electronic package and method of forming the same
HK1221204A1 (en) Package and method for manufacturing same
TWI560828B (en) Chip package and method for forming the same
TWI563615B (en) Electronic package structure and the manufacture thereof
TWI561325B (en) Display module manufacturing method and display module
TWI563613B (en) Method of manufacturing electronic package module and electronic package module manufactured by the same
EP2953161A4 (en) Secondary-battery-equipped circuit chip and manufacturing method therefor
TWI563665B (en) Semiconductor device and method of manufacturing the same
EP3176868A4 (en) Electronic device and electronic device manufacturing method
SG10201407629YA (en) Substrate with bump structure and manufacturing method thereof
TWI561143B (en) Housing, manufacture method of the housing and electronic device using the same
TWI562309B (en) Semiconductor structure and method for fabricating the same
EP3118878A4 (en) Electronic device and manufacturing method therefor
TWI562050B (en) Touch module and manufacturing method thereof