TWI559827B - Flexible electronic module and manufacturing method thereof - Google Patents

Description

Flexible electronic module and manufacturing method thereof

The invention relates to an electronic module and a manufacturing method thereof, and in particular to a flexible electronic module and a manufacturing method thereof.

In order to achieve the stability of electrical quality and the reliability and durability of conductive circuits, traditional electronic products usually make electronic components on rigid carrier boards, so as to avoid the influence of electronic products on the quality of conductive circuits due to deformation or Even the conductive line is broken or the wafer is damaged. However, the fabrication of electronic components on a rigid carrier will greatly limit the applicability of electronic products. For example, an oversized electronic product will be difficult to carry around, and it will be difficult for the user to wear it, and it is also inconvenient to collect. In addition, such electronic products are also difficult to adhere to a curved surface of a human, animal or plant or mechanical structure.

With the advancement of process technology, some flexible electronic products have been developed. However, these flexible electronic products still have certain limitations in deformation. For example, although they are bendable and bendable, they still cannot be stretched, and there are still some limitations in the application of such flexible electronic products.

Embodiments of the present invention provide a flexible electronic module that can be expanded and contracted according to usage requirements.

Embodiments of the present invention provide a method of manufacturing a flexible electronic module, which can manufacture a flexible electronic module capable of stretching and contracting.

A flexible electronic module according to an embodiment of the invention includes a patterned flexible substrate, a layer of stretchable material, and at least one electronic component. The patterned flexible substrate includes at least one distribution region, and the layer of expandable material connects the distribution regions. The electronic component is disposed on at least one of the patterned flexible substrate and the layer of the stretchable material. The at least one electronic component includes a stretchable wire.

In an embodiment of the invention, the ratio of the Young's modulus of the patterned flexible substrate to the Young's modulus of the layer of the stretchable material is greater than or equal to 10.

In an embodiment of the invention, the at least partially distributed regions are a plurality of island-like structures separated from each other.

In an embodiment of the invention, at least a portion of the distribution region is a plurality of protruding structures, the patterned flexible substrate has a recess between adjacent two protruding structures, and the adjacent two protruding structures are formed by the bottom of the recess Connected.

In an embodiment of the invention, the flexible electronic module further includes a cover layer, wherein the patterned flexible substrate is disposed between the layer of the stretchable material and the cover layer, and the material of the cover layer is a stretchable material.

In an embodiment of the invention, the flexible electronic module further includes a release layer disposed on the patterned flexible substrate.

In an embodiment of the invention, the release layer is disposed on the layer of stretchable material.

In an embodiment of the invention, the adhesion of the stretchable material layer to the patterned flexible substrate is greater than the adhesion of the patterned flexible substrate to the release layer.

In an embodiment of the invention, at least one electronic component includes a plurality of first electrodes, a layer of a stretchable material is disposed between the first electrodes, and the patterned flexible substrate, the layer of the stretchable material, and the at least one electronic component form a Flexible circuit board.

In an embodiment of the invention, the flexible electronic module further includes a flexible electronic device including a plurality of second electrodes, wherein the second electrodes are electrically connected to the first electrodes through an anisotropic conductive film The first electrode is electrically connected to each other through a plurality of anisotropic conductive films.

In an embodiment of the invention, the flexible electronic device includes another patterned flexible substrate and another layer of stretchable material. The other patterned flexible substrate includes at least another distribution region, wherein the second electrodes are disposed on another distribution region. This further layer of stretchable material joins these distribution regions and is disposed between these second electrodes.

A method of manufacturing a flexible electronic module according to an embodiment of the present invention includes: forming a flexible substrate; patterning the flexible substrate to form at least one distribution region; forming a layer of a stretchable material connecting the distribution regions; and forming a flexible substrate Forming at least one electronic component on at least one of the layers of the stretchable material.

In an embodiment of the invention, forming at least one electronic component on at least one of the flexible substrate and the stretchable material layer comprises: forming a conductive layer on the flexible substrate before patterning; and patterning the conductive layer to At least one electronic component is formed.

In an embodiment of the invention, the patterned flexible substrate comprises: forming a patterned mask layer covering the electronic component on the flexible substrate; and etching, removing or stamping the soft layer with the patterned mask layer as a barrier layer The substrate is patterned to expose portions of the mask layer to form a distribution region.

In an embodiment of the invention, forming the layer of the stretchable material connecting the distribution regions comprises: forming a layer of the stretchable material on the flexible substrate, filling the layer of the stretchable material in the gap of the distribution region, and making the layer of the stretchable material Cover electronic components.

In an embodiment of the invention, forming at least one electronic component on at least one of the flexible substrate and the stretchable material layer comprises: forming a conductive layer on the stretchable material layer; and patterning the conductive layer to form at least An electronic component.

In an embodiment of the invention, the manufacturing method of the flexible electronic module further comprises: stamping the layer of the stretchable material with a bump film to form a pattern of the stretchable material layer.

In an embodiment of the invention, the manufacturing method of the flexible electronic module further comprises: forming a release layer on a rigid carrier before forming the flexible substrate, wherein forming the flexible substrate comprises forming on the release layer The flexible substrate, and the adhesion of the release layer to the flexible substrate is greater than the adhesion of the release layer to the rigid carrier.

In an embodiment of the invention, the flexible substrate covers the edge of the release layer, and the manufacturing method of the flexible electronic module further comprises: cutting off the edge of the flexible substrate covering the edge of the release layer, and making the rigid carrier Separated from the release layer.

In an embodiment of the invention, the adhesion of the stretchable material layer to the flexible substrate is greater than the adhesion of the flexible substrate to the release layer.

In an embodiment of the invention, the method for manufacturing the flexible electronic module further comprises: forming a finishing layer on the release layer, wherein the flexible substrate is formed on the modifying layer, and the modifying layer is disposed on the flexible substrate and away from Between the layers to enhance the adhesion between the release layer and the flexible substrate.

In an embodiment of the invention, the manufacturing method of the flexible electronic module further comprises: forming a sacrificial layer on a hard carrier before forming the flexible substrate, wherein forming the flexible substrate comprises forming a flexible substrate on the sacrificial layer And after patterning the flexible substrate, forming the stretchable material, and forming the electronic component, the sacrificial layer is irradiated with a laser to separate the flexible substrate from the hard carrier.

In an embodiment of the invention, the ratio of the Young's modulus of the flexible substrate to the Young's modulus of the layer of the stretchable material is greater than or equal to 10.

In an embodiment of the present invention, the method for manufacturing the flexible electronic module further includes: forming a cover layer on the patterned flexible substrate, wherein the flexible substrate is disposed between the stretchable material layer and the cover layer, and The material of the cover layer is a stretchable material.

In the flexible electronic module of the embodiment of the present invention, since the stretchable material layer is connected to the distribution area, the flexible electronic module can have the effect of expanding and contracting according to the use requirement, thereby increasing the flexible electronic module. Application. In the method of manufacturing a flexible electronic module according to the embodiment of the present invention, since the stretchable material layer that connects the distribution regions is formed, a flexible electronic module capable of stretching and contracting can be manufactured.

In order to make the present invention more apparent, the following detailed description of the embodiments and the accompanying drawings are set forth below.

1 is a cross-sectional view of a flexible electronic module in accordance with an embodiment of the present invention. Referring to FIG. 1 , the flexible electronic module 100 of the present embodiment includes a patterned flexible substrate 110 , a stretchable material layer 120 , and at least one electronic component 130 (in FIG. 1 , a plurality of electronic components 130 are taken as an example). ). The patterned flexible substrate 110 includes at least one distribution region 112 (exemplified by a plurality of distribution regions 112 in FIG. 1), and the stretchable material layer 120 is connected to the distribution region 112. The electronic component 130 is disposed on at least one of the patterned flexible substrate 110 and the stretchable material layer 120, and FIG. 1 is an example in which the electronic component 130 is disposed on the patterned flexible substrate 110.

In the present embodiment, the ratio of the Young's modulus of the patterned flexible substrate 110 to the Young's modulus of the stretchable material layer 120 is greater than or equal to 10. In one embodiment, the ratio of the Young's modulus of the patterned flexible substrate 110 to the Young's modulus of the layer of expandable material 120 is greater than or equal to 50. Alternatively, in an embodiment, the ratio of the Young's modulus of the patterned flexible substrate 110 to the Young's modulus of the layer of expandable material 120 is greater than or equal to 100. In this embodiment, the material of the patterned flexible substrate 110 may be polyimide (PI), polymethylmethacrylate (PMMA), polycarbonate (PC), polyether ( Polyethersulfone, PES), polyamide (PA), polyethylene terephthalate (PET), polyetheretherketone (PEEK), polyethylene naphthalate , PEN), polyethylenimine (PEI) or a combination thereof. The material of the stretchable material layer 120 may be polyurethane (PU), polydimethylsiloxane (PDMS), acrylic, ether-containing polymer, polyolefin. ) or a combination thereof.

In this embodiment, the electronic component 130 may include a wire, an electrode, a resistor, an inductor, a capacitor, a transistor, a diode, a switching element, an amplifier, a processor, a controller, a thin film transistor, a touch element, and a pressure sensing. The components, microelectromechanical components, feedback components, optical components, displays or other suitable electronic components are not limited in this regard.

In the present embodiment, at least a portion of the distribution regions 112 are a plurality of island-like structures separated from each other. Taking FIG. 1 as an example, the distribution regions 112 are respectively a plurality of island structures separated from each other, and the stretchable material layer 120 connects the island structures.

In the flexible electronic module 100 of the present embodiment, since the flexible material layer 120 is connected to the distribution regions 112, the flexible electronic module 100 can have the effect of expanding and contracting according to the use requirement, thereby increasing the flexible electronic device. The applicability of the module 100. For example, by the stretching effect of the portion of the stretchable material layer 120 between the adjacent two distribution regions 112, the spacing between the adjacent two distribution regions 112 can be changed, thereby increasing the applicability of the flexible electronic module 100.

2A to 2I are schematic cross-sectional views showing nine modified embodiments of the flexible electronic module of FIG. 1. These nine variations are similar to the flexible electronic module of Figure 1, with the main differences being as follows. Referring to FIG. 2A, in the flexible electronic module 100a of the embodiment, at least a part of the distribution area 112a is a plurality of protruding structures. For example, in FIG. 2A, the distributed regions 112a of the patterned flexible substrate 110a are respectively a plurality of protruding structures. The patterned flexible substrate 110a has a recess 113 between adjacent two protruding structures (i.e., the distributed region 112a), and the adjacent two protruding structures are connected by the bottom portion 114 of the recess 113.

In the flexible electronic module 100a of the present embodiment, since the adjacent two distribution regions 112a are connected by the bottom portion 114 of the recess 113, the flexural electronic module 100a has a strong tensile strength, but can still be Stretched to a certain extent and direction.

Referring to FIG. 2B , the flexible electronic module 100b of the present embodiment further includes a release layer 140 disposed on the patterned flexible substrate 110 . In the present embodiment, the release layer 140 is disposed on the stretchable material layer 120. In addition, in the present embodiment, the adhesion of the stretchable material layer 120 to the patterned flexible substrate 110 is greater than the adhesion of the patterned flexible substrate 110 to the release layer 140. The material of the release layer 140 is, for example, a crystalline silicate, an aromatic polyamine (formed by copolymerization of a diamine and a dianhydride), and a diamine 4,4'-diaminodiphenyl ether. , 3,4'-diaminodiphenyl ether, p-phenylenediamine, 2,2'-bis(trifluoromethyl)diaminobiphenyl or a combination thereof, and the dianhydride is pyromellitic dianhydride And biphenyltetracarboxylic dianhydride, 4,4'-(hexafluoroisopropene) diacetic anhydride or a combination thereof.

Further, in the present embodiment, the electronic component 130 is disposed on the stretchable material layer 120. In addition, in the embodiment, the distribution area 112b of the patterned flexible substrate 110 may also have a small width.

Referring to FIG. 2C , in the flexible electronic module 100 c of the embodiment, in an embodiment, the electronic component 130 c can be an electronic component capable of sensing the degree of stretching, and is disposed on the layer 1 of the stretchable material. And located on a portion of the layer of expandable material 120 between the adjacent two distribution regions 112. In this way, the electronic component 130c can sense the degree of expansion and contraction of the stretchable material layer 120.

Referring to FIG. 2D, in the flexible electronic module 100d of the present embodiment, the surface of the stretchable material layer 120 may have a pattern, for example, having a recess 122. In addition, part of the electronic component 130 is disposed on the stretchable material layer 120, and another portion of the electronic component 130 is disposed on the patterned flexible substrate 110. Further, in the present embodiment, the partial distribution regions 112e and 112c are separated from each other into a plurality of island-like structures, and the partial distribution regions 112c and 112d form a convex structure connected by the bottom portion 114 of the recess 113.

Referring to FIG. 2E, in the flexible electronic module 100e of the embodiment, the thickness of the partial distribution area 112f may be thinner than the distribution area 112e of the other part. In an embodiment, the distribution area 112f may be a portion remaining in the process.

Referring to FIG. 2F, in the flexible electronic module 100f of the embodiment, the stretchable material layer 120 can be filled in the recess 113 between the adjacent two distribution regions 112 of the patterned flexible substrate 110a without covering the distribution area. 112.

Referring to FIG. 2G, in the flexible electronic module 100g of the present embodiment, the electronic component 130 is disposed on the disposition surface 111 of the patterned flexible substrate 110a, and the opening of the recess 113 between the adjacent two distribution regions 112 is oriented. Keep away from the direction of the configuration surface 111.

Referring to FIG. 2H, in the flexible electronic module 100h of the present embodiment, the release layer 140 is disposed on the lower surface of the patterned flexible substrate 110a and disposed at the bottom of the recess 113 between the adjacent two distribution regions 112. On the lower surface of 114.

The flexible electronic module 100i of the present embodiment further includes a cover layer 150, wherein the patterned flexible substrate 110 is disposed between the stretchable material layer 120 and the cover layer 150, and the cover layer 150 is made of a material Retractable material. The cover layer 150 and the stretchable material layer 120 may be the same stretchable material or different stretchable materials.

3A-3E are top views of a patterned flexible substrate and a layer of a stretchable material of a flexible electronic module according to another embodiment of the present invention. The flexible electronic module of FIG. 3A to FIG. 3E is similar to the flexible electronic module of FIGS. 1 and 2A to 2I, and the cross-sectional view thereof can be similar to that of FIG. 2A to FIG. 2I, and the patterned flexible substrate 110 and The top view of the layer of expandable material 120 can then be depicted in Figures 3A-3E.

Referring to FIG. 3A to FIG. 3E , in the flexible electronic modules 100 j , 100 k , 100 l , 100 m , and 100 n , at least a part of the distribution area 112 has a mesh structure, and the retractable material layer 120 is filled in the mesh structure. In the gap. For example, in the flexible electronic modules 100j, 100k, and 1001, all of the distributed regions 112 have a mesh structure, and in the flexible electronic modules 100m and 100n, a portion of the distributed regions 112 have a mesh structure. And another part of the distribution area 112m has an island structure. Further, the distribution regions 112 in the form of a mesh structure may be connected into one mesh (as shown in FIGS. 3A and 3D) or divided into a plurality of segments (as shown in FIGS. 3B, 3C, and 3E).

4A-4D are schematic cross-sectional views of a flexible electronic module according to another embodiment of the present invention. The flexible electronic module of FIGS. 4A-4D is similar to the flexible electronic module of FIG. 1 and FIG. 2A to FIG. 2I, and the main differences are as follows. Referring to FIG. 4A and FIG. 4B, in the flexible electronic modules 100o and 100p, the distribution area 112 may have an island structure, and the retractable material layer 120 is filled in the gap between adjacent island structures, and is not covered. distribution area. Referring to FIG. 4C, in the flexible electronic module 100q, the stretchable material layer 120 is filled between the adjacent two thickly distributed regions 112e and does not cover the distributed region 112e. Further, the stretchable material 120 covers the thinned distribution area 112f.

Referring to FIG. 4D, the flexible electronic module 100r of the present embodiment is similar to the flexible electronic module 100o of FIG. 4A, and the difference between the two is that the flexible electronic module 100r further includes the release layer 140. On the patterned flexible substrate 110 and the stretchable material layer 120. The release layer 140 of FIG. 4D may also be disposed on the lower surface of the patterned flexible substrate 110 and the stretchable material layer 120 of FIGS. 4A-4C.

FIG. 5A is a top view of a flexible electronic module according to another embodiment of the present invention, and FIG. 5B is a cross-sectional view of the flexible electronic module of FIG. 5A along line I-I. Referring to FIG. 5A and FIG. 5B , the flexible electronic module 100 s of the present embodiment is similar to the flexible electronic module 100 of FIG. 1 , and the main differences between the two are as follows. In the flexible electronic module 100s of the present embodiment, the electronic components 130 include a plurality of touch sensing electrodes 130s disposed on the patterned flexible substrate 110. In this embodiment, the electronic component 130 further includes a plurality of wires 130r and a plurality of bonding pads 130q, wherein the wires 130r electrically connect the touch sensing electrodes 130s to the bonding pads 130q, and the bonding pads 130q Electrically connectable to an external flexible printed circuit board. In this way, the flexible electronic module 100s can be a stretchable touch film. In this embodiment, the material of the wire 130r and the bonding pad 130q may be metal, and the material of the touch sensing electrode 130s may be metal or a metal oxide having conductivity. In addition, the wire 130r, the bonding pad 130q and the touch sensing electrode 130s belong to the electronic component 130.

6 is a top plan view of a flexible electronic module according to still another embodiment of the present invention. Referring to FIG. 6, the flexible electronic module 100t of the present embodiment is similar to the flexible electronic module 100s of FIG. 5A, and the difference between the two is as follows. In the flexible electronic module 100t of the present embodiment, the electronic components 130 include a plurality of stretchable wires 130t, and the stretchable wires 130t extend in a zigzag shape. The stretchable wires 130t electrically connect the touch sensing electrodes 130s to the bonding pads 130q, respectively.

In addition, in the present embodiment, the touch sensing electrodes 130s are respectively disposed on the respective distribution regions 112t1, the bonding pads 130q are disposed on a distribution region 112t2, and the stretchable wires 130t are respectively disposed in the respective distribution regions 112t3. Upper, wherein the distribution area 112t3 connects the distribution area 112t1 and the distribution area 112t2, and the distribution area 112t3 extends with the extendable wire 130t.

In FIG. 5A, the stretching direction of the flexible electronic module 100s may be the lateral direction of the drawing. However, in FIG. 6, since the flexible electronic module 100t employs the stretchable wire 130t, the flexible electronic module 100t can be stretched both in the lateral direction and the longitudinal direction of the drawing.

7A to 7G are schematic cross-sectional views showing the flow of a method of manufacturing a flexible electronic module according to an embodiment of the present invention. Referring to FIG. 7A to FIG. 7G, the manufacturing method of the flexible electronic module of the present embodiment can be used to manufacture the flexible electronic modules 100 and 100a-100t of the above embodiments, and the following is to manufacture a flexible electronic module. Group 100 is described as an example. The manufacturing method of the flexible electronic module of this embodiment includes the following steps. First, referring to Fig. 7A, a flexible substrate 110' is formed. In the present embodiment, before forming the flexible substrate 110', the release layer 140 is formed on a hard carrier 50, wherein the step of forming the flexible substrate 110' includes forming a flexible substrate 110' on the release layer 140, and The adhesion of the patterned layer 140 to the flexible substrate 110' is greater than the adhesion of the release layer 140 to the rigid carrier 50. The material of the rigid carrier 50 is, for example, glass, ceramic, metal, tantalum or other suitable rigid material.

The flexible substrate 110' is then patterned to form at least one distribution region 112 (as shown in Figure 7E). In addition, a stretchable material layer 120 (shown in FIG. 7G) connecting the distribution regions 112 is formed, and at least one electronic component 130 is formed on at least one of the flexible substrate 110' and the stretchable material layer 120 ( As shown in Figure 7C). In the present embodiment, the ratio of the Young's modulus of the flexible substrate 110' to the Young's modulus of the stretchable material layer 120 is greater than or equal to 10. In one embodiment, the ratio of the Young's modulus of the flexible substrate 110' to the Young's modulus of the layer of expandable material 120 is greater than or equal to 50. Alternatively, in one embodiment, the ratio of the Young's modulus of the flexible substrate 110' to the Young's modulus of the layer of expandable material 120 is greater than or equal to 100.

Specifically, in the present embodiment, referring to Fig. 7B, a conductive layer 130' is first formed on the flexible substrate 110' before patterning. Then, referring to FIG. 7C, the conductive layer 130' is patterned to form at least one electronic component 130. For example, conductive layer 130' can be patterned by photolithography to form these electronic components 130.

Then, referring to FIG. 7D, a patterned mask layer 60 covering the electronic component 130 is formed on the flexible substrate 110'. Next, referring to FIG. 7E, the portion of the flexible substrate 110' exposed by the patterned mask layer 60 is etched, chipped, or stamped with the patterned mask layer 60 as a barrier layer to form the distribution region 112. When the portion of the flexible substrate 110' that is exposed by the patterned mask layer 60 is etched, the patterned mask layer 60 is an etch barrier that resists erosion by the etchant. Further, the above etching includes dry etching or wet etching.

Thereafter, as illustrated in FIG. 7F, the patterned mask layer 60 is removed, for example, by a dry etch or wet etch process to remove the patterned mask layer 60. In this embodiment, the material of the patterned mask layer is, for example, a metal. However, in other embodiments, the patterned mask layer 60 may not be removed, but the next step may be performed directly. Next, as shown in FIG. 7G, a stretchable material layer 120 is formed on the flexible substrate 110', and the stretchable material layer 120 is filled in the gap 115 of the distribution region 112, and the expandable material layer 120 is coated with the electronic component. 130. In the present embodiment, when the flexible substrate 110' is formed on the release layer 140 (Fig. 7A), the flexible substrate 110' covers the edge 142 of the release layer 140. In the step of FIG. 7G, the portion of the flexible substrate 110' that covers the edge 142 of the release layer 140 is removed (eg, cut along the position of the broken line L of FIG. 7F), and the hard carrier 50 is separated from the release layer 140. . In the present embodiment, since the adhesion of the release layer 140 to the flexible substrate 110' is greater than the adhesion of the release layer 140 to the rigid carrier 50, when the flexible substrate 110' is removed, the edge 142 of the release layer 140 is covered. In some cases, the rigid carrier 50 can be easily peeled off from the release layer 140. After the rigid carrier 50 is peeled off, the remaining portion can be a flexible electronic module. Alternatively, since the adhesion of the stretchable material layer 120 to the flexible substrate 110' is greater than the adhesion of the flexible substrate 110' to the release layer 140, the release layer 140 can be further peeled off from the flexible substrate 110', and the remaining portion That is, the flexible electronic module 100 of FIG. 1 is obtained. In this way, the flexible electronic module 100 capable of stretching and contracting can be formed.

8A and 8B illustrate two steps in a method of fabricating a flexible electronic module according to another embodiment of the present invention. Referring to FIG. 8A and FIG. 8B , the manufacturing method of the flexible electronic module of the present embodiment is similar to the manufacturing method of the flexible electronic module of FIGS. 7A to 7G , and the differences between the two are as follows. In the manufacturing method of the flexible electronic module of the embodiment, as shown in FIG. 8A, a modification layer 70 is formed on the release layer 140, wherein the flexible substrate 110' is formed on the modification layer 70, and is modified. The layer 70 is disposed between the flexible substrate 110' and the release layer 140 to enhance the adhesion between the release layer 140 and the flexible substrate 110'. In the present embodiment, the finishing layer 70 can coat the edge 142 of the release layer 140. In the present embodiment, the material of the modification layer 70 is, for example, tantalum nitride or hafnium oxide.

Then, the manufacturing method of the flexible electronic module of the present embodiment performs steps similar to those of FIG. 7B to FIG. 7F, and will not be repeated herein. Then, as shown in FIG. 8B, after the portion of the edge 142 of the decorative layer 70 covering the release layer 140 is cut off, the rigid carrier 50 can be peeled off, and the remaining structure forms a flexible electronic module. In addition, the release layer 140 can be peeled off from the modification layer 70, and the remaining structure is also a flexible electronic module.

9A and 9B illustrate two steps of a method of manufacturing a flexible electronic module according to still another embodiment of the present invention. Referring to FIG. 9A and FIG. 9B , the manufacturing method of the flexible electronic module of the present embodiment is similar to the manufacturing method of the flexible electronic module of FIGS. 7A to 7G , and the difference between the two is as follows. In the present embodiment, a sacrificial layer 80 is formed on the hard carrier before forming the flexible substrate 110', wherein forming the flexible substrate 110' includes forming the flexible substrate 110' on the sacrificial layer 80. In other words, this embodiment replaces the release layer 140 of FIG. 7A with a sacrificial layer 80.

Next, the steps of FIGS. 7B to 7F are performed. Then, as shown in FIG. 9B, after the flexible substrate 110' is patterned, the stretchable material 120 is formed, and the electronic component 130 is formed, the sacrificial layer 80 is irradiated with a laser, for example, the laser is irradiated to the sacrificial layer via the hard carrier 50. 80, in order to separate the flexible substrate 110' from the rigid carrier 50. In other words, the material used for the sacrificial layer 80 can be separated from the hard carrier 50 when the sacrificial layer 80 is irradiated with laser light. In this way, after the rigid carrier 50 is peeled off by the laser lift-off method, the remaining structure can form a flexible electronic module that can be stretched. In this embodiment, the material of the sacrificial layer 80 is, for example, polystyrene sulfonate (PSS), polyethylenimine (PEI), polyacrylic acid (PAA (PAA (poly(styrene sulfonate))). Poly(allyl amine)), poly(diallyldimethylammonium chloride), poly(N-isopropylacrylamide) (PNIPAM(poly(N-isopropyl acrylamide)) )), chitosan (CS (Chitosan)), poly(methacrylic acid) (PMA), poly(vinyl sulfonic acid), polyacrylic acid (PAA) Poly(amic acid))) or polyhydroxyl fatty acid (PAH (poly(allylamine))), which is ionized in an aqueous solution and applied with a positive charge, or the material of the sacrificial layer 80 may include sodium polystyrene sulfonate (NaPSS ( Sodium poly (styrene sulfonate)) and polyvinyl sulfonic acid (PVS), or a combination of at least two of them.

10A to 10E are cross-sectional views showing the flow of a method of manufacturing a flexible electronic module according to still another embodiment of the present invention. Referring to FIG. 10A and FIG. 10E , the manufacturing method of the flexible electronic module of the present embodiment is similar to the manufacturing method of the flexible electronic module of FIGS. 7A to 7G , and the difference between the two is as follows. In this embodiment, as shown in FIG. 10A, after the release layer 140 is formed on the rigid substrate 50, the flexible substrate 110' is formed on the release layer 140 and patterned, wherein the patterning manner may be Etching, chipping or embossing as described above. Then, the stretchable material layer 120 is formed on the flexible substrate 110', and the stretchable material layer 120 is filled in the gap between the adjacent distributed regions 112. Then, a conductive layer 130' is formed on the stretchable material layer 120. Next, as shown in FIG. 10B, the conductive layer 130' is patterned to form at least one electronic component 130. Thereafter, as shown in FIG. 10C, the stretchable material layer 120 is embossed with a bump film 90 to pattern the stretchable material layer 120. The embossed layer of expandable material 120 is depicted in Figure 10D.

Then, as shown in FIG. 10E, the cladding of the flexible substrate 110' is cut off. The portion of the edge 142 of the layer 140 is such that the rigid carrier 50 is peeled from the release layer 140, and the remaining structure becomes a flexible electronic module that can be stretched.

Referring to FIG. 7G and FIG. 2I, in an embodiment, after the release layer 140 as shown in FIG. 7G is stripped, the patterned flexible substrate (ie, the patterned flexible substrate 110) may be as shown in FIG. A cover layer 150 is formed, wherein the patterned flexible substrate 110 is disposed between the stretchable material layer 120 and the cover layer 150, and the cover layer 150 is made of a stretchable material. The cover layer 150 can reduce the phenomenon that the patterned flexible substrate 110 may be peeled off from the stretchable material layer 120.

FIG. 11 is a cross-sectional view of a flexible electronic module according to another embodiment of the present invention. Referring to FIG. 11, the flexible electronic module 100u of the present embodiment is similar to the flexible electronic module 100o of FIG. 4A, and the difference between the two is as follows. In the flexible electronic module 100u of the embodiment, the electronic component 130 includes a plurality of first electrodes 130u, and the stretchable material layer 120 is distributed between the first electrodes 130u, and the flexible substrate 110 and the stretchable material are patterned. The layer 120 and the electronic component 130 form a flexible printed circuit (FPC).

In this embodiment, the flexible electronic module 100u further includes a flexible electronic device 200 including a plurality of second electrodes 230, and the second electrodes 230 are respectively transmitted through an anisotropic conductive film 300. The first electrode 130u is electrically connected.

In this way, when the flexible electronic device 200 is subjected to the pressure P or the tension T to cause the second electrode 230 to be displaced, since the stretchable material layer 120 is distributed between the first electrodes 130u, the first electrodes 130u can be There is a corresponding displacement. In this way, it is ensured between the first electrode 130u and the second electrode 230. Electrical connection status.

FIG. 12 is a cross-sectional view of a flexible electronic module according to still another embodiment of the present invention. Referring to FIG. 12, the flexible electronic module 100v of the present embodiment is similar to the flexible electronic module 100u of FIG. 11, and the differences between the two are as follows. In the flexible electronic module 100v of the present embodiment, the second electrodes 230 are respectively electrically connected to the first electrodes 130u through the plurality of anisotropic conductive films 300v, and the anisotropic conductive films 300v may be A plurality of separate anisotropic conductive films 300v. The flexible electronic module 100v can achieve the above-mentioned effects similar to the flexible electronic module 100u, and will not be repeated here.

FIG. 13 is a cross-sectional view of a flexible electronic module according to still another embodiment of the present invention. Referring to FIG. 13, the flexible electronic module 100w of the present embodiment is similar to the flexible electronic module 100u of FIG. 11, and the difference between the two is as follows. In the flexible electronic module 100w of the present embodiment, the flexible electronic device 200w includes another patterned flexible substrate 210 and another stretchable material layer 220. The embodiment of the patterned flexible substrate 210 and the stretchable material layer 220 may be an embodiment of the patterned flexible substrate 110 and the stretchable material layer 120 in the various embodiments described above. Specifically, the patterned flexible substrate 210 includes at least one distribution region 212 (exemplified by a plurality of distribution regions 212 in FIG. 13 ), wherein the second electrodes 230 are disposed on the distribution region 212 . The layer of expandable material 220 connects the distribution regions 212 and is disposed between the second electrodes 230.

The efficiencies of the flexible electronic module 100w of the present embodiment are similar to those of the flexible electronic module 100u, that is, when the flexible electronic device is installed. When the 200W is subjected to the pressure P or the tension T, the stretchable material layer 220 and the stretchable material layer 120 can make the displacement of the first electrode 130u and the second electrode 230 more elastic, thereby ensuring the displacement of the first electrode 130u and the second electrode. The displacement of 230 is uniform, and the electrical connection state between the first electrode 130u and the second electrode 230 is ensured.

FIG. 14 is a cross-sectional view of a flexible electronic module according to another embodiment of the present invention. Referring to FIG. 14, the flexible electronic module 100x of the present embodiment is similar to the flexible electronic module 100w of FIG. 13, and the difference between the two is as follows. In the flexible electronic module 100x of the present embodiment, the second electrodes 230 are respectively electrically connected to the first electrodes 130u through the plurality of anisotropic conductive films 300v, and the anisotropic conductive films 300v may be A plurality of separate anisotropic conductive films 300v.

In summary, in the flexible electronic module of the embodiment of the present invention, since the stretchable material layer is connected to the distribution area, the flexible electronic module can have the effect of expanding and contracting according to the use requirement, thereby increasing the flexibility. The application of electronic modules. In the method of manufacturing a flexible electronic module according to the embodiment of the present invention, since the stretchable material layer that connects the distribution regions is formed, a flexible electronic module capable of stretching and contracting can be manufactured.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

50‧‧‧hard carrier

60‧‧‧ patterned mask layer

70‧‧‧Retouching layer

80‧‧‧ sacrificial layer

90‧‧‧Bump film

100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100i, 100j, 100k, 100l, 100m, 100n, 100o, 100p, 100q, 100r, 100s, 100t, 100u, 100v, 100w, 100x‧ ‧‧Flexible electronic module

110, 110a‧‧‧ patterned flexible substrate

110'‧‧‧Soft substrate

111‧‧‧Configuration surface

112, 112a, 112b, 112c, 112d, 112e, 112f, 112t1, 112t2, 112t3‧‧‧ distribution area

113, 122‧‧‧ dent

114‧‧‧ bottom

115‧‧‧ gap

120‧‧‧Stretchable material layer

130, 130c‧‧‧ electronic components

130’‧‧‧ Conductive layer

130q‧‧‧ joint pad

130r‧‧‧Wire

130s‧‧‧Touch sensing electrode

130t‧‧‧stretchable wire

130u‧‧‧first electrode

140‧‧‧ release layer

142‧‧‧ edge

150‧‧‧ Coverage

200, 200w‧‧‧flexible electronic devices

210‧‧‧ patterned soft substrate

212‧‧‧Distributed area

220‧‧‧Stretchable material layer

230‧‧‧second electrode

300, 300v‧‧‧ anisotropic conductive film

L‧‧‧ dotted line

P‧‧‧ pressure

T‧‧‧ Tension

1 is a cross-sectional view of a flexible electronic module in accordance with an embodiment of the present invention. 2A to 2I are schematic cross-sectional views showing nine modified embodiments of the flexible electronic module of FIG. 1. 3A-3E are top views of a patterned flexible substrate and a layer of a stretchable material of a flexible electronic module according to another embodiment of the present invention. 4A-4D are schematic cross-sectional views of a flexible electronic module according to another embodiment of the present invention. FIG. 5A is a top view of a flexible electronic module according to another embodiment of the present invention. 5B is a cross-sectional view of the flexible electronic module of FIG. 5A taken along line I-I. 6 is a top plan view of a flexible electronic module according to still another embodiment of the present invention. 7A to 7G are schematic cross-sectional views showing the flow of a method of manufacturing a flexible electronic module according to an embodiment of the present invention. 8A and 8B illustrate two steps in a method of fabricating a flexible electronic module according to another embodiment of the present invention. 9A and 9B illustrate two steps of a method of manufacturing a flexible electronic module according to still another embodiment of the present invention. 10A to 10E are cross-sectional views showing the flow of a method of manufacturing a flexible electronic module according to still another embodiment of the present invention. FIG. 11 is a cross-sectional view of a flexible electronic module according to another embodiment of the present invention. FIG. 12 is a cross-sectional view of a flexible electronic module according to still another embodiment of the present invention. FIG. 13 is a cross-sectional view of a flexible electronic module according to still another embodiment of the present invention. FIG. 14 is a cross-sectional view of a flexible electronic module according to another embodiment of the present invention.

100: Flexible electronic module 110: patterned flexible substrate 112: distribution area 120: layer of expandable material 130: electronic component

Claims (24)

A flexible electronic module comprising: a patterned flexible substrate comprising at least one distribution area; a layer of a stretchable material connecting the distribution area; and at least one electronic component disposed on the patterned flexible substrate and the stretchable At least one of the layers of material, the at least one electronic component comprises a stretchable wire. The flexible electronic module of claim 1, wherein a ratio of a Young's modulus of the patterned flexible substrate to a Young's modulus of the stretchable material layer is greater than or equal to 10. The flexible electronic module of claim 1, wherein at least part of the at least one distribution area is a plurality of island structures separated from each other. The flexible electronic module of claim 1, wherein at least part of the at least one distribution area is a plurality of protruding structures, and the patterned flexible substrate has a recess between adjacent two of the protruding structures. And the adjacent two protruding structures are connected by the bottom of the recess. The flexible electronic module of claim 1, further comprising a cover layer, wherein the patterned flexible substrate is disposed between the layer of the stretchable material and the cover layer, and the cover layer is made of Retractable material. The flexible electronic module of claim 1, further comprising a release layer disposed on the patterned flexible substrate. The flexible electronic module of claim 6, wherein the release layer is disposed on the layer of the stretchable material. The flexible electronic module of claim 6, wherein the adhesion of the stretchable material layer to the patterned flexible substrate is greater than the adhesion of the patterned flexible substrate to the release layer. The flexible electronic module of claim 1, wherein the at least one electronic component comprises a plurality of first electrodes, the layer of the stretchable material is distributed between the first electrodes, and the patterned softness The substrate, the layer of stretchable material and the at least one electronic component form a flexible circuit board. The flexible electronic module of claim 9, further comprising a flexible electronic device, comprising: a plurality of second electrodes, wherein the second electrodes are respectively transmitted through an anisotropic conductive film The first electrodes are electrically connected to each other or electrically connected to the first electrodes through a plurality of anisotropic conductive films. The flexible electronic device of claim 10, wherein the flexible electronic device comprises: another patterned flexible substrate, including at least another distribution area, wherein the second electrodes are disposed on the other And a layer of another stretchable material connecting the distribution regions and disposed between the second electrodes. A method of manufacturing a flexible electronic module, comprising: forming a flexible substrate; patterning the flexible substrate to form at least one distribution region; forming a layer of a stretchable material connecting the distribution region; and forming the flexible substrate with the flexible substrate At least one electronic component is formed on at least one of the layers of the stretchable material. The method of manufacturing a flexible electronic module according to claim 12, wherein the forming at least one electronic component on at least one of the flexible substrate and the layer of the stretchable material comprises: before the patterning Forming a conductive layer on the flexible substrate; and patterning the conductive layer to form the at least one electronic component. The method of manufacturing the flexible electronic module of claim 13, wherein the patterning the flexible substrate comprises: forming a patterned mask layer covering the electronic component on the flexible substrate; The patterned mask layer acts as a barrier layer to etch, chip or emboss the portion of the flexible substrate that is exposed by the patterned mask layer to form the distribution region. The method of manufacturing the flexible electronic module of claim 14, wherein forming the layer of the stretchable material connecting the distribution region comprises: forming the layer of the stretchable material on the flexible substrate, and A layer of stretchable material is filled in the gap of the distribution region, and the layer of stretchable material coats the electronic component. The method of manufacturing a flexible electronic module according to claim 12, wherein the forming at least one electronic component on at least one of the flexible substrate and the layer of the stretchable material comprises: at the layer of the stretchable material Forming a conductive layer thereon; and patterning the conductive layer to form the at least one electronic component. The method for manufacturing a flexible electronic module according to claim 16, further comprising: stamping the layer of the stretchable material with a bump film to form the layer of the stretchable material. The method for manufacturing a flexible electronic module according to claim 12, further comprising: forming a release layer on a rigid carrier before forming the flexible substrate, wherein forming the flexible substrate is included in the method The flexible substrate is formed on the release layer, and the adhesion of the release layer to the flexible substrate is greater than the adhesion of the release layer to the rigid carrier. The method for manufacturing a flexible electronic module according to claim 18, wherein the flexible substrate covers an edge of the release layer, and the manufacturing method of the flexible electronic module further comprises: cutting the softness A substrate covers a portion of the edge of the release layer and separates the rigid carrier from the release layer. The method for manufacturing a flexible electronic module according to claim 18, wherein the adhesion of the stretchable material layer to the flexible substrate is greater than the adhesion of the flexible substrate to the release layer. The method for manufacturing a flexible electronic module according to claim 18, further comprising: forming a modified layer on the release layer, wherein the flexible substrate is formed on the modified layer, and the modified layer And disposed between the flexible substrate and the release layer to enhance adhesion between the release layer and the flexible substrate. The method for manufacturing a flexible electronic module according to claim 12, further comprising: forming a sacrificial layer on a hard carrier before forming the flexible substrate, wherein forming the flexible substrate is included in the sacrifice The flexible substrate is formed on the layer; and after the flexible substrate is patterned, the stretchable material is formed, and the electronic component is formed, the sacrificial layer is irradiated with a laser to separate the flexible substrate from the hard carrier. The method of manufacturing a flexible electronic module according to claim 12, wherein a ratio of a Young's modulus of the flexible substrate to a Young's modulus of the stretchable material layer is greater than or equal to 10. The method for manufacturing a flexible electronic module according to claim 12, further comprising: forming a cover layer on the patterned flexible substrate, wherein the flexible substrate is disposed on the layer of the stretchable material and Between the cover layers, and the material of the cover layer is a stretchable material.