TWI557261B - Precursor delivery system - Google Patents

Description

Precursor delivery system [Related application cross-reference]

The present invention claims the priority of U.S. Provisional Patent Application Serial No. 60/850,886, filed on October 10, 2006, and the priority of the application Serial No. 11/870,374, filed on October 10, 2000, And this case is part of the continuous application of 11/870,374.

The present invention relates generally to semiconductor processing equipment, and more particularly to apparatus for transporting reactive gases to a processing chamber.

Chemical vapor deposition (CVD) is a well-known process in the semiconductor industry for forming thin films of materials such as tantalum wafers. In chemical vapor deposition, reactive gases having different reactants (also referred to herein as "precursor gases") are delivered to one or more substrates in the reaction chamber. In many cases, the reaction chamber contains only a single substrate that is supported on a substrate holder (e.g., a susceptor) wherein the substrate and substrate holder are maintained at a desired processing temperature. The reaction gases react with each other to form a film on the substrate, and the growth rate is controlled by temperature or a reaction gas.

In some applications, the reaction gas system is stored as a gas in a reaction source vessel. In such applications, the reaction vapor is typically a gas at ambient (i.e., normal) pressure and temperature. Examples of such gases include nitrogen, Oxygen, hydrogen and ammonia. However, in some instances, a source chemical (precursor) is used which is a liquid or solid (eg, barium chloride) at ambient pressure and temperature. These source chemicals may need to be heated to produce a sufficient amount of vapor for the reaction procedure. For certain solid materials (referred to herein as ruthenium solid source precursors), the vapor pressure at room temperature is very low, so they must be heated to produce a sufficient amount of reactant vapor and/or remain relatively low. pressure. Once vaporized, it is important that the vapor phase reactants remain at or above the evaporation temperature via the processing system in order to prevent valves, filters, conduits, and other components associated with transporting the vapor phase reactants to the reaction chamber. Condensation required. Vapor phase reactants from such natural solid or liquid materials are beneficial for use in chemical reactions in a variety of other industries.

Atomic Layer Deposition (ALD) is another conventional procedure for forming thin films on substrates. In various applications, atomic layer deposition uses solid or liquid source chemicals as described above. Atomic layer deposition is a form of vapor deposition in which a thin film is established via a self-saturation reaction performed cyclically. The thickness of the film is determined by the number of cycles performed. In an atomic layer deposition process, gas precursors are alternately and repeatedly provided to a substrate or wafer to form a thin film of material on the wafer. In a self-limiting procedure, a reactant is absorbed on the wafer. A different, subsequently pulsed, reactant reacts with the absorbed material to form a monolayer of the desired material. With appropriately selected reagents, decomposition may occur via a reaction, such as in a ligand exchange or a gettering reaction. In a typical atomic layer deposition reaction, each cycle does not form more than one single Molecular layer. Thicker films are produced through repeated cycles of growth until the target thickness is reached.

A typical solid or liquid source precursor delivery system comprises a solid or liquid source precursor container and a heating mechanism (e.g., a radiant heat lamp, a resistive heater, etc.). The container contains a solid (for example in powder form) or a liquid source precursor. The heating mechanism heats the vessel to increase the vapor pressure of the precursor gas in the vessel. A container having an inlet and an outlet, for letting an inert carrier gas (e.g. N ₂₎ flow through the vessel. The carrier gas sweeps the precursor vapor together, exits the vessel and eventually reaches a substrate reaction chamber. The container typically includes an isolation valve for fluidly isolating the contents of the container from the exterior of the container. Typically, one isolation valve is located upstream of the vessel inlet and another isolation valve is located downstream of the vessel outlet. The precursor source vessel is typically provided with a conduit extending from the inlet and outlet, an isolation valve located on the conduit, and an accessory located on the valve that is constructed to connect to the gas flow line of the remaining substrate processing equipment. It is often necessary to provide several additional heaters for heating various valve and gas flow lines between the precursor source vessel and the reaction chamber to prevent condensation and deposition of precursor gases on these components. Thus, the gas delivery member between the source vessel and the reaction chamber is sometimes referred to as a hot zone, wherein the temperature remains above the evaporation/condensation temperature of the precursor.

It is known to provide a curved or meandering flow path for the flow of carrier gas while it is exposed to a solid or liquid precursor source. For example, U.S. Patent Nos. 4,883,362, 7,122,085, and 7,156,380 each disclose such a meandering path.

In one aspect of the invention, a precursor source container is provided. The precursor source container includes a lid having an inlet opening, an outlet opening, and a smashing opening. The precursor source container further includes a base that is removably attached to the lid. The base includes a recessed region formed therein.

In another aspect of the invention, a precursor source container is provided. The precursor source container includes a base having a recessed region formed therein. The recessed area is constructed to receive a precursor material. The precursor source container also includes a lid that is removably attached to the base. The lid has an inlet opening, an outlet opening, and a smashing opening. A snoring valve is operatively attached to the lid. The snoring valve is operatively coupled to the snoring port.

In another embodiment of the invention, a precursor source container is provided. The precursor source container includes a base having a bottom surface, a contact surface, a side surface extending between the contact surface and the bottom surface, and an inner surface extending from the contact surface to define the base A recessed area in the middle. The precursor source container also includes a lid that is removably attached to the base. The lid includes an inlet opening, an outlet opening, and a smashing opening.

In another aspect of the invention, a precursor source container is provided. The precursor source container includes a lid having a first cornice, a second cornice, and a third cornice. The precursor source container also includes a bottom a seat that is removably attached to the cover. The base includes a recessed region formed therein.

In another aspect, an apparatus for connecting a chemical reactant source vessel to a gas interface assembly of a vapor phase reactor for vapor processing of a substrate is provided. The apparatus includes a vessel, a gas interface assembly of the vapor phase reactor, and a connection assembly for connecting the vessel to the gas interface assembly. The container has a chamber for holding solid or liquid chemical reactants. The container includes an inlet and an outlet in fluid communication with the chamber. The gas interface assembly has a gas inlet for connection to an outlet of the container chamber. The connection assembly includes a track member and a lift assembly. The track member includes one or more elongate tracks for movably coupling one or more track coupling elements of the container. The lifting assembly is configured to vertically move the track member between a lower position and a raised position. When the one or more rail coupling elements of the container are coupled to one or more tracks of the track member, and when the lifting assembly moves the track member to its raised position, the outlet of the container becomes positioned substantially Directly in fluid communication with the gas inlet of the gas interface assembly.

Some objects and advantages of the present invention have been set forth above for the purpose of summarizing the advantages of the present invention. Of course, it will be appreciated that not all of the objects and advantages need to be achieved in accordance with any particular embodiment of the invention. Thus, for example, it will be understood by those of ordinary skill in the art that the present invention may be used to achieve or optimize one of the advantages or a set of advantages disclosed herein without departing from the teachings herein. Or other ways of suggesting goals or advantages are implemented Or achieve.

All of these embodiments are intended to be included within the scope of the invention disclosed herein. These and other embodiments of the present invention will become more apparent to those of ordinary skill in the art in the <RTIgt; Example.

The present application for patent application discloses an improved precursor source container, apparatus and method for loading and connecting the container to a reactor and interfering with the use of the container with a vapor processing reactor. The disclosed embodiments provide excellent access to the reaction vapor, reduced gas delivery of the reactor gas delivery system, and improved maintainability (e.g., replacement or refilling) of the precursor source container.

The detailed description of the preferred embodiments and methods below are set forth in detail in the description of the specific embodiments. However, those skilled in the art can implement the invention in a variety of different embodiments and methods, as defined and covered by the scope of the claims.

Gas delivery system overview

1 schematically illustrates a conventional precursor transport system 6 for feeding a gas phase reactant from a solid or liquid precursor source vessel 10 into a gas phase reaction chamber 12. Those of ordinary skill in the art will appreciate that the precursor delivery system of the present invention can incorporate the gas delivery system 6 of FIG. Many aspects of it. Therefore, the conventional delivery system 6 will now be described in order to be able to better understand the present invention.

Referring to Figure 1, the solid or liquid source container 10 contains a solid or gas source precursor (not shown). A solid source precursor is a source chemical that is solid under standard conditions (ie, room temperature and atmospheric pressure). Similarly, a liquid source precursor is a source chemical that is liquid under standard conditions. The precursor is vaporized in the source vessel 10, which can be maintained at or above the vapor temperature. The evaporated reactant is then fed to the reaction chamber 12. The reactant source vessel 10 and reaction chamber 12 can be positioned separately in a reactant source cabinet 16 and a reaction chamber vessel 18, which are preferably individually vented and/or thermally controlled. This can be achieved by providing these components with separate cooling and heating means, thermal insulation, isolation valves and/or associated piping, as is known in the art.

The illustrated gas delivery system 6 is particularly suitable for conveying vapor phase reactants to be used in a vapor phase reaction chamber. The vapor phase reactant can be used for deposition (eg, chemical vapor deposition) or atomic layer deposition (ALD).

As shown in FIG. 1, the reactant source vessel 10 and the reaction chamber 12 are adapted to be in selective fluid communication with each other via a first conduit 20 to feed the gas phase reactant from the reactant source vessel 10 to the reaction chamber. 12 (for example, an ALD reaction chamber). The first conduit 20 includes one or more isolation valves 22a, 22b that can be used to separate the gas space of the reactant source vessel 10 and the reaction chamber 12 during evacuation and/or during maintenance of the reactant source vessel 10 and the reaction chamber vessel 18. .

Inactive or inert gas is preferably used as a carrier gas, The precursor to evaporation. The inert gas (e.g., nitrogen or argon) can be fed to the precursor source vessel 10 via a second conduit 24. The reactant source container 10 includes at least one inlet for connection to the second conduit 24 and at least one outlet for withdrawing gas from the vessel 10. The outlet of the container 10 is connected to the first conduit 20. The container 10 can operate at a pressure that exceeds the pressure of the reaction chamber 12. Accordingly, the second conduit 24 includes at least one isolation valve 26 that can be used to fluidly isolate the interior of the container 10 during maintenance or replacement of the container 10. A control valve 27 is preferably positioned in the second conduit 24 outside of the reactant source cabinet 16.

In another variation, which can be used in embodiments of the present invention, the precursor vapor can be withdrawn to the reaction chamber 12 by applying a vacuum to the reactant source vessel 10 without the use of a carrier gas. This technique is sometimes referred to as "vapor draw."

In another variation (which may also be used in embodiments of the invention), the precursor vapor may be withdrawn from the vessel 10 by an external gas stream that produces a lower pressure on the exterior of the gas, such as It is in the Venturi effect. For example, the precursor vapor can be withdrawn by flowing a carrier gas along the path downstream of the vessel 10 toward the reaction chamber 12. In some cases, this can create a pressure differential between the vessel 10 and the carrier gas flow path. This pressure differential causes the precursor vapor to flow toward the reaction chamber 12.

When a solid source precursor is used, in order to remove the dispersed solid particles, the gas delivery system 6 includes a purifier 28 that is directed via a purifier. The purifier 28 can comprise one or more of a wide variety of Purification devices, such as mechanical filters, ceramic molecular sieves, and electrostatic filters, are capable of separating dispersed solids or particles or molecules of the smallest molecular size from the reactant gas stream. It is also well known that an additional purifier can be provided in the container 10. In particular, U.S. Patent Application Publication No. 2005/0000428 A1 discloses a container comprising a glass crucible enclosed in a steel container containing a source of reactants and having a lid with a filter attached thereto. The lid is separated from a container lid that is attached to the steel container.

With continued reference to FIG. 1, the reactant source container 10 is positioned within the reactant source cabinet 16. The interior space 30 of the cabinet 16 can be maintained under reduced pressure (e.g., 1 mTorr to 10 Torr, and typically about 500 mTorr) to facilitate radiant heating of the components within the cabinet 16 and to thermally isolate these components from each other to help even temperature. field. In other variations, the cabinet is not emptied and contains convection boosting devices (eg, fans, crossflows, etc.). The illustrated cabinet 16 includes one or more heating devices 32, such as radiant heaters. Also, a reflector sheet 34 can be provided that can be constructed to surround the components in the cabinet 16 to reflect the radiant heat generated by the heating device 32. The inner wall 40 of the reflector sheet 34 cabinet 16 is on the top plate 7 and the bottom plate 9 of the cabinet. In the illustrated apparatus, the substantial length of the first conduit 20 is controlled within the reactant source cabinet 16. Thus, the first conduit 20 will inherently receive some heat to prevent condensation of reactant vapors.

The reactant source cabinet 16 can include a cooling jacket 36 formed between the outer wall 38 and the inner wall 40 of the cabinet. The cooling jacket 36 can contain water or other coolant. The cooling jacket 36 allows the outer surface 38 of the cabinet 16 to remain at ambient temperature Degree or near ambient temperature.

In order to prevent or reduce the flow of gas from the reactant source vessel 10 between alternating pulse waves of the atomic layer deposition process, it is possible to form an inert gas barrier in the first conduit 20. This is sometimes referred to as "inert gas valving" or "diffusion barrier" in which a portion of the first conduit 20 is formed by forming a gas barrier barrier. Gas flows in the opposite direction of the normal reactant stream in a conduit 20 to prevent reactant streams from the reactant source vessel 10 from flowing to the reaction chamber 12. The gas barrier may be formed by feeding an inert gas into the first conduit 20 via a third conduit 50, and the third conduit 50 is coupled to the first conduit 20 at a junction 52. The third conduit 50 can be coupled to an inert gas source 54 that is supplied to the second conduit 24. The inert gas is preferably fed into the first conduit 20 via the third conduit 50 during a time interval between the feed of the vapor phase pulse waves from the reactant source vessel 10. This gas can be withdrawn via a fourth conduit 58 that is connected to the first conduit 20 at a second connection point 60 that is located upstream of the first connection point 52 (ie, Closer to the reactant source container 10). In this manner, the inert gas flow in the opposite direction of the normal reactant gas stream is achieved (between reactant pulse waves) in the first conduit 20 between the first junction 52 and the second junction 60. The fourth conduit 58 can be in communication with an evacuation source 64 (e.g., a vacuum pump). A limiter 61 and valves 56, 63, 70 may also be provided. Further details of the gas delivery system 6 are illustrated and described in U.S. Patent Application Serial No. US 2005/0000428 A1.

Existing solid or liquid precursor source delivery systems, such as shown in Figure 1 System 6, has many shortcomings and limitations. One of the disadvantages is that it is sometimes necessary to provide a large number of additional heaters to heat the gas lines and valves between the precursor source vessel (such as vessel 10) and the reaction chamber (such as reaction chamber 12). In particular, it is generally necessary to maintain these intermediate gas delivery members (e.g., valves 22a, 22b, 70, purifier 28, conduit 20) at a temperature above the condensation temperature of the precursor to prevent precursor vapor deposition on these components. . Typically, these intermediate members are separately heated by line heaters, cartridge heaters, heat lamps or the like. Some systems (e.g., U.S. Patent Application Publication No. 2005/0000428 A1) utilize these additional heaters to force the temperature of the intermediate member to rise above the temperature of the source vessel. This temperature biasing helps prevent the precursor from condensing in the intermediate member during cooling. Because the source containers typically have a higher thermal mass than the intermediate gas delivery members, these members present a risk of cooling to the condensation temperature faster than the source container. This may result in an undesired condition in which the source container is still producing precursor vapors that may flow to the cooler intermediate member and deposit thereon. This temperature offset can overcome this problem. However, the need for additional heaters increases the overall size and operating cost of the device.

Furthermore, conventional solid source delivery systems typically utilize a filter (e.g., purifier 28 of Figure 1) interposed between the outlet of the source vessel and the substrate reaction chamber to prevent solid precursor particles (e.g., enthalpy in the carrier gas stream). The powder in the) enters the reaction chamber. Such filters also increase the overall size of the device and may require additional heaters to prevent condensation therein. Similarly, such filters are typically located downstream of the source container outlet, and their packages The risk is that the precursor particles may deposit in the gas transport member downstream of the vessel outlet, such as in the gas conduit or in the vessel outlet valve itself. These particles can damage components such as valves that can jeopardize their ability to completely seal.

Another disadvantage of conventional solid or liquid source delivery systems is that it is often difficult to refill or replace a precursor source container. 2 shows a typical precursor source container 31 comprising a container body 33 and a lid 35. The cover 35 includes inlet conduits 43a, 43b and outlet conduits 45a, 45b that extend upwardly from the cover. An isolation valve 37 is inserted between the inlet lines 43a, 43b, and an isolation valve 39 is inserted between the outlet lines 45a, 45b. Another isolation valve 41 is inserted between the gas lines connecting the lines 43a and 45a. The inlet lines 43a, 43b and the outlet lines 45a, 45b provide an inert carrier gas flow through the container body 33. The lines 43a, 45a typically include fittings 47 that are constructed to form other gas flow lines that are connected to the reactant gas delivery system. When the solid or liquid source is depleted and needs to be replaced, it is customary to replace the entire source container 31 with a new source container with a full source of chemicals. Replacing the source container 31 requires closing the isolation valves 37 and 39, separating the fitting 47 from the remaining substrate processing equipment, completely removing the container 31, placing the new container 31 in place, and placing the new container 31 The fitting 47 is attached to the remaining substrate processing equipment. Typically, this procedure also includes the removal of multiple thermocouples, line heaters, fixtures, and the like. These procedures are a little laborious.

Another disadvantage of conventional solid or liquid source delivery systems is that the gas delivery system may create stagnant flow zones (also known as dead water zones). The dead water zone is prone to occur when the gas flow path from the precursor source vessel is long and complex. Conventional inlet and outlet isolation valves for source vessels (as described above) may create dead water zones. In general, the dead water zone increases the risk of unwanted precursor deposits on the gas delivery components of the delivery system. Such unwanted precursor deposits may result from cold spots associated with the failure volume, where the precursor Solidification at temperatures below the sublimation/melting temperature. Such unwanted precursor deposition may also occur due to hot spots associated with the failure volume, where the precursor decomposes at elevated temperatures. For this reason, it is generally desirable to have the reactant gas stream The stagnation is reduced or minimized. It is also generally desirable to reduce the surface area to be temperature controlled in order to reduce the chance of creating hot spots or cold spots.

Another reason for minimizing the amount and volume of the dead water zone is to reduce the overall volume of the gas delivery system interposed between the precursor source vessel and the substrate reaction chamber. As the overall volume of the gas delivery system increases, the minimum pulse time is often doubled and the minimum cleaning time associated with ALD processing is also increased. The minimum pulse time is the pulse time required for the injected reactant to saturate the surface of the substrate being processed. This small cleaning time is the time required to purge excess reactants in the substrate reaction chamber and gas delivery system between reactant pulse waves. When the minimum pulse time and the minimum cleaning time are reduced, the substrate productivity (the rate at which the substrate can be processed) is increased. Thus, it is desirable to reduce the amount and volume of the dead water zone to increase productivity.

Another advantage of reducing the overall volume of the gas delivery system is to improve the "pulse shape" of the reactant gas pulse. Pulse shape refers to the reaction of reactants in a reactant/carrier mixture for a reactant gas pulse wave. Learn the shape of the curve of the concentration. Figure 3 shows an ideal reactant concentration curve 80, and a curve 82 that is less than the desired value. The two curves contain a reactant gas pulse wave 84 that is separated by a time period 86 of substantially zero reactant concentration. The ideal curve 80 is like a linear wave, such as a square wave. Substantially linear waves are preferred because the height of each reactant gas pulse requires the delivery of the reactant form to all available reaction sites on the substrate surface (saturation) in a minimum amount of time to Material productivity is optimized. The linear pulse shape, for example in curve 80, optimizes productivity because the duration of each pulse has a high concentration of reactants, thus subsequently reducing the need to deliver sufficient reactant form to the surface of the substrate. Wave duration. Similarly, the reduced dispersion of the pulse shape of the line reduces the amount of helium pulse overlap between successive pulse waves of different precursors, which reduces the likelihood of an undesirable chemical vapor deposition growth model. In contrast, the pulse concentration of each pulse 84 of the undesired curve 82 takes longer to reach its maximum level, which increases the duration of the pulse wave that needs to completely saturate the surface of the substrate. Therefore, the frequency of curve 80 is less than the frequency of curve 82. As the overall volume of the gas delivery system increases, the pulse shape deteriorates. Therefore, it is desirable to improve the shape of the pulse wave by minimizing the dead water zone (i.e., making it more like a square wave).

Another disadvantage of conventional solid source delivery systems is the risk of contamination of the precursor source vessel prior to processing. The precursor source vessel is typically supplied with the head pressure of the gas in the vessel. For example, a source container filled with a precursor powder is typically shipped with helium or other inert gas at a pressure slightly above ambient pressure (eg, 5 psi).氦 usually used to Use the helium leak detector to perform an out-bound leak test to ensure container integrity prior to shipment. Helium is usually retained or replaced with nitrogen or other inert gases, so if there is a small amount of leakage, the gas leaks out of the container, preventing atmospheric contamination of the precursors in the container. The head pressure of the inert gas is generally removed before the container is used for substrate processing. Typically, the internal gas of the vessel is discharged through the outlet isolation valve of the vessel, through the reactant gas delivery system, and ultimately through the exhaust/scrubber of the reactor. In some systems, the internal gas of the container is discharged through the substrate reaction chamber. Other systems utilize a gas line in parallel with the reaction chamber (i.e., from a point just upstream of the reaction chamber to a point just downstream of the reaction chamber) so that the internal gas of the vessel can be directed to the exhaust/ The scrubber does not flow through the reaction chamber. In either case, the existing container design involves the risk of particle generation when the container is relieved of head pressure. This can result in the precursor powder becoming entrained in the exhaust stream (ie, the discharge of pressurized gas inside the vessel), which can contaminate and potentially damage the downstream components of the gas delivery system, including the vessel outlet itself. Even during normal processing, precursor materials (e.g., powders) may be entrained in the carrier gas flowing through the precursor source vessel, which involves the risk of undesirable precursor deposition in the gas delivery system.

Embodiments of the foregoing precursor delivery system substantially overcome these problems by utilizing improved precursor source containers and apparatus for rapidly connecting and separating containers from the remainder of the delivery system.

Gas plate in close thermal contact with the source container

Figures 4 through 6 illustrate three different gas plate configurations. The gas plate typically contains one or more valves located downstream of the precursor source vessel and may also contain one or more valves upstream of the vessel. 4 illustrates a conventional configuration in which a source chemical system is contained within a source container 10. A gas plate 90 includes a plurality of valves operable to deliver carrier gas from a carrier gas source (not shown) through the vessel 10 and into a reaction chamber (not shown). An inlet valve 91 is connected to the vessel 10 by a line 93, and an outlet valve 92 is connected downstream of the vessel 10 by a line 94. In this conventional configuration, the inlet valve 91, the outlet valve 92, and the valves and tubing of the gas plate 90 are typically not in intimate thermal contact with the container 10.

Figure 5 illustrates a configuration that is slightly modified relative to the configuration of Figure 4. In the configuration of FIG. 5, a precursor source container 100 has a surface mounted inlet valve 108 and a surface mounted outlet valve 110. Valves 108 and 110 are separated from a conventional gas plate 90 by lines 95 and 96. In this configuration, valves 108 and 110 are in intimate thermal contact with vessel 100, but are not in intimate thermal contact with the valves and tubing of gas plate 90.

FIG. 6 illustrates a configuration that is slightly modified relative to the configuration of FIG. In the configuration of Figure 6, the source container 100 has a generally flat surface with a surface mounted inlet valve 108 and a surface mounted outlet valve 110. Additionally, a gas plate 97 is configured such that the valve and tubing of the gas plate are positioned along a plane that is generally parallel to the generally planar surface of the container 100. In order to increase the thermal contact between the vessel 100 and the gas plate valve and the conduit, the distance between the plane of the gas plate valve and the conduit and the substantially flat surface of the vessel 100 is preferably no greater than about 10.0 cm, more preferably Land not Greater than about 7.5 cm, and even more preferably no more than about 5.3 cm.

Source container with surface mounted valve and helium path

FIG. 7 shows an embodiment of an improved solid and liquid precursor source container 100 and a quick connect assembly 102. The source container 100 includes a container body 104 and a lid 106. Cover 106 includes surface mounted isolation valves 108 and 110, as will be explained in greater detail below.

Figures 8 through 10 show the source container 100 of Figure 7 in more detail. 8 is an exploded view of the source container 100, and FIGS. 9 and 10 are rear cross-sectional views of the source container 100. The illustrated container 100 includes a container body 104, a pair of 蜿蜒 path inserts 112 in the body 104, and a cover member 106. The illustrated components are fastened together by fastening elements 124, such as screws and are a combination of nuts and bolts. The fastening elements 124 are for extending into aligned holes in the flange 126 of the body 104. Those of ordinary skill in the art will appreciate that the assembly can be secured together by a variety of alternative methods.

The meandering path insert 112 preferably defines a meandering meandering or meandering path 111 through which the carrier gas must move as it flows through the container 100. The crucible path 112 preferably contains a precursor source, such as a powder or a liquid. The crucible path 111 is much longer than the carrier gas flow path in a conventional precursor source vessel. Valves 108 and 110 (described below) and valve 210 (described below with reference to Figures 26-28) are subjected to less harsh environments, thereby increasing their reliability.

A spring 114 is preferably provided to face the 蜿蜒 path insert 112 The lid 106 is pressed to prevent reactant gases from escaping from the interface between the insert 112 and the lid 106. In other words, the spring 114 tends to reduce the risk of gas bypassing some or all of the meandering path. A suitable spring 114 includes a flat wire compression spring, such as a Spirawave® wave spring sold by Smalley Steel Ring, Inc., Lake Zurich, Ill.

FIG. 11A shows another embodiment of a modified solid or liquid precursor source container 400 that includes a container base 402, a seal 404, and a cover 406. Cover 406 includes a plurality of integrated air valves, or surface mount valves, as described in more detail below. 11B-11C illustrate an exemplary embodiment of a cover 406. 11D-11G show an embodiment of a base 402 of the source container 400. 11H-11I show other embodiments of the base 402 of the source container 400.

As shown in FIG. 11A, the base 402 is formed from a solid element that includes a recessed region 408 that is directly machined into the solid base 402. When the cover 406 is removably attached to the base 402, a seal 404 is placed therebetween before the cover 406 is secured to the base 402 to ensure that the contents of the source container 400 are enclosed therein. In one embodiment, base 402 and cover 406 are formed from the same material such that the two elements have substantially the same thermal conductivity and the same coefficient of thermal expansion. In another embodiment, the base 402 is formed from a different material than the material used to form the cover 406. In an embodiment, the base 402 and the cover 406 are formed from stainless steel. In other embodiments, the base 402 and/or cover 406 may be formed from a high nickel alloy, aluminum, or titanium. It will be appreciated by those of ordinary skill in the art that base 402 and cover 406 can be any other The material is formed that is capable of permitting sufficient heat transfer to evaporate the precursors located in the source container 400 while being inert or not reacting with precursors or contents in the source container 400.

Seal 404 is disposed between base 402 of source container 400 and cover 406 as shown in Figure 11A. In one embodiment, the seal 404 is an O-ring disposed in a groove 410 formed in the base 402. In another embodiment, the seal 404 can be formed as a metal washer or a V-shaped seal that can be configured to be disposed between the base 402 and the cover 406. It will be appreciated by those of ordinary skill in the art that the seal 404 can be of any shape, size sufficient to provide a seal when the cover 406 is attached to the base 402 and to ensure that the contents of the source container 400 are enclosed therein. Or a structure. In an embodiment, the seal 404 is formed from an elastomer, but it will be appreciated by those of ordinary skill in the art that the seal 404 can be formed of any other material sufficient to provide a seal, such as, but not limited to, , polymer or metal.

As shown in Figures 11A-11C, an embodiment of a cover 406 of the source container 400 is shown. The cover 406 is formed as a single component having an upper surface 412, a lower surface 414, and a sliding surface 413 extending between the upper surface 412 and the lower surface 414. In an embodiment, upper surface 412 and lower surface 414 are substantially planar surfaces. It will be appreciated by those of ordinary skill in the art that the flat upper surface 412 and lower surface 414 can further include indentations, grooves, holes or inserts formed therein. In an embodiment, the upper surface 412 and the lower surface 414 are substantially parallel to one another, thereby providing the cover 406 with a uniform thickness T1 across the entire cover 406. Such as As shown in FIG. 11B, the upper surface 412 can include a high tolerance zone 416 that is machined to provide a substantially smooth surface relative to the remainder of the upper surface 412. These high tolerance zones 416 allow the valve assembly 418 to be mounted flush with the upper surface 412 of the cover 406 to ensure an equal degree of direct thermal contact between the valve assembly 418 and the cover 406. With a plurality of surface area contacts between the members, heat transfer between the members can be maximized, thereby reducing the separation of heaters or heating in which the precursors that provide heat to the valve assembly 418 to prevent evaporation are condensed therein. Set of needs.

As shown in FIG. 11B, the cover 406 includes an inlet port 420, an outlet port 422, and a burp port 424. The inlet port 420 is constructed to allow carrier gas or inert gas to be introduced into the source container 400 via the inlet port 420. The outlet port 422 is constructed to allow gas to exit the source container 400 through the outlet port 422. The snoring port 424 can include any mouthpiece, such as a conventional inlet/outlet port, which can be constructed to be released after the first filling or installation of the source container 400, or after refilling or installation after the source container 400. The head pressure in the container 400. The release by the head of the sipe 424 provides the vaporized precursor material to the reaction chamber 162 (Fig. 25) in the source vessel 400 for completion prior to processing of the semiconductor substrate. In an embodiment, an interface member 426 is operatively attached to the upper surface 412 of the cover 406 at each of the ports 420, 422, 424. Each interface member 426 is constructed to be coupled to a valve assembly 418. It will be appreciated by those of ordinary skill in the art that each valve assembly 418 and interface member 426 can be operatively coupled to the upper surface 412 of the cover 406 in any manner.

As shown in Figures 11A and 11C, one of the valve assemblies 418 includes an exhaust valve or a burping valve 428 that is operatively coupled to the upper surface 412 of the cover 406. The snoring valve 428 can be a pneumatic valve or any other valve that regulates the flow of gas into and out of the source vessel 400. In an embodiment, the snoring valve 428 remains closed except for the release of gas to release the head pressure in the source container 400 prior to use of the source container 400 in a semiconductor processing system. An inert gas system is introduced into the source container 400 during manufacture of the source container 400 and during the initial filling of the precursor, or after the source container 400 is refilled with the precursor, to produce a head pressure in the source container 400. . This head pressure is used to allow the leak test to be performed once the source container 400 is filled (or refilled), as explained above. When the source container 400 is installed, the gas that produces head pressure in the source container 400 needs to be removed and replaced with an inert carrier gas that will be used to carry the vaporized precursor during processing. Conventionally, it is known in the art that head pressure is released from a source container by expelling a gas that produces an initial head pressure through an outlet port that passes through the precursor material during processing of the substrate. The export pass is the same. However, the filter near the exit vent typically becomes clogged with precursor particles that are accompanied by gas during the initial snoring procedure or release. While some of the precursor particles are blocked by the outlet filter, some of the particles can bypass the filter, or the particles captured by the filter can then become movable and enter the conduit leading to the reaction chamber. These migrated precursor particles may cause uneven deposition in the reaction chamber or block the gas line between the source vessel and the reaction chamber. Swept particles may also cause particles to adhere to being added The semiconductor substrate, on the semiconductor substrate, thus results in a reduction in the number of devices, wafers or circuits that the substrate can produce. The snoring port 424 of the present invention and the corresponding snoring valve 428 permit release of the head pressure during the slamming barrier procedure, wherein the gas and particles exiting the snoring port 424 are first snored before being diverted through a snoring gas line 432. The filter 430 is filtered and the helium gas line 432 is directly connected to the exhaust line 466 (Fig. 25), thereby bypassing the reaction chamber 162 to prevent any unwanted particles from interfering with processing in the reaction chamber 162.

As shown in FIG. 11C, a filter device 434 is operatively coupled to the lower surface 414 of the cover 406. Filtration device 434, such as shown in more detail in Figure 18 and described below, is constructed to construct a carrier gas that is introduced into the source container 400 through the cover 406 and exits the source through the snoring port 424 and the outlet port 422. The gas of the container 400. In the illustrated embodiment, a filter device 434 is attached to the lower portion of the cover 406 adjacent the inlet port 420, the outlet port 422, and the snoring port 424. The filter device 434 is attached directly to the lid 406 to allow a sufficient amount of heat transfer from the lid 406 to prevent the precursor material from condensing within each of the filter devices 434. Each filter device 434 preferably has a low profile because the low profile filter device provides good thermal uniformity across the filter bag media (Fig. 17).

An embodiment of the base 402 is shown in Figures 11E-11G. The base 402 includes a body 436 and a flange 438 that is integrally connected to and extends from the body 436. In an embodiment, body 436 and flange 438 are formed from a single piece of material. As explained above, the trenches 410 are formed in the body 436, wherein the trenches 410 are constructed to form a receiving seal. 404. The flange 438 is configured to extend radially outward from the upper portion of the body 436. The base 402 is defined by an upper contact surface 440, a bottom surface 442, a side surface 444, and an inner surface 446 that defines and forms a recessed region 408. Contact surface 440 is substantially a flat surface that forms the entire upper surface of base 402. The contact surface 440 is constructed to directly contact the lower surface 414c of the cover 406.

In one embodiment, the base 402 is a solid material or metal and the recessed regions 408 are machined (or removed) into the base 402, as shown in Figures 11D-11G. In another embodiment, the base 402 is formed as an integral casting in which the recessed regions 408 are formed in the base 402 during casting or forging. The recessed region 408 is constructed to receive a solid or liquid precursor therein. In the embodiment shown in FIGS. 11D-11I, the recessed region 408 is formed as an elongate, meandering path that extends from the contact surface 440 of the base 402. Inner surface 446 extends from contact surface 440 into the thickness of body 436. The depth at which the recessed regions 408 are formed into the body 436 can vary. It will be appreciated by those of ordinary skill in the art that the shape, depth and width of the recessed regions 408 can be varied as long as the recessed regions 408 permit flow paths extending between the inlet and outlet ports 420, 422, The residence time of the gas with the precursor material disposed in the recessed region 408 is increased.

In one embodiment, as shown in FIGS. 11E-11G, the recessed region 408 includes an inlet recessed pad 448, an exit recessed pad 450, a snoring recessed pad 452, and a channel 454 that fluidly connects the recesses Pads 448, 450, 452. The recessed pads 448, 450, 452 are generally triangular A recessed region that extends downwardly from the contact surface 440 of the base 402. The shape of the recessed pads 448, 450, 452 is substantially the same shape and size as the location of the corresponding filtering device 434, and the portion of the filtering device 434 is referred to by the lower surface 414 of the cover 406 extending into the base 402 such that each filtering A portion of device 434 is received within corresponding recessed pads 448, 450, 452. The recessed pads 448, 450, 452 extend downwardly from the contact surface 440 to a predetermined depth. In an embodiment, the depths of all of the recessed pads 448, 450, 452 are the same. In another embodiment, at least one of the recessed pads 448, 450, 452 has a different depth than the other recessed pads. When the base 402 is filled with the precursor, the volume of each of the recessed pads 448, 450, 452 is not filled with the precursor. When the carrier gas system is introduced into the base 402 through the filter device 434 adjacent the inlet port 420 of the cover 406, the carrier gas contacts and is interspersed with the inlet recess pad before passing through the remaining portion of the recessed region 408. Among 448. Since it is preferred that there is no precursor among any of the recessed pads 448, 450, 452, the introduction of the carrier gas into the inlet recessed pad 448 prevents the carrier gas from directly contacting the precursor, which may inhibit the precursor or cause the precursor. The particles are mixed with a carrier gas. Each of the recessed pads 448, 450, 452 of the recessed region 408 is fluidly coupled by a channel 454 formed in the body 436.

As shown in FIGS. 11F-11G, the channel 454 of the recessed region 408 extends from the contact surface 440, wherein the channel 454 is a continuous path through which the gas can extend between the inlet recess pad 448 and the exit recess pad 450. mobile. In another embodiment, the recessed region 408 does not include a recessed pad such that the channel 454 extends beyond the filtering device 434 adjacent the inlet port 420. The entire distance between the filter device 434 adjacent the exit hopper 422 and the snoring port 424. Channel 454 is formed in body 436 such that channel 454 has a depth that is greater than the depth of recessed pads 448, 450, 452. In an embodiment, the depth of the channel 454 is fixed along the entire length of the channel 454 between the inlet recess pad 448 and the exit recess pad 450. In another embodiment, the depth of the channel 454 varies along the length of the channel 454 between the inlet recess pad 448 and the exit recess pad 450.

When the source container 400 is filled with a liquid or solid precursor material (not shown), the precursor material is preferably disposed only in the channel 454 formed in the recessed region 408 in the body 436. Channel 454 should be filled to a depth below the bottom surface of recessed pads 448, 450, 452 to prevent any precursor material from being retained in recessed pads 448, 450, 452. Further, the bottom surface of the exit recess pad 450 is located on the upper surface of the precursor material such that any precursor material particles remain in the channel 454.

In the embodiment of the base 402 shown in FIG. 11E, the channel 454 extends between the inlet recess pad 448 and the exit recess pad 450 and has a meandering shape. Channel 454 forms a meandering path between inlet port 420 and outlet port 422 along which the carrier gas can move. In other words, the passage 454 between the inlet pocket 448 and the outlet pocket 450 is not linear between the inlet port 420 and the outlet port 422. In the embodiment illustrated in Figures 11E-11G, the channel 454 includes a plurality of linear segments 456. Furthermore, at least two adjacent straight line segments 456 are substantially parallel to each other. Channel 454 has a width. In an embodiment, the channel 454 has a fixed width along its entire length. In another embodiment, the pass The width of the track 454 varies along its length. The meandering shape of the channel 454 maximizes the amount of time and the distance that the carrier gas introduced into the source container 400 contacts the precursor material disposed in the recessed region 408.

In another embodiment of the base 402 of the source container 400, the channel 454 extends between and is in fluid communication with the inlet recess pad 448 and the outlet recess pad 450, as shown in Figure 11H. Channel 454 includes a plurality of curved segments 458. In an embodiment, the channel 454 includes at least two curved segments 458 that are substantially concentric with respect to each other. In another embodiment, the channel 454 includes a plurality of arcuate segments 458 instead of a linear segment 456. In another embodiment of the base 402 (not shown), the passage 454 is a completely irregular, 蜿 extending between the inlet recessed pad 448 and the outlet recessed pad 450 or between the inlet and outlet 420 and the outlet opening 422.蜒 path.

FIG. 11H illustrates an embodiment of a base 402 that further includes an add-on assembly 460 disposed within the base 402. In one embodiment, the heating assembly 460 is integrated into the wall of the base 402 between the side surface 444 and the bottom surface 442 and the inner surface 446. The heating assembly 460 is constructed to provide direct heat to the base 402 for the evaporative precursor material 464 disposed therein. In an embodiment, the heating assembly 460 can be a wire heater integrally formed in the base, or any other type of heating mechanism sufficient to provide direct heat to the base 402 while being integrated therein. In another embodiment, the heating component 460 is embedded in a resistive element in the base 402. In other embodiments, the heating assembly 460 can be a thin foil heating element embedded in the base 402. As is known to those of ordinary skill in the art, heating assembly 460 can include any heating means that provide The body 436 of the base 402 is heated directly to provide sufficient heat to evaporate the precursor material 464.

In another embodiment of the base 402 of the source container 400, a recessed region 408 is formed in the base 402 to provide a substantially hollow volume within the base 402 to receive the precursor material, as shown in Figure 11J. Although the embodiment illustrated in FIG. 11J does not include a channel or a meandering path similar to the embodiment described above, the recessed region 408 provides an extension between the inlet port 420 and the outlet port 422 in the base 402. , non-linear path.

When the source container 400 is assembled, the cover 406 is removably attached to the base 402 with the seal 404 disposed therebetween. When cover 406 is attached to base 402, an interior volume 468 is defined between inner surface 446 that forms recessed area 408 in base 402 and lower surface 414 of cover 406. The cover 406 includes a plurality of holes 462 that form the entire thickness T1 through the cover 406, as shown in Figure 11B. A hole 462 formed through the cover 406 is located adjacent the outer edge of the cover 406. The base 402 also includes a plurality of apertures 462 that form an overall thickness through the flange 438, as shown in Figure 11D. The cover 406 is aligned with the base 402 such that each filter device 434 attached to the cover 406 is received within a corresponding recessed pad 448, 450, 452 of the base 402. The seal 404 is disposed in a groove 410 formed in the base 402. When the cover 406 and the base 402 are aligned, the holes 462 formed in the cover 406 are likewise aligned with the holes 462 formed in the base 402. A connecting element (not shown) is inserted through each of the pair of base 402 and cover 406. The aperture 462 is such that the cover 406 is removably sealed to the base 402. It will be appreciated by those of ordinary skill in the art that any form of connecting element can be used to removably attach the cover 406 to the base 402, including, but not limited to, screws, bolts or clamps. When fully assembled, the lower surface 414 of the cover 406 is in intimate contact with the contact surface 440 of the base 402. Contact of the cover 406 with the contact surface 440 of the base 402 provides direct heat transfer between the cover 406 and the portion of the body 436 directly adjacent the recessed region 408 to transfer heat through the base 402 to a precursor disposed within the interior volume 468. material. It will be appreciated by those of ordinary skill in the art that both the lower surface 414 of the cover 406 and the contact surface 440 of the base 402 are substantially flat such that when the surfaces 414, 440 are in contact with each other, the cover 406 and the base The close relationship between 402 provides a seal between adjacent portions of the channel 454 (Figs. 11E and 11I) so that the carrier gas and the vaporized precursor material do not bypass the channel 454 by passing between the cover 406 and the base 402. The part.

In operation of the semiconductor substrate in processing chamber 162 (Fig. 25), a carrier gas system is introduced into source container 400 through inlet port 420 in lid 406. A precursor material 464 is disposed in the source container 400, and the source container 400 is heated, thereby evaporating the precursor material. The carrier gas then passes through a filtering device 434 located adjacent the inlet port 420 and then into the base 402 by forming an interior volume 468 defined by the inner surface 446 of the recessed region 408 and the lower surface 414 of the cover 406. Upon entering the interior volume 468, the carrier gas enters the inlet recess pad 448 and is subsequently dispersed via the channel 454. When the carrier gas moves through the internal volume 468, the carrier gas is mixed with the vaporized precursor material 464 (Fig. 11H) to form a gas mixture that is filled with the vaporized precursor material. The longer the residence time of the carrier gas remaining in the internal volume 468, the more the carrier gas becomes filled with the vaporized precursor material. It will be appreciated by those of ordinary skill in the art that the saturation of the carrier gas with the vaporized precursor material is limited, while the internal volume 468 is intermediate between the inlet port 420 and the outlet port 422. The length of the path is optimized to maximize the amount of saturation of the carrier gas. This gas mixture can ultimately exit the interior volume 468 by passing through a filtering device 434 that is operatively coupled to the lid 406 and located adjacent the outlet port 422. After passing through the filtration device 434, the gas mixture exits the source vessel 400 via an outlet port 422 and enters an outlet gas line 470 (Fig. 25) that is in fluid communication with a reaction chamber 162.

In a snoring procedure, the gas within the internal volume 468 of the source container 400 produces a head pressure therein that is added after the first fill or refill of the source container 400 is removed. In a snoring procedure, as shown in the schematic of FIG. 25, the snoring valve 428 is opened to allow gas in the source container 400 to exit the interior volume 468 via the snoring port 424. The head pressure is passed through a snoring filter 430 operatively coupled to a cover 406 adjacent the snoring port 424. After passing through the snoring filter 430, the head gas exits the source vessel 400 via the snoring port 424 and enters a snoring gas line 432 that bypasses the reaction chamber 162 and is fluidly and operatively coupled to an exhaust line 466. The effluent from reaction chamber 162 flows through the gas line 466. Once the gas that produced the initial head pressure exits the source vessel 400 such that the pressure in the source vessel 400 is equal, the carrier gas system is directed through A filter device 434 attached to the cover 406 near the inlet port 420 and then into the interior volume 468 of the base 402 to fill the recessed region 408 with the carrier gas to a predetermined operating pressure.

In another alternative embodiment, illustrated in Figures 12 through 16, the meandering path insert 112 includes a plurality of stacked trays that collectively define a helium gas flow path. For example, Figure 12 shows a plurality of stacked trays 230, 240 that are structurally removably inserted into a container body 104 (Figures 7-10) and collectively define a spiral gas flow path, It contains at least a portion of the meandering path of the container 100. In FIGS. 12 to 16, the heights of the trays 230, 240 are enlarged to be clearly displayed. It will be appreciated that the tray can be made relatively thin vertically so that the container 100 has a diameter that is much larger than its overall height.

In the illustrated embodiment, four trays are stacked: three upper trays 230 and one lower tray 240. The number of trays can vary depending on parameters such as volatility, carrier flow, and the like.

Referring to Figures 13 and 14, each upper tray 230 includes a solid divider 231 that prevents gas from flowing therethrough and extends the entire height of the tray 230, as well as a portion of divider 232 that allows gas to flow therethrough. Preferably, the partial divider comprises a screen 233 which is constructed to hold large precursor particles while allowing free gas to flow therethrough. In the illustrated embodiment, the screen 233 extends through the top portion of the partial divider 232, while a solid panel completes the height of the portion divider 232. An annular rim 234 also extends the height of the upper tray 230. The solid divider 231 and the partial divider 232 together define a primary compartment 235 and an outer space for holding solid source material (not shown) Channel compartment 236, which is open on the lower surface of tray 230. The illustrated upper tray 230 has a central core 237 that includes a central passage 238 for receiving a gas inlet tube that carries carrier gas to the bottom tray 240. The illustrated upper tray 230 also has a plurality of magazines 239 on its upper surface and a corresponding plurality of holes (not shown) on its lower surface for receiving staples of other trays thereunder. . In view of the more detailed understanding of the operation, as explained below, the apertures in the lower surface of the central core 237 are desirably rotationally offset relative to the pegs 239 on the upper surface as a correct alignment of the plurality of trays in another On a tray to define a curved flow path. In certain preferred embodiments, the exposed corners of the fluid in the primary compartment are rounded to minimize fluid stagnation at corners with sharp corners.

Referring to Figures 15 and 16, the lowermost tray 240 includes a solid divider 241 that prevents gas flow therethrough and extends the full height of the tray, and a portion of the divider 242 allows gas to flow through the upper portion. . Preferably, the partial divider 242 provides only an opening to the central passage 238 to the middle of the overlapping upper tray 230, which will be more fully understood with reference to the description of FIG. An annular rim 244 also extends the height of the lower tray 240. Annular edge 244, solid divider 241 and partial divider 242 together define a primary compartment 245 and an outer channel compartment 246 for holding solid source material (not shown). In a preferred embodiment, the solid source material fills only the primary compartment 245 up to the outer channel compartment 246 and is flush with the outer channel compartment 246. In an alternate embodiment, the solid source material is filled between one-third to two-thirds of the height of the primary compartment. Painted The illustrated lower tray 240 also has a central core 247 with an outer channel compartment 246 projecting into the central core 247; a plurality of pegs 249 located on the upper surface of the lower tray 240; and corresponding plurality of holes (not shown) ), located on the bottom surface of the lower tray 240 for receiving the studs projecting upward from the bottom layer of the container body 104 (Figs. 7 to 10).

The stack of trays 230, 240 is assembled as shown in the exploded view of FIG. The primary compartments 235, 245 for each of the upper and lower trays 230, 240 are filled with a precursor chemical, preferably in the form of a powder. The lower tray 240 and the plurality of upper trays 230 are stacked on each other and loaded into the outer container body 104. The trays 230, 240 are aligned by the pegs 239, 249 and corresponding holes such that gas flows into each of the trays, preferably at least a stroke of between 200 and 355 degrees around the main compartment, and subsequently The upper channel compartment 236 of the upper tray 230 is overlapped. The container lid 106 (Figs. 7 and 8) is then closed and sealed to the container body 104, and a central conduit 215 extends downwardly from the lid through the central passage 238 of the upper tray 230 to open to the passage compartment of the lower tray 240. 246. Figure 12 shows the central line 215 instead of the cover 106. The central piping system constitutes a carrier gas that transports an inlet that is transported to the vessel 100. In a particularly preferred embodiment, a spring or other compression mechanism (not shown) is typically positioned below the lower tray 240 to force all of the trays together to prevent leakage from the central core to different heights.

In operation, inert gas is preferably delivered to the stack of trays 230, 240 and horizontally undergoes long and winding flow paths, preferably before each tray 230, 240, past each tray Large in the main compartment An arc of about 200 to 350 degrees. In the illustrated embodiment, the inert carrier gas system is provided through a central inlet 215 that extends downwardly through the aligned central passages 238 of the upper tray 230 to open into the passage compartments 246 of the lower tray 240. The inert gas passes through the precursor source chemical in the primary space 245 until it encounters an opening in the lower surface of the overlapping upper tray 230. This opening allows the carrier gas, as well as the vaporized precursor it carries, to pass into the channel compartment 236 of the overlapping upper tray 230, from which the gas passes through the screen 233 (Fig. 13) and into the main compartment. 235. The gas enthalpy passes through a solid precursor in the primary compartment 235, preferably through an arc of about 200 to 350 degrees before encountering an opening in the lower surface of the overlapping upper tray or the like. At the uppermost upper tray 230, gas is allowed to exit the container 100, preferably by installing an outlet valve 110 (described below) at a surface at the container lid 106. Of course, it will be appreciated that the flow path can be reversed if needed. In other words, the inert carrier gas can begin from a top tray and flow down through the stack of trays.

Referring again to FIGS. 8-10, in the illustrated embodiment, the container lid 106 includes an inlet valve 108 and an outlet valve 110. The inlet valve 108 has an inlet end that receives a carrier gas via a conduit 121. The conduit 121 has a fitting 122 for attachment to a fitting 131 (Fig. 7) of a gas line 133 of a gas interface assembly 180 (described below). The inlet valve 108 also has an outlet end that is preferably in fluid communication with a first portion 117 (such as an end portion) of the weir path 111 of the insert 112. The outlet valve 110 has an inlet end that is preferably in fluid communication with a second portion 119 (such as an end portion) of the weir path 111, and a suitable gas with the cover 106. An outlet end of the body outlet in fluid communication, such as an orifice 128. In use, the carrier gas flows into the conduit 121 and passes through the inlet valve 108, the weir path 111, and the outlet valve 110 before exiting the orifice 128. Thus, the result that can be achieved by this embodiment includes installing the isolation valve on the cover 106 and causing the carrier gas to flow along a meandering or curved path while it is exposed to the precursor source. Those of ordinary skill in the art will recognize that container 200 can be constructed in different ways.

As explained above, conventional solid or liquid precursor source containers contain separate tubing that extends from the vessel body or lid and has a valve attached to the tubing in the line. For example, the conventional container 31 of Figure 2 includes separate conduits 43b and 45b that extend upwardly from the cover 35 with valves 37 and 39 attached to the conduit. The valves 37 and 39 of the container 31 are not directly attached to or joined to the lid 35. As a result, the reactant gases from the vessel 31 exit the outlet line 45b and then enter the outlet valve 39, which may contain a flow path with a stagnant or failed gas volume. In addition to this, the isolation valves 37, 39 and 41 of the conventional container 31 are largely thermally isolated from the container lid 35 and the body 33. Both the pipeline and the valve are very difficult to effectively heat with a three-dimensional geometry, with or without a failure volume or the presence of a "dead water zone." The valve has a lower thermal mass than the cover 35 and the body 33 and therefore tends to heat and cool more quickly. This is also why, in conventional systems, additional heaters (such as line heaters, cartridge heaters, direct heat lamps, etc.) are often used to specifically provide heat to the valve and associated tubes during system cooling. Roads to prevent these components from cooling faster than the vessel 31 (which may cause unwanted conditions in which reactant vapors flow into these components) And deposited on it). Another problem associated with conventional valves and tubing is that it may heat up faster than the container 31. For some precursors, this may result in a situation where the valve and tubing are warmer than the decomposition temperature of the precursor, causing the precursor to decompose and deposit thereon.

In contrast, the isolation valves 108 and 110 (FIGS. 7-10) of the source container 100 are preferably mounted directly to the surface of the lid 106 of the container 100. This surface mount technology can be referred to as an integrated gas system. Compared to conventional precursor source containers (eg, Figure 2), surface mount valves 108 and 110 can reduce dead water in the gas delivery system by eliminating tubing between the valve and vessel 100 (stagnation of reactants) The volume of the gas stream) which simplifies and shortens the path of movement of the reactant gases. Because of the compressed geometry and improved thermal contact, valves and tubing are more easily heated, which reduces the temperature gradient. The surface mount valves 108 and 110 are shown with valve port blocks 118 and 120, respectively, which preferably include a valve seat and an adjustable flow restrictor (e.g., a diaphragm) for selectively controlling the flow of gas through the valve seat. Such valves 108 and 110 isolate vessel 100 by restricting all of the gas flow through the valve seat. The mouthpiece blocks 118, 120 may be formed integrally with the lid 106 or may be separately formed and mounted thereon. In either case, the mouthpiece blocks 118, 120 preferably have a substantial height of thermal contact with the container lid 106. This causes the temperatures of the valves 108 and 110 to remain close to the temperature of the lid 106 and the vessel body 104 during temperature changes of the vessel 100. This surface mount valve structure reduces the overall number of heaters needed to prevent condensation of the vaporized precursor gas. When the vessel 100 is at a vaporization temperature above the precursor source chemical, the vaporized precursor can flow freely to the valves 108 and 110. Because it rises in temperature During this time, the valves 108, 110 closely follow the temperature of the vessel 100, and the valve is also higher than the vaporization temperature, thus reducing the need for a heater that prevents the precursor from condensing in the valve. The shortened gas flow path is also preferably suitable for controlled heating. Surface mounted valves 108 and 110 also have a small assembly space requirement.

In another embodiment, the valve regulating elements of the mouthpiece blocks 118, 120 (Fig. 8) may be integrally formed in the cover 406 of the source container 400, thereby allowing the inlet valve 108 and the outlet valve 110 and the snoring valve 428 to be directly The ground is attached to the cover 406 such that the inlet valve 108, the snoring valve 428, and the outlet valve 110 are mounted flush with the upper surface 412 of the cover 406, as shown in Figure 11J. Directly mounting the valve and flushing with the upper surface 412 of the cover 406 increases heat transfer therebetween and further reduces the distance that the inert gas and vaporized precursor mixture must move from the interior volume 468 of the base 402 to the reaction chamber 162 ( Figure 25).

Each of the valves 108 and 110 preferably includes a valve port block that includes a gas flow passage that can be restricted or opened by the valve. For example, referring to Figures 9 and 10, the mouthpiece block 118 of the valve 108 preferably includes an internal gas flow passage that extends from the conduit 121 through one of the sides 123 of the mouthpiece block 118 to a region 113. Zone 113 preferably includes an internal device (not shown) for restricting the flow of gas, such as a valve seat and a movable restrictor or diaphragm. In one embodiment, the movable internal limiter or diaphragm can be moved by rotating a knob (e.g., the upper upper portion 181 of the valve 108), either manually or automatically. Another internal gas flow passage preferably extends through region 113 Opposite side 125 of the mouthpiece block 118 to an inlet channel that extends through the lid 106 into the container 100. For example, the inlet channel can extend into the meandering path 111 defined by the helium insert 112. Valve 110 and exhaust valve 210 (described below with reference to Figures 26-28) may be constructed similar to valve 108. In an embodiment, valves 108 and 110 are pneumatic valves. In particular, it is preferred to integrally form the valve pockets 118 and 120 with the container lid 106. This eliminates the need for separate seals between them.

In another embodiment, valves 108, 110, and 210 (Figs. 26-28) are formed without a mouthpiece block, such as mouthpiece blocks 118, 120, and are preferably integrally formed with a portion of container 100, Like the container lid 106.

filter

Preferably, the precursor source container comprises a filtration device for filtering the flow of gas through the container to prevent particulate matter (eg, powder of source chemicals) from leaving the container. The filter device can be located in a lid of the container, preferably below the surface mount valves 118, 110 and/or 210 (read 26 to Figure 28). Preferably, the filtration device comprises individual filters for each inlet and outlet of the container.

17 is a cross-sectional view of an embodiment of a filtration device 130 that can be mounted in a body or lid of a reactant source container (eg, lid 106 of FIG. 8). The illustrated device 130 is a filter formed by a flange 132, a filter media 134, and a fastener element 136. In this embodiment, the filter 130 is sized and shaped to fit snugly within a recess 138 of the lid of the container (e.g., the lid 106 of Figure 8). Flange 132 The circumference may be circular, rectangular or other shape, and the shape preferably closely fits around the recess 138. The filter material 134 is constructed to limit the passage of particles larger than a particular size in the gas through an opening defined by an annular inner wall portion 140 of the flange 132. This material 134 preferably blocks the entire opening defined by the wall portion 140. Material 134 can comprise any of a variety of different materials, and in one embodiment is a high flow sintered nickel fiber media. In other embodiments, the filter media is made of other metals (e.g., stainless steel), ceramic (e.g., alumina), quartz, or other materials typically contained in a gas or liquid filter. The material 134 is preferably welded or bonded to the annular wall portion 140. In one embodiment, the filter 130 includes a surface mount sandwich filter, such as that sold by TEM Products, Inc. of Santa Clara, California.

In the illustrated embodiment, the fastener element 136 includes a spring retainer that presses against the flange 132 against a wall portion 146 of the cover 106. The ring 136 is preferably closely mated into an annular recess 142 in the periphery of the recess 138. The buckle 136 can include, for example, a flat wire compression spring, such as a Spirawave® wave spring sold by Smalley Steel Ring, Inc., Lake Zurich, Ill. Additional and different forms of fastener elements can be provided to secure the filter 130 to the cover 106. Preferably, the fastener element 136 prevents the flow of carrier gas and reactant vapor through the interface between the flange 132 and the cover 106 such that all of the gas must flow through the filter material 134. Secondary recess 147 can be provided to define an inflator 148 positioned on the outlet side of filter 130 that can improve the quality of the filtered gas stream. The illustrated filter 130 is easily replaceable by simply using the buckle 136 Removal from the annular recess 142 removes the filter 130 from the recess 138, inserts a new filter 130, and reinserts the buckle 136 into the annular recess 142.

The filter recess 138 is preferably in close proximity to one of the isolation valves of the precursor source container. In the embodiment of FIG. 17, the recess 138 is located directly below the valve port block 120 of the outlet isolation valve 110 (FIG. 1) of the source container 100. It will be appreciated by those of ordinary skill in the art that individual filters 130 can be incorporated with each isolation valve of the vessel, including inlet valve 108 and exhaust valve 210 (Figs. 26-28). A passage 145 extends from the plenum 148 to a passage 144 of the valve block 120. In the illustrated embodiment, the mouthpiece block 120 is formed separately from the container lid 106, and preferably a seal is disposed therebetween. In another embodiment, the block 120 is integrally formed with the cover 106 and the channels 144 and 145 are formed in the same drilling operation.

Figure 18 is an enlarged cross-sectional view of a surface portion of a filter material 134, in accordance with an embodiment. In this embodiment, the filter material 134 comprises a large particle filter layer 150 and a small particle filter layer 152. The large particle filter layer 150 preferably filters relatively large particles, while the small particle filter layer 152 preferably filters smaller particles. The large particle filter layer 150 includes a plurality of pores 151. In one embodiment, the large particle filter layer 150 has about 20% to 60% porosity, and more preferably 30% to 50% porosity. In one embodiment, the large particle filter layer 150 has about 42% porosity. The large particle filter layer 150 can comprise, for example, a stainless steel material. The large particle filter layer 150 preferably contains a majority of the filter material 134. Because of the pores 151, the filter material 134 is produced Born a fairly low pressure drop. One or more support tubes 154 may be provided for improving the structural rigidity of the large particle filter layer 150. The small particle filter layer 152 may have a pore size of 0.05 to 0.2 microns, and more preferably about 0.10 microns. The small particle filter layer 152 can have a thickness of about 5 to 20 microns, and more preferably about 10 microns. The small particle filter layer 152 can comprise, for example, a coating of zirconia. Each side of the large particle filter layer 150 may be coated with a small particle filter layer 152. A suitable filter material is similar to the AccuSep filter sold by the company Pall.

Gas interface component

19 is a schematic illustration of a gas delivery system 160 that can be used to flow a carrier and reactant gases through a precursor source vessel 100 and a vapor phase reaction chamber 162. Delivery system 160 includes the vessel 100, a carrier gas source 164, a downstream purifier or filter 166, and a plurality of additional valves, as described herein. The isolation valves 108, 110 are preferably surface mounted on the container 100 as described above. The carrier gas source 164 is operable to deliver an inert carrier gas to a junction 168. A valve 170 is interposed between the connection point 168 and the container inlet valve 108. A valve 172 is interposed between the connection point 168 and a connection point 174. A valve 176 is interposed between the connection point 174 and the container outlet valve 110. A purifier 166 and an additional valve 178 are interposed between the connection point 174 and the reaction chamber 162. As shown, the container 100 can have a suitable control and alarm interface, display, panel, or the like.

When it is desired to flow the carrier gas through the vessel 100 and to the reaction chamber 162, the valves 170, 108, 110, 176 and 178 are opened and the valve 172 shut down. Conversely, when it is desired to bypass the vessel 100 on its way to the reaction chamber 162, the valves 172 and 178 are open and preferably all of the valves 170, 108, 110 and 176 are closed. Valve 178 can be used to isolate reaction chamber 162 from gas delivery system 160, for example, for maintenance or repair.

Referring again to Figure 7, a precursor gas delivery system (e.g., as shown in Figure 19) can be implemented in a gas interface assembly 180 that facilitates control of the flow of carrier gas and reactant vapor through the vessel 100 and associated The vapor phase reaction chamber. The illustrated gas interface assembly 180 includes a plurality of valves 182 (which may substantially perform the same functions as valves 170, 172, 176, and 178 of FIG. 19), a downstream purifier or filter 184, and a heating plate 186. . Valve 182 may include a valve port block 188 that is similar in principle and operation to valve port blocks 118 and 120.

Referring to Figures 7 and 19, a gas line 133 extends from one of the valves 182 that receives carrier gas from a carrier gas source 164. For example, the valve 182 from which the gas line 133 extends can perform the substantially functioning of the valve 170 of FIG. Figure 7 does not show that the gas line extends from the carrier gas source into the valve, but it will be appreciated that this can be set. Gas line 133 includes an accessory 131 that is coupled to carrier gas inlet fitting 122 of container 100 when the container is coupled to gas interface assembly 180. An outlet 135 of the gas interface assembly 180 delivers gas to the reaction chamber 162. It will be appreciated that the carrier gas inlet of the source container can be constructed similar to the outlet orifice 128.

With continued reference to Figure 7, the heater plate 186 heats the valve 182 and the vessel 100, preferably to a temperature above the vaporization temperature of the precursor. Preferred embodiment Different valves, valve jaw blocks, with high thermal contact between their gas conduits, and the heating plate 186 approaching these components reduce the heat required to prevent the precursor from condensing in the gas transport members downstream of the vessel 100. The heater plate 186 can be heated by a variety of different forms of heaters, such as a cartridge heater or line heater. The heating plate can be formed from a variety of materials such as aluminum, stainless steel, titanium, or a variety of niobium alloys. A Thermofoil-type heater can also be used to heat the heating plate 186 and the valve block 188. The use of a hot foil heater allows for a variable watt density or more than one temperature control zone. The incorporation or variable temperature control zones of the variable watt density on the heating plate 186 enable it to cause a temperature gradient along the flow path of the gas. This provides gradual heating of the reactant vapor as the reactant vapor moves downstream, thus avoiding condensation. Suitable hot foil heaters are sold by Minco Corporation of Minneapolis, Minnesota. Additional heaters (including line heaters, cartridge heaters, radiant heat lamps, hot foil heaters) may also be provided to heat the container lid 106 and the container body 104.

In certain embodiments, a dedicated heater can be provided to heat the container 100. In a particular embodiment, shown in Figure 18 (described in more detail below), a dedicated heating device 220 is provided below the lower surface of the container body 104 of the container.

As mentioned above, the precursor vapor can also be withdrawn from the vessel 100 by "vapor extraction" and external gas flow methods. In the vapor extraction method, a vacuum system is applied to the vessel 100 to extract vapor. For example, a vacuum can be applied downstream of the reaction chamber 162 with valves 110, 176, and 178 open and valves 108, 170, and 172 closed. For example, vacuum can be achieved by using a vacuum The pump is applied. In the external gas flow method, the precursor vapor can be withdrawn from the vessel 100 by flowing carrier gas from the source 164 to the reaction chamber 162, with the valves 110, 172, 176, and 178 open and the valves 108 and 170 closed. In some cases, this can create a pressure differential between the flow path of the vessel 100 and the carrier gas that causes the precursor vapor to flow toward the reaction chamber.

Quick connect component

With continued reference to FIG. 7, the quick connect assembly 102 preferably facilitates loading, aligning, and connecting the precursor source container 100 to the gas interface assembly 180 faster and easier. The quick connect assembly 102 is ergonomically convenient and facilitates replacement, refilling, and durability of the container 100. A variety of different forms of quick connect components may be provided, and these objectives are to be kept in mind, and those of ordinary skill in the art will appreciate that the illustrated component 102 is merely one embodiment. The quick connect assembly 102 can be incorporated into a vacuum enclosure in which the source container 100 and the support control hardware are packaged.

Referring to FIG. 7, FIG. 20 and FIG. 21, the quick connect assembly 102 includes: a base 190; a bracket 192 extending upward from an edge of the base 190; a track member 194; and a lift assembly 196. The base 190 is preferably affixed to a lower inner surface of the gas delivery system 6 (FIG. 1), such as on the bottom plate 9 of the reactant source cabinet 16. Preferably, the bracket 192 is coupled to the gas interface assembly 180 and supports the gas interface assembly 180 at a location above the base 190. The track member 194 includes a platform 198 and two roller tracks 200 on opposite sides of the platform 198. Have a pair A pair of roller assemblies 202 of the roller 204 are preferably secured to opposite sides of the container 100. In this embodiment, the roller 204 is sized and configured to roll within the track 200 of the track member 194 so that the container 100 can be positioned simply and quickly on the platform 198.

When the container 100 is mounted to the platform 198 with the roller assembly 202 coupled to the track 200, the outlet of the outlet valve 110 preferably vertically aligns the inlet of one of the valves 182 of the gas interface assembly 180. The lift assembly 196 is constructed to vertically move the platform 198 between a lower position (shown in Figure 7) and a raised position (shown in Figures 20-21). The outlet of the outlet valve 110 preferably communicates directly or indirectly with the inlet of one of the valves 182 when the container 100 is loaded onto the platform 198 and the platform is moved to its raised position. A minimal manual adjustment may be required to properly seal the interface between the outlet of the outlet valve 110 and the inlet of the valve 182. In the illustrated embodiment, the outlet of the outlet valve 110 is the orifice 128 in the valve block 120. In this manner, the quick connect assembly 102 enables rapid connection of the precursor source container 100 and the gas interface assembly 180.

As shown in FIG. 20, the illustrated lift assembly 196 includes a lift handle 195 that can manually actuate the scissor foot 197 to move the platform 198 vertically. For example, the handle 195 and the foot 197 can operate in a manner similar to some existing automatic jacks. In one embodiment, when the handle 195 is rotated nearly 180 degrees, the lift assembly 196 lifts the platform 198 to its raised position. However, it will be appreciated that other forms of lifting devices may be additionally provided.

The quick connect assembly 102 makes it easier to dispense a depleted container 100 Replace with a new one. In addition to this, because assembly 102 simplifies container removal and installation, it also performs routine maintenance on container 100 more easily. Preferably, the weight of the container 100 is such that it can be easily handled by a single technician.

22 through 24 illustrate an alternate embodiment of the quick connect assembly 102. The illustrated assembly 102 includes a platform 198 and a cradle 192. The platform 198 includes a track 200 for receiving a tongue 206 attached to opposite sides of the container 100. One or more lifting devices 208 are provided to lift the platform 198. In the illustrated embodiment, the lift device 208 includes a bolt located below the platform 198. The bolt can be rotated to cause the platform 198 to rise to a connected position with the container 100. A guiding device (not shown) can be provided to maintain vertical alignment of the platform 198.

Vent

As mentioned above, the precursor source container is typically supplied with a head pressure of inert gas (e.g., helium) in the container. During this period of exhaust gas pressure drop to typical processing pressure (or during snoring), the solid precursor particles become aerosolized and entrained in the outflow of inert gas. This can contaminate the gas delivery system because such gases are typically expelled through the outlet isolation valve of the vessel, the reactant gas delivery system, and finally the venting/scrubber of the reactor. Thereafter, during the processing of the substrate, the portion of the gas plate that is shared with the precursor transport path and the exhaust path and contaminated may cause processing defects during atomic layer deposition on the substrate.

Figure 26 shows an example of a precursor source container 100 that includes an exhaust gas Valve 210. In this embodiment, the exhaust valve 210 is positioned intermediate the inlet isolation valve 108 and the outlet isolation valve 110. However, those of ordinary skill in the art will appreciate that other configurations are possible. Preferably, the exhaust valve 210 includes a valve port block 212 that can be substantially similar to the valve port blocks 118 and 120. Figure 27 shows the container 100 of Figure 26 coupled to the gas interface assembly of Figures 22-24, as described above.

28 is a cross-sectional view of an embodiment of the container 100 of FIG. 26. As noted above, the container 100 includes a container body 104, a cassette insert 112, a spring 114, and a container lid 106. The container lid 106 includes surface mounted isolation valves 108 and 110, and a preferably surface mounted isolation valve 210. Preferably, valves 108, 210, and 110 include valve port blocks 118, 212, and 120, respectively. Figure 28 also shows the internal gas passage 214 of the valve block. As described above, the valve port block 120 includes a gas outlet 128 that supplies precursor vapor and carrier gas to the gas interface assembly 180.

A filter is preferably coupled to each of the valves 108, 210 and 110. In the illustrated embodiment, the container lid 106 includes a filter 130 coupled to each valve (e.g., as shown in Figure 17 and described above). It will be appreciated that a variety of different forms of filters can be used. The filter prevents the precursor particles from leaving the container 100.

Although the preferred embodiment of the invention has been described, it should be understood that the invention is not limited thereto, and modifications may be made without departing from the invention. The scope of the present invention is defined by the scope of the appended claims, and all means, procedures, and methods in the meaning of

6‧‧‧Precursor delivery system

7‧‧‧ top board

9‧‧‧floor

10‧‧‧Source container

12‧‧‧Reaction room

16‧‧‧Reagent source cabinet

18‧‧‧Reaction chamber container

20‧‧‧First catheter

22a‧‧‧Isolation valve

22b‧‧‧Isolation valve

24‧‧‧second catheter

26‧‧‧Isolation valve

27‧‧‧Control valve

28‧‧‧ Purifier

30‧‧‧Internal space

31‧‧‧ precursor source container

32‧‧‧ heating device

33‧‧‧ container body

34‧‧‧ reflector sheet

35‧‧‧ cover

36‧‧‧Cooling sleeve

37‧‧‧Isolation valve

38‧‧‧ inner wall

39‧‧‧Isolation valve

40‧‧‧ outer wall

41‧‧‧Isolation valve

43a‧‧‧Inlet line

43b‧‧‧Inlet pipe

45a‧‧‧Export line

45b‧‧‧Export line

47‧‧‧Accessories

50‧‧‧ third catheter

52‧‧‧First connection point

54‧‧‧Inert air source

56‧‧‧ valve

58‧‧‧fourth catheter

60‧‧‧second connection point

61‧‧‧Restrictor

63‧‧‧Valves

64‧‧‧ evacuated source

70‧‧‧ valve

80‧‧‧ Curve

82‧‧‧ Curve

84‧‧‧Reaction gas pulse

86‧‧‧ time period

90‧‧‧ gas board

91‧‧‧Inlet valve

92‧‧‧Export valve

93‧‧‧pipe

94‧‧‧pipe

95‧‧‧ pipeline

96‧‧‧pipe

97‧‧‧ gas plate

100‧‧‧ precursor source container

102‧‧‧Quick connection components

104‧‧‧Ontology

106‧‧‧ cover

108‧‧‧Inlet valve

110‧‧‧Export valve

111‧‧‧ Path

112‧‧‧蜿蜒Path Inserts

113‧‧‧Area

114‧‧‧ Spring

117‧‧‧Part 1

118‧‧‧ valve mouth block

119‧‧‧Part II

120‧‧‧ valve mouth block

121‧‧‧ catheter

122‧‧‧Accessories

123‧‧‧ side

124‧‧‧ fastening elements

125‧‧‧ opposite side

126‧‧‧Flange

128‧‧‧孔口

130‧‧‧Filter equipment

131‧‧‧Accessories

132‧‧‧Flange

133‧‧‧ gas pipeline

134‧‧‧Filter media/material

135‧‧‧Export

136‧‧‧fastener components

138‧‧‧ recess

140‧‧‧Ring inner wall

142‧‧‧ annular recess

144‧‧‧ channel

145‧‧‧ channel

146‧‧‧ wall

147‧‧ times recess

148‧‧‧Inflatable Department

150‧‧‧large particle filter

151‧‧‧ pores

152‧‧‧Small particle filter

154‧‧‧Support tube

160‧‧‧ gas delivery system

162‧‧‧Reaction room

164‧‧‧Carrier gas source

166‧‧‧ purifier

168‧‧‧ connection point

170‧‧‧ valve

172‧‧‧ valve

174‧‧‧ Connection point

176‧‧‧ valve

178‧‧‧ valve

180‧‧‧ gas interface components

181‧‧‧上上

182‧‧‧ valve

184‧‧‧ purifier

186‧‧‧heating plate

188‧‧‧ valve mouth block

190‧‧‧Base

192‧‧‧ bracket

194‧‧‧ Track members

195‧‧‧ Lifting handle

196‧‧‧ Lifting components

197‧‧‧Scissors

198‧‧‧ platform

200‧‧‧Roll track

202‧‧‧Roll assembly

204‧‧‧Roller

206‧‧‧ tongue

208‧‧‧ lifting device

210‧‧‧ valve

212‧‧‧ valve mouth block

214‧‧‧ gas passage

215‧‧‧Central Pipeline

220‧‧‧ heating device

230‧‧‧Upper tray

231‧‧‧solid separator

232‧‧‧Part divider

233‧‧‧ Filter

234‧‧‧ring edge

235‧‧‧main compartment

236‧‧‧Outer access compartment

237‧‧‧Central Core

238‧‧‧Central Channel

239‧‧‧nails

240‧‧‧Down tray

241‧‧‧solid separator

242‧‧‧Part dividers

244‧‧‧ring edge

245‧‧‧main compartment

246‧‧‧Outer channel compartment

247‧‧‧Central Core

249‧‧‧Pegs

400‧‧‧ precursor source container

402‧‧‧Base

404‧‧‧Seal

406‧‧‧ cover

408‧‧‧ recessed area

410‧‧‧ trench

412‧‧‧ upper surface

413‧‧‧Sliding surface

414‧‧‧ lower surface

416‧‧‧High tolerance zone

418‧‧‧Valve assembly

420‧‧‧ Entrance entrance

422‧‧‧ Export import

424‧‧‧ 嗝埠口口

426‧‧‧Interface components

428‧‧‧Snoring valve

430‧‧‧Snoring filter

432‧‧‧Snoring gas pipeline

434‧‧‧Filter equipment

436‧‧‧ Ontology

438‧‧‧Flange

440‧‧‧Contact surface

442‧‧‧ bottom surface

444‧‧‧ side surface

446‧‧‧ inner surface

448‧‧‧ Entrance recessed cushion

450‧‧‧Exit recessed mat

452‧‧‧ 嗝 嗝 嗝

454‧‧‧ channel

456‧‧‧Line section

458‧‧‧Arc section

460‧‧‧heating components

462‧‧‧ hole

464‧‧‧Precursor materials

466‧‧‧Exhaust line

468‧‧‧ internal volume

470‧‧‧ gas pipeline

T1‧‧‧ thickness

These and other aspects of the present invention will be apparent to those skilled in the art in the <RTIgt; Wherein: Figure 1 is a schematic illustration of a conventional precursor source assembly and reactor chamber assembly.

Figure 2 is a perspective view of a conventional solid precursor source container.

Figure 3 is an ideal plot of the chemical concentration of the desired source in the reactant gas pulse waves for atomic layer deposition and a lower than ideal plot.

Figure 4 is a schematic illustration of a conventional precursor source vessel and gas plate.

Figure 5 is a schematic illustration of a precursor source container having a surface mount valve and a gas plate.

Figure 6 is a schematic illustration of a precursor source container having a surface mount valve and a gas plate in intimate thermal contact with the container.

7 is a perspective view of a precursor source container, a gas interface assembly for fluid communication with the container, and an embodiment for connecting the container to the gas interface assembly and the separate quick connect assembly.

Figure 8 is an exploded perspective view of the container of Figure 7.

Figure 9 is a rear perspective view of the container of Figure 7.

Figure 10 is a rear cross-sectional view of the container of Figure 7.

Figure 11A is an exploded view of another embodiment of a precursor source container.

Figure 11B is a top perspective view of the cover for the precursor source container shown in Figure 1IA.

Figure 11C is a bottom perspective view of the cover shown in Figure 11B.

Figure 11D is a perspective view of an embodiment of a base for the precursor source container shown in Figure 11A.

Figure 11E is a top plan view of the base shown in Figure 11D.

Figure 11F is a cross-sectional view of the base shown in Figure 11E taken along section line A-A.

Figure 11G is a cross-sectional view of the base shown in Figure 11E taken along section line B-B.

Figure 11H is a cross-sectional view of another embodiment of a base for displaying the precursor source container of Figure 11A.

Figure 11I is a top plan view of still another embodiment of the base for the precursor source container shown in Figure 11A.

Figure 11J is an exploded perspective view of another embodiment of the source container.

Figure 12 is an exploded perspective view of an embodiment of a cassette insert including a stack of trays.

Figure 13 is a perspective view of an upper stacking tray of the cymbal insert of Figure 12;

Figure 14 is a top plan view of the upper stacking tray of Figure 13 .

15 is a perspective view of the lower stacking tray of the cymbal insert of FIG.

Figure 16 is a top plan view of the lower stacking tray of Figure 15 .

Figure 17 is a cross-sectional view of the filter attached to the lid of the precursor source container.

Figure 18 is an embodiment of a filter material that can be used in the filter of Figure 17.

Figure 19 is used to flow the carrier and reactant gases through a precursor source Schematic representation of a gas delivery system for a vessel and a vapor phase reaction chamber.

20 and 21 are front perspective views of the gas interface assembly of Fig. 7 shown connected.

22 is a front perspective view of the precursor source container and gas interface assembly of FIG. 7 with another embodiment of a quick connect assembly.

23 is a top perspective view of the gas interface assembly of FIG. 22, shown in connection.

Figure 24 is a bottom front perspective view of the gas interface assembly of Figure 22, shown separated.

Figure 25 is a schematic illustration of a gas delivery system for flowing a carrier and reactant gases through a precursor source vessel and a reaction chamber.

Figure 26 is a perspective view of a precursor source container having an exhaust valve.

Figure 27 is a perspective view of the container of Figure 26 coupled to the gas interface assembly of Figures 22-24.

Figure 28 is a cross-sectional view of the container of Figure 26 with additional dedicated heating means for the container.

100‧‧‧ precursor source container

102‧‧‧Quick connection components

104‧‧‧Ontology

106‧‧‧ cover

108‧‧‧Inlet valve

110‧‧‧Export valve

118‧‧‧ valve mouth block

120‧‧‧ valve mouth block

121‧‧‧ catheter

122‧‧‧Accessories

128‧‧‧孔口

131‧‧‧Accessories

133‧‧‧ gas pipeline

135‧‧‧Export

180‧‧‧ gas interface components

181‧‧‧上上

182‧‧‧ valve

184‧‧‧ purifier

186‧‧‧heating plate

188‧‧‧ valve mouth block

190‧‧‧Base

192‧‧‧ bracket

194‧‧‧ Track members

195‧‧‧ Lifting handle

196‧‧‧ Lifting components

198‧‧‧ platform

200‧‧‧Roll track

202‧‧‧Roll assembly

204‧‧‧Roller

Claims (25)

A precursor source container comprising: a lid having an upper surface including an inlet port, an outlet port and a snoring port; and a surface mounted inlet valve in fluid communication with the inlet port; a surface mounted outlet valve in fluid communication with the outlet port; a surface mounted snoring valve in fluid communication with the snoring port; and a base removably attached to the cover, the base having A recessed region formed therein, the recessed region including an inlet recessed pad, an outlet recessed pad, a snagging recessed pad, and a channel integrally formed in the base. The precursor source container of claim 1, wherein the passage fluidly connects the inlet recess pad, the outlet recess pad, and the snoring recess pad. The precursor source container of claim 2, wherein the channel comprises a plurality of linear segments. The precursor source container of claim 3, wherein at least two of the linear segments are adjacent and substantially parallel. The precursor source container of claim 2, wherein the channel comprises a plurality of curved segments. The precursor source container of claim 5, wherein at least two of the arcuate segments are adjacent and substantially concentric. For example, the precursor source container described in the first paragraph of the patent application, further A filter device is included that is coupled to a bottom surface of the lid. The precursor source container of claim 1, wherein the channel has a depth greater than a depth of any one of the inlet recess pad, an exit recess pad, and a snagging recess pad. The precursor source container of claim 1, further comprising a valve operatively coupled to each of the ports, wherein each of the inlet valve, the outlet valve, and the snoring valve are mounted and capped One of the upper surfaces is flush. The precursor source container of claim 1, wherein the channel is processed into the base. The precursor source container of claim 1, wherein the channel is a path. A precursor source container comprising: a base having a recessed area integrally formed therein, the recessed area comprising an inlet recessed pad, an outlet recessed pad, a snoring recessed pad, and a passage, the inlet a recessed pad, an outlet recessed pad, and a snoring recessed pad extending downwardly from a contact surface of the base; a cover removably attached to the base, the cover having an upper surface including an inlet opening, an outlet A mouthwash, and a dozen mouthpieces; and a snoring valve operatively attached to the lid, and wherein the snoring valve is operatively coupled to the snoring port. The precursor source container of claim 12, further comprising a sputum filter installed to be adjacent to the sluice opening One of the upper surfaces is flush. The precursor source container of claim 12, wherein the snoring port is directly fluidly connected to a snoring gas line, the snoring gas line bypassing a reaction chamber. A precursor source container comprising: a base having a bottom surface, a contact surface, a side surface extending between the contact surface and the bottom surface, and an inner surface extending from the contact surface to define a recessed area in the base, the recessed area comprising an inlet recessed pad, an outlet recessed pad, a snoring recessed pad, and a channel integrally formed in the base; a cover removably attached Attached to the base, the cover has an upper surface including an inlet opening, an outlet opening, and a smashing opening. The precursor source container of claim 15, wherein the cover comprises an upper surface, a lower surface, and a side surface extending between the upper surface and the lower surface, and wherein the cover is attached to In the base, the lower surface of the cover is in close proximity to the contact surface of the base. The precursor source container of claim 16, further comprising an internal volume defined between an inner surface of the base and a lower surface of the cover. The precursor source container of claim 15 wherein the recessed region provides a fluid path between the inlet port and the outlet port. The precursor source container of claim 18, wherein the inlet recess pad, the outlet recess pad, and the channel system are added Work in the base. The precursor source container of claim 19, wherein the channel comprises a plurality of linear segments. The precursor source container of claim 20, wherein at least two of the linear segments are adjacent and substantially parallel. The precursor source container of claim 19, wherein the channel comprises a plurality of curved segments. The precursor source container of claim 22, wherein at least two of the arcuate segments are adjacent and substantially concentric. The precursor source container of claim 15, further comprising a heating assembly disposed in the base. A precursor source container comprising: a cover having an upper surface, including a first opening, a second opening, and a third opening; and a base removably attached to The cover has a recessed area formed therein, the base comprising an inlet recessed pad, an outlet recessed pad, a snagging recessed pad, and a channel integrally formed in the base.