TWI506281B - Low impedance value of the probe module - Google Patents

Description

Low impedance probe module

The invention relates to a probe card; in particular to a probe module of low impedance value.

Press, many electronic products must go through multiple inspection procedures to ensure quality before leaving the factory. The power-on test of one of the test items is to verify whether the electrical connection between the various precision electronic components inside the electronic product is true and whether the function meets the acceptance specifications. The method for detecting the electrical connection between the precision electronic components of the electronic product is usually a probe card as a transmission interface between the test signal and the power signal between the detecting device and the electronic device to be tested.

However, the distance between the signal contact and the ground contact on the electronic product usually determines the distance between the probes of the probe card, so that the values of the micro-resistance, capacitance and inductance of the probe set are based on the connection. The distance of the points is fixed and presents a predetermined size. In other words, because there is usually a large distance between the contacts to avoid the occurrence of a short-circuit point, the probe and the probe are often separated by a large distance and have a small capacitance value. When the high-frequency signal is transmitted, a large reactance occurs, and the loss of the high-frequency signal transmission is increased, thereby increasing the difficulty of detecting the signal by the detecting device.

In view of the above, the object of the present invention is to provide a probe module which has the advantage of having a low impedance value, so that the loss of the signal passing through is small, so that the detecting device can more easily recognize the signal.

In order to achieve the above object, the present invention provides a low impedance value. The probe module is disposed between a detecting device and a device to be tested, and the detecting device has a signal terminal and a grounding terminal, and the electronic device to be tested has a signal contact and a ground contact . The probe module includes a substrate, a plurality of first conductors, a plurality of second conductors, a third conductor, a fourth conductor, a signal probe, and a grounding probe. The substrate has a signal line, a ground line, a first connection line and a second connection line; one end of the signal line is electrically connected to the signal terminal, and one end of the ground line is electrically connected to the ground terminal One end of the first conductor is electrically connected to the other end of the signal line; one end of the second conductor is electrically connected to the other end of the ground line; one end of the third conductor and one end of the first connecting line Electrically connected, the other end is electrically connected to the other end of the first conductor; one end of the fourth conductor is electrically connected to one end of the second connecting line, and the other end is electrically connected to the other end of the second conductor One end of the signal probe is electrically connected to the other end of the first connecting line, and the other end is used to touch the signal contact of the electronic device to be tested; the grounding probe has one end and the second connecting line One end is electrically connected, and the other end is used to touch the ground contact of the electronic device to be tested.

According to the above concept, in one embodiment, one of the first conductors is located between the ground probe and the third conductor, and one of the second conductors is located between the signal probe and the first Between the four conductors, the other first conductor and the second conductor are alternately disposed between the ground probe and the signal probe.

According to the above concept, in another embodiment, the first guiding systems are disposed around the grounding probe, and the second guiding systems are disposed around the signal probe.

Therefore, through the above design, the impedance value of the probe module can be effectively reduced, so that the loss when the signal passes is small.

10‧‧‧Substrate

12‧‧‧ Signal Line

121‧‧‧Contacts

14‧‧‧ Grounding circuit

141‧‧‧Contacts

16‧‧‧First connection line

161‧‧‧Contacts

18‧‧‧Second connection line

181‧‧‧Contacts

20‧‧‧ needle seat

22, 24‧‧‧ lead line

31‧‧‧First conductor

32‧‧‧Second conductor

33‧‧‧ Third conductor

34‧‧‧fourth conductor

S‧‧‧ signal probe

G‧‧‧ Grounding probe

100‧‧‧Detection device

110‧‧‧ Signal Terminal

120‧‧‧ Grounding terminal

200‧‧‧Electronic device to be tested

210‧‧‧Signal contacts

220‧‧‧ Grounding contacts

1 is a structural view of a probe module according to a first preferred embodiment of the present invention;

2 is a view showing the arrangement of a probe and a conductor in a second preferred embodiment of the present invention.

In order that the present invention may be more clearly described, the preferred embodiments are illustrated in the accompanying drawings. Referring to FIG. 1 , a low-impedance probe module of the first preferred embodiment of the present invention is disposed between a detecting device 100 and a device to be tested 200, and the detecting device 100 has a signal terminal 110 and a ground. The terminal 120 and the electronic device 200 to be tested have a signal contact 210 and a ground contact 220. The probe module comprises a substrate 10, a socket 20, three first conductors 31, three second conductors 32, a third conductor 33, a fourth conductor 34, a signal probe S and a grounding probe G. . The substrate 10 is a multilayer printed circuit board in the embodiment, and a signal line 12, a ground line 14, a first connection line 16, and a second connection line 18 are embedded. One end of the signal line 12 is formed with a contact on the top surface of the substrate 10 to be in contact with the signal terminal 110, and the other end is formed with a plurality of contacts 121 on the bottom surface of the substrate 10. One end of the grounding line 14 is formed with a contact at the top end of the substrate 10 to be in contact with the grounding terminal 120, and the other end is also formed with a plurality of contacts 141 on the bottom surface of the substrate 10. Both ends of the first connecting line 16 and the second connecting line 18 form a contact 161, 181 on the bottom surface of the base 10, respectively.

The needle holder 20 is disposed between the substrate 10 and the electronic device 200 to be tested, and has a plurality of perforations at the top end and the bottom end, respectively. In addition, a plurality of lead wires 22 and 24 are provided in the hub 20.

The first conductors 31 are disposed on the needle holder 20 and have one end Passing through the through hole at the top of the needle holder 20 to abut the contact 121 on the bottom surface of the substrate 10, and then electrically connected to the signal line 12, and the other end is connected to the conductive line 22 in the needle holder 20, so that The first conductors 31 are electrically connected in parallel with each other.

The second conductors 32 are disposed on the needle holder 20, and one end of the second conductor 32 passes through the through hole at the top end of the needle holder 20 to abut the contact point 141 of the bottom surface of the substrate 10, and is electrically connected to the grounding line 14. The other end is connected to the conductive line 24 in the hub 20 to be electrically connected to each other, so that the second conductors 32 are connected in parallel.

The third conductor 33 is disposed on the needle holder 20 , and one end passes through the through hole at the top end of the needle holder 20 to abut the contact 161 of the bottom surface of the substrate 10 , and is electrically connected to the first connection line 16 . The other end of the third conductor 33 is connected to the conductive line 22 in the hub 20, and is electrically connected to the other end of the first conductor 31.

The fourth conductor 34 is disposed on the needle holder 20 , and one end passes through the through hole at the top end of the needle holder 20 to abut the contact 181 on the bottom surface of the substrate 10 , and is electrically connected to the second connection line 18 . The other end of the fourth conductor 34 is connected to the guiding line 24 in the hub 20, and is electrically connected to the other end of the second conductor 32.

The signal probe S is disposed on the needle holder 20, and one end passes through the through hole at the top end of the needle holder 20 to abut the contact 161 of the bottom surface of the substrate 10, and is electrically connected to the first connection line 16. In addition, the other end of the signal probe S passes through the through hole at the bottom end of the needle holder 20 to touch the signal contact 210 of the electronic device 200 to be tested.

The grounding probe G is disposed on the needle holder 20, and one end passes through the through hole at the top end of the needle holder 20 to abut the contact 181 on the bottom surface of the substrate 10, and is electrically connected to the second connection line 18. In addition, the other end of the grounding probe G passes through the through hole at the bottom end of the needle holder 20 to touch the electronic device to be tested. Place 200 ground contact 220.

In addition, in addition to the above electrical connection relationship, the positional relationship between the conductors and the probes is as follows:

1. One of the first conductors 31 is located between the grounding probe G and the third conductor 33.

2. One of the second conductors 32 is located between the signal probe S and the fourth conductor 34.

3. The other first conductor 31 and the second conductor 32 are alternately disposed between the ground probe G and the signal probe S.

4. The grounding probe G is located between the two first conductors 31.

5. The signal probe S is located between two of the second conductors 32.

Thereby, after the signal is output from the signal terminal 110 of the detecting device 100, the signal flows through the signal line 12 and the first conductors 31, and then flows from the third conductor 33 to the first connecting line 16, and finally The signal probe S is transmitted to the signal contact 210 of the electronic device 200 to be tested. Then, the signal flows out from the ground contact 220 of the electronic device 200 to be tested, passes through the grounding probe G, flows through the second connecting line 18 and the fourth conductor 34, and passes through the second conductor 32. The ground line 14 is returned to the ground terminal 120 of the detecting device 100, so that the signal path forms a loop for the purpose of detection.

In addition, through the above-mentioned structure and electrical connection design, when the signal is transmitted, the signal directions of the conductors 31-34 and the probes S and G are different from the signal directions of the adjacent conductors 31-34. The electromagnetic conduction direction of the original preset is not changed, and the distance between the probes S and G and the conductors 31 to 34 of the different flow directions is different from the distance between the conventional probes, so that the capacitance is increased, thereby reducing the high frequency transmission. , the equivalent reactance value of the signal line. In addition, by designing the first conductors 31 and the second conductors 32 in parallel, the equivalent resistance value of the signal path can be further reduced. In this way, the design is achieved through the aforementioned design. The purpose of the low overall impedance value is to reduce the loss of the signal passing, so that the signal can maintain the original waveform, so that the detecting device 100 can more easily recognize whether the received test signal is normal.

In addition, the arrangement of the conductors 31-34 and the probes S and G of the present invention may be the same as the second preferred embodiment shown in FIG. 2, except that the above-mentioned lateral staggered arrangement is used to achieve the purpose of reducing the impedance value. The first conductors 31 are disposed around the grounding probe G and connected in parallel with each other, and the second conductors 32 are disposed around the signal probes S and are also connected in parallel with each other, and one of the first conductors 31 is also located in the grounding probe. Between the pin G and the third conductor 33, and a second conductor 32 is also located between the signal probe S and the fourth conductor 34. In this way, when the first conductor 31, the fourth conductor 34 and the signal probe S are sent to the electronic device 200 to be tested, the second conductor 32 and the third conductor 33 are When the grounding probe G transmits the signal in the direction of the detecting device 100, the signal direction is also equivalent to the originally preset electrical conduction direction, and at the same time, the purpose of reducing the equivalent impedance value of the signal line can be achieved.

Furthermore, the above description is only for the preferred embodiments of the present invention, and equivalent changes to the scope of the present invention and the scope of the claims are intended to be included in the scope of the present invention.

10‧‧‧Substrate

12‧‧‧ Signal Line

121‧‧‧Contacts

14‧‧‧ Grounding circuit

141‧‧‧Contacts

16‧‧‧First connection line

161‧‧‧Contacts

18‧‧‧Second connection line

181‧‧‧Contacts

20‧‧‧ needle seat

22, 24‧‧‧ lead line

31‧‧‧First conductor

32‧‧‧Second conductor

33‧‧‧ Third conductor

34‧‧‧fourth conductor

S‧‧‧ signal probe

G‧‧‧ Grounding probe

100‧‧‧Detection device

110‧‧‧ Signal Terminal

120‧‧‧ Grounding terminal

200‧‧‧Electronic device to be tested

210‧‧‧Signal contacts

220‧‧‧ Grounding contacts

Claims (9)

A low-impedance probe module is disposed between a detecting device and a device to be tested, and the detecting device has a signal terminal and a grounding terminal, and the electronic device to be tested has a signal connection a probe and a ground contact; the probe module includes: a substrate having a signal line, a ground line, a first connection line, and a second connection line; one end of the signal line is electrically connected to the signal terminal And one end of the grounding line is electrically connected to the grounding terminal; one end of the plurality of first conductors is electrically connected to the other end of the signal line at the same time; and one end of the plurality of second conductors is electrically connected to the other end of the grounding line at the same time. a third conductor, one end of which is electrically connected to one end of the first connecting line, and the other end is electrically connected to the other end of the first conductor; a fourth conductor, one end thereof and the second connecting line One end is electrically connected, and the other end is electrically connected to the other end of the second conductor; a signal probe has one end electrically connected to the other end of the first connecting line, and the other end is used for the point Signal contact of the electronic device under test; and a ground probe, having one end connected to the other end electrically connected to the second line, and the other end to touch the ground contact of the electronic device under test. The low-impedance probe module of claim 1, wherein one of the first conductors is located between the ground probe and the third conductor, and one of the second conductors is located Between the signal probe and the fourth conductor, and The other first conductor and the second conductor are alternately disposed between the ground probe and the signal probe. The low-impedance probe module of claim 2, wherein the ground probe is located between two of the first conductors. The low-impedance probe module of claim 2, wherein the signal probe is located between two of the second conductors. The low-impedance probe module of claim 1, wherein the number of the first conductors is equal to the number of the second conductors. The low-impedance probe module of claim 1, wherein the first guiding system is disposed around the grounding probe. The low-impedance probe module of claim 1, wherein the second guiding system is disposed around the signal probe. The low-impedance probe module of claim 1 further includes a pin holder disposed between the substrate and the electronic device to be tested, and the conductors and the probe are disposed on the hub. The probe module of the low impedance value according to claim 8, wherein the needle holder further has a plurality of guiding lines for electrically connecting the first probes to the third probes and the second The probe is electrically connected to the fourth probe.