TWI506273B - Electronic unit testing jig and testing method - Google Patents

Description

Electronic component test fixture and test method

The invention relates to a test fixture and a test method, in particular to an electronic component test fixture and a test method for testing the anti-heating requirement of an electronic component.

While continually pursuing the speed or power of electronic components, electronic components (such as central processing units (CPUs) or graphics processing units (GPUs)) are also generating more and more heat due to their powerful computing performance. When an electronic component causes its own temperature to rise due to the heat generated, it often causes irreparable damage to the electronic component. Therefore, it is necessary to find a way to reduce the temperature of the electronic component during operation.

Therefore, after designing electronic components, and before shipping, manufacturers usually test the anti-heating requirements of electronic components, and configure different thermal modules on the electronic components according to different anti-heating requirements to meet the electronic products of different specifications. Usage requirements. In general, the test method for the anti-heating demand is usually to install a fan-type radiator or a heat sink directly above the electronic components, so as to test the heat-dissipating requirements of the electronic components in different heat-dissipating modes. , but this will cause inconvenient operation. Specifically, when testing the heat dissipation requirement of the electronic component, a thermal grease is applied between the electronic component and the fan-type heat sink, and then the electronic component is tested for overheating, and then the fan-type heat sink is removed. Then, the thermal grease on the electronic component is scraped off, and in order to make the fin-type heat sink connected to the test have good thermal conductivity between the electronic components, the thermal grease must be recoated on the electronic component, and then the fin type is applied. The heat sink is attached to one side of the electronic component coated with the thermal grease, and then the electronic component is tested for overheating.

Therefore, since it is necessary to replace the fan-type heat sink and the fin-type heat sink in the test process, it is necessary to have a process of scraping off the heat-dissipating paste, and this scraping action may also damage the structure of the electronic component. Resulting in incorrect test results and the presence of electronic components The risk of irrecoverable damage.

In view of the above problems, the present invention provides an electronic component test fixture and a test method thereof, thereby solving the problem that the test result of the heat dissipation requirement of the electronic component is incorrect due to one more scraping of the thermal grease paste process, and that the test result must be frequent during the test. The fan-type heat sink and the fin-type heat sink are replaced, and the process of scraping and applying the heat-dissipating paste must be repeatedly applied to the electronic components during the test, which leads to laborious and time-consuming problems in the entire test process.

The electronic component testing fixture of the invention is suitable for testing the anti-heating requirement of an electronic component in different heat dissipation modes, and the electronic component testing fixture comprises: a heat sink, disposed on the electronic component; a heat sink; and a fan, wherein The heat sink and the fan are detachably disposed on the heat sink. The heat sink is disposed on the heat sink in a first heat dissipation mode, and forms a first heat dissipation module with the heat sink, and the fan is disposed in a second heat dissipation mode. And on the heat sink, and forming a second heat dissipation module with the heat sink.

In the electronic component test fixture of the present invention, the heat dissipation efficiency of the second heat dissipation module is different from the heat dissipation efficiency of the first heat dissipation module.

The electronic component test fixture of the present invention may further include a lock firmware. The locker connects the heat sink and the heat sink to form the first heat dissipation module in the first heat dissipation mode, and connects the heat sink and the fan in the second heat dissipation mode. Forming a second heat dissipation module.

In the electronic component test fixture of the present invention, the heat sink may further have a first mating portion, and the heat sink has a second mating portion corresponding to the first mating portion, and the first mating portion and the second mating portion are coupled to each other. To form a first heat dissipation module.

Preferably, in the electronic component test fixture of the present invention, the heat sink and the heat sink are made of the same material. Preferably, the heat sink and the heat sink are made of copper or aluminum.

The electronic component testing method of the present invention comprises the steps of: providing a heat sink on an electronic component; and providing a first heat dissipation mode or a second heat dissipation mode to test the heat dissipation requirement of the electronic component, wherein, in the first heat dissipation mode A heat sink is disposed on the heat sink to form a first heat dissipation module, and the heat dissipation requirement of the electronic component is tested according to the heat dissipation performance of the first heat dissipation module; and a fan is disposed on the heat sink in the second heat dissipation mode, To form a second heat dissipation module, and to test the heat dissipation requirement of the electronic component according to the heat dissipation performance of the second heat dissipation module.

In the electronic component testing method of the present invention, a heat sink is disposed on the electronic component Before the step, the step of coating a heat dissipating paste on the heat sink and/or the electronic component may be further included.

In the electronic component testing method of the present invention, in the step of providing the first heat dissipation mode or the second heat dissipation mode, the first heat dissipation mode and the second heat dissipation mode may be sequentially provided.

The function of the electronic component test fixture and the test method of the present invention is that the heat sink is always disposed on the electronic component, and the heat sink and the fan are detachably disposed on the heat sink, and the heat sink and the heat sink are combined to form a heat sink. The first heat dissipation module is used as a fin type heat sink; and the fan and the heat sink are combined to form a second heat dissipation module to be used as a fan type heat sink, and therefore, it is not necessary to repeat the test of the heat dissipation requirement of the electronic component. Applying and removing the thermal grease between the heat sink and the electronic component, thereby reducing or even eliminating the problems of the prior art described above.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

100‧‧‧Electronic components

200‧‧‧ Heat sink

210‧‧‧Second Matching Department

300‧‧‧ radiator

310‧‧‧First Matching Department

400‧‧‧fan

500‧‧‧Locker

600, 610, 620‧ ‧ steps

Fig. 1a is an exploded view of the electronic component test fixture of the first embodiment of the present invention in a first heat dissipation mode.

FIG. 1b is a schematic view showing the combination of the electronic component test fixture of the first embodiment of the present invention in the first heat dissipation mode.

Fig. 2a is an exploded view of the electronic component test fixture of the first embodiment of the present invention in the second heat dissipation mode.

FIG. 2b is a schematic diagram showing the combination of the electronic component test fixture of the first embodiment of the present invention in the second heat dissipation mode.

Fig. 3a is an exploded view of the electronic component test fixture of the second embodiment of the present invention in the first heat dissipation mode.

FIG. 3b is a schematic diagram of the combination of the electronic component test fixture of the second embodiment of the present invention in the first heat dissipation mode.

Figure 4 is a flow chart showing the steps of the electronic component testing method of the present invention.

Please refer to the exploded view of the electronic component test fixture of the first embodiment of the present invention shown in FIG. 1a in the first heat dissipation mode; and the electronic component test fixture of the first embodiment of the present invention shown in FIG. 1b. A schematic diagram of a combination in a heat dissipation mode; an exploded view of the electronic component test fixture of the first embodiment of the present invention shown in FIG. 2a in a second heat dissipation mode; and a first embodiment of the present invention shown in FIG. 2b A schematic diagram of the combination of the electronic component test fixture in the second heat dissipation mode. In the electronic component test fixture of the first embodiment of the present invention, the heat dissipation requirement of an electronic component 100 is tested in different heat dissipation modes, such as a central processing unit, a micro processing unit, a graphics processor, or other heating components. The electronic component test fixture includes a heat sink 200, a heat sink 300, and a fan 400. The heat sink 200 is disposed on the electronic component 100 and has a plurality of heat sink fins, and the heat sink 300 The fan 400 is detachably disposed on the heat sink 200, respectively. The heat sink 300 also has a plurality of heat dissipating fins, and is disposed on the heat sink 200 in the first heat dissipation mode, thereby forming a first heat dissipation module with the heat sink 200 to simulate a heat dissipation mode of the single fin type heat sink; The fan 400 is disposed on the heat sink 200 in the second heat dissipation mode, and forms a second heat dissipation module with the heat sink 200 to form a heat dissipation mode of the fan type heat sink.

In other words, the electronic component test fixture of the present invention utilizes a configuration in which the heat sink 300 and the fan 200 are alternately replaceable, and provides the electronic component 100 to test its anti-heating demand in different heat dissipation modes. Generally, the first heat dissipation module and the second heat dissipation module The heat dissipation efficiency of the heat dissipation module is different. For example, the first heat dissipation module is configured to cooperate with the heat sink 300, and the second heat dissipation module is configured to cooperate with the heat sink 200 and the fan 400. The way to provide heat dissipation is therefore better than the heat sink 300. Therefore, for some high-order electronic products, since the electronic component 100 of the internal configuration must have a high operational efficiency, relatively high heat is generated, and at this time, the electronic component 100 can only transmit heat through the second heat dissipation module. The mode begins with enough antipyretic demand. In contrast, for some low-order electronic products, due to the low operational efficiency of the electronic component 100, in this case, it is possible to adopt the heat dissipation mode of the fin-type heat sink to meet the heat-dissipation requirement of the electronic component 100.

Therefore, after the test is completed, whether the heat dissipation performance of the first heat dissipation module and the second heat dissipation module meets the heat dissipation requirement of the electronic component 100 can be judged to be suitable for the fan type in the high-order electronic products and the low-order electronic products. Use with a heat sink or finned heat sink.

Wherein, the electronic component test fixture of the present invention is characterized in that the heat sink 200 of the electronic component test fixture is always attached to the electronic component regardless of whether the electronic component is subjected to the heat release requirement test in the first heat dissipation mode or the second heat dissipation mode. 100, so only a thermal grease coating operation between the heat sink 200 and the electronic component 100 is performed during the entire test, and then the heat sink 300 or the fan 400 is replaced on the heat sink 200. The anti-heating requirements of different heat dissipation modes are tested, so there is no need to repeatedly scrape and apply the thermal grease as in the prior art.

In addition, as shown in FIGS. 1a to 2b, the heat sink 300 and the fan 400 may be connected to the heat sink 200 through a fastener 500 such as a screw, a bolt or a bolt to form a first heat dissipation module and a second heat dissipation, respectively. Module. However, the connection between the heat sink 200 and the heat sink 300 or the fan 400 described herein may be replaced by mutual hooking, concave-convex fitting or the like. For example, please refer to the invention shown in FIG. 3a. The exploded view of the electronic component test fixture of the second embodiment in the first heat dissipation mode; and the combination of the electronic component test fixture of the second embodiment of the present invention shown in FIG. 3b in the first heat dissipation mode. The heat sink 300 has a first mating portion 310, and the heat sink 200 has a second mating portion 210 corresponding to the first mating portion 310, and the first mating portion 310 and the second mating portion 210 are coupled to each other to form a first The first mating portion 310 formed on the lower side of the heat sink 300 may be a bump, and the second mating portion 210 on the heat sink 200 may be formed between two adjacent fins. The groove allows the first fitting portion 310 of the heat sink 300 to be fitted into the second fitting portion 210 on the upper side of the heat sink 200 in a concave-convex manner.

It is to be noted that the above-mentioned combination is by way of example and not limitation, as long as it is replaced and transferred by a similar element, it should fall within the scope of the patent application of the present invention. For example, the heat sink 300 can also directly fit into the second mating portion 210 of the heat sink 200 by using the heat dissipating fins of the heat sink 300 as the first mating portion 310.

Preferably, the heat sink 200 is the same material as the heat sink 300. For example, a material of copper or aluminum may be used. The reason is that a single fin type heat sink provided by an electronic component after shipment is usually made of the same material, and in the electronic component test fixture of the present invention, in the first heat dissipation mode, the heat sink If the 200 and the heat sink 300 are made of the same material, they can be regarded as one material and have good thermal conductivity between the two, so that the heat dissipation effect of the first heat dissipation module formed by the combination of the heat sink 200 and the heat sink 300 can be similar to that. Electronic components after the goods 100 sets of single fin type heat sink cooling effect to improve the accuracy of test results.

Further, please refer to the flow chart of the steps of the electronic component testing method of the present invention shown in FIG. The invention further provides an electronic component testing method, in which step 610 is to provide a heat sink on an electronic component, and step 620 is to provide a first heat dissipation mode or a second heat dissipation mode to test the heat dissipation requirement of the electronic component, wherein a heat sink is disposed on the heat sink to form a first heat dissipation module, and the heat dissipation requirement of the electronic component is tested according to the heat dissipation performance of the first heat dissipation module; and a fan is disposed in the second heat dissipation mode. And forming a second heat dissipation module on the heat sink, and testing the heat dissipation requirement of the electronic component according to the heat dissipation performance of the second heat dissipation module. In the step 620 of providing the first heat dissipation mode or the second heat dissipation mode, the first heat dissipation mode and the second heat dissipation mode may be sequentially provided, or the second heat dissipation mode and the first heat dissipation mode may be sequentially provided, that is, the test The first or second heat dissipation mode may be used to test the heat dissipation requirement of the electronic component according to experience or demand, and then another heat dissipation mode is tested.

Preferably, before step 610, a step 600 of applying a thermal grease to the heat sink and/or the electronic component is further performed to increase the heat dissipation effect.

The electronic component test fixture and the test method of the present invention are not limited to the types disclosed in the embodiment. Those skilled in the art can change the electronic component test of the present invention according to actual design requirements or usage requirements. Fixtures and test methods.

The electronic component test fixture and the test method of the present invention are mainly configured by using a heat sink fixed to the electronic component, and the heat sink and the fan can be alternately arranged on the heat sink to form different heat dissipation modules, thereby providing different heat dissipation. The mode tests the anti-heating requirements of the electronic components, so the process of repeatedly scraping and applying the thermal grease on the heat sink and/or the electronic components is omitted during the test, thereby avoiding the problems in the prior art.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

100‧‧‧Electronic components

200‧‧‧ Heat sink

300‧‧‧ radiator

500‧‧‧Locker

Claims (10)

An electronic component test fixture suitable for testing the heat dissipation requirement of an electronic component in different heat dissipation modes, the electronic component test fixture includes: a heat sink disposed on the electronic component; and a heat sink detachably disposed on The heat sink is disposed on the heat sink, and the heat sink is disposed on the heat sink in a first heat dissipation mode, and forms a first heat dissipation module with the heat sink. The fan is disposed on the heat sink in a second heat dissipation mode, and forms a second heat dissipation module with the heat sink. The electronic component test fixture of claim 1, wherein the second heat dissipation module and the first heat dissipation module have different heat dissipation efficiencies. The electronic component test fixture of claim 1, further comprising a lock firmware, wherein the lock connects the heat sink and the heat sink to form the first heat dissipation module in the first heat dissipation mode, and The heat sink and the fan are connected to form the second heat dissipation module in the second heat dissipation mode. The electronic component test fixture of claim 1, wherein the heat sink has a first mating portion, and the heat sink has a second mating portion corresponding to the first mating portion, and the first mating portion and The second mating portions are coupled to each other to form the first heat dissipation module. The electronic component test fixture of claim 1, wherein the heat sink and the heat sink are made of the same material. The electronic component test fixture of claim 5, wherein the heat sink and the heat sink are made of copper or aluminum. An electronic component testing method includes the steps of: disposing a heat sink on an electronic component; and providing a first heat dissipation mode or a second heat dissipation mode to test a heat dissipation requirement of the electronic component, wherein, in the first heat dissipation mode a heat sink is disposed on the heat sink to form a first heat dissipation module, and the heat dissipation requirement of the electronic component is tested according to the heat dissipation performance of the first heat dissipation module; and a fan is disposed in the second heat dissipation mode. The heat sink is configured to form a second heat dissipation module, and the heat dissipation requirement of the electronic component is tested according to the heat dissipation performance of the second heat dissipation module. The electronic component testing method of claim 7, wherein the step of disposing the heat sink on the electronic component further comprises the step of applying a thermal grease to the heat sink and/or the electronic component. The electronic component testing method of claim 7, wherein the step of providing the first heat dissipation mode or the second heat dissipation mode sequentially provides the first heat dissipation mode and the second heat dissipation mode. The electronic component testing method of claim 7, wherein the step of providing the first heat dissipation mode or the second heat dissipation mode sequentially provides the second heat dissipation mode and the first heat dissipation mode.