TWI497653B - Insert for semiconductor package - Google Patents

Description

Semiconductor package plug-in [related application]

The present application claims priority to Korean Patent Application No. 10-2011-0052, filed on Jun. 1, 2011, the entire disclosure of which is hereby incorporated by reference.

The present invention relates to an insert for a semiconductor package, and more particularly to an insert for a semiconductor package that does not require an individual push unit.

In general, semiconductor packages must be tested for compliance with predetermined conditions in high temperature, high voltage, and low temperature environments. That is, the semiconductor package must be electrically tested to determine if it is defective or not. Further, the semiconductor package is supplied to the package for semiconductor package by using a vacuum absorption picker which is a transfer unit, so that the package for semiconductor package is tested. When the semiconductor package is provided for the semiconductor package, the semiconductor package insert allows the semiconductor package to be moved so that the terminal of the semiconductor package electrically contacts the pogo pin or the anisotropic conductive of the test socket. The conductor of sheet).

Further, the propulsion unit is a mechanism for propelling the semiconductor package to the semiconductor package by using a pusher to prevent the semiconductor package from being moved while the electrical test of the semiconductor package is being performed. 1 to 5 are schematic views showing the overall structure of a plug-in for a semiconductor package and a schematic diagram of a propulsion unit in the prior art.

1 to 4 show an insert 10 for a semiconductor package and an insert 10 The semiconductor package 30, while FIG. 5 shows the propulsion unit 40 and the insert 10.

In detail, the insert 10 illustrated in FIGS. 1 to 4 includes an insert body including a guide hole 12 , a guide post 41 , and a package receiving groove 11 . The guide holes 12 are formed on both end faces of the insert body. The guide post 41 in the propulsion unit 40 is as shown in FIG. The package receiving groove 11 is formed at the center of the plug body into which the semiconductor package 30 is inserted. The latch 13 is disposed in the inner wall of the package receiving receiving slot 11 for clamping the semiconductor package 30 from the package receiving slot 11 , and the protruding collar (not shown) is disposed on the package receiving slot 11 . The top surface of the two inner walls is used to activate the latch 13.

In addition, the opening cover 20 is mounted on the top surface of the insert 10 for pushing the collar (not shown) and opening the latch 13. Side guides (not shown) are formed on the edge of the bottom of the package receiving slot 11, which facilitates positioning and guiding the semiconductor package 30 for mounting the semiconductor package 30 in the correct position.

The propulsion unit 40 that propels the semiconductor package 30 includes a guide post 41 and a pusher 42 that is formed at both ends of the propulsion unit 40 in a downward direction toward the propulsion unit 40. When the guide post 41 is raised above the insert 10, it guides the position of the advancement unit 40. The pusher 42 is formed at the center of the bottom of the propulsion unit 40, and the propulsion semiconductor package 30 is placed on the insert 10.

In the plug-in 10 according to the prior art, when the semiconductor package 30 is vacuum-adsorbed by a vacuum adsorption receiver (not shown) inserted into the package receiving slot 11, the semiconductor package 30 and the cover 20 are pushed to push the collar (not shown). When the collar (not shown) slides down in the downward direction and allows the latch 13 to be pressed against the spring to be opened. In this case, the semiconductor package 30 is mounted on the bottom of the package receiving groove 11 by guiding by a side guide (not shown).

When the force applied to the opening cover 20 is released, the collar (not shown) rises. In this case, both ends of the semiconductor package 30 are embedded because the latch 13 is quickly returned to its original position due to the pulling force of the spring 14. Even if vibration from the outside is applied to the semiconductor package 30 being moved, the semiconductor package 30 is not detached from the package receiving groove 11 for testing.

Further, when the opening cover 20 is pressurized after the test of the semiconductor package 30 is completed, the latch 13 is pressed against the spring 14, and the opening cover 20 is pushed out and opened, causing the semiconductor package 30 to be detached from the latch 13.

In addition, the pusher 42 of the propulsion unit 40 is raised from the insert 10, and the semiconductor package 30 is pushed onto the package receiving groove 11 of the insert 10 by the guide post 41 guided by the guide hole 12. The semiconductor package 30 is moved when the test is performed.

According to the prior art, the package for semiconductor package has the following problems: First, in the plug-in according to the prior art, since the latch only contacts the upper edge of the semiconductor package for fixing the semiconductor package, when the semiconductor package is moved to the test socket The semiconductor package can be detached from the latch.

That is, when the latch is fixed to the insert body in a hinged manner, and only rotates and is pressed against the edge of the semiconductor package, the insert according to the prior art is fixed to fix the semiconductor package. When the latch is only applied to the edge of the semiconductor package for securing the semiconductor package, and the semiconductor package is moved while being housed in the latch, the semiconductor package can be disengaged from the latch, however this is not desirable.

Second, in the plug-in of the prior art, only the edge of the semiconductor package is pressed to fix the semiconductor package. Mounted in a test socket in a semiconductor package Thereafter, a pusher is utilized to allow the semiconductor package to be in firm contact with the telescopic probe. The thrusters must be individually fabricated according to the size of the semiconductor package to apply pressure to the overall surface of the semiconductor.

However, due to the size of the semiconductor package, the pusher must be fabricated separately. That is, inconvenient operations must be performed, such as making individual thrusters suitable for semiconductor packages, and replacing thrusters suitable for such semiconductor packages.

The present invention provides an insert for a semiconductor package which can be firmly fixed by covering a central portion of the package body of the package body to the semiconductor package, wherein the push unit can be used regardless of the size of the semiconductor package.

According to an aspect of the present invention, an insert for a semiconductor package includes: an insert body including a package receiving opening, the package receiving opening being formed at a center of the insert body and extending in a vertical direction to make the semiconductor package vertically The package is inserted into the package receiving opening; a package fixing body is pulled out from the inner walls of the package receiving opening or inserted into the inner walls of the package receiving opening to open or close the package receiving opening, and when the semiconductor package is inserted into the package When the opening is received, at least a part of the package receiving opening is closed to prevent the semiconductor package from being detached from the package receiving opening; and an elastic supporting member elastically supports the package fixing body to close the package fixing body toward the package fixing body Moving in one direction of the opening; an opening cover, located on the insert body, movable along a direction in which the opening cover is close to or away from the insert body; and an opening member, when the opening cover is close to the insert body, the opening member contacts the opening cover and rotates Removing the access force of the cover to the package fixing body, and allowing the package fixing body of the package receiving opening to be elastically supported by the elastic supporting member to be moved to open the package receiving opening, wherein a bottom surface of the package fixing body is completely Or almost completely covering a top surface of the semiconductor package to prevent the package fixing body from being detached from the package receiving opening.

The package fixing body described above can completely close the package receiving opening.

The above-mentioned package fixing body can be pulled out from the package receiving opening to cover the center of the top surface of a part of the semiconductor package after passing through the edge of the top surface of the semiconductor package.

The material having high thermal conductivity is disposed on the bottom surface of the package fixing body, and allows external heat contacting the bottom surface of the package fixing body to be uniformly conducted to the package fixing body.

The above material having high thermal conductivity may be metal and plated and bonded to the bottom surface of the package fixing body.

A pair of package fixing bodies are disposed, the end faces of each package fixing body can be slid to the center of the top surface of the semiconductor package, and the package fixing body is inserted into the package receiving opening.

A pair of package fixing bodies are disposed, and the elastic support members contact the opposite end ends of each package fixing body.

The elastic support member described above may include a helical compression spring.

According to another aspect of the present invention, an insert for a semiconductor package is provided, comprising: a plug body including a package receiving opening, the package receiving opening being formed at a center of the plug body and extending in a vertical direction to make a semiconductor package face vertically The direction is inserted into the package receiving opening; a package fixing body is self-packaging The two inner walls of the port are pulled out or inserted into the inner walls of the package receiving opening to open or close the package receiving opening, and when the semiconductor package is inserted into the package receiving opening, at least part of the package receiving opening is closed to prevent The semiconductor package is detached from the package receiving opening; and an elastic supporting member elastically supports the package fixing body to move the package fixing body in a direction to close the package receiving opening of the package fixing body, wherein a pair of package fixing bodies are disposed, The facing end of the package holder can be slid to the center of a top surface of the semiconductor package inserted into the package receiving opening.

The above and other features and advantages of the present invention are apparent from the following description of the accompanying drawings.

The present invention will be described in more detail with reference to the accompanying drawings.

The term "on" as used herein refers to a state in which the package holder opens the package receiving slot for the semiconductor package to be received in the package receiving slot. As used herein, the term "closed" means that the package holder closes the package receiving slot to prevent a state in which the semiconductor package inserted into the package receiving slot is removed from the package receiving slot. The term "closed" does not necessarily refer to a state in which the package holder completely closes the package fixing groove, and may also be a portion of the package receiving groove for preventing the inserted semiconductor package from being detached from the package receiving groove.

6 is a partial cross-sectional view of an insert for a semiconductor package in accordance with an embodiment of the present invention.

According to the current embodiment of the present invention, the semiconductor package insert 100 includes the plug body 110, the package fixing body 120, the elastic support member 130, and the opening Cover 140 and opening member 150

The package body 110 includes a package receiving opening 111 formed at a center of the card body 110 and extending in a vertical direction so that the semiconductor package 160 movable in the vertical direction can be inserted into the package receiving opening 111. The plug body 111 further includes a moving space 112 and a supporting wall 113. The package fixing body 120 is slidable in the moving space 112. The elastic support member 130 may be supported on the support wall 113. The insert body 111 supports a pair of guiding posts 126 that support the package fixing body 120 to slide.

The inserted semiconductor package 160 is placed on the insert body 110, and the package container 114 is coupled to the insert body 110 for attaching or detaching the insert body 110. The package container 114 can include a terminal that electrically connects the test socket to the semiconductor package 160.

The package fixing body 120 is pulled out from the inner walls of the package receiving opening 111 or inserted into the inner walls of the package receiving opening 111 to open or close the package receiving opening 111. The bottom surface of the package fixing body 120 covers the top surface of the semiconductor package 160 to prevent the semiconductor package 160 from being detached from the package receiving opening 111.

The package fixing body 120 is mounted to be slidable in a horizontal direction.

When the semiconductor package 160 is guided by a vacuum suction mechanism or a similar mechanism located on the package receiving opening 111, the package fixing body 120 opens the package receiving opening 111 for inserting the semiconductor package 160 into the package receiving opening 111. When the semiconductor package 160 is inserted into the package receiving opening 111, the package fixing body 120 closes the package receiving opening 111 to prevent the semiconductor package 160 from being detached from the package receiving opening 111.

The package fixing body 120 includes a facing end 121 that can be inserted into the package receiving opening 111. The inclined portion 122 extends from the facing end 121 and has a second inclined surface 122a, and as it approaches the horizontal direction, the height of its tip increases. A pair of side walls 123 extend from the facing end 121, traversing the second inclined surface 122a and surrounding the second inclined surface 122a.

The material 121a having high thermal conductivity is disposed on the bottom surface facing the end 121, which can contact the top surface of the semiconductor package 160. The material 121a may be metal and is plated and bonded to the bottom surface of the package fixing body 120. However, the present invention is not limited thereto, and a metal thin plate may be additionally attached to the bottom surface of the package fixing body 120, and may be combined therewith.

The metal thin plate is formed of a material 121a having high thermal conductivity and contacts the bottom surface of the package fixing body 120. When the semiconductor package 160 contacts the package fixing body 120, the metal thin plate allows external heat to be uniformly conducted to the package fixing body 120.

The second inclined surface 122a may contact the first inclined surface 152 of the opening member 150 and have an outer shape corresponding to the first inclined surface 152.

In addition, the pair of guiding posts 126 for supporting the package fixing body 120 to be slid are mounted on the groove portion 124 formed on the outer surface of the package fixing body 120. The groove portion 124 extends from the facing end 121 in the horizontal direction to the other end of the package fixing body 120.

The receiving groove 125 is formed at the other end of the package fixing body 120, and one end of the elastic supporting member 130 is located at the receiving groove 125.

A pair of package fixing bodies 120 are disposed on the insert body 110 for facing the respective facing ends 121 of the package fixing body 120 to face each other. In detail, the partial package fixing body 110 can be inserted into the moving space 112 of the plug body 110.

The package fixing body 120 is mounted such that its facing end 121 can be slid to the center of the top surface of the semiconductor package 160 inserted into the package receiving opening 111, Each package fixing body 120 can completely close the package receiving opening 111. When each package fixing body 120 completely closes the package receiving opening 111, the top surface of the semiconductor package 160 is completely covered by the package fixing body 120. Therefore, the semiconductor package 160 can be positioned.

However, the invention is not limited thereto. One of the package fixing bodies 120 can be pulled out from the package receiving opening 111 to cover the center of the top surface of the portion of the semiconductor package 160 after passing through the edge of the top surface of the semiconductor package 160.

The elastic support member 130 elastically supports the package fixing body 120 such that the package fixing body 120 can move toward the package receiving opening 111. In detail, the elastic support member 130 elastically supports the package fixing body 120 for applying a resilient bias to the pair of package fixing bodies 120 in a direction in which they are close to each other.

The elastic support member 130 may be a helical compression spring having one end that contacts the other end of the package fixing body 120, and the other end of the elastic support member 130 contacts the inner wall of the insert body 110. However, the invention is not limited thereto. Any member that elastically biases the package fixing body 120 to elastically bias the package fixing body 120 so that the pair of package fixing bodies 120 are close to each other can be used as the elastic supporting member 130.

The opening cover 140 is located on the insert body 110 and can be moved closer to or away from the insert body 110. The opening cover 140 includes an upper plate 141 and an upper portion 141 having an insertion hole 141a formed at a center of the corresponding package accommodating opening 111 and having an approximately rectangular cross section. The bent portion 142 is bent from the edge of the upper plate 141 to the lower side of the upper plate 141.

When the opening cover 140 is in close proximity to the insert body 110, the opening member 150 contacts the opening cover 140, and transfers the access force of the opening cover 140 to the package fixing body 120 to elastically support the package receiving opening 111 by the elastic supporting member 130. The package fixing body 120 is moved in one direction to open the package receiving opening 111.

The opening member 150 is a wedge member having a contact surface 151 formed at the top end and contacting the opening cover, and the first inclined surface 152 is formed at the bottom end by being inclined from a vertical direction by a predetermined angle. The opening member 150 is movable in the vertical direction in the insert body 110.

When the opening member 150 is pressed by the opening cover 140, the first inclined surface 152 and the second inclined surface 122 slide each other, and the opening member 150 allows the package fixing body 120 to slide in the opening direction.

The plug-in 100 shown in FIG. 6 operates as follows: First, the semiconductor package 160 is tested by moving from the tray toward the insert 100 by a vacuum suction unit (not shown). After the semiconductor package 160 is moved to the insert 100, the opening cover 140 of the insert 100 and the insert body 110 are pressed toward one another in a direction toward each other, and the opening cover 140 allows the opening member 150 to move in the downward direction. In this case, the first inclined surface 152 of the surface of the opening member 150 contacts the second inclined surface 122a of the inclined portion 122, and allows the package fixing body 120 to be slipped. The packaged package body 120 that has been slid opens the package accommodating opening 111, removes the semiconductor package 160, and mounts the semiconductor package 160 to the package container 114 through the package accommodating opening 111 in the package body 110. Subsequently, when the distance between the opening cover 140 and the insert body 110 is increased, the package fixing body 120 is immediately returned to the initial position due to the pulling force of the elastic supporting member 130, and the package receiving opening 111 is closed. In this case, since the first inclined surface 152 and the second inclined surface 122a are mutually Sliding causes the opening member 150 to rise.

When the package receiving opening 111 is closed, the semiconductor package 160 inserted into the package receiving opening 111 and assembled to the package container 114 may be configured by the package fixing body 120 to prevent the semiconductor package 160 from being detached from the package receiving opening 111. The insert 100 can then be moved to the test zone by the drive unit, where the test can be performed and the insert 100 is mounted on the test stand.

After the insert 100 is mounted to the test socket, when the insert 100 is supported by the pusher 201 for pressing against the insert body 110, a predetermined test is performed.

In detail, when the package receiving opening 111 is closed by the package fixing body 120, the pusher 201 of the pushing unit 200 is located on the insert 100, as shown in FIG.

In this case, the semiconductor package 160 is housed in the package holder 114 in the insert 100, and one end of the package holder 114 is at a distance S1 from the corresponding face of the insert body 110. The top surface of the semiconductor package 160 is spaced apart from the bottom surface of the package fixing body 120 by a distance S2 (S2 < S1).

In this state, as shown in FIG. 13, when the pusher 201 of the propulsion unit 200 is raised, the pusher 201 contacts the top surface of the package fixing body 120 and supports the package fixing body 120. Here, when the test socket is raised by the rising test element, the semiconductor package 160 is also raised. Since the distance S1 is greater than the distance S2, the top surface of the semiconductor package 160 contacts the bottom surface of the package fixing body 120 before the end of the package container 114 contacts the corresponding surface of the package body 110, and thus the semiconductor package 160 can be secured by the package fixing body 120. Pressurize the ground. Next, a predetermined electrical test is performed.

External heat when performing a burn-in test at high temperatures It is conducted to the semiconductor package 160 by the package fixing body 120. In particular, a material having high thermal conductivity is disposed on the bottom surface of the package fixing body 120 for allowing external heat to be uniformly and well conducted to the semiconductor package 160. In addition, since the package fixing body 120 completely covers the semiconductor package 160, heat can be uniformly conducted to the semiconductor package 160.

The plug-in 100 illustrated in FIG. 6 has the following effects: First, the semiconductor package 160 mounted in the interposer 100 is configured to position the top surface of the semiconductor package 160 and the top surface of the semiconductor package 160 by the package fixing body 120. Edge to slip in the horizontal direction. Therefore, when the semiconductor package 160 is moved to the test area or is being tested, the package fixing body 120 can be prevented from being detached from the package receiving opening 111 due to vibration.

In addition, since the package fixing body 120 is pressed against the entire top surface of the semiconductor package 160, it does not need to be pressed to all parts of the semiconductor package 160 as in the conventional pusher. Therefore, a customized thruster suitable for the size of the semiconductor package 160 is not required. As such, the inconvenience of replacing the thruster suitable for the semiconductor package 160 can be avoided when the customized thruster is not required.

In particular, the cost of testing can be reduced because there is no need for replacement time.

In addition, in a burn-in test, external heat can be uniformly conducted to the semiconductor package 160 by the package holder 120 for more reliable test results.

The plug-in 100 illustrated in FIG. 6 can be modified as follows: FIGS. 14-19 illustrate an insert 100 in accordance with another embodiment of the present invention. The insert 100 of this embodiment differs from FIG. 6 in terms of the slip of the packaged fixture 120.

In detail, the opening member 150 is rotatably hingedly coupled to the plug-in Body 110. When the top end of the opening member 150 contacts the opening cover 140, the opening member 150 rotates to allow the package fixing body 120 to slide.

The opening member 150 includes a first member 153 and a second member 154. The first member 153 has one end hingedly coupled to the insert body 110, the end having a hinge pin 153a. The second member 154 is bent from the first member 153 and extends in a downward direction. The opening cover 140 may contact the first member 153, while the plug member 128 of the package fixing body 120 described below contacts the second member 154.

When the package fixing body 120 is engaged with the rotating opening member 150, the package fixing body 120 is slidable. The package fixing body 150 includes a fixing body 127 and a plug member 128. The fixing body 127 slides in the receiving groove 125 in the insert body 110, and the plug member 128 protrudes from the fixing body 127, and when the plug member 128 is inserted into the sliding groove 115 of the insert body 110, it contacts the opening member 150.

The chute 115 is formed corresponding to the side of the package housing opening 111 in the plug body 110, and has a long hole shape extending in the horizontal direction.

In the insert 100 illustrated in FIG. 14, when the opening cover 140 is in close proximity to the insert body 110, the opening cover 140 is pressed against the opening member 150 and allows the opening member 150 to rotate, and the rotating opening member 150 allows the mounting of the fixing body 120. The bolt member 128 slides in the chute 115. As such, when the package fixing body 120 is slid, the package accommodating opening 111 is opened to be in a state in which the semiconductor package 160 can be accommodated, and the semiconductor package 160 is housed in the package accommodating opening 111.

After the semiconductor package 160 is placed in the package receiving opening 111, the opening cover 140 is raised. Therefore, since the elastic supporting member 130 elastically returns the package fixing body 120 to the initial position by slipping, the package fixing body 120 is slipped. In this case, the package housing opening 111 is in a closed state.

As described above, according to one or more embodiments of the present invention, in the package for semiconductor package, the package fixing body positioning semiconductor is packaged in the package body. The semiconductor package is slidable for the semiconductor package to be securely attached to the package body.

In addition, since the package fixing body is used in a sliding manner to press or fix the center of the semiconductor package, an additional propulsion unit is not required, and the test cost can be reduced.

While the invention has been particularly shown and described with reference to the exemplary embodiments the embodiments of the invention Defined.

10‧‧‧ plugin

11‧‧‧Package receiving slot

12‧‧‧ Guide hole

13‧‧‧Latch

14‧‧‧ Spring

20‧‧‧Open cover

30‧‧‧Semiconductor package

40‧‧‧Promotion unit

41‧‧‧ Guide column

42‧‧‧ propeller

100‧‧‧ plugin

110‧‧‧ plugin ontology

111‧‧‧Package receiving opening

112‧‧‧Mobile space

113‧‧‧Support wall

114‧‧‧Package container

115‧‧‧ chute

120‧‧‧Package fixed body

121‧‧‧ facing end

121a‧‧‧Material

122‧‧‧ inclined section

122a‧‧‧Second inclined surface

123‧‧‧ side wall

124‧‧‧ Groove

125‧‧‧ receiving slot

126‧‧‧ Guide column

127‧‧‧ fixed body

128‧‧‧Bolt components

130‧‧‧elastic support members

140‧‧‧Open cover

141‧‧‧Upper board

141a‧‧‧ insertion hole

142‧‧‧Bend

150‧‧‧Opening components

151‧‧‧Contact surface

152‧‧‧ first inclined surface

153‧‧‧ first component

153a‧‧‧Hinge bolt

154‧‧‧ second component

160‧‧‧Semiconductor package

200‧‧‧Advance unit

201‧‧‧ propeller

S1, S1‧‧‧ distance

1 to 4 illustrate an insert for a semiconductor package according to the prior art.

FIG. 5 is an illustration of an insert including a propulsion unit in accordance with conventional techniques.

FIG. 6 is a partial cross-sectional view of an insert for a semiconductor package according to an embodiment of the invention.

Figure 7 is a perspective view of the main portion of the insert of Figure 6.

8 to 11 are flow charts showing the operation of the plug-in of FIG. 6.

12 and 13 illustrate a state in which the insert of Fig. 6 is pressurized by a pusher.

Figure 14 is an exploded view of a package insert in accordance with another embodiment of the present invention.

Figure 15 is a combination diagram of Figure 14.

Figure 16 is a rear side view of Figure 15.

Figure 17 is a side view of Figure 15.

FIG. 18 is a flow chart showing the operation of the plug-in of FIG. 14.

Figure 19 is a side view of Figure 18.

100‧‧‧ plugin

110‧‧‧ plugin ontology

111‧‧‧Package receiving opening

112‧‧‧Mobile space

113‧‧‧Support wall

114‧‧‧Package container

120‧‧‧Package fixed body

121‧‧‧ facing end

121a‧‧‧Material

122‧‧‧ inclined section

123‧‧‧ side wall

125‧‧‧ receiving slot

130‧‧‧elastic support members

140‧‧‧Open cover

141‧‧‧Upper board

141a‧‧‧ insertion hole

142‧‧‧Bend

150‧‧‧Opening components

160‧‧‧Semiconductor package

Claims (9)

An insert for a semiconductor package, comprising: an insert body comprising a package receiving opening, the package receiving opening being formed at a center of the insert body and extending in a vertical direction to insert a semiconductor package in the vertical direction The package receiving opening; a package fixing body is pulled out from the inner walls of the package receiving opening or inserted into the inner walls of the package receiving opening to open or close the package receiving opening, and when When the semiconductor package is inserted into the package receiving opening, at least a portion of the package receiving opening is closed to prevent the semiconductor package from being detached from the package receiving opening; an elastic supporting member elastically supporting the package a fixing body for moving the package fixing body in a direction in which the package fixing body closes the package receiving opening; an opening cover on the insert body, which is adjacent to or away from the opening cover a direction of movement of the insert body; and an opening member, the opening member contacting the opening cover to transfer the opening cover when the opening cover is adjacent to the insert body An access force encapsulating the fixed body, and allowing the package fixing body that closes the package receiving opening to be elastically supported by the elastic supporting member to be moved to open the package receiving opening, wherein A bottom surface of the package fixing body completely or almost completely covers a top surface of the semiconductor package to prevent the package fixing body from being detached from the package receiving opening. The plug-in for a semiconductor package according to claim 1, wherein The package fixing body completely closes the package receiving opening. The package for semiconductor package according to claim 1, wherein the package fixing body is pulled out from the package receiving opening for passing the edge of the top surface of the semiconductor package, and covering the portion The center of the top surface of the semiconductor package. The insert for semiconductor package according to claim 1, wherein a material having high thermal conductivity is disposed on the bottom surface of the package fixing body, and allows external heat contacting the bottom surface of the package fixing body to be Conducted evenly to the package fixture. The insert for semiconductor package according to claim 4, wherein the material having high thermal conductivity is metal and is plated and bonded to the bottom surface of the package fixing body. The insert for a semiconductor package according to claim 1, wherein a pair of package fixing bodies are disposed, and a facing end of each of the package fixing bodies is slidable to a center of the top surface of the semiconductor package. The package fixing body is inserted into the package receiving opening. The insert for a semiconductor package according to claim 1, wherein a pair of package fixing bodies are disposed, and the elastic support members contact opposite end ends of each of the package fixing bodies. The insert for a semiconductor package according to claim 1, wherein the elastic support member comprises a spiral compression spring. An insert for a semiconductor package, comprising: a plug body comprising a package receiving opening, wherein the package receiving opening is formed at a center of the plug body and extends in a vertical direction to make a semiconductor The package is inserted into the package receiving opening in the vertical direction; a package fixing body is pulled out from the inner walls of the package receiving opening or inserted into the inner walls of the package receiving opening to open or close the inner wall Encapsulating an opening, and when the semiconductor package is inserted into the package receiving opening, closing at least a portion of the package receiving opening to prevent the semiconductor package from being detached from the package receiving opening; and an elastic a support member elastically supporting the package fixing body to move the package fixing body in a direction in which the package fixing body closes the package receiving opening, wherein a pair of package fixing bodies are disposed, and any one of the packages is fixed The facing end of the body can be slid to the center of a top surface of the semiconductor package inserted into the package receiving opening.