TWI492203B - Method of manufacturing display panel and laminated structure - Google Patents

Description

Display panel manufacturing method and laminate

The present invention relates to a method and a laminate for manufacturing a display panel, and more particularly to a method for manufacturing an ultra-thin display panel and a laminate produced when an ultra-thin display panel is manufactured.

As consumer electronics products have evolved toward light, thin, short, and small design trends, ultra-thin displays have emerged. In the prior art, the ultra-thin display is manufactured by performing a glass thinning process after the glass substrate is mounted on the upper and lower sides of the display panel. In the glass thinning process, a 0.5 mm or 0.4 mm glass substrate is generally used for etching to a desired thickness. However, when the glass substrate is thinned to 0.1 mm or less, problems such as cracking of the glass substrate or surface precipitates are liable to occur, so that the production yield is greatly lowered, thereby increasing the production cost.

Accordingly, it is an object of the present invention to provide a method and a laminate for manufacturing a display panel to solve the above problems.

According to an embodiment of the present invention, a method of manufacturing a display panel includes: providing a first substrate, a second substrate, a first colloid, a second colloid, a first carrier, and a second carrier; Bonding the first substrate to the first carrier, and bonding the second substrate to the second carrier with the second colloid; pairing the first substrate with the second substrate Laminating to form a laminate; applying a first external force to the first carrier to separate the first carrier from the first substrate; and heating the second colloid to reduce the viscosity of the second colloid and applying a A second external force is applied to the second carrier to separate the second carrier from the second substrate.

According to another embodiment, the laminate of the present invention comprises a first carrier, a first colloid, a first substrate, a second carrier, a second colloid, and a second substrate. The first colloid is formed on the first support, wherein the first colloid has a thermal cracking temperature greater than 370 °C. The first substrate is attached to the first carrier by the first colloid. The second colloid is formed on the second support, wherein the second colloid has a thermal cracking temperature of greater than 230 °C. The second substrate is bonded to the second carrier by the second colloid and is bonded to the first substrate pair.

In summary, the present invention can be used for ultra-thin glass (for example, between 0.05 mm and 0.1 mm in thickness) as the first substrate and the second substrate, and the thick glass (for example, the thickness is between 0.4 mm and 0.7 mm). Between the first carrier and the second carrier, and the first substrate and the second substrate are respectively attached to the first carrier and the second carrier by the first colloid and the second colloid to increase the support strength. Further, the first substrate and the second substrate are prevented from being broken during transportation of the process. After the process of the display panel is completed, since the second substrate has the second carrier support, the first carrier can be directly separated from the first substrate by external force, and then the second gel is heated to reduce the viscosity of the second colloid. At this time, the second carrier can be separated from the second substrate by a small external force. Thereby, the production yield of the ultra-thin display panel can be effectively improved.

It should be noted that the process of the display panel will have different temperatures at different stages of the process. For example, if a driving circuit (for example, a thin film transistor array) is formed on the first substrate, the maximum temperature of the process is, for example, about 370 ° C. At this time, the thermal decomposition temperature of the first colloid needs to be greater than 370 ° C. To avoid contamination of the product by the high temperature cracking of the first colloid in the process; if the color filter layer is formed on the second substrate, the highest temperature of the process is, for example, about 230 ° C. At this time, the thermal cracking temperature of the second colloid is greater than 230 ° C to avoid contamination of the product by the high temperature cracking of the second colloid during the process.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

Referring to FIGS. 1A to 8 , FIGS. 1A and 1B are flowcharts showing a method of manufacturing a display panel according to an embodiment of the present invention, and FIGS. 2 to 8 are a combination of FIGS. 1A and 1B. Schematic diagram of the process. First, step S10 is performed to provide a first substrate 10, a second substrate 12, a first colloid 14, a second colloid 16, a first carrier 18, and a second carrier 20. In this embodiment, the thickness of the first substrate 10 may be between 0.05 mm and 0.1 mm, the thickness of the second substrate 12 may be between 0.05 mm and 0.1 mm, and the thickness of the first carrier 18 may be between 0.4 mm and 0.1 mm. Between mm and 0.7 mm, and the thickness of the second carrier 20 may be between 0.4 mm and 0.7 mm. In other words, the thickness of the first carrier 18 and the second carrier 20 is thicker than the thickness of the first substrate 10 and the second substrate 12 to increase the support strength in the process of the display panel, thereby avoiding the first substrate 10 and the second substrate 12 Cracking occurred during transportation of the process. In addition, the first substrate 10, the second substrate 12, the first carrier 18, and the second carrier 20 may be glass, but not limit.

Next, step S12 is performed to wash the first carrier 18 and the second carrier 20, respectively. Next, step S14 is performed to form the first colloid 14 on the first carrier 18, and the second colloid 16 is formed on the second carrier 20, as shown in FIG. Next, step S16 is performed to pre-bake the first colloid 14 and the second colloid 16. In this embodiment, for example, the first colloid 14 and the second colloid 16 may be pre-baked at a temperature of about 170 °C. Step S18 is performed, the first substrate 10 is attached to the first carrier 18 by the first colloid 14, and the second substrate 12 is attached to the second carrier 20 by the second colloid 16, as shown in FIG. In this embodiment, the first substrate 10 can be attached to the first carrier 18 by the first colloid 14 in a vacuum bonding manner, and the second substrate can be pressed by the second colloid 16 by vacuum heating and bonding. 12 is attached to the second carrier 20.

Next, in step S20, a driving circuit 22 (for example, a thin film transistor array) is formed on the first substrate 10, as shown in FIG. Generally, the process for forming the thin film transistor array has a maximum temperature of, for example, about 370 ° C. At this time, the thermal decomposition temperature (Td) of the first colloid 14 needs to be greater than 370 ° C to avoid the high temperature of the first colloid 14 during the process. Cracking and contaminating products. In this embodiment, the first colloid 14 may comprise an alkenyl group of organopolysiloxane (diorganopolysiloxane), but not limited thereto, so that the first colloid 14 has a thermal cracking temperature greater than 370 °C. At the same time, step S22 is performed to form a color filter layer 24 on the second substrate 12, as shown in FIG. Generally, the process for forming the color filter layer 24 has a maximum temperature of, for example, about 230 ° C. At this time, the thermal decomposition temperature (Td) of the second colloid 16 needs to be greater than 230 ° C to avoid the second colloid 16 in the process. Cracking at high temperatures contaminates the product. In this embodiment, the second colloid 16 may include a cycloolefin copolymer (COC), but not limited thereto, so that the thermal decomposition temperature of the second colloid 16 is greater than 230 ° C. In addition, in the embodiment, a common electrode layer 27 is formed on the second substrate 12 on the color filter layer 24.

Next, step S24 is performed to bond the first substrate 10 and the second substrate 12 to each other to form a laminate 1 and a display medium 26 is disposed between the first substrate 10 and the second substrate 12, as described in Figure 5 shows. The laminate 1 includes a first substrate 10, a second substrate 12, a first colloid 14, a second colloid 16, a first carrier 18, and a second carrier 20. Next, step S26 is performed to apply a first external force F1 on the first carrier 18 to separate the first carrier 18 from the first substrate 10, as shown in FIG. In this embodiment, the second carrier 20 of the laminate 1 can be vacuumed by the base 30 of the apparatus 3 in FIG. 6, and the rotary arm 32 of the apparatus 3 in FIG. 6 can be used to evacuate. The first carrier 18 of the laminate 1 is adsorbed, and then the ejector 34 is operated to face the first external force F1 of at least greater than 1 N/25 mm so that the rotating arm 32 drives the first carrier 18 toward the arrow A. The direction is rotated to further separate the first carrier 18 from the first substrate 10. Since the second substrate 12 is supported by the second carrier 20, the second substrate 12 is not broken during the process of directly separating the first carrier 18 from the first substrate 10 by the first external force F1.

Next, step S28 is performed to heat the second colloid 16 to lower the viscosity of the second colloid 16 and apply a second external force F2 to the second carrier 20 to separate the second carrier 20 from the second substrate 12, such as Figure 7 shows. In this embodiment, the second external force The direction of application of F2 is parallel to the bonding surface of the second carrier 20 and the second substrate 12, so that the second carrier 20 slides relative to the second substrate 12 and is separated from the second substrate 12. The direction of the second external force F2 is preferably parallel to the bonding surface of the second carrier 20 and the second substrate 12, but is not limited thereto. In other words, the direction of the second external force F2 can also be perpendicular to the bonding surface of the second carrier 20 and the second substrate 12 or at any angle with the bonding surface, so that the second carrier 20 and the second substrate 12 are separated. Depending on the application. In this embodiment, when the temperature is lower than 60 ° C, the viscosity of the second colloid 16 is greater than 100 Pa. s, the second substrate 12 and the second carrier 20 can be firmly bonded together without relative movement; when the temperature is between 150 ° C and 200 ° C, the viscosity of the second colloid 16 is less than 50 Pa. s, at this time, the second carrier 20 and the second substrate 12 can be easily separated by applying a second external force F2 of a certain size. In other words, as long as the second colloid 16 is heated to between 150 ° C and 200 ° C, the second carrier 20 can be separated from the second substrate 12 by a second, lower external force F2, thereby avoiding the support of the first carrier 18 . The first substrate 10 is broken.

After the first carrier 18 and the second carrier 20 are removed from the first substrate 10 and the second substrate 12, respectively, the display panel 1' as shown in FIG. 8 can be completed. In this embodiment, the display medium 26 can be a liquid crystal, and the final display panel 1 ′ is a liquid crystal display panel. Since the heat resistance of the liquid crystal is, for example, about 200 ° C, if the temperature of the second colloid 16 is not more than 200 ° C, the liquid crystal is not damaged. In addition, since the liquid temperature used in the yellow light process is about 60 ° C, when the temperature is lower than 60 ° C, the viscosity of the second colloid 16 is greater than 100 Pa. s, can effectively ensure that the second substrate 12 and the second carrier 20 are firmly attached together without being in the yellow light process The relative movement occurs during the transportation process.

It should be noted that, in addition to the liquid crystal display panel, the present invention can also be used to manufacture other display panels, such as an Organic Light-Emitting Diode (OLED) display panel, an ElectroPhoretic Display (EPD), and the like. Please refer to FIG. 9. FIG. 9 is a schematic view of a display panel 1" according to another embodiment of the present invention. As shown in FIG. 9, the display panel 1" is a manufacturing method shown in FIGS. 1A and 1B. Manufactured OLED display panel. It should be noted that, when manufacturing the display panel 1", the driving circuit 22 formed on the first substrate 10 is a transparent conductive layer having a conductive property, such as Indium Tin Oxide (ITO). The display medium 26 between the substrate 10 and the second substrate 12 is an organic material, and the display medium 26 is interposed between the driving circuit 22 and the other metal electrode 28, and the color filter is not required to be formed on the second substrate 12. The light layer (i.e., step S22 described above is not required).

Compared with the prior art, the present invention can be ultra-thin glass (for example, between 0.05 mm and 0.1 mm in thickness) as the first substrate and the second substrate described above, with thick glass (for example, thickness between 0.4 mm and 0.7) Between the first carrier and the second carrier, and the first substrate and the second substrate are respectively attached to the first carrier and the second carrier by the first colloid and the second colloid to increase the support strength. In turn, the first substrate and the second substrate are prevented from being broken during transportation of the process. After the process of the display panel is completed, since the second substrate has the second carrier support, the first carrier can be directly separated from the first substrate by external force, and then the second gel is heated to reduce the viscosity of the second colloid. At this time, the second carrier can be separated from the second substrate by a small external force. By doing this, you can effectively improve Production yield of ultra-thin display panels.

It should be noted that the process of the display panel may have different requirements at the highest temperature in different stages. For example, if a driving circuit (for example, a thin film transistor array) is formed on the first substrate, the process of the highest temperature is, for example, about At 370 ° C, at this time, the thermal decomposition temperature of the first colloid needs to be greater than 370 ° C to avoid contamination of the product by the high temperature cracking of the first colloid in the process; if the color filter layer is formed on the second substrate, the process is the highest The temperature is, for example, about 230 ° C. At this time, the thermal decomposition temperature of the second colloid needs to be greater than 230 ° C to avoid contamination of the product by the high temperature cracking of the second colloid during the process.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1‧‧‧Laminated body

1', 1"‧‧‧ display panel

3‧‧‧ Equipment

10‧‧‧First substrate

12‧‧‧second substrate

14‧‧‧First colloid

16‧‧‧Second colloid

18‧‧‧ first carrier

20‧‧‧second carrier

22‧‧‧Drive circuit

24‧‧‧Color filter layer

26‧‧‧Display media

27‧‧‧Common electrode layer

28‧‧‧Metal electrodes

30‧‧‧Base

32‧‧‧Rotating arm

34‧‧‧Top pieces

F1‧‧‧First external force

F2‧‧‧Second external force

A‧‧‧ arrow

S10, S12, S14, S16, S18, S20, S22, S24, S26, S28‧‧

1A and 1B are flowcharts showing a method of manufacturing a display panel according to an embodiment of the present invention.

Fig. 2 to Fig. 8 are schematic diagrams showing the process of the first and third panels.

Figure 9 is a schematic view of a display panel in accordance with another embodiment of the present invention.

1‧‧‧Laminated body

10‧‧‧First substrate

12‧‧‧second substrate

14‧‧‧First colloid

16‧‧‧Second colloid

18‧‧‧ first carrier

20‧‧‧second carrier

22‧‧‧Drive circuit

24‧‧‧Color filter layer

26‧‧‧Display media

27‧‧‧Common electrode layer

Claims (17)

A method for manufacturing a display panel, comprising: providing a first substrate, a second substrate, a first colloid, a second colloid, a first carrier, and a second carrier, wherein when the temperature is lower than 60 ° C, the The viscosity of the second colloid is greater than 100Pa. s, when the temperature is between 150 ° C and 200 ° C, the viscosity of the second colloid is less than 50 Pa. The first substrate is attached to the first carrier by the first colloid, and the second substrate is attached to the second carrier by the second colloid; the first substrate and the second substrate are Bonding the substrate pair to form a laminate; applying a first external force to the first carrier to separate the first carrier from the first substrate; and heating the second colloid to lower the second The colloid is viscous and a second external force is applied to the second carrier to separate the second carrier from the second substrate. The method of manufacturing the display panel of claim 1, further comprising: forming a driving circuit on the first substrate; forming a color filter layer on the second substrate; and disposing a display medium on the first substrate Between the second substrate. The method of manufacturing the display panel of claim 1, further comprising: forming a driving circuit on the first substrate; and disposing a display medium between the first substrate and the second substrate. The manufacturing method of the display panel according to claim 1, wherein the heat of the first colloid is The cracking temperature is greater than 370 ° C and the thermal cracking temperature of the second colloid is greater than 230 ° C. The method of manufacturing a display panel according to claim 1, wherein the first external force is at least greater than 1 N/25 mm. The manufacturing method of the display panel of claim 1, wherein the biasing direction of the second external force is parallel to the bonding surface of the second carrier and the second substrate. The method of manufacturing a display panel according to claim 1, wherein the first colloid comprises an alkenyl organopolyoxane. The method of manufacturing a display panel according to claim 1, wherein the second colloid comprises a cyclic olefin copolymer. The manufacturing method of the display panel of claim 1, wherein the thickness of the first substrate is between 0.05 mm and 0.1 mm, and the thickness of the second substrate is between 0.05 mm and 0.1 mm. The method of manufacturing a display panel according to claim 1, wherein the first carrier has a thickness of between 0.4 mm and 0.7 mm, and the second carrier has a thickness of between 0.4 mm and 0.7 mm. A laminate comprising: a first carrier; a first colloid formed on the first carrier, wherein the first colloid has a thermal cracking temperature greater than 370 ° C; a first substrate, by the first colloid On the first carrier; a second carrier; a second colloid formed on the second carrier, wherein the second colloid has a thermal cracking temperature of more than 230 ° C, and when the temperature is lower than 60 ° C, the second carrier Colloidal adhesion Sex is greater than 100Pa. s, when the temperature is between 150 ° C and 200 ° C, the viscosity of the second colloid is less than 50 Pa. And a second substrate adhered to the second carrier by the second glue and bonded to the first substrate pair. The laminate of claim 11, further comprising: a driving circuit formed on the first substrate; a color filter layer formed on the second substrate; and a display medium disposed on the first Between the substrate and the second substrate. The laminate of claim 11, further comprising: a driving circuit formed on the first substrate; and a display medium disposed between the first substrate and the second substrate. The laminate of claim 11, wherein the first colloid comprises an alkenyl organopolyoxane. The laminate of claim 11, wherein the second colloid comprises a cyclic olefin copolymer. The laminate according to claim 11, wherein the thickness of the first substrate is between 0.05 mm and 0.1 mm, and the thickness of the second substrate is between 0.05 mm and 0.1 mm. The laminate of claim 11, wherein the first carrier has a thickness between 0.4 mm and 0.7 mm, and the second carrier has a thickness between 0.4 mm and 0.7 mm.