TWI482981B - A thimble board testing system and a method thereof - Google Patents

A thimble board testing system and a method thereof Download PDF

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TWI482981B
TWI482981B TW102146057A TW102146057A TWI482981B TW I482981 B TWI482981 B TW I482981B TW 102146057 A TW102146057 A TW 102146057A TW 102146057 A TW102146057 A TW 102146057A TW I482981 B TWI482981 B TW I482981B
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tested
test
thimble
ejector
conversion module
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TW102146057A
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TW201523001A (en
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Giant Wang
Alex Zhao
Sullivan Yang
Joey Huang
Ian Wang
Nash Liao
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Delta Electronics Inc
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Description

一種頂針板測試系統與方法Thimble plate test system and method

本發明係有關一種頂針板測試系統與方法,尤指一種利用一光繪資料(Gerber File)以任意電氣連接的方式找出一待測頂針板上各待測頂針(待測腳)之正確連接位置的測試系統與方法。The invention relates to a thimble board testing system and method, in particular to using a gerber data (Gerber File) to find the correct connection of each thimble to be tested (the foot to be tested) on the ejector plate to be tested by any electrical connection. Test system and method for location.

現行業界及產線線路板測試作法會依照待測電路板上每一待測腳(Pin)實際要測量的功能,事先將各待測腳連接到所對應的固定接點,作靜態測試。因此每更換不同機種,就要根據新的待測腳的功能之定義,重新連接至對應的接點,致使治具設置之前置作業複雜;再者,當人員異動時,須重新熟悉治具系統,增加訓練成本,且一頂針板之待測頂針與其連接器上的某些固定接點因為人為焊接不良而失去電氣連接時,或是一頂針板之待測頂針與其連接器上的複數個固定接點太多而不易除錯時,都會產生許多缺點:The current industry and production line circuit board test method will connect each test pin to the corresponding fixed contact point for static test according to the actual measurement function of each pin (Pin) to be tested on the circuit board to be tested. Therefore, each time a different model is replaced, it is necessary to reconnect to the corresponding contact according to the definition of the function of the new foot to be tested, so that the work of the fixture is complicated before the setting; in addition, when the personnel changes, the tool must be re-familiar. The system increases the training cost, and the fixed pin of the ejector pin and the connector on the ejector pin loses electrical connection due to poor soldering, or the thimble of the ejector pin and the plurality of connectors on the connector When there are too many fixed contacts and it is easy to debug, there are many disadvantages:

1、程序非常複雜麻煩,增加工時及人為錯誤率。1, the program is very complicated and troublesome, increasing the working hours and human error rate.

2、增加製作成本及治具的儲存空間。2. Increase production costs and storage space for fixtures.

3、在治具發生不可預期之錯誤時也難以在短時間內找出原因,需要人為逐步檢測。3. It is difficult to find out the cause in a short time when the fixture has an unexpected error, and it needs to be detected gradually.

因此,習知技術多會因為複雜的程序而衍生出以上所述的缺點。於是,如何研究出一種檢查的方法,以解決以上各項缺點,將是熟悉該項技藝之人士可以探討的一項重要課題。Therefore, conventional techniques often derive the disadvantages described above due to complicated procedures. Therefore, how to develop a method of inspection to solve the above shortcomings will be an important topic that can be explored by those familiar with the art.

關於本發明之優點與精神可以藉由以下的詳述及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention will be further understood from the following detailed description and the appended claims.

本發明之主要目的在於提供 一種頂針板測試系統與方法,係利用一光繪資料(Gerber File)以任意電氣連接的方式找出一待測頂針板上各待測頂針(待測腳)之正確連接位置。如此,當利用任一電氣連接的方式,係可在不知道原來待測頂針板上各待測頂針(待測腳)的正確位置下,進行測試,以找出其正確位置,進而解決習知技術的「 程序非常複雜麻煩,增加工時及人為錯誤率」與「增加製作成本及治具的儲存空間」的缺點。且本發明利用一測試系統進行測試,故而不需要人為逐步檢測。The main object of the present invention is to provide a thimble board testing system and method, which uses a Gerber File to find out the correctness of each ejector pin to be tested on the ejector plate to be tested by any electrical connection. Connection location. In this way, when any electrical connection is used, the test can be performed to find the correct position without knowing the correct position of the ejector pins to be tested (the feet to be tested) on the ejector plate to be tested, thereby solving the conventional knowledge. The shortcomings of the technology's "complex and complicated procedures, increased working hours and human error rates" and "increased production costs and storage space for fixtures". Moreover, the present invention utilizes a test system for testing, so that no human step-by-step detection is required.

一種頂針板測試系統,包括:一待測頂針板,具有複數個需要進行電氣測試的待測頂針;及一測試機台,係包括一傳動裝置、至少一連接器、一類比數位轉換模組,該待測頂針板可置入該測試機台,以進行電氣測試,且測試機台儲存有一座標檔,該座標檔具有待測頂針之座標資訊,測試機台係可讀取該座標資訊;該傳動裝置係裝設於測試機台,且具有一探針;該複數個待測頂針可任意地電氣連接於該連接器上之任意複數個連接點;及連接器係可電氣連接於該類比數位轉換模組和一數位類比轉換模組;其中,依據該座標檔所記錄之待測頂針之座標資訊,該傳動裝置將該探針移動至待測頂針板的每一支待測頂針,並利用類比數位轉換模組進行電氣測試,再歸納出經過電氣測試後頂針板上需要進行除錯的頂針所在的針孔資訊,並進行除錯。A thimble test system comprising: a ejector plate to be tested, having a plurality of thimbles to be tested for electrical testing; and a test machine comprising a transmission device, at least one connector, and an analog-to-digital conversion module. The ejector plate to be tested can be placed in the test machine for electrical testing, and the test machine stores a standard file, the coordinate file has coordinate information of the thimble to be tested, and the test machine can read the coordinate information; The transmission device is mounted on the testing machine and has a probe; the plurality of thimbles to be tested can be arbitrarily electrically connected to any of a plurality of connection points on the connector; and the connector can be electrically connected to the analog digital a conversion module and a digital analog conversion module; wherein, according to the coordinate information of the ejector to be tested recorded in the coordinate file, the transmission moves the probe to each of the ejector pins to be tested, and utilizes The analog digital conversion module performs electrical testing, and then summarizes the pinhole information of the thimble that needs to be debugged after the electrical test, and performs debugging.

一種頂針板測試方法,包括以下步驟:(1)將一待測頂針板上複數個需要進行電氣測試的待測頂針任意地電氣連接於至少一連接器上之任意複數個連接點;(2)將該待測頂針之座標資訊紀錄於一座標檔,且利用可置入該待測頂針板之一測試機台讀取該座標檔之該座標資訊;(3)該測試機台上之一傳動裝置將該傳動裝置上之一探針,依據待測頂針之座標資訊移動至每一支待測頂針,以進行電氣連接,並經由電氣連接該連接器之一類比數位轉換模組(Analog Digital Converter)進行電氣測試;及(4)歸納出經過電氣測試後,頂針板上需要進行除錯的頂針所在的針孔資訊,並進行除錯。A thimble test method includes the following steps: (1) arbitrarily electrically connecting a plurality of thimbles to be tested, which need to be electrically tested, to any of a plurality of connection points on at least one connector; (2) Recording the coordinate information of the thimble to be tested on a standard file, and reading the coordinate information of the coordinate file by using a test machine that can be placed in the ejector plate to be tested; (3) one of the transmissions on the test machine The device moves a probe on the transmission to the thimble to be tested according to the coordinate information of the ejector to be tested for electrical connection, and electrically connects the analog digital converter of the connector (Analog Digital Converter) Conduct electrical testing; and (4) summarize the pinhole information of the thimble that needs to be debugged after the electrical test, and debug.

(1)~(24)‧‧‧係步驟編號(1)~(24)‧‧‧ is the step number

1‧‧‧頂針板測試系統1‧‧‧Tedger board test system

11‧‧‧待測頂針板11‧‧‧The thimble board to be tested

111‧‧‧待測頂針111‧‧‧The thimble to be tested

12‧‧‧測試機台12‧‧‧Testing machine

121‧‧‧座標檔121‧‧‧Standard file

1211‧‧‧座標資訊1211‧‧‧Coordinate information

122‧‧‧傳動裝置122‧‧‧Transmission

1221‧‧‧探針1221‧‧‧Probe

123‧‧‧連接器123‧‧‧Connector

1231‧‧‧連接點1231‧‧‧ Connection point

124‧‧‧類比數位轉換模組124‧‧‧ Analog Digital Converter Module

1241‧‧‧通道1241‧‧‧ channel

125‧‧‧數位類比轉換模組125‧‧‧Digital analog conversion module

1251‧‧‧通道1251‧‧‧ channel

126‧‧‧中央處理器126‧‧‧Central Processing Unit

127‧‧‧通用輸入輸出控制暫存器127‧‧‧General-purpose input and output control register

128‧‧‧積體電路128‧‧‧Integrated circuit

第一圖係本發明之一種頂針板測試系統之一較佳實施例之架構示意圖;The first figure is a schematic structural view of a preferred embodiment of a thimble test system of the present invention;

第二圖係本發明之頂針板測試系統之較佳實施例之傳動裝置示意圖;2 is a schematic view of a transmission device of a preferred embodiment of the thimble test system of the present invention;

第三圖係本發明之頂針板測試系統之較佳實施例之待測頂針板、待測頂針與連接器之關係示意圖;The third figure is a schematic diagram of the relationship between the ejector plate to be tested, the thimble to be tested and the connector according to a preferred embodiment of the thimble test system of the present invention;

第四圖係本發明之頂針板測試系統之較佳實施例之訊號輸出測試電路示意圖;Figure 4 is a schematic diagram of a signal output test circuit of a preferred embodiment of the thimble test system of the present invention;

第五圖係本發明之頂針板測試系統之較佳實施例之訊號輸入測試電路示意圖;及5 is a schematic diagram of a signal input test circuit of a preferred embodiment of the thimble test system of the present invention; and

第六圖係本發明之一頂針板測試方法之該較佳實施例之步驟圖式。Figure 6 is a diagram showing the steps of a preferred embodiment of a thimble test method of the present invention.

有關本創作之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.

請參考第一圖,係本發明之一種頂針板測試系統之一較佳實施例之架構示意圖。該頂針板測試系統1包括:一待測頂針板(Thimble Board)11,具有複數個需要進行電氣測試的待測頂針111;及一測試機台12,係包括一傳動裝置122、複數個連接器(Connector)123、一類比數位轉換模組(Analog Digital Converter)124,該待測頂針板11可置入該測試機台12,以進行電氣測試,且測試機台12儲存有一座標檔121,以本實施例而言,係一光繪文件(Gerber File),該座標檔121具有待測頂針之座標資訊1211,測試機台12係可讀取該座標資訊1211;該傳動裝置122係裝設於測試機台12,且具有一探針1221,以本實施例而言,係一Z軸探針;該複數個待測頂針111可任意地電氣連接於該連接器123上之任意複數個連接點1231;及連接器123係可電氣連接於該類比數位轉換模組124和一數位類比轉換模組125;其中,依據該座標檔121所記錄之待測頂針111之座標資訊1211,該傳動裝置122將該探針1221移動至待測頂針板11的每一支待測頂針111,並利用類比數位轉換模組124進行電氣測試,以本實施例而言,該電氣測試包括一訊號輸出測試(Board out Test)與一訊號輸入測試(Board in Test),再歸納出經過電氣測試後頂針板11上需要進行除錯的頂針111所在的針孔(圖中未示)資訊,並進行除錯。Please refer to the first figure, which is a schematic structural diagram of a preferred embodiment of a thimble test system of the present invention. The thimble test system 1 includes: a thimble board 11 to be tested, having a plurality of thimbles 111 to be tested for electrical testing; and a test machine 12 including a transmission device 122 and a plurality of connectors (Connector) 123, an analog digital converter module (Analog Digital Converter) 124, the ejector plate 11 to be tested can be placed in the test machine 12 for electrical testing, and the test machine 12 stores a standard 121 to In this embodiment, it is a Gerber File, the coordinate file 121 has the coordinate information 1211 of the ejector to be tested, and the test machine 12 can read the coordinate information 1211; the transmission device 122 is installed in the The test machine 12 has a probe 1221, which in the present embodiment is a Z-axis probe; the plurality of thimbles 111 to be tested can be arbitrarily electrically connected to any of a plurality of connection points on the connector 123. The connector 123 is electrically connected to the analog digital conversion module 124 and a digital analog conversion module 125. The transmission device 122 is based on the coordinate information 1211 of the ejector pin 111 to be recorded recorded by the coordinate file 121. Move the probe 1221 Each of the ejector pins 111 to be tested is electrically tested by an analog digital conversion module 124. In this embodiment, the electrical test includes a board out test and a signal input. In the test (Board in Test), the information of the pinhole (not shown) where the thimble 111 needs to be debugged on the ejector plate 11 after electrical testing is summarized and debugged.

再者,該測試機台12內更包括一中央處理器(CPU)126、一通用輸入輸出控制暫存器127、一積體電路(IC)128、及一數位類比轉換模組(Digital Analog Converter)125;且該數位類比轉換模組125更包括複數個通道(Channel)1251,類比數位轉換模組124更包括複數個通道(Channel)1241。於是,經由第一圖所示之各元件間之運作,即可對頂針板11上複數個頂針進行電氣測試,進而得到需要進行除錯的頂針其所在位置的針孔之資訊。Furthermore, the test machine 12 further includes a central processing unit (CPU) 126, a universal input/output control register 127, an integrated circuit (IC) 128, and a digital analog conversion module (Digital Analog Converter). The digital analog conversion module 125 further includes a plurality of channels 1251, and the analog digital conversion module 124 further includes a plurality of channels 1241. Thus, through the operation between the components shown in the first figure, a plurality of thimbles on the ejector pin 11 can be electrically tested, thereby obtaining information on the pinholes at the position where the thimbles to be debugged are located.

請參考第六圖並配合第二圖至第五圖,係本發明之一頂針板測試方法之該較佳實施例之步驟圖式,本發明之頂針板測試系統之較佳實施例之傳動裝置示意圖,本發明之頂針板測試系統之較佳實施例之待測頂針板、待測頂針與連接器之關係示意圖,本發明之頂針板測試系統之較佳實施例之訊號輸出測試電路示意圖,及本發明之頂針板測試系統之較佳實施例之訊號輸入測試電路示意圖。 如第六圖所示,本發明之一頂針板測試方法包括以下步驟:Please refer to the sixth embodiment and the second to fifth figures, which are step diagrams of the preferred embodiment of the thimble test method of the present invention, and the transmission device of the preferred embodiment of the thimble test system of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a schematic diagram showing the relationship between a ejector plate to be tested, a thimble to be tested and a connector according to a preferred embodiment of the ejector plate test system of the present invention, a signal output test circuit diagram of a preferred embodiment of the ejector plate test system of the present invention, and A schematic diagram of a signal input test circuit of a preferred embodiment of the thimble test system of the present invention. As shown in the sixth figure, the ejector board test method of the present invention comprises the following steps:

(1)開始;(1) start;

(2)進行分類,以定義清楚待測頂針板(Thimble Board)11上複數個針孔哪些需要植入頂針(Thimble);(2) Classification to define clearly which of the plurality of pinholes on the Thimble Board 11 to be tested, which need to be implanted with a thimble;

(3)定義複數個待測頂針111中哪些需要進行一訊號輸出測試(Board out Test)或一訊號輸入測試(Board in Test),如第三圖所示;(3) Defining which of the plurality of thimbles 111 to be tested needs to perform a board out test or a board in test, as shown in the third figure;

(4)依照該分類,將每一支待測頂針111之一連接線1111任意地電氣連接至複數個連接器(Connector)123之任一個連接器123之任一連接點,如第三圖所示,僅以一連接器示意之,但未顯示該連接點;(4) According to the classification, one of the connection pins 1111 of each of the ejector pins 111 is arbitrarily electrically connected to any one of the plurality of connectors 123 of the connector 123, as shown in the third figure. Shown only by a connector, but the connection point is not shown;

(5)將分類後的各待測頂針111之座標資訊1211紀錄於座標檔121內,以本實施例而言,座標檔121係一光繪檔案(Gerber File);(5) Recording the coordinate information 1211 of each of the classified thimbles 111 to be recorded in the coordinate file 121. In this embodiment, the coordinate file 121 is a Gerber File;

(6)將待測頂針板11置入該測試機台12,測試機台12讀取座標檔121內之座標資訊1211;(6) placing the ejector plate 11 to be tested into the test machine 12, the test machine 12 reads the coordinate information 1211 in the coordinate file 121;

(7)是否對待測頂針板11上之任一待測頂針111進行一訊號輸出測試(Board out Test),若為是,進入步驟(8),若為否,進入步驟(14);(7) Whether to perform a signal out test on any of the ejector pins 111 to be tested on the ejector pin 11, if yes, proceed to step (8), and if not, proceed to step (14);

(8)測試機台12內之中央處理器(CPU)126命令通用輸入輸出控制暫存器127,以發出一高準位訊號給積體電路(IC)128,積體電路128將3.3V的電壓引入至傳動裝置122的一探針1221上,以本實施例而言,探針1221係一Z軸探針,如第二圖與第四圖所示;(8) The central processing unit (CPU) 126 in the test machine 12 commands the general-purpose input/output control register 127 to issue a high level signal to the integrated circuit (IC) 128, and the integrated circuit 128 will be 3.3V. The voltage is introduced to a probe 1221 of the transmission device 122. In this embodiment, the probe 1221 is a Z-axis probe, as shown in the second and fourth figures;

(9)測試機台12依據座標檔121之座標資訊1211,將傳動裝置122之探針1221移動至待測針板11上之待測頂針111,使探針1221與待測頂針111進行電氣連接;(9) The test machine 12 moves the probe 1221 of the transmission device 122 to the ejector pin 111 to be tested on the needle plate 11 to be tested according to the coordinate information 1211 of the coordinate file 121, so that the probe 1221 is electrically connected to the ejector pin 111 to be tested. ;

(10)測試機台12經由類比數位轉換模組(Analog Digital Converter)124判讀待測頂針111是否有引入3.3V電壓,若為是,進入步驟(11),若為否,進入步驟(12);(10) The test machine 12 determines whether the thimble 111 to be tested has a voltage of 3.3V via an analog digital converter 124. If yes, the process proceeds to step (11). If not, the process proceeds to step (12). ;

(11)座標檔121內之座標資訊1211之一座標與類比數位轉換模組124之複數個通道(Channel)1241之一通道1241是相吻合的,進入步驟(13);(11) One of the coordinate information 1211 coordinates in the coordinate file 121 is matched with one of the plurality of channels 1241 of the analog digital conversion module 124, and proceeds to step (13);

(12)待測頂針111有電氣連接問題,並進行記錄,進入步驟(13);(12) The thimble 111 to be tested has an electrical connection problem and is recorded, and proceeds to step (13);

(13) 是否對待測頂針板11之下一支待測頂針111進行訊號輸出測試,若為是,進入步驟(8),若為否,進入步驟(14);(13) Whether to perform a signal output test on a thimble 111 to be tested under the ejector pin 11, and if so, proceed to step (8), and if not, proceed to step (14);

(14) 是否對待測頂針板11之任一待測頂針111進行訊號輸入測試(Board in Test),若為是,進入步驟(15),若為否,進入步驟(22);(14) Whether to perform any signal input test (Board in Test) on any of the ejector pins 111 to be tested, if yes, proceed to step (15), and if not, proceed to step (22);

(15) 測試機台12內之中央處理器126命令通用輸入輸出控制暫存器127,以發出一低準位訊號給積體電路128,以將類比數位轉換模組124電氣連接至傳動裝置122上的探針1221,如第五圖所示;(15) The central processing unit 126 in the test machine 12 commands the general-purpose input/output control register 127 to issue a low level signal to the integrated circuit 128 to electrically connect the analog digital conversion module 124 to the transmission 122. Probe 1221 on, as shown in the fifth figure;

(16)測試機台12依據座標檔121之座標資訊1211,將傳動裝置122之探針1221移動至待測頂針板11上之另一待測頂針111,使探針1221與該另一待測頂針111進行電氣連接;(16) The test machine 12 moves the probe 1221 of the transmission device 122 to the other ejector pin 111 to be tested on the ejector plate 11 to be tested according to the coordinate information 1211 of the coordinate file 121, so that the probe 1221 and the other test are to be tested. The thimble 111 is electrically connected;

(17) 測試機台12 經由數位類比轉換模組(Digital Analog Converter)125 送出3.3V 的電壓至待測頂針111;(17) The test machine 12 sends a voltage of 3.3V to the ejector pin 111 to be tested via a digital analog converter 125;

(18)測試機台12經由類比數位轉換模組124判讀由數位類比轉換模組125送出之3.3V電壓是否有到達類比數位轉換模組124,若為是,進入步驟(19),若為否,進入步驟(20);(18) The test machine 12 interprets whether the 3.3V voltage sent by the digital analog conversion module 125 reaches the analog digital conversion module 124 via the analog digital conversion module 124. If yes, the process proceeds to step (19). Going to step (20);

(19) 座標檔121內之座標資訊1211之一座標與數位類比轉換模組125的複數個通道1251之 一通道1251是相吻合的,進入步驟(21);(19) One coordinate of the coordinate information 1211 in the coordinate file 121 coincides with the channel 1251 of the plurality of channels 1251 of the digital analog conversion module 125, and proceeds to step (21);

(20) 待測頂針111與數位類比轉換模組125的複數個通道1251之一通道1251有電氣連接問題,並進行紀錄;(20) The thimble 111 to be tested has an electrical connection problem with one of the plurality of channels 1251 of the digital analog conversion module 125, and records;

(21)是否對待測頂針板11之下一支待測頂針111進行訊號輸入測試,若為是,進入步驟(15),若為否,進入步驟(22);(21) Whether to perform a signal input test on a thimble 111 to be tested under the ejector pin 11, and if so, proceed to step (15), and if no, proceed to step (22);

(22) 列出經過訊號輸出測試或訊號輸入測試後需要進行除錯的頂針板11上之頂針111所在位置的針孔之資訊;(22) List the information of the pinholes at the position of the thimble 111 on the ejector plate 11 that needs to be debugged after the signal output test or the signal input test;

(23)進行一除錯程序;(23) performing a debugging procedure;

(24)結束。(24) End.

於是,綜上所述,可以瞭解本發明之一種頂針板測試系統與方法之優點在於,當因為人員異動而資料交接不清楚,且一電路板與其連接器上的某些固定接點因為人為焊接不良而失去電氣連接時,或是一電路板與其連接器上的複數個固定接點太多而不易除錯時,本發明可以將電路板製作成一待測頂針板,利用光繪資料(Gerber File)以任意電氣連接的方式找出該待測頂針板上各待測頂針與連接器的電氣連接關係。因此,本發明可以在不知道電路板原先與連接器的電氣連接關係下,重建彼此之間的原來電氣連接關係;再者,當固定接點太多而不易找出其電氣連接關係且不易除錯時,本發明可以任意電氣連接的方式找出錯誤,進行除錯。Therefore, in summary, it can be understood that the thimble test system and method of the present invention has the advantages that the data transfer is unclear due to personnel changes, and some fixed contacts on a circuit board and its connector are artificially welded. When the electrical connection is lost and the electrical connection is lost, or when there are too many fixed contacts on a circuit board and its connector, it is not easy to debug. The invention can make the circuit board into a ejector plate to be tested, and use the Gerber File. Find the electrical connection relationship between the ejector pins to be tested and the connector on the ejector plate to be tested by any electrical connection. Therefore, the present invention can reconstruct the original electrical connection relationship between each other without knowing the electrical connection relationship between the original board and the connector; furthermore, when there are too many fixed contacts, it is difficult to find the electrical connection relationship and it is difficult to remove. In the wrong time, the present invention can find errors and perform debugging by any electrical connection.

於是,本發明專利申請案係利用創作人豐富的經驗,以極富創意的構思,設計出簡單卻能充分解決習知技術的問題。因此,本發明專利申請案的功能,確實符合具有新穎性與進步性的專利要件。Thus, the patent application of the present invention utilizes the rich experience of the creator to design a simple but fully problematic solution to the problem of the prior art. Therefore, the function of the patent application of the present invention does meet the patent requirements of novelty and progress.

唯以上所述者,僅為本發明之較佳實施例,當不能以之限制本發明範圍。即大凡依本發明申請專利範圍所做之均等變化及修飾,仍將不失本發明之要義所在,亦不脫離本發明之精神和範圍,故都應視為本發明的進一步實施狀況。The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. It is to be understood that the scope of the present invention is not limited by the spirit and scope of the present invention, and should be considered as a further embodiment of the present invention.

 

(1)~(24)‧‧‧係步驟編號 (1)~(24)‧‧‧ is the step number

Claims (10)

一種頂針板測試系統,包括:
一待測頂針板,具有複數個需要進行電氣測試的待測頂針;及
一測試機台,係包括一傳動裝置、至少一連接器、一類比數位轉換模組,該待測頂針板可置入該測試機台,以進行電氣測試,且測試機台儲存有一座標檔,該座標檔具有待測頂針之座標資訊,測試機台係可讀取該座標資訊;該傳動裝置係裝設於測試機台,且具有一探針;該複數個待測頂針可任意地電氣連接於該連接器上之任意複數個連接點;及連接器係可電氣連接於該類比數位轉換模組和一數位類比轉換模組;
其中,依據該座標檔所記錄之待測頂針之座標資訊,該傳動裝置將該探針移動至待測頂針板的每一支待測頂針,並利用類比數位轉換模組進行電氣測試,再歸納出經過電氣測試後頂針板上需要進行除錯的頂針所在的針孔資訊,並進行除錯。
A thimble test system comprising:
a ejector plate to be tested, having a plurality of thimbles to be tested for electrical testing; and a testing machine comprising a transmission device, at least one connector, and an analog-digital conversion module, wherein the ejector plate to be tested can be placed The test machine is used for electrical testing, and the test machine stores a standard file, the coordinate file has coordinate information of the thimble to be tested, the test machine can read the coordinate information; the transmission device is installed in the testing machine And having a probe; the plurality of thimbles to be tested can be arbitrarily electrically connected to any of a plurality of connection points on the connector; and the connector can be electrically connected to the analog-to-digital conversion module and a digital analog conversion Module
Wherein, according to the coordinate information of the thimble to be tested recorded in the coordinate file, the transmission device moves the probe to each thimble to be tested of the ejector plate to be tested, and performs electrical test using an analog digital conversion module, and then generalizes After the electrical test, the pinhole information of the thimble that needs to be debugged on the ejector plate is debugged.
如請求項1所述之頂針板測試系統,其中,該電氣測試包括一訊號輸出測試(Board out Test)與一訊號輸入測試(Board in Test)。The ejector board test system of claim 1, wherein the electrical test comprises a board out test and a board in test. 如請求項2所述之頂針板測試系統,其中,該數位類比轉換模組更包括複數個通道(Channel)。The ejector board test system of claim 2, wherein the digital analog conversion module further comprises a plurality of channels. 一種頂針板測試方法,包括以下步驟:
(1)將一待測頂針板上複數個需要進行電氣測試的待測頂針任意地電氣連接於至少一連接器上之任意複數個連接點;
(2)將該待測頂針之座標資訊紀錄於一座標檔,且利用可置入該待測頂針板之一測試機台讀取該座標檔之該座標資訊;
(3)該測試機台上之一傳動裝置將該傳動裝置上之一探針,依據待測頂針之座標資訊移動至每一支待測頂針,以進行電氣連接,並經由電氣連接該連接器之一類比數位轉換模組(Analog Digital Converter)進行電氣測試;及
(4)歸納出經過電氣測試後,頂針板上需要進行除錯的頂針所在的針孔資訊,並進行除錯。
A thimble test method includes the following steps:
(1) arbitrarily electrically connecting a plurality of thimbles to be tested, which need to be electrically tested, to any of a plurality of connection points on at least one connector;
(2) recording the coordinate information of the ejector to be tested on a standard file, and reading the coordinate information of the coordinate file by using a test machine that can be placed in the ejector plate to be tested;
(3) one of the transmission devices of the test machine moves a probe on the transmission device to each of the ejector pins to be tested according to the coordinate information of the ejector pin to be electrically connected, and electrically connects the connector One of the analog digital converters for electrical testing; and
(4) Summarize the pinhole information of the thimble that needs to be debugged after the electrical test, and debug.
如請求項4所述之頂針板測試方法,其中,步驟(1)更包括以下步驟:
(11)進行分類,以定義清楚該待測頂針板(Thimble Board)上複數個針孔哪些需要植入頂針;
(12)定義複數個待測頂針中哪些需要進行一訊號輸出測試(Board out Test)或一訊號輸入測試(Board in Test);及
(13)依照該分類,將每一支待測頂針之一連接線任意地電氣連接至該至少一連接器上之任一連接點。
The thimble test method of claim 4, wherein the step (1) further comprises the following steps:
(11) Perform classification to define clearly which of the plurality of pinholes on the Thimble Board to be tested need to be implanted into the thimble;
(12) defining which of the plurality of thimbles to be tested needs to perform a board out test or a board in test; and
(13) According to the classification, one of the connection pins of each of the ejector pins to be tested is arbitrarily electrically connected to any of the connection points on the at least one connector.
如請求項4所述之頂針板測試方法,其中,步驟(2)更包括以下步驟:
(21)將分類後的各待測頂針之該座標資訊紀錄於一座標檔內;及
(22)將該待測頂針板置入該測試機台,測試機台讀取座標檔內之座標資訊。
The thimble test method of claim 4, wherein the step (2) further comprises the following steps:
(21) recording the coordinate information of each of the classified thimbles to be in a standard file; and
(22) The ejector plate to be tested is placed in the test machine, and the test machine reads the coordinate information in the coordinate file.
如請求項4所述之頂針板測試方法,其中,步驟(3)更包括以下步驟:
(31)是否對該待測頂針板上之任一待測頂針進行一訊號輸出測試,若為是,進入步驟(32),若為否,進入步驟(34);
(32)對待測頂針板上之任一待測頂針進行該訊號輸出測試;
(33)是否對待測頂針板上之下一支待測頂針進行訊號輸出測試,若為是,進入步驟(32),若為否,進入步驟(34);
(34)是否對待測頂針板上之任一待測頂針進行一訊號輸入測試,若為是,進入步驟(35),若為否,進入步驟(4);
(35)對待測頂針板上之任一待測頂針進行一訊號輸入測試;及
(36)是否對待測頂針板上之下一支待測頂針進行訊號輸入測試,若為是,進入步驟(35),若為否,進入步驟(4)。
The thimble test method of claim 4, wherein the step (3) further comprises the following steps:
(31) whether a signal output test is performed on any of the ejector pins to be tested on the ejector plate to be tested, and if so, proceeds to step (32), and if not, proceeds to step (34);
(32) performing the signal output test on any of the ejector pins to be tested on the ejector pin;
(33) Whether to perform the signal output test on the lower thimble under test on the ejector pin board, if yes, go to step (32), if no, go to step (34);
(34) Whether to perform a signal input test on any of the ejector pins to be tested on the ejector pin board, if yes, proceed to step (35), and if not, proceed to step (4);
(35) performing a signal input test on any of the thimbles to be tested on the ejector pin; and
(36) Whether to perform the signal input test on the lower thimble to be tested on the ejector plate, if yes, go to step (35), if no, go to step (4).
如請求項4所述之頂針板測試方法,其中,步驟(4)更包括以下步驟:
(41)歸納出經過一訊號輸出測試或一訊號輸入測試後,頂針板上需要進行除錯的頂針所在的針孔資訊;及
(42)進行一除錯程序。
The thimble test method of claim 4, wherein the step (4) further comprises the following steps:
(41) summarizing the pinhole information of the thimble on which the ejector pin needs to be debugged after a signal output test or a signal input test; and
(42) Perform a debug procedure.
如請求項7所述之頂針板測試方法,其中,步驟(32)更包括以下步驟:
(321)該測試機台內之一中央處理器(CPU)命令一通用輸入輸出控制暫存器發出一高準位訊號給一積體電路(IC),該積體電路將3.3V的電壓引入至該傳動裝置的該探針上;
(322)測試機台依據該座標檔之該座標資訊,將傳動裝置的探針移動至該待測針板上之該待測頂針,使探針與待測頂針進行電氣連接;
(323)測試機台經由該類比數位轉換模組判讀待測頂針是否有引入電壓,若為是,進入步驟(324),若為否,進入步驟(325);
(324)座標檔內之座標資訊之一座標與類比數位轉換模組之一通道是相吻合的,進入步驟(33);及
(325)待測頂針有電氣連接問題,並進行記錄,進入步驟(33)。
The thimble test method of claim 7, wherein the step (32) further comprises the following steps:
(321) A central processing unit (CPU) in the test machine commands a general-purpose input/output control register to issue a high level signal to an integrated circuit (IC), which introduces a voltage of 3.3V. To the probe of the transmission;
(322) the test machine moves the probe of the transmission device to the ejector pin to be tested on the needle plate according to the coordinate information of the coordinate file, so that the probe is electrically connected with the ejector pin to be tested;
(323) The test machine determines whether the thimble to be tested has a voltage to be introduced via the analog digital conversion module, and if so, proceeds to step (324), and if not, proceeds to step (325);
(324) one of the coordinates of the coordinate information in the coordinate file is consistent with one of the channels of the analog digital conversion module, and proceeds to step (33);
(325) The thimble to be tested has an electrical connection problem and is recorded, and proceeds to step (33).
如請求項7所述之頂針板測試方法,其中,步驟(35)更包括以下步驟:
(351)該測試機台內之一中央處理器命令一通用輸入輸出控制暫存器發出一低準位訊號給一積體電路(IC),以將類比數位轉換模組電氣連接至該傳動裝置的該探針上;
(352)測試機台依據該座標檔之該座標資訊,將傳動裝置之探針移動至該待測餅針板上之另一待測頂針,使探針與該另一待測頂針進行電氣連接;
(353)測試機台經由一數位類比轉換模組(Digital Analog Converter)送出3.3V的電壓至待測頂針;
(354)測試機台經由該類比數位轉換模組判讀由該數位類比轉換模組送出3.3V的電壓是否有到達類比數位轉換模組,若為是,進入步驟(355),若為否,進入步驟(356);
(355)座標檔內之座標資訊之一座標與數位類比轉換模組之一通道是相吻合的,進入步驟(36);及
(356)待測頂針與數位類比轉換模組的複數個通道之一有電 氣連接問題,並進行記錄,進入步驟(36)。
The thimble test method of claim 7, wherein the step (35) further comprises the following steps:
(351) a central processing unit in the test machine commands a general-purpose input/output control register to send a low level signal to an integrated circuit (IC) to electrically connect the analog digital conversion module to the transmission On the probe;
(352) the test machine moves the probe of the transmission device to another ejector pin to be tested on the pie plate to be tested according to the coordinate information of the coordinate file, so that the probe is electrically connected to the other ejector pin to be tested ;
(353) The test machine sends a voltage of 3.3V to the ejector to be tested via a digital analog converter (Digital Analog Converter);
(354) The test machine interprets whether the voltage of the 3.3V sent by the digital analog conversion module reaches the analog digital conversion module via the analog digital conversion module, and if yes, proceeds to step (355), and if not, enters Step (356);
(355) one of the coordinates of the coordinate information in the coordinate file is consistent with one of the channels of the digital analog conversion module, and proceeds to step (36);
(356) The thimble to be tested has an electrical connection problem with one of the plurality of channels of the digital analog conversion module, and is recorded, and proceeds to step (36).
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