TWI477736B - Multiplexing article parameter integrated optically measuring device and method thereof - Google Patents

Multiplexing article parameter integrated optically measuring device and method thereof Download PDF

Info

Publication number
TWI477736B
TWI477736B TW102144609A TW102144609A TWI477736B TW I477736 B TWI477736 B TW I477736B TW 102144609 A TW102144609 A TW 102144609A TW 102144609 A TW102144609 A TW 102144609A TW I477736 B TWI477736 B TW I477736B
Authority
TW
Taiwan
Prior art keywords
image
light
reference light
analyzed
unit
Prior art date
Application number
TW102144609A
Other languages
Chinese (zh)
Other versions
TW201522904A (en
Inventor
Ming Hsing Shen
Wei Chung Wang
Chi Hung Huang
Jyh Rou Sze
Chun Li Chang
Original Assignee
Nat Applied Res Laboratories
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Applied Res Laboratories filed Critical Nat Applied Res Laboratories
Priority to TW102144609A priority Critical patent/TWI477736B/en
Application granted granted Critical
Publication of TWI477736B publication Critical patent/TWI477736B/en
Publication of TW201522904A publication Critical patent/TW201522904A/en

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Description

多工物件參數光學量測整合裝置與方法Multi-work object parameter optical measurement integration device and method

本發明係關於一種光學量測裝置;更明確說來,本發明係關於一種用以取得一待測物之表面形貌、全對焦彩色、黑白影像與膜厚尺寸等之多工物件參數光學量測整合裝置。The present invention relates to an optical measuring device; more specifically, the present invention relates to an optical quantity of a multiplexed object parameter for obtaining a surface topography, a full-focus color, a black-and-white image, and a film thickness dimension of an object to be tested. Measure the integrated device.

隨著工業界各種微細製造技術之突飛猛進,對於微細元件檢測之需求不斷提高,以往各形式之三維輪廓量測總是不能滿足市場需求。在半導體、平面顯示器、與微機電元件與電子封裝等高科技產業中,由於微結構表面輪廓的準確性與機械性質決定產品的效能與壽命,在製程中皆需針對品質做監測。因此,微細結構之表面輪廓等有精密檢測之絕對必要性,且一般皆以光學技術配合光學架構來實現此等精密檢測。With the rapid advancement of various micro-fabrication technologies in the industry, the demand for micro-component detection has been continuously improved, and various forms of three-dimensional contour measurement have not been able to meet market demands. In the high-tech industries such as semiconductors, flat panel displays, and micro-electromechanical components and electronic packaging, the accuracy and mechanical properties of microstructure surface contours determine the efficacy and longevity of products, and quality monitoring is required in the process. Therefore, the surface profile of the microstructure is absolutely necessary for precise detection, and optical precision is generally used in conjunction with the optical architecture to achieve such precision detection.

白光干涉儀、共焦顯微儀與橢圓偏光儀所為之干涉、顯微與偏振量測功能對於半導體等微細相關領域之需要為一般所熟知,其能各自檢知一受測物件的相對參數,以利對線上製造中半導體產品之監控。White light interferometers, confocal microscopy and ellipsometers for interference, microscopy and polarization measurement functions are generally well known for the needs of micro-related fields such as semiconductors, which can each detect the relative parameters of a measured object to facilitate Monitoring of semiconductor products in online manufacturing.

干涉儀廣泛應用於表面輪廓之光路架設上,可分為Mirau、Linnik與Michelson三種類型,其中Mirau和Michelson這兩種類型的參考面與物鏡都整合於一個物鏡系統上且無法調整,而Linnk式干涉儀之光學架構在調整參考光光程與光學系統變化上較有彈性且可自行組裝。Interferometers are widely used in the surface contouring of light paths. They can be divided into three types: Mirau, Linnik and Michelson. The two types of reference surfaces and objective lenses of Mirau and Michelson are integrated on one objective system and cannot be adjusted, and Linnk The optical architecture of the interferometer is more flexible and self-assemblable in adjusting the reference optical path and optical system variations.

一般商用共焦顯微鏡可用以得到一受測物件的全對焦影像,其對待物件加以垂直掃描,並利用影像處理得到掃描影像之每一畫素中的高頻訊息,藉以得到每一畫素位於一物鏡景深內的灰階值,進而得到全域對焦訊息。A general commercial confocal microscope can be used to obtain a full-focus image of a measured object, which is vertically scanned for the object, and image processing is used to obtain a high-frequency message in each pixel of the scanned image, so that each pixel is located at a The grayscale value in the depth of field of the objective lens, and then the global focus message.

在膜厚量測厚度上普遍使用橢偏儀,一光源經過偏光處理後,形成一線性偏振光,再經過補償片調變相位,射入一具薄膜樣品上再反射回來後,進入一第二偏光處理並再被加補償,利用一偵測器分析斯托克斯(Stokes)參數,藉以分析反射光的振幅與相位,再反推出該薄膜的厚度資訊。An ellipsometer is commonly used in film thickness measurement. After a light source is processed, a linearly polarized light is formed, and then the phase is modulated by the compensation film. After being injected into a film sample, it is reflected back and then enters a second. The polarization treatment is further compensated, and a detector is used to analyze the Stokes parameters, thereby analyzing the amplitude and phase of the reflected light, and then deriving the thickness information of the film.

然而市面上干涉儀、共焦顯微儀與橢偏儀,各量測儀器之功能均為單一性,而相關專利多注重各量測功能演算法之精準度與穩定性。However, on the market, interferometers, confocal microscopy and ellipsometry, the functions of each measuring instrument are singular, and the related patents pay more attention to the accuracy and stability of each measurement function algorithm.

在膜厚尺寸量測方面,美國專利公開號US2013/0033698 A1揭露讓受測物件之表面與底面反射回不同的兩道光,並使用光譜儀偵測待測件的表面與底面光譜,再利用運算處理器分析此兩層之厚度尺寸。In the measurement of the film thickness, the US Patent Publication No. US2013/0033698 A1 discloses that the surface of the object to be tested and the bottom surface are reflected back to different light, and the spectrometer is used to detect the surface and bottom surface spectrum of the object to be tested, and then the operation processing is performed. The thickness of the two layers is analyzed.

美國專利公開號US2012/0218561 A1揭露使用光譜儀或光偵測器量測試件表面與膜介面之光反射時間差,即利用一表面反射光及介面反射光之光反射時間差,再藉由電腦運算得到膜厚尺寸。U.S. Patent Publication No. US 2012/0218561 A1 discloses the use of a spectrometer or a photodetector to measure the difference in light reflection time between the surface of the test piece and the film interface, that is, the difference in light reflection time between the surface reflected light and the interface reflected light, and then the film thickness is obtained by computer operation. size.

美國專利公開號US8416491 B2利用共焦顯微鏡原理即時得知量測試件表面形貌,其由光源射入一序列之條紋結構光,探測每個畫素之深度反應曲線,得知物體量測範圍內的深度分佈,反推回受測物件之表面形貌。美國專利公開號US8416399 B2利用白光干涉法與反測法量測受測物件的表面形貌與厚度尺寸。US Patent Publication No. US8416491 B2 uses the principle of confocal microscope to instantly know the surface topography of the test piece, which is injected into a sequence of stripe structured light by the light source, detects the depth response curve of each pixel, and knows that the object is within the measurement range. The depth distribution is reversed back to the surface topography of the object under test. U.S. Patent Publication No. US8416399 B2 utilizes white light interferometry and back measurement to measure the surface topography and thickness dimensions of the object under test.

中華民國專利申請案096147071利用一種離軸數位全像之方法接收R、G與B三種顏色之干涉訊號光譜,該彩色取像元件可接受帶有干涉訊號之光束並於彩色取像元件 形成全像干涉,並可得R、G、B之相位,將合成波長R、G及其相位,與合成波長G、B及其相位帶入計算,既可得合成波長,並由電腦運算待測物表面之R、G、B三種顏色資訊及其相位,即可得到受測物件的表面三維輪廓。The Republic of China Patent Application No. 096147071 receives an interference signal spectrum of three colors R, G and B by means of an off-axis digital holographic method, the color image capturing element can receive a beam with an interference signal and the color image capturing element Forming holographic interference, and obtaining the phases of R, G, and B, taking the synthesized wavelengths R, G and their phases, and the synthesized wavelengths G, B and their phases into the calculation, which can obtain the synthesized wavelength and be calculated by computer The three-dimensional contour of the surface of the object to be tested can be obtained by measuring the three colors of R, G, and B on the surface of the object.

然而,由於半導體等產業之製程技術早已走向高度整合性,以爭取時程縮短與系統化進行,進而節省製造成本與簡潔化流程;但在以該等量測用光學儀器量測受測物件之參數時,受測物件需分次經過該等儀器之處理與相對之移動,如此在設備成本與時程上仍有縮減之可能性,且製造中物件之移動有其損壞之可能性,故如何更符半導體等精細相關產業之線上即時測量特性仍可為一待努力突破之環節。However, as the process technology of semiconductor and other industries has already become highly integrated, the time-history is shortened and systematically carried out, thereby saving manufacturing costs and simplifying the process; however, measuring the object under test with the optical instrument for measuring When the parameters are measured, the objects to be tested need to be processed and moved relative to the instruments in stages, so there is still the possibility of reduction in equipment cost and time history, and the movement of the objects in the manufacturing has the possibility of damage, so how Even more in-line measurement characteristics of fine-related industries such as semiconductors can still be a breakthrough in efforts.

鑑於上述自習知技術觀察得之可突破點知,目前上述習用光學量測儀器有整合以節省設備成本、達到即時量測、快速監控、縮短製造時程、並降低製造中物件損壞之可能性的需要性,以更促產業進步。In view of the above-mentioned breakthroughs in self-study technology, the above-mentioned conventional optical measuring instruments have been integrated to save equipment costs, achieve real-time measurement, rapid monitoring, shorten manufacturing time, and reduce the possibility of damage of objects in manufacturing. Need to promote industrial progress.

鑑於上述,本發明之目的即在於提出一種多工物件參數光學量測整合裝置與方法。In view of the above, an object of the present invention is to provide an apparatus and method for optical measurement integration of a multiplex object.

本發明之多工物件參數光學量測整合裝置包含一光源單元、一光圈單元、一分光單元、一待測物端單元、一參考光處理單元、一光譜取得/影像擷取單元、一訊號處理單元、及一待測物支撐單元。該光源單元包含一外部光源、一準直光源、及一偏極單元,其中該準直單元接收該外部光源,用以提供一準直參考光與一準直入射光;而該偏極單元將該準直參考光與準直入射光加以偏極化,以得到一經偏極參考光與一經偏極入射光,且該經偏極參考光具有一行進路徑。該光圈單元包含一參考光光圈、一入射光光圈、及一待測光光圈,其中該參考光光圈控制該經偏極參考光的通過量,具有一開啟狀態與一關閉裝態,並在該關閉狀態時切斷 該經偏極參考光的行進路徑而該入射光光圈控制該經偏極入射光的通過量待測光光圈。該分光單元導引該經偏極參考光與該經偏極入射光各至一第一路徑與一第二路徑上。該待測物端單元位於該第二路徑上,用以透過該待測光光圈接收並聚焦該穿過該分光單元之經偏極入射光至該受測物件上,且該受測物件反射該穿過該分光單元之經偏極入射光而產生一待測光,該待測光透過該分光單元被折射至一該第二路徑反向之第三路徑上。該參考光處理單元位於該第一路徑上,用以在該參考光光圈處於該開啟狀態且該裝置處於一干涉模式時,反射該經偏極參考光而產生一準直作用參考光於該第三路徑上,且該待測光與該準直作用參考光透過該分光單元共同產生一干涉影像,並在該參考光光圈處於該關閉狀態且該裝置處於一顯微模式時,在該第三路徑上產生一經導引待測光影像。該光譜取得/影像擷取單元,包含一偏極分光單元、一光譜取得單元、及一影像擷取單元,其中該偏極分光單在該干涉模式時接收該干涉影像與在該顯微模時接收該待測光影像,而得到一第一待分析影像與一第二待分析影像;該光譜取得單元接收該第一待分析影像,以產生一光譜訊息;而該影像擷取單元接收該第二待分析影像。該訊號處理單元在該干涉模式時控制該受測物件在一垂直方向上移動,並分析該第二待分析影像,藉以在該第二待分析影像中找出並記錄每一像素之零光程差面,藉以令該光譜取得單元取得該光譜訊息,進而根據該光譜訊息與該第二待分析影像之至少一者計算出該受測物件的一表面形貌;關閉該參考光光圈以令該裝置進入該顯微模式,該光譜取得單元取得該零光程差面時之光譜訊息,並致動該受測物件在該垂直方向上移動,並藉由分析該第二待分析影像之每一像素的一對焦資訊,以得到一全對焦彩色影像與一全對焦黑白影像,並建立一深度反應曲線;致動該受測物件橫向移動,以根據該光譜訊息、該深 度反應曲線與一橫向色散現象取得該受測物件的一大範圍面積表面形貌;並當該待測物件為一具有一基板且在該基板上有一鍍膜層時,根據該零光程差面時之該光譜訊息推導出該受測物件的一膜厚尺寸及一另一表面形貌,其中該表面形貌與該另一表面形貌為相同者,該訊號處理單元可選擇僅計算與呈現其中一者。The multiplex object parameter optical measurement integration device of the present invention comprises a light source unit, an aperture unit, a beam splitting unit, an object end unit, a reference light processing unit, a spectral acquisition/image capturing unit, and a signal processing. a unit, and a test object support unit. The light source unit includes an external light source, a collimated light source, and a polarized unit, wherein the collimating unit receives the external light source to provide a collimated reference light and a collimated incident light; and the polarizing unit The collimated reference light and the collimated incident light are polarized to obtain a polarized reference light and a polarized incident light, and the polarized reference light has a traveling path. The aperture unit includes a reference light aperture, an incident light aperture, and a to-be-measured optical aperture, wherein the reference optical aperture controls the throughput of the polarized reference light, has an open state and a closed state, and is turned off Cut off when the state The incident light diaphragm controls the passing amount of the polarized incident light to be measured by the traveling path of the polarized reference light. The beam splitting unit directs the polarized reference light and the polarized incident light to a first path and a second path. The object to be tested is located on the second path for receiving and focusing the polarized incident light passing through the beam splitting unit to the object to be tested through the optical aperture to be measured, and the object to be tested reflects the wearing The light to be measured is generated by the polarized incident light of the light splitting unit, and the light to be measured is refracted through the light splitting unit to a third path in which the second path is reversed. The reference light processing unit is located on the first path for reflecting the polarized reference light to generate a collimated reference light when the reference light aperture is in the open state and the device is in an interference mode. And in the three paths, the light to be tested and the collimated reference light are collectively generated by the beam splitting unit to generate an interference image, and the third path is in the closed state when the reference light aperture is in the closed state and the device is in a micro mode A guided image to be measured is generated. The spectral acquisition/image capturing unit comprises a polarization splitting unit, a spectral acquisition unit, and an image capturing unit, wherein the polarization splitting sheet receives the interference image and the microscopic mode in the interference mode Receiving the image to be tested to obtain a first image to be analyzed and a second image to be analyzed; the spectrum acquisition unit receives the first image to be analyzed to generate a spectral message; and the image capturing unit receives the second image Image to be analyzed. The signal processing unit controls the object to be moved in a vertical direction during the interference mode, and analyzes the second image to be analyzed, thereby finding and recording the zero path length of each pixel in the second image to be analyzed. a difference surface, wherein the spectrum acquisition unit obtains the spectral information, and then calculates a surface topography of the measured object according to at least one of the spectral information and the second image to be analyzed; and closing the reference optical aperture to The device enters the micro mode, the spectrum acquisition unit acquires the spectral information of the zero optical path difference surface, and activates the object to be moved to move in the vertical direction, and analyzes each of the second image to be analyzed a focus information of the pixel to obtain a full focus color image and a full focus black and white image, and establish a depth response curve; actuate the object to be moved laterally to according to the spectral information, the depth And a lateral dispersion phenomenon to obtain a large-area surface topography of the object to be tested; and when the object to be tested has a substrate and a coating layer on the substrate, according to the zero optical path difference surface The spectral information at the time derives a film thickness dimension of the object to be tested and a surface topography, wherein the surface topography is identical to the other surface topography, and the signal processing unit can select only calculation and presentation. One of them.

本發明之多工物件參數光學量測整合方法包含下列步驟:(a)提供一準直參考光與一準直入射光;(b)偏極化該準直參考光與準直入射光,以得到一經偏極參考光與一經偏極入射光,且該經偏極參考光具有一行進路徑;(c)控制該經偏極參考光的通過量,並具有一開啟狀態與一關閉裝態,並在該關閉狀態時切斷該經偏極參考光的行進路徑;(d)控制該經偏極入射光的通過量;(e)導引該經偏極參考光與該經偏極入射光各至一第一路徑與一第二路徑上;(f)接收並聚焦該穿過該分光單元之經偏極入射光沿該第二路徑至該受測物件上,且該受測物件反射該穿過該分光單元之經偏極入射光而產生一待測光,並導引該待測光至一該第二路徑反向之第三路徑上;(g)在該參考光被控制為該開啟狀態且該裝置處於一干涉模式時,反射該經偏極參考光而產生一準直作用參考光於該第三路徑上,且該待測光與該準直作用參考光產生一干涉影像,並在該參考光被控制為該關閉狀態且該裝置處於一顯微模式時,產生一經導引待測光影像於該第三路徑上;(h)在該干涉模式時,接收該干涉影像與在該顯微模時接收該待測光影像,而得到一第一待分析影像與一第二待分析影像;(i)接收該第一待分析影像,以產生一光譜訊息;(j)接收該第二待分析影像;(k)在該干涉模式時,控制該受測物件在一垂直方向上移動,並分析該第二待分析影像,藉以在該第二待分析影像中找出並記錄每一像素之零光程差面,藉以取得該光譜訊息,進而根據該光譜訊息之該第二待分析影像之一計算 出該受測物件的一表面形貌;(l)控制該參考光光圈為該關閉裝態,以進入該顯微模式,並取得該零光程差面時之光譜訊息,並致動該受測物件在該垂直方向上移動,並藉由分析該第二待分析影像之每一像素的一對焦資訊,以得到一全對焦彩色影像與一全對焦黑白影像,並建立一深度反應曲線;(m)致動該受測物件橫向移動,以根據該光譜訊息、該深度反應曲線與一橫向色散現象取得該受測物件的一大範圍面積表面形貌;及(n)當該待測物件為一具有一基板且在該基板上有一鍍膜層時,根據該零光程差面時之該光譜訊息推導出該受測物件的一膜厚尺寸及一另一表面形貌,其中該表面形貌與該另一表面形貌為相同者,該訊號處理單元可選擇僅計算與呈現其中一者。The multiplexed object parameter optical measurement integration method of the present invention comprises the steps of: (a) providing a collimated reference light and a collimated incident light; (b) polarizing the collimated reference light and the collimated incident light to obtain a a polarized reference light and a polarized incident light, wherein the polarized reference light has a traveling path; (c) controlling a passing amount of the polarized reference light, and having an open state and a closed state, and Turning off the traveling path of the polarized reference light in the off state; (d) controlling the throughput of the polarized incident light; (e) guiding the polarized reference light and the polarized incident light to each a first path and a second path; (f) receiving and focusing the polarized incident light passing through the beam splitting unit along the second path to the object to be tested, and the object to be tested reflects the passing The light splitting unit generates a light to be measured through the polarized incident light, and guides the light to be measured to a third path in which the second path is reversed; (g) the reference light is controlled to the open state and the When the device is in an interference mode, the polarized reference light is reflected to generate a collimated reference light a third path, and the light to be measured generates an interference image with the collimated reference light, and when the reference light is controlled to the off state and the device is in a micro mode, a guided light image is generated (h) receiving, in the interference mode, the interference image and receiving the image to be measured during the micro mode, to obtain a first image to be analyzed and a second image to be analyzed; Receiving the first image to be analyzed to generate a spectral message; (j) receiving the second image to be analyzed; (k) controlling the object to be moved in a vertical direction during the interference mode, and analyzing the image a second image to be analyzed, wherein the zero optical path difference surface of each pixel is found and recorded in the second image to be analyzed, thereby obtaining the spectral information, and then calculating according to one of the second image to be analyzed of the spectral information. Extracting a surface topography of the object to be tested; (1) controlling the reference light aperture to be in the closed state to enter the microscopic mode, and obtaining a spectral information of the zero optical path difference surface, and actuating the received signal The object is moved in the vertical direction, and a focus information of each pixel of the second image to be analyzed is analyzed to obtain a full focus color image and a full focus black and white image, and a depth response curve is established; m) actuating the object to be moved laterally to obtain a large-area surface topography of the object to be tested according to the spectral information, the depth response curve and a lateral dispersion phenomenon; and (n) when the object to be tested is When a substrate is provided and a coating layer is formed on the substrate, a film thickness dimension and a surface morphology of the object to be tested are derived according to the spectral information of the zero optical path difference surface, wherein the surface topography In the same manner as the other surface topography, the signal processing unit may select to calculate and present only one of them.

藉由本發明之裝置及方法,由於傳統白光干涉儀、共焦顯微儀與橢偏儀之功能被有效整合為一單一裝置,故節省設備成本、達到即時量測、快速監控、縮短製造時程、並降低製造中物件損壞之可能性的優點與功效得以獲致。With the device and method of the present invention, since the functions of the conventional white light interferometer, confocal microscopy and ellipsometer are effectively integrated into a single device, equipment cost is saved, real-time measurement, rapid monitoring, shortened manufacturing time, and The advantages and benefits of reducing the possibility of damage to objects in manufacturing are achieved.

10‧‧‧準直光模組10‧‧‧ Collimation Light Module

11‧‧‧雙合透鏡11‧‧‧Double lens

12‧‧‧針孔12‧‧‧ pinhole

13‧‧‧聚焦透鏡13‧‧‧focus lens

14‧‧‧偏極片14‧‧‧Polar piece

15‧‧‧偏極片旋轉台15‧‧‧polar plate rotating table

16‧‧‧參考光反射鏡16‧‧‧Reference light mirror

17‧‧‧無限遠型校正物鏡17‧‧‧Infinity Correction Objectives

18‧‧‧無限遠型校正物鏡18‧‧‧Infinity Correcting Objectives

19‧‧‧聚焦透鏡19‧‧ ‧focus lens

20‧‧‧針孔20‧‧‧ pinhole

21‧‧‧聚焦透鏡21‧‧‧focus lens

22‧‧‧聚焦透鏡22‧‧‧focus lens

101‧‧‧光源單元101‧‧‧Light source unit

101a‧‧‧外部光源101a‧‧‧External light source

101b‧‧‧準直單元101b‧‧ ‧ Collimation unit

101c‧‧‧偏極單元101c‧‧‧polar unit

102‧‧‧光圈單元102‧‧‧ aperture unit

102a‧‧‧參考光光圈102a‧‧‧Reference light aperture

102b‧‧‧入射光光圈102b‧‧‧Incoming light aperture

102c‧‧‧待測光光圈102c‧‧‧Measurement aperture

103‧‧‧分光單元103‧‧‧Distribution unit

104‧‧‧待測物端單元104‧‧‧Measurement object unit

104a‧‧‧光程差精密位移機構104a‧‧‧Light path difference precision displacement mechanism

104b‧‧‧參考光反射鏡精密位移機構104b‧‧‧Reference light mirror precision displacement mechanism

105‧‧‧參考光處理單元105‧‧‧Reference light processing unit

106‧‧‧光譜取得/影像擷取單元106‧‧‧Spectrum acquisition/image capture unit

106a‧‧‧偏極分光單元106a‧‧‧polar spectroscopic unit

106b‧‧‧光譜取得單元106b‧‧‧spectral acquisition unit

106c‧‧‧影像擷取單元106c‧‧‧Image capture unit

107‧‧‧訊號處理單元107‧‧‧Signal Processing Unit

108‧‧‧待測物件支撐單元108‧‧‧Test object support unit

108a‧‧‧壓電致動器108a‧‧‧ Piezoelectric Actuator

108b‧‧‧精密位移載台108b‧‧‧Precision displacement stage

S301‧‧‧提供一準直參考光與一準直入射光S301‧‧‧ provides a collimated reference light and a collimated incident light

S302‧‧‧偏極化該準直參考光與準直入射光,以得到一經偏極參考光與一經偏極入射光,且該經偏極參考光具有一行進路徑S302‧‧‧ polarizing the collimated reference light and the collimated incident light to obtain a polarized reference light and a polarized incident light, and the polarized reference light has a traveling path

S303‧‧‧控制該經偏極參考光的通過量,並具有一開啟狀態與一關閉裝態,並在該關閉狀態時切斷該經偏極參考光的行進路徑S303‧‧‧ controls the passing amount of the polarized reference light, and has an open state and a closed state, and cuts the traveling path of the polarized reference light in the closed state

S304‧‧‧控制該經偏極入射光的通過量S304‧‧‧Control the throughput of the polarized incident light

S305‧‧‧導引該經偏極參考光與該經偏極入射光各至一第一路徑與一第二路徑上S305‧‧‧ guiding the polarized reference light and the polarized incident light to a first path and a second path

S306‧‧‧接收並聚焦該穿過該分光單元之經偏極入射光沿該第二路徑至該受測物件上,且該受測物件反射該穿過該分光單元之經偏極入射光而產生一待測光,並導引該待測光至一該第二路徑反向之第三路徑上S306‧‧‧ receiving and focusing the polarized incident light passing through the spectroscopic unit along the second path to the object to be tested, and the object to be tested reflects the polarized incident light passing through the spectroscopic unit Generating a light to be measured, and guiding the light to be measured to a third path in which the second path is reversed

S307‧‧‧在該參考光被控制為該開啟狀態且該裝置處於一干涉模式時,反射該經偏極參考光而產生一準直作用參考光於該第三路徑上,且該待測光與該準直作用參考光產生一干涉影像,並在該參考光被控制為該關閉狀態且該裝置處於一顯微模式時,產生一經導引待測光影像於該第三路徑上S307‧‧ ‧ when the reference light is controlled to the on state and the device is in an interference mode, the polarized reference light is reflected to generate a collimated reference light on the third path, and the light to be measured is The collimating action reference light generates an interference image, and when the reference light is controlled to the off state and the device is in a micro mode, generating a guided light image to be on the third path

S308‧‧‧在該干涉模式時,接收該干涉影像與在該顯微模時接收該待測光影像,而得到一第一待分析影像與一第二 待分析影像S308‧‧‧ In the interference mode, receiving the interference image and receiving the image to be tested during the micro mode, to obtain a first image to be analyzed and a second image Image to be analyzed

S309‧‧‧接收該第一待分析影像,以產生一光譜訊息S309‧‧‧ receiving the first image to be analyzed to generate a spectral message

S310‧‧‧接收該第二待分析影像S310‧‧‧ Receiving the second image to be analyzed

S311‧‧‧在該干涉模式時,控制該受測物件在一垂直方向上移動,並分析該第二待分析影像,藉以在該第二待分析影像中找出並記錄每一像素之零光程差面,藉以取得該光譜訊息,進而根據該光譜訊息與該第二待分析影像之至少一者計算出該受測物件的一表面形貌S311‧‧‧ In the interference mode, controlling the object to be moved to move in a vertical direction, and analyzing the second image to be analyzed, thereby finding and recording the zero light of each pixel in the second image to be analyzed Obtaining the spectral information, and calculating a surface topography of the measured object according to at least one of the spectral information and the second image to be analyzed

S312‧‧‧控制該參考光光圈為該關閉裝態,以進入該顯微模式,並取得該零光程差面時之光譜訊息,並致動該受測物件在該垂直方向上移動,並藉由分析該第二待分析影像之每一像素的一對焦資訊,以得到一全對焦彩色影像與一全對焦黑白影像,並建立一深度反應曲線S312‧‧‧ controlling the reference optical aperture to be in the closed state to enter the microscopic mode, and obtain the spectral information of the zero optical path difference surface, and actuate the object to be moved in the vertical direction, and By analyzing a focus information of each pixel of the second image to be analyzed, to obtain a full focus color image and a full focus black and white image, and establishing a depth response curve

S313‧‧‧致動該受測物件橫向移動,以根據該光譜訊息、該深度反應曲線與一橫向色散現象取得該受測物件的一大範圍面積表面形貌S313‧‧‧ actuation of the object to be moved laterally to obtain a large-area surface topography of the object to be tested according to the spectral information, the depth response curve and a lateral dispersion phenomenon

S314‧‧‧根據該零光程差面時之該光譜訊息推導出該受測物件的一膜厚尺寸S314‧‧‧Deriving a film thickness of the object to be tested based on the spectral information of the zero-path difference surface

以下圖式用以配合本發明之詳細說明,以令熟習該項技術者更得以了解本發明之特點與精神,其中:第1圖為本發明之多工物件參數光學量測整合裝置的方塊示意圖;第2圖為本發明之多工物件參數光學量測整合裝置的更細部架構示意圖;及第3A圖與第3B圖為本發明之多工物件參數光學量測整合方法的流程圖。The following drawings are used to clarify the detailed description of the present invention, so that those skilled in the art can better understand the features and spirit of the present invention. FIG. 1 is a block diagram of the multiplexed object parameter optical measurement integration device of the present invention. FIG. 2 is a schematic diagram showing a more detailed structure of the multiplexed object parameter optical measurement integration device of the present invention; and FIG. 3A and FIG. 3B are flowcharts of the method for integrating the optical measurement of the multiplex object parameter of the present invention.

以下將配合圖式及實施例來詳細說明本發明之特徵與實施方式,內容足以使任何熟習相關技藝者能夠輕易地充分理解本發明解決技術問題所應用的技術手段並據以實 施,藉此實現本發明可達成的功效。The features and embodiments of the present invention are described in detail below with reference to the drawings and embodiments, which are sufficient to enable those skilled in the art to fully understand the technical means to which the present invention solves the technical problems. Thereby, the achievable effects of the present invention are achieved.

本發明提出一種多工物件參數光學量測整合裝置及方法。首先,配合「第1圖」與「第2圖」進行本發明之裝置的說明,其中「第1圖」為本發明之多工物件參數光學量測整合裝置的方塊示意圖,「第2圖」則為本發明之多工物件參數光學量測整合裝置的更細部架構示意圖。The invention provides a device and a method for measuring optical parameters of a multiplex object. First, the description of the device of the present invention is carried out in conjunction with "Fig. 1" and "Fig. 2", wherein "Fig. 1" is a block diagram of the multiplexed object parameter optical measurement integration device of the present invention, "Fig. 2" It is a schematic diagram of a more detailed structure of the multiplexed object parameter optical measurement integration device of the present invention.

如圖所示,本發明之多工物件參數光學量測整合裝置100包含一光源單元101、一光圈單元102、一分光單元103、一待測物端單元104、一參考光處理單元105、一光譜取得/影像擷取單元106、一訊號處理單元107、及一待測物件支撐單元108,用以對一受測物件A進行幾何參數的量測,其中受測物件A為一具有一膜層於其一表面上的物件,並典型上為半導體元件等類似微細領域之元件。As shown in the figure, the multiplex object parameter optical measurement integration device 100 of the present invention comprises a light source unit 101, an aperture unit 102, a beam splitting unit 103, an object end unit 104 to be tested, a reference light processing unit 105, and a The spectral acquisition/image capturing unit 106, a signal processing unit 107, and an object to be tested support unit 108 are configured to measure geometric parameters of an object A to be tested, wherein the object A to be tested has a film layer. An object on one of its surfaces, and is typically a component such as a semiconductor element or the like.

該光源單元101包含一外部光源101a、一準直單元101b、及一偏極單元101c。該外部光源101a可為一白光鹵素燈或紅外光燈,且其光強度具有一高斯分佈。該偏極單元101c接收該外部光源101a,用以提供一準直參考光R1與一準直入射光I1。該偏極單元101c將該準直參考光R1與準直入射光I1加以偏極化,以得到一經偏極參考光R2與一經偏極入射光I2。The light source unit 101 includes an external light source 101a, a collimating unit 101b, and a polarizing unit 101c. The external light source 101a can be a white halogen lamp or an infrared lamp, and its light intensity has a Gaussian distribution. The polarizing unit 101c receives the external light source 101a for providing a collimated reference light R1 and a collimated incident light I1. The polarization unit 101c polarizes the collimated reference light R1 and the collimated incident light I1 to obtain a polarized reference light R2 and a polarized incident light I2.

該光圈單元102包含一參考光光圈102a、一入射光光圈102b、及一待測光光圈102c。該參考光光圈102a控制該經偏極參考光R2的通過量,具有一開啟狀態與一關閉裝態,並在該關閉狀態時切斷該經偏極參考光R2的行進路徑,即該裝置100的整個後級元件中皆不在有經偏極參考光R2的存在。該入射光光圈102b控制該經偏極入射光I2的通過量,該待測光光圈102c將在後文中描述。The aperture unit 102 includes a reference aperture 102a, an incident aperture 102b, and a to-be-measured aperture 102c. The reference optical aperture 102a controls the throughput of the polarized reference light R2, has an open state and a closed state, and cuts the travel path of the polarized reference light R2 in the closed state, that is, the device 100 There is no presence of the polarized reference light R2 in the entire subsequent element. The incident light aperture 102b controls the throughput of the polarized incident light I2, which will be described later.

該分光單元103將該經偏極參考光R2與該經偏極入射光I2分別導引至一第一路徑P1與一第二路徑P2兩者 上。The beam splitting unit 103 guides the polarized reference light R2 and the polarized incident light I2 to a first path P1 and a second path P2, respectively. on.

該待測物端單元104位於該第二路徑P2上,用以透過該待測光光圈102c接收並聚焦該穿過該分光單元103之經偏極入射光I2至受測物件A上,且受測物件A反射該穿過該分光單元103之經偏極入射光I2而產生一待測光M1,該待測光M1透過該分光單元103被折射至一該第二路徑P2反向之第三路徑P3上。The object end unit 104 is located on the second path P2, and is configured to receive and focus the polarized incident light I2 passing through the beam splitting unit 103 to the object to be tested A through the optical aperture 102c to be measured, and is tested. The object A reflects the polarized incident light I2 passing through the beam splitting unit 103 to generate a light to be measured M1. The light to be measured M1 is refracted through the light splitting unit 103 to a third path P3 opposite to the second path P2. .

該參考光處理單元105位於該第一路徑P1上。當參考光光圈102a處於該開啟狀態時,裝置100處於一干涉模式,參考光處理單元105反射該經偏極參考光R2,因之產生一準直作用參考光R3行進於該第三路徑P3上,且該待測光M1與該準直作用參考光R3透過該分光單元103共同產生一干涉影像,該干涉模式即指裝置100之此時的操作狀態。當參考光光圈102a處於該關閉狀態時,裝置100處於一顯微模式,此時在該第三路徑P3上有一經導引待測光影像M2的存在。The reference light processing unit 105 is located on the first path P1. When the reference optical aperture 102a is in the on state, the device 100 is in an interference mode, and the reference light processing unit 105 reflects the polarized reference light R2, thereby generating a collimation effect reference light R3 traveling on the third path P3. And the interference light M1 and the collimation action reference light R3 jointly generate an interference image through the light splitting unit 103, and the interference mode refers to the operation state of the device 100 at this time. When the reference aperture 102a is in the closed state, the device 100 is in a micro mode, and at this time, there is a presence of the guided light image to be measured M2 on the third path P3.

該光譜取得/影像擷取單元106包含一偏極分光單元106a、一光譜取得單元106b及一影像擷取單元106cThe spectrum acquisition / image capturing unit 106 comprises a biasing electrode spectroscopic units 106a, 106b a spectrum acquisition unit and an image capture unit 106 c.

在該干涉模式時,偏極分光單元106a接收該干涉影像;並在該顯微模時,接收該待測光影像,而得到一第一待分析影像與一第二待分析影像。光譜取得單元106b接收該第一待分析影像,以在各操作條件下產生對應之一光譜訊息。影像擷取單元106c則接收該第二待分析影像,以便供後序分析處理,以利用第二待分析影像與待測物件A之關係得到待測物件A的各個幾何參數。In the interference mode, the polarization beam splitting unit 106a receives the interference image; and in the micro mode, receives the image to be measured to obtain a first image to be analyzed and a second image to be analyzed. The spectrum acquisition unit 106b receives the first image to be analyzed to generate a corresponding one of the spectral information under each operating condition. The image capturing unit 106c receives the second image to be analyzed for subsequent analysis processing to obtain the geometric parameters of the object A to be tested by using the relationship between the second image to be analyzed and the object A to be tested.

該訊號處理單元107用以分析計算出受測物件A的各個幾何參數。在干涉模式時,訊號處理單元107控制受測物件A在一垂直方向V上移動,並分析第二待分析影像,藉以在第二待分析影像中找出並記錄每一像素之一零光程差 面,藉以令該光譜取得單元106b取得此一操作條件下的光譜訊息,進而根據該光譜訊息計算出該受測物件A的一表面形貌。The signal processing unit 107 is configured to analyze and calculate various geometric parameters of the tested object A. In the interference mode, the signal processing unit 107 controls the object A to be moved in a vertical direction V, and analyzes the second image to be analyzed, thereby finding and recording one zero path of each pixel in the second image to be analyzed. difference The surface acquisition unit 106b obtains the spectral information under the operating condition, and calculates a surface topography of the measured object A based on the spectral information.

接著,訊號處理單元107關閉參考光光圈102a以令裝置100進入顯微模式,光譜取得單元106b取得該零光程差面相對應之操作條件時的光譜訊息,並致動受測物件A在垂直方向V上移動,並藉由分析第二待分析影像之每一像素的一對焦資訊,以得到一全對焦彩色影像與一全對焦黑白影像,並建立一深度反應曲線。Next, the signal processing unit 107 turns off the reference optical aperture 102a to cause the device 100 to enter the microscopic mode, and the spectral acquisition unit 106b obtains the spectral information when the zero optical path difference surface corresponds to the operating condition, and activates the measured object A in the vertical direction. Moving on V, and analyzing a focus information of each pixel of the second image to be analyzed, to obtain a full focus color image and a full focus black and white image, and establishing a depth response curve.

接著,訊號處理單元107致動受測物件A橫向移動,以根據本操作條件下的光譜訊息、該求出之深度反應曲線與一橫向色散現象取得受測物件A的一大範圍面積表面形貌。Then, the signal processing unit 107 actuates the object A to move laterally to obtain a large-area surface topography of the object A according to the spectral information under the operating conditions, the obtained depth response curve and a lateral dispersion phenomenon. .

最後,當待測物件A為一具有一基板且在該基板上有一鍍膜層之結構時,根據該零光程差面時對應之操作條件下取得的光譜訊息推導出受測物件A的一膜厚尺寸,並可同時推導出一表面形貌,其中此表面形貌與上述表面形貌之取得在方式上不同,但求出之數值則相同,故受測物件A的表面形貌得以上述兩種方式求出,任選其一計算與呈現出來即可。Finally, when the object to be tested A has a structure with a substrate and a coating layer on the substrate, a film of the object A to be tested is derived according to the spectral information obtained under the operating conditions corresponding to the zero-path difference surface. Thickness, and a surface topography can be derived at the same time, wherein the surface topography is different from the above surface topography, but the obtained values are the same, so the surface topography of the measured object A can be the above two The method is determined, and one of them can be calculated and presented.

以下將對上述裝置100描述其更細部施行實施例。The above-described apparatus 100 will be described with respect to its more detailed embodiment.

待測物單元104更包含一光程差精密位移機構104a及一參考光反射鏡精密位移機構104b,其中光程差精密位移機構104a調整該準直作用參考光使與該待測光之間具有一零光程差,參考光反射鏡精密位移機構104b調整該干涉影像中之複數道條紋的對比度。The object to be tested unit 104 further includes an optical path difference precision displacement mechanism 104a and a reference light mirror precision displacement mechanism 104b, wherein the optical path difference precision displacement mechanism 104a adjusts the collimation action reference light to have a relationship with the light to be measured. With zero optical path difference, the reference light mirror precision displacement mechanism 104b adjusts the contrast of the complex stripe in the interference image.

偏極分光單元106a更包含一調整分光鏡角度旋轉平台(未顯示),用以調整該干涉影像中之複數道條紋的影像 清晰度。The polarizing beam splitting unit 106a further includes an adjusting beam splitter angle rotating platform (not shown) for adjusting the image of the plurality of stripes in the interference image. Sharpness.

本發明之裝置100更包含一待測物支撐單元108,待測物支撐單元108包含一壓電致動器108a及一精密位移載台108b,其中壓電致動器108a為該訊號處理單元107在該干涉模式時控制以讓受測物件A移動於該垂直方向V上,精密位移載台108b則用以支撐該壓電致動器108a。The device 100 of the present invention further includes a DUT support unit 108. The DUT support unit 108 includes a piezoelectric actuator 108a and a precision displacement stage 108b. The piezoelectric actuator 108a is the signal processing unit 107. In the interference mode, control is performed to move the object to be tested A in the vertical direction V, and the precision displacement stage 108b is used to support the piezoelectric actuator 108a.

訊號處理單元107在顯微模式時致動受測物件A於垂直方向V上移動,並分析第二待分析影像中每一畫素中的一高頻訊息,並拼接每畫素之一景深內灰階值,還原一影像失焦資訊,以形成該全對焦彩色影像與全對焦黑白影像,並建立該深度反應曲線。The signal processing unit 107 moves the object A to be moved in the vertical direction V in the micro mode, and analyzes a high frequency message in each pixel of the second image to be analyzed, and splicing one depth of each pixel The grayscale value restores an image out of focus information to form the full focus color image and the full focus black and white image, and establishes the depth response curve.

訊號處理單元107使用一影像對比度遮罩濾波與該等經分析得之高頻資訊分析該待分析影像之每像素的高頻資訊還原該影像失焦資訊,以得到該全對焦黑白影像,並分離該待分析影像為RGB三種顏色之影像,再分析並疊加RGB三種顏色影像,以還原成該全對焦彩色影像。The signal processing unit 107 uses an image contrast mask filter and the analyzed high frequency information to analyze the high frequency information of each pixel of the image to be analyzed to restore the image out of focus information to obtain the full focus black and white image, and separate The image to be analyzed is an image of three colors of RGB, and then the three color images of RGB are analyzed and superimposed to be restored to the full-focus color image.

光譜取得單元106b在顯微模式時擷取受測物件A之基板之一上表面與鍍膜層之一上面的光譜訊息,並依據該零光程差面之光譜訊息反推受測物件A之基板上表面與鍍膜層上表面之間的距離,並以該距離當作該鍍膜層的厚度。The spectrum acquisition unit 106b extracts the spectral information on one of the upper surface of the substrate of the object A and the coating layer in the microscopic mode, and reverses the substrate of the object A according to the spectral information of the zero-optical difference surface. The distance between the upper surface and the upper surface of the coating layer, and the distance is taken as the thickness of the coating layer.

適為影像擷取單元106c與光譜取得單元106b感測之光可為可見光或非可見光。The light suitable for the image capturing unit 106c and the spectrum acquiring unit 106b may be visible light or non-visible light.

訊號處理單元107對上述干涉條紋加以一相位移演算法,並分析該等干涉條紋之一最大強度,藉以建立一表面形貌資訊而取得受測物件A之表面形貌。The signal processing unit 107 applies a phase shift algorithm to the interference fringes, and analyzes the maximum intensity of one of the interference fringes, thereby establishing a surface topography information to obtain the surface topography of the object A to be tested.

現請參閱「第2圖」,用以配合對「第1圖」中各單元之細部元件進行說明。Please refer to "Figure 2" for the purpose of explaining the detailed components of each unit in "Figure 1".

如圖所示,光源單元101包含一準直光模組10及一偏極片14,其中準直光模組10包含一雙合透鏡11、一 針孔12及、一聚焦透鏡13,該偏極片14包含一偏極片旋轉台15。參考光處理單元105包含一參考光反射鏡16及一無限遠型校正物鏡17。在待測光M1通往待測物件支撐單元108(未顯示於圖中,但即包含壓電致動器108a及精密位移載台108b者)上具有一無限遠型校正物鏡18及一聚焦透鏡19。在偏極分光單元106a至光譜取得單元106b的路徑上有一針孔20及一聚焦透鏡21的存在,偏極分光單元106a更包含一偏極分光單元旋轉平台(未顯示),在偏極分光單元106a至影像擷取單元106c的路徑上更包含一聚焦透鏡22。熟習該項技術者可輕易知悉上述一般常用之細部光學元件10、11、至22之作用,在此省略贅述,以求簡潔。As shown in the figure, the light source unit 101 includes a collimating optical module 10 and a polarizing plate 14 , wherein the collimating optical module 10 includes a doublet 11 and a The pinhole 12 and a focusing lens 13 include a polarizing plate rotating table 15. The reference light processing unit 105 includes a reference light mirror 16 and an infinity type correction objective lens 17. An infinity-type correction objective lens 18 and a focus lens 19 are provided on the object to be tested M1 leading to the object support unit 108 (not shown in the drawing, but including the piezoelectric actuator 108a and the precision displacement stage 108b). . There is a pinhole 20 and a focus lens 21 on the path of the polarization splitting unit 106a to the spectrum obtaining unit 106b. The polarizing beam splitting unit 106a further includes a polarizing beam splitting unit rotating platform (not shown) in the polarizing beam splitting unit. The path from 106a to the image capturing unit 106c further includes a focusing lens 22. Those skilled in the art can easily understand the functions of the above-mentioned generally used detailed optical elements 10, 11, and 22, and the detailed description is omitted here for brevity.

藉由前文描述可知:本發明之裝置建構以Linnik干涉顯微儀為基本架構,整合傳統干涉儀、顯微儀與橢圓偏光儀之功能,即整合傳統白光干涉儀之表面形貌量測功能、共焦顯微儀之全景深影像分析功能、與橢圓偏光儀之膜厚尺寸量測功能,得以同時量測受測物件之表面形貌、全對焦彩色與黑白影像、大範圍面積表面形貌、及膜厚尺寸等三維幾何參數。藉此,相對於習用裝置,半導體等微習相關元件得利用本發明裝置之量測處理而達節省設備成本、設備系統簡單化、節省設備所佔空間、即時量測、快速監控、縮短製造時程、並減少移動待測物件之工且降低製造中物件損壞之可能性的優點與功效。As can be seen from the foregoing description, the device of the present invention is constructed by using a Linnik interference microscopy as a basic structure, integrating the functions of a conventional interferometer, a microscopy instrument and an ellipsometer, that is, integrating the surface topography measurement function of a conventional white light interferometer, The panoramic deep image analysis function of the confocal microscope and the film thickness measurement function of the ellipsometer can simultaneously measure the surface topography of the object under test, full-focus color and black-and-white image, large-area surface topography, and film. Three-dimensional geometric parameters such as thick dimensions. Thereby, compared with the conventional device, the micro-learning related components such as semiconductors can utilize the measurement processing of the device of the invention to save equipment cost, simplify the device system, save space occupied by the device, perform real-time measurement, quickly monitor, and shorten manufacturing time. And reduce the advantages and effects of moving the object to be tested and reducing the possibility of damage to the object in manufacture.

以下,本發明之多工物件參數光學量測整合方法將被配合顯示其之流程的「第3A圖」與「第3B圖」加以說明。Hereinafter, the multiplexed object parameter optical measurement integration method of the present invention will be described in conjunction with "3A" and "3B" showing the flow of the multiplex object.

本發明之多工物件參數光學量測整合方法所包含的步驟將詳述如下。首先,提供一準直參考光與一準直入射光(S301)。其次,偏極化該準直參考光與準直入射光,以得到一經偏極參考光與一經偏極入射光,且該經偏極參考光具 有一行進路徑(S302)。接著,控制該經偏極參考光的通過量,並具有一開啟狀態與一關閉裝態,並在該關閉狀態時切斷該經偏極參考光的行進路徑(S303)。接著,控制該經偏極入射光的通過量(S304)。接著,導引該經偏極參考光與該經偏極入射光各至一第一路徑與一第二路徑上(S305)。續之,接收並聚焦該穿過該分光單元之經偏極入射光沿該第二路徑至該受測物件上,且該受測物件反射該穿過該分光單元之經偏極入射光而產生一待測光,並導引該待測光至一該第二路徑反向之第三路徑上(S306)。續之,在該參考光被控制為該開啟狀態且該裝置處於一干涉模式時,反射該經偏極參考光而產生一準直作用參考光於該第三路徑上,且該待測光與該準直作用參考光產生一干涉影像,並在該參考光被控制為該關閉狀態且該裝置處於一顯微模式時,產生一經導引待測光影像於該第三路徑上(S307)。接著,在該干涉模式時,接收該干涉影像與在該顯微模時接收該待測光影像,而得到一第一待分析影像與一第二待分析影像(S308)。接著,接收該第一待分析影像,以產生一光譜訊息(S309)。接著,接收該第二待分析影像(S310)。接著,在該干涉模式時,控制該受測物件在一垂直方向上移動,並分析該第二待分析影像,藉以在該第二待分析影像中找出並記錄每一像素之零光程差面,藉以取得該光譜訊息,進而根據該光譜訊息與該第二待分析影像之至少一者計算出該受測物件的一表面形貌(S311)。續之,控制該參考光光圈為該關閉裝態,以進入該顯微模式,並取得該零光程差面時之光譜訊息,並致動該受測物件在該垂直方向上移動,並藉由分析該第二待分析影像之每一像素的一對焦資訊,以得到一全對焦彩色影像與一全對焦黑白影像,並建立一深度反應曲線(S312)。致動該受測物件橫向移動,以根據該光譜訊息、該深度反應曲線與一橫向色散現象取得該受測物件的一大範圍面積表面形貌(S313)。最後,根據該零光程差面時之該 光譜訊息推導出該受測物件的一膜厚尺寸(S314)。The steps involved in the optical measurement integration method of the multiplex object of the present invention will be described in detail below. First, a collimated reference light and a collimated incident light are provided (S301). Secondly, the collimated reference light and the collimated incident light are polarized to obtain a polarized reference light and a polarized incident light, and the polarized reference optical device There is a travel path (S302). Next, the throughput of the polarized reference light is controlled, and has an open state and a closed state, and the traveling path of the polarized reference light is cut off in the closed state (S303). Next, the throughput of the polarized incident light is controlled (S304). Then, the polarized reference light and the polarized incident light are respectively guided to a first path and a second path (S305). Continuing, receiving and focusing the polarized incident light passing through the beam splitting unit along the second path to the object to be tested, and the measured object reflects the polarized incident light passing through the beam splitting unit to generate The light to be measured is guided to the third path in which the second path is reversed (S306). In addition, when the reference light is controlled to the on state and the device is in an interference mode, the polarized reference light is reflected to generate a collimated reference light on the third path, and the light to be measured and the The collimating action reference light generates an interference image, and when the reference light is controlled to the off state and the device is in a micro mode, a guided light image is generated on the third path (S307). Then, in the interference mode, the interference image is received and the image to be tested is received during the micro mode, and a first image to be analyzed and a second image to be analyzed are obtained (S308). Then, the first image to be analyzed is received to generate a spectral message (S309). Then, the second image to be analyzed is received (S310). Then, in the interference mode, the object to be tested is controlled to move in a vertical direction, and the second image to be analyzed is analyzed, thereby finding and recording the zero optical path difference of each pixel in the second image to be analyzed. The surface information is obtained by the surface, and a surface topography of the object to be tested is calculated according to at least one of the spectral information and the second image to be analyzed (S311). In addition, the reference light aperture is controlled to enter the micro mode, and the spectral information of the zero optical path difference surface is obtained, and the object to be tested is actuated to move in the vertical direction, and A focus information of each pixel of the second image to be analyzed is analyzed to obtain a full focus color image and a full focus black and white image, and a depth response curve is established (S312). Actuating the object to be moved laterally to obtain a large-area surface topography of the object to be tested according to the spectral information, the depth response curve and a lateral dispersion phenomenon (S313). Finally, according to the zero optical path difference The spectral information derives a film thickness dimension of the object under test (S314).

本發明之方法的較細部說明與前述對本發明之裝置者相仿,吾人得直接參閱前文之描述而得知,在此為簡潔而省略贅述。The detailed description of the method of the present invention is similar to that of the above-described apparatus of the present invention, and it is to be understood by referring to the foregoing description, which is omitted here for brevity.

相較於習知方法,本發明之方法所具有的優點與效能與前述對本發明之裝置者相仿,吾人得直接參閱前文之描述而得知,在此為簡潔而省略贅述。Compared with the conventional method, the advantages and the advantages of the method of the present invention are similar to those of the above-mentioned device of the present invention, and it is to be understood by referring to the foregoing description, which is omitted here for brevity.

本發明已詳細說明如上,熟習該項技術者已可利用較佳實施例與圖式之配合說明據以實施本發明,然須聲明的是所有在精神上屬於本發明之簡易推衍與變體者,皆當按申請專利範圍之載述視為本發明之範圍。The present invention has been described in detail above, and those skilled in the art can use the description of the preferred embodiments and the drawings to practice the invention, and all the modifications and variants of the present invention in spirit are claimed. The description of the scope of the patent application is considered to be within the scope of the invention.

101‧‧‧光源單元101‧‧‧Light source unit

101a‧‧‧外部光源101a‧‧‧External light source

101b‧‧‧準直單元101b‧‧ ‧ Collimation unit

101c‧‧‧偏極單元101c‧‧‧polar unit

102‧‧‧光圈單元102‧‧‧ aperture unit

102a‧‧‧參考光光圈102a‧‧‧Reference light aperture

102b‧‧‧入射光光圈102b‧‧‧Incoming light aperture

102c‧‧‧待測光光圈102c‧‧‧Measurement aperture

103‧‧‧分光單元103‧‧‧Distribution unit

104‧‧‧待側物端單元104‧‧‧Side side unit

104a‧‧‧光程差精密位移機構104a‧‧‧Light path difference precision displacement mechanism

104b‧‧‧參考光反射鏡精密位移機構104b‧‧‧Reference light mirror precision displacement mechanism

105‧‧‧參考光處理單元105‧‧‧Reference light processing unit

106‧‧‧光譜取得/影像擷取單元106‧‧‧Spectrum acquisition/image capture unit

106a‧‧‧偏極分光單元106a‧‧‧polar spectroscopic unit

106b‧‧‧光譜取得單元106b‧‧‧spectral acquisition unit

106c‧‧‧影像擷取單元106c‧‧‧Image capture unit

107‧‧‧訊號處理單元107‧‧‧Signal Processing Unit

108‧‧‧待測物件支撐單元108‧‧‧Test object support unit

108a‧‧‧壓電致動器108a‧‧‧ Piezoelectric Actuator

108b‧‧‧精密位移載台108b‧‧‧Precision displacement stage

Claims (16)

一種多工物件參數光學量測整合裝置,包含:一光源單元,包含:一外部光源;一準直單元,接收該外部光源,用以提供一準直參考光與一準直入射光;一偏極單元,用以將該準直參考光與準直入射光加以偏極化,以得到一經偏極參考光與一經偏極入射光,且該經偏極參考光具有一行進路徑;一光圈單元,包含:一參考光光圈,用以控制該經偏極參考光的通過量,具有一開啟狀態與一關閉裝態,並在該關閉狀態時切斷該經偏極參考光的行進路徑;一入射光光圈,用以控制該經偏極入射光的通過量;及一待測光光圈;一分光單元,用以導引該經偏極參考光與該經偏極入射光各至一第一路徑與一第二路徑上;一待測物端單元,位於該第二路徑上,用以透過該待測光光圈接收並聚焦該穿過該分光單元之經偏極入射光至該受測物件上,且該受測物件反射該穿過該分光單元之經偏極入射光而產生一待測光,該待測光透過該分光單元被折射至一該第二路徑反向之第三路徑上;一參考光處理單元,位於該第一路徑上,用以在該參考光光圈處於該開啟狀態且該裝置處於一干涉模式時,反射該經偏極參考光而產生一準直作用參考光於該第三路徑上,且該待測光與該準直作用參考光透過該分光單元共同產生一干涉影像,並在該參考光光圈處於該關閉狀態且該裝置處於一顯微模式時,在該第三路徑上產生一經導引待測光影像;一光譜取得/影像擷取單元,包含: 一偏極分光單元,用以在該干涉模式時接收該干涉影像與在該顯微模時接收該待測光影像,而得到一第一待分析影像與一第二待分析影像;一光譜取得單元,用以接收該第一待分析影像,以產生一光譜訊息;及一影像擷取單元,用以接收該第二待分析影像;及一訊號處理單元,在該干涉模式時控制該受測物件在一垂直方向上移動,並分析該第二待分析影像,藉以在該第二待分析影像中找出並記錄每一像素之零光程差面,藉以令該光譜取得單元取得該光譜訊息,進而根據該光譜訊息與該第二待分析影像之至少一者計算出該受測物件的一表面形貌;關閉該參考光光圈以令該裝置進入該顯微模式,該光譜取得單元取得該零光程差面時之光譜訊息,並致動該受測物件在該垂直方向上移動,並藉由分析該第二待分析影像之每一像素的一對焦資訊,以得到一全對焦彩色影像與一全對焦黑白影像,並建立一深度反應曲線;致動該受測物件橫向移動,以根據該光譜訊息、該深度反應曲線與一橫向色散現象取得該受測物件的一大範圍面積表面形貌;並當該待測物件為一具有一基板且在該基板上有一鍍膜層時,根據該零光程差面時之該光譜訊息推導出該受測物件的一膜厚尺寸及一另一表面形貌,其中該表面形貌與該另一表面形貌為相同者,該訊號處理單元可選擇僅計算與呈現其中一者。A multiplexed object parameter optical measurement integration device comprises: a light source unit comprising: an external light source; a collimating unit receiving the external light source for providing a collimated reference light and a collimated incident light; a unit for polarizing the collimated reference light and the collimated incident light to obtain a polarized reference light and a polarized incident light, and the polarized reference light has a traveling path; an aperture unit, including a reference light aperture for controlling the throughput of the polarized reference light, having an open state and a closed state, and cutting the traveling path of the polarized reference light in the closed state; an incident light An aperture for controlling the throughput of the polarized incident light; and a light aperture to be measured; a light splitting unit for guiding the polarized reference light and the polarized incident light to a first path and a a second path is disposed on the second path for receiving and focusing the polarized incident light passing through the beam splitting unit to the object to be tested through the optical aperture to be measured, and the The object under test reflects this Passing the polarized incident light of the spectroscopic unit to generate a light to be measured, the light to be measured is refracted through the spectroscopic unit to a third path in which the second path is reversed; a reference light processing unit is located in the first path And, when the reference optical aperture is in the open state and the device is in an interference mode, the polarized reference light is reflected to generate a collimated reference light on the third path, and the light to be tested is And collimating the reference light to generate an interference image through the beam splitting unit, and generating a guided light image on the third path when the reference light aperture is in the closed state and the device is in a micro mode; Spectral acquisition/image capture unit, comprising: a polarization splitting unit for receiving the interference image in the interference mode and receiving the image to be measured during the micro mode, to obtain a first image to be analyzed and a second image to be analyzed; a spectrum acquisition unit Receiving the first image to be analyzed to generate a spectral message; and an image capturing unit for receiving the second image to be analyzed; and a signal processing unit controlling the object to be tested in the interference mode Moving in a vertical direction and analyzing the second image to be analyzed, thereby finding and recording a zero path difference surface of each pixel in the second image to be analyzed, so that the spectrum acquiring unit obtains the spectral information. And calculating a surface topography of the object to be tested according to at least one of the spectral information and the second image to be analyzed; turning off the reference light aperture to cause the device to enter the microscopic mode, the spectral acquisition unit obtaining the zero The spectral information of the optical path difference surface, and actuating the object to be moved in the vertical direction, and analyzing a focus information of each pixel of the second image to be analyzed to obtain a full a focus color image and a full focus black and white image, and establishing a depth response curve; actuating the object to be moved laterally to obtain a large range of the object to be tested according to the spectral information, the depth response curve and a lateral dispersion phenomenon An area surface topography; and when the object to be tested has a substrate and a coating layer on the substrate, the film thickness of the object to be tested is derived according to the spectral information of the zero optical path difference surface and In another surface topography in which the surface topography is identical to the other surface topography, the signal processing unit may select to calculate and present only one of them. 如申請專利範圍第1項之裝置,其中:該參考光處理單元更包含:一光程差精密位移機構,用以調整該準直作用參考光使與該待測光之間具有一零光程差;及一參考光反射鏡精密位移機構,調整該干涉影像中之複數道條紋的對比度; 該偏極分光單元更包含一調整分光鏡角度旋轉平台,用以調整該干涉影像中之複數道條紋的影像清晰度;且該裝置更包含一待測物支撐單元,包含:一壓電致動器,為該訊號處理單元在該干涉模式時控制該受測物件移動於該垂直方向上;及一精密位移載台,用以支撐該壓電致動器。 The device of claim 1, wherein the reference light processing unit further comprises: an optical path difference precision displacement mechanism for adjusting the collimated reference light to have a zero optical path difference from the light to be measured. And a reference light mirror precision displacement mechanism to adjust the contrast of the plurality of stripes in the interference image; The polarizing beam splitting unit further includes an adjusting beam splitter angle rotating platform for adjusting image sharpness of the plurality of stripes in the interference image; and the device further comprises a DST supporting unit, comprising: a piezoelectric actuator The signal processing unit controls the object to be moved in the vertical direction during the interference mode; and a precision displacement stage for supporting the piezoelectric actuator. 如申請專利範圍第1項之裝置,其中該訊號處理單元在該顯微模式時致動該受測物件於該垂直方向上移動,並分析該第二待分析影像中每一畫素中的一高頻訊息,並拼接每畫素之一景深內灰階值,還原一影像失焦資訊,以形成該全對焦彩色影像與該全對焦黑白影像,並建立該深度反應曲線。 The device of claim 1, wherein the signal processing unit actuates the object to be moved in the vertical direction in the micro mode, and analyzes one of each pixel in the second image to be analyzed. The high frequency message is spliced and the gray scale value of one depth of each pixel is spliced to restore an image out of focus information to form the full focus color image and the full focus black and white image, and the depth response curve is established. 如申請專利範圍第3項之裝置,其中該訊號處理單元使用一影像對比度遮罩濾波法與該等經分析得之高頻資訊還原該影像失焦資訊,以得到該全對焦黑白影像,並分離該待分析影像為RGB三種顏色之影像,再分析並疊加該RGB三種顏色影像,以還原成該全對焦彩色影像。 The device of claim 3, wherein the signal processing unit uses an image contrast mask filtering method and the analyzed high frequency information to restore the image out of focus information to obtain the full focus black and white image, and separate The image to be analyzed is an image of three colors of RGB, and then the three color images of the RGB are analyzed and superimposed to be restored to the full focus color image. 如申請專利範圍第1項之裝置,其中該光譜取得單元在該顯微模式時擷取該受測物件之該基板之一上表面與該鍍膜層之一上面的光譜訊息,並依據該零光程差面之光譜訊息反推該受測物件之該基板上表面與該鍍膜層上表面之間的距離,並以該距離當作該鍍膜層的厚度。 The apparatus of claim 1, wherein the spectrum acquisition unit captures a spectral information on an upper surface of the substrate and one of the coating layers of the object to be tested in the micro mode, and according to the zero light The spectral information of the path surface reverses the distance between the upper surface of the substrate of the object to be tested and the upper surface of the coating layer, and the distance is regarded as the thickness of the coating layer. 如申請專利範圍第1項之裝置,其中該外部光源為一白光鹵素燈與紅外光燈之一,且具有一高斯分佈之強度。 The device of claim 1, wherein the external light source is one of a white halogen lamp and an infrared lamp, and has a Gaussian distribution intensity. 如申請專利範圍第1項之裝置,其中該影像擷取單元與該光譜取得單元可感測者可為可見光與非可見光。 The device of claim 1, wherein the image capturing unit and the spectrum acquiring unit are sensible to visible light and non-visible light. 如申請專利範圍第1項之裝置,其中該訊號處理單元對該等干涉條紋加以一相位移演算法,並分析該等干涉條紋之一最大強度,藉以建立一表面形貌資訊而取得該受測物件之表面形貌。 The device of claim 1, wherein the signal processing unit performs a phase shift algorithm on the interference fringes and analyzes a maximum intensity of the interference fringes to establish a surface topography information to obtain the measured The surface topography of the object. 一種多工物件參數光學量測整合方法,包含下列步驟: (a)提供一準直參考光與一準直入射光;(b)偏極化該準直參考光與準直入射光,以得到一經偏極參考光與一經偏極入射光,且該經偏極參考光具有一行進路徑;(c)控制該經偏極參考光的通過量,並具有一開啟狀態與一關閉裝態,並在該關閉狀態時切斷該經偏極參考光的行進路徑;(d)控制該經偏極入射光的通過量;(e)導引該經偏極參考光與該經偏極入射光各至一第一路徑與一第二路徑上;(f)接收並聚焦該穿過該分光單元之經偏極入射光沿該第二路徑至該受測物件上,且該受測物件反射該穿過該分光單元之經偏極入射光而產生一待測光,並導引該待測光至一該第二路徑反向之第三路徑上;(g)在該參考光被控制為該開啟狀態且該裝置處於一干涉模式時,反射該經偏極參考光而產生一準直作用參考光於該第三路徑上,且該待測光與該準直作用參考光產生一干涉影像,並在該參考光被控制為該關閉狀態且該裝置處於一顯微模式時,產生一經導引待測光影像於該第三路徑上;(h)在該干涉模式時,接收該干涉影像與在該顯微模時接收該待測光影像,而得到一第一待分析影像與一第二待分析影像;(i)接收該第一待分析影像,以產生一光譜訊息;(j)接收該第二待分析影像;(k)在該干涉模式時,控制該受測物件在一垂直方向上移動,並分析該第二待分析影像,藉以在該第二待分析影像中找出並記錄每一像素之零光程差面,藉以取得該光譜訊息,進而根據該光譜訊息之該第二待分析影像之一計算出該受測物件的一表面形貌;(l)控制該參考光光圈為該關閉裝態,以進入該顯微模 式,並取得該零光程差面時之光譜訊息,並致動該受測物件在該垂直方向上移動,並藉由分析該第二待分析影像之每一像素的一對焦資訊,以得到一全對焦彩色影像與一全對焦黑白影像,並建立一深度反應曲線;(m)致動該受測物件橫向移動,以根據該光譜訊息、該深度反應曲線與一橫向色散現象取得該受測物件的一大範圍面積表面形貌;並(n)當該待測物件為一具有一基板且在該基板上有一鍍膜層時,根據該零光程差面時之該光譜訊息推導出該受測物件的一膜厚尺寸及一另一表面形貌,其中該表面形貌與該另一表面形貌為相同者,該訊號處理單元可選擇僅計算與呈現其中一者。A method for integrating optical measurement of multiplex object parameters includes the following steps: (a) providing a collimated reference light and a collimated incident light; (b) polarizing the collimated reference light and the collimated incident light to obtain a polarized reference light and a polarized incident light, and the polarized The reference light has a traveling path; (c) controlling the throughput of the polarized reference light, and having an open state and a closed state, and cutting the traveling path of the polarized reference light in the closed state; (d) controlling the throughput of the polarized incident light; (e) guiding the polarized reference light and the polarized incident light to a first path and a second path; (f) receiving and Focusing the polarized incident light passing through the light splitting unit along the second path to the object to be tested, and the measured object reflects the polarized incident light passing through the light splitting unit to generate a light to be measured, and Directing the light to be measured to a third path in which the second path is reversed; (g) generating the polarized reference light when the reference light is controlled to the open state and the device is in an interference mode a collimating action reference light is on the third path, and the light to be measured and the collimated action reference light are generated And receiving an image to be measured on the third path when the reference light is controlled to the off state and the device is in a micro mode; (h) receiving the interference image in the interference mode And receiving the image to be measured during the micro mode to obtain a first image to be analyzed and a second image to be analyzed; (i) receiving the first image to be analyzed to generate a spectral message; (j) receiving The second image to be analyzed; (k) in the interference mode, controlling the object to be moved to move in a vertical direction, and analyzing the second image to be analyzed, thereby finding and recording in the second image to be analyzed a zero optical path difference surface of each pixel, to obtain the spectral information, and then calculating a surface topography of the object to be tested according to one of the second image to be analyzed of the spectral information; (1) controlling the reference light aperture To close the state to enter the micromode And obtaining the spectral information of the zero optical path difference surface, and actuating the object to be moved in the vertical direction, and analyzing a focus information of each pixel of the second image to be analyzed to obtain a full focus color image and a full focus black and white image, and establish a depth response curve; (m) actuate the object to move laterally to obtain the measured according to the spectral information, the depth response curve and a lateral dispersion phenomenon a large-area surface topography of the object; and (n) when the object to be tested has a substrate and a coating layer on the substrate, the spectral information is derived from the zero-path difference surface Measuring a film thickness dimension of the object and a surface topography, wherein the surface topography is identical to the other surface topography, the signal processing unit may select to calculate and present only one of them. 如申請專利範圍第9項之方法,其中:該步驟(c)更包含下列步驟;(c1)調整該準直作用參考光使與該待測光之間具有該零光程差;該步驟(e)更包含下列步驟:(e1)調整該干涉影像中之複數道條紋的對比度;及(e2)調整該干涉影像中之複數道條紋的影像清晰度;且該方法更在步驟(a)前包含下列步驟:(a1)支撐該受測物件,並在該干涉模式時控制該受測物件移動於該垂直方向上。The method of claim 9, wherein: the step (c) further comprises the following steps; (c1) adjusting the collimated reference light to have the zero optical path difference between the light to be measured; Further comprising the steps of: (e1) adjusting the contrast of the plurality of stripes in the interference image; and (e2) adjusting the image sharpness of the plurality of stripes in the interference image; and the method further comprises before step (a) The following steps: (a1) supporting the object to be tested, and controlling the object to be moved to move in the vertical direction in the interference mode. 如申請專利範圍第9項之方法,其中該步驟(l)更包含下列步驟:(l1)分析該第二待分析影像中每一畫素中的一高頻訊息,並拼接每畫素之一景深內灰階值,還原一影像失焦資訊,以形成該全對焦彩色影像與該全對焦黑白影像,並建立該深度反應曲線。The method of claim 9, wherein the step (1) further comprises the following steps: (l1) analyzing a high frequency message in each pixel of the second image to be analyzed, and splicing one of each pixel The grayscale value in the depth of field restores an image out of focus information to form the full focus color image and the full focus black and white image, and establishes the depth response curve. 如申請專利範圍第11項之方法,其中該步驟(l1)更包含下 列步驟:(l2)使用一影像對比度遮罩濾波法與該等經分析得之高頻資訊還原該影像失焦資訊,以得到該全對焦黑白影像,並分離該待分析影像為RGB三種顏色之影像,再分析並疊加該RGB三種顏色影像,以還原成該全對焦彩色影像。For example, the method of claim 11 wherein the step (l1) further includes Column step: (l2) using an image contrast mask filtering method and the analyzed high frequency information to restore the image out of focus information to obtain the full focus black and white image, and separating the image to be analyzed into three colors of RGB The image is then analyzed and superimposed on the RGB three color images to be restored to the full focus color image. 如申請專利範圍第9項之方法,其中該步驟(n)更包含下列步驟:在該顯微模式時擷取該受測物件之該基板之一上表面與該鍍膜層之一上面的光譜訊息,並依據該零光程差面之光譜訊息反推該受測物件之該基板上表面與該鍍膜層上表面之間的距離,並以該距離當作該鍍膜層的厚度。The method of claim 9, wherein the step (n) further comprises the step of: extracting spectral information on an upper surface of the substrate and one of the coating layers of the object to be tested in the micro mode; And according to the spectral information of the zero optical path difference surface, the distance between the upper surface of the substrate and the upper surface of the coating layer of the object to be tested is reversed, and the distance is regarded as the thickness of the coating layer. 如申請專利範圍第9項之方法,其中該準直參考光與一準直入射光為白光鹵素燈與紅外光燈之一,並具有一高斯分佈之強度。The method of claim 9, wherein the collimated reference light and the collimated incident light are one of a white halogen lamp and an infrared lamp, and have a Gaussian distribution intensity. 如申請專利範圍第9項之方法,其中該第一與第二待分析影像可為可見光與非可見光影像。The method of claim 9, wherein the first and second images to be analyzed are visible light and non-visible light images. 如申請專利範圍第9項之方法,其中該步驟(k)更包含下列步驟:加以一相位移演算法於該等干涉條紋上,並分析該等干涉條紋之一最大強度,藉以建立一表面形貌資訊而取得該受測物件之表面形貌。The method of claim 9, wherein the step (k) further comprises the steps of: applying a phase shift algorithm to the interference fringes and analyzing a maximum intensity of the interference fringes to establish a surface shape; The surface topography of the object to be tested is obtained by the appearance information.
TW102144609A 2013-12-05 2013-12-05 Multiplexing article parameter integrated optically measuring device and method thereof TWI477736B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102144609A TWI477736B (en) 2013-12-05 2013-12-05 Multiplexing article parameter integrated optically measuring device and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102144609A TWI477736B (en) 2013-12-05 2013-12-05 Multiplexing article parameter integrated optically measuring device and method thereof

Publications (2)

Publication Number Publication Date
TWI477736B true TWI477736B (en) 2015-03-21
TW201522904A TW201522904A (en) 2015-06-16

Family

ID=53185938

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102144609A TWI477736B (en) 2013-12-05 2013-12-05 Multiplexing article parameter integrated optically measuring device and method thereof

Country Status (1)

Country Link
TW (1) TWI477736B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548875B (en) * 2015-06-11 2016-09-11 Landrex Technologies Co Ltd Optical needle detection system and method
CN113639661A (en) * 2021-08-11 2021-11-12 中国科学院长春光学精密机械与物理研究所 Morphology detection system and morphology detection method
TWI770459B (en) * 2019-02-25 2022-07-11 日月光半導體製造股份有限公司 Optical measurement equipment and method for measuring warpage of a workpiece

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596685B (en) * 2017-01-04 2017-08-21 Surface 3D testing equipment and testing methods
TWI791046B (en) * 2017-10-02 2023-02-01 美商奈米創尼克影像公司 Apparatus and method to reduce vignetting in microscopic imaging
US10502944B2 (en) 2017-10-02 2019-12-10 Nanotronics Imaging, Inc. Apparatus and method to reduce vignetting in microscopic imaging
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040070773A1 (en) * 1998-04-21 2004-04-15 Takenori Hirose Thin film thickness measuring method and apparatus, and mehtod and apparatus for manufacturing a thin film device using the same
CN101089579A (en) * 2006-03-22 2007-12-19 3i系统公司 System for inspecting surfaces with improved light efficiency
US7468799B2 (en) * 2003-10-27 2008-12-23 Zygo Corporation Scanning interferometry for thin film thickness and surface measurements
TW201000848A (en) * 2008-06-30 2010-01-01 Snu Precision Co Ltd Method for measuring thickness or surface profile
TW201237357A (en) * 2011-03-04 2012-09-16 Univ Nat Formosa One-dimensional laser-scanning profilometer and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040070773A1 (en) * 1998-04-21 2004-04-15 Takenori Hirose Thin film thickness measuring method and apparatus, and mehtod and apparatus for manufacturing a thin film device using the same
US7468799B2 (en) * 2003-10-27 2008-12-23 Zygo Corporation Scanning interferometry for thin film thickness and surface measurements
CN101089579A (en) * 2006-03-22 2007-12-19 3i系统公司 System for inspecting surfaces with improved light efficiency
TW201000848A (en) * 2008-06-30 2010-01-01 Snu Precision Co Ltd Method for measuring thickness or surface profile
TW201237357A (en) * 2011-03-04 2012-09-16 Univ Nat Formosa One-dimensional laser-scanning profilometer and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548875B (en) * 2015-06-11 2016-09-11 Landrex Technologies Co Ltd Optical needle detection system and method
TWI770459B (en) * 2019-02-25 2022-07-11 日月光半導體製造股份有限公司 Optical measurement equipment and method for measuring warpage of a workpiece
CN113639661A (en) * 2021-08-11 2021-11-12 中国科学院长春光学精密机械与物理研究所 Morphology detection system and morphology detection method

Also Published As

Publication number Publication date
TW201522904A (en) 2015-06-16

Similar Documents

Publication Publication Date Title
TWI477736B (en) Multiplexing article parameter integrated optically measuring device and method thereof
US11536940B2 (en) 3D microscope including insertable components to provide multiple imaging and measurement capabilities
TWI420068B (en) Interferometry for lateral metrology
US9395173B2 (en) Multi-functioned optical measurement device and method for optically measuring a plurality of parameters
JP4885212B2 (en) Method and system for analyzing low coherence interferometer signals for information about thin film structures
TWI490444B (en) Slit-scan microscopic system and method using the same
TWI439661B (en) Generating model signals for interferometry
TWI428582B (en) Interferometry apparatus, and interferometry method for determining characteristics of an object surface
IL282673A (en) Spectroscopic beam profile metrology
TWI671501B (en) Method and white light interferometer for characterizing a sample, method for processing white light interferometric data from a sample with a patterned structure, and white light interferometer for measuring a sample with a patterned structure
US20120140243A1 (en) Non-contact surface characterization using modulated illumination
US20080174784A1 (en) Apparatus and method for measuring characteristics of surface features
WO2016025769A1 (en) Optical evaluation of lenses and lens molds
KR101987402B1 (en) Optical measuring system for thicknesses of thin and thick films and 3D surface profile using a polarized pixel array
KR20170055661A (en) Apparatus of real time imaging spectroscopic ellipsometry for large-area thin film measurements
TW201339564A (en) White-light interference measuring device and interfere measuring method thereof
TW201317542A (en) Interference film thickness meter
KR20080090225A (en) Surface profile measuring apparatus and method using separated polarization interferometer
CN107923735B (en) Method and device for deducing the topography of an object surface
JP2007298281A (en) Measuring method and device of surface shape of specimen
WO2008151266A2 (en) Interferometry for determining characteristics of an object surface, with spatially coherent illumination
TWI420072B (en) Interferometer with a virtual reference surface
CN114616437A (en) Device and method for measuring the contour of a flat object with unknown material
TWI386638B (en) Thin film optical inspection apparatus
Feng et al. Non-scanning techniques