TWI475950B - Heat-dissipation module - Google Patents

Description

Thermal module

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module applied to an electronic device.

In recent years, with the rapid advancement of computer technology, the operating speed of computers has continued to increase, and the heat generation rate of electronic components (Electronic Elements) in the computer mainframe has continued to rise. In order to prevent the electronic components inside the computer host from overheating, which causes temporary or permanent failure of the electronic components, it is important to provide sufficient heat dissipation performance for the electronic components inside the computer.

For example, in a computer system, for example, a central processing unit (CPU), a North Bridge Chip, a South Bridge Chip, or other heating elements may be disposed on a motherboard ( In the Mother Board, conventional techniques are used to remove the heat generated by the high-speed operation of the motherboard, and a heat dissipation module is usually disposed on the heat-generating components to dissipate the heat-generating components.

Generally speaking, the heat dissipation module is mainly composed of a fan, a heat dissipation fin group and a heat pipe. The heat dissipation fin group is disposed at an air outlet of the fan and is connected to the heat pipe to dissipate heat absorbed by the heat pipe from the heat source. The heat sink fin group is composed of a plurality of metal sheets arranged in parallel, and a certain gap is formed between the adjacent metal sheets, so that heat is dissipated into the air. Therefore, when the fan is in operation, the cooling airflow can flow to the heat dissipation fin group through the air outlet, and through the gap between the metal sheets, the heat is discharged outside the body by convection, thereby reducing the temperature in the electronic device. .

It is worth noting that since the fans are directly blown to the heat dissipation fin group of the heat dissipation module, the number of heat dissipation fins is large and the configuration is close to the fan, so the resistance of the fan is increased, and the heat dissipation effect of the fan is reduced, thereby causing The heat dissipation capability of the heat dissipation module is greatly reduced.

The invention provides a heat dissipation module with better heat dissipation efficiency.

The invention provides a heat dissipation module suitable for dissipating heat from a heat generating component in a casing. The heat dissipation module includes a first fan, a second fan, and a heat conducting component. The first fan is disposed in the casing and is adapted to introduce an external airflow to generate a first airflow. The second fan is disposed in the casing and is adapted to introduce an external airflow to generate a second airflow, wherein the heating element is disposed between the first fan and the second fan. The heat conducting component is disposed in the casing and has a first end and a second end opposite to each other. The first end of the thermally conductive element is thermally coupled to the heating element and the second end of the thermally conductive element extends above the second fan. The first gas stream flows directly to the heating element to produce a third gas stream. The third air flow is directed to the thermal element and transmitted to the outside through the thermally conductive element. The second airflow flows directly to a portion of the thermally conductive element located above the second fan and is transmitted to the outside through a portion of the thermally conductive element.

In an embodiment of the present invention, the heat dissipation module further includes a heat dissipation fin set disposed under the partial heat conduction component, and the second airflow directly flows to a portion of the heat dissipation fin group located above the second fan and Part of the thermal conductive element.

In an embodiment of the invention, the temperature of the first gas stream is equal to the temperature of the second gas stream, and the temperature of the third gas stream is higher than the temperature of the first gas stream.

In an embodiment of the invention, the flow rate of the first gas stream is greater than the flow rate of the third gas stream.

In an embodiment of the invention, the heat dissipation module further includes a retaining wall having a first retaining wall portion and a second retaining wall portion. The first retaining wall portion is disposed at a first air outlet of the first fan, and the second retaining wall portion is disposed at a second air outlet of the second fan.

In an embodiment of the present invention, the retaining wall further includes a third retaining wall portion connecting the first retaining wall portion and the second retaining wall portion, and the first retaining wall portion, the second retaining wall portion, and the third portion The retaining wall portion divides the casing into a first accommodating space, a second accommodating space and a third accommodating space. The first fan is located in the first accommodating space. The heating element is located in the second accommodating space. The second fan is located in the third accommodating space. The heat conducting element extends from the second accommodating space into the third accommodating space.

In an embodiment of the invention, the second retaining wall portion has an opening, and the second airflow of the second fan flows through the opening to a portion of the heat conducting element located in the second receiving space.

In an embodiment of the invention, the height of the second retaining wall portion is lower than the height of the first retaining wall portion, and the heat conducting member extends from the third retaining wall portion toward the upper portion of the second retaining wall portion.

In an embodiment of the invention, the heat conducting component comprises a heat pipe or a heat sink.

In an embodiment of the invention, the heating element comprises a central processing unit (CPU), a north bridge chip, a south bridge chip or a memory.

Based on the above, the first airflow generated by the first fan of the heat dissipation module of the present invention flows directly to the heat generating component to effectively reduce the heat generated by the heat generating component by means of active heat dissipation. Then, the cooled heating element can be passively dissipated by the heat conducting element to transfer the heat of the heating element to the outside. Furthermore, the second airflow generated by the second fan of the heat dissipation module is a heat conduction component directly flowing above the second fan to assist in removing heat of the heat conduction component by means of active heat dissipation. In short, the heat dissipation module of the present invention can more effectively remove the heat generated by the heat generating component from the outside of the casing, and has better heat dissipation effect.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a schematic view showing the arrangement of a heat dissipating module and a heat generating component in a casing according to an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the heat dissipation module 100 a is adapted to dissipate heat from a heat generating component 20 in a casing 10 , wherein the casing 10 is, for example, a casing of an electronic device, and the heating element 20 is, for example, a central portion. A CPU (Center Process Unit, CPU), a North Bridge Chip, a South Bridge Chip, or a memory is not limited herein.

In detail, the heat dissipation module 100a includes a first fan 110, a second fan 120, and a heat conducting component 130. The first fan 110 is disposed in the casing 10 and is adapted to introduce an external airflow V0 to generate a first airflow V1. The second fan 120 is disposed in the casing 10 and is adapted to introduce the external airflow V0 to generate a second airflow V2. The heating element 20 is disposed between the first fan 110 and the second fan 120. The heat conducting component 130 is disposed in the casing 10 and has a first end 132 and a second end 134 opposite to each other, wherein the first end 132 of the heat conducting component 130 is thermally coupled to the heat generating component 20, and the second heat conducting component 130 is End 134 extends above second fan 120. In particular, the first airflow V1 flows directly from the first air outlet 112 of the first fan 110 to the heat generating component 20 to generate a third airflow V3, and the third airflow V3 flows to the heat element 130 and is transmitted to the outside through the heat conducting component 130. . The second air flow V2 flows directly from a third air outlet 124 of the second fan 120 to a portion of the heat conduction element 130 located above the second fan 120 and is transmitted to the outside through the partial heat conduction element 130. Here, the heat conducting element 130 is, for example, a heat pipe or a heat sink.

It should be noted that, since the first airflow V1 and the second airflow V2 are respectively generated by the first fan 110 and the second fan 120 to introduce the external airflow V0, and do not flow through any heat generating component, the first airflow V1 and the second airflow are respectively generated. The air flow V2 can be regarded as a cold air flow, and the temperature of the first air flow V1 is substantially equal to the temperature of the second air flow V2. Furthermore, since the first airflow V1 flows directly to the heat generating component 20 in the casing 10, the heat generated by the heat generating component 20 can be directly and effectively reduced to generate the third airflow V3. That is, the third airflow V3 is the airflow flowing through the heat generating component 20, and thus the temperature of the third airflow V3 is substantially higher than the temperature of the first airflow V1. In addition, since the first airflow V1 is directly generated by the first fan 110, that is, the airflow that does not encounter the resistance, and the third airflow V3 is the airflow that has flowed through the heating element 20, that is, the airflow after the resistance has been encountered, Therefore, the flow rate of the first air flow V1 is substantially greater than the flow rate of the third air flow V3.

Moreover, in order to increase the heat dissipation efficiency of the heat dissipation module 100a, the heat dissipation module 100a may further include a heat dissipation fin set 140. The heat dissipation fin group 140 is disposed under the partial heat conduction element 130 , and the second air flow V2 directly flows to a portion of the heat dissipation fin set 140 located above the second fan 120 and a portion of the heat conduction element 130 thereon. In addition, in order to prevent the hot airflow (for example, the third airflow V3) in the casing 10 from flowing back to the first fan 110 and the second fan 120, the heat dissipation module 100a further includes a retaining wall 150a. Specifically, the retaining wall 150a has a first retaining wall portion 152 and a second retaining wall portion 154a, wherein the first retaining wall portion 152 is disposed at the first air outlet 152 of the first fan 110, and the second retaining wall portion The 154 a is disposed on a second air outlet 122 of the second fan 120 . Of course, in order to have a better anti-flow effect, the retaining wall 150a may further include a third retaining wall portion 156, wherein the third retaining wall portion 156 connects the first retaining wall portion 152 and the second retaining wall portion 154a, and The first retaining wall portion 152, the second retaining wall portion 154a, and the third retaining wall portion 156 can divide the casing into a first accommodating space S1, a second accommodating space S2, and a third accommodating space S3. Here, the height H2 of the second retaining wall portion 154a is lower than the height H1 of the first retaining wall portion 152, and the heat conducting member 130 extends from the third retaining wall portion 156 toward the upper side of the second retaining wall portion 154a. The first fan 110 is located in the first accommodating space S1, and the heating element 20 is located in the second accommodating space S2. The second fan 120 is located in the third accommodating space S3, and the heat conducting element 130 is extended from the second accommodating space S2 into the third accommodating space S3.

Since the first airflow V1 generated by the first fan 110 of the heat dissipation module 100a of the present embodiment flows directly to the heat generating component 20, the heat generated by the heat generating component 20 is effectively reduced by active heat dissipation. Then, the cooled heating element 20 can be passively dissipated by the heat conducting element 130 to transfer the heat of the heating element 20 to the outside. Moreover, the second airflow V2 generated by the second fan 120 of the heat dissipation module 100a is directly flowing to the heat conduction component 130 above the second fan 120 to assist in removing heat of the heat conduction component 130 by active heat dissipation. Compared with the conventional cooling airflow, the first airflow V1 of the first fan 110 of the present embodiment flows directly to the heat generating component 20, that is, directly radiates heat to the heat generating component 20, and the second airflow V2. The heat conduction component 130 is also directly radiated, and the heat on the heat conduction element 130 is discharged outside the casing 10 through the convection by the heat dissipation fin group 140. Therefore, the heat dissipation module 100a of the embodiment can more effectively remove the heat generated by the heat generating component 20 from the casing 10, and has better heat dissipation effect.

It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

2 is a schematic view showing the arrangement of a heat dissipating module and a heat generating component in a casing according to another embodiment of the present invention. Referring to FIG. 2, the heat dissipation module 100b of the present embodiment is similar to the heat dissipation module 100a of FIG. 1, but the main difference is that the second wall portion 154b of the retaining wall 150b of the embodiment has an opening 155. The part of the second airflow V2 of the second fan 120 can flow to the partial heat conducting component 130 located in the second accommodating space S2 via the opening 155. In other words, the second airflow V2 can flow to the heat conducting component 130 and the heat sink fin set 140 in the second accommodating space S2 and the third accommodating space S3 via the second air outlet 122 and the third air outlet 124, respectively.

In summary, the first airflow generated by the first fan of the heat dissipation module of the present invention flows directly to the heat generating component to effectively reduce the heat generated by the heat generating component by means of active heat dissipation. Then, the cooled heating element can be passively dissipated by the heat conducting element to transfer the heat of the heating element to the outside. Furthermore, the second airflow generated by the second fan of the heat dissipation module directly flows to the heat conduction component above the second fan to assist in removing heat of the heat conduction component by means of active heat dissipation, and the heat dissipation fin group below the heat conduction component The heat on the heat conducting element can also be discharged outside the casing by convection. In short, the heat dissipation module of the present invention can more effectively remove the heat generated by the heat generating component from the outside of the casing, and has better heat dissipation effect.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10. . . cabinet

20. . . Heating element

100a, 100b. . . Thermal module

110. . . First fan

112. . . First air outlet

120. . . Second fan

122. . . Second outlet

124. . . Third air outlet

130. . . Thermal element

132. . . First end

134. . . Second end

140. . . Heat sink fin set

150a, 150b. . . Retaining wall

152. . . First retaining wall

154a, 154b. . . Second retaining wall

155. . . Opening

156. . . Third retaining wall

H1. . . First height

H2. . . Second height

V0. . . Outside airflow

V1. . . First airflow

V2. . . Second airflow

V3. . . Third airflow

S1‧‧‧First accommodation space

S2‧‧‧Second accommodating space

S3‧‧‧ third accommodating space

1 is a schematic view showing the arrangement of a heat dissipating module and a heat generating component in a casing according to an embodiment of the present invention.

2 is a schematic view showing the arrangement of a heat dissipating module and a heat generating component in a casing according to another embodiment of the present invention.

10. . . cabinet

20. . . Heating element

100a. . . Thermal module

110. . . First fan

112. . . First air outlet

120. . . Second fan

122. . . Second outlet

124. . . Third air outlet

130. . . Thermal element

132. . . First end

134. . . Second end

140. . . Heat sink fin set

150a. . . Retaining wall

152. . . First retaining wall

154a. . . Second retaining wall

156. . . Third retaining wall

H1. . . First height

H2. . . Second height

V0. . . Outside airflow

V1. . . First airflow

V2. . . Second airflow

V3. . . Third airflow

S1. . . First accommodation space

S2. . . Second accommodation space

S3. . . Third accommodation space

Claims (9)

A heat dissipation module is configured to dissipate heat from a heat generating component in a casing. The heat dissipation module includes: a first fan disposed in the casing and adapted to introduce an external airflow to generate a first a second fan, disposed in the casing, and adapted to introduce the external airflow to generate a second airflow, wherein the heating element is disposed between the first fan and the second fan; The component is disposed in the casing and has a first end and a second end opposite to each other, the first end of the heat conducting component is thermally coupled to the heat generating component, and the second end of the heat conducting component extends to Above the second fan, wherein the first airflow flows directly to the heating element to generate a third airflow, and the third airflow flows to the heat conducting component and is transmitted to the outside through the heat conducting component, and the second airflow flows directly to the outside a portion of the second heat-dissipating member is transmitted to the outside through the heat-conducting member; and a retaining wall having a first retaining wall portion and a second retaining wall portion, wherein the first retaining wall portion is disposed The first wind A first outlet, and the second wall portion disposed in a second air outlet of the second fan. The heat dissipation module of claim 1, further comprising a heat dissipation fin set disposed under a portion of the heat conduction element, and the second air flow directly flowing to the portion of the heat dissipation fin located above the second fan The sheet set and the portion thereof are thermally conductive. The heat dissipation module of claim 1, wherein the temperature of the first airflow is equal to the temperature of the second airflow, and the temperature of the third airflow is The degree is higher than the temperature of the first gas stream. The heat dissipation module of claim 1, wherein the flow rate of the first air flow is greater than the flow rate of the third air flow. The heat dissipation module of claim 1, wherein the retaining wall further comprises a third retaining wall portion connecting the first retaining wall portion and the second retaining wall portion, the first retaining wall portion, the The second retaining wall portion and the third retaining wall portion divide the casing into a first accommodating space, a second accommodating space and a third accommodating space, and the first fan is located in the first accommodating space. The heating element is located in the second accommodating space, the second fan is located in the third accommodating space, and the heat conducting element extends from the second accommodating space into the third accommodating space. The heat dissipation module of claim 5, wherein the second retaining wall portion has an opening, and the second airflow of the second fan flows through the opening to a portion of the heat conducting component located in the second receiving space. . The heat dissipation module of claim 5, wherein the height of the second retaining wall portion is lower than the height of the first retaining wall portion, and the heat conducting member faces the second retaining wall by the third retaining wall portion The top of the section extends. The heat dissipation module of claim 1, wherein the heat conduction element comprises a heat pipe or a heat sink. The heat dissipation module of claim 1, wherein the heat generating component comprises a central processing unit, a north bridge wafer, a south bridge wafer or a memory.