TWI475050B - Organopolysiloxane, method for producing the same and curable resin composition containing the same - Google Patents

Organopolysiloxane, method for producing the same and curable resin composition containing the same Download PDF

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TWI475050B
TWI475050B TW101111318A TW101111318A TWI475050B TW I475050 B TWI475050 B TW I475050B TW 101111318 A TW101111318 A TW 101111318A TW 101111318 A TW101111318 A TW 101111318A TW I475050 B TWI475050 B TW I475050B
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carbon atoms
organopolyoxane
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TW201247745A (en
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Yuji Okada
Yoshito Kuroda
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Asahi Kasei Chemicals Corp
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有機聚矽氧烷、其製造方法及含有有機聚矽氧烷之硬化性樹脂組成物Organic polyoxane, method for producing the same, and curable resin composition containing organic polyoxyalkylene

本發明係關於一種有機聚矽氧烷、其製造方法及含有上述有機聚矽氧烷之硬化性樹脂組成物。The present invention relates to an organopolysiloxane, a method for producing the same, and a curable resin composition containing the above organopolysiloxane.

一直以來,已知使用酸酐系硬化劑之環氧系樹脂組成物,可以形成透明之硬化物,而適於作為發光二極體、光二極體等之光半導體元件的密封材料。Conventionally, it has been known that an epoxy resin composition using an acid anhydride-based curing agent can form a transparent cured product, and is suitable as a sealing material for an optical semiconductor element such as a light-emitting diode or a photodiode.

其例如以雙酚A型環氧樹脂、雙酚F型環氧樹脂及甲基-3,4-環氧環己烷羧酸(3′,4′-環氧環己基)酯等之以有機樹脂骨架的環氧樹脂為主成分之環氧樹脂組成物,可使用在光半導體元件之領域中。It is organic, for example, with a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a methyl-3,4-epoxycyclohexanecarboxylic acid (3',4'-epoxycyclohexyl) ester. An epoxy resin composition containing an epoxy resin as a main component of the resin skeleton can be used in the field of optical semiconductor elements.

但近年來,隨著光半導體之高性能化之進步,對光半導體元件的密封材料要求具有更為優異之耐熱性、耐光性等,使上述已往以來一般所知之環氧樹脂組成物,其特性已不夠充分。However, in recent years, with the advancement of the high performance of the optical semiconductor, the sealing material for the optical semiconductor element is required to have more excellent heat resistance, light resistance, and the like, and the epoxy resin composition generally known in the prior art is The characteristics are not sufficient.

鑑於上述問題,已往以來在各種光半導體用途之樹脂組成物方面,亦已有各種之提案。In view of the above problems, various proposals have been made in various resin compositions for optical semiconductor applications.

例如提案一種以特定之聚矽氧組成物經過矽氫化反應使其硬化之光半導體用途的熱硬化性樹脂組成物(可參考如專利文獻1。)。For example, a thermosetting resin composition for photo-semiconductor use in which a specific polyoxymethylene composition is hardened by a hydrogenation reaction is proposed (refer to Patent Document 1).

同時,亦提案一種以已改善其硬度的特定之聚矽氧組成物作為光半導體用途使用的技術(可參考如專利文獻2。)。At the same time, a technique of using a specific polyoxyl composition having improved hardness as a photo-semiconductor is also proposed (refer to Patent Document 2).

此外,又有提案一種其中含具有特定構造之有機聚矽氧烷之作為光半導體用途的組成物(可參考如專利文獻3。)。Further, there has been proposed a composition containing an organic polysiloxane having a specific structure as an optical semiconductor (refer to Patent Document 3).

除此之外,亦有提案以含甲基丙烯醯氧基之聚矽氧組成物作為光半導體用途的技術(可參考如專利文獻4。)。In addition, there has also been proposed a technique of using a polyoxymethylene composition containing a methacryloxy group as a photo-semiconductor (refer to Patent Document 4).

其他,又有提案以環氧樹脂組成物作為感光性塗覆材料及印墨等之技術,該技術中併用脂環式環氧化合物及乙烯醚化合物(可參考如專利文獻5及6。)。In addition, there has been proposed a technique in which an epoxy resin composition is used as a photosensitive coating material and ink, and an alicyclic epoxy compound and a vinyl ether compound are used in this technique (see, for example, Patent Documents 5 and 6).

之外,又有提案在併用環氧化合物及乙烯醚化合物的材料中,再使藉由含特定之酚樹脂,以控制其硬化物的機械特性之技術(可參考如專利文獻7。)。In addition, there is a proposal to control the mechanical properties of the cured product by using a specific phenol resin in a material in which an epoxy compound and a vinyl ether compound are used in combination (refer to Patent Document 7).

[先前技術文獻][Previous Technical Literature]

專利文獻Patent literature

[專利文獻1]日本專利特開2010-1358號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-1358

[專利文獻2]日本專利特開2008-274185號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-274185

[專利文獻3]日本專利特開2008-201851號公報[Patent Document 3] Japanese Patent Laid-Open Publication No. 2008-201851

[專利文獻4]日本專利特開2008-131009號公報[Patent Document 4] Japanese Patent Laid-Open Publication No. 2008-131009

[專利文獻5]日本專利特開平6-298911號公報[Patent Document 5] Japanese Patent Laid-Open No. Hei 6-298911

[專利文獻6]日本專利特開平9-328634號公報[Patent Document 6] Japanese Patent Laid-Open No. Hei 9-328634

[專利文獻7]日本專利第4235698號公報[Patent Document 7] Japanese Patent No. 4235698

然而,上述之先前提案的技術,仍有下述問題點。However, the techniques of the previously proposed above still have the following problems.

在專利文獻1中所提案之熱硬化性樹脂組成物,其耐 熱黃變性及耐光性雖佳,但硬化物之硬度仍低因此易發生損傷而難以使用。同時,其阻氣性及對基材之密接性亦低,因此無法適用在光半導體用密封材之用途方面。The thermosetting resin composition proposed in Patent Document 1 is resistant Although the heat yellowing property and the light resistance are good, the hardness of the cured product is still low, so that it is liable to be damaged and difficult to use. At the same time, since the gas barrier properties and the adhesion to the substrate are also low, it is not applicable to the use of the sealing material for optical semiconductors.

在專利文獻2中所提案之聚矽氧組成物,為提高其硬度而使用苯基,惟該苯基卻成為降低耐熱黃變性及耐光性之原因,因此在光半導體用密封材之用途方面亦不適於使用。In the polyfluorene composition proposed in Patent Document 2, a phenyl group is used to increase the hardness thereof, but the phenyl group is responsible for reducing heat yellowing resistance and light resistance, and therefore, the use of the sealing material for an optical semiconductor is also Not suitable for use.

在專利文獻3中所提案之組成物,在硬度、密接性及阻氣性方面雖佳,惟形成基本骨架之異三聚氰酸酯卻成為降低耐熱黃變性、耐光性之原因,因此在光半導體用密封材之用途方面未必達到可滿足之程度。The composition proposed in Patent Document 3 is excellent in hardness, adhesion, and gas barrier properties, but the hetero-cyanate forming the basic skeleton is a cause of reducing heat-resistant yellowing and light resistance, and thus is in the light. The use of a semiconductor sealing material is not necessarily satisfactory.

在專利文獻4中所提案之聚矽氧組成物,在耐熱黃變性及耐光性方面雖佳,由於分子構造中並無可緩和應力(stress)之部位,在進行冷熱衝擊試驗等之環境變化試驗時,會使硬化物發生破裂。亦即,在光半導體用途方面,在反複操作開關之ON-OFF時會使樹脂發生破裂,而此又與斷線問題有關。同時,又未能達到可滿足阻氣性及對基材之密接性的程度。The polyfluorene-oxygen composition proposed in Patent Document 4 is excellent in heat-resistant yellowing and light resistance, and has no stress-relieving stress in the molecular structure, and is subjected to an environmental change test such as a thermal shock test. When the hardened material is broken. That is, in the use of optical semiconductors, the resin is broken when the ON-OFF of the switch is repeatedly operated, which is related to the disconnection problem. At the same time, it has not been able to meet the degree of gas barrier properties and adhesion to the substrate.

在專利文獻5至7中所提案之材料,雖然阻氣性及密接性佳,但均為易發生黃變之環氧樹脂組成物,故在耐熱黃變性、耐光性之點方面亦未能達到可滿足的程度。The materials proposed in Patent Documents 5 to 7 are excellent in gas barrier properties and adhesion, but are all epoxy resin compositions which are prone to yellowing, so they have not been able to reach the point of heat yellowing and light resistance. The degree of satisfaction.

如上所述,先前提案之樹脂組成物,在硬度、阻氣性、耐熱黃變性、耐光性、耐冷熱衝擊性及對基材之密接性的全部特性方面,仍無法得到可充分滿足在光半導體用途及 塗覆材等領域方面所要求的程度良好地平衡之硬化物。As described above, the resin composition previously proposed has not been able to sufficiently satisfy the optical semiconductor in terms of hardness, gas barrier properties, heat yellowing resistance, light resistance, thermal shock resistance, and adhesion to a substrate. Use and A hardened material that is well balanced to the extent required in the field of coating materials and the like.

亦即本發明之目的係提供一種可形成充分地滿足在硬度、阻氣性、耐熱黃變性、耐光性、耐冷熱衝擊性及對基材之密接性之全部特性,特別是在光半導體用途方面所要求之程度良好地平衡之硬化物的有機聚矽氧烷、其製造方法及使用其之硬化性樹脂組成物,以及上述特性中所必要之光半導用晶片接合(die-bonding)材、塗覆材、奈米模印用硬化性樹脂組成物及印墨。That is, the object of the present invention is to provide all the characteristics that can sufficiently satisfy the hardness, gas barrier properties, heat yellowing resistance, light resistance, thermal shock resistance, and adhesion to a substrate, particularly in optical semiconductor applications. An organic polysiloxane having a cured product which is well balanced, a method for producing the same, a curable resin composition using the same, and a die-bonding material for optical semi-conducting, which are required for the above characteristics, A coating material, a curable resin composition for nano-imprinting, and an ink.

本發明人等為解決上述問題經過刻意檢討之結果,發現以含有特定構造的有機聚矽氧烷之硬化性樹脂組成物,可以達成上述目的,而完成本發明。As a result of deliberate review of the above problems, the present inventors have found that the above object can be attained by a curable resin composition containing an organic polysiloxane having a specific structure, and the present invention has been completed.

亦即本發明,係如下之各項。That is, the present invention is as follows.

〔1〕〔1〕

一種有機聚矽氧烷,係在1分子中含1個以上含不飽和鍵之基,而具有下述通式(1)至(3)所示之構成單位F1、M1、T中的(i)F1及M1、(ii)F1及T、(iii)F1、M1及T之任意組合的構成單位。An organopolyoxane having one or more unsaturated bond-containing groups in one molecule and having the constituent units F1, M1, and T represented by the following general formulae (1) to (3) (i) A constituent unit of any combination of F1 and M1, (ii) F1 and T, (iii) F1, M1, and T.

(上述通式(1)至(3)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R2 表示碳數2至10含不飽和鍵之基;X表示碳數2至10之二價烴基;Y表示碳數2至10之二價烴基;a、b、c各自獨立地表示1以上之整數。其中,F1表示環狀有機聚矽氧烷之構成單位。) (In the above formulae (1) to (3), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or not Any one selected from the group consisting of a substituted aryl group and a substituted or unsubstituted aralkyl group; R 2 represents a group having 2 to 10 carbon atoms and an unsaturated bond; and X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and a, b, and c each independently represent an integer of 1 or more. Among them, F1 represents a constituent unit of a cyclic organopolyoxane.

〔2〕〔2〕

如上述〔1〕所述之有機聚矽氧烷,上述通式(1)至(3)中,a、b、c滿足下述通式(I)。The organopolyoxane according to the above [1], wherein a, b, and c satisfy the following formula (I) in the above formulae (1) to (3).

0.1≦a/(b+c)≦5………(I)0.1≦a/(b+c)≦5.........(I)

〔3〕[3]

如上述〔1〕或〔2〕所述之有機聚矽氧烷,上述通式(1)所示之構成單位F1中之R2 係丙烯醯氧基或甲基丙烯醯氧基。The organopolyoxane according to the above [1] or [2], wherein R 2 is an acryloxy group or a methacryloxy group in the constituent unit F1 represented by the above formula (1).

〔4〕[4]

如上述〔1〕至〔3〕中任一項所述之有機聚矽氧烷,其中,含下述通式(4)至(6)所示之構成單位:D1、D2、D3之任意者。The organopolyoxane according to any one of the above-mentioned items (1) to (3), which comprises any of the constituent units represented by the following general formulae (4) to (6): D1, D2, and D3. .

D1:(R1 2 SiO2 /2 )………(4)D1: (R 1 2 SiO 2 / 2 ).........(4)

D3:(R1 2 SiO2 /2 )………(6) (上述通式(4)至(6)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;X表示碳數2至10之二價烴基。D3: (R 1 2 SiO 2 / 2 ) (6) (In the above formulae (4) to (6), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, substituted Or any one selected from the group consisting of an unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aralkyl group; X represents a carbon number of 2 to 10 Hydrocarbyl group.

其中,D1、D2表示環狀有機聚矽氧烷之構成單位,D3表示鏈狀有機聚矽氧烷之構成單位。)Here, D1 and D2 represent a constituent unit of a cyclic organopolyoxane, and D3 represents a constituent unit of a chain organopolysiloxane. )

〔5〕[5]

如上述〔1〕至〔4〕中任一項所述之有機聚矽氧烷,其中,包含下述通式(7)所示之構成單位S,且該通式(7)所示之構成單位的含量,相對於上述通式(1)所示之構成單位F1的含量可滿足下述通式(II)。The organopolyoxane according to any one of the above [1] to (4), which comprises a constituent unit S represented by the following formula (7), and the composition represented by the formula (7) The content of the unit can satisfy the following formula (II) with respect to the content of the constituent unit F1 represented by the above formula (1).

d/a≦0.1………(II)d/a≦0.1.........(II)

(上述通式(7)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者。其中,構成單位S表示環狀或鏈狀有機聚矽 氧烷之構成單位。) (In the above formula (7), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of a substituted or unsubstituted aralkyl group, wherein the constituent unit S represents a constituent unit of a cyclic or chain organopolyoxane.

[6][6]

如上述〔1〕至〔5〕中任一項所述之有機聚矽氧烷,其中,係只含有如上述(1)所示之構成單位F1作為上述含有R2 之構成單位。The organic polyoxosiloxane according to any one of the above aspects, wherein the constituent unit F1 represented by the above (1) is contained as the constituent unit containing the above R 2 .

〔7〕[7]

如上述〔1〕至〔5〕中任一項所述之有機聚矽氧烷,其中,係含有上述通式(1)所示之構成單位F1及下述通式(8)所示之構成單位F2作為上述含有R2 之構成單位。(其中,下述通式(8)中,R21 係包含於上述R2 中。)The organopolyoxane according to any one of the above-mentioned [1], wherein the composition unit F1 represented by the above formula (1) and the composition represented by the following formula (8) are contained. The unit F2 is a constituent unit containing the above R 2 . (In the following general formula (8), R 21 is contained in the above R 2 .)

(上述通式(8)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;Y表示碳數2至10之二價烴基。 (In the above formula (8), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of substituted or unsubstituted aralkyl groups; R 21 represents an acryloxy group or a methacryloxy group; and Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms.

其中,F2表示鏈狀有機聚矽氧烷之構成單位。)Wherein F2 represents a constituent unit of a chain organopolyoxane. )

〔8〕〔8〕

一種有機聚矽氧烷,其中,相對於100質量份之如上述〔1〕至〔7〕中任一項所述之有機聚矽氧烷,又含有0.1至100質量份之下述通式(9)所示之環狀有機聚矽氧烷。An organopolyoxane which further contains 0.1 to 100 parts by mass of the following formula with respect to 100 parts by mass of the organopolyoxane according to any one of the above [1] to [7] ( 9) A cyclic organopolyoxane as shown.

(上述通式(9)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;X表示碳數2至10之二價烴基;e表示1以上之整數;f表示0以上之整數;e+f表示3至20之整數。) (In the above formula (9), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of substituted or unsubstituted aralkyl groups; R 21 represents an acryloxy group or a methacryloxy group; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and e represents 1 or more An integer; f represents an integer greater than 0; e+f represents an integer from 3 to 20.)

〔9〕〔9〕

一種有機聚矽氧烷,其中,相對於100質量份之如上述〔1〕至〔8〕中任一項所示的有機聚矽氧烷,又含有0.01至1000質量份之下述通式(10)所示的化合物。An organopolyoxane which further contains 0.01 to 1000 parts by mass of the following formula with respect to 100 parts by mass of the organopolyoxane shown in any one of the above [1] to [8] ( 10) The compound shown.

(上述通式(10)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選 擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;X表示碳數2至10之二價烴基;g表示1以上之整數;h表示0以上之整數;i表示0至20之整數。) (In the above formula (10), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of a substituted or unsubstituted aralkyl group; R 21 represents an acryloxy group or a methacryloxy group; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and g represents 1 or more An integer; h represents an integer greater than 0; i represents an integer from 0 to 20.)

〔10〕[10]

如上述〔1〕至〔9〕中任一項所述之有機聚矽氧烷,其中,含有下述通式(9)所示之環狀有機聚矽氧烷及下述通式(10)所示之化合物, (上述通式(9)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;X表示碳數2至10之二價烴基;e表示1以上之整數;f表示0以上之整數;e+f表示3至20之整數。)The organopolyoxane according to any one of the above [1] to (9), which contains a cyclic organopolyoxane represented by the following formula (9) and a formula (10) The compound shown, (In the above formula (9), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of substituted or unsubstituted aralkyl groups; R 21 represents an acryloxy group or a methacryloxy group; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and e represents 1 or more An integer; f represents an integer greater than 0; e+f represents an integer from 3 to 20.)

(上述通式(10)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;X表示碳數2至10之二價烴基;g表示1以上之整數;h表示0以上之整數;i表示0至20之整數。) (In the above formula (10), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of a substituted or unsubstituted aralkyl group; R 21 represents an acryloxy group or a methacryloxy group; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and g represents 1 or more An integer; h represents an integer greater than 0; i represents an integer from 0 to 20.)

其由以基質輔助游離化飛行時間型質譜分析法測定所得之峰強度以下述通式(III)計算,所得之上述通式(10)所示之化合物含量〔WB〕相對於上述通式(9)所示之化合物含量〔WA〕之比:〔WB〕/〔WA〕之值為0.1以上20.0以下。The peak intensity obtained by the matrix-assisted free time-of-flight mass spectrometry is calculated by the following formula (III), and the obtained compound (WB) represented by the above formula (10) is compared with the above formula (9). The ratio of the compound content [WA] shown: the value of [WB] / [WA] is 0.1 or more and 20.0 or less.

[數1][WB]/[WA]=符合通式(10)構造的質量與鈉質量23的合計質量所相當之峰的強度/符合通式(9)之構造的質量與鈉質量23之合計質量所相當之峰的強度………(III)[Number 1] [WB] / [WA] = the intensity of the peak corresponding to the mass of the structure of the general formula (10) and the total mass of the sodium mass 23 / the mass of the structure conforming to the formula (9) and the sodium mass 23 The intensity of the peak corresponding to the total mass.........(III)

〔11〕[11]

如上述〔1〕至〔10〕中任一項所述之有機聚矽氧烷,其中,上述R1 為碳數1至10之烷基。The organopolyoxane according to any one of the above aspects, wherein the above R 1 is an alkyl group having 1 to 10 carbon atoms.

〔12〕[12]

如上述〔1〕至〔11〕中任一項所述之有機聚矽氧烷,其中,上述R1 為甲基。The organopolyoxane according to any one of the above [1], wherein the above R 1 is a methyl group.

〔13〕[13]

如上述〔1〕至〔12〕中任一項所述之有機聚矽氧烷, 其中,上述R2 含有丙烯醯氧基或甲基丙烯醯氧基,且丙烯醯氧基或甲基丙烯醯氧基之官能基當量為210至2100g/莫耳。The organopolyoxane according to any one of the above [1], wherein the above R 2 contains an acryloxy group or a methacryloxy group, and the propylene oxime group or the methacrylium group The functional group equivalent of the oxy group is from 210 to 2100 g/mole.

〔14〕[14]

如上述〔1〕至〔13〕中任一項所述之有機聚矽氧烷,其重量平均分子量為700至5000000,25℃下之黏度為50至1000000 mPa.s。The organopolyoxane according to any one of the above [1] to [13], which has a weight average molecular weight of 700 to 5,000,000 and a viscosity at 25 ° C of 50 to 1,000,000 mPa. s.

〔15〕[15]

一種有機聚矽氧烷的製造方法,係製造如上述〔1〕至〔14〕中任一項所述之有機聚矽氧烷的方法,其具有下述步驟:將下述通式(11)所示之氫化聚矽氧烷(a1)及依所需之具有1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)、i)具有2個以上直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)或具有2個以上直接鍵結於矽原子的羥基之聚矽氧烷(b2),以及ii)1分子中具有2個以上不飽和鍵的有機化合物(c)之加成反應,在矽氫化反應催化劑(d)之存在下進行, (上述通式(11)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;j表示1以上之整數;k表示0以上之整數;j+k表示3至20之整數。)。A method for producing an organopolyoxane according to any one of the above [1] to [14], which has the following steps: the following formula (11) The hydrogenated polyoxyalkylene (a1) and the hydrogenated polyoxyalkylene (a2) and i) having one or more hydrogen atoms directly bonded to a halogen atom are directly bonded to the ruthenium. a vinyl group-containing vinyl polyorganosiloxane (b1) of an atom or a polyoxyalkylene (b2) having two or more hydroxyl groups directly bonded to a ruthenium atom, and ii) having two or more in one molecule The addition reaction of the saturated bond organic compound (c) is carried out in the presence of a hydrazine hydrogenation catalyst (d). (In the above formula (11), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of substituted or unsubstituted aralkyl groups; j represents an integer of 1 or more; k represents an integer of 0 or more; and j+k represents an integer of 3 to 20.).

〔16〕[16]

如上述〔15〕項所述之有機聚矽氧烷的製造方法,其中,上述進行加成反應之步驟係包含:調製反應液的步驟、以及在上述反應液中添加矽氫化反應催化劑(d)之步驟,其中,該反應液含有上述通式(11)所示之氫化聚矽氧烷(a1)、依所需之上述具有1個以上直接鍵結於上述矽原子之氫原子的氫化聚矽氧烷(a2)、上述具有2個以上之直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)及1分子中具有2個以上不飽和鍵的有機化合物(c),或是具有2個以上直接鍵結於矽原子的羥基之聚矽氧烷(b2)及1分子中具有2個以上不飽和鍵的有機化合物(c)。The method for producing an organopolyoxane according to the above [15], wherein the step of performing the addition reaction comprises the steps of: preparing a reaction liquid; and adding a rhodium hydrogenation catalyst (d) to the reaction liquid. And the reaction solution contains the hydrogenated polyoxyalkylene (a1) represented by the above formula (11), and the above-mentioned hydrogenated polyfluorene having one or more hydrogen atoms directly bonded to the above-mentioned germanium atom. An alkane (a2), the above-mentioned vinyl group-containing organopolyoxane (b1) having two or more vinyl groups bonded directly to a ruthenium atom, and an organic compound having two or more unsaturated bonds in one molecule (c) Or an organic compound (c) having two or more polyoxyalkylenes (b2) directly bonded to a hydroxyl group of a halogen atom and two or more unsaturated bonds in one molecule.

〔17〕[17]

如上述〔15〕項所述之有機聚矽氧烷的製造方法,其中,上述進行加成反應之步驟依序進行下述步驟:調製反應液的步驟,該反應液係含有上述通式(11)所示之氫化聚矽氧烷(a1)、依所需之上述具有1個以上直接鍵結於上述矽原子之氫原子的氫化聚矽氧烷(a2)及1分子中具有2個以上不飽和鍵的有機化合物(c); 生成加成體之步驟,係在上述反應液中添加矽氫化反應催化劑(d)而生成上述通式(11)所示之氫化聚矽氧烷(a1)、依所需之上述具有1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)及1分子中具有2個以上不飽和鍵的有機化合物(c)之加成物之步驟;以及添加步驟,係在上述反應液中加入上述具有2個以上直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)、或具有2個以上直接鍵結於矽原子的羥基之聚矽氧烷(b2)。The method for producing an organopolyoxane according to the above [15], wherein the step of performing the addition reaction is carried out in the following steps: a step of preparing a reaction liquid containing the above formula (11) The hydrogenated polyoxyalkylene (a1) shown, which has two or more hydrogenated polyoxyalkylenes (a2) having one or more hydrogen atoms bonded directly to the above-mentioned germanium atom, and one or more molecules Saturated bond of organic compound (c); In the step of forming an adduct, the hydrogenation catalyst (d) is added to the reaction liquid to form a hydrogenated polyoxyalkylene (a1) represented by the above formula (11), and one or more of the above-mentioned ones are required. a step of directly bonding a hydrogenated polyoxyalkylene (a2) to a hydrogen atom of a halogen atom and an addition product of an organic compound (c) having two or more unsaturated bonds in one molecule; and an addition step in the above reaction The above-mentioned vinyl group-containing organopolyoxane (b1) having two or more vinyl groups directly bonded to a ruthenium atom or a polyoxyxane having two or more hydroxyl groups directly bonded to a ruthenium atom is added to the liquid ( B2).

〔18〕[18]

一種硬化性樹脂組成物,其含有100質量份之如上述〔1〕至〔14〕中任一項所述之有機聚矽氧烷及0.5至10質量份之熱自由基產生劑。A curable resin composition containing 100 parts by mass of the organopolysiloxane according to any one of the above [1] to [14] and 0.5 to 10 parts by mass of a thermal radical generator.

〔19〕[19]

一種硬化性樹脂組成物,其含有100質量份之如上述〔1〕至〔14]中任一項所述之有機聚矽氧烷及0.5至20質量份之光自由基產生劑。A curable resin composition containing 100 parts by mass of the organic polysiloxane of any one of the above [1] to [14] and 0.5 to 20 parts by mass of a photo radical generator.

〔20〕[20]

如上述〔18〕或〔19〕項所述之硬化性樹脂組成物,其中,相對於100質量份之如上述〔1〕至〔14〕中任一項所述之有機聚矽氧烷,又含有0.1至10質量份之矽烷偶合劑。The sclerosing resin composition according to any one of the above-mentioned [1] to [14], wherein the organopolysiloxane according to any one of the above [1] to [14], It contains 0.1 to 10 parts by mass of a decane coupling agent.

〔21〕〔twenty one〕

如上述〔18〕至〔20〕中任一項所述之硬化性樹脂組 成物,其中,相對於100質量份之如上述〔1〕至〔14〕中任一項所述之有機聚矽氧烷,又含有0.001質量份以下之(d)矽氫化反應催化劑。The curable resin group according to any one of the above [18] to [20] The (d) hydrazine hydrogenation catalyst is further contained in an amount of 0.001 part by mass or less based on 100 parts by mass of the organopolysiloxane of any one of the above [1] to [14].

〔22〕〔twenty two〕

如上述〔18〕至〔21〕中任一項所述之硬化性樹脂組成物,其中,相對於100質量份之如上述〔1〕至〔14〕中任一項所述之有機聚矽氧烷,又含有0.1至500質量份之無機氧化物。The sclerosing resin composition according to any one of the above [1] to [14], wherein the organic polyoxo oxide according to any one of the above [1] to [14] The alkane further contains 0.1 to 500 parts by mass of an inorganic oxide.

〔23〕〔twenty three〕

一種光半導體用密封材,其含有如上述〔18〕至〔22〕中任一項所述之硬化性樹脂組成物。A sealing material for a photo-semiconductor, which comprises the curable resin composition according to any one of the above [18] to [22].

〔24〕〔twenty four〕

一種光半導體用晶片接合材(die bonding material),其包含如上述〔18〕至〔22〕中任一項所述之硬化性樹脂組成物。A die bonding material for an optical semiconductor, comprising the curable resin composition according to any one of the above [18] to [22].

〔25〕[25]

一種塗覆材,其包含如上述〔18〕至〔22〕中任一項所述之硬化性樹脂組成物。A coating material comprising the curable resin composition according to any one of the above [18] to [22].

〔26〕[26]

一種奈米模印用硬化性樹脂組成物,其包含如上述〔18〕至〔22〕中任一項所述之硬化性樹脂組成物。A curable resin composition for a nano-imprint, comprising the curable resin composition according to any one of the above [18] to [22].

〔27〕[27]

一種印墨,其包含如上述〔18〕至〔22〕中任一項所述之硬化性樹脂組成物及著色劑。An ink composition comprising the curable resin composition according to any one of the above [18] to [22], and a coloring agent.

〔28〕[28]

一種光半導體封裝體,係以如上述〔23〕項所述之光半導體用密封材而成形。An optical semiconductor package is formed by using a sealing material for an optical semiconductor according to the above [23].

如依本發明,可以得到在硬度、阻氣性、耐熱黃變性、耐光性、耐冷熱衝擊性及對基材之密接性的全部特性方面,形成其在光半導體之用途上所要求的程度可以良好地平衡而充分地滿足之硬化物的有機聚矽氧烷及使用此之硬化性樹脂組成物。According to the present invention, it is possible to obtain all the characteristics required for the use of the optical semiconductor in terms of hardness, gas barrier properties, heat yellow resistance, light resistance, thermal shock resistance, and adhesion to the substrate. An organic polyoxyalkylene which is well-balanced and sufficiently satisfactorily cured, and a curable resin composition using the same.

如依本發明,亦可以提供具有上述特性之光半導體用密封材、光半導體用晶片接合材、塗覆材、奈米模印用硬化性樹脂組成物、印墨領域上有用之材料及將上述光半導體用密封材成形之光半導體封裝體。According to the present invention, it is also possible to provide a sealing material for an optical semiconductor having the above characteristics, a wafer bonding material for an optical semiconductor, a coating material, a curable resin composition for nanoimprint printing, a material useful in the field of ink printing, and the like. An optical semiconductor package formed of a sealing material for an optical semiconductor.

以下再對本發明之實施形態(以下,稱為「本實施形態」)詳加說明。Hereinafter, embodiments of the present invention (hereinafter referred to as "this embodiment") will be described in detail.

惟本發明並不限定於以下所記載,在合於其要點之範圍內亦可作種種變形而實施。However, the present invention is not limited to the following description, and various modifications may be made without departing from the spirit and scope of the invention.

〔有機聚矽氧烷〕[organic polyoxane]

本實施形態之有機聚矽氧烷,係在1分子中含有1個以上不飽和鍵之基,而具有下述通式(1)至(3)所示之構成單位F1、M1、T中的(i)F1及M1、(ii)F1及T、 (iii)F1、M1及T之任意組合的構成單位之有機聚矽氧烷。The organopolyoxane of the present embodiment has a group containing one or more unsaturated bonds in one molecule, and has constituent units F1, M1 and T represented by the following general formulae (1) to (3). (i) F1 and M1, (ii) F1 and T, (iii) an organic polyoxane of a constituent unit of any combination of F1, M1 and T.

上述通式(1)至(3)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R2 表示碳數2至10含不飽和鍵之基;X表示碳數2至10之二價烴基;Y表示碳數2至10之二價烴基;a、b、c各自獨立地表示1以上之整數。其中,F1表示環狀有機聚矽氧烷之構成單位。In the above formulae (1) to (3), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted group. Any one selected from the group consisting of an aryl group and a substituted or unsubstituted aralkyl group; R 2 represents a group having 2 to 10 carbon atoms and an unsaturated bond; and X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; A divalent hydrocarbon group having 2 to 10 carbon atoms; a, b, and c each independently represent an integer of 1 or more. Wherein F1 represents a constituent unit of the cyclic organopolyoxane.

本實施形態之有機聚矽氧烷,由耐光性之觀點而言,以含有任意之下述通式(4)至(6)所示之構成單位:D1、D2、D3之有機聚矽氧烷為佳。The organopolyoxane of the present embodiment is an organic polyoxoxane containing any constituent units represented by the following general formulae (4) to (6): D1, D2, and D3 from the viewpoint of light resistance. It is better.

D1:(R1 2 SiO2 /2 )………(4)D1: (R 1 2 SiO 2 / 2 ).........(4)

D3:(R1 2 SiO2 /2 )………(6)D3: (R 1 2 SiO 2 / 2 ).........(6)

上述通式(4)至(6)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;X表示碳數2至10之二價烴基。In the above formulae (4) to (6), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted group. Any one selected from the group consisting of an aryl group and a substituted or unsubstituted aralkyl group; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms.

其中,D1、D2表示:環狀有機聚矽氧烷之構成單位,D3表示鏈狀有機聚矽氧烷之構成單位。Here, D1 and D2 represent a constituent unit of a cyclic organopolyoxane, and D3 represents a constituent unit of a chain organopolysiloxane.

本實施形態之有機聚矽氧烷,宜為含有下述通式(7)所示之構成單位S,且該通式(7)所示之構成單位S之含量,相對於上述通式(1)所示之構成單位F1之含量,係滿足下述通式(II)之有機聚矽氧烷。The organopolysiloxane of the present embodiment is preferably a constituent unit S represented by the following formula (7), and the content of the constituent unit S represented by the formula (7) is relative to the above formula (1). The content of the constituent unit F1 shown is an organic polyoxane of the following formula (II).

d/a≦0.1………(II)d/a≦0.1.........(II)

其中多含下述通式(7)所示之構成單位S時,在餾除溶劑時或保存時會有SiH與不飽和鍵反應而膠體化之虞慮,由製品之安定生產性及保存安定性之觀點而言,以滿足上述通式(II)為佳。When many of the constituent units S represented by the following formula (7) are contained, there is a concern that the SiH reacts with the unsaturated bond to colloidal upon storage of the solvent or during storage, and the product is stable in productivity and storage stability. From the viewpoint of the nature, it is preferred to satisfy the above formula (II).

上述通式(7)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者。In the above formula (7), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and Any of the group of substituted or unsubstituted aralkyl groups.

構成單位S表示環狀或鏈狀有機聚矽氧烷之構成單 位。The constituent unit S represents a constituent of a cyclic or chain organopolyoxane Bit.

此外,本實施形態之有機聚矽氧烷,由硬化物之硬度之觀點而言,作為含有上述R2 之構成單位者,係只含有上述通式(1)所示之構成單位F1的有機聚矽氧烷為佳。此乃由於,在只有構成單位F1時,可使硬化物之交聯密度變高。In addition, the organic polysiloxane of the present embodiment contains the organic component of the constituent unit F1 represented by the above formula (1) as a constituent unit containing the above R 2 from the viewpoint of the hardness of the cured product. A siloxane is preferred. This is because the crosslinking density of the cured product can be increased only when the unit F1 is formed.

又,上述之「含有R2 之構成單位」中,係含有R2 之從屬概念下之R21 的構成單位,亦包含下述通式(8)至(10)。亦即,上述之所謂「作為含有上述R2 之構成單位者,係只含上述通式(1)所示之構成單位F1」,意為「雖含有通式(1)所示之構成單位F1,但並未含有含下述R21 之構成單位的通式(8)至(10)」。Further, the above-mentioned "constituting unit containing R 2 " includes a constituent unit of R 21 in the subordinate concept of R 2 and also includes the following general formulae (8) to (10). In other words, the above-mentioned "constituting unit constituting the above-mentioned R 2 includes only the constituent unit F1 represented by the above formula (1)", and means "having a constituent unit F1 represented by the general formula (1). However, the formula (8) to (10)" containing the constituent units of the following R 21 is not contained.

又,本實施形態之有機聚矽氧烷,由含該有機聚矽氧烷之硬化性樹脂組成物在低黏度下之操作性的觀點而言,以含有上述通式(1)所示之構成單位F1及下述通式(8)所示之構成單位F2之有機聚矽氧烷為佳。In addition, the organic polysiloxane of the present embodiment contains the composition represented by the above formula (1) from the viewpoint of workability at a low viscosity of the curable resin composition containing the organopolysiloxane. The organopolysiloxane having the unit F1 and the constituent unit F2 represented by the following formula (8) is preferred.

此乃由於,四官能之SiH之一部分至其一半部分經二官能之SiH所取代時,可以抑制矽氧烷之交聯構造的生成,因此可使黏度減低。This is because when one part of the tetrafunctional SiH is substituted with the difunctional SiH, the formation of the crosslinked structure of the decane can be suppressed, so that the viscosity can be reduced.

上述通式(8)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取 代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;Y表示碳數2至10之二價烴基。其中,F2表示鏈狀有機聚矽氧烷之構成單位。In the above formula (8), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and Any one selected from the group consisting of substituted or unsubstituted aralkyl groups; R 21 represents an acryloxy group or a methacryloxy group; and Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms. Wherein F2 represents a constituent unit of a chain organopolyoxane.

本實施形態之有機聚矽氧烷,以下述通式(9)所示之環狀有機聚矽氧烷,在其下述通式(9)以外之有機聚矽氧烷成分為100質量份時,再含有0.1至100質量份為佳。在其中含如下述通式(9)之構造,可使其硬化物之交聯密度增加,因此提高硬度及阻氣性。The organopolysiloxane of the present embodiment is a cyclic organopolyoxane represented by the following formula (9), and when the organopolyoxane component other than the following formula (9) is 100 parts by mass It is preferably further contained in an amount of 0.1 to 100 parts by mass. The structure containing the following general formula (9) can increase the crosslinking density of the cured product, thereby improving hardness and gas barrier properties.

下述通式(9)所示之環狀有機聚矽氧烷之含量,以1至90質量份為佳,5至80質量份更佳。The content of the cyclic organopolyoxane represented by the following formula (9) is preferably from 1 to 90 parts by mass, more preferably from 5 to 80 parts by mass.

上述通式(9)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者。R21 表示丙烯醯氧基或甲基丙烯醯氧基。X表示碳數2至10之二價烴基。e表示1以上之整數。f表示0以上之整數。e+f表示3至20之整數。In the above formula (9), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and Any of the group of substituted or unsubstituted aralkyl groups. R 21 represents an acryloxy group or a methacryloxy group. X represents a divalent hydrocarbon group having 2 to 10 carbon atoms. e represents an integer of 1 or more. f represents an integer of 0 or more. e+f represents an integer from 3 to 20.

同時,本實施形態之有機聚矽氧烷,又以下述通式(10)所示之化合物,在其有機聚矽氧烷成分為100質量 份時,為含有0.01至1000質量份為佳。Meanwhile, the organopolyoxane of the present embodiment is further a compound represented by the following formula (10), wherein the organopolyoxane component is 100 mass. When it is a part, it is preferable to contain 0.01 to 1000 mass parts.

在其中含通式(10)之化合物時,可對其硬化物賦予柔軟性,因此可提高其耐冷熱衝擊性。When the compound of the formula (10) is contained therein, flexibility can be imparted to the cured product, so that the thermal shock resistance can be improved.

下述通式(10)所示化合物之含量,以0.03至900質量份為佳,0.05至750質量份更佳。The content of the compound represented by the following formula (10) is preferably from 0.03 to 900 parts by mass, more preferably from 0.05 to 750 parts by mass.

通式(10)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者。R21 表示丙烯醯氧基或甲基丙烯醯氧基。X表示碳數2至10之二價烴基。g表示1以上之整數;h表示0以上之整數。i表示0至20之整數。In the formula (10), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group and a substitution. Any one selected from the group consisting of unsubstituted aralkyl groups. R 21 represents an acryloxy group or a methacryloxy group. X represents a divalent hydrocarbon group having 2 to 10 carbon atoms. g represents an integer of 1 or more; h represents an integer of 0 or more. i represents an integer from 0 to 20.

又,本實施形態之有機聚矽氧烷,由硬度、阻氣性及耐冷熱衝擊性平衡之觀點而言,以含上述通式(9)所示之環狀有機聚矽氧烷及上述通式(10)所示之化合物,且其以基質輔助游離化飛行時間型質譜分析法測定時得到之峰強度以下述通式(III)所計算所得,上述通式(10)所示之化合物含量〔WB〕相對於上述通式(9)所示之化合物含量〔WA〕之比:〔WB〕/〔WA〕之值,為0.1以上20.0以下 為佳,0.3以上18以下更佳,0.5以上15以下又更佳。Further, the organopolysiloxane of the present embodiment contains the cyclic organopolyoxane represented by the above formula (9) and the above-mentioned viewpoint from the viewpoint of balance between hardness, gas barrier properties and cold shock resistance. a compound represented by the formula (10), and the peak intensity obtained by the matrix-assisted free time-of-flight mass spectrometry is calculated by the following formula (III), and the compound represented by the above formula (10) The ratio of [WB] to the compound content [WA] represented by the above formula (9): [WB] / [WA] is 0.1 or more and 20.0 or less. Preferably, it is more preferably 0.3 or more and 18 or less, and more preferably 0.5 or more and 15 or less.

[數2][WB]/[WA]=符合通式(10)構造之質量與鈉質量23的合計質量所相當之峰的強度/符合通式(9)構造之質量與鈉質量23之合計質量所相當之峰的強度………(III)[Number 2] [WB] / [WA] = the intensity of the peak corresponding to the mass of the structure of the general formula (10) and the total mass of the sodium mass 23 / the sum of the mass of the structure of the general formula (9) and the mass of the sodium 23 The intensity of the peak corresponding to the quality.........(III)

其中如前所述,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者。Wherein R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and a substituted or Any one selected from the group of unsubstituted aralkyl groups.

R1 之例,可舉如:甲基、乙基、丙基、丁基、異丁基、第三丁基、戊基、新戊基、己基、環戊基、環己基及辛基等之碳數1至10之烷基;環丙基、環丁基、環戊基、環己基、環辛基、環癸基等之碳數3至10之環烷基;苯基、甲苯基、二甲苯基、異丙苯基及三甲苯基等之芳基;苯甲基、苯乙基及苯丙基等之芳烷基;或此等基之碳原子上鍵結之氫原子的一部分或全部經羥基、氰基及鹵素原子等取代之羥丙基、氰乙基、1-氯丙基及3,3,3-三氟丙基等。Examples of R 1 include methyl, ethyl, propyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, cyclopentyl, cyclohexyl and octyl groups. An alkyl group having 1 to 10 carbon atoms; a cycloalkyl group having 3 to 10 carbon atoms such as a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cyclooctyl group or a cyclodecyl group; a phenyl group, a tolyl group, and a second group; An aryl group such as a tolyl group, a cumyl group or a trimethylphenyl group; an aralkyl group such as a benzyl group, a phenethyl group or a phenylpropyl group; or a part or all of a hydrogen atom bonded to a carbon atom of the group; A hydroxypropyl group, a cyanoethyl group, a 1-chloropropyl group, a 3,3,3-trifluoropropyl group or the like substituted with a hydroxyl group, a cyano group, a halogen atom or the like.

R1 方面,由耐光性之觀點而言,以碳數1至10之烷基為佳。In the case of R 1 , from the viewpoint of light resistance, an alkyl group having 1 to 10 carbon atoms is preferred.

同時,R1 ,由本實施形態之有機聚矽氧烷及硬化性樹脂組成物之耐熱黃變性、耐光性之觀點而言,以甲基為更佳。Meanwhile, R 1 is more preferably a methyl group from the viewpoints of heat-resistant yellowing and light resistance of the organopolysiloxane and the curable resin composition of the present embodiment.

如前所述,R2 表示碳數2至10含不飽和鍵之基。As described above, R 2 represents a group having 2 to 10 carbon atoms and containing an unsaturated bond.

其例可舉如:乙烯基、烯丙基、異丙烯基、3-丁烯基、2-甲基丙烯基、4-戊烯基、5-己烯基、6-庚烯基、7-辛烯基、8-壬烯基、9-癸烯基等之不飽和鏈烴基;環己烯基、降莰烯基等之不飽和環烴基;乙烯醚基、烯丙醚基等含醚鍵之不飽和烴基;環己烯基等之環不飽和烴基;丙烯醯氧基、甲基丙烯醯氧基等之不飽和脂肪酸酯基。Examples thereof include vinyl, allyl, isopropenyl, 3-butenyl, 2-methylpropenyl, 4-pentenyl, 5-hexenyl, 6-heptenyl, 7- An unsaturated chain hydrocarbon group such as an octenyl group, an 8-alkenyl group or a 9-nonenyl group; an unsaturated cyclic hydrocarbon group such as a cyclohexenyl group or a nortenyl group; and an ether bond such as a vinyl ether group or an allyl ether group; An unsaturated hydrocarbon group such as a cyclohexenyl group; an unsaturated fatty acid group such as an acryloxy group or a methacryloxy group;

其中,由在形成後述之硬化性樹脂組成物時之反應性,即其熱硬化或光硬化易於進行而快速進行反應之觀點而言,以下述通式(12)所示之丙烯醯氧基、或下述通式(13)所示之甲基丙烯醯氧基(此等合併稱為(甲基)丙烯醯氧基)為佳。In the viewpoint of the reactivity in the formation of a curable resin composition to be described later, that is, the thermal curing or the photocuring is easy to carry out and the reaction proceeds rapidly, the acryloxy group represented by the following formula (12), Or a methacryloxy group represented by the following formula (13) (these are collectively referred to as (meth) acryloxy).

如前所述,X表示碳數2至10之二價烴基。As described above, X represents a divalent hydrocarbon group having 2 to 10 carbon atoms.

其例可舉如:-(CH2 )2 -、-(CH2 )3 -、-(CH2 )4 -、-(CH2 )5 -、-(CH2 )6 -、-(CH2 )8 -、-(CH2 )10 -、-CH(CH3 )CH2 -、-C(CH3 )2 -等,特別是由-(CH2 )2 -、-(CH2 )3 -、-(CH2 )4 -之原料易於取得及反應性,即其熱硬化或光硬化易於進行而快速反應之觀點而言較佳。Examples thereof include: -(CH 2 ) 2 -, -(CH 2 ) 3 -, -(CH 2 ) 4 -, -(CH 2 ) 5 -, -(CH 2 ) 6 -, -(CH 2 8 -, -(CH 2 ) 10 -, -CH(CH 3 )CH 2 -, -C(CH 3 ) 2 -, etc., especially from -(CH 2 ) 2 -, -(CH 2 ) 3 - The material of -(CH 2 ) 4 - is preferred because it is easy to obtain and react, that is, it is easy to carry out thermal hardening or photohardening and rapid reaction.

如前所述,Y表示碳數2至10之二價烴基。As described above, Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms.

其例可舉如:-(CH2 )2 -、-(CH2 )3 -、-(CH2 )4 -、-(CH2 )5 -、-(CH2 )6 -、-(CH2 )8 -、-(CH2 )10 -、-CH(CH3 )CH2 -、-C(CH3 )2 - 等,特別是由-(CH2 )3 -、-(CH2 )4 -、-(CH2 )6 -之原料易於取得及反應性,即其熱硬化或光硬化易於進行而快速反應之觀點而言較佳。Examples thereof include: -(CH 2 ) 2 -, -(CH 2 ) 3 -, -(CH 2 ) 4 -, -(CH 2 ) 5 -, -(CH 2 ) 6 -, -(CH 2 8 -, -(CH 2 ) 10 -, -CH(CH 3 )CH 2 -, -C(CH 3 ) 2 -, etc., especially from -(CH 2 ) 3 -, -(CH 2 ) 4 - The material of -(CH 2 ) 6 - is preferred because it is easy to obtain and react, that is, it is easy to carry out thermal hardening or photohardening and rapid reaction.

如上所述,本實施形態之有機聚矽氧烷,其上述之構成單位中,係具有(i)F1及M1、(ii)F1及T、(iii)F1、M1及T之任意組合的構成單位。As described above, the organopolysiloxane of the present embodiment has the constitution of any combination of (i) F1 and M1, (ii) F1 and T, (iii) F1, M1 and T. unit.

本實施形態之有機聚矽氧烷,以上述通式(1)至(3)中之a、b、c滿足下述通式(1)為佳。The organopolysiloxane of the present embodiment preferably satisfies the following general formula (1) in a, b, and c of the above formulas (1) to (3).

0.1≦a/(b+c)≦5………(I)0.1≦a/(b+c)≦5.........(I)

上述通式(1)之a/(b+c)之值,由使用後述之有機聚矽氧烷的硬化性樹脂組成物之硬化物的硬度之觀點而言,以0.1以上為佳,而由耐熱黃變性及耐光性之觀點而言,以5以下為佳。The value of a/(b+c) of the above formula (1) is preferably 0.1 or more from the viewpoint of the hardness of the cured product of the curable resin composition of the organopolysiloxane described later. From the viewpoint of heat-resistant yellowing and light resistance, it is preferably 5 or less.

又,由此觀點而言,較佳之範圍為0.12以上4以下,更佳之範圍為0.15以上3以下,本實施形態之有機聚矽氧烷之具體例,可舉如下述之化合物。In this case, the preferred range is 0.12 or more and 4 or less, and more preferably 0.15 or more and 3 or less. Specific examples of the organopolysiloxane of the present embodiment include the following compounds.

上述通式(13)至(31)中,m表示0至2000之整數;n表示0至20之整數;r表示0至20之整數。In the above formulae (13) to (31), m represents an integer of 0 to 2000; n represents an integer of 0 to 20; and r represents an integer of 0 to 20.

本實施形態之有機聚矽氧烷,由耐光性之觀點而言,以上述R1 為甲基者為佳;由反應性之觀點而言,以上述R2 為丙烯醯氧基或甲基丙烯醯氧基者為佳;由原料之取得容易之觀點而言,以上述Y為-(CH2 )3 -或-(CH2 )4 -或-(CH2 )6 -者為佳。The organopolysiloxane of the present embodiment is preferably one in which R 1 is a methyl group from the viewpoint of light resistance, and the above R 2 is an acryloxy group or a methacrylic group from the viewpoint of reactivity. The oxime is preferred; from the viewpoint of easy availability of the starting material, it is preferred that Y is -(CH 2 ) 3 - or -(CH 2 ) 4 - or -(CH 2 ) 6 -.

本實施形態之有機聚矽氧烷,其上述通式(1)所示之構成單位F1中之R2 係含丙烯醯氧基或甲基丙烯醯氧基,其中在本實施形態之有機聚矽氧烷中所含之全丙烯醯氧基或甲基丙烯醯氧基的官能基當量,由使用後述之有機 聚矽氧烷的硬化性樹脂組成物之硬化物的耐熱黃變性、耐光性之觀點而言以210g/mol以上為佳;由硬度之觀點而言以2000g/mol以下為佳。由此觀點而言,又以丙烯醯氧基或甲基丙烯醯氧基的官能基當量在250g/mol以上1500g/mol以下較佳,300g/mol以上1000g/mol以下更佳。In the organopolysiloxane of the present embodiment, the R 2 in the constituent unit F1 represented by the above formula (1) contains an acryloxy group or a methacryloxy group, and the organic polyfluorene in the embodiment. The functional group equivalent of the all-acryloxy group or the methacryloxy group contained in the oxyalkylene is derived from the viewpoint of heat-resistant yellowing and light resistance of the cured product of the curable resin composition of the organopolysiloxane described later. It is preferably 210 g/mol or more, and more preferably 2000 g/mol or less from the viewpoint of hardness. From this point of view, the functional group equivalent of the acryloxy group or the methacryloxy group is preferably 250 g/mol or more and 1500 g/mol or less, more preferably 300 g/mol or more and 1000 g/mol or less.

又,該丙烯醯氧基或甲基丙烯醯氧基的官能基當量可依後述之實施例中所記載之方法測定。Further, the functional group equivalent of the acryloxy group or the methacryloxy group can be measured by the method described in the examples below.

本實施形態之有機聚矽氧烷,其重量平均分子量,由使用後述之有機聚矽氧烷的硬化性樹脂組成物之硬化物的耐冷熱衝擊性之觀點而言,以700以上為佳;由硬度之觀點而言,以5000000以下為佳,1000以上3000000以下更佳,1500以上1000000以下又更佳。The weight average molecular weight of the organopolysiloxane of the present embodiment is preferably 700 or more from the viewpoint of the thermal shock resistance of the cured product of the curable resin composition of the organopolysiloxane described later; From the viewpoint of hardness, it is preferably 5,000,000 or less, more preferably 1,000 or more and 3,000,000 or less, and still more preferably 1,500 or more and 1,000,000 or less.

又,本實施形態之有機聚矽氧烷,由有機聚矽氧烷之25℃下的黏度,在螢光體及著色劑之分散安定性之觀點而言,以50mPa.s以上為佳;由作業性之觀點而言,以1000000mPa.s以下為佳。黏度又以80mPa.s以上500000mPa.s以下為佳,100mPa.s以上100000mPa.s以下更佳。Further, the organopolysiloxane of the present embodiment has a viscosity at 25 ° C from the organopolyoxane, and is 50 mPa from the viewpoint of dispersion stability of the phosphor and the color former. Above s is better; from the point of view of workability, it is 1000000mPa. The following is better. The viscosity is again 80mPa. s above 500000mPa. s below is better, 100mPa. s above 100000mPa. s is better below.

其中有機聚矽氧烷之重量平均分子量及黏度,可以後述之實施例中所記載之方法測定。The weight average molecular weight and viscosity of the organopolyoxane can be measured by the methods described in the examples below.

〔有機聚矽氧烷之製造方法〕[Method for Producing Organic Polyoxane]

本實施形態之有機聚矽氧烷,係將下述通式(11)所示之氫化聚矽氧烷(a1)及依所需之具有1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)、 i)具有2個以上直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)或具有2個以上直接鍵結於矽原子的羥基之聚矽氧烷(b2),以及ii)1分子中具有2個以上不飽和鍵的有機化合物(c)之加成反應,在矽氫化反應催化劑(d)之存在下進行而製造。The organopolyoxane of the present embodiment is a hydrogenated polyadenine (a1) represented by the following formula (11) and a hydrogenation of one or more hydrogen atoms directly bonded to a ruthenium atom as required. Polyoxane (a2), i) a vinyl group-containing organopolyoxane (b1) having two or more vinyl groups directly bonded to a ruthenium atom or a polyoxy siloxane (b2) having two or more hydroxyl groups directly bonded to a ruthenium atom, And ii) an addition reaction of the organic compound (c) having two or more unsaturated bonds in one molecule, and is produced by carrying out the reaction of the hydrazine hydrogenation catalyst (d).

上述通式(11)中之R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;j表示1以上之整數;k表示0以上之整數;j+k表示3至20之整數。R 1 in the above formula (11) represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and Any one selected from the group consisting of substituted or unsubstituted aralkyl groups; j represents an integer of 1 or more; k represents an integer of 0 or more; and j+k represents an integer of 3 to 20.

上述通式(11)所示之1分子中至少具有1個SiH基之氫化聚矽氧烷(a1)之例,可舉如:以下式(32)、(33)或(34)所示之化合物。An example of the hydrogenated polyoxyalkylene (a1) having at least one SiH group in one molecule represented by the above formula (11) is as shown in the following formula (32), (33) or (34). Compound.

上述之氫化聚矽氧烷(a1),可為2種以上之組合,亦可為單獨1種。The above-mentioned hydrogenated polyoxyalkylene oxide (a1) may be used alone or in combination of two or more.

上述具有1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)之例,可舉如:下述式(35)、(36)、(37)或(38)所示之化合物。Examples of the hydrogenated polyoxyalkylene (a2) having one or more hydrogen atoms bonded directly to a halogen atom may be as shown in the following formula (35), (36), (37) or (38). Compound.

具有1個以上直接鍵結於矽原子的氫原子之氫化聚矽氧烷方面,將上述(a1)與上述(a2)以任意之比例組合,即可以調節其硬化物之硬度、阻氣性及本實施形態之含有機聚矽氧烷的硬化性樹脂組成物之黏度。In the case of having one or more hydrogenated polyoxyalkylenes directly bonded to a hydrogen atom of a halogen atom, the above (a1) and the above (a2) may be combined in an arbitrary ratio to adjust the hardness and gas barrier properties of the cured product. The viscosity of the curable resin composition containing the organopolysiloxane of the present embodiment.

在增多上述(a1)之比例時,可以提高硬化物之硬度、阻氣性;在增多上述(a2)之比例時,可以降低本實施形態之含有機聚矽氧烷的硬化性樹脂組成物之黏度而使操作容易。When the ratio of the above (a1) is increased, the hardness and gas barrier properties of the cured product can be increased. When the ratio of the above (a2) is increased, the curable resin composition containing the polysiloxane of the present embodiment can be reduced. Viscosity makes operation easy.

具有2個以上直接鍵結於上述矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)可舉如以下之例。例如:CH2 =CHSi(Me)2 O-Si(Me)2 CH=CH2 、CH2 =CHSi(Me)2 O-Si(Me)2 O-Si(Me)2 CH=CH2 、 CH2 =CHSi(Me)2 O-(Si(Me)2 O)2 -Si(Me)2 CH=CH2 、CH2 =CHSi(Me)2 O-(Si(Me)2 O)3 -Si(Me)2 CH=CH2 、CH2 =CHSi(Me)2 O-(Si(Me)2 O)6 -Si(Me)2 CH=CH2 、CH2 =CHSi(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 CH=CH2 、CH2 =CHSi(Me)2 O-(Si(Me)2 O)11 -Si(Me)2 CH=CH2 、CH2 =CHSi(Me)2 O-(Si(Me)2 O)12 -Si(Me)2 CH=CH2 、CH2 =CHSi(Me)2 O-(Si(Me)2 O)20 -Si(Me)2 CH=CH2 、CH2 =CHCH2 Si(Me)2 O-Si(Me)2 CH2 CH=CH2 及CH2 =CHCH2 Si(Me)2 O-Si(Me)2 O-Si(Me)2 CH2 CH=CH2The vinyl group-containing organopolyoxane (b1) having two or more vinyl groups directly bonded to the above-mentioned ruthenium atom can be exemplified as follows. For example: CH 2 =CHSi(Me) 2 O-Si(Me) 2 CH=CH 2 , CH 2 =CHSi(Me) 2 O-Si(Me) 2 O-Si(Me) 2 CH=CH 2 , CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 2 -Si(Me) 2 CH=CH 2 , CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 3 -Si (Me) 2 CH=CH 2 , CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 6 -Si(Me) 2 CH=CH 2 , CH 2 =CHSi(Me) 2 O-( Si(Me) 2 O) 8 -Si(Me) 2 CH=CH 2 , CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 11 -Si(Me) 2 CH=CH 2 ,CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 12 -Si(Me) 2 CH=CH 2 , CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 20 -Si (Me) 2 CH=CH 2 , CH 2 =CHCH 2 Si(Me) 2 O-Si(Me) 2 CH 2 CH=CH 2 and CH 2 =CHCH 2 Si(Me) 2 O-Si(Me) 2 O-Si(Me) 2 CH 2 CH=CH 2 .

上述式中,Me表示甲基。In the above formula, Me represents a methyl group.

具有2個以上直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1),可為2種以上之組合,亦可為單獨1種。The vinyl group-containing organopolyoxane (b1) having two or more vinyl groups bonded directly to a ruthenium atom may be used alone or in combination of two or more.

具有2個以上直接鍵結於上述矽原子的羥基之聚矽氧烷(b2)可舉如以下之例。其例如:HO-Si(Me)2 O-Si(Me)2 -OH、HO-Si(Me)2 O-Si(Me)2 O-Si(Me)2 -OH、HO-Si(Me)2 O-(Si(Me)2 O)2 -Si(Me)2 -OH、HO-Si(Me)2 O-(Si(Me)2 O)3 -Si(Me)2 -OH、HO-Si(Me)2 O-(Si(Me)2 O)6 -Si(Me)2 -OH、HO-Si(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 -OH、HO-Si(Me)2 O-(Si(Me)2 O)11 -Si(Me)2 -OH、HO-Si(Me)2 O-(Si(Me)2 O)12 -Si(Me)2 -OH、HO-Si(Me)2 O-(Si(Me)2 O)20 -Si(Me)2 -OH。The polyoxane (b2) having two or more hydroxyl groups directly bonded to the above-mentioned ruthenium atom can be exemplified as follows. For example: HO-Si(Me) 2 O-Si(Me) 2 -OH, HO-Si(Me) 2 O-Si(Me) 2 O-Si(Me) 2 -OH, HO-Si(Me) 2 O-(Si(Me) 2 O) 2 -Si(Me) 2 -OH, HO-Si(Me) 2 O-(Si(Me) 2 O) 3 -Si(Me) 2 -OH, HO- Si(Me) 2 O-(Si(Me) 2 O) 6 -Si(Me) 2 -OH, HO-Si(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 - OH, HO-Si(Me) 2 O-(Si(Me) 2 O) 11 -Si(Me) 2 -OH, HO-Si(Me) 2 O-(Si(Me) 2 O) 12 -Si( Me) 2 -OH, HO-Si(Me) 2 O-(Si(Me) 2 O) 20 -Si(Me) 2 -OH.

上述式中,Me表示甲基。In the above formula, Me represents a methyl group.

具有2個以上直接鍵結於上述矽原子的羥基之聚矽氧烷(b2),可為2種以上之組合,亦可為單獨1種。The polyoxyalkylene (b2) having two or more hydroxyl groups directly bonded to the above-mentioned ruthenium atom may be used alone or in combination of two or more.

上述1分子中具有2個以上不飽和鍵的有機化合物(c),係如下述通式(39)所示。The organic compound (c) having two or more unsaturated bonds in the above one molecule is represented by the following formula (39).

CH2 =CH-R3 -R2 ………(39)CH 2 =CH-R 3 -R 2 .........(39)

上述通式(39)中之R2 表示碳數2至10含不飽和鍵之基;R3 表示碳數1至8之二價烴基。R 2 in the above formula (39) represents a group having 2 to 10 carbon atoms and an unsaturated bond; and R 3 represents a divalent hydrocarbon group having 1 to 8 carbon atoms.

R3 之碳數,特別以1至4為佳。如此之下,可使矽氫化反應確實地進行。The carbon number of R 3 is particularly preferably from 1 to 4. In this way, the hydrogenation reaction of hydrazine can be carried out reliably.

另一方面,R3 在4以下時,可以抑制其沸點,因此可將由反應溶液剩餘之上述(c)簡單地餾除。On the other hand, when R 3 is 4 or less, the boiling point thereof can be suppressed, so that the above (c) remaining from the reaction solution can be easily distilled off.

上述1分子中具有2個以上不飽和鍵的有機化合物(c),可為2種以上之組合,亦可為單獨1種。The organic compound (c) having two or more unsaturated bonds in the above-mentioned one molecule may be used alone or in combination of two or more.

在本實施形態之有機聚矽氧烷之製造步驟中,上述1分子中具有2個以上不飽和鍵的有機化合物(c)之使用量(莫耳量),由可在不殘留SiH基下反應至最後之觀點而言,相對於:將源自上述通式(11)所示之氫化聚矽氧烷(a1)之SiH基的莫耳量與依所需而添加之具有1個以上直接鍵結於上述矽原子之氫原子的源自氫化聚矽氧烷(a2)之SiH基的莫耳量之和、與具有2個以上直接鍵結於上述矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)之乙烯 基的莫耳量或具有2個以上直接鍵結於矽原子的羥基之聚矽氧烷(b2)的羥基之莫耳量之差,亦即,相對於〔(a1)之SiH基之莫耳量+(a2)之SiH基之莫耳量〕-〔(b1)之乙烯基之莫耳量或(b2)之羥基之莫耳量〕,以過剩地添加為佳。In the production step of the organopolyoxane of the present embodiment, the amount of the organic compound (c) having two or more unsaturated bonds in one molecule (molar amount) can be reacted without leaving a SiH group. From the last point of view, the molar amount of the SiH group derived from the hydrogenated polyoxyalkylene (a1) represented by the above formula (11) is added as desired, and has one or more direct bonds. a molar amount of a molar amount of a SiH group derived from a hydrogenated polyoxyalkylene (a2) bonded to a hydrogen atom of the above-mentioned germanium atom, and a vinyl group-containing organic having two or more vinyl groups directly bonded to the above-mentioned germanium atom Polyoxyalkylene (b1) ethylene The molar amount of the base or the molar amount of the hydroxyl group of the polyoxyalkylene (b2) having two or more hydroxyl groups bonded directly to the halogen atom, that is, the molar amount of the SiH group relative to [(a1) The molar amount of the SiH group of the amount +(a2)]-[the molar amount of the vinyl group of (b1) or the molar amount of the hydroxyl group of (b2) is preferably added excessively.

具體言之,即以〔1分子中具有2個以上不飽和鍵的有機化合物(c)之莫耳量〕/〔(源自(a1)、(a2)之SiH基之莫耳量)-(源自(b1)之乙烯基之莫耳量或源自(b2)之羥基之莫耳量)〕=1.2至3.0為佳。Specifically, it is [the molar amount of the organic compound (c) having two or more unsaturated bonds in one molecule] / [(the molar amount of the SiH group derived from (a1), (a2)) - ( The molar amount of the vinyl group derived from (b1) or the molar amount of the hydroxyl group derived from (b2) is preferably 1.2 to 3.0.

上述矽氫化反應催化劑(d),並無特別之限定,已往所知之物種均可使用。The above-mentioned hydrazine hydrogenation catalyst (d) is not particularly limited, and any of the known species can be used.

其例如:鉑黑、氯化鉑、氯鉑酸、氯鉑酸與一元醇反應之生成物、氯鉑酸與烯烴類之錯合物、雙-乙醯乙酸鉑等之鉑系催化劑;鈀系催化劑、銠系催化劑等的鉑系催化劑以外之鉑族金屬系催化劑。For example, platinum black, platinum chloride, chloroplatinic acid, a product of reaction of chloroplatinic acid with a monohydric alcohol, a complex of chloroplatinic acid and an olefin, a platinum-based catalyst such as bis-acetonitrile platinum; A platinum group metal catalyst other than a platinum-based catalyst such as a catalyst or a ruthenium catalyst.

矽氫化反應催化劑(d),可為2種以上之組合,亦可為單獨1種。The hydrazine hydrogenation catalyst (d) may be used alone or in combination of two or more.

矽氫化反應催化劑(d)之量並無特別之限定,相對於將通式(11)所示之氫化聚矽氧烷(a1)及依所需再含1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)、與i)具有2個以上直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)、或具有2個以上直接鍵結於矽原子的羥基之聚矽氧烷(b2)及ii)1分子中具有2個以上不飽和鍵的有機化合物(c),經過加成反應所得到 之生成物的有機聚矽氧烷之重量,以0.01至100ppm為佳。The amount of the hydrazine hydrogenation catalyst (d) is not particularly limited, and is further bonded to the ruthenium atom with respect to the hydrogenated polyoxy siloxane (a1) represented by the formula (11) and, if necessary, one or more. a hydrogenated polyoxyalkylene (a2) having a hydrogen atom, and i) a vinyl group-containing organopolyoxane (b1) having two or more vinyl groups bonded directly to a ruthenium atom, or having two or more direct bonds An organic compound (c) having two or more unsaturated bonds in one molecule of a polyoxyalkylene (b2) of a hydroxyl group of a halogen atom and ii), which is obtained by an addition reaction The weight of the organic polyoxane of the product is preferably from 0.01 to 100 ppm.

上述矽氫化反應催化劑(d)之量,由可充分得到其添加效果之觀點而言,以0.01ppm以上為佳;由成本之觀點而言,以100ppm以下為佳。The amount of the above-mentioned hydrazine hydrogenation catalyst (d) is preferably 0.01 ppm or more from the viewpoint of sufficiently obtaining the effect of addition, and is preferably 100 ppm or less from the viewpoint of cost.

同時,矽氫化反應催化劑(d),亦可在加成反應之後以活性氧化鋁及活性碳等吸附材去除。Meanwhile, the rhodium hydrogenation catalyst (d) may be removed by an adsorbent such as activated alumina or activated carbon after the addition reaction.

由耐熱黃變性、耐光性之觀點而言,後述矽氫化反應催化劑(d)之量,以相對於100質量份之以上述通式(11)所示之氫化聚矽氧烷(a1)及依所需再含1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)、與i)具有2個以上直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)、或具有2個以上直接鍵結於矽原子的羥基之聚矽氧烷(b2)及ii)1分子中具有2個以上不飽和鍵的有機化合物(c)經過加成反應所得到之生成物,即有機聚矽氧烷,以0.001質量份以下為佳。From the viewpoint of heat-resistant yellowing and light resistance, the amount of the hydrogenation-reactive catalyst (d) described later is based on 100 parts by mass of the hydrogenated polyoxane (a1) represented by the above formula (11). A vinyl-containing organic polyfluorene having one or more hydrogenated polyoxyalkylenes (a2) directly bonded to a hydrogen atom of a halogen atom, and i) having two or more vinyl groups directly bonded to a halogen atom of a halogen atom. Oxygenane (b1) or an organic compound (c) having two or more polyoxyalkylenes (b2) directly bonded to a hydroxyl group of a halogen atom and ii) having two or more unsaturated bonds in one molecule undergoing an addition reaction The product obtained, that is, the organopolysiloxane, is preferably 0.001 parts by mass or less.

上述硬化性樹脂組成物中之矽氫化反應催化劑(d)之量,可經由分析後述之硬化性樹脂組成物進行測定。The amount of the hydrazine hydrogenation catalyst (d) in the curable resin composition can be measured by analyzing a curable resin composition described later.

本實施形態之有機聚矽氧烷的製造步驟中之上述加成反應,一般可在室溫至100℃下進行反應。In the above-described addition reaction in the production step of the organopolysiloxane of the present embodiment, the reaction can be generally carried out at room temperature to 100 °C.

上述R2 為(甲基)丙烯醯氧基時,由於(甲基)丙烯醯氧基在高溫下有易於反應而膠體化之可能性,其反應溫度以40℃至70℃為佳。When the above R 2 is a (meth) propylene fluorenyloxy group, the (meth) propylene fluorenyloxy group may be colloidalized by being easily reacted at a high temperature, and the reaction temperature is preferably 40 ° C to 70 ° C.

上述加成反應,亦可依所需在溶劑中進行。The above addition reaction can also be carried out in a solvent as required.

該溶劑之例,可使用如:甲苯及二甲苯等之芳族系溶 劑;己烷及辛烷等之脂族系溶劑;甲乙酮及甲基異丁酮等之酮系溶劑;乙酸乙酯及乙酸異丁酯等之酯系溶劑;二異丙醚、1,4-二噁烷、二乙醚、四氫呋喃、乙二醇二甲醚、乙二醇二乙醚及丙二醇單甲醚乙酸酯等之醚系溶劑;以及異丙醇等之醇系溶劑;或此等之混合溶劑。As an example of the solvent, an aromatic solution such as toluene or xylene can be used. An aliphatic solvent such as hexane or octane; a ketone solvent such as methyl ethyl ketone or methyl isobutyl ketone; an ester solvent such as ethyl acetate or isobutyl acetate; diisopropyl ether; An ether solvent such as dioxane, diethyl ether, tetrahydrofuran, ethylene glycol dimethyl ether, ethylene glycol diethyl ether or propylene glycol monomethyl ether acetate; and an alcohol solvent such as isopropyl alcohol; or a mixture thereof Solvent.

加成反應中之環境,可在空氣中、非活性氣體中之任意者。在所得到之有機氫化聚矽氧烷之著色少之點方面,以在氮、氬及氦等之非活性氣體中為佳,上述R2 為(甲基)丙烯醯氧基時,為防止(甲基)丙烯醯氧基之聚合反應之目的亦可再導入少量之氧。The environment in the addition reaction can be any of air or inert gas. In the case where the color of the obtained organic hydrogenated polyoxyalkylene is less colored, it is preferably an inert gas such as nitrogen, argon or helium, and when the above R 2 is a (meth)acryloxy group, it is prevented ( For the purpose of the polymerization of methyl) propylene methoxy group, a small amount of oxygen can be introduced.

上述R2 為(甲基)丙烯醯氧基時,以防止(甲基)丙烯醯氧基之聚合反應之目的,以預先在反應系中添加啡噻嗪、受阻酚系化合物、胺系化合物及醌系化合物等之阻聚劑者為佳。該阻聚劑之種類及量,以不會因該等之添加而妨礙矽氫化反應之進行,如可防止(甲基)丙烯醯氧基,亦即丙烯醯氧基或甲基丙烯醯氧基之聚合反應者即可,並無特別之限定。When R 2 is a (meth) propylene oxime group, a phenothiazine, a hindered phenol compound, an amine compound, and the like are added to the reaction system in advance for the purpose of preventing polymerization of the (meth) propylene oxime group. A polymerization inhibitor such as a lanthanoid compound is preferred. The type and amount of the polymerization inhibitor are not hindered by the addition of such a hydrazine reaction, such as prevention of (meth) propylene oxime, that is, propylene oxime or methacryloxy group. The polymerization reactor is not particularly limited.

在加成反應終了之後,該反應混合物亦可再以水洗或活性碳處理等一般之方法去除加成反應催化劑。在使用剩餘之1分子中具有2個以上不飽和鍵之有機化合物(c)及溶劑時,可在加熱及/或減壓下餾除,即可得到具有上述通式(1)至(3)所示之構成單位F1、M1、T中的(i)F1及M1、(ii)F1及T、 (iii)F1、M1及T之任意組合的構成單位之有機聚矽氧烷。After the end of the addition reaction, the reaction mixture may be further subjected to removal of the addition reaction catalyst by a usual method such as water washing or activated carbon treatment. When the organic compound (c) and the solvent having two or more unsaturated bonds in the remaining one molecule are used, they can be distilled off under heating and/or reduced pressure to obtain the above formula (1) to (3). (i) F1 and M1, (ii) F1 and T in the constituent units F1, M1, T shown, (iii) an organic polyoxane of a constituent unit of any combination of F1, M1 and T.

在本實施形態之有機聚矽氧烷的製造步驟中,可事先調製下述反應液,然後在該反應液中加入矽氫化反應催化劑(d)進行上述之加成反應一次合成而實施,該反應液係包含上述氫化聚矽氧烷(a1)及依所需再與上述氫化聚矽氧烷(a2)、與含上述乙烯基之有機聚矽氧烷(b1)及1分子中具有2個以上不飽和鍵的有機化合物(c)、或與具有2個以上直接鍵結於上述矽原子的羥基之聚矽氧烷(b2)及1分子中具有2個以上不飽和鍵的有機化合物(c)者In the production step of the organopolyoxane of the present embodiment, the following reaction liquid can be prepared in advance, and then the hydrazine hydrogenation reaction catalyst (d) is added to the reaction liquid to carry out the above-described addition reaction and synthesis, and the reaction is carried out. The liquid system contains the hydrogenated polyoxyalkylene oxide (a1) and, if necessary, two or more of the hydrogenated polyoxyalkylene oxide (a2) and the vinyl group-containing organic polyoxane (b1) and one molecule. An organic compound (c) having an unsaturated bond or an organic compound (c) having two or more polyoxyalkylenes (b2) directly bonded to a hydroxyl group of the above-mentioned ruthenium atom and one or more unsaturated bonds in one molecule; By

此外,本實施形態之有機聚矽氧烷的製造步驟中之上述加成反應,可依序實施第1階段與第2階段,該第1階段係:預先調製其中含上述氫化聚矽氧烷(a1)、依所需的上述氫化聚矽氧烷(a2)及1分子中具有2個以上不飽和鍵的有機化合物(c)之反應液,再於該反應液中添加矽氫化反應催化劑(d),使生成上述氫化聚矽氧烷(a1)、依所需的上述氫化聚矽氧烷(a2)及1分子中具有2個以上不飽和鍵的有機化合物(c)之加成體的步驟;第2階段係:在上述反應液中添加上述含乙烯基之有機聚矽氧烷(b1)、或具有2個以上直接鍵結於上述矽原子的羥基之聚矽氧烷(b2)之步驟。Further, in the above-described addition reaction in the production step of the organopolysiloxane of the present embodiment, the first step and the second step may be sequentially performed, and the first step is to preliminarily prepare the above-mentioned hydrogenated polyoxyalkylene ( A1) a reaction liquid of the above-mentioned hydrogenated polyoxyalkylene (a2) and an organic compound (c) having two or more unsaturated bonds in one molecule, and further adding a hydrogenation catalyst (d) to the reaction liquid The step of producing the above-mentioned hydrogenated polyoxyalkylene oxide (a1), the above-mentioned hydrogenated polyoxyalkylene oxide (a2), and an organic compound (c) having two or more unsaturated bonds in one molecule The second stage is a step of adding the vinyl group-containing organopolyoxane (b1) or the polyoxyalkylene (b2) having two or more hydroxyl groups directly bonded to the above ruthenium atom to the reaction liquid. .

〔硬化性樹脂組成物〕[Cure resin composition] (熱自由基產生劑)(thermal radical generator)

本實施形態之熱硬化性樹脂組成物,其一形態可列舉 如:含有上述有機聚矽氧烷及熱自由基產生劑之所謂熱硬化性樹脂組成物。One form of the thermosetting resin composition of the present embodiment is exemplified For example, a so-called thermosetting resin composition containing the above organopolysiloxane and a thermal radical generator.

上述熱自由基產生劑,只要為可由熱使(甲基)丙烯醯氧基發生自由基聚合者即可並無特別之限定。The above-mentioned thermal radical generating agent is not particularly limited as long as it can radically polymerize a (meth)acryloxy group by heat.

其例如:過氧化苯甲醯、過氧化月桂醯、過氧化第三丁烷、氫過氧化異丙苯之類的有機過氧化物;偶氮雙異丁腈之類的偶氮化合物。Examples thereof include an organic peroxide such as benzamidine peroxide, laurel peroxide, tributane peroxide, cumene hydroperoxide, or an azo compound such as azobisisobutyronitrile.

其具體之例,可舉如:2,2-偶氮雙(4-甲氧基-2,4-二甲基戊腈)(V-70,日本和光純藥公司製造)、2,2′-偶氮雙(2,4-二甲基戊腈)(V-65,日本和光純藥公司製造)、2,2′-偶氮雙異丁腈(V-60,日本和光純藥公司製造)及2,2′-偶氮雙(2-甲基丁腈)(V-59,日本和光純藥公司製造)等之偶氮腈化合物;過氧化辛醯(PEROYL O,日本油脂公司製造)、過氧化月桂醯(PEROYL L,日本油脂公司製造)、過氧化硬脂醯(PEROYL S,日本油脂公司製造)、過氧化琥珀酸(PEROYL SA,日本油脂公司製造)、過氧化苯甲醯(NYPER BW,日本油脂公司製造)、過氧化異丁醯(PEROYL IB,日本油脂公司製造)、過氧化-2,4-二氯苯甲醯(NYPER CS,日本油脂公司製造)及過氧化-3,5,5-三甲基己醯(PEROYL 355,日本油脂公司製造)等之過氧化二醯類;過氧化二羧酸二正丙酯(PEROYL NPP-50M,日本油脂公司製造)、過氧化二羧酸二異丙酯(PEROYL IPP-50,日本油脂公司製造)、過氧化二羧酸雙(4-第三丁基環己基)酯(PEROYL TCP,日本油脂公司製造)、過氧化二羧酸二-2- 乙氧乙酯(PEROYL EEP,日本油脂公司製造)、過氧化二羧酸二-2-乙氧己酯(PEROYL OPP,日本油脂公司製造)、過氧化二羧酸二-2-甲氧丁酯(PEROYL MBP,日本油脂公司製造)及過氧化二羧酸二(3-甲基-3-甲氧基丁基)酯(PEROYL SOP,日本油脂公司製造)等之過氧化二羧酸酯類;氫過氧化第三丁烷(PERBUTYL H-69,日本油脂公司製造)及過氧化-1,1,3,3-四甲基丁烷(PEROCTA H,日本油脂公司製造)等之氫過氧化物類;過氧化二第三丁烷(PERBUTYL D,日本油脂公司製造)、2,5-二甲基-2,5-雙(第三丁基過氧化)己烷(PERHEXA 25B,日本油脂公司製造)等之過氧化二烷類;α,α’-雙(新癸醯過氧化)二異丙苯(DYPER ND,日本油脂公司製造)、過氧化新癸酸異苯丙酯(PERCUMYL ND,日本油脂公司製造)、過氧化新癸酸-1,1,3,3-四甲基丁酯(PEROCTA ND,日本油脂公司製造)、過氧化新癸酸-1-環己基-1-甲乙酯(PERCYCLO ND,日本油脂公司製造)、過氧化新癸酸第三己酯(PERHEXYL ND,日本油脂公司製造)、過氧化新癸酸第三丁酯(PERBUTYL ND,日本油脂公司製造)、過氧化三甲基乙酸第三己酯(PERHEXYL PV,日本油脂公司製造)、過氧化三甲基乙酸第三丁酯(PERBUTYL PV,日本油脂公司製造)、過氧化-2-乙基己酸-1,1,3,3-四甲基丁酯(PEROCTA O,日本油脂公司製造)、2,5-二甲基-2,5-雙(2-乙基己醯過氧基)己烷(PERHEXA 250,日本油脂公司製造)、過氧化-2-乙基己酸-1-環己基-1-甲乙酯(PERCYCLO O,日本油脂公司製造)、過氧化-2-乙基己酸第三己酯 (PERHEXYL O,日本油脂公司製造)、過氧化-2-乙基己酸第三丁酯(PERBUTYL O,日本油脂公司製造)、過氧化異丁酸第三丁酯(PERBUTYL IB,日本油脂公司製造)、過氧化異丙基單羧酸第三己酯(PERHEXYL I,日本油脂公司製造)及過氧化順丁烯二酸第三丁酯(PERBUTYL MA,日本油脂公司製造)、過氧化-2-乙基己酸第三戊酯(Trigonox 121,日本化藥Akzo公司製造)、過氧化-3,5,5-三甲基己酸第三戊酯(Kayaester AN,日本化藥Akzo公司製造)等之過氧化酯類等之有機過氧化物等,但並不特別限定於此。Specific examples thereof include 2,2-azobis(4-methoxy-2,4-dimethylvaleronitrile) (V-70, manufactured by Nippon Wako Pure Chemical Industries, Ltd.), 2, 2' -Azobis(2,4-dimethylvaleronitrile) (V-65, manufactured by Nippon Wako Pure Chemical Industries, Ltd.), 2,2'-azobisisobutyronitrile (V-60, manufactured by Nippon Wako Pure Chemical Industries, Ltd.) And an azonitrile compound such as 2,2'-azobis(2-methylbutyronitrile) (V-59, manufactured by Nippon Wako Pure Chemical Co., Ltd.); PEROYL O (manufactured by Nippon Oil & Fats Co., Ltd.) , Peroxidic Laurel (PEROYL L, manufactured by Nippon Oil & Fats Co., Ltd.), Peroxylated Rhenol (PEROYL S, manufactured by Nippon Oil & Fats Co., Ltd.), Peroxidic Succinic Acid (PEROYL SA, manufactured by Nippon Oil & Fats Co., Ltd.), Benzoyl peroxide ( NYPER BW, manufactured by Nippon Oil & Fats Co., Ltd., isobutyl oxime (PEROYL IB, manufactured by Nippon Oil & Fats Co., Ltd.), perylene-2,4-dichlorobenzamide (manufactured by Nippon Oil & Fats Co., Ltd.) and peroxidized-3 , 5,5-trimethylhexanide (PEROYL 355, manufactured by Nippon Oil & Fats Co., Ltd.), etc.; di-n-propyl peroxydicarboxylate (PEROYL NPP-50M, manufactured by Nippon Oil & Fats Co., Ltd.), peroxidation Diisopropyl dicarboxylate (PEROYL IPP-50, Oil & Fat Co., Ltd.), a dicarboxylic acid peroxide, bis (4-tert-butyl-cyclohexyl) ester (PEROYL TCP, manufactured by Nippon Oil Corporation) peroxide, di-dicarboxylic acid Ethoxyethyl ester (PEROYL EEP, manufactured by Nippon Oil & Fats Co., Ltd.), di-2-ethoxyhexyl peroxydicarboxylate (PEROYL OPP, manufactured by Nippon Oil & Fats Co., Ltd.), di-2-methoxybutyl peroxide dicarboxylate (PEROYL MBP, manufactured by Nippon Oil & Fats Co., Ltd.) and peroxydicarboxylates such as di(3-methyl-3-methoxybutyl)peroxydicarboxylate (PEROYL SOP, manufactured by Nippon Oil & Fats Co., Ltd.); Hydroperoxide, such as PERBUTYL H-69 (manufactured by Nippon Oil & Fats Co., Ltd.) and peroxidized-1,1,3,3-tetramethylbutane (PEROCTA H, manufactured by Nippon Oil & Fats Co., Ltd.) Benzene peroxide (PERBUTYL D, manufactured by Nippon Oil & Fats Co., Ltd.), 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane (PERHEXA 25B, manufactured by Nippon Oil & Fats Co., Ltd.) And other dioxanes; α,α'-bis(new bismuth peroxide) diisopropylbenzene (DYPER ND, manufactured by Nippon Oil & Fats Co., Ltd.), isopropenyl neodecanoate (PERCUMYL ND, Japan) Produced by Oils and Fats Co., Ltd., peroxy neodecanoic acid-1,1,3,3-tetramethylbutyl ester (PEROCTA ND, manufactured by Nippon Oil & Fats Co., Ltd.), peroxy neodecanoate-1-cyclohexyl-1-methylethyl ester (PERCYCLO ND, Japan Oil Company Manufactured, perhexyl neodecanoate (PERHEXYL ND, manufactured by Nippon Oil Co., Ltd.), perbutyl neodecanoate (PERBUTYL ND, manufactured by Nippon Oil Co., Ltd.), trimethylacetate peroxide Ester (PERHEXYL PV, manufactured by Nippon Oil & Fats Co., Ltd.), tributyl methacrylate (PERBUTYL PV, manufactured by Nippon Oil & Fats Co., Ltd.), peroxy-2-ethylhexanoic acid-1,1,3,3-tetra Methyl butyl ester (PEROCTA O, manufactured by Nippon Oil & Fats Co., Ltd.), 2,5-dimethyl-2,5-bis(2-ethylhexylperoxy)hexane (PERHEXA 250, manufactured by Nippon Oil & Fats Co., Ltd.), Peroxy-2-ethylhexanoate-1-cyclohexyl-1-methylethyl ester (PERCYCLO O, manufactured by Nippon Oil & Fats Co., Ltd.), third hexyl peroxy-2-ethylhexanoate (PERHEXYL O, manufactured by Nippon Oil & Fats Co., Ltd.), tert-butyl peroxy-2-ethylhexanoate (PERBUTYL O, manufactured by Nippon Oil & Fats Co., Ltd.), and tert-butyl peroxyisobutyrate (PERBUTYL IB, manufactured by Nippon Oil & Fats Co., Ltd.) ), isopropyl peroxy monocarboxylic acid trihexyl ester (PERHEXYL I, manufactured by Nippon Oil & Fats Co., Ltd.) and perbutyl maleic acid tert-butyl ester (PERBUTYL MA, manufactured by Nippon Oil Co., Ltd.), peroxy-2- Tripentyl ethyl hexanoate (Trigonox 121, manufactured by Nippon Chemical Co., Ltd.), 3,5,5-trimethylhexanoic acid, triamyl ester (Kayaester AN, manufactured by Nippon Chemical Co., Ltd.), etc. The organic peroxide or the like such as a peroxyester is not particularly limited thereto.

熱自由基產生劑,可單獨使用,亦可組合2種以上使用。The thermal radical generating agent may be used singly or in combination of two or more.

熱自由基產生劑之含量,相對於100質量份之上述通式(11)所示之氫化聚矽氧烷(a1)及依所需再含1個以上直接鍵結於矽原子之氫原子的上述氫化聚矽氧烷(a2)、與i)具有2個以上直接鍵結於上述矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)、或具有2個以上直接鍵結於上述矽原子的羥基之聚矽氧烷(b2)及ii)上述1分子中具有2個以上不飽和鍵的有機化合物(c)之加成反應生成物的本實施形態之有機聚矽氧烷,以0.5至10質量份為佳。The content of the thermal radical generator is more than 100 parts by mass of the hydrogenated polyoxyalkylene (a1) represented by the above formula (11) and, if necessary, one or more hydrogen atoms directly bonded to the halogen atom. The hydrogenated polyoxyalkylene oxide (a2) and i) have two or more vinyl group-containing organopolyoxanes (b1) directly bonded to the above-mentioned fluorene atom, or have two or more direct bonds to The organopolyoxane of the present embodiment of the addition reaction product of the organic compound (c) having two or more unsaturated bonds in the above one molecule, wherein the polyoxyalkylene (b2) of the hydroxyl group of the halogen atom and the ii) It is preferably from 0.5 to 10 parts by mass.

熱自由基產生劑之含量為0.5質量份以上時可使其具有優異之硬化性;在10質量份以下時可得到耐熱黃變性優良之硬化性樹脂組成物及硬化物。由此觀點而言,熱自由基產生劑之含量以1質量份以上8質量份以下較佳,2質量份以上5質量份以下更佳。When the content of the thermal radical generator is 0.5 parts by mass or more, the curable resin composition is excellent in curability; and when it is 10 parts by mass or less, a curable resin composition and a cured product excellent in heat yellow resistance are obtained. From this viewpoint, the content of the thermal radical generating agent is preferably 1 part by mass or more and 8 parts by mass or less, more preferably 2 parts by mass or more and 5 parts by mass or less.

(光自由基產生劑)(photoradical generator)

本實施形態之硬化性樹脂組成物,其實施形態之一,係含有上述有機聚矽氧烷及光自由基產生劑的所謂光硬化性樹脂組成物。One of the embodiments of the curable resin composition of the present embodiment is a so-called photocurable resin composition containing the above-mentioned organopolysiloxane and a photoradical generator.

其中上述光自由基產生劑,只要為可以光使(甲基)丙烯醯氧基進行自由基聚合之物種即可並無特別之限定。The photoradical generating agent is not particularly limited as long as it is a species capable of photopolymerizing a (meth)acryloxy group.

其具體之例,可舉如:在日本特公昭59-1281號公報、日本特公昭61-9621號公報及日本特開昭60-60104號公報等之中所記載之三嗪衍生物;在日本特開昭59-1504號公報及日本特開昭61-243807號公報等之中所記載之有機過氧化物;在日本特公昭43-23684號公報、日本特公昭44-6413號公報、日本特公昭44-6413號公報及日本特公昭47-1604號公報等及美國專利第3,567,453號說明書之中所記載之重氮化合物;在美國專利第2,848,328號說明書、美國專利第2,852,379號說明書及美國專利第2,940,853號之各說明書中所記載之有機疊氮化合物;在日本特公昭36-22062號公報、日本特公昭37-13109號公報、日本特公昭38-18015號公報及日本特公昭45-9610號公報等之中所記載之鄰醌二疊氮化合物類;在日本特公昭55-39162號公報及日本特開昭59-14023號公報等之各公報及在「Macromolecules,第10卷,第1307頁(1977年)」之中所記載之各種鎓類化合物(onium compounds);在日本特開昭59-142205號公報之中所記載之偶氮化合物;在日本特開平1-54440號公報、歐洲專利第109,851 號說明書、歐洲專利第126,712號說明書及「J.Imag.Sci.,第30卷,第174頁(1986年)」等之中所記載之金屬重烯錯合物;在日本特開平6-213861號公報及日本特開平6-255347號公報中所記載之(側氧基)鋶(sulfonium)有機硼錯合物;在日本特開昭61-151197號公報中所記載之二茂鈦類;在「Coordination Chemistry Review,第84卷,第85‧第277頁(1988年)」及日本特開平2-182701號公報中所記載之含釕等過渡金屬之過渡金屬錯合物;在日本特開平3-209477號公報中所記載之2,4,5-三芳基咪唑二聚物;四氯化碳及在日本特開昭59-107344號公報中所記載之有機鹵素化合物等。Specific examples thereof include a triazine derivative described in Japanese Patent Publication No. Sho 59-1281, Japanese Patent Publication No. Sho 61-9621, and Japanese Patent Laid-Open Publication No. Sho 60-60104, and the like. An organic peroxide described in, for example, Japanese Patent Publication No. Sho 43-243807, Japanese Patent Publication No. Sho 43-23684, Japanese Patent Publication No. Sho 44-6413, and Japanese The diazo compound described in the specification of U.S. Patent No. 3,567,453, and the specification of U.S. Patent No. 2,848,328, the specification of U.S. Patent No. 2,852,379, and the U.S. Patent No. Japanese Patent Publication No. Sho. The ortho-quinonediazide compounds described in the above, and each of the publications of Japanese Patent Publication No. Sho 55-39162 and JP-A-59-14023, and "Macromolecules, Vol. 10, p. 1307 ( 1977) It described the various onium compounds (onium compounds); azo compound in Japanese Unexamined Patent Publication No. 59-142205 described in the; Japanese Unexamined Patent Publication No. 1-54440, European Patent No. 109,851 No. specification, European Patent No. 126,712 and "J.Imag. Sci., Vol. 30, p. 174 (1986)", etc.; in Japanese Patent Laid-Open No. 6-213861 (a oxy) sulfonium organoboron compound described in Japanese Laid-Open Patent Publication No. Hei 6-255347; "Coordination Chemistry Review, Vol. 84, pp. 85‧ 277 (1988)" and a transition metal complex containing a transition metal such as ruthenium described in JP-A-2-182701; The 2,4,5-triarylimidazole dimer described in the publication No. 209 477, the carbon tetrachloride, and the organohalogen compound described in JP-A-59-107344.

此等物種可單獨使用,亦可組合2種以上使用。These species may be used alone or in combination of two or more.

光自由基產生劑之含量,相對於100質量份之上述通式(11)所示之氫化聚矽氧烷(a1)及依所需再含1個以上直接鍵結於上述矽原子之氫原子的氫化聚矽氧烷(a2)、與i)具有2個以上直接鍵結於上述矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)、或具有2個以上直接鍵結於上述矽原子的羥基之聚矽氧烷(b2)及ii)上述1分子中具有2個以上不飽和鍵的有機化合物(c)之加成反應生成物的本實施形態之有機聚矽氧烷,以0.5至20質量份為佳。The content of the photoradical generator is more than one part by weight of the hydrogenated polyoxoxane (a1) represented by the above formula (11) and one or more hydrogen atoms directly bonded to the above ruthenium atom. a hydrogenated polyoxyalkylene (a2), and i) a vinyl group-containing organopolyoxane (b1) having two or more vinyl groups bonded directly to the above-mentioned germanium atom, or having two or more direct bonds The organopolyoxane of the present embodiment of the addition reaction product of the organic compound (c) having two or more unsaturated bonds in the above one molecule, wherein the polyoxyalkylene (b2) of the hydroxyl group of the halogen atom and the ii) It is preferably from 0.5 to 20 parts by mass.

光自由基產生劑之含量為0.5質量份以上時可使其具有優異之硬化性;在20質量份以下時可得到耐光性優良之硬化性樹脂組成物及硬化物。由此觀點而言,光自由基產生劑之含量,以0.1質量份以上15質量份以下較佳,1質 量份以上10質量份以下更佳。When the content of the photoradical generator is 0.5 parts by mass or more, the curable resin composition is excellent in curability, and when it is 20 parts by mass or less, a curable resin composition and a cured product excellent in light resistance are obtained. From this point of view, the content of the photo radical generating agent is preferably 0.1 part by mass or more and 15 parts by mass or less. It is more preferably 10 parts by mass or less.

(其他成分)(other ingredients)

本實施形態之硬化性樹脂組成物中,依照其必要,在促進對熱及紫外線等之能量的硬化性(提高其感度)之目的方面,亦可添加(甲基)丙烯酸酯單體類及低聚物類及(甲基)丙烯酸乙烯酯等之自由基聚合性化合物等。In the curable resin composition of the present embodiment, it is also possible to add (meth) acrylate monomers and low in order to promote the curability (enhance the sensitivity) of energy such as heat and ultraviolet rays. A radical polymerizable compound such as a polymer or a vinyl (meth)acrylate.

其他,在不脫離本發明範圍之量、質之範圍內,亦可再配合抗老化劑、脫模劑、稀釋劑、抗氧化劑、熱安定劑、阻燃劑、塑化劑及界面活性劑等之添加劑。Others, anti-aging agents, mold release agents, diluents, antioxidants, thermal stabilizers, flame retardants, plasticizers, surfactants, etc. may be blended in the range of amounts and qualities without departing from the scope of the invention. Additives.

又,本實施形態之硬化性樹脂組成物中,亦可再含有玻璃、金屬、矽石等無機材料;合成樹脂等之有機材料。此外,在含有該無機材料及有機材料時,在構成該硬化性樹脂組成物的有機聚矽氧烷之製造步驟中,上述通式(11)所示之氫化聚矽氧烷(a1)及依所需之上述具有1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)、與i)上述具有2個以上直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)、或具有2個以上直接鍵結於上述矽原子的羥基之聚矽氧烷(b2)及ii)上述1分子中具有2個以上不飽和鍵的有機化合物(c)經加成反應而得的生成物中宜再調配矽烷偶合劑。Further, the curable resin composition of the present embodiment may further contain an inorganic material such as glass, metal or vermiculite or an organic material such as synthetic resin. Further, when the inorganic material and the organic material are contained, the hydrogenated polyoxyalkylene (a1) and the compound represented by the above formula (11) are produced in the step of producing the organopolysiloxane having the curable resin composition. The above-mentioned hydrogenated polyoxyalkylene (a2) having one or more hydrogen atoms directly bonded to a halogen atom, and i) a vinyl group-containing organic having two or more vinyl groups directly bonded to a halogen atom a polyoxyalkylene (b1) or a polyoxyalkylene (b2) having two or more hydroxyl groups directly bonded to the above-mentioned ruthenium atom, and ii) an organic compound having two or more unsaturated bonds in the above one molecule (c) The decane coupling agent should be further formulated in the product obtained by the addition reaction.

上述矽烷偶合劑,只要為在1分子中,具有可與玻璃、金屬、矽石等無機材料形成化學鍵之反應基及可再與合成樹脂等有機材料形成化學鍵之反應基或與有機材料互溶性佳之取代基的化合物即可,並無特別之限定。The decane coupling agent has a reactive group capable of forming a chemical bond with an inorganic material such as glass, metal or vermiculite in one molecule, and a reactive group capable of forming a chemical bond with an organic material such as a synthetic resin or a miscible with an organic material. The compound of the substituent is not particularly limited.

上述可與無機材料形成化學鍵之反應基,可舉如:甲氧基及乙氧基等。The above-mentioned reactive group capable of forming a chemical bond with an inorganic material may, for example, be a methoxy group or an ethoxy group.

上述可與有機材料形成化學鍵之反應基,可舉如:乙烯基、環氧基、胺基、甲基丙烯酸基、丙烯酸基、氫硫基、異氰酸酯基等。The above-mentioned reactive group capable of forming a chemical bond with an organic material may, for example, be a vinyl group, an epoxy group, an amine group, a methacryl group, an acryl group, a thiol group or an isocyanate group.

上述與有機材料互溶性佳之取代基,可舉如:異三聚氰酸酯基等。其具體例可舉如:乙烯基三甲氧矽烷(KBM-1003,日本信越化學公司製造)、乙烯基三乙氧矽烷(KBE-1003,日本信越化學公司製造)、2-(3,4-環氧環己基)乙基三甲氧矽烷(KBM-303,日本信越化學公司製造)、3-環氧丙氧丙基甲基二甲氧矽烷(KBM-402,日本信越化學公司製造)、3-環氧丙氧丙基三甲氧矽烷(KBM-403,日本信越化學公司製造)、3-環氧丙氧丙基甲基二乙氧矽烷(KBE-402,日本信越化學公司製造)、3-環氧丙氧丙基三乙氧矽烷(KBE-403,日本信越化學公司製造)、對苯乙烯三甲氧矽烷(KBM-1403,日本信越化學公司製造)、3-甲基丙烯醯氧丙基甲基二甲氧矽烷(KBM-502,日本信越化學公司製造)、3-甲基丙烯醯氧丙基三甲氧矽烷(KBM-503,日本信越化學公司製造)、3-甲基丙烯醯氧丙基甲基二乙氧矽烷(KBE-502,日本信越化學公司製造)、3-甲基丙烯醯氧丙基三乙氧矽烷(KBE-503,日本信越化學公司製造)、3-丙烯醯氧丙基三甲氧矽烷(KBM-5103,日本信越化學公司製造)、N-2-(胺乙基)-3-胺丙基甲基二甲氧矽烷(KBM-602,日本信越化學公司製造)、N-2-(胺乙基)-3- 胺丙基三甲氧矽烷(KBM-603,日本信越化學公司製造)、3-胺丙基三甲氧矽烷(KBM-903,日本信越化學公司製造)、3-胺丙基三乙氧矽烷(KBE-903,日本信越化學公司製造)、3-三乙氧矽基-3-N-(1,3-二甲基-亞丁基)丙胺(KBE-9103,日本信越化學公司製造)、N-苯基-3-胺丙基三甲氧矽烷(KBM-573,日本信越化學公司製造)、N-(乙烯基苯甲基)-2-胺乙基-3-胺丙基三甲氧矽烷之鹽酸鹽(KBM-575,日本信越化學公司製造)、3-脲丙基三乙氧矽烷(KBE-585,日本信越化學公司製造)、3-氫硫丙基甲基二甲氧矽烷(KBM-802,日本信越化學公司製造)、3-氫硫丙基三甲氧矽烷(KBM-803,日本信越化學公司製造)、四硫化雙(三乙氧矽丙基)(KBE-846,日本信越化學公司製造)、3-異氰酸酯丙基三乙氧矽烷(KBE-9007,日本信越化學公司製造)、異三聚氰酸三-(3-三甲氧矽基丙基)酯(X-12-965,日本信越化學公司製造)等,但並不限定於此。The substituent which is excellent in miscibility with the organic material may, for example, be an isomeric cyanate group. Specific examples thereof include vinyl trimethoxy decane (KBM-1003, manufactured by Shin-Etsu Chemical Co., Ltd.), vinyl triethoxy decane (KBE-1003, manufactured by Shin-Etsu Chemical Co., Ltd.), and 2-(3,4-ring). Oxycyclohexyl)ethyltrimethoxydecane (KBM-303, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropylmethyldimethoxydecane (KBM-402, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-ring Oxypropoxypropyltrimethoxydecane (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropylmethyldiethoxydecane (KBE-402, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-epoxy Propoxypropyl triethoxy decane (KBE-403, manufactured by Shin-Etsu Chemical Co., Ltd.), p-styrene trimethoxy decane (KBM-1403, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-methylpropenyl methoxypropylmethyl Methoxysilane (KBM-502, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-methacryloxypropyltrimethoxysilane (KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-methylpropenyl methoxypropylmethyl Diethoxy decane (KBE-502, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-methacryl oxime propyl triethoxy decane (KBE-503, Shin-Etsu Chemical Co., Ltd., Japan) Manufactured by the company, 3-propenyl methoxypropyltrimethoxy decane (KBM-5103, manufactured by Shin-Etsu Chemical Co., Ltd.), N-2-(aminoethyl)-3-aminopropylmethyldimethoxy decane (KBM- 602, manufactured by Shin-Etsu Chemical Co., Ltd., N-2-(Aminoethyl)-3- Aminopropyltrimethoxydecane (KBM-603, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-aminopropyltrimethoxydecane (KBM-903, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-aminopropyltriethoxydecane (KBE- 903, manufactured by Shin-Etsu Chemical Co., Ltd., 3-triethoxyindol-3-N-(1,3-dimethyl-butylene) propylamine (KBE-9103, manufactured by Shin-Etsu Chemical Co., Ltd.), N-phenyl 3-aminopropyltrimethoxy decane (KBM-573, manufactured by Shin-Etsu Chemical Co., Ltd.), N-(vinylbenzyl)-2-amineethyl-3-aminopropyltrimethoxy decane hydrochloride ( KBM-575, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-ureidopropyltriethoxysilane (KBE-585, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-hydrothiopropylmethyldimethoxydecane (KBM-802, Japan) (manufactured by Shin-Etsu Chemical Co., Ltd.), 3-hydrothiopropyltrimethoxy decane (KBM-803, manufactured by Shin-Etsu Chemical Co., Ltd.), bis(triethoxyphosphoryl) tetrasulfide (KBE-846, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-isocyanate propyl triethoxy decane (KBE-9007, manufactured by Shin-Etsu Chemical Co., Ltd.), tris-(3-trimethoxydecylpropyl) isocyanurate (X-12-965, Japan Shin-Etsu Chemical Co., Ltd. Manufacturing), etc., but not limited Here.

又,此等矽烷偶合劑,可各單獨使用,亦可組合2種以上使用。Further, these decane coupling agents may be used singly or in combination of two or more.

本實施形態之硬化性樹脂組成物中的矽烷偶合劑之含量,相對於100質量份之有機聚矽氧烷,以0.5至10質量份為佳。The content of the decane coupling agent in the curable resin composition of the present embodiment is preferably 0.5 to 10 parts by mass based on 100 parts by mass of the organopolysiloxane.

該矽烷偶合劑之含量,在0.5質量份以上時可使其密接性優異,在10質量份以下時可使其耐熱黃變性佳。由此觀點而言,矽烷偶合劑之含量,以0.7質量份以上8質量 份以下較佳,1質量份以上5質量份以下更佳。When the content of the decane coupling agent is 0.5 parts by mass or more, the adhesion can be excellent, and when it is 10 parts by mass or less, the heat yellow resistance can be improved. From this point of view, the content of the decane coupling agent is 0.7 parts by mass or more and 8 masses. The following is preferred, and more preferably 1 part by mass or more and 5 parts by mass or less.

本實施形態之硬化性樹脂組成物,在有機聚矽氧烷之加成反應之步驟中,在其中使用(d)矽氫化反應催化劑時,相對於100質量份之該有機聚矽氧烷,(d)矽氫化反應催化劑可含0.001質量份以下。In the step of the addition reaction of the organopolyoxane in the step of the addition reaction of the organopolyoxane, the (d) hydrazine hydrogenation catalyst is used in an amount of 100 parts by mass of the organopolyoxane. d) The rhodium hydrogenation catalyst may be contained in an amount of 0.001 part by mass or less.

該矽氫化反應催化劑(d),如上所述,可在有機聚矽氧烷之加成反應後以活性氧化鋁及活性碳等吸附劑去除。The rhodium hydrogenation catalyst (d) can be removed by an adsorbent such as activated alumina or activated carbon after the addition reaction of the organopolyoxane as described above.

該(d)矽氫化反應催化劑之含量,由耐熱黃變性、耐光性之觀點而言,以0.001質量份以下為佳,0.0008質量份以下更佳,0.0005質量份以下又更佳。The content of the (d) hydrazine hydrogenation catalyst is preferably 0.001 parts by mass or less, more preferably 0.0008 parts by mass or less, more preferably 0.0005 parts by mass or less, from the viewpoint of heat yellowing resistance and light resistance.

本實施形態之硬化性樹脂組成物,在本實施形態之有機聚矽氧烷中,以改善耐熱黃變性、耐光性、硬度、導電性、熱傳導性、觸變性(thixotropy)及低熱膨脹性等之目的,可依所需而含有以無機氧化物為代表之填充材。The curable resin composition of the present embodiment has improved heat yellowing resistance, light resistance, hardness, electrical conductivity, thermal conductivity, thixotropy, and low thermal expansion property in the organopolysiloxane of the present embodiment. The purpose is to contain a filler represented by an inorganic oxide as needed.

該填充材之例,可舉如:氧化矽(氣相氧化矽(fumed silica)、膠態氧化矽(colloidal silica)及沉降氧化矽(precipitated silica)等)、氮化矽、氮化硼、氧化鋁、氧化鋯、氧化鈦及鈦酸鋇等之無機氧化物或無機氮化物、玻璃、陶瓷、銀粉、金粉及銅粉等。Examples of the filler include cerium oxide (fumed silica, colloidal silica, and precipitated silica), tantalum nitride, boron nitride, and oxidation. Inorganic oxides or inorganic nitrides such as aluminum, zirconia, titanium oxide and barium titanate, glass, ceramics, silver powder, gold powder and copper powder.

填充材可以經過或未經過表面處理之狀態使用,經過表面處理時,可以提高硬化性樹脂組成物之流動性、增加填充率,在工業上較佳。The filler can be used with or without surface treatment, and when subjected to surface treatment, the fluidity of the curable resin composition can be increased, and the filling rate can be increased, which is industrially preferable.

經過表面處理之微粒無機填充材之例,可舉如經過:甲氧化、三甲矽化、辛矽化、或經矽油處理者。Examples of the surface-treated particulate inorganic filler may be, for example, those subjected to methoxylation, trimethylation, octopine or eucalyptus.

本實施形態之硬化性樹脂組成物中之無機氧化物之含量,相對於100質量份之有機聚矽氧烷,以0.1至500質量份為佳。The content of the inorganic oxide in the curable resin composition of the present embodiment is preferably 0.1 to 500 parts by mass based on 100 parts by mass of the organopolysiloxane.

〔硬化物〕[hardened matter]

本實施形態之硬化性樹脂組成物,在硬化前為液狀或固狀,可藉由施行預定之處理製作成其硬化物。The curable resin composition of the present embodiment is liquid or solid before curing, and can be formed into a cured product by a predetermined treatment.

例如使硬化性樹脂組成物中含有上述熱自由基產生劑時,可藉由施行加熱處理得到其硬化物。其中之硬化溫度一般為100至250℃。For example, when the above-mentioned thermal radical generating agent is contained in the curable resin composition, the cured product can be obtained by heat treatment. The hardening temperature therein is generally from 100 to 250 °C.

硬化性樹脂組成物之硬化方法、成形方法,並無特別之限定。在硬化性樹脂組成物為液狀時,可經由如:鑄模、低壓轉注成形、裝填(potting)、浸漬、加壓成形及射出成形使其成形。The curing method and molding method of the curable resin composition are not particularly limited. When the curable resin composition is in a liquid state, it can be molded by, for example, casting, low pressure transfer molding, potting, dipping, press molding, and injection molding.

硬化性樹脂組成物為固狀時,可使用如:擠壓機、低壓轉注成形機等在加壓下加熱硬化使其成形。When the curable resin composition is in a solid form, it can be molded by heating and hardening under pressure using, for example, an extruder or a low-pressure transfer molding machine.

本實施形態之硬化性樹脂組成物之硬化物,亦適於作為光半導體裝置之密封材使用。The cured product of the curable resin composition of the present embodiment is also suitable for use as a sealing material for an optical semiconductor device.

又,本實施形態之硬化性樹脂組成物,亦可作為晶片接合漿使用,其硬化物可作為晶片接合材使用。Further, the curable resin composition of the present embodiment can also be used as a wafer bonding paste, and the cured product can be used as a wafer bonding material.

同時,本實施形態之硬化性樹脂組成物之硬化物,亦適於使用在包覆晶片之周圍的塗覆材、鏡片材等之光半導體裝置用途方面。At the same time, the cured product of the curable resin composition of the present embodiment is also suitably used in the use of an optical semiconductor device such as a coating material or a lens material around the coated wafer.

該情形下,光半導體可舉如:LED燈、晶片式LED、半導體雷射、光耦合器及光二極體等。In this case, the optical semiconductor may be, for example, an LED lamp, a wafer type LED, a semiconductor laser, an optical coupler, and a photodiode.

以本實施形態之硬化性樹脂組成物的硬化物作為其光半導體的密封材使用之上述光半導體裝置,係具備下述構成:外殼材、設置於該外殼材內之矽晶片及以本實施形態之硬化性樹脂組成物的硬化物作為密封上述矽晶片的密封材。The optical semiconductor device using the cured product of the curable resin composition of the present embodiment as the sealing material for the optical semiconductor includes the following structure: an outer casing material, a tantalum wafer provided in the outer casing material, and the present embodiment. The cured product of the curable resin composition serves as a sealing material for sealing the above-mentioned tantalum wafer.

其中,上述外殼材之材料,並無特別之限定,可舉如:聚苯二甲醯胺等之芳族聚醯胺;66尼龍等之工程塑料;陶瓷等,在聚苯二甲醯胺時,特別可表現高密接性。The material of the outer casing material is not particularly limited, and examples thereof include aromatic polyamines such as polyphthalamide; engineering plastics such as 66 nylon; ceramics, and the like, in the case of polyphthalamide. In particular, it can exhibit high adhesion.

上述外殼材中再含玻璃纖維時可使其接著強度提高而更佳。上述玻璃纖維之含量,以外殼材之質量為基準,以5至40質量%為佳,10至30質量%更佳,特別以15至25質量%又更佳。玻璃纖維之含量在此數值範圍內時,可更顯著發揮密接性。When the glass material is further contained in the outer casing, the strength of the bonding can be improved and it is more preferable. The content of the above glass fiber is preferably from 5 to 40% by mass, more preferably from 10 to 30% by mass, particularly preferably from 15 to 25% by mass, based on the mass of the outer shell material. When the content of the glass fiber is within this numerical range, the adhesion can be more significantly exhibited.

如上所述,本實施形態之硬化性樹脂組成物,在硬化前為液狀或固狀,以預定之光自由基產生劑調配時,可以紫外線等能量線照射而製作其硬化物。As described above, the curable resin composition of the present embodiment is liquid or solid before being cured, and when it is prepared by a predetermined photoradical generator, it can be irradiated with an energy beam such as ultraviolet rays to produce a cured product.

其中在調配光自由基產生劑時,硬化性樹脂組成物,亦適合於在要求不加熱下快速硬化的樹脂膜、基板等作為其塗覆材使用。When the photo-radical generator is formulated, the curable resin composition is also suitable for use as a coating material for a resin film, a substrate, or the like which is required to be rapidly cured without heating.

其例如可在平板顯示器(FPD)等之中使用之抗反射膜形成用塗覆材。For example, it is a coating material for forming an antireflection film which can be used in a flat panel display (FPD) or the like.

又,特別在作為上述抗反射膜形成用塗覆材使用時,為形成折射率1.4以下之硬化膜,硬化性樹脂組成物以含形成空隙之多孔質微粒為佳。In particular, when used as the coating material for forming an antireflection film, it is preferable to form a cured film having a refractive index of 1.4 or less, and the curable resin composition preferably contains porous fine particles which form voids.

上述多孔質微粒可舉如平均粒徑5nm至1μm之氧化矽粒子,由硬化膜之透明性之觀點而言,以具有5至100nm平均粒徑之氧化矽粒子較佳。具體之例係如販售品之具親水性或表面經過疏水化處理之氣相氧化矽之「Aerosil」(商品名,日本Aerosil公司製造)及氧化矽粒子以直鏈連結之珍珠鏈狀矽溶膠之「SNOWTEX PS」(商品名,日本日產化學公司製造)等。此類多孔質微粒,相對於100質量份之硬化性樹脂組成物,以多孔質微粒合計在10至70質量份之範圍添加使用為佳,且以使用均質機等使硬化性樹脂組成物內均一地分散為佳。The porous fine particles may be cerium oxide particles having an average particle diameter of 5 nm to 1 μm, and from the viewpoint of transparency of the cured film, cerium oxide particles having an average particle diameter of 5 to 100 nm are preferable. Specific examples are "Aerosil" (trade name, manufactured by Nippon Aerosil Co., Ltd.) which is hydrophilic or has a surface-hydrophobized gas phase oxidized ruthenium, and a pearl chain sputum sol which is linearly linked by cerium oxide particles. "SNOWTEX PS" (trade name, manufactured by Nissan Chemical Co., Ltd.). The porous fine particles are preferably used in an amount of from 10 to 70 parts by mass based on 100 parts by mass of the total of the porous fine particles, and are uniform in the curable resin composition by using a homogenizer or the like. Dispersion is better.

本實施形態之硬化性樹脂組成物在作為塗覆材使用時,硬化膜之形成方法,可舉如在透明基材(如聚甲基丙烯酸甲酯、聚碳酸酯、聚苯乙烯及三乙醯纖維素之樹脂基材或玻璃等之無機材料)之表面上以含本實施形態之硬化性樹脂組成物的塗覆材塗布,該塗膜再經過光硬化,形成可作為抗反射膜及保護膜等之厚度為10nm至1μm的硬化膜的方法。When the curable resin composition of the present embodiment is used as a coating material, the method for forming the cured film may be, for example, a transparent substrate (for example, polymethyl methacrylate, polycarbonate, polystyrene, and triacetone). The surface of the cellulose resin substrate or the inorganic material such as glass is coated with a coating material containing the curable resin composition of the present embodiment, and the coating film is further photocured to form an antireflection film and a protective film. A method of hardening a film having a thickness of 10 nm to 1 μm.

在基材上塗布時,由於有以高精細度形成較薄之膜的必要,此時可使用:微凹版塗布法、輥塗法、淋塗法、旋塗法、剛模塗布法、延流塗法及噴塗法等。When coating on a substrate, it is necessary to form a thin film with high fineness. At this time, a micro gravure coating method, a roll coating method, a shower coating method, a spin coating method, a rigid mold coating method, and a flow extension can be used. Coating method and spraying method.

硬化性樹脂組成物,可依所需使用調整黏度用之溶劑等進行稀釋,亦可以形成含多孔質微粒等之溶膠之形態。在使用溶劑等進行稀釋時、及以含多孔質微粒等之溶膠形態使用時,為預先使溶劑成分揮散,可在硬化前以50至 150℃進行約數分鐘之加熱。The curable resin composition may be diluted with a solvent or the like for adjusting the viscosity as needed, or may be in the form of a sol containing porous fine particles or the like. When it is used for dilution with a solvent or the like, and when it is used in the form of a sol containing porous fine particles or the like, the solvent component is volatilized in advance, and may be 50 to 50 before curing. Heating at about 150 ° C for about several minutes.

本實施形態之硬化性樹脂組成物中再添加著色劑,即可成為硬化性印墨。In the curable resin composition of the present embodiment, a coloring agent is further added to form a curable ink.

上述之著色劑,可使用各種有機顏料、無機顏料。其例如:氧化鈦、鋅白、鉛白、鋅鋇白及氧化銻等之白色顏料;苯胺黑、鐵黑及碳黑等之黑色顏料;鉻黃、黃氧化鐵、漢薩黃(100、50、30等)、鈦黃、石油醚黃及永固黃等之黃色顏料;鉻朱紅(Chrome Vermilion)、永固橙、硫化永固橙(Vulcan Fast Orange)等之橙色顏料;氧化鐵、永固棕及對位棕等之褐色顏料;紅氧化鐵、鎘紅、銻辰砂、永固紅、玫塊紅色澱、茜素色澱、硫靛紅、PV胭脂紅、Monolight永固紅及喹吖酮系紅色顏料等之紅色顏料;鈷紫、錳紫、永固紫、甲基紫色澱、陰丹士林亮紫、二嗪紫等之紫色顏料;群青、普魯士藍、鈷藍、鹼性藍色澱、無金屬酞花青藍、銅酞青藍、陰丹士林藍、靛藍等之藍色顏料;鉻綠、氧化鉻、翡翠綠、萘酚綠、金黃綠、酸性綠色澱、孔雀綠色澱、酞花青綠及多氯溴銅酞青素等之綠色顏料;其他各種螢光顏料、金屬粉顏料及體質顏料等。此等著色劑之量,相對於硬化性樹脂組成物之全量,以1至50質量%為佳,5至25質量%更佳。As the above coloring agent, various organic pigments and inorganic pigments can be used. For example: white pigments such as titanium oxide, zinc white, lead white, zinc antimony and antimony oxide; black pigments such as aniline black, iron black and carbon black; chrome yellow, yellow iron oxide, Hansa yellow (100, 50) , 30, etc., yellow pigments such as titanium yellow, petroleum ether yellow and permanent yellow; orange pigments such as Chrome Vermilion, permanent orange, Vulcan Fast Orange; iron oxide, permanent brown and Brown pigment such as brown; red iron oxide, cadmium red, strontium sand, permanent red, rose red lake, alizarin lake, thiored red, PV carmine red, Monolight permanent red and quinophthalone red Red pigments such as pigments; purple pigments such as cobalt violet, manganese violet, permanent violet, methyl violet lake, indanthrene brilliant violet, diazilium violet; ultramarine blue, Prussian blue, cobalt blue, alkaline blue lake, Blue pigments without metal phthalocyanine blue, copper sapphire blue, indanthrene blue, indigo, etc.; chrome green, chrome oxide, emerald green, naphthol green, golden green, acid green lake, peacock green lake, 酞Green pigments such as cyanine green and copper chlorobromide; other various fluorescent pigments, metallic pigments and physique Pigments, etc. The amount of these coloring agents is preferably from 1 to 50% by mass, more preferably from 5 to 25% by mass, based on the total amount of the curable resin composition.

硬化性印墨中,著色劑亦可再依所需使用顏料分散劑。In the curable ink, the colorant can also be used as needed.

該顏料分散劑之例,可舉如:高級脂肪酸鹽、烷基硫酸鹽、烷基酯硫酸鹽、烷基磺酸鹽、磺琥珀酸鹽、萘磺酸 鹽、烷基磷酸鹽、聚氧烯烷基醚磷酸鹽、聚氧烯烷基苯醚、丙三醇酯、山梨醇酐酯及聚氧乙烯脂肪醯胺等之活化劑;由苯乙烯、苯乙烯衍生物、乙烯萘衍生物、丙烯酸、丙烯酸衍生物、順丁烯二酸、順丁烯二酸衍生物、衣康酸、衣康酸衍生物、反丁烯二酸及反丁烯二酸衍生物之中選擇之2種以上之單體所構成之嵌段共聚物或無規共聚物及此等物種之鹽等。Examples of the pigment dispersant include higher fatty acid salts, alkyl sulfates, alkyl ester sulfates, alkyl sulfonates, sulfosuccinates, and naphthalenesulfonic acids. Activator of salt, alkyl phosphate, polyoxyalkylene ether phosphate, polyoxyalkylene alkyl phenyl ether, glycerol ester, sorbitan ester and polyoxyethylene fatty decylamine; from styrene, benzene Ethylene derivative, vinyl naphthalene derivative, acrylic acid, acrylic acid derivative, maleic acid, maleic acid derivative, itaconic acid, itaconic acid derivative, fumaric acid and fumaric acid A block copolymer or a random copolymer composed of two or more kinds of monomers selected from the group consisting of salts of such species, and the like.

硬化性印墨中之著色劑之分散方法,可舉如使用:球磨機、砂磨機、磨碎機、輥磨機、攪拌機、亨歇爾混合機、膠磨機、超音波均質機、珠磨機、濕式噴射粉碎機及塗料振盪機等各種分散機的方法。The method for dispersing the coloring agent in the curable ink can be used as follows: ball mill, sand mill, grinder, roll mill, mixer, Henschel mixer, rubber mill, ultrasonic homogenizer, bead mill A method of various dispersers such as a machine, a wet jet mill, and a paint shaker.

又,以去除硬化性印墨中之顏料分散體的粗粒份之目的,可使用離心機或過濾器施行預定之處理。Further, for the purpose of removing coarse particles of the pigment dispersion in the curable ink, a predetermined treatment can be carried out using a centrifuge or a filter.

上述著色劑在使用顏料印墨時,顏料印墨中之顏料粒子的平均粒徑,考慮其在硬化性印墨中之安定性、畫像濃度、光澤感、耐光性等而選擇,在增加光澤、改善質感之觀點上,以適當選擇顏料粒子的平均粒徑為佳。When the pigment ink is used as the coloring agent, the average particle diameter of the pigment particles in the pigment ink is selected in consideration of stability in the curable ink, image density, glossiness, light resistance, etc., and the gloss is increased. From the viewpoint of improving the texture, it is preferred to appropriately select the average particle diameter of the pigment particles.

本實施形態之硬化性樹脂組成物,可發揮其耐熱黃變性及高透明性,而適於使用在眼鏡鏡片、光學機器用鏡片、CD及DVD之讀取鏡片、汽車頭燈用鏡片及投影機用鏡片等之鏡片的材料,光纖、光波導、濾光器、光學用接著劑、光碟基板、顯示器基板、奈米模印用硬化性樹脂等的各種光學構件材料中。The curable resin composition of the present embodiment exhibits heat-resistant yellowing and high transparency, and is suitable for use in spectacle lenses, optical device lenses, CD and DVD reading lenses, automotive headlight lenses, and projectors. The material of the lens such as a lens is used in various optical member materials such as an optical fiber, an optical waveguide, a filter, an optical adhesive, a disk substrate, a display substrate, and a curable resin for nanoimprint.

本實施形態之硬化性樹脂組成物,可作為光半導體用 密封材使用,其硬化物,適於作為半導體封裝體用之透明樹脂,而上述光半導體用密封材經由成形可得到半導體封裝體。The curable resin composition of the present embodiment can be used as an optical semiconductor The sealing material is used, and the cured product is suitable as a transparent resin for a semiconductor package, and the above-mentioned optical semiconductor sealing material can be obtained by molding.

上述光半導體用密封材,係在電漿處理後再經過底膜處理之被處理物上,直接以分注機及旋轉分注機等塗布裝置塗布成形。The sealing material for an optical semiconductor is applied to a workpiece subjected to a base film treatment after plasma treatment, and is directly applied by a coating device such as a dispenser or a rotary dispenser.

該塗布之光半導體密封材,可使其硬化、或以成型機等使其硬化。The coated optical semiconductor sealing material can be cured or cured by a molding machine or the like.

[實施例][Examples]

以下再具體地舉實施例、比較例說明本發明,惟本發明並不限定於以下之實施例。Hereinafter, the present invention will be specifically described by way of examples and comparative examples, but the present invention is not limited to the following examples.

在實施例、比較例中係依以下方法進行測定及評定。In the examples and comparative examples, the measurement and evaluation were carried out in the following manner.

<(1)SiH之反應率之計算><(1) Calculation of reaction rate of SiH>

將0.05g之抽樣反應溶液(即在後述實施例、比較例中之有機聚矽氧烷合成中的反應溶液,由反應開始經過72小時後之溶液)溶解於1g之氘代氯仿溶劑中作為測定試料。0.05 g of the sample reaction solution (that is, the reaction solution in the synthesis of the organopolyoxane in the examples and the comparative examples described later, the solution after 72 hours from the start of the reaction) was dissolved in 1 g of the deuterated chloroform solvent as a measurement. Sample.

之後以該測定試料,在400MHz(日本分光公司製造,α-400)下,以累積次數100次進行1 H NMR測定,再解析測定之結果。Then, the measurement sample was subjected to 1 H NMR measurement at a cumulative frequency of 100 times at 400 MHz (manufactured by JASCO Corporation, α-400), and the measurement results were analyzed.

其SiH之反應率,係求出反應前及反應後之緣自Si-CH3 之0.2ppm之峰與緣自SiH之4.6ppm之峰的面積比,再依照下述式計算。The reaction rate of SiH was determined by calculating the area ratio of the peak of 0.2 ppm from Si-CH 3 and the peak of 4.6 ppm from SiH before and after the reaction, and then calculated according to the following formula.

之後評定SiH之反應率在98%以上時為◎,90%以上且 低於98%時為○,低於90%時為×。After that, when the reaction rate of SiH is 98% or more, it is ◎, 90% or more. When it is less than 98%, it is ○, and when it is less than 90%, it is ×.

SiH之反應率(%)=〔(X1-Y1)/X1〕×100Reaction rate of SiH (%) = [(X1-Y1) / X1] × 100

X1:反應前之峰面積比X1: peak area ratio before reaction

(反應前之SiH之峰面積)/(反應前之Si-CH3 之峰面積)(peak area of SiH before reaction) / (peak area of Si-CH 3 before reaction)

Y1:反應後之峰面積比Y1: peak area ratio after reaction

(反應後之SiH之峰面積)/(反應後之Si-CH3 之峰面積)(peak area of SiH after reaction) / (peak area of Si-CH 3 after reaction)

<(2)分子構造之鑑定><(2) Identification of molecular structure>

相對於20mg之後述實施例、比較例中所製作的有機聚矽氧烷(A1)至(A17)的試樣,以1g之比例溶解於氘代氯仿溶劑中之溶液作為測定試料。再以該測定試料,以日本分光公司製造之α-400以累積次數200次進行1 H NMR測定,再解析測定之結果。With respect to 20 mg of the samples of the organopolyoxanes (A1) to (A17) prepared in the examples and the comparative examples described later, a solution dissolved in a deuterated chloroform solvent at a ratio of 1 g was used as a measurement sample. Further, the measurement sample was subjected to 1 H NMR measurement at a cumulative number of times of α-400 manufactured by JASCO Corporation, and the results of the measurement were analyzed.

另以相對於0.3g之試樣,以1g之比例溶解於氘代氯仿溶劑中之溶液作為測定試料。以該測定試料,以日本分光公司製造之α-400以累積次數20000次進行13 C NMR測定,再解析測定之結果。Further, a solution which was dissolved in a deuterated chloroform solvent in a ratio of 1 g with respect to a sample of 0.3 g was used as a measurement sample. The measurement sample was subjected to 13 C NMR measurement at a cumulative number of 20,000 times by α-400 manufactured by JASCO Corporation, and the results of the measurement were analyzed.

另再以相對於0.15g之試樣,以1g之比例溶解於氘代氯仿溶劑中,並添加相對於矽氧烷之8質量%的Cr(acac)3 之溶液作為測定試料。再以該測定試料,以日本分光公司製造之α-400以累積次數4000次進行29 Si NMR測定,再解析測定之結果。Further, it was dissolved in a deuterated chloroform solvent in a ratio of 1 g with respect to 0.15 g of the sample, and a solution of 8 g% of Cr(acac) 3 with respect to the decane was added as a measurement sample. Further, the measurement sample was subjected to 29 Si NMR measurement at a cumulative number of times of α-400 manufactured by JASCO Corporation, and the results of the measurement were analyzed.

之後解析以該1 H NMR、13 C NMR、29 Si NMR所得到之結 果,鑑定有機聚矽氧烷(A1)至(A17)之分子構造。Then, the results obtained by the 1 H NMR, 13 C NMR, and 29 Si NMR were analyzed to determine the molecular structures of the organopolyoxanes (A1) to (A17).

<(3)(甲基)丙烯醯氧基之官能基當量之計算><(3) Calculation of functional group equivalents of (meth)acryloxyloxy group>

相對於30mg之後述實施例、比較例中所製作的有機聚矽氧烷(A1)至(A17)之試樣,以1g之比例溶解於氘代氯仿溶劑中的溶液作為測定試料。之後以該測定試料,以日本分光公司製造之α-400以累積次數200次進行1 H NMR測定,再解析所得之結果求出有機聚矽氧烷1分子中之平均組成。A solution of the organopolyoxane (A1) to (A17) produced in the examples and the comparative examples described later in a ratio of 1 g was dissolved in a solvent of deuterated chloroform as a measurement sample. Then, the measurement sample was subjected to 1 H NMR measurement at a cumulative number of times of α-400 manufactured by JASCO Corporation, and the average composition in the molecule of the organopolysiloxane was determined by the analysis.

再以相對於0.15g之試樣,以1g之比例溶解於氘代氯仿溶劑中,並添加相對於矽氧烷之8質量%的Cr(acac)3 之溶液作為測定試料。之後以該測定試料,以日本分光公司製造之α-400以累積次數4000次進行29 Si NMR測定,再解析測定之結果求出有機聚矽氧烷1分子中之平均組成。Further, it was dissolved in a deuterated chloroform solvent at a ratio of 1 g with respect to 0.15 g of the sample, and a solution of 8 g% of Cr(acac) 3 with respect to the decane was added as a measurement sample. Then, the measurement sample was subjected to 29 Si NMR measurement at a cumulative number of 4,000 times by α-400 manufactured by JASCO Corporation, and the average composition in the molecule of the organopolysiloxane was determined by the analysis and measurement.

之後解析由1 H NMR及29 Si NMR所得到之結果,計算(甲基)丙烯醯氧基之官能基當量(每1莫耳官能基之質量)。Thereafter, the results obtained by 1 H NMR and 29 Si NMR were analyzed, and the functional group equivalent (mass per 1 mol of the functional group) of the (meth)acryloxy group was calculated.

<(4)重量平均分子量之計算><(4) Calculation of weight average molecular weight>

相對於100mg之後述實施例、比較例中所製作的有機聚矽氧烷(A1)至(A17)的測定用試樣,以2g之比例溶解於氯仿溶劑中,並以0.45μm之濾膜過濾作為測定試料溶液。The sample for measurement of the organopolyoxane (A1) to (A17) produced in the examples and the comparative examples described later was dissolved in a chloroform solvent at a ratio of 2 g, and filtered through a filter of 0.45 μm. As a sample solution.

再於管柱溫度40℃、溶出液(氯仿)之流量1mL/分鐘之條件下,通過管柱〔管柱之構成,保護管柱係使用日本東曹公司製造之Tskguard column H小時-H(註冊商 標),以日本東曹公司製造之Tskgel(註冊商標)G5000H小時及日本東曹公司製造之Tskgel(註冊商標)G3000H小時、日本東曹公司製造之Tskgel(註冊商標)G1000H小時之各1支串連配置〕。另外,再預先作成以Polymer Laboratories公司製造之分子量7,500,000、2,560,000、841,700、320,000、148,000、59,500、28,500、10,850、2,930、580之已知分子量的單分散聚苯乙烯標準品及苯乙烯單體(分子量104)以RI檢測求出沖提時間之校準曲線。Then, under the conditions of a column temperature of 40 ° C and a flow rate of the eluent (chloroform) of 1 mL/min, the column was constructed. The column was protected, and the Tskguard column H hour-H manufactured by Tosoh Corporation of Japan was used. Business Standard), Tskgel (registered trademark) G5000H hour manufactured by Tosoh Corporation of Japan and Tskgel (registered trademark) G3000H hour manufactured by Tosoh Corporation of Japan, Tskgel (registered trademark) G1000H hour manufactured by Tosoh Corporation of Japan Even configuration]. In addition, monodisperse polystyrene standards of known molecular weights of molecular weights of 7,500,000, 2,560,000, 841,700, 320,000, 148,000, 59,500, 28,500, 10,850, 2,930, 580 and styrene monomers (molecular weight) manufactured by Polymer Laboratories, Inc., were previously prepared. 104) A calibration curve for the extraction time is determined by RI detection.

之後以測定試料溶液之溶出時間及檢測強度,由上述校準曲線算出其分子量。Thereafter, the molecular weight was calculated from the above calibration curve by measuring the elution time and the detection intensity of the sample solution.

<(5)黏度之測定><(5) Determination of viscosity>

係對後述實施例、比較例中所製作的有機聚矽氧烷(A1)至(A17)之測定用試樣,以日本東機產業公司製造之TVE-22H,測定在溫度25℃下之黏度。For the measurement samples of the organopolyoxane (A1) to (A17) produced in the examples and the comparative examples described later, the viscosity at a temperature of 25 ° C was measured using TVE-22H manufactured by Nippon Seiki Co., Ltd. .

<(6)通式(10)所示之化合物含量〔WB〕相對於通式(9)所示之化合物含量〔WA〕之比(〔WB〕/〔WA〕)之計算><(6) Calculation of the ratio of the compound content [WB] represented by the formula (10) to the compound content [WA] represented by the formula (9) ([WB]/[WA]) >

〔WA〕及〔WB〕之值,係以有機聚矽氧烷以基質輔助游離化飛行時間型質譜分析法(以下以MALDI-TOF/MS表示)測定所得之符合通式(9)及通式(10)的各構造之質量、與鈉質量23所合計的質量所對應之峰的強度表示。The values of [WA] and [WB] are determined by the matrix-assisted free time-of-flight mass spectrometry (hereinafter referred to as MALDI-TOF/MS) using organopolysiloxane to satisfy the general formula (9) and the general formula. The mass of each structure of (10) and the intensity of the peak corresponding to the mass of the sodium mass 23 are shown.

其中,符合該通式(9)及通式(10)之各構造的質量,在上述構造之構成元素在具有同位素時,係指以在各元素的同位素之質量內,其存在率為最大的同位素之質量所計算之值。In addition, the mass of each structure conforming to the general formula (9) and the general formula (10), when the constituent elements of the above structure have an isotope, means that the existence ratio is the highest within the mass of the isotope of each element. The value calculated for the mass of the isotope.

同時,符合通式(9)及通式(10)之峰存在複數個時,具有通式(9)之構造的化合物之含量〔WA〕及通式(10)所示的化合物之含量〔WB〕,各係符合其構造之峰強度之合計值。Meanwhile, when a plurality of peaks conforming to the general formula (9) and the general formula (10) are present, the content of the compound having the structure of the general formula (9) [WA] and the content of the compound represented by the general formula (10) [WB 〕, each line meets the total value of the peak intensity of its structure.

但,在相對於符合通式(9)及通式(10)之各構造的質量及鈉質量23的合計質量所對應的峰之最大強度,其具有強度3%以下之峰強度,在計算其峰強度之合計值時係將其排除。However, the maximum intensity of the peak corresponding to the mass of the respective structures conforming to the general formula (9) and the general formula (10) and the total mass of the sodium mass 23 has a peak intensity of 3% or less, and the peak is calculated. The total value of the strength is excluded.

MALDI-TOF/MS之測定方法係以以下之方法進行。The measurement method of MALDI-TOF/MS was carried out in the following manner.

<MALDI-TOF/MS之測定方法><Method for measuring MALDI-TOF/MS>

室溫下以將0.1g之如後述之實施例、比較例中所製作的有機聚矽氧烷(A5)、(A6)、(A11)、(A12)溶解於100mL之四氫呋喃之溶液、與以10mg之蒽三酚(Dithranol)溶解於1mL之四氫呋喃中之溶液,在室溫下以體積比1:1之比例均一混合製作成溶液a。其次,在其中裝入1μL以10mg的碘化鈉溶解於1mL之丙酮中的溶液之試驗盤中再滴入1μL之溶液a,之後於室溫下使溶劑蒸發後,以下述之測定條件進行MALDI-TOF/MS之測定。A solution of 0.1 g of the organopolyoxane (A5), (A6), (A11), and (A12) prepared in the examples and the comparative examples described later in 100 mL of tetrahydrofuran at room temperature was used. A solution of 10 mg of stilbene (Dithranol) dissolved in 1 mL of tetrahydrofuran was uniformly mixed at room temperature in a ratio of 1:1 to prepare a solution a. Next, 1 μL of the solution a was added dropwise to a test disk containing 1 μL of a solution in which 10 mg of sodium iodide was dissolved in 1 mL of acetone, and then the solvent was evaporated at room temperature, and then MALDI was carried out under the following measurement conditions. - Determination of TOF/MS.

(測定條件)(measurement conditions)

裝置:日本島津公司AXIMA CFR plusDevice: AXIMA CFR plus, Shimadzu Corporation, Japan

雷射光:氮氣雷射光(337nm)Laser light: nitrogen laser light (337nm)

檢測器形式:線性式Detector form: linear

離子檢測:正離子(正離子型)Ion detection: positive ion (positive ion type)

累積次數:500次Cumulative number: 500 times

<(7)耐熱黃變性><(7) Heat-resistant yellowing>

以後述實施例、比較例中所製作之硬化物為測定用試樣,使用厚度為3mm之硬化物,再以日本Konica-Minolta公司製造之分光光度計CM-3600d(商品名)測定其Y1(黃度)。The cured product prepared in the examples and the comparative examples described later was a sample for measurement, and a cured product having a thickness of 3 mm was used, and the Y1 was measured by a spectrophotometer CM-3600d (trade name) manufactured by Konica-Minolta Co., Ltd., Japan. Yellow degree).

其次,再將該硬化物以鋁箔包覆,於空氣中在150℃下進行加熱處理150小時,之後再以日本Konica-Minolta公司製造之分光光度計CM-3600d(商品名)測定其Y1(黃度)。Next, the cured product was coated with aluminum foil, and heat-treated at 150 ° C for 150 hours in the air, and then measured by a spectrophotometer CM-3600d (trade name) manufactured by Konica-Minolta Co., Ltd., Japan. degree).

其中以加熱處理前後之Y1的變化為△Y1,評定△Y1低於1.0為◎,1.0以上且低於3.0為○,3.0以上為×。The change in Y1 before and after the heat treatment was ΔY1, and it was evaluated that ΔY1 was less than 1.0, ◎, 1.0 or more and less than 3.0 were ○, and 3.0 or more was ×.

<(8)耐光性><(8) Light resistance>

其中以後述實施例、比較例中所製作之硬化物為測定用試樣,使用厚度為3mm之硬化物,再以日本Konica-Minolta公司製造之分光光度計CM-3600d(商品名)測定其Y1(黃度)。The cured product prepared in the examples and the comparative examples described later is a sample for measurement, and a cured product having a thickness of 3 mm is used, and the Y1 is measured by a spectrophotometer CM-3600d (trade name) manufactured by Konica-Minolta Co., Ltd., Japan. (yellowness).

其次,將該硬化物放置於設定為50℃之恒定的恒溫乾燥機中,再以裝設365nm帶通濾波器的UV照射裝置(日本Ushio電機公司製造,商品名:SP-7),在365nm下以照度4W/cm2 照射100小時。Next, the cured product was placed in a constant temperature dryer set to 50 ° C, and then a UV irradiation apparatus (manufactured by Ushio Electric Co., Ltd., trade name: SP-7) equipped with a 365 nm band pass filter at 365 nm. The irradiation was performed at an illuminance of 4 W/cm 2 for 100 hours.

之後,再次以日本Konica-Minolta公司製造之分光光度計CM-3600d(商品名)測定其Y1(黃度)。以UV照射前後之Y1的變化為△Y1,評定△Y1低於1.0為◎,1.0以上且低於3.0為○,3.0以上為×。Thereafter, the Y1 (yellowness) was measured again by a spectrophotometer CM-3600d (trade name) manufactured by Konica-Minolta Co., Ltd., Japan. The change in Y1 before and after UV irradiation was ΔY1, and it was evaluated that ΔY1 was less than 1.0, ◎, 1.0 or more and less than 3.0 were ○, and 3.0 or more was ×.

<(9)耐冷熱衝擊性><(9) Resistance to thermal shock resistance>

在20mm×20mm×2mm之平板中央設置有10mm之深度1mm的凹槽之聚苯二甲醯胺樹脂(Solvay公司製造AModel 4122)之成形體的外殼材內配置5mm×5mm×0.2mm之矽晶片。10mm in the center of the 20mm × 20mm × 2mm flat plate A 5 mm × 5 mm × 0.2 mm tantalum wafer was placed in the outer shell of the molded body of the polyphenylene amide resin (AModel 4122 manufactured by Solvay Co., Ltd.) having a groove of 1 mm in depth.

其次,將實施例1至17、比較例1至6中製作之硬化性樹脂組成物注模,之後經過加熱或光硬化,形成密封矽晶片之硬化物(密封材),即可得到光半導體裝置之試驗片。Next, the curable resin compositions produced in Examples 1 to 17 and Comparative Examples 1 to 6 were injection-molded, and then heated or photo-cured to form a cured product (sealing material) for sealing the wafer, thereby obtaining an optical semiconductor device. Test piece.

該得到之試驗片再以日本Espec公司製造之小型冷熱衝擊裝置TSE-11以室溫至-40℃(15分鐘)至120℃(15分鐘)至室溫為1循環,以目視觀察至發生剝離為止之次數。The obtained test piece was further circulated at room temperature to -40 ° C (15 minutes) to 120 ° C (15 minutes) to room temperature for 1 cycle at a small thermal shock device TSE-11 manufactured by Espec Corporation of Japan. The number of times so far.

以100次以上循環仍不發生剝離者為◎,50次以上且低於100次時發生剝離者為○,低於50次時發生剝離者為×。The peeling does not occur in 100 cycles or more, and the peeling occurs when the peeling is 50 or more and less than 100 times, and the peeling occurs when it is less than 50 times.

<(10)硬度><(10) hardness>

後述實施例、比較例中所製作之硬化物為測定用試樣,使用長35mm×寬8mm×厚2mm之硬化物,再以日本Anton Parr公司製造之MCR-301測定-120℃至150℃(昇溫速度2℃/分鐘)下之動態黏彈性。The cured product prepared in the examples and the comparative examples described later was a sample for measurement, and a cured product having a length of 35 mm, a width of 8 mm, and a thickness of 2 mm was used, and then it was measured at -120 ° C to 150 ° C by MCR-301 manufactured by Anton Parr Co., Ltd., Japan ( Dynamic viscoelasticity at a heating rate of 2 ° C / min).

硬度以30℃下G′(儲存模數)之數值,評定以107 以上時為◎,106 以上且低於107 時為○,低於106 時為×。The hardness was evaluated as a value of G' (storage modulus) at 30 ° C, and was ◎ when it was 10 7 or more, ○ when it was 10 6 or more and less than 10 7 , and × when it was less than 10 6 .

<(11)密接性><(11) Adhesion>

在20mm×20mm×2mm之平板中央設置有10mm、深度 1mm的凹槽之聚苯二甲醯胺樹脂(Solvay公司製造AModel 4122)的模型內,以實施例1至17、比較例1至6所製作之硬化性樹脂組成物注模,之後經過加熱或光硬化即可得到試驗片。10mm in the center of the 20mm × 20mm × 2mm flat plate In the model of a polyphthalamide resin (AModel 4122 manufactured by Solvay Co., Ltd.) having a groove of 1 mm in depth, the curable resin composition prepared in Examples 1 to 17 and Comparative Examples 1 to 6 was injection molded, and then passed through. A test piece can be obtained by heating or photohardening.

該得到之試驗片再以日本Espec公司製造之小型冷熱衝擊裝置TSE-11以室溫至-40℃(15分鐘)至120℃(15分鐘)至室溫為1循環,以目視觀察至剝離發生為止之次數。The obtained test piece was further circulated at room temperature to -40 ° C (15 minutes) to 120 ° C (15 minutes) to room temperature for 1 cycle at a small thermal shock device TSE-11 manufactured by Japan Espec Co., Ltd., to visually observe that peeling occurred. The number of times so far.

以100次以上循環仍不發生剝離者為◎,50次以上且低於100次時發生剝離者為○,低於50次時發生剝離者為×。The peeling does not occur in 100 cycles or more, and the peeling occurs when the peeling is 50 or more and less than 100 times, and the peeling occurs when it is less than 50 times.

<(12)阻氣性><(12) Gas barrier property>

後述實施例、比較例中所製作之硬化物為測定用試樣,使用其厚度0.2mm之100mm×100mm之硬化物,以Systech Illinois日本公司製造,氧透過率測定裝置Model 8001,在溫度23℃、乾燥條件下測定其氧透過率。以氧透過率低於500cc/m2 /day時為◎,500cc/m2 /day以上且低於1000cc/m2 /day時為○,1000cc/m2 /day以上時為×。The cured product prepared in the examples and the comparative examples described later was a sample for measurement, and a cured product of 100 mm × 100 mm having a thickness of 0.2 mm was used, and the oxygen permeability measuring device Model 8001 was manufactured by Systech Illinois Japan Co., Ltd. at a temperature of 23 ° C. The oxygen transmission rate was measured under dry conditions. When the oxygen permeability is less than 500 cc/m 2 /day, it is ◎, 500 cc/m 2 /day or more and less than 1000 cc/m 2 /day is ○, and when it is 1000 cc/m 2 /day or more, it is ×.

〔實施例1〕[Example 1] <具有含不飽和鍵之基的有機聚矽氧烷(A1)之製造><Manufacture of Organic Polyoxane (A1) Having a Group Containing an Unsaturated Bond>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入53g(0.2莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、27g(0.1莫耳)之作為(a2)成分的甲基三(二甲矽氧基)矽烷、242g(0.3莫耳)之作 為(b1)成分的如下述平均組成式(B1-1)所示的重量平均分子量為780之乙烯基二甲矽氧基末端的聚二甲基矽氧烷、101g(0.9莫耳)之作為(c)成分的6-乙烯基雙環〔2.2.1〕庚-2-烯、1600g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃。In a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser, 53 g (0.2 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. Alkyl, 27 g (0.1 mol) of methyltris(dimethyloxy)decane as component (a2), 242 g (0.3 m) The polydimethyl siloxane having a weight average molecular weight of 780, which is represented by the following average composition formula (B1-1), having a weight average molecular weight of 780, and 101 g (0.9 m) as the component (b1) (c) component of 6-vinylbicyclo[2.2.1]hept-2-ene, 1600 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor), stirred under nitrogen and simultaneously heated to 60 °C.

CH2 =CHSi(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 CH=CH2 ………(B1-1)CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 CH=CH 2 ... (B1-1)

其中,上述平均組成式(B1-1)中,Me表示甲基(本說明書中之實施例及比較例中所示之平均組成式中均同樣。)。In the above average composition formula (B1-1), Me represents a methyl group (the same is true for the average composition formula shown in the examples and the comparative examples in the present specification).

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polysiloxane of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為98%。Thereafter, the contents of the distillation flask were analyzed, and it was found that the reaction rate of the SiH group was 98%.

之後,再經過活性碳處理、餾除揮發成分,即可得到350g之下述通式(40)所示之含不飽和鍵之基的有機聚矽氧烷(A1)。Thereafter, the activated carbon treatment is carried out to distill off the volatile component, whereby 350 g of an organopolyoxane (A1) having an unsaturated bond-containing group represented by the following formula (40) can be obtained.

該所得之含不飽和鍵之基的有機聚矽氧烷(A1),其中不含(甲基)丙烯醯氧基,其含不飽和鍵之基的官能基當量為694g/mol,由GPC測定計算之重量平均分子量為37500,25℃下之黏度為2800mPa.s。The obtained unsaturated poly bond-containing organopolyoxane (A1), which does not contain a (meth) propylene fluorenyl group, has a functional group equivalent of 694 g/mol of an unsaturated bond group, as determined by GPC The calculated weight average molecular weight is 37,500, and the viscosity at 25 ° C is 2800 mPa. s.

上述通式(40)中,m表示平均10之整數;n表示平均8之整數。In the above formula (40), m represents an integer of 10 on average; n represents an integer of 8 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-17.2ppmF1: -17.2ppm

M1:+8.8ppmM1: +8.8ppm

T:-66.2ppmT: -66.2 ppm

D2:-19.8ppmD2: -19.8ppm

D3:-21.2ppmD3: -21.2ppm

a/(b+c)之值為0.78。The value of a/(b+c) is 0.78.

但其中並未觀察到S:-32.3ppm之峰;d/a之值為0。However, no peak of S: -32.3 ppm was observed; the value of d/a was zero.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含不飽和鍵之基的有機聚矽氧烷(A1) 中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。100 parts by mass of an organopolyoxane (A1) having an unsaturated bond group 2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Nippon Chemical Co., Ltd., trade name: Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, and the mixture was stirred to make the whole uniform. Then, after defoaming, a hardenable composition is obtained.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性方面之評定結果如下述表1所示。The evaluation results of the obtained cured product characteristics are shown in Table 1 below.

〔實施例2〕[Example 2] <含甲基丙烯醯氧基之有機聚矽氧烷(A2)之製造><Manufacture of organopolyoxyalkylene (A2) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入53g(0.2莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、27g(0.1莫耳)之作為(a2)成分的甲基三(二甲矽氧基)矽烷、242g(0.3莫耳)之作為(b1)成分的如下述平均組成式(B1-2)所示的重量平均分子量為780之乙烯基二甲矽氧基末端的聚二甲基矽氧烷、118g(0.9莫耳)之作為(c)成分的甲基丙烯酸3-丁烯酯、1600g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃。In a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser, 53 g (0.2 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. Alkane, 27 g (0.1 mol) of methyltris(dimethyloxy)decane as a component (a2), and 242 g (0.3 mol) of the component (b1) as the following average composition formula (B1-2) The weight average molecular weight shown is 780 of a vinyl dimethyloxy end-terminated polydimethyl siloxane, 118 g (0.9 mol) of 3-butenyl methacrylate as component (c), 1600 g Toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor) were stirred under a nitrogen atmosphere and simultaneously heated to 60 °C.

CH2 =CHSi(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 CH=CH2 ………(B1-2)CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 CH=CH 2 ... (B1-2)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬,相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polyoxyalkylene of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以 水冷或氣冷保持於55至65℃,同時攪拌72小時。After determining that the hydrogenation reaction begins, the reaction system is kept warm and Water or air cooling was maintained at 55 to 65 ° C while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為99%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%.

之後,再經過活性碳處理、餾除揮發成分,即可得到370g之下述通式(41)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A2)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 370 g of the methacryloxy group-containing organopolyoxane (A2) represented by the following formula (41) can be obtained.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A2)的官能基當量為714g/mol,由GPC測定計算之重量平均分子量為38200,25℃下之黏度為2600mPa.s。The obtained methacryloxy group-containing organopolyoxane (A2) has a functional group equivalent of 714 g/mol, a weight average molecular weight calculated by GPC of 38,200, and a viscosity at 25 ° C of 2600 mPa. s.

上述通式(41)中,m表示平均10之整數;n表示平均8之整數。In the above formula (41), m represents an integer of 10 on average; n represents an integer of 8 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。The results of Si NMR measurement were observed to be equivalent to the constituent units as follows The peak shown.

F1:-18.2ppmF1: -18.2ppm

M1:+8.8ppmM1: +8.8ppm

T:-66.2ppmT: -66.2 ppm

D2:-19.8ppmD2: -19.8ppm

D3:-21.2ppmD3: -21.2ppm

a/(b+c)之值為0.78。The value of a/(b+c) is 0.78.

但其中並未觀察到S:-32.3ppm之峰;d/a之值為0。However, no peak of S: -32.3 ppm was observed; the value of d/a was zero.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A2)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A2) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表1所示。The evaluation results of the obtained cured product characteristics are shown in Table 1 below.

〔實施例3〕[Example 3] <含甲基丙烯醯氧基之有機聚矽氧烷(A3)之製造><Manufacture of organopolyoxyalkylene (A3) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入53g(0.2莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、16g(0.05莫耳)之作為(a2)成分的四(二甲矽氧基)矽烷、203g(0.3莫耳)之作為(b1) 成分的如下述平均組成式(B1-3)所示的重量平均分子量為780之乙烯基二甲矽氧基末端的聚二甲基矽氧烷、118g(0.9莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、1500g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣下攪拌並同時加溫至60℃。In a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser, 53 g (0.2 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. Alkane, 16g (0.05m) of tetrakis(dimethyloxy)decane as component (a2), 203g (0.3m) as (b1) The component has a weight average molecular weight of 780 as shown in the following average composition formula (B1-3), a polydimethylsiloxane having a vinyl dimethyloxy group at the end of 780, and 118 g (0.9 mol) as a component (c). The -3-butenyl methacrylate, 1500 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor) were stirred under nitrogen and simultaneously heated to 60 °C.

CH2 =CHSi(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 CH=CH2 ………(B1-3)CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 CH=CH 2 ... (B1-3)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polysiloxane of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為97%。Thereafter, the contents of the distillation flask were analyzed, and it was found that the reaction rate of the SiH group was 97%.

之後,再經過活性碳處理、餾除揮發成分,即可得到330g之下述通式(42)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A3)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 330 g of the methacryloxy group-containing organopolyoxane (A3) represented by the following formula (42) can be obtained.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A3)的官能基當量為626g/mol,由GPC測定計算之重量平均分子量為34200,25℃下之黏度為3500mPa.s。The obtained methacryloxy group-containing organopolyoxane (A3) has a functional group equivalent of 626 g/mol, a weight average molecular weight calculated by GPC of 34,200, and a viscosity at 25 ° C of 3,500 mPa. s.

上述通式(42)中,m表示平均5之整數;n表示平均8之整數。In the above formula (42), m represents an integer of 5 on average; n represents an integer of 8 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

M1:+8.8ppmM1: +8.8ppm

D2:-19.8ppmD2: -19.8ppm

D3:-21.2ppmD3: -21.2ppm

S:-32.3ppmS: -32.3 ppm

a/(b+c)之值為1.08;d/a之值為0.08。The value of a/(b+c) is 1.08; the value of d/a is 0.08.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A3)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A3) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表1所示。The evaluation results of the obtained cured product characteristics are shown in Table 1 below.

〔實施例4〕[Example 4] <含甲基丙烯醯氧基之有機聚矽氧烷(A4)之製造><Manufacture of organopolyoxyalkylene (A4) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入41g(0.2莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、125g(0.2莫耳)之作為(b1)成分的如下述平均組成式(B1-4)所示的重量平均分子量為780之乙烯基二甲矽氧基末端的聚二甲基矽氧烷、76g(0.6莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、864g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃。In a 3.0 L 3-port retort equipped with a stirring device, a thermometer, and a reflux condenser, 41 g (0.2 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. Alkane, 125 g (0.2 mol) of polydimethyl methoxy oxane having a weight average molecular weight of 780 as shown in the following average composition formula (B1-4) as a component (b1) 76 g (0.6 mol) of 3-butenyl methacrylate as component (c), 864 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor), stirred under nitrogen atmosphere and simultaneously added Warm to 60 ° C.

CH2 =CHSi(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 CH=CH2 ………(B1-4)CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 CH=CH 2 ... (B1-4)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polysiloxane of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為99%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%.

之後,再經過活性碳處理、餾除揮發成分,即可得到205g之下述通式(43)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A4)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 205 g of the methacryloxy group-containing organopolyoxane (A4) represented by the following formula (43) can be obtained.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A4)的官能基當量為600g/mol,由GPC測定計算之重量平均分子量為19800,25℃下之黏度為4500mPa.s。The obtained methacryloxy-containing organopolyoxane (A4) has a functional group equivalent of 600 g/mol, a weight average molecular weight calculated by GPC of 19,800, and a viscosity at 25 ° C of 4,500 mPa. s.

上述通式(43)中,m表示平均15之整數;n表示平均8之整數。In the above formula (43), m represents an integer of 15 on average; n represents an integer of 8 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

M1:+8.8ppmM1: +8.8ppm

D2:-19.8ppmD2: -19.8ppm

D3:-21.2ppmD3: -21.2ppm

a/(b+c)之值為1.13。The value of a/(b+c) is 1.13.

但其中並未觀察到S:-32.3ppm之峰;d/a之值為0。However, no peak of S: -32.3 ppm was observed; the value of d/a was zero.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A4)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A4) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表1所示。The evaluation results of the obtained cured product characteristics are shown in Table 1 below.

〔實施例5〕[Example 5] <含甲基丙烯醯氧基之有機聚矽氧烷(A5)之製造><Manufacture of organopolysiloxane (A5) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入68g(0.3莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、51g(0.3莫耳)之作為(b1)成分的如下述平均組成式(B1-5)所示的分子量為186之乙烯基二甲矽氧基末端的二甲基二矽氧烷、119g(0.9莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、795g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並 同時加溫至60℃反應。In a 3.0 L 3-port retort equipped with a stirring device, a thermometer, and a reflux condenser, 68 g (0.3 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. 51 g (0.3 mol) of dimethyl dimethyl oxane having a molecular weight of 186 and having a molecular weight of 186 as the component (b1) below, 119 g (0.9 mol) of 3-butenyl methacrylate as component (c), 795 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor), stirred under a nitrogen atmosphere and At the same time, the reaction was heated to 60 ° C.

CH2 =CHSi(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 CH=CH2 ………(B1-5)CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 CH=CH 2 ... (B1-5)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polysiloxane of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為99%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%.

之後,再經過活性碳處理、餾除揮發成分,即可得到188g之下述通式(44)、下述通式(45)及下述通式(46)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A5)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 188 g of the methacrylic oxime represented by the following formula (44), the following formula (45), and the following formula (46) can be obtained. Based on organopolyoxane (A5).

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A5)的官能基當量為350g/mol,由GPC測定計算之重量平均分子量為16400,25℃下之黏度為15000mPa.s。The obtained methacryloxy-containing organopolyoxane (A5) has a functional group equivalent of 350 g/mol, a weight average molecular weight of 16400 as determined by GPC, and a viscosity of 15000 mPa at 25 ° C. s.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A5)的[WB]/[WA]之值為1.7。又,通式(45)相當於通式(9),通式(46)相當於通式(10)。The obtained methacryloxy group-containing organopolyoxane (A5) had a value of [WB]/[WA] of 1.7. Further, the formula (45) corresponds to the formula (9), and the formula (46) corresponds to the formula (10).

上述通式(44)中,m表示平均25之整數;n表示平均0之整數。In the above formula (44), m represents an integer of 25 on average; n represents an integer of 0 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

M1:+8.8ppmM1: +8.8ppm

D2:-19.8ppmD2: -19.8ppm

a/(b+c)之值為1.04。The value of a/(b+c) is 1.04.

但其中並未觀察到S:-32.3ppm之峰;d/a之值為0。However, no peak of S: -32.3 ppm was observed; the value of d/a was zero.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A5)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日 本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氧下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (100 parts by mass) of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A5) The chemical company Akzo Co., Ltd., trade name: Trigonox 121-50E, 50% by mass solution) is mixed under nitrogen and oxygen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表1所示。The evaluation results of the obtained cured product characteristics are shown in Table 1 below.

〔實施例6〕[Example 6] <含甲基丙烯醯氧基之有機聚矽氧烷(A6)之製造><Manufacture of organopolyoxyalkylene (A6) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入201g(0.8莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、269g(1.4莫耳)之作為(b1)成分的如下述平均組成式(B1-6)所示的分子量為186之乙烯基二甲矽氧基末端的聚二甲基矽氧烷、97g(0.7莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、2138g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。In a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser, 201 g (0.8 mol) of 1,3,5,7-tetramethylcyclotetrazepine as component (a1) was added. 269 g (1.4 mol) of a polydimethylsiloxane having a molecular weight of 186 as shown in the following average composition formula (B1-6) as a component (b1): 97 g of a vinyl dimethyloxy end group, 97 g (0.7 mol) of 3-butenyl methacrylate as component (c), 2138 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor), stirred under nitrogen and simultaneously heated to Reaction at 60 ° C.

CH2 =CHSi(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 CH=CH2 ………(B1-6)CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 CH=CH 2 ... (B1-6)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polysiloxane of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為99%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%.

之後,再經過活性碳處理、餾除揮發成分,即可得到520g之下述通式(47)、下述通式(48)及下述通式(49)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A6)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 520 g of the methacrylic acid-containing oxime represented by the following formula (47), the following formula (48), and the following formula (49) can be obtained. Based on organopolyoxane (A6).

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A6)的官能基當量為1157g/mol,由GPC測定計算之重量平均分子量為98600,25℃下之黏度為26000mPa.s。The obtained methacryloxy-containing organopolyoxane (A6) has a functional group equivalent of 1157 g/mol, a weight average molecular weight calculated by GPC of 98600, and a viscosity at 25 ° C of 26000 mPa. s.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A6)之[WB]/[WA]之值為10.1。又,通式(48)相當於通式(9),通式(49)相當於通式(10)。The value of [WB]/[WA] of the obtained methacryloxy group-containing organopolyoxane (A6) was 10.1. Further, the formula (48) corresponds to the formula (9), and the formula (49) corresponds to the formula (10).

上述通式(47)中,m表示平均30之整數;n表示平均0之整數。In the above formula (47), m represents an integer of 30 on average; n represents an integer of 0 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

M1:+8.8ppmM1: +8.8ppm

D2:-19.8ppmD2: -19.8ppm

a/(b+c)之值為0.16。The value of a/(b+c) is 0.16.

但其中並未觀察到S:-32.3ppm之峰;d/a之值為0。However, no peak of S: -32.3 ppm was observed; the value of d/a was zero.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A6)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A6) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表1所示。The evaluation results of the obtained cured product characteristics are shown in Table 1 below.

〔實施例7〕[Example 7] <含甲基丙烯醯氧基之有機聚矽氧烷(A7)之製造><Manufacture of organopolyoxyalkylene (A7) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入24g(0.1莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、13g(0.05莫耳)之作為(a2)成分的甲基三(二甲矽氧基)矽烷及0.1g(0.002莫耳)之四甲矽烷、119g(0.2莫耳)之作為(b1)成分的如下述平均組成式(B1-7)所示的重量平均分子量為780之乙烯基二甲矽氧基末端的聚二甲基矽氧烷、53g(0.3莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、768g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。In a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser, 24 g (0.1 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. Alkyl, 13 g (0.05 mol) of methyltris(dimethyloxy)decane as component (a2) and 0.1 g (0.002 mol) of tetramethyl decane, 119 g (0.2 mol) as (b1) The component has a weight average molecular weight of 780 as shown in the following average composition formula (B1-7): a vinyl dimethyloxy end group of polydimethyl methoxy oxane, and 53 g (0.3 mol) of (c) component. The 3-butenyl methacrylate, 768 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor) were stirred under a nitrogen atmosphere while heating to 60 ° C for reaction.

CH2 =CHSi(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 CH=CH2 ………(B1-7)CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 CH=CH 2 ... (B1-7)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polysiloxane of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為99%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%.

之後,再經過活性碳處理、餾除揮發成分,即可得到180g之下述通式(50)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A7)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 180 g of the methacryloxy group-containing organopolyoxane (A7) represented by the following formula (50) can be obtained.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A7)的官能基當量為767g/mol,由GPC測定計算之重量平均分子量為189800,25℃下之黏度為45000mPa.s。The obtained methacryloxy-containing organopolyoxane (A7) has a functional group equivalent of 767 g/mol, a weight average molecular weight calculated by GPC of 189,800, and a viscosity at 25 ° C of 45,000 mPa. s.

上述通式(50)中,m表示平均50之整數;n表示平均8之整數。In the above formula (50), m represents an integer of 50 on average; n represents an integer of 8 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

M1:+8.8ppmM1: +8.8ppm

T:-66.2ppmT: -66.2 ppm

D2:-19.8ppmD2: -19.8ppm

D3:-21.2ppmD3: -21.2ppm

a/(b+c)之值為0.70。The value of a/(b+c) is 0.70.

但其中並未觀察到S:-32.3ppm之峰;d/a之值為0。However, no peak of S: -32.3 ppm was observed; the value of d/a was zero.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A7)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A7) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表1所示。The evaluation results of the obtained cured product characteristics are shown in Table 1 below.

〔實施例8〕[Example 8] <含甲基丙烯醯氧基之有機聚矽氧烷(A8)之製造><Manufacture of organopolyoxyalkylene (A8) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3 口蒸餾瓶中,加入53g(0.2莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、27g(0.1莫耳)之作為(a2)成分的甲基三(二甲矽氧基)矽烷、235g(0.3莫耳)之作為(b2)成分的如下述平均組成式(B1-8)所示的重量平均分子量為760之羥基二甲矽氧基末端的聚二甲基矽氧烷、118g(0.9莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、1600g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。3.0L 3 equipped with a stirring device, thermometer, and reflux condenser In a retort, 53 g (0.2 mol) of 1,3,5,7-tetramethylcyclotetraoxane as component (a1) and 27 g (0.1 mol) of a component (a2) were added. A hydroxy dimethyl methoxy end group having a weight average molecular weight of 760 as shown in the following average composition formula (B1-8) as a component of the (b2) component of bis(xycyloxy)decane, 235 g (0.3 mol) Polydimethyloxane, 118 g (0.9 mol) of 3-butenyl methacrylate as component (c), 1600 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor), The mixture was stirred under a nitrogen atmosphere while heating to 60 ° C.

HO-Si(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 -OH………(B1-8)HO-Si(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 -OH.........(B1-8)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為40ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polyoxyalkylene of the addition reaction product 40 ppm.

在確定脫氫反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After the start of the dehydrogenation reaction was determined, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為96%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 96%.

之後,再經過活性碳處理、餾除揮發成分,即可得到370g之下述通式(51)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A8)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 370 g of the methacryloxy group-containing organopolyoxane (A8) represented by the following formula (51) can be obtained.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A8)的官能基當量為703g/mol,由GPC測定計算之重量平均分子量為34500,25℃下之黏度為2500mPa.s。The obtained methacryloxy group-containing organopolyoxane (A8) has a functional group equivalent of 703 g/mol, a weight average molecular weight calculated by GPC of 34,500, and a viscosity at 25 ° C of 2,500 mPa. s.

上述通式(51)中,m表示平均10之整數;n表示平均8之整數。In the above formula (51), m represents an integer of 10 on average; n represents an integer of 8 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

T:-66.2ppmT: -66.2 ppm

D1及D2:-19.8ppmD1 and D2: -19.8ppm

D3:-21.2ppmD3: -21.2ppm

S:-32.3ppmS: -32.3 ppm

a/(b+c)之值為1.33;d/a之值為0.09。The value of a/(b+c) is 1.33; the value of d/a is 0.09.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A8)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日 本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (100 parts by mass) of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A8) The chemical product manufactured by Akzo Co., Ltd., trade name: Trigonox 121-50E, 50% by mass solution) is mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表1所示。The evaluation results of the obtained cured product characteristics are shown in Table 1 below.

〔實施例9〕[Example 9] <含甲基丙烯醯氧基之有機聚矽氧烷(A9)之製造><Manufacture of organopolyoxyalkylene (A9) containing methacryloxyloxy group>

係在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入53g(0.2莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、16g(0.05莫耳)之作為(a2)成分的四(二甲矽氧基)矽烷、197g(0.3莫耳)之作為(b2)成分的如下述平均組成式(B1-9)所示的重量平均分子量為760之羥基二甲矽氧基末端的聚二甲基矽氧烷、118g(0.9莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、1500g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。In a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser, 53 g (0.2 mol) of 1,3,5,7-tetramethylcyclotetraindole as the component (a1) was added. As the oxyalkylene, 16 g (0.05 mol) of tetrakis (dimethyl methoxy) decane as the component (a2) and 197 g (0.3 mol) as the component (b2), as shown in the following average composition formula (B1-9) The weight average molecular weight is 760 hydroxy dimethyl methoxy end polydimethyl methoxy oxane, 118 g (0.9 mol) of (c) component methacrylic acid 3-butenyl ester, 1500 g of toluene And 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor), stirred under a nitrogen atmosphere and simultaneously heated to 60 ° C to react.

HO-Si(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 -OH………(B1-9)HO-Si(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 -OH.........(B1-9)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為40ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polyoxyalkylene of the addition reaction product 40 ppm.

在確定脫氫反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After the start of the dehydrogenation reaction was determined, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率 為97%。After analyzing the contents of the distillation bottle, the reaction rate of the SiH group is known. It is 97%.

之後,再經過活性碳處理、餾除揮發成分,即可得到325g之下述通式(52)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A9)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 325 g of the methacryloxy group-containing organopolyoxane (A9) represented by the following formula (52) can be obtained.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A9)的官能基當量為617g/mol,由GPC測定計算之重量平均分子量為33200,25℃下之黏度為3400mPa.s。The obtained methacryloxy-containing organopolyoxane (A9) has a functional group equivalent of 617 g/mol, a weight average molecular weight calculated by GPC of 33,200, and a viscosity at 25 ° C of 3400 mPa. s.

上述通式(52)中,m表示平均5之整數;n表示平均8之整數。In the above formula (52), m represents an integer of 5 on average; n represents an integer of 8 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

T:-66.2ppmT: -66.2 ppm

D3:-21.2ppmD3: -21.2ppm

S:-32.3ppmS: -32.3 ppm

a/(b+c)之值為1.75;d/a之值為0.08。The value of a/(b+c) is 1.75; the value of d/a is 0.08.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A9)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A9) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表2所示。The evaluation results of the obtained cured product characteristics are shown in Table 2 below.

〔實施例10〕[Example 10] <含甲基丙烯醯氧基之有機聚矽氧烷(A10)之製造><Manufacture of organopolyoxyalkylene (A10) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入41g(0.2莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、122g(0.2莫耳)之作為(b2)成分的如下述平均組成式(B1-10)所示的重量平均分子量為760之羥基二甲矽氧基末端的聚二甲基矽氧烷、76g(0.6 莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、864g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。In a 3.0 L 3-port retort equipped with a stirring device, a thermometer, and a reflux condenser, 41 g (0.2 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. 122 g (0.2 mol) of polydimethyl methoxyoxane having a weight average molecular weight of 760 as shown in the following average composition formula (B1-10) as a component (b2), 76g (0.6 Methyl 3-butenyl methacrylate as component (c), 864 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor), stirred under nitrogen atmosphere and simultaneously heated to 60 ° C reaction.

HO-Si(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 -OH………(B1-10)HO-Si(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 -OH.........(B1-10)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為40ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polyoxyalkylene of the addition reaction product 40 ppm.

在確定脫氫反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After the start of the dehydrogenation reaction was determined, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為96%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 96%.

之後,再經過活性碳處理、餾除揮發成分,即可得到201g之下述通式(53)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A10)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 201 g of the methacryloxy group-containing organopolyoxane (A10) represented by the following formula (53) can be obtained.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A10)的官能基當量為591g/mol,由GPC測定計算之重量平均分子量為19500,25℃下之黏度為4200mPa.s。The obtained methacryloxy group-containing organopolyoxane (A10) has a functional group equivalent of 591 g/mol, a weight average molecular weight calculated by GPC of 19,500, and a viscosity at 25 ° C of 4,200 mPa. s.

上述通式(53)中,m表示平均15之整數;n表示平均8之整數。In the above formula (53), m represents an integer of 15 on average; n represents an integer of 8 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

T:-66.2ppmT: -66.2 ppm

D3:-21.2ppmD3: -21.2ppm

S:-32.3ppmS: -32.3 ppm

a/(b+c)之值為1.13;d/a之值為0.08。The value of a/(b+c) is 1.13; the value of d/a is 0.08.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A10)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A10) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表2所示。The evaluation results of the obtained cured product characteristics are shown in Table 2 below.

〔實施例11〕[Example 11] <含甲基丙烯醯氧基之有機聚矽氧烷(A11)之製造><Manufacture of organopolyoxyalkylene (A11) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入68g(0.3莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、45g(0.3莫耳)之作為(b2) 成分的如下述平均組成式(B1-11)所示的分子量為166之羥基二甲矽氧基末端的二甲基二矽氧烷、119g(0.9莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、795g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。In a 3.0 L 3-port retort equipped with a stirring device, a thermometer, and a reflux condenser, 68 g (0.3 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. Alkane, 45g (0.3m) as (b2) The dimethyl hydroxy methoxy end of dimethyl dioxane having a molecular weight of 166, and the 119 g (0.9 mol) of the methyl group as the component (c) represented by the following average composition formula (B1-11) 3-butenyl acrylate, 795 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor) were stirred under a nitrogen atmosphere while heating to 60 ° C for reaction.

HO-Si(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 -OH………(B1-11)HO-Si(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 -OH.........(B1-11)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為40ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polyoxyalkylene of the addition reaction product 40 ppm.

在確定脫氫反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After the start of the dehydrogenation reaction was determined, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為99%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%.

之後,再經過活性碳處理、餾除揮發成分,即可得到183g之下述通式(54)、下述通式(55)及下述通式(56)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A11)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 183 g of the methacrylic acid-containing oxime represented by the following formula (54), the following formula (55), and the following formula (56) can be obtained. Based on organopolyoxane (A11).

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A11)的官能基當量為340g/mol,由GPC測定計算之重量平均分子量為17600,25℃下之黏度為14500mPa.s。The obtained methacryloxy-containing organopolyoxane (A11) has a functional group equivalent of 340 g/mol, a weight average molecular weight calculated by GPC of 17600, and a viscosity at 25 ° C of 14500 mPa. s.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A11)之[WB]/[WA]之值為1.9。又,通式(55)相當於通式(9),通式(56)相當於通式(10)。The value of [WB]/[WA] of the obtained methacryloxy group-containing organopolyoxane (A11) was 1.9. Further, the formula (55) corresponds to the formula (9), and the formula (56) corresponds to the formula (10).

上述通式(54)中,m表示平均25之整數;n表示平均0之整數。In the above formula (54), m represents an integer of 25 on average; n represents an integer of 0 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

T:-66.2ppmT: -66.2 ppm

a/(b+c)之值為1.00。The value of a/(b+c) is 1.00.

但其中並未觀察到S:-32.3ppm之峰;d/a之值為0。However, no peak of S: -32.3 ppm was observed; the value of d/a was zero.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A11)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A11) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表2所示。The evaluation results of the obtained cured product characteristics are shown in Table 2 below.

〔實施例12〕[Example 12] <含甲基丙烯醯氧基之有機聚矽氧烷(A12)之製造><Manufacture of organopolyoxyalkylene (A12) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入201g(0.8莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、240g(1.4莫耳)之作為(b2)成分的如下述平均組成式(B1-12)所示的分子量為166之羥基二甲矽氧基末端的二甲基二矽氧烷、97g(0.7莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、2138g之甲苯 及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。In a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser, 201 g (0.8 mol) of 1,3,5,7-tetramethylcyclotetrazepine as component (a1) was added. An alkane, 240 g (1.4 mol) of dimethyl dimethyl oxane having a molecular weight of 166, which is represented by the following average composition formula (B1-12), having a molecular weight of 166, 97 g (1.4 mol). 0.7 moles of 3-butenyl methacrylate as component (c), 2138 g of toluene And 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor), stirred under a nitrogen atmosphere and simultaneously heated to 60 ° C to react.

HO-Si(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 -OH………(B1-12)HO-Si(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 -OH.........(B1-12)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為40ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polyoxyalkylene of the addition reaction product 40 ppm.

在確定脫氫反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After the start of the dehydrogenation reaction was determined, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為93%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 93%.

之後,再經過活性碳處理、餾除揮發成分,即可得到490g之下述通式(57)、下述通式(58)及下述通式(59)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A12)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 490 g of the methacrylic oxime represented by the following formula (57), the following formula (58), and the following formula (59) can be obtained. Based on organopolyoxane (A12).

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A12)的官能基當量為1094g/mol,由GPC測定計算之重量平均分子量為99700,25℃下之黏度為25500mPa.s。The obtained methacryloxy group-containing organopolyoxane (A12) has a functional group equivalent of 1094 g/mol, a weight average molecular weight calculated by GPC of 99700, and a viscosity at 25 ° C of 25500 mPa. s.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A12)之[WB]/[WA]之值為9.6。又,通式(58)相當於通式(9),通式(59)相當於通式(10)。The value of [WB]/[WA] of the obtained methacryloxy group-containing organopolyoxane (A12) was 9.6. Further, the formula (58) corresponds to the formula (9), and the formula (59) corresponds to the formula (10).

上述通式(57)中,m表示平均30之整數;n表示平均0之整數。In the above formula (57), m represents an integer of 30 on average; n represents an integer of 0 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

T:-66.2ppmT: -66.2 ppm

a/(b+c)之值為0.15。The value of a/(b+c) is 0.15.

但其中並未觀察到S:-32.3ppm之峰;d/a之值為0。However, no peak of S: -32.3 ppm was observed; the value of d/a was zero.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A12)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A12) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表2所示。The evaluation results of the obtained cured product characteristics are shown in Table 2 below.

〔實施例13〕[Example 13] <含甲基丙烯醯氧基之有機聚矽氧烷(A13)之製造><Manufacture of organopolyoxyalkylene (A13) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入24g(0.1莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、13g(0.05莫耳)之作為(a2)成分的甲基三(二甲矽氧基)矽烷及0.1g(0.002莫耳)之四甲矽烷、116g(0.2莫耳)之作為(b2)成分的如下述平均組成式(B1-13)所示的重量平均分子量為760之羥基二甲矽氧基末端的聚二甲基矽氧烷、53g(0.3莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、768g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。In a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser, 24 g (0.1 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. Alkane, 13 g (0.05 mol) of methyltris(dimethyloxy)decane as component (a2) and 0.1 g (0.002 mol) of tetramethyl decane, 116 g (0.2 mol) as (b2) The component has a weight average molecular weight of 760 as shown in the following average composition formula (B1-13): hydroxy dimethyl methoxy end of polydimethyl siloxane, 53 g (0.3 mol) as component (c) 3-butenyl methacrylate, 768 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor) were stirred under a nitrogen atmosphere while heating to 60 ° C for reaction.

HO-Si(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 -OH………(B1-13)HO-Si(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 -OH.........(B1-13)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為40ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polyoxyalkylene of the addition reaction product 40 ppm.

在確定脫氫反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After the start of the dehydrogenation reaction was determined, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為97%。Thereafter, the contents of the distillation flask were analyzed, and it was found that the reaction rate of the SiH group was 97%.

之後,再經過活性碳處理、餾除揮發成分,即可得到170g之下述通式(60)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A13)。Thereafter, the activated carbon treatment is carried out to distill off the volatile component, whereby 170 g of the methacryloxy group-containing organopolyoxane (A13) represented by the following formula (60) can be obtained.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A13) 的官能基當量為756g/mol,由GPC測定計算之重量平均分子量為182100,25℃下之黏度為42300mPa.s。The obtained methacryloxy-containing organopolyoxane (A13) The functional group equivalent weight is 756g/mol, the weight average molecular weight calculated by GPC is 182100, and the viscosity at 25 ° C is 42300mPa. s.

上述通式(60)中,m表示平均50之整數;n表示平均8之整數。In the above formula (60), m represents an integer of 50 on average; n represents an integer of 8 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

T:-66.2ppmT: -66.2 ppm

D3:-21.2ppmD3: -21.2ppm

S:-32.3ppmS: -32.3 ppm

a/(b+c)之值為1.25;d/a之值為0.10。The value of a/(b+c) is 1.25; the value of d/a is 0.10.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A13)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by the Japanese chemical company Akzo) in 100 parts by mass of the methacryloxy group-containing organopolyoxane (A13) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表2所示。The evaluation results of the obtained cured product characteristics are shown in Table 2 below.

〔實施例14〕[Example 14] <含甲基丙烯醯氧基之有機聚矽氧烷(A14)之製造><Manufacture of organopolyoxyalkylene (A14) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入96g(0.4莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、107g(0.8莫耳)之作為(a2)成分的甲基-1,1,3,3-四甲基二矽氧烷、269g(1.4莫耳)之作為(b1)成分的如下述平均組成式(B1-14)所示的分子量為186之乙烯基二甲矽氧基末端的二甲基二矽氧烷、97g(0.7莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、2138g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。In a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser, 96 g (0.4 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. As an alkane, 107 g (0.8 mol) of methyl-1,1,3,3-tetramethyldioxane as component (a2) and 269 g (1.4 mol) of the component (b1) as follows a dimethyl dimethyl oxane having a molecular weight of 186 and a vinyl dimethyloxy end group represented by the formula (B1-14), 97 g (0.7 mol) of methacrylic acid-3- as a component (c) Butenyl ester, 2138 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor) were stirred under a nitrogen atmosphere while heating to 60 ° C for reaction.

CH2 =CHSi(Me)2 O-(Si(Me)2 O)8 -Si(Me)2 CH=CH2 ………(B1-14)CH 2 =CHSi(Me) 2 O-(Si(Me) 2 O) 8 -Si(Me) 2 CH=CH 2 ... (B1-14)

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polysiloxane of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以 水冷或氣冷保持於55至65℃,同時攪拌72小時。After determining that the hydrogenation reaction begins, the reaction system is kept warm and Water or air cooling was maintained at 55 to 65 ° C while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為99%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%.

之後,再經過活性碳處理、餾除揮發成分,即可得到520g之下述通式(61)及下述通式(62)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A14)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 520 g of the organopolyoxane having the methacryloxy group represented by the following formula (61) and the following formula (62) can be obtained ( A14).

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A14)的官能基當量為1300g/mol,由GPC測定計算之重量平均分子量為11000,25℃下之黏度為600mPa.s。The obtained methacryloxy group-containing organopolyoxane (A14) has a functional group equivalent of 1300 g/mol, a weight average molecular weight of 11,000 calculated by GPC, and a viscosity of 600 mPa at 25 ° C. s.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A14),其原料之1分子中至少含1個SiH基的氫化聚矽氧烷成分,係共同使用(a1)及(a2)。因此之故,使其所得到之含甲基丙烯醯氧基之有機聚矽氧烷(A14)的交聯構造降低,而使其黏度減低。The obtained methacryloxy group-containing organopolyoxane (A14), which contains at least one SiH group-containing hydrogenated polyoxane component in one molecule of the raw material, is used in combination (a1) and (a2). . Therefore, the crosslinked structure of the obtained methacryloxy group-containing organopolyoxane (A14) is lowered to lower the viscosity.

上述通式(61)中,m表示平均30之整數;n表示平均0之整數;r表示平均0之整數。In the above formula (61), m represents an integer of averaging 30; n represents an integer of 0; and r represents an integer of 0.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

M1:+8.8ppmM1: +8.8ppm

D2:-19.8ppmD2: -19.8ppm

F2:+7.0ppmF2: +7.0ppm

a/(b+c)之值為0.16。The value of a/(b+c) is 0.16.

但其中並未觀察到S:-32.3ppm之峰;d/a之值為0。However, no peak of S: -32.3 ppm was observed; the value of d/a was zero.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A14)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by the Japanese chemical company Akzo) in 100 parts by mass of the methacryloxy group-containing organopolyoxane (A14) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應, 即可得到其硬化物。Thereafter, the curable composition was poured into a frame model made of SUS316, and the hardening reaction was carried out at 100 ° C for 4 hours and at 150 ° C for 1 hour. The hardened material can be obtained.

該所得之硬化物特性之評定結果如下述表2所示。The evaluation results of the obtained cured product characteristics are shown in Table 2 below.

〔實施例15〕[Example 15] <含甲基丙烯醯氧基之有機聚矽氧烷(A2)之製造><Manufacture of organopolyoxyalkylene (A2) containing methacryloxyloxy group>

第一階段之反應,係在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入53g(0.2莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、27g(0.1莫耳)之作為(a2)成分的甲基三(二甲矽氧基)矽烷、40g(0.3莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、1600g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。In the first stage of the reaction, a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser was charged with 53 g (0.2 mol) of 1,3,5,7- as the component (a1). Tetramethylcyclotetraoxane, 27 g (0.1 mol) of methyltris(dimethyloxy)decane as component (a2), 40 g (0.3 mol) of methacrylic acid as component (c) 3-butenyl ester, 1600 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor) were stirred under a nitrogen atmosphere while heating to 60 ° C for reaction.

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polysiloxane of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

第二階段之反應,係在上述第一階段之反應液中,加入242g(0.3莫耳)之作為(b1)成分的如下述平均組成式(B1-1)所示的重量平均分子量為780之乙烯基二甲矽氧基末端的聚二甲基矽氧烷、將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。In the second-stage reaction, 242 g (0.3 mol) of the component (b1) having a weight average molecular weight of 780 as shown in the following average composition formula (B1-1) is added to the reaction liquid of the first stage. The vinyl dimethyl oxy-terminated polydimethyl siloxane was incubated, and the reaction was incubated and kept at 55 to 65 ° C with water or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為99%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%.

之後,再經過活性碳處理、餾除揮發成分,即可得到360g之下述通式(41)所示之含甲基丙烯醯氧基之有機聚 矽氧烷(A2)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 360 g of the organopoly(meth) group having the methacryloxy group represented by the following formula (41) can be obtained. Oxane (A2).

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A2)的官能基當量為714g/mol,由GPC測定計算之重量平均分子量為38200,25℃下之黏度為2600mPa.s。The obtained methacryloxy group-containing organopolyoxane (A2) has a functional group equivalent of 714 g/mol, a weight average molecular weight calculated by GPC of 38,200, and a viscosity at 25 ° C of 2600 mPa. s.

Si NMR測定之結果,可觀察到與構成單位相當之如下所示之峰。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed.

F1:-18.2ppmF1: -18.2ppm

M1:+8.8ppmM1: +8.8ppm

T:-66.2ppmT: -66.2 ppm

D2:-19.8ppmD2: -19.8ppm

D3:-21.2ppmD3: -21.2ppm

a/(b+c)之值為0.78。The value of a/(b+c) is 0.78.

但其中並未觀察到S:-32.3ppm之峰;d/a之值為0。However, no peak of S: -32.3 ppm was observed; the value of d/a was zero.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A2)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A2) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表2所示。The evaluation results of the obtained cured product characteristics are shown in Table 2 below.

〔實施例16〕[Example 16] <含甲基丙烯醯氧基之有機聚矽氧烷(A2)之製造><Manufacture of organopolyoxyalkylene (A2) containing methacryloxyloxy group>

含甲基丙烯醯氧基之有機聚矽氧烷(A2),係以如實施例2同樣之方法製造。The organopolyoxyalkylene (A2) containing a methacryloxy group was produced in the same manner as in Example 2.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A2)中,將3質量份之1-羥基-環己基-苯酮(BASF日本公司製造,商品名:IRGACURE 184)、3質量份之2-甲基-1-〔4-甲硫基-苯基〕-2-N-口末啉丙烷-1-酮(BASF日本公司製造,商品名:RGACURE 907)混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。3 parts by mass of 1-hydroxy-cyclohexyl-benzophenone (manufactured by BASF Japan, trade name: IRGACURE 184), in 100 parts by mass of the organopolysiloxane (A2) containing methacryloxyloxy group, 3 parts by mass of 2-methyl-1-[4-methylthio-phenyl]-2-N-norpoline propan-1-one (manufactured by BASF Japan, trade name: RGACURE 907) was mixed and stirred. After the whole is uniform, the foaming composition is obtained by defoaming.

之後將該硬化性組成物,設置在玻璃板(縱50mm×橫50mm×厚3mm)上形成矽製含間隔之模型(縱50mm×橫50mm×厚3mm),再於間隔之內部將該硬化性組成物注入,並以玻璃板夾住。Then, the curable composition was placed on a glass plate (50 mm in length × 50 mm in width × 3 mm in thickness) to form a mold having a spacing (50 mm in length × 50 mm in width × 3 mm in thickness), and the hardening property was further inside the space. The composition was injected and clamped with a glass plate.

之後,再以含高壓汞燈之紫外線照射裝置(日本SENENGINEERING公司製造),以累積照射量為2000 mJ/cm2 由上述玻璃板側曝光。Thereafter, the glass plate side was exposed to a cumulative irradiation amount of 2000 mJ/cm 2 by an ultraviolet irradiation apparatus (manufactured by Japan SENENGINEERING Co., Ltd.) containing a high pressure mercury lamp.

其中硬化,係在溫度:23℃、濕度:60%RH之環境下進行。The hardening is carried out in an environment of temperature: 23 ° C and humidity: 60% RH.

之後再移除該模型即可得硬化物。The mold is then removed to obtain a cured product.

該所得之硬化物特性之評定結果如下述表2所示。The evaluation results of the obtained cured product characteristics are shown in Table 2 below.

〔實施例17〕[Example 17] <含甲基丙烯醯氧基之有機聚矽氧烷(A2)之製造><Manufacture of organopolyoxyalkylene (A2) containing methacryloxyloxy group>

含甲基丙烯醯氧基之有機聚矽氧烷(A2),係以如實 施例2同樣之方法製造。Organopolyoxyalkylene (A2) containing methacryloxyloxy group Example 2 was produced in the same manner.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A2)中將3質量份之3-甲基丙烯醯氧丙基甲基二甲氧矽烷(KBM-502,日本信越化學公司製造)及2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。3 parts by mass of 3-methylpropenyloxypropylmethyldimethoxydecane (KBM-502, Shin-Etsu Chemical Co., Ltd.) in 100 parts by mass of the methacryloxy-containing organopolyoxane (A2) (manufactured by the company) and 2.5 parts by mass of triamyl peroxy-2-ethylhexanoate (manufactured by Nippon Chemical Co., Ltd., trade name: Trigonox 121-50E, 50% by mass solution), mixed under nitrogen, and stirred After the whole is uniform, the hardening composition can be obtained by defoaming.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表2所示。The evaluation results of the obtained cured product characteristics are shown in Table 2 below.

〔比較例1〕[Comparative Example 1] <含甲基丙烯醯氧基之有機聚矽氧烷(A15)之製造><Manufacture of organopolyoxyalkylene (A15) containing methacryloxyloxy group>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入134g(1.0莫耳)之1,1,3,3-四甲基二矽氧烷、420g(3.0莫耳)之甲基丙烯酸-3-丁烯酯、1600g之甲苯及0.05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同時加溫至60℃反應。In a 3.0 L 3-port retort equipped with a stirring device, a thermometer, and a reflux condenser, 134 g (1.0 mol) of 1,1,3,3-tetramethyldioxane, 420 g (3.0 m) was charged. Benzyl methacrylate, 1600 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor) were stirred under a nitrogen atmosphere while heating to 60 ° C for reaction.

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polysiloxane of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為99%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%.

之後,再經過活性碳處理、餾除揮發成分,即可得到405g之下述通式(63)所示之含甲基丙烯醯氧基之有機聚矽氧烷(A15)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 405 g of the methacryloxy group-containing organopolyoxane (A15) represented by the following formula (63) can be obtained.

該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A15)的官能基當量為415g/mol,由GPC測定計算之重量平均分子量為400,25℃下之黏度為150mPa.s。The obtained methacryloxy group-containing organopolyoxane (A15) has a functional group equivalent of 415 g/mol, a weight average molecular weight of 400 by GPC measurement, and a viscosity of 150 mPa at 25 ° C. s.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A15)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by Akzo Co., Ltd., a trade name of 100 parts by mass of the methacryloxy group-containing organopolyoxane (A15) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表3所示。The evaluation results of the obtained cured product characteristics are shown in Table 3 below.

〔比較例2〕[Comparative Example 2] <含甲基丙烯醯氧基之有機聚矽氧烷(A16)之製造><Manufacture of organopolyoxyalkylene (A16) containing methacryloxyloxy group>

下述通式(64)所示之含甲基丙烯醯氧基之有機聚矽 氧烷(A16),係使用日本信越化學公司製造之X22-164C。A methacryloxy-containing organic polyfluorene represented by the following formula (64) Oxane (A16) was X22-164C manufactured by Shin-Etsu Chemical Co., Ltd., Japan.

該含甲基丙烯醯氧基之有機聚矽氧烷(A16)的官能基當量為2300g/mol,由GPC測定計算之重量平均分子量為4500,25℃下之黏度為3600mPa.sS。The functional group equivalent of the methacryloxy group-containing organopolyoxane (A16) is 2300 g/mol, and the weight average molecular weight calculated by GPC is 4500, and the viscosity at 25 ° C is 3600 mPa. sS.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷(A16)中將2.5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。2.5 parts by mass of a third amyl peroxy-2-ethylhexanoate (manufactured by the Japanese chemical company Akzo) in 100 parts by mass of the methacryloxy group-containing organopolyoxane (A16) : Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下4小時、再以150℃下1小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 150 ° C for 1 hour.

該所得之硬化物特性之評定結果如下述表3所示。The evaluation results of the obtained cured product characteristics are shown in Table 3 below.

〔比較例3〕[Comparative Example 3] <含環氧基之有機聚矽氧烷(A17)之製造><Manufacture of epoxy-containing organopolyoxane (A17)>

在裝配有攪拌裝置、溫度計、回流冷凝器的3.0L之3口蒸餾瓶中,加入53g(0.2莫耳)之作為(a1)成分的1,3,5,7-四甲基環四矽氧烷、27g(0.1莫耳)之作為(a2)成分的甲基三(二甲矽氧基)矽烷、242g(0.3莫耳)之作為(b1)成分的如下述平均組成式(B1-1)所示的重量平 均分子量為780之乙烯基二甲矽氧基末端的聚二甲基矽氧烷、104g(0.9莫耳)之作為(c)成分的乙烯基環己烯氧化物、1300g之甲苯,於氮氣環境下攪拌並同時加溫至60℃反應。In a 3.0-liter 3-neck retort equipped with a stirring device, a thermometer, and a reflux condenser, 53 g (0.2 mol) of 1,3,5,7-tetramethylcyclotetrazepine as the component (a1) was added. Alkyl, 27 g (0.1 mol) of methyltris(dimethyloxy)decane as component (a2), and 242 g (0.3 mol) of the component (b1) as the following average composition formula (B1-1) Weight shown a polydimethylsiloxane having a vinyl dimethyloxy group at a molecular weight of 780, 104 g (0.9 mol) of a vinylcyclohexene oxide as a component (c), and 1300 g of toluene in a nitrogen atmosphere The mixture was stirred while heating to 60 ° C.

之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。Thereafter, a solution of chloroplatinic acid in isopropyl alcohol was added to make the weight of the platinum metal relative to the organic polysiloxane of the addition reaction product 20 ppm.

在確定矽氫化反應開始後,即將該反應系保溫,並以水冷或氣冷保持於55至65℃,同時攪拌72小時。After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours.

之後分析該蒸餾瓶之內容物,可知其SiH基之反應率為99%。Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%.

之後,再經過活性碳處理、餾除揮發成分,即可得到310g之下述通式(65)所示之含環氧基之有機聚矽氧烷(A17)。Thereafter, after the activated carbon treatment and distillation of the volatile component, 310 g of the epoxy group-containing organopolyoxane (A17) represented by the following formula (65) can be obtained.

該含環氧基之有機聚矽氧烷(A17),並無含不飽和鍵之基。The epoxy group-containing organopolyoxane (A17) has no group containing an unsaturated bond.

該所得之含環氧基之有機聚矽氧烷(A17),由GPC測定計算之重量平均分子量為30500,25℃下之黏度為5600mPa.s。The obtained epoxy group-containing organopolyoxane (A17) has a weight average molecular weight of 30,500 as determined by GPC and a viscosity of 5,600 mPa at 25 ° C. s.

上述通式(65)中,m表示平均10之整數,n表示平均8之整數。In the above formula (65), m represents an integer of 10 on average, and n represents an integer of 8 on average.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

在100質量份之含環氧基之有機聚矽氧烷(A17)中,混合60.5質量份之甲基六氫苯二甲酸酐、1質量份之二氮雜二環十一碳烯辛酸鹽,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。6 parts by mass of methyl hexahydrophthalic anhydride and 1 part by mass of diazabicycloundecene octoate, in 100 parts by mass of the epoxy group-containing organopolyoxane (A17), After stirring, the whole is uniform, and then defoaming is performed to obtain a curable composition.

之後以該硬化性組成物注入模型中,以120℃下1小時、再以150℃下2小時進行硬化反應,即可得到其硬化物。Thereafter, the curable composition was injected into the mold, and the hardened product was obtained by performing a hardening reaction at 120 ° C for 1 hour and then at 150 ° C for 2 hours.

該所得之硬化物特性之評定結果如下述表3所示。The evaluation results of the obtained cured product characteristics are shown in Table 3 below.

〔比較例4〕[Comparative Example 4] <硬化性樹脂組成物(A18)><Curable resin composition (A18)>

硬化性樹脂組成物(A18),其中之光半導體密封材用硬化性樹脂組成物係使用市售之日本信越化學公司製造之KER-2500。In the curable resin composition (A18), the KER-2500 manufactured by Shin-Etsu Chemical Co., Ltd., which is commercially available, is used as the curable resin composition for the optical semiconductor sealing material.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

以已有販售之KER-2500A及KER-2500B以各100質量份混合,再攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。The KER-2500A and KER-2500B which have been sold are mixed in 100 parts by mass, and after stirring, the whole is uniform, and then defoaming is performed to obtain a curable composition.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下1小時、再以150℃下5小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the hardened product was obtained by performing a hardening reaction at 100 ° C for 1 hour and at 150 ° C for 5 hours.

該所得之硬化物特性之評定結果如下述表3所示。The evaluation results of the obtained cured product characteristics are shown in Table 3 below.

〔比較例5〕[Comparative Example 5] <硬化性樹脂組成物(A19)><Curable resin composition (A19)>

硬化性樹脂組成物(A19),其中之光半導體密封材用硬化性樹脂組成物,係使用已有販售之日本信越化學公司製造之ASP-1010。The curable resin composition (A19), which is a curable resin composition for an optical semiconductor sealing material, is ASP-1010 manufactured by Shin-Etsu Chemical Co., Ltd., which is already sold.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

以該販售之ASP-1010A(商品名,日本信越化學公司製造)及ASP-1010B(商品名,日本信越化學公司製造)各以100質量份混合,攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。Each of the sold ASP-1010A (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) and ASP-1010B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) were mixed in an amount of 100 parts by mass, stirred to make the whole uniform, and then defoamed. A hardenable composition can be obtained.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下1小時、再以150℃下5小時進行硬化反應, 即可得到其硬化物。Thereafter, the curable composition was poured into a frame model made of SUS316, and the hardening reaction was carried out at 100 ° C for 1 hour and then at 150 ° C for 5 hours. The hardened material can be obtained.

該所得之硬化物特性方面之評定結果如下述表3所示。The evaluation results of the obtained cured product characteristics are shown in Table 3 below.

〔比較例6〕[Comparative Example 6] <硬化性樹脂組成物(A20)><Curable resin composition (A20)>

硬化性樹脂組成物(A20),其中之光半導體密封材用硬化性樹脂組成物係使用已有販售,日本Kaneka公司製造之FX-001。The curable resin composition (A20), which is a curable resin composition for an optical semiconductor sealing material, is commercially available as FX-001 manufactured by Kaneka Co., Ltd., Japan.

<硬化物之製造及特性評定><Manufacture and Characterization of Hardened Materials>

將販售之FX-001A(商品名,日本Kaneka公司製造):40質量份及FX-001B(商品名,日本Kaneka公司製造):60質量份混合,進行攪拌使全體均一後,再經過脫泡即可得到硬化性組成物。FX-001A (trade name, manufactured by Kaneka Co., Ltd., Japan): 40 parts by mass and FX-001B (trade name, manufactured by Kaneka Co., Ltd., Japan): 60 parts by mass, stirred, homogenized, and then defoamed A hardenable composition can be obtained.

之後將該硬化性組成物注入SUS316製之框架模型中,以100℃下1小時、150℃下1小時、再以180℃下0.5小時進行硬化反應,即可得到其硬化物。Then, the curable composition was poured into a frame model made of SUS316, and the cured product was obtained by curing at 100 ° C for 1 hour, at 150 ° C for 1 hour, and at 180 ° C for 0.5 hour.

該所得之硬化物特性之評定結果如下述表3所示。The evaluation results of the obtained cured product characteristics are shown in Table 3 below.

本實施形態之有機聚矽氧烷,係分子構造中具有上述通式(1)至(3)所示之構成單位F1、M1、T中的(i)F1及M1、(ii)F1及T、(iii)F1、M1及T之任意組合的構成單位。The organopolyoxane of the present embodiment has (i) F1 and M1, (ii) F1 and T among the constituent units F1, M1 and T represented by the above formulas (1) to (3) in the molecular structure. And (iii) the constituent unit of any combination of F1, M1 and T.

藉由含構成單位F1、M1、T,可得到耐熱黃變性、耐光性優異之有機聚矽氧烷。By containing the constituent units F1, M1, and T, an organic polyoxane excellent in heat yellowing resistance and light resistance can be obtained.

同時,由構成單位F1所形成之交聯構造的部位及由含構成單位M1或T的矽氧烷所構成之可緩和應力之部位,係包含在其局部之分子構造中,因而使其可以兼具硬度、耐冷熱衝擊性、阻氣性。At the same time, the portion of the crosslinked structure formed by the constituent unit F1 and the portion of the buffer containing the constituent unit M1 or T which can alleviate the stress are included in the partial molecular structure, thereby making it possible With hardness, cold and thermal shock resistance, gas barrier.

由實施例1至17可知,在耐熱黃變性、耐光性、耐冷熱衝擊性、硬度、密接性及阻氣性之點方面,可以得到形成特別是在光半導體用途中所要求之程度均可充分滿足的透明硬化物之有機聚矽氧烷及使用此之硬化性樹脂組成物。It can be seen from Examples 1 to 17 that in terms of heat-resistant yellowing, light resistance, thermal shock resistance, hardness, adhesion, and gas barrier properties, it is possible to obtain a sufficient degree of formation, particularly in the use of optical semiconductors. An organic polysiloxane having a transparent cured product and a curable resin composition using the same.

由比較例1至6可知,由於其中不具備上述本實施形態之構成,因此由耐熱黃變性、耐光性、耐冷熱衝擊性、硬度、密接性及阻氣性之中的所欲之特性及此等特性之平衡的觀點而言,實際使用上並無法得到完全之特性。As is clear from Comparative Examples 1 to 6, since the above-described configuration of the present embodiment is not provided, the desired characteristics among the heat-resistant yellowing, light resistance, thermal shock resistance, hardness, adhesion, and gas barrier properties are as follows. From the point of view of the balance of characteristics, the actual characteristics cannot be obtained in full.

本專利申請,亦根據2011年3月30日向日本專利廳提出申請之歐洲專利申請(第PCT/JP2011/058115號)、2011年3月31日向中華民國經濟部智慧財產局提出申請 之專利申請(第100111196號),其中之內容亦包含在本案作為參照。This patent application is also filed with the European Patent Application (PCT/JP2011/058115) filed with the Japanese Patent Office on March 30, 2011, and the Intellectual Property Office of the Ministry of Economic Affairs of the Republic of China on March 31, 2011. Patent application (No. 100111196), the contents of which are also incorporated herein by reference.

[產業上之可利用性][Industrial availability]

本發明之有機聚矽氧烷及使用其之硬化性樹脂組成物,可作為光半導體用晶片接合材、塗覆材、奈米模印用硬化性樹脂組成物、印墨方面之材料,在產業上具有可利用性。The organopolysiloxane of the present invention and the curable resin composition using the same can be used as a wafer bonding material for an optical semiconductor, a coating material, a curable resin composition for nano-imprinting, and a material for ink printing. Available on the top.

Claims (28)

一種有機聚矽氧烷,係在1分子中含1個以上含不飽和鍵之基,而具有下述通式(1)至(3)所示之構成單位F1、M1、T中的(i)F1及M1、(ii)F1及T、(iii)F1及M1及T之任意組合的構成單位,且以下述通式(14)至(25)、(28)至(31)之任一者所示者;F1:M1:T:(通式(1)至(3)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R2 表示碳數2至10含不飽和鍵之基;X表示碳數2至10之二價烴基;Y表示碳數2至10之二價烴基;a、b、c各自獨立地表示1以上之整數;其中,F1表示環狀有機聚矽氧烷之構成單 位) (前述通式(14)至(25)、(28)至(31)中,m表示0至2000之整數,n表示0至20之整數,r表示0至20之整數)。An organopolyoxane having one or more unsaturated bond-containing groups in one molecule and having the constituent units F1, M1, and T represented by the following general formulae (1) to (3) (i) a constituent unit of any combination of F1 and M1, (ii) F1 and T, (iii) F1, and M1 and T, and any one of the following general formulae (14) to (25), (28) to (31) As shown by the person; F1: M1: T: (In the general formulae (1) to (3), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted group. Any one selected from the group consisting of an aryl group and a substituted or unsubstituted aralkyl group; R 2 represents a group having 2 to 10 carbon atoms and an unsaturated bond; and X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; a divalent hydrocarbon group having 2 to 10 carbon atoms; a, b, and c each independently represent an integer of 1 or more; wherein F1 represents a constituent unit of the cyclic organopolyoxane) (In the above general formulae (14) to (25), (28) to (31), m represents an integer of 0 to 2000, n represents an integer of 0 to 20, and r represents an integer of 0 to 20). 如申請專利範圍第1項所述之有機聚矽氧烷,上述通式(1)至(3)中,a、b、c滿足下述式(I),0.1≦a/(b+c)≦5...(I)。 In the above-mentioned general formulae (1) to (3), a, b, and c satisfy the following formula (I), 0.1≦a/(b+c), in the above-described general formula (1) to (3). ≦5. . . (I). 如申請專利範圍第1或2項所述之有機聚矽氧烷,上述通式(1)所示之構成單位F1中之R2 係丙烯醯氧基或甲基丙烯醯氧基。The organopolysiloxane according to claim 1 or 2, wherein R 2 in the constituent unit F1 represented by the above formula (1) is an acryloxy group or a methacryloxy group. 如申請專利範圍第1或2項所述之有機聚矽氧烷,其中,含有下述通式(4)至(6)所示之構成單位:D1、D2、D3之任意者, D1:(R1 2 SiO2 /2 )...(4)D2:D3:(R1 2 SiO2 /2 )...(6)(通式(4)至(6)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;X表示碳數2至10之二價烴基;其中,D1、D2表示環狀有機聚矽氧烷之構成單位,D3表示鏈狀有機聚矽氧烷之構成單位)。The organopolyoxane according to claim 1 or 2, which comprises any of the constituent units represented by the following general formulae (4) to (6): D1, D2, and D3, D1: R 1 2 SiO 2 / 2 ). . . (4) D2: D3: (R 1 2 SiO 2 / 2 ). . . (6) (In the general formulae (4) to (6), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, and a substitution. Or any one selected from the group consisting of an unsubstituted aryl group and a substituted or unsubstituted aralkyl group; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; wherein D1 and D2 represent a cyclic organopolyoxane The constituent unit, D3 represents the constituent unit of the chain organopolysiloxane. 如申請專利範圍第1或2項所述之有機聚矽氧烷,其中,含有下述通式(7)所示之構成單位S,且該通式(7)所示之構成單位的含量,相對於上述通式(1)所示之構成單位F1的含量,滿足下述式(II):d/a≦0.1...(II)S:(通式(7)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;其中,構成單位S表示環狀或鏈狀 有機聚矽氧烷之構成單位)。The organopolyoxane according to claim 1 or 2, which contains the constituent unit S represented by the following formula (7), and the content of the constituent unit represented by the formula (7), With respect to the content of the constituent unit F1 represented by the above formula (1), the following formula (II) is satisfied: d/a ≦ 0.1. . . (II) S: (In the formula (7), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and Any one selected from the group consisting of a substituted or unsubstituted aralkyl group; wherein the constituent unit S represents a constituent unit of a cyclic or chain organopolysiloxane. 如申請專利範圍第1或2項所述之有機聚矽氧烷,其中,只含有上述通式(1)所示之構成單位F1,作為含有上述R2 之構成單位。The organopolyoxyalkylene as described in claim 1 or 2, wherein only the constituent unit F1 represented by the above formula (1) is contained, and the constituent unit of the above R 2 is contained. 如申請專利範圍第1或2項所述之有機聚矽氧烷,其中,含有上述通式(1)所示之構成單位F1及下述通式(8)所示之構成單位F2,作為含有上述R2 之構成單位,(而且,下述通式(8)中,R21 係包含於上述R2 中)F2: (上述通式(8)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;Y表示碳數2至10之二價烴基;其中,F2表示鏈狀有機聚矽氧烷之構成單位)。The organic polyoxosiloxane according to the first or second aspect of the invention, wherein the constituent unit F1 represented by the above formula (1) and the constituent unit F2 represented by the following formula (8) are contained as The constituent unit of the above R 2 (and, in the following formula (8), R 21 is contained in the above R 2 ) F2: (In the above formula (8), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of substituted or unsubstituted aralkyl groups; R 21 represents an acryloxy group or a methacryloxy group; Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms; wherein F2 represents The constituent unit of the chain organopolyoxane). 一種有機聚矽氧烷,其中,相對於100質量份之如申請專利範圍第1至7項中任一項所述之有機聚矽氧烷,又含有0.1至100質量份之下述通式(9)所示之環狀有機聚矽氧烷, (上述通式(9)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;X表示碳數2至10之二價烴基;e表示1以上之整數;f表示0以上之整數;e+f表示3至20之整數)。An organopolyoxane, which further contains 0.1 to 100 parts by mass of the following formula with respect to 100 parts by mass of the organopolyoxane as described in any one of claims 1 to 7. 9) a cyclic organopolyoxane, (In the above formula (9), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of substituted or unsubstituted aralkyl groups; R 21 represents an acryloxy group or a methacryloxy group; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and e represents 1 or more An integer; f represents an integer greater than 0; e+f represents an integer from 3 to 20. 一種有機聚矽氧烷,其中,相對於100質量份之如申請專利範圍第1至8項中任一項所示的有機聚矽氧烷,又含有0.01至1000質量份之下述通式(10)所示的化合物, (上述通式(10)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、 取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;X表示碳數2至10之二價烴基;g表示1以上之整數;h表示0以上之整數;i表示0至20之整數)。An organic polyoxoxane, which further contains 0.01 to 1000 parts by mass of the following formula with respect to 100 parts by mass of the organopolyoxane shown in any one of claims 1 to 8. 10) the compound shown, (In the above formula (10), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of a substituted or unsubstituted aralkyl group; R 21 represents an acryloxy group or a methacryloxy group; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and g represents 1 or more An integer; h represents an integer greater than 0; i represents an integer from 0 to 20. 如申請專利範圍第1、2、8及9項中任一項所述之有機聚矽氧烷,其中,含有下述通式(9)所示之環狀有機聚矽氧烷及下述通式(10)所示之化合物, (上述通式(9)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;X表示碳數2至10之二價烴基;e表示1以上之整數;f表示0以上之整數;e+f表示3至20之整數) ...(10)(通式(10)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;R21 表示丙烯醯氧基或甲基丙烯醯氧基;X表示碳數2至10之二價烴基;g表示1以上之整數;h表示0以上之整數;i表示0至20之整數)其由以基質輔助游離化飛行時間型質譜分析法測定時所得之峰的強度以下述式(III)計算,所得之上述通式(10)所示之化合物含量〔WB〕相對於上述通式(9)所示之化合物含量〔WA〕之比:〔WB〕/〔WA〕之值為0.1以上20.0以下,[WB]/[WA]=符合通式(10)之構造的質量與鈉質量23的合計質量所相當之峰的強度/符合通式(9)之構造的質量與鈉質量23的合計質量所相當之峰的強度....(III)。The organopolyoxane according to any one of the preceding claims, wherein the cyclic polyorganosiloxane represented by the following formula (9) and the following a compound of the formula (10), (In the above formula (9), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group. And any one selected from the group consisting of substituted or unsubstituted aralkyl groups; R 21 represents an acryloxy group or a methacryloxy group; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and e represents 1 or more An integer; f represents an integer greater than 0; e+f represents an integer from 3 to 20) . . . (10) (In the formula (10), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, substituted or unsubstituted. Any one selected from the group consisting of an aryl group and a substituted or unsubstituted aralkyl group; R 21 represents an acryloxy group or a methacryloxy group; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; An integer of 1 or more; h represents an integer of 0 or more; i represents an integer of 0 to 20) which is calculated by the following formula (III) by the intensity of a peak obtained by matrix-assisted free time-of-flight mass spectrometry. The ratio of the content of the compound represented by the above formula (10) [WB] to the content of the compound represented by the above formula (9) [WA]: the value of [WB] / [WA] is 0.1 or more and 20.0 or less, [WB ] / [WA] = the intensity of the peak corresponding to the mass of the structure of the general formula (10) and the total mass of the sodium mass 23 / the quality of the structure conforming to the general formula (9) and the total mass of the sodium mass 23 The intensity of the peak. . . . (III). 如申請專利範圍第1、2、8及9項中任一項所述之有機聚矽氧烷,其中,上述R1 為碳數1至10之烷基。The organopolyoxane according to any one of claims 1, 2, 8 and 9, wherein the above R 1 is an alkyl group having 1 to 10 carbon atoms. 如申請專利範圍第1、2、8及9項中任一項所述之有機聚矽氧烷,其中,上述R1 為甲基。The organopolyoxane according to any one of claims 1, 2, 8 and 9, wherein the above R 1 is a methyl group. 如申請專利範圍第1、2、8及9項中任一項所述之有機聚矽氧烷,其中,上述R2 含有丙烯醯氧基或甲基丙烯醯氧基,且丙烯醯氧基或甲基丙烯醯氧基之官能基當量為210至2100g/莫耳。The organopolyoxane according to any one of claims 1, 2, 8 and 9, wherein the above R 2 contains an acryloxy group or a methacryloxy group, and the propylene oxime group or The functional equivalent of the methacryloxy group is from 210 to 2100 g/mole. 如申請專利範圍第1、2、8及9項中任一項所述之有機聚矽氧烷,其重量平均分子量為700至5000000,25℃之黏度為50至1000000mPa.s。 The organopolyoxane according to any one of claims 1, 2, 8 and 9 which has a weight average molecular weight of 700 to 5,000,000 and a viscosity at 25 ° C of 50 to 1,000,000 mPa. s. 一種有機聚矽氧烷的製造方法,係製造如申請專利範圍第1至14項中任一項所述之有機聚矽氧烷的方法,其具有下述步驟:將下述通式(11)所示之氫化聚矽氧烷(a1)、依所需之具有1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)、i)具有2個以上直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)或具有2個以上直接鍵結於矽原子的羥基之聚矽氧烷(b2),以及ii)1分子中具有2個以上不飽和鍵的有機化合物(c)之加成反應,在矽氫化反應催化劑(d)之存在下進行之步驟, (通式(11)中,R1 表示由:取代或未取代之碳數1至10的烷基、取代或未取代之碳數3至10的環烷基、取代或未取代之芳基及取代或未取代之芳烷基所成之群中選擇之任意者;j表示1以上之整數;k表示0以上之整數;j+k表示3至20之整數)。A method for producing an organopolyoxane, which is a method for producing an organopolyoxane according to any one of claims 1 to 14, which has the following step: (11) The hydrogenated polyoxyalkylene (a1) shown, and the hydrogenated polyoxyalkylene (a2) and i) having one or more hydrogen atoms directly bonded to a halogen atom, have two or more direct bonds to the hydrazine. a vinyl group-containing vinyl polyorganosiloxane (b1) of an atom or a polyoxyalkylene (b2) having two or more hydroxyl groups directly bonded to a ruthenium atom, and ii) having two or more in one molecule a step of performing an addition reaction of a saturated bond organic compound (c) in the presence of a rhodium hydrogenation catalyst (d), (In the formula (11), R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and Any one selected from the group consisting of substituted or unsubstituted aralkyl groups; j represents an integer of 1 or more; k represents an integer of 0 or more; j+k represents an integer of 3 to 20). 如申請專利範圍第15項所述之有機聚矽氧烷的製造方法,其中,上述進行加成反應之步驟係包含:調製反應液的步驟、以及在上述反應液中添加矽氫化反應催化劑(d)之步驟,其中,該反應液含有上述通式(11)所示之氫化聚矽氧烷(a1)、依所需之上述具有1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)、上述具有2個以上之直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)及1分子中具有2個以上不飽和鍵的有機化合物(c),或是具有2個以上直接鍵結於矽原子的羥基之聚矽氧烷(b2)及1分子中具有2個以上不飽和鍵的有機化合物(c)。 The method for producing an organopolyoxane according to claim 15, wherein the step of performing the addition reaction comprises the steps of: preparing a reaction liquid, and adding a hydrogenation catalyst (d) to the reaction liquid. And the reaction liquid contains the hydrogenated polyoxyalkylene (a1) represented by the above formula (11), and the above-mentioned hydrogenated polyfluorene having one or more hydrogen atoms directly bonded to a halogen atom. An alkane (a2), the above-mentioned vinyl group-containing organopolyoxane (b1) having two or more vinyl groups bonded directly to a ruthenium atom, and an organic compound having two or more unsaturated bonds in one molecule (c) Or an organic compound (c) having two or more polyoxyalkylenes (b2) directly bonded to a hydroxyl group of a halogen atom and two or more unsaturated bonds in one molecule. 如申請專利範圍第15項所述之有機聚矽氧烷的製造方法,其中,上述進行加成之反應之步驟,係依序進行下述步驟:調製反應液的步驟,該反應液係含有上述通式(11)所示之氫化聚矽氧烷(a1)、依所需之上述具有1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)及1分子中具有2個以上不飽和鍵的有機化合物(c);生成加成體之步驟,係在上述反應液中添加矽氫化反應催化劑(d)而生成上述通式(11)所示之氫化聚矽氧烷(a1)、依所需之上述具有1個以上直接鍵結於矽原子之氫原子的氫化聚矽氧烷(a2)及1分子中 具有2個以上不飽和鍵的有機化合物(c)之加成物;以及添加步驟,係在上述反應液中加入上述具有2個以上直接鍵結於矽原子的乙烯基之含乙烯基的有機聚矽氧烷(b1)、或具有2個以上直接鍵結於矽原子的羥基之聚矽氧烷(b2)。 The method for producing an organopolyoxane according to claim 15, wherein the step of performing the addition reaction is carried out in the following steps: a step of preparing a reaction liquid, the reaction liquid containing the above The hydrogenated polyoxyalkylene (a1) represented by the formula (11) and the above-mentioned hydrogenated polyoxyalkylene (a2) having one or more hydrogen atoms bonded directly to a halogen atom, and having 2 molecules in one molecule The organic compound (c) having one or more unsaturated bonds; and the step of forming an adduct by adding a hydrogenation catalyst (d) to the reaction liquid to form a hydrogenated polyoxyalkylene represented by the above formula (11) ( A1), as described above, having more than one hydrogenated polyoxane (a2) and one molecule directly bonded to a hydrogen atom of a halogen atom An adduct of an organic compound (c) having two or more unsaturated bonds; and an addition step of adding a vinyl group-containing organic polymer having two or more vinyl groups directly bonded to a ruthenium atom to the above reaction liquid A decane (b1) or a polyoxyalkylene (b2) having two or more hydroxyl groups bonded directly to a ruthenium atom. 一種硬化性樹脂組成物,其含有100質量份之如申請專利範圍第1至14項中任一項所述之有機聚矽氧烷及0.5至10質量份之熱自由基產生劑。 A curable resin composition comprising 100 parts by mass of the organopolysiloxane according to any one of claims 1 to 14 and 0.5 to 10 parts by mass of a thermal radical generator. 一種硬化性樹脂組成物,其含有100質量份之如申請專利範圍第1至14項中任一項所述之有機聚矽氧烷及0.5至20質量份之光自由基產生劑。 A curable resin composition containing 100 parts by mass of the organic polysiloxane of any one of claims 1 to 14 and 0.5 to 20 parts by mass of a photo radical generator. 如申請專利範圍第18或19項所述之硬化性樹脂組成物,其中,相對於100質量份之如申請專利範圍第1至14項中任一項所述之有機聚矽氧烷,又含有0.1至10質量份之矽烷偶合劑。 The sclerosing resin composition according to claim 18, wherein the organic polyoxane according to any one of claims 1 to 14 is further contained in an amount of 100 parts by mass. 0.1 to 10 parts by mass of a decane coupling agent. 如申請專利範圍第18或19項所述之硬化性樹脂組成物,其中,相對於100質量份之如申請專利範圍第1至14項中任一項所述之有機聚矽氧烷,又含有0.001質量份以下之(d)矽氫化反應催化劑。 The sclerosing resin composition according to claim 18, wherein the organic polyoxane according to any one of claims 1 to 14 is further contained in an amount of 100 parts by mass. 0.001 parts by mass or less of (d) hydrazine hydrogenation catalyst. 如申請專利範圍第18或19項所述之硬化性樹脂組成物,其中,相對於100質量份之如申請專利範圍第1至14項中任一項所述之有機聚矽氧烷,又含有0.1至500質量份之無機氧化物。 The sclerosing resin composition according to claim 18, wherein the organic polyoxane according to any one of claims 1 to 14 is further contained in an amount of 100 parts by mass. 0.1 to 500 parts by mass of the inorganic oxide. 一種光半導體用密封材,其包含如申請專利範圍第18至22項中任一項所述之硬化性樹脂組成物。 A sealing material for an optical semiconductor, comprising the curable resin composition according to any one of claims 18 to 22. 一種光半導體用晶片接合材(die bonding material),其包含如申請專利範圍第18至22項中任一項所述之硬化性樹脂組成物。 A die bonding material for an optical semiconductor, comprising the curable resin composition according to any one of claims 18 to 22. 一種塗覆材,其包含如申請專利範圍第18至22項中任一項所述之硬化性樹脂組成物。 A coating material comprising the curable resin composition according to any one of claims 18 to 22. 一種奈米模印用硬化性樹脂組成物,其包含如申請專利範圍第18至22項中任一項所述之硬化性樹脂組成物。 A curable resin composition for a nano-imprint, which comprises the curable resin composition according to any one of claims 18 to 22. 一種印墨,其包含如申請專利範圍第18至22項中任一項所述之硬化性樹脂組成物及著色劑。 An ink comprising the curable resin composition according to any one of claims 18 to 22, and a coloring agent. 一種光半導體封裝體,係以如申請專利範圍第23項所述之光半導體用密封材而成形。 An optical semiconductor package formed by using a sealing material for an optical semiconductor according to claim 23 of the patent application.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI731956B (en) * 2016-03-31 2021-07-01 日商太陽油墨製造股份有限公司 Curable resin composition, dry film, cured product, and printed wiring board

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624236B1 (en) * 1998-12-24 2003-09-23 3M Espe Ag Cyclosiloxane-based cross-linkable monomers, production thereof and use thereof in polymerizable materials
TW200906916A (en) * 2007-04-17 2009-02-16 Asahi Kasei Chemicals Corp Epoxy silicone and method for producing the same, curable resin composition and use thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624236B1 (en) * 1998-12-24 2003-09-23 3M Espe Ag Cyclosiloxane-based cross-linkable monomers, production thereof and use thereof in polymerizable materials
TW200906916A (en) * 2007-04-17 2009-02-16 Asahi Kasei Chemicals Corp Epoxy silicone and method for producing the same, curable resin composition and use thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI731956B (en) * 2016-03-31 2021-07-01 日商太陽油墨製造股份有限公司 Curable resin composition, dry film, cured product, and printed wiring board

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