TWI469284B - Cooling systems incorporating heat transfer meshes - Google Patents

Description

Cooling system combined with heat transfer network

The present invention generally relates to effective cooling of devices, such as electrical devices, and more particularly to high efficiency heat conducting members, including wire meshes, which can define tortuous flow path channels for coolant fluids, and electrical devices or packages thereof In a close combination.

There is a need in the industry for efficient, compact, and simple heat transfer members, as described above. The prior thermal technology and devices provided for this cooling lack the unique advantages provided by the devices disclosed herein in terms of structure, function, and results.

It is a primary object of the present invention to provide a simple and elegant heat transfer device that meets the above needs. Basically, the improved apparatus comprises: a) a structure comprising a hollow body and defining a cavity for receiving a cooling fluid, b) the structure defining an opening or passage whereby the cooling fluid and the package are Direct contact is established to conduct heat from the package to the fluid contained within the cavity, a thermal connection wire is disposed in the flow path of the coolant fluid, c) and a member for the fluid Cycling to conduct heat to a heat conducting member for removing heat from the fluid.

Another object includes the arrangement of a wire structure, such as a micro-wire, associated with the aperture or channel described above, disposed in the fluid circulation path to enhance the heat transfer as the fluid flows through the tortuous path defined by the wire. . The wire typically extends through or intersects the opening or channel and may have a Dutch braid pattern to define an efficient, tortuous coolant flow path or pattern. Additionally, one or more fluid enclosures are provided for closing the surface between the body and the package, and adjacent to the aperture.

Yet another object is to provide a pump for actuation to displace the fluid along a circulation path and associated with the aperture. In this regard, the pump can be exposed to the fluid within the aperture, or within the aperture, and preferably has a moving surface that acts as a fluid shear surface during pumping. A pump motor can be disposed outside of the aperture and magnetic coupling can provide torque transmission from the motor to the pump.

Still another object includes providing a housing for the body and the motor, a plurality of housings disposed on the housing to receive heat from the fluid to the housing, and for moving the cooling gas to the fins The piece is a component of the cooling relationship.

Still another object includes providing a heat transfer device comprising: a) a heat source from an electrical device and having a thermally conductive surface, b) a wire mesh extending adjacent the surface to receive heat conducted therefrom, The wire comprises a particular line and other lines, the particular and other lines forming a slit, c) and a member for conveying a coolant fluid substantially parallel to the wire for flow through the slot to receive The heat transmitted by the cable.

It can be seen that the coolant fluid can be guided to flow in and parallel to the wire; a second heat transfer wire can be provided for receiving the coolant fluid; and a heat receiver having cooling fins can be The second network cable receives heat.

The above and other objects and advantages of the present invention, as well as the details of the illustrated embodiments, are fully understood from the following description and drawings.

The present invention incorporates a range of technologies that can substantially increase power density and information transfer rates within electronic and microelectronic systems and subsystems. These increases are provided by the use of braided wire meshes composed of electronic conductors and the transport of fluids in intimate contact with the heat generating zone through passages created by one or more wire wires. The substantial increase in heat transfer rate and compliance interposer further enhances the feasibility of using one or more thin semiconductor dies and dies with two sides. The invention can be used in conjunction with microelectronics, micromotors, and/or microfluidic components/arrays.

The present invention can achieve increased reliability and durability in addition to process enhancement by reducing operating temperatures and thermal gradients and by providing increased mechanical compliance.

The improved network cable can be used with existing two-, one-half, three-dimensional electronic packaging and interconnection processes, including computing, power electronics, and lighting in applications.

Current electronic products and systems have limited ability to efficiently deliver heat to the surrounding environment. The present invention conducts heat from the active area of the die to the surrounding area by referring to the woven wire and the one or more semiconductor dies in plane and in close proximity, flowing the fluid into the plane of the wire and the die. Environment to seek to resolve this issue.

The cooling fluid includes liquids, vapors, and/or gases, and phase changes can be utilized to assist in heat transfer. Useful internal heat transfer fluids include water, alcohol, polyalphaolefins, polyethyl ethers, polyethyl siloxanes, and FLUORINERT brand fluorinated liquids such as those sold by 3M Company.

Pumping mechanisms include positive displacement, power and shear. The use of micro-motor pumping mechanisms such as the piezoelectric effect is an attractive option. The pump can be integrated with the electronics to be cooled or can be located at the far end as part of a modular system. A single pump can be used to deliver fluid to a number of electronic modules.

The wire web can substantially increase the effective area for heat transport, and create one or more tortuous paths with a very small effective edge layer, thereby substantially increasing the heat transfer rate from the die to the heat transfer fluid.

The desired wire mesh can also serve as an electronic power and/or communication conduit, and thereby provide increased power density and communication rates. The wire mesh is typically made of a high conductivity metal wire, such as gold, silver, copper, and/or aluminum, and can be plated to enhance paint adhesion and/or improve electrical communication and/or assistance to the contact area. Processes such as soldering, wire bonding and/or bonding. The wires can be woven into a square or triangular array and typically have a thin dielectric coating to prevent electrical communication other than those desired. Dielectric coating options include inorganic materials such as oxides, nitrides, and/or glasses, and/or organic coatings such as parylene and/or commodity coatings such as those used in "magnet wires." Dielectric coatings can be removed from areas requiring electrical communication by means of lasers and grinding. Electrical communication for the contact area can be achieved by means of pressure contact, electrical conductive bonding, soldering, conjugate bonding, microsplicing, and wire bonding.

An X-Y gate (row array) conductor is selectively electrically communicable from its edge (line end) to any individual X-Y point, ie each X-Y point (node) contains a diode or X and Y One or more switching elements between the conductors. The diodes and/or one or more switching elements can be attached to the network cable and/or attached to adjacent dies, and/or as an integral part of the dies circuit and at each node It is electrically connected to the X and Y lines of the network cable. The nodes can be adapted to semiconductor emitters and/or detectors, such as laser or light emitting diodes (LEDs), to provide the network line nodes and/or network lines to the die and/or die to crystal The particles and/or grains are communicated back and forth to the high data rate between the remote elements.

A network consisting of an X-Y grid line and having no diodes or switches at the nodes, and insulated to prevent contact at the point of intersection, in addition to being a compliant interposer and providing increased heat transfer, is available Providing power and communication to the die on one or both sides of the network cable. One possible configuration is to make the array of lines in one axis as the power line tube and the line array in the other axis as the electrical communication line tube. Many variations can be implemented through systems such as multiplexed and diode-free network cables that allow for the use of complex electrical interactions that are more similar to the animal's central nervous system (neural network) than general digital electronic systems.

Electrical

Braided wire mesh provides a finer spacing than a ball grid array (BGA), a pin grid array (PGA), a contact grid array (LGA), or a wire bond. The insulated metal wire can be used with a diameter of less than 0.0005 吋. Braided wire screens can be used in the wire, which is sufficient to provide more than one million individual addressable nodes per square inch (>1500/mm2) in systems including diodes or semiconductor switches such as node transistors. The braided wire grid can be made by varying the spacing along the axis. The Dutch net can be made by the difference in the size of the distance between the axes. This configuration provides more efficient power to a grid through the coarse pitch of a larger cross-section conductor and the fine pitch of a smaller cross-section conductor.

The tight grain spacing achieved by the present invention means that the length of the electrical communication path is substantially reduced, and this further results in a higher data transfer rate.

The braided wire mesh can be much finer than the corresponding contact array on the die, and thereby achieve a large alignment tolerance while still ensuring at least one line for electrical communication within the pads and/or wires The increased amount of wire is available to increase the choice of electrical communication.

One configuration uses one of the braided wire grids on the active side of the die for communication, and a backside gate is used to provide power through the through metal vias.

The braided wire mesh array can also be used as a single electrical conductor on one side of a die for providing power or as a ground and/or an EMI/RFI shield.

Temperature

The braided wire mesh can greatly increase the area for heat transfer.

The braided wire web can increase heat transfer by creating a narrow, tortuous fluid path, and thereby reduce the effective edge layer thickness and its associated thermal resistance.

The desired fluid motion of the present invention can be achieved by boiling anywhere in the fluid delivery system, which is similar to a typical or toroidal heat pipe, or the fluid can be forced to provide increased heat delivery by dynamic pumping. Heat from the system is typically conducted to the air stream there, and this can be increased by free convection or forced convection. High thermal conductivity can be achieved by forced convection cooling of the phase change (boiling) and forced convection cooling on the air side of the heat exchange system. For example, thermal conductivity of more than 10 瓩/cm 2 is possible. The high power density microprocessor used in personal computers has a thermal power density of 15 watts per square centimeter, and there are several problems with this level, such as the work of increasing the general power density associated with increasing the clock rate and the denser The ability of the transistor array to continue.

Sub-ambient cooling is attractive and required for specific electronic or optical electronic systems, and is achieved by the technology through technologies including compression refrigeration and thermoelectricity.

The present invention enables designers and product designators of electronic systems and subsystems to provide systems that efficiently deliver heat at very high rates, and through tighter packaging thereby reducing system cost, weight, and volume. For example, 3D packages have been used for memory grains in specific applications for many years, but are not costly and cannot be used for high power density dies, such as processors or power conversion devices. The present invention allows a high power density die to be stacked in multiple layers as needed while maintaining grain temperature consistent with high efficiency and long life.

Alternative high rate systems such as "microchannel cooling" do not provide an array of electrical conductors that have channel clogging that does not allow fluid to pass through, such as a braided wire mesh, and provide heat associated with the integrated circuit die. There is more difficulty in proper heat transfer for uniformity.

The wire grid can be selectively filled with a polymer to assist in flow organization, for example, to optimize heat transfer in a non-uniform heat receiving device.

Mechanical / structural

Temperature-mechanical failures are often cited as the primary failure mechanism in microelectronics and optoelectronic subsystems. Thermal cycling, temperature gradients, and differences in thermal expansion between adjacent components are contributing factors.

The braided wire mesh of the present invention is subjected to fragmentation and/or plastic deformation as a mechanically compliant interposer between the die and/or between the die and other components such as a circuit board or end plate. Metal and wire and array temperature and mechanical history for use in wire arrays can be selected to provide mechanical compliance. Other compliance may be through the use of multiple strands, compliant dielectric coatings, and/or by using a conductive polymer or conductive coated polymer wire/filament in one or more axes, and/or This is achieved by the use of very thin grains to allow for elastic deformation of the in-line contact area, and/or by the use of an elastic layer between a braided wire and one of the inactive sides of the die or against an inactive element.

The use of pressure-type contacts can further reduce thermomechanical failures and greatly simplify the modifications.

Thermoplastic and/or thermoset polymers/elastomers can be integrated with such wires to increase mechanical stability and/or compliance.

Alignment is one of the major events in 3D electronics. Many 3D processes require wafer alignment prior to severing. The alignment method proposed by the present invention assumes that the die and die are aligned in alignment with the die, rather than wafer-to-wafer or die-to-die alignment. The proposed method includes self-alignment through the surface tension of the solder. This institution is generally used for BGAs. The integrated circuit die typically has only one active surface, and the surface can be aligned with the wire mesh by means of a fixture that secures the wire and allows the die above and below the wire to pass through the surface of the molten solder. Tension to accommodate the cable.

A network cable having a much smaller distance than the die bond pad. This principle can be applied to anisotropic conductive members.

Mechanical through-hole and / or grooved minimum limit fasteners. The wires may have open areas for alignment stitches, mechanical, electrical, optical, and/or fluid through holes.

An optical method for aligning wafers to wafers for bonding.

A combination of the above.

Detailed description

In Fig. 1, an electrical component or structure, such as a die or wafer 10 in a microprocessor, produces heat as indicated by heat conduction arrow 11. After flowing through a heat spreader layer 12, the heat preferably flows to a mesh layer 13 adjacent to layer 12. The wire may extend or conductively contact the side 12a of the layer 12 in a thermally conductive relationship for efficient heat transfer, such as conduction. Figure 1a discloses elements 10, 12 embedded or partially embedded or sunk into the wire layer 13 to conduct heat to the wire and to the coolant fluid.

The coolant fluid, indicated at 14, flows into and through the wire, generally in the plane of the wire, and through the gaps between the wires, and below the wires, to effectively transfer heat from the mesh The wire is removed, thereby allowing the die or wafer 10 to be effectively cooled by a combination of simple and extremely compact components. Furthermore, the coolant is guided by the wire to flow into a plurality of meandering flows in a hot frictional relationship with the side or surface 12a of the heat sink. Please refer to the air flow arrow 14a in Figure 1a. Therefore, the heat is extracted by the coolant in two ways; the meandering flow contacts the wire and the meandering flow contacts the surface 12a of the heat sink. The heat sink can be omitted and the side 10a of the die or wafer can be in contact with the wire, as shown in Figure 1a. The heat sink 12 can be composed of one or more good thermally conductive metals, such as copper and/or tantalum, or alloys thereof. Pump 90 is controlled at number 91 to achieve lateral flow 14 within the wire. A pump 90 can be disposed within the aperture 92 and magnetically coupled to a motor 93 outside of the recess.

The flow of the coolant fluid, such as air, can be directed to the edge direction, i.e., in the transverse direction and in the plane of the wire, for example by the tube wall faces 15, 16 of the opposite sides of the wire, the conduit elements are labeled 15b, 16b. The wall 15 may define an opening 15a for receiving the heat sink to contact one side of the wire layer as shown. The composition of the network cable can be referred to as above. The walls 15, 16 may be thermally insulating. A closure member 18 can be used and disposed at the edge of the opening 15a, that is, between the surface 12b of the heat sink 12 and the surface 15a of the wall surface 15 to prevent coolant from escaping from the slit formed by the mesh wires. .

The heat contained in the coolant is then removed by conduction to the ambient air outside the device. For example, reference is made to a preferred heat removal member in the form of a second wire layer 25, or an extension 13a extending adjacent to, and preferably in thermal conductive contact with, the body 26 having fins 27. Heat flows from the heated coolant passing through the mesh layer 25 in the edge direction to the mesh wires, and then to the body 26 and the fins 27. Heat also flows directly from the coolant to the surface 26a of the body 26. The heat is removed from the fins by conduction to air, and the air is driven by the motor 29 to drive the fins 28 toward the fins. The conduit wall faces 30, 31 extending on opposite sides of the wire layer 25 limit the coolant to the plane of the wire 25 or 13 flowing in the edge direction.

These network cables can be used to carry current, such as for communication or other circuit purposes. Please refer to the input or output line 44 connected between the network cable 42 and the external communication circuit 43. The network wires 42, 45 are interlaced and extend in the X and Y transverse directions. These wires can be electrically insulating but not thermally insulating. Line 42 can be used for electrical communication or line 45 can be used as a power line.

Shear pumps are preferred, in part because they can provide high pressure in a single stage and can serve as a heat exchanger for effectively sweeping surfaces, in addition to being a very delicate potential factor.

A pumping system incorporating a single glass disc rotor has been fabricated and tested, and is advantageously characterized by the following: rotor stability : the gap between the rotor and the mating stator must be extremely small, especially with very low Viscosity fluids such as 3M Fluorinerts require accurate fabrication and a multi-bearing hub. This can be a positive feedback loop (Bernoulli effect) which progressively draws the rotor towards a certain sub-region by a slightly smaller rotor-stator gap, thereby increasing the fluid viscosity everywhere.

Rotor heat transfer : If one side of the rotor acts as a hot side sweep surface heat exchanger and the other side of the rotor acts as a cold side sweep surface heat exchanger, the rotor should conduct heat from one side to the other side Minimize to a minimum.

Rotor durability : Glass rotors provide low cost, low thermal conductivity, and high stiffness in materials. A spiral power pump is preferred.

2 discloses a coolant fluid pump 60 disposed between the edge streamline 61 (corresponding to the mesh 13) and the substantially larger edge streamline 62 (corresponding to the mesh 25). The pump has gears 63, 64 and rotates with the intermeshing teeth to create a positive displacement flow of coolant fluid that flows through the first wire 61 in the edge direction, and then to the wire tube 65 and the second wire 62 to Flow back to the inlet of the pump. The network cable 61 is a heat source side heat exchanger, and the network cable 62 is a heat radiation side heat exchanger. This structure corresponds functionally to FIG. 1 and the fins 66 correspond to the fins 27.

Figure 3 is similar to Figure 2 except that it uses a shear pump motor 68 in place of the positive displacement gears. The flow in the edge direction within the planar mesh lines 69, 70 corresponds to the flow within the mesh lines 61, 62.

Figure 4 illustrates a modular system that is supported on a computer or other electronic device, such as motherboard 75. The heat source cable (e.g., 13) is housed in a container 77 disposed on the heat source circuit assembly 76 to be cooled; and the heat sink wire is in the container 77 on the motherboard 75. The cooling fins (such as 27) are located at 78. The coolant flows through the conduit 80 from the wire in the 76 to the wire in the 77; and the coolant flows from a pump 82 in the fin structure 78 to the wire in the 77 or through a conduit 81.

Figures 5-11 disclose various network cable weaves, which are identified as follows: Figure 5: Network cable 90 Figure 6: Network cable 91 Figure 7: Network cable 92 Figure 8: Network cable 93 Figure 9: Network cable 94 Figure 10: Network cable 95 Figure 11: Network cable 96 (please note the ball 116)

The invention includes within its scope a microchannel array produced by a woven mesh and fluid flows in the plane of the mesh.

The braided wire array adds an additional dimension to the fluid stream, thereby allowing the fluid to steer on the side of the obstacle that may cause blockage of the microchannels. The wires also act as a microfluidic static mixer and periodically contact the fluid stream with the first barrier layer and subsequently another barrier layer. The increased flow capability of the planar 2D to 1D provides for the creation of systems including obstacles such as through holes for electrical, mechanical, structural, fluid, temperature, and/or optical purposes.

Braided wire mesh can be obtained from a variety of materials, wire mesh sizes and woven styles. The copper wire screen cloth is a low-cost commodity material and it is three times the thermal conductivity of the crucible, and can be modified in a wide range of processes, including annealing, bending, punching, brazing, rolling, electrical discharge machining, Etching, insert molding, milling, planing, punching, rolling, shearing, welding, stamping, tempering, and welding.

The braided wire can act as a mechanical/structural buffer between the materials of the greatly different coefficients of thermal expansion. This is a significant benefit because thermomechanical failure is the main failure structure in microelectronics.

The braided wire mesh provides a higher thermal conductivity of the material, a better thermal coupling to the die, and a substantially increased heat transfer area ratio, with a heat transfer per unit pumping power of 10 times that of the microchannel array.

The present invention provides a semiconductor die having an integrated circuit on both sides of the die by providing a novel and more practical method of heat transfer and power transfer.

The increased heat transfer rate should be considered as a basic item in the enhanced process in the electronics industry, rather than an emergency measure to reduce the operating temperature of critical components. In many cases, the increased heat transfer rate is far more cost effective than alternatives. Microprocessors and graphics processors are examples of products that can be operated at significantly increased rates and closer by improved heat transfer.

The present invention provides a method for transporting heat from an active area of a semiconductor by placing the network line close to or in contact with the active area and flowing fluid into the plane of the network lines, with substantially reduced thermal resistance and substantially increased heat transfer rate. Go to the surroundings.

The invention provides a low-cost heat transport system that provides high thermal conductivity and heat transfer rate, which can dramatically accelerate the development of 3D electrons and lead to the recovery of the benefits and development of semiconductor materials, which were partially neglected due to temperature considerations. .锗 is an example of an electronic material option, and cadmium selenide and zinc selenide are examples of optoelectronic material options, the benefit of which comes from the improved thermal state provided by the present invention.

Electronic integrated circuits are typically produced on thin flat substrates which provide a short path thermal communication path. The 3D electronic components are achieved by stacking of semiconductor dies to facilitate reducing system volume and/or reducing problems associated with long electronic path lengths. 3D electronic components traditionally include an active die (high electrical and temperature power density) and a plurality of passive die (low electrical and temperature power density) to provide a die sufficient to maintain a reasonable lifetime The heat transfer rate of the temperature. The present invention allows for extremely large groups of extremely high power density dies to be placed in an extremely tight manner, thereby resulting in substantially reduced cost, quality, and volume for the fabrication of processing, communications, and power conversion systems. In addition to the thermal issues associated with 3D electronic systems, it also requires manufacturing because of its limited difficulty and ability to modify associated with large amounts of communication and required power delivery connections. The present invention overcomes these conventional limitations and provides the designer with access to a large number of locations on one or both sides of each die through a slotted network cable that provides periodic electronic and/or proton conduits to Conveniently coupled to the input and/or output circuitry by extending the wire beyond the edge of the die.

Methods for providing mechanical compliance in the present invention include the use of elastic and/or plastically deformable metal mesh wires, wires composed of metal wires in an axis and polymer electrons and/or proton conductors in opposite axes and A wire consisting of polymer electrons and/or proton conductors in two axes.

Examples of materials for compliant metal mesh wires composed of metal wires in two axes include annealed copper, silver, and gold braided wire mesh cloths with suitable coating and/or plating. Compliance can be minimized by using polymer coating, metal plating, annealing, (continuous and/or periodic) perpendicular to the plane of the cover, and/or by use in the opposite axis. The difference between the elastic and plastic deformation is stronger than the line and/or by using a multi-wire conductor (bundle or strips).

Examples of materials for a compliant mesh composed of metal wires in one axis and polymer fibers in opposite axes include metal wires selected from the group consisting of copper, nickel, silver, and gold and have suitable coating and / or electroplating, while the polymer fibers in the opposite axis are selected from the group consisting of acrylic acid, polyfluorene oxide, urethane, and polymethylpentene.

Examples of the material of the compliant mesh composed of the polymer fibers in the two axes include polymers such as acrylic acid, polyfluorene oxide, urethane, and polymethylpentene. Polymer fibers can be used as electronic and/or proton tubes. The electrical conductivity within the polymer fibers can be achieved by the use of intrinsically conductive polymers, carbon addition, linear or spiral wound metal wires, and/or conduction including transparent electrically conductive coatings such as indium tin oxide. Increased in coatings/plating.

The enclosure for the assembly may be constructed of metal, polymer, ceramic, and/or glass, and the system incorporating the assembly may be divided into modular components or tightly integrated with other components, including other components for fluids. A flow pump and a fan and fin row for transporting heat from the active zone to the surrounding environment.

Contact and communication between the integrated circuit die and the gapped network line can be provided by conventional techniques, such as soldering and/or through pressure type contact. Pressure-type contact can be achieved by elastoplastic deformation of an external spring or screw and/or a gapped wire.

10. . . Die or wafer

10a. . . Wafer side

11. . . Heat conduction arrow

12. . . Radiator layer

12a. . . Radiator layer side

12b. . . Radiator surface

13,25. . . Network layer

13a. . . Extension

14. . . Coolant fluid

14a. . . Air flow arrow

15, 16, 30, 31. . . Wire wall

15a. . . Opening/surface

15b, 16b. . . Wire tube component

18. . . Closure

26. . . main body

26a. . . Body surface

27, 66, 78. . . Fin

28. . . fan

29, 93. . . motor

41, 44. . . Input/output line

42, 45, 90-96. . . cable

43. . . External communication circuit

60. . . Coolant fluid pump

61. . . Edge mobile network cable

62. . . Larger edge mobile network cable

63, 64. . . gear

65, 80, 81. . . Line tube

68. . . Shear pump rotor

69, 70. . . Flat network cable

75. . . motherboard

76. . . Heat source circuit assembly

77. . . container

82, 90. . . Pump

91. . . control

92. . . hole

116. . . Bonding ball

1 is a perspective view of a preferred form of the invention; FIG. 1a is a perspective view of an electrical package, such as a wafer embedded in a wire; FIGS. 2-4 reveal other forms of the invention, and/or A part; Figure 5-11 reveals the mesh weave structure.

10. . . Die or wafer

10a. . . Wafer side

11. . . Heat conduction arrow

12. . . Radiator layer

12a. . . Radiator layer side

12b. . . Radiator surface

13,25. . . Network layer

13a. . . Extension

14. . . Coolant fluid

15, 16, 30, 31. . . Wire wall

15a. . . Opening/surface

15b, 16b. . . Wire tube component

18. . . Closure

26. . . main body

26a. . . Body surface

27. . . Fin

28. . . fan

29, 93. . . motor

41, 44. . . Input/output line

42, 45. . . cable

43. . . External communication circuit

90. . . Pump

91. . . control

92. . . hole

Claims (37)

A device for cooling an electrical component package, the combination comprising: a) a structure including a hollow body and defining a cavity for receiving a cooling fluid, b) the structure defining an opening or passageway Directly contacting the cooling fluid with the package is established to conduct heat from the package to the fluid contained within the cavity, c) a wire that is configured to enhance the heat transfer, d) and Recycling a member of the fluid for conducting heat to another heat conducting member for removing heat from the fluid, e) and including a fluid enclosure disposed between the plurality of surfaces defined by the body and the package And adjacent to the opening. The apparatus of claim 1 wherein the member includes a pump for actuating to displace the fluid along a circulation path and associated with the aperture. The device of claim 2, wherein the pump is exposed to the fluid within the aperture. The device of claim 3, wherein the pump has a moving surface as a fluid shear surface. The device of claim 3, comprising a motor disposed outside the aperture for driving the pump. The device of claim 5, comprising magnetic coupling between the motor and the pump. The device of claim 5, comprising a housing for the main body and the motor, a plurality of housings disposed on the housing for receiving heat from the fluid to the housing, and for moving The cooling fluid is in a cooling relationship with the fins. A heat transfer device comprising: a) a heat source from an electrical device and having a thermally conductive surface, b) a wire mesh extending adjacent the surface to receive heat transferred therefrom, the wire comprising a specific Lines and other lines, the particular and other lines forming a slit, c) and a transfer member for conveying a coolant fluid substantially parallel to the wire for flow through the slot to receive from the wire Conducting heat, d) and comprising a second heat conducting wire for receiving the coolant fluid flowing from the first wire and another member for conducting heat of the second wire, e) And the further member includes a coolant fluid passing through the second wire and is substantially parallel to a plane defined by the second wire. The heat transfer device of claim 8, wherein the member comprises a plurality of fins, heat can be conducted therethrough from the fluid that has passed through the second wire, and a fan that circulates air through the fins. A heat transfer device comprising: a) a heat source from an electrical device and having a thermally conductive surface, b) a wire mesh extending adjacent the surface to receive heat transferred therefrom, the wire comprising a specific Lines and other lines, the particular and other lines forming a slit, c) and a transfer member for conveying a coolant fluid substantially parallel to the wire for flow through the slot to receive from the wire Heat of conduction, d) wherein the network cable is a first network cable, and includes a second network cable for receiving the coolant fluid from the first network cable to receive heat therefrom and for Heat is transferred to the heat dissipating member, e) and wherein the first network cable is substantially planar, and the coolant fluid flows in one or more of its planar ranges within the mesh line, and the second network cable is substantially planar, and The coolant fluid flows within the wire in one or more of its planar extents. The heat transfer device of claim 10, wherein the second network cable is one of: i) spaced apart from the first network cable, and ii) being an extension of the first network cable. The heat transfer device of claim 10, comprising a fluid coolant pump disposed between the first and second network wires. The heat transfer device of claim 10, wherein at least one of the first and the second wire has an interlaced bundle to form a slit through which the coolant fluid flows. The heat transfer device of claim 13, wherein the interlaced bundles comprise a plurality of sliver beam thermal conductors. The heat transfer device of claim 13, wherein the bundles form one of: i) a Dutch weave pattern, ii) a diamond weave pattern; iii) a triaxial weave pattern. A heat transfer device according to claim 13 comprising a splice ball disposed on a particular bundle. A device for cooling an integrated circuit having a package, the device being attachable to the integrated circuit and having a hollow body, wherein a cavity formed by the hollow body receives fluid for passage therethrough Cooling the integrated circuit with an opening, and achieving contact between the cooling device and the integrated circuit at the surface The fluid is in direct contact with the package of the integrated circuit. The device of claim 17, wherein the flow system moves within the aperture by a pump. The device of claim 18, wherein the pump is driven by magnetic coupling to an external motor. The device of claim 17, wherein the opening of the aperture is substantially circular and includes a seal disposed between the integrated circuit and the aperture of the cooling device, the seal being established by an O-ring. The device of claim 17, wherein a microscopic wire covers the opening of the aperture. The device of claim 21, wherein the microscopic mesh uses a Dutch weave pattern. The device of claim 21, wherein the microscopic mesh uses a diamond weave pattern. The device of claim 21, wherein the microscopic mesh uses a triaxial weave pattern. The device of claim 21, wherein the micro-network wire uses a weave pattern having a secondary conductor. The device of claim 21, wherein the microscopic mesh uses a weave pattern having attached bonding balls. The device of claim 21, wherein the flow system moves within the aperture by a pump disposed within the aperture. The device of claim 27, wherein the pump is driven by magnetic coupling to an external motor. The device of claim 21, wherein the pump is a displacement pump. The device of claim 21, wherein the pump has a shear surface. The device of claim 19, wherein the external motor drives a fan, the fan will be empty The gas is displaced by cooling the fins to receive heat conducted from a wire passing through the cooling fluid. The apparatus of claim 31, wherein the cooling stream system has a low viscosity of carbon fluoride. The device of claim 17, comprising a network cable adjacent to the aperture and having a line and circuitry for electrically communicating with at least some of the network lines. A heat transfer device comprising: a) a heat source from an electrical device and having a thermally conductive surface, b) a wire mesh extending adjacent the surface to receive heat transferred therefrom, the wire comprising a specific Lines and other lines, the particular and other lines forming a slit, c) and a transfer member for conveying a coolant fluid substantially parallel to the wire for flow through the slot to receive from the wire Heat of conduction, d) wherein the network cable is a first network cable, and includes a second network cable for receiving the coolant fluid from the first network cable to receive heat therefrom and for Heat is conducted to the heat dissipating member, e) and wherein the heat dissipating member includes another fluid operable to change the phase state upon receiving heat from the cooling fluid. A heat transfer device comprising: a) a heat source from an electrical device and having a thermally conductive surface, b) a wire mesh extending adjacent the surface to receive heat transferred therefrom, the wire comprising a specific Lines and other lines, the particular and other lines forming a slit, c) and a transfer member for conveying a coolant fluid substantially parallel to the wire for flow through the slot to receive from the wire Conducting heat, d) and including a second heat transfer network wire for receiving flow from the first wire The coolant fluid, and another member for thermally conducting the second wire, e) and comprising a polymer, selectively filling at least one or more portions of at least one of the wires Inside, for the cooling fluid to flow and organize. A heat transfer device comprising: a) a heat source from an electrical device and having a thermally conductive surface, b) a wire mesh extending adjacent the surface to receive heat transferred therefrom, the wire comprising a specific Lines and other lines, the particular and other lines forming a slit, c) and a transfer member for conveying a coolant fluid substantially parallel to the wire for flow through the slot to receive from the wire Heat of conduction, d) wherein the network cable is a first network cable, and includes a second network cable for receiving the coolant fluid from the first network cable to receive heat therefrom and for Conducting heat to the heat dissipating member, e) wherein the first wire is substantially planar, and the coolant fluid flows in one or more of its planar ranges within the wire, and the second wire is a planar shape, and the coolant fluid flows in one or more of its planar ranges within the wire, f) a fluid coolant pump disposed between the first and second wire, g) and The pump has a glass disc rotor. A cooling device for an electrical component package, the combination comprising: a) a structure including a hollow body defining a cavity for receiving a cooling fluid, b) the structure defining an opening or passageway Directly contacting the cooling fluid with the package is established to conduct heat from the package to the flow contained within the cavity Body, c) a wire provided to enhance the heat transfer, d) and means for circulating the fluid for conducting heat to another heat conducting member e for removing heat from the fluid and wherein The package is at least partially embedded or sunk into the network cable.