TWI463497B - Memory access method and flash memory using the same - Google Patents

Memory access method and flash memory using the same Download PDF

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TWI463497B
TWI463497B TW100140945A TW100140945A TWI463497B TW I463497 B TWI463497 B TW I463497B TW 100140945 A TW100140945 A TW 100140945A TW 100140945 A TW100140945 A TW 100140945A TW I463497 B TWI463497 B TW I463497B
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memory
period
string
memory cell
strings
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TW201320083A (en
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Chung Kuang Chen
Shuo Nan Hung
Chun Hsiung Hung
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Macronix Int Co Ltd
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記憶體存取方法及應用其之快閃記憶體Memory access method and flash memory using the same

本發明是有關於一種記憶體存取方法,且特別是有關於一種應用於快閃記憶體陣列中之記體存取方法。The present invention relates to a memory access method, and more particularly to a method of object access applied to a flash memory array.

在科技發展日新月異的現今時代,非揮發性記憶體裝置係被廣泛地應用在多種電子產品中;舉例來說,快閃記憶體為最為廣泛使用之非揮發性記憶體之一。一般來說,快閃記憶體中之記憶胞係具有可編程的臨界電壓,此可編程的臨界電壓係用以指示此記憶胞中儲存的資料數值。In today's fast-changing world of technology, non-volatile memory devices are widely used in a variety of electronic products; for example, flash memory is one of the most widely used non-volatile memories. Generally, the memory cell in the flash memory has a programmable threshold voltage, and the programmable threshold voltage is used to indicate the value of the data stored in the memory cell.

隨著高儲存容量快閃記憶體的需求與日俱增,具有三維結構之快閃記憶體陣列係已被開發出來。然而,傳統記憶體存取方法往往會面臨資料存取精確度問題。據此,如何設計出可克服傳統方法所面臨的資料存取不精確的問題,為業界不斷致力的方向之一。With the increasing demand for high-storage flash memory, flash memory arrays with three-dimensional structures have been developed. However, traditional memory access methods often face data access accuracy issues. Based on this, how to design the problem of inaccurate data access that can overcome the traditional methods is one of the directions that the industry is constantly striving for.

本發明有關於一種記憶體存取方法,其係應用於記憶體控制器中,以針對記憶體陣列進行存取,其中記憶體陣列包括多個記憶胞,此些記憶胞係排列成多個記憶胞串,由列選擇(String Select)訊號來進行控制。本發明相關之記憶體存取方法首先在設定期間中提供記憶胞串偏壓訊號及選擇字元線(Word-line)訊號,以決定選擇記憶胞串上之選擇記憶胞;在設定期間中,本發明相關之記憶體存取方 法更將記憶體陣列中其餘之記憶胞偏壓為導通傳輸記憶體(Pass Transistor)。本發明相關之記憶體存取方法在針對選擇記憶胞進行讀取操作之前,提供放電路徑與各記憶胞串聯接,以消除其中至少一個未選擇記憶胞串上的耦合電荷。據此,相較於傳統記憶體存取方法,本發明相關之記憶體存取方法具有可有效地消除未選擇記憶胞串上之耦合電荷、避免耦合電荷影響選擇記憶胞的存取操作及實現較高的記憶體存取準確性的優點。The invention relates to a memory access method, which is applied to a memory controller for accessing a memory array, wherein the memory array comprises a plurality of memory cells, and the memory cells are arranged in a plurality of memories. The cell string is controlled by a String Select signal. The memory access method of the present invention first provides a memory cell string bias signal and a word line line (Word-line) signal during a set period to determine a selected memory cell on the selected memory cell string; during the set period, Memory accessor related to the present invention The method further biases the remaining memory cells in the memory array into a pass transit memory (Pass Transistor). The memory access method of the present invention provides a discharge path in series with each memory cell to perform a read operation on the selected memory cell to eliminate coupling charges on at least one of the unselected memory cell strings. Accordingly, compared with the conventional memory access method, the memory access method of the present invention has an access operation capable of effectively eliminating the coupling charge on the unselected memory cell string, avoiding the coupling charge affecting the selected memory cell, and realizing The advantage of higher memory access accuracy.

根據本發明之第一方面,提出一種記憶體存取方法,應用於記憶體控制器中,以針對記憶體陣列進行存取。記憶體陣列中之多個記憶胞排列為多個記憶胞串,其由列選擇(String Select)訊號進行控制。記憶體存取方法包括下列步驟。在設定期間中提供記憶胞串偏壓訊號至此些記憶胞串之選擇記憶胞串,並提供選擇字元線訊號至選擇記憶胞串之選擇記憶胞;提供多個未選擇字元線訊號至記憶體陣列中其餘之記憶胞,以使其被偏壓為導通傳輸電晶體;及在設定期間中提供放電路徑連接至此些記憶胞串,以消除其中至少一個未選擇記憶胞串上之耦合電荷。在讀取期間中致能列選擇訊號使得選擇記憶胞串經由金屬位元線(Metal Bit Line)連接至感測單元,並經由電壓感測機制(Voltage Sensing Scheme)來針對選擇記憶胞串上之選擇記憶胞進行讀取,其中讀取期間不與設定期間重疊(Overlapped)。According to a first aspect of the present invention, a memory access method is proposed for use in a memory controller for accessing a memory array. A plurality of memory cells in the memory array are arranged in a plurality of memory cell strings, which are controlled by a String Select signal. The memory access method includes the following steps. Providing a memory string bias signal to the selected memory cell string of the memory cell string during the set period, and providing a selected word line signal to the selected memory cell of the selected memory cell string; providing a plurality of unselected word line signals to the memory The remaining memory cells in the body array are biased to turn on the transmission transistor; and a discharge path is provided during the set period to connect to the memory cell strings to eliminate coupling charges on at least one of the unselected memory cell strings. The enable column selection signal during the reading period causes the selected memory cell string to be connected to the sensing unit via a metal bit line (Metal Bit Line) and is directed to the selected memory cell via a Voltage Sensing Scheme. The memory cell is selected for reading, wherein the read period does not overlap with the set period (Overlapped).

根據本發明之第二方面,提出一種快閃記憶體,包括感測單元、記憶體陣列及記憶體控制器。記憶體陣列包括 多個記憶胞,排列為多個記憶胞串,且由列選擇訊號進行控制。記憶體控制器耦接至記憶體陣列,記憶體控制器更決定設定期間及讀取期間,其中讀取期間不與設定期間重疊(Overlapped)。於設定期間中,記憶體控制器提供記憶胞串偏壓訊號至此些記憶胞串中之選擇記憶胞串,並提供選擇字元線訊號至選擇記憶胞串之選擇記憶胞;提供多個未選擇字元線訊號至記憶體陣列中其餘之記憶胞,使其被偏壓為導通傳輸電晶體;及提供放電路徑連接至此些記憶胞串,以消除此些記憶胞串中至少一個未選擇記憶胞串上之耦合電荷。於讀取期間中,記憶體控制器致能列選擇訊號使得選擇記憶胞串經由金屬位元線連接至感測單元,感測單元經由電壓感測機制來針對選擇記憶胞串上之選擇記憶胞進行讀取。According to a second aspect of the present invention, a flash memory is provided, comprising a sensing unit, a memory array, and a memory controller. Memory array includes A plurality of memory cells are arranged in a plurality of memory cell strings and controlled by column selection signals. The memory controller is coupled to the memory array, and the memory controller further determines a set period and a read period, wherein the read period is not overlapped with the set period. During the set period, the memory controller provides a memory string bias signal to the selected memory cell string in the memory cell string, and provides a selected word line signal to the selected memory cell of the selected memory cell string; providing multiple unselected The word line signal is sent to the remaining memory cells in the memory array to be biased to turn on the transmission transistor; and a discharge path is provided to connect to the memory strings to eliminate at least one unselected memory cell in the memory strings The coupled charge on the string. During the reading period, the memory controller enables the column selection signal such that the selected memory cell string is connected to the sensing unit via the metal bit line, and the sensing unit is configured to select the selected memory cell on the selected memory cell via the voltage sensing mechanism. Read it.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下:In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

本實施例之記憶體存取方法提供放電路徑來消除未選擇記憶胞串上的耦合電荷,以針對選擇記憶胞串上之選擇記憶胞實現精確度較高的存取操作。The memory access method of this embodiment provides a discharge path to eliminate coupling charges on the unselected memory cell strings to achieve a more accurate access operation for selecting memory cells on the selected memory cell string.

請參照第1圖,其繪示依照本發明實施例之快閃記憶體的方塊圖。快閃記憶體1包括記憶體陣列10、記憶體存取電路及記憶體控制器12。舉例來說,記憶體陣列10為三維NAND型記憶體陣列,其中包括多個記憶胞。部份之記憶胞係排列成多個記憶胞串,其係經由對應之多個選擇 開關耦接至一條相同的金屬位元線(Metal Bit-line)。Please refer to FIG. 1 , which is a block diagram of a flash memory in accordance with an embodiment of the present invention. The flash memory 1 includes a memory array 10, a memory access circuit, and a memory controller 12. For example, the memory array 10 is a three-dimensional NAND type memory array including a plurality of memory cells. Part of the memory cell line is arranged in a plurality of memory cell strings, which are selected by corresponding multiples The switch is coupled to a common metal bit line (Metal Bit-line).

請參照第2圖,其繪示乃記憶體陣列10之子區域的電路圖。舉例來說,記憶體陣列10包括金屬位元線MBL,其係被用來存取N個記憶胞串S_0、S_1、S_2、...及S_N-1,其中N為大於1之自然數。由N個記憶胞串S_0至S_N-1具有實質上相同的電路結構,接下來,係僅以其中之第i個記憶胞串S_i為例,來針對記憶胞串S_0至S_N-1做進一步的說明,其中i為大於或等於0,且小於N的整數。Referring to FIG. 2, a circuit diagram of a sub-area of the memory array 10 is shown. For example, memory array 10 includes metal bit lines MBL that are used to access N memory cell strings S_0, S_1, S_2, ..., and S_N-1, where N is a natural number greater than one. The N memory cell strings S_0 to S_N-1 have substantially the same circuit structure. Next, the ith memory cell string S_i is taken as an example to further the memory cell strings S_0 to S_N-1. Description, where i is an integer greater than or equal to 0 and less than N.

第i個記憶胞串S_i包括M個記憶胞MC(i,0)、MC(i,1)、MC(i,2)、...及MC(i,M-1)、列選擇開關SW_i、接地選擇開關SWG_i、PN二極體D_i及節點N_i。列選擇開關SW_i及接地選擇開關SWG_i係以金氧半(Metal Oxide Semiconductor,MOS)電晶體來實現,記憶胞MC(i,0)至MC(i,M-1)係以臨界電壓可編程的MOS電晶體來實現。列選擇開關SW_i的源極及汲極分別連接至金屬位元線MBL及記憶胞MC(i,M-1)的源極。PN二極體D_i的正端及負端分別連接至節點N_i及接地選擇開關SWG_i的汲極。接地選擇開關SWG_i的源極係連接至記憶胞MC(i,0)的汲極,而記憶胞MC(i,1)至MC(i,M-2)係依序地串接於記憶胞MC(i,0)的源極與記憶胞MC(i,M-1)的汲極之間。The i-th memory cell string S_i includes M memory cells MC(i, 0), MC(i, 1), MC(i, 2), ..., and MC(i, M-1), column selection switch SW_i , ground selection switch SWG_i, PN diode D_i and node N_i. The column selection switch SW_i and the ground selection switch SWG_i are implemented by a Metal Oxide Semiconductor (MOS) transistor, and the memory cells MC(i, 0) to MC(i, M-1) are programmable with a threshold voltage. MOS transistor is used to achieve. The source and drain of the column selection switch SW_i are connected to the metal bit line MBL and the source of the memory cell MC(i, M-1), respectively. The positive and negative terminals of the PN diode D_i are connected to the node N_i and the drain of the ground selection switch SWG_i, respectively. The source of the ground selection switch SWG_i is connected to the drain of the memory cell MC(i, 0), and the memory cells MC(i, 1) to MC(i, M-2) are sequentially connected in series to the memory cell MC. The source of (i, 0) is between the drain of the memory cell MC (i, M-1).

分別與記憶胞串S_0至S_N-1對應之列選擇開關SW_0至SW_N-1的控制端係接收列選擇訊號SSL,其中列選擇訊號SSL係被用來對所有之列選擇開關SW_0至SW_N-1進行整體控制。接地選擇開關SWG_0至SWG_N-1的控制端係接收接地選擇訊號GSL,其中接地選擇訊號 GSL係被用來對所有之接地選擇開關SWG_0至SWG_N-1進行整體控制。對應至相同x座標位置的各個記憶胞的控制端接收相同的字元線訊號,並受其之控制。舉例來說,記憶胞MC(0,0)、MC(1,0)、MC(2,0)、...、MC(N-1,0)對應至相同的x座標位置(x=0),而其均受控於相同的字元線訊號SWL_0。The control terminals of the column selection switches SW_0 to SW_N-1 corresponding to the memory cell strings S_0 to S_N-1 respectively receive the column selection signal SSL, wherein the column selection signal SSL is used to select the switches SW_0 to SW_N-1 for all the columns. Take overall control. The control terminals of the ground selection switches SWG_0 to SWG_N-1 receive the ground selection signal GSL, wherein the ground selection signal The GSL system is used to control all of the ground selection switches SWG_0 to SWG_N-1. The control terminals of the respective memory cells corresponding to the same x coordinate position receive and are controlled by the same word line signal. For example, memory cells MC(0,0), MC(1,0), MC(2,0),...,MC(N-1,0) correspond to the same x coordinate position (x=0 ), and they are all controlled by the same word line signal SWL_0.

請再次地參照第1圖。記憶體存取電路係連接至記憶體陣列10及記憶體控制器12,並受控於記憶體控制器12來對記憶體陣列10進行存取操作。舉例來說,記憶體存取電路包括汲極偏壓電路14a、Y多工器14b1、14b2、感測單元14c及X解碼器14d。汲極偏壓電路14a提供記憶胞串偏壓電壓VB至Y多工器14b1。舉例來說,記憶體陣列1係應用反相讀取機制(Reverse Read Scheme)來進行存取操作,其中記憶胞串偏壓電壓VB對應至高位準電壓(例如高於接地電壓GND)。Y多工器14b1耦接至記憶體控制器12,以對應地提供記憶胞串偏壓訊號CSL_0至CSL_N-1,其中記憶胞串偏壓訊號CSL_0至CSL_N-1其中之一對應至記憶胞串偏壓電壓VB,使得其對應之記憶胞串S_0至S_N-1其中之一被選擇為選擇記憶胞串;而記憶胞串偏壓訊號CSL_0至CSL_N-1中剩餘之N-1個記憶胞串偏壓訊號對應至接地電壓GND。舉一個例子來說,記憶胞串偏壓訊號CSL_0對應至記憶胞串偏壓電壓VB,而其他的N-2個記憶胞串偏壓訊號CLS_1至CSL_N-1對應至接地電壓GND;換言之,記憶胞串S_0係對應地被選擇為選擇記憶胞串。Please refer to Figure 1 again. The memory access circuit is connected to the memory array 10 and the memory controller 12, and is controlled by the memory controller 12 to perform an access operation on the memory array 10. For example, the memory access circuit includes a drain bias circuit 14a, Y multiplexers 14b1, 14b2, a sensing unit 14c, and an X decoder 14d. The drain bias circuit 14a supplies the memory string bias voltage VB to the Y multiplexer 14b1. For example, the memory array 1 performs an access operation by using a reverse read scheme in which the memory cell string bias voltage VB corresponds to a high level voltage (eg, higher than the ground voltage GND). The Y multiplexer 14b1 is coupled to the memory controller 12 to correspondingly provide the memory string bias signals CSL_0 to CSL_N-1, wherein one of the memory string bias signals CSL_0 to CSL_N-1 corresponds to the memory string. The bias voltage VB is such that one of the corresponding memory cell strings S_0 to S_N-1 is selected as the selected memory cell string; and the remaining N-1 memory cells of the memory string bias signals CSL_0 to CSL_N-1 The bias signal corresponds to the ground voltage GND. For example, the memory string bias signal CSL_0 corresponds to the memory string bias voltage VB, and the other N-2 memory string bias signals CLS_1 to CSL_N-1 correspond to the ground voltage GND; in other words, the memory The cell string S_0 is correspondingly selected to select a memory cell string.

X解碼器14d受控於記憶體控制器12來提供列選擇訊號SSL、接地選擇訊號GSL及字元線訊號SWL_0至SWL_M-1。舉例來說,字元線訊號SWL_0至SWL_M-1其中之一對應至選擇字元線電壓VS,以針對選擇記憶胞串上之一個選擇記憶胞進行讀取;而字元線訊號SWL_0至SWL_M-1中剩餘之M-1個字元線電壓對應至導通字元線電壓VP,使得記憶體陣列10中其他的記憶胞被偏壓為導通傳輸電晶體(Pass Transistor)。舉例來說,字元線訊號SWL_0對應至選擇字元線電壓VS,而字元線訊號SWL_1至SWL_M-1對應至導通字元線電壓VP。換言之,選擇記憶胞串中x座標位置等於0的記憶胞係被選擇為選擇記憶胞。The X decoder 14d is controlled by the memory controller 12 to provide the column selection signal SSL, the ground selection signal GSL, and the word line signals SWL_0 to SWL_M-1. For example, one of the word line signals SWL_0 to SWL_M-1 corresponds to the selected word line voltage VS for reading for one selected memory cell on the selected memory string; and the word line signals SWL_0 to SWL_M- The remaining M-1 word line voltages in 1 correspond to the turn-on word line voltage VP such that other memory cells in the memory array 10 are biased to turn on the pass transistor. For example, the word line signal SWL_0 corresponds to the selected word line voltage VS, and the word line signals SWL_1 to SWL_M-1 correspond to the on word line voltage VP. In other words, the memory cell line in which the x coordinate position in the selected memory cell string is equal to 0 is selected as the selected memory cell.

舉例來說,選擇字元線電壓VS的位元係與記憶體陣列10中各記憶胞MC(0,0)至MC(N-1,M-1)的臨界電壓位準相關。在一個實施例中,記憶胞MC(0,0)至MC(N-1,M-1)具有大於接地電壓GND之臨界電壓,而選擇字元線電壓VS係具有高於接地電壓GND之電壓位準。在其他實施例中,記憶胞MC(0,0)至MC(N-1,M-1)的臨界電壓亦可實質上等於接地電壓GND;而選擇字元線電壓VS可對應地具有與接地電壓GND實質上相同之電壓位準。在本實施例中,係僅舉例來對記憶胞MC(0,0)至MC(N-1,M-1)之臨界電壓高於接地電壓GND(即是選擇字元線電壓VS具有高於接地電壓GND之位準)的情形做說明,而記憶胞MC(0,0)至MC(N-1,M-1)之臨界電壓實質上等於接地電壓GND的情形可根據本實施例之揭露類推得到。For example, the bit line selecting the word line voltage VS is related to the threshold voltage level of each of the memory cells MC(0, 0) to MC(N-1, M-1) in the memory array 10. In one embodiment, the memory cells MC(0,0) through MC(N-1, M-1) have a threshold voltage greater than the ground voltage GND, and the selected word line voltage VS has a voltage higher than the ground voltage GND. Level. In other embodiments, the threshold voltage of the memory cells MC(0,0) to MC(N-1, M-1) may also be substantially equal to the ground voltage GND; and the selected word line voltage VS may have a ground connection correspondingly The voltage GND is substantially the same voltage level. In this embodiment, the threshold voltage of the memory cells MC(0, 0) to MC(N-1, M-1) is higher than the ground voltage GND (that is, the selected word line voltage VS is higher than that of the selected cell line VS). The case of the level of the ground voltage GND is explained, and the case where the threshold voltage of the memory cells MC(0, 0) to MC(N-1, M-1) is substantially equal to the ground voltage GND can be disclosed according to the embodiment. Analogy is obtained.

Y多工器14b2受控於記憶體控制器12來將經由金屬位元線MBL傳輸之記憶胞串電流C_0(例如是選擇記憶胞MC(0,0)的記憶胞電流)提供至感測單元14c,如此,可針對選擇記憶胞儲存之資料值進行偵測。舉例來說,感測單元14c係應用電壓感測機制(Voltage Sensing Scheme)來針對選擇記憶胞中之資料值進行偵測。The Y multiplexer 14b2 is controlled by the memory controller 12 to provide the memory cell string current C_0 (for example, the memory cell current of the selected memory cell MC(0, 0)) transmitted through the metal bit line MBL to the sensing unit. 14c, in this way, the data value of the selected memory cell can be detected. For example, the sensing unit 14c applies a Voltage Sensing Scheme to detect data values in the selected memory cells.

記憶體控制器12經由記憶體存取電路耦接至記憶體陣列10,並針對其中之選擇記憶胞串上的選擇記憶胞執行存取操作。舉例來說,記憶體控制器12可以狀態機(State Machine)的方式來實現於快閃記憶體1中。接下來係以存取選擇記憶胞為記憶胞MC(0,0)的操作實例,來針對記憶體控制器12的時序控制作進一步的說明。The memory controller 12 is coupled to the memory array 10 via a memory access circuit and performs an access operation for a selected memory cell on the selected memory string. For example, the memory controller 12 can be implemented in the flash memory 1 in a state machine manner. Next, the timing control of the memory controller 12 will be further described by an operation example of accessing the selected memory cell as the memory cell MC (0, 0).

請參照第3圖,其繪示乃第2圖的相關訊號時序圖。記憶體控制器12決定設定期間Tsetup 及讀取期間Tdevelop ,其中設定期間Tsetup 及讀取期間Tdevelop 彼此不相互重疊(Overlapped)。Please refer to FIG. 3, which is a timing diagram of related signals in FIG. The memory controller 12 determines the set period T setup and the read period T develop , wherein the set period T setup and the read period T develop do not overlap each other.

在設定期間Tsetup 中,記憶體控制器12驅動Y多工器14b1提供記憶胞串偏壓訊號CSL_0至CSL_N-1,其中記憶胞串偏壓訊號CSL_0對應至記憶胞串偏壓電壓VB,而記憶胞串偏壓訊號CSL_1至CSL_N-1對應至接地電壓GND。此外,記憶體控制器12更驅動X解碼器14d來將字元線訊號SWL_0偏壓至選擇字元線電壓VS,並將字元線訊號SWL_1至SWL_N-1偏壓至導通字元線電壓VP。據此,選擇記憶胞串S_0中之記憶胞CM(0,0)係被選擇做為選擇記憶胞,而其他的記憶胞係被導通做為導通傳輸電 晶體。During the set period T setup , the memory controller 12 drives the Y multiplexer 14b1 to provide the memory string bias signals CSL_0 to CSL_N-1, wherein the memory string bias signal CSL_0 corresponds to the memory string bias voltage VB, and The memory string bias signals CSL_1 to CSL_N-1 correspond to the ground voltage GND. In addition, the memory controller 12 further drives the X decoder 14d to bias the word line signal SWL_0 to the selected word line voltage VS and bias the word line signals SWL_1 to SWL_N-1 to the on word line voltage VP. . Accordingly, the memory cell CM(0,0) in the selected memory cell string S_0 is selected as the selected memory cell, and the other memory cell cells are turned on as the conduction transmission transistor.

此外,在設定期間Tsetup 中,列選擇訊號SSL及接地選擇訊號GSL被提供至高電壓HV(例如高於接地電壓GND)。據此,在設定期間Tsetup 中,選擇記憶胞串S_0係實質上被偏壓為導通傳輸電晶體串。In addition, during the set period T setup , the column selection signal SSL and the ground selection signal GSL are supplied to the high voltage HV (eg, higher than the ground voltage GND). Accordingly, during the set period T setup , the selected memory cell string S_0 is substantially biased to turn on the transfer transistor string.

相對地,對於未被選擇到之記憶胞串S_1至S_N-1來說,其之PN二極體D_1至D_N-1係回應於對應至接地電壓GND之記憶胞串偏壓訊號CSL_1至CSL_N-1為截止。如此,在列選擇訊號SSL之位準被提升至足以導通列選擇開關SW_1至SW_N-1的位準前,未選擇記憶胞串S_1至S_N-1為實質上浮接,其中各個未選擇記憶胞串S_1至S_N-1實質上形成一個大電容,其之一端接收字元線訊號SWL_1至SWL_N-1,另一端為浮接。更糟糕的是,字元線訊號SWL_1至SWL_N-1係同時地在設定期間Tsetup 中被提升至選擇字元線電壓VS或導通字元線電壓VP。這樣一來,將使得記憶胞串電壓V(S_0)至V(S_N-1)(例如是實質上浮接的未選擇記憶胞串S_1至S_N-1中任一個記憶胞的源極或汲極電壓及選擇記憶胞串S_0中任一個記憶胞的源極或汲極電壓)經由電容耦合效應而被提升至高電壓位準。In contrast, for the unselected memory cell strings S_1 to S_N-1, the PN diodes D_1 to D_N-1 are responsive to the memory cell string bias signals CSL_1 to CSL_N corresponding to the ground voltage GND. 1 is the deadline. Thus, before the level of the column selection signal SSL is raised enough to turn on the levels of the column selection switches SW_1 to SW_N-1, the unselected memory cells S_1 to S_N-1 are substantially floating, wherein each unselected memory cell string S_1 to S_N-1 substantially form a large capacitor, one of which receives the word line signals SWL_1 to SWL_N-1, and the other end of which is floating. To make matters worse, the word line signals SWL_1 to SWL_N-1 are simultaneously boosted to the selected word line voltage VS or the on word line voltage VP during the set period T setup . In this way, the memory cell string voltages V(S_0) to V(S_N-1) (for example, the source or drain voltage of any one of the substantially floating unselected memory cell strings S_1 to S_N-1) will be caused. And selecting the source or drain voltage of any one of the memory cells S_0 is boosted to a high voltage level via a capacitive coupling effect.

為了解決前述記憶胞串電壓V(S_0)至V(S_N-1)因為電容耦合效應而提高的情形,列選擇訊號SSL在設定期間SSL中亦被提高至高電壓HV。這樣一來,列選擇開關SW_1至SW_N-1對應地在設定期間中Tsetup 中導通,以將放電路徑(由金屬位元線MBL及感測單元14c所形成)連接至記 憶胞串S_0至S_N-1,以對應地將記憶胞串電壓V(S_0)至V(S_N-1)拉低至接地電壓GND,並對應地在設定期間Tsetup 中移除電容耦合效應所產生的電荷。In order to solve the case where the aforementioned memory cell string voltages V(S_0) to V(S_N-1) are increased due to the capacitive coupling effect, the column selection signal SSL is also boosted to the high voltage HV during the set period SSL. In this way, the column selection switches SW_1 to SW_N-1 are turned on correspondingly in the T setup during the set period to connect the discharge path (formed by the metal bit line MBL and the sensing unit 14c) to the memory cell strings S_0 to S_N. -1 to correspondingly pull the memory cell string voltages V(S_0) to V(S_N-1) to the ground voltage GND, and correspondingly remove the charge generated by the capacitive coupling effect during the set period T setup .

在讀取期間Tdevelop 中,金屬位元線MBL為浮接,且記憶體控制器12持續地提供致能之列選擇訊號SSL,如此選擇記憶胞MC(0,0)之記憶胞電流可經由金屬位元線MBL及Y多工器14b2來對金屬位元線MBL上看到的電容進行充電,使得金屬位元線MBL的電壓V(MBL)對應地被提升。記憶體控制器12更驅動感測單元14c來對電壓V(MBL)進行偵測,以對應地實現存取選擇記憶胞MC(0,0)的操作。During the read period T develop , the metal bit line MBL is floating, and the memory controller 12 continuously provides the enable column selection signal SSL, so that the memory cell current of the memory cell MC (0, 0) can be selected via The metal bit line MBL and the Y multiplexer 14b2 charge the capacitance seen on the metal bit line MBL such that the voltage V (MBL) of the metal bit line MBL is correspondingly boosted. The memory controller 12 further drives the sensing unit 14c to detect the voltage V (MBL) to correspondingly implement the operation of accessing the selected memory cell MC(0, 0).

綜合以上,本實施例之記憶體存取方法可在設定期間Tsetup 中,經由放電路徑移除未選擇記憶胞串S_1至S_N-1上的電荷。這樣一來,可有效地避免在讀取期間Tdevelop 中所得到之選擇記憶胞MC(0,0)的記憶胞電流受到未選擇記憶胞串S_1至S_N-1的干擾。這樣一來,記憶胞電流可被應用來準確地找出選擇記憶胞MC(0,0)中所儲存之資料值。In summary, the memory access method of the present embodiment can remove the charges on the unselected memory cell strings S_1 to S_N-1 via the discharge path during the set period T setup . In this way, the memory cell current of the selected memory cell MC(0, 0) obtained during the reading period Tdevelop can be effectively prevented from being interfered by the unselected memory cell strings S_1 to S_N-1. In this way, the memory cell current can be applied to accurately find the data value stored in the selected memory cell MC(0,0).

在本實施例中,雖僅以記憶體控制器12決定兩個操作期間(即是設定期間Tsetup 及讀取期間Tdevelop ),並於其中執行對應之操作的情形為例作說明,然,本實施例之記憶體控制器12並不侷限於此。在其他例子中,記憶體控制器12更決定第二設定期間Tsetup’ ,記憶體控制器12係於其針對感測單元14c中之頁暫存器(Page Buffer)進行設定,並針對金屬位元線MBL進行偏壓,如第4圖所示。 舉例來說,列選擇訊號SSL在第二設定期間Tsetup’ 之前被拉低至接地電壓GND,據此列選擇開關SW_0至SW_N-1在第二設定期間Tsetup’ 中為關閉,以進行金屬位元線MBL之偏壓操作及頁暫存器的設定操作。In the present embodiment, the case where only the two operation periods (that is, the set period T setup and the read period T develop ) are determined by the memory controller 12, and the corresponding operation is performed therein is taken as an example. The memory controller 12 of the present embodiment is not limited to this. In other examples, the memory controller 12 further determines the second setup period T setup' , and the memory controller 12 is configured for the page buffer in the sensing unit 14c, and for the metal bit The line MBL is biased as shown in Figure 4. For example, the column selection signal SSL is pulled down to the ground voltage GND before the second set period T setup ' , according to which the column selection switches SW_0 to SW_N-1 are turned off in the second setting period T setup ' to perform metal The bias operation of the bit line MBL and the setting operation of the page register.

在再一個例子中,記憶體控制器12更在設定期間Tsetup 中決定第一子期間Tsetup_1 與第二子期間Tsetup_2 ,如第5圖所示。在第一子期間Tsetup_1 中,記憶體控制器12提供記憶胞串偏壓訊號CSL_0至CSL_N-1字元線訊號SWL_0至SWL_N-1。在第二子期間Tsetup_2 中,記憶體控制器12經由提供致能之列選擇訊號SSL提供放電路徑。換言之,記憶體控制器12係在提供記憶胞串偏壓訊號CSL_0至CSL_N-1及字元線訊號SWL_0至SWL_N-1的操作之後,提供放電路徑來移除未選擇記憶胞串S_1至S_N-1上之電荷。In still another example, the memory controller 12 further determines the first sub-period T setup_1 and the second sub-period T setup_2 in the set period T setup as shown in FIG. 5. In the first sub-period T setup_1 , the memory controller 12 provides the memory string bias signals CSL_0 to CSL_N-1 word line signals SWL_0 to SWL_N-1. In the second sub-period T setup_2 , the memory controller 12 provides a discharge path via the column enable signal SSL providing the enable. In other words, the memory controller 12 provides a discharge path to remove the unselected memory strings S_1 to S_N after the operations of providing the memory string bias signals CSL_0 to CSL_N-1 and the word line signals SWL_0 to SWL_N-1. 1 on the charge.

本實施例之記憶體存取方法係應用於記憶體控制器中,以針對記憶體陣列進行存取,其中記憶體陣列包括多個記憶胞,此些記憶胞係排列成多個記憶胞串,由列選擇訊號來進行控制。本實施例之記憶體存取方法首先在設定期間中提供記憶胞串偏壓訊號及選擇字元線訊號,以決定選擇記憶胞串上之選擇記憶胞;在設定期間中,本實施例之記憶體存取方法更將記憶體陣列中其餘之記憶胞偏壓為導通傳輸記憶體。本實施例之記憶體存取方法在針對選擇記憶胞進行讀取操作之前,提供放電路徑與各記憶胞串聯接,以消除其中至少一個未選擇記憶胞串上的耦合電荷。據此,相較於傳統記憶體存取方法,本實施例之記憶 體存取方法具有可有效地消除未選擇記憶胞串上之耦合電荷、避免耦合電荷影響選擇記憶胞的存取操作及實現較高的記憶體存取準確性的優點。The memory access method of this embodiment is applied to a memory controller for accessing a memory array, wherein the memory array includes a plurality of memory cells, and the memory cells are arranged in a plurality of memory strings. Controlled by the column selection signal. The memory access method of the embodiment first provides a memory cell string bias signal and a selected word line signal during the set period to determine a selected memory cell on the selected memory cell string; during the set period, the memory of the embodiment The body access method further biases the remaining memory cells in the memory array to turn on the transfer memory. The memory access method of this embodiment provides a discharge path in series with each memory cell to perform a read operation on the selected memory cell to eliminate the coupled charge on at least one of the unselected memory cell strings. Accordingly, the memory of this embodiment is compared to the conventional memory access method. The bulk access method has the advantages of effectively eliminating the coupling charge on the unselected memory cell string, avoiding the coupling charge affecting the access operation of the selected memory cell, and achieving higher memory access accuracy.

綜上所述,雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

1‧‧‧快閃記憶體1‧‧‧flash memory

10‧‧‧記憶體陣列10‧‧‧ memory array

12‧‧‧記憶體控制器12‧‧‧ memory controller

14a‧‧‧汲極偏壓電路14a‧‧‧汲polar bias circuit

14b1、14b2‧‧‧Y多工器14b1, 14b2‧‧‧Y multiplexer

14c‧‧‧感測單元14c‧‧‧Sensor unit

14d‧‧‧X解碼器14d‧‧‧X decoder

第1圖繪示依照本發明實施例之快閃記憶體的方塊圖。FIG. 1 is a block diagram of a flash memory in accordance with an embodiment of the present invention.

第2圖繪示乃記憶體陣列10之子區域的電路圖。FIG. 2 is a circuit diagram showing a sub-area of the memory array 10.

第3圖繪示乃第2圖的相關訊號時序圖。Figure 3 is a timing diagram of the related signals in Figure 2.

第4圖繪示乃第2圖的另一相關訊號時序圖。Figure 4 is a timing diagram of another related signal in Figure 2.

第5圖繪示乃第2圖的再一相關訊號時序圖。Figure 5 is a timing diagram of still another related signal in Figure 2.

Tsetup ‧‧‧設定期間T setup ‧‧‧Setting period

Tdevelop ‧‧‧讀取期間T develop ‧‧‧Reading period

Claims (8)

一種記憶體存取方法,應用於一記憶體控制器中,以針對一記憶體陣列進行存取,其中該記憶體陣列中之複數個記憶胞排列為複數個記憶胞串,該些記憶胞串係由一列選擇(String Select)訊號來進行控制,該記憶體存取方法包括:在一設定期間中,提供一記憶胞串偏壓訊號至該些記憶胞串中之一選擇記憶胞串,並提供一選擇字元線(Word-line)訊號至該選擇記憶胞串中之一選擇記憶胞;在該設定期間中,提供複數個未選擇字元線訊號至該記憶體陣列中其餘之記憶胞,以使其被偏壓為導通傳輸電晶體(Pass Transistor);在該設定期間中,提供一放電路徑連接至該些記憶胞串,以消除該些記憶胞串中至少一個未選擇記憶胞串上之耦合電荷;以及在一讀取期間中,致能該列選擇訊號使得該選擇記憶胞串經由一金屬位元線(Metal Bit Line)連接至一感測單元,並經由電壓感測機制(Voltage Sensing Scheme)來針對該選擇記憶胞串上之該選擇記憶胞進行讀取,其中該讀取期間不與該設定期間重疊(Overlapped)。 A memory access method is applied to a memory controller for accessing a memory array, wherein a plurality of memory cells in the memory array are arranged in a plurality of memory cells, and the memory strings are Controlled by a string of select signals, the memory access method includes: providing a memory string bias signal to one of the memory strings in a set period, and selecting a memory string, and Providing a select word line (Word-line) signal to one of the selected memory cells to select a memory cell; during the set period, providing a plurality of unselected word line signals to the remaining memory cells in the memory array So that it is biased into a pass transistor; during the set period, a discharge path is provided to connect to the memory strings to eliminate at least one unselected memory string in the memory strings The coupled charge is coupled; and during a read period, enabling the column select signal causes the selected memory string to be coupled to a sensing unit via a metal bit line (Metal Bit Line) and via voltage sensing System (Voltage Sensing Scheme) for the selected memory cell to the strings of the selected memory cells for read, wherein the reading period does not overlap with the period setting (Overlapped). 如申請專利範圍第1項所述之記憶體存取方法,其中提供該放電路徑之步驟更包括:致能該列選擇訊號,使得該些記憶胞串同時耦接至該金屬位元線,並使得該至少一未選擇記憶胞串經由該金屬 位元線放電。 The memory access method of claim 1, wherein the step of providing the discharge path further comprises: enabling the column selection signal such that the memory strings are simultaneously coupled to the metal bit line, and Causing the at least one unselected memory cell string via the metal The bit line is discharged. 如申請專利範圍第1項所述之記憶體存取方法,更包括:於該設定期間中決定一第一子期間,其中提供該記憶胞串偏壓訊號及該選擇字元線訊號之步驟,及提供該些未選擇字元線訊號的步驟係執行於該第一子期間中。 The memory access method of claim 1, further comprising: determining, in the set period, a first sub-period, wherein the step of providing the memory string bias signal and the selected word line signal, And the step of providing the unselected word line signals is performed in the first sub-period. 如申請專利範圍第3項所述之記憶體存取方法,更包括:於該設定期間中決定一第二子期間,其中提供該放電路徑之步驟係執行於該第二子期間中。 The memory access method of claim 3, further comprising: determining a second sub-period during the set period, wherein the step of providing the discharge path is performed in the second sub-period. 一種快閃記憶體,包括:一感測單元;一記憶體陣列,包括複數個記憶胞,該些記憶胞排列為複數個記憶胞串,且該些記憶胞串係由一列選擇(String Select)訊號來進行控制;以及一記憶體控制器,耦接至該記憶體陣列,該記憶體控制器更決定一設定期間及一讀取期間,其中該讀取期間不與該設定期間重疊(Overlapped);其中於該設定期間中,該記憶體控制器提供一記憶胞串偏壓訊號至該些記憶胞串中之一選擇記憶胞串,並提供一選擇字元線(Word-line)訊號至該選擇記憶胞串中之一選擇記憶胞; 其中於該設定期間中,該記憶體控制器提供複數個未選擇字元線訊號至該記憶體陣列中其餘之記憶胞,以使其被偏壓為導通傳輸電晶體(Pass Transistor);其中於該設定期間中,該記憶體控制器提供一放電路徑連接至該些記憶胞串,以消除該些記憶胞串中至少一個未選擇記憶胞串上之耦合電荷;及其中於該讀取期間中,該記憶體控制器致能該列選擇訊號使得該選擇記憶胞串經由一金屬位元線(Metal Bit Line)連接至該感測單元,該感測單元經由電壓感測機制(Voltage Sensing Scheme)來針對該選擇記憶胞串上之該選擇記憶胞進行讀取。 A flash memory comprising: a sensing unit; a memory array comprising a plurality of memory cells arranged in a plurality of memory cells, and wherein the memory strings are selected by a column (String Select) a signal controller is coupled to the memory array, and the memory controller further determines a set period and a read period, wherein the read period does not overlap with the set period (Overlapped) During the set period, the memory controller provides a memory string bias signal to one of the memory strings to select a memory string, and provides a select word line signal to the Select one of the memory cell strings to select a memory cell; The memory controller provides a plurality of unselected word line signals to the remaining memory cells in the memory array to be biased into a pass transistor (Pass Transistor); During the set period, the memory controller provides a discharge path connected to the memory strings to eliminate coupling charges on at least one of the unselected memory strings of the memory strings; and during the reading period The memory controller enables the column selection signal such that the selected memory string is connected to the sensing unit via a metal bit line, and the sensing unit is via a Voltage Sensing Scheme. The selected memory cell on the selected memory string is read. 如申請專利範圍第5項所述之快閃記憶體,其中該記憶體控制器係經由致能該列選擇訊號,使得該些記憶胞串同時耦接至該金屬位元線,並使得該至少一未選擇記憶胞串經由該金屬位元線放電,來提供該放電路徑。 The flash memory of claim 5, wherein the memory controller enables the column of signals to be coupled to the metal bit line simultaneously by enabling the column selection signal, and causing the at least An unselected memory cell is discharged via the metal bit line to provide the discharge path. 如申請專利範圍第5項所述之快閃記憶體,其中該記憶體控制器更於該設定期間中決定一第一子期間,其中該記憶體控制器於該第一子期間提供該記憶胞串偏壓訊號、該選擇字元線訊號及該些未選擇字元線訊號。 The flash memory of claim 5, wherein the memory controller further determines a first sub-period during the set period, wherein the memory controller provides the memory cell during the first sub-period The string bias signal, the selected word line signal, and the unselected word line signals. 如申請專利範圍第7項所述之快閃記憶體,其中該記憶體控制器更於該設定期間中決定一第二子期間,其中該記憶體控制器於該第二子期間中提供該放電路徑。 The flash memory of claim 7, wherein the memory controller further determines a second sub-period during the set period, wherein the memory controller provides the discharge during the second sub-period path.
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