TWI460315B - Panel to panel horizontal continue plating line - Google Patents

Description

Horizontal continuous plating system

The present invention relates to a horizontal continuous plating system, and more particularly to a system for forming a horizontal and continuous plating through a bonded substrate, which fully automates the plating process and greatly reduces the time and increases the productivity.

Electroplating is an electrolysis process in which a metal sheet providing a plated metal acts as an anode, an electrolyte solution is usually a metal-plated ionic solution, and a plated object acts as a cathode. After inputting a voltage between the anode and the cathode, the metal ions in the electrolyte are attracted to the cathode, and are plated thereon after reduction. At the same time, the metal of the anode is redissolved to provide more metal ions in the electrolyte. In some cases, an insoluble anode is used, and a fresh electrolyte is added to the plating to add metal ions.

Electroplating generally refers to the deposition of a film on an object by an electrolytic reduction reaction. The current types of use are: electroplating, composite plating, alloy plating, selective plating, pen plating, and the like. The plated surface is widely used because of its protective and decorative effects. There are also a small number of electroplating that provide other characteristics such as high electrical conductivity, high light reflectivity or reduced toxicity. The most commonly used electroplated metals are nickel, chromium, tin, copper, silver and gold.

The electroplating process is mainly carried out using water as a medium, including pre-treatment, electroplating and post-treatment. These processes are subject to a cleaning process.

1. Pre-treatment: the surface of the plated parts is stained before the plating, such as oil Grease or dust must be cleaned up. The pre-treatment stage typically involves the use of preliminary alkaline descaling, electrical de-oiling and pickling to remove scale and rust, and other surface activation methods. The individual pre-treatment process is designed according to the type of plating and the subsequent plating process. In addition, some plating parts such as aluminum, stainless steel or ABS glue require some special pre-treatment.

2. Electroplating: The electroplating process is to deposit a thin layer of metal on the surface of the conductor to decorate the plated parts or prevent rust. Common metal plating includes nickel, copper, brass, chromium, zinc, silver and gold. In addition to electroplating, common metal surface treatments include electroless plating, anodizing, and painting.

3. Post-treatment: The main work of the post-treatment is to dry the plated parts and make a final inspection. In some cases, the workpiece needs to be converted or painted to provide a protective layer after electroplating.

4. Cleaning: Cleaning is the process with the largest amount of water used in the electroplating line. After each plating bath, there is usually a set of water washing procedures to prevent the plating parts from carrying the residue into other procedures and causing contamination.

In terms of conventional electroplating technology, in addition to the vertical plating well known in the industry, there are horizontal plating techniques applied to circuit boards. Among them, the vertical plating portion is limited by the fixing, hanging and electrode arrangement of the substrate, and has difficulty in long operation time, poor uniformity of coating, difficulty in operation of large size, and turning problem when the front and back processes are horizontally turned. Moreover, because the substrate is getting thinner and thinner, especially the metal substrate, when the thickness is above 100 μm, the substrate is less likely to be deformed when the suspension is fixed, but when the thickness of the substrate is less than 100 μm, the thickness is usually 80 μm and 60 μm. In the case of 50 μm and 30 μm substrates, the thin substrate is easily deformed when it is suspended, and thus plating unevenness affects the plating quality.

In order to solve the problem of thin substrate deformation, existing producers will use the substrate surface The product is reduced, but whether it is vertical plating or horizontal plating, there is a problem of fixing and moving in and out of the plating apparatus, which makes the production capacity difficult to increase and increases the production cost.

Therefore, in order to solve the above disadvantages, the object of the present invention is to provide a horizontal continuous plating system for continuously and continuously connecting a substrate into and out of a horizontal plating apparatus, thereby achieving a horizontal and continuous manner of producing a metal thin film on a substrate to reduce the use of existing The high cost of vertical or horizontal plating and the avoidance of the applicability of known plating techniques.

In order to achieve the above purpose, the present invention discloses a horizontal continuous plating system, which mainly includes: an upper rack conveying device for continuously feeding and transporting the substrates one by one; and a positioning device for continuously accessing the upper rack conveying device for transmission Substrate, synchronously transporting the substrate and forming a fixed spacing between the substrate and the substrate; a metal pressing device for continuously accessing the substrate conveyed by the positioning device, and passing the edge of the substrate through the edge of the substrate during the substrate transportation Conducting an adhesive material at a plurality of points on the trailing edge, and then pressing a plurality of metal sheets on the conductive adhesive material through a pressing device at a time, and connecting the substrates of the front and rear sheets to form a continuous shape through the metal sheets; The device is configured to access the substrate conveyed by the metal pressing device, and solidify the conductive adhesive material under the metal piece during substrate transportation; a horizontal plating device is used to access the substrate transferred by the curing device and perform on the substrate a plating process required; a cutting device for accessing a substrate passing through the horizontal plating device, and a substrate between the substrate and the substrate through a cutting blade Cutting metal sheet; the last iteration means for continuously withdrawn one by one and stacked substrate through the cutting device through a push.

Wherein the curing device and the horizontal plating device are provided with a first The conveying buffer device is provided with a second conveying buffer device between the horizontal plating device and the cutting device, and the buffer plate formed by the first and second conveying buffer devices can prevent the surface of the substrate from being pulled and damaged.

Wherein, the conductive adhesive material is a metal conductive adhesive.

Wherein, the metal pressing device comprises a rolling device to make the metal sheet and the substrate fit more closely, and the metal pressing device is configured to laterally move the pressing device synchronously with the substrate when the plurality of metal sheets are pressed; Increase the time that the pressing device presses the metal sheets.

Wherein, the curing device performs a curing process of the conductive adhesive material through an ultraviolet baking device, and the curing device includes a cooling device to perform a cooling process after the curing process.

The invention has the advantages that the horizontal plating device can be continuously and continuously connected to the horizontal plating device, and the metal film can be produced on the substrate in a horizontal and continuous manner, which can solve the problem that the thin substrate is easily deformed in the existing plating technology, and can be continuously and automatically produced. , resulting in a substantial increase in production capacity.

The detailed description and technical description of the present invention are as follows: Referring to FIG. 1 , the present invention discloses a horizontal continuous plating system, which mainly includes: an upper rack conveying device 100 is stacked by a suction device 110 The substrate 10 is continuously loaded onto the transport device 120 for automatic feeding, wherein the transport device 120 can be implemented as a roller transport device.

Referring to FIG. 2A and FIG. 2B, a positioning device 200 is used to continuously feed the substrate 10 automatically conveyed by the rack-mounting device 100, synchronously transport the substrate 10, and form a fixed relationship between the substrate 10 and the substrate 10. Spacing (about 3~5mm pitch). The positioning device 200 can control the time for the substrate 10 to move forward and stop between the two conveyor belts 221 and 222 through the up and down movement of the baffle 210, thereby correcting the angle of the leading edge of the substrate 10 and controlling the substrate 10 and the substrate. 10 fixed spacing.

Referring to FIG. 3A to FIG. 3C, a metal pressing device 300 is used to continuously access the substrate 10 conveyed by the positioning device 200, and the front end of the substrate 10 is advanced through the dispensing machine 310 during the substrate 10 transportation. The conductive adhesive material 20 is placed at a plurality of points on the trailing edge, and then the plurality of metal sheets 30 are pressed against the conductive adhesive material 20 at a time through a pressing device 320, and the front and back substrates 10 are connected through the metal sheets 30. Form a continuous shape. The conductive adhesive material 20 is a metal conductive paste, such as a solder paste.

Moreover, the metal pressing device 300 includes a rolling device 330. When the substrate 10 passes through the rolling device 330, the bonding between the metal piece 30 and the substrate 10 can be made closer, and the rolling device 330 can be adjusted through use. The force of rolling applies to the thickness of the different substrates 10 and metal sheets 30, and the tightness between the metal sheets 30 and the substrate 10. When the metal pressing device 300 is pressed, the pressing device 320 moves laterally synchronously with the substrate 10 (as shown in FIG. 3B ) to increase the pressing device 320 to press the metal. At the time of the sheet 30, the pressing device 320 moves a certain distance and then returns to the next metal sheet 30 to be pressed (as shown in Fig. 3C).

Referring to FIG. 4, a curing device 400 is connected to the substrate 10 conveyed by the metal pressing device 300. At this time, the substrates 10 are connected to form a continuous shape, and the metal sheet 30 is transported through the curing device 400 during the substrate 10 transportation. The lower conductive adhesive material 20 is cured. In the implementation, the curing device 400 performs a curing process of the conductive adhesive material 20 through the ultraviolet baking device 410, and the curing device 400 includes a cooling device 420 (for example, a fan) to perform a cooling process after the curing process, so that the substrate 10 can be strengthened. Interconnection.

Referring to FIG. 5, FIG. 6 and FIG. 7 , a horizontal plating apparatus 500 is used to access the substrate 10 conveyed by the curing apparatus 400 and perform a plating process required on the substrate (as shown in FIG. 6 ). The horizontal plating apparatus 500 includes the main processes of the electroplating process, including three stages of pre-treatment, electroplating and post-treatment, and of course these processes are subjected to a cleaning process. Therefore, the horizontal plating apparatus 500 is different in material to be plated according to the substrate 10 or has different internal process design, and the internal design of the horizontal plating apparatus 500 is a known technology, and the focus of the patent is not This is not to be repeated.

In addition, a first transport buffer device 510 (shown in FIG. 5) is disposed between the curing device 400 and the horizontal plating device 500. The horizontal plating device 500 is provided with a second transport buffer device 520 (shown in FIG. 7). The buffer zone formed by the first and second transport buffer devices 510 and 520 can prevent the substrate 10 in the continuous state from being damaged by the surface of the substrate 10 when it is plated in and out of the horizontal plating device 500, and the substrate 10 and the substrate are maintained. The currents in the 10 horizontal plating devices 500 are continuous.

Referring to FIG. 8 again, a cutting device 600 is configured to access the substrate 10 that has been plated through the horizontal plating device 500 (or the substrate 10 that has been plated by the second transfer buffer device 520) through a cutting blade 610. Cutting the metal piece 30 between the substrate 10 and the substrate 10 so that the substrates 10 are no longer connected, but forming a single substrate 10; Through the stacking device 710, the substrate 10 passing through the cutting device 600 is successively taken out and stacked.

The system enters and exits the horizontal plating device 500 by continuously connecting the substrate 10, thereby achieving the horizontal and automatic continuous generation of the metal film on the substrate 10. This can solve the problem that the thin substrate is plated one by one on the existing plating technology and is easily deformed. And it is possible to continuously produce a large increase in production capacity.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

10‧‧‧Substrate

20‧‧‧Electrically conductive adhesive materials

30‧‧‧metal pieces

100‧‧‧Upper conveyor

110‧‧‧ suction device

120‧‧‧Conveyor

200‧‧‧ Positioning device

210‧‧‧Baffle

221, 222‧‧‧ conveyor belt

300‧‧‧Metal pressing device

310‧‧‧ Dispenser

320‧‧‧Pressing equipment

330‧‧‧Rolling equipment

400‧‧‧Curing device

410‧‧‧UV baking equipment

420‧‧‧Cooling equipment

500‧‧‧Horizontal plating unit

510‧‧‧First delivery buffer

520‧‧‧Second transport buffer

600‧‧‧ cutting device

610‧‧‧Cutting knife

710‧‧‧Pushing device

Figure 1 is a schematic view of the overhead transport device of the present invention.

FIG. 2A and FIG. 2B are schematic diagrams of the positioning device of the present invention.

Figure 3A, Figure 3B and Figure 3C are the metal pressing devices and their operation diagrams.

Figure 4 is a schematic view of the curing device of the present invention.

Figure 5 is a schematic view of the first delivery buffer device of the present invention.

Figure 6 is a schematic view of the horizontal plating apparatus of the present case.

Figure 7 is a schematic view of the second conveying buffer device of the present invention.

Figure 8 is a schematic view of the cutting device and the push-up device of the present invention.

20‧‧‧Electrically conductive adhesive materials

30‧‧‧metal pieces

300‧‧‧Metal pressing device

310‧‧‧ Dispenser

320‧‧‧Pressing equipment

330‧‧‧Rolling equipment

Claims (8)

A horizontal continuous plating system, which mainly comprises: an upper rack conveying device for continuously feeding and transporting the substrate one by one; a positioning device for continuously accessing the substrate conveyed by the upper rack conveying device, and synchronously transferring the substrate and Forming a fixed spacing between the substrate and the substrate; a metal pressing device for continuously accessing the substrate conveyed by the positioning device, and passing through the edge of the front end and the trailing end of the substrate through a little glue machine during substrate transportation Pointing on the conductive adhesive material, and then pressing a plurality of metal sheets on the conductive adhesive material through a pressing device, and connecting the front and rear substrate through the metal sheets to form a continuous shape; a curing device is used for accessing The substrate conveyed by the metal pressing device solidifies the conductive adhesive material under the metal sheet during substrate transportation; a horizontal plating device is used to access the substrate conveyed by the curing device and perform a plating process; a cutting device, The substrate for passing through the horizontal plating device is cut by a cutting blade between the substrate and the substrate; and a push-up device is used The continuously withdrawn one by one through the substrate cutting apparatus and stacked. The horizontal continuous plating system of claim 1, wherein the curing device and the horizontal plating device are provided with a first conveying buffer device. The horizontal continuous plating system of claim 1, wherein the horizontal plating device and the cutting device are provided with a second conveying buffer device. The horizontal continuous plating system of claim 1, wherein the conductive adhesive material is a metal conductive adhesive. The horizontal continuous plating system as described in claim 1, wherein The metal pressing device includes a rolling device to make the metal sheet and the substrate fit more closely. The horizontal continuous plating system of claim 1, wherein the metal pressing device presses the plurality of metal sheets to press the pressing device synchronously and laterally to increase the pressing device to press the pressing device. The time of some metal pieces. The horizontal continuous plating system according to claim 1, wherein the curing device performs a curing process of the conductive adhesive material through an ultraviolet baking device. The horizontal continuous plating system according to claim 7, wherein the curing device includes a cooling device to perform a cooling process after the curing process.