TWI458890B - Heat dissipation structure - Google Patents

Description

Heat dissipation structure

The invention relates to a heat dissipation structure, in particular to a heat conduction path which can change the fin group, prevents the heat of the fin group from being directly transmitted to other components or shells of the electronic device, and can increase the cooling air flow space, so that the heat is not caused. A heat dissipation structure that accumulates inside the fin group.

Press, the central processing unit (CPU) in the general electronic device (such as a notebook computer) and its surrounding electronic components will emit high heat during operation or operation, so a heat sink is provided for heat dissipation.

The heat dissipation structure 10 of the electronic device shown in FIG. 1 has a housing 11 . The housing 11 is provided with an air outlet 111 . The housing 11 defines a fan 12 . The fan 12 has a fan housing 121 . The fan casing 121 is disposed at a bottom of a circuit board 13. A circuit board fan 12 is disposed between the first surface of the fin group and the inner wall of the casing, and is disposed in a space formed by the circuit board 13 and the fan casing 121. A fin set 14 is disposed between the fan 12 and the air outlet 111, and a heat pipe 15 is disposed at the bottom of the fin set 14. One end of the heat pipe 15 extends outside the fin set 14 and is connected with electronic components (not shown). In contact, the heat generated when the electronic component generates heat can be conducted to the fin group 14 by the heat pipe 15, and the dotted arrow shown in the figure represents heat conduction, and then the fan 12 is operated to generate cooling wind to the fin group 14, and the fin is folded. The heat of the group 14 is blown out of the casing 11 by the air outlet 111, thereby achieving the purpose of heat dissipation.

It can be seen from the above structure that since most of the heat is concentrated on the fin set 14, the fin set 14 continues to maintain a high temperature during the operation of the electronic device, and the heat of the fin set 14 (the dotted arrow shown in the figure) is also transmitted to Other electronic components or structures around the fin set 14, such as circuit board 13 or housing 11. When the circuit board 13 is in a high temperature state for a long time, the circuit of the circuit board 13 or the electronic components disposed on the circuit board 13 may be adversely affected, and the heat generated by the heat absorption of the casing 11 may cause the user to touch The contact with the housing 11 causes discomfort, and may even feel that the system is not functioning properly. In addition, although the cooling air generated by the operation of the fan 12 can pass between the two fins constituting the fin group 14, when the heat is too high or the cooling air is insufficient, heat tends to accumulate inside the fin group 14 and is difficult to discharge, affecting Cooling effect.

In view of the lack of the prior art, the present invention provides a heat dissipation structure that can change the heat conduction path of the fin group, prevent the heat of the fin group from being directly transmitted to other components or shells of the electronic device, and can increase the cooling air flow space. The heat is not accumulated in the fin group.

To achieve the above object, the present invention provides a heat dissipation structure comprising: a housing having an air outlet; a fan disposed in the housing; and a fin set having a first side and an opposite one a wind surface and a wind surface facing the fan, the wind surface facing the air outlet, the first surface being adjacent to the air inlet surface and the air outlet surface, on the first surface Having at least one recess, the first surface and the recess are directed toward an inner wall of the housing, the first surface having a first distance from an inner wall of the housing, the recess having an inner wall of the housing a second distance, the second distance being greater than the first distance.

In order to enable your review committee to have a better understanding and recognition of the structural purpose and efficacy of the present invention, the detailed description is as follows.

The technical means and efficacy of the present invention for achieving the object will be described below with reference to the accompanying drawings, and the embodiments listed in the following drawings are only for the purpose of explanation, and are to be understood by the reviewing committee, but the technical means of the present invention are not Limited to the listed figures.

Referring to the second and third figures, the heat dissipation structure 20 of the present invention has a housing 21, a fan 22 and a fin set 23, and an air outlet 211 is provided in the housing 21 for the housing. A fan 22 is disposed in the body 21, the fan 22 has a fan casing 221, the fan casing 221 is disposed at the bottom of a circuit board 24, and the fan 22 is disposed in the space formed by the circuit board 24 and the fan casing 221, and the fan 22 is A fin group 23 is provided between the air outlets 211.

The fin group 23 has a first surface 231 and a second surface 232 opposite to each other, and an air inlet surface 233 and an air surface 234 opposite to each other. The circuit board 24 is disposed on the first surface of the fin group 23 . Between the 233 and the inner wall 212 of the housing 21, a heat pipe 25 is disposed on the second surface 232. One end of the heat pipe 25 extends outside the fin group 23 and is in contact with an electronic component (not shown). The heat generated when the heat is generated can be conducted to the fin group 23 by the heat pipe 25. The air inlet surface 232 is directed toward the fan 22, and the air outlet surface 233 is directed toward the air outlet 211. The first surface 231 is adjacent to the air inlet surface 232 and the air outlet surface 233, and the first surface 231 is provided with a recess 235. The recess 235 is provided. The first surface 231 is biased on one side of the first wind surface 233, so that the first surface 231 is in a second-order step shape. The first surface 231 and the recess 234 are directed toward the circuit board 24, that is, toward the inner wall 212 of the housing 21. The first surface 231 has a first distance D1 from the inner wall 212 of the housing 21, and the recess 234 and the housing 21 The inner wall 212 has a second distance D2 that is greater than the first distance D1.

As shown in the third figure, the fin group 23 of the present embodiment is composed of an array of a plurality of fins 236 in the form of a sheet. The fins 236 are made of copper or aluminum, and the fins 236 have opposite sides. A first side 2361 and a second side 2362, and a third side 2363 are combined by the first side 2361 of the heat dissipation fins 236 to form an air inlet surface 233 of the fin set 23, The second side 2362 of the heat dissipation fin 236 is combined to form an air surface 234 of the fin group 23, and the third side 2363 of the heat dissipation fins 236 is combined to form a first surface 231 of the fin group 23 and a concave portion 235. The first surface 231 of the fin set 23 of the present embodiment is in contact with the circuit board 24, and the recess 235 of the fin set 23 has a third distance D3 from the circuit board 23.

The invention is characterized in that when the heat pipe 25 conducts heat to the fin group 23, the traveling path of heat to the fin group 23 is blocked by the arrangement of the concave portion 235, as shown by the dotted arrow in the second figure, in the cooling wind. Under the action of W, the heat will turn to the wind surface 234, and since only the first surface 231 is in contact between the fin group 23 and the circuit board 24, only a small amount of heat is conducted to the circuit board 24 via the first surface 231. The heat transfer to the circuit board 24 can be greatly reduced, so that the temperature of the casing 21 is also greatly reduced, and most of the heat is transmitted to the air outlet surface 234, and then blown out of the casing 11 by the air outlet 111, thereby achieving the purpose of heat dissipation. .

Referring to the embodiments shown in FIG. 4 and FIG. 5 , the heat dissipation structure 30 provided in this embodiment is based on the second embodiment, and has a casing 31 , a fan 32 , and a fin set 33 . An air outlet 311 is disposed in the housing 31. A fan 32 is disposed in the housing 31. The fan housing 321 is disposed at a bottom of a circuit board 34. The fin assembly 33 has a first surface 331 and a second surface 332. And a corresponding air inlet surface 333 and an air outlet surface 334, a recess 335 is disposed on the first surface 331 , and a heat pipe 35 is disposed on the second surface 332 .

The embodiment is characterized in that the fin group 33 has a transparent portion 336, the transparent portion 336 is penetrated through the fin group 33, and the transparent portion 336 is penetrated through the air inlet surface 333 and the wind surface of the fin group 33. The path of the cooling wind formed between 334, as shown in the third figure, the cooling wind W can be moved into and out of the fin group 33 by the air inlet surface 333 and the air outlet surface 334, and at the same time, when the cooling air can be in the transparent portion 336 The fin group 33 is transversely penetrated. Further, the traveling path of heat in the fin group 33 is blocked by the provision of the transparent portion 336. In other words, the fin group 33 of the present embodiment is provided with the concave portion 335 and the transparent portion. The 336 dual structure not only greatly reduces heat conduction to the circuit board 34 and the casing 31, but also prevents heat from accumulating inside the fin group 33.

Referring to the embodiment shown in FIG. 6, the heat dissipation structure 40 provided in this embodiment is based on the second embodiment, and has a housing 41, a fan 42 and a fin set 43 in the housing 41. An air outlet 411 is provided, and a fan 42 is disposed in the housing 41. A circuit board 44 is disposed between the fin set 43 and the inner wall 412 of the housing 41. The fin set 43 has a first surface 431 and a first surface. The second surface 432, and the opposite one of the air inlet surface 433 and the air outlet surface 434, the second surface 432 is provided with a heat pipe 45, and the fin group 43 has a transparent portion 436. The first embodiment 431 is provided with a concave portion 435, and the concave portion 435 is located at a central portion of the first surface 431, so that the first surface 431 has a concave-convex shape.

Referring to the embodiment shown in FIG. 7 , the heat dissipation structure 50 provided in this embodiment is based on the fourth embodiment, and has a housing 51 , a fan 52 , and a fin set 53 . An air outlet 511 is disposed, and a fan 52 is disposed in the housing 51. A circuit board 54 is disposed between the fin set 53 and the inner wall 512 of the housing 51. The fin set 53 has a first surface 531 and a first surface. The second surface 532, and one of the air inlet surface 533 and the air outlet surface 534, is provided with a heat pipe 55 on the second surface 532, and has a transparent portion 536 on the fin group 53. The first embodiment is characterized in that the first surface 531 is provided with two concave portions 535A and 535B, and the concave portion 535 is located at a central portion of the first surface 431, so that the first surface 531 has a continuous uneven shape.

Referring to the embodiment shown in FIG. 8 , the heat dissipation structure 60 provided in this embodiment is based on the second embodiment, and has a housing 61 , a fan 62 and a fin set 63 on the housing 61 . An air outlet 611 is provided. A fan 62 is disposed in the housing 61. A circuit board 64 is disposed between the fin set 63 and the inner wall 612 of the housing 61. The fin set 63 has a first surface 631 and a first surface. The second surface 632, and one of the air inlet surface 633 and the air outlet surface 634, is provided with a heat pipe 65 on the second surface 632, and has a transparent portion 636 in the fin group 63. The difference between this embodiment and the second figure is that only the transparent portion 636 is provided in the embodiment, and the first surface 631 of the embodiment is not provided with a concave portion. This embodiment is described by the provision of the transparent portion 636. The purpose of blocking heat conduction is such that heat is not accumulated inside the fin group 63.

Referring to the embodiment shown in FIG. 9 , the heat dissipation structure 70 provided in this embodiment is based on the second embodiment, and has a housing 71 , a fan 72 and a fin set 73 on the housing 71 . An air outlet 711 is provided, and a fan 72 is disposed in the housing 71. The fin set 73 has a first surface 731 and a second surface 732 opposite to each other, and an air inlet surface 733 and an air outlet surface 734. A recess 735 is disposed on the first surface 731, a heat pipe 75 is disposed on the second surface 732, and a permeable portion 736 is defined in the fin set 73. The difference between this embodiment and the second figure is that only the air-permeable portion 736 is provided in the embodiment. The difference between the present embodiment and the second figure is that the fan 72 of the embodiment is disposed on the bottom surface of the interior of the housing 71. 72 and the fin set 73 are provided with a cover 76. This embodiment illustrates that when the heat pipe 75 conducts heat to the fin group 73, the path of heat to the fin group 73 is blocked by the arrangement of the recess 735, and the cooling wind W can be transversely penetrated through the hollow portion 736. The fin group 73, in addition, the path of heat to the fin group 73 is blocked by the arrangement of the transparent portion 736. In other words, the fin group 73 of the present embodiment is provided with the recess 735 and the transparent portion 736. The structure not only greatly reduces heat conduction to the cover 76 and the housing 71, but also prevents heat from accumulating inside the fin set 73.

It must be noted that the size, position and number of the recesses and the venting portions provided in the different embodiments described above must be designed according to the temperature at which the actual housing is to be lowered.

In summary, the heat dissipation structure provided by the present invention can change the heat conduction path of the fin group after changing the shape of the fin group, and prevent the heat of the fin group from being directly transmitted to other components or shells of the electronic device, and The cooling air flow space is increased so that the heat is not accumulated in the fin group, which not only protects the internal components and the casing of the electronic device from damage due to high temperature, but also reduces the temperature of the casing and increases user comfort. According to the actual sample verification, when the ambient temperature is about 25 degrees Celsius and the heating temperature of the electronic component is about 81.9 degrees Celsius, the structure of the embodiment shown in the second figure can reduce the temperature of the casing from 46.4 degrees Celsius to 36.8 degrees. At 9 degrees Celsius, and the structure of the embodiment shown in the eighth figure, the temperature of the casing can be reduced from 41 degrees Celsius to 38.6 degrees, and the range of reduction is about 1 to 3 degrees Celsius, which proves that the present invention does have an improvement in its efficacy. It can be seen that in the fourth, sixth, and eighth embodiments, since the fin group is provided with the concave portion and the transparent portion at the same time, the magnitude of the temperature drop can be further improved.

However, the above description is only for the embodiments of the present invention, and the scope of the invention is not limited thereto. That is to say, the equivalent changes and modifications made by the applicant in accordance with the scope of the patent application of the present invention should still fall within the scope of the patent of the present invention. I would like to ask your review committee to give a clear explanation and pray for it.

Prior art:

10. . . Heat dissipation structure

11. . . case

111. . . Air outlet

12. . . fan

121. . . Fan housing

13. . . Circuit board

14. . . Fin set

15. . . Heat pipe

this invention:

20, 30, 40, 50, 60, 70. . . Heat dissipation structure

21, 31, 42, 51, 61, 71. . . case

211, 311, 411, 511, 611, 711. . . Air outlet

212, 412, 512, 612. . . Inner wall

22, 32, 42, 52, 62, 72. . . fan

221, 321. . . Fan housing

23, 33, 43, 53, 63, 73. . . Fin set

231, 331, 431, 531, 631, 731. . . First side

232, 332, 432, 532, 632, 732. . . Second side

233, 333, 433, 533, 633, 733. . . Wind inlet

234, 334, 434, 534, 634, 734. . . Wind face

235, 335, 435, 535A, 535B, 735. . . Concave

236. . . Heat sink fin

2361. . . First side

2362. . . Second side

2363. . . Third side

24, 34, 44, 54, 64. . . Circuit board

25, 35, 45, 55, 65, 75. . . Heat pipe

336, 436, 536, 636, 736. . . Ventilation

76. . . Cover

D1. . . First distance

D2. . . Second distance

D3. . . Third distance

W. . . Cooling wind

The first figure is a schematic diagram of a conventional heat dissipation structure.

The second drawing is a schematic cross-sectional view of a first embodiment of the present invention.

The third figure is a perspective view of the combined structure of the heat sink fins, the fan and the heat pipe of the second embodiment.

The fourth figure is a schematic cross-sectional view of a second embodiment of the present invention.

The fifth figure is a three-dimensional structure diagram of the fin group of the fourth figure.

6 to 9 are schematic cross-sectional views of different embodiments of the present invention.

20. . . Heat dissipation structure

twenty one. . . case

211. . . Air outlet

212. . . Inner wall

twenty two. . . fan

221. . . Fan housing

twenty three. . . Fin set

231. . . First side

232. . . Second side

233. . . Wind inlet

234. . . Wind face

235. . . Concave

twenty four. . . Circuit board

25. . . Heat pipe

D1. . . First distance

D2. . . Second distance

D3. . . Third distance

W. . . Cooling wind

Claims (8)

A heat dissipation structure includes: a casing having an air outlet; a fan disposed in the casing; and a fin set having a first surface and an opposite air inlet surface and an air outlet surface, The air inlet surface faces the fan, and the air outlet surface faces the air outlet, the first surface is adjacent to the air inlet surface and the air outlet surface, and the first surface is provided with at least one recess, the first surface One side and the recess are directed toward an inner wall of the housing, the first surface having a first distance from an inner wall of the housing, the recess having a second distance from the inner wall of the housing, the second distance More than the first distance, the fin set has at least one transparent portion, the transparent portion is penetrated through the fin set, and the transparent portion penetrates the air inlet surface and the wind surface of the fin group The path of the cooling wind formed between the two. The heat dissipation structure of claim 1, wherein the first surface of the fin set is provided with a recess, and the recess is offset from a side of the first surface adjacent to the air inlet surface, the first surface The system presents a second-order step. The heat dissipation structure of claim 1, wherein the first surface of the fin set is provided with a plurality of concave portions, and the first surface has a continuous concave-convex shape. The heat dissipation structure of claim 1, wherein the fin assembly is formed by a plurality of fin-shaped arrays of fins having a first side and a second side opposite to each other. And a third side, the first side of the plurality of heat dissipating fins is combined to form the air inlet surface, and the second side of the plurality of heat dissipating fins is combined to form the air outlet surface, and the plurality of heat dissipating fins The third side combination constitutes the first side. The heat dissipation structure of claim 4, wherein the plurality of heat dissipation fins are made of copper or aluminum. The heat dissipation structure of claim 1, wherein a circuit board is disposed between the first surface of the fin set and the inner wall of the housing. The heat dissipation structure of claim 6, wherein the first side of the fin set and the circuit board are in contact with each other, and the recess of the fin set has a distance from the circuit board. The heat dissipation structure of claim 1, wherein the fin set has a second surface, the first surface is opposite to the second surface, and a heat pipe is disposed on the second surface, the heat pipe It is used to conduct heat generated by heat generation of an electronic component to the fin set.