TWI456277B - Optical connector - Google Patents

Claims (10)

An optical connector comprising: a printed circuit board; a semiconductor substrate disposed on the printed circuit board, having a concave platform formed therein, an optical transmission interface disposed on the concave platform; a first and a And a second transmission line is formed on the semiconductor substrate, and a through hole is formed through the semiconductor substrate to electrically connect the first and the second transmission line; an optical component is disposed on the semiconductor substrate, coupled to the a first transmission line; and a chip coupled to the printed circuit board, coupled to the optical element through the first, the second transmission line and the through-channel. The optical connector of claim 1, wherein the wafer comprises a transimpedance amplifier chip or a driver circuit wafer. The optical connector of claim 1, wherein the optical transmission interface comprises an optical fiber, a waveguide, or a jumper. The optical connector of claim 1, wherein the optical component comprises a laser, a vertical cavity surface radiation laser, a photodetector or a light emitting diode. An optical connector comprising: a printed circuit board; a stacked chip module coupled to the printed circuit board; a semiconductor substrate disposed on the stacked chip module, having a concave platform formed therein, a light The transmission interface is disposed on the concave platform; a first and a second transmission line are respectively formed on the upper and lower sides of the semiconductor substrate, and a through hole passages through the semiconductor substrate to electrically connect the first and the second transmission lines; And a light component disposed on the semiconductor substrate, coupled to the stacked wafer module through the first, the second transmission line and the through hole. The optical connector of claim 5, wherein the stacked wafer module comprises a first wafer, an interposer, and a second wafer stacked on top of the printed circuit board from top to bottom. The optical connector of claim 6, wherein the first wafer comprises a transimpedance amplifier chip or a driver circuit wafer, the second wafer comprising a processing wafer, a central processing unit wafer, an image wafer, a sound effect wafer or a data wafer. An optical connector comprising: a printed circuit board; an integrated chip module coupled to the printed circuit board; a semiconductor substrate disposed on the integrated chip module, having a concave platform formed therein, a light The transmission interface is disposed on the concave platform; a first and a second transmission line, respectively Formed on the semiconductor substrate above and below, a through hole passage through the semiconductor substrate to electrically connect the first and the second transmission line; and an optical element disposed on the semiconductor substrate, through the first, the The second transmission line and the perforation channel are coupled to the integrated wafer module. The optical connector of claim 8, wherein the integrated chip module integrates a transimpedance amplifier chip, a driver circuit chip, and a process The wafer, central processing unit wafer, image wafer, sound effect wafer or data wafer is in a second semiconductor substrate. An optical connector comprising: a printed circuit board; an integrated chip module coupled to the printed circuit board; a semiconductor substrate, configured On the integrated chip module, an optical transmission interface is disposed on the semiconductor substrate; an optical member is disposed on the semiconductor substrate; and a first and second transmission lines are respectively formed on the semiconductor substrate a first and second transmission lines are disposed on the semiconductor substrate, and the first and second transmission lines are disposed on the semiconductor substrate perforation The channel is coupled to the integrated wafer module.