TWI455252B - A mold release mechanism for a light emitting diode package process - Google Patents

Description

Release mechanism for LED package process

The present invention relates to a demolding mechanism, and more particularly to a demolding mechanism for a light emitting diode packaging process.

According to the conventional stripping mechanism for the LED package process, the substrate carrying the majority of the LED package unit is directly ejected by the ejector pin to be separated from the molding cavity, and then the robot arm or It is taken out by hand or the like to complete the demolding operation; however, the operation mode of the demolding mechanism is liable to cause damage to the LED package unit, and the damage can be roughly divided into two types.

Firstly, this fast forced ejection mode will make the LED package unit which is originally tightly integrated into the molding cavity, and suddenly the outer packaging component is quickly formed with the molding cavity due to the application of strong external force. The wall surface is separated, which causes the surface layer of the encapsulant to be damaged by peeling or the like.

Secondly, since the substrate and the LED package unit are relatively thin and fragile, when the ejector pin is ejected from the substrate, the stress generated on the substrate will cause the substrate and the LED package unit. Produces deformation and even cracks.

Therefore, the release of the mold by the conventional mold release mechanism will result in a decrease in the yield and reliability of the finished package of the light-emitting diode. In view of this, the inventor of this case has been carefully researched and accumulated years of experience in the development and manufacturing of related industries, and finally has the invention.

The main object of the present invention is to provide a demolding mechanism for a light-emitting diode packaging process, which can smoothly release a mold release, thereby improving product yield and reliability.

In order to achieve the above object, the present invention provides a demolding mechanism for a light emitting diode packaging process for promoting demolding of a substrate carrying a plurality of LED packages, the demolding mechanism The method includes: a molding module and a substrate carrier that are relatively movable; wherein a top surface of the molding module has a plurality of molding cavities corresponding to the LED package units, and at least one air hole, the air holes and the holes The molding cavity is connected to allow external air to flow into the molding cavity; and the substrate carrier is used to carry the substrate, and the relative movement of the substrate carrier and the molding module promotes the LED package The unit enters or exits the molding cavity.

Thereby, the demolding mechanism of the present invention utilizes the relatively movable molding module and the substrate carrier such that a slight gap is formed between the substrate and the molding module, and then external air is introduced into the gap, thereby causing non-mechanical damage. The gas assisted ejection mode assists in the demolding of the LED package unit on the substrate.

Referring to the first preferred embodiment of the present invention, the demolding mechanism 100 for the LED manufacturing process is used to assist a carrier diode L with a plurality of LED packages. The substrate S is demolded, and the mold is released The mechanism 100 mainly includes a molding die holder 10, a substrate carrier 20, an actuator member 30, a gas supply unit 40 and a suction device 50. The top surface 101 of the molding die holder 10 is provided with a plurality of corresponding portions. The molding cavity 11 of the LED package unit L is disposed, and a plurality of air holes 12 are disposed around the molding cavity 11. Each of the molding cavities 11 is filled with a predetermined encapsulating material (including a transparent encapsulating layer, a fluorescent layer or a lens layer, etc.), and the air holes 12 are in gas communication with the molding cavities 11 for the gas. The gas A supplied from the supply unit 40 flows into the molding cavities 11 through the air holes 12, and the function of this portion will be described later. In addition, a heating unit 13 is further disposed in the molding die holder 10, and the heating unit 13 can uniformly heat the molding die holder 10 and provide a heating temperature of 50 to 300 ° C, so that the packages in the molding cavity 11 are encapsulated. The glue is cured to a predetermined extent to facilitate demolding.

In this embodiment, the substrate carrier 20 is a hollow module having a hollow portion 21 and a positioning portion 22 disposed on the circumferential side of the hollow portion 21. The molding die holder 10 is located in the hollow portion 21, and the periphery of the substrate S is fixed to the positioning portion 22, and the LED package units L are located in the hollow portion 21, and Facing the molding cavity 11 , in other words, the substrate carrier 20 abuts against the substrate S and has one side of the LED package unit L.

It should be particularly noted that the demolding mechanism 100 further includes the actuating member 30, and the actuating member 30 is an elastic component that can be controlled to adjust the stretched length thereof, and is disposed on the molding die holder 10 and the substrate. Between the seats 20, in this embodiment, one end thereof abuts against the top side of the molding die holder 10, the other end abuts against the bottom side of the substrate carrier 20, and the molding die holder 10 is fixed, whereby the substrate carries The base 20 can be moved up and down relative to the molding die holder 10 by the action of the actuating member 30 to synchronously drive the substrate S up and down, so that the LED package unit L on the substrate S enters or exits the LED package unit L. These molding cavities 11 have the effects of this portion described later. Of course, the movement mechanism of the substrate carrier 20 and the molding die holder 10 can also be designed such that the substrate carrier 20 is fixed, and the molding die holder 10 is moved by the actuating member 30, and the substrate carrier 20 is moved up and down. The displacement can also cause the LED package unit L of the substrate S to be relatively close to or away from the molding cavities 11. In addition, the actuating member 30 can be replaced by any conventional lifting mechanism (such as a pressure cylinder, etc.), and any device that can promote the relative movement of the substrate carrier 20 and the molding die holder 10 can be applied to the present invention. invention.

It should be noted that the gas supply unit 40 has a gas source 41 (such as an air compressor) and a plurality of intake pipes 42 connected to the mold block 10 . The gas holes 12 are connected to each other, whereby the gas outputted by the gas source 41 can flow through the gas inlet pipe 42 and the gas holes 12 into the molding cavity 11 in sequence; and the suction device 50 is disposed on the molding die Above the seat 10, the upper and lower movements and rotations can be controlled, and the suction device 50 can be vacuum-applied to the back side of the substrate S to drive the substrate S toward or away from the molding die holder 10.

The above is the structural description of the demolding mechanism 100 according to the first preferred embodiment of the present invention. The demolding operation mode will be described below: please refer to the first to fourth figures, the actual packaging and demoulding are prior to the The molding cavity 11 of the molding die holder 10 is filled with a predetermined sealing glue Then, the substrate S is sucked through the suction device 50 (of course, by mechanical arm or manual method), and the substrate S is placed on the substrate carrier 20, so that the light-emitting diode package units L are impregnated. After being heated and solidified by the heating unit 13 in the encapsulating material, the mold release is performed. It should be particularly noted that, in order to facilitate the demolding operation, the actuating member 30 is controlled to move, so that the substrate carrier 20 is slightly raised, thereby synchronously driving the substrate S to slightly move up, thereby causing the substrate S to A very small gap G is formed between the molding die holders 10 (this gap G is extremely small, the drawing is for reference), and at the same time, the gas supply unit 40 is controlled to output the gas A, and the gas A is controlled. The air intake tube 42 and the air holes 12 enter the gap G, and then flow into and fill the molding cavity 11 to loosen the light-emitting diode package unit L which is originally tightly coupled to the molding cavity 11 by gas. In order to reduce the peeling phenomenon and deformation and cracking during the demolding of the conventional light-emitting diode package unit, the suction device 50 is controlled to attract the substrate S to move upward, and after moving to a predetermined position, The self-rotation causes the substrate S to be reversed, so that the light-emitting diode package units L face upwards, and the subsequent operations are performed.

It can be seen from the above structure that the present invention utilizes the relatively movable molding die holder 10 and the substrate carrier 20 to form a very small gap G between the LED package unit L and the molding cavity 11 to allow gas A. Inflowing and uniformly loosening and assisting the ejection of the LED package units L in a non-destructive pneumatic manner, so that the LED package units L are smoothly demolded, thereby improving product yield and reliability; Secondly, if you want to replace the package type, you don't need to replace the whole set of molds as you would, just replace the mold base. 10 can be used to save equipment and labor costs.

The spirit of the present invention further derives the demolding mechanism 200 of the second preferred embodiment as shown in the sixth embodiment, the structure comprising a molding die holder 60, a substrate carrier 70 and the molding die holder 60 and the a second cylinder 80 of the substrate carrier 70, and a gas supply unit 90; wherein each of the cylinders 80 has a piston rod 81 connected to the substrate carrier 70 such that the substrate carrier 70 can be opposed to the molding die holder 60. Moving, the substrate S and the LED package unit L on the substrate carrier 70 can also be moved closer to or away from the molding cavity 61 of the molding die holder 60, thereby forming the gap, and when the gap is formed, Cooperating with the gas supplied by the gas supply unit 90 to achieve non-destructive demoulding, thereby improving product yield and reliability.

Furthermore, the spirit of the present invention can further derive the demolding mechanism 300 of the third preferred embodiment as shown in the seventh embodiment. The substrate carrier 20' referred to in this embodiment is the aforementioned suction device 50. In this embodiment, the substrate carrier 20' (ie, the suction device 50 of the first embodiment) is used instead of the substrate carrier 20 of the first embodiment to drive the substrate S to perform slight displacement, and when the gap G is formed, the same is borrowed. By supplying the gas A, the purpose of assisting the demolding is smooth.

It should be reiterated here that the spirit of the present invention is not limited to the structure described in the above embodiments, in other words, as long as the substrate S is driven by two relatively movable objects, the LED package unit L is The forming cavity creates a small gap to allow gas to flow into the forming cavity to achieve a mechanical contact-free and uniform gas ejection mode to assist in demolding, which is claimed herein.

The above description is only a preferred and feasible embodiment of the present invention. The equivalent structural changes of the present specification and the scope of the claims are intended to be included in the scope of the invention.

10‧‧‧ molding base

101‧‧‧ top surface

11‧‧‧Forming cavity

12‧‧‧ stomata

13‧‧‧heating unit

20‧‧‧Substrate carrier

20'‧‧‧Substrate carrier

21‧‧‧镂空部

22‧‧‧ Positioning Department

30‧‧‧Acoustic

40‧‧‧ gas supply unit

41‧‧‧Pneumatic source

42‧‧‧Intake pipe

50‧‧‧Attraction device

60‧‧‧ molding base

61‧‧‧Forming cavity

70‧‧‧Substrate carrier

80‧‧‧pressure cylinder

81‧‧‧ piston rod

90‧‧‧ gas supply unit

100‧‧‧Removal mechanism

200‧‧‧Removal mechanism

300‧‧‧Removal mechanism

A‧‧‧ gas

G‧‧‧ gap

L‧‧‧Light Emitting Diode

S‧‧‧Substrate

The first figure discloses a demolding mechanism for a light emitting diode packaging process in accordance with a first preferred embodiment of the present invention.

The second figure discloses a perspective view of a part of the member of the demolding mechanism of the first preferred embodiment.

The third to fifth figures are flow charts of the demolding operation of the demolding mechanism of the first preferred embodiment described above.

Fig. 6 is a view showing a demolding mechanism for a light emitting diode packaging process according to a second preferred embodiment of the present invention.

FIG. 7 is a view showing a demolding mechanism for a light emitting diode packaging process according to a third preferred embodiment of the present invention.

11‧‧‧Forming cavity

12‧‧‧ stomata

20‧‧‧Substrate carrier

30‧‧‧Acoustic

40‧‧‧ gas supply unit

41‧‧‧Pneumatic source

42‧‧‧Intake pipe

50‧‧‧Attraction device

100‧‧‧Removal mechanism

A‧‧‧ gas

G‧‧‧ gap

L‧‧‧Light Emitting Diode

S‧‧‧Substrate

Claims (10)

A demolding mechanism for a light-emitting diode packaging process for promoting a mold release of a substrate carrying a plurality of light-emitting diode package units, the mold release mechanism comprising a movable module and a substrate The molding module has a molding surface having a plurality of molding cavities corresponding to the LED package units, and at least one air hole communicating with the molding cavities for external air inflow And the substrate carrier is configured to carry the substrate, and the relative movement of the substrate carrier and the molding module causes the LED package units to enter or exit the molding cavity. The stripping mechanism for a light emitting diode package process according to claim 1, wherein the substrate carrier has a hollow portion and a positioning portion disposed on a peripheral side of the hollow portion, and a periphery of the substrate is fixed to the substrate a positioning portion, the light emitting diode package units are located in the hollow portion. The demolding mechanism for a light emitting diode packaging process according to claim 2, wherein the molding module is located in the hollow portion. The stripping mechanism for a light emitting diode packaging process according to claim 3, wherein the molding module is fixed, and the substrate carrier is vertically reciprocally displaceable relative to the molding module. The stripping mechanism for a light emitting diode packaging process according to claim 3, wherein the substrate carrier is fixed, and the molding module is vertically reciprocally displaceable relative to the substrate carrier. The demolding mechanism for the LED package process according to claim 3, further comprising an actuator, one end of which is opposite to the molding module, and the other end The substrate is mounted on the substrate. The demolding mechanism for the LED package process of claim 2, further comprising at least one pressure cylinder disposed on the molding module and having a piston rod connected to the substrate carrier. The stripping mechanism for a light emitting diode packaging process according to claim 1, further comprising a gas supply unit having a gas source connected to the at least one air inlet tube and the air inlet tube The air holes communicate with each other, and the gas source supplies the gas, and causes the gas to sequentially enter the air intake tube and the air hole to enter the molding cavity. The stripping mechanism for the LED package process of claim 1, wherein the substrate carrier has a side of the substrate with the light emitting diode package unit, and the demolding mechanism further comprises A suction device is adsorbed to the other side of the substrate by vacuum suction. The stripping mechanism for a light emitting diode packaging process according to claim 9, wherein the attracting device is rotatable to drive the substrate to flip.