TWI444797B - Method for monitoring and controlling abatement systems - Google Patents

Method for monitoring and controlling abatement systems Download PDF

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TWI444797B
TWI444797B TW96131306A TW96131306A TWI444797B TW I444797 B TWI444797 B TW I444797B TW 96131306 A TW96131306 A TW 96131306A TW 96131306 A TW96131306 A TW 96131306A TW I444797 B TWI444797 B TW I444797B
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systems
abatement
effluent
display
presenting
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TW96131306A
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TW200827963A (en
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Youssef A Loldj
Shaun W Crawford
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Applied Materials Inc
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00Control of flow
    • G05D7/06Control of flow characterised by the use of electric means
    • G05D7/0617Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G05D7/0641Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
    • G05D7/0658Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged for the control of a single flow from a plurality of converging flows
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring

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  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Treating Waste Gases (AREA)

Description

用於監測與控制減弱系統之方法Method for monitoring and controlling abatement systems

本發明係關於半導體元件之製造,更具體地係關於用以監測多重減弱系統之方法與系統。This invention relates to the fabrication of semiconductor components, and more particularly to methods and systems for monitoring multiple attenuation systems.

從半導體材料、元件、產品與記憶體物件之製造而來的氣體流,包含在製程設備中所使用以及產生的各種化合物。這些化合物包含了無機與有機化合物、光阻與其他試劑分解的產物,以及其他各種的氣體,在經由製程設備排入大氣之前,都必須由廢氣中移除。Gas streams from the fabrication of semiconductor materials, components, products, and memory articles contain various compounds used and produced in process equipment. These compounds contain inorganic and organic compounds, products of decomposition of photoresists and other agents, and various other gases that must be removed from the exhaust prior to being vented to the atmosphere via process equipment.

半導體製造過程中使用了各種化合物,其中多種化合物的人體容許劑量(human tolerance level)極低。於製程過程中(例如物理氣相沉積、擴散、蝕刻PFC製程、磊晶等),所使用的部分工具(例如化學氣相沉積室、化學機械研磨室、擴散室等)以及製程可能會產生不想要的副產物,例如全氟化物(perfluorocompounds,PFCs)或可能分解成PFCs之副產物。PFCs乃已被認定是造成溫室效應的極大因素。Various compounds are used in the semiconductor manufacturing process, and many of them have extremely low human tolerance levels. During the process (such as physical vapor deposition, diffusion, etching PFC process, epitaxy, etc.), some of the tools used (such as chemical vapor deposition chambers, chemical mechanical polishing chambers, diffusion chambers, etc.) and processes may not be generated. The desired by-products, such as perfluorocompounds (PFCs) or by-products that may decompose into PFCs. PFCs have been identified as a major contributor to the greenhouse effect.

藉由一減弱系統,可將這些不想要的副產物從流出物中移除。基材與平面顯示器/LCD之製程所產生的氣體,可由減弱系統轉換成對環境較少衝擊的形式,再排放環境中。減弱系統可與半導體製程工具耦合,並典型地可在氣體產生時,減弱由工具而來的製程氣體。據此,仍待開發出一種介面,用以操作且監測減弱系統。These unwanted by-products can be removed from the effluent by a weakening system. The gas generated by the substrate and the flat panel display/LCD process can be converted into a form that is less impactful to the environment by the abatement system and then discharged into the environment. The abatement system can be coupled to a semiconductor process tool and typically attenuates process gases from the tool as the gas is generated. Accordingly, an interface has yet to be developed to operate and monitor the abatement system.

於本發明之一態樣中,提供一種監測及控制一或多個減弱系統之方法。該方法包含下列步驟(1)在一顯示器上呈現一或多個減弱系統;(2)在該顯示器上呈現從製程工具而來的一或多個流出物流;(3)在該顯示器上呈現複數個流出物流配置之選擇;(4)接收一所選擇的流出物流配置;以及(5)控制一界面歧管,以執行該所選的流出物流配置。In one aspect of the invention, a method of monitoring and controlling one or more attenuation systems is provided. The method comprises the steps of (1) presenting one or more attenuation systems on a display; (2) presenting one or more effluent streams from the process tool on the display; (3) presenting a plurality of effluent streams on the display Selection of an effluent stream configuration; (4) receiving a selected effluent stream configuration; and (5) controlling an interface manifold to perform the selected effluent stream configuration.

於本發明之另一態樣中,提供一種監測及控制一或多個減弱系統之方法。該方法包含下列步驟(1)在一顯示器上呈現一或多個減弱系統;(2)在該顯示器上呈現從製程工具而來的一或多個流出物流;(3)接受一選擇,該選擇係指示一備用流出物流配置,其中該一或多個減弱系統之一第一子集,係選作為一主要減弱系統,而該一或多個減弱系統之一第二子集,則選作為一備用減弱系統;(4)將該一或多個流出物流導入該一或多個主要減弱系統;(5)將一或多個被用減弱系統設定成一備用模式;以及(6)配置一界面歧管,以依據該主要減弱系統的一狀態,將流出物流從該一或多個主要減弱系統,重新導入該一或多個備用減弱系統。In another aspect of the invention, a method of monitoring and controlling one or more attenuation systems is provided. The method comprises the steps of (1) presenting one or more abatement systems on a display; (2) presenting one or more effluent streams from the process tool on the display; (3) accepting a selection, the selection Instructing an alternate outflow logistics configuration, wherein the first subset of the one or more attenuation systems is selected as a primary attenuation system and the second subset of the one or more attenuation systems is selected as a a standby abatement system; (4) introducing the one or more effluent streams into the one or more primary abatement systems; (5) setting one or more of the abatement systems to be in a standby mode; and (6) configuring an interface disparity And re-importing the effluent stream from the one or more primary abatement systems to the one or more alternate abatement systems in accordance with a state of the primary abatement system.

於本發明之又一態樣中,提供一種監測及控制一或多個減弱系統之方法,該方法包含步驟(1)在一顯示器上呈現一或多個減弱系統;(2)在該顯示器上呈現從製程工具而來的一或多個流出物流;(3)接受一選擇,該選擇係指示一冗餘流出物流配置,其中該一或多個減弱系統之至少一第一減弱系統,則接收從製程工具而來的一或多個流出物流,以及該一或多個減弱系統之至少一第二減弱系統,則接收從製程工具而來的一或多個流出物流;以及(4)配置一界面歧管,以依據一斷線減弱系統的狀態,將該一或多個流出物流從該斷線減弱系統,重新導入一操作中的減弱系統。In yet another aspect of the present invention, a method of monitoring and controlling one or more attenuation systems is provided, the method comprising the steps of (1) presenting one or more attenuation systems on a display; (2) on the display Presenting one or more effluent streams from the process tool; (3) accepting a selection indicating a redundant effluent stream configuration, wherein at least one of the first mitigation systems of the one or more mitigation systems receives One or more effluent streams from the process tool, and at least one second mitigation system of the one or more mitigation systems, receiving one or more effluent streams from the process tool; and (4) arranging one The interface manifold re-introduces the one or more effluent streams from the disconnection abatement system to an operational abatement system in accordance with a disconnection attenuating system condition.

於本發明之另一態樣中,提供一種監測及控制一或多個減弱系統之方法。該方法包含(1)在一顯示器上呈現一或多個減弱系統;(2)在該顯示器上呈現從製程工具而來的一或多個流出物流;(3)接受一選擇,該選擇係指示一載量平衡流出物流配置;以及(4)配置一界面歧管,以依據至少一效率標準,將該流出物流導入該一或多個減弱系統。In another aspect of the invention, a method of monitoring and controlling one or more attenuation systems is provided. The method comprises (1) presenting one or more attenuation systems on a display; (2) presenting one or more effluent streams from the process tool on the display; (3) accepting a selection, the selection is indicative a load balancing effluent stream configuration; and (4) configuring an interface manifold to direct the effluent stream to the one or more abatement systems in accordance with at least one efficiency criterion.

於本發明之又一態樣中,提供一種監測及控制一或多個減弱系統之方法。該方法包含(1)在一顯示器上呈現一或多個減弱系統;(2)在該顯示器上呈現從製程工具而來的一或多個流出物流;(3)接受一選擇,該選擇係指示一特定應用流出物流配置;(4)配置一界面歧管,以將一第一流出物流導入一第一減弱系統,其中該第一流出物流係從一第一製程而來;以及(5)配置一界面歧管,以將一第二流出物流導入一第二減弱系統,其中該第二流出物流係從一第二製程而來。In yet another aspect of the invention, a method of monitoring and controlling one or more attenuation systems is provided. The method comprises (1) presenting one or more attenuation systems on a display; (2) presenting one or more effluent streams from the process tool on the display; (3) accepting a selection, the selection is indicative a specific application effluent stream configuration; (4) configuring an interface manifold to direct a first effluent stream to a first abatement system, wherein the first effluent stream is from a first process; and (5) configuring An interface manifold for introducing a second effluent stream into a second abatement system, wherein the second effluent stream is from a second process.

依據下述之實施方式、申請專利範圍與所附圖示,可使本發明其他特徵與態樣更為清楚。Further features and aspects of the present invention will become apparent from the Detailed Description, the appended claims and appended claims.

本發明係提供一種監測與控制一或多個減弱系統之系統與方法,以將減弱系統整為單一整合系統。本發明能夠自動監測、追蹤以及操作減弱系統和從電子元件製程工具至減弱系統間的流出物流。舉例而言,在具有兩個操作之減弱系統的系統中,操作者可藉由一軟體介面至一系統控制器,檢閱流入每一減弱系統的流出物,並決定僅其中一個減弱系統要在此時容納這些流出物流。之後,操作者可利用介面將合適的轉換輸入系統中,以將第二減弱系統設定成備用模式,而原本流入第二減弱系統的流出物則被導入第一減弱系統。另外,可將系統控制器建構成能自動地使用減弱系統,例如可以最有效率的方式使用。The present invention provides a system and method for monitoring and controlling one or more abatement systems to integrate the abatement system into a single integrated system. The present invention is capable of automatically monitoring, tracking, and operating the abatement system and the effluent stream from the electronic component process tool to the weakened system. For example, in a system with two operational abatement systems, the operator can review the effluent flowing into each of the abatement systems via a software interface to a system controller and decide that only one of the abatement systems is to be These effluent streams are accommodated. Thereafter, the operator can use the interface to convert the appropriate conversion into the system to set the second abatement system to the standby mode, while the effluent originally flowing into the second abatement system is directed to the first abatement system. In addition, the system controller can be constructed to automatically use the abatement system, for example, in the most efficient manner.

於部份實施例中,本發明能使操作者經由界面歧管,將流出物流導至減弱系統,這些岐管可包含一系列的電子控制閥,用以開啟、關閉、及/或轉換一或多個電子元件製程工具與一或多個減弱系統間的通道。界面岐管可與一控制器耦合,並被控制器操作,該控制器係用以接收從界面歧管、操作者、製程工具與減弱系統來的訊息。於部份實施例中,操作者可檢閱這些訊息,之後可將指示經由控制器傳送至界面歧管。另外,控制器可依據從界面歧管、操作者、製程工具與減弱系統所接收到的訊息,自動地操作界面歧管。In some embodiments, the present invention enables an operator to direct an effluent stream to an abatement system via an interface manifold, which may include a series of electronically controlled valves for opening, closing, and/or switching one or A channel between a plurality of electronic component processing tools and one or more abatement systems. The interface manifold can be coupled to a controller and operated by a controller for receiving messages from the interface manifold, the operator, the process tool, and the abatement system. In some embodiments, the operator can review the messages and then communicate the indications to the interface manifold via the controller. In addition, the controller can automatically operate the interface manifold based on messages received from the interface manifold, operator, process tool, and abatement system.

系統控制器可允許一些已預設或操作者設定之流出物流配置的簡易選擇與施行。舉例而言,預設流出物流配置可包含備用配置、冗餘配置、載量平衡配置與特定應用配置。這些流配置類型將於下文中詳述。The system controller allows for easy selection and execution of effluent configurations that have been preset or operator-set. For example, the preset outflow logistics configuration can include an alternate configuration, a redundant configuration, a load balancing configuration, and a specific application configuration. These flow configuration types are detailed below.

參照第1圖,其係繪示使用者介面100之示意圖。使用者介面可由使用標準操作系統之標準個人電腦(PC)執行。另外,可於控制器上執行使用者介面,此係揭露於2006年8月23日所申請之美國專利申請號60/823,292,標題為「具有備用功能之減弱系統及其使用方法(ABATEMENT SYSTEM WITH BACK-UP FUNCTIONALITY AND METHOD OF USING THE SAME)」(代理人案號11469),其全部揭示內容以引用方式併入本文。使用者介面100在顯示器104上,可包含一或多個選擇地互動的減弱系統102之圖像。於此則繪示了三個減弱系統102,然而此僅為示例之用,其可顯示所檢測之任意數目的減弱系統102。每一減弱系統可具有一特定(例如靜態)IP位址,並可經由一集線器,連接至例如個人電腦或伺服器等的單一整合系統。Referring to Figure 1, a schematic diagram of a user interface 100 is shown. The user interface can be executed by a standard personal computer (PC) using a standard operating system. In addition, the user interface can be implemented on the controller, which is disclosed in U.S. Patent Application Serial No. 60/823,292, filed on Aug. 23, 2006, entitled "Attenuation System with Standby Function and Method of Use (ABATEMENT SYSTEM WITH) BACK-UP FUNCTIONALITY AND METHOD OF USING THE SAME) (Attorney Docket No. 11469), the entire disclosure of which is incorporated herein by reference. The user interface 100, on the display 104, can include images of one or more selectively interacting attenuation systems 102. Here, three attenuation systems 102 are illustrated, however this is for illustrative purposes only, and may display any number of attenuation systems 102 detected. Each abatement system can have a specific (e.g., static) IP address and can be connected via a hub to a single integrated system such as a personal computer or server.

使用者介面100亦可包含一或多個流出物流配置106之圖像,該些流出物流配置可施用於每一減弱系統102。舉例而言,流出物流配置可包含一備用流出物流配置、一特定應用流出物流配置、一載量平衡流出物流配置、一冗餘流出物流配置以及一使用者設定流出物流配置。施用於所顯示之減弱系統102A-C的流出物流配置106,可以其他方式標記或指示。於下文中將對流出物流配置有更詳盡描述。User interface 100 may also include images of one or more effluent streams 106 that may be applied to each abatement system 102. For example, the effluent configuration can include a standby effluent configuration, a specific application effluent configuration, a load balancing effluent configuration, a redundant effluent configuration, and a user set effluent configuration. The effluent configuration 106 applied to the weakened systems 102A-C shown may be otherwise marked or indicated. The effluent configuration will be described in more detail below.

操作者(未繪示)可利用使用者介面100遙控安裝在製程系統中的每一減弱系統102,該製程系統係與系統通聯地耦合。操作者可監測與追蹤每一減弱系統102之不同參數(如第2圖所示),亦可操作參數。於部份實施例中,若操作者選擇第一減弱系統102A,則顯示器會顯示關於減弱系統102A之特定訊息,如第2圖所示。An operator (not shown) can remotely install each of the attenuation systems 102 in the process system using the user interface 100, the process system being coupled in series with the system. The operator can monitor and track different parameters of each of the abatement systems 102 (as shown in Figure 2), as well as manipulate the parameters. In some embodiments, if the operator selects the first attenuation system 102A, the display will display a specific message regarding the attenuation system 102A, as shown in FIG.

參照第2圖,其係繪示顯示器200之示意圖,顯示器200呈現於第1圖中所選之第一減弱系統102A。如圖所示,減弱系統202A則以圖示方式呈現。亦可使用其他的呈現方式。可顯示與減弱系統202A相關的數個參數訊息204。參數訊息204可包含例如減弱系統202A每一入口的壓力、CDA流速、燃料流速、槽溫度、每一入口的壓力變化、槽高度(tank level)、洗滌器排氣壓力等。操作者可選擇地操作數個參數,以改變減弱系統202A之功能。Referring to Figure 2, which is a schematic diagram of display 200, display 200 is presented in a first attenuating system 102A selected in Figure 1. As shown, the attenuation system 202A is presented graphically. Other presentation methods can also be used. A number of parameter messages 204 associated with the attenuation system 202A can be displayed. The parameter message 204 can include, for example, attenuating the pressure at each inlet of the system 202A, the CDA flow rate, the fuel flow rate, the bath temperature, the pressure change at each inlet, the tank level, the scrubber exhaust pressure, and the like. The operator can optionally manipulate a number of parameters to change the functionality of the abatement system 202A.

顯示器200亦可包含一警報指示器206。藉由選擇警報指示器206,操作者可檢視與所選之減弱系統202A相關的所有警報與警告。操作者可依據類型(例如警報、警告等)或依據減弱系統202A檢視警報。操作者亦可檢視一指定減弱系統202A之警報歷史。警報、警告或其他相關事件可局部地儲存於PC(例如以文字檔形式)中、自動存於一遠端伺服器或控制器中。Display 200 can also include an alarm indicator 206. By selecting the alarm indicator 206, the operator can view all of the alarms and warnings associated with the selected attenuation system 202A. The operator can view the alarm depending on the type (eg, alarm, warning, etc.) or on the weakening system 202A. The operator can also view the alarm history of a designated attenuation system 202A. Alarms, warnings, or other related events may be stored locally in the PC (eg, in the form of a text file), automatically stored in a remote server or controller.

顯示器200亦可包含趨勢指標208。藉由選擇趨勢指標208,操作者可檢視減弱系統202A的歷史趨勢。舉例而言,由位於減弱系統102A-C(202A-C?)之感測器而來的所有類似數值,可記入一特定速率。操作者可選擇單獨的感測器,並調整感測器最小值與最大值兩者的範圍,以按比例將該趨勢繪入一趨勢顯示中。Display 200 can also include trend indicator 208. By selecting trend indicator 208, the operator can view the historical trend of weakening system 202A. For example, all similar values from the sensors located in the attenuation systems 102A-C (202A-C?) can be credited to a particular rate. The operator can select a separate sensor and adjust the range of both the sensor minimum and maximum values to scale the trend into a trend display.

此外,每一減弱系統202A之資料可以逗號分隔文字檔(common separated value file)(例如CSV等)的形式匯出,其可與耦合至系統的其他工具(例如Excel檔等)相容。In addition, the data for each weakening system 202A can be exported in the form of a common separated value file (eg, CSV, etc.) that is compatible with other tools (eg, Excel files, etc.) coupled to the system.

參照第3圖,其係繪示用以監測及控制一或多個減弱系統之一示例方法的流程圖。於步驟S100中,在顯示器上呈現一或多個減弱系統。在步驟S102中,則在顯示器上呈現一或多個從製程工具而來的流出物流。此外,可在顯示器上呈現一或多個通道,該通道係用以將一或多個流出物流傳送至一或多個減弱系統。於步驟S104中,在顯示器上呈現數個流出物流配置的選擇。流出物流配置可包含一使用者設定配置、一備用配置、一冗餘配置、一載量平衡配置以及一特定應用流出物流配置。之後,在S106中,則接收了指示流出物流配置的選擇。可選地,可在顯示器上呈現用以將一或多個流出物流傳送至一或多個減弱系統的一或多個通道,進而反映出所選的流出物流配置。於步驟S108中,控制位在界面歧管中的數個閥,以執行所選的流出物流配置。Referring to Figure 3, there is shown a flow chart of an exemplary method for monitoring and controlling one or more of the attenuation systems. In step S100, one or more attenuation systems are presented on the display. In step S102, one or more effluent streams from the process tool are presented on the display. Additionally, one or more channels may be presented on the display for communicating one or more effluent streams to one or more abatement systems. In step S104, a selection of a plurality of effluent configurations is presented on the display. The effluent configuration can include a user-configured configuration, an alternate configuration, a redundant configuration, a load balancing configuration, and a specific application effluent configuration. Thereafter, in S106, a selection indicating the configuration of the outflow logistics is received. Alternatively, one or more channels for delivering one or more effluent streams to one or more abatement systems may be presented on the display to reflect the selected effluent stream configuration. In step S108, a number of valves in the interface manifold are controlled to perform the selected effluent configuration.

參照第4圖,其係繪示用以監測及控制一或多個減弱系統之一示例方法的流程圖。於步驟S200中,在顯示器上呈現一或多個減弱系統。在步驟S202中,則在顯示器上呈現一或多個從製程工具而來的流出物流。此外,可在顯示器上呈現一或多個通道,該通道係用以將一或多個流出物流傳送至一或多個減弱系統。於步驟S204中,則接受了指示一備用流出物流配置的選擇。一或多個減弱系統係選作為主要減弱系統,而一或多個減弱系統則選作為備用減弱系統。可依據數個參數,來選擇一或多個減弱系統以作為主要或備用系統。該些主要與備用減弱系統亦可呈現在顯示器上。可選地,可在顯示器上呈現用以將一或多個流出物流傳送至一或多個減弱系統的一或多個通道,進而反映出所選的流出物流配置。於步驟S206中,將一或多個流出物流導至一或多個主要減弱系統。於步驟S208中,則將一或多個備用減弱系統設為備用模式。之後在步驟S210中,配置界面歧管,以依據主要減弱系統的狀態,將流出物流從一或多個主要減弱系統重新導入一或多個備用減弱系統。前述狀態可指出主要減弱系統已斷線。亦可於顯示器上呈現主要與被用減弱系統的更新狀態。Referring to Figure 4, there is shown a flow diagram of an exemplary method for monitoring and controlling one or more of the attenuation systems. In step S200, one or more attenuation systems are presented on the display. In step S202, one or more effluent streams from the process tool are presented on the display. Additionally, one or more channels may be presented on the display for communicating one or more effluent streams to one or more abatement systems. In step S204, a selection indicating a standby outflow configuration is accepted. One or more abatement systems are selected as the primary abatement system, and one or more abatement systems are selected as the alternate abatement system. One or more weakening systems can be selected as primary or backup systems based on a number of parameters. These primary and alternate abatement systems can also be presented on the display. Alternatively, one or more channels for delivering one or more effluent streams to one or more abatement systems may be presented on the display to reflect the selected effluent stream configuration. In step S206, one or more effluent streams are directed to one or more primary abatement systems. In step S208, one or more standby weakening systems are set to the standby mode. Thereafter, in step S210, an interface manifold is configured to reintroduce the effluent stream from one or more primary abatement systems into one or more alternate abatement systems depending on the state of the primary abatement system. The foregoing state may indicate that the primary weakening system has been disconnected. The updated status of the primary and the abatement system can also be presented on the display.

參照第5圖,其係繪示用以監測及控制一或多個減弱系統之一示例方法的流程圖。於步驟S300中,在顯示器上呈現一或多個減弱系統。在步驟S302中,則在顯示器上呈現一或多個從製程工具而來的流出物流。此外,可在顯示器上呈現一或多個通道,該通道係用以將一或多個流出物流傳送至一或多個減弱系統。於步驟S304中,接受了指示冗餘流出物流配置之選擇。可選地,可在顯示器上呈現用以將一或多個流出物流傳送至一或多個減弱系統的一或多個通道,進而反映出所選的流出物流配置。一或多個減弱系統之至少一第一減弱系統則接收從製程工具而來的一或多個流出物流,而一或多個減弱系統之至少一第二減弱系統則接收從製程工具而來的一或多個流出物流。該第一或第二減弱系統其中至少之一者可為斷線。可於顯示器上呈現操作中的與斷線之減弱系統的更新狀態。於步驟S306中,依據斷線減弱系統的狀態,配置界面歧管,以將一或多個流出物流從一斷線減弱系統重新導入一操作中的減弱系統。Referring to Figure 5, there is shown a flow chart of an exemplary method for monitoring and controlling one or more of the attenuation systems. In step S300, one or more attenuation systems are presented on the display. In step S302, one or more effluent streams from the process tool are presented on the display. Additionally, one or more channels may be presented on the display for communicating one or more effluent streams to one or more abatement systems. In step S304, a selection indicating a redundant outflow configuration is accepted. Alternatively, one or more channels for delivering one or more effluent streams to one or more abatement systems may be presented on the display to reflect the selected effluent stream configuration. At least one first abatement system of the one or more attenuation systems receives one or more effluent streams from the process tool, and at least one second abatement system of the one or more attenuation systems receives the process tool One or more effluent streams. At least one of the first or second attenuation systems can be broken. The updated state of the system in operation and the weakening of the disconnection can be presented on the display. In step S306, an interface manifold is configured to re-introduce one or more effluent streams from a disconnection abatement system into an operational abatement system in accordance with the state of the disconnection abatement system.

參照第6圖,其係繪示用以監測及控制一或多個減弱系統之一示例方法的流程圖。於步驟S400中,在顯示器上呈現一或多個減弱系統。在步驟S402中,則在顯示器上呈現一或多個從製程工具而來的流出物流。此外,可在顯示器上呈現一或多個通道,該通道係用以將一或多個流出物流傳送至一或多個減弱系統。於步驟S404中,接收了指示載量平衡流出物流配置之選擇。可選地,可在顯示器上呈現用以將一或多個流出物流傳送至一或多個減弱系統的一或多個通道,進而反映出所選的流出物流配置。之後,於步驟S406中,則依據效率標準,配置界面歧管,以將流出物流導入一或多個減弱系統。每一減弱系統可具有一相關的操作成本,而效率標準可包含例如減弱一特定流出物流之最少成本,減弱一特定流出物流之物力的最少量,減弱一特定流出物流之最少時間。可於顯示器上呈現用以接收流出物流之一或多個減弱系統。Referring to Figure 6, a flow diagram of an exemplary method for monitoring and controlling one or more attenuation systems is shown. In step S400, one or more attenuation systems are presented on the display. In step S402, one or more effluent streams from the process tool are presented on the display. Additionally, one or more channels may be presented on the display for communicating one or more effluent streams to one or more abatement systems. In step S404, a selection is received indicating the load balancing outflow configuration. Alternatively, one or more channels for delivering one or more effluent streams to one or more abatement systems may be presented on the display to reflect the selected effluent stream configuration. Thereafter, in step S406, an interface manifold is configured to introduce the effluent stream into one or more abatement systems in accordance with efficiency criteria. Each abatement system can have an associated operating cost, and the efficiency criteria can include, for example, a minimum cost of a particular effluent stream, a minimum amount of material that reduces a particular effluent stream, and a minimum time to a particular effluent stream. One or more abatement systems can be presented on the display to receive the effluent stream.

參照第7圖,其係繪示用以監測及控制一或多個減弱系統之一示例方法的流程圖。於步驟S500中,在顯示器上呈現一或多個減弱系統。在步驟S502中,則在顯示器上呈現一或多個從製程工具而來的流出物流。此外,可在顯示器上呈現一或多個通道,該通道係用以將一或多個流出物流傳送至一或多個減弱系統。於步驟S504中,接收了指示特定應用流出物流配置之選擇。在步驟S506中,配置界面歧管,以將第一流出物流導入一第一減弱系統。第一流出物流係從第一製程而來。之後,於步驟S508中,配置界面歧管,以將第二流出物流導入一第二減弱系統。第二流出物流係從第二製程而來。第一與第二製程可為相似或不同。舉例而言,第一製程可為基材製造製程,然而,第二製程可為處理室清潔製程。可選地,可在顯示器上呈現用以將一或多個流出物流傳送至一或多個減弱系統的一或多個通道,進而反映出所選的流出物流配置。Referring to Figure 7, a flow diagram of an exemplary method for monitoring and controlling one or more attenuation systems is shown. In step S500, one or more attenuation systems are presented on the display. In step S502, one or more effluent streams from the process tool are presented on the display. Additionally, one or more channels may be presented on the display for communicating one or more effluent streams to one or more abatement systems. In step S504, a selection indicating a particular application outflow configuration is received. In step S506, an interface manifold is configured to direct the first effluent stream to a first abatement system. The first effluent stream comes from the first process. Thereafter, in step S508, an interface manifold is configured to introduce the second effluent stream into a second abatement system. The second effluent stream comes from the second process. The first and second processes can be similar or different. For example, the first process can be a substrate manufacturing process, however, the second process can be a process chamber cleaning process. Alternatively, one or more channels for delivering one or more effluent streams to one or more abatement systems may be presented on the display to reflect the selected effluent stream configuration.

上述內容僅揭示本發明之例示。任何熟習技藝者可迅速理解落入本發明之範圍內的系統與方法的修飾。於部分實施例中,本發明之系統與方法可應用於半導體元件製程及/或電子元件製程。The foregoing merely discloses examples of the invention. Modifications of the systems and methods that fall within the scope of the invention are readily understood by those skilled in the art. In some embodiments, the systems and methods of the present invention are applicable to semiconductor component processing and/or electronic component processing.

據此,雖然本發明已以實施例揭露如上,然其他之更動與潤飾仍不脫離本發明之精神和範圍,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Accordingly, the present invention has been described by way of example only, and other modifications and changes may be made without departing from the spirit and scope of the invention, and the scope of the invention is defined by the scope of the appended claims.

100...使用者介面100. . . user interface

102...減弱系統102. . . Weakening system

104...顯示器104. . . monitor

106...流出物流配置106. . . Outflow logistics configuration

200...顯示器200. . . monitor

202A...減弱系統202A. . . Weakening system

204...參數訊息204. . . Parameter message

206...警報指示器206. . . Alarm indicator

208...趨勢指標208. . . Trend indicator

S100...步驟S100. . . step

S102...步驟S102. . . step

S104...步驟S104. . . step

S106...步驟S106. . . step

S108...步驟S108. . . step

S200...步驟S200. . . step

S202...步驟S202. . . step

S204...步驟S204. . . step

S206...步驟S206. . . step

S208...步驟S208. . . step

S210...步驟S210. . . step

S300...步驟S300. . . step

S302...步驟S302. . . step

S304...步驟S304. . . step

S306...步驟S306. . . step

S400...步驟S400. . . step

S402...步驟S402. . . step

S404...步驟S404. . . step

S406...步驟S406. . . step

S500...步驟S500. . . step

S502...步驟S502. . . step

S504...步驟S504. . . step

S506...步驟S506. . . step

S508...步驟S508. . . step

第1圖係繪示依照本發明之一實施例,一種用以監測及控制一或多個減弱系統之系統的示意圖。1 is a schematic diagram of a system for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention.

第2圖係繪示依照本發明之一實施例,一種用以監測及控制一或多個減弱系統之系統的示意圖。2 is a schematic diagram of a system for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention.

第3圖係繪示依照本發明之一實施例,一種用以監測及控制一或多個減弱系統之示例方法的流程圖。3 is a flow chart showing an exemplary method for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention.

第4圖係繪示依照本發明之一實施例,一種用以監測及控制一或多個減弱系統之示例方法的流程圖。4 is a flow chart showing an exemplary method for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention.

第5圖係繪示依照本發明之一實施例,一種用以監測及控制一或多個減弱系統之示例方法的流程圖。5 is a flow chart showing an exemplary method for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention.

第6圖係繪示依照本發明之一實施例,一種用以監測及控制一或多個減弱系統之示例方法的流程圖。6 is a flow chart showing an exemplary method for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention.

第7圖係繪示依照本發明之一實施例,一種用以監測及控制一或多個減弱系統之示例方法的流程圖。7 is a flow chart showing an exemplary method for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention.

200...顯示器200. . . monitor

202A...減弱系統202A. . . Weakening system

204...參數訊息204. . . Parameter message

206...警報指示器206. . . Alarm indicator

208...趨勢指標208. . . Trend indicator

Claims (29)

一種監測及控制一或多個減弱系統之方法,其至少包含:在一顯示器上呈現一或多個減弱系統;在該顯示器上呈現從製程工具而來的一或多個流出物流;在該顯示器上呈現複數個流出物流配置之選擇;接收一所選擇的流出物流配置;以及控制一界面歧管,以執行該所選的流出物流配置。A method of monitoring and controlling one or more attenuation systems, comprising: presenting one or more attenuation systems on a display; presenting one or more effluent streams from a process tool on the display; A selection of a plurality of effluent configurations is presented; receiving a selected effluent configuration; and controlling an interface manifold to perform the selected effluent configuration. 如申請專利範圍第1項所述之方法,其中該界面歧管包含複數個閥,以執行該所選的流出物流配置。The method of claim 1, wherein the interface manifold comprises a plurality of valves to perform the selected effluent stream configuration. 如申請專利範圍第1項所述之方法,更包含:在該顯示器上呈現一或多個通道,該通道係用以將該一或多個流出物流傳送至該一或多個減弱系統。The method of claim 1, further comprising: presenting one or more channels on the display for communicating the one or more effluent streams to the one or more abatement systems. 如申請專利範圍第3項所述之方法,更包含:在該顯示器上呈現一或多個通道,該通道係用以將該一或多個流出物流傳送至該一或多個減弱系統,以反映出該所選的流出物流配置。The method of claim 3, further comprising: presenting one or more channels on the display for transmitting the one or more effluent streams to the one or more abatement systems to The selected effluent stream configuration is reflected. 如申請專利範圍第1項所述之方法,其中該所選的流出物流配置係由一使用者所設定。The method of claim 1, wherein the selected effluent stream configuration is set by a user. 如申請專利範圍第1項所述之方法,其中該所選的流出物流配置為一備用配置、一冗餘配置、一載量平衡配置以及一特定應用配置之至少一者。The method of claim 1, wherein the selected effluent stream is configured as at least one of a standby configuration, a redundant configuration, a load balancing configuration, and a specific application configuration. 一種監測及控制一或多個減弱系統之方法,其至少包含:在一顯示器上呈現一或多個減弱系統;在該顯示器上呈現從製程工具而來的一或多個流出物流;接受一選擇,該選擇係指示一備用流出物流配置,其中該一或多個減弱系統之一第一子集,則選作為一主要減弱系統,以及該一或多個減弱系統之一第二子集,則選作為一備用減弱系統;將該一或多個流出物流導入該一或多個主要減弱系統;將一或多個備用減弱系統設定成一備用模式;以及配置一界面歧管,以依據該主要減弱系統的一狀態,將流出物流從該一或多個主要減弱系統,重新導入該一或多個備用減弱系統。A method of monitoring and controlling one or more attenuation systems, comprising: presenting one or more attenuation systems on a display; presenting one or more effluent streams from the process tool on the display; accepting a selection The selection indicates an alternate outflow configuration, wherein the first subset of the one or more attenuation systems is selected as a primary attenuation system and a second subset of the one or more attenuation systems, Selecting as an alternate abatement system; directing the one or more effluent streams to the one or more primary abatement systems; setting one or more alternate abatement systems to a standby mode; and configuring an interface manifold to rely on the primary attenuation A state of the system re-introducing the effluent stream from the one or more primary abatement systems to the one or more alternate abatement systems. 如申請專利範圍第7項所述之方法,更包含:接收該一或多個主要減弱系統之狀態,而該一或多個減弱系統係為斷線。The method of claim 7, further comprising: receiving a state of the one or more primary abatement systems, wherein the one or more abatement systems are disconnected. 如申請專利範圍第8項所述之方法,更包含:在該顯示器上呈現該一或多個主要與被用減弱系統的更新狀態。The method of claim 8, further comprising: presenting, on the display, an update status of the one or more primary and used abatement systems. 如申請專利範圍第7項所述之方法,其中選擇該一或多個減弱系統,以作為主要或備用系統之步驟,係依據一或多個參數。The method of claim 7, wherein the step of selecting the one or more attenuation systems as the primary or backup system is based on one or more parameters. 如申請專利範圍第7項所述之方法,更包含:在該顯示器上呈現選作為主要減弱系統之該一或多個減弱系統,及選作為備用減弱系統之該一或多個減弱系統。The method of claim 7, further comprising: presenting the one or more attenuation systems selected as the primary attenuation system on the display, and the one or more attenuation systems selected as the standby attenuation system. 如申請專利範圍第7項所述之方法,更包含:在該顯示器上呈現一或多個通道,該通道係用以將該一或多個流出物流傳送至該一或多個減弱系統。The method of claim 7, further comprising: presenting one or more channels on the display for communicating the one or more effluent streams to the one or more abatement systems. 如申請專利範圍第12項所述之方法,更包含:在該顯示器上呈現該一或多個通道,該通道係用以將該一或多個流出物流傳送至該一或多個減弱系統,以反映出該所選的備用流出物流配置。The method of claim 12, further comprising: presenting the one or more channels on the display, the channels for transmitting the one or more effluent streams to the one or more abatement systems, To reflect the selected alternate effluent configuration. 一種監測及控制一或多個減弱系統之方法,其至少包含:在一顯示器上呈現一或多個減弱系統;在該顯示器上呈現從製程工具而來的一或多個流出物流;接受一選擇,該選擇係指示一冗餘流出物流配置,其中該一或多個減弱系統之至少一第一減弱系統,係接收從製程工具而來的一或多個流出物流,而該一或多個減弱系統之至少一第二減弱系統則接收從製程工具而來的一或多個流出物流;以及配置一界面歧管,以依據一斷線減弱系統的狀態,將該一或多個流出物流從該斷線減弱系統,重新導入一操作中的減弱系統。A method of monitoring and controlling one or more attenuation systems, comprising: presenting one or more attenuation systems on a display; presenting one or more effluent streams from the process tool on the display; accepting a selection The selection indicates a redundant effluent stream configuration, wherein the at least one first abatement system of the one or more abatement systems receives one or more effluent streams from the process tool, and the one or more At least one second abatement system of the system receives one or more effluent streams from the process tool; and an interface manifold is configured to draw the one or more effluent streams from the state of a disconnection abatement system The disconnection weakens the system and re-imports the weakened system in an operation. 如申請專利範圍第14項所述之方法,更包含:接收一狀態,該狀態指示該第一或第二減弱系統之至少其中一者係為斷線。The method of claim 14, further comprising: receiving a state indicating that at least one of the first or second weakening systems is disconnected. 如申請專利範圍第15項所述之方法,更包含:在該顯示器上呈現該一或多個操作中或斷線減弱系統的更新狀態。The method of claim 15, further comprising: presenting an update status of the one or more operational or disconnection abatement systems on the display. 如申請專利範圍第14項所述之方法,更包含:在該顯示器上呈現該一或多個通道,該通道係用以將該一或多個流出物流傳送至該一或多個減弱系統。The method of claim 14, further comprising: presenting the one or more channels on the display for communicating the one or more effluent streams to the one or more abatement systems. 如申請專利範圍第17項所述之方法,更包含:在該顯示器上呈現該一或多個通道,該通道係用以將該一或多個流出物流傳送至該一或多個減弱系統,以反映出該所選的備用流出物流配置。The method of claim 17, further comprising: presenting the one or more channels on the display, the channels for transmitting the one or more effluent streams to the one or more abatement systems, To reflect the selected alternate effluent configuration. 一種監測及控制一或多個減弱系統之方法,其至少包含:在一顯示器上呈現一或多個減弱系統;在該顯示器上呈現從製程工具而來的一或多個流出物流;接受一選擇,該選擇係指示一載量平衡流出物流配置;以及配置一界面歧管,以依據至少一效率標準,將該一或多個流出物流導入該一或多個減弱系統。A method of monitoring and controlling one or more attenuation systems, comprising: presenting one or more attenuation systems on a display; presenting one or more effluent streams from the process tool on the display; accepting a selection The selection is indicative of a load balancing effluent stream configuration; and an interface manifold is configured to direct the one or more effluent streams to the one or more abatement systems in accordance with at least one efficiency criterion. 如申請專利範圍第19項所述之方法,更包含:在該顯示器上呈現該一或多個通道,該通道係用以將該一或多個流出物流傳送至該一或多個減弱系統。The method of claim 19, further comprising: presenting the one or more channels on the display for communicating the one or more effluent streams to the one or more abatement systems. 如申請專利範圍第19項所述之方法,更包含:在該顯示器上呈現該所選的載量平衡流出物流配置。The method of claim 19, further comprising: presenting the selected load balancing effluent stream configuration on the display. 如申請專利範圍第19項所述之方法,其中每一減弱系統具有一相關的操作成本,且其中該效率標準包含減弱一特定流出物流之一最少成本。The method of claim 19, wherein each of the abatement systems has an associated operating cost, and wherein the efficiency criterion comprises attenuating a minimum cost of one of the particular effluent streams. 如申請專利範圍第19項所述之方法,其中每一減弱系統具有一相關的操作成本,且其中該效率標準包含減弱一特定流出物流之物力的最少量。The method of claim 19, wherein each abatement system has an associated operating cost, and wherein the efficiency criterion comprises a minimum amount of material that reduces a particular effluent stream. 如申請專利範圍第19項所述之方法,其中每一減弱系統具有一相關的操作成本,且其中該效率標準包含減弱一特定流出物流之最少時間。The method of claim 19, wherein each abatement system has an associated operating cost, and wherein the efficiency criterion includes a minimum time to attenuate a particular effluent stream. 一種監測及控制一或多個減弱系統之方法,其至少包含:在一顯示器上呈現一或多個減弱系統;在該顯示器上呈現從製程工具而來的一或多個流出物流;接受一選擇,該選擇係指示一特定應用流出物流配置;配置一界面歧管,以將一第一流出物流導入一第一減弱系統,其中該第一流出物流係從一第一製程而來;以及配置一界面歧管,以將一第二流出物流導入一第二減弱系統,其中該第二流出物流係從一第二製程而來。A method of monitoring and controlling one or more attenuation systems, comprising: presenting one or more attenuation systems on a display; presenting one or more effluent streams from the process tool on the display; accepting a selection The selection indicates a particular application effluent configuration; an interface manifold is configured to direct a first effluent stream to a first abatement system, wherein the first effluent stream is from a first process; and a The interface manifold is configured to direct a second effluent stream to a second abatement system, wherein the second effluent stream is from a second process. 如申請專利範圍第25項所述之方法,更包含:在該顯示器上呈現該一或多個通道,該通道係用以將該一或多個流出物流傳送至該一或多個減弱系統。The method of claim 25, further comprising: presenting the one or more channels on the display for communicating the one or more effluent streams to the one or more abatement systems. 如申請專利範圍第26項所述之方法,更包含:在該顯示器上呈現該一或多個通道,該通道係用以將該一或多個流出物流傳送至該一或多個減弱系統,以反映出該所選的特定應用流出物流配置。The method of claim 26, further comprising: presenting the one or more channels on the display, the channels for transmitting the one or more effluent streams to the one or more abatement systems, To reflect the selected specific application outflow logistics configuration. 如申請專利範圍第25項所述之方法,其中該第一製程係不同於該第二製程。The method of claim 25, wherein the first process is different from the second process. 如申請專利範圍第25項所述之方法,其中該第一製程為一製造製程,而該第二製程為一清潔製程。The method of claim 25, wherein the first process is a manufacturing process and the second process is a cleaning process.
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