TWI443482B - System and method for correcting for pressure variations using a motor, computer readable medium - Google Patents

System and method for correcting for pressure variations using a motor, computer readable medium Download PDF

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TWI443482B
TWI443482B TW095142930A TW95142930A TWI443482B TW I443482 B TWI443482 B TW I443482B TW 095142930 A TW095142930 A TW 095142930A TW 95142930 A TW95142930 A TW 95142930A TW I443482 B TWI443482 B TW I443482B
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Taiwan
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pressure
dispensing
valve
volume
pump
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TW095142930A
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Chinese (zh)
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TW200732872A (en
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George Gonnella
James Cedrone
Raymond A Zagers
Robert F Mcloughlin
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Entegris Inc
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B13/00Pumps specially modified to deliver fixed or variable measured quantities
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B45/00Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
    • F04B45/08Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having peristaltic action
    • F04B45/10Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having peristaltic action having plate-like flexible members

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Reciprocating Pumps (AREA)
  • Control Of Positive-Displacement Pumps (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Jet Pumps And Other Pumps (AREA)

Description

用以改正使用一馬達之壓力變化之系統及方法,與電腦可讀媒體System and method for correcting pressure changes using a motor, and computer readable media

本發明大體上係關於流體泵。更明確地說,本發明之實施例係關於多級泵。甚至更明確地說,本發明之實施例係關於對由用於半導體製造之泵中之組件致動所導致之壓力變化的改正。The present invention generally relates to fluid pumps. More specifically, embodiments of the invention relate to multi-stage pumps. Even more specifically, embodiments of the present invention relate to corrections to pressure changes caused by actuation of components in a pump for semiconductor manufacturing.

存在對泵裝置施配之流體之量及/或速率之精確控制為必要的許多應用。舉例而言,在半導體處理中,重要的是控制諸如光阻化學品之光化學品塗覆至半導體晶圓之量及速率。在處理期間塗覆至半導體晶圓之塗層通常需要以埃為單位而量測之在晶圓之整個表面上的平坦度。必須控制處理化學品塗覆至晶圓之速率,以確保均勻地塗覆處理液體。There are many applications where precise control of the amount and/or rate of fluid dispensed to the pump device is necessary. For example, in semiconductor processing, it is important to control the amount and rate at which a photochemical such as a photoresist chemical is applied to a semiconductor wafer. Coatings applied to semiconductor wafers during processing typically require flatness on the entire surface of the wafer measured in angstroms. The rate at which the treatment chemicals are applied to the wafer must be controlled to ensure uniform application of the treatment liquid.

現今,用於半導體工業中之許多光化學品非常昂貴,通常花費多達每公升$1000。因此,較佳的是確保使用最少但充足量之化學品並確保化學品不受到泵裝置之損害。當前的多級泵可導致液體中之急劇的壓力尖峰。舉例而言,負的壓力尖峰可促進化學品中之除氣作用及氣泡形成,此可導致晶圓塗佈之缺陷。類似地,正的壓力尖峰可導致過早的聚合物交聯,此亦可導致塗佈缺陷。Today, many of the photochemicals used in the semiconductor industry are very expensive and typically cost as much as $1000 per liter. Therefore, it is preferred to ensure the use of a minimum but sufficient amount of chemicals and to ensure that the chemicals are not damaged by the pumping device. Current multistage pumps can cause sharp pressure spikes in the liquid. For example, negative pressure spikes can promote outgassing and bubble formation in chemicals, which can lead to defects in wafer coating. Similarly, positive pressure spikes can lead to premature polymer cross-linking, which can also lead to coating defects.

可看出,此等壓力尖峰及隨後之壓力降可損害流體(亦即,可不利地改變流體之物理特性)。另外,壓力尖峰可導致積聚流體壓力,此可導致施配泵所施配之流體多於所欲之流體或以具有不利動力學之方式來施配流體。It can be seen that such pressure spikes and subsequent pressure drops can damage the fluid (i.e., can adversely alter the physical properties of the fluid). Additionally, pressure spikes can cause accumulated fluid pressure, which can result in the dispensing pump dispensing more fluid than desired or dispensing the fluid in a manner that is unfavorable.

更具體言之,當關閉一閥以在泵裝置內產生一入陷空間時,此閥之關閉可在此封閉空間內導致壓力增加。當此壓力增加發生於含有待施配之流體的施配腔室中時,其可能尤為有害的。因此,需要一種用以補償歸因於泵裝置內閥之移動而引起之壓力增加的方式。More specifically, when a valve is closed to create a trap space in the pump unit, the closing of the valve can cause an increase in pressure in the enclosed space. This pressure increase may be particularly detrimental when this pressure increase occurs in the dispensing chamber containing the fluid to be dispensed. Therefore, there is a need for a way to compensate for the increase in pressure due to movement of the valve within the pump device.

本發明係關於用於補償可發生於一泵裝置之各種封閉空間中之壓力增加(或減少)之系統及方法。本發明之實施例可藉由移動泵裝置之泵構件來調整腔室之容積以補償腔室中之壓力增加(或減少)而補償泵裝置之腔室中的壓力增加(或減少)。更具體言之,在一實施例中,為了解決對施配腔室中之流體之不需要的壓力增加,可使施配馬達反轉以收回活塞來補償施配腔室中之任何壓力增加。The present invention relates to systems and methods for compensating for pressure build-up (or reduction) that can occur in various enclosed spaces of a pumping device. Embodiments of the present invention may compensate for an increase (or decrease) in the chamber of the pump device by adjusting the volume of the chamber by moving the pump member of the pump device to compensate for an increase (or decrease) in pressure in the chamber. More specifically, in one embodiment, to address an undesired increase in pressure to the fluid in the dispensing chamber, the dispensing motor can be reversed to retract the piston to compensate for any pressure increase in the dispensing chamber.

本發明之實施例提供用於改正壓力波動之系統及方法,其大體上消除或減少先前所開發之泵系統及方法之缺點。更明確地說,本發明之實施例提供一種用以改正施配腔室中由多級泵或結合多級泵而使用之設備之內部的各種機構或組件之致動所導致之壓力波動之系統及方法。Embodiments of the present invention provide systems and methods for correcting pressure fluctuations that substantially eliminate or reduce the disadvantages of previously developed pump systems and methods. More specifically, embodiments of the present invention provide a system for correcting pressure fluctuations caused by actuation of various mechanisms or components within a dispensing chamber that are internal to a multi-stage pump or a multi-stage pump. And methods.

在施配段開始之前,本發明之一實施例可改正施配腔室中由一淨化閥之關閉所導致之壓力變化。此改正係藉由使一施配馬達反轉以使得施配腔室之容積大體上增加淨化閥之滯留容積來達成。Prior to the beginning of the dispensing section, an embodiment of the present invention can correct for pressure changes in the dispensing chamber caused by the closure of a purge valve. This correction is achieved by reversing a dispensing motor such that the volume of the dispensing chamber substantially increases the retention volume of the purge valve.

在施配段之前,本發明之另一實施例藉由使施配馬達反轉一額外距離且使施配馬達向前移動一等於此額外距離之量來確保施配馬達之最後運動處於向前方向上。Prior to the dispensing section, another embodiment of the present invention ensures that the final motion of the dispensing motor is forward by reversing the dispensing motor by an additional distance and moving the dispensing motor forward by an amount equal to the additional distance. up.

本發明之實施例可提供以下技術優勢:允許在施配段之前於施配腔室中達成用於施配之所需基線壓力。Embodiments of the present invention may provide the technical advantage of allowing the desired baseline pressure for dispensing to be achieved in the dispensing chamber prior to the dispensing section.

本發明之其他實施例可提供補償結合多級泵而使用之設備之差異(諸如系統之間的輸送壓力差)的能力。Other embodiments of the present invention can provide the ability to compensate for differences in equipment used in conjunction with multi-stage pumps, such as differential pressures of delivery between systems.

本發明之某些實施例藉由解決可發生於施配馬達之驅動總成中之任何齒隙以使得該齒隙對施配具有可忽略的效應來提供一優勢。Certain embodiments of the present invention provide an advantage by addressing any backlash that can occur in a drive assembly of a mating motor such that the backlash has a negligible effect on the dispense.

當結合以下描述及隨附圖式來考慮時,將更好地瞭解及理解本發明之此等及其他態樣。在指示本發明之各種實施例及其許多特定細節時,以下描述係以說明之方式而非限制之方式來給出。可在本發明之範疇內進行許多替換、修改、添加或再配置,且本發明包括所有此等替換、修改、添加或再配置。These and other aspects of the present invention will be better understood and understood from the <RTIgt; The following description is presented by way of illustration and not limitation Many alternatives, modifications, additions or re-configurations are possible within the scope of the invention, and the invention includes all such substitutions, modifications, additions or re-configurations.

圖中說明本發明之較佳實施例,相似數字用於指代各種圖式之相似及相應部分。The preferred embodiments of the present invention are illustrated in the drawings, and like numerals are used to refer to the

本發明之實施例係關於一種使用一泵來準確地施配流體之泵系統,該泵可為單級泵或多級泵。更明確地說,本發明之實施例可補償可發生於泵裝置之各種封閉空間中的壓力增加(或減少)。本發明之實施例可藉由移動泵裝置之泵構件來調整腔室之容積以補償壓力變化而補償泵裝置之腔室中的壓力變化。更具體言之,在一實施例中,為了解決對施配腔室中之流體之不需要的壓力增加,可使施配馬達反轉以收回活塞來補償施配腔室中之任何壓力增加。此泵系統之實施例揭示於全文以引用之方式併入本文中的由發明者James Cedrone、George Gonnella及Iraj Gashgaee於2005年12月5日提出申請之標題為"System And Method For Multi-Stage Pump With Reduced Form Factor"的美國臨時專利申請案第60/742,435號中。Embodiments of the present invention relate to a pump system that uses a pump to accurately dispense fluid, which may be a single stage pump or a multi-stage pump. More specifically, embodiments of the present invention compensate for the increase (or decrease) in pressure that can occur in various enclosed spaces of the pump device. Embodiments of the present invention can compensate for pressure changes in the chamber of the pump device by moving the pump member of the pump device to adjust the volume of the chamber to compensate for pressure changes. More specifically, in one embodiment, to address an undesired increase in pressure to the fluid in the dispensing chamber, the dispensing motor can be reversed to retract the piston to compensate for any pressure increase in the dispensing chamber. An example of such a pump system is disclosed in the inventors by James Cedrone, George Gonnella, and Iraj Gashgaee on December 5, 2005, entitled "System And Method For Multi-Stage Pump". U.S. Provisional Patent Application Serial No. 60/742,435, the disclosure of which is incorporated herein by reference.

圖1為泵系統10之一此實施例的圖示。泵系統10可包括一流體源15、一泵控制器20及一多級泵100,其共同工作以將流體施配於一晶圓25上。多級泵100之運作可藉由泵控制器20來控制,泵控制器20可自載於多級泵100上或經由用於傳達控制信號、資料或其他資訊之一或多個通信鏈路而連接至多級泵100。另外,泵控制器20之功能性可分佈於一機上控制器與另一控制器之間。泵控制器20可包括一含有一組用於控制多級泵100之運作之控制指令30的電腦可讀媒體27(例如,RAM、ROM、快閃記憶體、光碟、磁碟機或其他電腦可讀媒體)。一處理器35(例如,CPU、ASIC、RISC、DSP或其他處理器)可執行該等指令。處理器之一實例為Texas Instruments TMS320F2812PGFA 16位元DSP(Texas Instruments為生產基地在TX州Dallas市的公司)。在圖1之實施例中,控制器20經由通信鏈路40及45而與多級泵100通信。通信鏈路40及45可為網路(例如,乙太網路、無線網路、全球區域網路、DeviceNet網路或此項技術中已知或開發之其他網路)、匯流排(例如,SCSI匯流 排)或其他通信鏈路。控制器20可被建構為一自載PCB板、遠端控制器或以其他適合的方式來建構。泵控制器20可包括對控制器所建立之適當介面(例如,網路介面、I/O介面、類比數位轉換器及其他組件)以與多級泵100通信。另外,泵控制器20可包括此項技術中已知之各種電腦組件,包括為了簡明起見而未展示之處理器、記憶體、介面、顯示器件、周邊裝置或其他電腦組件。泵控制器20可控制多級泵中之各種閥及馬達以使多級泵準確地施配流體,包括低黏度流體(亦即,小於100厘泊(centipoise))或其他流體。可使用如描述於以引用之方式來全部併入本文中的由Cedrone等人於2005年12月2日提出申請之標題為"I/O Interface System and Method for a Pump"的美國專利申請案第60/741,657號及於2006年11月20日提出申請之標題為"I/O Systems,Methods and Devices for Interfacing a Pump Controller"的美國專利申請案第11/602,449號[ENTG1810-1]中之I/O介面連接器來將泵控制器20連接至各種介面及製造工具。FIG. 1 is an illustration of one such embodiment of a pump system 10. The pump system 10 can include a fluid source 15, a pump controller 20, and a multi-stage pump 100 that cooperate to dispense fluid onto a wafer 25. The operation of the multi-stage pump 100 can be controlled by a pump controller 20 that can be self-contained on the multi-stage pump 100 or via one or more communication links for communicating control signals, data or other information. Connected to the multistage pump 100. Additionally, the functionality of the pump controller 20 can be distributed between an on-board controller and another controller. The pump controller 20 can include a computer readable medium 27 (eg, RAM, ROM, flash memory, compact disc, disk drive, or other computer) containing a set of control commands 30 for controlling the operation of the multi-stage pump 100. Read the media). A processor 35 (eg, a CPU, ASIC, RISC, DSP, or other processor) can execute the instructions. An example of a processor is the Texas Instruments TMS320F2812PGFA 16-bit DSP (Texas Instruments is a manufacturing facility in Dallas, TX). In the embodiment of FIG. 1, controller 20 is in communication with multi-stage pump 100 via communication links 40 and 45. Communication links 40 and 45 can be networks (e.g., Ethernet, wireless networks, global area networks, DeviceNet networks, or other networks known or developed in the art), bus bars (e.g., SCSI sink Row) or other communication link. Controller 20 can be constructed as a self-contained PCB board, remote controller, or otherwise constructed. Pump controller 20 may include an appropriate interface (eg, a network interface, an I/O interface, an analog to digital converter, and other components) established for the controller to communicate with multi-stage pump 100. Additionally, pump controller 20 may include various computer components known in the art, including processors, memory, interfaces, display devices, peripheral devices, or other computer components not shown for the sake of brevity. The pump controller 20 can control various valves and motors in the multi-stage pump to enable the multi-stage pump to accurately dispense fluids, including low viscosity fluids (i.e., less than 100 centipoise) or other fluids. U.S. Patent Application Serial No. entitled "I/O Interface System and Method for a Pump", filed on Dec. 2, 2005 by Cedrone et al., which is incorporated herein by reference. I of U.S. Patent Application Serial No. 11/602,449 [ENTG1810-1], entitled "I/O Systems, Methods and Devices for Interfacing a Pump Controller", filed on Nov. 20, 2006. The /O interface connector connects the pump controller 20 to various interfaces and manufacturing tools.

圖2為多級泵100之圖示。多級泵100包括一饋入級部分105及一獨立施配級部分110。自流體流動之觀點而言,位於饋入級部分105與施配級部分110之間的為用以過濾來自處理流體之雜質的過濾器120。許多閥可控制流經多級泵100之流體流動,包括(例如)入口閥125、隔離閥130、阻障閥135、淨化閥140、排放閥145及出口閥147。施配級部分110可進一步包括一判定施配級110處流體之壓力的壓力感應器112。如下文所述,由壓力感應器112所判定之壓力可 用於控制各種泵之速度。實例壓力感應器包括陶瓷及聚合物壓阻性及電容性壓力感應器,包括由德國Korb之Metallux AG所製造的壓力感應器。根據一實施例,壓力感應器112之接觸處理流體之面為全氟聚合物。泵100可包括額外之壓力感應器,諸如用以讀取饋入腔室155中之壓力的壓力感應器。2 is an illustration of a multi-stage pump 100. The multi-stage pump 100 includes a feed stage portion 105 and an independent dispense stage portion 110. From the viewpoint of fluid flow, between the feed stage portion 105 and the dispense stage portion 110 is a filter 120 for filtering impurities from the treatment fluid. A number of valves control the flow of fluid through the multi-stage pump 100, including, for example, the inlet valve 125, the isolation valve 130, the barrier valve 135, the purge valve 140, the discharge valve 145, and the outlet valve 147. The dispensing stage portion 110 can further include a pressure sensor 112 that determines the pressure of the fluid at the dispensing stage 110. As described below, the pressure determined by the pressure sensor 112 can be Used to control the speed of various pumps. Example pressure sensors include ceramic and polymer piezoresistive and capacitive pressure sensors, including pressure sensors manufactured by Metallux AG of Korb, Germany. According to an embodiment, the surface of the pressure sensor 112 that contacts the treatment fluid is a perfluoropolymer. Pump 100 may include an additional pressure sensor, such as a pressure sensor to read the pressure fed into chamber 155.

饋入級105及施配級110可包括滾動隔膜泵以抽汲多級泵110中之流體。饋入級泵150("饋入泵150")(例如)包括一用以收集流體之饋入腔室155、一用以在饋入腔室155內移動且移位流體之饋入級隔膜160、一用以移動饋入級隔膜160之活塞165、一導螺桿170及一步進馬達175。導螺桿170經由一螺帽、齒輪或用於將來自馬達之能量賦予導螺桿170之其他機構而耦接至步進馬達175。根據一實施例,饋入馬達175使一螺帽旋轉,該螺帽又使導螺桿170旋轉,從而使活塞165致動。施配級泵180("施配泵180")可類似地包括一施配腔室185、一施配級隔膜190、一活塞192、一導螺桿195及一施配馬達200。施配馬達200可經由一螺紋螺帽(例如,Torlon或其他材料螺帽)而驅動導螺桿195。Feed stage 105 and dispensing stage 110 can include a rolling diaphragm pump to pump fluid in multi-stage pump 110. The feed stage pump 150 ("feed pump 150") includes, for example, a feed chamber 155 for collecting fluid, a feed stage diaphragm 160 for moving within the feed chamber 155 and displacing fluid. One for moving the piston 165 fed into the stage diaphragm 160, a lead screw 170 and a stepping motor 175. The lead screw 170 is coupled to the stepper motor 175 via a nut, gear or other mechanism for imparting energy from the motor to the lead screw 170. According to an embodiment, the feed motor 175 rotates a nut which in turn rotates the lead screw 170 to actuate the piston 165. The dispensing stage pump 180 ("dispensing pump 180") can similarly include a dispensing chamber 185, a dispensing stage diaphragm 190, a piston 192, a lead screw 195, and a dispensing motor 200. The dosing motor 200 can drive the lead screw 195 via a threaded nut (eg, a Torlon or other material nut).

根據其他實施例,饋入級105及施配級110可為包括氣動或液壓致動泵、液壓泵或其他泵之各種其他泵。使用一用於饋入級之氣動致動泵及一步進馬達驅動液壓泵之多級泵之一實例描述於美國專利申請案第11/051,576號中。然而,在兩個級處使用馬達提供以下一優勢:消除了液壓管路、控制系統及流體,藉此減少了空間及潛在洩漏。According to other embodiments, the feed stage 105 and the dispense stage 110 can be various other pumps including pneumatic or hydraulically actuated pumps, hydraulic pumps, or other pumps. An example of a multi-stage pump that uses a pneumatically actuated pump for a feed stage and a stepper motor to drive a hydraulic pump is described in U.S. Patent Application Serial No. 11/051,576. However, the use of a motor at two stages provides the advantage of eliminating hydraulic lines, control systems, and fluids, thereby reducing space and potential leakage.

饋入馬達175及施配馬達200可為任何適合之馬達。根據一實施例,施配馬達200為永磁同步馬達("PMSM")。該PMSM可藉由在馬達200處使用場導向控制("FOC")或此項技術中已知之其他類型之位置/速度控制之數位信號處理器("DSP")、自載於多級泵100上之控制器或獨立泵控制器(例如,如圖1中所示)來控制。PMSM 200可進一步包括一用於施配馬達200之位置之即時回饋的編碼器(例如,細線旋轉位置編碼器)。位置感應器之使用給予活塞192之位置之準確且可重複的控制,此導致對施配腔室185中之流體移動之準確且可重複的控制。舉例而言,藉由使用一根據一實施例將8000個脈衝提供給DSP之2000線編碼器,有可能對0.045度之旋轉進行準確地量測及在0.045度之旋轉下進行控制。另外,PMSM可在很少有振動或沒有振動之情況下以低速來運轉。饋入馬達175亦可為PMSM或步進馬達。亦應注意,饋入泵可包括一本地感應器以指示饋入泵何時處於其原位。Feed motor 175 and dispense motor 200 can be any suitable motor. According to an embodiment, the dispensing motor 200 is a permanent magnet synchronous motor ("PMSM"). The PMSM can be self-contained in the multi-stage pump 100 by using field oriented control ("FOC") at the motor 200 or other type of position/speed controlled digital signal processor ("DSP") known in the art. The upper controller or independent pump controller (eg, as shown in Figure 1) is controlled. The PMSM 200 can further include an encoder (e.g., a fine line rotational position encoder) for dispensing the instantaneous feedback of the position of the motor 200. The use of a position sensor gives accurate and repeatable control of the position of the piston 192, which results in accurate and repeatable control of fluid movement in the dispensing chamber 185. For example, by using a 2000 line encoder that provides 8000 pulses to the DSP in accordance with an embodiment, it is possible to accurately measure the 0.045 degree rotation and control at 0.045 degrees of rotation. In addition, the PMSM can operate at low speed with little or no vibration. The feed motor 175 can also be a PMSM or a stepper motor. It should also be noted that the feed pump can include a local sensor to indicate when the feed pump is in its home position.

圖3A為用於多級泵100之泵總成之一實施例的圖示。多級泵100可包括一施配區塊205,施配區塊205界定通過多級泵100之各種流體流徑且至少部分地界定饋入腔室155及施配腔室185。根據一實施例,施配泵區塊205可為PTFE、經改質PTFE或其他材料之整體區塊。因為此等材料不與許多處理流體發生反應或與許多處理流體最低限度地發生反應,所以此等材料之使用允許以最少量的額外硬體來將流道及泵腔室直接加工於施配區塊205中。施配區塊205因此藉由提供一整合之流體歧管而減少對管路之需要。FIG. 3A is an illustration of one embodiment of a pump assembly for a multi-stage pump 100. The multi-stage pump 100 can include a dispensing block 205 that defines various fluid flow paths through the multi-stage pump 100 and at least partially defines the feed chamber 155 and the dispensing chamber 185. According to an embodiment, the dispense pump block 205 can be an integral block of PTFE, modified PTFE, or other material. Because these materials do not react with many treatment fluids or react minimally with many treatment fluids, the use of such materials allows the flow path and pump chamber to be directly processed into the dispensing zone with a minimum amount of additional hardware. In block 205. The dispensing block 205 thus reduces the need for piping by providing an integrated fluid manifold.

施配區塊205可包括各種外部入口及出口,包括(例如)用於收納流體之入口210、用於在排放段期間排放流體之排放出口215,及用於在施配段期間施配流體之施配出口220。在圖3A之實例中,由於將淨化流體導引回至饋入腔室(如圖4A及圖4B所示),所以施配區塊205不包括一外部淨化出口。然而,在本發明之其他實施例中,可在外部淨化流體。以引用之方式全部併入本文中的由Iraj Gashgaee於2005年12月2日提出申請之標題為"O-Ring-Less Low Profile Fitting and Assembly Thereof"的美國臨時專利申請案第60/741,667號描述可用於將施配區塊205之外部入口及出口連接至流體線之接頭的實施例。The dispensing block 205 can include various external inlets and outlets, including, for example, an inlet 210 for containing fluid, a discharge outlet 215 for discharging fluid during the discharge section, and for dispensing fluid during the dispensing section. The outlet 220 is dispensed. In the example of FIG. 3A, since the purge fluid is directed back to the feed chamber (as shown in Figures 4A and 4B), the dispense block 205 does not include an external purge outlet. However, in other embodiments of the invention, the fluid can be purified externally. U.S. Provisional Patent Application Serial No. 60/741,667, entitled "O-Ring-Less Low Profile Fitting and Assembly Thereof", filed on December 2, 2005 by Iraj Gashgaee, incorporated herein by reference. Embodiments that can be used to connect the outer inlet and outlet of the dispensing block 205 to the fluid line.

施配區塊205將流體導引至饋入泵、施配泵及過濾器120。一泵蓋225可保護饋入馬達175及施配馬達200不受到損害,而活塞外殼227可為活塞165及活塞192提供保護,且根據本發明之一實施例,活塞外殼227可由聚乙烯或其他聚合物形成。閥板230為可經組態以引導流體流向多級泵100之各種組件的閥系統(例如,圖2之入口閥125、隔離閥130、阻障閥135、淨化閥140及排放閥145)提供一閥外殼。根據一實施例,入口閥125、隔離閥130、阻障閥135、淨化閥140及排放閥145中之每一者至少部分地整合於閥板230中,且為一視將壓力還是真空施加至相應隔膜而打開或關閉之隔膜閥。在其他實施例中,該等閥中之一些可在施配區塊205之外部或配置於額外閥板中。根據一實施例,PTFE薄片夾於閥板230與施配區塊205之間以形成各種閥之隔膜。閥板230包括一用於每一閥之閥控制入口以將壓力或真空施加至相應隔膜。舉例而言,入口235對應於阻障閥135,入口240對應於淨化閥140,入口245對應於隔離閥130,入口250對應於排放閥145,且入口255對應於入口閥125(在此情況下,出口閥147在外部)。藉由將壓力或真空選擇性地施加至該等入口,打開及關閉相應閥。The dispensing block 205 directs fluid to the feed pump, the dispense pump, and the filter 120. A pump cover 225 protects the feed motor 175 and the dispense motor 200 from damage, while the piston housing 227 provides protection for the piston 165 and the piston 192, and the piston housing 227 may be polyethylene or other in accordance with an embodiment of the present invention. The polymer is formed. Valve plate 230 is provided for a valve system (eg, inlet valve 125, isolation valve 130, barrier valve 135, purge valve 140, and discharge valve 145 of FIG. 2) that can be configured to direct fluid flow to various components of multi-stage pump 100. A valve housing. According to an embodiment, each of the inlet valve 125, the isolation valve 130, the barrier valve 135, the purge valve 140, and the discharge valve 145 is at least partially integrated into the valve plate 230 and is applied to the pressure or vacuum at a point A diaphragm valve that opens or closes with the corresponding diaphragm. In other embodiments, some of the valves may be external to the dispensing block 205 or disposed in an additional valve plate. According to an embodiment, the PTFE sheet is sandwiched between the valve plate 230 and the dispensing block 205 to form a diaphragm for the various valves. Valve plate 230 includes a valve control inlet for each valve to apply pressure or vacuum to the respective diaphragm. For example, the inlet 235 corresponds to the barrier valve 135, the inlet 240 corresponds to the purge valve 140, the inlet 245 corresponds to the isolation valve 130, the inlet 250 corresponds to the discharge valve 145, and the inlet 255 corresponds to the inlet valve 125 (in this case The outlet valve 147 is external). The respective valves are opened and closed by selectively applying pressure or vacuum to the inlets.

閥控制氣體及真空係經由閥控制供應線260而提供至閥板230,閥控制供應線260經由施配區塊205而自一閥控制歧管(在頂蓋263或外殼蓋225之下的一區域中)延伸至閥板230。閥控制氣體供應入口265將一加壓氣體提供至閥控制歧管,且真空入口270將真空(或低壓)提供至閥控制歧管。閥控制歧管充當三通閥以經由供應線260而將加壓氣體或真空導引至閥板230之適當入口以致動相應閥。在一實施例中,可使用諸如描述於以引用之方式全部併入本文中的由Gashgaee等人於2006年11月20日提出申請之標題為"Fixed Volume Valve System"的美國專利申請案第11/602,457號[ENTG1770-1]中之閥板的閥板,其減少閥之滯留容積、消除歸因於真空波動而引起之容積波動、減少真空需求且減少對閥隔膜之應力。The valve control gas and vacuum are provided to the valve plate 230 via the valve control supply line 260, which controls the manifold from a valve (via the top cover 263 or the housing cover 225) via the dispensing block 205 In the region) extends to the valve plate 230. The valve control gas supply inlet 265 provides a pressurized gas to the valve control manifold and the vacuum inlet 270 provides a vacuum (or low pressure) to the valve control manifold. The valve control manifold acts as a three-way valve to direct pressurized gas or vacuum to the appropriate inlet of valve plate 230 via supply line 260 to actuate the respective valve. In an embodiment, U.S. Patent Application Serial No. 11 entitled "Fixed Volume Valve System", filed on November 20, 2006, by Gashgaee et al. The valve plate of the valve plate of /602,457 [ENTG1770-1] reduces the retention volume of the valve, eliminates volume fluctuations due to vacuum fluctuations, reduces vacuum requirements, and reduces stress on the valve diaphragm.

圖3B為多級泵100之另一實施例的圖示。圖3B中所示之許多特徵類似於上文結合圖3A而描述之特徵。然而,圖3B之實施例包括用以防止流體滴液進入多級泵100之容納電子器件之區域的若干特徵。舉例而言,當操作者連接或斷開來自入口210、出口215或排放口220之管道時,可發生滴液。"防滴"特徵經設計以防止潛在有害之化學品之滴液進入泵(尤其是電子腔室),且其未必要求泵為"防水的"(例如,可浸沒於流體中而無洩漏)。根據其他實施例,可完全密封該泵。FIG. 3B is an illustration of another embodiment of a multi-stage pump 100. Many of the features shown in Figure 3B are similar to those described above in connection with Figure 3A. However, the embodiment of FIG. 3B includes several features to prevent fluid dripping into the area of the multi-stage pump 100 that houses the electronics. For example, dripping can occur when an operator connects or disconnects a conduit from inlet 210, outlet 215, or vent 220. The "anti-drip" feature is designed to prevent drops of potentially harmful chemicals from entering the pump (especially the electronics chamber) and it does not necessarily require the pump to be "water resistant" (eg, immersible in the fluid without leakage). According to other embodiments, the pump can be completely sealed.

根據一實施例,施配區塊205可包括一自施配區塊205之與頂蓋263接合之邊緣向外突出的垂直突出之凸緣或唇緣272。根據一實施例,在頂部邊緣上,頂蓋263之頂部與唇緣272之頂部表面齊平。此導致在施配區塊205與頂蓋263之頂部介面附近的滴液傾向於在施配區塊205上流動,而非經由該介面。然而,在側面上,頂蓋263與唇緣272之基底齊平,或另外自唇緣272之外表面向內偏移。此導致滴液傾向於沿由頂蓋263與唇緣272所建立之拐角流下,而非在頂蓋263與施配區塊205之間流下。另外,在頂蓋263之頂部邊緣與背板271之間置放一橡膠密封件以防止滴液在頂蓋263與背板271之間洩漏。According to an embodiment, the dispensing block 205 can include a vertically projecting flange or lip 272 that projects outwardly from the edge of the dispensing block 205 that engages the top cover 263. According to an embodiment, the top of the top cover 263 is flush with the top surface of the lip 272 on the top edge. This causes the drip near the top interface of the dispensing block 205 and the top cover 263 to tend to flow over the dispensing block 205 rather than through the interface. However, on the side, the top cover 263 is flush with the base of the lip 272 or otherwise offset inwardly from the outer surface of the lip 272. This causes the drip to flow down the corner established by the top cover 263 and the lip 272 rather than between the top cover 263 and the dispensing block 205. In addition, a rubber seal is placed between the top edge of the top cover 263 and the backing plate 271 to prevent the dripping from leaking between the top cover 263 and the backing plate 271.

施配區塊205亦可包括傾斜特徵273,傾斜特徵273包括一界定於施配區塊205內之傾斜表面,該表面向下並遠離泵100之容納電子器件之區域傾斜。因此,將在施配區塊205之頂部附近之滴液導引遠離電子器件。另外,泵蓋225亦可自施配區塊205之外側邊緣稍微向內偏移,使得沿泵100之側面流下的滴液將傾向於流過泵蓋225與泵100之其他部分之介面。The dispensing block 205 can also include a sloped feature 273 that includes an angled surface defined within the dispensing block 205 that slopes downwardly and away from the area of the pump 100 that houses the electronics. Thus, the drip near the top of the dispensing block 205 is directed away from the electronics. Additionally, the pump cover 225 may also be slightly offset inwardly from the outer edge of the dispensing block 205 such that dripping from the side of the pump 100 will tend to flow through the interface between the pump cover 225 and other portions of the pump 100.

根據本發明之一實施例,在一金屬蓋與施配區塊205建立介面之處,金屬蓋之垂直表面可自施配區塊205之相應垂直表面稍微向內偏移(例如,1/64英吋或0.396875毫米)。另外,多級泵100可包括密封件、傾斜特徵及其他特徵以防止滴液進入多級泵100之容納電子器件的部分。此外,如下文中所論述之圖4A中所示,背板271可包括用以使多級泵100進一步"防滴"之特徵。In accordance with an embodiment of the present invention, where a metal cover establishes an interface with the dispensing block 205, the vertical surface of the metal cover may be slightly offset inward from the corresponding vertical surface of the dispensing block 205 (eg, 1/64) Miles or 0.396875 mm). Additionally, the multi-stage pump 100 can include seals, tilting features, and other features to prevent dripping into the portion of the multi-stage pump 100 that houses the electronics. Additionally, as shown in FIG. 4A discussed below, the backing plate 271 can include features to further "drip-proof" the multi-stage pump 100.

圖4A為多級泵100之一實施例的圖示,其中使施配區塊205透明以展示其處所界定之流體流道。施配區塊205界定多級泵100之各種腔室及流體流道。根據一實施例,可將饋入腔室155及施配腔室185直接加工於施配區塊205中。另外,可將各種流道加工於施配區塊205中。流體流道275(圖5C中所示)自入口210延伸至入口閥。流體流道280自入口閥延伸至饋入腔室155,以完成自入口210至饋入泵150之路徑。閥外殼230中之入口閥125調節入口210與饋入泵150之間的流動。流道285將流體自饋入泵150導引至閥板230中之隔離閥130。隔離閥130之輸出藉由另一流道(未圖示)而導引至過濾器120。流體自過濾器120流經將過濾器120連接至排放閥145及阻障閥135之流道。排放閥145之輸出導引至排放出口215,而阻障閥135之輸出經由流道290而導引至施配泵180。在施配段期間,施配泵可經由流道295而將流體輸出至出口220,或在淨化段中,施配泵可經由流道300而將流體輸出至淨化閥。在淨化段期間,流體可經由流道305而返回至饋入泵150。因為流體流道可直接形成於PTFE(或其他材料)區塊中,所以施配區塊205可充當多級泵100之各組件之間的處理流體之管路,從而避免或減少了對額外管道之需要。在其他情況下,可將管道插入至施配區塊205中以界定該等流體流道。根據一實施例,圖4B提供施配區塊205的圖示,其中使施配區塊205透明以展示其中之若干流道。4A is an illustration of one embodiment of a multi-stage pump 100 in which the dispensing block 205 is made transparent to show the fluid flow path defined therein. The dispensing block 205 defines various chambers and fluid flow paths of the multi-stage pump 100. According to an embodiment, the feed chamber 155 and the dispensing chamber 185 can be processed directly into the dispensing block 205. Additionally, various flow paths can be machined into the dispensing block 205. Fluid flow passage 275 (shown in Figure 5C) extends from inlet 210 to the inlet valve. Fluid flow passage 280 extends from the inlet valve to feed chamber 155 to complete the path from inlet 210 to feed pump 150. An inlet valve 125 in the valve housing 230 regulates the flow between the inlet 210 and the feed pump 150. Flow passage 285 directs fluid from feed pump 150 to isolation valve 130 in valve plate 230. The output of the isolation valve 130 is directed to the filter 120 by another flow path (not shown). Fluid flows from the filter 120 through a flow path connecting the filter 120 to the discharge valve 145 and the barrier valve 135. The output of the discharge valve 145 is directed to the discharge outlet 215, and the output of the barrier valve 135 is directed to the dispense pump 180 via the flow passage 290. During the dispensing section, the dispensing pump can output fluid to the outlet 220 via the flow passage 295, or in the purge section, the dispensing pump can output fluid to the purge valve via the flow passage 300. Fluid may be returned to feed pump 150 via flow passage 305 during the purge section. Because the fluid flow path can be formed directly into the PTFE (or other material) block, the dispense block 205 can act as a conduit for the process fluid between the various components of the multi-stage pump 100, thereby avoiding or reducing additional conduit Need. In other cases, tubing can be inserted into the dispensing block 205 to define the fluid flow channels. In accordance with an embodiment, FIG. 4B provides an illustration of a dispensing block 205 in which the dispensing block 205 is made transparent to show several of the flow paths therein.

返回至圖4A,圖4A亦展示多級泵100,其中泵蓋225及頂蓋263經移除以展示饋入泵150(包括饋入級馬達190)、施配泵180(包括施配馬達200)及閥控制歧管302。根據本發明之一實施例,藉由使用插入於施配區塊205中之相應空穴中之條桿(例如,金屬條桿),可將饋入泵150、施配泵180及閥板230之部分耦接至施配區塊205。每一條桿可包括一或多個螺紋孔以收納一螺桿。作為一實例,可經由通過施配區塊205中之螺桿孔以旋擰至條桿285中之相應孔中的一或多個螺桿(例如,螺桿275及螺桿280)而將施配馬達200及活塞外殼227安裝至施配區塊205。應注意,用於將組件耦接至施配區塊205之此機構係作為實例而提供,且可使用任何合適之附著機構。Returning to FIG. 4A, FIG. 4A also shows a multi-stage pump 100 in which the pump cover 225 and the top cover 263 are removed to show the feed pump 150 (including the feed stage motor 190), the dispense pump 180 (including the dispense motor 200). And valve control manifold 302. According to an embodiment of the present invention, the feed pump 150, the dispensing pump 180, and the valve plate 230 can be fed by using a bar (e.g., a metal bar) inserted into a corresponding cavity in the dispensing block 205. Portions are coupled to the dispensing block 205. Each of the rods may include one or more threaded holes to receive a screw. As an example, the dispensing motor 200 can be dispensed via one or more screws (eg, screw 275 and screw 280) that are screwed into corresponding holes in the bar 285 by screw holes in the dispensing block 205. The piston housing 227 is mounted to the dispensing block 205. It should be noted that this mechanism for coupling the assembly to the dispensing block 205 is provided as an example, and any suitable attachment mechanism can be used.

根據本發明之一實施例,背板271可包括頂蓋263及泵蓋225所安裝至之向內延伸的突出部(例如,托架274)。因為頂蓋263及泵蓋225與托架274重疊(例如,在頂蓋263之底邊緣及背邊緣與泵蓋225之頂邊緣及背邊緣處),所以防止滴液流至頂蓋263之底邊緣與泵蓋225之頂邊緣之間的任何空間或頂蓋263及泵蓋225之背邊緣處的電子器件區域中。In accordance with an embodiment of the present invention, the backing plate 271 can include a top cover 263 and an inwardly extending projection (e.g., bracket 274) to which the pump cover 225 is mounted. Since the top cover 263 and the pump cover 225 overlap with the bracket 274 (for example, at the bottom edge and the back edge of the top cover 263 and the top edge and the back edge of the pump cover 225), the drip is prevented from flowing to the bottom of the top cover 263. Any space between the edge and the top edge of the pump cover 225 or in the electronics area at the back edge of the top cover 263 and the pump cover 225.

根據本發明之一實施例,歧管302可包括一組螺線管閥以選擇性地將壓力/真空引導至閥板230。當一特定螺線管接通以藉此視建構而將真空或壓力引導至閥時,該螺線管將產生熱。根據一實施例,歧管302安裝於一PCB板(其安裝至背板27l且更好地展示於圖4C中)之下方,遠離施配區塊205且尤其遠離施配腔室185。歧管302可安裝至一托架,該托架又安裝至背板271或另外可耦接至背板271。此有助於防止來自歧管302中之螺線管的熱影響施配區塊205中之流體。背板271可由不銹鋼、經加工之鋁或可散逸來自歧管302及PCB之熱的其他材料製成。換言之,背板271可充當歧管302及PCB之散熱托架。泵100可進一步安裝至可由背板271將熱所傳導至之表面或其他結構。因此,背板271及其所附著至之結構充當歧管302及泵100之電子器件的散熱片。According to an embodiment of the invention, manifold 302 may include a set of solenoid valves to selectively direct pressure/vacuum to valve plate 230. The solenoid will generate heat when a particular solenoid is turned on to thereby direct vacuum or pressure to the valve. According to an embodiment, the manifold 302 is mounted below a PCB board (which is mounted to the backing plate 27l and better shown in Figure 4C), away from the dispensing block 205 and particularly away from the dispensing chamber 185. The manifold 302 can be mounted to a bracket that is in turn mounted to the backing plate 271 or otherwise coupled to the backing plate 271. This helps prevent heat from the solenoids in the manifold 302 from affecting the fluid in the dispensing block 205. The backing plate 271 can be made of stainless steel, machined aluminum, or other materials that dissipate heat from the manifold 302 and the PCB. In other words, the backing plate 271 can function as a heat dissipation bracket for the manifold 302 and the PCB. The pump 100 can be further mounted to a surface or other structure to which heat can be conducted by the backing plate 271. Thus, the backing plate 271 and the structure to which it is attached serve as a heat sink for the manifold 302 and the electronics of the pump 100.

圖4C為展示用於將壓力或真空提供至閥板230之供應線260之多級泵100的圖示。如結合圖3所論述,閥板230中之閥可經組態以允許流體流至多級泵100之各種組件。閥之致動藉由將壓力或真空引導至每一供應線260之閥控制歧管302來控制。每一供應線260可包括一具有一小孔之接頭(一實例接頭以318來指示)。此孔可具有一小於接頭318所附著至之相應供應線260之直徑的直徑。在一實施例中,該孔之直徑可近似為0.010英吋。因此,接頭318之孔可用以對供應線260產生限制。每一供應線260中之孔有助於減輕壓力與真空至供應線之施加之間的急劇壓力差之效應,且因此可使壓力與真空至閥之施加之間的轉變平穩。換言之,該孔有助於減少壓力變化對下游閥之隔膜的影響。此允許更平穩及更緩慢地打開及關閉閥,此可導致系統內之較平穩的壓力轉變增加(其可由閥之打開及關閉所導致)且可實際上增加閥自身之壽命。4C is a diagram showing a multi-stage pump 100 for providing pressure or vacuum to a supply line 260 of a valve plate 230. As discussed in connection with FIG. 3, the valves in valve plate 230 can be configured to allow fluid to flow to various components of multi-stage pump 100. Actuation of the valve is controlled by directing pressure or vacuum to the valve control manifold 302 of each supply line 260. Each supply line 260 can include a joint having an aperture (an example joint is indicated at 318). The aperture may have a diameter that is less than the diameter of the corresponding supply line 260 to which the joint 318 is attached. In one embodiment, the diameter of the aperture can be approximately 0.010 inches. Thus, the aperture of the joint 318 can be used to create a limit on the supply line 260. The holes in each supply line 260 help to mitigate the effects of a sharp pressure differential between pressure and vacuum to the application of the supply line, and thus smooth the transition between pressure and vacuum to valve application. In other words, the hole helps to reduce the effect of pressure changes on the diaphragm of the downstream valve. This allows for a smoother and slower opening and closing of the valve, which can result in a smoother pressure transition within the system (which can be caused by the opening and closing of the valve) and can actually increase the life of the valve itself.

圖4C亦說明可耦接至歧管302之PCB 397。根據本發明之一實施例,歧管302可接收來自PCB板397之信號以導致螺線管打開/關閉以將真空/壓力引導至各種供應線260來控制多級泵100之閥。此外,如圖4C所示,歧管302可位於PCB 397之遠離施配區塊205之遠端處以減少熱對施配區塊205中之流體的影響。另外,在基於PCB設計及空間約束為可行之程度上,產生熱之組件可置放於PCB之遠離施配區塊205之側面上,從而再次減少熱之影響。來自歧管302及PCB 397之熱可藉由背板271來散逸。另一方面,圖4D為泵100之一實施例的圖示,其中歧管302直接安裝至施配區塊205。FIG. 4C also illustrates PCB 397 that can be coupled to manifold 302. In accordance with an embodiment of the present invention, manifold 302 can receive signals from PCB board 397 to cause solenoids to open/close to direct vacuum/pressure to various supply lines 260 to control the valves of multi-stage pump 100. Additionally, as shown in FIG. 4C, the manifold 302 can be located distal of the PCB 397 remote from the dispensing block 205 to reduce the effect of heat on the fluid in the dispensing block 205. Additionally, to the extent that PCB design and space constraints are feasible, the thermally generated component can be placed on the side of the PCB remote from the dispensing block 205, again reducing the effects of heat. Heat from manifold 302 and PCB 397 can be dissipated by backing plate 271. 4D is an illustration of one embodiment of pump 100 in which manifold 302 is mounted directly to dispensing block 205.

現在可能有用的是描述多級泵100之運作。在多級泵100之運作期間,打開或關閉多級泵100之閥以允許或限制流體流至多級泵100之各種部分。根據一實施例,此等閥可為氣動致動的(亦即,氣體驅動的)隔膜閥,其視確定壓力還是真空而打開或關閉。然而,在本發明之其他實施例中,可使用任何適合之閥。It may now be useful to describe the operation of the multi-stage pump 100. During operation of the multi-stage pump 100, the valves of the multi-stage pump 100 are opened or closed to allow or restrict fluid flow to various portions of the multi-stage pump 100. According to an embodiment, the valves may be pneumatically actuated (i.e., gas actuated) diaphragm valves that open or close depending on whether the pressure or vacuum is determined. However, in other embodiments of the invention, any suitable valve can be used.

以下提供多級泵100之運作之各種級的概述。然而,可根據各種控制機制來控制多級泵100以對閥排定序列並控制壓力,該等控制機制包括(但不限於)描述於各以引用之方式全部併入本文中的由Michael Clarke、Robert F.McLoughlin及Marc Laverdiere於2006年8月11日提出申請之標題為"Systems And Methods For Fluid Flow Control In An Immersion Lithography System"的美國專利申請案第11/502,729號中之控制機制。根據一實施例,多級泵100可包括一就緒段、施配段、填充段、預過濾段、過濾段、排放段、淨化段及靜態淨化段。在饋入段期間,打開入口閥125,且饋入級泵150移動(例如,拉動)饋入級隔膜160以將流體汲取至饋入腔室155中。一旦足夠量之流體已填充饋入腔室155,就關閉入口閥125。在過濾段期間,饋入級泵150移動饋入級隔膜160以自饋入腔室155移位流體。打開隔離閥130及阻障閥135以允許流體通過過濾器120而流至施配腔室185。根據一實施例,可首先打開隔離閥130(例如,在"預過濾段"中)以允許在過濾器120中建置壓力,且接著打開阻障閥135以允許流體流至施配腔室185中。根據其他實施例,皆可打開隔離閥130及阻障閥135且可移動饋入泵以在過濾器之施配側上建置壓力。在過濾段期間,可使施配泵180處於其原位。如皆以引用之方式併入本文中的由Laverdiere等人於2004年11月23日提出申請之標題為"System and Method for a Variable Home Position Dispense System"的美國臨時專利申請案第60/630,384號及由Laverdiere等人於2005年11月21日提出申請之標題為"System and Method for Variable Home Position Dispense System"的PCT申請案第PCT/US2005/042127號中所描述,施配泵之原位可為在施配循環中在施配泵處給出最大可用容積但小於施配泵可提供之最大可用容積的位置。基於施配循環之各種參數來選擇原位以減少多級泵100之未用滯留容積。可類似地使饋入泵150處於一提供小於其最大可用容積之容積的原位。An overview of the various stages of operation of the multi-stage pump 100 is provided below. However, the multi-stage pump 100 can be controlled in accordance with various control mechanisms to sequence the valves and control the pressure, including but not limited to those described by Michael Clarke, each of which is incorporated herein by reference in its entirety. The control mechanism of U.S. Patent Application Serial No. 11/502,729, filed on Aug. According to an embodiment, the multi-stage pump 100 can include a ready section, a dispensing section, a filling section, a pre-filtration section, a filtration section, a discharge section, a purification section, and a static purification section. During the feed section, the inlet valve 125 is opened and the feed stage pump 150 moves (eg, pulls) the feed stage diaphragm 160 to draw fluid into the feed chamber 155. Once a sufficient amount of fluid has filled the feed chamber 155, the inlet valve 125 is closed. Feed stage pump 150 moves into feed stage diaphragm 160 to displace fluid from feed chamber 155 during the filter section. The isolation valve 130 and the barrier valve 135 are opened to allow fluid to pass through the filter 120 to the dispensing chamber 185. According to an embodiment, the isolation valve 130 may be first opened (eg, in a "pre-filtration section") to allow pressure to be built into the filter 120, and then the barrier valve 135 is opened to allow fluid flow to the dispensing chamber 185 in. According to other embodiments, the isolation valve 130 and the barrier valve 135 can be opened and the feed pump can be moved to build pressure on the dispensing side of the filter. The dispensing pump 180 can be placed in its home position during the filtration section. U.S. Provisional Patent Application Serial No. 60/630,384, entitled "System and Method for a Variable Home Position Dispense System", filed on November 23, 2004, by Laverdiere et al., which is incorporated herein by reference. And the in-situ application of the pump can be described in PCT Application No. PCT/US2005/042127, filed on Nov. 21, 2005, to the name of PCT Application No. PCT/US2005/042127. To give the maximum available volume at the dispensing pump during the dispensing cycle but less than the maximum available volume that the dispensing pump can provide. The home position is selected based on various parameters of the dispense cycle to reduce the unused hold volume of the multi-stage pump 100. The feed pump 150 can similarly be placed in an in situ position that provides a volume that is less than its maximum available volume.

在排放段開始時,打開隔離閥130,關閉阻障閥135且打開排放閥145。在另一實施例中,阻障閥135可在排放段期間保持打開且在排放段結束時關閉。在此時間期間,若阻障閥135打開,則控制器可獲知壓力,因為可藉由壓力感應器112而量測之在施配腔室中之壓力將受到過濾器120中之壓力的影響。饋入級泵150將壓力施加至流體以經由打開之排放閥145而自過濾器120移除氣泡。可控制饋入級泵150以使排放以一預定速率來發生,此允許較長的排放時間及較低的排放速率,藉此允許排放廢物之量的準確控制。若饋入泵為氣動型泵,則可對排放流徑產生流體流動限制,且可增加或減少施加至饋入泵之氣動壓力,以維持一"排放"設定點壓力,從而給出另外不受控制之方法的某一控制。At the beginning of the discharge section, the isolation valve 130 is opened, the barrier valve 135 is closed and the discharge valve 145 is opened. In another embodiment, the barrier valve 135 can remain open during the discharge section and closed at the end of the discharge section. During this time, if the barrier valve 135 is open, the controller can know the pressure because the pressure in the dispensing chamber that can be measured by the pressure sensor 112 will be affected by the pressure in the filter 120. The feed stage pump 150 applies pressure to the fluid to remove air bubbles from the filter 120 via the open discharge valve 145. Feed stage pump 150 can be controlled to cause emissions to occur at a predetermined rate, which allows for longer discharge times and lower discharge rates, thereby allowing for accurate control of the amount of waste discharged. If the feed pump is a pneumatic pump, fluid flow restriction can be generated on the discharge flow path, and the pneumatic pressure applied to the feed pump can be increased or decreased to maintain a "discharge" set point pressure, thereby giving an additional A certain control of the method of control.

在淨化段開始時,關閉隔離閥130,關閉阻障閥135(若其在排放段中打開),關閉排放閥145,且打開淨化閥140並打開入口閥125。施配泵180將壓力施加至施配腔室185中之流體以經由淨化閥140而排放氣泡。在靜態淨化段期間,停止施配泵180,但淨化閥140保持打開以繼續排放空氣。可將在淨化或靜態淨化段期間所移除之任何過量流體導引出多級泵100(例如,返回至流體源或丟棄)或再循環至饋入級泵150。在就緒段期間,可打開入口閥125、隔離閥130及阻障閥135且關閉淨化閥140,使得饋入級泵150可達到來源(例如,源瓶)之周圍壓力。根據其他實施例,可在就緒段時關閉所有閥。At the beginning of the purge section, the isolation valve 130 is closed, the barrier valve 135 is closed (if it is open in the discharge section), the discharge valve 145 is closed, and the purge valve 140 is opened and the inlet valve 125 is opened. The dispensing pump 180 applies pressure to the fluid in the dispensing chamber 185 to vent air bubbles via the purge valve 140. During the static purge section, pumping of pump 180 is stopped, but purge valve 140 remains open to continue to vent air. Any excess fluid removed during the purge or static purge section may be directed out of the multi-stage pump 100 (eg, back to the fluid source or discarded) or recycled to the feed stage pump 150. During the ready phase, the inlet valve 125, the isolation valve 130, and the barrier valve 135 can be opened and the purge valve 140 closed so that the feed stage pump 150 can reach the ambient pressure of the source (eg, the source bottle). According to other embodiments, all valves can be closed at the ready stage.

在施配段期間,出口閥147打開且施配泵180將壓力施加至施配腔室185中之流體。因為出口閥147對控制作出反應可比施配泵180慢,所以可首先打開出口閥147且在某一預定時段後起動施配馬達200。此防止施配泵180將流體推動通過一部分打開之出口閥147。此外,此防止由閥打開而導致流體沿施配噴嘴向上移,接著為由馬達動作而導致之向前流體運動。在其他實施例中,可打開出口閥147且施配泵180同時開始施配。During the dispensing section, the outlet valve 147 opens and the dispensing pump 180 applies pressure to the fluid in the dispensing chamber 185. Because the outlet valve 147 can react to the control more slowly than the dispensing pump 180, the outlet valve 147 can be first opened and the dispensing motor 200 can be started after a predetermined period of time. This prevents the dispensing pump 180 from pushing fluid through a portion of the open outlet valve 147. In addition, this prevents the fluid from moving up along the dispensing nozzle by the valve opening, followed by the forward fluid motion caused by the motor action. In other embodiments, the outlet valve 147 can be opened and the pump 180 dispensed while dispensing begins.

可執行一額外反吸段,其中可移除施配噴嘴中之過量流體。在反吸段期間,出口閥147可關閉且可使用一輔助馬達或真空來將過量流體自出口噴嘴中吸出。或者,出口閥147可保持打開且可使施配馬達200反轉以將流體反吸至施配腔室中。反吸段有助於防止過量流體滴落於晶圓上。An additional suckback section can be implemented in which excess fluid in the dispensing nozzle can be removed. During the suckback section, the outlet valve 147 can be closed and an auxiliary motor or vacuum can be used to draw excess fluid from the outlet nozzle. Alternatively, the outlet valve 147 can remain open and the dispensing motor 200 can be reversed to draw back fluid into the dispensing chamber. The reverse suction section helps prevent excess fluid from dripping onto the wafer.

簡要地參看圖5,此圖提供圖2之多級泵100之運作的各種段之閥及施配馬達時序的圖示。雖然在段改變期間將若干閥展示為同時關閉,但可稍微隔開地(例如,100毫秒)來定時閥之關閉以減少壓力尖峰。舉例而言,在排放與淨化段之間,可在關閉排放閥145之前不久關閉隔離閥130。然而,應注意,可在本發明之各種實施例中使用其他閥時序。另外,可共同執行該等段中之若干者(例如,可同時執行填充/施配級,在此情況下,入口及出口閥均可在施配/填充段中打開)。應進一步注意,不必為每一循環而重複特定段。舉例而言,可能不在每一循環中執行淨化及靜態淨化段。類似地,可能不在每一循環中執行排放段。Referring briefly to Figure 5, there is shown a graphical representation of the timing of the various stages of the operation of the multi-stage pump 100 of Figure 2 and the timing of the dispensed motor. While several valves are shown to be closed at the same time during the segment change, the closing of the valve can be timed off (eg, 100 milliseconds) to reduce pressure spikes. For example, between the discharge and purge sections, the isolation valve 130 can be closed shortly before the discharge valve 145 is closed. However, it should be noted that other valve timings may be used in various embodiments of the invention. Additionally, several of the segments can be performed together (eg, the fill/distribution stages can be performed simultaneously, in which case both the inlet and outlet valves can be opened in the dispense/fill section). It should be further noted that it is not necessary to repeat a particular segment for each cycle. For example, purification and static purification sections may not be performed in each cycle. Similarly, the discharge section may not be executed in each cycle.

各種閥之打開及關閉可導致多級泵100內之流體的壓力尖峰。因為在靜態淨化段期間關閉出口閥147,所以在靜態淨化段結束時淨化閥140之關閉(例如)可導致施配腔室185中之壓力增加。此可發生,因為每一閥可在其關閉時排移少量的流體。更明確地說,在自腔室185施配流體之前的許多情況下,使用一淨化循環及/或一靜態淨化循環來淨化來自施配腔室185之空氣,以防止在自多級泵100施配流體時出現濺射或其他擾動。然而,在靜態淨化循環結束時,淨化閥140關閉,以密封施配腔室185而為施配之開始做準備。當淨化閥140關閉時,其迫使大量的額外流體(近似等於淨化閥140之滯留容積)進入施配腔室185,此又導致施配腔室185中之流體的壓力增加至高於為流體之施配所欲之基線壓力。此過量壓力(高於基線)可導致流體之隨後施配時的問題。此等問題在低壓應用中加劇,因為由淨化閥140之關閉所導致的壓力增加可為施配所需之基線壓力的較大百分比。The opening and closing of various valves can result in pressure spikes in the fluid within the multi-stage pump 100. Because the outlet valve 147 is closed during the static purge section, the closing of the purge valve 140 at the end of the static purge section, for example, can result in an increase in pressure in the dispense chamber 185. This can happen because each valve can displace a small amount of fluid when it is closed. More specifically, in many instances prior to dispensing fluid from chamber 185, a purge cycle and/or a static purge cycle is used to purge air from dispense chamber 185 to prevent application from multistage pump 100. Sputtering or other disturbances occur when dispensing a fluid. However, at the end of the static purge cycle, purge valve 140 is closed to seal dispensing chamber 185 to prepare for the start of dispensing. When the purge valve 140 is closed, it forces a large amount of additional fluid (approximately equal to the retentate volume of the purge valve 140) into the dispense chamber 185, which in turn causes the pressure of the fluid in the dispense chamber 185 to increase above that of the fluid. Match the desired baseline pressure. This excess pressure (above the baseline) can cause problems with subsequent fluid dispensing. These problems are exacerbated in low pressure applications because the increase in pressure caused by the closing of purge valve 140 can be a large percentage of the baseline pressure required to dispense.

更具體言之,由於歸因於淨化閥140之關閉而發生的壓力增加,所以若未減小壓力,則在隨後之施配段期間,可發生流體至晶圓上之"噴濺"、雙重施配或其他不良的流體動力學。另外,因為此壓力增加在多級泵100之運作期間可能不恆定,所以此等壓力增加可導致在連續施配段期間所施配之流體之量的變化或施配之其他特性。施配之此等變化可又導致晶圓碎屑之增加及晶圓之返工。本發明之實施例解決歸因於系統內之各種閥關閉的壓力增加以達成用於施配段開始之所需的起動壓力,此藉由允許在施配之前在施配腔室185中達成幾乎任何基線壓力而解決各種系統之設備中之不同的輸送壓力及其他差異。More specifically, since the pressure occurring due to the closing of the purge valve 140 is increased, if the pressure is not reduced, a "splash" of the fluid onto the wafer may occur during the subsequent dispensing period, Dispensing or other undesirable fluid dynamics. Additionally, because this increase in pressure may not be constant during operation of the multi-stage pump 100, such pressure increases may result in changes in the amount of fluid dispensed or other characteristics of the dispensed during the continuous dispensing stage. These changes in the allocation can in turn lead to an increase in wafer debris and wafer rework. Embodiments of the present invention address the increase in pressure due to various valve closures within the system to achieve the desired starting pressure for the beginning of the dispensing section, which allows for almost complete in the dispensing chamber 185 prior to dispensing. Any baseline pressure to address different delivery pressures and other differences in the equipment of various systems.

在一實施例中,為了解決對施配腔室185中之流體之不需要的壓力增加,在靜態淨化段期間,可使施配馬達200反轉以將活塞192收回一預定距離以補償由阻障閥135、淨化閥140及/或可在施配腔室185中導致壓力增加之其他來源之關閉所導致的任何壓力增加。如併入本文中的由George Gonnella及James Cedrone於2005年12月2日提出申請之標題為"System and Method for Control of Fluid Pressure"的美國專利申請案第11/292,559號及由George Gonnella及James Cedrone於2006年2月28日提出申請之標題為"System And Method For Monitoring Operation Of A Pump"的美國專利申請案第11/364,286號中所描述,可藉由調節饋入泵150之速度來控制施配腔室185中之壓力。In one embodiment, to address an undesired increase in pressure to the fluid in the dispensing chamber 185, during the static purge segment, the dispense motor 200 can be reversed to retract the piston 192 a predetermined distance to compensate for the resistance. Barrier valve 135, purge valve 140, and/or any pressure increase that may result from closure of other sources of pressure increase in dispensing chamber 185. U.S. Patent Application Serial No. 11/292,559, entitled "System and Method for Control of Fluid Pressure," by George Gonnella and James Cedrone, filed on December 2, 2005, by George Gonnella and James. Cedrone, as described in U.S. Patent Application Serial No. 11/364,286, filed on Jan. The pressure in the chamber 185 is applied.

因此,本發明之實施例提供一具有平緩流體處理特性之多級泵。藉由在施配段之前補償施配腔室中之壓力波動,可避免或減輕潛在地損害壓力尖峰。本發明之實施例亦可使用其他泵控制機構及閥時序來幫助減小壓力及壓力變化對處理流體之有害效應。Accordingly, embodiments of the present invention provide a multi-stage pump having gentle fluid handling characteristics. Potentially damaging the pressure spikes can be avoided or mitigated by compensating for pressure fluctuations in the dispensing chamber prior to the dispensing section. Embodiments of the invention may also use other pump control mechanisms and valve timing to help reduce the deleterious effects of pressure and pressure changes on the treatment fluid.

為此,關注用於補償可發生於泵裝置之各種封閉空間中之壓力增加或減少的系統及方法。本發明之實施例可藉由移動泵裝置之泵構件以調整腔室之容積來補償腔室中之壓力增加或減少而補償泵裝置之腔室中的壓力增加或減少。更具體言之,在一實施例中,為了解決對施配腔室中之流體之不需要的壓力增加,可使施配馬達反轉以收回活塞來補償施配腔室中之任何壓力增加。To this end, attention is directed to systems and methods for compensating for pressure increases or decreases that may occur in various enclosed spaces of a pump device. Embodiments of the present invention may compensate for an increase or decrease in pressure in a chamber of a pump device by moving a pump member of the pump device to adjust the volume of the chamber to compensate for an increase or decrease in pressure in the chamber. More specifically, in one embodiment, to address an undesired increase in pressure to the fluid in the dispensing chamber, the dispensing motor can be reversed to retract the piston to compensate for any pressure increase in the dispensing chamber.

可參看圖6來更好地理解壓力之此等變化的減少,圖6說明用於運作根據本發明之一實施例之多級泵之施配腔室185處的實例壓力輪廓。在點440處,開始一施配,且施配泵180將流體推出出口。在點445處,施配結束。施配腔室185處之壓力在填充級期間保持相當恆定,因為在此級中通常不涉及施配泵180。在點450處,過濾級開始且饋入級馬達175以一預定速率而向前行進以推動來自饋入腔室155之流體。在圖6中可看出,施配腔室185中之壓力開始上升以在點455處達到一預定設定點。當施配腔室185中之壓力達到該設定點時,施配馬達200以恆定速率來反轉以增加施配腔室185中之可用容積。在點455與點460之間的壓力輪廓之相對平坦部分中,只要壓力降至低於設定點,則饋入馬達175之速度增加;且當達到設定點時,饋入馬達175之速度減少。此使施配腔室185中之壓力保持於一近似恆定之壓力。在點460處,施配馬達200到達其原位,且過濾級結束。在點460處之急劇壓力尖峰係由在過濾結束時阻障閥135之關閉所導致。The reduction in such changes in pressure can be better understood with reference to Figure 6, which illustrates an example pressure profile at a dispensing chamber 185 for operating a multi-stage pump in accordance with an embodiment of the present invention. At point 440, a dispensing is initiated and the pump 180 is dispensed to push the fluid out of the outlet. At point 445, the dispensing ends. The pressure at the dispensing chamber 185 remains fairly constant during the filling stage because the dispensing pump 180 is typically not involved in this stage. At point 450, the filtration stage begins and the feed stage motor 175 travels forward at a predetermined rate to propel the fluid from the feed chamber 155. As can be seen in Figure 6, the pressure in the dispensing chamber 185 begins to rise to reach a predetermined set point at point 455. When the pressure in the dispensing chamber 185 reaches the set point, the dispensing motor 200 is reversed at a constant rate to increase the available volume in the dispensing chamber 185. In the relatively flat portion of the pressure profile between point 455 and point 460, as soon as the pressure drops below the set point, the speed of the feed motor 175 increases; and when the set point is reached, the speed of the feed motor 175 decreases. This maintains the pressure in the dispensing chamber 185 at an approximately constant pressure. At point 460, the dispensing motor 200 reaches its home position and the filter stage ends. The sharp pressure spike at point 460 is caused by the closing of the barrier valve 135 at the end of the filtration.

在排放及淨化段之後且在靜態淨化段結束之前,關閉淨化閥140,此導致在壓力輪廓中之點1500處開始之壓力的尖峰。在壓力輪廓之點1500與1502之間可看出,歸因於此關閉,施配腔室185中之壓力可經受顯著的增加。歸因於淨化閥140之關閉的壓力增加通常不一致,且視系統之溫度及與多級泵100一起使用之流體的黏度而定。After the discharge and purge section and before the end of the static purge section, purge valve 140 is closed, which results in a spike in pressure that begins at point 1500 in the pressure profile. It can be seen between points 1500 and 1502 of the pressure profile that the pressure in the dispensing chamber 185 can undergo a significant increase due to this shutdown. The increase in pressure due to the closing of purge valve 140 is generally inconsistent and depends on the temperature of the system and the viscosity of the fluid used with multi-stage pump 100.

為了解決在點1500與1502之間出現的壓力增加,可使施配馬達200反轉以將活塞192收回一預定距離以補償由阻障閥135、淨化閥140及/或任何其他來源之關閉所導致的任何壓力增加。在一些情況下,由於淨化閥140可花費大量時間來關閉,所以可能需要在反轉施配馬達200之前延遲某一時間量。因此,壓力輪廓上之點1500與1504之間的時間反映用以關閉淨化閥140之信號與施配馬達200之反轉之間的延遲。此時間延遲可足以允許淨化閥140完全關閉,且允許施配腔室185內之壓力大體上穩定,此時間延遲可為大約50毫秒。To account for the pressure increase occurring between points 1500 and 1502, the dispense motor 200 can be reversed to retract the piston 192 a predetermined distance to compensate for the closure by the barrier valve 135, the purge valve 140, and/or any other source. Any pressure caused by the increase. In some cases, since the purge valve 140 may take a significant amount of time to shut down, it may be desirable to delay a certain amount of time before reversing the dispensed motor 200. Thus, the time between points 1500 and 1504 on the pressure profile reflects the delay between the signal to close purge valve 140 and the reversal of dispense motor 200. This time delay may be sufficient to allow the purge valve 140 to fully close and allow the pressure within the dispense chamber 185 to be substantially stable, which may be approximately 50 milliseconds.

由於淨化閥140之滯留容積可為一已知量(例如,在製造容差內),所以可使施配馬達200反轉以將活塞192a收回補償距離,以將施配腔室185之容積增加近似等於淨化閥140之滯留容積。由於施配腔室185及活塞192之尺寸亦可為已知量,所以可使施配馬達200反轉特定數目之馬達增量,其中藉由使施配馬達200反轉此數目之馬達增量,施配腔室185之容積增加近似為淨化閥140之滯留容積。Since the stagnant volume of the purge valve 140 can be a known amount (eg, within manufacturing tolerances), the dispense motor 200 can be reversed to retract the piston 192a for a compensation distance to increase the volume of the dispense chamber 185. It is approximately equal to the retention volume of the purge valve 140. Since the size of the dispensing chamber 185 and the piston 192 can also be a known amount, the dispensing motor 200 can be reversed by a specific number of motor increments by inverting the number of motor increments by the dispensing motor 200. The volume increase of the dispensing chamber 185 is approximately the retention volume of the purge valve 140.

經由施配馬達200之反轉而收回活塞192之效應導致施配腔室185中之壓力自點1504減少至近似為在點1506處之施配所要之基線壓力。在許多情況下,此壓力改正可足以在隨後之施配級中獲得滿意的施配。然而,視用於施配馬達200之馬達類型或用於淨化閥140之閥類型而定,反轉施配馬達200以增加施配腔室185之容積可在施配馬達200之驅動機構中產生一空間或"齒隙"。此"齒隙"可意謂:當在向前方向上啟動施配馬達200以在施配段期間將流體推出施配泵180時,可在施配馬達200之組件(諸如馬達螺帽總成)之間存在某些量之空隙或空間,其在施配馬達200之驅動總成實體上嚙合以使得活塞192移動之前可能必須被佔據。由於此齒隙之量可能為可變的,所以可能難以在判定使活塞192向前移動多遠以獲得所要施配壓力時解決此齒隙。因此,施配馬達200之驅動總成中之此齒隙可導致在每一施配段期間所施配之流體量的可變性。The effect of retracting the piston 192 via the reversal of the dispense motor 200 causes the pressure in the dispense chamber 185 to decrease from point 1504 to approximately the desired baseline pressure at point 1506. In many cases, this pressure correction may be sufficient to achieve a satisfactory application in the subsequent dispensing stage. However, depending on the type of motor used to dispense the motor 200 or the type of valve used to purge the valve 140, reversing the dispensing of the motor 200 to increase the volume of the dispensing chamber 185 can be produced in the drive mechanism of the dispensing motor 200. A space or "backlash". This "backlash" may mean that when the dispensing motor 200 is activated in the forward direction to push fluid out of the dispensing pump 180 during the dispensing section, components of the motor 200 (such as a motor nut assembly) may be dispensed. There is some amount of clearance or space between which it may have to be engaged before the drive assembly of the dispensing motor 200 is physically engaged to cause the piston 192 to move. Since the amount of this backlash may be variable, it may be difficult to resolve this backlash when determining how far forward the piston 192 is to obtain the desired dispense pressure. Thus, the backlash in the drive assembly of the motor 200 can result in variability in the amount of fluid dispensed during each dispensing stage.

因此,可能需要確保施配馬達200之最後運動在施配段之前係在向前方向上,以便將施配馬達200之驅動總成中之齒隙的量減少至大體上可忽略的或不存在的程度。因此,在一些實施例中,為了解決施配馬達200之驅動馬達總成中之不需要的齒隙,可使施配馬達200反轉以將活塞192收回一預定距離以補償由阻障閥135、淨化閥140及/或可在施配腔室185中導致壓力增加之任何其他來源之關閉所導致的任何壓力增加,且另外,可使施配馬達反轉以將活塞192收回一額外超越量距離以將一超越量容積添加至施配腔室185。施配馬達200可接著在向前方向上嚙合以在向前方向上將活塞192移動大體上等於該超越量距離。此在施配腔室185中導致近似所要之基線壓力,同時亦確保在施配之前施配馬達200之最後運動係在向前方向上,從而大體上自施配馬達200之驅動總成移除任何齒隙。Accordingly, it may be desirable to ensure that the final motion of the dispensing motor 200 is in the forward direction prior to the dispensing section to reduce the amount of backlash in the drive assembly of the mating motor 200 to substantially negligible or non-existent. degree. Accordingly, in some embodiments, to address the unwanted backlash in the drive motor assembly of the dispense motor 200, the dispense motor 200 can be reversed to retract the piston 192 a predetermined distance to compensate for the relief valve 135. The purge valve 140 and/or any pressure increase that may result from the closure of any other source that causes an increase in pressure in the dispensing chamber 185, and in addition, the dispense motor may be reversed to retract the piston 192 by an additional excess. The distance is added to the dispensing chamber 185 by an excess volume. The mating motor 200 can then be engaged in a forward direction to move the piston 192 in the forward direction to be substantially equal to the overrunning distance. This results in an approximate desired baseline pressure in the dispensing chamber 185 while also ensuring that the final motion of the dispensed motor 200 prior to dispensing is in the forward direction, thereby substantially removing any drive assembly from the mating motor 200. Backlash.

仍參看圖6,如上文所述,在壓力輪廓中之點1500處開始之壓力尖峰可由淨化閥140之關閉所導致。為了解決在點1500與1502之間出現的壓力增加,在一延遲之後,可使施配馬達200反轉以將活塞192收回一用以補償由淨化閥140(及/或任何其他來源)之關閉所導致之任何壓力增加的預定距離加上一額外超越量距離。如上文所述,該補償距離可將施配腔室185之容積增加近似等於淨化閥140之滯留容積。視特定建構而定,該超越量距離亦可將施配腔室185之容積增加近似等於淨化閥140之滯留容積、或更小或更大之容積。Still referring to FIG. 6, as described above, the pressure spike that begins at point 1500 in the pressure profile can be caused by the closing of purge valve 140. To account for the pressure increase that occurs between points 1500 and 1502, after a delay, the dispense motor 200 can be reversed to retract the piston 192 to compensate for the closing of the purge valve 140 (and/or any other source). The predetermined distance resulting from any increase in pressure plus an additional excess distance. As described above, the compensation distance can increase the volume of the dispensing chamber 185 approximately equal to the retention volume of the purge valve 140. Depending on the particular configuration, the overrunning distance may also increase the volume of the dispensing chamber 185 by approximately equal to the retained volume of the purge valve 140, or a smaller or larger volume.

經由施配馬達200之反轉而將活塞192收回補償距離加上超越量距離之效應導致施配腔室185中之壓力自點1504減少至點1508。施配馬達200可接著在向前方向上嚙合以在向前方向上將活塞192移動大體上等於超越量距離。在一些情況下,可能需要允許在向前方向上嚙合施配馬達200之前大體上完全停止施配馬達200;此延遲可為大約50毫秒。經由施配馬達200之向前嚙合而使活塞192向前移動之 效應導致施配腔室185中之壓力自點1510增加至近似在點1512處之施配所要之基線壓力,同時確保在施配段之前施配馬達200之最後移動係在向前方向上,從而大體上自施配馬達200之驅動總成移除所有齒隙。在靜態淨化段結束時施配馬達200之反轉及向前移動描述於圖3之時序圖中。The effect of retracting the piston 192 by the reversal of the dispense motor 200 to compensate for the distance plus the excess distance causes the pressure in the dispensing chamber 185 to decrease from point 1504 to point 1508. The mating motor 200 can then be engaged in the forward direction to move the piston 192 in the forward direction substantially equal to the overrunning distance. In some cases, it may be desirable to allow the motor 200 to be substantially completely stopped prior to engaging the dispensing motor 200 in the forward direction; this delay may be approximately 50 milliseconds. The piston 192 is moved forward by the forward engagement of the mating motor 200 The effect causes the pressure in the dispensing chamber 185 to increase from point 1510 to approximately the desired baseline pressure at point 1512, while ensuring that the final movement of the mating motor 200 prior to the dispensing section is in the forward direction, thereby generally The drive assembly of the upper self-dispensing motor 200 removes all backlash. The reversal and forward movement of the dispense motor 200 at the end of the static purge section is depicted in the timing diagram of FIG.

可參看圖7來更清楚地描述本發明之實施例,圖7說明在運作根據本發明之一實施例之多級泵之某些段期間在施配腔室185處的實例壓力輪廓。線1520表示施配流體所要之基線壓力,其雖然可為所要之任何壓力,但通常為大約0p.s.i(例如,量規)或大氣壓。在點1522處,在淨化段期間,施配腔室185中之壓力可剛好高於基線壓力1520。施配馬達200可在淨化段結束時停止,從而導致施配腔室185中之壓力在點1524處開始降至在點1526處之近似基線壓力1520。然而,在靜態淨化段結束之前,可關閉泵100中之諸如淨化閥140的閥,從而導致壓力輪廓之點1528與1530之間的壓力尖峰。Embodiments of the present invention will be more clearly described with reference to Figure 7, which illustrates an example pressure profile at the dispensing chamber 185 during operation of certain stages of a multi-stage pump in accordance with an embodiment of the present invention. Line 1520 represents the baseline pressure required to dispense the fluid, which, although any desired pressure, is typically about 0 p.s.i (e.g., gauge) or atmospheric pressure. At point 1522, the pressure in the dispensing chamber 185 may be just above the baseline pressure 1520 during the purge section. The dispense motor 200 can be stopped at the end of the purge section, causing the pressure in the dispense chamber 185 to begin to decrease to an approximate baseline pressure 1520 at point 1526 at point 1524. However, prior to the end of the static purge section, a valve such as purge valve 140 in pump 100 may be closed, resulting in a pressure spike between points 1528 and 1530 of the pressure profile.

可接著使施配馬達200反轉以將活塞192移動一補償距離及一超越量距離(如上文所述),從而導致施配腔室185中之壓力降至低於壓力輪廓之點1532與1534之間的基線壓力1520。為了將施配腔室185中之壓力返回至近似基線壓力1520且為了自施配馬達200之驅動總成移除齒隙,施配馬達200可在向前方向上嚙合大體上等於超越量距離。此移動導致施配腔室185中之壓力返回至壓力輪廓之點1536與 1538之間的基線壓力1520。因此,施配腔室185中之壓力大體上返回至施配所要之基線壓力,將齒隙自施配馬達200之驅動總成移除,且可在一後續施配段期間達成一所需施配。The dispensing motor 200 can then be reversed to move the piston 192 a compensation distance and an overrun distance (as described above), causing the pressure in the dispensing chamber 185 to drop below the pressure profile points 1532 and 1534. The baseline pressure between the 1520. To return the pressure in the dispensing chamber 185 to the approximate baseline pressure 1520 and to remove the backlash from the drive assembly of the dispensing motor 200, the dispensing motor 200 can be engaged in the forward direction to be substantially equal to the overrunning distance. This movement causes the pressure in the dispensing chamber 185 to return to the point 1536 of the pressure profile and The baseline pressure between 1538 is 1520. Accordingly, the pressure in the dispensing chamber 185 is substantially returned to the desired baseline pressure for dispensing, the backlash is removed from the drive assembly of the dispensing motor 200, and a desired application can be achieved during a subsequent dispensing session. Match.

雖然本發明之上述實施例已結合改正在靜態淨化段期間由淨化閥之關閉所導致的壓力增加而加以主要描述,但將顯而易見的係,在多級泵100之運作的任何級期間,可應用此等相同技術來改正由幾乎任何來源(無論是在多級泵100之內部還是外部)所導致之壓力增加或減少,且其尤其用於改正由通向或來自施配腔室185之流徑中之閥的打開或關閉所導致的在施配腔室185中之壓力變化。While the above-described embodiments of the present invention have been primarily described in connection with modifying the pressure increase caused by the closing of the purge valve during the static purge section, it will be apparent that during any stage of operation of the multistage pump 100, These same techniques are used to correct for an increase or decrease in pressure caused by almost any source, whether internal or external to the multi-stage pump 100, and which is particularly useful for correcting the flow path from or to the dispensing chamber 185. The change in pressure in the dispensing chamber 185 caused by the opening or closing of the valve.

另外,將顯而易見的係,此等相同技術可用於藉由補償結合多級泵100而使用之其他設備的變化而在施配腔室185中達成一所要基線壓力。為了更好地補償設備之此等差異或處理之其他變化,在多級泵100之內部或外部所使用之環境或設備、本發明之某些態樣或變數(諸如在施配腔室185中所要之基線壓力、補償距離、超越量距離、延遲時間,等等)可由泵100之使用者來組態。Additionally, it will be apparent that such same techniques can be used to achieve a desired baseline pressure in the dispensing chamber 185 by compensating for changes in other equipment used in conjunction with the multi-stage pump 100. In order to better compensate for such differences in equipment or other variations in processing, the environment or equipment used within or external to the multi-stage pump 100, certain aspects or variables of the invention (such as in the dispensing chamber 185) The desired baseline pressure, compensation distance, overrun distance, delay time, etc. can be configured by the user of the pump 100.

此外,本發明之實施例可利用壓力感應器112而在施配腔室185中類似地達成所要之基線壓力。舉例而言,為了補償由淨化閥140(及/或任何其他來源)之關閉所導致的任何壓力增加,可收回(或向前移動)活塞192,直至在施配腔室185中達成所要之基線壓力(如由壓力感應器112所量測)為止。類似地,為了在施配之前將施配馬達200之驅動總成中之齒隙的量減少至大體上可忽略的或不存在的程度,可收回活塞193,直至施配腔室185中之壓力低於基線壓力為止;且接著在向前方向上嚙合,直至施配腔室185中之壓力達到施配所要之基線壓力為止。Moreover, embodiments of the present invention may utilize pressure sensor 112 to similarly achieve a desired baseline pressure in dispensing chamber 185. For example, to compensate for any pressure increase caused by the closing of the purge valve 140 (and/or any other source), the piston 192 can be retracted (or moved forward) until the desired baseline is achieved in the dispensing chamber 185. The pressure (as measured by the pressure sensor 112). Similarly, to reduce the amount of backlash in the drive assembly of the dispense motor 200 to a substantially negligible or non-existent extent prior to dispensing, the piston 193 can be retracted until the pressure in the dispense chamber 185 Below the baseline pressure; and then engaged in the forward direction until the pressure in the dispensing chamber 185 reaches the desired baseline pressure for dispensing.

如上文所述,不僅可解決流體之壓力變化,而且另外,處理流體中之壓力尖峰或其他壓力波動亦可藉由避免關閉閥以產生入陷空間且避免在入陷空間之間打開閥來減少。在多級泵100之一完整施配循環(例如,自施配段至施配段)期間,多級泵100內之閥可多次改變狀態。在此等無數次改變期間,可出現不需要的壓力尖峰及降落。不僅此等壓力波動可導致敏感性處理化學品受到損害,而且另外,此等閥之打開及關閉可導致流體之施配的中斷或變化。舉例而言,由耦接至施配腔室185之一或多個內部閥之打開所導致的滯留容積中之突然壓力增加可導致施配腔室185內之流體之壓力的相應降落,且可導致在流體中形成氣泡,此又可影響隨後之施配。As noted above, not only can the pressure change of the fluid be addressed, but in addition, pressure spikes or other pressure fluctuations in the process fluid can also be reduced by avoiding closing the valve to create trapped space and avoiding opening the valve between the trapped spaces. . During a complete dispensing cycle of the multi-stage pump 100 (e.g., from the dispensing section to the dispensing section), the valve within the multi-stage pump 100 can change state multiple times. Unwanted pressure spikes and drops can occur during such numerous changes. Not only can such pressure fluctuations cause damage to the sensitive processing chemicals, but in addition, the opening and closing of such valves can result in interruptions or changes in the dispensing of the fluid. For example, a sudden increase in pressure in the stagnant volume caused by opening of one or more internal valves coupled to the dispensing chamber 185 can result in a corresponding drop in the pressure of the fluid within the dispensing chamber 185, and can This results in the formation of bubbles in the fluid which in turn can affect subsequent dispensing.

為了改善由多級泵100內之各種閥之打開及關閉所導致的壓力變化,可定時各種閥之打開及關閉及/或馬達之嚙合及脫離以減少此等壓力尖峰。一般而言,為了減少根據本發明之實施例的壓力變化,將永不關閉一閥以不在流徑中產生一封閉或入陷空間(若其可避免),且此之主要部分為,將不打開兩個入陷空間之間的閥(若其可避免)。相反地,應避免打開任何閥,除非存在通向在多級泵100之外部之區域的打開流徑或通向在多級泵100之外部之氣氛或條件的打開流徑(例如,出口閥147、排放閥145或入口閥125打開)。In order to improve the pressure changes caused by the opening and closing of various valves within the multi-stage pump 100, the opening and closing of various valves and/or the engagement and disengagement of the motors can be timed to reduce such pressure spikes. In general, in order to reduce pressure variations in accordance with embodiments of the present invention, a valve will never be closed to create a closed or trapped space in the flow path (if it can be avoided), and the main part of this will be Open the valve between the two trap spaces (if it can be avoided). Conversely, any valves should be avoided unless there is an open flow path to an area outside the multi-stage pump 100 or an open flow path to an atmosphere or condition external to the multi-stage pump 100 (eg, outlet valve 147) The discharge valve 145 or the inlet valve 125 is open).

根據本發明之實施例用以表達多級泵100內之閥之打開及關閉之普通準則的另一方式在於:在多級泵100之運作期間,僅當諸如入口閥125、排放閥145或出口閥147之外部閥打開以排出由可由閥之打開而引起之容積變化(近似等於待打開之內部閥之滯留容積)所導致的任何壓力變化時,將打開或關閉多級泵100中之諸如阻障閥135或淨化閥140之內部閥。此等準則可以又一方式來考慮,當打開多級泵100內之閥時,應自外部向內打開閥(亦即,應在打開內部閥之前打開外部閥),而當關閉多級泵100內之閥時,應自內部向外關閉閥(亦即,應在關閉外部閥之前關閉內部閥)。Another way to express the general criteria for opening and closing valves in a multi-stage pump 100 in accordance with embodiments of the present invention is that during operation of the multi-stage pump 100, only such as inlet valve 125, drain valve 145 or outlet When the external valve of the valve 147 is opened to discharge any pressure change caused by the volume change that can be caused by the opening of the valve (approximately equal to the retained volume of the internal valve to be opened), the multi-stage pump 100 will be turned on or off. Barrier valve 135 or internal valve of purge valve 140. These criteria may be considered in another manner. When opening the valve in the multi-stage pump 100, the valve should be opened from the outside inward (i.e., the external valve should be opened before opening the internal valve), and when the multi-stage pump 100 is closed When the valve is inside, the valve should be closed from the inside out (ie, the internal valve should be closed before closing the external valve).

另外,在一些實施例中,在某些改變之間將利用足夠量之時間,以確保在另一改變(例如,閥打開或關閉,馬達起動或停止)發生(例如,起始)之前,完全打開或關閉一特定閥,完全起動或停止一馬達,或系統或該系統之一部分內之壓力大體上為零p.s.i.(例如,量規)或其他非零位準。在許多情況下,100與300毫秒之間的延遲應足以允許多級泵100內之一閥大體上完全打開或關閉,然而,待用於此等技術之一特定應用或建構中的實際延遲可至少部分地視待與多級泵100一起使用之流體的黏度以及各種其他因素而定。Additionally, in some embodiments, a sufficient amount of time will be utilized between certain changes to ensure that before another change (eg, valve opening or closing, motor starting or stopping) occurs (eg, starting), completely Opening or closing a particular valve, fully starting or stopping a motor, or the pressure within a portion of the system or system is substantially zero psi (eg, gauge) or other non-zero level. In many cases, the delay between 100 and 300 milliseconds should be sufficient to allow one of the valves within the multi-stage pump 100 to be substantially fully open or closed, however, the actual delay to be used in a particular application or construction of one of these techniques may be The viscosity of the fluid to be used with the multi-stage pump 100, as well as various other factors, depends, at least in part.

可參看圖8A及8B來更好地理解上述準則,圖8A及8B提供多級泵100之運作之各種段的閥及馬達時序之一實施例的圖示,該等時序用於改善在多級泵100之運作期間的壓力變化。應注意,圖8A及8B未按比例繪製,且每一編號段無論其在此等圖中之描述而可各具有不同的或唯一的時間長度(包括零時間),且此等編號段中之每一者的長度可基於各種因素,諸如所建構之使用者配方、用於多級泵100中之閥類型(例如,花費多長時間來打開或關閉此等閥),等等。The above criteria can be better understood with reference to Figures 8A and 8B, which provide illustrations of one embodiment of valve and motor timing for various stages of operation of multi-stage pump 100 for improved at multiple stages. Pressure changes during operation of pump 100. It should be noted that Figures 8A and 8B are not drawn to scale, and that each number segment may have a different or unique length of time (including zero time), as described in the figures, and in the numbered segments The length of each can be based on various factors, such as the user recipe being constructed, the type of valve used in the multi-stage pump 100 (eg, how long it takes to open or close such valves), and the like.

參看圖8A,在時間2010時,一就緒段信號可指示多級泵100準備執行一施配,在此後的某時,在時間2010時,可在時間2020時發送一或多個信號以打開入口閥125、以在向前方向上運作施配馬達200以施配流體,且以使填充馬達175反轉以將流體汲取至填充腔室155中。在時間2020之後但在時間2022之前(例如,在段2期間),可發送一信號以打開出口閥147,使得可自出口閥147來施配流體。Referring to FIG. 8A, at time 2010, a ready segment signal may indicate that the multi-stage pump 100 is ready to perform a dispense, and at some time thereafter, at time 2010, one or more signals may be sent at time 2020 to open the portal. The valve 125 operates to dispense the motor 200 in a forward direction to dispense fluid, and to reverse the filling motor 175 to draw fluid into the filling chamber 155. After time 2020 but before time 2022 (eg, during segment 2), a signal can be sent to open outlet valve 147 such that fluid can be dispensed from outlet valve 147.

在閱讀本揭示案之後將顯而易見的係,閥信號及馬達信號之時序可基於為啟動泵之各種閥或馬達所需之時間,結合多級泵100而建構之配方或其他因素而改變。舉例而言,在圖8A中,可在發送一信號以在向前方向上運作施配馬達200之後發送該信號以打開出口閥147,因為在此實例中,出口閥147可比施配馬達200運作得更快,且因此,需要定時出口閥147之打開及施配馬達200之啟動,使得其大體上一致以達成更好的施配。然而,其他閥及馬達可具有不同的啟動速度等等,且因此,不同的時序可與此等不同的閥及馬達一起利用。舉例而言,可比用以啟動施配馬達200之信號早或與其大體上同時地發送一用以打開出口閥147之信號,且類似地,可比用以停用施配馬達200之信號早、遲或與其同時地發送一用以關閉出口閥147之信號,等等。As will be apparent upon reading this disclosure, the timing of the valve signal and motor signal may vary based on the time required to activate the various valves or motors of the pump, the formulation constructed in conjunction with the multi-stage pump 100, or other factors. For example, in FIG. 8A, the signal can be sent to open the outlet valve 147 after transmitting a signal to operate the dispensing motor 200 in the forward direction, because in this example, the outlet valve 147 can operate better than the dispensing motor 200. Faster, and therefore, the opening of the timing outlet valve 147 and the activation of the dispensing motor 200 are required such that they are substantially uniform for better dispensing. However, other valves and motors may have different starting speeds and the like, and thus, different timings may be utilized with such different valves and motors. For example, a signal to open the outlet valve 147 may be transmitted earlier or substantially simultaneously with the signal used to activate the dispensing motor 200, and similarly, may be earlier or later than the signal used to deactivate the dispensing motor 200. Or simultaneously send a signal to close the outlet valve 147, and so on.

因此,在時段2020與2030之間,可自多級泵200來施配流體。視由多級泵200所建構之配方而定,施配馬達200之運作速率在時段2020與2030之間(例如,在段2-6中之每一者中)可能為可變的,使得可在時段2020-2030之間的不同點時施配不同量的流體。舉例而言,施配馬達可根據一多項式函數來運作,使得施配馬達200在段2期間比在段6期間更快地運作,且相應地,在段2中比在段6中自多級泵200施配更多的流體。在施配段已發生之後,在時間2030之前,發送一信號以關閉出口閥147,在此後在時間2030時,發送一信號以停止施配馬達200。Thus, fluid may be dispensed from the multi-stage pump 200 between periods 2020 and 2030. Depending on the formulation constructed by the multi-stage pump 200, the operating rate of the dispense motor 200 may be variable between periods 2020 and 2030 (eg, in each of the segments 2-6) such that Different amounts of fluid are dispensed at different points between periods 2020-2030. For example, the dispensing motor can operate according to a polynomial function such that the dispensing motor 200 operates faster during segment 2 than during segment 6, and correspondingly, in segment 2 from multi-stage in segment 6 Pump 200 dispenses more fluid. After the dispensing segment has occurred, a signal is sent to close the outlet valve 147 prior to time 2030, and thereafter at time 2030, a signal is sent to stop dispensing the motor 200.

類似地,在時間2020與2050之間(例如,段2-7),饋入腔室155可經由填充馬達175之反轉而以流體來填充。接著在時間2050時,接著發送一信號以停止填充馬達175,在此後,結束填充段。為了允許填充腔室155內之壓力大體上返回至零p.s.i.(例如,量規),在採取任何其他行動之前,可在時間2050與時間2060之間(例如,段9,延遲0)使入口閥保持打開。在一實施例中,此延遲可為大約10毫秒。在另一實施例中,時間2050與時間2060之間的時段可能為可變的,且可視填充腔室155中之壓力讀數而定。舉例而言,可利用一壓力傳感器來量測填充腔室155中之壓力。當壓力傳感器指示填充腔室155中之壓力已達到零p.s.i.時,段10可在時間2060時開始。Similarly, between time 2020 and 2050 (eg, segments 2-7), the feed chamber 155 can be filled with fluid via the reversal of the fill motor 175. Next at time 2050, a signal is then sent to stop filling motor 175, after which the fill segment is ended. To allow the pressure within the fill chamber 155 to generally return to zero psi (eg, a gauge), the inlet valve can be made between time 2050 and time 2060 (eg, segment 9, delay 0) before any other action is taken. Keep it open. In an embodiment, this delay can be approximately 10 milliseconds. In another embodiment, the time period between time 2050 and time 2060 may be variable and may depend on the pressure reading in the filling chamber 155. For example, a pressure sensor can be utilized to measure the pressure in the filling chamber 155. Segment 10 may begin at time 2060 when the pressure sensor indicates that the pressure in fill chamber 155 has reached zero p.s.i.

接著,在時間2060時,發送一信號以打開隔離閥130,且在一足夠長以允許隔離閥130完全打開之適合延遲(例如,大約250毫秒)之後,在時間2070時發送一信號以打開阻障閥135。再次在一足夠長以允許阻障閥135完全打開之適合延遲(例如,大約250毫秒)之後,在時間2080時發送一信號以關閉入口閥125。在一用以允許入口閥125完全關閉之適合延遲(例如,大約350毫秒)之後,可在時間2090時發送一信號以啟動填充馬達175,且可在時間2100時發送一信號以啟動施配馬達200,使得填充馬達175在預過濾及過濾段期間(例如,段13及14)為活動的,且施配馬達200在過濾段期間(例如,段14)為活動的。時間2090與時間2100之間的時段可為一預過濾段、可為允許經過濾之流體之壓力達到一預定設定點的一設定時段或馬達移動之一設定距離,或可如上文所述使用一壓力傳感器來判定。Next, at time 2060, a signal is sent to open the isolation valve 130, and after a suitable delay (e.g., about 250 milliseconds) long enough to allow the isolation valve 130 to fully open, a signal is sent to open the resistance at time 2070. Barrier valve 135. Again, after a suitable delay (e.g., about 250 milliseconds) long enough to allow the barrier valve 135 to fully open, a signal is sent at time 2080 to close the inlet valve 125. After a suitable delay (e.g., about 350 milliseconds) to allow the inlet valve 125 to fully close, a signal can be sent at time 2090 to activate the fill motor 175, and a signal can be sent at time 2100 to activate the dispense motor 200, such that the fill motor 175 is active during the pre-filtration and filtration stages (eg, segments 13 and 14), and the dispense motor 200 is active during the filter section (eg, section 14). The period between time 2090 and time 2100 may be a pre-filter section, may be a set period of time that allows the pressure of the filtered fluid to reach a predetermined set point, or a set distance of motor movement, or may be used as described above Pressure sensor to determine.

或者,可利用壓力傳感器來量測流體之壓力,且當壓力傳感器指示流體之壓力已達到一設定點時,過濾段14可在時間2100時開始。此等處理之實施例更詳盡地描述於以引用之方式併入本文中的由George Gonnella及James Cedrone於2005年12月2日提出申請之標題為"System and Method for Control of Fluid Pressure"的美國專利申請案第11/292,559號及George Gonnella及James Cedrone之標題為"System and Method for Monitoring Operation of a Pump"的美國專利申請案第11/364,286號中。Alternatively, a pressure sensor can be utilized to measure the pressure of the fluid, and when the pressure sensor indicates that the pressure of the fluid has reached a set point, the filter section 14 can begin at time 2100. The examples of such treatments are described in more detail in the United States, filed on Dec. 2, 2005 by George Gonnella and James Cedrone, entitled "System and Method for Control of Fluid Pressure", incorporated herein by reference. U.S. Patent Application Serial No. 11/364,286, the entire disclosure of which is incorporated herein by reference.

在過濾段之後,在時間2110時發送一或多個信號以停用填充馬達175及施配馬達200。時間2100與時間2110之間的長度(例如,過濾段14)可視所要之過濾速率、填充馬達175及施配馬達200之速度、流體之黏度等等而改變。在一實施例中,過濾段可在施配馬達200到達原位之時間2110時結束。After the filter segment, one or more signals are sent at time 2110 to disable the fill motor 175 and the dispense motor 200. The length between time 2100 and time 2110 (eg, filter section 14) may vary depending on the desired filtration rate, the speed of filling motor 175 and dispensing motor 200, the viscosity of the fluid, and the like. In an embodiment, the filter section may end when the dispensing motor 200 reaches the home position 2110.

在一允許填充馬達175及施配馬達200完全停止之適合延遲之後(其可根本不需要任何時間(例如,無延遲)),在時間2120時發送一信號以打開排放閥145。移至圖8B,在一允許排放閥145完全打開之適合延遲(例如,大約225毫秒)之後,可在時間2130時將一信號發送至填充馬達175以為排放段(例如,段17)而啟動步進馬達175。雖然可在排放段期間使阻障閥135保持打開以允許在排放段期間藉由壓力感應器112來監控多級泵100內之流體的壓力,但亦可在時間2130時開始排放段之前關閉阻障閥135。After a suitable delay that allows the fill motor 175 and the dispense motor 200 to completely stop (which may not require any time at all (eg, no delay)), a signal is sent at time 2120 to open the drain valve 145. Moving to Figure 8B, after a suitable delay (e.g., about 225 milliseconds) that allows the discharge valve 145 to fully open, a signal can be sent to the fill motor 175 at time 2130 to initiate the step for the discharge section (e.g., segment 17). Into the motor 175. While the barrier valve 135 can be left open during the discharge section to allow monitoring of the pressure of the fluid within the multi-stage pump 100 by the pressure sensor 112 during the discharge section, the resistance can also be closed prior to the start of the discharge section at time 2130. Barrier valve 135.

為了結束排放段,在時間2140時發送一信號以停用填充馬達175。若須要,則在時間2140與時間2142之間,可花費一延遲(例如,大約100毫秒)來允許適合地耗散流體之壓力,例如,若在排放段期間流體之壓力較高。在一實施例中,時間2142與2150之間的時段可用於將壓力感應器112調至零,且可為大約10毫秒。To end the discharge section, a signal is sent at time 2140 to deactivate the fill motor 175. If desired, between time 2140 and time 2142, a delay (e.g., about 100 milliseconds) may be spent to allow the pressure of the fluid to be suitably dissipated, for example, if the pressure of the fluid is high during the discharge section. In an embodiment, the time period between time 2142 and 2150 can be used to tune the pressure sensor 112 to zero and can be about 10 milliseconds.

接著,在時間2150時,發送一信號以關閉阻障閥135。 在時間2150之後,允許一適合延遲,使得阻障閥135可完全關閉(例如,大約250毫秒)。接著在時間2160時發送一信號以關閉隔離閥130,且在一允許隔離閥130完全關閉之適合延遲(大約250毫秒)之後,在時間2170時發送一信號以關閉排放閥145。允許一適合延遲,使得排放閥145可完全關閉(例如,大約250毫秒),在此後,在時間2180時發送一信號以打開入口閥125,且在一允許入口閥125完全打開之適合延遲(例如,大約250毫秒)之後,在時間2190時發送一信號以打開淨化閥140。Next, at time 2150, a signal is sent to close the barrier valve 135. After time 2150, a suitable delay is allowed such that the barrier valve 135 can be fully closed (eg, approximately 250 milliseconds). A signal is then sent at time 2160 to close the isolation valve 130, and after a suitable delay (about 250 milliseconds) to allow the isolation valve 130 to fully close, a signal is sent at time 2170 to close the discharge valve 145. Allowing a suitable delay such that the bleed valve 145 can be fully closed (e.g., about 250 milliseconds), after which a signal is sent at time 2180 to open the inlet valve 125 and at a suitable delay that allows the inlet valve 125 to fully open (e.g. After approximately 250 milliseconds, a signal is sent at time 2190 to open purge valve 140.

在一允許排放閥145完全打開之適合延遲(例如,大約250毫秒)之後,可在時間2200時將一信號發送至施配馬達200以為淨化段(例如,段25)而起動施配馬達200,且在可具有配方依賴性之用於淨化段之時段之後,可在時間2210時發送一信號以停止施配馬達200並結束淨化段。在時間2210與2212之間,允許一足夠時段(例如,使用壓力感應器1112來預定或判定),使得施配腔室185中之壓力可大體上穩定為零p.s.i(例如,大約10毫秒)。隨後,在時間2220時,可發送一信號以關閉淨化閥140,且在允許一足以使淨化閥140完全關閉之延遲(例如,大約250毫秒)之後,可在時間2230時發送一信號以關閉入口閥125。在啟動施配馬達200以改正由多級泵100內之閥之關閉所導致的任何壓力變化(如上文所述)之後,多級泵100可再次準備在時間2010時執行施配。After a suitable delay (eg, about 250 milliseconds) that allows the discharge valve 145 to fully open, a signal can be sent to the dispense motor 200 at time 2200 to start the dispense motor 200 for the purge section (eg, section 25), And after a period of time that can be recipe dependent for the purge section, a signal can be sent at time 2210 to stop dispensing the motor 200 and end the purge section. Between times 2210 and 2212, a sufficient period of time is allowed (e.g., using pressure sensor 1112 to predetermined or determine) such that the pressure in dispensing chamber 185 can be substantially stable to zero p.s.i (e.g., about 10 milliseconds). Subsequently, at time 2220, a signal can be sent to close purge valve 140, and after allowing a delay sufficient to cause purge valve 140 to fully close (e.g., about 250 milliseconds), a signal can be sent at time 2230 to close the inlet. Valve 125. After the dispensing of the motor 200 is initiated to correct any pressure changes (as described above) caused by the closing of the valves within the multi-stage pump 100, the multi-stage pump 100 can again be ready to perform the dispensing at time 2010.

應注意,在就緒段與施配段之間可存在某一延遲。由於當多級泵100進入就緒段時,可關閉阻障閥135及隔離閥130,所以有可能在不影響多級泵之隨後施配的情況下將流體引入至填充腔室155中,此無關於施配是在此填充期間還是在此填充之後被起始。It should be noted that there may be some delay between the ready segment and the dispense segment. Since the barrier valve 135 and the isolation valve 130 can be closed when the multi-stage pump 100 enters the ready section, it is possible to introduce fluid into the filling chamber 155 without affecting the subsequent application of the multi-stage pump. Whether the dispensing is initiated during this filling or after this filling.

可參看圖9A及9B來更清楚地描述在多級泵100處於就緒狀態的同時填充填充腔室155,圖9A及9B提供多級泵100之運作的各種段之閥及馬達時序之另一實施例的圖示,該等時序用於改善多級泵100之運作期間的壓力變化。9A and 9B, it will be more clearly described that the filling chamber 155 is filled while the multi-stage pump 100 is in a ready state, and FIGS. 9A and 9B provide another implementation of the various stages of valve and motor timing for operation of the multi-stage pump 100. As illustrated by the examples, the timings are used to improve pressure changes during operation of the multi-stage pump 100.

參看圖9A,在時間3010時,一就緒段信號可指示多級泵100準備執行施配,在此後之某時,在時間3012時,可發送一信號以打開出口閥147。在一允許出口閥147打開之適合延遲之後,可在時間3020時發送一或多個信號,以在向前方向上運作施配馬達200以自出口閥147來施配流體,且以使填充馬達175反轉以將流體汲取至填充腔室155中(如下文中更充分之描述,自一先前填充段以來,入口閥125可仍為打開的)。可在時間3030時發送一信號以停止施配馬達200,且在時間3040時發送一信號以關閉出口閥147。Referring to Figure 9A, at time 3010, a ready segment signal may indicate that the multi-stage pump 100 is ready to perform the dispense, at some time thereafter, at time 3012, a signal may be sent to open the outlet valve 147. After a suitable delay to allow the outlet valve 147 to open, one or more signals may be sent at time 3020 to operate the dispensing motor 200 in the forward direction to dispense fluid from the outlet valve 147, and to cause the filling motor 175 Inversion to draw fluid into the filling chamber 155 (as described more fully below, the inlet valve 125 may remain open since a previous filling section). A signal may be sent at time 3030 to stop dispensing the motor 200 and a signal is sent at time 3040 to close the outlet valve 147.

在閱讀本揭示案之後將顯而易見的係,閥信號及馬達信號之時序可基於為啟動泵之各種閥或馬達所需之時間、結合多級泵100而建構之配方或其他因素而改變。舉例而言(如圖8A中所描述),可在發送一信號以在向前方向上運作施配馬達200之後發送該信號以打開出口閥147,因為在此實例中,出口閥147可比施配馬達200運作得更快,且因此,需要定時出口閥147之打開及施配馬達200之啟動,使得其大體上一致以達成更好的施配。然而,其他閥及馬達可具有不同的啟動速度等等,且因此,不同的時序可與此等不同的閥及馬達一起利用。舉例而言,可比用以啟動施配馬達200之信號早或與其同時地發送一用以打開出口閥147之信號,且類似地,可比用以停用施配馬達200之信號早、遲或與其同時地發送一用以關閉出口閥147之信號,等等。As will be apparent upon reading this disclosure, the timing of the valve signals and motor signals may vary based on the time required to activate the various valves or motors of the pump, the formulation constructed in conjunction with the multi-stage pump 100, or other factors. For example (as depicted in Figure 8A), the signal can be sent to open the outlet valve 147 after transmitting a signal to operate the dispensing motor 200 in the forward direction, as in this example, the outlet valve 147 can be compared to the dispensing motor The 200 operates faster and, therefore, requires the opening of the timing outlet valve 147 and the activation of the dispensing motor 200 such that they are substantially identical for better dispensing. However, other valves and motors may have different starting speeds and the like, and thus, different timings may be utilized with such different valves and motors. For example, a signal to activate the outlet valve 147 may be transmitted earlier or concurrently with the signal used to activate the dispensing motor 200, and similarly, may be used earlier or later than the signal used to deactivate the dispensing motor 200. Simultaneously send a signal to close the outlet valve 147, and so on.

因此,在時段3020與3030之間,可自多級泵200施配流體。視由多級泵200所建構之配方而定,施配馬達200之運作速率在時段3020與3030之間(例如,在段2-6中之每一者中)可能為可變的,使得可在時段3020-3030之間的不同點時施配不同量的流體。舉例而言,施配馬達可根據一多項式函數來運作,使得施配馬達200在段2期間比在段6期間更快地運作,且相應地,在段2中比在段6中自多級泵200施配更多的流體。在施配段已發生之後,在時間3030之前,發送一信號以關閉出口閥147,在此後在時間3030時,發送一信號以停止施配馬達200。Thus, fluid may be dispensed from the multi-stage pump 200 between periods 3020 and 3030. Depending on the formulation constructed by the multi-stage pump 200, the operating rate of the dispense motor 200 may be variable between periods 3020 and 3030 (eg, in each of the segments 2-6) such that Different amounts of fluid are dispensed at different points between periods 3020-3030. For example, the dispensing motor can operate according to a polynomial function such that the dispensing motor 200 operates faster during segment 2 than during segment 6, and correspondingly, in segment 2 from multi-stage in segment 6 Pump 200 dispenses more fluid. After the dispensing section has occurred, a signal is sent to close the outlet valve 147 before time 3030, and thereafter at time 3030, a signal is sent to stop the dispensing of the motor 200.

類似地,在時間3020與3050之間(例如,段2-7),饋入腔室155可經由填充馬達175之反轉而以流體來填充。接著在時間3050時,接著發送一信號以停止填充馬達175,在此後,結束填充段。為了允許填充腔室155內之壓力大體上返回至零p.s.i.(例如,量規),在採取任何其他行動之前,可在時間3050與時間3060之間(例如,段9,延遲0)使入口閥保持打開。在一實施例中,此延遲可為大約10毫秒。在另一實施例中,時間3050與時間3060之間的時段可能為可變的,且可視填充腔室155中之壓力讀數而定。舉例而言,可利用一壓力傳感器來量測填充腔室155中之壓力。當壓力傳感器指示填充腔室155中之壓力已達到零p.s.i.時,段10可在時間3060時開始。Similarly, between times 3020 and 3050 (eg, segments 2-7), the feed chamber 155 can be filled with fluid via the reversal of the fill motor 175. Next at time 3050, a signal is then sent to stop filling motor 175, after which the fill segment is ended. To allow the pressure within the fill chamber 155 to generally return to zero psi (eg, a gauge), the inlet valve can be made between time 3050 and time 3060 (eg, segment 9, delay 0) before any other action is taken. Keep it open. In an embodiment, this delay can be approximately 10 milliseconds. In another embodiment, the time period between time 3050 and time 3060 may be variable and may depend on the pressure reading in the filling chamber 155. For example, a pressure sensor can be utilized to measure the pressure in the filling chamber 155. Segment 10 may begin at time 3060 when the pressure sensor indicates that the pressure in fill chamber 155 has reached zero p.s.i.

接著,在時間3060時,發送一信號以打開隔離閥130,且在時間3070時發送一信號以打開阻障閥135。接著在時間3080時發送一信號以關閉入口閥125,在此後,在時間3090時發送一信號以啟動填充馬達175,且可在時間3100時發送一信號以啟動施配馬達200,使得填充馬達175在預過濾及過濾段期間為活動的且施配馬達200在過濾段期間為活動的。Next, at time 3060, a signal is sent to open the isolation valve 130, and at time 3070 a signal is sent to open the barrier valve 135. A signal is then sent at time 3080 to close the inlet valve 125, after which a signal is sent at time 3090 to activate the fill motor 175, and a signal can be sent at time 3100 to activate the dispense motor 200 such that the fill motor 175 Active during the pre-filtration and filtration section and the dispensing motor 200 is active during the filtration section.

在過濾段之後,在時間3110時發送一或多個信號以停用填充馬達175及施配馬達200。在時間3120時發送一信號以打開排放閥145。移至圖9B,可在時間3130時將一信號發送至填充馬達175以為排放段而啟動步進馬達175。為了結束排放段,在時間3140時發送一信號以停用填充馬達175。接著,在時間3150時,發送一信號以關閉阻障閥125,而在時間3160時發送一信號以關閉隔離閥130且在時間3170時發送一信號以關閉排放閥145。After the filter segment, one or more signals are sent at time 3110 to disable the fill motor 175 and the dispense motor 200. A signal is sent at time 3120 to open the drain valve 145. Moving to Figure 9B, a signal can be sent to the fill motor 175 at time 3130 to activate the stepper motor 175 for the discharge section. To end the discharge section, a signal is sent at time 3140 to deactivate the fill motor 175. Next, at time 3150, a signal is sent to close the barrier valve 125, while at time 3160 a signal is sent to close the isolation valve 130 and a signal is sent at time 3170 to close the discharge valve 145.

在時間3180時發送一信號以打開入口閥125,且在此後,在時間3190時發送一信號以打開淨化閥140。接著可在時間3200時將一信號發送至施配馬達200以為淨化段而起動施配馬達200,且在淨化段之後,可在時間3210時發送一信號以停止施配馬達200。A signal is sent at time 3180 to open the inlet valve 125, and thereafter, at time 3190 a signal is sent to open the purge valve 140. A signal can then be sent to the dispense motor 200 at time 3200 to start the dispense motor 200 for the purge section, and after the purge section, a signal can be sent at time 3210 to stop the dispense motor 200.

隨後,在時間3220時,可發送一信號以關閉淨化閥140,接著在時間3230時發送一信號以關閉入口閥125。在啟動施配馬達200以改正由多級泵100內之閥之關閉所導致的任何壓力變化(如上文所述)之後,多級泵100可再次準備在時間3010時執行施配。Subsequently, at time 3220, a signal can be sent to turn off purge valve 140, and then a signal is sent at time 3230 to close inlet valve 125. After the dispensing of the motor 200 is initiated to correct any pressure changes (as described above) caused by the closing of the valves within the multi-stage pump 100, the multi-stage pump 100 can again be ready to perform the dispensing at time 3010.

一旦多級泵100在時間3010時進入就緒段,就可發送一信號以打開入口閥125,且可發送另一信號以使填充馬達175反轉,使得在多級泵100處於就緒狀態的同時將液體汲取至填充腔室155中。雖然在就緒段期間填充腔室155填充有液體,但此填充毫不影響多級泵100在進入就緒段之後的任一點時施配流體之能力,因為阻障閥135及隔離閥130關閉,從而大體上將填充腔室155與施配腔室185分離。此外,若在填充完成之前起始一施配,則填充可大體上與流體自多級泵100之施配同時地繼續。Once the multi-stage pump 100 enters the ready section at time 3010, a signal can be sent to open the inlet valve 125 and another signal can be sent to reverse the fill motor 175 so that while the multi-stage pump 100 is in the ready state The liquid is drawn into the filling chamber 155. Although the filling chamber 155 is filled with liquid during the ready section, this filling does not affect the ability of the multi-stage pump 100 to dispense fluid at any point after entering the ready section because the barrier valve 135 and the isolation valve 130 are closed, thereby The filling chamber 155 is generally separated from the dispensing chamber 185. Moreover, if a dispensing is initiated prior to completion of filling, the filling may generally continue concurrently with the dispensing of fluid from the multi-stage pump 100.

當多級泵100最初進入就緒段時,施配腔室185中之壓力可處於近似為施配段所要之壓力。然而,由於可在進入就緒段與施配段之起始之間存在某一延遲,所以在就緒段期間,施配腔室185內之壓力可基於各種因素而改變,諸如施配腔室185中之施配級隔膜190之性質、溫度之改變或相配之其他因素。因此,當起始施配段時,施配腔室185中之壓力可自為施配所要之基線壓力浮動相對顯著之程度。When the multi-stage pump 100 initially enters the ready section, the pressure in the dispensing chamber 185 can be at a pressure that is approximately the desired portion of the dispensing section. However, since there may be some delay between the entry of the ready section and the beginning of the dispensing section, during the ready section, the pressure within the dispensing chamber 185 may vary based on various factors, such as in the dispensing chamber 185. The nature of the graded membrane 190, the change in temperature, or other factors that match. Thus, when the dispensing section is initiated, the pressure in the dispensing chamber 185 can be relatively significant from the baseline pressure required for dispensing.

可參看圖10A及10B來更清楚地展示此浮動。圖10A描述施配腔室185處之實例壓力輪廓,其說明在就緒段期間施 配腔室中之壓力的浮動。如上文中參看圖9A及9B所描述,近似在點4010處,可發生對由閥移動或另一原因所導致之任何壓力變化的改正。此壓力改正可將施配腔室185中之壓力改正至近似在點4020處之施配所要之近似基線壓力(藉由線4030來表示),在此點處,多級泵100可進入就緒段。可看出,在進入就緒段之後,近似在點4020處,歸因於諸如上文所述之因素的各種因素,施配腔室185中之壓力可經受一穩定上升。接著,當隨後之施配段發生時,自基線壓力4030之此壓力浮動可導致不滿意的施配。This float can be more clearly shown with reference to Figures 10A and 10B. FIG. 10A depicts an example pressure profile at the dispensing chamber 185 illustrating the application during the ready phase The float of the pressure in the chamber. As described above with reference to Figures 9A and 9B, approximately at point 4010, corrections can be made to any pressure changes caused by valve movement or another cause. This pressure correction can correct the pressure in the dispensing chamber 185 to approximately the desired baseline pressure (indicated by line 4030) at the point 4020, at which point the multi-stage pump 100 can enter the ready section. . It can be seen that after entering the ready section, approximately at point 4020, the pressure in the dispensing chamber 185 can withstand a steady rise due to various factors such as those described above. This pressure fluctuation from baseline pressure 4030 can then result in an unsatisfactory dispense when subsequent dispensing sessions occur.

另外,由於進入就緒段與隨後之施配段之間的時間延遲可能為可變的,且施配腔室185中之壓力浮動可與延遲之時間相關,所以歸因於可在不同延遲期間出現之不同的浮動量,發生於連續施配段中之每一者中的施配可能不同。因此,此壓力浮動亦可影響多級泵100準確地重複一施配之能力,此又可妨礙在製程配方複製中多級泵100之使用。因此,可能需要在多級泵100之就緒段期間大體上維持基線壓力以改良在隨後之施配段期間的施配及跨越施配段之施配的可重複性,而同時達成可接受之流體動力學。Additionally, since the time delay between entering the ready segment and the subsequent dispensing segment may be variable, and the pressure fluctuation in the dispensing chamber 185 may be related to the time of the delay, due to the fact that it may occur during different delays The different amounts of float, the dispensing that occurs in each of the successive dispensing segments, may be different. Thus, this pressure fluctuation can also affect the ability of the multi-stage pump 100 to accurately repeat a dispensing operation, which in turn can hinder the use of the multi-stage pump 100 in process recipe replication. Accordingly, it may be desirable to maintain a substantially baseline pressure during the ready phase of the multi-stage pump 100 to improve the dispensing during the subsequent dispensing stage and the repeatability of the dispensing across the dispensing section while achieving acceptable fluids. dynamics.

在一實施例中,為了在就緒段期間大體上維持基線壓力,可控制施配馬達200以補償或解決可發生於施配腔室185中之向上(或向下)壓力浮動。更明確地說,可控制施配馬達200以使用"死帶"封閉迴路壓力控制來大體上維持施配腔室185中之基線壓力。簡要地返回至圖2,壓力感應器112可以規則的時間間隔來向泵控制器20報告壓力讀數。若所報告之壓力與所要基線壓力偏離某一量或容差,則泵控制器20可將一信號發送至施配馬達200以反轉(或向前移動)有可能使施配馬達200移動在泵控制器20處可偵測到的最小距離(馬達增量),因此收回(或向前移動)活塞192及施配級隔膜190,從而使施配腔室185內之壓力產生相應的減少(或增加)。In an embodiment, to substantially maintain baseline pressure during the ready phase, the dispensing motor 200 can be controlled to compensate or account for upward (or downward) pressure fluctuations that can occur in the dispensing chamber 185. More specifically, the dispensing motor 200 can be controlled to substantially maintain the baseline pressure in the dispensing chamber 185 using "dead band" closed loop pressure control. Returning briefly to FIG. 2, the pressure sensor 112 can report pressure readings to the pump controller 20 at regular time intervals. If the reported pressure deviates from the desired baseline pressure by a certain amount or tolerance, the pump controller 20 may send a signal to the dispensing motor 200 to reverse (or move forward) possibly moving the dispensing motor 200 at The minimum distance (motor increment) detectable at the pump controller 20 thus retracts (or moves forward) the piston 192 and the dispensing stage diaphragm 190, thereby correspondingly reducing the pressure within the dispensing chamber 185 ( Or increase).

由於與施配馬達200之運作速度相比,壓力感應器112可取樣及報告施配腔室185中之壓力的頻率可能稍快,所以大約在將一信號發送至施配馬達200時之某一時窗期間,泵控制器20可能不處理由壓力感應器112所報告之壓力量測,或可停用壓力感應器112,使得在泵控制器20接收或處理另一壓力量測之前,施配馬達200可完成其移動。或者,在處理由壓力感應器112所報告之壓力量測之前,泵控制器20可等待直至其已偵測到施配馬達200已完成其移動為止。在許多實施例中,壓力感應器112取樣施配腔室185中之壓力及報告此壓力量測的取樣時間間隔可為大約30 kHz、大約10 kHz或另一時間間隔。Since the pressure sensor 112 can sample and report the frequency of the pressure in the dispensing chamber 185 may be slightly faster than the operating speed of the dispensing motor 200, approximately one time when a signal is sent to the dispensing motor 200 During the window, the pump controller 20 may not process the pressure measurements reported by the pressure sensor 112, or the pressure sensor 112 may be deactivated such that the motor is dispensed before the pump controller 20 receives or processes another pressure measurement. 200 can complete its movement. Alternatively, prior to processing the pressure measurements reported by pressure sensor 112, pump controller 20 may wait until it has detected that dispensing motor 200 has completed its movement. In many embodiments, the pressure sensor 112 samples the pressure in the dispensing chamber 185 and reports a sampling interval for this pressure measurement of about 30 kHz, about 10 kHz, or another time interval.

然而,上述實施例並非不具有其問題。在一些情況下,如上文所述,當進入就緒段與隨後施配段之間的時間延遲為可變時,此等實施例中之一或多個可展示施配之顯著變化。在某一程度上,藉由在進入就緒段與隨後施配之間利用一固定的時間間隔,可減少此等問題且增強可重複性,然而,此在建構一特定處理時不總是可行的。However, the above embodiments are not without their problems. In some cases, as described above, one or more of these embodiments may exhibit a significant change in the dispense when the time delay between entering the ready segment and the subsequent dispensing segment is variable. To some extent, by using a fixed time interval between entering the ready segment and subsequent dispensing, these problems can be reduced and reproducibility enhanced, however, this is not always feasible when constructing a particular process. .

為了在多級泵100之就緒段期間大體上維持基線壓力,同時增強施配之可重複性,在一些實施例中,可控制施配馬達200以使用封閉迴路壓力控制來補償或解決可發生於施配腔室185中之壓力浮動。壓力感應器112可以規則的時間間隔(如上文所述,在一些實施例中,此時間間隔可為大約30 kHz、大約10 kHz或另一時間間隔)來向泵控制器20報告壓力讀數。若所報告之壓力高於(或低於)所要之基線壓力,則泵控制器20可將一信號發送至施配馬達200以將施配馬達200反轉(或向前移動)一馬達增量,因此收回(或向前移動)活塞192及施配級隔膜190且減少(或增加)施配腔室185內之壓力。此壓力監控及改正可大體上連續地發生,直至施配段之起始為止。以此方式,可在施配腔室185中維持近似所要之基線壓力。In order to substantially maintain baseline pressure during the ready phase of multi-stage pump 100 while enhancing the repeatability of the dispense, in some embodiments, controllable dispensing motor 200 to compensate or resolve using closed loop pressure control may occur The pressure in the dispensing chamber 185 floats. The pressure sensor 112 can report pressure readings to the pump controller 20 at regular time intervals (as described above, in some embodiments, this time interval can be about 30 kHz, about 10 kHz, or another time interval). If the reported pressure is above (or below) the desired baseline pressure, pump controller 20 may send a signal to dispense motor 200 to reverse (or move forward) the dispense motor 200 to a motor increment. Thus, the piston 192 is retracted (or moved forward) and the stage diaphragm 190 is dispensed and the pressure within the dispensing chamber 185 is reduced (or increased). This pressure monitoring and correction can occur substantially continuously until the beginning of the dispensing section. In this manner, an approximately desired baseline pressure can be maintained in the dispensing chamber 185.

如上文所論述,與施配馬達200之運作速度相比,壓力感應器112可取樣及報告施配腔室185中之壓力的頻率可能稍頻繁。為了解決此差異,大約在將一信號發送至施配馬達200時之某一時窗期間,泵控制器20可能不處理由壓力感應器112所報告之壓力量測,或可停用壓力感應器112,使得在泵控制器20接收或處理另一壓力量測之前,施配馬達200可完成其移動。或者,在處理由壓力感應器112所報告之壓力量測之前,泵控制器20可等待直至其已偵測到施配馬達200已完成其移動或接收到施配馬達200已完成其移動的通知為止。As discussed above, the frequency at which the pressure sensor 112 can sample and report the pressure in the dispensing chamber 185 may be slightly more frequent than the operating speed of the dispense motor 200. To address this difference, the pump controller 20 may not process the pressure measurements reported by the pressure sensor 112 during a certain time window when a signal is sent to the dispensing motor 200, or the pressure sensor 112 may be deactivated. The dispensing motor 200 can complete its movement before the pump controller 20 receives or processes another pressure measurement. Alternatively, prior to processing the pressure measurements reported by the pressure sensor 112, the pump controller 20 may wait until it has detected that the dispensing motor 200 has completed its movement or received a notification that the dispensing motor 200 has completed its movement. until.

可參看圖10B來容易地看出如所論述之使用封閉迴路控制系統之一實施例來大體上維持基線壓力的有益效應,圖10B描述施配腔室185處之實例壓力輪廓,其中,在就緒段期間剛好使用封閉迴路控制系統之此實施例。如上文中參看圖6及7所描述,近似在點4050處,可發生對由閥移動或另一原因所導致之任何壓力變化的改正。此壓力改正可將施配腔室185中之壓力改正至近似在點4060處之施配所要之近似基線壓力(藉由線4040來表示),在此點處,多級泵100可進入就緒段。在進入就緒段之後,近似在點4060處,封閉迴路控制系統之一實施例可解決就緒段期間之任何壓力浮動以大體上維持所要之基線溫度。舉例而言,在點4070處,封閉迴路控制系統可偵測一壓力上升且解決此壓力上升以大體上維持基線壓力4040。類似地,在點4080、4090、4100、4110處,封閉迴路控制系統可解決或改正施配腔室185中之壓力浮動以大體上維持所要之基線壓力4040,而不管就緒段之長度(注意,點4080、4090、4100及4110僅為代表性的,且藉由封閉迴路控制系統所進行之其他壓力改正描述於圖10B中,沒有為其給出參考數字且因此未如此論述)。因此,由於在就緒段期間藉由封閉迴路控制系統而在施配腔室185中大體上維持所要之基線壓力4040,所以可在隨後之施配段中達成更滿意之施配。The beneficial effect of using one of the closed loop control systems to substantially maintain baseline pressure as discussed, can be readily seen with reference to Figure 10B, which depicts an example pressure profile at the dispensing chamber 185, where This embodiment of the closed loop control system is just used during the segment. As described above with reference to Figures 6 and 7, approximately at point 4050, corrections can be made to any pressure changes caused by valve movement or another cause. This pressure correction can correct the pressure in the dispensing chamber 185 to approximately the desired baseline pressure (indicated by line 4040) at approximately point 4060, at which point the multi-stage pump 100 can enter the ready section. . After entering the ready section, approximately at point 4060, one embodiment of the closed loop control system can resolve any pressure fluctuations during the ready section to substantially maintain the desired baseline temperature. For example, at point 4070, the closed loop control system can detect a pressure rise and resolve the pressure rise to substantially maintain the baseline pressure 4040. Similarly, at points 4080, 4090, 4100, 4110, the closed loop control system can resolve or correct the pressure fluctuations in the dispensing chamber 185 to substantially maintain the desired baseline pressure 4040 regardless of the length of the ready section (note, Points 4080, 4090, 4100, and 4110 are merely representative, and other pressure corrections performed by the closed loop control system are depicted in Figure 10B, without reference numerals being given thereto and thus not discussed as such). Thus, since the desired baseline pressure 4040 is substantially maintained in the dispensing chamber 185 by the closed loop control system during the ready section, a more satisfactory dispensing can be achieved in the subsequent dispensing section.

然而,在隨後之施配段期間,為了達成此更滿意之施配,可能需要在致動施配馬達200以自施配腔室185施配流體時解決所進行之任何改正以大體上維持基線壓力。更具體言之,在點4060處,剛好在壓力改正發生且多級泵100最初進入就緒段之後,施配級隔膜190可處於起始位置。為了自此初始位置達成所要施配,應將施配級隔膜190移動至一施配位置。然而,在改正如上文所述之壓力浮動之後,施配級隔膜190可處於一不同於初始位置之第二位置。在一些實施例中,應在施配段期間藉由將施配級隔膜190移動至施配位置以達成所要施配來解決此差異。換言之,為了達成所要之施配,當多級泵100最初進入就緒段時,施配級隔膜190可在對就緒段期間之壓力浮動的任何改正已發生之後自其第二位置移動至施配級隔膜190之初始位置,在此後,施配級隔膜190接著可移動自初始位置至施配位置之距離。However, during this subsequent dispensing phase, in order to achieve this more satisfactory dispensing, it may be desirable to address any corrections made to substantially maintain the baseline when the dispensing motor 200 is actuated to dispense fluid from the dispensing chamber 185. pressure. More specifically, at point 4060, the dispensing stage diaphragm 190 can be in the starting position just after the pressure correction occurs and the multi-stage pump 100 initially enters the ready section. In order to achieve the desired application from this initial position, the dispensing stage diaphragm 190 should be moved to a dispensing position. However, after changing the pressure float as described above, the dispensing stage diaphragm 190 can be in a second position that is different from the initial position. In some embodiments, this difference should be resolved during the dispensing segment by moving the dispensing stage diaphragm 190 to the dispensing position to achieve the desired dispense. In other words, in order to achieve the desired dispensing, when the multi-stage pump 100 initially enters the ready section, the dispensing stage diaphragm 190 can be moved from its second position to the dispensing stage after any corrections to the pressure fluctuations during the ready section have occurred. The initial position of the diaphragm 190, after which the dispensing stage diaphragm 190 can then be moved from the initial position to the dispensing position.

在一實施例中,當多級泵100最初進入就緒段時,泵控制器20可計算用以移動施配馬達200以達成所要施配之初始距離(施配距離)。在多級泵100處於就緒段時,泵控制器20可追蹤施配馬達200已移動以改正發生於就緒段期間之任何壓力浮動的距離(改正距離)。在施配級期間,為了達成所要施配,泵控制器20可向施配馬達200發信號以移動改正距離加上(或減去)施配距離。In an embodiment, when the multi-stage pump 100 initially enters the ready section, the pump controller 20 may calculate an initial distance (distribution distance) for moving the dispensing motor 200 to achieve the desired dispense. While the multi-stage pump 100 is in the ready section, the pump controller 20 can track the distance (correction distance) that the dispense motor 200 has moved to correct any pressure fluctuations that occurred during the ready section. During the dispensing stage, in order to achieve the desired dispense, the pump controller 20 may signal the dispense motor 200 to move the correction distance plus (or minus) the dispense distance.

然而,在其他情況下,可能不需要在致動施配馬達200以自施配腔室185施配流體時解決此等壓力改正。更具體言之,在點4060處,剛好在壓力改正發生且多級泵100最初進入就緒段之後,施配級隔膜190可處於起始位置。為了自此初始位置達成所要施配,應將施配級隔膜190移動一施配距離。在改正如上文所述之壓力浮動之後,施配級隔膜190可處於一不同於初始位置之第二位置。在一些實施例中,僅藉由將施配級隔膜190移動施配距離(自第二位置開始),可達成所要之施配。However, in other cases, it may not be necessary to address such pressure corrections when the dispensing motor 200 is actuated to dispense fluid from the dispensing chamber 185. More specifically, at point 4060, the dispensing stage diaphragm 190 can be in the starting position just after the pressure correction occurs and the multi-stage pump 100 initially enters the ready section. In order to achieve the desired dispense from this initial position, the dispensing stage diaphragm 190 should be moved a dispense distance. After the pressure fluctuation as described above, the dispensing stage diaphragm 190 can be in a second position different from the initial position. In some embodiments, the desired dispensing can be achieved simply by moving the dispensing stage diaphragm 190 a dispensing distance (starting from the second position).

在一實施例中,當多級泵100最初進入就緒段時,泵控制器20可計算用以移動施配馬達200以達成一所要施配之初始距離。接著,在施配級期間,為了達成所要施配,泵控制器20可向施配馬達200發信號以移動此初始距離,此無關於施配馬達200已移動以改正就緒段期間之壓力浮動的距離。In an embodiment, when the multi-stage pump 100 initially enters the ready section, the pump controller 20 may calculate to move the dispensing motor 200 to achieve an initial distance to be dispensed. Next, during the dispensing stage, in order to achieve the desired dispense, the pump controller 20 can signal the dispensing motor 200 to move the initial distance regardless of the pressure float during which the dispensing motor 200 has moved to correct the ready segment. distance.

將顯而易見的係,對用於任何給定環境中之上述實施例中之一者的選擇將視許多因素而定,諸如待結合所選實施例而使用之系統、設備或經驗條件。亦將顯而易見的係,雖然用於大體上維持基線壓力之控制系統之上述實施例已關於解決就緒段期間之向上壓力浮動而加以描述,但此等相同系統及方法之實施例同樣可用於解決多級泵100之就緒段或任何其他段中的向上或向下壓力浮動。此外,雖然本發明之實施例已關於多級泵100而加以描述,但應瞭解,此等發明之實施例(例如,控制方法,等等)同樣可良好地用於且有效地用於單級泵裝置或實際上任何其他類型之泵裝置。It will be apparent that the selection of one of the above-described embodiments for use in any given environment will depend on a number of factors, such as the system, equipment, or experience conditions to be used in connection with the selected embodiments. It will also be apparent that while the above-described embodiments of the control system for substantially maintaining baseline pressure have been described with respect to addressing the upward pressure fluctuation during the ready segment, embodiments of such identical systems and methods are equally applicable to The upward or downward pressure in the ready section of the stage pump 100 or any other section floats. Moreover, while embodiments of the present invention have been described in relation to multi-stage pump 100, it should be understood that embodiments of such invention (e.g., control methods, etc.) are equally well utilized and effectively used in a single stage. Pump device or virtually any other type of pump device.

此處可能有用的是描述可結合本發明之各種實施例而利用之剛才此單級泵裝置的實例。圖11為用於泵4000之泵總成之一實施例的圖示。泵4000可類似於上文所述之多級泵100之一級(例如,施配級),且可包括一由步進馬達、無刷DC馬達或其他馬達所驅動之滾動隔膜泵。泵4000可包括一界定通過泵4000之各種流體流道且至少部分地界定一泵腔室之施配區塊4005。根據一實施例,施配泵區塊4005可為PTFE、經改質之PTFE或其他材料之整體區塊。因為此等材料不與許多處理流體發生反應或與許多處理流體最低限度地發生反應,所以此等材料之使用允許以最少量的額外硬體來將流道及泵腔室直接加工於施配區塊4005中。施配區塊4005因此藉由提供整合之流體歧管而減少對管路之需要。What may be useful herein is an example of a single stage pump device that can be utilized in conjunction with various embodiments of the present invention. 11 is an illustration of one embodiment of a pump assembly for pump 4000. The pump 4000 can be similar to one of the stages of the multi-stage pump 100 described above (eg, a dispensing stage) and can include a rolling diaphragm pump driven by a stepper motor, a brushless DC motor, or other motor. Pump 4000 can include a dispensing block 4005 that defines various fluid flow paths through pump 4000 and at least partially defines a pump chamber. According to an embodiment, the dispense pump block 4005 can be an integral block of PTFE, modified PTFE, or other material. Because these materials do not react with many treatment fluids or react minimally with many treatment fluids, the use of such materials allows the flow path and pump chamber to be directly processed into the dispensing zone with a minimum amount of additional hardware. In block 4005. The dispensing block 4005 thus reduces the need for piping by providing an integrated fluid manifold.

施配區塊4005可包括各種外部入口及出口,包括(例如)用於收納流體之入口4010、用於淨化/排放流體之淨化/排放出口4015,及用於在施配段期間施配流體之施配出口4020。在圖11之實例中,由於泵僅具有一腔室,所以施配區塊4005包括外部淨化出口4010。以引用之方式全部併入本文中的由Iraj Gashgaee於2005年12月2日提出申請之標題為"O-Ring-Less Low Profile Fitting and Assembly Thereof"的美國臨時專利申請案第60/741,667號及由Iraj Gashgaee於2006年11月20日提出申請之標題為"O-Ring-Less Low Profile Fittings and Fitting Assemblies"的美國專利申請案第11/602,513號[ENTG1760-1]中描述了可用於將施配區塊4005之外部入口及出口連接至流體線之接頭的實施例。The dispensing block 4005 can include various external inlets and outlets, including, for example, an inlet 4010 for containing fluid, a purge/discharge outlet 4015 for purifying/discharging fluid, and for dispensing fluid during the dispensing section. The outlet 4020 is dispensed. In the example of FIG. 11, since the pump has only one chamber, the dispensing block 4005 includes an external purge outlet 4010. U.S. Provisional Patent Application Serial No. 60/741,667, entitled "O-Ring-Less Low Profile Fitting and Assembly Thereof", filed on December 2, 2005 by Iraj Gashgaee, incorporated herein by reference. U.S. Patent Application Serial No. 11/602,513, entitled "O-Ring-Less Low Profile Fittings and Fitting Assemblies", which is hereby incorporated by reference in its entirety in An embodiment in which the outer inlet and outlet of the distribution block 4005 are connected to the joint of the fluid line.

施配區塊4005將流體自入口導引至入口閥(例如,至少部分地由閥板4030界定)、自入口閥導引至泵腔室、自泵腔室導引至排放/淨化閥及自泵腔室導引至出口4020。一泵蓋4225可保護泵馬達不受到損害,而活塞外殼4027可為活塞提供保護,且根據本發明之一實施例,活塞外殼4027可由聚乙烯或其他聚合物形成。閥板4030為可經組態以引導流體流至泵4000之各種組件的閥系統(例如,入口閥及淨化/排放閥)提供閥外殼。可類似於上文所述之結合閥板230而描述之方式來形成閥板4030及相應閥。根據一實施例,入口閥及淨化/排放閥中之每一者至少部分地整合於閥板4030中,且為一視壓力還是真空施加至相應隔膜而打開或關閉之隔膜閥。在其他實施例中,該等閥中之一些可在施配區塊4005之外部或配置於額外閥板中。根據一實施例,一PTFE薄片夾於閥板4030與施配區塊4005之間以形成各種閥之隔膜。閥板4030包括一用於每一閥之閥控制入口(未圖示)以將壓力或真空施加至相應隔膜。The dispensing block 4005 directs fluid from the inlet to the inlet valve (eg, at least partially defined by the valve plate 4030), from the inlet valve to the pump chamber, from the pump chamber to the drain/purge valve, and from The pump chamber is directed to the outlet 4020. A pump cover 4225 protects the pump motor from damage, while a piston housing 4027 can provide protection to the piston, and in accordance with an embodiment of the present invention, the piston housing 4027 can be formed from polyethylene or other polymers. Valve plate 4030 is a valve housing that is configured to direct fluid flow to various components of pump 4000 (eg, inlet valves and purge/discharge valves). The valve plate 4030 and corresponding valves can be formed in a manner similar to that described above in connection with the valve plate 230. According to an embodiment, each of the inlet valve and the purge/discharge valve is at least partially integrated into the valve plate 4030 and is a diaphragm valve that is opened or closed for a viewing pressure or vacuum applied to the respective diaphragm. In other embodiments, some of the valves may be external to the dispensing block 4005 or disposed in an additional valve plate. According to one embodiment, a PTFE sheet is sandwiched between the valve plate 4030 and the dispensing block 4005 to form a diaphragm for the various valves. Valve plate 4030 includes a valve control inlet (not shown) for each valve to apply pressure or vacuum to the respective diaphragm.

如同多級泵100一樣,泵4000可包括若干特徵以防止流體滴液進入多級泵100之容納電子器件的區域。"防滴"特徵可包括突出唇緣、傾斜特徵、組件之間的密封、金屬/聚合物介面處之偏移及上文所述之其他特徵以使電子器件與滴液隔離。可類似於上文所述之方式來組態電子器件及歧管以減少熱對泵腔室中之流體的效應。因此,在多級泵中用以減少形狀因數及熱效應且防止流體進入電子器件外殼之類似特徵可用於單級泵中。As with multi-stage pump 100, pump 4000 can include several features to prevent fluid dripping into the area of the multi-stage pump 100 that houses the electronics. "Drip-proof" features may include protruding lips, sloped features, seals between components, offsets at the metal/polymer interface, and other features described above to isolate the electronics from the drops. The electronics and manifold can be configured in a manner similar to that described above to reduce the effect of heat on the fluid in the pump chamber. Thus, similar features used in multi-stage pumps to reduce form factor and thermal effects and prevent fluid from entering the electronics housing can be used in single stage pumps.

另外,上文所述之許多控制方法亦可結合泵4000而用以達成大體上滿意之施配。舉例而言,本發明之實施例可用於控制泵4000之閥以確保根據經組態以大體上最小化關閉通過泵裝置之流體流徑(例如,至泵裝置之外部的區域)之時間的閥序列來運作泵裝置之閥系統。此外,在某些實施例中,當泵4000運作時,將在閥狀態改變之間利用足夠量之時間,以確保在起始另一改變之前完全打開或關閉一特定閥。舉例而言,可將泵4000之馬達的移動延遲一足夠量之時間以確保在填充段之前完全打開泵4000之入口閥。In addition, many of the control methods described above can also be combined with pump 4000 to achieve a substantially satisfactory dispensing. For example, embodiments of the present invention can be used to control a valve of pump 4000 to ensure a valve that is configured to substantially minimize the time of fluid flow through the pump device (eg, to an area external to the pump device) The sequence operates the valve system of the pump unit. Moreover, in certain embodiments, when pump 4000 is operating, a sufficient amount of time will be utilized between valve state changes to ensure that a particular valve is fully opened or closed prior to initiating another change. For example, the movement of the motor of pump 4000 can be delayed for a sufficient amount of time to ensure that the inlet valve of pump 4000 is fully opened prior to the filling section.

類似地,用於補償或解決可發生於泵裝置之腔室中之壓力浮動之系統及方法的實施例可以大體上相等之功效來應用於泵4000。可基於在施配腔室中所感應之壓力來控制施配馬達以在施配之前大體上維持施配腔室中之基線壓力,可利用一控制迴路,使得重複地判定施配腔室中之壓力是否不同於所要壓力(例如,高於或低於),且若如此,則調節泵構件之移動以大體上維持施配腔室中之所要壓力。Similarly, embodiments of systems and methods for compensating or resolving pressure fluctuations that may occur in a chamber of a pump device may be applied to pump 4000 with substantially equal efficiency. The dispensing motor can be controlled based on the pressure induced in the dispensing chamber to substantially maintain the baseline pressure in the dispensing chamber prior to dispensing, and a control loop can be utilized to repeatedly determine the dispensing chamber Whether the pressure is different from the desired pressure (eg, above or below), and if so, adjusts the movement of the pump member to substantially maintain the desired pressure in the dispensing chamber.

雖然泵4000之腔室中之壓力的調節實際上可在任何時間發生,但在起始施配段之前可尤為有用的。更明確地說,當泵4000最初進入就緒段時,施配腔室185中之壓力可處於一基線壓力,該基線壓力近似為隨後之施配段所要之壓力(例如,根據校正或先前施配而判定之施配壓力)或其之某一部分。此所要之施配壓力可用於達成具有一組所要特性之施配,諸如所要流率、量,等等。藉由在出口閥打開之前的任何時候使施配腔室185中之流體達到此所要之基線壓力,可在施配段之前解決泵4000之組件的順應性及變化且可達成滿意的施配。While the adjustment of the pressure in the chamber of pump 4000 can actually occur at any time, it can be particularly useful prior to the initial dispensing section. More specifically, when the pump 4000 initially enters the ready section, the pressure in the dispensing chamber 185 can be at a baseline pressure that is approximately the desired pressure for the subsequent dispensing section (eg, based on calibration or prior dispensing). And determine the pressure of the application) or a part of it. This desired dispensing pressure can be used to achieve a dispensing with a desired set of characteristics, such as desired flow rate, amount, and the like. By bringing the fluid in the dispensing chamber 185 to the desired baseline pressure at any time prior to the opening of the outlet valve, the compliance and variation of the components of the pump 4000 can be resolved prior to the dispensing section and satisfactory dispensing can be achieved.

然而,由於可在進入就緒段與施配段之起始之間存在某一延遲,所以泵4000之腔室內的壓力可在就緒段期間基於各種因素而改變。為了對抗此壓力浮動,可利用本發明之實施例,使得在泵4000之腔室中大體上維持所要之基線壓力,且在隨後之施配段中達成滿意的施配。However, since there may be some delay between the entry of the ready section and the beginning of the dispensing section, the pressure within the chamber of the pump 4000 may vary based on various factors during the ready section. To counter this pressure fluctuation, embodiments of the present invention may be utilized such that the desired baseline pressure is substantially maintained in the chamber of pump 4000 and a satisfactory dispensing is achieved in the subsequent dispensing section.

除了在單級泵中控制壓力浮動以外,亦可使用本發明之實施例來補償由在泵4000之內部之各種機構或組件或結合泵4000而使用之設備的致動所導致之在施配腔室中的壓力波動。In addition to controlling pressure fluctuations in a single stage pump, embodiments of the present invention may also be used to compensate for the dispensing chamber caused by actuation of various mechanisms or components within the pump 4000 or equipment used in conjunction with the pump 4000. Pressure fluctuations in the room.

本發明之一實施例可在施配段(或任何其他段)開始之前改正由淨化或排放閥之關閉所導致之在泵之腔室中的壓力變化。藉由使泵4000之馬達反轉以使得在關閉淨化或入口閥時泵4000之腔室之容積大體上增加此閥之滯留容積,可類似於上文關於多級泵100之描述來達成此補償。One embodiment of the present invention may correct for changes in pressure in the chamber of the pump caused by the closing of the purge or discharge valve prior to the start of the dispensing section (or any other section). This compensation can be achieved similarly to the description of multistage pump 100 above by reversing the motor of pump 4000 such that the volume of the chamber of pump 4000 substantially increases the retention volume of the valve when the purge or inlet valve is closed. .

因此,本發明之實施例提供一具有平緩流體處理特性之泵裝置。藉由對泵裝置內之閥之打開及關閉及/或馬達之啟動排定序列,可避免或減輕潛在地損害壓力尖峰。本發明之實施例亦可使用其他泵控制機構及閥時序來幫助減小壓力對處理流體之有害效應。Accordingly, embodiments of the present invention provide a pump device having a gentle fluid handling characteristic. Potentially damaging the pressure spikes can be avoided or mitigated by sequencing the opening and closing of the valves within the pumping device and/or the activation of the motor. Embodiments of the invention may also use other pump control mechanisms and valve timing to help reduce the deleterious effects of pressure on the treatment fluid.

在前述之本說明中,已參考特定實施例而描述了本發明。然而,一般技術者應瞭解,在不脫離如以下申請專利範圍中所陳述之本發明之範疇的情況下,可進行各種修改及改變。因此,應在說明性意義而非限制性意義上來考慮本說明書及諸圖,且所有此等修改意欲包括於本發明之範疇內。In the foregoing specification, the invention has been described with reference to the specific embodiments. However, it will be apparent to those skilled in the art that various modifications and changes can be made without departing from the scope of the invention as set forth in the appended claims. The specification and drawings are to be considered in a

上文中已關於特定實施例而描述了益處、其他優勢及問題解決方法。然而,不應將該等益處、優勢、問題解決方法及可使任何益處、優勢或解決方法出現或變得更明顯的任何組件解釋為申請專利範圍中之任何項或所有項之關鍵、所需或本質的特徵或組件。Benefits, other advantages, and problem solving methods have been described above with regard to specific embodiments. However, these benefits, advantages, solutions to problems, and any components that may cause or become more apparent to any benefit, advantage, or solution should not be construed as critical or required for any or all of the scope of the patent application. Or essential features or components.

10...泵系統10. . . Pump system

15...流體源15. . . Fluid source

20...泵控制器20. . . Pump controller

25...晶圓25. . . Wafer

27...電腦可讀媒體27. . . Computer readable medium

30...控制指令30. . . Control instruction

35...處理器35. . . processor

40...通信鏈路40. . . Communication link

45...通信鏈路45. . . Communication link

100...多級泵100. . . Multistage pump

105...饋入級部分105. . . Feeding level

110...獨立施配級部分110. . . Independent allocation level

112...壓力感應器112. . . Pressure sensor

120...過濾器120. . . filter

125...入口閥125. . . Inlet valve

130...隔離閥130. . . Isolation valve

135...阻障閥135. . . Barrier valve

140...淨化閥140. . . Purification valve

145...排放閥145. . . Drain valve

147...出口閥147. . . Outlet valve

150...饋入泵150. . . Feed pump

155...饋入腔室155. . . Feed into the chamber

160...饋入級隔膜160. . . Feed-in diaphragm

165...活塞165. . . piston

170...導螺桿170. . . Lead screw

175...步進馬達175. . . Stepper motor

180...施配泵180. . . Dispensing pump

185...施配腔室185. . . Dispensing chamber

190...施配級隔膜190. . . Application level diaphragm

192...活塞192. . . piston

195...導螺桿195. . . Lead screw

200...施配馬達200. . . Distribution motor

205...施配區塊205. . . Distribution block

210...入口210. . . Entrance

215...排放出口215. . . Emission outlet

220...施配出口220. . . Distribution exit

225...泵蓋225. . . Pump cover

227...活塞外殼227. . . Piston housing

230...閥板230. . . Valve plate

235...入口235. . . Entrance

240...入口240. . . Entrance

245...入口245. . . Entrance

250...入口250. . . Entrance

255...入口255. . . Entrance

260...閥控制供應線260. . . Valve control supply line

263...頂蓋263. . . Top cover

265...閥控制氣體供應入口265. . . Valve control gas supply inlet

270...真空入口270. . . Vacuum inlet

271...背板271. . . Backplane

272...凸緣/唇緣272. . . Flange/lip

273...傾斜特徵273. . . Tilting feature

274...托架274. . . bracket

280...流道280. . . Runner

285...流道285. . . Runner

290...流道290. . . Runner

295...流道295. . . Runner

300...流道300. . . Runner

302...歧管302. . . Manifold

305...流道305. . . Runner

397...PCB板397. . . PCB board

440...點440. . . point

445...點445. . . point

450...點450. . . point

455...點455. . . point

460...點460. . . point

1500...點1500. . . point

1502...點1502. . . point

1504...點1504. . . point

1506...點1506. . . point

1508...點1508. . . point

1510...點1510. . . point

1512...點1512. . . point

1520...點1520. . . point

1522...點1522. . . point

1524...點1524. . . point

1526...點1526. . . point

1528...點1528. . . point

1530...點1530. . . point

1532...點1532. . . point

1534...點1534. . . point

1536...點1536. . . point

1538...點1538. . . point

2010...時間2010. . . time

2020...時間2020. . . time

2022...時間2022. . . time

2030...時間2030. . . time

2040...時間2040. . . time

2050...時間2050. . . time

2060...時間2060. . . time

2070...時間2070. . . time

2080...時間2080. . . time

2090...時間2090. . . time

2100...時間2100. . . time

2110...時間2110. . . time

2120...時間2120. . . time

2130...時間2130. . . time

2140...時間2140. . . time

2142...時間2142. . . time

2150...時間2150. . . time

2160...時間2160. . . time

2170...時間2170. . . time

2180...時間2180. . . time

2190...時間2190. . . time

2200...時間2200. . . time

2210...時間2210. . . time

2212...時間2212. . . time

2220...時間2220. . . time

2230...時間2230. . . time

3010...時間3010. . . time

4000...泵4000. . . Pump

4005...施配泵區塊4005. . . Dispensing pump block

4010...點/入口4010. . . Point/entry

4015...淨化/排放出口4015. . . Purification/discharge exit

4020...點/施配出口4020. . . Point/distribution exit

4027...活塞外殼4027. . . Piston housing

4030...閥板4030. . . Valve plate

4040...基線壓力4040. . . Baseline pressure

4050...點4050. . . point

4060...點4060. . . point

4070...點4070. . . point

4080...點4080. . . point

4090...點4090. . . point

4100...點4100. . . point

4110...點4110. . . point

圖1為泵系統之一實施例的圖示;圖2為根據本發明之一實施例之多級泵的圖示;圖3A、3B、4A、4C及4D為多級泵之各種實施例的圖示;圖4B為施配區塊之一實施例的圖示;圖5為本發明之一實施例之閥及馬達時序的圖示;圖6為與泵一同使用之致動序列之實施例的實例壓力輪廓;圖7為與泵一同使用之致動序列之實施例之一部分的實例壓力輪廓;圖8A及8B為泵之運作之各種段的閥及馬達時序之一實施例的圖示;圖9A及9B為泵之運作之各種段的閥及馬達時序之一實施例的圖示;圖10A及10B為與泵一同使用之致動序列之實施例之一部分的實例壓力輪廓;及圖11為泵系統之一實施例的圖示。1 is a diagram of one embodiment of a pump system; FIG. 2 is an illustration of a multi-stage pump in accordance with an embodiment of the present invention; FIGS. 3A, 3B, 4A, 4C, and 4D are various embodiments of a multi-stage pump Figure 4B is an illustration of one embodiment of a dispensing block; Figure 5 is an illustration of a valve and motor timing for an embodiment of the present invention; and Figure 6 is an embodiment of an actuation sequence for use with a pump Example pressure profile; Figure 7 is an example pressure profile of a portion of an embodiment of an actuation sequence for use with a pump; Figures 8A and 8B are illustrations of one embodiment of valve and motor timing for various stages of operation of the pump; 9A and 9B are diagrams showing one embodiment of valve and motor timing for various stages of operation of the pump; FIGS. 10A and 10B are example pressure profiles of a portion of an embodiment of an actuation sequence for use with a pump; and FIG. Is an illustration of one embodiment of a pump system.

2010...時間2010. . . time

2020...時間2020. . . time

2022...時間2022. . . time

2030...時間2030. . . time

2050...時間2050. . . time

2060...時間2060. . . time

2070...時間2070. . . time

2080...時間2080. . . time

2090...時間2090. . . time

2100...時間2100. . . time

2110...時間2110. . . time

2120...時間2120. . . time

Claims (18)

一種用以改正使用一馬達之壓力變化之方法,其包含:將流體引入至一泵裝置之一施配腔室中;及移動該泵裝置之一泵構件之一隔膜以調整該腔室之容積來補償該施配腔室中之一壓力變化,其中利用一馬達來直接移動該隔膜。 A method for correcting a pressure change using a motor, comprising: introducing a fluid into a dispensing chamber of a pump device; and moving a diaphragm of one of the pump members to adjust a volume of the chamber To compensate for a change in pressure in the dispensing chamber, wherein a motor is used to directly move the diaphragm. 如請求項1之方法,其中該壓力變化為一歸因於一閥之打開或一閥之關閉的壓力減少。 The method of claim 1, wherein the pressure change is a pressure reduction due to opening of a valve or closing of a valve. 如請求項2之方法,其中該壓力增加與該閥之一留置容積近似成比例,及移動該隔膜以將該施配腔室之該容積增加一大體上等於該閥之該留置容積的量。 The method of claim 2, wherein the increase in pressure is approximately proportional to an indwelling volume of the valve, and moving the diaphragm to increase the volume of the dispensing chamber by an amount substantially equal to the indwelling volume of the valve. 如請求項3之方法,其中移動該隔膜以將該施配腔室之該容積增加近似一超越量容積,且接著移動該隔膜以將該施配腔室之該容積減少近似該超越量容積。 The method of claim 3, wherein the diaphragm is moved to increase the volume of the dispensing chamber by approximately an excess volume, and then the diaphragm is moved to reduce the volume of the dispensing chamber to the excess volume. 如請求項3之方法,其中移動該隔膜以增加該施配腔室之該容積,直至在該腔室中達成一所要壓力為止。 The method of claim 3, wherein the diaphragm is moved to increase the volume of the dispensing chamber until a desired pressure is achieved in the chamber. 如請求項3之方法,其中移動該隔膜以增加該施配腔室之該容積,直至在該施配腔室中達成一低於一所要壓力之壓力為止,且接著移動該隔膜以減少該施配腔室之該容積,直至達成近似該所要壓力為止。 The method of claim 3, wherein the diaphragm is moved to increase the volume of the dispensing chamber until a pressure of less than a desired pressure is reached in the dispensing chamber, and then the diaphragm is moved to reduce the dispensing chamber This volume is until an approximate pressure is reached. 一種電腦可讀媒體,其包含可轉譯用於以下動作之指令:將流體引入至一泵裝置之一施配腔室中;及移動該泵裝置之一泵構件之一隔膜以調整該施配腔室 之容積來補償該腔室中之一壓力變化,其中利用一馬達來直接移動該隔膜。 A computer readable medium comprising instructions translatable for introducing a fluid into a dispensing chamber of a pumping device; and moving a diaphragm of one of the pumping members of the pumping device to adjust the dispensing chamber The volume compensates for a change in pressure in the chamber, wherein a motor is used to directly move the diaphragm. 如請求項7之電腦可讀媒體,其中該壓力變化為一歸因於一閥之打開或一閥之關閉的壓力減少。 The computer readable medium of claim 7, wherein the pressure change is a pressure reduction due to opening of a valve or closing of a valve. 如請求項8之電腦可讀媒體,其中該壓力增加與該閥之一留置容積近似成比例且移動該隔膜以將該施配腔室之該容積增加一大體上等於該閥之該留置容積的量。 The computer readable medium of claim 8, wherein the pressure increase is approximately proportional to an indwelling volume of the valve and the diaphragm is moved to increase the volume of the dispensing chamber by a quantity substantially equal to the indwelling volume of the valve . 如請求項9之電腦可讀媒體,其中移動該隔膜以將該施配腔室之該容積增加近似一超越量容積,且接著移動該隔膜以將該施配腔室之該容積減少近似該超越量容積。 The computer readable medium of claim 9, wherein the diaphragm is moved to increase the volume of the dispensing chamber by an excess volume, and then moving the diaphragm to reduce the volume of the dispensing chamber to the excess volume . 如請求項9之電腦可讀媒體,其中移動該隔膜以增加該施配腔室之該容積,直至在該施配腔室中達成一所要壓力為止。 The computer readable medium of claim 9, wherein the diaphragm is moved to increase the volume of the dispensing chamber until a desired pressure is achieved in the dispensing chamber. 如請求項9之電腦可讀媒體,其中移動該隔膜以增加該腔室之該容積,直至在該施配腔室中達成一低於一所要壓力之壓力為止,且接著移動該隔膜以減少該施配腔室之該容積,直至達成近似該所要壓力為止。 The computer readable medium of claim 9, wherein the diaphragm is moved to increase the volume of the chamber until a pressure of less than a desired pressure is reached in the dispensing chamber, and then the diaphragm is moved to reduce the dispensing This volume of the chamber is until an approximate pressure is reached. 一種用以改正使用一馬達之壓力變化之系統,其包含:一泵裝置,其包含一饋入腔室、一可運作以收納用於施配之流體之施配腔室及一在該施配腔室內之泵構件,該泵構件包含一隔膜,該隔膜耦接至一可運作以直接移動該隔膜之馬達;及一控制器,其經組態以調節該泵裝置之該泵構件之移動,以調整該施配腔室之容積來補償該施配腔室中之一 壓力變化。 A system for correcting a pressure change using a motor, comprising: a pump device including a feed chamber, a dispensing chamber operable to receive a fluid for dispensing, and a dispensing chamber An indoor pump member, the pump member including a diaphragm coupled to a motor operable to directly move the diaphragm; and a controller configured to adjust movement of the pump member of the pump device to Adjusting the volume of the dispensing chamber to compensate for one of the dispensing chambers Pressure changes. 如請求項13之系統,其中該壓力變化為一歸因於一閥之打開或一閥之關閉的壓力減少。 The system of claim 13 wherein the pressure change is a decrease in pressure due to opening of a valve or closing of a valve. 如請求項14之系統,其中該壓力增加與該閥之一留置容積近似成比例且調整該施配腔室之該容積包含移動該隔膜以將該施配腔室之該容積增加一大體上等於該閥之該留置容積的量。 The system of claim 14, wherein the increase in pressure is approximately proportional to an indwelling volume of the valve and adjusting the volume of the dispensing chamber comprises moving the diaphragm to increase the volume of the dispensing chamber by substantially equal to the valve The amount of the indwelling volume. 如請求項15之系統,其中調整該施配腔室之該容積包含移動該隔膜以將該施配腔室之該容積增加近似一超越量容積,且接著移動該隔膜以將該施配腔室之該容積減少近似該超越量容積。 The system of claim 15 wherein adjusting the volume of the dispensing chamber comprises moving the diaphragm to increase the volume of the dispensing chamber by approximately an excess volume, and then moving the diaphragm to volume the dispensing chamber Reduce the approximate excess volume. 如請求項15之系統,其中調整該施配腔室之該容積包含移動該隔膜以增加該施配腔室之該容積,直至在該施配腔室中達成一所要壓力為止。 The system of claim 15 wherein adjusting the volume of the dispensing chamber comprises moving the diaphragm to increase the volume of the dispensing chamber until a desired pressure is achieved in the dispensing chamber. 如請求項15之系統,其中調整該施配腔室之該容積包含移動該隔膜以增加該施配腔室之該容積,直至在該施配腔室中達成一低於一所要壓力之壓力為止,且接著移動該隔膜以減少該施配腔室之該容積,直至達成近似該所要壓力為止。 The system of claim 15 wherein adjusting the volume of the dispensing chamber comprises moving the diaphragm to increase the volume of the dispensing chamber until a pressure of less than a desired pressure is reached in the dispensing chamber, and then The diaphragm is moved to reduce the volume of the dispensing chamber until an approximate desired pressure is reached.
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CN101495756B (en) 2012-07-04
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TW200732872A (en) 2007-09-01
WO2007067359A3 (en) 2009-04-23

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