TWI442273B - Touch display device and method for bonding fpc thereof - Google Patents

Touch display device and method for bonding fpc thereof Download PDF

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TWI442273B
TWI442273B TW99102067A TW99102067A TWI442273B TW I442273 B TWI442273 B TW I442273B TW 99102067 A TW99102067 A TW 99102067A TW 99102067 A TW99102067 A TW 99102067A TW I442273 B TWI442273 B TW I442273B
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bonding
circuit board
flexible circuit
display device
touch panel
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TW201126390A (en
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Kai Meng
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Innolux Corp
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觸控顯示裝置的軟性電路板結合方法及觸控顯示裝置 Flexible circuit board bonding method of touch display device and touch display device

本發明涉及一種觸控顯示裝置的軟性電路板結合方法及觸控顯示裝置。 The invention relates to a flexible circuit board bonding method and a touch display device of a touch display device.

隨著平板顯示技術的蓬勃發展及製造成本的日益降低,具有輻射低、厚度小、功耗低等優點的平板顯示裝置越來越受到消費者的青睞,因此被廣泛地應用在電子產品中。為了符合現代人對於更加便利、更加直觀的人機界面的需要,近年來市場上逐漸推出各種各樣具有觸控功能的平板顯示裝置,即觸控顯示裝置。通常,觸控顯示裝置可分為外置式和內嵌式兩種。其中,外置式觸控顯示裝置在傳統的平板顯示裝置基礎上附加一觸控面板;而內置式觸控顯示裝置是直接將觸控面板通過內嵌的方式整合至顯示面板(比如液晶面板)之中。目前的外置式觸控面板種類繁多,包括電阻式、電容式、紅外線式和表面聲波式等多種類型。 With the rapid development of flat panel display technology and the decreasing manufacturing cost, flat panel display devices with low radiation, small thickness and low power consumption are increasingly favored by consumers, and thus are widely used in electronic products. In order to meet the needs of modern people for a more convenient and more intuitive human-machine interface, various flat panel display devices with touch functions, namely touch display devices, have been gradually introduced in the market in recent years. Generally, the touch display device can be divided into an external type and an in-line type. The external touch display device is provided with a touch panel on the basis of the conventional flat display device; and the built-in touch display device directly integrates the touch panel into the display panel (such as the liquid crystal panel) through the embedded method. in. At present, there are many types of external touch panels, including resistive, capacitive, infrared, and surface acoustic wave types.

習知觸控顯示裝置的觸控面板(如電容式觸控面板)通常包括導電層、與導電層電連接的電極或周邊線路及覆蓋該導電層、電極或周邊線路的保護層。為實現觸控面板與外部驅動電路的電連接,需要一軟性電路板一方面與該電極或周邊線路結合(bonding),另一方面電連接至外部驅動電路(如印刷電路板)。 A touch panel (such as a capacitive touch panel) of a conventional touch display device generally includes a conductive layer, an electrode or a peripheral line electrically connected to the conductive layer, and a protective layer covering the conductive layer, the electrode or the peripheral line. In order to realize the electrical connection between the touch panel and the external driving circuit, a flexible circuit board is required to be bonded to the electrode or the peripheral circuit on the one hand, and to an external driving circuit (such as a printed circuit board) on the other hand.

在軟性電路板與觸控面板的結合過程中,首先需要將覆蓋在電極或周邊線路的保護層通過蝕刻製程去除,再將軟性電路板對應該觸控面板的電極或周邊線路的壓合。然而,該保護層通常特性比較穩定,不易蝕刻,比如:當採用二氧化矽作為保護層時,通常需採用氫氟酸蝕刻製程或者光罩製程去除覆蓋電極或周邊線路的二氧化矽,這些製程花費大量人力物力,從而導致習知觸控顯示裝置的軟性 電路板的結合製程複雜、成本較高。 In the process of combining the flexible circuit board and the touch panel, the protective layer covering the electrode or the peripheral circuit is first removed by an etching process, and then the flexible circuit board is pressed against the electrode of the touch panel or the peripheral circuit. However, the protective layer is generally stable in characteristics and difficult to etch. For example, when ruthenium dioxide is used as the protective layer, it is usually necessary to remove the ruthenium dioxide covering the electrode or the peripheral line by a hydrofluoric acid etching process or a mask process. A lot of manpower and material resources are spent, resulting in the softness of the conventional touch display device The combination process of the circuit board is complicated and the cost is high.

有鑑於此,提供一種製程簡單、成本較低觸控顯示裝置的軟性電路板結合方法實為必要。 In view of the above, it is necessary to provide a flexible circuit board bonding method with a simple process and a low cost touch display device.

同時,也有必要提供一種製程簡單、成本較低觸控顯示裝置。 At the same time, it is also necessary to provide a touch display device with a simple process and a low cost.

一種觸控顯示裝置的軟性電路板結合方法,該觸控顯示裝置包括一觸控面板及一軟性電路板,該觸控面板包括導電層、電連接該導電層的接合線路及覆蓋該導電層與接合線路的保護層,該軟性電路板包括一接合端,該軟性電路板的結合方法包括如下步驟:提供一具有多個導電粒子的異方性導電膜;將該軟性電路板的接合端對應該觸控面板的接合線路,並將該異方性導電膜設置於該接合端與接合線路之間;及提供一外力至該軟性電路板的接合端,使得該軟性電路板的接合端通過該異方性導電膜與該觸控面板結合為一體,其中,在該外力的作用下,該異方性導電膜中的導電粒子嵌入該保護層接觸該接合線路。 A touch panel device includes a touch panel and a flexible circuit board. The touch panel includes a conductive layer, a bonding line electrically connecting the conductive layer, and a conductive layer covering the conductive layer. a protective layer of the bonding circuit, the flexible circuit board comprising a bonding end, the bonding method of the flexible circuit board comprising the steps of: providing an anisotropic conductive film having a plurality of conductive particles; corresponding to the bonding end of the flexible circuit board a bonding line of the touch panel, and the anisotropic conductive film is disposed between the bonding end and the bonding line; and an external force is applied to the bonding end of the flexible circuit board, so that the bonding end of the flexible circuit board passes the difference The square conductive film is integrated with the touch panel, and the conductive particles in the anisotropic conductive film are embedded in the protective layer to contact the bonding line under the external force.

一種觸控顯示裝置,其包括一觸控面板、一軟性電路板及一異方性導電膜,該觸控面板包括導電層、電連接該導電層的接合線路及覆蓋該導電層與接合線路的保護層,該軟性電路板包括一接合端,該異方性導電膜包括多個導電粒子,該軟性電路板的接合端通過該異方性導電膜與該觸控面板的接合線路電連接。其中,該異方性導電膜中的導電粒子一方面接觸該接合端,另一方面在外力作用下嵌入該保護層以接觸該接合線路。 A touch display device includes a touch panel, a flexible circuit board, and an anisotropic conductive film. The touch panel includes a conductive layer, a bonding line electrically connecting the conductive layer, and a cover layer covering the conductive layer and the bonding line. The protective layer includes a bonding end. The anisotropic conductive film includes a plurality of conductive particles. The bonding end of the flexible circuit board is electrically connected to the bonding line of the touch panel through the anisotropic conductive film. The conductive particles in the anisotropic conductive film contact the bonding end on the one hand, and the protective layer is embedded under the external force to contact the bonding line.

與習知技術相比較,本發明觸控顯示裝置的軟性電路板結合方法及通過該方法得到的觸控顯示裝置中,由於異方性導電膜中的導電粒子在外力下可以嵌入該保護層接觸 該接合線路,進而實現該軟性電路板的接合端與該觸控面板的接合線路之間的電連接,因此,本發明觸控顯示裝置的軟性電路板結合方法較習知包括蝕刻製程或光罩製程的結合方法簡單且成本較低。 Compared with the prior art, the flexible circuit board bonding method of the touch display device of the present invention and the touch display device obtained by the method can be embedded in the protective layer by the conductive particles in the anisotropic conductive film under an external force. The bonding circuit further realizes an electrical connection between the bonding end of the flexible circuit board and the bonding line of the touch panel. Therefore, the flexible circuit board bonding method of the touch display device of the present invention is conventionally including an etching process or a mask. The combination of processes is simple and low cost.

請參閱圖1,圖1是本發明觸控顯示裝置的立體分解示意圖。該觸控顯示裝置100包括一觸控面板110、一軟性電路板120及一異方性導電膜130。該異方性導電膜130用於將該軟性電路板120與該觸控面板110結合為一體,以實現該軟性電路板120與該觸控面板110的電性連接。 Please refer to FIG. 1. FIG. 1 is a perspective exploded view of the touch display device of the present invention. The touch display device 100 includes a touch panel 110 , a flexible circuit board 120 , and an anisotropic conductive film 130 . The anisotropic conductive film 130 is used to integrate the flexible circuit board 120 and the touch panel 110 to electrically connect the flexible circuit board 120 and the touch panel 110 .

本實施例中,該觸控面板110為一電容式觸控面板,其包括一基底111、一設置於該基底111上的第一導電層112、一設置於該第一導電層112上的絕緣層113、一設置於該絕緣層113上的第二導電層114、一電連接該第二導電層114的接合線路115、及覆蓋該第二導電層114與該接合線路115的保護層116。該接合線路115可以位於該第二導電層114的邊緣區域,其包括設置於該第二導電層114上的多個金屬引腳1151,該多個金屬引腳1151可以作為檢測該第二導電層114上的觸控信號的多個探測電極。該多個金屬引腳1151的材料可以為銀膠、金屬(如:銅)或者金屬合、金(如:銅合金),其中銀膠可以包括膠材及分佈於膠材中的銀粒子或者其他導電粒子。該第二導電層114可以包括多條相互平行的電極線(圖未示),該多條電極線可以與該多個金屬引腳一一電連接。該保護層116的材料主要為二氧化矽。 In this embodiment, the touch panel 110 is a capacitive touch panel including a substrate 111, a first conductive layer 112 disposed on the substrate 111, and an insulating layer disposed on the first conductive layer 112. The layer 113 has a second conductive layer 114 disposed on the insulating layer 113, a bonding line 115 electrically connected to the second conductive layer 114, and a protective layer 116 covering the second conductive layer 114 and the bonding line 115. The bonding line 115 may be located at an edge region of the second conductive layer 114, and includes a plurality of metal pins 1151 disposed on the second conductive layer 114. The plurality of metal pins 1151 may serve as the second conductive layer. A plurality of detecting electrodes of the touch signal on 114. The material of the plurality of metal pins 1151 may be silver glue, metal (such as: copper) or metal alloy, gold (such as: copper alloy), wherein the silver glue may include a glue material and silver particles distributed in the glue material or other Conductive particles. The second conductive layer 114 may include a plurality of mutually parallel electrode lines (not shown), and the plurality of electrode lines may be electrically connected to the plurality of metal pins one by one. The material of the protective layer 116 is mainly cerium oxide.

該軟性電路板120包括一對應該接合線路115的接合端121。該接合端121包括多個金屬引腳1211,該金屬引腳1211也可以稱為金手指。該接合端121的多個金屬引腳1211分別與該接合線路115的多個金屬引腳1151(即探測電極)一一對應。該異方性導電膜130分別對應該接合線 路115及該接合端121。 The flexible circuit board 120 includes a pair of mating ends 121 that should engage the lines 115. The joint end 121 includes a plurality of metal pins 1211, which may also be referred to as gold fingers. The plurality of metal pins 1211 of the bonding end 121 respectively correspond to the plurality of metal pins 1151 (ie, the detecting electrodes) of the bonding line 115. The anisotropic conductive film 130 respectively corresponds to the bonding wire The road 115 and the joint end 121.

請一併參閱圖2及圖3,圖2是圖1所示觸控顯示裝置的各元件結合後的示意圖,圖3是圖2沿線II-II的剖面示意圖。該異方性導電膜130包括多個導電粒子131,優選地,該導電粒子131為不規則形狀的硬質的導電粒子,比如鎳顆粒、碳顆粒。該硬質的導電粒子可以定義為:在外力作用下能夠嵌入或穿過該保護層116的導電粒子。該軟性電路板120的接合端121對應該觸控面板110的接合線路115,且該軟性電路板120通過該異方性導電膜130與該觸控面板110結合為一體。具體地,在該外力的作用下,該異方性導電膜130中的導電粒子131一方面嵌入該保護層116接觸該接合線路115的金屬引腳1151,另一方面接觸該接合端121的金屬引腳1211,使得該接合線路115的金屬引腳1151與該接合端121的金屬引腳1211一一對應電連接。 2 and FIG. 3, FIG. 2 is a schematic view of the components of the touch display device of FIG. 1 combined, and FIG. 3 is a cross-sectional view of FIG. 2 along line II-II. The anisotropic conductive film 130 includes a plurality of conductive particles 131. Preferably, the conductive particles 131 are irregularly shaped hard conductive particles such as nickel particles or carbon particles. The hard conductive particles may be defined as conductive particles capable of being embedded or passed through the protective layer 116 under an external force. The bonding end 121 of the flexible circuit board 120 corresponds to the bonding line 115 of the touch panel 110 , and the flexible circuit board 120 is integrated with the touch panel 110 through the anisotropic conductive film 130 . Specifically, under the action of the external force, the conductive particles 131 in the anisotropic conductive film 130 are embedded on the one hand, the protective layer 116 contacts the metal pin 1151 of the bonding line 115, and on the other hand, the metal contacting the bonding end 121. The pin 1211 is such that the metal pin 1151 of the bonding line 115 is electrically connected to the metal pin 1211 of the bonding terminal 121 in one-to-one correspondence.

請參閱圖4、圖5及圖6,圖4、圖5及圖6是圖3所示觸控顯示裝置100的軟性電路板120結合方法的示意圖。該觸控顯示裝置100的軟性電路板120結合方法主要包括以下步驟: Please refer to FIG. 4 , FIG. 5 and FIG. 6 . FIG. 4 , FIG. 5 and FIG. 6 are schematic diagrams showing a method for combining the flexible circuit board 120 of the touch display device 100 illustrated in FIG. 3 . The flexible circuit board 120 bonding method of the touch display device 100 mainly includes the following steps:

步驟一:提供一軟性電路板、一異方性導電膜及一觸控面板。 Step 1: provide a flexible circuit board, an anisotropic conductive film, and a touch panel.

請參閱圖4,具體而言,該軟性電路板120包括一具有多個金屬引腳1211的接合端121。該觸控面板110為電容式觸控面板,其包括一基底111、一設置於該基底111上的第一導電層112、一設置於該第一導電層112上的絕緣層113、一設置於該絕緣層113上的第二導電層114、一電連接該第二導電層114的接合線路115、及覆蓋該第二導電層114與該接合線路115的保護層116。該接合線路115位於該第二導電層114的邊緣區域,其包括設置於該第二導電層114上的多個金屬引腳1154,該多個金屬引腳1151 可以作為檢測該第二導電層114上的觸控信號的探測電極。該多個金屬引腳1151的材料可以為銀膠、金屬(如:銅)或者金屬合金(如:銅合金),其中銀膠可以包括膠材及分佈於膠材中的銀粒子或者其他導電粒子。該接合線路115的多個金屬引腳1151可以在該觸控面板110形成該第二導電層114之後,通過銀漿印刷製程直接形成在該第二導電層114表面而與該第二導電層114電連接。該保護層116完全覆蓋該接合線路115的多個金屬引腳1151及該第二導電層114,以保護該接合線路115及該第二導電層114不被腐蝕。該保護層116的材料主要為二氧化矽,該保護層的厚度範圍可以為30nm-100nm,優選為50nm。 Referring to FIG. 4, in particular, the flexible circuit board 120 includes an engagement end 121 having a plurality of metal pins 1211. The touch panel 110 is a capacitive touch panel, and includes a substrate 111, a first conductive layer 112 disposed on the substrate 111, and an insulating layer 113 disposed on the first conductive layer 112. A second conductive layer 114 on the insulating layer 113, a bonding line 115 electrically connected to the second conductive layer 114, and a protective layer 116 covering the second conductive layer 114 and the bonding line 115. The bonding line 115 is located at an edge region of the second conductive layer 114, and includes a plurality of metal pins 1154 disposed on the second conductive layer 114. The plurality of metal pins 1151 It can be used as a detecting electrode for detecting a touch signal on the second conductive layer 114. The material of the plurality of metal pins 1151 may be silver glue, metal (such as copper) or metal alloy (such as copper alloy), wherein the silver glue may include a glue material and silver particles or other conductive particles distributed in the glue material. . The plurality of metal pins 1151 of the bonding line 115 may be directly formed on the surface of the second conductive layer 114 and the second conductive layer 114 by a silver paste printing process after the touch panel 110 forms the second conductive layer 114. Electrical connection. The protective layer 116 completely covers the plurality of metal pins 1151 and the second conductive layer 114 of the bonding line 115 to protect the bonding line 115 and the second conductive layer 114 from corrosion. The material of the protective layer 116 is mainly cerium oxide, and the protective layer may have a thickness ranging from 30 nm to 100 nm, preferably 50 nm.

該異方性導電膜130包括絕緣基質及散佈於該絕緣基質中的導電粒子131。該導電粒子131為硬質的導電粒子,其硬度可以大於該金屬引腳1151的硬度。該導電粒子131可以為鎳顆粒、碳顆粒或金屬合金顆粒。優選地,該導電粒子131為不規則形狀,包括多個尖端。該導電粒子131的直徑範圍可以為10um-50um,優選區間為10um-30um,其中,該導電粒子131的直徑是指該導電粒子131上任意兩點間距離的最大值。該導電粒子131的直徑大於該保護層116的厚度。 The anisotropic conductive film 130 includes an insulating substrate and conductive particles 131 dispersed in the insulating substrate. The conductive particles 131 are hard conductive particles, and the hardness thereof may be greater than the hardness of the metal pin 1151. The conductive particles 131 may be nickel particles, carbon particles or metal alloy particles. Preferably, the conductive particles 131 are irregular in shape and include a plurality of tips. The diameter of the conductive particles 131 may range from 10 um to 50 um, and preferably from 10 um to 30 um. The diameter of the conductive particles 131 refers to the maximum distance between any two points on the conductive particles 131. The diameter of the conductive particles 131 is larger than the thickness of the protective layer 116.

步驟二:將該軟性電路板的接合端對應該觸控面板的接合線路,並將該異方性導電膜設置於該接合端與接合線路之間。該步驟具體包括:請參閱圖5,將該觸控面板110設置於一基臺上,且使具有該保護層116的一側位於上方。將該異方性導電膜130放置在該保護層116的對應該接合線路115的區域。接著,將該軟性電路板120的接合端121對應該接合線路115並放置在該異方性導電膜130上,且可以保持該軟性電路板120與該觸控面板110板面基本平行。 Step 2: The bonding end of the flexible circuit board corresponds to the bonding line of the touch panel, and the anisotropic conductive film is disposed between the bonding end and the bonding line. The step specifically includes: referring to FIG. 5, the touch panel 110 is disposed on a base, and the side having the protective layer 116 is located above. The anisotropic conductive film 130 is placed in a region of the protective layer 116 corresponding to the bonding line 115. Then, the bonding end 121 of the flexible circuit board 120 is corresponding to the bonding line 115 and placed on the anisotropic conductive film 130, and the flexible circuit board 120 can be kept substantially parallel to the surface of the touch panel 110.

步驟三:提供一外力,使該軟性電路板的接合端通過 該異方性導電膜與該觸控面板結合為一體,同時,在該外力的作用下,該異方性導電膜中的導電粒子嵌入該保護層接觸該接合線路。 Step 3: Provide an external force to pass the joint end of the flexible circuit board The anisotropic conductive film is integrated with the touch panel, and at the same time, the conductive particles in the anisotropic conductive film are embedded in the protective layer to contact the bonding line under the external force.

具體而言,該步驟中,可以在該軟性電路板120遠離該異方性導電膜130一側提供一熱壓頭,沿垂直該觸控面板110的方向向該軟性電路板120的接合端121施加一外力,進而該軟性電路板120、該異方性導電膜130及該觸控面板110結合為一體。具體地,在該外力的作用下,該異方性導電膜130中的導電粒子131一方面嵌入該保護層116接觸該接合線路115的金屬引腳1151,另一方面接觸該接合端121的金屬引腳1211,使得該接合線路115的金屬引腳1151與該接合端121的金屬引腳1211通過該導電粒子131一一電連接。 Specifically, in this step, a thermal head can be provided on the side of the flexible circuit board 120 away from the anisotropic conductive film 130, and the bonding end 121 of the flexible circuit board 120 is perpendicular to the direction of the touch panel 110. An external force is applied, and the flexible circuit board 120, the anisotropic conductive film 130, and the touch panel 110 are integrated. Specifically, under the action of the external force, the conductive particles 131 in the anisotropic conductive film 130 are embedded on the one hand, the protective layer 116 contacts the metal pin 1151 of the bonding line 115, and on the other hand, the metal contacting the bonding end 121. The pin 1211 is such that the metal pin 1151 of the bonding line 115 and the metal pin 1211 of the bonding end 121 are electrically connected one by one through the conductive particles 131.

步驟四:移除外力,完成該軟性電路板與觸控面板的結合。 Step 4: Remove the external force and complete the combination of the flexible circuit board and the touch panel.

請參閱圖6,移除熱壓頭,冷卻後,完成該軟性電路板120與觸控面板110的電連接。 Referring to FIG. 6 , the thermal head is removed, and after cooling, the electrical connection between the flexible circuit board 120 and the touch panel 110 is completed.

至此,該軟性電路板120通過該異方性導電膜130與該觸控面板110實現電連接,該觸控顯示裝置100的軟性電路板120結合方法結束。 The flexible circuit board 120 is electrically connected to the touch panel 110 through the anisotropic conductive film 130. The flexible circuit board 120 bonding method of the touch display device 100 ends.

與習知技術相比較,本發明觸控顯示裝置100的軟性電路板120結合方法及通過該方法得到的觸控顯示裝置100中,由於異方性導電膜130中的硬質的導電粒子131在外力下可以嵌入該保護層116接觸該接合線路115,進而實現該軟性電路板120的接合端121與該觸控面板110的接合線路115之間的電連接,因此,本發明觸控顯示裝置100的軟性電路板120結合方法較習知包括蝕刻製程或光罩製程的結合方法簡單且成本較低。 Compared with the prior art, the flexible circuit board 120 of the touch display device 100 of the present invention and the touch display device 100 obtained by the method have an external force due to the hard conductive particles 131 in the anisotropic conductive film 130. The protective layer 116 can be embedded in contact with the bonding line 115 to realize electrical connection between the bonding end 121 of the flexible circuit board 120 and the bonding line 115 of the touch panel 110. Therefore, the touch display device 100 of the present invention The flexible circuit board 120 bonding method is simpler than the conventional method including the etching process or the mask process, and the cost is low.

另外,當該導電粒子131的直徑遠大於該保護層116的厚度時,該導電粒子131可以輕易穿過該保護層116, 進而該軟性電路板120與該觸控面板110的結合製程將更加簡單、容易。 In addition, when the diameter of the conductive particles 131 is much larger than the thickness of the protective layer 116, the conductive particles 131 can easily pass through the protective layer 116. Furthermore, the bonding process of the flexible circuit board 120 and the touch panel 110 will be simpler and easier.

特別地,當該導電粒子131的硬度大於該金屬引腳1151的硬度時,該金屬引腳1151在壓合過程中不易發生形變,從而該接合端121的金屬引腳1211與該接合線路115的金屬引腳1151的電連接特性更好,即該軟性電路板120與該觸控面板110的結合特性更好。 In particular, when the hardness of the conductive particles 131 is greater than the hardness of the metal pin 1151, the metal pin 1151 is less susceptible to deformation during the pressing process, so that the metal pin 1211 of the bonding end 121 and the bonding line 115 are The electrical connection characteristic of the metal pin 1151 is better, that is, the bonding property of the flexible circuit board 120 and the touch panel 110 is better.

此外,需要說明的是,本發明觸控顯示裝置100中,實施例中所示結構的觸控面板110的第一導電層112通常也可以電連接一包括多個金屬引腳的另一接合線路(圖未示),該另一接合線路用於與外部電路(如軟性電路板)結合,且也由保護層覆蓋。所屬領域的一般技術人員應當理解,與該第一導電層112電連接的另一接合線路也可以通過“上述該軟性電路板120與該接合線路115的電連接方法”與該外部電路電連接,此處不再贅述。 In addition, in the touch display device 100 of the present invention, the first conductive layer 112 of the touch panel 110 of the structure shown in the embodiment can also be electrically connected to another bonding line including a plurality of metal pins. (not shown), the other bond line is used in combination with an external circuit such as a flexible circuit board and is also covered by a protective layer. One of ordinary skill in the art will appreciate that another bond line electrically coupled to the first conductive layer 112 can also be electrically coupled to the external circuit by "the electrical connection method of the flexible circuit board 120 and the bond line 115 described above". I will not repeat them here.

綜上所述,本發明確已符合發明專利之要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,本發明之範圍並不以上述實施例為限,該舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. All should be covered by the following patent application.

110‧‧‧觸控面板 110‧‧‧Touch panel

120‧‧‧軟性電路板 120‧‧‧Soft circuit board

130‧‧‧異方性導電膜 130‧‧‧ anisotropic conductive film

111‧‧‧基底 111‧‧‧Base

112‧‧‧第一導電層 112‧‧‧First conductive layer

113‧‧‧絕緣層 113‧‧‧Insulation

114‧‧‧第二導電層 114‧‧‧Second conductive layer

115‧‧‧接合線路 115‧‧‧Connected lines

116‧‧‧保護層 116‧‧‧Protective layer

1151、1211‧‧‧金屬引腳 1151, 1211‧‧‧ metal pins

121‧‧‧接合端 121‧‧‧ joint end

131‧‧‧導電粒子 131‧‧‧ conductive particles

圖1是本發明觸控顯示裝置的立體分解示意圖。 1 is a perspective exploded view of a touch display device of the present invention.

圖2是圖1所示觸控顯示裝置的各元件結合後的示意圖。 FIG. 2 is a schematic view showing the combination of the components of the touch display device shown in FIG. 1. FIG.

圖3是圖2沿線II-II的剖面示意圖。 Figure 3 is a cross-sectional view of Figure 2 taken along line II-II.

圖4至圖6是圖3所示觸控顯示裝置的軟性電路板結合方法的各步驟示意圖。 4 to FIG. 6 are schematic diagrams showing steps of a method for bonding a flexible circuit board of the touch display device shown in FIG.

110‧‧‧觸控面板 110‧‧‧Touch panel

120‧‧‧軟性電路板 120‧‧‧Soft circuit board

130‧‧‧異方性導電膜 130‧‧‧ anisotropic conductive film

111‧‧‧基底 111‧‧‧Base

112‧‧‧第一導電層 112‧‧‧First conductive layer

113‧‧‧絕緣層 113‧‧‧Insulation

114‧‧‧第二導電層 114‧‧‧Second conductive layer

116‧‧‧保護層 116‧‧‧Protective layer

1151、1211‧‧‧金屬引腳 1151, 1211‧‧‧ metal pins

121‧‧‧接合端 121‧‧‧ joint end

131‧‧‧導電粒子 131‧‧‧ conductive particles

Claims (10)

一種觸控顯示裝置的軟性電路板結合方法,該觸控顯示裝置包括一觸控面板及一軟性電路板,該觸控面板包括導電層、電連接該導電層的接合線路及覆蓋該導電層與接合線路的保護層,該軟性電路板包括一接合端,該軟性電路板的結合方法包括如下步驟:提供一具有多個導電粒子的異方性導電膜;將該軟性電路板的接合端對應該觸控面板的接合線路,並將該異方性導電膜設置於該接合端與接合線路之間;及提供一外力使該軟性電路板的接合端通過該異方性導電膜與該觸控面板結合為一體,其中,在該外力的作用下,該異方性導電膜中的導電粒子之一端刺穿該保護層接觸該接合線路,該導電粒子另一端則直接接觸該接合端。 A touch panel device includes a touch panel and a flexible circuit board. The touch panel includes a conductive layer, a bonding line electrically connecting the conductive layer, and a conductive layer covering the conductive layer. a protective layer of the bonding circuit, the flexible circuit board comprising a bonding end, the bonding method of the flexible circuit board comprising the steps of: providing an anisotropic conductive film having a plurality of conductive particles; corresponding to the bonding end of the flexible circuit board a bonding line of the touch panel, and the anisotropic conductive film is disposed between the bonding end and the bonding line; and an external force is provided to pass the bonding end of the flexible circuit board through the anisotropic conductive film and the touch panel The combination is integrated, wherein one end of the conductive particles in the anisotropic conductive film pierces the protective layer to contact the bonding line under the action of the external force, and the other end of the conductive particle directly contacts the bonding end. 如申請專利範圍第1項所述的觸控顯示裝置的軟性電路板結合方法,其中,該導電粒子為鎳顆粒、碳顆粒或金屬合金顆粒。 The flexible circuit board bonding method of the touch display device according to claim 1, wherein the conductive particles are nickel particles, carbon particles or metal alloy particles. 如申請專利範圍第1項所述的觸控顯示裝置的軟性電路板結合方法,其中,該導電粒子為不規則形狀。 The flexible circuit board bonding method of the touch display device according to claim 1, wherein the conductive particles have an irregular shape. 如申請專利範圍第1項所述的觸控顯示裝置的軟性電路板結合方法,其中,該導電粒子的直徑範圍為10um-50um。 The flexible circuit board bonding method of the touch display device according to claim 1, wherein the conductive particles have a diameter ranging from 10 um to 50 um. 如申請專利範圍第1項所述的觸控顯示裝置的軟性電路板結合方法,其中,該導電粒子的直徑大於該保護層的厚度。 The flexible circuit board bonding method of the touch display device according to claim 1, wherein the conductive particles have a diameter larger than a thickness of the protective layer. 如申請專利範圍第1項所述的觸控顯示裝置的軟性電路板結合方法,其中,該保護層的厚度範圍為30nm-100nm。 The flexible circuit board bonding method of the touch display device according to claim 1, wherein the protective layer has a thickness ranging from 30 nm to 100 nm. 如申請專利範圍第1項所述的觸控顯示裝置的軟性電路板結合方法,其中,該保護層的材料包括二氧化矽。 The flexible circuit board bonding method of the touch display device according to claim 1, wherein the material of the protective layer comprises cerium oxide. 如申請專利範圍第1項所述的觸控顯示裝置的軟性電路 板結合方法,其中,該接合線路包括多個金屬引腳,該接合端包括多個金屬引腳,在該外力的作用下,該異方性導電膜中的導電粒子嵌入該保護層接觸該接合線路的金屬引腳,同時該異方性導電膜中的導電粒子也接觸該接合端的金屬引腳,使得該接合線路的金屬引腳與該接合端的金屬引腳一一電連接。 The flexible circuit of the touch display device according to claim 1 a board bonding method, wherein the bonding line includes a plurality of metal pins, the bonding end includes a plurality of metal pins, and the conductive particles in the anisotropic conductive film are embedded in the protective layer to contact the bonding under the external force The metal pins of the circuit, and the conductive particles in the anisotropic conductive film also contact the metal pins of the bonding end, so that the metal pins of the bonding wires are electrically connected to the metal pins of the bonding terminals. 如申請專利範圍第1項所述的觸控顯示裝置的軟性電路板結合方法,其中,該導電粒子的硬度大於該接合線路的金屬引腳的硬度。 The flexible circuit board bonding method of the touch display device according to claim 1, wherein the conductive particles have a hardness greater than a hardness of the metal pins of the bonding wires. 一種觸控顯示裝置,其包括一觸控面板、一軟性電路板及一異方性導電膜,該觸控面板包括導電層、電連接該導電層的接合線路及覆蓋該導電層與接合線路的保護層,該軟性電路板包括一接合端,該異方性導電膜包括多個導電粒子,該軟性電路板的接合端通過該異方性導電膜與該觸控面板的接合線路電連接,其中,該異方性導電膜中的導電粒子一方面接觸該接合端,另一方面在外力作用下刺穿該保護層以接觸該接合線路。 A touch display device includes a touch panel, a flexible circuit board, and an anisotropic conductive film. The touch panel includes a conductive layer, a bonding line electrically connecting the conductive layer, and a cover layer covering the conductive layer and the bonding line. a protective layer, the flexible circuit board includes a bonding end, the anisotropic conductive film includes a plurality of conductive particles, and the bonding end of the flexible circuit board is electrically connected to the bonding line of the touch panel through the anisotropic conductive film, wherein The conductive particles in the anisotropic conductive film contact the bonding end on the one hand, and pierce the protective layer under external force to contact the bonding line on the other hand.
TW99102067A 2010-01-26 2010-01-26 Touch display device and method for bonding fpc thereof TWI442273B (en)

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CN103675581B (en) * 2012-09-06 2017-04-19 宸鸿科技(厦门)有限公司 Electrical connection component and detection method thereof
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CN103336601A (en) * 2013-06-14 2013-10-02 业成光电(深圳)有限公司 Touch display device
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CN104461140A (en) * 2014-12-10 2015-03-25 重庆墨希科技有限公司 Production method of bonding area silver paste protection structure
CN104375712A (en) * 2014-12-10 2015-02-25 重庆墨希科技有限公司 Production method of touchscreen binding area sliver paste protective structure
CN104391605A (en) * 2014-12-10 2015-03-04 重庆墨希科技有限公司 Protective structure for silver paste in binding region
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CN104461139A (en) * 2014-12-10 2015-03-25 重庆墨希科技有限公司 Production method of bonding area silver paste protection structure
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