TWI415711B - Polishing pad with floating elements and method of making and using the same - Google Patents

Abstract

The disclosure is directed to polishing pads with floating polishing elements bonded to a support layer, for example by thermal bonding, and to methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pad includes a multiplicity of polishing elements, at least some of which may be porous, each polishing element affixed to a major surface of a support layer so as to restrict lateral movement of the polishing elements with respect to one or more of the other polishing elements, but remaining moveable in an axis substantially normal to the support layer. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer opposite the polishing elements, and optionally, a polishing composition distribution layer. In some embodiments using porous polishing elements, the pores are distributed substantially at a polishing surface of the polishing elements.

Description

Abrasive pad with floating element, and method of making and using same

This invention relates to polishing pads having floating abrasive elements and to methods of making such polishing pads and using such polishing pads in a polishing process (e.g., in a chemical mechanical planarization process).

During fabrication of semiconductor devices and integrated circuits, germanium wafers are processed through a series of deposition and etching steps to form overlying material layers and device structures. One of the chemical polishing techniques known as chemical mechanical planarization (CMP) may be used to remove surface irregularities (such as bumps, unequal elevation regions, trenches, and trenches) remaining after the deposition and etching steps, for purposes A smooth wafer surface is obtained without scratches or pits (referred to as depressions) with a high degree of uniformity across the wafer surface.

In a typical CMP polishing process, a substrate such as a wafer is pressed onto a polishing pad in the presence of a working liquid which is typically one of the abrasive particles in water and/or an etch chemistry. The substrate is moved relative to it. Various CMP polishing pads for use with abrasive slurries are disclosed in, for example, U.S. Patent Nos. 5,257,478, 5,921,855, 6, 126, 532, 6, 899, 598 B2, and 7, 267, 610. Fixed abrasive polishing pads are also known as exemplified in U.S. Patent No. 6,908,366 B2, in which abrasive particles are generally generally secured to the surface of the pad in the form of a precisely shaped abrasive composite extending from the surface of the pad. More recently, in WO/2006057714 a polishing pad has been described having a plurality of abrasive elements extending from a compressible underlayer and secured to the underlying layer by a guide plate. Although a wide variety of polishing pads are known and used, the present technology continues to find new and improved polishing pads for CMP, particularly where larger grain diameters or wafer surfaces requiring higher levels are being used. Flatness and uniformity of polishing in the CMP process.

In one exemplary embodiment, the invention features a polishing pad that includes a plurality of abrasive elements, each of which is bonded to a support layer to limit the abrasive elements relative to the other abrasive elements One or more of the lateral movements, but remaining movable along an axis perpendicular to one of the abrasive surfaces of the abrasive elements. In certain exemplary embodiments, the abrasive elements are thermally bonded to the support layer. In certain exemplary embodiments, at least a portion of the abrasive elements comprise porous abrasive elements, and in additional embodiments, at least one surface of each of the porous abrasive elements comprises a plurality of apertures.

In certain particular embodiments of the porous abrasive element, the apertures can be distributed substantially throughout the porous abrasive element. In other particular embodiments of the porous abrasive element, the holes may be distributed substantially over the abrasive surface of the element. In certain exemplary embodiments, the holes substantially distributed over the abrasive surface of the element comprise a plurality of channels having a cross-sectional shape selected from the group consisting of: cylindrical, triangular, rectangular, trapezoidal, Hemispheres and combinations thereof.

In another exemplary embodiment, the present invention describes a polishing pad comprising: a support layer having a first major side and a second major side opposite the first major side; and a plurality of abrasive elements Attached to the first major side of the support layer, wherein the abrasive elements extend from the first major side of the support layer in a first direction that is substantially perpendicular to the first major side. In certain exemplary embodiments, the abrasive elements are thermally bonded to the support layer. In certain exemplary embodiments, at least a portion of the abrasive elements comprise porous abrasive elements, and in additional embodiments, at least one surface of each of the porous abrasive elements comprises a plurality of apertures.

In certain particular embodiments of the porous abrasive element, the apertures can be distributed substantially throughout the porous abrasive element. In other particular embodiments, the holes may be distributed substantially at the abrasive surface of the elements. In certain particular exemplary embodiments, the holes substantially distributed at the abrasive surface of the element comprise a plurality of channels having a cross-sectional shape selected from the group consisting of: cylindrical, triangular, rectangular, trapezoidal , hemispheres and combinations thereof.

In a further exemplary embodiment, a method of making a polishing pad is provided, the method comprising forming a plurality of porous abrasive elements, and joining the abrasive elements to a support layer. In certain exemplary embodiments, joining the abrasive elements to the support layer includes thermal bonding, actinic radiation bonding, adhesive bonding, and combinations thereof.

In certain exemplary embodiments, the method further includes configuring the plurality of abrasive elements into a pattern prior to joining the abrasive elements to the support layer. In certain exemplary embodiments, configuring the plurality of abrasive elements in a pattern includes disposing the abrasive elements in a template, disposing the abrasive elements on the support layer, and combinations thereof. In certain embodiments, at least a portion of the abrasive elements comprise a porous abrasive element. In certain additional embodiments, at least a portion of the abrasive elements comprise substantially non-porous abrasive elements.

In certain particular exemplary embodiments, the method includes forming a porous abrasive element by injection molding a gas-saturated polymer melt, and injection molding to emit a gas during the reaction to form a polymer reaction. The mixture, injection molding comprises a mixture of one of the polymers dissolved in a supercritical gas, a mixture of one of the incompatible polymers by injection molding in a solvent, and injection molding dispersed in a thermoplastic polymer. Porous thermoset particles and combinations thereof.

In an additional exemplary embodiment, the present invention is directed to a method of using a polishing pad as described above in a polishing process, the method comprising: bonding a surface of a substrate to a plurality including thermally bonding to a support layer One of the polishing elements is in contact with one of the polishing pads, and the polishing pad is moved relative to the substrate to abrade the surface of the substrate. In certain exemplary embodiments, at least a portion of the abrasive elements comprise a porous abrasive element, and in certain embodiments, at least one surface of each porous abrasive element includes a plurality of apertures. In other exemplary implementations, a working fluid can be provided to an interface between the surface of the polishing pad and the surface of the substrate.

An exemplary embodiment of a polishing pad having a porous abrasive element in accordance with the present invention has various features and characteristics that enable it to be used in a variety of abrasive applications. In certain presently preferred embodiments, the polishing pads of the present invention are particularly suitable for use in the fabrication of integrated circuits and chemical mechanical planarization (CMP) of wafers in semiconductor devices. In certain exemplary embodiments, the polishing pads described in this invention may provide some or all of the following advantages.

For example, in certain exemplary implementations, a polishing pad in accordance with the present invention can be used to better retain one of the working fluids used in the CMP process on the abrasive surface of the pad and the surface of the substrate being ground. At the interface between them, thereby improving the efficiency of the working fluid in enhancing the grinding. In other exemplary embodiments, a polishing pad in accordance with the present invention can reduce or eliminate dishing and/or edge corrosion of the wafer surface during grinding.

In a further exemplary embodiment, the use of a polishing pad having one of the porous elements in accordance with the present invention permits the processing of larger diameter wafers while maintaining the desired degree of surface uniformity to achieve high wafer yields, where adjustment of the pad surface is required to maintain Processing more wafers prior to polishing uniformity of the wafer surface or reducing processing time and pad conditioner wear. In some embodiments, a CMP pad having a porous abrasive element can also provide the benefits and advantages of a conventional CMP pad having a surface texture such as a groove, but can be manufactured at a lower cost and more reproducible. In an additional embodiment, joining the abrasive elements to the support layer eliminates the need to secure the elements to the support layer using a guide plate.

Various aspects and advantages of the exemplary embodiments of the invention have been summarized. The above summary is not intended to describe each illustrated embodiment or every embodiment of the present exemplary embodiments. The following figures and embodiments more particularly exemplify certain preferred embodiments using the principles disclosed herein.

In a typical CMP slurry process for wafer polishing, a wafer having a characteristic topography is placed in contact with a polishing pad and a polishing solution containing an abrasive and a polishing chemical. If the polishing pad conforms to the polishing pad, dents and corrosion can occur because the pad grinds the lower region on the wafer at the same rate as the raised regions. If the polishing pad is a rigid polishing pad, the depression and corrosion can be greatly reduced; however, although the rigid polishing pad can advantageously produce good in-grain planarization uniformity, it can also disadvantageously produce poor intra-wafer uniformity. This is due to a rebound effect occurring on the periphery of the wafer. This rebound effect results in poor edge yield and a narrow CMP grinding process window. In addition, it may be difficult to develop a stable polishing process by means of a rigid polishing pad, so that the pads are sensitive to different crystal domes and are completely dependent on the use of a pad conditioner to form a polishing solution and interface with the wafer. One of the best abrasive textures.

The present invention is directed to an improved polishing pad having a plurality of floating abrasive elements bonded to a support layer, in various embodiments, which combines with certain advantageous characteristics of both rigid and rigid polishing pads while eliminating or reducing corresponding pads Some of the disadvantages. By describing the abrasive elements as "floating" abrasive elements bonded to a support layer, Applicants intend that each of the abrasive elements is bonded to a support layer to limit the abrasive elements relative to other abrasives. One or more of the elements move laterally but remain movable along an axis generally perpendicular to one of the abrasive elements.

Various exemplary embodiments of the present invention will now be described with particular reference to the drawings. Various modifications and changes may be made to the exemplary embodiments of the invention without departing from the spirit and scope of the invention. Therefore, it is to be understood that the embodiments of the present invention are not limited to the exemplary embodiments described herein, but are limited by the scope of the claims and their equivalents.

Referring to Figure 1, there is shown an exemplary embodiment of a polishing pad 2 comprising a plurality of abrasive elements 4-4', each of which is bonded to a support layer 10 to limit abrasive elements 4-4' moves laterally relative to one or more of the other abrasive elements 4-4', but remains movable along an axis perpendicular to one of the abrasive surfaces 14 of each of the abrasive elements 4-4'. In the particular embodiment illustrated in FIG. 1, the polishing element 4-4' is shown, for example, by direct thermal bonding to the support layer 10 or to one of the first layers of the support layer 10 by the use of an adhesive. side.

In the particular exemplary embodiment illustrated in Figure 1, the support layer 10 is secured to a compliant layer 16 that is positioned on a side opposite the plurality of abrasive elements 4-4'. Additionally, a selective adhesive layer 12 is shown at an interface between the compliant layer 16 and the support layer 10. The selective adhesive layer 12 can be used to secure the second major side of the support layer 10 to the compliant layer 16. Additionally, a selective pressure sensitive adhesive layer 18 secured to the compliant layer 16 opposite the plurality of abrasive elements 4-4' can be used to temporarily (e.g., removably) the polishing pad 2 to a CMP polishing apparatus. One of the polishing platens (not shown in Figure 1) (not shown in Figure 1).

Also shown in Fig. 1 is a selective abrasive component distribution layer 8, which can also be used as a guide plate for the abrasive element 4-4'. The selective abrasive component distribution layer 8 assists in the distribution of the working liquid and/or the abrasive slurry to the individual abrasive elements 4-4' during a polishing process. When used as a guide plate, the abrasive component distribution layer 8 (guide plate) can be positioned on the first major side of the support layer 10 to facilitate the configuration of the plurality of abrasive elements 4-4' such that the abrasive component distribution layer 8 One of the first main surfaces of the guide plate is away from the support layer 10, and one of the second main surfaces of the abrasive component distribution layer 8 (guide plate) is opposed to the first main surface of the abrasive component distribution layer 8.

The abrasive element 4-4' extends from a first major surface of the abrasive component distribution layer 8 (guide plate) in a first direction substantially perpendicular to one of the first major sides of the support layer 10. If the abrasive component distribution layer 8 is also used as a guide plate, it is preferred to provide a plurality of orifices 6 extending through the abrasive component distribution layer 8 (guide plates). A portion of each of the abrasive elements 4 extends into a corresponding aperture 6. Thus, a plurality of apertures 6 can be used to guide the arrangement of the abrasive elements 4 on the support layer 10.

In an exemplary embodiment illustrated in Figure 1, at least a portion of the abrasive elements 4-4' are porous abrasive elements 4, and certain abrasive elements 4-4' are substantially non-porous abrasive elements 4'. However, it should be understood that in other exemplary embodiments not shown in FIG. 1, all of the abrasive elements 4-4' may be selected to be porous abrasive elements 4, or all of the abrasive elements 4-4' may be selected. The substantially non-porous abrasive element 4' is used.

In the particular embodiment illustrated in Figure 1, two porous abrasive elements 4 are shown along with a substantially non-porous abrasive element 4'. In addition, the porous abrasive element 4 is shown to include both a porous abrasive surface 14 and apertures 15 that are generally distributed throughout the abrasive element 4. However, it should be understood that any number of abrasive elements 4-4' can be used, and any number of abrasive elements 4-4' can be selected as porous abrasive elements 4 or substantially non-porous abrasive elements 4'.

Additionally, in certain exemplary embodiments not illustrated by FIG. 1, a plurality of abrasive elements 4-4' may, for example, be configured in a pattern on one of the major surfaces of the support layer 10 or bonded to the support The layers are previously disposed in a template or mold for configuring one of the abrasive elements. For example, Figures 3A-3B illustrate one exemplary configuration of a plurality of abrasive elements 4-4' that are configured in a template 30 into a generally circular two-dimensional array pattern 32. After the plurality of abrasive elements 4-4' are arranged in the pattern 30 in the template 30, one of the first major sides of the support layer 10 can be contacted and bonded to the plurality of abrasive elements 4-4', for example, by direct Thermal bonding to the support layer 10 or by using an adhesive or other bonding material.

Moreover, it should be understood that the polishing pad 2 need not include only substantially the same abrasive element 4. Thus, for example, any combination or arrangement of porous abrasive elements and non-porous abrasive elements can constitute a plurality of porous abrasive elements 4. It should also be appreciated that in certain embodiments, any number of porous abrasive elements 4 and substantially non-porous abrasive elements 4', and any combination or arrangement thereof, may be advantageously utilized to form a floating abrasive having a bond to a support layer 10. One of the components 4-4' is a polishing pad.

In certain additional exemplary embodiments illustrated in Figure 1, at least one surface of a porous abrasive element 4, in this case at least the abrasive surface 14, includes a plurality of apertures (not shown in Figure 1, but in Illustrated in Figure 4). In other exemplary embodiments, each of the porous abrasive elements 4 is also shown as having a plurality of apertures 15 that are generally distributed throughout the abrasive element 4. In other exemplary embodiments (not shown in FIG. 1, but illustrated by FIG. 4), the holes are generally distributed at or near the abrading surface 14 of the abrasive element 4. However, it should be understood that the scope of the present invention encompasses a polishing pad 2 having a combination or configuration of abrasive elements 4: the polishing elements 4 having pores distributed substantially throughout the polishing element 4; the apertures are generally distributed at the abrasive surface 14 of the abrasive element 4. Or only the abrasive element 4 of the abrasive surface 14 of the abrasive element 4; and the abrasive element 4 having substantially no holes, and such abrasive pads may also be advantageously fabricated.

Referring to Figure 2, there is shown another exemplary embodiment of a polishing pad 2' comprising: a support layer 10 having a first major side and a second main opposite the first major side a plurality of abrasive elements 4-4' joined to a first major side of the support layer 10; and a selective guide plate 28 having a first major surface and a second opposite the first major surface The major surface, guide plate 28 is positioned to position a plurality of abrasive elements 4-4' on the first major side of support layer 10 with the first major surface of selective guide plate 28 remote from support layer 10. In the particular embodiment illustrated in FIG. 1, the abrasive element 4 is shown attached to the first major side of the support layer 10, for example, by direct thermal bonding to the support layer 10 or by the use of an adhesive.

In the particular exemplary embodiment illustrated in FIG. 2, the support layer 10 is secured to a compliant layer 16 that is positioned over the plurality of abrasive elements of the support layer 10 and to the first major side of the support layer 10. 4-4' is opposite the second main side. In addition, the selective adhesive layer 12 is shown at an interface between the compliant layer 16 and the support layer 10. The selective adhesive layer 12 can be used to secure the second major side of the support layer 10 to the compliant layer 16. Additionally, a selective pressure sensitive adhesive layer 18 secured to the compliant layer 16 opposite the plurality of abrasive elements 4-4' can be used to temporarily (e.g., removably) the polishing pad 2 to a CMP polishing apparatus. One of the polishing platens (not shown in Figure 2) (not shown in Figure 2).

A selective guide plate 28 is also shown in the exemplary embodiment of FIG. A polishing pad 2' in accordance with the present invention is typically fabricated without the optional guide plate 28 (which can also be used as an alignment template for arranging a plurality of abrasive elements 4-4' on the first major side of the support layer 10). In certain exemplary embodiments, the selective guide plate 28 can be completely eliminated from the polishing pad, as illustrated by the polishing pad 2 of FIG. Fabricating such embodiments may be advantageously easier and less expensive than other conventional polishing pads comprising a plurality of abrasive elements.

Also shown in Fig. 2 is a selective abrasive component distribution layer 8' which can also be used as a guide plate for the abrasive element 4-4'. During a polishing process, the selectively abrasive composition distribution layer 8' aids in the distribution of the working liquid and/or the abrasive slurry to the individual abrasive elements 4-4'. When used as a guide plate, the abrasive component distribution layer 8 can be positioned on the first major side of the support layer 10 to facilitate the configuration of the plurality of abrasive members 4 such that one of the first major surfaces of the abrasive component distribution layer 8' is remote from The support layer 10, and one of the second main surfaces of the abrasive component distribution layer 8' is opposed to the first major surface of the abrasive component distribution layer 8'. As shown in FIG. 2, a plurality of apertures 6 extending through at least the selective guide plate 28 (if present) and/or selectively abrasively distributing the component distribution layer 8' (if present) may also be provided.

As illustrated in FIG. 2, each of the abrasive elements 4-4' extends from a first major surface of the selective guide plate 28 in a first direction generally perpendicular to one of the first major sides of the support layer 10. In some embodiments shown in FIG. 2, each of the abrasive elements 4-4' has a mounting flange, and each of the abrasive elements 4-4' is joined to the support layer 10 by a corresponding flange A primary side and optionally a second major surface of the component distribution layer 8' is selectively bonded to the first major side of the support layer 10. Thus, during a grinding process, the abrasive element 4-4' is free to undergo displacement in a direction substantially perpendicular to one of the first major sides of the support layer 10 while still remaining bonded to the support layer 10, and by selective grinding The component distribution layer 8' is additionally fixed to the support layer 10 as appropriate.

In these embodiments, at least a portion of each of the abrasive elements 4-4' extends into a corresponding aperture 6, and each of the abrasive elements 4-4' also passes through a corresponding aperture 6 and is self-selectively directed to the plate 28. The first major surface extends outward. Thus, the plurality of apertures 6 of the selective guide plate 28 and/or the selective abrasive component distribution layer 8' can also be used as a template to guide the abrasive element 4-4' to the first major side of the support layer 10. Horizontal configuration. In other words, the selective guide plate 28 and/or the selective abrasive component distribution layer 8' can be used as a template or guide to configure the plurality of abrasive elements 4-4' at the first of the support layer 10 during the polishing pad manufacturing process. On the main side.

In the particular embodiment illustrated in Figure 2, the selective guide plate 28 can include an adhesive (not shown) positioned at an interface between the support layer 10 and the abrasive component distribution layer 8'. The selective guide plate 28 can thus be used to secure the selective abrasive component distribution layer 8' to the support layer 10, thereby securely securing the plurality of abrasive elements 4-4' to the first major side of the support layer 10. However, other joining methods can be used, including direct bonding of the abrasive element 4-4' to the support layer 10 using, for example, heat and pressure.

In one related exemplary embodiment illustrated in FIG. 2, the plurality of apertures may be configured as an array of apertures, wherein at least a portion of the apertures 6 comprise a primary aperture formed by the selective abrasive composition distribution layer 8' And forming an undercut region by the selective guide plate 28, and the undercut region forms a shoulder that engages the corresponding abrasive element flange, thereby eliminating the need to directly bond the abrasive element 4-4' to the support layer 10 The abrasive element 4-4' is securely fixed to the support layer 10 in the case. Additionally, in certain exemplary embodiments not illustrated by FIG. 2, the plurality of abrasive elements 4-4' can be configured in a pattern, for example, configured to be disposed on one of the major surfaces of the support layer 10 The array of dimension elements, or prior to bonding to the support layer, is disposed in a template or mold for configuring one of the abrasive elements.

In a further exemplary embodiment illustrated in Figure 2, at least one surface of a porous abrasive element 4, in this case at least the abrasive surface 14, comprises a plurality of apertures (not shown in Figure 2, but in Figure 4 Graphical illustration). In other exemplary embodiments, each of the porous abrasive elements 4 is also shown as having a plurality of apertures 15 that are generally distributed throughout the abrasive element 4. In other exemplary embodiments (not shown in FIG. 2, but illustrated by FIG. 4), the holes are generally distributed at or near the abrasive surface 14 of the porous abrasive element 4. However, it should be understood that the scope of the present invention also encompasses a polishing pad 2' having a combination or arrangement of abrasive elements 4: abrasive elements 4 having apertures generally distributed throughout the polishing element 4, having a distribution substantially distributed to the polishing elements 4. The polishing element 4 at or near the surface of the polishing surface 14 of the polishing element 4 and the polishing element 4 having substantially no holes are also advantageously fabricated.

Referring now to Figure 4, a porous abrasive element 4 having a porous abrasive surface 14 comprising a plurality of apertures 15 can be used in a polishing pad in accordance with another exemplary embodiment of the present invention. The porous abrasive element 4 of Figure 4 is also shown having a flange 25 that can be used, for example, to facilitate bonding to a support layer (not shown in Figure 4) as illustrated in Figure 2. The porous abrasive element shown in FIG. 4 includes a plurality of apertures 15 positioned generally at the abrasive surface 14. However, it should be understood that in other embodiments, for example, in the embodiment illustrated in Figures 1-2, a plurality of apertures 15 may be distributed throughout the porous abrasive element 4 and the abrasive surface 14. It should be further understood that in other embodiments, a plurality of apertures 15 may be distributed throughout the porous abrasive element 4 rather than being distributed at the abrasive surface 14.

Figure 4 illustrates a particular shape of a porous abrasive element 4. It should be understood that a substantially non-porous abrasive element 4' can be made using the same shape. It should be further understood that, in practice, the abrasive element 4-4' can be formed in any shape, and a plurality of abrasive elements 4-4' having two or more different shapes can be advantageously used, and bonded to The polishing elements are arranged in a pattern as appropriate prior to forming a support layer (not shown in Figure 4) of a polishing pad (not shown in Figure 4).

In certain exemplary embodiments, the abrasive element 4-4' can be characterized by a height (H) and a width (W), as illustrated in FIG. Additionally, the cross-sectional shape of the abrasive element 4-4' (taken through one of the abrasive elements 4-4' in a direction generally parallel to the direction of the abrasive surface 14) can vary widely depending on the intended application. Although FIG. 4 shows a generally cylindrical abrasive element 4 having a generally cylindrical cross section, other cross sectional shapes may be and may be required in certain embodiments. For example, circular, elliptical, triangular, square, rectangular, and trapezoidal cross-sectional shapes can be used.

For a generally cylindrical abrasive element 4 having a circular cross-section as shown in Figure 4, in certain embodiments, the abrasive element 4 is at least about 50 microns (μm) along a cross-sectional diameter generally parallel to one of the abrasive surfaces 14. More preferably, it is at least about 1 mm, and more preferably at least about 5 mm. In certain embodiments, the abrasive element 4 has a cross-sectional diameter in a direction generally parallel to one of the abrasive surfaces 14 of up to about 20 mm, more preferably up to about 15 mm, still more preferably up to about 12 mm. In certain embodiments, the abrasive element is taken at the abrasive surface 14 as shown in FIG. 4 and the diameter corresponding to the width (W) can be from about 50 μm to about 20 mm, in certain embodiments, The diameter is from about 1 mm to about 15 mm, and in other embodiments, the cross-sectional diameter is from about 5 mm to about 12 mm.

For non-cylindrical abrasive elements having a non-circular cross section, a characteristic dimension can be used to characterize the size of the abrasive element for a height, width and/or length. In certain exemplary embodiments, the characteristic size may be selected to be at least about 50 μm, more preferably at least about 1 mm, and even more preferably at least about 5 mm. In certain embodiments, the abrasive element 4 has a cross-sectional diameter in a direction generally parallel to one of the abrasive surfaces 14 of up to about 20 mm, more preferably up to about 15 mm, still more preferably up to about 12 mm.

In other exemplary embodiments, each of the abrasive elements 4 may have a cross-sectional area that is generally at least about 1 mm ² in a direction generally parallel to one of the abrasive surfaces 14, and in other embodiments, at least about 10 mm ² , and Still other embodiments are at least about 20 mm ² . In other exemplary embodiments, the cross-sectional area of each of the abrasive elements 4 in a direction generally parallel to one of the abrasive surfaces 14 may be up to about 1,000 mm ² , and in other embodiments, up to about 500 mm ² , and in In still other embodiments, up to about 250 mm ^{2 is used} .

Depending on the intended application, the abrasive elements (4-4' in Figure 1-2) can be distributed in a variety of patterns on one of the main sides of the support layer (10 in Figure 1-2), and such The pattern can be a regular or irregular pattern. The abrasive elements can reside on substantially the entire surface of the support layer, or the support layer can have regions that do not include abrasive elements. In certain embodiments, the abrasive element has an average surface coverage of at least 30%, at least 40%, or at least 50% of the support layer. In other embodiments, the abrasive elements have an average surface coverage of the support layer of up to about 80%, up to about 70%, or up to about 60% of the total area of the major surface of the support layer, such as by the number of abrasive elements, per The cross-sectional area of an abrasive element and the cross-sectional area of the polishing pad are determined.

In certain exemplary embodiments, the polishing pad has a cross-sectional area in a direction generally parallel to one of the major surfaces of the polishing pad ranging from about 100 cm ² to about 300,000 cm ² ; in other embodiments , from the range of about between 1,000 cm ² of about 100,000cm ^2; and in yet another embodiment, in the range from about 2,000 cm ² of about 50,000 cm ^2.

In some exemplary implementations, each polishing element (4-4 in Figure 1-2) is used before the polishing pad (2 in Figure 1, 2' in Figure 2) for the first time in a polishing operation. ') extends in a first direction that is substantially perpendicular to the first major side of the support layer (10 in Figures 1-2). In certain exemplary embodiments, the abrasive elements comprise a selective abrasive component distribution layer (8 in FIG. 1, 8' in FIG. 2) and/or a selective guide plate in the first direction (FIG. 2) One of the 28) extends above the plane by at least about 0 mm, 0.25 mm, at least about 0.3 mm, or at least about 0.5 mm.

In other exemplary embodiments, the abrasive surfaces of the abrasive elements can be flush with the exposed major surface of the selective abrasive component distribution layer. In other exemplary embodiments, the abrasive surfaces of the abrasive elements can be recessed below the exposed major surface of the selective abrasive component distribution layer, and then, for example, by selective selective polishing. One portion of the component distribution layer is such that the abrasive surfaces of the abrasive elements are flush with or extend beyond the exposed major surface of the selective abrasive component distribution layer. Such embodiments may advantageously be used with a polishing composition distribution layer selected to be selectively applied during the polishing process or before, during or after contact with the workpiece in a selective conditioning process applied to the polishing pad. Abraded or corroded.

In a further exemplary embodiment, each of the abrasive elements 4-4' extends at least about 0.25 mm, at least about 0.3 mm, or in a first direction above a plane comprising the support layer (10 in Figures 1-2), or At least about 0.5 mm. In an additional exemplary embodiment, the abrasive surface (14 in Figures 1-2) is higher than the height of the base or bottom of the abrasive element (i.e., the height (H) of the abrasive element as shown in Figure 4) can be 0.25 mm , 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 5.0 mm, 10 mm or more, depending on the grinding composition used and the material selected for the abrasive element.

Referring again to Figures 1-2, the entire selective component distribution layer (8 in Figure 1, 8' in Figure 2) and/or the orifice on the selective guide plate 28 (6 in Figure 1-2) The depth and spacing can vary as needed for a particular CMP process. In some embodiments, the abrasive elements (4-4' in FIGS. 1-2) are each substantially opposite to each other and the abrasive component distribution layer (8 in FIG. 1, 28 in FIG. 2) and the guide plate 31. It is maintained in a planar orientation and projects above the surface of the selective abrasive component distribution layer (8 in Figure 1, 8' in Figure 2) and/or the surface of the selective guide plate 28.

In some exemplary embodiments, the polishing element 4-4' is in any of the selective guide plates (28 in Figure 2) and any selectively abrasive component distribution layer (8 in Figure 1, 8 in Figure 2) The void volume formed by the upper extension can provide a space for the distribution of the abrasive component on the surface of the selective abrasive component distribution layer (8 in Fig. 1, 8' in Fig. 2). The polishing element 4-4' protrudes above the polishing component distribution layer (8 in Fig. 1, 8' in Fig. 2), the amount of protrusion being at least partially dependent on the material properties of the polishing element and the abrasive composition (working liquid and Or abrasive slurry) the desired flow above the surface of the abrasive component distribution layer (8 in Figure 1, 8' in Figure 2).

As illustrated in Figures 1-2, in certain exemplary embodiments, at least a portion of the abrasive element 4-4' is a porous abrasive element 4, which in some embodiments has at least one porous abrasive surface (Figure 1 14 of the -2), the porous abrasive surface can be in sliding or rotational contact with one of the substrates to be ground (not shown in Figure 1). In other embodiments, the porous abrasive elements may not have a porous abrasive surface 14, but may have apertures 15 that are generally distributed throughout the porous abrasive element 4. These porous abrasive elements can be used as a compliant abrasive element that exhibits certain advantageous properties of a compliant abrasive pad. A number of suitable porous abrasive elements are disclosed in co-pending U.S. Provisional Patent Application Serial No. 61/075,970, the entire disclosure of which is incorporated herein by reference.

In certain particular exemplary embodiments, one or more of the porous abrasive elements 4 can include a plurality of apertures 15 that are generally distributed throughout the abrasive element 4 in the form of a porous foam. The foam may be a closed chamber foam or an open chamber foam. In certain embodiments, a closed cell foam may be preferred. Preferably, the plurality of apertures 15 in the form of a foam exhibit a monomodal pore size (e.g., pore diameter) distribution. In certain exemplary embodiments, the plurality of pores exhibit an average pore size of at least about 1 nanometer (nm), at least about 100 nm, at least about 500 nm, or at least about 1 μιη. In other exemplary embodiments, the plurality of pores exhibit an average pore size of up to about 100 μm, up to about 50 μm, up to about 10 μm, or up to about 1 μm. In some presently preferred embodiments, the plurality of apertures exhibit an average pore size from about 1 μm to about 50 μm.

Referring now to Figures 1-2 and 4, the abrasive surface 14 of the abrasive element 4-4' can be a substantially planar surface or can be textured. In some presently preferred embodiments, at least the abrasive surface of each porous abrasive element is porous, for example having microscopic surface openings or holes 15, which may take exits, passages, grooves, channels And the form of the analog. The apertures 15 at the abrasive surface can be used to facilitate distribution and maintenance of a polishing component at an interface between a substrate (not shown) and a corresponding porous abrasive element (eg, one of the working fluids not shown in the figures and / or abrasive slurry).

In certain exemplary embodiments illustrated in FIG. 4, the abrasive surface 14 includes apertures 15 that are generally cylindrical capillaries. The aperture 15 can extend from the abrasive surface 14 into the abrasive element 4. In a related embodiment, the abrasive surface includes a bore 15 that is a generally cylindrical capillary that extends from the abrasive surface 14 into the porous abrasive element 4. The holes need not be cylindrical and may have other hole geometries such as conical, rectangular, pyramidal, and the like. In general, the characteristic dimensions of the holes can be specified as a depth of the same width (or diameter) and a length. The characteristic pore sizes may range from about 25 μm to about 6,500 μm in depth, from about 5 μm to about 1000 μm in width (or diameter), and are in length From about 10 μm to about 2,000 μm.

In other exemplary implementations (not illustrated), the abrasive surface includes apertures in the form of a plurality of channels, wherein each channel preferably extends at least along a direction generally parallel to one of the abrasive surfaces across an abrasive surface of a corresponding abrasive element portion. Preferably, each channel extends substantially parallel to one of the abrasive surfaces across the entire abrasive surface of a corresponding abrasive element. In other exemplary embodiments (not illustrated), the apertures may take the form of a two-dimensional array of channels, with each channel extending only across a portion of the abrasive surface.

In further exemplary embodiments (not illustrated), the channels may have virtually any shape, such as cylindrical, triangular, rectangular, trapezoidal, hemispherical, and combinations thereof. In certain exemplary embodiments, each channel is selected to be in a range of at least about 100 μm to about 7500 μm along a depth that is substantially perpendicular to one of the abrasive surfaces of the abrasive element. In other exemplary embodiments, the cross-sectional area of each channel along a direction generally parallel to one of the abrasive surfaces of the abrasive element is selected to range from about 75 square micrometers (μm ² ) to about 3×10 ⁶ μm ² In the scope.

In a further exemplary embodiment, the support layer can be substantially incompressible, such as a rigid film or other hard substrate, but is preferably compressible to provide a positive pressure toward the abrasive surface. In certain exemplary embodiments, the support layer can comprise a flexible and compliant material such as a compliant rubber or polymer. In other exemplary embodiments, the support layer is preferably made of a compressible polymeric material (preferably via a foamed polymeric material). In some embodiments, a closed cell foam may be preferred, but in other embodiments, an open cell foam may be used. In additional exemplary embodiments, the abrasive elements can be formed as a unitary abrasive element sheet secured to the support layer, the support layer being a compressible or conformable support layer.

The support layer is preferably liquid impermeable to prevent penetration or penetration of working fluid into or from the support layer. However, in certain embodiments, the support layer can comprise a liquid permeable material, either alone or in combination with a selective barrier layer, to prevent or inhibit penetration or penetration of liquid from the support layer. Moreover, in other embodiments, a porous support layer may be advantageously employed, for example, to maintain a working fluid at the interface between the polishing pad and a workpiece during grinding (eg, an abrasive slurry) .

In certain exemplary embodiments, the support layer may comprise a material selected from the group consisting of polyoxyn, natural rubber, styrene-butadiene rubber, neoprene, polyurethane, polyester, polyethylene, and combinations thereof. A polymeric material. The support layer can further comprise a wide variety of additional materials such as fillers, particulates, fibers, reinforcing agents, and the like.

Polyurethane resins have been found to be particularly useful support layer materials, with thermoplastic polyurethanes (TPU) being especially preferred. In some presently preferred embodiments, the support layer comprises a film of one or more of the following TPUs: an ESTANE TPU (available from OH, Cleveland Lubrizol Advanced Materials, Inc.), a TEXIN Or DESMOPAN TPU (available from Bayer Material Science of PA, Pittsburgh), a PELLETHANE TPU (available from MI, Dow Chemical Company of Midland), and similar TPUs.

The abrasive elements can comprise a wide variety of materials, with polymeric materials being preferred. Suitable polymeric materials include, for example, polyurethanes, polyacrylates, polyvinyl alcohol polyesters, polycarbonates, and are commercially available under the tradename DELRIN (available from DE, Wilmington, EI DuPont de Nemours, Inc.). Acquired acetal. In certain exemplary implementations, at least some of the abrasive elements comprise a thermoplastic polyurethane, a polyacrylate, polyvinyl alcohol, or a combination thereof.

The abrasive elements can also include a reinforced polymer or other composite material including, for example, metal particles, ceramic particles, polymer particles, fibers, combinations thereof, and the like. In certain embodiments, it may be made conductive and/or thermally conductive by the inclusion of a filler such as carbon, graphite, metal, or combinations thereof in the abrasive element. In other embodiments, a conductive polymer may be used in the presence or absence of the above-described conductive and/or thermally conductive filler, such as, for example, polyaniline (PANI) sold under the trade name ORMECOM (available from Ormecon Chemie of Germany, Ammersbek) Purchased).

In certain exemplary embodiments, the polishing pad further includes a compliant layer that is secured to the support layer opposite the abrasive elements. The compliant layer may be secured to the support layer by any of the joining surfaces, but preferably the support layer is secured to the support layer by an adhesive layer positioned at the interface between the compliant layer and the support layer The polishing element is opposite the compliant layer.

In certain embodiments, the compliant layer is preferably compressible to provide a positive pressure to one of the abrasive surfaces of the workpieces that are directed toward a workpiece during grinding. In certain exemplary embodiments, the support layer can comprise a flexible and compliant material such as a compliant rubber or polymer. In other exemplary embodiments, the support layer is preferably made of a compressible polymeric material (preferably via a foamed polymeric material). In some embodiments, a closed cell foam may be preferred, but in other embodiments, an open cell foam may be used.

In certain particular embodiments, the compliant layer can comprise a polymeric material selected from the group consisting of polyoxyn, natural rubber, styrene-butadiene rubber, neoprene, polyurethane, polyethylene, and combinations thereof. . The compliance may further include a wide variety of additional materials such as fillers, particulates, fibers, reinforcing agents, and the like. The compliant layer is preferably liquid impermeable (although the permeable material can be used in conjunction with a selective barrier layer to prevent or inhibit liquid penetration into the compliant layer).

Preferred polymeric materials for use in the compliant layer are polyurethanes, with TPU being especially preferred. Suitable polyurethanes include, for example, those available under the trade designation PORON from CT, Rogers Corp., Rogers Corp., and those available under the trade designation PELLETHANE from MI, Midland, Dow Chemical. Polyurethane (especially PELLETHANE 2102-65D). Other suitable materials include polyethylene terephthalate (PET) (such as, for example, biaxially oriented PET, widely available under the trade name MYLAR) and bonded rubber sheets (for example, under the trade name BONDTEX from CA, Santa Ana) Rubber sheet purchased by Rubberite Cypress Sponge Rubber Products, Inc.).

In certain exemplary embodiments, the use of a polishing pad in accordance with the present invention in a CMP process has certain advantages, such as improved in-wafer polishing uniformity, a relatively flat polished wafer surface, and self-crystallisation. One of the edge grain yields of one of the circles increases and the operating range and consistency of the improved CMP process. Although not wishing to be bound by any particular theory, such advantages may be derived by decoupling the abrasive surface of the abrasive element from the compliant layer underlying the support layer, thereby allowing the polishing pad to contact a workpiece during a polishing process Allowing the abrasive elements to "float" in a direction substantially perpendicular to one of the abrasive surfaces of the components.

In some embodiments, the decoupling of the abrasive surface of the abrasive element from the compliant layer can be enhanced by incorporating the abrasive material into a selective guide plate that includes the guide from a first major surface. The plate extends to a plurality of apertures in a second major surface, wherein at least a portion of each of the abrasive elements extends into a corresponding aperture, and wherein each of the abrasive elements extends outwardly from the second major surface of the guide plate. A selective guide plate, preferably comprising a rigid or non-compliant material, can be used to maintain the spatial orientation of the abrasive surface and to maintain lateral movement of the components on the polishing pad. However, in other embodiments, the selective guide plate is not required because the elements are maintained by bonding the abrasive elements to the support layer, preferably by directly thermally bonding the abrasive elements to the support layer. Spatial orientation and prevention of lateral movement.

The selective guide sheets can be made from a wide variety of materials such as polymers, copolymers, polymer blends, polymer composites, or combinations thereof. A rigid, non-compliant non-conductive and liquid impermeable polymeric material is generally preferred, and polycarbonate has been found to be particularly useful.

In a further embodiment, the polishing pad of the present invention may further comprise a selectively abrasive component distribution layer covering at least a portion of one of the first major sides of the support layer and a first major surface of the selective guide plate (if present). The selectively ground component distribution layer can be made from a wide variety of polymeric materials. In certain embodiments, the selectively ground component distribution layer can include at least one hydrophilic polymer. Preferred hydrophilic polymers include polyurethanes, polyacrylates, polyvinyl alcohols, polyoxymethylenes, and combinations thereof. In a particular embodiment, the abrasive component layer can comprise one of a hydrogel material (such as, for example, one of the absorbable water hydrophilic polyurethanes), preferably in the range of from about 5 to about 60 weight percent. Polyacrylate) to provide a smooth surface during the grinding operation.

In an additional exemplary embodiment, the selective abrasive composition distribution layer includes a compliant material (for example, a porous polymer or foam) to provide when the abrasive composition distribution layer is compressed during a grinding operation A positive pressure is directed towards the substrate. In certain exemplary embodiments, the compliance of the abrasive component distribution layer is selected to be less than the compliance of the selective compliance layer. In certain embodiments, a porous or foamed material having an open or closed chamber may be a preferred compliant material for use in a selectively abrasive component distribution layer. In certain particular embodiments, the selectively ground component distribution layer has a porosity of between about 10% and about 90%.

In certain exemplary embodiments, the abrasive surface of the abrasive elements can be flush or recessed below the major surface of the selective abrasive component distribution layer. These embodiments may be advantageously employed to maintain a working fluid (e.g., a slurry) at the interface between the exposed abrasive surface of the abrasive elements and a workpiece. In such embodiments, the abrasive component distribution layer can advantageously be selected to include a material that is selective to the abrasive surface applied to the polishing pad during, during, or after the polishing process or prior to contact with a workpiece. Abrasion or corrosion during the conditioning process.

In a further exemplary embodiment, the abrasive component distribution layer can be used to distribute the abrasive component substantially evenly across the surface of the substrate being subjected to grinding, which can provide for more uniform grinding. The abrasive component distribution layer may optionally include flow blocking elements (such as baffles, grooves (not shown in the figures), holes, and the like) to adjust the flow rate of the abrasive components during milling. In a further exemplary embodiment, the abrasive component distribution layer can comprise a variety of different material layers to achieve a desired abrasive component flow rate at different depths from the abrasive surface.

In certain exemplary embodiments, one or more of the abrasive elements can include an open core region or cavity defined within the abrasive element, although such a configuration is not required. In certain embodiments, as described in WO/2006/055720, the core of the abrasive element can include a sensor to detect pressure, conductivity, capacitance, eddy current, and the like. In still another embodiment, the polishing pad can include a window extending through the pad in a direction perpendicular to the polishing surface, or a transparent layer and/or a transparent abrasive element can be used to allow optical endpoint measurement of a polishing process, such as The co-pending U.S. Provisional Patent Application Serial No. 61/053,429, filed on May 15, 2008, which is incorporated herein by reference.

The term "transparent layer" as used above is intended to include a layer comprising a transparent region which may be made of one or the same material as the remainder of the layer. In some exemplary embodiments, the elements, layers or regions may be transparent or may be made transparent by applying heat and/or pressure to the material, or a transparent material may be cast into one of the layers suitably positioned. A suitable location in the aperture to form a transparent region. In an alternate embodiment, the entire support layer can be made of a material that is either transparent to the energy in the wavelength range of interest utilized by an endpoint detection device. Preferred transparent materials for a transparent element, layer or region comprise, for example, a transparent polyurethane.

Moreover, as used above, the term "transparent" is intended to include one element, layer, and/or region that is substantially transparent to the energy in the wavelength range of interest utilized by an end point measuring device. In certain exemplary embodiments, the endpoint detection device uses one or more sources of electromagnetic energy to emit radiation in the form of ultraviolet light, visible light, infrared light, microwaves, radio waves, combinations thereof, and the like. In certain embodiments, the term "transparent" means at least about 25% (eg, at least about 35%, at least about 50%, at least about) of the energy at a wavelength of interest impinging on a transparent element, layer or region. 60%, at least about 70%, at least about 80%, at least about 90%, at least about 95%) are transmitted therefrom.

In certain exemplary embodiments, the support layer is transparent. In certain exemplary embodiments, at least one of the abrasive elements is transparent. In an additional exemplary embodiment, at least one of the abrasive elements is transparent and the adhesive layer and the support layer are also transparent. In other exemplary embodiments, the support layer, the guide plate, the abrasive component distribution layer, the at least one abrasive element, or a combination thereof are transparent.

The invention further relates to a method of using a polishing pad as described above in a polishing process, the method comprising one surface of a substrate and one of a plurality of abrasive elements (at least some of the abrasive elements being porous) An abrasive surface of the polishing pad contacts and the polishing pad is relatively moved relative to the substrate to abrade the surface of the substrate. In some exemplary implementations, a working fluid can be provided to an interface between the surface of the polishing pad and the surface of the substrate. Suitable working fluid systems are known in the art, and suitable working fluids are found in, for example, U.S. Patent Nos. 6,238,592 B1, 6,491,843 B1 and WO/200233736.

In certain embodiments, making the polishing pads described herein can be relatively easy and inexpensive. The following is a brief disclosure of certain exemplary methods for making a polishing pad in accordance with the present invention, which is not intended to be exhaustive or limiting. Accordingly, in other exemplary embodiments, a method of making a polishing pad is provided, the method comprising forming a plurality of polishing elements, and joining the polishing elements to a support layer to form a polishing pad. In certain embodiments, joining the abrasive elements to the support layer can include thermal bonding, or using a bonding material to effect adhesive bonding, actinic radiation bonding, or a combination thereof.

In some embodiments, the abrasive elements are thermally bonded to the support layer. For example, a bonding interface can be formed by contacting one of the main surfaces of the support layer with one surface of each of the polishing elements, and heating the polishing elements and the support layer to the polishing elements and the support layer. The temperature of softening, melting or flowing to form a bond at the joint interface to achieve thermal bonding. Ultrasonic welding can also be used to thermally bond the abrasive elements to the support layer. In some presently preferred embodiments, pressure is applied to the joint interface while heating the abrasive element and the support layer. In a further presently preferred embodiment, the support layer is heated to a temperature greater than one of the temperatures to which the abrasive elements are applied.

In other exemplary embodiments, joining the abrasive element to the support layer involves the use of a bonding material that forms a physical and/or chemical interface at an interface between the abrasive element and one of the major surfaces of the support layer. Combine. In some embodiments, one of the physical and/or chemical bonds may be formed using one of the adhesives positioned at the joint interface between each of the abrasive elements and the major surface of the support layer. In other embodiments, the bonding material can be cured by, for example, thermal curing, radiation curing (eg, using actinic radiation such as ultraviolet light, visible light, infrared light, electron beams, or other sources of radiation) Curing) and the like) to form a bonding material.

In some embodiments, at least some of the abrasive elements are substantially non-porous abrasive elements. In some presently preferred embodiments, at least a portion of the abrasive elements can be porous abrasive elements. Accordingly, in certain exemplary embodiments, the method includes forming the porous abrasive elements by injection molding a gas-saturated polymer melt, and injection molding to evolve a gas during the reaction to form a polymer. One reactive mixture, injection molding comprising a mixture of one of the polymers dissolved in a supercritical gas, a mixture of one of the incompatible polymers by injection molding in a solvent, and injection molding dispersed in a thermoplastic polymerization. Porous thermosetting microparticles and combinations thereof.

In certain exemplary embodiments, the porous abrasive elements have apertures that are generally distributed throughout the abrasive element. In other embodiments, the holes may be distributed substantially at the abrasive surface of the porous abrasive elements. In certain additional embodiments, the porosity imparted to the abrasive surface of a porous abrasive element can be, for example, by injection molding, calendering, mechanical drilling, laser drilling, needle drilling, gas dispersion foaming. , chemical treatment and its combination.

It will be appreciated that the polishing pad need not include only substantially the same abrasive element. Thus, for example, any combination or arrangement of porous abrasive elements and non-porous abrasive elements can constitute a plurality of porous abrasive elements. It will be appreciated that in certain embodiments, any number of porous abrasive elements and substantially non-porous abrasive elements, any combination or arrangement thereof, may be advantageously employed to form a polishing pad having a floating abrasive element bonded to a support layer. .

In further exemplary embodiments, the abrasive elements can be configured to form a pattern. Any pattern can be advantageously employed. For example, the abrasive elements can be configured to form a two dimensional array, for example, an array of rectangular, triangular or circular abrasive elements. In additional exemplary embodiments, the abrasive elements can comprise both a porous abrasive element and a substantially non-porous abrasive element configured in a pattern on a support layer. In certain exemplary embodiments, the porous abrasive elements can be advantageously configured relative to any substantially non-porous abrasive elements to form any configuration of porous abrasive elements and non-porous abrasive elements on the major surface of the support layer. In such embodiments, the number and configuration of the porous abrasive elements relative to the substantially non-porous abrasive elements can be advantageously selected to achieve the desired abrasive performance.

For example, in certain exemplary embodiments, the porous abrasive elements can be disposed generally adjacent the center of one of the major surfaces of the polishing pad, and the substantially non-porous abrasive elements can be disposed generally adjacent the peripheral edge of the major surface of the polishing pad. Such exemplary embodiments may desirably maintain a working fluid (for example, an abrasive slurry) in a contact zone between the polishing pad and the wafer surface, thereby improving uniform polishing of the wafer surface. Degree (eg, reduced depression at the surface of the wafer) and reduced amount of waste slurry produced by the CMP process. These exemplary embodiments are also desirably provided with more aggressive grinding at the edge of the die, thereby reducing or eliminating the formation of an edge ridge and improving yield and grain milling uniformity.

In other exemplary embodiments, the porous abrasive element can be disposed proximate to the edge of one of the major surfaces of the polishing pad, and the substantially non-porous abrasive element can be disposed proximate to the center of the major surface of the polishing pad. Other configurations and/or patterns of the abrasive elements can be covered as long as they fall within the scope of the present invention.

In some embodiments, the abrasive elements can be configured in a pattern by being disposed on one of the major surfaces of the support layer. In other exemplary embodiments, the abrasive element can be configured in a pattern using one of the desired patterns, and the support layer can be positioned above or below the polishing element and the template prior to bonding, wherein the support layer A major surface contacts each of the abrasive elements at a joint interface.

An exemplary embodiment of a polishing pad having abrasive elements in accordance with the present invention can have various features and characteristics that enable it to be used in a variety of abrasive applications. In certain presently preferred embodiments, the polishing pads of the present invention are particularly suitable for use in the fabrication of integrated circuits and chemical mechanical planarization (CMP) of wafers in semiconductor devices. In certain exemplary embodiments, the polishing pads described in this invention may provide advantages over those known to those skilled in the art.

For example, in certain exemplary implementations, a polishing pad in accordance with the present invention can be used to better maintain one of the working fluids used in a CMP process between the abrasive surface of the pad and the surface of the substrate being ground. At the interface, thereby improving the efficiency of the working fluid in enhancing the grinding. In other exemplary embodiments, a polishing pad in accordance with the present invention can reduce or eliminate dishing and/or edge corrosion of the wafer surface during grinding. In certain exemplary embodiments, the use of a polishing pad in accordance with the present invention in a CMP process results in improved in-wafer polishing uniformity, a relatively flat polished wafer surface, and one edge of the wafer. One of the increase in grain yield and the improved operating range and consistency of the CMP process.

In a further exemplary embodiment, the use of a polishing pad having one of the porous elements in accordance with the present invention permits the processing of larger diameter wafers while maintaining the desired degree of surface uniformity to achieve high wafer yields, where adjustment of the pad surface is required to maintain Processing more wafers prior to polishing uniformity of the wafer surface or reducing processing time and pad conditioner wear.

An exemplary polishing pad in accordance with the present invention will now be illustrated with reference to the following non-limiting examples.

Instance

The following non-limiting examples illustrate various methods for making both porous and non-porous abrasive elements that can be used to prepare a polishing pad comprising a plurality of abrasive elements joined to a support layer.

Example 1

This example illustrates the preparation of both a non-porous abrasive element (Example 1A) and a porous abrasive element (Example 1B) in which the pores are distributed substantially throughout the abrasive element. The porous abrasive elements are prepared by injection molding a mixture comprising one of the polymers dissolved in a supercritical gas.

A thermoplastic polyurethane having a melt index of 5 (OH, Cleveland Lubrizol Advanced Materials, Inc., ESTANE ETE 60DT3 NAT 022P) was selected at 210 ° C and a force of 3800 g. The thermoplastic polyurethane pellets were fed to a 80 ton MT Arburg injection molding machine equipped with a 30 mm diameter single screw (L/D = 24:1) under high temperature and pressure (Germany, Lossburg) Arburg GmbH) produces a polymer melt.

In Example 1A, the polymer melt was injection molded into a 32 cavity cold runner mold (solid injection weight of 9.2 grams) to form a hollow internal cylindrical cavity and weighed approximately 0.15 grams per element. Hole grinding element.

In Example 1B, nitrogen was injected into the polymer melt at a high temperature and pressure using a Trexel SII-TR10 equipped with a mass pulsed delivery system (available from Trexel, Inc. of MA, Woburn). This results in the formation of a 0.6% w/w blend of supercritical nitrogen in the polymer melt. The supercritical nitrogen and polymer melt blend was injection molded into the 32 cavity cold runner mold (solid injection weight of 9.2 grams) to form a porous abrasive element having a hollow internal cylindrical cavity and weighing 0.135 grams. And wherein the holes are distributed substantially throughout the abrasive element.

The temperature, molding temperature, screw, injection, packaging pressure, molding time, and mold clamping force of each zone of the extruders of Comparative Examples 1A and 1B are summarized in Table 1.

Example 2

This example illustrates the preparation of a porous abrasive element in which the pores are only distributed substantially at the abrasive surface of the element.

As generally described above in Example 1A, a thermoplastic polyurethane having a melt index of 5 at a pressure of 210 ° C and 3800 g was first injection molded (OH, Cleveland Lubrizol Advanced Materials, Inc.). ESTANE ETE 60DT3 NAT 022P) A non-porous abrasive element is prepared by forming a generally cylindrical abrasive element having a diameter of about 15 mm.

The abrasive surface of an injection molded abrasive element is then laser drilled using an AVIA 355 nm ultraviolet laser (CA, Coherent, Inc. of Santa Clara) to form a porous abrasive element that is in nanoseconds. Pulse rate, repetition rate of 15 kHz, power setting of 60-80% (0.8-1.1 watts) and a scan between 100 mm/sec and 300 mm/sec (29.8 seconds and 13.2 seconds total running time) Rate operation.

Example 3

This example illustrates the preparation of both a non-porous abrasive element (Example 3A) and a porous abrasive element (Example 3B) wherein the pores are distributed substantially only at the abrasive surface of the element in the form of a plurality of channels formed on the abrasive surface.

Preparation of porous abrasive elements by injection molding at 210 ° C and 3800 g force with a melt index of 5 thermoplastic polyurethane (OH, Cleveland Lubrizol Advanced Materials, Inc. ESTANE ETE 60DT3 NAT 022P) . Feeding thermoplastic polyurethane pellets to Engel 100 ton injection molding machine (PA, York, Engel) with one 25 mm diameter single screw (L/D = 24.6:1) under high temperature and pressure Machinery, Inc.) produces a polymer melt.

The thermoplastic polyurethane is melt injection molded to a one-cavity cold runner mold equipped with a ribbed mold insert in one chamber and a blank mold insert in the other chamber (injection weight is 34.01 grams). These injection molding conditions are summarized in Table 2.

Figure 5 illustrates an exemplary apparatus that can be used to thermally bond abrasive elements to a support layer. The plurality of non-porous abrasive elements 4' can be configured to be positioned in a two-dimensional array pattern in the template 30 (see Figure 3A) on the release layer 34. The support layer 10 can be placed over the exposed surface of the abrasive element 4'. The release layer 34' can be placed over the exposed surface of the support layer 10 and the entire assembly can be placed between a platen 36 and a lower platen 38 above a heat press.

It will be appreciated that the relative order and configuration of elements in the exemplary device can be varied without departing from the scope of the invention. Thus, for example, the support layer 10 can be placed on the release layer 34 and overlaid on the template 30, and then the non-porous abrasive element 4 can be configured into a two-dimensional array pattern in the template and the configured components Overlying release layer 34'. Furthermore, the porous abrasive element 4 can be substituted for the non-porous abrasive element 4' in any number, configuration or combination.

Example 4

Example 4 illustrates a method of thermally bonding an injection molded thermoplastic polyurethane abrasive element prepared according to Example 1 to one of the support layer films comprising a thermoplastic polyurethane.

Abrasive elements (15 mm diameter) were formed by injection molding a thermoplastic polyurethane (TPU), ESTANE 58144 (available from OH, Cleveland Lubrizol Advanced Materials, Inc.) according to Example 1. The abrasive elements are arranged in a generally circular two-dimensional array pattern using a polycarbonate template as shown in Figure 6, and joined to a 26 μm thick support layer by 182 A thermoplastic polyurethane (TPU), ESTANE 58887-NAT02 (available from OH, Cleveland Lubrizol Advanced Materials, Inc.) was extruded into a film form at °C.

Thermal bonding was carried out in a platen hot press (CA, El Monte Pasadena Hydraulics Press Company) as generally shown in FIG. The upper platen was maintained at about 143.3 ° C and the lower platen was maintained at about 26.7 ° C. Sufficient pressure is applied to form contact between the TPU abrasive element and the TPU support layer, the TPU abrasive elements being positioned between the paper release liner as shown in FIG. The joint was substantially completed and uniform after 30 seconds. After thermally bonding the TPU support layer to the TPU abrasive element, the paper liner is removed to create a TPU support layer that is one-piece transparent with one of the thermally bonded TPU abrasive elements, as shown in FIG.

Example 5

Example 5 illustrates a method of thermally bonding an injection molded thermoplastic polyurethane abrasive element prepared according to Example 1 to a support layer film comprising a different thermoplastic polyurethane.

The abrasive element (6 mm diameter) was formed according to Example 1 by injection molding a TPU (ESTANE 58212 (available from OH, Cleveland Lubrizol Advanced Materials, Inc.)). The abrasive elements were arranged in a generally circular two-dimensional array pattern using a polycarbonate template (Fig. 6) and thermally bonded to a 122 μm thick TPU film support layer (MA, Estsampton's Stevens Urethane ST- 1522CL).

Thermal bonding was carried out in a platen hot press (KS, Pittsburgh HIX N-800 single plate press) as generally shown in FIG. The upper platen was maintained at about 149 ° C and the lower platen was maintained at about 26.7 ° C. A pressure of 40 psi (about 275,790 Pa) is applied to the TPU abrasive element and TPU support layer positioned between the paper release liners as shown in FIG. The joint was approximately completed and uniform after 15 seconds. After thermally bonding the TPU support layer to the TPU abrasive element, the paper liner is removed to produce a TPU support layer that is one-piece transparent with one of the thermally bonded TPU abrasive elements.

Example 6

Example 6 illustrates an alternative method of thermally bonding an injection molded thermoplastic polyurethane abrasive element prepared according to Example 1 to a support layer film comprising one of the polyesters.

Grinding elements (15 mm diameter) were formed according to Example 1 by injection molding a TPU (ESTANE 58144, available from Lubrizol Advanced Materials, Inc. of OH, Cleveland). The polishing elements are directly disposed on one main surface of the support layer and thermally bonded to the support layer, which is a 102 μm thick polyester film (MN, St. Paul's 3M Thermo-Bond 615 Film, 3M) Company).

Thermal bonding was carried out in a plate hot press (CA, El Monte Pasadena Hydraulics Press) to maintain the upper platen at about 121 ° C and the lower platen at about 26.7 ° C. Sufficient pressure is applied to form contact between the TPU abrasive element and the support layer, the TPU abrasive elements being positioned between the support layer and the paper release liner. The joint was substantially completed and uniform after 20 seconds. After thermally bonding the support layer to the TPU abrasive elements, the paper liner is removed to create a support layer that is transparent to one of the thermally bonded TPU abrasive elements.

Example 7

Example 7 illustrates a method of thermally bonding an injection molded thermoplastic polyurethane abrasive element prepared according to Example 1 to a support layer comprising a different polyester film.

Grinding elements (15 mm diameter) were formed according to Example 1 by injection molding a TPU (ESTANE 58144, available from Lubrizol Advanced Materials, Inc. of OH, Cleveland). The polishing elements are directly disposed on one of the main surfaces of the support layer and thermally bonded to the support layer, the support layer being a 102 μm thick polyester film (MN, St. Paul's 3M Thermo-Bond 668 Film) , 3M Company).

Thermal bonding was carried out in a plate hot press (KS, Pittsburgh HIX N-800 single plate press). The upper platen was maintained at about 149 ° C and the lower platen was maintained at about 26.7 ° C. A pressure of 40 psi (about 275,790 Pa) is applied to the TPU abrasive element and support layer positioned between the paper release liners. The joint was approximately completed and uniform after 15 seconds.

Example 8

Example 8 illustrates a method of thermally bonding a monolithic film comprising one of the abrasive elements bonded to a support layer to a compliant layer to form a polishing pad having one of the floating elements.

After the TPU support layer was thermally bonded to the TPU abrasive element as described in Example 4, it was laminated by hand to a 127 μm thick adhesive layer (MN, 3M Company's 3M 9672 transfer adhesive from St. Paul). The main surface of the support layer opposite to the abrasive elements is fixed to a 1.59 mm thick polyurethane foam compliant layer (Rogers PORON urethane foam, article number 4701-50-20062 -04, obtained from MN, Chaska's American Flexible). Grinding is accomplished by hand laminating a pressure sensitive adhesive (3M 442DL transfer tape from 3M Company, St. Paul) onto the surface of the urethane foam compliant layer opposite the abrasive elements. pad.

8 is a photograph of a polishing pad including a floating abrasive element bonded to a support layer, wherein the support layer is fixed to a compliant sub-layer by an adhesive, in accordance with still another exemplary embodiment of the present invention, and One of the pressure sensitive adhesives adheres to one of the major surfaces of the compliant sub-layer opposite the abrasive elements.

Example 9

The polishing pad of Example 8 was mounted to an aluminum polishing platen using a transfer tape pressure sensitive adhesive on the bottom surface of the compliant foam sublayer. The polishing platen with the polishing pad was then mounted in a CETR mill (CA, Campbell CP-4, Center for Tribology, Inc.) and placed in a diamond pad dresser (3M sintered abrasive adjustment) A3800) was contacted and stressed in deionized water under various conditions (see Table 1) for 5 minutes.

After each test condition, the mat was inspected for component cracking and no component cracking was detected. To determine whether the regulation of the continuous mat or tolerable wear, the 8 lb _f (about 3,632 g _f), run (4 cycles / min) 60 rpm table speed, and a platen 10 mm and shaken until the top of the pad is ground broken. Throughout the test, the mat was periodically inspected for the presence or absence of cracking of the abrasive element and no element cracking was detected. The test conditions are summarized in Table 3.

Using the teachings provided in the above embodiments and examples, individual porous and optionally non-porous abrasive elements can be secured to a support layer to provide polishing pads in accordance with various additional embodiments of the present invention. It should be appreciated that the polishing pad in accordance with an exemplary embodiment of the present invention need not include only substantially identical abrasive elements. Thus, for example, any combination or arrangement of porous abrasive elements and non-porous abrasive elements can constitute a plurality of porous abrasive elements. It will be appreciated that in certain embodiments, any number of porous abrasive elements and substantially non-porous abrasive elements, any combination or arrangement thereof, may be advantageously employed to form a polishing pad having a floating abrasive element bonded to a support layer. .

In a particularly advantageous embodiment illustrating an integral polishing pad, a multi-cavity mold can have a backfill chamber, wherein each cavity corresponds to an abrasive element. A plurality of abrasive elements (which may comprise a porous abrasive element and a non-porous abrasive element as described herein) may be injection molded into a multi-cavity mold and melted with the same polymer by injection molding a suitable polymer melt Or another polymer melt is backfilled into the backfill chamber to form a support layer. Upon cooling of the mold, the abrasive elements remain fixed to the support layer whereby a plurality of abrasive elements are formed by the support layer as a unitary abrasive element sheet.

Throughout the specification, whether or not the term "exemplary" is included before the term "embodiment", reference is made to "one embodiment", "some embodiments", "one or more embodiments" or "one" The embodiment is meant to include a particular feature, structure, material, or characteristic of one of the embodiments described in connection with at least one embodiment of the invention. Therefore, it may not be necessary in various places throughout the specification, such as "in one or more embodiments", "in some embodiments", "in one embodiment" or "in an embodiment" Reference is made to the same embodiment of certain exemplary embodiments of the invention. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

Although the specification has been described in detail with reference to the preferred embodiments of the embodiments of the present invention, it is understood that modifications, variations and equivalents of the embodiments are readily apparent to those skilled in the art. Therefore, it is to be understood that the invention is not limited to the illustrative embodiments set forth herein. In particular, as used herein, the numerical ranges recited by the endpoints are intended to include all numbers that are within the scope (eg, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4 and 5). In addition, it is assumed that all numbers used herein will be modified by the term "about." In addition, all publications and patents referred to herein are hereby incorporated by reference in their entirety in their entirety in their entirety herein

Various exemplary embodiments have been described. These and other embodiments are within the scope of the following patent application.

2. . . Abrasive pad

2'. . . Abrasive pad

4. . . Abrasive element

4'. . . Abrasive element

6. . . Orifice

8. . . Grinding component distribution layer

8'. . . Grinding component distribution layer

10. . . Support layer

12. . . Adhesive layer

14. . . Abrasive surface

15. . . hole

16. . . Compliance layer

18. . . Pressure sensitive adhesive layer

25. . . Flange

28. . . guide plate

30. . . template

32. . . pattern

34. . . Release layer

34'. . . Release layer

36. . . Upper plate

38. . . Lower plate

Exemplary embodiments of the present invention are further described with reference to the accompanying drawings in which:

1 is a side elevational view of a polishing pad having a floating abrasive element bonded to a support layer, in accordance with an exemplary embodiment of the present invention.

2 is a side elevational view of a polishing pad having a floating abrasive element bonded to a support layer and including a guide plate, in accordance with another exemplary embodiment of the present invention.

3A is a perspective view of one of the templates of the polishing element configured to be used to fabricate one of the patterns of one of the polishing pads in accordance with an exemplary embodiment of the present invention.

3B is a top plan view of a polishing element configured to be used to fabricate one of the patterns of one of the polishing pads in accordance with an exemplary embodiment of the present invention.

4 is a perspective view of one of the porous abrasive elements having a porous abrasive surface in accordance with another exemplary embodiment of the present invention.

Figure 5 is a side elevational view of an exemplary joining device that can be used in a method of joining a plurality of abrasive elements to a support layer in accordance with an exemplary embodiment of the present invention.

6 is a view showing an image of a template that can be used to configure a plurality of abrasive elements into a pattern and bond layers formed prior to joining the plurality of abrasive elements to a support layer in accordance with a further exemplary embodiment of the present invention. There are a plurality of joined abrasive elements configured in a pattern.

Figure 7 is an image of a support layer formed in accordance with the embodiment of Figure 6 having a plurality of joined abrasive elements configured in the pattern.

Figure 8 is an image of an abrasive pad comprising a plurality of floating abrasive elements joined to a support layer according to the embodiment of Figure 7 in accordance with still another exemplary embodiment of the present invention, the support layer being secured to a conforming Underlying layer.

In the drawings, the same reference numerals indicate the same elements. In the present description, the drawings are not drawn to scale, and in the drawings, the composition of the polishing pad is sized to emphasize selected features.

2. . . Abrasive pad

4. . . Abrasive element

4'. . . Abrasive element

6. . . Orifice

8. . . Grinding component distribution layer

8'. . . Grinding component distribution layer

10. . . Support layer

12. . . Adhesive layer

14. . . Abrasive surface

15. . . hole

16. . . Compliance layer

18. . . Pressure sensitive adhesive layer

Claims (49)

A polishing pad comprising: a support layer (10); a plurality of polishing elements (4), each of the polishing elements being thermally bonded to one of the main sides of the support layer without using an adhesive, wherein The abrasive elements comprise an elongate body and a mounting flange extending in a first direction perpendicular to a plane containing the polishing pad and passing through a polishing component distribution layer (8), and the mounting a flange extending outwardly from the elongate body, and wherein the mounting flange engages a major side of the abrasive component distribution layer (8); wherein the abrasive elements are transverse to one or more of the other abrasive elements Movement is limited, but the abrasive elements remain movable along an axis substantially perpendicular to one of the abrasive surfaces of the abrasive elements; and wherein the elongated bodies of the abrasive elements are perpendicular to the abrasive surface from the support layer The axis extends and protrudes through the abrasive component distribution layer. The polishing pad of claim 1, further comprising a guide plate on the abrasive component distribution layer, wherein the guide plate comprises a plurality of wires extending from the first major surface through the guide plate to a second major surface An aperture, wherein at least a portion of each of the abrasive elements extends into a corresponding aperture, and wherein each of the abrasive elements extends outwardly from the second major surface of the guide plate. The polishing pad of claim 2, wherein the guide plate comprises a polymer, a copolymer, a polymer blend, a polymer composite, or a combination thereof. The polishing pad of claim 2, wherein the guide plate maintains orientation of the abrasive elements in the first direction while allowing the abrasive elements to translate independently relative to the guide plate in the first direction. A polishing pad according to claim 1 or 2, wherein each of the abrasive elements extends at least about 0.25 mm in the first direction above a plane containing the distribution of the abrasive component. The polishing pad of claim 1 or 2, wherein at least some of the abrasive elements have an abrasive surface that is flush with a surface to which one of the abrasive component distribution layers is exposed. The polishing pad of claim 1 or 2, wherein the abrasive component distribution layer comprises an abradable material having a hardness that is less than one of the hardness of the one of the abrasive elements. The polishing pad of claim 1 or 2, wherein the abrasive component distribution layer comprises at least one hydrophilic polymer. The polishing pad of claim 1 or 2, wherein the abrasive component distribution layer comprises a foam. The polishing pad of any of claims 1 or 2, further comprising a compliant layer secured to the support layer on a side opposite the major side of the support layer and the abrasive elements. The polishing pad of claim 10, wherein the compliant layer is secured to the support layer by an adhesive layer at an interface between the compliant layer and the support layer. The polishing pad of claim 10, wherein the compliant layer comprises a polymer selected from the group consisting of polyoxyn, natural rubber, styrene-butadiene rubber, neoprene, and polyaminocarboxylic acid. Polymer materials of esters, polyethylenes, and combinations thereof. The polishing pad of claim 10, wherein one of the abrasive component distribution layers is less flexible than one of the compliant layers. The polishing pad of claim 10, further comprising a pressure sensitive adhesive layer secured to the compliant layer relative to the plurality of abrasive elements. The polishing pad of claim 10, wherein each of the abrasive elements extends at least about 0.25 mm in the first direction above a plane containing the support layer. The polishing pad of claim 10, wherein at least one of the abrasive elements comprises a porous abrasive element, wherein each of the porous abrasive elements comprises a plurality of holes. The polishing pad of claim 16, wherein substantially all of the abrasive elements are porous abrasive elements. The polishing pad of claim 16, wherein the holes constituting each of the porous abrasive elements are distributed over substantially the entire porous abrasive element. The polishing pad of claim 16, wherein at least a portion of each of the abrasive surfaces comprises the plurality of apertures. The polishing pad of claim 19, wherein the plurality of holes constituting the abrasive surface comprise a plurality of channels having a cross-sectional shape selected from the group consisting of: cylindrical, triangular, rectangular, trapezoidal, hemispherical And their combinations. The polishing pad of claim 20, wherein the depth of each channel in the first direction is from about 100 microns to about 7500 microns. The requested item 20 of the polishing pad, wherein the cross-sectional area of each channel of the system from about 75 square microns to about 3 × 10 ⁶ square micrometers. The polishing pad of claim 16, wherein the plurality of apertures comprise a closed chamber foam. The polishing pad of claim 16, wherein the plurality of apertures comprise an open chamber foam. The polishing pad of claim 16, wherein the plurality of holes exhibit a single peak pore size distribution. The polishing pad of claim 16, wherein the plurality of apertures exhibit an average pore size from about 1 nanometer to about 100 micrometers. The polishing pad of claim 26, wherein the plurality of apertures exhibit an average pore size from about 1 micrometer to about 50 micrometers. The polishing pad of claim 16, wherein the abrasive elements are arranged in a two-dimensional array pattern on the major side of the support layer. The polishing pad of claim 1 or 2, wherein at least some of the elements are selected to have a shape selected from the first direction selected from the group consisting of a circle, an ellipse, a triangle, a square, a rectangle, and a trapezoid section. A polishing pad according to claim 1 or 2, wherein the plurality of abrasive elements are formed as a unitary abrasive element sheet together with the support layer. A polishing pad according to claim 1 or 2, wherein at least a portion of the abrasive elements comprise a thermoplastic polyurethane, a polyacrylate, polyvinyl alcohol or a combination thereof. The polishing pad of claim 1 or 2, wherein the abrasive elements have at least one dimension from about 0.1 mm to about 30 mm. A polishing pad according to claim 1 or 2, wherein the support layer comprises a thermoplastic polyurethane. A polishing pad according to claim 1 or 2, wherein at least a portion of the abrasive elements comprise abrasive particles. The polishing pad of claim 1 or 2, wherein the abrasive elements are arranged in a two-dimensional array pattern on the major side of the support layer. A polishing pad according to claim 1 or 2, wherein at least one of the polishing elements is transparent. The polishing pad of claim 36, wherein the support layer is transparent. The polishing pad of claim 10, wherein the support layer, the guide plate, the abrasive component distribution layer, the at least one abrasive element, or a combination thereof is transparent. The polishing pad of claim 11, wherein the support layer, the guide plate, the abrasive component distribution layer, the compliant layer, the adhesive layer, the at least one abrasive element, or a combination thereof are transparent. A method of using a polishing pad, comprising: contacting a surface of a substrate with an abrasive surface of one of the polishing pads of any one of claims 1 to 39; moving the polishing pad relative to the substrate to The surface of the substrate is abraded. The method of claim 40, further comprising providing an abrasive component to an interface between the surface of the polishing pad and the surface of the substrate. A method of making a polishing pad comprising: forming a plurality of abrasive elements; joining the abrasive elements to a support layer to form a polishing pad according to any one of claims 1 to 39. The method of claim 42, further comprising configuring the plurality of abrasive elements in a pattern prior to thermally bonding the abrasive elements to the support layer. The method of claim 43, wherein at least a portion of the abrasive elements comprise a porous abrasive element. The method of claim 44, wherein at least some of the abrasive elements comprise substantially non-porous abrasive elements. The method of claim 44, wherein the porous abrasive elements are formed by injection molding a gas-saturated polymer melt, and injection molding releases a gas during the reaction to form a reactive mixture of a polymer, Injection molding includes a mixture of one of the polymers dissolved in a supercritical gas, a mixture of one of the incompatible polymers injection molded in a solvent, and a porous thermoset that is injection molded and dispersed in a thermoplastic polymer. Particles and combinations thereof. The method of claim 44, wherein the porous polymeric elements comprise a plurality of pores formed substantially at one of the abrasive surfaces of the porous abrasive element. The method of claim 47, wherein the holes are formed by injection molding, calendering, mechanical drilling, laser drilling, needle drilling, gas dispersion foaming, chemical treatment, and combinations thereof. The method of claim 43, wherein configuring the plurality of abrasive elements in a pattern comprises disposing the abrasive elements in a template, arranging the polishing elements on the support layer, and combinations thereof.