TWI412886B - A photosensitive resin composition and a panel structure to which it is applied - Google Patents

Abstract

The present invention relates to a photosensitive resin composition containing resin, photosensitive initiator, monomer and solvent. The resin contains at least glycidyl methacrylate and methacrylic acid. The glycidyl methacrylate in the resin is 5 to 40 wt%, and the methacrylic acid in the resin is 15 to 40 wt%. The photosensitive resin composition is disposed on a transparent substrate surface and forms a panel structure having protective and insulating effects. It can be applied to touch panel or flat panel display and other related products in order to achieve high transmittance and high hardness requirements.

Description

Photosensitive resin composition and panel structure applied thereto

The present invention relates to a composition of a photosensitive resin composition, and aims to provide a photosensitive resin composition which can be applied to related products such as a touch panel or a flat panel display to achieve high light transmittance and high hardness.

The touch panel is usually used in front of the display screen of electronic products such as mobile phones, cameras, PDAs, etc., in order to improve the convenience of implement control and signal input; and in various types of touch panels, due to capacitive touch The control board has the advantages of stable performance and long service life, so it is gradually used in communication products, computer products and consumer electronics. As known, the capacitive touch The capacitive sensing structure of the control board includes an X-axis sensing layer and a Y-axis sensing layer, so that the X and Y-axis sensing layers are insulated from the touch panel body, and the X and Y-axis sensing layers are respectively grounded. And connected to a control circuit, in operation, a capacitive effect is generated by the moment the user touches the finger or the conductor, so that the position of the finger or the conductor can be determined by the change of the capacitance value; since the capacitive touch panel can be used with a finger The input is input, and the input operation is convenient, and the input operation does not need to be touched, and the panel does not suffer from the stress of reverse stress and deformation, so the product performance is stable. long lasting.

The touch panel is provided with a transparent substrate. The upper surface of the transparent substrate is provided with a plurality of transparent conductive structures arranged at intervals to serve as an X-axis sensing layer, and the lower surface of the transparent substrate is arranged under a plurality of intervals. The transparent conductive structure acts as a Y-axis sensing layer, and each of the transparent conductive structures is covered with a metal structure, and each metal structure is exposed, which is easy to form oxidation or is scratched, so that the circuit cannot be normally transmitted to form a short circuit, thereby affecting the whole The result of the touch panel being turned on.

Therefore, in order to improve the above-mentioned defects, Hard Coating should be provided on the surface of the substrate as protection or insulation to improve the environmental stability and mechanical strength of the transparent substrate; and in the technical field of use of the cured film at that time, it can be used as There are many kinds of materials for the cured film, including Diamond Like Carbon (DLC), Silicon-Based Compound, and metal oxides. Among them, the film is cured with cerium oxide, which has a lower refractive index. The rate (about 1.46) and relatively excellent hardness have been widely applied to optical coatings of various light-transmitting substrates.

For the current technology of making cerium oxide hardened film, many plastic raw material production and related upstream plastic processing industries still use Dipping method to immerse the transparent substrate in a specific solution to achieve the deposition of cerium oxide hardened film. Mainstream, however, because the impregnation method is easily affected by the shape of the transparent substrate itself, the uniformity of the cerium oxide cured film is not good, the yield of the downstream process for fabricating the related components is lowered, and the specific solution immersed in the transparent substrate is required. Dilution by high-content solvent to facilitate dip molding; however, the specific solution has a low solid content due to high solvent content, and the cerium oxide hardened film formed on the surface of the transparent substrate after volatilization solvent volatilization Thinner, resulting in lower overall hardness (about HB); however, due to the lower hardness, it is prone to obvious scratches and other operational traces under long-term use, and the scratch resistance is obviously insufficient.

In view of this, the present invention aims to provide a product that can be applied to related products such as a touch panel or a flat panel display to achieve high transmittance and high hardness.

In order to achieve the above object, the photosensitive resin composition of the present invention contains a resin (Resin), a photoinitiator (photo initiator), a monomer (Monomer), and a solvent (Solvent); wherein the resin contains at least a methyl group. Glycidyl acrylate and methacrylic acid, the glycidyl methacrylate is 5 to 40% by weight in the resin, and the methacrylic acid is 15 to 40% by weight in the resin, and the photosensitive resin composition is set. Forming a panel structure with a protective insulating effect on a surface of a transparent substrate, which can be applied to related products such as a touch panel or a flat panel display, so that the light transmittance of visible light having a wavelength range of 380 to 400 nm can reach 95% or more. And the hardness can reach the demand of 5H.

In order to enable the reviewing committee members to understand the main technical contents and embodiments of the present invention, the following description is made with reference to the following drawings: The photosensitive resin composition of the present invention contains 5 to 30% by weight of resin (Resin), 1 to 2% by weight. a photo initiator, 5 to 15 wt% of a monomer (Monomer), and 50 to 80 wt% of a solvent (Solvent); wherein the resin contains at least propylene methacrylate, methacrylic acid, The glycidyl methacrylate is 5 to 40 wt% (preferably 15 to 35 wt%) in the resin, and the methacrylic acid is 15 to 40 wt% (20 to 35 wt%) in the resin. Preferably, the resin in the photosensitive resin composition is preferably 12 to 15 wt%, or the photosensitive initiator is preferably 1.5 wt%, or the monomer is preferably 10 wt%; Of course, the photosensitive resin composition of the present invention further contains less than 1% by weight of additives.

The photosensitive resin composition of the present invention can be applied to related products such as a touch panel or a flat panel display. As shown in the first figure, the present invention is applied to a light transmissive substrate via a spin coating step. The photosensitive resin composition is coated on the upper surface of the light-transmitting substrate, and then sequentially subjected to vacuum drying, pre-baking, exposure, developing, and hard baking. a step of forming a photosensitive resin layer 112 on the upper surface 111 of the transparent substrate 11. As shown in the second figure, a panel structure 1 having a protective insulating effect is formed, and the lower surface of the transparent substrate can be further combined with a touch. The component is formed into a touch panel, or can be applied to a related product such as a flat panel display. The photosensitive resin layer of the present invention can achieve a transmittance of visible light having a wavelength ranging from 380 to 400 nm of 95% or more, and the hardness can be achieved. 5H demand.

The specific implementation is as follows, however, the invention is not limited thereto.

The resin has the following composition, as listed in Table 1:

Wherein, Comparative Resin 1 does not contain glycidyl methacrylate and does not contain styrene; Example Resin 2 contains methacrylic acid, glycidyl methacrylate, and styrene; and Example Resin 3 contains methacrylic acid, Glycidyl methacrylate and styrene.

The above resin: Comparative resin 1, Example resin 2 and Example resin 3 were mixed with a photosensitive initiator, a monomer, a solvent and a surfactant to prepare a photosensitive resin composition as listed in Table 2:

Comparative Example 1, Example 2, and Example 3 had the same photosensitizer, monomer, solvent, and surfactant composition. In Comparative Example 1, the comparative resin 1 was used as a resin; in Example 2, the example resin 2 was used as a resin; and in Example 3, the example resin 3 was used as a resin.

The above-mentioned Comparative Example 1, Example 2, and Example 3 were subjected to development resolution and adhesion test, and the results are shown in Table 3:

Here, each photosensitive resin composition is applied to a light-transmissive substrate by spin coating, vacuum drying (vacuum dry: 133 Pa), pre-baking (pre-baking: 110 ° C / 90 sec) ), exposure (exposure: 200 mJ/cm ² ), lye development (developing: 23 ° C / 60 sec), and hard baking (post baking: 230 ° C / 30 min), the test results were carried out. The test method is as follows:

The first test method--the photosensitive resin composition was developed, and the pattern number remaining on the glass substrate was observed by an optical microscope (representing the line width of the pattern; 4, 6, 8, 10, 12, 14, 16, 18, respectively) 20, 30, 40, 50); the pattern is not dropped to 5 points, the drop below 10 is 4 points, the drop below 20 is 3 points, the drop below 40 is 2 points, and the total drop is 1 point.

The second test method--observing whether the pattern can present a complete pattern (long strip) by optical microscope, can be divided into good according to the condition of the line (good linearity), bad line edge (there is a gap between the patterns but the linearity is not Good) and difficult to develop (cannot develop between the patterns, resulting in the pattern can not be formed).

The test results in Table 3 show that Example 3 has good development resolution and adhesion. Therefore, the resin 3 of the example used in Example 3 is further compounded with a photosensitive initiator, a monomer, a solvent and a surfactant. The composition of the photosensitive resin is as listed in Table 4:

The above Examples 3 to 7 were tested for heat resistance, hundred-grain blade adhesion, light transmittance and hardness. The results are shown in Table 5:

In the same manner, each photosensitive resin composition is applied to a light-transmissive substrate by spin coating, and sequentially subjected to vacuum drying, pre-baking, exposure, lye development, and hard baking. Test results. The test method is as follows:

1. Test method for resistive heat resistance: The photosensitive resin composition after hard baking is baked at 250 ° C / 1 hr, and the percentage change of film thickness (residual film rate) is observed. The higher the residual film rate, the better the heat resistance. .

2. Adhesion test method after hard baking: Tested by the 100-gauge scraper test method, no drop is 5B, all drops are 0B, and so on.

3. Transmittance test method: a colorimetric analyzer is used to penetrate the object to be tested by penetrating light, and the percentage of light transmission is obtained after being detected by the sensor.

4, hardness test method: with automatic pencil hardness measurement (JIS specification).

The test results in Table 5 show that Examples 3 to 5 have the linearity of the preferred pattern, and the linearities of the patterns of Examples 3 to 5 are good, which is superior to the line edges of Examples 6 to 7; In terms of force, the adhesion of the test of Examples 3 to 5 was as high as 5 B, which was superior to that of Examples 6 to 7; in terms of the residual film ratio, the residual film ratio of Example 7 was higher and the heat resistance was the best, and the implementation was carried out. In Example 3, the residual film rate is the lowest and the heat resistance is the worst; in terms of light transmittance, the light transmittance is the same in each embodiment; in terms of hardness, the hardness of Example 5 is as high as 5H, which is superior to the other embodiments of 3H or 4H; In terms of performance, Example 5 has the linearity, adhesion, heat resistance, light transmittance and hardness of a preferred pattern, which are superior to the formulation compositions of the other examples.

As described above, the present invention provides a photosensitive resin composition and a panel structure to which the same is applied, and an application for a patent of the invention is provided according to the law; however, the above description and drawings show a preferred embodiment of the present invention. The present invention is not limited thereto, and any similarity and similarity to the structure, device, features, and the like of the present invention are within the scope of the present invention and the scope of the patent application.

1. . . Panel structure

11. . . Light transmissive substrate

111. . . Upper surface

12. . . Photosensitive resin layer

The first figure is a schematic flow chart of preparing a panel in the present invention.

The second figure is a schematic structural view of the panel in the present invention.

1. . . Panel structure

11. . . Light transmissive substrate

111. . . Upper surface

12. . . Photosensitive resin layer

Claims (6)

A photosensitive resin composition comprising 12 to 15 wt% of resin (Resin), 1 to 2 wt% of a photoinitiator (photo initiator), 5 to 15 wt% of a monomer (Monomer), and 50 to 80 wt% Solvent; wherein the resin comprises at least glycidyl methacrylate, methacrylic acid and styrene, and the glycidyl methacrylate is 5 to 40% by weight in the resin, and the methacrylic acid is The resin is 15 to 35 wt%, and the styrene is 20 to 45 wt% in the resin. The photosensitive resin composition according to claim 1, wherein the photosensitive initiator is 1.5 wt%, or the monomer is 10 wt%. The photosensitive resin composition according to claim 1, wherein the methacrylic acid is 20 to 35 wt% in the resin. The photosensitive resin composition according to claim 1, wherein the photosensitive resin composition further contains less than 1% by weight of additives. A panel structure, the panel structure is provided with a transparent substrate, and a photosensitive resin layer is disposed on an upper surface of the transparent substrate, the photosensitive resin layer is formed of a photosensitive resin composition, and the photosensitive resin composition is It comprises 12-15% by weight of resin (Resin), 1~2wt% of photoinitiator, 5~15wt% of monomer (Monomer) and 50~80wt% of solvent (Solvent); The resin comprises at least glycidyl methacrylate, methacrylic acid and styrene, and the glycidyl methacrylate is in the resin 5 to 40% by weight, the methacrylic acid is 15 to 35 wt% in the resin, and the styrene is 20 to 45 wt% in the resin. The panel structure of claim 5, wherein the lower surface of the transparent substrate is further provided with a touch component.