TWI386144B - Method for manufacturing double-sided printed circuit board - Google Patents

Description

Double-sided circuit board manufacturing method

The invention relates to a circuit board manufacturing technology, in particular to a method for manufacturing a double-sided circuit board.

Generally, the circuit board is made of a series of processes such as cutting, drilling, exposing, developing, etching, pressing, printing, molding, and the like. For details, see "Dielectric characterization of printed circuit board substrates" by C. H. Steer et al., Proceedings of the IEEE, Vol. 39, No. 2 (August 2002).

With the development of circuit boards, the requirements for high flexibility and thinness are increasing. At present, the thickness of copper clad laminates used to make double-sided printed circuit boards has dropped from 60 microns to 36 microns, even to 27 microns. Since the thickness of the copper clad laminate is too thin, the yield is low when the double-sided circuit board is made of the copper-clad board of only 27 micrometers or 36 micrometers on the prior equipment. In the production process, there are mainly the following problems: a series of copper clad laminates are easily bent and crushed in a wet process; the second system is crimped after selective electroplating, and it is difficult to peel off the selective electroplating coating film, and may even be peeled off. The double-sided circuit board is scrapped; when the three series are plated with the plating fixture for plating, the thickness is too thin to be clamped, and the plating solution is easily slipped during the plating process, causing the double-sided circuit board to be scrapped; When the second surface of the conductive line is fabricated, since the copper-clad substrate is too thin and too soft, the double-sided circuit board obtained by etching the conductive line on the second side causes severe wrinkles, affecting the appearance of the product and the thickness of the solder resist film. Pressed to make.

In view of the above, it is necessary to provide a method for manufacturing a double-sided circuit board which can effectively improve the yield and reduce wrinkles in view of the above problems.

A method of fabricating a double-sided circuit board will be described below with reference to specific embodiments.

A method for manufacturing a double-sided circuit board, comprising the steps of: providing a first copper clad plate and a second copper clad plate, the first copper clad plate comprising a first insulating layer and first copper foils respectively formed on opposite surfaces of the first insulating layer And a second copper foil layer having a first wiring region and a first edge region surrounding the first wiring region, the second copper clad plate comprising a second insulating layer and oppositely formed on the second insulating layer a third copper foil layer and a fourth copper foil layer on both surfaces, the second copper clad plate having a second line region and a second edge region surrounding the second line region; forming a first line region of the first copper foil layer a first line pattern formed in the second line region of the third copper foil layer to form a third line pattern; the first edge region of the first copper foil layer is bonded to form a ring-shaped first adhesive ring, in the third a second edge region of the copper foil layer is bonded to form a ring-shaped second adhesive ring; a support plate is provided, the support plate has a first support surface and a second support surface; and the first copper-clad plate is An adhesive ring is pasted at the first pressing temperature and pressed against the first branch The second copper clad plate is adhered and pressed to the second support surface by the second adhesive ring at a first pressing temperature; and the second line pattern is formed in the first line region of the second copper foil layer, thereby Forming the first copper clad plate into the first double panel, and forming a fourth line pattern in the second line region of the fourth copper foil layer, thereby forming the second copper clad plate into the second double panel; and the first double The panel is separated from the first adhesive ring to separate the second double panel from the second adhesive ring.

Compared with the prior art, the manufacturing method of the double-sided circuit board of the present technical solution is to form a first line pattern and a first copper pattern on the first copper foil layer of the first copper clad layer and the third copper foil layer of the second copper clad layer. After the three-line pattern, the first copper clad plate and the second copper clad plate are respectively adhered to the first support surface and the second support surface of the support plate by the first adhesive ring and the second adhesive ring, respectively, and then Forming a second line pattern and a fourth line pattern on the second copper foil layer of the first copper clad layer and the fourth copper foil layer of the second copper clad layer, and finally separating the first double panel and the second double panel As the two double-sided circuit boards, the first copper clad plate and the second copper clad plate are respectively adhered and pressed to the first support surface and the second support surface of the support plate by using the first adhesive ring and the second adhesive ring, respectively. Therefore, the first copper clad laminate and the second copper clad laminate can be prevented from being bent and crushed in the wet process manufacturing process for forming the second circuit pattern and the fourth circuit pattern, respectively, and severe wrinkles are generated, and the peeling is facilitated to form the second line. Graphic, fourth line graphics The photoresist, thereby improving the manufacturing efficiency of the double-sided circuit board of thinner.

The method for fabricating the double-sided circuit board of the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 , an embodiment of the present technical solution provides a method for manufacturing a double-sided circuit board, which includes the following steps:

Step 110, referring to FIG. 2, provides a first copper clad laminate 10 and a second copper clad laminate 20. The first copper clad laminate 10 includes a first insulating layer 12 and a first copper foil layer 14 and a second copper foil layer 16 respectively formed on opposite surfaces of the first insulating layer 12. The first copper clad laminate 10 has a first line region 101 and a first edge region 102 surrounding the first line region 101. The second copper clad layer 20 includes a second insulating layer 22 and a third copper foil layer 24 and a fourth copper foil layer 26 respectively formed on opposite surfaces of the second insulating layer 22. The second copper clad laminate 20 has a second line region 201 and a second edge region 202 surrounding the second line region 201.

Specifically, the first edge region 102 is located on the outer side of the first line region 101. The first line region 101 is the region where the finished circuit board is finally formed, and the first edge region 102 is an area to be cut and removed when forming a finished circuit board. In this embodiment, the first copper clad laminate 10 may have a thickness of 27 microns or 36 microns. When the thickness of the first copper clad laminate 10 is 27 μm, the thickness of the first insulating layer 12, the first copper foil layer 14, and the second copper foil layer 16 are both 9 μm. When the thickness of the first copper clad laminate 10 is 36 micrometers, the thickness of the first insulating layer 12, the first copper foil layer 14, and the second copper foil layer 16 are both 12 micrometers.

The second edge region 202 is located on the outer side of the second line region 201. The second edge region 202 corresponds to the first edge region 102, which corresponds to the first line region 101. The second line region 201 is the region where the finished circuit board is finally formed, and the second edge region 202 is an area to be cut and removed when the finished circuit board is formed. In this embodiment, the thickness of the second copper clad laminate 20 can be 27 microns or 36 microns. When the thickness of the second copper clad laminate 20 is 27 micrometers, the thickness of the second insulating layer 22, the third copper foil layer 24, and the fourth copper foil layer 26 are both 9 micrometers. When the thickness of the second copper clad laminate 20 is 36 μm, the thickness of the second insulating layer 22, the third copper foil layer 24, and the fourth copper foil layer 26 are both 12 μm.

Step 120, referring to FIG. 3, a first line pattern 142 is formed in the first line region 101 of the first copper foil layer 14, and a third line pattern 242 is formed in the second line region 201 of the third copper foil layer 24.

Specifically, forming the first line pattern 142 on the first copper foil layer 14 of the first copper clad laminate 10 includes the following steps: first, covering the surface of the first copper foil layer 14 with a photoresist (not shown); a photomask (not shown) having a corresponding pattern with the first line pattern 142 is exposed to the photoresist; then, a portion of the area where the photoresist is exposed is removed by using a developing solution; and finally, the first copper is etched using an etching solution The foil layer 14 is etched and forms a first line pattern 142. The first line pattern 142 is located in the first line region 101 of the first copper clad laminate 10.

Similarly, the specific steps of forming the third line pattern 242 on the third copper foil layer 24 of the second copper clad laminate 20 are substantially the same as the steps of forming the first line pattern 142, and are not described herein again. The third line pattern 242 is located in the second line region 201 of the second copper clad laminate 20.

Step 130, referring to FIG. 4, a first blind via 104 is formed in the first line region 101. The first blind via 104 penetrates the second copper foil layer 16 and the first insulating layer 12 to form a second wiring region 201. The second blind via 204 penetrates the fourth copper foil layer 26 and the second insulating layer 22 .

Specifically, the second copper foil layer 16 and the first insulating layer 12 may be ablated from one side of the second copper foil layer 16 by laser to form the second copper foil layer 16 and the first insulating layer 12 . The first blind hole 104. The first blind hole 104 is located in the first line region 101 of the first copper clad laminate 10. The fourth copper foil layer 26 and the second insulating layer 22 may be ablated from one side of the fourth copper foil layer 26 by laser to form a fourth layer that penetrates the fourth copper foil layer 26 and the second insulating layer 22. Two blind holes 204. The second blind hole 204 is located in the second line region 201 of the second copper clad laminate 20.

In addition, when the first copper clad laminate 10 and the second copper clad laminate 20 do not need to form a blind hole, the step 130 may be omitted.

Step 140, referring to FIG. 5, the first edge region 102 of the first copper foil layer 14 is bonded to form a ring-shaped first adhesive ring 310, and is adhered to the second edge region 202 of the third copper foil layer 24. A ring-shaped second adhesive ring 320 is formed. Preferably, the second adhesive ring 320 is aligned with the first adhesive ring 310.

Specifically, in one embodiment, bonding the first edge region 102 of the first copper foil layer 14 to form a ring-shaped first adhesive ring 310 includes the following steps: First, referring to FIG. 6, providing the first glue The adhesive sheet 31 has a central region 311 and a peripheral region 312 surrounding the central region 311. Next, referring to FIG. 7, the central region 311 of the first adhesive sheet 31 is cut and removed, thereby obtaining the peripheral region 312 of the first adhesive sheet 31. Then, the peripheral region 312 of the first adhesive sheet 31 is attached to the first edge region 102 of the first copper foil layer 14, thereby forming a first adhesive ring 310 as shown in FIG.

Similarly, bonding the second edge region 202 of the third copper foil layer 24 to form a ring-shaped second adhesive ring 320 includes the following steps: First, referring to FIG. 6, a second adhesive sheet 32 is provided, The second adhesive sheet 32 has a central region 321 and a peripheral region 322 surrounding the central region 321 . Next, referring to FIG. 7, the central region 321 of the second adhesive sheet 32 is removed to obtain the peripheral region 322 of the second adhesive sheet 32. Then, the peripheral region 322 of the second adhesive sheet 32 is attached to the second edge region 202 of the third copper foil layer 24, thereby forming a second adhesive ring 320 as shown in FIG.

Of course, the first adhesive ring 310 and the second adhesive ring 320 may be adhered to the first edge region 102 of the first copper foil layer 14 and the second edge region 202 of the third copper foil layer 24 by other methods. . For example, in another embodiment, bonding the first edge region 102 of the first copper foil layer 14 to form a ring-shaped first adhesive ring 310 includes the following steps: First, please refer to FIG. The type of adhesive tape 41 includes a first adhesive layer 411 and a first release layer 412. The first release layer 412 is attached to one surface of the first adhesive layer 411. Of course, the other surface of the first adhesive layer 411 may also be attached with a release layer (not shown) to protect the first adhesive layer 411 before the adhesive is adhered, and then peel off the release layer when it is attached. Next, referring to FIG. 9 , the first release tape 41 is attached to the first edge region 102 around the first line region 101 , and the first adhesive layer 411 is brought into contact with the first copper foil layer 14 . Then, the first release layer 412 is removed, thereby obtaining the first adhesive ring 310 as shown in FIG. 5, which is composed of the first adhesive layer 411 of the first release tape 41.

Similarly, the second edge region 202 of the third copper foil layer 24 is bonded to form a ring-shaped second adhesive ring 320. The first step is as follows: First, referring to FIG. 8, a second release tape 42 is provided. The two release tape 42 includes a second adhesive layer 421 and a second release layer 422. The second release layer 422 is attached to one surface of the second adhesive layer 421. Of course, the other surface of the second adhesive layer 421 may also be attached with a release layer (not shown) to protect the second adhesive layer 421 before being pasted, and then peel off the release layer when it is bonded. Next, referring to FIG. 9, the second release tape 42 is attached to the second edge region 202 around the second line region 201, and the second adhesive layer 421 is brought into contact with the third copper foil layer 24. Then, the second release layer 422 is removed, thereby obtaining a second adhesive ring 320 as shown in FIG. 5, which is composed of the second adhesive layer 421 of the second release tape 42.

Step 150, referring to FIG. 10, provides a support plate 50 having a first support surface 51 and a second support surface 52 opposite thereto.

The support plate 50 can be formed by using a hard insulating material, and has good thermochemical stability and high strength. In this embodiment, the size of the surface of the support plate 50 is substantially equal to the size of the surface of the first copper clad laminate 10 and the second copper clad laminate 20.

In step 160, referring to FIG. 11 and FIG. 12, the first copper clad laminate 10 is adhered to the first support surface 51 by the first adhesive ring 310 at the first pressing temperature, and the second copper clad laminate 20 is used. The second adhesive ring 320 is adhered to the second support surface 52 at a first pressing temperature.

At this time, the first copper foil layer 14 of the first copper clad laminate 10 is opposite to the first support surface 51, and the first first adhesive ring 310 of the first copper foil layer 14 and the external environment of the first copper foil layer 14 Isolated. Since the first adhesive ring 310 is not bonded to the first line region 101 of the first copper foil layer 14 after pressing, the first line pattern 142 in the first line region 101 is not affected or destroyed. And, after the pressing, the first copper clad plate 10 and the first adhesive ring 310 are enclosed with the first supporting surface 51 to form a first closed space 301. The first closed space 301 stores a certain amount of gas, which can be The first line region 101 of the first copper foil layer 14 and the first line pattern 142 of the first line region 101 are buffered and protected in a subsequent process.

Moreover, the third copper foil layer 24 of the second copper clad laminate 20 is opposite to the second support surface 52. The annular second adhesive ring 320 isolates the second line region 201 of the third copper foil layer 24 from the external environment. . Since the second adhesive ring 320 is not bonded to the second line region 201 of the third copper foil layer 24 after pressing, the third line pattern 242 in the second line region 201 is not affected or destroyed. Moreover, after the pressing, the second copper clad 20, the second adhesive ring 320 and the second supporting surface 52 are enclosed to form a second closed space 302. The second closed space 302 has a certain amount of gas, which can be In the subsequent process, the second line pattern 201 of the third copper foil layer 24 and the third line pattern 242 of the second line area 201 are buffer-protected.

In this embodiment, the first pressing temperature is between 90 degrees Celsius and 130 degrees Celsius, and different temperatures may be selected according to different materials of the first adhesive ring 310 and the second adhesive ring 320.

In addition, the first copper clad laminate 10 and the second copper clad laminate 20 can be respectively pressed against the first support surface 51 and the second support surface 52 of the support plate 50; the first copper clad laminate 10 can be first pressed onto the support plate. The first supporting surface 51 of the 50, the second copper clad 20 is pressed against the second supporting surface 52 of the supporting plate 50.

Step 170, referring to FIG. 13, the first blind via 104 and the second blind via 204 are plated with copper.

In the embodiment, when the first blind via 104 and the second blind via 204 are plated with copper, the first blind via 104 and the second blind via 204 are first subjected to a black shadow processing to make the first blind via 104. Graphitizing the hole wall of the second blind hole 204 to facilitate subsequent plating of the first blind hole 104 and the second blind hole 204; then, integrally clamping the first copper clad plate 10, the support plate 50, and the like by using a plating jig The second copper clad laminate 20 is immersed in the plating solution for electroplating, so that the first blind via 104 and the second blind via 204 are plated with a copper layer. Of course, the first blind via 104 and the second blind via 204 may be plated with copper by other copper plating methods.

In addition, it is not necessary to form a blind hole in the first copper clad laminate 10 and the second copper clad laminate 20, that is, before the step 130 can be omitted, the step 170 can also be omitted.

Step 180, referring to FIG. 14 and FIG. 15, a second line pattern 162 is formed in the first line region 101 of the second copper foil layer 16, thereby forming the first copper clad plate 10 into a first double panel; The second line region 201 of the foil layer 26 is formed to form a fourth line pattern 262. Thereby, the second copper clad laminate 20 is made into a second double panel.

Specifically, forming the second line pattern 162 in the first line region 101 of the second copper foil layer 16 includes the following steps: first, covering the surface of the second copper foil layer 16 with a photoresist (not shown); The second line pattern 162 has a mask (not shown) corresponding to the pattern to expose the photoresist; then, the developing portion is used to remove a portion of the portion where the photoresist is exposed; and finally, the second copper foil is etched by the etching solution. Layer 16 is etched and forms a second line pattern 162. The second line pattern 162 is located in the first line region 101 of the first copper clad laminate 10.

Similarly, the specific steps of forming the fourth line pattern 262 in the second line region 201 of the fourth copper foil layer 26 are substantially the same as the steps of forming the second line pattern 162, and are not described herein again. The fourth line pattern 262 is located in the second line region 201 of the second copper clad laminate 20.

Step 190, referring to FIG. 16, the first double panel is separated from the first adhesive ring 310, and the second double panel is separated from the second adhesive ring 320.

The first double panel is separated from the first adhesive ring 310, and the second double panel is separated from the second adhesive ring 320 to obtain two double-sided circuit boards on which conductive lines are formed.

In addition, after separating the first double panel from the first adhesive ring 310 and separating the second double panel from the second adhesive ring 320, the surface of the first line pattern 142 and the second line pattern 162 may also be included. The surface, the surface of the third line pattern 242, and the surface of the fourth line pattern 262 are stepped at a second pressing temperature to press a solder resist (not shown). Wherein, the second pressing temperature is greater than the first pressing temperature. Typically, the second press temperature is between 160 degrees Celsius and 230 degrees Celsius. Moreover, a surface treatment process such as gold can be performed in the future to protect the conductive lines and prevent oxidation of the exposed lines.

Compared with the prior art, the manufacturing method of the double-sided circuit board of the present technical solution is to form a first line pattern and a first copper pattern on the first copper foil layer of the first copper clad layer and the third copper foil layer of the second copper clad layer. After the three-line pattern, the first copper clad plate and the second copper clad plate are respectively adhered to the first support surface and the second support surface of the support plate by the first adhesive ring and the second adhesive ring, respectively, and then Forming a second line pattern and a fourth line pattern on the second copper foil layer of the first copper clad layer and the fourth copper foil layer of the second copper clad layer, and finally separating the first double panel and the second double panel As the two double-sided circuit boards, the first copper clad plate and the second copper clad plate are respectively adhered and pressed to the first support surface and the second support surface of the support plate by using the first adhesive ring and the second adhesive ring, respectively. Therefore, the first copper clad laminate and the second copper clad laminate can be prevented from being bent and crushed in the wet process manufacturing process for forming the second circuit pattern and the fourth circuit pattern, respectively, and severe wrinkles are generated, and the peeling is facilitated to form the second line. Graphic, fourth line graphics The photoresist, thereby improving the manufacturing efficiency of the double-sided circuit board of thinner.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. In the prior art, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧First CCL

20‧‧‧Second CCL

12‧‧‧First insulation

14‧‧‧First copper foil layer

16‧‧‧Second copper foil layer

101‧‧‧First line area

102‧‧‧First marginal zone

22‧‧‧Second insulation

24‧‧‧ Third copper foil layer

26‧‧‧fourth copper foil layer

201‧‧‧Second line area

202‧‧‧Second marginal zone

142‧‧‧First line graphics

162‧‧‧second line graphics

242‧‧‧ Third line graphics

262‧‧‧fourth line graphic

104‧‧‧First blind hole

204‧‧‧Second blind hole

310‧‧‧First adhesive ring

320‧‧‧Second adhesive ring

31‧‧‧First adhesive sheet

32‧‧‧Second adhesive sheet

311, 321‧‧‧Central Area

312, 322‧‧‧ surrounding areas

41‧‧‧First release tape

42‧‧‧Second release tape

411‧‧‧First adhesive layer

412‧‧‧First release layer

421‧‧‧Second adhesive layer

422‧‧‧Second release layer

50‧‧‧Support board

51‧‧‧First support surface

52‧‧‧second support surface

301‧‧‧First enclosed space

302‧‧‧Second enclosed space

1 is a flow chart of a method for fabricating a double-sided circuit board according to an embodiment of the present technical solution.

2 is a schematic view showing a first copper clad plate and a second copper clad plate provided in the method for manufacturing the double-sided circuit board of FIG. 1.

3 is a schematic view showing a method of fabricating a double-sided circuit board of FIG. 1 to form a first line pattern on a first copper clad board and a third line pattern on a second copper clad board.

4 is a schematic view showing a first blind hole formed on a first copper clad plate and a second blind hole formed on a second copper clad plate in the method of manufacturing the double-sided circuit board of FIG. 1.

FIG. 5 is a schematic view showing a first copper clad plate to which a first adhesive ring is adhered and a second copper clad plate to which a second adhesive ring is adhered in the method for manufacturing the double-sided circuit board of FIG. 1. FIG.

6 is a schematic view showing a first adhesive sheet and a second adhesive sheet provided in the method for fabricating the double-sided circuit board of FIG. 1.

FIG. 7 is a schematic view showing the first adhesive sheet and the second adhesive sheet cut in the intermediate portion provided in the method for manufacturing the double-sided circuit board of FIG. 1. FIG.

FIG. 8 is a schematic view showing the first release tape and the second release tape provided in the method for manufacturing the double-sided circuit board of FIG. 1. FIG.

9 is a schematic view showing a first copper clad plate to which a first release tape is adhered and a second copper clad laminate to which a second release tape is adhered in the method for manufacturing the double-sided circuit board of FIG. 1.

10 is a schematic view of a support plate provided in the method of fabricating the double-sided circuit board of FIG. 1.

11 is a schematic view showing the first copper clad laminate and the second copper clad laminate pressed against the support plate in the method for manufacturing the double-sided circuit board of FIG. 1.

Figure 12 is a cross-sectional view taken along line I-I of Figure 7.

13 is a schematic view showing copper plating of a first blind via and a second blind via in the method of fabricating the double-sided circuit board of FIG. 1.

FIG. 14 is a schematic diagram showing the formation of a second line pattern on the first copper clad board in the method of fabricating the double-sided circuit board of FIG. 1. FIG.

FIG. 15 is a schematic view showing the formation of a fourth line pattern on the second copper clad board in the method of fabricating the double-sided circuit board of FIG. 1. FIG.

16 is a schematic view showing the first double panel and the second double panel separated from the first adhesive ring and the second adhesive ring respectively in the manufacturing method of the double-sided circuit board of FIG. 1 .

Claims (10)

A method for manufacturing a double-sided circuit board, comprising the steps of:
Providing a first copper clad plate and a second copper clad plate, the first copper clad plate comprising a first insulating layer and a first copper foil layer and a second copper foil layer respectively formed on opposite surfaces of the first insulating layer, the first cladding The copper plate has a first line region and a first edge region surrounding the first circuit region, the second copper clad plate includes a second insulating layer and a third copper foil layer and a fourth copper respectively formed on opposite surfaces of the second insulating layer a foil layer, the second copper clad plate having a second line region and a second edge region surrounding the second line region;
Forming a first line pattern in the first line region of the first copper foil layer, and forming a third line pattern in the second line region of the third copper foil layer;
Forming a ring-shaped first adhesive ring on the first edge region of the first copper foil layer, and bonding a second adhesive ring on the second edge region of the third copper foil layer;
Providing a support plate having a first support surface and a second support surface;
The first copper clad plate is adhered to the first support surface by the first adhesive ring at a first pressing temperature, and the second copper clad plate is pasted at the first pressing temperature by the second adhesive ring. Pressing on the second support surface;
Forming a second line pattern in the first line region of the second copper foil layer, thereby forming the first copper clad plate into the first double panel, and forming a fourth line pattern in the second line region of the fourth copper foil layer, Thereby, the second copper clad laminate is made into a second double panel; and the first double panel is separated from the first adhesive ring, and the second double panel is separated from the second adhesive ring. The method for manufacturing a double-sided circuit board according to the first aspect of the invention, wherein after the forming the first line pattern and the third line pattern, the step of forming the first blind hole and the second blind hole is further included. The first blind hole penetrates the second copper foil layer and the first insulating layer, and is located in the first line region, and the second blind hole penetrates the fourth copper foil layer and the second insulating layer, and is located in the second line region Before the forming the second line pattern and the fourth line pattern, the step of performing copper plating on the first blind hole and the second blind hole is further included. The method for manufacturing a double-sided circuit board according to claim 1, wherein the second edge region corresponds to the first edge region, the second line region corresponds to the first line region, and the second glue The adhesive ring is aligned with the first adhesive ring. The method for manufacturing a double-sided circuit board according to the first aspect of the invention, wherein the first edge region of the first copper foil layer is bonded to form a ring-shaped first adhesive ring, comprising the steps of:
Providing a first adhesive sheet, the first adhesive sheet having a central region and a peripheral region surrounding the central region;
Cutting and removing the central region of the first adhesive sheet to obtain a peripheral region of the first adhesive sheet;
The peripheral region of the first adhesive sheet is attached to the first edge region of the first copper foil layer to form a first adhesive ring. The method of manufacturing the double-sided circuit board according to the first aspect of the invention, wherein the second edge region of the third copper foil layer is bonded to form a ring-shaped second adhesive ring, comprising the steps of:
Providing a second adhesive sheet having a central region and a peripheral region surrounding the central region;
Cutting and removing the central region of the second adhesive sheet to obtain a peripheral region of the second adhesive sheet;
The peripheral region of the second adhesive sheet is attached to the second edge region of the third copper foil layer to form a second adhesive ring. The method for manufacturing a double-sided circuit board according to the first aspect of the invention, wherein the first edge region of the first copper foil layer is bonded to form a ring-shaped first adhesive ring, comprising the steps of:
Providing a first release tape, the first release tape comprising a first adhesive layer and a first release layer;
Laminating the first release tape around the first line region to the first edge region, and contacting the first adhesive layer with the first copper foil layer;
The first release layer is removed to obtain a first adhesive ring composed of the first adhesive layer of the first release tape. The method of manufacturing the double-sided circuit board according to the first aspect of the invention, wherein the second edge region of the second copper foil layer is bonded to form a ring-shaped second adhesive ring.
Providing a second release tape, the second release tape comprising a second adhesive layer and a second release layer;
Laminating the second release tape around the second line region to the second edge region, and contacting the second adhesive layer with the second copper foil layer;
The second release layer is removed to obtain a second adhesive ring composed of the second adhesive layer of the second release tape. The method of manufacturing the double-sided circuit board according to the first aspect of the invention, wherein after the first copper clad plate is adhered to the first support surface by the first adhesive ring at a first pressing temperature The first copper clad plate and the first adhesive ring are enclosed with the first supporting surface to form a first closed space, wherein the first closed space stores a certain amount of gas; and the second copper clad plate is coated with the second adhesive After the ring is pasted and pressed against the second supporting surface, the second copper clad plate and the second adhesive ring are enclosed by the second supporting surface to form a second closed space, and the second closed space is present. The amount of gas. The method of fabricating a double-sided circuit board according to claim 1, wherein the first pressing temperature is between 90 degrees Celsius and 130 degrees Celsius. The method for manufacturing a double-sided circuit board according to the first aspect of the invention, wherein the first double panel is separated from the first adhesive ring, and the second double panel is separated from the second adhesive ring, And step of pressing the solder resist film at a second pressing temperature on the first line pattern surface, the second line pattern surface, the third line pattern surface, and the fourth line pattern surface, the second pressing temperature being greater than the first Pressing temperature.